KSZ9031RNXIA-TR - MICROCHIP TECHNOLOGY

 2016-2017 Microchip Technology Inc. DS00002117F-page 1

Features

• Single-Chip 10/100/1000 Mbps Ethernet Trans-

ceiver Suitable for IEEE 802.3 Applications

• RGMII Timing Supports On-Chip Delay According

to RGMII Version 2.0, with Programming Options

for External Delay and Making Adjustments and

Corrections to TX and RX Timing Paths

• RGMII with 3.3V/2.5V/1.8V Tolerant I/Os

• Auto-Negotiation to Automatically Select the

Highest Link-Up Speed (10/100/1000 Mbps) and

Duplex (Half/Full)

• On-Chip Termination Resistors for the Differential

Pairs

• On-Chip LDO Controller to Support Single 3.3V

Supply Operation – Requires Only One External

FET to Generate 1.2V for the Core

• Jumbo Frame Support up to 16 KB

• 125 MHz Reference Clock Output

• Energy Detect Power-Down Mode for Reduced

Power Consumption When the Cable is Not

Attached

• Wake-On-LAN (WOL) Support with Robust Cus-

tom-Packet Detection

• Programmable LED Outputs for Link, Activity, and

Speed

• Baseline Wander Correction

• LinkMD TDR-Based Cable Diagnostic to Identify

Faulty Copper Cabling

• Parametric NAND Tree Support to Detect Faults

Between Chip I/Os and Board

• Loopback Modes for Diagnostics

• Automatic MDI/MDI-X Crossover to Detect and

Correct Pair Swap at all Speeds of Operation

• Automatic Detection and Correction of Pair

Swaps, Pair Skew, and Pair Polarity

• MDC/MDIO Management Interface for PHY Reg-

ister Configuration

• Interrupt Pin Option

• Power-Down and Power-Saving Modes

• Operating Voltages

- Core (DVDDL, AVDDL, AVDDL_PLL): 1.2V

(External FET or Regulator)

- VDD I/O (DVDDH): 3.3V, 2.5V, or 1.8V

- Transceiver (AVDDH): 3.3V or 2.5V (Com-

mercial Temp.)

• AEC-Q100 Grade 3 (KSZ9031RNXUA/UB) and

Grade 2 (KSZ9031RNXVA/VB) Qualified for Auto-

motive Applications

• 48-pin QFN (7 mm × 7 mm) Package

Target Applications

• Laser/Network Printer

• Network Attached Storage (NAS)

• Network Server

• Gigabit LAN on Motherboard (GLOM)

• Broadband Gateway

• Gigabit SOHO/SMB Router

•IPTV

• IP Set-Top Box

• Game Console

• Triple-Play (Data, Voice, Video) Media Center

• Industrial Control

• Automotive In-Vehicle Networking

KSZ9031RNX

Gigabit Ethernet Transceiver with RGMII

Support

KSZ9031RNX

DS00002117F-page 2  2016-2017 Microchip Technology Inc.

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Customer Notification System

 2016-2017 Microchip Technology Inc. DS00002117F-page 3

KSZ9031RNX

Table of Contents

1.0 Introduction ..................................................................................................................................................................................... 4

2.0 Pin Description and Configuration .................................................................................................................................................. 5

3.0 Functional Description .................................................................................................................................................................. 13

4.0 Register Descriptions .................................................................................................................................................................... 31

5.0 Operational Characteristics ........................................................................................................................................................... 52

6.0 Electrical Characteristics ............................................................................................................................................................... 53

7.0 Timing Diagrams ........................................................................................................................................................................... 57

8.0 Reset Circuit ................................................................................................................................................................................. 63

9.0 Reference Circuits — LED Strap-In Pins ...................................................................................................................................... 65

10.0 Reference Clock - Connection and Selection ............................................................................................................................. 66

11.0 On-Chip LDO Controller - MOSFET Selection ............................................................................................................................ 66

12.0 Magnetic - Connection and Selection ......................................................................................................................................... 67

13.0 Package Outlines ........................................................................................................................................................................ 69

Appendix A: Data Sheet Revision History ........................................................................................................................................... 74

The Microchip Web Site ...................................................................................................................................................................... 76

Customer Change Notification Service ............................................................................................................................................... 76

Customer Support ............................................................................................................................................................................... 76

Product Identification System ............................................................................................................................................................. 77

 2016-2017 Microchip Technology Inc. DS00002117F-page 4

KSZ9031RNX

1.0 INTRODUCTION

1.1 General Description

The KSZ9031RNX is a completely integrated triple-speed (10BASE-T/100BASE-TX/1000BASE-T) Ethernet physical-

layer transceiver for transmission and reception of data on standard CAT-5 unshielded twisted pair (UTP) cable.

The KSZ9031RNX provides the Reduced Gigabit Media Independent Interface (RGMII) for direct connection to RGMII

MACs in Gigabit Ethernet processors and switches for data transfer at 10/100/1000 Mbps.

The KSZ9031RNX reduces board cost and simplifies board layout by using on-chip termination resistors for the four

differential pairs and by integrating an LDO controller to drive a low-cost MOSFET to supply the 1.2V core.

The KSZ9031RNX offers diagnostic features to facilitate system bring-up and debugging in production testing and in

product deployment. Parametric NAND tree support enables fault detection between KSZ9031 I/Os and the board. The

LinkMD® TDR-based cable diagnostic identifies faulty copper cabling. Remote and local loopback functions verify ana-

log and digital data paths.

The standard KSZ9031RNX is available in a 48-pin, lead-free QFN package, and the AEC-Q100 automotive qualified

parts, KSZ9031RNXUA/UB and KSZ9031RNXVA/VB, are available in a 48-pin lead-free VQFN (wettable) package.

FIGURE 1-1: SYSTEM BLOCK DIAGRAM

RGMII

10/100/1000Mbps

RGMII

ETHERNET MAC MDC/MDIO

MANAGEMENT

KSZ9031RNX

LDO

CONTROLLER

ON-CHIP TERMINATION

RESISTORS

VIN

3.3VA

VOUT

1.2V (FOR CORE VOLTAGES)

MAGNETICS

RJ-45

CONNECTOR

MEDIA TYPES

10Base-T

100Base-TX

1000Base-T

(SYSTEM POWER CIRCUIT)

PME_N

 2016-2017 Microchip Technology Inc. DS00002117F-page 5

KSZ9031RNX

2.0 PIN DESCRIPTION AND CONFIGURATION

FIGURE 2-1: 48-QFN PIN ASSIGNMENT (TOP VIEW)

TXRXP_A

LED2/

PHYAD1

4142434445464748

PADDLE GROUND

(ON BOTTOM OF CHIP)

37383940

TXRXM_A 3

AVDDL

AVDDH

TXRXP_B

TXRXM_B

AVDDL

2019181716151413 24232221

LED1 /

PME_N1 /

PHYAD0

DVDDH

TXD0

DVDDL

TXD2

TXD3

DVDDL

TX_EN

RXD1/

MODE1

RXD0/

MODE0

RX_DV/

CLK125_EN

DVDDH

VSS

RX_CLK/

PHYAD2

RESET_N

ISET

AVDDL_PLL

LDO_O

DVDDH

CLK125_NDO/

LED_MODE

DVDDL

INT_N/

PME_N2

MDIO

TXD1

DVDDL

KSZ9031RNX

AVDDH

TXRXP_C

TXRXM_C

TXRXP_D

TXRXM_D

MDC

RXD2/

MODE2

RXD3/

MODE3

DVDDL

GTX_CLK

KSZ9031RNX

DS00002117F-page 6  2016-2017 Microchip Technology Inc.

TABLE 2-1: SIGNALS - KSZ9031RNX

Number

Name

Type

Note

2-1

Description

1 AVDDH P 3.3V/2.5V (commercial temp only) analog VDD

2 TXRXP_A I/O

Media Dependent Interface[0], positive signal of differential pair

1000BASE-T mode:

TXRXP_A corresponds to BI_DA+ for MDI configuration and BI_DB+ for MDI-

X configuration, respectively.

10BASE-T/100BASE-TX mode:

TXRXP_A is the positive transmit signal (TX+) for MDI configuration and the

positive receive signal (RX+) for MDI-X configuration, respectively.

3 TXRXM_A I/O

Media Dependent Interface[0], negative signal of differential pair

1000BASE-T mode:

TXRXM_A corresponds to BI_DA– for MDI configuration and BI_DB– for

MDI-X configuration, respectively.

10BASE-T/100BASE-TX mode:

TXRXM_A is the negative transmit signal (TX–) for MDI configuration and the

negative receive signal (RX–) for MDI-X configuration, respectively.

4 AVDDL P 1.2V analog VDD

5 TXRXP_B I/O

Media Dependent Interface[1], positive signal of differential pair

1000BASE-T mode:

TXRXP_B corresponds to BI_DB+ for MDI configuration and BI_DA+ for MDI-

X configuration, respectively.

10BASE-T/100BASE-TX mode:

TXRXP_B is the positive receive signal (RX+) for MDI configuration and the

positive transmit signal (TX+) for MDI-X configuration, respectively.

6 TXRXM_B I/O

Media Dependent Interface[1], negative signal of differential pair

1000BASE-T mode:

TXRXM_B corresponds to BI_DB– for MDI configuration and BI_DA– for

MDI-X configuration, respectively.

10BASE-T/100BASE-TX mode:

TXRXM_B is the negative receive signal (RX–) for MDI configuration and the

negative transmit signal (TX–) for MDI-X configuration, respectively.

7 TXRXP_C I/O

Media Dependent Interface[2], positive signal of differential pair

1000BASE-T mode:

TXRXP_C corresponds to BI_DC+ for MDI configuration and BI_DD+ for

MDI-X configuration, respectively.

10BASE-T/100BASE-TX mode:

TXRXP_C is not used.

8 TXRXM_C I/O

Media Dependent Interface[2], negative signal of differential pair

1000BASE-T mode:

TXRXM_C corresponds to BI_DC– for MDI configuration and BI_DD– for

MDI-X configuration, respectively.

10BASE-T/100BASE-TX mode:

TXRXM_C is not used.

9 AVDDL P 1.2V analog VDD

 2016-2017 Microchip Technology Inc. DS00002117F-page 7

KSZ9031RNX

10 TXRXP_D I/O

Media Dependent Interface[3], positive signal of differential pair

1000BASE-T mode:

TXRXP_D corresponds to BI_DD+ for MDI configuration and BI_DC+ for

MDI-X configuration, respectively.

10BASE-T/100BASE-TX mode:

TXRXP_D is not used.

11 TXRXM_D I/O

Media Dependent Interface[3], negative signal of differential pair

1000BASE-T mode:

TXRXM_D corresponds to BI_DD– for MDI configuration and BI_DC– for

MDI-X configuration, respectively.

10BASE-T/100BASE-TX mode:

TXRXM_D is not used.

12 AVDDH P 3.3V/2.5V (commercial temp only) analog VDD

13 NC — No connect. This pin is not bonded and can be connected to digital ground for

footprint compatibility with the KSZ9021RN Gigabit PHY.

14 DVDDL P 1.2V digital VDD

TABLE 2-1: SIGNALS - KSZ9031RNX (CONTINUED)

Number

Name

Type

Note

2-1

Description

KSZ9031RNX

DS00002117F-page 8  2016-2017 Microchip Technology Inc.

15 LED2/

PHYAD1 I/O

LED output: Programmable LED2 output

Config mode: The pull-up/pull-down value is latched as PHYAD[1] during

power-up/reset. See the Strap-In Options - KSZ9031RNX section for details.

The LED2 pin is programmed by the LED_MODE strapping option (Pin 41),

and is defined as follows:

Single-LED Mode

Link Pin State LED Definition

Link Off H OFF

Link On (any speed) L ON

Tri-Color Dual-LED Mode

Link/Activity

Pin State LED Definition

LED2 LED1 LED2 LED1

Link Off H H OFF OFF

1000 Link/No Activity L H ON OFF

1000 Link/Activity

(RX, TX) Toggle H Blinking OFF

100 Link/No Activity H L OFF ON

100 Link/Activity

(RX, TX) H Toggle OFF Blinking

10 Link/No Activity L L ON ON

10 Link/Activity

(RX, TX) Toggle Toggle Blinking Blinking

For tri-color dual-LED mode, LED2 works in conjunction with LED1 (Pin 17) to

indicate 10 Mbps link and activity.

16 DVDDH P 3.3V, 2.5V, or 1.8V digital VDD_I/O

TABLE 2-1: SIGNALS - KSZ9031RNX (CONTINUED)

Number

Name

Type

Note

2-1

Description

 2016-2017 Microchip Technology Inc. DS00002117F-page 9

KSZ9031RNX

LED1/

PHYAD0/

PME_N1

I/O

LED1 output: Programmable LED1 output

Config mode: The voltage on this pin is sampled and latched during the

power-up/reset process to determine the value of PHYAD[0]. See the Strap-In

Options - KSZ9031RNX section for details.

PME_N output: Programmable PME_N output (pin option 1). This pin function

requires an external pull-up resistor to DVDDH (digital VDD_I/O) in a range

from 1.0 k to 4.7 k. When asserted low, this pin signals that a WOL event

has occurred.

This pin is not an open-drain for all operating modes.

The LED1 pin is programmed by the LED_MODE strapping option (Pin 41),

and is defined as follows:

Single-LED Mode

Activity Pin State LED Definition

No Activity H OFF

Activity (RX, TX) Toggle Blinking

Tri-Color Dual-LED Mode

Link/Activity

Pin State LED Definition

LED2 LED1 LED2 LED1

Link Off H H OFF OFF

1000 Link/No Activity L H ON OFF

1000 Link/Activity

(RX, TX) Toggle H Blinking OFF

100 Link/No Activity H L OFF ON

100 Link/Activity

(RX, TX) H Toggle OFF Blinking

10 Link/No Activity L L ON ON

10 Link/Activity

(RX, TX) Toggle Toggle Blinking Blinking

For tri-color dual-LED mode, LED1 works in conjunction with LED2 (Pin 15) to

indicate 10 Mbps link and activity.

18 DVDDL P 1.2V digital VDD

19 TXD0 I RGMII mode: RGMII TD0 (Transmit Data 0) input

20 TXD1 I RGMII mode: RGMII TD1 (Transmit Data 1) input

21 TXD2 I RGMII mode: RGMII TD2 (Transmit Data 2) input

22 TXD3 I RGMII mode: RGMII TD3 (Transmit Data 3) input

23 DVDDL P 1.2V digital VDD

24 GTX_CLK I RGMII mode: RGMII TXC (Transmit Reference Clock) input

TABLE 2-1: SIGNALS - KSZ9031RNX (CONTINUED)

Number

Name

Type

Note

2-1

Description

KSZ9031RNX

DS00002117F-page 10  2016-2017 Microchip Technology Inc.

25 TX_EN I RGMII mode: RGMII TX_CTL (Transmit Control) input

26 DVDDL P 1.2V digital VDD

27 RXD3/

MODE3 I/O

RGMII mode: RGMII RD3 (Receive Data 3) output

Config mode: The pull-up/pull-down value is latched as MODE3 during

power-up/reset. See the Strap-In Options - KSZ9031RNX section for details.

28 RXD2/

MODE2 I/O

RGMII mode: RGMII RD2 (Receive Data 2) output

Config mode: The pull-up/pull-down value is latched as MODE2 during

power-up/reset. See the Strap-In Options - KSZ9031RNX section for details.

29 VSS GND Digital ground

30 DVDDL P 1.2V digital VDD

31 RXD1/

MODE1 I/O

RGMII mode: RGMII RD1 (Receive Data 1) output

Config mode: The pull-up/pull-down value is latched as MODE1 during

power-up/reset. See the Strap-In Options - KSZ9031RNX section for details.

32 RXD0/

MODE0 I/O

RGMII mode: RGMII RD0 (Receive Data 0) output

Config mode: The pull-up/pull-down value is latched as MODE0 during

power-up/reset. See the Strap-In Options - KSZ9031RNX section for details.

33 RX_DV/

CLK125_EN I/O

RGMII mode: RGMII RX_CTL (Receive Control) output

Config mode: Latched as CLK125_NDO Output Enable during power-up/

reset. See the Strap-In Options - KSZ9031RNX section for details.

34 DVDDH P 3.3V, 2.5V, or 1.8V digital VDD_I/O

35 RX_CLK/

PHYAD2 I/O

RGMII mode: RGMII RXC (Receive Reference Clock) output

Config mode: The pull-up/pull-down value is latched as PHYAD[2] during

power-up/reset. See the Strap-In Options - KSZ9031RNX section for details.

36 MDC Ipu Management data clock input

This pin is the input reference clock for MDIO (Pin 37).

37 MDIO Ipu/O

Management data input/output

This pin is synchronous to MDC (Pin 36) and requires an external pull-up

resistor to DVDDH (digital VDD_I/O) in a range from 1.0 k to 4.7 k.

38 INT_N/

PME_N2 O

Interrupt output: Programmable interrupt output, with Register 1Bh as the

Interrupt Control/Status register, for programming the interrupt conditions and

reading the interrupt status. Register 1Fh, Bit [14] sets the interrupt output to

active low (default) or active high.

PME_N output: Programmable PME_N output (pin option 2). When asserted

low, this pin signals that a WOL event has occurred.

For Interrupt (when active low) and PME functions, this pin requires an exter-

nal pull-up resistor to DVDDH (digital VDD_I/O) in a range from 1.0 k to

4.7 k.

This pin is not an open-drain for all operating modes.

39 DVDDL P 1.2V digital VDD

40 DVDDH P 3.3V, 2.5V, or 1.8V digital VDD_I/O

TABLE 2-1: SIGNALS - KSZ9031RNX (CONTINUED)

Number

Name

Type

Note

2-1

Description

 2016-2017 Microchip Technology Inc. DS00002117F-page 11

KSZ9031RNX

Note 2-1 P = power supply

GND = ground

I = input

O = output

I/O = bi-directional

Ipu = Input with internal pull-up (see Section 6.0, "Electrical Characteristics" for value).

Ipu/O = Input with internal pull-up (see Section 6.0, "Electrical Characteristics" for value) during

power-up/reset; output pin otherwise.

41 CLK125_NDO/

LED_MODE I/O

125 MHz clock output

This pin provides a 125 MHz reference clock output option for use by the

MAC.

Config mode: The pull-up/pull-down value is latched as LED_MODE during

power-up/reset. See the Strap-In Options - KSZ9031RNX section for details.

42 RESET_N Ipu

Chip reset (active low)

Hardware pin configurations are strapped-in at the de-assertion (rising edge)

of RESET_N. See the Strap-In Options - KSZ9031RNX section for details.

43 LDO_O O

On-chip 1.2V LDO controller output

This pin drives the input gate of a P-channel MOSFET to generate 1.2V for

the chip’s core voltages. If the system provides 1.2V and this pin is not used,

it can be left floating.

Note: This pin should never be driven externally.

44 AVDDL_PLL P 1.2V analog VDD fo r P LL

45 XO O 25 MHz crystal feedback

This pin is a no connect if an oscillator or external clock source is used.

46 XI I Crystal/Oscillator/External Clock input

25 MHz ±50 ppm tolerance

47 NC —

No connect

This pin is not bonded and can be connected to AVDDH power for footprint

compatibility with the KSZ9021RN Gigabit PHY.

48 ISET I/O Set the transmit output level

Connect a 12.1 k 1% resistor to ground on this pin.

Paddle P_GND GND Exposed paddle on bottom of chip

Connect P_GND to ground.

TABLE 2-1: SIGNALS - KSZ9031RNX (CONTINUED)

Number

Name

Type

Note

2-1

Description

KSZ9031RNX

DS00002117F-page 12  2016-2017 Microchip Technology Inc.

Pin strap-ins are latched during power-up or reset. In some systems, the MAC receive input pins may be driven during

power-up or reset, and consequently cause the PHY strap-in pins on the RGMII signals to be latched to an incorrect

configuration. In this case, external pull-up or pull-down resistors should be added on the PHY strap-in pins to ensure

the PHY is configured to the correct pin strap-in mode.

Note 2-2 I/O = Bi-directional.

TABLE 2-2: STRAP-IN OPTIONS - KSZ9031RNX

Pin Number Pin Name Type

Note 2-2 Description

PHYAD2

PHYAD1

PHYAD0

I/O

The PHY address, PHYAD[2:0], is sampled and latched at power-up/

reset and is configurable to any value from 0 to 7. Each PHY address

bit is configured as follows:

Pull-up = 1

Pull-down = 0

PHY Address Bits [4:3] are always set to ‘00’.

