Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 32, 64, and 128 Mbit Datasheet Product Features Architecture -- Symmetrical 128-KB blocks -- 128 Mbit (128 blocks) -- 64 Mbit (64 blocks) -- 32 Mbit (32 blocks) -- Blank Check to verify an erased block Performance -- Initial Access Speed: 75ns -- 25 ns 8-word Asynchronous page-mode reads -- 256-Word write buffer for x16 mode, 256Byte write buffer for x8 mode; 1.41 s per Byte Effective programming time System Voltage -- VCC = 2.7 V to 3.6 V -- VCCQ = 2.7 V to 3.6 V Packaging -- 56-Lead TSOP -- 64-Ball Easy BGA package Security -- Enhanced security options for code protection -- Absolute protection with VPEN = Vss -- Individual block locking -- Block erase/program lockout during power transitions -- Password Access feature -- One-Time Programmable Register: 64 OTP bits, programmed with unique information by Numonyx 64 OTP bits, available for customer programming Software -- Program and erase suspend support -- Numonyx(R) Flash Data Integrator (FDI) -- Common Flash Interface (CFI) Compatible -- Scalable Command Set Quality and Reliability -- Operating temperature: -40 C to +85 C -- 100K Minimum erase cycles per block -- 65 nm Flash Technology -- JESD47E Compliant 208032-04 Jan 2018 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2010 Micron Technology, Inc. All rights reserved. Legal Lines and Disclaime Datasheet 2 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 www.micron.com/productsupport Customer Comment Line: 800-932-4992 Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur. rs Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Contents 1.0 Introduction .............................................................................................................. 6 1.1 Nomenclature ..................................................................................................... 6 1.2 Acronyms........................................................................................................... 7 1.3 Conventions ....................................................................................................... 7 2.0 Functional Overview .................................................................................................. 9 2.1 Block Diagram .................................................................................................. 11 2.2 Memory Map..................................................................................................... 12 3.0 Package Information ............................................................................................... 13 3.1 56-Lead TSOP Package for 32-, 64-, 128-Mbit ....................................................... 13 3.2 64-Ball Easy BGA Package for 32-, 64-, 128-Mbit .................................................. 14 4.0 Ballouts/Pinouts and Signal Descriptions ................................................................ 16 4.1 Easy BGA Ballout for 32-, 64-, 128-Mbit ............................................................... 16 4.2 56-Lead TSOP Package Pinout for 32-, 64-,128-Mbit .............................................. 17 4.3 Signal Descriptions ............................................................................................ 18 5.0 Maximum Ratings and Operating Conditions............................................................ 19 5.1 Absolute Maximum Ratings ................................................................................. 19 5.2 Operating Conditions ......................................................................................... 19 5.3 Power-Up/Down ................................................................................................ 19 5.3.1 Power-Up/Down Sequence....................................................................... 19 5.3.2 Power Supply Decoupling ........................................................................ 20 5.4 Reset............................................................................................................... 20 6.0 Electrical Characteristics ......................................................................................... 21 6.1 DC Current Specifications ................................................................................... 21 6.2 DC Voltage specifications.................................................................................... 22 6.3 Capacitance...................................................................................................... 22 7.0 AC Characteristics ................................................................................................... 23 7.1 Read Specifications............................................................................................ 24 7.2 Program, Erase, Block-Lock Specifications ............................................................ 28 7.3 Reset Specifications........................................................................................... 28 7.4 AC Test Conditions ............................................................................................ 29 8.0 Bus Interface........................................................................................................... 30 8.1 Bus Reads ........................................................................................................ 31 8.1.1 Asynchronous Page Mode Read ................................................................ 31 8.1.2 Output Disable....................................................................................... 32 8.2 Bus Writes........................................................................................................ 32 8.3 Standby ........................................................................................................... 33 8.3.1 Reset/Power-Down ................................................................................. 33 8.4 Device Commands............................................................................................. 33 9.0 Flash Operations ..................................................................................................... 34 9.1 Status Register ................................................................................................. 34 9.1.1 Clearing the Status Register .................................................................... 35 9.2 Read Operations ............................................................................................... 35 9.2.1 Read Array ............................................................................................ 35 9.2.2 Read Status Register .............................................................................. 36 9.2.3 Read Device Information ......................................................................... 36 9.2.4 CFI Query ............................................................................................. 36 9.3 Programming Operations.................................................................................... 36 Datasheet 3 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 9.4 9.5 9.6 9.7 9.8 9.3.1 Single-Word/Byte Programming................................................................36 9.3.2 Buffered Programming ............................................................................37 Block Erase Operations .......................................................................................38 Blank Check ......................................................................................................39 Suspend and Resume .........................................................................................39 Status Signal ....................................................................................................41 Security and Protection.......................................................................................42 9.8.1 Normal Block Locking ..............................................................................42 9.8.2 Configurable Block Locking.......................................................................43 9.8.3 Password Access.....................................................................................43 9.8.4 128-bit OTP Protection Register ................................................................43 9.8.5 Reading the 128-bit OTP Protection Register...............................................43 9.8.6 Programming the 128-bit OTP Protection Register .......................................43 9.8.7 Locking the 128-bit OTP Protection Register ...............................................44 9.8.8 VPEN Protection......................................................................................45 10.0 ID Codes ..................................................................................................................46 11.0 Device Command Codes ...........................................................................................47 12.0 Flow Charts..............................................................................................................48 13.0 Common Flash Interface ..........................................................................................57 13.1 Query Structure Output ......................................................................................57 13.2 Query Structure Overview...................................................................................58 13.3 Block Status Register .........................................................................................59 13.4 CFI Query Identification String ............................................................................59 13.5 System Interface Information..............................................................................60 13.6 Device Geometry Definition .................................................................................60 13.7 Primary-Vendor Specific Extended Query Table ......................................................61 A Additional Information.............................................................................................64 B Ordering Information...............................................................................................65 Datasheet 4 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Revision History Date Revision May 2009 01 March 2010 02 Jan 2011 03 Jan 2018 04 Description Initial release Add Blank Check function and command. Add Blank Check specification tBC/MB, update Clear Block Lock-Bits Max Time and Program time in Table 13, "Configuration Performance" on page 28. Update ICCR in Table 7, "DC Current Characteristics" on page 21. Order information with device features digit. Update part number information in Valid Combination table. Add a note to clarify the SR output after E8 command in Figure 16, "Write to Buffer Flowchart" on page 48. State JESD47E Compliant at front page. Update ECR.13 description in Table 18, "Enhanced Configuration Register" on page 32. Correct the typo of comment for offset 24h at CFI from 2048s to 1024s. Correct the typo of tAVQV and tELQV to Max Specifications. Emphasize the valid and legal command usage at Section 11.0, "Device Command Codes" on page 47. Put a link for part numbers after Table 46, "Valid Combinations" on page 65. Add Buffer Program Time for 128 Words (256 Bytes) at Table 13, "Configuration Performance" on page 28. Add JEDEC standard lead width for TSOP56 package at Table 1, "56-Lead TSOP Dimension Table" on page 13. Added Important Notes and Warnings section for further clarification aligning to industry standards Datasheet 5 Important Notes and Warnings Important Notes and Warnings Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions. This document supersedes and replaces all information supplied prior to the publication hereof. You may not rely on any information set forth in this document if you obtain the product described herein from any unauthorized distributor or other source not authorized by Micron. Automotive Applications. Products are not designed or intended for use in automotive applications unless specifically designated by Micron as automotive-grade by their respective data sheets. 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Customer/distributor shall ensure that the terms and conditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron products are not designed or intended for use in automotive applications unless specifically designated by Micron as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to indemnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting from any use of non-automotive-grade products in automotive applications. Critical Applications. Products are not authorized for use in applications in which failure of the Micron component could result, directly or indirectly in death, personal injury, or severe property or environmental damage ("Critical Applications"). Customer must protect against death, personal injury, and severe property and environmental damage by incorporating safety design measures into customer's applications to ensure that failure of the Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron component for any critical application, customer and distributor shall indemnify and hold harmless Micron and its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, or death arising in any way out of such critical application, whether or not Micron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the Micron product. Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems, applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAILURE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included in customer's applications and products to eliminate the risk that personal injury, death, or severe property or environmental damages will result from failure of any semiconductor component. Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort, warranty, breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly authorized representative. Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 1.0 Introduction This document contains information pertaining to the Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) device features, operation, and specifications. Unless otherwise indicated throughout the rest of this document, the Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) device is referred to as J3 65 nm SBC. The J3 65 nm SBC device provides improved mainstream performance with enhanced security features, taking advantage of the high quality and reliability of the NOR-based 65 nm technology. Offered in 128-Mbit, 64-Mbit, and 32-Mbit densities, the J3 65 nm SBC device brings reliable, low-voltage capability (3 V read, program, and erase) with high speed, low-power operation. The J3 65 nm SBC device takes advantage of proven manufacturing experience and is ideal for code and data applications where high density and low cost are required, such as in networking, telecommunications, digital set top boxes, audio recording, and digital imaging. Numonyx Flash Memory components also deliver a new generation of forward-compatible software support. By using the Common Flash Interface (CFI) and Scalable Command Set (SCS), customers can take advantage of density upgrades and optimized write capabilities of future Numonyx Flash Memory devices. 