TCM809SENB713 - MICROCHIP - Datasheet.Technology

TCM809/TCM810

Features

• Precision VDD Monitor for 2.5V, 3.0V, 3.3V, 5.0V

Nominal System Voltage Supplies

• 140 msec Minimum RESET Time-Out Period

• RESET Output to VDD = 1.0V (TCM809)

• Low Supply Current, 9 µA (typ.)

•V

DD Transient Immunity

• Small 3-Pin SC-70 and SOT-23B Packages

• No External Compo nen ts

• Push-Pull RESET Output

• Temperature Ranges:

- Industrial: SC-70 (E): -40°C to +85°C

- Extended: SOT-23, SC-70 (V): -40°C to +125°C

Applications

• Computers

• Embedded Systems

• Battery-powered Equipment

• Critical Mi cro con trol ler Power Supply Monitori ng

• Automotive

Typical Application Circuit

General Description

The TCM809 and TCM810 are cost-effective system

supervisor circuits designed to monitor VDD in digital

system s; provid ing a rese t signal t o the host processo r ,

when necessary. No external components are

required.

The RESET output is typically driven active within

65 µsec of VDD falling through the reset voltage thresh-

old. RESET is maintained active for a minimum of

140 msec after VDD rises above the reset threshold.

The TCM810 has an active-high RESET output, while

the TCM809 has an active-low RESET output. The

output of the TCM809/TCM810 is valid down to

VDD = 1V. Both devices are available in 3-Pin SC-70

and SOT-23B packages.

The TCM809/TCM810 are optimized to reject fast

transient glitches on the VDD line. A low supply current

of 9 µA (typ., VDD = 3.3V) make these devices suitable

for battery-powered applications.

Pin Configurations

TCM809

VDD

RESET RESET

INPUT

(Active-Low)

GND GND

PICmicro®

Microcontroller

SOT-23B/SC-70

Note: 3-Pin SOT-23B is equivale nt to

VDD

TCM809 RESET

GND

TCM809/

TCM810

TCM810 (RESET)

JEDEC TO-236.

3-Pin Microcontroller Reset Monitors

TCM809/TCM810

1.0 ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings†

Supply Voltage (VDD to GND) ........................................................6.0V

RESET, RESET ...................................................-0.3V to (VDD +0.3V)

Input Current, VDD.......................................................................20 mA

Output Current, RESET, RESET.................................................20 mA

dV/dt (VDD)...........................................................................100V/µsec

Operating Temperature Range ...................................-40°C to +125°C

Power Dissipation (TA = 70°C):

3-Pin SOT-23B (derate 4 mW/°C above +70°C) ....................320 mW

3-Pin SC-70 (derate 2.17 mW/°C above +70°C)....................174 mW

Storage Temperature Range.......................................-65°C to +150°C

Maximum Junction Temperature, TJ............................................150°C

† Notice: Stresses above those listed under “Maximum

Ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operational listings of this specification is not implied.

Exposure to m aximum rating conditions for ext ended pe riods

may affect device reliability.

ELECTRICAL CHARACTERISTICS

VDD = Full Range, TA = Operating Tem peratur e Range, unless otherwise noted. Typical values are at TA = +25°C,

VDD = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note 1).

Parameter Sym Min Typ Max Unit s Test Conditions

VDD Range 1.0 — 5.5 V TA = 0°C to +70°C

1.2 — 5.5 TA = – 40°C to +125°C

Supply Current ICC —1230µATCM8xxL/M/J: VDD < 5.5V

—925 TCM8xxR/S/T/Z: VDD < 3.6V

Reset Threshold (Note 2) VTH 4.56 4.63 4.70 V TCM8xxL: TA = +25°C

4.50 — 4.75 TA = – 40°C to +125°C

4.31 4.38 4.45 V TCM8xxM: TA = +25°C

4.25 — 4.50 V TA = – 40°C to +125°C

3.93 4.00 4.06 V TCM809J: TA = +25°C

3.89 — 4.10 V TA = – 40°C to +125°C

3.04 3.08 3.11 V TCM8xxT: TA = +25°C

3.00 — 3.15 V TA = – 40°C to +125°C

2.89 2.93 2.96 V TCM8xxS: TA = +25°C

2.85 — 3.00 V TA = – 40°C to +125°C

2.59 2.63 2.66 V TCM8xxR: TA = +25°C

2.55 — 2.70 V TA = – 40°C to +125°C

2.28 2.32 2.35 V TCM8xxZ: TA = +25°C

2.25 — 2.38 V TA = – 40°C to +125°C

Reset Threshold Tempco — 30 — ppm/°C

VDD to Reset Delay, — 65 — µsec VDD = VTH to (VTH – 100 mV) (Note 2)