MODE3

MODE2

MODE1

MODE0

I/O

The MODE[3:0] strap-in pins are sampled and latched at power-up/

reset and are defined as follows:

MODE[3:0] Mode

0000 Reserved - not used

0001 Reserved - not used

0010 Reserved - not used

0011 Reserved - not used

0100 NAND tree mode

0101 Reserved - not used

0110 Reserved - not used

0111 Chip power-down mode

1000 Reserved - not used

1001 Reserved - not used

1010 Reserved - not used

1011 Reserved - not used

1100 RGMII mode - Advertise 1000BASE-T full-duplex

only

1101 RGMII mode - Advertise 1000BASE-T full- and half-

duplex only

1110

RGMII mode - Advertise all capabilities (10/100/1000

speed half-/full-duplex), except 1000BASE-T half-

duplex

1111 RGMII mode - Advertise all capabilities (10/100/1000

speed half-/full-duplex)

33 CLK125_EN I/O

CLK125_EN is sampled and latched at power-up/reset and is

defined as follows:

Pull-up (1) = Enable 125 MHz clock output

Pull-down (0) = Disable 125 MHz clock output

Pin 41 (CLK125_NDO) provides the 125 MHz reference clock output

option for use by the MAC.

41 LED_MODE I/O

LED_MODE is sampled and latched at power-up/reset and is

defined as follows:

Pull-up (1) = Single-LED mode

Pull-down (0) = Tri-color dual-LED mode

 2016-2017 Microchip Technology Inc. DS00002117F-page 13

KSZ9031RNX

3.0 FUNCTIONAL DESCRIPTION

The KSZ9031RNX is a completely integrated triple-speed (10BASE-T/100BASE-TX/1000BASE-T) Ethernet physical

layer transceiver solution for transmission and reception of data over a standard CAT-5 unshielded twisted pair (UTP)

cable.

The KSZ9031RNX reduces board cost and simplifies board layout by using on-chip termination resistors for the four

differential pairs and by integrating an LDO controller to drive a low-cost MOSFET to supply the 1.2V core.

On the copper media interface, the KSZ9031RNX can automatically detect and correct for differential pair misplace-

ments and polarity reversals, and correct propagation delays and re-sync timing between the four differential pairs, as

specified in the IEEE 802.3 standard for 1000BASE-T operation.

The KSZ9031RNX provides the RGMII interface for connection to RGMII MACs in Gigabit Ethernet processors and

switches for data transfer at 10/100/1000 Mbps.

Figure 3-1 shows a high-level block diagram of the KSZ9031RNX.

FIGURE 3-1: KSZ9031RNX BLOCK DIAGRAM

3.1 10BASE-T/100BASE-TX Transceiver

3.1.1 100BASE-TX TRANSMIT

The 100BASE-TX transmit function performs parallel-to-serial conversion, 4B/5B coding, scrambling, NRZ-to-NRZI con-

version, and MLT-3 encoding and transmission.

The circuitry starts with a parallel-to-serial conversion, which converts the MII data from the MAC into a 125 MHz serial

bit stream. The data and control stream is then converted into 4B/5B coding, followed by a scrambler. The serialized

data is further converted from NRZ-to-NRZI format, and then transmitted in MLT-3 current output. The output current is

set by an external 12.1 k 1% resistor for the 1:1 transformer ratio.

The output signal has a typical rise/fall time of 4 ns and complies with the ANSI TP-PMD standard regarding amplitude

balance, and overshoot. The wave-shaped 10BASE-T output is also incorporated into the 100BASE-TX transmitter.

3.1.2 100BASE-TX RECEIVE

The 100BASE-TX receiver function performs adaptive equalization, DC restoration, MLT-3-to-NRZI conversion, data

and clock recovery, NRZI-to-NRZ conversion, de-scrambling, 4B/5B decoding, and serial-to-parallel conversion.

The receiving side starts with the equalization filter to compensate for inter-symbol interference (ISI) over the twisted

pair cable. Because the amplitude loss and phase distortion are a function of the cable length, the equalizer must adjust

its characteristics to optimize performance. In this design, the variable equalizer makes an initial estimation based on

comparisons of incoming signal strength against some known cable characteristics, then tunes itself for optimization.

This is an ongoing process and self-adjusts against environmental changes such as temperature variations.

MEDIA

INTERFACE

PMA

TX10/100/1000

PMA

RX1000

PMA

RX100

PMA

RX10

CLOCK

RESET

PCS10

AUTO-

NEGOTIATION

PCS100

PCS1000

INTERFACE

LED

DRIVERS

CONFIGURATIONS

RGMII

KSZ9031RNX

DS00002117F-page 14  2016-2017 Microchip Technology Inc.

Next, the equalized signal goes through a DC-restoration and data-conversion block. The DC-restoration circuit com-

pensates for the effect of baseline wander and improves the dynamic range. The differential data conversion circuit con-

verts the MLT-3 format back to NRZI. The slicing threshold is also adaptive.

The clock-recovery circuit extracts the 125 MHz clock from the edges of the NRZI signal. This recovered clock is then

used to convert the NRZI signal into the NRZ format. This signal is sent through the de-scrambler followed by the 4B/

5B decoder. Finally, the NRZ serial data is converted to the RGMII format and provided as the input data to the MAC.

3.1.3 SCRAMBLER/DE-SCRAMBLER (100BASE-TX ONLY)

The purpose of the scrambler is to spread the power spectrum of the signal to reduce electromagnetic interference (EMI)

and baseline wander. Transmitted data is scrambled using an 11-bit wide linear feedback shift register (LFSR). The

scrambler generates a 2047-bit non-repetitive sequence, then the receiver de-scrambles the incoming data stream

using the same sequence as at the transmitter.

3.1.4 10BASE-T TRANSMIT

The 10BASE-T output drivers are incorporated into the 100BASE-TX drivers to allow for transmission with the same

magnetic. The drivers perform internal wave-shaping and pre-emphasis, and output signals with typical amplitude of

2.5V peak for standard 10BASE-T mode and 1.75V peak for energy-efficient 10BASE-Te mode. The 10BASE-T/

10BASE-Te signals have harmonic contents that are at least 31 dB below the fundamental frequency when driven by

an all-ones Manchester-encoded signal.

3.1.5 10BASE-T RECEIVE

On the receive side, input buffer and level-detecting squelch circuits are used. A differential input receiver circuit and a

phase-locked loop (PLL) perform the decoding function. The Manchester-encoded data stream is separated into clock

signal and NRZ data. A squelch circuit rejects signals with levels less than 300 mV or with short pulse widths to prevent

noises at the receive inputs from falsely triggering the decoder. When the input exceeds the squelch limit, the PLL locks

onto the incoming signal and the KSZ9031RNX decodes a data frame. The receiver clock is maintained active during

idle periods between receiving data frames.

The KSZ9031RNX removes all 7 bytes of the preamble and presents the received frame starting with the SFD (start of

frame delimiter) to the MAC.

Auto-polarity correction is provided for the receiving differential pair to automatically swap and fix the incorrect +/– polar-

ity wiring in the cabling.

3.2 1000BASE-T Transceiver

The 1000BASE-T transceiver is based-on a mixed-signal/digital-signal processing (DSP) architecture, which includes

the analog front-end, digital channel equalizers, trellis encoders/decoders, echo cancelers, cross-talk cancelers, preci-

sion clock recovery scheme, and power-efficient line drivers.

Figure 3-2 shows a high-level block diagram of a single channel of the 1000BASE-T transceiver for one of the four dif-

ferential pairs.

 2016-2017 Microchip Technology Inc. DS00002117F-page 15

KSZ9031RNX

FIGURE 3-2: KSZ9031RNX 1000BASE-T BLOCK DIAGRAM - SINGLE CHANNEL

3.2.1 ANALOG ECHO-CANCELLATION CIRCUIT

In 1000BASE-T mode, the analog echo-cancellation circuit helps to reduce the near-end echo. This analog hybrid circuit

relieves the burden of the ADC and the adaptive equalizer.

This circuit is disabled in 10BASE-T/100BASE-TX mode.

3.2.2 AUTOMATIC GAIN CONTROL (AGC)

In 1000BASE-T mode, the automatic gain control (AGC) circuit provides initial gain adjustment to boost up the signal

level. This pre-conditioning circuit is used to improve the signal-to-noise ratio of the receive signal.

3.2.3 ANALOG-TO-DIGITAL CONVERTER (ADC)

In 1000BASE-T mode, the analog-to-digital converter (ADC) digitizes the incoming signal. ADC performance is essen-

tial to the overall performance of the transceiver.

This circuit is disabled in 10BASE-T/100BASE-TX mode.

3.2.4 TIMING RECOVERY CIRCUIT

In 1000BASE-T mode, the mixed-signal clock recovery circuit together with the digital phase-locked loop is used to

recover and track the incoming timing information from the received data. The digital phase-locked loop has very low

long-term jitter to maximize the signal-to-noise ratio of the receive signal.

The 1000BASE-T slave PHY must transmit the exact receive clock frequency recovered from the received data back to

the 1000BASE-T master PHY. Otherwise, the master and slave will not be synchronized after long transmission. This

also helps to facilitate echo cancellation and NEXT removal.

3.2.5 ADAPTIVE EQUALIZER

In 1000BASE-T mode, the adaptive equalizer provides the following functions:

• Detection for partial response signaling

• Removal of NEXT and ECHO noise

• Channel equalization

Signal quality is degraded by residual echo that is not removed by the analog hybrid because of impedance mismatch.

The KSZ9031RNX uses a digital echo canceler to further reduce echo components on the receive signal.

In 1000BASE-T mode, data transmission and reception occurs simultaneously on all four pairs of wires (four channels).

This results in high-frequency cross-talk coming from adjacent wires. The KSZ9031RNX uses three NEXT cancelers on

each receive channel to minimize the cross-talk induced by the other three channels.

CLOCK

GENERATION

BASELINE

WANDER

COMPENSATION

ECHO

CANCELLER

TRANSMIT

BLOCK

NEXT Canceller

CANCELLER

RX-

ADC

AGC

+FFE SLICER

CLOCK AND PHASE

RECOVERY

AUTO -

NEGOTIATION

PMA STATE

MACHINES

MII

REGISTERS

MII

MANAGEMENT

CONTROL

DFE

ANALOG

HYBRID

PCS STATE

MACHINES

PAIR SWAP

AND

ALIGN UNIT DESCRAMBLER

DECODER

SIDE-STREAM

SCRAMBLER

AND

SYMBOL ENCODER

LED DRIVER

XTAL OTHER

CHANNELS

SIGNAL

KSZ9031RNX

DS00002117F-page 16  2016-2017 Microchip Technology Inc.

In 10BASE-T/100BASE-TX mode, the adaptive equalizer needs only to remove the inter-symbol interference and

recover the channel loss from the incoming data.

3.2.6 TRELLIS ENCODER AND DECODER

In 1000BASE-T mode, the transmitted 8-bit data is scrambled into 9-bit symbols and further encoded into 4D-PAM5

symbols. The initial scrambler seed is determined by the specific PHY address to reduce EMI when more than one

KSZ9031RNX is used on the same board. On the receiving side, the idle stream is examined first. The scrambler seed,

pair skew, pair order, and polarity must be resolved through the logic. The incoming 4D-PAM5 data is then converted

into 9-bit symbols and de-scrambled into 8-bit data.

3.3 Auto MDI/MDI-X

The Automatic MDI/MDI-X feature eliminates the need to determine whether to use a straight cable or a crossover cable

between the KSZ9031RNX and its link partner. This auto-sense function detects the MDI/MDI-X pair mapping from the

link partner, and assigns the MDI/MDI-X pair mapping of the KSZ9031RNX accordingly.

Table 3-1 shows the KSZ9031RNX 10/100/1000 pin configuration assignments for MDI/MDI-X pin mapping.

Auto MDI/MDI-X is enabled by default. It is disabled by writing a one to Register 1Ch, Bit [6]. MDI and MDI-X mode is

set by Register 1Ch, Bit [7] if Auto MDI/MDI-X is disabled.

An isolation transformer with symmetrical transmit and receive data paths is recommended to support Auto MDI/MDI-X.

3.4 Pair-Swap, Alignment, and Polarity Check

In 1000BASE-T mode, the KSZ9031RNX

• Detects incorrect channel order and automatically restores the pair order for the A, B, C, D pairs (four channels).

• Supports 50 ns ±10 ns difference in propagation delay between pairs of channels in accordance with the IEEE

802.3 standard, and automatically corrects the data skew so the corrected four pairs of data symbols are synchro-

nized.

Incorrect pair polarities of the differential signals are automatically corrected for all speeds.

3.5 Wave Shaping, Slew-Rate Control, and Partial Response

In communication systems, signal transmission encoding methods are used to provide the noise-shaping feature and

to minimize distortion and error in the transmission channel.

• For 1000BASE-T, a special partial-response signaling method is used to provide the band-limiting feature for the

transmission path.

• For 100BASE-TX, a simple slew-rate control method is used to minimize EMI.

• For 10BASE-T, pre-emphasis is used to extend the signal quality through the cable.

3.6 PLL Clock Synthesizer

The KSZ9031RNX generates 125 MHz, 25 MHz, and 10 MHz clocks for system timing. Internal clocks are generated

from the external 25 MHz crystal or reference clock.

TABLE 3-1: MDI/MDI-X PIN MAPPING

(RJ-45 Pair)

MDI MDI-X

1000BASE-T 100BASE-T 10BASE-T 1000BASE-T 100BASE-T 10BASE-T

TXRXP/M_A

(1, 2)

A+/– TX+/– TX+/– B+/– RX+/– RX+/–

TXRXP/M_B

(3, 6)

B+/– RX+/– RX+/– A+/– TX+/– TX+/–

TXRXP/M_C

(4, 5)

C+/– Not Used Not Used D+/– Not Used Not Used

TXRXP/M_D

(7, 8)

D+/– Not Used Not Used C+/– Not Used Not Used

 2016-2017 Microchip Technology Inc. DS00002117F-page 17

KSZ9031RNX

3.7 Auto-Negotiation

The KSZ9031RNX conforms to the auto-negotiation protocol, defined in Clause 28 of the IEEE 802.3 Specification.

Auto-negotiation allows UTP (unshielded twisted pair) link partners to select the highest common mode of operation.

During auto-negotiation, link partners advertise capabilities across the UTP link to each other, and then compare their

own capabilities with those they received from their link partners. The highest speed and duplex setting that is common

to the two link partners is selected as the operating mode.

The following list shows the speed and duplex operation mode from highest-to-lowest:

• Priority 1: 1000BASE-T, full-duplex

• Priority 2: 1000BASE-T, half-duplex

• Priority 3: 100BASE-TX, full-duplex

• Priority 4: 100BASE-TX, half-duplex

• Priority 5: 10BASE-T, full-duplex

• Priority 6: 10BASE-T, half-duplex

If auto-negotiation is not supported or the KSZ9031RNX link partner is forced to bypass auto-negotiation for 10BASE-

T and 100BASE-TX modes, the KSZ9031RNX sets its operating mode by observing the input signal at its receiver. This

is known as parallel detection, and allows the KSZ9031RNX to establish a link by listening for a fixed signal protocol in

the absence of the auto-negotiation advertisement protocol.

The auto-negotiation link-up process is shown in Figure 3-3.

FIGURE 3-3: AUTO-NEGOTIATION FLOW CHART

For 1000BASE-T mode, auto-negotiation is required and always used to establish a link. During 1000BASE-T auto-

negotiation, the master and slave configuration is first resolved between link partners. Then the link is established with

the highest common capabilities between link partners.

Auto-negotiation is enabled by default after power-up or hardware reset. After that, auto-negotiation can be enabled or

disabled through Register 0h, Bit [12]. If auto-negotiation is disabled, the speed is set by Register 0h, Bits [6, 13] and

the duplex is set by Register 0h, Bit [8].

If the speed is changed on the fly, the link goes down and auto-negotiation and parallel detection initiate until a common

speed between KSZ9031RNX and its link partner is re-established for a link.

If the link is already established and there is no change of speed on the fly, the changes (for example, duplex and pause

capabilities) will not take effect unless either auto-negotiation is restarted through Register 0h, Bit [9], or a link-down to

link-up transition occurs (that is, disconnecting and reconnecting the cable).

START AUTO-NEGOTIATION

FORCE LINK SETTING

LISTEN FOR 10BASE-T

LINK PULSES

LISTEN FOR 100BASE-TX

IDLES

ATTEMPT AUTO-

NEGOTIATION

LINK MODE SET

BYPASS AUTO-NEGOTIATION

AND SET LINK MODE

LINK MODE SET?

PARALLEL

OPERATION

YES

JOIN FLOW

KSZ9031RNX

DS00002117F-page 18  2016-2017 Microchip Technology Inc.

After auto-negotiation is completed, the link status is updated in Register 1h, Bit [2], and the link partner capabilities are

updated in Registers 5h, 6h, 8h, and Ah.

The auto-negotiation finite state machines use interval timers to manage the auto-negotiation process. The duration of

these timers under normal operating conditions is summarized in Table 3-2.

3.8 10/100 Mbps Speeds Only

Some applications require link-up to be limited to 10/100 Mbps speeds only.

After power-up/reset, the KSZ9031RNX can be restricted to auto-negotiate and link-up to 10/100 Mbps speeds only by

programming the following register settings:

1. Set Register 0h, Bit [6] = ‘0’ to remove 1000 Mbps speed.

2. Set Register 9h, Bits [9:8] = ‘00’ to remove Auto-Negotiation advertisements for 1000 Mbps full-/half-duplex.

3. Write a ‘1’ to Register 0h, Bit [9], a self-clearing bit, to force a restart of Auto-Negotiation.

Auto-Negotiation and 10BASE-T/100BASE-TX speeds use only differential pairs A (pins 2, 3) and B (pins 5, 6). Differ-

ential pairs C (pins 7, 8) and D (pins 10, 11) can be left as no connects.

3.9 RGMII Interface

The Reduced Gigabit Media Independent Interface (RGMII) supports on-chip data-to-clock delay timing according to

the RGMII Version 2.0 Specification, with programming options for external delay timing and to adjust and correct TX

and RX timing paths.

RGMII provides a common interface between RGMII PHYs and MACs, and has the following key characteristics:

• Pin count is reduced from 24 pins for the IEEE Gigabit Media Independent Interface (GMII) to 12 pins for RGMII.

• All speeds (10 Mbps, 100 Mbps, and 1000 Mbps) are supported at both half- and full-duplex.

• Data transmission and reception are independent and belong to separate signal groups.

• Transmit data and receive data are each four bits wide, a nibble.

In RGMII operation, the RGMII pins function as follows:

• The MAC sources the transmit reference clock, TXC, at 125 MHz for 1000 Mbps, 25 MHz for 100 Mbps, and

2.5 MHz for 10 Mbps.

• The PHY recovers and sources the receive reference clock, RXC, at 125 MHz for 1000 Mbps, 25 MHz for

100 Mbps, and 2.5 MHz for 10 Mbps.

• For 1000BASE-T, the transmit data, TXD[3:0], is presented on both edges of TXC, and the received data,

RXD[3:0], is clocked out on both edges of the recovered 125 MHz clock, RXC.

• For 10BASE-T/100BASE-TX, the MAC holds TX_CTL low until both PHY and MAC operate at the same speed.

TABLE 3-2: AUTO-NEGOTIATION TIMERS

Auto-Negotiation Interval Timers Time Duration

Transmit Burst Interval 16 ms

Transmit Pulse Interval 68 µs

FLP Detect Minimum Time 17.2 µs

FLP Detect Maximum Time 185 µs

Receive Minimum Burst Interval 6.8 ms

Receive Maximum Burst Interval 112 ms

Data Detect Minimum Interval 35.4 µs

Data Detect Maximum Interval 95 µs

NLP Test Minimum Interval 4.5 ms

NLP Test Maximum Interval 30 ms

Link Loss Time 52 ms

Break Link Time 1480 ms

Parallel Detection Wait Time 830 ms

Link Enable Wait Time 1000 ms

 2016-2017 Microchip Technology Inc. DS00002117F-page 19

KSZ9031RNX

During the speed transition, the receive clock is stretched on either a positive or negative pulse to ensure that no

clock glitch is presented to the MAC.