1.1 J3 65 nm SBC AMIN AMAX Nomenclature Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) All Densities AMIN = A0 for x8 All Densities AMIN = A1 for x16 32 Mbit AMAX = A21 64 Mbit AMAX = A22 128 Mbit AMAX = A23 Block A group of flash cells that share common erase circuitry and erase simultaneously. Clear Indicates a logic zero (0) Program Writes data to the flash array Set Indicates a logic one (1) VPEN Refers to a signal or package connection name VPEN Refers to timing or voltage levels Datasheet 6 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 1.2 Acronyms SBC Single Bit per Cell FDI Flash Data Integrator CFI Common Flash Interface SCS Scalable Command Set CUI Command User Interface OTP One Time Programmable PLR Protection Lock Register PR Protection Register PRD Protection Register Data RFU Reserved for Future Use SR Status Register SRD Status Register Data WSM Write State Machine ECR Enhanced Configuration Register ECD Enhanced Configuration Register Data 1.3 Conventions h Hexadecimal Suffix K(noun) 1,000 M (noun) 1,000,000 Nibble 4 bits Byte 8 bits Word 16 bits Kb 1,024 bits KB 1,024 bytes KW 1,024 words Mb 1,048,576 bits MB 1,048,576 bytes MW 1,048,576 words Kbit 1,024 bits Mbit 1,048,576 bits Datasheet 7 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Datasheet 8 Brackets Square brackets ([]) will be used to designate group membership or to define a group of signals with similar function (i.e. A[21:1], SR[4,1] and D[15:0]). 00FFh Denotes 16-bit hexadecimal numbers 00FF 00FFh Denotes 32-bit hexadecimal numbers DQ[15:0] Data I/O signals Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 2.0 Functional Overview The J3 65 nm SBC family contains high-density memory organized in any of the following configurations: * 16-MB or 8-MW (128-Mbit), organized as one-hundred-twenty-eight 128-KB erase blocks. * 8-MB or 4-MW (64-Mbit), organized as sixty-four 128-KB erase blocks. * 4-MB or 2-MW (32-Mbit), organized as thirty-two 128-KB erase blocks. These devices can be accessed as 8- or 16-bit words. See Figure 1, "Memory Block Diagram for 32-, 64-, 128-Mbit" on page 11 for further details. A 128-bit Protection Register has multiple uses, including unique flash device identification. The J3 65 nm SBC device includes new security features that were not available on the (previous) 0.13m versions of the J3 family. These new security features prevent altering of code through different protection schemes that can be implemented, based on user requirements. The J3 65 nm SBC optimized architecture and interface dramatically increases read performance by supporting page-mode reads. This read mode is ideal for non-clock memory systems. Its Common Flash Interface (CFI) permits software algorithms to be used for entire families of devices. This allows device-independent, JEDEC ID-independent, and forward- and backward-compatible software support for the specified flash device families. Flash vendors can standardize their existing interfaces for long-term compatibility. The Scalable Command Set (SCS) allows a single, simple software driver in all host systems to work with all SCS-compliant flash memory devices, independent of systemlevel packaging (e.g., memory card, SIMM, or direct-to-board placement). Additionally, SCS provides the highest system/device data transfer rates and minimizes device and system-level implementation costs. A Command User Interface (CUI) serves as the interface between the system processor and internal operation of the device. A valid command sequence written to the CUI initiates device automation. An internal Write State Machine (WSM) automatically executes the algorithms and timings necessary for block erase, program, and lock-bit configuration operations. A block erase operation erases one of the device's 128-KB blocks typically within one second, independent of other blocks. Each block can be independently erased 100,000 times. Block erase suspend mode allows system software to suspend block erase to read or program data from any other block. Similarly, program suspend allows system software to suspend programming (byte/word program and write-to-buffer operations) to read data or execute code from any other block that is not being suspended. Each device incorporates a Write Buffer of 256-Byte (x8 mode) or 256-Word (x16 mode) to allow optimum programming performance. By using the Write Buffer data is programmed more efficiently in buffer increments. Memory Blocks are selectively and individually lockable in-system. Individual block locking uses block lock-bits to lock and unlock blocks. Block lock-bits gate block erase and program operations. Lock-bit configuration operations set and clear lock-bits (using the Set Block Lock-Bit and Clear Block Lock-Bits commands). Datasheet 9 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) The Status Register indicates when the WSM's block erase, program, or lock-bit configuration operation completes. The STS (status) output gives an additional indicator of WSM activity by providing both a hardware signal of status (versus software polling) and status masking (interrupt masking for background block erase, for example). Status indication using STS minimizes both CPU overhead and system power consumption. When configured in level mode (default mode), it acts as a RY/BY# signal. When low, STS indicates that the WSM is performing a block erase, program, or lock-bit configuration. STS-high indicates that the WSM is ready for a new command, block erase is suspended (and programming is inactive), program is suspended, or the device is in reset/power-down mode. Additionally, the configuration command allows the STS signal to be configured to pulse on completion of programming and/or block erases. Three CE signals are used to enable and disable the device. A unique CE logic design (see Table 17, "Chip Enable Truth Table for 32-, 64-, 128-Mb" on page 30) reduces decoder logic typically required for multi-chip designs. External logic is not required when designing a single chip, a dual chip, or a 4-chip miniature card or SIMM module. The BYTE# signal allows either x8 or x16 read/writes to the device: * BYTE#-low enables 8-bit mode; address A0 selects between the low byte and high byte. * BYTE#-high enables16-bit operation; address A1 becomes the lowest order address and address A0 is not used (don't care). Figure 1, "Memory Block Diagram for 32-, 64-, 128-Mbit" on page 11 shows a device block diagram. When the device is disabled (see Table 17, "Chip Enable Truth Table for 32-, 64-, 128Mb" on page 30), with CEx at VIH and RP# at VIH, the standby mode is enabled. When RP# is at VIL, a further power-down mode is enabled which minimizes power consumption and provides write protection during reset. A reset time (tPHQV) is required from RP# going high until data outputs are valid. Likewise, the device has a wake time (tPHWL) from RP#-high until writes to the CUI are recognized. With RP# at VIL, the WSM is reset and the Status Register is cleared. Datasheet 10 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 2.1 Figure 1: Block Diagram Memory Block Diagram for 32-, 64-, 128-Mbit Datasheet 11 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) J3 65 nm SBC Memory Map A [23:0]:128 Mbit A [22:0]: 64Mbit A [21:0]: 32Mbit 3E0000h 03FFFFh 020000h 01FFFFh 000000h 63 3FFFFFh 3F0000h 128 - KB Block 31 128 - KB Block 1 128 - KB Block 0 Byte-Wide (x 8 ) Mode Datasheet 12 1FFFFFh 1F0000h 01FFFFh 010000h 00FFFFh 000000h 64- KW Block 127 64- KW Block 63 64- KW Block 31 64- KW Block 1 64- KW Block 0 Word-Wide (x16) Mode 128- Mbit 3FFFFFh 128 - KB Block 7FFFFFh 7F0000h 128- Mbit 7E0000h 127 64- Mbit 7FFFFFh 128 - KB Block 32- Mbit FFFFFFh FE0000h A [23:1]:128 Mbit A [22:1]: 64Mbit A [21:1]: 32Mbit 64- Mbit Figure 2: Memory Map 32- Mbit 2.2 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 3.0 Package Information 3.1 56-Lead TSOP Package for 32-, 64-, 128-Mbit Figure 3: 56-Lead TSOP Package Mechanical Z A2 See Note 2 See Notes 1 and 3 Pin 1 e See Detail B E Y D1 A1 D Seating Plane See Detail A A Detail A Detail B C 0 b L Notes: 1. One dimple on package denotes Pin 1. 2. If two dimples, then the larger dimple denotes Pin 1. 3. Pin 1 will always be in the upper left corner of the package, in reference to the product mark. Table 1: 56-Lead TSOP Dimension Table Millimeters Parameter Inches Symbol Min Nom Max Min Nom Max Package Height A -- -- 1.200 -- -- 0.047 Standoff A1 0.050 -- -- 0.002 -- -- Package Body Thickness A2 0.965 0.995 1.025 0.038 0.039 0.040 Lead Width1 b 0.170 0.220 0.270 0.0067 0.0087 0.0106 Lead Thickness c 0.100 0.150 0.200 0.004 0.006 0.008 Package Body Length D1 18.200 18.400 18.600 0.717 0.724 0.732 Package Body Width E 13.800 14.000 14.200 0.543 0.551 0.559 Lead Pitch e -- 0.500 -- -- 0.0197 -- Terminal Dimension D 19.800 20.00 20.200 0.780 0.787 0.795 Lead Tip Length L 0.500 0.600 0.700 0.020 0.024 0.028 Datasheet 13 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Table 1: 56-Lead TSOP Dimension Table Millimeters Parameter Inches Symbol Min Nom Max Min Nom Max Lead Count N -- 56 -- -- 56 -- Lead Tip Angle 0 3 5 0 3 5 Seating Plane Coplanarity Y -- -- 0.100 -- -- 0.004 Lead to Package Offset Z 0.150 0.250 0.350 0.006 0.010 0.014 1. For legacy lead width, 0.15mm (Typ), 0.10mm (Min), 0.20mm (Max). 3.2 Figure 4: 64-Ball Easy BGA Package for 32-, 64-, 128-Mbit 64-Ball Easy BGA Mechanical Specifications Ball A1 Corner Ball A1 Corner D 1 2 3 4 S1 5 6 7 8 8 A A B B C C D 7 6 5 4 3 2 1 S2 D E E E F F G G H H e b Bottom View - Ball Side Up Top View - Plastic Backside Complete Ink Mark Not Shown A1 A2 A Seating Y Plane Table 2: Easy BGA Package Dimensions Table (Sheet 1 of 2) Millimeters Parameter Package Height A Ball Height A1 Package Body Thickness A2 Ball (Lead) Width b Datasheet 14 Inches Symbol Min Nom Max Min Nom Max -- -- 1.200 -- -- 0.0472 0.250 -- -- 0.0098 -- -- -- 0.780 -- -- 0.0307 -- 0.310 0.410 0.510 0.012 0.016 0.020 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Table 2: Easy BGA Package Dimensions Table (Sheet 2 of 2) Millimeters Parameter Inches Symbol Min Nom Max Min Nom Max Package Body Width D 9.900 10.000 10.100 0.3898 0.3937 0.3976 Package Body Length E 12.900 13.000 13.100 0.5079 0.5118 0.5157 Pitch e -- 1.000 -- -- 0.0394 -- Ball (Lead) Count N -- 64 -- -- 64 -- Seating Plane Coplanarity Y -- -- 0.100 -- -- 0.0039 Corner to Ball A1 Distance Along D S1 1.400 1.500 1.600 0.0551 0.0591 0.0630 Corner to Ball A1 Distance Along E S2 2.900 3.000 3.100 0.1142 0.1181 0.1220 Datasheet 15 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 4.0 Ballouts/Pinouts and Signal Descriptions J3 65 nm SBC is available in two package types. All densities of the J3 65 nm SBC devices are supported on both 64-ball Easy BGA and 56-lead Thin Small Outline Package (TSOP) packages. The figures below show the ballouts/Pinouts. 4.1 Easy BGA Ballout for 32-, 64-, 128-Mbit Figure 5: Easy BGA Ballout (32/64/128 Mbit) 1 2 3 4 5 6 7 8 7 8 6 5 4 3 2 1 A A A1 A6 A8 VPEN A13 VCC A18 (2) A22 (2) A22 A18 VCC A13 VPEN A8 A6 A1 B B A2 VSS A9 CE0 A14 RFU A19 CE1 CE1 A19 RFU A14 CE0 A9 VSS A2 A3 A7 A10 A12 A15 RFU A20 A21 A21 A20 RFU A15 A12 A10 A7 A3 A4 A5 A11 RP# RFU RFU A16 A17 A17 RFU RFU RP# A11 A5 A4 DQ8 DQ1 DQ9 DQ3 DQ4 RFU DQ15 STS STS DQ15 RFU DQ4 DQ9 DQ1 BYTE# DQ0 DQ10 DQ11 DQ12 RFU RFU OE# OE# RFU RFU DQ12 DQ11 DQ10 DQ0 VCCQ DQ6 DQ14 WE# WE# DQ14 DQ6 DQ5 C C D D A16 E E DQ3 DQ8 F F BYTE# G G (3) A23 (1) A0 DQ2 DQ5 VCCQ DQ2 (1) A0 (3) A23 H H CE2 RFU VCC VSS DQ13 VSS DQ7 (4) A24 (4) A24 DQ7 VSS DQ13 Notes: 1. 2. 3. 4. RFU Bottom View - Ball Side Up A0 is the least significant address bit. A22 is valid for 64-Mbit density and above. On 32-Mbit, it is a no-connect (NC). A23 is valid for 128-Mbit density. On 32- and 64-Mbit, it is a no-connect (NC). A24 is a no connect (NC) on 128-, 64-, 32- Mbit, reserved for 256-Mbit. Datasheet 16 VCC Easy BGA Easy BGA Top View - Ball Side Down VSS CE2 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 4.2 56-Lead TSOP Package Pinout for 32-, 64-,128-Mbit Figure 6: 56-Lead TSOP Package Pinout (32/64/128 Mbit) (3) 1 2 56 A24(5) 55 WE# 3 54 OE# 4 5 STS A19 53 52 A18 6 51 DQ7 A17 7 50 DQ14 A16 8 9 10 49 48 47 DQ6 VCC(1) A22 CE1 A21 A20 A15 A14 A12 11 12 13 CE0 14 VPEN 15 RP# 16 A11 17 A13 (R) Numonyx Embedded Flash Memory J3 56-Lead TSOP Package 14 mm x 20 mm Top View 46 DQ15 VSS DQ13 DQ5 45 44 43 DQ12 42 VSS 41 40 DQ11 DQ10 DQ4 VCCQ DQ3 A10 18 39 A9 19 38 DQ2 20 21 37 36 VCC A7 A6 22 35 DQ1 23 34 DQ8 A5 24 33 DQ0 A4 25 32 A0 A3 26 31 BYTE# A2 27 30 A23 A1 28 29 CE2 A8 VSS Notes: 1. 2. 3. 4. 5. DQ9 (2) (4) No internal connection for pin 9; it may be driven or floated. For legacy designs, the pin can be tied to VCC. A0 is the least significant address bit. A22 is valid for 64-Mbit density and above. On 32-Mbit, it is a no-connect (NC). A23 is valid for 128-Mbit density. On 32- and 64-Mbit, it is a no-connect (NC). A24 is a no connect (NC) on 128-, 64-, 32- Mbit, reserved for 256-Mbit. Datasheet 17 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 4.3 Signal Descriptions Table 3 lists the active signals used on J3 65 nm SBC and provides a description of each. Table 3: Signal Descriptions for J3 65 nm SBC Symbol Type Name and Function A0 Input BYTE-SELECT ADDRESS: Selects between high and low byte when the device is in x8 mode. This address is latched during a x8 program cycle. Not used in x16 mode (i.e., the A0 input buffer is turned off when BYTE# is high). A[MAX:1] Input ADDRESS INPUTS: Inputs for addresses during read and program operations. Addresses are internally latched during a program cycle: 32-Mbit -- A[21:1] 64-Mbit-- A[22:1] 128-Mbit -- A[23:1] DQ[7:0] Input/ Output LOW-BYTE DATA BUS: Inputs data during buffer writes and programming, and inputs commands during CUI writes. Outputs array, CFI, identifier, or status data in the appropriate read mode. Data is internally latched during write operations. DQ[15:8] Input/ Output HIGH-BYTE DATA BUS: Inputs data during x16 buffer writes and programming operations. Outputs array, CFI, or identifier data in the appropriate read mode; not used for Status Register reads. Data is internally latched during write operations in x16 mode. D[15:8] float in x8 mode. CE[2:0] Input CHIP ENABLE: Activates the 32-, 64-, 128-Mbit devices' control logic, input buffers, decoders, and sense amplifiers. When the device is de-selected (see Table 17, "Chip Enable Truth Table for 32-, 64-, 128-Mb" on page 30), power reduces to standby levels. All timing specifications are the same for these three signals. Device selection occurs with the first edge of CE0, CE1, or CE2 that enables the device. Device deselection occurs with the first edge of CE0, CE1, or CE2 that disables the device (see Table 17, "Chip Enable Truth Table for 32-, 64-, 128-Mb" on page 30). RP# Input RESET: RP#-low resets internal automation and puts the device in power-down mode. RP#-high enables normal operation. Exit from reset sets the device to read array mode. When driven low, RP# inhibits write operations which provides data protection during power transitions. OE# Input OUTPUT ENABLE: Activates the device's outputs through the data buffers during a read cycle. OE# is active low. WE# Input WRITE ENABLE: Controls writes to the CUI, the Write Buffer, and array blocks. WE# is active low. Addresses and data are latched on the rising edge of WE#. STS Open Drain Output STATUS: Indicates the status of the internal state machine. When configured in level mode (default), it acts as a RY/BY# signal. When configured in one of its pulse modes, it can pulse to indicate program and/or erase completion. For alternate configurations of the Status signal, see the Configurations command and Section 9.7, "Status Signal" on page 41. STS is to be tied to VCCQ with a pull-up resistor. BYTE# Input BYTE ENABLE: BYTE#-low places the device in x8 mode; data is input or output on D[7:0], while D[15:8] is placed in High-Z. Address A0 selects between the high and low byte. BYTE#-high places the device in x16 mode, and turns off the A0 input buffer, the address A1 becomes the lowest-order address bit. VPEN Input ERASE / PROGRAM / BLOCK LOCK ENABLE: For erasing array blocks, programming data, or configuring lock-bits. With VPEN VPENLK, memory contents cannot be altered. VCC Power CORE Power Supply: Core (logic) source voltage. Writes to the flash array are inhibited when VCC VLko. Caution: Device operation at invalid Vcc voltages should not be attempted. VCCQ Power I/O Power Supply: Power supply for Input/Output buffers.This ball can be tied directly to VCC. VSS Supply GROUND: Ground reference for device logic voltages. Connect to system ground. NC -- No Connect: Lead is not internally connected; it may be driven or floated. -- Reserved for Future Use: Balls designated as RFU are reserved by Numonyx for future device functionality and enhancement. RFU Datasheet 18 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 5.0 Maximum Ratings and Operating Conditions 5.1 Absolute Maximum Ratings Warning: Stressing the device beyond the "Absolute Maximum Ratings" may cause permanent damage. These are stress ratings only. NOTICE: This document contains information available at the time of its release. The specifications are subject to change without notice. Verify with your local Numonyx sales office that you have the latest datasheet before finalizing a design. Table 4: Absolute Maximum Ratings Parameter Temperature under Bias Expanded (TA, Ambient) Min Max Unit Notes -40 +85 C -- Storage Temperature -65 +125 C -- VCC Voltage -2.0 +5.6 V 2 VCCQ Voltage -2.0 +5.6 V 2 Voltage on any input/output signal (except VCC, VCCQ) -2.0 VCCQ (max) + 2.0 V 1 -- 100 mA 3 ISH Output Short Circuit Current Notes: 1. Voltage is referenced to VSS. During infrequent non-periodic transitions, the voltage potential between VSS and input/ output pins may undershoot to -2.0 V for periods < 20 ns or overshoot to VCCQ (max) + 2.0 V for periods < 20 ns. 2. During infrequent non-periodic transitions, the voltage potential between VCC and the supplies may undershoot to -2.0 V for periods < 20 ns or VSUPPLY (max) + 2.0 V for periods < 20 ns. 3. Output shorted for less than one second. No more than one output pin/ball can be shorted at a time. 5.2 Operating Conditions Warning: Operations beyond the "Operating Conditions" is not recommended and extended exposure beyond the "Operating Conditions" may affect device reliability. Table 5: Symbol Temperature and VCC Operating Condition Parameter Min Max Unit Test Condition TA Operating Temperature -40.0 +85 C Ambient Temperature VCC VCC Supply Voltage 2.70 3.6 V -- VCCQ VCCQ Supply Voltage 2.70 3.6 V -- 5.3 Power-Up/Down This section provides an overview of system level considerations with regards to the flash device. It includes a brief description of power-up/down sequence and decoupling design considerations. 5.3.1 Power-Up/Down Sequence To prevent conditions that could result in spurious program or erase operations, the power-up/power-down sequence shown in Table 6 is recommended. For DC voltage characteristics refer to Table 8. Note that each power supply must reach its minimum voltage range before applying/removing the next supply voltage. Datasheet 19 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Table 6: Power-Up/Down Sequence Power Supply Voltage Note: 1. Power-Up Sequence VCC(min) 1st VCCQ(min) 2nd VPEN(min) 3rd 1st 2nd(1) 1st(1) Power-Down Sequence 3rd Sequencing not required(1) 2nd 2nd 1st 2nd 1st(1) 2nd(1) Sequencing not required(1) 1st Power supplies connected or sequenced together. Device inputs must not be driven until all supply voltages reach their minimum range. RP# should be low during power transitions. 5.3.2 Power Supply Decoupling When the device is enabled, many internal conditions change. Circuits are energized, charge pumps are switched on, and internal voltage nodes are ramped. All of this internal activities produce transient signals. The magnitude of the transient signals depends on the device and system loading. To minimize the effect of these transient signals, a 0.1 F ceramic capacitor is required across each VCC/VSS and VCCQ signal. Capacitors should be placed as close as possible to device connections. Additionally, for every eight flash devices, a 4.7 F electrolytic capacitor should be placed between VCC and VSS at the power supply connection. This 4.7 F capacitor should help overcome voltage slumps caused by PCB trace inductance. 5.4 Reset By holding the flash device in reset during power-up and power-down transitions, invalid bus conditions may be masked. The flash device enters reset mode when RP# is driven low. In reset, internal flash circuitry is disabled and outputs are placed in a highimpedance state. After return from reset, a certain amount of time is required before the flash device is able to perform normal operations. After return from reset, the flash device defaults to asynchronous page mode. If RP# is driven low during a program or erase operation, the program or erase operation will be aborted and the memory contents at the aborted block or address are no longer valid. See Figure 12, "AC Waveform for Reset Operation" on page 28 for detailed information regarding reset timings. Datasheet 20 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 6.0 Electrical Characteristics 6.1 DC Current Specifications Table 7: Symbol DC Current Characteristics VCCQ 2.7 - 3.6V VCC 2.7 - 3.6V Parameter Test Conditions Typ Max Unit Notes ILI Input and VPEN Load Current -- 1 A VCC = VCC Max; VCCQ = VCCQ Max VIN = VCCQ or VSS 1 ILO Output Leakage Current -- 10 A VCC= VCC Max; VCCQ = VCCQ Max VIN = VCCQ or VSS 1 50 ICCS ICCD A VCC Power-Down Current Enable Truth Table for 32-, 64-, 128-Mb" on page 30), RP# = VCCQ 0.2 V VCC Standby Current 0.71 2 mA TTL Inputs, VCC = VCC Max, Vccq = VccqMax Device is disabled (see Table 50 120 A RP# = VSS 0.2 V, IOUT (STS) = 0 mA mA CMOS Inputs, VCC = VCC Max, VCCQ = VCCQ Max using standard 8 word page mode reads. Device is enabled (see Table 17, "Chip 15 ICCR 120 CMOS Inputs, VCC = VCC Max; Vccq = VccqMax Device is disabled (see Table 17, "Chip 20 17, "Chip Enable Truth Table for 32-, 64-, 128-Mb" on page 30), RP# = VIH -- Enable Truth Table for 32-, 64-, 128-Mb" on page 30) f = 5 MHz, IOUT = 0 mA 8-Word Page 1,2,3 CMOS Inputs,VCC = VCC Max, VCCQ = VCCQ Max using standard 8 word page mode reads. Device is enabled (see Table 17, "Chip 30 54 mA 35 60 mA CMOS Inputs, VPEN = VCC 40 70 mA TTL Inputs, VPEN = VCC 35 70 mA CMOS Inputs, VPEN = VCC 40 80 mA TTL Inputs, VPEN = VCC -- 10 mA Device is enabled (see Table 17, "Chip Enable Truth Table for 32-, 64-, 128-Mb" on page 30) 1,3 Enable Truth Table for 32-, 64-, 128-Mb" on page 30) f = 33 MHz, IOUT = 0 mA ICCW VCC Program or Set Lock-Bit Current ICCE ICCBC VCC Block Erase or VCC Blank Check or Clear Block Lock-Bits Current ICCWS ICCES VCC Program Suspend or Block Erase Suspend Current 1,4 1,4 1,5 Notes: 1. All currents are in RMS unless otherwise noted. These currents are valid for all product versions (packages and speeds). Contact Numonyx or your local sales office for information about typical specifications. 2. Includes STS. 3. CMOS inputs are either VCC 0.2 V or VSS 0.2 V. TTL inputs are either VIL or VIH. 4. Sampled, not 100% tested. 5. ICCWS and ICCES are specified with the device selected. If the device is read or written while in erase suspend mode, the device's current draw is ICCR and ICCWS. Datasheet 21 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 6.2 DC Voltage specifications Table 8: DC Voltage Characteristics Symbol VCCQ 2.7 - 3.6 V VCC 2.7 - 3.6 V Parameter Min Test Conditions Max Notes Unit VIL Input Low Voltage -0.5 0.8 V -- 2, 5, 6 VIH Input High Voltage 2.0 VCCQ + 0.5 V -- 2, 5, 6 -- 0.4 V VCC = VCCMin VCCQ = VCCQ Min IOL = 2 mA Output Low Voltage VOL VOH -- 0.2 V VCC = VCCMin VCCQ = VCCQ Min IOL = 100 A 0.85 x VCCQ -- V VCC = VCCMIN VCCQ = VCCQ Min IOH = -2.5 mA VCC = VCCMIN VCCQ = VCCQ Min IOH = -100 A Output High Voltage VPENLK VPEN Lockout during Program, Erase and Lock-Bit Operations VPENH VPEN during Block Erase, Program, or Lock-Bit Operations VLKO VCC Lockout Voltage 1, 2 1, 2 VCCQ - 0.2 -- V -- 2.2 V -- 2, 3 2.7 3.6 V -- 3 -- 2.0 V -- 4 Notes: 1. Includes STS. 2. Sampled, not 100% tested. 3. Block erases, programming, and lock-bit configurations are inhibited when VPEN VPENLK, and not guaranteed in the range between VPENLK (max) and VPENH (min), and above VPENH (max). 4. Block erases, programming, and lock-bit configurations are inhibited when VCC VLKO, and not guaranteed in the range between VLKO and VCC (min), and above VCC (max). 5. Includes all operational modes of the device. 6. Input/Output signals can undershoot to -1.0V referenced to VSS and can overshoot to VCCQ + 1.0V for duration of 2ns or less, the VCCQ valid range is referenced to VSS. 6.3 Capacitance Table 9: Capacitance Symbol Parameter1 Type Max Unit Condition2 CIN Input Capacitance 6 7 pF VIN = 0.0 V COUT Output Capacitance 4 5 pF VOUT = 0.0 V Notes: 1. Sampled, not 100% tested. 2. TA = -40 C to +85 C, VCC= VCCQ= 0 to 3.6 V. Datasheet 22 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 7.0 AC Characteristics Timing symbols used in the timing diagrams within this document conform to the following convention. Figure 7: Timing Signal Naming Convention t E L Q V Source Signal Target State Source State Target Signal Table 10: Timing Signal Name Decoder Signal Code State Code Address A High H Data - Read Q Low L Data - Write D High-Z Z Chip Enable (CE) E Low-Z X Output Enable (OE#) G Valid V Write Enable (WE#) W Invalid I Status (STS) R Reset (RP#) P Byte Enable (BYTE#) F Erase/Program/Block Lock Enable (VPEN) V Note: Exceptions to this convention include tACC and tAPA. tACC is a generic timing symbol that refers to the aggregate initial-access delay as determined by tAVQV, tELQV, and tGLQV (whichever is satisfied last) of the flash device. tAPA is specified in the flash device's data sheet, and is the address-to-data delay for subsequent page-mode reads. Datasheet 23 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 7.1 Read Specifications Table 11: Read Operations Asynchronous Specifications VCC = 2.7 V-3.6 V (3) and VCCQ = 2.7 V-3.6 V(3) # R1 Sym Parameter tAVAV Read/Write Cycle Time R2 tAVQV Address to Output Delay R3 tELQV CEX to Output Delay R4 tGLQV OE# to Non-Array Output Delay Density All 32 Mbit R5 tPHQV RP# High to Output Delay Min Max Unit Notes 75 -- ns 1,2 -- 75 ns 1,2 -- 75 ns 1,2 -- 25 ns 1,2,4 -- 150 64 Mbit -- 180 128 Mbit -- 210 1,2 ns 1,2 1,2 R6 tELQX CEX to Output in Low Z 0 -- ns 1,2,5 R7 tGLQX OE# to Output in Low Z 0 -- ns 1,2,5 R8 tEHQZ CEX High to Output in High Z -- 25 ns 1,2,5 R9 tGHQZ OE# High to Output in High Z -- 15 ns 1,2,5 R10 tOH Output Hold from Address, CEX, or OE# Change, Whichever Occurs First 0 -- ns 1,2,5 -- 10 ns 1,2,5 R11 All tELFL/tELFH CEX Low to BYTE# High or Low R12 tFLQV/tFHQV BYTE# to Output Delay -- 1 s 1,2 R13 tFLQZ BYTE# to Output in High Z -- 1 s 1,2,5 R14 tEHEL CEx High to CEx Low 0 -- ns 1,2,5 R15 tAPA Page Address Access Time -- 25 ns 5, 6 R16 tGLQV OE# to Array Output Delay -- 25 ns 1,2,4 Notes: 1. CEX low is defined as the combination of pins CE0, CE1 and CE2 that enable the device. CEX high is defined as the combination of pins CE0, CE1, and CE2 that disable the device (see Table 17, "Chip Enable Truth Table for 32, 64-, 128-Mb" on page 30). 2. See AC Input/Output Reference Waveforms for the maximum allowable input slew rate. 3. OE# may be delayed up to tELQV-tGLQV after the falling edge of CEX (see note 1 and Table 17, "Chip Enable Truth Table for 32-, 64-, 128-Mb" on page 30) without impact on tELQV. 4. See Figure 13, "AC Input/Output Reference Waveform" on page 29 and Figure 14, "Transient Equivalent Testing Load Circuit" on page 29 for testing characteristics. 5. Sampled, not 100% tested. 6. For devices configured to standard word/byte read mode, R15 (tAPA) will equal R2 (tAVQV). Datasheet 24 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Figure 8: Single-Word Asynchronous Read Waveform R1 R2 Address [A] R8 R3 CEx [E] R9 R4 OE # [G] WE# [W] R7 R10 R6 DQ[15:0] [Q] R13 R11 R12 BYTE# [F] R5 RP# [P ] Notes: 1. CEX low is defined as the combination of pins CE0, CE1, and CE2 that enable the device. CEX high is defined as the combination of pins CE0, CE1, and CE2 that disable the device (see Table 17, "Chip Enable Truth Table for 32, 64-, 128-Mb" on page 30). 2. When reading the flash array a faster tGLQV (R16) applies. For non-array reads, R4 applies (i.e., Status Register reads, query reads, or device identifier reads). Figure 9: 8-Word Asynchronous Page Mode Read R1 R2 A[MAX :4] [A] 000 A [3:1] [A] 001 110 111 R3 CEx [E] R4 OE # [G] R7 WE# [W] R10 R15 1 DQ[15:0] [Q] R8 R10 R6 2 R9 7 8 R5 RP# [P] BYTE # [F] Notes: 1. CEX low is defined as the combination of pins CE0, CE1, and CE2 that enable the device. CEX high is defined as the combination of pins CE0, CE1, and CE2 that disable the device (see Table 17, "Chip Enable Truth Table for , 64-, 128-Mb" on page 30). 2. In this diagram, BYTE# is asserted high. 32- Datasheet 25 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Table 12: Write Operations # Symbol W1 tPHWL (tPHEL) Parameter RP# High Recovery to WE# (CEX) Going Low Density Valid for All Speeds Min Max 32 Mbit 150 -- 64 Mbit 180 -- 128 Mbit 210 -- Unit Notes 1,2,3,4 W2 tELWL (tWLEL) W3 tWP W4 tDVWH (tDVEH) Data Setup to WE# (CEX) Going High 50 -- 1,2,3,6 W5 tAVWH (tAVEH) Address Setup to WE# (CEX) Going High 55 -- 1,2,3,6 CEX (WE#) Low to WE# (CEX) Going Low Write Pulse Width 0 -- 1,2,3,5 60 -- 1,2,3,5 W6 tWHEH (tEHWH) CEX (WE#) Hold from WE# (CEX) High 0 -- W7 tWHDX (tEHDX) Data Hold from WE# (CEX) High 0 -- W8 tWHAX (tEHAX) Address Hold from WE# (CEX) High W9 tWPH W11 tVPWH (tVPEH) VPEN Setup to WE# (CEX) Going High W12 tWHGL (tEHGL) Write Recovery before Read W13 tWHRL (tEHRL) WE# (CEX) High to STS Going Low -- 500 1,2,3,9 -- 1,2,3,4, 9,10 W15 tQVVL Write Pulse Width High VPEN Hold from Valid SRD, STS Going High All ns 1,2,3 1,2,3 0 -- 1,2,3 30 -- 1,2,3,7 0 -- 1,2,3,4 35 -- 1,2,3,8 0 Notes: 1. CEX low is defined as the combination of pins CE0, CE1, and CE2 that enable the device. CEX high is defined as the combination of pins CE0, CE1, and CE2 that disable the device (see Table 17, "Chip Enable Truth Table for 32-, 64-, 128-Mb" on page 30). 