Reset Active T ime Out

Period 140 320 560 msec

RESET Output V oltage

Low (TCM809)VOL ——0.3VTCM809R/S/T/Z: VDD = VTH min, ISINK = 1.2 mA

——0.4 TCM809L/M/J: VDD = VTH min, ISINK = 3. 2 mA

——0.3 V

DD > 1.0V, ISINK = 50 µA

RESET Output V oltage

High (TCM809)VOH 0.8 VDD ——VTCM809R/S/T/Z: VDD > VTH max, ISOURCE = 500 µA

VDD – 1.5 — — TCM809L/M/J: VDD > VTH max, ISOURCE = 800 µA

RESET Output Voltage

Low (TCM810)VOL ——0.3VTCM810R/S/T/Z:VDD = VTH max, ISINK = 1.2 mA

——0.4 TCM810L/M: VDD = VTH max, ISINK = 3.2 mA

RESET Output Voltage

High (TCM810)VOH 0.8 VDD ——V1.8 < V

DD < VTH min, I SOURCE = 150 µA

Note 1: Prod uction testing done at TA = +25°C, overtemperature limits ensured by QC screen.

2: RESET output for TCM809, RESET output for TCM810.

TCM809/TCM810

2.0 TYPICAL PERFORMANCE CHARA CTERISTICS

FIGURE 2-1: Supply Current vs.

Temperature.

FIGURE 2-2: Supply Current vs.

Temperature.

FIGURE 2-3: Power-up Reset Time Out

vs. Temperature.

FIGURE 2-4: Normalized Reset

Threshold vs. Temperature.

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

-40 -20 0 20 40 60 80 100 120

Temperatur e (°C)

Supply Current ( µA)

VDD = 1V

VDD = 3V

VDD = 5V

TCM8x x /R /S/T/Z, No Lo ad

-40-200 20406080100120

Temperatur e (°C)

Supply Current ( µA)

VDD = 5V

VDD = 3V

VDD = 1V

TCM8xx/L/M/J, No Load

100

150

200

250

300

350

400

450

-40 -20 0 20 40 60 80 100 120

Temperatur e (°C)

Power-up Reset Timeout (µsec)

0.997

0.998

0.999

1.001

-40-200 20406080100120

Temperature (°C)

Normalized Reset Threshold

TCM809/TCM810

3.0 PIN DESCRIPTIONS

The descri pti ons of the pins are giv en in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

3.1 Ground (GND)

Ground term in al.

3.2 RESET Output (TCM809)

The RESET push-pull output remains low while VDD is

below the reset voltage threshold, and for 240 msec

(140 msec min.) af t er V DD rise s ab ov e res et th res hol d.

3.3 RESET Output (TCM810 )

The RESET push-pull output remains high while VDD is

below the reset voltage threshold, and for 240 msec

(140 msec min.) af t er VDD rise s ab ov e res et th res hol d.

3.4 Supply Voltage (VDD)

VDD: +2.5V, +3.0V, +3.3V and +5.0V

NAME FUNCTION

GND Ground

RESET (TCM809) RESET push-pull outpu t

RESET (TCM810) RESET push-pull outpu t

VDD Supply voltage (+2.5V, +3.0V,

+3.3V, +5.0V).

TCM809/TCM810

4.0 APPLICATIONS INFORMATION

4.1 VDD Transient Reject ion

The T CM8 09/TCM810 prov id es ac cu rate V DD monitor-

ing and res et timi ng during power-up, power-d own and

brown-out/sag conditions. These devices also reject

negative-going transients (glitches) on the power

supply line. Figure 4-1 shows the maximum transient

duration vs. maximum negative excursion (overdrive)

for glitch rejection. Any combination of duration and

overdrive that lies under the curve will not generate a

reset signal.

