LC5523FLF3054 - Sanken Electric Co., Ltd.

SANKEN ELECTRIC CO., LTD.

LC5523F

Description

The LC5500 series is a power IC for LED drivers. It has

an incorporated power MOSFET, and is designed for input

capacitorless applications, making it possible for systems

to comply with the harmonics standard (IEC61000-3-2

Class C). The controller adapts the average current control

method for realizing high power factors, and the quasi-

resonant topology contributes to high efficiency and low

EMI noise.

The rich set of protection features helps to realize low com-

ponent counts, and high performance-to-cost power supply.

The LC5523F is intended for isolated designs. The incor-

porated MOSFET has a VDSS(min) rating of 650 V and

RDS(on)(max) of 1.9 Ω. It is capable of a maximum output

power of 60 W on 230 VAC supply and 40 W on universal

supply based on the thermal rating. Note that the maximum

output power can be up to 120% to 140% of this value.

However, it may be limited in applications with low output

voltage or short duty cycle.

Single-Stage Power Factor Corrected

Of f-Line Switching Regulator IC

Typical Application

Package: 7-pin TO-220F

Not to scale

LF 3052 LF 3054

LF 3051

Features and Benefits

• Integrated on-width control circuit (it realizes high power

factor by average current control)

• Integrated soft-start circuit (reduces power stress during

start-up on the incorporated power MOSFET and

output rectifier)

• Integrated bias assist circuit (improves the startup

performance, suppresses VCC voltage droop during

operation, allows reduction of VCC capacitor value as well

as use of a ceramic capacitor)

• Integrated Leading Edge Blanking (LEB) circuit

• Integrated maximum on-time limit circuit

• Protection features:

▫ Overcurrent protection (OCP): pulse-by-pulse

▫ Overvoltage protection (OVP): pins VCC, OVP, and

OCP, auto restart

▫ Overload protection (OLP): auto restart

▫ Thermal shutdown (TSD): latched shutdown

F1 L1

PC1

DZ1

DZ2

LED

PC2

R10

R11

R12

R13

R14

R15

R16

R17

R18

R19

OVP

VA C

PC1

C10

C11

C12

C13

C14

C15 C16

C17

Vcc

OCP FB

VCC

S/GND

R20

D/ST

ROCP R3

LC5523F

Control

Part

DZ3

R21

C18

June 14, 2012

LC5523F-DS

SANKEN ELECTRIC CO., LTD.

LC5523F-DS

Single-Stage Power Factor Corrected

Of f-Line Switching Regulator IC

LC5523F

June 14, 2012

Selection Guide

Part Number Package

LC5523F TO-220F

(specify leadform when ordering)

Absolute Maximum Ratings TA = 25°C, unless otherwise specified

Characteristic Symbol Notes Pins Rating Unit

Drain Current1IDPeak Single pulse 1 – 2 9.2 A

Single Pulse Avalanche Energy2EAS ILPeak = 2.9 A, VDD = 99 V, L = 20 mH 1 – 2 99 mJ

Supply Voltage for Control Part VCC 4 – 2 35 V

OCP Pin Voltage VOCP 5 – 2 2.0 to 5.0 V

FB Pin Voltage VFB 6 – 2 0.3 to 7.0 V

OVP Pin Voltage VOVP 7 – 2 0.3 to 5.0 V

Allowable Power Dissipation of

MOSFET3PD1

With infinite heatsink 1 – 2 20.2 W

Without heatsink 1 – 2 1.8 W

Internal Frame Temperature in

Operation TF20 to 115 °C

Operating Ambient Temperature TOP 55 to 115 °C

Storage Temperature Tstg 55 to 125 °C

Channel Temperature Tch 150 °C

1Refer to MOSFET Safe Operating Area Curve.

2Refer to MOSFET Avalanche Energy Derating Coefficient Curve.

3Refer to MOSFET Temperature versus Power Dissipation Curve.

The polarity value for current specifies a sink as "+," and a source as “,” referencing the IC.

SANKEN ELECTRIC CO., LTD.

