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Parameter Test Conditions Min. Typ. Max. Unit
V(BR)DSS Drain–Source Breakdown Voltage
VGS(th) Gate Thresshold Voltage
IGSS Gate–Source Leakage
IDSS Zero Gate Voltage Drain Current
rDS(on) Drain–Source On–Resistance1
gfsForward Transconductance1
Ciss Input Capacitance
Coss Output capacitance
Crss Reverse Transfer Capacitance
td (on) Turn–On Delay Time
trRiseTime
td (off) Turn off Delay Time
tfFallTime
VSD Diode Forward Voltage1
ISContinues Current
ISM Pulsed Current2
trr Reverse Recovery Time
Qrr Reverse Recovered Charge
VGS = 0 ID= 1.0mA
VDS=VGS ID= 250μA
VDS = 0 VGS = ±20V
VDS =0.8 x V(BR)DSS
VGS = 0 Tj = 125°C
VGS = 10V ID= 1.25A
VDS = >15V ID= 1.25A
VDS = 25V VGS = 0
f = 1.0MHZ
VDD = 200V
ID= 2.0A
RG = 7.5Ω
VGS = 0 IS= 2.0A
IF= 2.0A VDD = 50V
dIF/dT = 100A/μS
400
2.0 4.0
±100
25
250
1.8
1.0 350
100
45 40
35
60
35
1.4
2.0
10
650
5.0
V
nA
μA
Ω
s( )
pF
ns
V
A
ns
μC
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk Website: http://www.semelab.co.uk Document Number 6407
Issue 1
ELECTRICAL CHARACTERISTICS (TJ= 25°C unless otherwise stated)
1) Pulse test : Pulse Width < 300μs ,Duty Cycle < 2%
2) Pulse width limited by maximum juction temperature
SOURCE DRAIN DIODE RATING CHARACTERISTICS
Ω
IRFF320
2N6792