EP2545ETPDL-40.000M REGULATORY COMPLIANCE (Data Sheet downloaded on Dec 21, 2018) 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) 40.000MHz 50ppm -40C to +85C ELECTRICAL SPECIFICATIONS Nominal Frequency 40.000MHz Frequency Tolerance/Stability 50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range,Supply Voltage Change, Output Load Change, First Year Aging at 25C, Shock, and Vibration) Aging at 25C 5ppm/year Maximum Operating Temperature Range -40C to +85C Supply Voltage 5.0Vdc 10% Input Current 45mA Maximum (Unloaded) Output Voltage Logic High (Voh) 2.4Vdc Minimum (IOH = -16mA) Output Voltage Logic Low (Vol) 0.4Vdc Maximum (IOL = +16mA) Rise/Fall Time 4nSec Maximum (Measured at 0.8Vdc to 2.0Vdc) Duty Cycle 50 10(%) (Measured at 1.4Vdc with TTL Load or 50% of waveform with HCMOS Load) Load Drive Capability 10TTL Load Maximum Output Logic Type TTL Pin 1 Connection Power Down (Disabled Output: Logic Low) Pin 1 Input Voltage (Vih and Vil) +2.0Vdc Minimum to enable output, +0.8Vdc Maximum to disable output, No Connect to enable output. Standby Current 50A Maximum (Pin 1 = Ground) Absolute Clock Jitter 100pSec Maximum, 50pSec Typical One Sigma Clock Period Jitter 30pSec Maximum Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 1 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EP2545ETPDL-40.000M MECHANICAL DIMENSIONS (all dimensions in millimeters) 7.00 0.15 5.08 0.15 4 3 MARKING ORIENTATION 5.00 0.15 2.20 0.15 2 1 1.4 0.2 1.4 0.1 3.68 0.15 PIN CONNECTION 1 Power Down (Logic Low) 2 Ground/Case Ground 3 Output 4 Supply Voltage LINE MARKING 1 ECLIPTEK 2 40.000M 3 XXXXX XXXXX=Ecliptek Manufacturing Identifier 1.60 0.20 Suggested Solder Pad Layout All Dimensions in Millimeters 2.0 (X4) 2.2 (X4) Solder Land (X4) 2.88 1.81 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 2 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EP2545ETPDL-40.000M CLOCK OUTPUT POWER DOWN INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% or 2.0VDC OUTPUT DISABLE (LOGIC LOW) 50% or 1.4VDC 20% or 0.8VDC VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 3 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EP2545ETPDL-40.000M Test Circuit for CMOS Output Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Frequency Counter Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) Tri-State or Power Down Note 1: An external 0.01F ceramic bypass capacitor in parallel with a 0.1F high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and High bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet for `Load Drive Capability'. www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 4 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EP2545ETPDL-40.000M Test Circuit for TTL Output Output Load Drive Capability 10TTL 5TTL RL Value (Ohms) CL Value (pF) 390 780 15 15 Oscilloscope Table 1: RL Resistance Value and CL Capacitance Value Vs. Output Load Drive Capability + + Power Supply _ Current Meter _ Supply Voltage (VDD) Frequency Counter Probe (Note 2) RL (Note 4) Output + Voltage Meter _ + 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) Power Supply _ Power Down or Tri-State Note 1: An external 0.01F ceramic bypass capacitor in parallel with a 0.1F high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'. Note 5: All diodes are MMBD7000, MMBD914, or equivalent. www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 5 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EP2545ETPDL-40.000M Recommended Solder Reflow Methods High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3C/Second Maximum 150C 175C 200C 60 - 180 Seconds 3C/Second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 Seconds 6C/Second Maximum 8 Minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 6 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EP2545ETPDL-40.000M Recommended Solder Reflow Methods Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5C/Second Maximum N/A 150C N/A 60 - 120 Seconds 5C/Second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 2 Times / 230C Maximum 1 Time 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time 5C/Second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 7 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Ecliptek: EP2545ETPDL-40.000M