2. Read timing characteristics during block erase, program, and lock-bit configuration operations are the same as during read-only operations. Refer to AC Characteristics-Read-Only Operations. 3. A write operation can be initiated and terminated with either CEX or WE#. 4. Sampled, not 100% tested. 5. Write pulse width (tWP) is defined from CEX or WE# going low (whichever goes low last) to CEX or WE# going high (whichever goes high first). Hence, tWP = tWLWH = tELEH = tWLEH = tELWH. 6. Refer to Table 18, "Enhanced Configuration Register" on page 32 for valid AIN and DIN for block erase, program, or lock-bit configuration. 7. Write pulse width high (tWPH) is defined from CEX or WE# going high (whichever goes high first) to CEX or WE# going low (whichever goes low first). Hence, tWPH = tWHWL = tEHEL = tWHEL = tEHWL. 8. For array access, tAVQV is required in addition to tWHGL for any accesses after a write. 9. STS timings are based on STS configured in its RY/BY# default mode. 10. VPEN should be held at VPENH until determination of block erase, program, or lock-bit configuration success (SR[5:3,1] = 0). Datasheet 26 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Figure 10: Asynchronous Write Waveform W5 W8 Address [A] W6 CEx (WE#) [E (W)] W2 W3 W9 WE# (CEx) [W (E)] OE# [G] W4 W7 D DATA [D/Q ] W13 STS [R] W1 RP# [P] W11 VPEN [V] Figure 11: Asynchronous Write to Read Waveform W5 W8 Address [A] W6 CEx [E] W2 W3 WE# [W] W12 OE # [G] W4 W7 D DATA [D/Q] W1 RP# [P] W11 VPEN [V ] Datasheet 27 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 7.2 Program, Erase, Block-Lock Specifications Table 13: Configuration Performance # Symbol Parameter W200 tPROG/W W250 tPROG W501 tERS/AB Block Erase Time W650 tlks W651 tlkc Program Time Single word Typ Max Unit Notes 40 175 s 1,2,3,4,6 Aligned 16 Words BP Time (32 Bytes) 128 654 s 1,2,3,4,5,6 Aligned 128 Words BP Time (256 Bytes) 400 2000 s 1,2,3,4,5,6 Aligned 256 Words BP Time 720 3600 s 1,2,3,4,5,6 1.0 4.0 sec 1,2,3,4,6 Set Lock-Bit Time 50 60 s 1,2,3,4,6 Clear Block Lock-Bits Time 0.5 1 sec 1,2,3,4,6 Buffer Program Time W600 tSUSP/P Program Suspend Latency Time to Read 15 20 s 1,2,3,6 W601 tSUSP/E Erase Suspend Latency Time to Read 15 20 s 1,2,3,6 W602 tERS/SUSP Erase to Suspend 500 -- s 1,7 W652 tSTS STS Pulse Width Low Time 500 -- ns 1 W702 tBC/MB 3.2 -- ms -- blank check Array Block Notes: 1. Typical values measured at TA = +25 C and nominal voltages. Assumes corresponding lock-bits are not set. Subject to change based on device characterization. 2. These performance numbers are valid for all speed versions. 3. Sampled but not 100% tested. 4. Excludes system-level overhead. 5. These values are valid when the buffer is full, and the start address is aligned. 6. Max values are measured at worst case temperature, data pattern and VCC corner within 100K cycles. But for W650, W651, W600 and W601, the Max value are expressed at +25 C or -40 C. 7. W602 is the typical time between an initial block erase or erase resume command and then a subsequent erase suspend command. Violating the specification repeatedly during any particular block erase may cause erase failures. 7.3 Reset Specifications Figure 12: AC Waveform for Reset Operation STS (R) P1 RP# (P) P3 Vcc Note: STS is shown in its default mode (RY/BY#). Datasheet 28 P2 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Table 14: Reset Specifications # Symbol Parameter Min Max Unit Notes RP# is asserted during block erase, program or lock-bit configuration operation 25 -- s 1 RP# is asserted during read tPLPH RP# Pulse Low Time (If RP# is tied to VCC, this specification is not applicable) 100 -- ns 1 P2 tPHRH RP# High to Reset during Block Erase, Program, or Lock-Bit Configuration -- 100 ns 1,2 P3 tVCCPH Vcc Power Valid to RP# de-assertion (high) 60 -- s -- P1 Notes: 1. These specifications are valid for all product versions (packages and speeds). 2. A reset time, tPHQV, is required from the latter of STS (in RY/BY# mode) or RP# going high until outputs are valid. 7.4 AC Test Conditions Figure 13: AC Input/Output Reference Waveform VCCQ Input VCCQ/2 Test Points VCCQ/2 Output 0.0 Note: AC test inputs are driven at VCCQ for a Logic "1" and 0.0 V for a Logic "0." Input timing begins, and output timing ends, at VCCQ/2 V (50% of VCCQ). Input rise and fall times (10% to 90%) < 5 ns. Figure 14: Transient Equivalent Testing Load Circuit Device Under Test Note: Out CL CL Includes Jig Capacitance Table 15: Test Configuration Test Configuration CL (pF) VCCQ = VCCQMIN 30 Datasheet 29 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 8.0 Bus Interface This section provides an overview of Bus operations. The on-chip Write State Machine (WSM) manages all erase and program algorithms. The system CPU provides control of all in-system read, write, and erase operations through the system bus. All bus cycles to or from the flash memory conform to standard microprocessor bus cycles. Table 16 summarizes the necessary states of each control signal for different modes of operations. Table 16: Bus Operations RP# CEx(1) OE#(2) WE#(2) VPEN DQ15:0(3) STS (Default Mode) Notes Async., Status, Query and Identifier Reads VIH Enabled VIL VIH X DOUT High Z 4,6 Output Disable VIH Enabled VIH VIH X High Z High Z -- Standby VIH Disabled X X X High Z High Z -- Reset/Power-down VIL X X X X High Z High Z -- Command Writes VIH Enabled VIH VIL X DIN High Z 6,7 Array Writes VIH Enabled VIH VIL VPENH X VIL 5,8 Mode Notes: 1. 2. 3. 4. 5. 6. 7. 8. See Table 17 for valid CEx configurations. OE# and WE# should never be asserted simultaneously. If done so, OE# overrides WE#. DQ refers to DQ[7:0] when BYTE# is low and DQ[15:0] if BYTE# is high. Refer to DC characteristics. When VPEN VPENLK, memory contents can be read but not altered. X should be VIL or VIH for the control pins and VPENLK or VPENH for VPEN. For outputs, X should be VOL or VOH. In default mode, STS is VOL when the WSM is executing internal block erase, program, or a lock-bit configuration algorithm. It is VOH (pulled up by an external pull up resistance 10k) when the WSM is not busy, in block erase suspend mode (with programming inactive), program suspend mode, or reset power-down mode. See Section 11.0, "Device Command Codes" on page 47 for valid DIN (user commands) during a Write operation. Array writes are either program or erase operations. Table 17: Chip Enable Truth Table for 32-, 64-, 128-Mb Note: CE2 CE1 DEVICE VIL VIL VIL Enabled VIL VIL VIH Disabled VIL VIH VIL Disabled VIL VIH VIH Disabled VIH VIL VIL Enabled VIH VIL VIH Enabled VIH VIH VIL Enabled VIH VIH VIH Disabled For single-chip applications, CE2 and CE1 can be connected to VSS. Datasheet 30 CE0 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 8.1 Bus Reads Reading from flash memory outputs stored information to the processor or chipset, and does not change any contents. Reading can be performed an unlimited number of times. Besides array data, other types of data such as device information and device status are available from the flash. To perform a bus read operation, CEx (refer to Table 17 on page 30) and OE# must be asserted. CEx is the device-select control; when active, it enables the flash memory device. OE# is the data-output control; when active, the addressed flash memory data is driven onto the I/O bus. For all read states, WE# and RP# must be de-asserted. See Section 9.2, "Read Operations" on page 35. 8.1.1 Asynchronous Page Mode Read Unlike J3 130nm devices, J3 65 nm SBC device provides Eight-Word Asynchronous Page mode only. Array data can be sensed up to eight words (16 Bytes) at a time. This is the default mode on power-up or reset. On J3 130nm devices, the Set Enhanced Configuration Register command is used to enable Eight-Word Page mode upon power-up or reset, however this has no effect on J3 65 nm SBC device anymore. After the initial access delay, the first word out of the page buffer corresponds to the initial address. Address bits A[3:1] determine which word is output from the page buffer for a x16 bus width, and A[3:0] determine which byte is output from the page buffer for a x8 bus width. Subsequent reads from the device come from the page buffer. These reads are output on DQ[15:0] for a x16 bus width and DQ[7:0] for a x8 bus width after a minimum delay by changing A[3:1] or A[3:0]. Data can be read from the page buffer multiple times, and in any order.If address bits A[MAX:4] change at any time, or if CEx# is toggled, the device will sense and load new data into the page buffer. Asynchronous Page mode is the default read mode on powerup or reset. To perform a Page mode read after any other operation, the Read Array command must be issued to read from the flash array. Asynchronous Page mode reads are permitted in all blocks and are used to access register information. During register access, only one word is loaded into the page buffer. 8.1.1.1 Enhanced Configuration Register The Enhanced Configuration Register (ECR) is a volatile storage register that when addressed by the Set ECR command can select between Four-Word Page mode and Eight-Word Page mode on J3 130nm devices, however this has no effect on J3 65 nm SBC device. The ECR is volatile; all bits will be reset to default values when RP# is deasserted or power is removed from the device. To modify ECR settings, use the Set ECR command. The Set ECR command is written along with the configuration register value, which is placed on the lower 16 bits of the address bus A[16:1]. This is followed by a second write that confirms the operation and again presents the ECR data on the address bus. After executing this command, the device returns to Read Array mode. The ECR is shown in Table 18. 8-word page mode Command Bus-Cycle is captured in Table 19 for backward compatibility reasons. Note: If the 8-word Asynchronous Page mode is used on J3 65 nm SBC, a Clear Status Register command must be executed after issuing the Set ECR command. Datasheet 31 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Table 18: Enhanced Configuration Register Reserved ECR 15 Page Length ECR 14 ECR 13 Reserved ECR 12 ECR 11 BITS ECR 10 ECR 9 ECR 8 ECR 7 ECR 6 ECR 5 ECR 4 DESCRIPTION ECR[15:14] RFU ECR.13 * * ECR[12:0] RFU ECR 3 ECR 2 ECR 1 ECR 0 NOTES All bits should be set to 0. "1" = 8-Word Page mode "0" = 8-Word Page mode (Default) Either "1" or "0" is for 8-word sense in page mode. All bits should be set to 0. Table 19: Asynchronous 8-Word Page Mode Command Bus-Cycle Definition Command Set Enhanced Configuration Register (Set ECR) First Bus Cycle Second Bus Cycle Bus Cycles Required Oper Addr(1) Data Oper Addr(1) Data 2 Write ECD 0060h Write ECD 0004h 1. ECD = Enhanced Configuration Register Data 8.1.2 Output Disable With CEx asserted, and OE# at a logic-high level (VIH), the device outputs are disabled. Output signals DQ[15:0] are placed in a high-impedance state. 8.2 Bus Writes Writing or Programming to the device, is where the host writes information or data into the flash device for non-volatile storage. When the flash device is programmed, `ones' are changed to `zeros'. `Zeros' cannot be programed back to `ones'. To do so, an erase operation must be performed. Writing commands to the Command User Interface (CUI) enables various modes of operation, including the following: * Reading of array data * Common Flash Interface (CFI) data * Identifier codes, inspection, and clearing of the Status Register * Block Erasure, Program, and Lock-bit Configuration (when VPEN = VPENH) Erasing is performed on a block basis - all flash cells within a block are erased together. Any information or data previously stored in the block will be lost. Erasing is typically done prior to programming. The Block Erase command requires appropriate command data and an address within the block to be erased. The Byte/Word Program command requires the command and address of the location to be written. Set Block Lock-Bit commands require the command and block within the device to be locked. The Clear Block Lock-Bits command requires the command and address within the device to be cleared. The CUI does not occupy an addressable memory location. It is written when the device is enabled and WE# is active. The address and data needed to execute a command are latched on the rising edge of WE# or CEX (CEX low is defined as the combination of pins CE0, CE1, and CE2 that enable the device. CEX high is defined as the combination of pins CE0, CE1, and CE2 that disable the device. See Table 17 on page 30). Standard microprocessor write timings are used. Datasheet 32 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 8.3 Standby CE0, CE1, and CE2 can disable the device (see Table 17 on page 30) and place it in standby mode. This manipulation of CEx substantially reduces device power consumption. DQ[15:0] outputs are placed in a high-impedance state independent of OE#. If deselected during block erase, program, or lock-bit configuration, the WSM continues functioning, and consuming active power until the operation completes. 8.3.1 Reset/Power-Down RP# at VIL initiates the reset/power-down mode. In read modes, RP#-low deselects the memory, places output drivers in a highimpedance state, and turns off numerous internal circuits. RP# must be held low for a minimum of tPLPH. Time tPHQV is required after return from reset mode until initial memory access outputs are valid. After this wake-up interval, normal operation is restored. The CUI is reset to read array mode and Status Register is set to 0080h. During Block Erase, Program, or Lock-Bit Configuration modes, RP#-low will abort the operation. In default mode, STS transitions low and remains low for a maximum time of tPLPH + tPHRH until the reset operation is complete. Memory contents being altered are no longer valid; the data may be partially corrupted after a program or partially altered after an erase or lock-bit configuration. Time tPHWL is required after RP# goes to logic-high (VIH) before another command can be written. As with any automated device, it is important to assert RP# during system reset. When the system comes out of reset, it expects to read from the flash memory. Automated flash memories provide status information when accessed during Block Erase, Program, or Lock-Bit Configuration modes. If a CPU reset occurs with no flash memory reset, proper initialization may not occur because the flash memory may be providing status information instead of array data. Numonyx Flash memories allow proper initialization following a system reset through the use of the RP# input. In this application, RP# is controlled by the same RESET# signal that resets the system CPU. 8.4 Device Commands When VPEN VPENLK, only read operations from the Status Register, CFI, identifier codes, or blocks are enabled. Placing VPENH on VPEN additionally enables block erase, program, and lock-bit configuration operations. Device operations are selected by writing specific commands to the Command User Interface (CUI). The CUI does not occupy an addressable memory location. It is the mechanism through which the flash device is controlled. A command sequence is issued in two consecutive write cycles - a Setup command followed by a Confirm command. However, some commands are single-cycle commands consisting of a setup command only. Generally, commands that alter the contents of the flash device, such as Program or Erase, require at least two write cycles to guard against inadvertent changes to the flash device. Flash commands fall into two categories: Basic Commands and Extended Commands. Basic commands are recognized by all Numonyx Flash devices, and are used to perform common flash operations such as selecting the read mode, programming the array, or erasing blocks. Extended commands are product-dependant; they are used to perform additional features such as software block locking. Section 11.0, "Device Command Codes" on page 47 describes all applicable commands on J3 65 nm SBC device. Datasheet 33 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 9.0 Flash Operations This section describes the operational features of flash memory. Operations are command-based, wherein command codes are first issued to the device, then the device performs the desired operation. All command codes are issued to the device using bus-write cycles (see Chapter 8.0, "Bus Interface"). A complete list of available command codes can be found in Section 11.0, "Device Command Codes" on page 47. 