LC5523F-DS

Single-Stage Power Factor Corrected

Of f-Line Switching Regulator IC

LC5523F

June 14, 2012

ELECTRICAL CHARACTERISTICS (Controller Part) TA = 25°C, VCC = 20 V, unless otherwise specified

Characteristic Symbol Test Conditions Pins Min. Typ. Max. Unit

Startup Operation

Operation Start Voltage VCC(ON) 4 – 2 13.8 15.1 17.3 V

Operation Stop Voltage* VCC(OFF) 4 – 2 8.4 9.4 10.7 V

Operating Current ICC(ON) 4 – 2 – – 3.7 mA

Startup Circuit Operation Voltage VSTARTUP 1 – 2 42 57 72 V

Startup Current ICC(STARTUP) VCC = 13 V 4 – 2 5.5 3.0 1.0 mA

Startup Current Threshold Biasing

Voltage-1* VCC(BIAS)1 4 – 2 9.5 11.0 12.5 V

Startup Current Threshold Biasing

Voltage-2 VCC(BIAS)2 4 – 2 14.4 16.6 18.8 V

Normal Operation

PWM Operation Frequency fOSC 1 – 2 11.0 14.0 18.0 kHz

Maximum On-Width tON(MAX) 1 – 2 30.0 40.0 50.0 s

FB Pin Voltage Minimum Limit VFB(MIN) 6 – 2 0.55 0.90 1.25 V

Maximum Feedback Current IFB(MAX) 6 – 2 40 25 10 A

Leading Edge Blanking Time tON(LEB) 5 – 2 500 ns

Quasi-Resonant Operation Threshold

Voltage-1 VBD(TH1) 5 – 2 0.14 0.24 0.34 V

Quasi-Resonant Operation Threshold

Voltage-2 VBD(TH2) 5 – 2 0.12 0.17 0.22 V

Protection Operation

OCP Pin Overcurrent Protection

(OCP) Threshold Voltage VOCP 5 – 2 0.66 0.60 0.54 V

OCP Pin Source Current IOCP 5 – 2 120 40 10 A

OCP Pin Overvoltage Protection

(OVP) Threshold Voltage VBD(OVP) 5 – 2 2.2 2.6 3.0 V

Overload Protection (OLP) Threshold

Voltage-1 VFB(OLP)1 6 – 2 5.0 5.5 6.0 V

Overload Protection (OLP) Threshold

Voltage-2 VFB(OLP)2 6 – 2 4.1 4.5 4.9 V

OVP Pin OVP Threshold Voltage VOVP(OVP) 7 – 2 1.6 2.0 2.4 V

VCC Pin OVP Threshold Voltage VCC(OVP) 4 – 2 28.5 31.5 34.0 V

Thermal Shutdown Activating

Temperature TJ(TSD) – 135 – – °C

*VCC(BIAS)1 > VCC(OFF) always.

SANKEN ELECTRIC CO., LTD.

LC5523F-DS

Single-Stage Power Factor Corrected

Of f-Line Switching Regulator IC

LC5523F

June 14, 2012

ELECTRICAL CHARACTERISTICS (MOSFET) TA = 25°C, unless otherwise specified

Characteristic Symbol Test Conditions Pins Min. Typ. Max. Unit

Drain-to-Source Breakdown Voltage VDSS 1 – 2 650  V

Drain Leakage Current IDSS 1 – 2 300 A

On Resistance RDS(on) 1 – 2 1.9 

Switching Time tf1 – 2 400 ns

Thermal Resistance Rch-F Between channel and internal leadframe 3.1 °C/W

SANKEN ELECTRIC CO., LTD.

LC5523F-DS

Single-Stage Power Factor Corrected

Of f-Line Switching Regulator IC

LC5523F

June 14, 2012

0.1

0.01

0.001

Transient Thermal Resistance, Rch-c (°C/W)

Transient Thermal Resistance Curve

Time (s)

-6

-5

-4

-3

-2

-1

Ambient Temperature, TA (°C)

With infinite heatsink

20.2

1.8 115

Without heatsink

0255075 125100 150

MOSFET Temperature versus Power Dissipation Curve

Allowable Power Dissipation, PD1 (W)

Channel Temperature, Tch (°C)

100

25 50 75 125100 150

EAS

Temperature Derating Coefficient (%)

MOSFET Avalanche Energy Derating Coefficient Curve

Drain-to-Source Voltage, VDS (V)

0.1

0.01 10 100 1000

MOSFET Safe Operating Area Curve

Drain current limited

by on-resistance

1 ms

0.1 ms

Drain Current, ID (A)

To use this graph, apply the S.O.A

temperature derating coefficient

taken from the graph at the left

Channel Temperature, Tch (°C)

100

00 25 50 75 125100 150

Safe Operating Area

Temperature Derating Coefficient (%)

S. O. A. Temperature Derating Coefficient Curve

Characteristic Performance

SANKEN ELECTRIC CO., LTD.

