74HCU04 Hex inverter Rev. 5 -- 6 August 2012 Product data sheet 1. General description The 74HCU04 is high-speed Si-gate CMOS devices and is pin compatible with low power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7A. The 74HCU04 is a general purpose hex inverter. Each of the six inverters is a single stage. 2. Features and benefits Balanced propagation delays ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V Multiple package options Specified from 40 C to +125 C 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version SOT27-1 74HCU04N 40 C to +125 C DIP14 plastic dual in-line package; 14 leads (300 mil) 74HCU04D 40 C to +125 C SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 74HCU04DB 40 C to +125 C SSOP14 plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1 74HCU04PW 40 C to +125 C TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 74HCU04BQ 40 C to +125 C DHVQFN14 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 3 0.85 mm SOT762-1 74HCU04 NXP Semiconductors Hex inverter 4. Functional diagram 1 1 1 1A 1Y 2 3 2A 2Y 4 1 3 3A 3Y 6 9 4A 4Y 8 11 5A 5Y 10 13 6A 6Y 12 6 1 9 8 1 11 10 1 13 12 A Y mna045 mna343 mna342 Fig 1. 4 1 5 5 2 Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram (one inverter) 5. Pinning information 1 1A terminal 1 index area 74HCU04 14 VCC 74HCU04 1Y 2 13 6A 1A 1 14 VCC 2A 3 12 6Y 1Y 2 13 6A 2Y 4 2A 3 12 6Y 3A 5 2Y 4 11 5A 3A 5 10 5Y 3Y 6 3Y 6 9 4A GND 7 8 4Y 11 5A VCC (1) 10 5Y 7 8 GND 4Y 9 4A 001aal925 Transparent top view 001aal924 (1) The die substrate is attached to the exposed die pad using conductive die attach material. It cannot be used as a supply pin or input. Fig 4. Pin configuration DIP14, SO14 and (T)SSOP14 74HCU04 Product data sheet Fig 5. Pin configuration DHVQFN14 All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 2 of 18 74HCU04 NXP Semiconductors Hex inverter 5.1 Pin description Table 2. Pin description Symbol Pin Description 1A 1 data input 1Y 2 data output 2A 3 data input 2Y 4 data output 3A 5 data input 3Y 6 data output GND 7 ground (0 V) 4Y 8 data output 4A 9 data input 5Y 10 data output 5A 11 data input 6Y 12 data output 6A 13 data input VCC 14 supply voltage 6. Functional description Table 3. Function table H = HIGH voltage level; L = LOW voltage level Input Output nA nY L H H L 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC supply voltage IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V IO output current 0.5 V < VO < VCC + 0.5 V - 25 mA ICC supply current - 50 mA IGND ground current 50 - mA Tstg storage temperature 65 +150 C DIP14 package - 750 mW SO14, (T)SSOP14 and DHVQFN14 packages - 500 mW Ptot Conditions Product data sheet Max Unit 0.5 +7.0 V [1] - 20 mA [1] - 50 mA [2] total power dissipation 74HCU04 Min All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 3 of 18 74HCU04 NXP Semiconductors Hex inverter [1] [2] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For DIP14 package: Ptot derates linearly with 12 mW/K above 70 C. For SO14 package: Ptot derates linearly with 8 mW/K above 70 C. For (T)SSOP14 packages: Ptot derates linearly with 5.5 mW/K above 60 C. For DHVQFN14 packages: Ptot derates linearly with 4.5 mW/K above 60 C. 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit VCC supply voltage 2.0 5.0 6.0 V VI input voltage 0 - VCC V VO output voltage 0 - VCC V Tamb ambient temperature 40 +25 +125 C 9. Static characteristics Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 C Conditions Min VIH VIL VOH HIGH-level input voltage 40 C to +85 C Max Min 40 C to +125 C Unit Max Min Max VCC = 2.0 V 1.7 1.4 - 1.7 - 1.7 - V VCC = 3.0 V 3.6 2.6 - 3.6 - 3.6 - V VCC = 5.5 V 4.8 3.4 - 4.8 - 4.8 - V VCC = 2.0 V - 0.6 0.3 - 0.3 - 0.3 V VCC = 3.0 V - 1.9 0.9 - 0.9 - 0.9 V VCC = 5.5 V - 2.6 1.2 - 1.2 - 1.2 V HIGH-level VI = VIH or VIL output voltage IO = 20 A; VCC = 2.0 V 1.8 2.0 - 1.8 - 1.8 - V IO = 20 A; VCC = 4.5 V 4.0 4.5 - 4.0 - 4.0 - V 4.32 - 3.84 - 3.7 - V LOW-level input voltage IO = 4.0 mA; VCC = 4.5 V 3.98 IO = 20 A; VCC = 6.0 V 5.5 IO = 5.2 mA; VCC = 6.0 V 5.48 VOL Typ LOW-level VI = VIH or VIL output voltage IO = 20 A; VCC = 2.0 V 74HCU04 Product data sheet - 6.0 - 5.5 - 5.5 - V 5.81 - 5.34 - 5.2 - V 0 0.2 - 0.2 - 0.2 V IO = 20 A; VCC = 4.5 V - 0 0.5 - 0.5 - 0.5 V IO = 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V IO = 20 A; VCC = 6.0 V - 0 0.5 - 0.5 - 0.5 V IO = 