9.1 Status Register The Status Register (SR) is an 8-bit, read-only register that indicates device status and operation errors. To read the Status Register, issue the Read Status Register command. Subsequent reads output Status Register information on DQ[7:0], and 00h on DQ[15:8]. SR status bits are set and cleared by the device. SR error bits are set by the device, but must be cleared using the Clear Status Register command. Upon power-up or exit from reset, the Status Register defaults to 80h. Page-mode reads are not supported in this read mode. Status Register contents are latched on the falling edge of OE# or CEX (CEX low is defined as the combination of pins CE0, CE1, and CE2 that enable the device. CEX high is defined as the combination of pins CE0, CE1, and CE2 that disable the device). OE# must toggle to VIH or the device must be disabled before further reads to update the Status Register latch. The Read Status Register command functions independently of VPEN voltage. Table 20 shows Status Register bit definitions. Table 20: Status Register Bit Definitions Status Register (SR) Default Value = 80h Ready Status Erase Suspend Status Erase Error Program Error Program/ Erase Voltage Error Program Suspend Status Block-Locked Error Reserved 7 6 5 4 3 2 1 0 Bit Name Description 7 Ready Status 0 = Device is busy. SR[6:0] are invalid (Not driven); 1 = Device is ready. SR[6:0] are valid. 6 Erase Suspend Status 0 = Erase suspend not in effect. 1 = Erase suspend in effect. 5 4 3 Erase Error Program Error Command Sequence Error Program/Erase Voltage Error SR.5 SR.4 0 0 = Program or erase operation successful. 0 1 = Program error - operation aborted. 1 0 = Erase error - operation aborted. 1 1 = Command sequence error - command aborted. 0 = Within acceptable limits during program or erase operation. 1 = Not within acceptable limits during program or erase operation - Operation aborted. 2 Program Suspend Status 0 = Program suspend not in effect. 1 = Program suspend in effect. 1 Block-Locked Error 0 = Block NOT locked during program or erase - operation successful. 1 = Block locked during program or erase - operation aborted. 0 Reserved Reserved Datasheet 34 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 9.1.1 Clearing the Status Register The Status Register (SR) contain Status and error bits which are set by the device. SR status bits are cleared by the device, however SR error bits are cleared by issuing the Clear SR command (see Table 21). Resetting the device also clears the SR. Table 21: Clear Status Register Command Bus-Cycles Setup Write Cycle Command Clear Status Register Confirm Write Cycle Address Bus Data Bus Address Bus Data Bus Device Address 0050h -- -- Issuing the Clear SR command places the device in Read SR mode. Note: Care should be taken to avoid SR ambiguity. If a command sequence error occurs while in an Erase Suspend condition, the SR will indicate a Command Sequence error by setting SR.4 and SR.5. When the erase operation is resumed (and finishes), any errors that may have occurred during the erase operation will be masked by the Command Sequence error. To avoid this situation, clear the Status Register prior to resuming a suspended erase operation. The Clear SR command functions independent of the voltage level on VPEN. 9.2 Read Operations Four types of data can be read from the device: array data, device information, CFI data, and device status. Upon power-up or return from reset, the device defaults to Read Array mode. To change the device's read mode, the appropriate command must be issued to the device. Table 22 shows the command codes used to configure the device for the desired read mode. The following sections describe each read mode. Table 22: Read Mode Command Bus-Cycles Command Setup Write Cycle Address Bus Confirm Write Cycle Data Bus Address Bus Data Bus Read Array Device Address 00FFh -- -- Read Status Register Device Address 0070h -- -- Read Device Information Device Address 0090h -- -- CFI Query Device Address 0098h -- -- 9.2.1 Read Array Upon power-up or return from reset, the device defaults to Read Array mode. Issuing the Read Array command places the device in Read Array mode. Subsequent reads output array data on DQ[15:0]. The device remains in Read Array mode until a different read command is issued, or a program or erase operation is performed, in which case, the read mode is automatically changed to Read Status. To change the device to Read Array mode while it is programming or erasing, first issue the Suspend command. After the operation has been suspended, issue the Read Array command. When the program or erase operation is subsequently resumed, the device will automatically revert back to Read Status mode. Note: Issuing the Read Array command to the device while it is actively programming or erasing causes subsequent reads from the device to output invalid data. Valid array data is output only after the program or erase operation has finished. Datasheet 35 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) The Read Array command functions independent of the voltage level on VPEN. 9.2.2 Read Status Register Issuing the Read Status Register command places the device in Read Status Register mode. Subsequent reads output Status Register information on DQ[7:0], and 00h on DQ[15:8]. The device remains in Read Status Register mode until a different readmode command is issued. Performing a program, erase, or block-lock operation also changes the device's read mode to Read Status Register mode. The Status Register is updated on the falling edge of OE# or CEx, whichever occurs last. Status Register contents are valid only when SR.7 = 1. When WSM is active, SR.7 indicates the WSM's state and SR[6:0] are in high-Z state. The Read Status Register command functions independent of the voltage level on VPEN. 9.2.3 Read Device Information Issuing the Read Device Information command places the device in Read Device Information mode. Subsequent reads output device information on DQ[15:0]. The device remains in Read Device Information mode until a different read command is issued. Also, performing a program, erase, or block-lock operation changes the device to Read Status Register mode. The Read Device Information command functions independent of the voltage level on VPEN. 9.2.4 CFI Query The CFI query table contains an assortment of flash product information such as block size, density, allowable command sets, electrical specifications, and other product information. The data contained in this table conforms to the CFI protocol. Issuing the CFI Query command places the device in CFI Query mode. Subsequent reads output CFI information on DQ[15:0]. The device remains in CFI Query mode until a different read command is issued, or a program or erase operation is performed, which changes the read mode to Read Status Register mode. The CFI Query command functions independent of the voltage level on VPEN. 9.3 Programming Operations All programming operations require the addressed block to be unlocked, and a valid VPEN voltage applied throughout the programming operation. Otherwise, the programming operation will abort, setting the appropriate Status Register error bit(s). The following sections describe each programming method. 9.3.1 Single-Word/Byte Programming Array programming is performed by first issuing the Single-Word/Byte Program command. This is followed by writing the desired data at the desired array address. The read mode of the device is automatically changed to Read Status Register mode, which remains in effect until another read-mode command is issued. Datasheet 36 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) During programming, STS and the Status Register indicate a busy status (SR.7 = 0). Upon completion, STS and the Status Register indicate a ready status (SR.7 = 1). The Status Register should be checked for any errors (SR.4), then cleared. Note: Issuing the Read Array command to the device while it is actively programming causes subsequent reads from the device to output invalid data. Valid array data is output only after the program operation has finished. Standby power levels are not be realized until the programming operation has finished. Also, asserting RP# aborts the programming operation, and array contents at the addressed location are indeterminate. The addressed block should be erased, and the data re-programmed. If a Single-Word/Byte program is attempted when the corresponding block lock-bit is set, SR.1 and SR.4 will be set. 9.3.2 Buffered Programming Buffered programming operations simultaneously program multiple words/bytes into the flash memory array, significantly reducing effective word-write/byte-write times. User-data is first written to a write buffer, then programmed into the flash memory array in buffer-size increments. For additional details, see the flow chart of the buffered-programming operation. Optimal performance and power consumption is realized by aligning the start address on 256-Word boundaries (i.e., A[8:1] = 00000000b). Crossing a 256-Word boundary during a buffered programming operation can cause programming time to double. To perform a buffered programming operation, first issue the Buffered Program setup command at the desired starting address. The read mode of the device/addressed partition is automatically changed to Read Status Register mode. Polling SR.7 determines write-buffer availability (0 = not available, 1 = available). If the write buffer is not available, re-issue the setup command and check SR.7; repeat until SR.7 = 1. Note: The device defaults to output SR data after the Buffered Programming Setup command (E8h) is issued. CE# and OE# must be toggled to update Status Register. Don't issue the Read SR command (70h), which would be interpreted by the internal state machine as Buffer Word Count. Next, issue the word count at the desired starting address. The word count represents the total number of words to be written into the write buffer, minus one. This value can range from 00h (one) to a maximum of FFh (256). Exceeding the allowable range causes an abort. Note: The maximum number of bytes in write buffer on CFI region (offset 2Ah, refer Table 41, "Device Geometry Definition" on page 60) is set to 05h (32 bytes) for backward compatible reasons. No software change is required on existing applications for both x8 and x16 mode. Applications can optimize the system performance using the maximum of 256 buffer size. Please contact your sales representatives for questions. Following the word count, the write buffer is filled with user-data. Subsequent buswrite cycles provide addresses and data, up to the word count. All user-data addresses must lie between <starting address> and <starting address + word count>, otherwise the WSM continues to run as normal but, user may advertently change the content in unexpected address locations. Note: User-data is programmed into the flash array at the address issued when filling the write buffer. Datasheet 37 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) After all user-data is written into the write buffer, issue the confirm command. If a command other than the confirm command is issued to the device, a command sequence error occurs and the operation aborts. Note: After issuing the confirm command, write-buffer contents are programmed into the flash memory array. The Status Register indicates a busy status (SR.7 = 0) during array programming.Issuing the Read Array command to the device while it is actively programming or erasing causes subsequent reads from the device to output invalid data. Valid array data is output only after the program or erase operation has finished. Upon completion of array programming, the Status Register indicates ready (SR.7 = 1). A full Status Register check should be performed to check for any programming errors, then cleared by using the Clear Status Register command. Additional buffered programming operations can be initiated by issuing another setup command, and repeating the buffered programming bus-cycle sequence. However, any errors in the Status Register must first be cleared before another buffered programming operation can be initiated. 9.4 Block Erase Operations Erasing a block changes `zeros' to `ones'. To change ones to zeros, a program operation must be performed (See Section 9.3, "Programming Operations"). Erasing is performed on a block basis - an entire block is erased each time an erase command sequence is issued. Once a block is fully erased, all addressable locations within that block read as logical ones (FFFFh for x16 mode, FFh for x8 mode). Only one block-erase operation can occur at a time, and is not permitted during a program suspend. To perform a block-erase operation, issue the Block Erase command sequence at the desired block address. Table 23 shows the two-cycle Block Erase command sequence. Table 23: Block-Erase Command Bus-Cycles Command Block Erase Note: Setup Write Cycle Confirm Write Cycle Address Bus Data Bus Address Bus Data Bus Block Address 0020h Block Address 00D0h A block-erase operation requires the addressed block to be unlocked, and a valid voltage applied to VPEN throughout the block-erase operation. Otherwise, the operation will abort, setting the appropriate Status Register error bit(s). The Erase Confirm command latches the address of the block to be erased. The addressed block is preconditioned (programmed to all zeros), erased, and then verified. The read mode of the device is automatically changed to Read Status Register mode, and remains in effect until another read-mode command is issued. During a block-erase operation, STS and the Status Register indicates a busy status (SR.7 = 0). Upon completion, STS and the Status Register indicates a ready status (SR.7 = 1). The Status Register should be checked for any errors, then cleared. If any errors did occur, subsequent erase commands to the device are ignored unless the Status Register is cleared. The only valid commands during a block erase operation are Read Array, Read Device Information, CFI Query, and Erase Suspend. After the block-erase operation has completed, any valid command can be issued. Datasheet 38 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Note: Issuing the Read Array command to the device while it is actively erasing causes subsequent reads from the device to output invalid data. Valid array data is output only after the block-erase operation has finished. Standby power levels are not be realized until the block-erase operation has finished. Also, asserting RP# aborts the block-erase operation, and array contents at the addressed location are indeterminate. The addressed block should be erased before programming within the block is attempted. 