PESD1LVDS,115 - NXP SEMICONDUCTORS - Datasheet.Technology

Important notice

Dear Customer,

On 7 February 2017 the former NXP Standard Product business became a new company with the

tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS

semiconductors with its focus on the automotive, industrial, computing, consumer and wearable

application markets

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use

the references to Nexperia, as shown below.

Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,

use http://www.nexperia.com

Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use

salesaddresses@nexperia.com (email)

Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on

the version, as shown below:

reserved

Should be replaced with:

If you have any questions related to the data sheet, please contact our nearest sales office via e-mail

or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and

understanding,

Kind regards,

Team Nexperia

1. Product profile

1.1 General description

The device is designed to protect in-vehicle ultra high-speed interfaces in automotive

applications, such as Low-Voltage Differential Signaling (LVDS), High-Definition

Multimedia Interface (HDMI) and DisplayPort interfaces against ElectroStatic

Discharge (ESD).

The device is housed in an ultra small SOT1165- 1 (XSON10) Surface-Mounted

Design (SMD) plastic package.

1.2 Features and benefits

System ESD protection for LVDS, HDMI and DisplayPort interfaces

Line capacitance of only 0.6 pF with 0.05 pF matching capacitance between

signal pairs

Ultra small XSON10 package with design-friendly ‘pass-thru’ signal routing

AEC-Q101 qualified

1.3 Applications

The devices are desig ned for high-speed receiver and transmitter port protection:

Automotive A/V monitors, displays and cameras

1.4 Quick reference data

[1] This parameter is guaranteed by design.

PESD1LVDS

ESD protection for in-vehicle ultra high-speed interfaces

Rev. 3 — 5 July 2016 Product data sheet

DFN2510-10

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VRWM reverse standoff voltage - - 5.5 V

Cch channel capacitance f = 1 MHz;

Vbias =2.5V [1] -0.6-pF

Product data sheet Rev. 3 — 5 July 2016 2 of 12

NXP Semiconductors PESD1LVDS

ESD protection for in-vehicle ultra high-speed interfaces

2. Pinning information

3. Ordering information

4. Limiting values

[1] Device stressed with ten non-repetitive ESD pulses.

[2] All pins to ground.

Table 2. Pinning

Pin Symbol Description Simplified outline Graphic symbol

1CH1negative channel 1

ESD protection

XSON10

2 CH1+ positive channel 1

ESD protection

3 GND ground

4CH2negative channel 2

ESD protection

5 CH2+ positive channel 2

ESD protection

6 n.c. not connected

7 n.c. not connected

8 GND ground

9 n.c. not connected

10 n.c. not connected

Transparent top view

3, 8 001aai619

1 5

Table 3. Ordering i nformation

Type number Package

Name Description Version

PESD1LVDS XSON10 plastic extremely thin small outline package; no leads;

10 terminal s ; bo d y 1 2.5 0.5 mm SOT1165-1

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Tstg storage temperature 55 +125 C

Tamb ambient temperature 40 +125 C

Table 5. ESD maximum ratings

Tamb =25



C unless otherwise specified.

Symbol Parameter Conditions Min Max Unit

VESD electrostatic

discharge voltage IEC 61000-4-2

(contact discharge) [1][2] -8kV

Product data sheet Rev. 3 — 5 July 2016 3 of 12

NXP Semiconductors PESD1LVDS

ESD protection for in-vehicle ultra high-speed interfaces

5. Characteristics

[1] This parameter is guaranteed by design.

[2] Between signal pin and pin n.c.

Table 6. ESD standards compliance

Standard Conditions

IEC 61000-4-2; level 4 (ESD) > 8 kV (contact)

MIL-STD-883; class 3B (human body model) > 8 kV

Fig 1. ESD pulse waveform according to IEC 61000-4-2

001aaa631

IPP

100 %

90 %

30 ns

60 ns

10 %

tr = 0.6 ns to 1 ns

Table 7. Characteristics

Tamb =25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VRWM reverse standoff voltage - - 5.5 V

IRM reverse leakage current per channel;

V=3.0V --1A

VBR breakdown voltage I = 1 mA 6 - 9 V

VFforward voltage - 0.7 - V

C(I/O-GND) input/output to ground

capacitance f=1MHz;

Vbias =2.5V [1] -0.6-pF

C(I/O-GND) input/output to ground

capacitance variation f=1MHz;

Vbias =2.5V [1] -0.05-pF

Cch(mutual) mutual cha nnel

capacitance f=1MHz;

Vbias =2.5V [1][2] -0.07-pF

Product data sheet Rev. 3 — 5 July 2016 4 of 12

NXP Semiconductors PESD1LVDS

ESD protection for in-vehicle ultra high-speed interfaces

Fig 2. ESD clamping test setup and waveforms

50 Ω

DUT

(DEVICE

UNDER

TEST)

GND

450 Ω

RG 223/U

50 Ω coax

ESD TESTER

IEC 61000-4-2 network

CZ = 150 pF; RZ = 330 Ω

4 GHz DIGITAL

OSCILLOSCOPE

10x

ATTENUATOR

unclamped +8 kV ESD pulse waveform

(IEC 61000-4-2 network)

unclamped –8 kV ESD pulse waveform

(IEC 61000-4-2 network)

vertical scale = 2 kV/div

horizontal scale = 15 ns/div

vertical scale = 2 kV/div

horizontal scale = 15 ns/div

GND

clamped +8 kV ESD pulse waveform

(IEC 61000-4-2 network)

006aac764

GND

clamped –8 kV ESD pulse waveform

(IEC 61000-4-2 network)

vertical scale = 20 V/div

horizontal scale = 10 ns/div

vertical scale = 20 V/div

horizontal scale = 10 ns/div

Product data sheet Rev. 3 — 5 July 2016 5 of 12

NXP Semiconductors PESD1LVDS

ESD protection for in-vehicle ultra high-speed interfaces

6. Application information

The devices are desig ned to provide high-level ESD protection for high-speed serial

data buses such as LVDS, HDMI and DisplayPort data lines.

