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Super Yellow Green
Super Yellow Green
0.3(.012)
0.4(.016)
Cathode
Cathode Mark
0.5(.020)
2.0(.079)±0.2
4-R0.25(.010)
1.0(.039)±0.2
0.6(.024)
Cathode
0.6(.024)
2.0(.079)
0.6(.024)
3.2(.126)±0.2
1.3(.051)
2
1
4
3
0.8(.02)
1.0(.039)
For right anoge mounting
2.0(.079)1.5(.059) 1.5(.059)
Super Yellow Green
Super Yellow Green
2.0(.079)
For reflow soldeving
For upright mounting
1.5(.059)
2
1
1.5(.059)
3,4
0.35(.014)
38.4
0.2(.007)
0.2(.007)
0.6(.024)
● Features:
1. Emitted Color : Super Yellow Green and
Super Yellow Green
2. Lens Appearance : Water Clear
3. Bi-color type.
4. 3.2x1.0x2.0mm(1204) standard package
5. Suitable for all SMT assembly methods.
6. Compatible with infrared and vapor phase
reflow solder process.
7. Compatible with automatic placement
equipment.
8. This product doesn’t contain restriction
Substance, comply ROHS standard.
● Applications:
1. Automotive : Dashboards, stop lamps,
turn signals.
2. Backlighting : LCDs, Key pads advertising.
3. Status indicators : Comsumer & industrial
electronics.
4. General use.
● Absolute Maximum Ratings(Ta=25℃)
Parameter Symbol Super Yellow Green Super Yellow Green Unit
Power Dissipation Pd 100 100 mW
Forward Current IF 30 30 mA
Peak Forward Current ＊1 IFP 100 100 mA
Reverse Volage VR 5 V
Operating Temperature Topr -25℃~80℃ -
Storage Temperature Tstg -30℃~85℃ -
Soldering Temperature Tsol See Page 6 -
＊1 Condition for IFp is pulse of 1/10 duty and 0.1msec width.
●Package Dimensions:
NOTES:
1. All dimensions are in millimeters (inches).
2. Tolerance is ± 0.10mm (0.004”) unless otherwise specified.
3. Specifications are subject to change without notice.
Ver.1.0 Page 1 of 7
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● Electrical and optical characteristics(Ta=25℃)
Parameter Symbol Condition Color Min. Typ. Max. Unit
Forward Voltage Vf IF=20mA Super Yellow Green
Super Yellow Green - 2.0 2.6 V
Luminous Intensity Iv IF=20mA Super Yellow Green
Super Yellow Green 18.5 35 - mcd
Reverse Current IR VR=5V Super Yellow Green
Super Yellow Green - - 100 µA
Peak Wave Length λp IF=20mA Super Yellow Green
Super Yellow Green - 570 - nm
Dominant Wave Length λd IF=20mA Super Yellow Green
Super Yellow Green 566 - 576 nm
Spectral Line Half-width Δλ IF=20mA Super Yellow Green
Super Yellow Green - 30 - nm
Viewing Angle 2θ1/2 I
F=20mA Super Yellow Green
Super Yellow Green - 100 - deg
● Typical Electro-Optical Characteristics Curves
Fig.6 Radiation diagram
Relative radlant intensity
0.7
0.9
0.8
1.0
0.5 0.3 0.1 0.2
010
70
0.4
90
0.6
80
60
50
40
20
30
Relative luminous intensity (@20mA)
Forward current (mA)
0
10520
0.5
1.0
1.5
4030 50
Fig.3 Forward current vs. forward voltage
(G,G)
Forward voltage(V)
Fig.5 Relative luminous intensity vs. forward current
Forward current (mA)
2.0
0
21
10
20
30
40
Relative luminous intensity
(Normalized @ 20mA)
AAmbient temperature Ta( C)
0.5
435
0
-40
1.0
0-20 20 40 60
3.0
1.5
2.0
2.5
Fig.4 Relative luminous intensity vs.
