2018 Microchip Technology Inc. DS20005921A-page 1
MD1715
Features
Advanced CMOS Technology
±4.75 to 12.9V Gate Drive Voltage
2A Output Source and Sink Current
6.5 ns Rise and Fall Time with 1 nF Load
10 ns Propagation Delay
±2 ns Matched Delay Times
12 Matched Channels
1.8V to 3.3V CMOS Logic Interface
Smart Logic Threshold
Low-inductance Package
Applications
Medical Ultrasound Imaging
Piezoelectric Transducer Drivers
Metal Flaw Detection
Non-destructive Testing (NDT)
General Description
The MD1715, paired with Microchip’s TC8020, forms a
2-channel five-level high-voltage high-speed transmit
pulser chip set. The chip set is designed for medical
ultrasound imaging applications but can also be used
for metal flaw detection, NDT and piezoelectric
transducer drivers.
The MD1715 is a 2-channel logic controller circuit with
12 low-impedance MOSFET gate drivers. There are
two sets of control logic inputs—one for Channel A and
one for Channel B. Each channel consists of three pairs
of MOSFET gate drivers. These drivers are designed to
match the drive requirements of Microchip’s TC8020.
The TC8020 is the output stage of the pulser, with six
pairs of MOSFETs. Each pair consists of a P-channel
and an N-channel MOSFET. They are designed to
have the same impedance and can provide typical
peak currents of ±3.5A at 200V.
Package Type
See Table 2-1 for pin information.
40-lead QFN
(Top view)
1
40
2-Channel 5-Level High-Speed Ultrasound Driver IC
VDD2
GN2
VSS
VDD1
High Speed
Gate Buffers
SP1
DP1
100Ω
DN1
SP2
SN2
DP2
DN2
DP3
DN3
OP1 GP1
ON1 GN1
Control
Logic
and
Level
Translation
VLL/EN
SEL
POS
NEG
GND
OP2 GP2
ON2
OP3 GP3
GN3
ON3
SN3
SP3
VPP2
VNN2
VNN1
MD1715
1 OF 2-CH TC8020
6 of 12-FETs
VPP1
VDD1 VDD2
-12V
VSS
AVSS
-12V
GND
+12V +12V
AVDD
+12V
PAD PAD
VDD2
VDD1
VDD1
High Speed
Gate Buffers
SN1
MD1715
DS20005921A-page 2 2018 Microchip Technology Inc.
Functional Block Diagram
2018 Microchip Technology Inc. DS20005921A-page 3
MD1715
Typical Application Circuit
10nF
10nF
10nF
10nF
10nF
10nF
10nF
10nF
TX(B)
TX(A)
TC8020
MD1715
AVDD
SELA
POSA
NEGA
POSB
NEGB
SELB
OP1A
ON1A
OP2A
ON2A
OP3A
ON3A
OP1B
ON1B
OP2B
ON2B
OP3B
ON3B
GP1
GN1
GP2
GN2
GP3
GN3
GP4
GN4
GP5
GN5
GP6
GN6
AGND
VLL/EN
+12V
GND AVSS(SUB) VSS
1.8 to 3.3V
CMOS
Input Logic
VDD1 VDD2
-12V
+12V +12V
+3.3V
-12V
VPP2
SP2
VPP1
SP1
SP3 SP4
SP5
SP6
SN3 SN2 SN1
VNN1
VNN2
SN5 SN4
SN6
PAD
DP1
DN1
DP2
DN2
DP3
DN3
DP4
DN4
DP5
DN5
DP6
DN6
MD1715
DS20005921A-page 4 2018 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
GND and AGND, Ground .......................................................................................................................................... 0V
Logic Input Pin, VLL ................................................................................................................................ –0.5V to +5.5V
Positive Gate Drive Supply, AVDD, VDD1, VDD2 ................................................................................... –0.5V to +14.5V
Negative Gate Drive Supply, AVSS, VSS ............................................................................................... –14.5V to +0.5V
Operating Junction Temperature, TJ ....................................................................................................... 0°C to +125°C
Storage Temperature, TS ..................................................................................................................... –65°C to +150°C
