MIC5801YV TR - MICROCHIP TECHNOLOGY

 2019 Microchip Technology Inc. DS20006184A-page 1

MIC5800/1

Features

• 4.4 MHz Minimum Data Input Rate

• High-Voltage, High-Current Sink Outputs

• Output Transient Protection

• CMOS, PMOS, NMOS, and TTL Compatible

Inputs

• Internal Pull-Down Resistors

• Low-Power CMOS Latches

General Description

The MIC5800 and MIC5801 latched drivers are

high-voltage, high-current integrated circuits

comprised of four or eight CMOS data latches, a

bipolar Darlington transistor driver for each latch, and

CMOS control circuitry for the common CLEAR,

STROBE, and OUTPUT ENABLE functions.

The bipolar/MOS combination provides an extremely

low-power latch with maximum interface flexibility.

MIC5800 contains four latched drivers; MIC5801

contains eight latched drivers.

Data input rates are greatly improved in these devices.

With a 5V supply, they will typically operate at better

than 5 MHz. With a 12V supply, significantly higher

speeds are obtained. The CMOS inputs are compatible

with standard CMOS, PMOS, and NMOS circuits. TTL

or DTL circuits may require the use of appropriate

pull-up resistors. The bipolar outputs are suitable for

use with relays, solenoids, stepping motors, LED or

incandescent displays, and other high-power loads.

Both units have open-collector outputs and integral

diodes for inductive load transient suppression. The

output transistors are capable of sinking 500 mA and

will sustain at least 50V in the OFF state. Because of

limitations on package power dissipation, the

simultaneous operation of all drivers at maximum rated

current can only be accomplished by a reduction in

duty cycle. Outputs may be connected in parallel for

higher load current capability.

Package Types

MIC5800YM

14-Lead SOIC (M)

(Top View)

MIC5801YWM

24-Lead SOIC (WM)

(Top View)

MIC5801YV

28-Lead PLCC (V)

(Top View)

COMGND

LATCHES

CLEAR OE

STROBE VDD

IN1 OUT1

IN2 OUT2

IN3 OUT3

IN4 OUT4

10 15

11 14

12 13

OE VDD

CLEAR

OUT1

IN1

STROBE

OUT2

IN2 OUT3

IN3 OUT4

IN4 OUT5

IN5 OUT6

IN6 OUT7

IN7 OUT8

IN8 NC

GND COM

IN1

OUT224

IN2

OUT323

IN3

OUT422

IN4

OUT521

IN5

OUT620

IN6

OUT719

CLEAR

OUT125

12 13 14 15 16 17 18

4 3 2 1 28 27 26

VDD

STROBE

GND

COM

OUT8

IN8

IN7

LATCHES

4/8-Bit Parallel-Input Latched Drivers

MIC5800/1

DS20006184A-page 2  2019 Microchip Technology Inc.

Typical Application Circuit

Functional Block Diagram

114

VDD

OUT1

OUT2

OUT3

OUT4

IN4

IN3

IN2

IN1

STROBE

CLEAR

LATCHES

μP

0.1μF

+30V

0.1μF

+30V

STEPPER

MOTOR

OUTPUT ENABLE

VDD

INn

STROBE

CLEAR

OUTPUT

ENABLE COMMON MOS

CONTROL

TYPICAL MOS

LATCH

TYPICAL BIPOLAR

DRIVER

GND

OUTn

COMMON

 2019 Microchip Technology Inc. DS20006184A-page 3

MIC5800/1

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

Output Voltage (VCE) ................................................................................................................................................+50V

Supply Voltage (VDD) ................................................................................................................................................+15V

Input Voltage Range (VIN).................................................................................................................–0.3V to VDD + 0.3V

Continuous Collector Current (IC) .........................................................................................................................500 mA

ESD Rating (Note 1) .................................................................................................................................. ESD Sensitive

Operating Ratings ††

Package Power Dissipation (PD)

MIC5800 SOIC..........................................................................................................................................................1.0W

Derate above TA = +25°C ................................................................................................................................8.5 mW/°C

MIC5801 PLCC.......................................................................................................................................................2.25W

Derate above TA = +25°C ..............................................................................................................................18.2 mW/°C

MIC5801 Wide SOIC ................................................................................................................................................1.4W

Derate above TA = +25°C ................................................................................................................................. 11 mW/°C

† Notice: Exceeding the absolute maximum ratings may damage the device.