LC5523F-DS

Single-Stage Power Factor Corrected

Of f-Line Switching Regulator IC

LC5523F

June 14, 2012

Functional Block DiagramFunctional Block DiagramFunctional Block Diagram

Pin-out Diagrams

(LF 3052)

(LF 3051)

(LF 3054)

D/ST

S/GND

VCC

OCP

OVP

D/ST

S/GND

VCC

OCP

OVP

D/ST

S/GND

VCC

OCP

OVP

S/GND

TSD

LEB

D/ST

STARTUP

Reg

Bias

UVLO

VCC

OCP

OVP

OSC

OCP

Detection

Bottom

Reg

Control

Feedback

OLP

Drv

④

①

②

⑥

⑦

⑤

NC 3

Control Part

LC5523F Pin List Table

Number Name Function

1 D/ST MOSFET drain pin and input of the startup current

2 S/GND MOSFET source and GND pin for the Control Part

3 NC No connection

4 VCC Supply voltage input and Overvoltage protection (OVP) signal input

5 OCP Overcurrent Protection, quasi-resonant signal input pin, and

Overvoltage Protection (OVP) signal input

6 FB Feedback signal input and Overload Protection (OLP) signal input

7 OVP Overvoltage Protection (OVP) signal input

SANKEN ELECTRIC CO., LTD.

LC5523F-DS

Single-Stage Power Factor Corrected

Of f-Line Switching Regulator IC

LC5523F

June 14, 2012

Package Outline Drawing, TO-220F Leadform 3051

（5.6）

±0.2

（At base of pin）

（At tip of pin）

Front view Side view

（At tip of pin）

±0.3

＝5.85±0.15

5×P1.17±0.15

5±0.5

±0.2

（1.1）

±0.2

±0.510.4

7-0.55 +0.2

-0.1

7-0.62 ±0.15

2±0.15

2.8 +0.2

4.2

2.6

±0.12.6

R-end

5±0.5

R-end

-0.1

+0.2

0.45 2.54±0.6

5.08±0.6

0.50.5 0.50.5

Gate burr

Unit: mm

b: Lot number

letter: Last digit of year

letter: Month

Jan to September: Numeric

October: O

November: N

December: D

and 4

letter: Date

01 to 31: Numeric

letter: Internal use control number

Package: TO-220F-7L

Leadframe material: Cu

Pin treatment: Solder dip

Weight: Approximately 1.45 g

a: Part # 5523F

Ø3.2 ±0.2

"Gate Burr" shows area

where 0.3 mm (max) gate

burr may be present

Pin treatment Pb-free. Device composition

compliant with the RoHS directive.

SANKEN ELECTRIC CO., LTD.

LC5523F-DS

Single-Stage Power Factor Corrected

Of f-Line Switching Regulator IC

LC5523F

June 14, 2012

Package Outline Drawing, TO-220F Leadform 3052

（5.6）

±0.2

±0.3

＝5.85±0.15

5×P1.17±0.15

5±0.5

±0.2

（1.1）

±0.2

765432

±0.5

10.4

7-0.55+0.2

-0.1

7-0.62 ±0.15

2±0.15

2.8 +0.2

4.2

2.6

±0.1

2.6

R-end

Front View Side View

-0.1

+0.2

0.45

5.08±0.6

0.5

0.5 0.50.5

Gate burr

（At base of pin）

（At tip of pin）

Unit: mm

a: Part # 5523F

b: Lot number

letter: Last digit of year

letter: Month

Jan to September: Numeric

October: O

November: N

December: D

and 4

letter: Date

01 to 31: Numeric

letter: Internal use control number

Package: TO-220F-7L

Leadframe material: Cu

Pin treatment: Solder dip

Weight: Approximately 1.45 g

Ø3.2 ±0.2

"Gate Burr" shows area

where 0.3 mm (max) gate

burr may be present

Pin treatment Pb-free. Device composition

compliant with the RoHS directive.

SANKEN ELECTRIC CO., LTD.

LC5523F-DS

Single-Stage Power Factor Corrected

Of f-Line Switching Regulator IC

LC5523F

June 14, 2012

Package Outline Drawing, TO-220F Leadform 3054

0.50.5 0.50.5

7654

7-0.62

7-0.55

±0.210

(5.6)

±0.22.8

±0.315

±0.152

Gate burr

-0.1

+0.2

±0.53.8

3-( R1)

±0.55

2.5

2.8

±0.2

2.6

(1.1)

±0.15

-0.1

+0.2

±0.12.6

4.2

±0.2

Ø3.2 ±0.2

0.45 ±0.5

±0.5

（At base of pin）

5×P 1.17 ±0.15

= 5.85 ±0.15

Plan View Side View

（At base of pin）

（At tip of pin）

Unit: mm

b: Lot number

letter: Last digit of year

letter: Month

Jan to September: Numeric

October: O

November: N

December: D

and 4

letter: Date

01 to 31: Numeric

letter: Internal use control number

Package: TO-220F-7L

Leadframe material: Cu

Pin treatment: Solder dip

Weight: Approximately 1.45 g

a: Part # 5523F

"Gate Burr" shows area

where 0.3 mm (max) gate

burr may be present

Pin treatment Pb-free. Device composition

compliant with the RoHS directive.