• TX_ER and RX_ER are combined with TX_EN and RX_DV, respectively, to form TX_CTL and RX_CTL. These

two RGMII control signals are valid at the falling clock edge.

After power-up or reset, the KSZ9031RNX is configured to RGMII mode if the MODE[3:0] strap-in pins are set to one of

the RGMII mode capability options. See the Strap-In Options - KSZ9031RNX section.

The KSZ9031RNX has the option to output a 125 MHz reference clock on the CLK125_NDO pin. This clock provides a

lower-cost reference clock alternative for RGMII MACs that require a 125 MHz crystal or oscillator. The 125 MHz clock

output is enabled after power-up or reset if the CLK125_EN strap-in pin is pulled high.

3.9.1 RGMII SIGNAL DEFINITION

Table 3-3 describes the RGMII signals. Refer to the RGMII Version 2.0 Specification for more detailed information.

3.9.2 RGMII SIGNAL DIAGRAM

The KSZ9031RNX RGMII pin connections to the MAC are shown in Figure 3-4.

FIGURE 3-4: KSZ9031RNX RGMII INTERFACE

TABLE 3-3: RGMII SIGNAL DEFINITION

RGMII Signal

Name (per spec)

RGMII Signal

Name (per

KSZ9031RNX)

Pin Type (with

respect to PHY)

Pin Type (with

respect to MAC) Description

TXC GTX_CLK Input Output Transmit Reference Clock

(125MHz for 1000Mbps, 25MHz for

100Mbps, 2.5MHz for 10Mbps)

TX_CTL TX_EN Input Output Transmit Control

TXD[3:0] TXD[3:0] Input Output Transmit Data[3:0]

RXC RX_CLK Output Input Receive Reference Clock

(125 MHz for 1000 Mbps, 25 MHz

for 100 Mbps, 2.5 MHz for

10 Mbps)

RX_CTL RX_DV Output Input Receive Control

RXD[3:0] RXD[3:0] Output Input Receive Data[3:0]

KSZ9031RNX

GTX _CLK

TX _EN

TXD[3:0]

RX_CLK

RX _DV

RXD[3:0]

GMII

ETHERNET MAC

TXC

TX _CTL

TXD[3:0]

RXC

RX _CTL

RXD[3:0]

KSZ9031RNX

DS00002117F-page 20  2016-2017 Microchip Technology Inc.

3.9.3 RGMII PAD SKEW REGISTERS

Pad skew registers are available for all RGMII pins (clocks, control signals, and data bits) to provide programming

options to adjust or correct the timing relationship for each RGMII pin. Because RGMII is a source-synchronous bus

interface, the timing relationship needs to be maintained only within the RGMII pin’s respective timing group.

• RGMII transmit timing group pins: GTX_CLK, TX_EN, TXD[3:0]

• RGMII receive timing group pins: RX_CLK, RX_DV, RXD[3:0]

Table 3-4 details the four registers located at MMD Address 2h that are provided for pad skew programming.

The RGMII control signals and data bits have 4-bit skew settings, while the RGMII clocks have 5-bit skew settings.

Each register bit is approximately a 0.06 ns step change. A single-bit decrement decreases the delay by approximately

0.06 ns, while a single-bit increment increases the delay by approximately 0.06 ns.

Table 3-5 and Ta b l e 3 - 6 list the approximate absolute delay for each pad skew (value) setting.

TABLE 3-4: RGMII PAD SKEW REGISTERS

Address Name Description Mode Default

MMD Address 2h, Register 4h – RGMII Control Signal Pad Skew

2.4.15:8 Reserved Reserved RW 0000_0000

2.4.7:4 RX_DV

Pad Skew

RGMII RX_CTL output pad skew control (0.06 ns/

step)

RW 0111

2.4.3:0 TX_EN

Pad Skew

RGMII TX_CTL input pad skew control (0.06 ns/

step)

RW 0111

MMD Address 2h, Register 5h – RGMII RX Data Pad Skew

2.5.15:12 RXD3

Pad Skew

RGMII RXD3 output pad skew control (0.06 ns/

step)

RW 0111

2.5.11:8 RXD2

Pad Skew

RGMII RXD2 output pad skew control (0.06 ns/

step)

RW 0111

2.5.7:4 RXD1

Pad Skew

RGMII RXD1 output pad skew control (0.06 ns/

step)

RW 0111

2.5.3:0 RXD0

Pad Skew

RGMII RXD0 output pad skew control (0.06 ns/

step)

RW 0111

MMD Address 2h, Register 6h – RGMII TX Data Pad Skew

2.6.15:12 TXD3

Pad Skew

RGMII TXD3 input pad skew control (0.06 ns/step) RW 0111

2.6.11:8 TXD2

Pad Skew

RGMII TXD2 input pad skew control (0.06 ns/step) RW 0111

2.6.7:4 TXD1

Pad Skew

RGMII TXD1 input pad skew control (0.06 ns/step) RW 0111

2.6.3:0 TXD0

Pad Skew

RGMII TXD0 input pad skew control (0.06 ns/step) RW 0111

MMD Address 2h, Register 8h – RGMII Clock Pad Skew

2.8.15:10 Reserved Reserved RW 0000_00

2.8.9:5 GTX_CLK

Pad Skew

RGMII GTX_CLK input pad skew control (0.06 ns/

step)

RW 01_111

2.8.4:0 RX_CLK

Pad Skew

RGMII RX_CLK output pad skew control (0.06 ns/

step)

RW 0_1111

 2016-2017 Microchip Technology Inc. DS00002117F-page 21

KSZ9031RNX

TABLE 3-5: ABSOLUTE DELAY FOR 5-BIT PAD SKEW SETTING

Pad Skew Value Delay (ns)

0_0000 –0.90

0_0001 –0.84

0_0010 –0.78

0_0011 –0.72

0_0100 –0.66

0_0101 –0.60

0_0110 –0.54

0_0111 –0.48

0_1000 –0.42

0_1001 –0.36

0_1010 –0.30

0_1011 –0.24

0_1100 –0.18

0_1101 –0.12

0_1110 –0.06

0_1111 No delay adjustment (default value)

1_0000 +0.06

1_0001 +0.12

1_0010 +0.18

1_0011 +0.24

1_0100 +0.30

1_0101 +0.36

1_0110 +0.42

1_0111 +0.48

1_1000 +0.54

1_1001 +0.60

1_1010 +0.66

1_1011 +0.72

1_1100 +0.78

1_1101 +0.84

1_1110 +0.90

1_1111 +0.96

KSZ9031RNX

DS00002117F-page 22  2016-2017 Microchip Technology Inc.

When computing the RGMII timing relationships, delays along the entire data path must be aggregated to determine the

total delay to be used for comparison between RGMII pins within their respective timing group. For the transmit data

path, total delay includes MAC output delay, MAC-to-PHY PCB routing delay, and PHY (KSZ9031RNX) input delay and

skew setting (if any). For the receive data path, the total delay includes PHY (KSZ9031RNX) output delay, PHY-to-MAC

PCB routing delay, and MAC input delay and skew setting (if any).

As the default, after power-up or reset, the KSZ9031RNX RGMII timing conforms to the timing requirements in the

RGMII Version 2.0 Specification for internal PHY chip delay.

For the transmit path (MAC to KSZ9031RNX), the KSZ9031RNX does not add any delay locally at its GTX_CLK, TX_EN

and TXD[3:0] input pins, and expects the GTX_CLK delay to be provided on-chip by the MAC. If MAC does not provide

any delay or insufficient delay for the GTX_CLK, the KSZ9031RNX has pad skew registers that can provide up to

1.38 ns on-chip delay.

For the receive path (KSZ9031RNX to MAC), the KSZ9031RNX adds 1.2ns typical delay to the RX_CLK output pin with

respect to RX_DV and RXD[3:0] output pins. If necessary, the KSZ9031RNX has pad skew registers that can adjust the

RX_CLK on-chip delay up to 2.58 ns from the 1.2 ns default delay.

The above default RGMII timings imply:

• RX_CLK clock skew is set by the KSZ9031RNX default register settings.

• GTX_CLK clock skew is provided by the MAC.

• No PCB delay is required for GTX_CLK and RX_CLK clocks.

The following examples show how to read/write to MMD Address 2h, Register 8h for the RGMII GTX_CLK and RX_CLK

skew settings. MMD register access is through the direct portal Registers Dh and Eh. For more programming details,

refer to the MMD Registers section.

• Read back value of MMD Address 2h, Register 8h.

- Write Register 0xD = 0x0002 // Select MMD Device Address 2h

- Write Register 0xE = 0x0008 // Select Register 8h of MMD Device Address 2h

- Write Register 0xD = 0x4002 // Select register data for MMD Device Address 2h, Register 8h

- Read Register 0xE // Read value of MMD Device Address 2h, Register 8h

TABLE 3-6: ABSOLUTE DELAY FOR 4-BIT PAD SKEW SETTING

Pad Skew Value Delay (ns)

0000 –0.42

0001 –0.36

0010 –0.30

0011 –0.24

0100 –0.18

0101 –0.12

0110 –0.06

0111 No delay adjustment (default value)

1000 +0.06

1001 +0.12

1010 +0.18

1011 +0.24

1100 +0.30

1101 +0.36

1110 +0.42

1111 +0.48

 2016-2017 Microchip Technology Inc. DS00002117F-page 23

KSZ9031RNX

• Write value 0x03FF (delay GTX_CLK and RX_CLK pad skews to their maximum values) to MMD Address 2h,

- Write Register 0xD = 0x0002 // Select MMD Device Address 2h

- Write Register 0xE = 0x0008 // Select Register 8h of MMD Device Address 2h

- Write Register 0xD = 0x4002 // Select register data for MMD Device Address 2h, Register 8h

- Write Register 0xE = 0x03FF // Write value 0x03FF to MMD Device Address 2h, Register 8h

3.9.4 RGMII IN-BAND STATUS

The KSZ9031RNX provides in-band status to the MAC during the inter-frame gap when RX_DV is de-asserted. RGMII

in-band status is always enabled after power-up.

The in-band status is sent to the MAC using the RXD[3:0] data pins, and is described in Ta b l e 3 - 7 .

3.10 MII Management (MIIM) Interface

The KSZ9031RNX supports the IEEE 802.3 MII management interface, also known as the Management Data Input/

Output (MDIO) interface. This interface allows upper-layer devices to monitor and control the state of the KSZ9031RNX.

An external device with MIIM capability is used to read the PHY status and/or configure the PHY settings. More details

about the MIIM interface can be found in Clause 22.2.4 of the IEEE 802.3 Specification.

The MIIM interface consists of the following:

• A physical connection that incorporates the clock line (MDC) and the data line (MDIO).

• A specific protocol that operates across the physical connection mentioned earlier, which allows an external con-

troller to communicate with one or more KSZ9031RNX devices. Each KSZ9031RNX device is assigned a unique

PHY address between 0h and 7h by the PHYAD[2:0] strapping pins.

• A 32-register address space for direct access to IEEE-defined registers and vendor-specific registers, and for indi-

rect access to MMD addresses and registers. See the Register Map section.

PHY Address 0h is supported as the unique PHY address only; it is not supported as the broadcast PHY address, which

allows for a single write command to simultaneously program an identical PHY register for two or more PHY devices

(for example, using PHY Address 0h to set Register 0h to a value of 0x1940 to set Bit [11] to a value of one to enable

software power-down). Instead, separate write commands are used to program each PHY device.

Table 3-8 shows the MII management frame format for the KSZ9031RNX.

3.11 Interrupt (INT_N)

The INT_N pin is an optional interrupt signal that is used to inform the external controller that there has been a status

update in the KSZ9031RNX PHY register. Bits [15:8] of Register 1Bh are the interrupt control bits that enable and dis-

able the conditions for asserting the INT_N signal. Bits [7:0] of Register 1Bh are the interrupt status bits that indicate

which interrupt conditions have occurred. The interrupt status bits are cleared after reading Register 1Bh.

Bit [14] of Register 1Fh sets the interrupt level to active high or active low. The default is active low.

TABLE 3-7: RGMII IN-BAND STATUS

RX_DV RXD3 RXD[2:1] RXD0

(valid only when RX_DV is

low)

Duplex Status

0 = Half-duplex

1 = Full-duplex

RX_CLK clock speed

00 = 2.5 MHz (10 Mbps)

01 = 25 MHz (100 Mbps)

10 = 125 MHz (1000 Mbps)

11 = Reserved

Link Status

0 = Link down

1 = Link up

TABLE 3-8: MII MANAGEMENT FRAME FORMAT FOR THE KSZ9031RNX

Preamble Start of

Frame

Read/Write

OP Code

PHY

Address

Bits [4:0]

REG

Address

Bits [4:0]

TA Data Bits [15:0] Idle

Read 32 1’s 01 10 00AAA RRRRR Z0 DDDDDDDD_DDDDDDDD Z

Write 32 1’s 01 01 00AAA RRRRR 10 DDDDDDDD_DDDDDDDD Z

KSZ9031RNX

DS00002117F-page 24  2016-2017 Microchip Technology Inc.

The MII management bus option gives the MAC processor complete access to the KSZ9031RNX control and status

registers. Additionally, an interrupt pin eliminates the need for the processor to poll the PHY for status change.

3.12 LED Mode

The KSZ9031RNX provides two programmable LED output pins, LED2 and LED1, which are configurable to support

two LED modes. The LED mode is configured by the LED_MODE strap-in (Pin 41). It is latched at power-up/reset and

is defined as follows:

• Pull-Up: Single-LED Mode

• Pull-Down: Tri-Color Dual-LED Mode

Each LED output pin can directly drive an LED with a series resistor (typically 220 to 470).

3.12.1 SINGLE-LED MODE

In single-LED mode, the LED2 pin indicates the link status while the LED1 pin indicates the activity status, as shown in

Table 3-9.

3.12.2 TRI-COLOR DUAL-LED MODE

In tri-color dual-LED mode, the link and activity status are indicated by the LED2 pin for 1000BASE-T; by the LED1 pin

for 100BASE-TX; and by both LED2 and LED1 pins, working in conjunction, for 10BASE-T. This is summarized in

Table 3-10.

TABLE 3-9: SINGLE-LED MODE - PIN DEFINITION

LED Pin Pin State LED Definition Link/Activity

LED2 H OFF Link Off

L ON Link On (any speed)

LED1 H OFF No Activity

Toggle Blinking Activity (RX, TX)

TABLE 3-10: TRI-COLOR DUAL-LED MODE - PIN DEFINITION

LED Pin (State) LED Pin (Definition)

Link/Activity

LED2 LED1 LED2 LED1

H H OFF OFF Link Off

L H ON OFF 1000 Link/No Activity

Toggle H Blinking OFF 1000 Link/Activity (RX, TX)

H L OFF ON 100 Link/No Activity

H Toggle OFF Blinking 100 Link/Activity (RX, TX)

L L ON ON 10 Link/No Activity

Toggle Toggle Blinking Blinking 10 Link/Activity (RX, TX)

 2016-2017 Microchip Technology Inc. DS00002117F-page 25

KSZ9031RNX

3.13 Loopback Mode

The KSZ9031RNX supports the following loopback operations to verify analog and/or digital data paths.

• Local (digital) loopback

• Remote (analog) loopback

3.13.1 LOCAL (DIGITAL) LOOPBACK

This loopback mode checks the RGMII transmit and receive data paths between KSZ9031RNX and external MAC, and

is supported for all three speeds (10/100/1000 Mbps) at full-duplex.

The loopback data path is shown in Figure 3-5.

1. RGMII MAC transmits frames to KSZ9031RNX.

2. Frames are wrapped around inside KSZ9031RNX.

3. KSZ9031RNX transmits frames back to RGMII MAC.

FIGURE 3-5: LOCAL (DIGITAL) LOOPBACK

The following programming steps and register settings are used for local loopback mode.

For 1000 Mbps loopback,

1. Set Register 0h,

- Bit [14] = 1 // Enable local loopback mode

- Bits [6, 13] = 10 // Select 1000 Mbps speed

- Bit [12] = 0 // Disable auto-negotiation

- Bit [8] = 1 // Select full-duplex mode

2. Set Register 9h,

- Bit [12] = 1 // Enable master-slave manual configuration

- Bit [11] = 0 // Select slave configuration (required for loopback mode)

For 10/100 Mbps loopback,

1. Set Register 0h,

- Bit [14] = 1 // Enable local loopback mode

- Bits [6, 13] = 00 / 01 // Select 10 Mbps/100 Mbps speed

- Bit [12] = 0 // Disable auto-negotiation

- Bit [8] = 1 // Select full-duplex mode

3.13.2 REMOTE (ANALOG) LOOPBACK

This loopback mode checks the line (differential pairs, transformer, RJ-45 connector, Ethernet cable) transmit and

receive data paths between KSZ9031RNX and its link partner, and is supported for 1000BASE-T full-duplex mode only.

The loopback data path is shown in Figure 3-6.

1. The Gigabit PHY link partner transmits frames to KSZ9031RNX.

2. Frames are wrapped around inside KSZ9031RNX.

3. KSZ9031RNX transmits frames back to the Gigabit PHY link partner.

PCS

(DIGITAL)

AFE

(ANALOG)

KSZ9031RNX

RGMII RGMII

MAC

KSZ9031RNX

DS00002117F-page 26  2016-2017 Microchip Technology Inc.

FIGURE 3-6: REMOTE (ANALOG) LOOPBACK

The following programming steps and register settings are used for remote loopback mode.

1. Set Register 0h,

- Bits [6, 13] = 10 // Select 1000 Mbps speed

- Bit [12] = 0 // Disable auto-negotiation

- Bit [8] = 1 // Select full-duplex mode

Or just auto-negotiate and link up at 1000BASE-T full-duplex mode with the link partner.

2. Set Register 11h,

- Bit [8] = 1 // Enable remote loopback mode

3.14 LinkMD® Cable Diagnostic

The LinkMD function uses Time Domain Reflectometry (TDR) to analyze the cabling plant for common cabling prob-

lems, such as open circuits, short circuits, and impedance mismatches.

LinkMD operates by sending a pulse of known amplitude and duration down the selected differential pair, then analyzing

the polarity and shape of the reflected signal to determine the type of fault: open circuit for a positive/non-inverted ampli-

tude reflection and short circuit for a negative/inverted amplitude reflection. The time duration for the reflected signal to

return provides the approximate distance to the cabling fault. The LinkMD function processes this TDR information and

presents it as a numerical value that can be translated to a cable distance.

LinkMD is initiated by accessing Register 12h, the LinkMD Cable Diagnostic register, in conjunction with Register 1Ch,

the Auto MDI/MDI-X register. The latter register is needed to disable the Auto MDI/MDI-X function before running the

LinkMD test. Additionally, a software reset (Reg. 0h, Bit [15] = 1) should be performed before and after running the

LinkMD test. The reset helps to ensure the KSZ9031RNX is in the normal operating state before and after the test.

3.15 NAND Tree Support

The KSZ9031RNX provides parametric NAND tree support for fault detection between chip I/Os and board. NAND tree

mode is enabled at power-up/reset with the MODE[3:0] strap-in pins set to ‘0100’. Ta b le 3 - 11 lists the NAND tree pin

order.

TABLE 3-11: NAND TREE TEST PIN ORDER FOR KSZ9031RNX

Pin Description

LED2 Input

LED1/PME_N1 Input

TXD0 Input

TXD1 Input

TXD2 Input

TXD3 Input

RJ-45

CAT-5

(UTP)

KSZ9031RNX

1000BASE-T

LINK PARTNER

AFE

(ANALOG)

PCS

(DIGITAL)

RGMII

 2016-2017 Microchip Technology Inc. DS00002117F-page 27

KSZ9031RNX

3.16 Power Management

The KSZ9031RNX incorporates a number of power-management modes and features that provide methods to consume

less energy. These are discussed in the following sections.

3.16.1 ENERGY-DETECT POWER-DOWN MODE

Energy-detect power-down (EDPD) mode is used to further reduce the transceiver power consumption when the cable

is unplugged. It is enabled by writing a one to MMD Address 1Ch, Register 23h, Bit [0], and is in effect when auto-nego-

tiation mode is enabled and the cable is disconnected (no link).