†† Notice: The device is not guaranteed to function outside its operating ratings.

Note 1: Microchip CMOS devices have input-static protection, but are susceptible to damage when exposed to

extremely high static electrical charges.

ELECTRICAL CHARACTERISTICS

Electrical Characteristics: VDD = 5V, TA = +25°C, VA ≤ +85°C unless otherwise noted. Note 1

Parameter Sym. Min. Typ. Max. Units Conditions

Output Leakage Current ICEX

——50

µA VCE = 50V, TA = +25°C

— — 100 VCE = 50V, TA = +70°C

Collector-Emitter

Saturation Voltage VCE(SAT)

—0.91.1

IC = 100 mA

—1.11.3 I

C = 200 mA

—1.31.6 I

C = 350 mA, VDD = 7.0V

Input Voltage (Low) VIN(0) ——1.0V—

Input Voltage (High) VIN(1)

10.5 — —

VDD = 12V

8.5 — — VDD = 10V

3.5 — — VDD = 5V, Note 2

Input Resistance RIN

50 200 —

kΩ

VDD = 12V

50 300 — VDD = 10V

50 600 — VDD = 5V

Supply Current ON (Each

Stage) IDD(ON)

—1.02.0

VDD = 12V, Outputs Open

—0.91.7 V

DD = 10V, Outputs Open

—0.71.0 V

DD = 5V, Outputs Open

Supply Current OFF

(Total) IDD(OFF)

— — 200 µA VDD = 12V, Outputs Open, Inputs = 0V

— 50 100 VDD = 5V, Outputs Open, Inputs = 0V

Note 1: Specification for packaged product only.

2: Operation of these devices with standard TTL or DTL may require the use of appropriate pull-up resistors

to ensure a minimum logic “1”.

MIC5800/1

DS20006184A-page 4  2019 Microchip Technology Inc.

Information present at an input is transferred to its latch when the STROBE is high. A high CLEAR input will set all

latches to the output OFF condition regardless of the data or STROBE input levels. A high /OE will set all outputs to the

off condition, regardless of any other input conditions. When the /OE is low, the outputs depend on the state of their

respective latches.

Clamp Diode Leakage

Current IR

——50

µA VR = 50V, TA = +25°C

— — 100 VR = 50V, TA = +70°C

Clamp Diode Forward

Voltage VF—1.72.0 VI

F = 350 mA

TRUTH TABLE

INNStrobe Clear /OE

OUTN

t – 1 t

0100XOFF

1100XON

XX1XXOFF

XXX1XOFF

X 0 0 0 ON ON

X000OFFOFF

Legend: X = Irrelevant; t – 1 = Previous output state; t = Present output state.

TEMPERATURE SPECIFICATIONS

Parameters Sym. Min. Typ. Max. Units Conditions

Temperature Ranges

Storage Temperature Range TS–65 — +125 °C —

Operating Temperature Range TA–40 — +85 °C —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics: VDD = 5V, TA = +25°C, VA ≤ +85°C unless otherwise noted. Note 1

Parameter Sym. Min. Typ. Max. Units Conditions

Note 1: Specification for packaged product only.

2: Operation of these devices with standard TTL or DTL may require the use of appropriate pull-up resistors

to ensure a minimum logic “1”.

 2019 Microchip Technology Inc. DS20006184A-page 5

MIC5800/1

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1 and Table 2-2.

FIGURE 2-1: Typical Input.

TABLE 2-1: MIC5800 PIN FUNCTION TABLE

Pin Number Pin Name Description

1 CLEAR Resets all latches and turns all outputs OFF (open).

2 STROBE Input strobe pin. Loads output latches when high.

3, 4, 5, 6 INNParallel inputs, 1 through 4.

7 GND Logic and Output Ground pin.

8 COM Transient suppression diode common cathode pin.

9, 10, 11, 12 OUTNParallel outputs, 4 through 1.

13 VDD Logic Supply Voltage.

14 /OE

Output Enable. When low, outputs are active. When high, outputs are inactive and

device is reset from a fault condition. An undervoltage condition emulates a high OE

input.

TABLE 2-2: MIC5801 PIN FUNCTION TABLE

Pin Number

SOIC

Pin Number

PLCC Pin Name Description

128/OE

Output Enable. When low, outputs are active. When high, outputs

are inactive and device is reset from a fault condition. An

undervoltage condition emulates a high OE input.

2 1 CLEAR Resets all latches and turns all outputs OFF (open).