5.2 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 4 of 18 74HCU04 NXP Semiconductors Hex inverter Table 6. Static characteristics ...continued Voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 C Conditions VI = VCC or GND; VCC = 6.0 V 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max - - 0.1 - 1.0 - 1.0 A II input leakage current ICC supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 2 - 20 - 20 A CI input capacitance - 3.5 - - - - - pF 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 7. Symbol Parameter propagation delay tpd 25 C Conditions Typ Max Max Max VCC = 2.0 V; CL = 50 pF 19 70 90 105 ns VCC = 4.5 V; CL = 50 pF 7 14 18 21 ns VCC = 5.0 V; CL = 15 pF 5 - - - ns 6 12 15 18 ns VCC = 2.0 V; CL = 50 pF 19 75 95 110 ns VCC = 4.5 V; CL = 50 pF 7 15 19 22 ns 6 13 16 19 ns 10 - nA to nY; see Figure 6 [2] see Figure 6 VCC = 6.0 V; CL = 50 pF power dissipation capacitance CPD [1] tpd is the same as tPHL, tPLH. [2] tt is the same as tTHL, tTLH. [3] 40 C to Unit +125 C [1] VCC = 6.0 V; CL = 50 pF transition time tt 40 C to +85 C per inverter; VI = GND to VCC [3] pF CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs. 74HCU04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 5 of 18 74HCU04 NXP Semiconductors Hex inverter 11. Waveforms VI VM nA input VM GND t PHL t PLH VOH VCC 90 % PULSE GENERATOR VM VM nY output 10 % VOL VI VO DUT CL 50 pF RT t THL t TLH mna034 mna722 VM = 0.5 VCC; VI = GND to VCC. Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 6. The input (nA) to output (nY) propagation delay times Fig 7. Load circuit for switching times 12. Typical transfer characteristics 001aal928 2.4 (1) VO (V) ID (mA) 001aal927 6 1.2 VO (V) ID (mA) (1) 1.6 0.8 4 16 0.8 0.4 2 8 (2) (2) 0 0 0.8 0 0 2.4 1.6 0 0 2 VI (V) VCC = 2.0 V; IO = 0 A 74HCU04 Product data sheet 4 6 VI (V) Tamb = 25 C. Fig 8. 24 Tamb = 25 C. Fig 9. VCC = 4.5 V; IO = 0 A All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 6 of 18 74HCU04 NXP Semiconductors Hex inverter 001aal926 6 60 (1) VO (V) ID (mA) 4 40 Rbias = 560 k VCC 2 20 0.47 F (2) 0 2 4 output VI (f = 1 kHz) 0 0 input 100 F A IO GND 6 VI (V) mna050 Tamb = 25 C. I g fs = --------oV i fi = 1 kHz at VO is constant Fig 10. VCC = 6.0 V; IO = 0 A Fig 11. Test set-up for measuring forward transconductance mna355 40 g fs (mA/V) 30 20 10 0 0 2 4 VCC (V) 6 Tamb = 25 C. Fig 12. Typical forward transconductance as a function of the supply voltage 74HCU04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 7 of 18 74HCU04 NXP Semiconductors Hex inverter 13. Application information Some applications are: * Linear amplifier (see Figure 13) * Crystal oscillator design (see Figure 14) * Astable multivibrator (see Figure 15) Remark: All values given are typical unless otherwise specified. R2 R1 VCC 1 F R2 R1 U04 U04 C1 ZL C2 out mna052 mna053 Maximum Vo(p-p) = VCC 2.0 V centered at 0.5 VCC. C1 = 47 pF (typical) G ol G v = - --------------------------------------R1 1 + ------- 1 + G ol R2 C2 = 33 pF (typical) R1 = 1 M to 10 M (typical R2 optimum value depends on the frequency and required stability against changes in VCC or average minimum ICC. ICC is typically 5 mA at VCC = 5 V and fi = 10 MHz. Gol = open loop gain Gv = voltage gain R1 3 k, R2 1 M ZL > 10 k; Gol = 20 (typical) VCC = 6.0 V Typical unity gain bandwidth product is 5 MHz. Fig 13. Used as a linear amplifier Fig 14. Crystal oscillator configuration Table 8. External components for resonator (f < 1 MHz) All values given are typical and must be used as an initial set-up. Frequency R1 R2 C1 C2 10 kHz to 15.9 kHz 22 M 220 k 56 pF 20 pF 16 kHz to 24.9 kHz 22 M 220 k 56 pF 10 pF 25 kHz to 54.9 kHz 22 M 100 k 56 pF 10 pF 55 kHz to 129.9 kHz 22 M 100 k 47 pF 5 pF 130 kHz to 199.9 kHz 22 M 47 k 47 pF 5 pF 200 kHz to 349.9 kHz 10 M 47 k 47 pF 5 pF 350 kHz to 600 kHz 10 M 47 k 47 pF 5 pF 74HCU04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 8 of 18 74HCU04 NXP Semiconductors Hex inverter Table 9. Optimum value for R2 Frequency R2 Optimum for 3 kHz 2.0 k minimum required ICC 8.0 k minimum influence due to change in VCC 6 kHz 1.0 k minimum required ICC 4.7 k minimum influence by VCC 0.5 k minimum required ICC 10 kHz 14 kHz >14 kHz 2.0 k minimum influence by VCC 0.5 k minimum required ICC 1.0 k minimum influence by VCC - replace R2 by C3 with a typical value of 35 pF 001aal930 80 input capacitance (pF) (1) 60 (2) (3) U04 40 U04 (4) (5) RS R C 20 001aah115 0 0 2 4 6 8 VI (V) VCC = 2.0 V 1 1 f = --- --------------T 2.2RC VCC = 3.0 V RS 2 R VCC = 4.0 V The average ICC (mA) is approximately 3.5 + 0.05 f (MHz) C (pF) at VCC = 5.0 V. VCC = 6.0 V VCC = 5.0 V Tamb = 25 C. Fig 15. Astable multivibrator 74HCU04 Product data sheet Fig 16. Input capacitance as function of input voltage All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 9 of 18 74HCU04 NXP Semiconductors Hex inverter 14. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.2 inches 0.17 0.02 0.13 0.068 0.044 0.021 0.015 0.014 0.009 0.77 0.73 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT27-1 050G04 MO-001 SC-501-14 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Fig 17. Package outline SOT27-1 (DIP14) 74HCU04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 10 of 18 74HCU04 NXP Semiconductors Hex inverter SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.010 0.057 inches 0.069 0.004 0.049 0.05 0.244 0.039 0.041 0.228 0.016 0.028 0.024 0.01 0.01 0.028 0.004 0.012 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 18. Package outline SOT108-1 (SO14) 74HCU04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 11 of 18 74HCU04 NXP Semiconductors Hex inverter SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index Lp L 7 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.4 0.9 8o o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT337-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 Fig 19. Package outline SOT337-1 (SSOP14) 74HCU04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 12 of 18 74HCU04 NXP Semiconductors Hex inverter TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 E D A X c y HE v M A Z 8 14 Q (A 3) A2 A A1 pin 1 index Lp L 1 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.72 0.38 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 MO-153 Fig 20. Package outline SOT402-1 (TSSOP14) 74HCU04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 13 of 18 74HCU04 NXP Semiconductors Hex inverter DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 6 y y1 C v M C A B w M C b L 1 7 Eh e 14 8 13 9 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.30 0.18 c D (1) Dh E (1) Eh 0.2 3.1 2.9 1.65 1.35 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 2 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT762-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 21. Package outline SOT762-1 (DHVQFN14) 74HCU04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 14 of 18 74HCU04 NXP Semiconductors Hex inverter 15. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor LSTTL Low-power Schottky Transistor-Transistor Logic ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model CDM Charge Device Model TTL Transistor-Transistor Logic 16. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HCU04 v.5 20120806 Product data sheet - 74HCU04 v.4 Modifications: 74HCU04 v.4 Modifications: * Measurement points added to figure 6 (errata). 20111212 * Product data sheet - 74HCU04 v.3 Legal pages updated. 74HCU04 v.3 20100916 Product data sheet - 74HCU04_CNV v.2 74HCU04_CNV v.2 19970826 Product specification - - 74HCU04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 15 of 18 74HCU04 NXP Semiconductors Hex inverter 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 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In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 17.3 Disclaimers Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. 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This document supersedes and replaces all information supplied prior to the publication hereof. 74HCU04 Product data sheet Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 16 of 18 74HCU04 NXP Semiconductors Hex inverter Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. Translations -- A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74HCU04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 6 August 2012 (c) NXP B.V. 2012. All rights reserved. 17 of 18 74HCU04 NXP Semiconductors Hex inverter 19. Contents 1 2 3 4 5 5.1 6 7 8 9 10 11 12 13 14 15 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Typical transfer characteristics . . . . . . . . . . . . 6 Application information. . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 August 2012 Document identifier: 74HCU04