SANKEN ELECTRIC CO., LTD.

LC5523F-DS

Single-Stage Power Factor Corrected

Of f-Line Switching Regulator IC

LC5523F

June 14, 2012

Because reliability can be affected adversely by improper storage

environments and handling methods, please observe the following

cautions.

Cautions for Storage

• Ensure that storage conditions comply with the standard

temperature (5°C to 35°C) and the standard relative humidity

(around 40% to 75%); avoid storage locations that experience

extreme changes in temperature or humidity.

• Avoid locations where dust or harmful gases are present and

avoid direct sunlight.

• Reinspect for rust on leads and solderability of the products that

have been stored for a long time.

Cautions for Testing and Handling

When tests are carried out during inspection testing and other

standard test periods, protect the products from power surges

from the testing device, shorts between the product pins, and

wrong connections. Ensure all test parameters are within the

ratings specified by Sanken for the products.

Remarks About Using Silicone Grease with a Heatsink

• When silicone grease is used in mounting the products on a

heatsink, it shall be applied evenly and thinly. If more silicone

grease than required is applied, it may produce excess stress.

• Volatile-type silicone greases may crack after long periods of

time, resulting in reduced heat radiation effect. Silicone greases

with low consistency (hard grease) may cause cracks in the mold

resin when screwing the products to a heatsink.

Our recommended silicone greases for heat radiation purposes,

which will not cause any adverse effect on the product life, are

indicated below:

Type Suppliers

G746 Shin-Etsu Chemical Co., Ltd.

YG6260 Momentive Performance Materials Inc.

SC102 Dow Corning Toray Co., Ltd.

Cautions for Mounting to a Heatsink

• When the flatness around the screw hole is insufficient, such as when

mounting the products to a heatsink that has an extruded (burred)

screw hole, the products can be damaged, even with a lower than

recommended screw torque. For mounting the products, the mounting

surface flatness should be 0.05 mm or less.

• Please select suitable screws for the product shape. Do not use

a flat-head machine screw because of the stress to the products.

Self-tapping screws are not recommended. When using self-tapping

screws, the screw may enter the hole diagonally, not vertically,

depending on the conditions of hole before threading or the work

situation. That may stress the products and may cause failures.

• Recommended screw torque: 0.588 to 0.785 Nm (6 to 8 kgfcm).

• For tightening screws, if a tightening tool (such as a driver) hits the

products, the package may crack, and internal stress fractures may

occur, which shorten the lifetime of the electrical elements and can

cause catastrophic failure. Tightening with an air driver makes a

substantial impact. In addition, a screw torque higher than the set

torque can be applied and the package may be damaged. Therefore,

an electric driver is recommended.

When the package is tightened at two or more places, first pre-tighten

with a lower torque at all places, then tighten with the specified torque.

When using a power driver, torque control is mandatory.

Soldering

• When soldering the products, please be sure to minimize the

working time, within the following limits:

260±5°C 10±1 s (Flow, 2 times)

380±10°C 3.5±0.5 s (Soldering iron, 1 time)

• Soldering should be at a distance of at least 2.0 mm from the

body of the products.

Electrostatic Discharge

• When handling the products, the operator must be grounded.

Grounded wrist straps worn should have at least 1 M of

resistance from the operator to ground to prevent shock hazard,

and it should be placed near the operator.

• Workbenches where the products are handled should be

grounded and be provided with conductive table and floor mats.

• When using measuring equipment such as a curve tracer, the

equipment should be grounded.

• When soldering the products, the head of soldering irons or the

solder bath must be grounded in order to prevent leak voltages

generated by them from being applied to the products.

• The products should always be stored and transported in Sanken

shipping containers or conductive containers, or be wrapped in

aluminum foil.

SANKEN ELECTRIC CO., LTD.

LC5523F-DS

Single-Stage Power Factor Corrected

Of f-Line Switching Regulator IC

LC5523F

June 14, 2012

• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the

latest revision of the document before use.

• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod-

ucts herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or

any other rights of Sanken or any third party which may result from its use.

• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semicon-

ductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures

including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device

failure or malfunction.

• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equip-

ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).

When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and

its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever

long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales

representative to discuss, prior to the use of the products herein.

The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required

(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.

• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the

degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the

load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,

derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such

as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,

instantaneous values, maximum values and minimum values must be taken into consideration.

In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of

derating of junction temperature affects the reliability significantly.

• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically

or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance

and proceed therewith at your own responsibility.

• Anti radioactive ray design is not considered for the products listed herein.

• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribu-

tion network.

• The contents in this document must not be transcribed or copied without Sanken's written consent.