3 3 STROBE Input strobe pin. Loads output latches when high.

4, 5, 6, 7, 8, 9,

10, 11

5, 6, 7, 8, 9,

10, 11, 12 INNParallel inputs, 1 through 8.

12 15 GND Logic and Output Ground pin.

13 17 COM Transient suppression diode common cathode pin.

14, 23 2, 4, 13, 14,

16, 26 NC No Connection. Leave floating.

15, 16, 17, 18,

19, 20, 21, 22

18, 19, 20, 21,

22, 23, 24, 25 OUTNParallel outputs, 8 through 1.

24 27 VDD Logic Supply Voltage.

VDD

MIC5800/1

DS20006184A-page 6  2019 Microchip Technology Inc.

3.0 TIMING

FIGURE 3-1: Timing Diagram.

TABLE 3-1: TIMING CONDITIONS

Characteristics: TA = +25°C; Logic levels are VDD and Ground; VDD = 5V.

Condition Min. Typ. Max.

A. Minimum data active time before strobe enabled (data set-up time) 50 ns — —

B. Minimum data active time after strobe disabled (data hold time) 50 ns — —

C. Minimum strobe pulse width 125 ns — —

D. Typical time between strobe activation and output on to off transition — 500 ns —

E. Typical time between strobe activation and output off to on transition — 500 ns —

F. Minimum clear pulse width 300 ns — —

G. Minimum data pulse width 225 ns — —

CLEAR

STROBE

OUTPUT

ENABLE

CBA

OUT

 2019 Microchip Technology Inc. DS20006184A-page 7

MIC5800/1

4.0 TYPICAL APPLICATIONS

FIGURE 4-1: MIC5800 Unipolar Stepper-Motor Drive.

FIGURE 4-2: Unipolar Wave Drive. FIGURE 4-3: Unipolar 2-Phase Drive.

114

VDD

OUT1

OUT2

OUT3

OUT4

IN4

IN3

IN2

IN1

STROBE

CLEAR

LATCHES

μP

0.1μF

+30V

0.1μF

+30V

STEPPER

MOTOR

OUTPUT ENABLE

STROBE

OUT

STROBE

OUT

MIC5800/1

DS20006184A-page 8  2019 Microchip Technology Inc.

FIGURE 4-4: MIC5801 Relay Driver.

FIGURE 4-5: MIC5800 Incandescent/Halogen Lamp Driver.

LATCHES

12 13

STROBE

INPUT 7

INPUT 6

INPUT 5

INPUT 4

INPUT 3

INPUT 2

INPUT 1

+12V

+5V

CLEAR

INPUT 8

Relays: Guardian Electric 1725-1C-12D

0.1μF 22μF

LATCHES

+24V

+5V

INPUT 4

INPUT 3

INPUT 2

INPUT 1

0.1μF 22μF +

Note: Lamp inrush current is approximately 10× lamp operating current.

 2019 Microchip Technology Inc. DS20006184A-page 9

MIC5800/1

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

Example28-Lead PLCC*

XXXXXX

XXXXXXXXX

WNNN

MICREL

MIC5801YV

7691

Example24-Lead SOICW*

XXXXXX

XXXXXXXXXX

WNNN

MICREL

MIC5801YWM

8664

Example14-Lead PDIP*

XXXXXX

XXXXXXXXX

WNNN

MICREL

MIC5800YN

3570

Example14-Lead SOIC*

XXXXXX

XXXXXXXXX

WNNN

MICREL

MIC5800YM

1963

Legend: XX...X Product code or customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC® designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle

mark).

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information. Package may or may not include

the corporate logo.

Underbar (_) and/or Overbar (⎯) symbol may not be to scale.

MIC5800/1

DS20006184A-page 10  2019 Microchip Technology Inc.

