DS3695A, DS3695AT, DS3696A
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SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
DS3695A/DS3695AT/DS3696A Multipoint RS485/RS422 Transceivers
Check for Samples: DS3695A,DS3695AT,DS3696A
1FEATURES DESCRIPTION
The DS3695A and DS3696A are high speed
2• Meets EIA Standard RS485 for Multipoint Bus differential TRI-STATE bus/line transceivers designed
Transmission and is Compatible with RS-422 to meet the requirements of EIA standard RS485 with
• 10 Ns Driver Propagation Delays (Typical) extended common mode range (+12V to −7V), for
• Single +5V Supply multipoint data transmission. In addition they are
compatible with requirements of RS-422.
•−7V to +12V Bus Common Mode Range
Permits ±7V Ground Difference between The driver and receiver outputs feature TRI-STATE
Devices on the Bus capability. The driver outputs remain in over the
entire common mode range of +12V to −7V. Bus
• Thermal Shutdown Protection faults that cause excessive power dissipation within
• High Impedance to Bus with Driver in TRI- the device trigger a thermal shutdown circuit, which
STATE or with Power Off, over the Entire forces the driver outputs into the high impedance
Common Mode Range Allows the Unused state. The DS3696A provides an output pin (TS)
Devices on the Bus to be Powered Down which reports the thermal shutdown of the device. TS
is an “open collector” pin with an internal 10 kΩpull-
• Combined Impedance of a Driver Output and up resistor. This allows the TS outputs of several
Receiver Input is less than One RS485 Unit devices to be wire OR-ed.
Load, Allowing up to 32 Transceivers on the
Bus Both AC and DC specifications are guaranteed over
the 0°C to 70°C temperature and 4.75V to 5.25V
• 70 mV Typical Receiver Hysteresis supply voltage range.
• Available in SOIC Packaging
Connection and Logic Diagrams
Figure 1. Molded Package, Small Outline (D0008A) Figure 2. Top View
Top View (See Package Number D0008A)
TS was LF (Line Fault) on previous datasheets, TS goes low upon thermal shutdown.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1996–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DS3695A, DS3695AT, DS3696A
SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)(2)
Supply Voltage, VCC 7V
Control Input Voltages 7V
Driver Input Voltage 7V
Driver Output Voltages +15V/−10V
Receiver Input Voltages +15V/−10V
Receiver Output Voltage 5.5V
Continuous Power Dissipation @ 25°C
D0008A Package 630 mW (3)
Storage Temp. Range −65°C to +150°C
Lead Temp. (Soldering 4 seconds) 260°C
(1) “Absolute maximum ratings” are those beyond which the safety of the device cannot be verified. They are not meant to imply that the
device should be operated at these limits. The tables of “Electrical Characteristics” provide conditions for actual device operation.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Derate linearly at 6.5 mW/°C to 337 mW at 70°C.
Recommended Operating Conditions Min Max Units
Supply Voltage, VCC 4.75 5.25 V
Bus Voltage −7 +12 V
Operating Free Air Temperature (TA)
Commercial (DS3695AM) 0 +70 °C
Industrial (DS3695ATM) −40 +85 °C
Commercial (DS3696AM) 0 +70 °C
Electrical Characteristics (1) (2)
0°C ≤TA≤70°C, 4.75V < VCC < 5.25V unless otherwise specified
Parameter Test Conditions Min Typ Max Units
VOD1 Differential Driver Output Voltage (Unloaded) IO= 0 5 V
VOD2 Differential Driver Output Voltage (with Load) R = 50Ω; (RS-422) (3) 2 V
R = 27Ω; (RS-485) 1.5 V
ΔVOD Complementary Output States R = 27Ω0.2 V
Differential Output Voltage For
Change in Magnitude of Driver
VOC Driver Common Mode Output Voltage 3.0 V
Δ|VOC| Change in Magnitude of Driver 0.2 V
Common Mode Output Voltage
For Complementary Output States
VIH Input High Voltage DI, DE, RE , 2 V
RE/DE
VIL Input Low Voltage 0.8 V
VCL Input Clamp Voltage IIN =−18 mA −1.5 V
IIL Input Low Current VIL = 0.4V −200 μA
IIH Input High Current VIH = 2.4V 20 μA
(1) All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
(2) All typicals are given for VCC = 5V and TA= 25°C.
(3) All limits for which this note is applied must be derated by 10% for DS3695AT. Other parameters remain the same for this extended
temperature range device (−40°C ≤TA≤+85°C).