9.5 Blank Check The Blank Check operation determines whether a specified array block is blank (i.e. completely erased). Without Blank Check, Block Erase would be the only other way to ensure a block is completely erased. Blank Check is especially useful in the case of erase operation interrupted by a power loss event. Blank Check can apply to only one block at a time, and no operations other than Status Register Reads are allowed during Blank Check (e.g. reading array data, program, erase etc.). Suspend and resume operations are not supported during Blank Check, nor is Blank Check supported during any suspended operations. Blank Check operations are initiated by writing the Block Blank Check command to the block address. Next, the Blank Check Confirm command is issued along with the same block address. When a successful command sequence is entered, the device automatically enters the Read Status State. The WSM then reads the entire specified block, and determines whether any bit in the block is programmed or over-erased. The status register can be examined for Blank Check progress and errors by reading any address within the block being accessed. During a blank check operation, the Status Register indicates a busy status (SR.7 = 0). Upon completion, the Status Register indicates a ready status (SR.7 = 1). The Status Register should be checked for any errors, and then cleared. If the Blank Check operation fails, which means the block is not completely erased, the Status Register bit SR.5 will be set ("1"). CE# or OE# toggle (during polling) updates the Status Register. The device remains in Status Register Mode until another command is written to the device. After examining the Status Register, it should be cleared by the Clear Status Register command before issuing a new command. Any command can follow once the Blank Check command is complete. 9.6 Suspend and Resume An erase or programming operation can be suspended to perform other operations, and then subsequently resumed. Table 24 shows the Suspend and Resume command buscycles. Note: All erase and programming operations require the addressed block to remain unlocked with a valid voltage applied to VPEN throughout the suspend operation. Otherwise, the block-erase or programming operation will abort, setting the appropriate Status Register error bit(s). Also, asserting RP# aborts suspended block-erase and Datasheet 39 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) programming operations, rendering array contents at the addressed location(s) indeterminate. Table 24: Suspend and Resume Command Bus-Cycles Command Setup Write Cycle Address Bus Data Bus Confirm Write Cycle Address Bus Data Bus Suspend Device Address 00B0h -- -- Resume Device Address 00D0h -- -- To suspend an on-going erase or program operation, issue the Suspend command to any device address. The program or erase operation suspends at pre-determined points during the operation after a delay of tSUSP. Suspend is achieved whenSTS (in RY/BY# mode) goes high, SR[7,6] = 1 (erase-suspend) or SR[7,2] = 1 (program-suspend). Note: Issuing the Suspend command does not change the read mode of the device. The device will be in Read Status Register mode from when the erase or program command was first issued, unless the read mode was changed prior to issuing the Suspend command. Not all commands are allowed when the device is suspended. Table 25 shows which device commands are allowed during Program Suspend or Erase Suspend. Table 25: Valid Commands During Suspend Device Command Program Suspend Erase Suspend STS Configuration Allowed Allowed Read Array Allowed Allowed Read Status Register Allowed Allowed Clear Status Register Allowed Allowed Read Device Information Allowed Allowed Allowed Allowed Not Allowed Allowed CFI Query Word/Byte Program Buffered Program Not Allowed Allowed Block Erase Not Allowed Not Allowed Program Suspend Not Allowed Allowed Erase Suspend Not Allowed Not Allowed Program/Erase Resume Allowed Allowed Lock Block Not Allowed Not Allowed Unlock Block Not Allowed Not Allowed Program OTP Register Not Allowed Not Allowed Blank Check Not Allowed Not Allowed During Suspend, array-read operations are not allowed in blocks being erased or programmed. A block-erase under program-suspend is not allowed. However, word-program under erase-suspend is allowed, and can be suspended. This results in a simultaneous erasesuspend/ program-suspend condition, indicated by SR[7,6,2] = 1. Datasheet 40 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) To resume a suspended program or erase operation, issue the Resume command to any device address. The read mode of the device is automatically changed to Read Status Register. The operation continues where it left off, STS (in RY/BY# mode) goes low, and the respective Status Register bits are cleared. When the Resume command is issued during a simultaneous erase-suspend/ programsuspend condition, the programming operation is resumed first. Upon completion of the programming operation, the Status Register should be checked for any errors, and cleared. The resume command must be issued again to complete the erase operation. Upon completion of the erase operation, the Status Register should be checked for any errors, and cleared. 9.7 Status Signal The STATUS (STS) signal can be configured to different states using the STS Configuration command (Table 26). Once the STS signal has been configured, it remains in that configuration until another Configuration command is issued or RP# is asserted low. Initially, the STS signal defaults to RY/BY# operation where RY/BY# low indicates that the WSM is busy. RY/BY# high indicates that the state machine is ready for a new operation or suspended. Table 27 displays possible STS configurations. Table 26: STS Configuration Register Command Bus-Cycles Setup Write Cycle Confirm Write Cycle Command Address Bus STS Configuration Device Address Data Bus 00B8h Address Bus Device Address Data Bus Register Data To reconfigure the STATUS (STS) signal to other modes, the Configuration command is given followed by the desired configuration code. The three alternate configurations are all pulse mode for use as a system interrupt as described in the following paragraphs. For these configurations, bit 0 controls Erase Complete interrupt pulse, and bit 1 controls Program Complete interrupt pulse. Supplying the 00h configuration code with the Configuration command resets the STS signal to the default RY/BY# level mode. The Configuration command may only be given when the device is not busy or suspended. Check SR.7 for device status. An invalid configuration code will result in SR.4 and SR.5 being set. Note: STS Pulse mode is not supported in the Clear Lock Bits and Set Lock Bit commands. Datasheet 41 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Table 27: STS Configuration Register and Coding Definitions D7 D6 D5 D4 D3 D2 Reserved3 D[1:0] = STS Configuration Codes2 D1 D0 Pulse on Program Complete1 Pulse on Erase Complete1 Notes 00 = default, level mode; device ready indication Controls HOLD to a memory controller to prevent accessing a flash memory subsystem while any flash device's WSM is busy. 01 = pulse on Erase Complete Generates a system interrupt pulse when any flash device in an array has completed a block erase. Helpful for reformatting blocks after file system free space reclamation or "cleanup." 10 = pulse on Program Complete Not supported on this device. 11 = pulse on Erase or Program Complete Generates system interrupts to trigger servicing of flash arrays when either erase or program operations are completed, when a common interrupt service routine is desired. Notes: 1. When configured in one of the pulse modes, STS pulses low with a typical pulse width of 500 ns. 2. An invalid configuration code will result in both SR.4 and SR.5 being set. 3. Reserved bits are invalid should be ignored. 9.8 Security and Protection J3 65 nm SBC device offers both hardware and software security features. Block lock operations, PRs and VPEN allow users to implement various levels of data protection. 9.8.1 Normal Block Locking J3 65 nm SBC has the capability of Flexible Block Locking (locked blocks remain locked upon reset or power cycle): All blocks within the device are in unlocked state when ship from Numonyx. Blocks can be locked individually by issuing the Set Block Lock Bit command sequence to any address within a block. Once locked, blocks remain locked when power is removed, or when the device is reset. All locked blocks are unlocked simultaneously by issuing the Clear Block Lock Bits command sequence to any device address. Locked blocks cannot be erased or programmed. Table 28 summarizes the command bus-cycles. Table 28: Block Locking Command Bus-Cycles Command Set Block Lock Bit Clear Block Lock Bits Setup Write Cycle Confirm Write Cycle Address Bus Data Bus Address Bus Data Bus Block Address 0060h Block Address 0001h Device Address 0060h Device Address 00D0h After issuing the Set Block Lock Bit setup command or Clear Block Lock Bits setup command, the device's read mode is automatically changed to Read Status Register mode. After issuing the confirm command, completion of the operation is indicated by STS (in RY/BY# mode) going high and SR.7 = 1. Blocks cannot be locked or unlocked while programming or erasing, or while the device is suspended. Reliable block lock and unlock operations occur only when VCC and VPEN are valid. When VPEN VPENLK, block lock-bits cannot be changed. Datasheet 42 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) When the set lock-bit operation is complete, SR.4 should be checked for any error. When the clear lock-bit operation is complete, SR.5 should be checked for any error. Errors bits must be cleared using the Clear Status Register command. Block lock-bit status can be determined by first issuing the Read Device Information command, and then reading from <block base address> + 02h. DQ0 indicates the lock status of the addressed block (0 = unlocked, 1 = locked). 9.8.2 Configurable Block Locking J3 65 nm SBC devices feature user-configurable block locking. This feature can be implemented to protect and/or secure the user's system. The user can individually set each block as Non-Volatile Temporary, Non-Volatile Semi-Permanent or Non-Volatile Permanent. For additional information and collateral, please contact the sales representative. 9.8.3 Password Access Password Access is a security enhancement offered on the J3 65 nm SBC device. This feature protects information stored in main-array memory blocks by preventing content alteration or reads, until a valid 64-bit password is received. Password Access may be combined with Non-Volatile Protection and/or Volatile Protection to create a multitiered solution. Please contact your Numonyx Sales for further details concerning Password Access. 9.8.4 128-bit OTP Protection Register J3 65 nm SBC includes a 128-bit Protection Register (PR) that can be used to increase the security of a system design. For example, the number contained in the PR can be used to "match" the flash component with other system components such as the CPU or ASIC, hence preventing device substitution. The 128-bits of the PR are divided into two 64-bit segments: * One segment is programmed at the Numonyx factory with a unique unalterable 64bit number. * The other segment is left blank for customer designers to program as desired. Once the customer segment is programmed, it can be locked to prevent further programming. 9.8.5 Reading the 128-bit OTP Protection Register The Protection Register is read in Identification Read mode. The device is switched to this mode by issuing the Read Identifier command (0090h). Once in this mode, read cycles from addresses shown in Table 31, "Word-Wide Protection Register Addressing" or Table 32, "Byte-Wide Protection Register Addressing" retrieve the specified information. To return to Read Array mode, write the Read Array command (00FFh). 9.8.6 Programming the 128-bit OTP Protection Register PR bits are programmed using the two-cycle Program OTP Register command. The 64bit number is programmed 16 bits at a time for word-wide configuration and eight bits at a time for byte-wide configuration. First write the Protection Program Setup command, 00C0h. The next write to the device will latch in address and data and program the specified location. The allowable addresses are shown in Table 31, "WordWide Protection Register Addressing" on page 45 or Table 32, "Byte-Wide Protection Register Addressing" on page 45. See Figure 24, "Protection Register Programming Datasheet 43 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Flowchart" on page 56. Any attempt to address Program OTP Register command outside the defined PR address space will result in a Status Register error (SR.4 will be set). Attempting to program a locked PR segment will result in a Status Register error (SR.4 and SR.1 will be set). Table 29: Programming the 128-bit Protection Register Command Bus-Cycles First Bus Cycle Second Bus Cycle Command Program OTP Register 9.8.7 Address Bus Data Bus Address Bus Data Bus Device Address 00C0h Register Offset Register Data Locking the 128-bit OTP Protection Register The user-programmable segment of the PR is lockable by programming Bit 1 of the Protection Lock Register (PLR) to 0. Bit 0 of this location is programmed to 0 at the Numonyx factory to protect the unique device number. Bit 1 is set using the Protection Program command to program "0xFFFD" to the PLR. After these bits have been programmed, no further changes can be made to the values stored in the Protection Register. Protection Program commands to a locked section will result in a Status Register error (SR.4 and SR.1 will be set). The PR lockout state is not reversible. Table 30: Programming Protection Lock Register Command Bus-Cycles First Bus Cycle Second Bus Cycle Command Program OTP Register Address Bus Data Bus Address Bus Data Bus Device Address 00C0h 80h FFFDh Figure 15: 128-bit Protection Register Memory Map 128-Mbit: A[23:1] Word Address 64-Mbit: A[22:1] 32-Mbit: A[21:1] 128-Bit Protection Register 0x88 0x87 0x86 0x85 0x84 0x83 0x82 0x81 0x80 64- bit Segment ( User- Programmable) 64- bit Segment ( Factory- Programmed) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Protection Lock Register Note: A0 is not used in x16 mode when accessing the protection register map. See A0 is used, see Table 32 for x8 addressing. Datasheet 44 Table 31 for x16 addressing. In x8 mode Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Table 