14-Lead Plastic Small Outline SOIC Package Outline and Recommended Land Pattern

0.20 C

0.25 CA–B D

2X N/2 TIPS

TOP VIEW

SIDE VIEW

VIEW A–A

Microchip Technology Drawing No. C04-065-D3X Rev D

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

NX b

SEATING

PLANE

0.10 C

14X

0.10 CA–B

0.10 C D

SEE VIEW C

(L1)

R0.13

VIEW C

NOTE 1 3

0.10 C

NOTE 5

14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC]

Atmel Legacy Global Package Code SVQ

 2019 Microchip Technology Inc. DS20006184A-page 11

MIC5800/1

Microchip Technology Drawing No. C04-065-D3X Rev D Sheet 2 of 2

14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Foot Angle 0° - 8°

15°-5°

Mold Draft Angle Bottom

15°-5°

Mold Draft Angle Top

0.51-0.31bLead Width

0.25-0.10

Lead Thickness

1.04 REFL1Footprint

0.50-0.25hChamfer (Optional)

8.65 BSCDOverall Length

3.90 BSCE1Molded Package Width

6.00 BSCEOverall Width

0.25-0.10

Standoff

--1.25A2Molded Package Thickness

1.75--AOverall Height

1.27 BSC

Pitch

14NNumber of Pins

MAXNOMMINDimension Limits

MILLIMETERSUnits

Foot Length L 0.40 - 1.27

or protrusion, which shall not exceed 0.25 mm per side.

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimension D does not include mold flash, protrusions or gate burrs, which shall

Pin 1 visual index feature may vary, but must be located within the hatched area.

§ Significant Characteristic

Dimensioning and tolerancing per ASME Y14.5M

not exceed 0.15 mm per end. Dimension E1 does not include interlead flash

5. Datums A & B to be determined at Datum H.

Lead Angle 0° - -

Atmel Legacy Global Package Code SVQ

MIC5800/1

DS20006184A-page 12  2019 Microchip Technology Inc.

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Contact Pitch

MILLIMETERS

1.27 BSC

MIN

MAX

Contact Pad Length (X14)

Contact Pad Width (X14)

1.55

0.60

NOM

CContact Pad Spacing 5.40

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

SILK SCREEN

Microchip Technology Drawing No. C04-2065-D3X Rev D

14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC]

Atmel Legacy Global Package Code SVQ

 2019 Microchip Technology Inc. DS20006184A-page 13

MIC5800/1

14-Lead PDIP Package Outline and Recommended Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging.

MIC5800/1

DS20006184A-page 14  2019 Microchip Technology Inc.

28-Lead PLCC Package Outline and Recommended Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging.

 2019 Microchip Technology Inc. DS20006184A-page 15

MIC5800/1

24-Lead SOICW Package Outline and Recommended Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging.

MIC5800/1

DS20006184A-page 16  2019 Microchip Technology Inc.

NOTES:

 2019 Microchip Technology Inc. DS20006184A-page 17

MIC5800/1

APPENDIX A: REVISION HISTORY

Revision A (April 2019)

• Converted Micrel document MIC5800/1 to Micro-

chip data sheet template DS20006184A.

• Minor grammatical text changes throughout.

MIC5800/1

DS20006184A-page 18  2019 Microchip Technology Inc.

NOTES:

 2019 Microchip Technology Inc. DS20006184A-page 19

MIC5800/1

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.

Examples:

a) MIC5800YM: MIC5800, –40°C to +85°C

Temperature Range, 14-Lead

SOIC, 54/Tube

b) MIC5800YM-TR: MIC5800, –40°C to +85°C

Temperature Range, 14-Lead

SOIC, 2,500/Reel

c) MIC5800YN: MIC5800, –40°C to +85°C

Temperature Range, 14-Lead

PDIP, 25/Tube

d) MIC5801YV: MIC5801, –40°C to +85°C

Temperature Range, 28-Lead

PLCC, 38/Tube

e) MIC5801YV-TR: MIC5801, –40°C to +85°C

Temperature Range, 28-Lead

PLCC, 750/Reel

f) MIC5801YWM: MIC5801, –40°C to +85°C

Temperature Range, 24-Lead

Wide SOIC, 31/Tube

g) MIC5801YWM-TR: MIC5801, –40°C to +85°C

Temperature Range, 24-Lead

Wide SOIC, 1,000/Reel

Device:

MIC5800: 4-Bit Parallel-Input, High-Voltage, High-

Current Latched Driver

MIC5801: 8-Bit Parallel-Input, High-Voltage, High-

Current Latched Driver

Junction

Temperature

Range:

Y = –40°C to +85°C, Industrial

Package:

M = 14-Lead SOIC (MIC5800)

N = 14-Lead PDIP (MIC5800)

V = 28-Lead PLCC (MIC5801)

WM = 24-Lead Wide SOIC (MIC5801)

Media Type:

<blank>= 54/Tube (M, MIC5800)

<blank>= 25/Tube (N, MIC5800)

<blank>= 38/Tube (V, MIC5801)

<blank>= 31/Tube (WM, MIC5801)

TR = 750/Reel (V, MIC5801)

TR = 1,000/Reel (WM, MIC5801)

TR = 2,500/Reel (M, MIC5800) Note 1: Tape and Reel identifier only appears in the

catalog part number description. This identifier is

used for ordering purposes and is not printed on

the device package. Check with your Microchip

Sales Office for package availability with the

Tape and Reel option.