ambient temperature
Ambient temperature Ta( C)
vs. ambient temperature
Forward Current (mA)
0
1010
20
30
4020 60 80 100
50
40
60
Fig.2 Forward current derating curve
(G,G)
Fig.1 Relative intensity vs. wavelength
Relative radiant intensity
520
0
0.5
1.0
Wavelength (nm)
570 620
Ver.1.0 Page 2 of 7
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● Tapping and packaging specifications(Units: mm)
CATHODE
0.05±
CATHODE
5.3
ANODE
START
FIXING TAPE
NOTE: 3000 pcs PER REEL
4.0
4.0 ±0.1
±0.1 2.0± 0.05
1.5± 0.1
1.75 0.1±
USER DIRECTION OF FEED
2.3 ±0.1
END
±
3.5 0.05±
8.0 0.3±
3.3 0.1
0.3
0.1
±
1.3
71.0± 0.1
LEADER
TRAILER
179± 1
13.0 0.5±
1.217.2±
●Package Method:(unit:mm)
220
245
470
Aluminum Foil Bag
220
645
210
185
6 box/car t on
Bar Code Label
3000 pcs/reel
12 bag/box
200
Ver.1.0 Page 3 of 7
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●Bin Limits
Intensity Bin Limits (At 20mA) (GE1)
BIN CODE Min. (mcd) Max. (mcd)
L 18.5 28.0
M 28.0 42.0
N 42.0 63.0
P 63.0 94.0
Tolerance for each Bin limit is ± 15 %.
Color Bin Limits (At 20mA) (GE1)
BIN CODE Min. (nm) Max. (nm)
4 566 568
5 568 570
6 570 572
7 572 574
8 574 576
Tolerance for each Bin limit is ± 1nm.
Intensity Bin Limits (At 20mA) (GE2)
BIN CODE Min. (mcd) Max. (mcd)
L 18.5 28.0
M 28.0 42.0
N 42.0 63.0
P 63.0 94.0
Tolerance for each Bin limit is ± 15 %.
Color Bin Limits (At 20mA) (GE2)
BIN CODE Min. (nm) Max. (nm)
4 566 568
5 568 570
6 570 572
7 572 574
8 574 576
Tolerance for each Bin limit is ± 1nm.
● BIN：x x-x x
Intensity BIN CODE (GE1)
Ver.1.0 Page 4 of 7
Color BIN CODE
(
GE1
)
Intensit
y
BIN CODE
(
GE2
)
Color BIN CODE
(
GE2
)
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● Reliability Test
Classification Test Item Reference Standard Test Conditions Result
Operation Life MIL-STD-750:1026
MIL-STD-883:1005
JIS-C-7021 :B-1
Connect with a power If=20mA
Ta=Under room temperature
Test time=1,000hrs
0/20
High
Temperature
High Humidity
Storage
MIL-STD-202:103B
JIS-C-7021 :B-11
Ta=+65℃±5℃
RH=90%-95%
Test time=240hrs 0/20
High
Temperature
Storage
MIL-STD-883:1008
JIS-C-7021 :B-10
High Ta=+85℃±5℃
Test time=1,000hrs 0/20
Endurance
Test
Low
Temperature
Storage
JIS-C-7021 :B-12
Low Ta=-35℃±5℃
Test time=1,000hrs 0/20
Temperature
Cycling
MIL-STD-202:107D
MIL-STD-750:1051
MIL-STD-883:1010
JIS-C-7021 :A-4
-35℃ ~ +25℃ ~ +85℃ ~ +25℃
60min 20min 60min 20min
Test Time=5cycle 0/20
Thermal Shock MIL-STD-202:107D
MIL-STD-750:1051
MIL-STD-883:1011
-35℃±5℃ ~+85℃±5℃
20min 20min
Test Time=10cycle
0/20
Environmental
Test
Solder
Resistance MIL-STD-202:201A
MIL-STD-750:2031
JIS-C-7021 :A-1
Preheating：
140℃-160℃,within 2 minutes.
Operation heating：
260℃(Max.), within 10seconds. (Max.)
0/20
● Judgment criteria of failure for the reliability
Measuring items Symbol Measuring conditions Judgement criteria for failure
Forward voltage VF ( V) IF=20mA Over Ux1.2
Reverse current IR(uA) VR=5V Over Ux2
Luminous intensity Iv ( mcd ) IF=20mA Below SX0.5
Note: 1.U means the upper limit of specified characteristics. S means initial value.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
Ver.1.0 Page 5 of 7
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● Soldering :
1. Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
2. Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 260℃(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
3. DIP soldering (Wave Soldering) :
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
● Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
Temperatur
Time
OVER 2 MIN.
4℃ /SEC. MAX.
4℃ /SEC. MAX.
10 SEC . MA X.
260℃ MAX.
140~160℃
Temperature
Time
120~180 sec.
Preheat
245 ±5℃ within 5 sec.
Soldering heat Max. 260 ℃
120~150℃
Ver.1.0 Page 6 of 7