In EDPD Mode, the KSZ9031RNX shuts down all transceiver blocks, except for the transmitter and energy detect cir-

cuits. Power can be reduced further by extending the time interval between the transmissions of link pulses to check for

the presence of a link partner. The periodic transmission of link pulses is needed to ensure the KSZ9031RNX and its

link partner, when operating in the same low-power state and with Auto MDI/MDI-X disabled, can wake up when the

cable is connected between them. By default, EDPD mode is disabled after power-up.

3.16.2 SOFTWARE POWER-DOWN MODE

This mode is used to power down the KSZ9031RNX device when it is not in use after power-up. Software power-down

(SPD) mode is enabled by writing a one to Register 0h, Bit [11]. In the SPD state, the KSZ9031RNX disables all internal

functions, except for the MII management interface. The KSZ9031RNX exits the SPD state after a zero is written to Reg-

ister 0h, Bit [11].

3.16.3 CHIP POWER-DOWN MODE

This mode provides the lowest power state for the KSZ9031RNX device when it is mounted on the board but not in use.

Chip power-down (CPD) mode is enabled after power-up/reset with the MODE[3:0] strap-in pins set to ‘0111’. The

KSZ9031RNX exits CPD mode after a hardware reset is applied to the RESET_N pin (Pin 42) with the MODE[3:0] strap-

in pins set to an operating mode other than CPD.

3.17 Wake-On-LAN

Wake-On-LAN (WOL) is normally a MAC-based function to wake up a host system (for example, an Ethernet end

device, such as a PC) that is in standby power mode. Wake-up is triggered by receiving and detecting a special packet

(commonly referred to as the “magic packet”) that is sent by the remote link partner. The KSZ9031RNX can perform the

same WOL function if the MAC address of its associated MAC device is entered into the KSZ9031RNX PHY registers

for magic-packet detection. When the KSZ9031RNX detects the magic packet, it wakes up the host by driving its power

management event (PME) output pin low.

By default, the WOL function is disabled. It is enabled by setting the enabling bit and configuring the associated registers

for the selected PME wake-up detection method.

The KSZ9031RNX provides three methods to trigger a PME wake-up:

• Magic-packet detection

• Customized-packet detection

• Link status change detection

GTX_CLK Input

TX_EN Input

RX_DV Input

RX_CLK Input

INT_/PME_N2 Input

MDC Input

MDIO Input

CLK125_NDO Output

TABLE 3-11: NAND TREE TEST PIN ORDER FOR KSZ9031RNX (CONTINUED)

Pin Description

KSZ9031RNX

DS00002117F-page 28  2016-2017 Microchip Technology Inc.

3.17.1 MAGIC-PACKET DETECTION

The magic packet’s frame format starts with 6 bytes of 0xFFh and is followed by 16 repetitions of the MAC address of

its associated MAC device (local MAC device).

When the magic packet is detected from its link partner, the KSZ9031RNX asserts its PME output pin low.

The following MMD Address 2h registers are provided for magic-packet detection:

• Magic-packet detection is enabled by writing a ‘1’ to MMD Address 2h, Register 10h, Bit [6]

• The MAC address (for the local MAC device) is written to and stored in MMD Address 2h, Registers 11h – 13h

The KSZ9031RNX does not generate the magic packet. The magic packet must be provided by the external system.

3.17.2 CUSTOMIZED-PACKET DETECTION

The customized packet has associated register/bit masks to select which byte, or bytes, of the first 64 bytes of the packet

to use in the CRC calculation. After the KSZ9031RNX receives the packet from its link partner, the selected bytes for

the received packet are used to calculate the CRC. The calculated CRC is compared to the expected CRC value that

was previously written to and stored in the KSZ9031RNX PHY registers. If there is a match, the KSZ9031RNX asserts

its PME output pin low.

Four customized packets are provided to support four types of wake-up scenarios. A dedicated set of registers is used

to configure and enable each customized packet.

The following MMD registers are provided for customized-packet detection:

• Each of the four customized packets is enabled via MMD Address 2h, Register 10h,

- Bit [2] // For customized packets, type 0

- Bit [3] // For customized packets, type 1

- Bit [4] // For customized packets, type 2

- Bit [5] // For customized packets, type 3

• 32-bit expected CRCs are written to and stored in:

- MMD Address 2h, Registers 14h – 15h // For customized packets, type 0

- MMD Address 2h, Registers 16h – 17h // For customized packets, type 1

- MMD Address 2h, Registers 18h – 19h // For customized packets, type 2

- MMD Address 2h, Registers 1Ah – 1Bh // For customized packets, type 3

• Masks to indicate which of the first 64-bytes to use in the CRC calculation are set in:

- MMD Address 2h, Registers 1Ch – 1Fh // For customized packets, type 0

- MMD Address 2h, Registers 20h – 23h // For customized packets, type 1

- MMD Address 2h, Registers 24h – 27h // For customized packets, type 2

- MMD Address 2h, Registers 28h – 2Bh // For customized packets, type 3

 2016-2017 Microchip Technology Inc. DS00002117F-page 29

KSZ9031RNX

3.17.3 LINK STATUS CHANGE DETECTION

If link status change detection is enabled, the KSZ9031RNX asserts its PME output pin low whenever there is a link

status change using the following MMD Address 2h registers bits and their enabled (1) or disabled (0) settings:

• MMD Address 2h, Register 10h, Bit [0] // For link-up detection

• MMD Address 2h, Register 10h, Bit [1] // For link-down detection

The PME output signal is available on either LED1/PME_N1 (Pin 17) or INT_N/PME_N2 (Pin 38), and is selected and

enabled using MMD Address 2h, Register 2h, Bits [8] and [10], respectively. Additionally, MMD Address 2h, Register

10h, Bits [15:14] defines the output functions for Pins 17 and 38.

The PME output is active low and requires a 1 k pull-up to the VDDIO supply. When asserted, the PME output is

cleared by disabling the register bit that enabled the PME trigger source (magic packet, customized packet, link status

change).

3.18 Typical Current/Power Consumption

Table 3-12, Table 3-13 , Table 3-14, and Tab l e 3 - 1 5 show the typical current consumption by the core (DVDDL, AVDDL,

AVDDL_PLL), transceiver (AVDDH), and digital I/O (DVDDH) supply pins, and the total typical power for the entire

KSZ9031RNX device for various nominal operating voltage combinations.

TABLE 3-12: TYPICAL CURRENT/POWER CONSUMPTION

TRANSCEIVER (3.3V), DIGITAL I/O (3.3V)

Condition

1.2V Core

(DVDDL, AVDDL,

AVDDL_PLL)

3.3V Transceiver

(AVDDH)

3.3V Digital I/O

(DVDDH)

Total

Chip Power

1000BASE-T Link-Up (no traffic) 210 mA 67.4 mA 19.5 mA 538 mW

1000BASE-T Full-Duplex at

100% Utilization

221 mA 66.3 mA 41.5 mA 621 mW

100BASE-TX Link-Up (no traffic) 63.6 mA 28.7 mA 13.9 mA 217 mW

100BASE-TX Full-Duplex at

100% Utilization

63.8 mA 28.6 mA 17.2 mA 228 mW

10BASE-T Link-Up (no traffic) 7.1 mA 15.9 mA 11.5 mA 99 mW

10BASE-T Full-Duplex at

100% Utilization

7.7 mA 28.6 mA 13.7 mA 149 mW

Software Power-Down Mode

(Reg. 0h.11 = 1)

1.0 mA 4.2 mA 9.3 mA 46 mW

TABLE 3-13: TYPICAL CURRENT/POWER CONSUMPTION

TRANSCEIVER (3.3V), DIGITAL I/O (1.8V)

Condition

1.2V Core

(DVDDL, AVDDL,

AVDDL_PLL)

3.3V Transceiver

(AVDDH)

1.8V Digital I/O

(DVDDH)

Total

Chip Power

1000BASE-T Link-Up (no traffic) 210 mA 67.4 mA 11.2 mA 494 mW

1000BASE-T Full-Duplex at

100% Utilization

221 mA 66.3 mA 23.6 mA 526 mW

100BASE-TX Link-Up (no traffic) 63.6 mA 28.7 mA 8.4 mA 186 mW

100BASE-TX Full-Duplex at

100% Utilization

63.8 mA 28.6 mA 9.8 mA 189 mW

10BASE-T Link-Up (no traffic) 7.1 mA 15.9 mA 3.6 mA 67 mW

10BASE-T Full-Duplex at

100% Utilization

7.7 mA 28.6 mA 5.6 mA 114 mW

Software Power-Down Mode

(Reg. 0h.11 = 1)

1.0 mA 4.2 mA 5.5 mA 25 mW

KSZ9031RNX

DS00002117F-page 30  2016-2017 Microchip Technology Inc.

Note 3-1 2.5V AVDDH is recommended for commercial temperature range (0°C to +70°C) operation only.

Note 3-2 2.5V AVDDH is recommended for commercial temperature range (0°C to +70°C) operation only.

TABLE 3-14: TYPICAL CURRENT/POWER CONSUMPTION

TRANSCEIVER (2.5V; Note 3-1), DIGITAL I/O (2.5V)

Condition

1.2V Core

(DVDDL, AVDDL,

AVDDL_PLL)

2.5V Transceiver

(AVDDH)

2.5V Digital I/O

(DVDDH)

Total

Chip Power

1000BASE-T Link-Up (no traffic) 210 mA 58.8 mA 14.7 mA 435 mW

1000BASE-T Full-Duplex at

100% Utilization

221 mA 57.9 mA 31.5 mA 488 mW

100BASE-TX Link-Up (no traffic) 63.6 mA 24.9 mA 10.5 mA 165 mW

100BASE-TX Full-Duplex at

100% Utilization

63.8 mA 24.9 mA 13.0 mA 171 mW

10BASE-T Link-Up (no traffic) 7.1 mA 11.5 mA 6.3 mA 53 mW

10BASE-T Full-Duplex at

100% Utilization

7.7 mA 25.3 mA 9.0 mA 95 mW

Software Power-Down Mode

(Reg. 0h.11 = 1)

1.0 mA 3.1 mA 6.7 mA 26 mW

TABLE 3-15: TYPICAL CURRENT/POWER CONSUMPTION

TRANSCEIVER (2.5V; Note 3-2), DIGITAL I/O (1.8V)

Condition

1.2V Core

(DVDDL, AVDDL,

AVDDL_PLL)

2.5V Transceiver

(AVDDH)

1.8V Digital I/O

(DVDDH)

Total

Chip Power

1000BASE-T Link-Up (no traffic) 210 mA 58.8 mA 11.2 mA 419 mW

1000BASE-T Full-Duplex at

100% Utilization

221 mA 57.9 mA 23.6 mA 452 mW

100BASE-TX Link-Up (no traffic) 63.6 mA 24.9 mA 8.4 mA 154 mW

100BASE-TX Full-Duplex at

100% Utilization

63.8 mA 24.9 mA 9.8 mA 156 mW

10BASE-T Link-Up (no traffic) 7.1 mA 11.5 mA 3.6 mA 44 mW

10BASE-T Full-Duplex at

100% Utilization

7.7 mA 25.3 mA 5.6 mA 83 mW

Software Power-Down Mode

(Reg. 0h.11 = 1)

1.0 mA 3.1 mA 5.5 mA 19 mW

 2016-2017 Microchip Technology Inc. DS00002117F-page 31

KSZ9031RNX

4.0 REGISTER DESCRIPTIONS

This chapter describes the various control and status registers (CSRs).

4.1 Register Map

The register space within the KSZ9031RNX consists of two distinct areas.

• Standard registers // Direct register access

• MDIO Manageable device (MMD) registers // Indirect register access

The KSZ9031RNX supports the following standard registers.

The KSZ9031RNX supports the following MMD device addresses and their associated register addresses, which make

up the indirect MMD registers. These can be seen in Ta b l e 4 - 2 .

TABLE 4-1: STANDARD REGISTERS SUPPORTED BY KSZ9031RNX

IEEE-Defined Registers

0h Basic Control

1h Basic Status

2h PHY Identifier 1

3h PHY Identifier 2

4h Auto-Negotiation Advertisement

5h Auto-Negotiation Link Partner Ability

6h Auto-Negotiation Expansion

7h Auto-Negotiation Next Page

8h Auto-Negotiation Link Partner Next Page Ability

9h 1000BASE-T Control

Ah 1000BASE-T Status

Bh - Ch Reserved

Dh MMD Access – Control

Eh MMD Access – Register/Data

Fh Extended Status

Vendor-Specific Registers

10h Reserved

11h Remote Loopback

12h LinkMD Cable Diagnostic

13h Digital PMA/PCS Status

14h Reserved

15h RXER Counter

16h - 1Ah Reserved

1Bh Interrupt Control/Status

1Ch Auto MDI/MDI-X

1Dh - 1Eh Reserved

1Fh PHY Control

KSZ9031RNX

DS00002117F-page 32  2016-2017 Microchip Technology Inc.

TABLE 4-2: MMD REGISTERS SUPPORTED BY KSZ9031RNX

Device Address (hex) Register Address (hex) Description

0h 3h AN FLP Burst Transmit – LO

4h AN FLP Burst Transmit – HI

1h 5Ah 1000BASE-T Link-Up Time Control

0h Common Control

1h Strap Status

2h Operation Mode Strap Override

3h Operation Mode Strap Status

4h RGMII Control Signal Pad Skew

5h RGMII RX Data Pad Skew

6h RGMII TX Data Pad Skew

8h GMII Clock Pad Skew

10h Wake-On-LAN – Control

11h Wake-On-LAN – Magic Packet, MAC-DA-0

12h Wake-On-LAN – Magic Packet, MAC-DA-1

13h Wake-On-LAN – Magic Packet, MAC-DA-2

14h Wake-On-LAN – Customized Packet, Type 0, Expected

CRC 0

15h Wake-On-LAN – Customized Packet, Type 0, Expected

CRC 1

16h Wake-On-LAN – Customized Packet, Type 1, Expected

CRC 0

17h Wake-On-LAN – Customized Packet, Type 1, Expected

CRC 1

18h Wake-On-LAN – Customized Packet, Type 2, Expected

CRC 0

19h Wake-On-LAN – Customized Packet, Type 2, Expected

CRC 1

1Ah Wake-On-LAN – Customized Packet, Type 3, Expected

CRC 0

1Bh Wake-On-LAN – Customized Packet, Type 3, Expected

CRC 1

1Ch Wake-On-LAN – Customized Packet, Type 0, Mask 0

1Dh Wake-On-LAN – Customized Packet, Type 0, Mask 1

1Eh Wake-On-LAN – Customized Packet, Type 0, Mask 2

1Fh Wake-On-LAN – Customized Packet, Type 0, Mask 3

20h Wake-On-LAN – Customized Packet, Type 1, Mask 0

21h Wake-On-LAN – Customized Packet, Type 1, Mask 1

22h Wake-On-LAN – Customized Packet, Type 1, Mask 2

23h Wake-On-LAN – Customized Packet, Type 1, Mask 3

 2016-2017 Microchip Technology Inc. DS00002117F-page 33

KSZ9031RNX

4.2 Standard Registers

Standard registers provide direct read/write access to a 32-register address space, as defined in Clause 22 of the IEEE

802.3 Specification. Within this address space, the first 16 registers (Registers 0h to Fh) are defined according to the

IEEE specification, while the remaining 16 registers (Registers 10h to 1Fh) are defined specific to the PHY vendor.

24h Wake-On-LAN – Customized Packet, Type 2, Mask 0

25h Wake-On-LAN – Customized Packet, Type 2, Mask 1

26h Wake-On-LAN – Customized Packet, Type 2, Mask 2

27h Wake-On-LAN – Customized Packet, Type 2, Mask 3

28h Wake-On-LAN – Customized Packet, Type 3, Mask 0

29h Wake-On-LAN – Customized Packet, Type 3, Mask 1

2Ah Wake-On-LAN – Customized Packet, Type 3, Mask 2

2Bh Wake-On-LAN – Customized Packet, Type 3, Mask 3

1Ch 4h Analog Control 4

23h EDPD Control

TABLE 4-3: IEEE-DEFINED REGISTER DESCRIPTIONS

Address Name Description Mode

Note 4-1 Default

0.15 Reset 1 = Software PHY reset

0 = Normal operation

This bit is self-cleared after a ‘1’ is written to it.

RW/SC 0

0.14 Loopback 1 = Loopback mode

0 = Normal operation

RW 0

0.13 Speed Select

(LSB)

[0.6, 0.13]

[1,1] = Reserved

[1,0] = 1000 Mbps

[0,1] = 100 Mbps

[0,0] = 10 Mbps

This bit is ignored if auto-negotiation is enabled

(Reg. 0.12 = 1).

RW 0

0.12 Auto-Negoti-

ation Enable

1 = Enable auto-negotiation process

0 = Disable auto-negotiation process

If enabled, auto-negotiation result overrides set-

tings in Reg. 0.13, 0.8 and 0.6.

If disabled, Auto MDI-X is also automatically dis-

abled. Use Register 1Ch to set MDI/MDI-X.

RW 1

0.11 Power-Down 1 = Power-down mode

0 = Normal operation

When this bit is set to ‘1’, the link-down status

might not get updated in the PHY register. Software

should note link is down and should not rely on the

PHY register link status.

After this bit is changed from ‘1’ to ‘0’, an internal

global reset is automatically generated. Wait a min-

imum of 1 ms before read/write access to the PHY

registers.

RW 0

TABLE 4-2: MMD REGISTERS SUPPORTED BY KSZ9031RNX (CONTINUED)

Device Address (hex) Register Address (hex) Description

KSZ9031RNX

DS00002117F-page 34  2016-2017 Microchip Technology Inc.

0.10 Isolate 1 = Electrical isolation of PHY from RGMII

0 = Normal operation

RW 0

0.9 Restart Auto-

Negotiation

1 = Restart auto-negotiation process

0 = Normal operation

This bit is self-cleared after a ‘1’ is written to it.

RW/SC 0

0.8 Duplex Mode 1 = Full-duplex

0 = Half-duplex

RW 1

0.7 Reserved Reserved RW 0

0.6 Speed Select

(MSB)

[0.6, 0.13]

[1,1] = Reserved

[1,0] = 1000 Mbps

[0,1] = 100 Mbps

[0,0] = 10 Mbps

This bit is ignored if auto-negotiation is enabled

(Reg. 0.12 = 1).

RW Set by MODE[3:0]

strapping pins.

See the Strap-In

Options -

KSZ9031RNX

section for details.

0.5:0 Reserved Reserved RO 00_0000

1.15 100BASE-T4 1 = T4 capable

0 = Not T4 capable

RO 0

1.14 100BASE-TX

Full-Duplex

1 = Capable of 100 Mbps full-duplex

0 = Not capable of 100 Mbps full-duplex

RO 1

1.13 100BASE-TX

Half-Duplex

1 = Capable of 100 Mbps half-duplex

0 = Not capable of 100 Mbps half-duplex

RO 1

1.12 10BASE-T

Full-Duplex

1 = Capable of 10 Mbps full-duplex

0 = Not capable of 10 Mbps full-duplex

RO 1

1.11 10BASE-T

Half-Duplex

1 = Capable of 10 Mbps half-duplex

0 = Not capable of 10 Mbps half-duplex

RO 1

1.10:9 Reserved Reserved RO 00

1.8 Extended

Status

1 = Extended status info in Reg. 15h.

0 = No extended status info in Reg. 15h.

RO 1

1.7 Reserved Reserved RO 0

1.6 No Preamble 1 = Preamble suppression

0 = Normal preamble

RO 1

1.5 Auto-Negoti-

ation Com-

plete

1 = Auto-negotiation process completed

0 = Auto-negotiation process not completed

RO 0

1.4 Remote Fault 1 = Remote fault

0 = No remote fault

RO/LH 0

1.3 Auto-Negoti-

ation Ability

1 = Can perform auto-negotiation

0 = Cannot perform auto-negotiation

RO 1

1.2 Link Status 1 = Link is up

0 = Link is down

RO/LL 0

1.1 Jabber

Detect

1 = Jabber detected

0 = Jabber not detected (default is low)

RO/LH 0

1.0 Extended

Capability

1 = Supports extended capability registers RO 1

TABLE 4-3: IEEE-DEFINED REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

 2016-2017 Microchip Technology Inc. DS00002117F-page 35

KSZ9031RNX

2.15:0 PHY ID

Number

Assigned to Bits [3:18] of the organizationally

unique identifier (OUI). KENDIN Communication’s

OUI is 0010A1h.