Power Dissipation:
40-lead QFN (Note 1) ................................................................................................................................. 1.3W
Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1:
OPERATING SUPPLY VOLTAGES AND CURRENTS
Electrical Specifications for Operating Supply Currents: Over operating conditions unless otherwise specified,
VLL = 3.3V, AVDD = VDD1 = VDD2 = +12V, AVSS = VSS = –12V, TA = 25°C
Parameter Sym. Min. Typ. Max. Unit Conditions
Logic Supply VLL 1.8 3.3 3.6 V
Positive Analog Supply AVDD 8 12.9 VAVDD (VDD1 or VDD2)
Positive Gate Drive Supply VDD2, VDD14.75 12.9 V
Negative Gate Drive Supply AVSS, VSS –12.9 –4.75 V
Logic Reference Current IVLL 10 µA VLL = 3.3V
AVDD Power-down Current IAVDDQ 0.4 mA EN = 0, all inputs low
VSS Power-down Current IVSSQ 0.1 mA
VDD1 Power-down Current IVDD1Q 10 25 µA EN = 0, all inputs low
VDD2 Power-down Current IVDD2Q 10 25 µA
AVDD Power-up Current IAVDDEN 2 3 mA EN = 1, all inputs low
VSS Power-up Current IVSSEN 0.7 1mA
VDD1 Power-up Current IVDD1EN 10 µA EN = 1, all inputs low
VDD2 Power-up Current IVDD2EN 10 µA
AVDD CW 5 MHz Current IAVDDCW 10 mA A and B Channels on
at 5 MHz, no load,
VDD1 = 12V, VDD2 = 5V
VSS CW 5 MHz Current IVSSCW 5 mA
VDD1 CW 5 MHz Current IVDD1CW 25 mA
A and B Channels on
at 5 MHz, no load,
VDD1 = 5V, VDD2 = 12V
VDD2 CW 5 MHz Current IVDD2CW 25 mA
A and B Channels on
at 5 MHz, no load,
VDD1 = 12V, VDD2 = 5V
1 oz. four-layer 3 inches x 4 inches PCB
DC ELECTRICAL CHARACTERISTICS
Parameter Sym. Min. Typ. Max. Unit Conditions
P-CHANNEL AND N-CHANNEL GATE DRIVER OUTPUTS
Output Sink Resistance P-Channel RSINK
5 6 ISINK = 100 mA
N-Channel 5 6 ISINK = 100 mA
Output Source Resistance P-Channel RSOURCE
5 6 ISOURCE = 100 mA
N-Channel 5 6 ISOURCE = 100 mA
Peak Output Sink Current P-Channel ISINK
1.7 2 A
N-Channel 1.7 2 A
Peak Output Source Current P-Channel ISOURCE
1.7 2 A
N-Channel 1.7 2 A
LOGIC INPUTS
Chip Disable Low Voltage VENL 0 0.3 VVLL/EN is a dual function
pin
Input Logic High Voltage VIH 0.8 VLL VLL V
Input Logic Low Voltage VIL 0 0.2 VLL V
Input Logic High Current IIH 1 µA
Input Logic Low Current IIL –1 µA
AC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over operating conditions unless otherwise specified, VLL = 3.3V,
AVDD = VDD1 = VDD2 = +12V, AVSS = VSS = –12V, TA = 25°C
Parameter Sym. Min. Typ. Max. Unit Conditions
Input Rise and Fall Time tirf 10 ns Logic input edge speed
requirement
Output Rise Time tr6.5 ns
1 nF load, input signal
rise/fall time 2 ns (Timing
Waveforms)
Output Fall Time tf6.5 ns
Output Rise Delay tdr 10 ns
Output Fall Delay tdf 10 ns
Rise and Fall Time Matching |tr–tf| 1 For each channel
Propagation Delay Matching |tdr–tdf| 1
Delay Time Matching tdm ±2 ns Channel to channel and
device to device
Output Jitter tj20 ps VDD = 10V
IC Enable Time tEN_ON 25 50 μs
IC Disable Time tEN_OFF 0.5 2μs
Second Harmonic Distortion HD2 –40 dB
2018 Microchip Technology Inc. DS20005921A-page 5
MD1715
MD1715
DS20005921A-page 6 2018 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS
Parameter Sym. Min. Typ. Max. Unit Conditions
TEMPERATURE RANGE
Operating Junction Temperature TJ–0 +125 °C
Storage Temperature TS–65 +150 °C
PACKAGE THERMAL RESISTANCE
40-lead QFN JA 24 °C/W
tdf
50%
10%
50%
Input
Output
0V
tdr
VDD
trtf
90%
2018 Microchip Technology Inc. DS20005921A-page 7
MD1715
Timing Waveforms
MD1715
DS20005921A-page 8 2018 Microchip Technology Inc.