When designing the Printed-Circu it Board (PCB), careful consideration should be given to

impedance matching, and signal coupling.

Basic application diagrams for the ESD protection of an HDMI interface are shown in

Figure 3.

Fig 3. Application diagram of HDMI ESD protection

006aac617

n.c.

CEC

TMDS_D2+

GND

TMDS_GND

TMDS_D1+

TMDS_GND

TMDS_D0+

TMDS_GND

TMDS_CLK+

TMDS_GND

TMDS_CLK–

DDC_CLK

DDC_DAT

GND

+5 V

HOT PLUG DETECTION

PESD1LVDS

TMDS_D1–

TMDS_D2–

TMDS_CH2+

TMDS_CH1+

TMDS_CH1–

TMDS_CH2–

TMDS_CH2+

TMDS_CH1+

TMDS_CH1–

TMDS_CH2–

GND

TMDS_D0–

HDMI

CONNECTOR

PESD1LVDS

654

100 nF

123

Product data sheet Rev. 3 — 5 July 2016 6 of 12

NXP Semiconductors PESD1LVDS

ESD protection for in-vehicle ultra high-speed interfaces

7. Test information

7.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in auto motive applications.

Product data sheet Rev. 3 — 5 July 2016 7 of 12

NXP Semiconductors PESD1LVDS

ESD protection for in-vehicle ultra high-speed interfaces

8. Package outline

Fig 4. Package outline SOT1165-1 (XSON10)

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

SOT1165-1 - - -

- - -

sot1165-1_po

13-01-09

13-02-18

Unit

max

nom

min

0.5 0.05

0.00

0.25

0.20

0.15

0.45

0.40

0.35

2.6

2.5

2.4

1.1

1.0

0.9 0.2

0.43

0.38

0.33

0.05

Dimensions

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

DFN2510-10: plastic, extremely thin small outline package; no leads;

10 terminals; body 1 x 2.5 x 0.5 mm SOT1165-1

A1c

0.127

1D(1) E(1) e

0.5

kLv

0.1

0.05

0 1 2 mm

scale

- - -

B A

terminal 1

index area

detail X

eAC B

terminal 1

index area

10 6

Terminal#3 identification

Product data sheet Rev. 3 — 5 July 2016 8 of 12

NXP Semiconductors PESD1LVDS

ESD protection for in-vehicle ultra high-speed interfaces

9. Soldering

Reflow soldering is the only recommended soldering method.

Fig 5. Reflow soldering footprint SOT1165-1 (XSON10)

SOT1165-1

Remark:

Stencil of 75 μm is recommended.

A stencil of 75 μm gives an aspect ratio of 0.77

With a stencil of 100 μm one will obtain an aspect ratio of 0.58

Footprint information for reflow soldering of DFN2510-10 package

solder land plus solder paste

occupied area

solder land

solder paste deposit

solder resist

Dimensions in mm

Ay By C D Hy

1.3 0.25 0.525 0.20

0.40

0.500 1.6

2.45

Generic footprint pattern

Refer to the package outline drawing for actual layout

sot1165-1_fr

ByHy

0.05

D0.05

Product data sheet Rev. 3 — 5 July 2016 9 of 12

NXP Semiconductors PESD1LVDS

ESD protection for in-vehicle ultra high-speed interfaces

10. Revision history

Table 8. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PESD1LVDS v.3 20160705 Product data sheet - PESD1LVDS v.2

Modifications: •Table 4 “Limiting values ”: updated maximum ambient temperature Tamb from +85 C to

+125 C

PESD1LVDS v.2 20130123 Product data sheet - PESD1LVDS v.1

PESD1LVDS v.1 20111010 Product data sheet - -

Product data sheet Rev. 3 — 5 July 2016 10 of 12

NXP Semiconductors PESD1LVDS

ESD protection for in-vehicle ultra high-speed interfaces

11. Legal information

11.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

11.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental ,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggreg ate and cumulative liabil ity towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

applications. Unless otherwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support , life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors pro duct can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and t her efo re su ch inclu si on a nd/or use is at the cu stome r's own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for t he customer’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associate d with t heir

applications and products.

NXP Semiconductors does not accept any liabili ty related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo mer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors her eby exp r essly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 3 — 5 July 2016 11 of 12

NXP Semiconductors PESD1LVDS

ESD protection for in-vehicle ultra high-speed interfaces

No offer to sell or license — Nothing in this document may be interpret ed or

construed as an of fer to se ll product s that is op en for accept ance or the grant ,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

11.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

12. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors PESD1LVDS

ESD protection for in-vehicle ultra high-speed interfaces

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 5 July 2016

Document identifier: PESD1LVDS

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

13. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Application information. . . . . . . . . . . . . . . . . . . 5

7 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6

7.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

12 Contact information. . . . . . . . . . . . . . . . . . . . . 11

13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12