RO 0022h

3.15:10 PHY ID

Number

Assigned to Bits [19:24] of the organizationally

unique identifier (OUI). KENDIN Communication’s

OUI is 0010A1h.

RO 0001_01

3.9:4 Model

Number

Six-bit manufacturer’s model number RO 10_0010

3.3:0 Revision

Number

Four-bit manufacturer’s revision number RO Indicates silicon

revision

4.15 Next Page 1 = Next page capable

0 = No next page capability

RW 0

4.14 Reserved Reserved RO 0

4.13 Remote Fault 1 = Remote fault supported

0 = No remote fault

RW 0

4.12 Reserved Reserved RO 0

4.11:10 Pause [4.11, 4.10]

[0,0] = No pause

[1,0] = Asymmetric pause (link partner)

[0,1] = Symmetric pause

[1,1] = Symmetric and asymmetric pause (local

device)

RW 00

4.9 100BASE-T4 1 = T4 capable

0 = No T4 capability

RO 0

4.8 100BASE-TX

Full-Duplex

1 = 100 Mbps full-duplex capable

0 = No 100 Mbps full-duplex capability

RW 1

4.7 100BASE-TX

Half-Duplex

1 = 100 Mbps half-duplex capable

0 = No 100 Mbps half-duplex capability

RW 1

4.6 10BASE-T

Full-Duplex

1 = 10 Mbps full-duplex capable

0 = No 10 Mbps full-duplex capability

RW 1

4.5 10BASE-T

Half-Duplex

1 = 10 Mbps half-duplex capable

0 = No 10 Mbps half-duplex capability

RW 1

4.4:0 Selector

Field

[00001] = IEEE 802.3 RW 0_0001

5.15 Next Page 1 = Next page capable

0 = No next page capability

RO 0

5.14 Acknowledge 1 = Link code word received from partner

0 = Link code word not yet received

RO 0

5.13 Remote Fault 1 = Remote fault detected

0 = No remote fault

RO 0

5.12 Reserved Reserved RO 0

TABLE 4-3: IEEE-DEFINED REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

KSZ9031RNX

DS00002117F-page 36  2016-2017 Microchip Technology Inc.

5.11:10 Pause [5.11, 5.10]

[0,0] = No pause

[1,0] = Asymmetric Pause (link partner)

[0,1] = Symmetric pause

[1,1] = Symmetric and asymmetric pause (local

device)

RW 00

5.9 100BASE-T4 1 = T4 capable

0 = No T4 capability

RO 0

5.8 100BASE-TX

Full-Duplex

1 = 100 Mbps full-duplex capable

0 = No 100 Mbps full-duplex capability

RO 0

5.7 100BASE-TX

Half-Duplex

1 = 100 Mbps half-duplex capable

0 = No 100 Mbps half-duplex capability

RO 0

5.6 10BASE-T

Full-Duplex

1 = 10 Mbps full-duplex capable

0 = No 10 Mbps full-duplex capability

RO 0

5.5 10BASE-T

Half-Duplex

1 = 10 Mbps half-duplex capable

0 = No 10 Mbps half-duplex capability

RO 0

5.4:0 Selector

Field

[00001] = IEEE 802.3 RO 0_0000

6.15:5 Reserved Reserved RO 0000_0000_000

6.4 Parallel

Detection

Fault

1 = Fault detected by parallel detection

0 = No fault detected by parallel detection

RO/LH 0

6.3 Link Partner

Able

1 = Link partner has next page capability

0 = Link partner does not have next page capability

RO 0

6.2 Next Page

Able

1 = Local device has next page capability

0 = Local device does not have next page capabil-

ity

RO 1

6.1 Page

Received

1 = New page received

0 = New page not received

RO/LH 0

6.0 Link Partner

Auto-Negoti-

ation Able

1 = Link partner has auto-negotiation capability

0 = Link partner does not have auto-negotiation

capability

RO 0

7.15 Next Page 1 = Additional next pages will follow

0 = Last page

RW 0

7.14 Reserved Reserved RO 0

7.13 Message

Page

1 = Message page

0 = Unformatted page

RW 1

7.12 Acknowl-

edge2

1 = Will comply with message

0 = Cannot comply with message

RW 0

7.11 Toggle 1 = Previous value of the transmitted link code

word equaled logic one

0 = Logic zero

RO 0

7.10:0 Message

Field

11-bit wide field to encode 2048 messages RW 000_0000_0001

TABLE 4-3: IEEE-DEFINED REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

 2016-2017 Microchip Technology Inc. DS00002117F-page 37

KSZ9031RNX

8.15 Next Page 1 = Additional next pages will follow

0 = Last page

RO 0

8.14 Acknowledge 1 = Successful receipt of link word

0 = No successful receipt of link word

RO 0

8.13 Message

Page

1 = Message page

0 = Unformatted page

RO 0

8.12 Acknowl-

edge2

1 = Able to act on the information

0 = Not able to act on the information

RO 0

8.11 Toggle 1 = Previous value of transmitted link code word

equal to logic zero

0 = Previous value of transmitted link code word

equal to logic one

RO 0

8.10:0 Message

Field

— RO 000_0000_0000

9.15:13 Test Mode

Bits

Transmitter test mode operations

[9.15:13] Mode

[000] Normal operation

[001] Test mode 1 –Transmit waveform test

[010] Test mode 2 –Transmit jitter test in master

mode

[011] Test mode 3 –Transmit jitter test in slave

mode

[100] Test mode 4 –Transmitter distortion test

[101] Reserved, operations not identified

[110] Reserved, operations not identified

[111] Reserved, operations not identified

To enable 1000BASE-T Test Mode:

1) Set Register 0h = 0x0140 to disable auto-negoti-

ation and select 1000 Mbps speed.

2) Set Register 9h, bits [15:13] = 001, 010, 011, or

100 to select one of the 1000BASE-T Test Modes.

After the above settings, the test waveform for the

selected test mode is transmitted onto each of the

4 differential pairs. No link partner is needed.

RW 000

9.12 Master-Slave

Manual Con-

figuration

Enable

1 = Enable master-slave manual configuration

value

0 = Disable master-slave manual configuration

value

RW 0

9.11 Master-Slave

Manual Con-

figuration

Value

1 = Configure PHY as master during master-slave

negotiation

0 = Configure PHY as slave during master-slave

negotiation

This bit is ignored if master-slave manual configu-

ration is disabled (Reg. 9.12 = 0).

RW 0

9.10 Port Type 1 = Indicate the preference to operate as multi-port

device (master)

0 = Indicate the preference to operate as single-

port device (slave)

This bit is valid only if master-slave manual config-

uration is disabled (Reg. 9.12 = 0).

RW 0

TABLE 4-3: IEEE-DEFINED REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

KSZ9031RNX

DS00002117F-page 38  2016-2017 Microchip Technology Inc.

9.9 1000BASE-T

Full-Duplex

1 = Advertise PHY is 1000BASE-T full-duplex

capable

0 = Advertise PHY is not 1000BASE-T full-duplex

capable

RW 1

9.8 1000BASE-T

Half-Duplex

1 = Advertise PHY is 1000BASE-T half-duplex

capable

0 = Advertise PHY is not 1000BASE-T half-duplex

capable

RW Set by MODE[3:0]

strapping pins.

See the Strap-In

Options -

KSZ9031RNX

section for details.

9.7:0 Reserved Write as 0, ignore on read RO —

A.15 Master-Slave

Configura-

tion Fault

1 = Master-slave configuration fault detected

0 = No master-slave configuration fault detected

RO/LH/SC 0

A.14 Master-Slave

Configura-

tion Resolu-

tion

1 = Local PHY configuration resolved to master

0 = Local PHY configuration resolved to slave

RO 0

A.13 Local

Receiver

Status

1 = Local receiver OK (loc_rcvr_status = 1)

0 = Local receiver not OK (loc_rcvr_status = 0)

RO 0

A.12 Remote

Receiver

Status

1 = Remote receiver OK (rem_rcvr_status = 1)

0 = Remote receiver not OK (rem_rcvr_status = 0)

RO 0

A.11 Link Partner

1000BASE-T

Full-Duplex

Capability

1 = Link partner is capable of 1000BASE-T full-

duplex

0 = Link partner is not capable of 1000BASE-T

full-duplex

RO 0

A.10 Link Partner

1000BASE-T

Half-Duplex

Capability

1 = Link partner is capable of 1000BASE-T half-

duplex

0 = Link Partner is not capable of 1000BASE-T

half-duplex

RO 0

A.9:8 Reserved Reserved RO 00

A.7:0 Idle Error

Count

Cumulative count of errors detected when receiver

is receiving idles and PMA_TXMODE.indicate =

SEND_N.

The counter is incremented every symbol period

that rxerror_status = ERROR.

RO/SC 0000_0000

D.15:14 MMD –

Operation

Mode

For the selected MMD device address (Bits [4:0] of

this register), these two bits select one of the fol-

lowing register or data operations and the usage

for MMD Access – Register/Data (Reg. Eh).

00 = Register

01 = Data, no post increment

10 = Data, post increment on reads and writes

11 = Data, post increment on writes only

RW 00

D.13:5 Reserved Reserved RW 00_0000_000

TABLE 4-3: IEEE-DEFINED REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

 2016-2017 Microchip Technology Inc. DS00002117F-page 39

KSZ9031RNX

Note 4-1 RW = Read/Write; RO = Read Only; SC = Self-Cleared; LH = Latch High; LL = Latch Low.

D.4:0 MMD –

Device

Address

These five bits set the MMD device address. RW 0_0000

E.15:0 MMD –

Data

For the selected MMD device address (Reg. Dh,

Bits [4:0]),

When Reg. Dh, Bits [15:14] = 00, this register

contains the read/write register address for the

MMD device address.

Otherwise, this register contains the read/write

data value for the MMD device address and its

selected register address.

See also Reg. Dh, Bits [15:14], for descriptions of

post increment reads and writes of this register for

data operation.

RW 0000_0000_0000_00

F.15 1000BASE-X

Full-Duplex

1 = PHY can perform 1000BASE-X full-duplex

0 = PHY cannot perform 1000BASE-X full-duplex

RO 0

F.14 1000BASE-X

Half-Duplex

1 = PHY can perform 1000BASE-X half-duplex

0 = PHY cannot perform 1000BASE-X half-duplex

RO 0

F.13 1000BASE-T

Full-Duplex

1 = PHY can perform 1000BASE-T full-duplex

0 = PHY cannot perform 1000BASE-T full-duplex

RO 1

F.12 1000BASE-T

Half-Duplex

1 = PHY can perform 1000BASE-T half-duplex

0 = PHY cannot perform 1000BASE-T half-duplex

RO 1

F.11:0 Reserved Ignore when read RO —

TABLE 4-4: VENDOR-SPECIFIC REGISTER DESCRIPTIONS

Address Name Description Mode

Note 4-1 Default

11.15:9 Reserved Reserved RW 0000_000

11.8 Remote

Loopback

1 = Enable remote loopback

0 = Disable remote loopback

RW 0

11.7:1 Reserved Reserved RW 1111_010

11.0 Reserved Reserved RO 0

12.15 Cable

Diagnostic

Test Enable

Write value:

1 = Enable cable diagnostic test. After test has

completed, this bit is self-cleared.

0 = Disable cable diagnostic test.

Read value:

1 = Cable diagnostic test is in progress.

0 = Indicates cable diagnostic test (if enabled) has

completed and the status information is valid for

read.

RW/SC 0

12.14 Reserved This bit should always be set to ‘0’. RW 0

TABLE 4-3: IEEE-DEFINED REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

KSZ9031RNX

DS00002117F-page 40  2016-2017 Microchip Technology Inc.

12.13:12 Cable

Diagnostic

Test Pair

These two bits select the differential pair for testing:

00 = Differential pair A (Pins 2, 3)

01 = Differential pair B (Pins 5, 6)

10 = Differential pair C (Pins 7, 8)

11 = Differential pair D (Pins 10, 11)

RW 00

12.11:10 Reserved These two bits should always be set to ‘00’. RW 00

12.9:8 Cable

Diagnostic

Status

These two bits represent the test result for the

selected differential pair in Bits [13:12] of this regis-

ter.

00 = Normal cable condition (no fault detected)

01 = Open cable fault detected

10 = Short cable fault detected

11 = Reserved

RO 00

12.7:0 Cable

Diagnostic

Fault Data

For the open or short cable fault detected in Bits

[9:8] of this register, this 8-bit value represents the

distance to the cable fault.

RO 0000_0000

13.15:3 Reserved Reserved RO/LH 0000_0000_0000_0

13.2 1000BASE-T

Link Status

1000BASE-T link status

1 = Link status is OK

0 = Link status is not OK

RO 0

13.1 100BASE-TX

Link Status

100BASE-TX link status

1 = Link status is OK

0 = Link status is not OK

RO 0

13.0 Reserved Reserved RO 0

15.15:0 RXER

Counter

Receive error counter for symbol error frames RO/RC 0000_0000_0000_00

1B.15 Jabber Inter-

rupt Enable

1 = Enable jabber interrupt

0 = Disable jabber interrupt

RW 0

1B.14 Receive

Error Inter-

rupt Enable

1 = Enable receive error interrupt

0 = Disable receive error interrupt

RW 0

1B.13 Page

Received

Interrupt

Enable

1 = Enable page received interrupt

0 = Disable page received interrupt

RW 0

1B.12 Parallel

Detect Fault

Interrupt

Enable

1 = Enable parallel detect fault interrupt

0 = Disable parallel detect fault interrupt

RW 0

1B.11 Link Partner

Acknowl-

edge Inter-

rupt Enable

1 = Enable link partner acknowledge interrupt

0 = Disable link partner acknowledge interrupt

RW 0

1B.10 Link-Down

Interrupt

Enable

1 = Enable link-down interrupt

0 = Disable link-down interrupt

RW 0

TABLE 4-4: VENDOR-SPECIFIC REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

 2016-2017 Microchip Technology Inc. DS00002117F-page 41

KSZ9031RNX

1B.9 Remote Fault

Interrupt

Enable

1 = Enable remote fault interrupt

0 = Disable remote fault interrupt

RW 0

1B.8 Link-Up

Interrupt

Enable

1 = Enable link-up interrupt

0 = Disable link-up interrupt

RW 0

1B.7 Jabber Inter-

rupt

1 = Jabber occurred

0 = Jabber did not occur

RO/RC 0

1B.6 Receive

Error Inter-

rupt

1 = Receive error occurred

0 = Receive error did not occur

RO/RC 0

1B.5 Page

Receive

Interrupt

1 = Page receive occurred

0 = Page receive did not occur

RO/RC 0

1B.4 Parallel

Detect Fault

Interrupt

1 = Parallel detect fault occurred

0 = Parallel detect fault did not occur

RO/RC 0

1B.3 Link Partner

Acknowl-

edge Inter-

rupt

1 = Link partner acknowledge occurred

0 = Link partner acknowledge did not occur

RO/RC 0

1B.2 Link-Down

Interrupt

1 = Link-down occurred

0 = Link-down did not occur

RO/RC 0

1B.1 Remote Fault

Interrupt

1 = Remote fault occurred

0 = Remote fault did not occur

RO/RC 0

1B.0 Link-Up

Interrupt

1 = Link-up occurred

0 = Link-up did not occur

RO/RC 0

1C.15:8 Reserved Reserved RW 0000_0000

1C.7 MDI Set When Swap-Off (Bit [6] of this register) is asserted

(1),

1 = PHY is set to operate as MDI mode

0 = PHY is set to operate as MDI-X mode

This bit has no function when Swap-Off is

de-asserted (0).

RW 0

1C.6 Swap-Off 1 = Disable Auto MDI/MDI-X function

0 = Enable Auto MDI/MDI-X function

RW 0

1C.5:0 Reserved Reserved RW 00_0000

1F.15 Reserved Reserved RW 0

1F.14 Interrupt

Level

1 = Interrupt pin active high

0 = Interrupt pin active low

RW 0

1F.13:12 Reserved Reserved RW 00

1F.11:10 Reserved Reserved RO/LH/RC 00

1F.9 Enable

Jabber

1 = Enable jabber counter

0 = Disable jabber counter

RW 1

1F.8:7 Reserved Reserved RW 00

TABLE 4-4: VENDOR-SPECIFIC REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

KSZ9031RNX

DS00002117F-page 42  2016-2017 Microchip Technology Inc.

Note 4-1 RW = Read/Write; RO = Read Only; SC = Self-Cleared; RC = Read-Cleared; LH = Latch High.

1F.6 Speed

Status

1000BASE-T

1 = Indicate chip final speed status at 1000BASE-T RO 0

1F.5 Speed

Status

100BASE-TX

1 = Indicate chip final speed status at 100BASE-TX RO 0

1F.4 Speed

Status

10BASE-T

1 = Indicate chip final speed status at 10BASE-T RO 0

1F.3 Duplex

Status

Indicate chip duplex status

1 = Full-duplex

0 = Half-duplex

RO 0

1F.2 1000BASE-T

Master/Slave

Status

Indicate chip master/slave status

1 = 1000BASE-T master mode

0 = 1000BASE-T slave mode

RO 0

1F.1 Reserved Reserved RW 0

1F.0 Link Status

Check Fail

1 = Fail

0 = Not failing

RO 0

TABLE 4-4: VENDOR-SPECIFIC REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

 2016-2017 Microchip Technology Inc. DS00002117F-page 43

KSZ9031RNX

4.3 MMD Registers

MMD registers provide indirect read/write access to up to 32 MMD device addresses with each device supporting up to

65,536 16-bit registers, as defined in Clause 22 of the IEEE 802.3 Specification. The KSZ9031RNX, however, uses only

a small fraction of the available registers. See the Register Map section for a list of supported MMD device addresses

and their associated register addresses.

The following two standard registers serve as the portal registers to access the indirect MMD registers.

• Standard register Dh – MMD Access – Control

• Standard register Eh – MMD Access – Register/Data

Note 4-1 RW = Read/Write.

Examples:

MMD Register Write

Write MMD - Device Address 2h, Register 10h = 0001h to enable link-up detection to trigger PME for WOL.

1. Write Register Dh with 0002h // Set up register address for MMD – Device Address 2h.

2. Write Register Eh with 0010h // Select Register 10h of MMD – Device Address 2h.

3. Write Register Dh with 4002h // Select register data for MMD – Device Address 2h, Register 10h.

4. Write Register Eh with 0001h // Write value 0001h to MMD – Device Address 2h, Register 10h.

MMD Register Read

Read MMD - Device Address 2h, Register 11h – 13h for the magic packet’s MAC address.

1. Write Register Dh with 0002h // Set up register address for MMD – Device Address 2h.

2. Write Register Eh with 0011h // Select Register 11h of MMD – Device Address 2h.

3. Write Register Dh with 8002h // Select register data for MMD – Device Address 2h, Register 11h.

4. Read Register Eh // Read data in MMD – Device Address 2h, Register 11h.

5. Read Register Eh // Read data in MMD – Device Address 2h, Register 12h.

6. Read Register Eh // Read data in MMD – Device Address 2h, Register 13h.

TABLE 4-5: MMD PORTAL REGISTERS

Address Name Description Mode

Note 4-1 Default

D.15:14 MMD -

Operation

Mode

For the selected MMD device address (Bits [4:0] of

this register), these two bits select one of the fol-

lowing register or data operations and the usage

for MMD Access – Register/Data (Reg. Eh).

00 = Register

01 = Data, no post increment

10 = Data, post increment on reads and writes

11 = Data, post increment on writes only

RW 00

D.13:5 Reserved Reserved RW 00_0000_000

D.4:0 MMD –

Device

Address

These five bits set the MMD device address RW 0_0000

E.15:0 MMD –

Data

For the selected MMD device address (Reg. Dh,

Bits [4:0]),

When Reg. Dh, Bits [15:14] = 00, this register

contains the read/write register address for the

MMD device address.

Otherwise, this register contains the read/write

data value for the MMD device address and its

selected register address.

See also Register Dh, Bits [15:14] descriptions for

post increment reads and writes of this register for

data operation.

RW 0000_0000_

0000_0000

KSZ9031RNX

DS00002117F-page 44  2016-2017 Microchip Technology Inc.

TABLE 4-6: MMD REGISTER DESCRIPTIONS

Address Name Description Mode

Note 4-1 Default

MMD Address 0h, Register 3h – AN FLP Burst Transmit – LO

0.3.15:0 AN FLP

Burst Trans-

mit – LO

This register and the following register set the

Auto-Negotiation FLP burst transmit timing. The

same timing must be set for both registers.