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SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
Electrical Characteristics (1) (2) (continued)
0°C ≤TA≤70°C, 4.75V < VCC < 5.25V unless otherwise specified
Parameter Test Conditions Min Typ Max Units
IIN Input Current RI, RI, DO/RI, VCC = 0V or 5.25V, VIN = 12V +1.0 mA
DO/RI DE or RE /DE = 0V VIN =−7V −0.8 mA
VTH Differential Input Threshold Voltage for Receiver −7V ≤VCM ≤+12V −0.2 +0.2 V
ΔVTH Receiver Input Hysteresis VCM = 0V 70 mV
VOH Receiver Output High Voltage IOH =−400 μA 2.4 V
VOL Output Low Voltage RO IOL = 16 mA (3) 0.5 V
TS IOL = 8 mA 0.45 V
IOZR Output Current at Receiver OFF-State (High 0.4V ≤VO≤2.4V, VCC = Max, ±20 μA
Impedance)
RIN Receiver Input Resistance −7V ≤VCM ≤+12V 12 kΩ
ICC Supply Current Driver Outputs 42 60 mA
Enabled
No Load(3) Driver Outputs 27 40 mA
Disabled
IOSD VO=−7V (3) −250 mA
Output Current Driver Short-Circuit VO= +12V (3) +250 mA
IOSR Output Current Receiver Short-Circuit VO= 0V −15 −85 mA
Receiver Switching Characteristics
0°C ≤TA≤70°C, 4.75V < VCC < 5.25V unless otherwise specified (4)
Symbol Test Conditions Min Typ Max Units
tPLH CL= 15 pF 15 28 42 ns
tPHL S1 and S2 15 28 42 ns
|tPLH–tPHL| Closed 0 3 ns
tPLZ CL= 15 pF, S2 Open 5 29 35 ns
tPHZ CL= 15 pF, S1 Open 5 12 16 ns
tPZL CL= 15 pF, S2 Open 7 15 28 ns
tPZH CL= 15 pF, S1 Open 7 15 20 ns
(4) All typicals are given for VCC = 5V and TA= 25°C.
Driver Switching Characteristics
0°C ≤TA≤70°C, 4.75V < VCC < 5.25V unless otherwise specified (1)
Symbol Test Conditions Min Typ Max Units
SINGLE ENDED CHARACTERISTICS (Figure 7,Figure 8, and Figure 10)
tPLH RLDIFF = 60Ω9 15 22 ns
tPHL CL1 = CL2 = 100 pF 9 15 22 ns
tSKEW|tPLH–tPHL| 0 2 8 ns
tPLZ CL= 15 pF, S2 Open 7 15 30 ns
tPHZ CL= 15 pF, S1 Open 7 15 30 ns
tPZL CL= 100 pF, S2 Open 30 35 50 ns
tPZH CL= 100 pF, S1 Open 30 35 50 ns
DIFFERENTIAL SWITCHING CHARACTERISTICS (Figure 10)
tr, tfRLDIFF = 60Ω6 10 18 ns
CL1 = CL2 = 100 pF
(1) All typicals are given for VCC = 5V and TA= 25°C.
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DS3695A, DS3695AT, DS3696A
SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
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AC TEST CIRCUITS AND SWITCHING WAVEFORMS
Figure 3. Receiver Propagation Delay Test Circuit
Differential input voltage may be realized by grounding RI and pulsing RI between +2.5V and −2.5V
Figure 4. Receiver Input-to-Output Propagation Delay Timing
Figure 5. Receiver Enable/Disable Propagation Delay Timing
Figure 6. Unless Otherwise Specified the Switches are Closed
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DS3695A, DS3695AT, DS3696A
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SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
Figure 7. Driver Propagation Delay Test Circuits
tPLH and tPHL are measured to the respective 50% points. tSKEW is the difference between propagation delays of the
complementary outputs.
Figure 8. Driver Input-to-Output Propagation Delay Timing (Single-Ended)
Figure 9. Driver Enable/Disable Propagation Delay Timing
Figure 10. Driver Differential Transition Timing
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DS3695A, DS3695AT, DS3696A
SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
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Table 1. Function Tables DS3695A/DS3696A Transmitting(1)
Inputs Line Outputs
RE DE DI Condition DO DO TS * (DS3696A Only)
X 1 1 No Fault 0 1 H
X 1 0 No Fault 1 0 H
X 0 X X Z Z H
X 1 X Fault Z Z L
Table 2. Function Tables DS3695A/DS3696A Receiving(1)
Inputs Outputs
RE DE RI–RI RO TS * (DS3696A Only)
0 0 ≥+0.2V 1 H
0 0 ≤−0.2V 0 H
0 0 Inputs Open** 1 H
1 0 X Z H
(1) X — Don't care condition
Z — High impedance state
Fault — Improper line conditions causing excessive power dissipation in the driver, such as shorts or bus contention situations
* TS is an “open collector” output with an on-chip 10 kΩpull-up resistor.
** This is a fail safe condition
(1) X — Don't care condition
Z — High impedance state
Fault — Improper line conditions causing excessive power dissipation in the driver, such as shorts or bus contention situations
* TS is an “open collector” output with an on-chip 10 kΩpull-up resistor.
** This is a fail safe condition
Typical Application
Repeater control logic not shown.
Figure 11.
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DS3695A, DS3695AT, DS3696A
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SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 6
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Product Folder Links: DS3695A DS3695AT DS3696A
PACKAGE OPTION ADDENDUM
www.ti.com 28-Sep-2018
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DS3695AM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS36
95AM
DS3695AMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS36
95AM
DS3695ATM/NOPB OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 85 DS369
5ATM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS3695AMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Aug-2018
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS3695AMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Aug-2018
Pack Materials-Page 2
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