Device X XX -XX

Part No. Junction Temp.

Range

Package Media Type

MIC5800/1

DS20006184A-page 20  2019 Microchip Technology Inc.

NOTES:

 2019 Microchip Technology Inc. DS20006184A-page 21

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, AVR,

AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,

CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,

JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,

maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,

OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip

Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,

SuperFlash, tinyAVR, UNI/O, and XMEGA are registered

trademarks of Microchip Technology Incorporated in the U.S.A.

and other countries.

ClockWorks, The Embedded Control Solutions Company,

EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,

mTouch, Precision Edge, and Quiet-Wire are registered

trademarks of Microchip Technology Incorporated in the U.S.A.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any

Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,

CryptoAuthentication, CryptoAutomotive, CryptoCompanion,

CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average

Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial

Programming, ICSP, INICnet, Inter-Chip Connectivity,

JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,

motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,

MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,

PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,

QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,

SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total

Endurance, TSHARC, USBCheck, VariSense, ViewSpan,

WiperLock, Wireless DNA, and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated in

the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip

Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology

Germany II GmbH & Co. KG, a subsidiary of Microchip

Technology Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

ISBN: 978-1-5224-4361-2

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

QUALITYMANAGEMENTS

YSTEM

CERTIFIEDBYDNV

== ISO/TS16949==

DS20006184A-page 22  2019 Microchip Technology Inc.

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Tel: 86-20-8755-8029

China - Hangzhou

Tel: 86-571-8792-8115

China - Hong Kong SAR

Tel: 852-2943-5100

China - Nanjing

Tel: 86-25-8473-2460

China - Qingdao

Tel: 86-532-8502-7355

China - Shanghai

Tel: 86-21-3326-8000

China - Shenyang

Tel: 86-24-2334-2829

China - Shenzhen

Tel: 86-755-8864-2200

China - Suzhou

Tel: 86-186-6233-1526

China - Wuhan

Tel: 86-27-5980-5300

China - Xian

Tel: 86-29-8833-7252

China - Xiamen

Tel: 86-592-2388138

China - Zhuhai

Tel: 86-756-3210040

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-3090-4444

India - New Delhi

Tel: 91-11-4160-8631

India - Pune

Tel: 91-20-4121-0141

Japan - Osaka

Tel: 81-6-6152-7160

Japan - Tokyo

Tel: 81-3-6880- 3770

Korea - Daegu

Tel: 82-53-744-4301

Korea - Seoul

Tel: 82-2-554-7200

Malaysia - Kuala Lumpur

Tel: 60-3-7651-7906

Malaysia - Penang

Tel: 60-4-227-8870

Philippines - Manila

Tel: 63-2-634-9065

Singapore

Tel: 65-6334-8870

Taiwan - Hsin Chu

Tel: 886-3-577-8366

Taiwan - Kaohsiung

Tel: 886-7-213-7830

Taiwan - Taipei

Tel: 886-2-2508-8600

Thailand - Bangkok

Tel: 66-2-694-1351

Vietnam - Ho Chi Minh

Tel: 84-28-5448-2100

EUROPE

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

Finland - Espoo

Tel: 358-9-4520-820

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany - Garching

Tel: 49-8931-9700

Germany - Haan

Tel: 49-2129-3766400

Germany - Heilbronn

Tel: 49-7131-67-3636

Germany - Karlsruhe

Tel: 49-721-625370

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Germany - Rosenheim

Tel: 49-8031-354-560

Israel - Ra’anana

Tel: 972-9-744-7705

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Italy - Padova

Tel: 39-049-7625286

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Norway - Trondheim

Tel: 47-7288-4388

Poland - Warsaw

Tel: 48-22-3325737

Romania - Bucharest

Tel: 40-21-407-87-50

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

Sweden - Gothenberg

Tel: 46-31-704-60-40

Sweden - Stockholm

Tel: 46-8-5090-4654

UK - Wokingham

Tel: 44-118-921-5800

Fax: 44-118-921-5820

Worldwide Sales and Service

08/15/18