0x4000 = Select 8 ms interval timing (default)

0x1A80 = Select 16 ms interval timing

All other values are reserved.

RW 0x4000

MMD Address 0h, Register 4h – AN FLP Burst Transmit – HI

0.4.15:0 AN FLP

Burst Trans-

mit – HI

This register and the previous register set the Auto-

Negotiation FLP burst transmit timing. The same

timing must be set for both registers.

0x0003 = Select 8 ms interval timing (default)

0x0006 = Select 16 ms interval timing

All other values are reserved.

RW 0x0003

MMD Address 1h, Register 5Ah – 1000BASE-T Link-Up Time Control

1.5A.8:4 Reserved Reserved RW 1_0000

1.5A.3:1 1000BASE-T

Link-Up Time

When the link partner is another KSZ9031 device,

the 1000BASE-T link-up time can be long. These

three bits provide an optional setting to reduce the

1000BASE-T link-up time.

100 = Default power-up setting

011 = Optional setting to reduce link-up time when

the link partner is a KSZ9031 device.

All other settings are reserved and should not be

used.

The optional setting is safe to use with any link

partner.

Note: Read/Write access to this register bit is avail-

able only when Reg. 0h is set to 0x2100 to disable

auto-negotiation and force 100BASE-TX mode.

RW 100

1.5A.0 Reserved Reserved RW 0

MMD Address 2h, Register 0h – Common Control

2.0.15:5 Reserved Reserved RW 0000_0000_000

2.0.4 LED Mode

Override

Override strap-in for LED_MODE

1 = Single-LED mode

0 = Tri-color dual-LED mode

This bit is write-only and always reads back a value

of ‘0’. The updated value is reflected in Bit [3] of

this register.

WO 0

2.0.3 LED Mode LED_MODE Status

1 = Single-LED mode

0 = Tri-color dual-LED mode

RO Set by LED_MODE

strapping pin.

See the Strap-In

Options -

KSZ9031RNX

section for details.

Can be updated by

Bit [4] of this register

after reset.

2.0.2 Reserved Reserved RW 0

 2016-2017 Microchip Technology Inc. DS00002117F-page 45

KSZ9031RNX

2.0.1 CLK125_EN

Status

Override strap-in for CLK125_EN

1 = CLK125_EN strap-in is enabled

0 = CLK125_EN strap-in is disabled

RW Set by CLK125_EN

strapping pin.

See the Strap-In

Options -

KSZ9031RNX

section for details.

2.0.0 Reserved Reserved RW 0

MMD Address 2h, Register 1h – Strap Status

2.1.15:8 Reserved Reserved RO 0000_0000

2.1.7 LED_MODE

Strap-In

Status

Strap to

1 = Single-LED mode

0 = Tri-color dual-LED mode

RO Set by LED_MODE

strapping pin.

See the Strap-In

Options -

KSZ9031RNX

section for details.

2.1.6 Reserved Reserved RO 0

2.1.5 CLK125_EN

Strap-In

Status

Strap to

1 = CLK125_EN strap-in is enabled

0 = CLK125_EN strap-in is disabled

RO Set by CLK125_EN

strapping pin.

See the Strap-In

Options -

KSZ9031RNX

section for details.

2.1.4:3 Reserved Reserved RO 00

2.1.2:0 PHYAD[2:0]

Strap-In

Value

Strap-in value for PHY address

Bits [4:3] of PHY address are always set to ‘00’.

RO Set by PHYAD[2:0]

strapping pin.

See the Strap-In

Options -

KSZ9031RNX

section for details.

MMD Address 2h, Register 2h – Operation Mode Strap Override

2.2.15 RGMII All

Capabilities

Override

1 = Override strap-in for RGMII to advertise all

capabilities

Set by MODE[3:0]

strapping pin.

See the Strap-In

Options -

KSZ9031RNX

section for details.

2.2.14 RGMII No

1000BT_HD

Override

1 = Override strap-in for RGMII to advertise all

capabilities except 1000BASE-T half-duplex

2.2.13 RGMII

1000BT_H/

FD Only

Override

1 = Override strap-in for RGMII to advertise

1000BASE-T full- and half-duplex only

2.2.12 RGMII

1000BT_FD

Only Over-

ride

1 = Override strap-in for RGMII to advertise

1000BASE-T full-duplex only

2.2.11 Reserved Reserved RW 0

2.2.10 PME_N2

Output

Enable

For INT_N/PME_N2 (Pin 38),

1 = Enable PME output

0 = Disable PME output

This bit works in conjunction with MMD Address

2h, Reg. 10h, Bits [15:14] to define the output for

Pin 38.

RW 0

TABLE 4-6: MMD REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

KSZ9031RNX

DS00002117F-page 46  2016-2017 Microchip Technology Inc.

2.2.9 Reserved Reserved RW 0

2.2.8 PME_N1

Output

Enable

For LED1/PME_N1 (Pin 17),

1 = Enable PME output

0 = Disable PME output

This bit works in conjunction with MMD Address

2h, Reg. 10h, Bits [15:14] to define the output for

Pin 17.

RW 0

2.2.7 Chip Power-

Down

Override

1 = Override strap-in for chip power-down mode RW Set by MODE[3:0]

strapping pin.

See the Strap-In

Options -

KSZ9031RNX

section for details.

2.2.6:5 Reserved Reserved RW 00

2.2.4 NAND Tree

Override

1 = Override strap-in for NAND Tree mode RW Set by MODE[3:0]

strapping pin.

See the Strap-In

Options -

KSZ9031RNX

section for details.

2.2.3:0 Reserved Reserved RW 0000

MMD Address 2h, Register 3h – Operation Mode Strap Status

2.3.15 RGMII All

Capabilities

Strap-In

Status

1 = Strap to RGMII to advertise all capabilities RO

Set by MODE[3:0]

strapping pin.

See the Strap-In

Options -

KSZ9031RNX

section for details.

2.3.14 RGMII No

1000BT_HD

Strap-In

Status

1 = Strap to RGMII to advertise all capabilities

except 1000BASE-T half-duplex

2.3.13 RGMII Only

1000BT_H/

FD Strap-In

Status

1 = Strap to RGMII to advertise 1000BASE-T full-

and half-duplex only

2.3.12 RGMII Only

1000BT_FD

Strap-In

Status

1 = Strap to RGMII to advertise 1000BASE-T full-

duplex only

2.3.11:8 Reserved Reserved RO 0000

2.3.7 Chip Power-

Down Strap-

In Status

1 = Strap to chip power-down mode RO Set by MODE[3:0]

strapping pin.

See the Strap-In

Options -

KSZ9031RNX

section for details.

2.3.6:5 Reserved Reserved RO 00

TABLE 4-6: MMD REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

 2016-2017 Microchip Technology Inc. DS00002117F-page 47

KSZ9031RNX

2.3.4 NAND Tree

Strap-In

Status

1 = Strap to NAND Tree mode RO Set by MODE[3:0]

strapping pin.

See the Strap-In

Options -

KSZ9031RNX

section for details.

2.3.3:0 Reserved Reserved RO 0000

MMD Address 2h, Register 4h – RGMII Control Signal Pad Skew

2.4.15:8 Reserved Reserved RW 0000_0000

2.4.7:4 RX_DV Pad

Skew

RGMII RX_CTL output pad skew control (0.06 ns/

step)

RW 0111

2.4.3:0 TX_EN Pad

Skew

RGMII TX_CTL input pad skew control (0.06 ns/

step)

RW 0111

MMD Address 2h, Register 5h – RGMII RX Data Pad Skew

2.5.15:12 RXD3 Pad

Skew

RGMII RXD3 output pad skew control (0.06 ns/

step)

RW 0111

2.5.11:8 RXD2 Pad

Skew

RGMII RXD2 output pad skew control (0.06 ns/

step)

RW 0111

2.5.7:4 RXD1 Pad

Skew

RGMII RXD1 output pad skew control (0.06 ns/

step)

RW 0111

2.5.3:0 RXD0 Pad

Skew

RGMII RXD0 output pad skew control (0.06 ns/

step)

RW 0111

MMD Address 2h, Register 6h – RGMII TX Data Pad Skew

2.6.15:12 TXD3 Pad

Skew

RGMII TXD3 input pad skew control (0.06 ns/step) RW 0111

2.6.11:8 TXD2 Pad

Skew

RGMII TXD2 input pad skew control (0.06 ns/step) RW 0111

2.6.7:4 TXD1 Pad

Skew

RGMII TXD1 input pad skew control (0.06 ns/step) RW 0111

2.6.3:0 TXD0 Pad

Skew

RGMII TXD0 input pad skew control (0.06 ns/step) RW 0111

MMD Address 2h, Register 8h – RGMII Clock Pad Skew

2.8.15:10 Reserved Reserved RW 0000_00

2.8.9:5 GTX_CLK

Pad Skew

RGMII GTX_CLK input pad skew control (0.06 ns/

step)

RW 01_111

2.8.4:0 RX_CLK

Pad Skew

RGMII RX_CLK output pad skew control (0.06 ns/

step)

RW 0_1111

TABLE 4-6: MMD REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

KSZ9031RNX

DS00002117F-page 48  2016-2017 Microchip Technology Inc.

MMD Address 2h, Register 10h – Wake-On-LAN – Control

2.10.15:14 PME Output

Select

These two bits work in conjunction with MMD

Address 2h, Reg. 2h, Bits [8] and [10] for PME_N1

and PME_N2 enable, to define the output for Pins

17 and 38, respectively.

LED1/PME_N1 (Pin 17)

00 = PME_N1 output only

01 = LED1 output only

10 = LED1 and PME_N1 output

11 = Reserved

INT_N/PME_N2 (Pin 38)

00 = PME_N2 output only

01 = INT_N output only

10 = INT_N and PME_N2 output

11 = Reserved

RW 00

2.10.13:7 Reserved Reserved RW 00_0000_0

2.10.6 Magic Packet

Detect

Enable

1 = Enable magic-packet detection

0 = Disable magic-packet detection

RW 0

2.10.5 Custom-

Packet Type

3 Detect

Enable

1 = Enable custom-packet, Type 3 detection

0 = Disable custom-packet, Type 3 detection

RW 0

2.10.4 Custom-

Packet Type

2 Detect

Enable

1 = Enable custom-packet, Type 2 detection

0 = Disable custom-packet, Type 2 detection

RW 0

2.10.3 Custom-

Packet Type

1 Detect

Enable

1 = Enable custom-packet, Type 1 detection

0 = Disable custom-packet, Type 1 detection

RW 0

2.10.2 Custom-

Packet Type

0 Detect

Enable

1 = Enable custom-packet, Type 0 detection

0 = Disable custom-packet, Type 0 detection

RW 0

2.10.1 Link-Down

Detect

Enable

1 = Enable link-down detection

0 = Disable link-down detection

RW 0

2.10.0 Link-Up

Detect

Enable

1 = Enable link-up detection

0 = Disable link-up detection

RW 0

MMD Address 2h, Register 11h – Wake-On-LAN – Magic Packet, MAC-DA-0

2.11.15:0 Magic Packet

MAC-DA-0

This register stores the lower two bytes of the

destination MAC address for the magic packet.

Bit [15:8] = Byte 2 (MAC Address [15:8])

Bit [7:0] = Byte 1 (MAC Address [7:0])

The upper four bytes of the destination MAC

address are stored in the following two registers.

RW 0000_0000_0000_00

TABLE 4-6: MMD REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

 2016-2017 Microchip Technology Inc. DS00002117F-page 49

KSZ9031RNX

MMD Address 2h, Register 12h – Wake-On-LAN – Magic Packet, MAC-DA-1

2.12.15:0 Magic Packet

MAC-DA-1

This register stores the middle two bytes of the

destination MAC address for the magic packet.

Bit [15:8] = Byte 4 (MAC Address [31:24])

Bit [7:0] = Byte 3 (MAC Address [23:16])

The lower two bytes and upper two bytes of the

destination MAC address are stored in the previous

and following registers, respectively.

RW 0000_0000_0000_00

MMD Address 2h, Register 13h – Wake-On-LAN – Magic Packet, MAC-DA-2

2.13.15:0 Magic Packet

MAC-DA-2

This register stores the upper two bytes of the

destination MAC address for the magic packet.

Bit [15:8] = Byte 6 (MAC Address [47:40])

Bit [7:0] = Byte 5 (MAC Address [39:32])

The lower four bytes of the destination MAC

address are stored in the previous two registers.

RW 0000_0000_0000_00

MMD Address 2h, Register 14h – Wake-On-LAN – Customized Packet, Type 0, Expected CRC 0

MMD Address 2h, Register 16h – Wake-On-LAN – Customized Packet, Type 1, Expected CRC 0

MMD Address 2h, Register 18h – Wake-On-LAN – Customized Packet, Type 2, Expected CRC 0

MMD Address 2h, Register 1Ah – Wake-On-LAN – Customized Packet, Type 3, Expected CRC 0

2.14.15:0

2.16.15:0

2.18.15:0

2.1A.15:0

Custom

Packet Type

X CRC 0

This register stores the upper two bytes for the

expected CRC.

Bit [15:8] = Byte 2 (CRC [15:8])

Bit [7:0] = Byte 1 (CRC [7:0])

The lower two bytes for the expected CRC are

stored in the following register.

RW 0000_0000_0000_00

MMD Address 2h, Register 15h – Wake-On-LAN – Customized Packet, Type 0, Expected CRC 1

MMD Address 2h, Register 17h – Wake-On-LAN – Customized Packet, Type 1, Expected CRC 1

MMD Address 2h, Register 19h – Wake-On-LAN – Customized Packet, Type 2, Expected CRC 1

MMD Address 2h, Register 1Bh – Wake-On-LAN – Customized Packet, Type 3, Expected CRC 1

2.15.15:0

2.17.15:0

2.19.15:0

2.1B.15:0

Custom

Packet Type

X CRC 1

This register stores the lower two bytes for the

expected CRC.

Bit [15:8] = Byte 4 (CRC [31:24])

Bit [7:0] = Byte 3 (CRC [23:16])

The upper two bytes for the expected CRC are

stored in the previous register.

RW 0000_0000_0000_00

MMD Address 2h, Register 1Ch – Wake-On-LAN – Customized Packet, Type 0, Mask 0

MMD Address 2h, Register 20h – Wake-On-LAN – Customized Packet, Type 1, Mask 0

MMD Address 2h, Register 24h – Wake-On-LAN – Customized Packet, Type 2, Mask 0

MMD Address 2h, Register 28h – Wake-On-LAN – Customized Packet, Type 3, Mask 0

2.1C.15:0

2.20.15:0

2.24.15:0

2.28.15:0

Custom

Packet Type

X Mask 0

This register selects the bytes in the first 16 bytes

of the packet (bytes 1 through 16) that will be used

for CRC calculation.

For each bit in this register,

1 = Byte is selected for CRC calculation

0 = Byte is not selected for CRC calculation

The register-bit to packet-byte mapping is as fol-

lows:

Bit [15]: Byte 16

……

Bit [2]: Byte 2

Bit [0]: Byte 1

RW 0000_0000_0000_00

TABLE 4-6: MMD REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

KSZ9031RNX

DS00002117F-page 50  2016-2017 Microchip Technology Inc.

MMD Address 2h, Register 1Dh – Wake-On-LAN – Customized Packet, Type 0, Mask 1

MMD Address 2h, Register 21h – Wake-On-LAN – Customized Packet, Type 1, Mask 1

MMD Address 2h, Register 25h – Wake-On-LAN – Customized Packet, Type 2, Mask 1

MMD Address 2h, Register 29h – Wake-On-LAN – Customized Packet, Type 3, Mask 1

2.1D.15:0

2.21.15:0

2.25.15:0

2.29.15:0

Custom

Packet Type

X Mask 1

This register selects the bytes in the second 16

bytes of the packet (bytes 17 thru 32) that will be

used for CRC calculation.

For each bit in this register,

1 = Byte is selected for CRC calculation

0 = Byte is not selected for CRC calculation

The register-bit to packet-byte mapping is as fol-

lows:

Bit [15]: Byte 32

……

Bit [2]: Byte 18

Bit [0]: Byte 17

RW 0000_0000_0000_00

MMD Address 2h, Register 1Eh – Wake-On-LAN – Customized Packet, Type 0, Mask 2

MMD Address 2h, Register 22h – Wake-On-LAN – Customized Packet, Type 1, Mask 2

MMD Address 2h, Register 26h – Wake-On-LAN – Customized Packet, Type 2, Mask 2

MMD Address 2h, Register 2Ah – Wake-On-LAN – Customized Packet, Type 3, Mask 2

2.1E.15:0

2.22.15:0

2.26.15:0

2.2A.15:0

Custom

Packet Type

X Mask 2

This register selects the bytes in the third 16 bytes

of the packet (bytes 33 through 48) that will be

used for CRC calculation.

For each bit in this register,

1 = Byte is selected for CRC calculation

0 = Byte is not selected for CRC calculation

The register-bit to packet-byte mapping is as fol-

lows:

Bit [15]: Byte 48

……

Bit [2]: Byte 34

Bit [0]: Byte 33

RW 0000_0000_0000_00

MMD Address 2h, Register 1Fh – Wake-On-LAN – Customized Packet, Type 0, Mask 3

MMD Address 2h, Register 23h – Wake-On-LAN – Customized Packet, Type 1, Mask 3

MMD Address 2h, Register 27h – Wake-On-LAN – Customized Packet, Type 2, Mask 3

MMD Address 2h, Register 2Bh – Wake-On-LAN – Customized Packet, Type 3, Mask 3

2.1F.15:0

2.23.15:0

2.27.15:0

2.2B.15:0

Custom

Packet Type

X Mask 3

This register selects the bytes in the fourth 16 bytes

of the packet (bytes 49 through 64) that will be

used for CRC calculation.

For each bit in this register,

1 = Byte is selected for CRC calculation

0 = Byte is not selected for CRC calculation

The register-bit to packet-byte mapping is as fol-

lows:

Bit [15]: Byte 64

……

Bit [2]: Byte 50

Bit [0]: Byte 49

RW 0000_0000_0000_00

MMD Address 1Ch, Register 4h – Analog Control 4

1C.4.15:11 Reserved Reserved RW 0000_0

1C.4.10 10BASE-Te

Mode

1 = 10BASE-Te (1.75V TX amplitude)

0 = Standard 10BASE-T (2.5V TX amplitude)

RW 0

1C.4.9:0 Reserved Reserved RW 00_1111_1111

TABLE 4-6: MMD REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

 2016-2017 Microchip Technology Inc. DS00002117F-page 51

KSZ9031RNX

Note 4-1 RW = Read/Write; RO = Read Only; WO = Write Only; LH = Latch High.

MMD Address 1Ch, Register 23h – EDPD Control

1C.23.15:1 Reserved Reserved RW 0000_0000_0000_00

1C.23.0 EDPD Mode

Enable

Energy-detect power-down mode

1 = Enable

0 = Disable

RW 0

TABLE 4-6: MMD REGISTER DESCRIPTIONS (CONTINUED)

Address Name Description Mode

Note 4-1 Default

 2016-2017 Microchip Technology Inc. DS00002117F-page 52

KSZ9031RNX

5.0 OPERATIONAL CHARACTERISTICS

5.1 Absolute Maximum Ratings*

Supply Voltage (VIN)

(DVDDL, AVDDL, AVDDL_PLL) ................................................................................................................ –0.5V to +1.8V

(AVDDH) ................................................................................................................................................... –0.5V to +5.0V

(DVDDH)................................................................................................................................................... –0.5V to +5.0V

Input Voltage (all inputs) ........................................................................................................................... –0.5V to +5.0V

Output Voltage (all outputs) ...................................................................................................................... –0.5V to +5.0V

Lead Temperature (soldering, 10s) ....................................................................................................................... +260°C

Storage Temperature (TS)...................................................................................................................... –55°C to +150°C

*Exceeding the absolute maximum rating may damage the device. Stresses greater than the absolute maximum rating

may cause permanent damage to the device. Operation of the device at these or any other conditions above those spec-

ified in the operating sections of this specification is not implied. Maximum conditions for extended periods may affect

reliability.