2.0 PIN DESCRIPTION
The details on the pins of MD1715 are listed on
Table 2-1. See Package Type for the location of pins.
TABLE 2-1: PIN FUNCTION TABLE
Pin Number Pin Name Description
1SELA SEL input logic control for Channel A. See Tab l e 3-1.
2POSA POS input logic control for Channel A. See Ta b le 3-1.
3NEGA NEG input logic control for Channel A. See Ta b l e 3-1.
4VLL/EN Logic High reference voltage and chip enable input
5AVDD Positive supply voltage of analog circuitry. AVDD should be at the same or higher
potential than the highest voltages of VDD1 or VDD2.
6AGND Digital ground
7AVSS Negative supply voltage of analog circuitry and connection of IC substrate.
Should be at the same potential as VSS.
8SELB SEL input logic control for Channel B. See Tab l e 3-2.
9POSB POS input logic control for Channel B. See Ta b le 3-2.
10 NEGB NEG input logic control for Channel B. See Ta b l e 3-2.
11 VDD2 Positive supply voltage of the gate drivers for the output stages OP1 and ON1 in
Channel A and Channel B. VDD2 can be at a different voltage than VDD1.
12 OP1B First output P-channel gate driver for Channel B
13 VDD1
Positive supply voltage of the gate drivers for the output stages OP2, ON2 and
ON3 in Channel A and Channel B. VDD1 can be at a different voltage than
VDD2.
14 GND Power ground
15 OP2B Second output P-channel gate driver for Channel B
16 VDD2 Positive supply voltage of the gate drivers for the output stages OP1 and ON1 in
Channel A and Channel B. VDD2 can be at a different voltage than VDD1.
17 ON1B First output N-channel gate driver for Channel B
18 GND Power ground
19 VDD1
Positive supply voltage of the gate drivers for the output stages OP2, ON2 and
ON3 in Channel A and Channel B. VDD1 can be at a different voltage than
VDD2.
20 ON2B Second output N-channel gate driver for Channel B
21 GND Power ground
22 ON3B Damping output N-channel gate driver for Channel B
23 VSS Negative supply voltage for the gate drive of OP3. Should be the same voltage as
AVSS.
24 OP3B Damping output P-channel gate driver for Channel B
25 GND Power ground
26 VSS Negative supply voltage for gate drive of OP3. Should be the same voltage as
AVSS.
27 OP3A Damping output P-channel gate driver for Channel A
28 GND Power ground
2018 Microchip Technology Inc. DS20005921A-page 9
MD1715
29 GND Power ground
30 ON3A Damping output N-channel gate driver for Channel A
31 ON2A Second output N-channel gate driver for Channel A
32 VDD1
Positive supply voltage of the gate drivers for the output stages OP2, ON2 and
ON3 in Channel A and Channel B. VDD1 can be at a different voltage than
VDD2.
33 GND Power ground
34 ON1A First output N-channel gate driver for Channel A
35 VDD2 Positive supply voltage of the gate drivers for the output stages OP1 and ON1 in
Channel A and Channel B. VDD2 can be at a different voltage than VDD1.
36 OP2A Second output P-channel gate driver for Channel A
37 GND Power ground
38 VDD1
Positive supply voltage of the gate drivers for the output stages OP2, ON2 and
ON3 in Channel A and Channel B. VDD1 can be at a different voltage than
VDD2.
39 OP1A First output P-channel gate driver for Channel A
40 VDD2 Positive supply voltage of the gate drivers for the output stages OP1 and ON1 in
Channel A and Channel B. VDD2 can be at a different voltage than VDD1.
Center Pad Thermal Pad IC substrate, must connect to AVSS externally
TABLE 2-1: PIN FUNCTION TABLE (CONTINUED)
Pin Number Pin Name Description
MD1715
DS20005921A-page 10 2018 Microchip Technology Inc.