31: Word-Wide Protection Register Addressing Word Use A8 A7 A6 A5 A4 A3 A2 A1 LOCK Both 1 0 0 0 0 0 0 0 0 Factory 1 0 0 0 0 0 0 1 1 Factory 1 0 0 0 0 0 1 0 2 Factory 1 0 0 0 0 0 1 1 3 Factory 1 0 0 0 0 1 0 0 4 User 1 0 0 0 0 1 0 1 5 User 1 0 0 0 0 1 1 0 6 User 1 0 0 0 0 1 1 1 7 User 1 0 0 0 1 0 0 0 Note: All address lines not specified in the above table must be 0 when accessing the Protection Register (i.e., A[MAX:9] = 0.) Table 32: Byte-Wide Protection Register Addressing Byte Use A8 A7 A6 A5 A4 A3 A2 A1 A0 LOCK Both 1 0 0 0 0 0 0 0 0 LOCK Both 1 0 0 0 0 0 0 0 1 0 Factory 1 0 0 0 0 0 0 1 0 1 Factory 1 0 0 0 0 0 0 1 1 2 Factory 1 0 0 0 0 0 1 0 0 3 Factory 1 0 0 0 0 0 1 0 1 4 Factory 1 0 0 0 0 0 1 1 0 5 Factory 1 0 0 0 0 0 1 1 1 6 Factory 1 0 0 0 0 1 0 0 0 7 Factory 1 0 0 0 0 1 0 0 1 8 User 1 0 0 0 0 1 0 1 0 9 User 1 0 0 0 0 1 0 1 1 A User 1 0 0 0 0 1 1 0 0 B User 1 0 0 0 0 1 1 0 1 C User 1 0 0 0 0 1 1 1 0 D User 1 0 0 0 0 1 1 1 1 E User 1 0 0 0 1 0 0 0 0 User 1 0 0 0 1 0 0 0 1 F Note: 9.8.8 All address lines not specified in the above table must be 0 when accessing the Protection Register, i.e., A[MAX:9] = 0. VPEN Protection When it's necessary to protect the entire array, global protection can be achieved using a hardware mechanism using VPEN. Whenever a valid voltage is present on VPEN, blocks within the main flash array can be erased or programmed. By grounding VPEN, blocks within the main array cannot be altered - attempts to program or erase blocks will fail resulting in the setting of the appropriate error bit in the Status Register. By holding VPEN low, absolute write protection of all blocks in the array can be achieved. Datasheet 45 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 10.0 ID Codes Table 33: Read Identifier Codes Code Device Code Datasheet 46 Address Data 32-Mbit 00001h 0016h 64-Mbit 00001h 0017h 128-Mbit 00001h 0018h Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 11.0 Device Command Codes For a complete definition on device operations refer to Section 8.4, "Device Commands" on page 33. The list of all applicable commands are included here one more time for the convenience. Note: Some customer applications use illegal or invalid commands (like 0x00) accidentally or intentionally with the device. An illegal or invalid command caused the device output to change to Array Read mode on 130nm. On the 65nm device, the output will change to Read Status Register mode. After an illegal or invalid command, software may attempt to read the device. If the illegal command was intentional, software will expect to read array data on 130nm device, such as 0xFFFF in an unprogrammed location. On the 65nm device, software may not get the expected array data and instead the status register is read. Please refer to the legal and valid commands/spec defined in the Datasheet, such as forread mode, issue 0xFF to Read Array mode, 0x90 to Read Signature, 0x98 to Read CFI/OTP array mode. Table 34: Command Bus Cycles and Command Codes Setup Write Cycle Confirm Write Cycle Command Program Enhanced Configuration Register Program OTP Register Data Bus Address Bus Data Bus Register Data 0060h Register Data 0004h Device Address 00C0h Register Offset Register Data Device Address 0050h -- -- Program STS Configuration Register Device Address 00B8h Device Address Register Data Device Address 00FFh -- -- Read Status Register Device Address 0070h -- -- Read Array Read Identifier Codes (Read Device Information) Device Address 0090h -- -- CFI Query Device Address 0098h -- -- Word/Byte Program Device Address 0040h/ 0010h Device Address Array Data Block Address 00E8h Block Address 00D0h Blank Check Security Read Modes Clear Status Register Program and Erase Registers Address Bus Buffered Program Block Erase Block Address 0020h Block Address 00D0h Program/Erase Suspend Device Address 00B0h -- -- Program/Erase Resume Device Address 00D0h -- -- Block Address 0060h Block Address 0001h Device Address 0060h Device Address 00D0h Block Address 00BCh Block Address 00D0h Set Block Lock Bit Clear Block Lock Bits Blank Check Datasheet 47 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 12.0 Flow Charts Figure 16: Write to Buffer Flowchart Start End Setup - Write 0xE8 - Block Address Check Buffer Status - Perform Read Operation - Read Ready Status on signal SR.7 (Note 1) Full Status Register Check(if desired) Yes No SR.7 = 1 ? SR.7 = 1 ? No Yes Word Count - Address = block address - Data = word count minus 1 (Valid range = 0x00 to 0xFF) Load Buffer - Fill write buffer up to word count - Address = within buffer range - Data = User data Read Status Register(SR) Confirm - Write 0xD0 - Block address Notes: 1. The device defaults to output SR data after the Buffered Programming Setup command (E8h) is issued. CE# and OE# must be toggled to update Status Register. Don't issue the Read SR command (70h), which would be interpreted by the internal state machine as Buffer Word Count. Datasheet 48 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Figure 17: Status Register Flowchart Start Command Cycle - Issue Status Register Command - Address = any dev ice address - Data = 0x70 Data Cycle - Read Status Register SR[7:0] SR7 = '1' No Yes - Set/Reset by WSM SR6 = '1' Y es Erase Suspend See Suspend/Resume Flowchart Y es Program Suspend See Suspend/Resume Flowchart No SR2 = '1' No SR5 = '1' Y es SR4 = '1' Yes Error Command Sequence No No Error Erase Failure Y es Error Program Failure Y es Error V PEN < VPENLK Y es Error Block Locked SR4 = '1' - Set by WSM - Reset by user - See Clear Status Register Command No SR3 = '1' No SR1 = '1' No End Datasheet 49 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Figure 18: Byte/Word Program Flowchart Start Write 40H, Address Write Data and Address Read Status Register Command Comments Write Setup Byte/ Word Program Data = 40H Addr = Location to Be Programmed Write Byte/Word Program Data = Data to Be Programmed Addr = Location to Be Programmed Read (Note 1) Status Register Data Standby Check SR.7 1 = WSM Ready 0 = WSM Busy 1. Toggling OE# (low to high to low) updates the status register. This can be done in place of issuing the Read Status Register command. Repeat for subsequent programming operations. 0 SR.7 = Bus Operation SR full status check can be done after each program operation, or after a sequence of programming operations. 1 Full Status Check if Desired Write FFH after the last program operation to place device in read array mode. Byte/Word Program Complete FULL STATUS CHECK PROCEDURE Bus Operation Read Status Register Data (See Above) Check SR.3 1 = Programming to Voltage Error Detect Standby Check SR.1 1 = Device Protect Detect RP# = VIH, Block Lock-Bit Is Set Only required for systems implemeting lock-bit configuration. Standby Check SR.4 1 = Programming Error Voltage Range Error 0 1 SR.1 = Device Protect Error 0 1 SR.4 = Programming Error 0 Byte/Word Program Successful Datasheet 50 Comments Standby 1 SR.3 = Command Toggling OE# (low to high to low) updates the status register. This can be done in place of issuing the Read Status Register command. Repeat for subsequent programming operations. SR.4, SR.3 and SR.1 are only cleared by the Clear Status Register command in cases where multiple locations are programmed before full status is checked. If an error is detected, clear the status register before attempting retry or other error recovery. Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Figure 19: Program Suspend/Resume Flowchart Start Bus Operation Command Write Program Suspend Write B0H 0 Data = B0H Addr = X Status Register Data Addr = X Read Read Status Register Comments Standby Check SR.7 1 - WSM Ready 0 = WSM Busy Standby Check SR.6 1 = Programming Suspended 0 = Programming Completed SR.7 = Write Read Array Data = FFH Addr = X 1 SR.2 = Read array locations other than that being programmed. Read 0 Programming Completed Write Program Resume Data = D0H Addr = X 1 Write FFH Read Data Array No Done Reading Yes Write D0H Write FFH Programming Resumed Read Array Data Datasheet 51 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Figure 20: Block Erase Flowchart Start Issue Single Block Erase Command 20H, Block Address Bus Operation Command Write Erase Block Write (Note 1) Erase Confirm Read Standby Write Confirm D0H Block Address Suspend Erase Loop Full Status Check if Desired Erase Flash Block(s) Complete Datasheet 52 Data = D0H Addr = Block Address Status register data With the device enabled, OE# low updates SR Addr = X Check SR.7 1 = WSM Ready 0 = WSM Busy Full status check can be done after all erase and write sequences complete. Write FFH after the last operation to reset the device to read array mode. No 1 Data = 20H Addr = Block Address 1. The Erase Confirm byte must follow Erase Setup. This device does not support erase queuing. Please see Application note AP-646 For software erase queuing compatibility. Read Status Register SR.7 = Comments 0 Suspend Erase Yes Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Figure 21: Block Erase Suspend/Resume Flowchart Start Bus Operation Command Write Erase Suspend Write B0H 0 Data = B0H Addr = X Status Register Data Addr = X Read Read Status Register Comments Standby Check SR.7 1 - WSM Ready 0 = WSM Busy Standby Check SR.6 1 = Block Erase Suspended 0 = Block Erase Completed SR.7 = Write Erase Resume Data = D0H Addr = X 1 0 SR.6 = Block Erase Completed 1 Program Read Read or Program? Read Array Data No Program Loop Done? Yes Write D0H Write FFH Block Erase Resumed Read Array Data Datasheet 53 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Figure 22: Set Block Lock-Bit Flowchart Start Write 60H, Block Address Write 01H, Block Address Bus Operation Command Write Set Block Lock-Bit Setup Data = 60H Addr =Block Address Write Set Block Lock-Bit Confirm Data = 01H Addr = Block Address Read Status Register Data Read Status Register Check SR.7 1 = WSM Ready 0 = WSM Busy Standby Repeat for subsequent lock-bit operations. 0 SR.7 = Comments Full status check can be done after each lock-bit set operation or after a sequence of lock-bit set operations. 1 Write FFH after the last lock-bit set operation to place device in read array mode. Full Status Check if Desired Set Lock-Bit Complete FULL STATUS CHECK PROCEDURE Read Status Register Data (See Above) Bus Operation 1 SR.3 = 1 SR.4,5 = Command Sequence Error 0 1 SR.4 = 0 Set Lock-Bit Successful Datasheet 54 Set Lock-Bit Error Comments Standby Check SR.3 1 = Programming Voltage Error Detect Standby Check SR.4, 5 Both 1 = Command Sequence Error Standby Check SR.4 1 = Set Lock-Bit Error Voltage Range Error 0 Command SR.5, SR.4 and SR.3 are only cleared by the Clear Status Register command, in cases where multiple lock-bits are set before full status is checked. If an error is detected, clear the status register before attempting retry or other error recovery. Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Figure 23: Clear Lock-Bit Flowchart Start Write 60H Bus Operation Command Write Clear Block Lock-Bits Setup Data = 60H Addr = X Write Clear Block or Lock-Bits Confirm Data = D0H Addr = X Write D0H Read Status Register Data Read Status Register Check SR.7 1 = WSM Ready 0 = WSM Busy Standby 0 SR.7 = Comments Write FFH after the clear lock-bits operation to place device in read array mode. 1 Full Status Check if Desired Clear Block Lock-Bits Complete FULL STATUS CHECK PROCEDURE Bus Operation Read Status Register Data (See Above) 1 SR.3 = Standby Standby Check SR.4, 5 Both 1 = Command Sequence Error Standby Check SR.5 1 = Clear Block Lock-Bits Error 0 1 Command Sequence Error 0 1 SR.5 = Comments Check SR.3 1 = Programming Voltage Error Detect Voltage Range Error SR.4,5 = Command SR.5, SR.4, and SR.3 are only cleared by the Clear Status Register command. Clear Block Lock-Bits Error If an error is detected, clear the status register before attempting retry or other error recovery. 0 Clear Block Lock-Bits Successful Datasheet 55 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Figure 24: Protection Register Programming Flowchart Start Bus Operation Command Write C0H (Protection Reg. Program Setup) Write Protection Program Setup Data = C0H Write Protection Program Data = Data to Program Addr = Location to Program Write Protect. Register Address/Data Read Status Register Data Toggle CE# or OE# to Update Status Register Data Check SR.7 1 = WSM Ready 0 = WSM Busy Standby Read Status Register Protection Program operations can only be addressed within the protection register address space. Addresses outside the defined space will return an error. No SR.7 = 1? Comments Repeat for subsequent programming operations. Yes SR Full Status Check can be done after each program or after a sequence of program operations. Full Status Check if Desired Write FFH after the last program operation to reset device to read array mode. Program Complete FULL STATUS CHECK PROCEDURE Bus Operation Read Status Register Data (See Above) VPEN Range Error 0,1 SR.1, SR.4 = Protection Register Programming Error Comments Standby SR.1 SR.3 SR.4 0 1 1 VPEN Low Standby 0 0 1 Prot. Reg. Prog. Error 1 0 1 Register Locked: Aborted 1, 1 SR.3, SR.4 = Command Standby SR.3 MUST be cleared, if set during a program attempt, before further attempts are allowed by the Write State Machine. 1,1 SR.1, SR.4 = Program Successful Datasheet 56 Attempted Program to Locked Register Aborted SR.1, SR.3 and SR.4 are only cleared by the Clear Staus Register Command, in cases of multiple protection register program operations before full status is checked. If an error is detected, clear the status register before attempting retry or other error recovery. Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 13.0 Common Flash Interface The CFI specification outlines device and host system software interrogation handshake which allows specific vendor-specified software algorithms to be used for entire families of devices. This allows device independent, JEDEC ID-independent, and forward- and backward-compatible software support for the specified flash device families. It allows flash vendors to standardize their existing interfaces for long-term compatibility. This section defines the data structure or "database" returned by the (CFI) Query command. System software should parse this structure to gain critical information such as block size, density, x8/x16, and electrical specifications. Once this information has been obtained, the software will know which command sets to use to enable flash writes, block erases, and otherwise control the flash component. The Query is part of an overall specification for multiple command set and control interface descriptions called CFI. 13.1 Query Structure Output The Query "database" allows system software to gain information for controlling the flash component. This section describes the device's CFI-compliant interface that allows the host system to access Query data. Query data are always presented on the lowest-order data outputs (D[7:0]) only. The numerical offset value is the address relative to the maximum bus width supported by the device. On this family of devices, the Query table device starting address is a 10h, which is a word address for x16 devices. For a word-wide (x16) device, the first two bytes of the Query structure, "Q" and "R" in ASCII, appear on the low byte at word addresses 10h and 11h. This CFI-compliant device outputs 00h data on upper bytes. Thus, the device outputs ASCII "Q" in the low byte (D[7:0]) and 00h in the high byte (D[15:8]). At Query addresses containing two or more bytes of information, the least significant data byte is presented at the lower address, and the most significant data byte is presented at the higher address. In all of the following tables, addresses and data are represented in hexadecimal notation, so the "h" suffix has been dropped. In addition, since the upper byte of wordwide devices is always "00h," the leading "00" has been dropped from the table notation and only the lower byte value is shown. Any x16 device outputs can be assumed to have 00h on the upper byte in this mode. Table 35: Summary of Query Structure Output as a Function of Device and Mode Device Type/ Mode x16 device x16 mode x16 device Query start location in maximum device bus width addresses 10h Query data with maximum device bus width addressing Query data with byte addressing Hex Offset Hex Code ASCII Value Hex Offset Hex Code ASCII Value 10: 0051 "Q" 20: 51 "Q" 11: 0052 "R" 21: 00 "Null" 12: 0059 "Y" 22: 52 "R" 20: 51 "Q" Datasheet 57 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Table 35: Summary of Query Structure Output as a Function of Device and Mode Device Type/ Mode Query start location in maximum device bus width addresses Hex Offset N/A(1) x8 mode Note: 1. Query data with maximum device bus width addressing Query data with byte addressing ASCII Value Hex Code N/A(1) Hex Offset Hex Code ASCII Value 21: 51 "Q" 22: 52 "R" The system must drive the lowest order addresses to access all the device's array data when the device is configured in x8 mode. Therefore, word addressing, where these lower addresses are not toggled by the system, is "Not Applicable" for x8-configured devices. Table 36: Example of Query Structure Output of a x16- and x8-Capable Device Word Addressing Offset Byte Addressing Hex Code A15-A0 Value Offset D15-D0 0010h Hex Code A7-A0 0051 "Q" Value D7-D0 20h 51 "Q" 0011h 0052 "R" 21h 51 "Q" 0012h 0059 "Y" 22h 52 "R" 0013h P_IDLO PrVendor 23h 52 "R" 0014h P_IDHI ID # 24h 59 "Y" 0015h PLO PrVendor 25h 59 "Y" 0016h PHI TblAdr 26h P_IDLO PrVendor 0017h A_IDLO AltVendor 27h P_IDLO PrVendor 0018h A_IDHI ID # 28h P_IDHI ID # ... ... ... ... ... ... 13.2 Query Structure Overview The Query command causes the flash component to display the Common Flash Interface (CFI) Query structure or "database." The structure sub-sections and address locations are summarized below. See AP-646 Common Flash Interface (CFI) and Command Sets (order number 292204) for a full description of CFI. The following sections describe the Query structure sub-sections in detail. Table 37: Query Structure Offset Sub-Section Name Description Notes 00h Identification Code Manufacturer Code 1 01h Identification Code Device Code 1 Block Status Register Block-Specific Information Reserved Reserved for Vendor-Specific Information 1 10h CFI Query Identification String Reserved for Vendor-Specific Information 1 1Bh System Interface Information Command Set ID and Vendor Data Offset 1 (BA+2)h(2) 04-0Fh Datasheet 58 1,2 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Table 37: Query Structure Offset Sub-Section Name Description Notes 27h Device Geometry Definition Flash Device Layout 1 P(3) Primary Numonyx-Specific Extended Query Table Vendor-Defined Additional Information Specific to the Primary Vendor Algorithm 1,3 Notes: 1. Refer to the Query Structure Output section and offset 28h for the detailed definition of offset address as a function of device bus width and mode. 2. BA = Block Address beginning location (i.e., 02000h is block 2's beginning location when the block size is 128 KB). 3. Offset 15 defines "P" which points to the Primary Numonyx-Specific Extended Query Table. 13.3 Block Status Register The Block Status Register indicates whether an erase operation completed successfully or whether a given block is locked or can be accessed for flash program/erase operations. Table 38: Block Status Register Offset Length (BA+2)h(1) Note: 1. 1 Description Address Value Block Lock Status Register BA+2: --00 or --01 BSR.0 Block Lock Status 0 = Unlocked 1 = Locked BA+2: (bit 0): 0 or 1 BSR 1-15: Reserved for Future Use BA+2: (bit 1-15): 0 BA = The beginning location of a Block Address (i.e., 010000h is block 1's (64-KW block) beginning location in word mode). 13.4 CFI Query Identification String The CFI Query Identification String provides verification that the component supports the Common Flash Interface specification. It also indicates the specification version and supported vendor-specified command set(s). Table 39: CFI Identification Offset 10h 13h 15h 17h 19h Length 3 2 2 2 2 Description Query-unique ASCII string "QRY" Add. Hex Code Value 10 --51 "Q" 11: --52 "R" 12: --59 "Y" Primary vendor command set and control interface ID code. 13: --01 16-bit ID code for vendor-specified algorithms 14: --00 Extended Query Table primary algorithm address 15: --31 16: --00 Alternate vendor command set and control interface ID code. 17: --00 0000h means no second vendor-specified algorithm exists 18: --00 Secondary algorithm Extended Query Table address. 19: --00 0000h means none exists 1A: --00 Datasheet 59 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 13.5 System Interface Information The following device information can optimize system interface software. Table 40: System Interface Information Add. Hex Code Value VCC logic supply minimum program/erase voltage bits 0-3 BCD 100 mV bits 4-7 BCD volts 1B: --27 2.7 V 1 VCC logic supply maximum program/erase voltage bits 0-3 BCD 100 mV bits 4-7 BCD volts 1C: --36 3.6 V 1Dh 1 VPP [programming] supply minimum program/erase voltage bits 0-3 BCD 100 mV bits 4-7 HEX volts 1D: --00 0.0 V 1Eh 1 VPP [programming] supply maximum program/erase voltage bits 0-3 BCD 100 mV bits 4-7 HEX volts 1E: --00 0.0 V 1Fh 1 "n" such that typical single word program time-out = 2n s 1F: --06 64 s Offset Length 1Bh 1 1Ch Description 2n 20h 1 "n" such that typical max. buffer write time-out = 21h 1 "n" such that typical block erase time-out = 2n ms 2n s 20: --07 1 128 s 1 21: --0A 1s 22: --00 NA 23: --02 256 s 22h 1 "n" such that typical full chip erase time-out = 23h 1 "n" such that maximum word program time-out = 2n times typical 24h 1 "n" such that maximum buffer write time-out = 2n times typical 24: --03 1024s 25h 1 "n" such that maximum block erase time-out = 2n times typical 25: --02 4s 26: --00 NA 26h 1 "n" such that maximum chip erase time-out = 2n ms times typical Notes: 1. The value is 32 Bytes buffer write typical time out 13.6 Device Geometry Definition This field provides critical details of the flash device geometry. Table 41: Device Geometry Definition (Sheet 1 of 2) Offset Length Description 2n Code See Table Below 27h 1 "n" such that device size = 28h 2 Flash device interface: 2Ah 2 "n" such that maximum number of bytes in write buffer = 2n 1 Number of erase block regions within device: 1. x = 0 means no erase blocking; the device erases in "bulk" 2. x specifies the number of device or partition regions with one or more contiguous same-size erase blocks 3. Symmetrically blocked partitions have one blocking region 4. Partition size = (total blocks) x (individual block size) in number of bytes x8 async x16 async x8/x16 async 28:00,29:00 28:01,29:00 28:02,29:00 2Ch Notes: 1. The value is 32 Bytes buffer write typical time out Datasheet 60 27: 28: 29: 2A: --02 x8/ x16 --00 --05 1 2B: --00 2C: --01 32 1 1 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Table 41: Device Geometry Definition (Sheet 2 of 2) Offset Length 2Dh 4 Description Code See Table Below Erase Block Region 1 Information 2D: bits 0-15 = y, y+1 = number of identical-size erase blocks 2E: bits 16-31 = z, region erase block(s) size are z x 256 bytes 2F: 30: Notes: 1. Compatible with J3 130nm device (32 bytes). J3 65 nm SBC device supports up to maximum 256 words (x16 mode)/ 256 bytes (x8 mode) buffer write. Table 42: Device Geometry: Address Codes Address 32 Mbit 64 Mbit 128 Mbit 27: --16 --17 --18 28: --02 --02 --02 29: --00 --00 --00 2A: --05 --05 --05 13.7 2B: --00 --00 --00 2C: --01 --01 --01 2D: --1F --3F --7F 2E: --00 --00 --00 2F: --00 --00 --00 30: --02 --02 --02 Primary-Vendor Specific Extended Query Table Certain flash features and commands are optional. The Primary Vendor-Specific Extended Query table specifies this and other similar information. Table 43: Primary Vendor-Specific Extended Query (Sheet 1 of 2) Offset(1) P = 31h Length (P+0)h 3 (P+1)h Description (Optional Flash Features and Commands) Primary extended query table Unique ASCII string "PRI" (P+2)h Add. Hex Code Value 31: --50 "P" 32: --52 "R" 33: --49 "I" (P+3)h 1 Major version number, ASCII 34: --31 "1" (P+4)h 1 Minor version number, ASCII 35: --31 "1" Datasheet 61 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Table 43: Primary Vendor-Specific Extended Query (Sheet 2 of 2) Offset(1) P = 31h Length 4 Description (Optional Flash Features and Commands) Optional feature and command support (1=yes, 0=no) Undefined bits are "0." If bit 31 is "1" then another 31 bit field of optional features follows at the end of the bit-30 field. bit 0 Chip erase supported (P+5)h (P+6)h (P+7)h (P+8)h --00 39: --00 bit 0 = 0 No Yes bit 3 = 1 Yes bit 4 = 0 No bit 5 Instant Individual block locking supported bit 5 = 0 No bit 6 Protection bits supported bit 6 = 1 Yes bit 7 Page-mode read supported bit 7 = 1 Yes bit 8 Synchronous read supported bit 8 = 0 No bit 9 = 0 No bit 30 CFI Link(s) to follow (32, 64, 128 Mb) bit 30 = 0 No bit 31 Another "Optional Feature" field to follow bit 31 = 0 No Supported functions after suspend: read Array, Status, Query Other supported operations are: bits 1-7 reserved; undefined bits are "0" 3A: --01 bit 0 = 1 Yes Block Status Register mask 3B: --01 bits 2-15 are Reserved; undefined bits are "0" 3C: --00 bit 0 Block Lock-Bit Status register active bit 0 = 1 Yes bit 1 Block Lock-Down Bit Status active bit 1 = 0 No (P+C)h 1 (P+D)h 1 VPP optimum program/erase supply voltage bits 0-3 BCD value in 100 mV bits 4-7 HEX value in volts Setting this bit, will lead to the extension of the CFI table. Datasheet 62 --00 38: Yes VCC logic supply highest performance program/erase voltage bits 0-3 BCD value in 100 mV bits 4-7 BCD value in volts Note: 1. 37: bit 1 = 1 bit 0 Program supported after erase suspend 2 --CE bit 2 = 1 bit9 Simultaneous Operation Supported (P+A)h (P+B)h 36: Value bit 2 Suspend program supported bit 3 Legacy lock/unlock supported 1 Hex Code bit 1 Suspend erase supported bit 4 Queued erase supported (P+9)h Add. 3D: --33 3.3 V 3E: --00 0.0 V Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Table 44: Protection Register Information Offset(1) P = 31h Length (P+E)h 1 Number of Protection register fields in JEDEC ID space. "00h," indicates that 256 protection bytes are available 4 Protection Field 1: Protection Description This field describes user-available One Time Programmable (OTP) protection register bytes. Some are pre-programmed with deviceunique serial numbers. Others are user-programmable. Bits 0-15 point to the protection register lock byte, the section's first byte. The following bytes are factory pre-programmed and user-programmable. bits 0-7 = Lock/bytes JEDEC-plane physical low address bits 8-15 = Lock/bytes JEDEC-plane physical high address bits 16-23 = "n" such that 2n = factory pre-programmed bytes bits 24-31 = "n" such that 2n = user-programmable bytes (P+F)h (P+10)h (P+11)h (P+12)h Note: 1. Description (Optional Flash Features and Commands) Add. Hex Code Value 3F: --01 01 40: 41: 42: 43: --80 --00 --03 --03 80h 00h 8bytes 8bytes Add. Hex Code Value The variable P is a pointer which is defined at CFI offset 15h. Table 45: Burst Read Information Offset(1) P = 31h Length (P+13)h 1 Page Mode Read capability bits 0-7 = "n" such that 2n HEX value represents the number of readpage bytes. See offset 28h for device word width to determine pagemode data output width. 00h indicates no read page buffer. 44: --04 16 byte (P+14)h 1 Number of synchronous mode read configuration fields that follow. 00h indicates no burst capability. 45: --00 0 (P+15)h 1 Synchronous Mode Read Capability Configuration 1 Bits 3-7 = Reserved bits 0-2 = "n" such that 2n+1 HEX value represents the maximum number of continuous synchronous burst reads when the device is configured for its maximum word width. A value of 07h indicates that the device is capable of continuous linear bursts until that will output data until the internal burst counter reaches the end of the device's burstable address space. This field's 3-bit value can be written directly to the Read Configuration Register Bits 0-2 if the device is configured for its maximum word width. See offset 1Fh for word width to determine the burst data output width. 46: --00 n/a (P+16h)h 1 Synchronous Mode Read Capability Configuration 2 47: --00 n/a (P+45h)h 1 J3C mark for VIL fix for customers 76: --01 01 Note: 1. Description (Optional Flash Features and Commands) The variable P is a pointer which is defined at CFI offset 15h. Datasheet 63 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Appendix A Additional Information Order Number 316577 298136 Note: Document/Tool Numonyx(R) Embedded Flash Memory (J3 v D); 28F256J3D, 28F128J3D, 28F640J3D, 28F320J3D Specification Update Numonyx(R) Persistent Storage Manager (PSM) User's Guide Software Manual 292204 AP-646 Common Flash Interface (CFI) and Command Sets 319942 Numonyx(R) Embedded Flash Memory (J3-65nm_256-Mbit_MLC Datasheet) Contact your local Numonyx or distribution sales office or visit the Numonyx home page http://www.numonyx.com for technical documentation, tools, or the most current information on Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) . Datasheet 64 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) Appendix B Ordering Information Figure 25: Decoder for 32-, 64-, 128-Mbit l P C2 8 F 3 2 0 J 3 F 7 5 * Device Features * Package Access Speed JS = Pb-Free 56-TSOP RC = 64-Ball Easy BGA PC = 64-Ball Pb-Free Easy BGA 75ns Lithography F = 65nm Voltage (VCC/VPEN) 3 = 3 V/3 V Product Line Designator Numonyx(R) Flash Memory Product Family J = Numonyx(R) Embedded Flash Memory Device Density 128 = 128-Mbit 640 = 64-Mbit 320 = 32-Mbit Note: The last digit is randomly assigned to cover packing media and/or features or other specific configuration. Table 46: Valid Combinations Note: 32-Mbit 64-Mbit 128-Mbit JS28F320J3F75* JS28F640J3F75* JS28F128J3F75* RC28F320J3F75* RC28F640J3F75* RC28F128J3F75* PC28F320J3F75* PC28F640J3F75* PC28F128J3F75* For further information on ordering products or for product part numbers, go to:http:// www.numonyx.com/en-US/MemoryProducts/Pages/PartNumberLookup.aspx. Datasheet 65 Numonyx(R) Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC) 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 www.micron.com/productsupport Customer Comment Line: 800-932-4992 Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur. Datasheet 66 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2010 Micron Technology, Inc. All rights reserved.