5.2 Operating Ratings**

Supply Voltage

(DVDDL, AVDDL, AVDDL_PLL) ........................................................................................................ +1.140V to +1.380V

(AVDDH @ 3.3V) .............................................................................................................................. +3.135V to +3.465V

(AVDDH @ 2.5V; Commercial temp. only)........................................................................................ +2.375V to +2.625V

(DVDDH @ 3.3V).............................................................................................................................. +3.135V to +3.465V

(DVDDH @ 2.5V).............................................................................................................................. +2.375V to +2.625V

(DVDDH @ 1.8V).............................................................................................................................. +1.710V to +1.890V

Ambient Temperature

(TA Commercial: KSZ9031RNXC) ............................................................................................................... 0°C to +70°C

(TA Industrial: KSZ9031RNXI) ................................................................................................................. –40°C to +85°C

(TA Automotive: KSZ9031RNXUA/UB) .................................................................................................... –40°C to +85°C

(TA Automotive: KSZ9031RNXVA/VB)................................................................................................... –40°C to +105°C

Maximum Junction Temperature (TJ max.) ........................................................................................................... +125°C

Thermal Resistance (JA)..............................................................................................................................+36.34°C/W

Thermal Resistance (JC) ...............................................................................................................................+9.47°C/W

**The device is not guaranteed to function outside its operating ratings.

Note: Do not drive input signals without power supplied to the device.

KSZ9031RNX

DS00002117F-page 53  2016-2017 Microchip Technology Inc.

6.0 ELECTRICAL CHARACTERISTICS

TA = 25°C. Specification is for packaged product only.

TABLE 6-1: SUPPLY CURRENT - CORE/DIGITAL I/O

Parameters Symbol Min. Typ. Max. Units Note

1.2V Total of:

DVDDL (digital core) +

AVDDL (analog core) +

AVDDL_PLL (PLL)

ICORE

—210—

1000BASE-T link-up (no traffic)

—221— 1000BASE-T full-duplex @

100% utilization

— 63.6 — 100BASE-TX link-up (no traffic)

—63.8— 100BASE-TX full-duplex @

100% utilization

— 7.1 — 10BASE-T link-up (no traffic)

—7.7— 10BASE-T full-duplex @

100% utilization

—1.0— Software power-down mode

(Reg. 0.11 = 1)

—0.7— Chip power-down mode

(strap-in pins MODE[3:0] = 0111)

1.8V for Digital I/O

(RGMII operating @ 1.8V) IDVDDH_1.8

—11.2—

1000BASE-T link-up (no traffic)

—23.6— 1000BASE-T full-duplex @

100% utilization

— 8.4 — 100BASE-TX link-up (no traffic)

—9.8— 100BASE-TX full-duplex @

100% utilization

— 3.6 — 10BASE-T link-up (no traffic)

—5.6— 10BASE-T full-duplex @

100% utilization

—5.5— Software power-down mode

(Reg. 0.11 = 1)

—0.3— Chip power-down mode

(strap-in pins MODE[3:0] = 0111)

2.5V for Digital I/O

(RGMII operating @ 2.5V) IDVDDH_2.5

—14.7—

1000BASE-T link-up (no traffic)

—31.5— 1000BASE-T full-duplex @

100% utilization

— 10.5 — 100BASE-TX link-up (no traffic)

—13.0— 100BASE-TX full-duplex @

100% utilization

— 6.3 — 10BASE-T link-up (no traffic)

—9.0— 10BASE-T full-duplex @

100% utilization

—6.7— Software power-down mode

(Reg. 0.11 = 1)

—0.7— Chip power-down mode

(strap-in pins MODE[3:0] = 0111)

 2016-2017 Microchip Technology Inc. DS00002117F-page 54

KSZ9031RNX

Note 6-1 Equivalent to current draw through external transformer center taps for PHY transceivers with current-

mode transmit drivers.

3.3V for Digital I/O

(RGMII operating @ 3.3V) IDVDDH_3.3

—19.5—

1000BASE-T link-up (no traffic)

—41.5— 1000BASE-T full-duplex @

100% utilization

— 13.9 — 100BASE-TX link-up (no traffic)

—17.2— 100BASE-TX full-duplex @

100% utilization

— 11.5 — 10BASE-T link-up (no traffic)

—13.7— 10BASE-T full-duplex @

100% utilization

—9.3— Software power-down mode

(Reg. 0.11 = 1)

—2.2— Chip power-down mode

(strap-in pins MODE[3:0] = 0111)

TABLE 6-2: SUPPLY CURRENT - TRANSCEIVER (Note 6-1)

Parameters Symbol Min. Typ. Max. Units Note

2.5V for Transceiver

(Recommended for

commercial temperature

range operation only)

IAVDDH_2.5

—58.8—

1000BASE-T link-up (no traffic)

—57.9— 1000BASE-T full-duplex @

100% utilization

— 24.9 — 100BASE-TX link-up (no traffic)

—24.9— 100BASE-TX full-duplex @

100% utilization

— 11.5 — 10BASE-T link-up (no traffic)

—25.3— 10BASE-T full-duplex @

100% utilization

—3.1— Software power-down mode

(Reg. 0.11 = 1)

—0.02— Chip power-down mode

(strap-in pins MODE[3:0] = 0111)

3.3V for Transceiver

Parameter IAVDDH_3.3

—67.4—

1000BASE-T link-up (no traffic)

—66.3— 1000BASE-T full-duplex @

100% utilization

— 28.7 — 100BASE-TX link-up (no traffic)

—28.6— 100BASE-TX full-duplex @

100% utilization

— 15.9 — 10BASE-T link-up (no traffic)

—28.6— 10BASE-T full-duplex @

100% utilization

—4.2— Software power-down mode

(Reg. 0.11 = 1)

—0.02— Chip power-down mode

(strap-in pins MODE[3:0] = 0111)

TABLE 6-1: SUPPLY CURRENT - CORE/DIGITAL I/O (CONTINUED)

Parameters Symbol Min. Typ. Max. Units Note

KSZ9031RNX

DS00002117F-page 55  2016-2017 Microchip Technology Inc.

TABLE 6-3: CMOS INPUTS

Parameters Symbol Min. Typ. Max. Units Note

Input High Voltage VIH

2.0 — —

DVDDH (digital I/O) = 3.3V

1.5 — — DVDDH (digital I/O) = 2.5V

1.1 — — DVDDH (digital I/O) = 1.8V

Input Low Voltage VIL

——1.3

DVDDH (digital I/O) = 3.3V

— — 1.0 DVDDH (digital I/O) = 2.5V

— — 0.7 DVDDH (digital I/O) = 1.8V

Input High

Leakage Current IIHL –2.0 — 2.0 µA DVDDH = 3.3V and VIH = 3.3V

All digital input pins

Input Low Leakage Current IILL

–2.0 — 2.0

µA

DVDDH = 3.3V and VIL = 0.0V

All digital input pins, except MDC,

MDIO, RESET_N.

–120 — –40

DVDDH = 3.3V and VIL = 0.0V

MDC, MDIO, RESET_N pins with

internal pull-ups

TABLE 6-4: CMOS OUTPUTS

Parameter Symbol Min. Typ. Max. Units Note

Output High Voltage VOH

2.7 — —

DVDDH (digital I/O) = 3.3V,

IOH (min) = 10 mA

All digital output pins

2.0 — —

DVDDH (digital I/O) = 2.5V,

IOH (min) = 10 mA

All digital output pins

1.5 — —

DVDDH (digital I/O) = 1.8V,

IOH (min) = 13 mA

All digital output pins, except LED1,

LED2

Output Low Voltage VOL

——0.3

DVDDH (digital I/O) = 3.3V,

IOL (min) = 10 mA

All digital output pins

——0.3

DVDDH (digital I/O) = 2.5V,

IOL (min) = 10 mA

All digital output pins

——0.3

DVDDH (digital I/O) = 1.8V,

IOL (min) = 13 mA

All digital output pins, except LED1,

LED2

Output Tri-State Leakage |Ioz|——10µA —

TABLE 6-5: LED OUTPUTS

Parameters Symbol Min. Typ. Max. Units Note

Output Drive Current ILED 10 — — mA

DVDDH (digital I/O) = 3.3V or 2.5V,

and VOL at 0.3V

Each LED pin (LED1, LED2)

 2016-2017 Microchip Technology Inc. DS00002117F-page 56

KSZ9031RNX

Note 6-2 Measured with pin input voltage level at one-half DVDDH.

Note 6-3 Measured differentially after 1:1 transformer.

Note 6-4 Measured differentially after 1:1 transformer.

TABLE 6-6: PULL-UP PINS (Note 6-2)

Parameters Symbol Min. Typ. Max. Units Note

Internal Pull-Up Resistance

(MDC, MDIO,

RESET_N pins)

13 22 31

k

DVDDH (digital I/O) = 3.3V

16 28 39 DVDDH (digital I/O) = 2.5V

26 44 62 DVDDH (digital I/O) = 1.8V

TABLE 6-7: 100BASE-TX TRANSMIT (Note 6-3)

Parameters Symbol Min. Typ. Max. Units Note

Peak Differential Output

Voltage

VO0.95 — 1.05 V 100 termination across differential

output

Output Voltage Imbalance VIMB —— 2 %100 termination across differential

output

Rise/Fall Time tr, tf3—5ns —

Rise/Fall Time Imbalance — 0 — 0.5 ns —

Duty Cycle Distortion — — — ±0.25 ns —

Overshoot — — — 5 % —

Output Jitter — — 0.7 — ns Peak-to-peak

TABLE 6-8: 10BASE-T TRANSMIT (Note 6-4)

Parameters Symbol Min. Typ. Max. Units Note

Peak Differential Output

Voltage

VP2.2 — 2.8 V 100 termination across differential

output

Jitter Added — — — 3.5 ns Peak-to-peak

Harmonic Rejection — — –31 — dB Transmit all-one signal sequence

TABLE 6-9: 10BASE-T RECEIVE

Parameters Symbol Min. Typ. Max. Units Note

Squelch Threshold VSQ 300 400 — mV 5 MHz square wave

TABLE 6-10: TRANSMITTER - DRIVE SETTING

Parameters Symbol Min. Typ. Max. Units Note

Reference Voltage of ISET VSET —1.2— V R(I

SET) = 12.1 k

TABLE 6-11: LDO CONTROLLER - DRIVE RANGE

Parameters Symbol Min. Typ. Max. Units Note

Output drive range for

LDO_O (Pin 43) to gate

input of P-channel

MOSFET

VLDO_O

0.85 — 2.8

AVDDH = 3.3V for MOSFET source

voltage

0.85 — 2.0

AVDDH = 2.5V for MOSFET source

voltage (recommended for commer-

cial temperature range operation only)

KSZ9031RNX

DS00002117F-page 57  2016-2017 Microchip Technology Inc.

7.0 TIMING DIAGRAMS

7.1 RGMII Timing

As the default, after power-up or reset, the KSZ9031RNX RGMII timing conforms to the timing requirements in the

RGMII Version 2.0 Specification for internal PHY chip delay.

For the transmit path (MAC to KSZ9031RNX), the KSZ9031RNX does not add any delay locally at its GTX_CLK, TX_EN

and TXD[3:0] input pins, and expects the GTX_CLK delay to be provided on-chip by the MAC. If MAC does not provide

any delay or insufficient delay for the GTX_CLK, the KSZ9031RNX has pad skew registers that can provide up to

1.38 ns on-chip delay.

For the receive path (KSZ9031RNX to MAC), the KSZ9031RNX adds 1.2 ns typical delay to the RX_CLK output pin

with respect to RX_DV and RXD[3:0] output pins. If necessary, the KSZ9031RNX has pad skew registers that can adjust

the RX_CLK on-chip delay up to 2.58 ns from the 1.2 ns default delay.

It is common to implement RGMII PHY-to-MAC designs that either PHY, MAC, or both PHY and MAC are not fully RGMII

v2.0 compliant with on-chip clock delay. These combinations of mixed RGMII v1.3/v2.0 designs and plus sometimes

non-matching RGMII PCB trace routings require a review of the entire RGMII system timings (PHY on-chip, PCB trace

delay, MAC on-chip) to compute the aggregate clock delay and determine if the clock delay timing is met. If timing adjust-

ment is needed, pad skew registers are provided by the KSZ9031RNX. Refer to RGMII Pad Skew Registers section.

The following Figure 7-1, Figure 7-2, and Table 7-1 from the RGMII v2.0 Specification are provided as references to

understanding RGMII v1.3 external delay and RGMII v2.0 on-chip delay timings.

FIGURE 7-1: RGMII V2.0 SPEC (MULTIPLEXING AND TIMING DIAGRAM – ORIGINAL RGMII

(V1.3) WITH EXTERNAL DELAY)

 2016-2017 Microchip Technology Inc. DS00002117F-page 58

KSZ9031RNX

FIGURE 7-2: RGMII V2.0 SPEC (MULTIPLEXING AND TIMING DIAGRAM – RGMII-ID (V2.0)

WITH INTERNAL CHIP DELAY)

The following notes provide clarification for Figure 7-2.

TXC (SOURCE DATA), solid line, is the MAC GTX_CLK clock output timing per RGMII v1.3 Specification (PCB delay

line required or PHY internal delay required)

TXC (SOURCE DATA) WITH INTERNAL DELAY ADDED, dotted line, is the MAC GTX_CLK clock output timing per

RGMII v2.0 Specification (no PCB delay required and no PHY internal delay required)

RXC (SOURCE DATA), solid line, is the PHY RX_CLK clock output timing per RGMII v1.3 Specification (PCB delay line

required or MAC internal delay required)

RXC (SOURCE DATA) WITH INTERNAL DELAY ADDED, dotted line, is the PHY RX_CLK clock output timing per

RGMII v2.0 Specification (no PCB delay required and no MAC internal delay required)

TABLE 7-1: RGMII V2.0 SPECIFICATION

Parameter Description Min. Typ. Max. Units

TskewT Data-to-clock output skew (at transmitter) per

RGMII v1.3 (external delay)

–500 — 500 ps

TskewR Data-to-clock input skew (at receiver) per RGMII

v1.3 (external delay)

1.0 — 2.6

TsetupT Data-to-clock output setup (at transmitter – inte-

grated delay)

1.2 2.0 —

TholdT Clock-to-data output hold (at transmitter – inte-

grated delay)

1.2 2.0 —

TsetupR Data-to-clock input setup (at receiver – integrated

delay)

1.0 2.0 —

TholdR Clock-to-data input hold (at receiver – integrated

delay)

1.0 2.0 —

tcyc (1000BASE-T) Clock cycle duration for 1000BASE-T 7.2 8.0 8.8

tcyc (100BASE-TX) Clock cycle duration for 100BASE-TX 36 40 44

tcyc (10BASE-T) Clock cycle duration for 10BASE-T 360 400 440

TXC(SOURCE DATA) TXC WITH INTERNAL

DELAY ADDED

TXD[8:5][3:0]

TXD[7:4][3:0]

TX_CTL

TXC (AT RECEIVER)

RXC (SOURCE DATA)

RXD[8:5][3:0]

RXD[7:4][3:0]

RX_CTL

RXC (AT RECEIVER)

TXD[3:0] TXD[8:5]

TXD[7:4]

TSETUPT

THOLDT

TSETUPR

THOLDR

TXD[4]

TXEN

TXD[9]

TXERR

RXC WITH INTERNAL

DELAY ADDED

RXD[3:0] RXD[8:5]

RXD[7:4]

TSETUPT

THOLDT

TSETUPR

THOLDR

RXD[4]

RXDV

RXD[9]

RXERR

KSZ9031RNX

DS00002117F-page 59  2016-2017 Microchip Technology Inc.

The RGMII Version 2.0 Specification defines the RGMII data-to-clock skews only for 1000 Mbps operation, which uses

both clock edges for sampling the data and control signals at the 125 MHz clock frequency (8 ns period). For 10/100

Mbps operations, the data signals are sampled on the rising clock edge and the control signals are sampled on both

clock edges. With slower clock frequencies, 2.5 MHz (400 ns period) for 10 Mbps and 25 MHz (40 ns period) for

100 Mbps, the RGMII data-to-clock skews for 10/100 Mbps operations will have greater timing margins than for

1000 Mbps operation, and therefore can be relaxed from 2.6 ns (maximum) for 1000 Mbps to 160 ns (maximum) for

10 Mbps and 16 ns (maximum) for 100 Mbps.

 2016-2017 Microchip Technology Inc. DS00002117F-page 60

KSZ9031RNX

FIGURE 7-3: AUTO-NEGOTIATION FAST LINK PULSE (FLP) TIMING

The KSZ9031RNX Fast Link Pulse (FLP) burst-to-burst transmit timing for Auto-Negotiation defaults to 8 ms. IEEE

802.3 Standard specifies this timing to be 16 ms ±8 ms. Some PHY link partners need to receive the FLP with 16 ms

centered timing; otherwise, there can be intermittent link failures and long link-up times.

After KSZ9031RNX power-up/reset, program the following register sequence to set the FLP timing to 16 ms:

1. Write Register Dh = 0x0000 // Set up register address for MMD – Device Address 0h

2. Write Register Eh = 0x0004 // Select Register 4h of MMD – Device Address 0h

3. Write Register Dh = 0x4000 // Select register data for MMD – Device Address 0h, Register 4h

4. Write Register Eh = 0x0006 // Write value 0x0006 to MMD – Device Address 0h, Register 4h

5. Write Register Dh = 0x0000 // Set up register address for MMD – Device Address 0h

6. Write Register Eh = 0x0003 // Select Register 3h of MMD – Device Address 0h

7. Write Register Dh = 0x4000 // Select register data for MMD – Device Address 0h, Register 3h

8. Write Register Eh = 0x1A80 // Write value 0x1A80 to MMD – Device Address 0h, Register 3h

9. Write Register 0h, Bit [9] = 1 // Restart Auto-Negotiation

The above setting for 16 ms FLP transmit timing is compatible with all PHY link partners.

TABLE 7-2: AUTO-NEGOTIATION FAST LINK PULSE (FLP) TIMING PARAMETERS

Timing

Parameter Description Min. Typ. Max. Units

tBTB FLP burst to FLP burst 8 16 24 ms

tFLPW FLP burst width — 2 —

tPW Clock/Data pulse width — 100 — ns

tCTD Clock pulse to data pulse 55.5 64 69.5 µs

tCTC Clock pulse to clock pulse 111 128 139

— Number of clock/data pulses per FLP burst 17 — 33 —

KSZ9031RNX

DS00002117F-page 61  2016-2017 Microchip Technology Inc.

FIGURE 7-4: MDC/MDIO TIMING

The typical MDC clock frequency is 2.5 MHz (400 ns clock period).

The KSZ9031RNX can operate with MDC clock frequencies generated from bit banging with GPIO pin in the 10s/100s

of Hertz and have been tested up to a MDC clock frequency of 8.33 MHz (120 ns clock period). Test condition for

8.33 MHz is for one KSZ9031RNX PHY on the MDIO line with a 1.0 k pull-up to the DVDDH supply rail.

TABLE 7-3: MDC/MDIO TIMING PARAMETERS

Timing

Parameter Description Min. Typ. Max. Units

tPMDC period 120 400 —

tMD1 MDIO (PHY input) setup to rising edge of MDC 10 — —

tMD2 MDIO (PHY input) hold from rising edge of MDC 10 — —

tMD3 MDIO (PHY output) delay from rising edge of MDC 0 — —

 2016-2017 Microchip Technology Inc. DS00002117F-page 62

KSZ9031RNX

FIGURE 7-5: POWER-UP/POWER-DOWN/RESET TIMING

Note 1: The recommended power-up sequence is to have the transceiver (AVDDH) and digital I/O (DVDDH) voltages

power up before the 1.2V core (DVDDL, AVDDL, AVDDL_PLL) voltage. If the 1.2V core must power up first, the maxi-

mum lead time for the 1.2V core voltage with respect to the transceiver and digital I/O voltages should be 200 µs.

There is no power sequence requirement between transceiver (AVDDH) and digital I/O (DVDDH) power rails.

The power-up waveforms should be monotonic for all supply voltages to the KSZ9031RNX.

Note 2: After the de-assertion of reset, wait a minimum of 100 µs before starting programming on the MIIM (MDC/MDIO)

interface.

Note 3: The recommended power-down sequence is to have the 1.2V core voltage power-down before powering down

the transceiver and digital I/O voltages.

Before the next power-up cycle, all supply voltages to the KSZ9031RNX should reach less than 0.4V and there should

be a minimum wait time of 150 ms from power-off to power-on.