3.0 FUNCTIONAL DESCRIPTION
TC8020
GN1
GN2
NC
GN3
GP3
NC
SN3
SN6
NC
GP6
GN6
NC
GN5
GN4
GP5
GP4
NC
SN5
NC
SN4
NC
VSUB
NC
SP4
NC
SP5
NC
NC
DN1
DP1
DN2
DP2
DN3
DP3
SP3
SP6
DN6
DP6
DN5
DP5
DN4
DP4
GP2
GP1
NC
SN2
NC
SN1
NC
VSUB
NC
SP1
NC
SP2
NC
NC
MD1715
SELA
POSA
NEGA
VLL/EN
AVDD
AGND
AVSS
SELB
POSB
NEGB
VDD2
OP1A
VDD1
GND
OP2A
VDD2
ON1A
GND
VDD1
ON2A
ON3A
GND
GND
OP3A
VSS
GND
OP3B
VSS
ON3B
GND
VDD2
OP1B
VDD1
GND
OP2B
VDD2
ON1B
GND
VDD1
ON2B
TX(A)
TX(B)
FIGURE 3-1: Circuit Pin Layout.
TABLE 3-1: TRUTH FUNCTION TABLE FOR CHANNEL A
EN
Logic Inputs A SP1
to
DP1
SN1
to
DN1
SP2
to
DP2
SN2
to
DN2
SP3
to
DP3
SN3
to
DN3
SELA POSA NEGA
1000OFF OFF OFF OFF ON ON
1001OFF OFF OFF ON OFF OFF
1010OFF OFF ON OFF OFF OFF
1011OFF OFF OFF OFF OFF OFF
1100OFF OFF OFF OFF ON ON
1101OFF ON OFF OFF OFF OFF
1110ON OFF OFF OFF OFF OFF
1111OFF OFF OFF OFF OFF OFF
TABLE 3-2: TRUTH FUNCTION TABLE FOR CHANNEL B
EN
Logic Inputs B SP4
to
DP4
SN4
to
DN4
SP5
to
DP5
SN5
to
DN5
SP6
to
DP6
SN6
to
DN6
SELB POSB NEGB
1000OFF OFF OFF OFF ON ON
1001OFF OFF OFF ON OFF OFF
1010OFF OFF ON OFF OFF OFF
1011OFF OFF OFF OFF OFF OFF
1100OFF OFF OFF OFF ON ON
1101OFF ON OFF OFF OFF OFF
1110ON OFF OFF OFF OFF OFF
1111OFF OFF OFF OFF OFF OFF
0 X X X OFF OFF OFF OFF ON ON
01 0 0 0 EN transitions from low to high or high to low should occur at all logic
inputs low.
10 0 0 0
2018 Microchip Technology Inc. DS20005921A-page 11
MD1715
MD1715
DS20005921A-page 12 2018 Microchip Technology Inc.
4.0 PACKAGING INFORMATION
4.1 Package Marking Information
Legend: XX...X Product Code or Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available characters
for product code or customer-specific information. Package may or not include
the corporate logo.
3
e
3
e
40-lead QFN Example
XXXXXXX
YYWWNNN
XX
MD1715
1836985
K6
e3
e3
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
2018 Microchip Technology Inc. DS20005921A-page 13
MD1715
MD1715
DS20005921A-page 14 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20005921A-page 15
MD1715
APPENDIX A: REVISION HISTORY
Revision A (January 2018)
Converted Supertex Doc# DSFP-MD1715 to
Microchip DS20005921A
Changed the package marking format
Changed the quantity of the 40-lead VQFN K6
M935 package from 2000/Reel to 3000/Reel
Made minor text changes throughout the
document
MD1715
DS20005921A-page 16 2018 Microchip Technology Inc.
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) MD1715K6-G: 2-Channel 5-Level High-
Speed Ultrasound Driver
IC, 40-lead VQFN,
490/Tray
b) MD1715K6-G-M935: 2-Channel 5-Level High-
Speed Ultrasound Driver
IC, 40-lead VQFN,
3000/Reel
PART NO.
Device
Device: MD1715 = 2-Channel 5-Level High-Speed Ultrasound
Driver IC
Package: K6 = 40-lead VQFN
Environmental: G = Lead (Pb)-free/RoHS-compliant Package
Media Types: (blank) = 490/Tray for a K6 Package
M935 = 3000/Reel for a K6 Package
XX
Package
-
X - X
Environmental
Media Type
Options
2018 Microchip Technology Inc. DS20005921A-page 17
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
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Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
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trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
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USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
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SQTP is a service mark of Microchip Technology Incorporated in
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Silicon Storage Technology is a registered trademark of Microchip
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All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2591-5
Note the following details of the code protection feature on Microchip devices:
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There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
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Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
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DS20005921A-page 18 2018 Microchip Technology Inc.
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Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7289-7561
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
10/25/17