TABLE 7-4: POWER-UP/POWER-DOWN/RESET TIMING PARAMETERS

Timing

Parameter Description Min. Typ. Max. Units

tVR Supply voltages rise time (must be monotonic) 200 — — µs

tSR Stable supply voltages to de-assertion of reset 10 — — ms

tCS Strap-in pin configuration setup time 5 — —

nstCH Strap-in pin configuration hold time 5 — —

tRC De-assertion of reset to strap-in pin output 6 — —

tPC Supply voltages cycle off-to-on time 150 — — ms

SUPPLY

VOLTAGES

RESET_N

STRAP-IN

VALUE

STRAP-IN /

OUTPUT PIN

CORE (DVDDL, AVDDL, AVDDL_PLL)

TRANSCEIVER (AVDDH), DIGITAL I/Os (DVDDH)

NOTE

KSZ9031RNX

DS00002117F-page 63  2016-2017 Microchip Technology Inc.

8.0 RESET CIRCUIT

The following are some reset circuit suggestions.

Figure 8-1 illustrates the reset circuit for powering up the KSZ9031RNX if reset is triggered by the power supply.

FIGURE 8-1: RESET CIRCUIT IF TRIGGERED BY THE POWER SUPPLY

Figure 8-2 illustrates the reset circuit for applications where reset is driven by another device (for example, the CPU or

an FPGA). At power-on-reset, R, C, and D1 provide the monotonic rise time to reset the KSZ9031RNX device. The

RST_OUT_N from the CPU/FPGA provides the warm reset after power-up.

The KSZ9031RNX and CPU/FPGA references the same digital I/O voltage (DVDDH).

FIGURE 8-2: RECOMMENDED RESET CIRCUIT FOR CPU/FPGA RESET OUTPUT

Figure 8-3 illustrates the reset circuit with an MIC826 voltage supervisor driving the KSZ9031RNX reset input.

DVDDH

D1: 1N4148

D1 R 10K

KSZ9031RNX

RESET_N

C 10µF

DVDDH

KSZ9031RNX D1 R 10K

RESET_N

C 10µF

CPU/FPGA

RST_OUT_N

D1, D2: 1N4148

 2016-2017 Microchip Technology Inc. DS00002117F-page 64

KSZ9031RNX

FIGURE 8-3: RESET CIRCUIT WITH MIC826 VOLTAGE SUPERVISOR

KSZ9031RNX MIC826

Part

Number

RESET#

Reset

Threshold

DVDDH = 3.3V, 2.5V, or 1.8V

RESET_N

DVDDHDVDDH

MIC826TYMT / 3.075V

MIC826ZYMT / 2.315V

MIC826WYMT / 1.665V

KSZ9031RNX

DS00002117F-page 65  2016-2017 Microchip Technology Inc.

9.0 REFERENCE CIRCUITS — LED STRAP-IN PINS

The pull-up and pull-down reference circuits for the LED2/PHYAD1 and LED1/PHYAD0 strapping pins are shown in

Figure 9-1 for 3.3V and 2.5V DVDDH.

FIGURE 9-1: REFERENCE CIRCUITS FOR LED STRAPPING PINS

For 1.8V DVDDH, LED indication support requires voltage level shifters between LED[2:1] pins and LED indicator

diodes to ensure the multiplexed PHYAD[1:0] strapping pins are latched in high/low correctly. If LED indicator diodes

are not implemented, the PHYAD[1:0] strapping pins just need 10 k pull-up to 1.8V DVDDH for a value of 1, and 1.0 k

pull-down to ground for a value of 0.

LED PIN

220Ω

10kΩ

PULL-UP

KSZ9031RNX

220Ω

PULL-DOWN

KSZ9031RNX

LED PIN

DVDDH = 3.3V, 2.5V

1k Ω

 2016-2017 Microchip Technology Inc. DS00002117F-page 66

KSZ9031RNX

10.0 REFERENCE CLOCK - CONNECTION AND SELECTION

A crystal or external clock source, such as an oscillator, is used to provide the reference clock for the KSZ9031RNX.

The reference clock is 25 MHz for all operating modes of the KSZ9031RNX.

The KSZ9031RNX uses the AVDDH supply, analog 3.3V (or analog 2.5V option for commercial temperature only), for

the crystal/clock pins (XI, XO). If the 25 MHz reference clock is provided externally, the XI input pin should have a min-

imum clock voltage peak-to-peak (VPP) swing of 2.5V reference to ground. If VPP is less than 2.5V, series capacitive

coupling is recommended. With capacitive coupling, the VPP swing can be down to 1.5V. Maximum VPP swing is 3.3V

+5%.

Figure 10-1 and Table 10-1 show the reference clock connection to XI and XO of the KSZ9031RNX, and the reference

clock selection criteria.

FIGURE 10-1: 25 MHZ CRYSTAL/OSCILLATOR REFERENCE CLOCK CONNECTION

11.0 ON-CHIP LDO CONTROLLER - MOSFET SELECTION

If the optional LDO controller is used to generate 1.2V for the core voltage, the selected MOSFET should exceed the

following minimum requirements:

• P-channel

• 500 mA (continuous current)

• 3.3V or 2.5V (source – input voltage)

• 1.2V (drain – output voltage)

•V

GS in the range of:

- (–1.2V to –1.5V) @ 500 mA for 3.3V source voltage

- (–1.0V to –1.1V) @ 500 mA for 2.5V source voltage

The VGS for the MOSFET needs to be operating in the constant current saturated region, and not towards the VGS(th),

the threshold voltage for the cut-off region of the MOSFET.

See Table 6-11 for LDO controller output driving range to the gate input of the MOSFET.

Refer to application note ANLAN206 – KSZ9031 Gigabit PHY Optimized Power Scheme for High Efficiency, Low-Power

Consumption and Dissipation as a design reference.

TABLE 10-1: 25 MHZ CRYSTAL/REFERENCE CLOCK SELECTION CRITERIA

Characteristics Value

Frequency 25 MHz

Frequency Tolerance (max.) ±50 ppm

Crystal Series Resistance (typ.) 40

Total Period Jitter (peak-to-peak) <100 ps

22pF

25 MHz XTAL

±50PPM

25 MHz OSC

±50PPM

KSZ9031RNX

DS00002117F-page 67  2016-2017 Microchip Technology Inc.

12.0 MAGNETIC - CONNECTION AND SELECTION

A 1:1 isolation transformer is required at the line interface. Use one with integrated common-mode chokes for designs

exceeding FCC requirements. An optional auto-transformer stage following the chokes provides additional common-

mode noise and signal attenuation.

The KSZ9031RNX design incorporates voltage-mode transmit drivers and on-chip terminations.

With the voltage-mode implementation, the transmit drivers supply the common-mode voltages to the four differential

pairs. Therefore, the four transformer center tap pins on the KSZ9031RNX side should not be connected to any power

supply source on the board; rather, the center tap pins should be separated from one another and connected through

separate 0.1 µF common-mode capacitors to ground. Separation is required because the common-mode voltage could

be different between the four differential pairs, depending on the connected speed mode.

Figure 12-1 shows the typical gigabit magnetic interface circuit for the KSZ9031RNX.

FIGURE 12-1: TYPICAL GIGABIT MAGNETIC INTERFACE CIRCUIT

Table 12-1 lists recommended magnetic characteristics.

Table 12-2 is a list of compatible single-port magnetics with separated transformer center tap pins on the G-PHY chip

side that can be used with the KSZ9031RNX.

TABLE 12-1: MAGNETICS SELECTION CRITERIA

Parameter Value Test Conditions

Turns Ratio 1 CT : 1 CT —

Open-Circuit Inductance (min.) 350 µH 100 mV, 100 kHz, 8 mA

Insertion Loss (max.) 1.0 dB 0 MHz to 100 MHz

HIPOT (min.) 1500 VRMS —

TABLE 12-2: COMPATIBLE SINGLE-PORT 10/100/1000 MAGNETICS

Manufacturer Part Number Auto-Transformer Temperature Range Magnetic + RJ-45

Bel Fuse 0826-1G1T-23-F Yes 0°C to 70°C Yes

HALO TG1G-E001NZRL No –40°C to 85°C No

4x75 Ω

1000 pF / 2kV

45 CONNECTOR

CHASSIS GROUND

(4 x 0.1µF)

TXRXP_A

TXRXM_A

KSZ9031RNX

SIGNAL GROUND

TXRXP_B

TXRXM_B

TXRXP_C

TXRXM_C

TXRXP_D

TXRXM_D

 2016-2017 Microchip Technology Inc. DS00002117F-page 68

KSZ9031RNX

HALO TG1G-S001NZRL No 0°C to 70°C No

HALO TG1G-S002NZRL Yes 0°C to 70°C No

Pulse H5007NL Yes 0°C to 70°C No

Pulse H5062NL Yes 0°C to 70°C No

Pulse HX5008NL Yes –40°C to 85°C No

Pulse JK0654219NL Yes 0°C to 70°C Yes

Pulse JK0-0136NL No 0°C to 70°C Yes

TDK TLA-7T101LF No 0°C to 70°C No

Wurth/Midcom 000-7093-37R-LF1 Yes 0°C to 70°C No

TABLE 12-2: COMPATIBLE SINGLE-PORT 10/100/1000 MAGNETICS (CONTINUED)

Manufacturer Part Number Auto-Transformer Temperature Range Magnetic + RJ-45

 2016-2017 Microchip Technology Inc. DS00002117F-page 69

KSZ9031RNX

13.0 PACKAGE OUTLINES

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

FIGURE 13-1: 48-LEAD QFN 7 MM X 7 MM PACKAGE WITH 3.5 MM X 3.5 MM EXPOSED PAD

AREA

KSZ9031RNX

DS00002117F-page 70  2016-2017 Microchip Technology Inc.

FIGURE 13-2: 48-LEAD QFN 7 MM X 7 MM PACKAGE WITH 5.1 MM X 5.1 MM EXPOSED PAD

AREA

TITLE

48 LEAD QFN 7x7mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN

DRAWING # QFN77-48LD-PL-1 UNIT MM

NOTE:

1. MAX PACKAGE WARPAGE IS 0.05mm.

2. MAX ALLOWABLE BURR IS 0.076mm IN ALL DIRECTIONS.

3. PIN #1 IS ON TOP WILL BE LASER MARKED.

4. RED CIRCLE IN LAND PATTERN INDICATES THERMAL VIA. SIZE SHOULD BE 0.30-0.35mm IN DIAMETER AND SHOULD BE

CONNECTED TO GND FOR MAX THERMAL PERFORMANCE. PITCH is 1.00mm.

5. GREEN RECTANGLES (SHADED AREA) REPRESENT SOLDER STENCIL OPENING ON EXPOSED PAD AREA. RECOMMENDED SIZE

IS 1.00x1.00mm, SPACING IS 0.25mm.

NOTE: 1, 2, 3

0.25±0.05

5.50

Ref.

0.50 Bsc

0.40±0.05

PIN #1 ID

CHAMFER 0.35x45°

7.00±0.05

Top View

NOTE: 1, 2, 3

Bottom View

0.85±0.05

0.253 (REF)

0.00-0.05

NOTE: 1, 2, 3

Side View

5.10±0.05

Exp.DAP

5.10±0.05

Exp.DAP

 2016-2017 Microchip Technology Inc. DS00002117F-page 71

KSZ9031RNX

FIGURE 13-3: 48-LEAD QFN 7 MM X 7 MM PACKAGE WITH 5.1 MM X 5.1 MM EXPOSED PAD

AREA RECOMMENDED LAND PATTERN

POD-Land Pattern drawing #: QFN77-48LD-PL-1-C

KSZ9031RNX

DS00002117F-page 72  2016-2017 Microchip Technology Inc.

FIGURE 13-4: 48-LEAD VQFN 7 MM X 7 MM PACKAGE (WETTABLE FLANK) WITH 5.05 MM X

5.05 MM EXPOSED PAD AREA

 2016-2017 Microchip Technology Inc. DS00002117F-page 73

KSZ9031RNX

FIGURE 13-5: 48-LEAD VQFN 7 MM X 7 MM PACKAGE (WETTABLE FLANK) WITH 5.05 MM X

5.05 MM EXPOSED PAD AREA RECOMMENDED LAND PATTERN

 2016-2017 Microchip Technology Inc. DS00002117F-page 74

KSZ9031RNX

APPENDIX A: DATA SHEET REVISION HISTORY

TABLE A-1: REVISION HISTORY

Revision Section/Figure/Entry Correction

DS00002117F (06-02-17) Table 2-1, "Signals -

KSZ9031RNX"

Added the following note to pin description for pin

43:

Note: This pin should never be driven externally.

DS00002117E (05-26-17) Product Identification System - Added “wettable flank lead frame” after VQFN for

automotive grade ordering examples e through l.

- Modified “automotive temperature” to automotive

grade 3 temperature” for ordering example e.

- Modified “automotive extended temperature” to

“automotive grade 2 temperature” for ordering

example f.

- In note 1, replaced “module #8” with “module

#11”.

Section 13.0 “Package Out-

lines”

Updated figure titles in Figure 13-4 and Figure 13-

Features on page 1 Updated ordering of bulleted list. Corrections to

part numbers in AEC-Q100 Grade 3 and Grade 2

part numbering.

Target Applications on page 1 Added Industrial Control. Removed Media Con-

verter.

Section 1.1, "General Descrip-

tion," on page 4

Modified description to refer to KSZ9031RNXUA/

UB and KSZ9031RNXVA/VB as the automotive

part names.

Section 5.2, "Operating Rat-

ings**," on page 52

Modified ratings to refer to KSZ9031RNXUA/UB

and KSZ9031RNXVA/VB as the automotive part

names.

FIGURE 13-4: 48-Lead VQFN

7 mm x 7 mm PackagE (wet-

table flank) with 5.05 mm x

5.05 mm Exposed Pad Area

on page 72 and FIGURE 13-5:

48-Lead VQFN 7 mm x 7 mm

Package (wettable flank) with

5.05 mm x 5.05 mm Exposed

Pad Area Recommended

Land Pattern on page 73

New package drawings to that change WQFN to

VQFN.

Product Identification System

on page 77

Corrections to PIS ordering code matrix.

KSZ9031RNX

DS00002117F-page 75  2016-2017 Microchip Technology Inc.

DS00002117D (01-05-17) All Sales listing and cover pages updated. Minor text

changes throughout.

Features on page 1 Updated info for AEC-Q100 Qualified for Automo-

tive Applications.

Target Applications on page 1 Added Automotive In-Vehicle Networking.

Section 5.2, "Operating Rat-

ings**," on page 52

Updated maximum operating voltage for (DVDDL,

AVDDL, AVDDL_PLL).

DS00002117C (07-26-16) All Removed Energy Efficient Ethernet functionality.

DS00002117B (05-24-16) 10.0 Reference Clock -

Connection and Selection

Specified jitter for 25 MHz reference crystal/clock.

DS00002117A (03-14-16) Converted Micrel data sheet KSZ9031RNX to

Microchip DS00002117A. Minor text changes

throughout.

Wake-On-LAN – Customized

Packet, Expected CRC 1 and

CRC 2 Registers.

The “lower” and “upper” denotations for the two

bytes of expected CRC are swapped in the previ-

ous revision.

Product Identification

System

Specified exposed pad size area for packages.

Package Information Corrected information for copper wire part num-

bers (KSZ9031RNXCC, KSZ9031RNXIC) to 48-

pin (7 mm x 7 mm) QFN with (5.1 mm x 5.1 mm)

exposed pad area. This is a data sheet correction.

There is no change to the copper wire package.

TABLE A-1: REVISION HISTORY (CONTINUED)

Revision Section/Figure/Entry Correction

 2016-2017 Microchip Technology Inc. DS00002117F-page 76

KSZ9031RNX

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make

files and information easily available to customers. Accessible by using your favorite Internet browser, the web site

contains the following information:

•Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s

guides and hardware support documents, latest software releases and archived software

•General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion

groups, Microchip consultant program member listing

•Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of

seminars and events, listings of Microchip sales offices, distributors and factory representatives

CUSTOMER CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive

e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or

development tool of interest.

To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notifi-

cation” and follow the registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales

offices are also available to help customers. A listing of sales offices and locations is included in the back of this

document.

Technical support is available through the web site at: http://microchip.com/support

 2016-2017 Microchip Technology Inc. DS00002117F-page 77

KSZ9031RNX

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Device: KSZ9031

Interface: R= RGMII

Package: NX = 48-pin QFN or VQFN

Temperature: C= 0C to +70C (Commercial)

I= -40C to +85C (Industrial)

U= -40C to +85C (Automotive Grade 3)

V= -40C to +105C (Automotive Grade 2)

Bond Wire: A or B = Gold

C = Copper

Media Type: Blank = Standard packaging (tray)

TR = Tape and Reel(1)

Automotive

Option:

VAO = Automotive Option(1)

Examples:

a) KSZ9031RNXCA

RGMII Interface

48-pin QFN (Pb-Free, 3.5 mm x 3.5 mm ePad)

Commercial Temperature

Gold Wire Bonding

b) KSZ9031RNXCC

RGMII Interface

48-pin QFN (Pb-Free, 5.1 mm x 5.1 mm ePad)

Commercial Temperature

Copper Wire Bonding

c) KSZ9031RNXIA

RGMII Interface

48-pin QFN (Pb-Free, 3.5 mm x 3.5 mm ePad)

Industrial Temperature

Gold Wire Bonding

d) KSZ9031RNXIC

RGMII Interface

48-pin QFN (Pb-Free, 5.1 mm x 5.1 mm ePad)

Industrial Temperature

Copper Wire Bonding

e) KSZ9031RNXUA

RGMII Interface

48-pin VQFN wettable flank lead frame

(Pb-Free, 5.05 mm x 5.05 mm ePad)

Automotive Grade 3 Temperature

Gold Wire Bonding

f) KSZ9031RNXVA

RGMII Interface

48-pin VQFN wettable flank lead frame

(Pb-Free, 5.05 mm x 5.05 mm ePad)

Automotive Grade 2 Temperature

Gold Wire Bonding

g) KSZ9031RNXUA-TR

RGMII Interface

48-pin VQFN wettable flank lead frame

Automotive Grade 3 Temperature

Gold Wire Bonding

Tape and Reel packaging

h) KSZ9031RNXUB-TRVAO

RGMII Interface

48-pin VQFN wettable flank lead frame

Automotive Grade 3 Temperature

Gold Wire Bonding

Tape and Reel packaging

Automotive Option

i) KSZ9031RNXUB-VAO

RGMII Interface

48-pin VQFN wettable flank lead frame

Automotive Grade 3 Temperature

Gold Wire Bonding

Automotive Option

j) KSZ9031RNXVA-TR

RGMII Interface

48-pin VQFN wettable flank lead frame

Automotive Grade 2 Temperature

Gold Wire Bonding

Tape and Reel packaging

k) KSZ9031RNXVB-TRVAO

RGMII Interface

48-pin VQFN wettable flank lead frame

Automotive Grade 2 Temperature

Gold Wire Bonding

Tape and Reel

Automotive Option

l) KSZ9031RNXVB-VAO

RGMII Interface

48-pin VQFN wettable flank lead frame

Automotive Grade 2 Temperature

Gold Wire Bonding

Automotive Option

PART NO. XXX

PackageInterface

Device

Temp.

XXX

Media

Type

XXX

Automotive

Option

Note 1: KSZ9031RNXUB and KSZ9031RNXVB corrects an erratum in the respective

KSZ9031RNXUA and KSZ9031RNXVA (see Module #11 in the

KSZ9031RNX errata document). KSZ9031RNXUB and KSZ9031RNXVB is

recommended for all new designs and is a 100% functional and pin equivalent

replacement for KSZ9031RNXUA and KSZ9031RNXVA, respectively.

Wire

Bond

 2016-2017 Microchip Technology Inc. DS00002117F-page 78

KSZ9031RNX

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be

superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO

REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,

MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Micro-

chip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold

harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or

otherwise, under any Microchip intellectual property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF,

dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR,

MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC,

SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and

other countries.

ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision

Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard,

CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,

EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench,

MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,

PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher,

SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other

countries.

All other trademarks mentioned herein are property of their respective companies.

ISBN: 9781522417729

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

QUALITYMANAGEMENTS

YSTEM

CERTIFIEDBYDNV

== ISO/TS16949==

 2016-2017 Microchip Technology Inc. DS00002117F-page 79

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11/07/16