FIGURE 4-1: Maximum Transient

Duration vs. Overdrive for Glitch Rejection at

+25°C.

Combinations above the curve are detected as a

brown-out or power-down condition. Transient

immunity can be improved by adding a capacitor in

close pro ximity to the VDD pin of the TCM809/TC M810.

4.2 RESET Signal Integrity During

Power-Down

The TCM809 RESET output is valid to VDD = 1.0V.

Below this voltage the output becomes an "open cir-

cuit" and does not sink current. This means CMOS

logic inputs to the microcontroller will be floating at an

undetermined voltage. Most digital systems are

completely shut down well above this voltage.

However, in situations where RESET must be main-

tained valid to VDD = 0V, a pull-down resistor must be

connected from RESET to ground to discharge stray

capa citance s and hold the out put low (Figure 4-2 ). This

resistor value, though not critical, should be chosen

such that it does not appreciably load RESET under

normal operation (100 kΩ will be suitable for most

applications). Similarly, a pull-up resistor to VDD is

required for the TCM 810 to ensure a valid high RESET

for VDD below 1.0V.

FIGURE 4-2: The addition of R1 at the

RESET output of the TCM809 ensures that the

RESET output is valid to VDD = 0V.

Reset Comparator Overdrive

[VTH – VDD] (mv)

400

240

160

320

0 1

100

1000

TA = +25°C

VTH

Duration

Overdrive

VDD

TCM8XXL/M/J (SOT-23)

Maximum Transient Duration (µsec)

TCM8XXZ/R/S/T

(SOT-23)

[VTH – VDD] (mv)

100

110

120

130

1 10 100 1000

Reset Comparator Overdrive (mV)

VDD to Reset Delay (µsec)

TCM8XXL/M/J (SC-70)

TCM8XXZ/R/S/T (SC-70)

TCM809

VDD

100 kΩ

RESET

GND

TCM809/TCM810

4.3 Controllers and Processors With

Bidirectional I/O Pins

Some microcontrollers have bidirectional reset pins.

Depending on the current drive capabi lity of the control-

ler pin, an indeterminate logic level may result if there

is a logic conflict. This can be avoided by adding a

4.7 kΩ resistor in series with the outpu t of the TCM809/

TCM810 (Figure 4-3). If there are other components in

the system that require a reset signal, they should be

buffered so as not to load the reset line. If the other

components are required to follow the reset I/O of the

microcontroller, the buffer should be connected as

shown with the solid line. FIGURE 4-3: I n te rf a ci n g t h e T C M 809 t o a

Bidirection a l RES ET I/ O .

TCM809

VDD

RESET

GND

RESET

GND

Buffered RESET

To Other System

Components

Micro-

4.7 kΩcontroller

Buffer

PICmicro®

TCM809/TCM810

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

3-Pin SOT-23B

XXNN

Legend: XX...X Customer-specific information*

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb- free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the even t the full Mic rochip part nu mber ca nn ot be marked o n one lin e, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

Example:

Customer Specific Information Codes for:

TCM8xx =

Part Number TCM809 TCM810

TCM8xxLENB J1 K1

VNB JZ KZ

TCM8xxMENB J2 K2

VNB JY KY

TCM8xxTENB J3 K3

VNB JX KX

TCM8xxSENB J4 K4

VNB JV KV

TCM8xxRENB J5 K5

VNB JU KU

TCM8xxJ ENB J6 —

VNB JT KS

TCM8xxZENB J7 K6

3-Pin SC-70

To p Side Bottom Side

XXN

YWW

XXNN

Example:

Customer Specific Information Codes for:

TCM8xx =

Part Number TCM809 TCM810

TCM8xxL ELB J1 —

VLB JZ KZ

TCM8xxM ELB J2 —

VLB JY KY

TCM8xxT ELB J3 —

VLB JX KX

TCM8xxS ELB J4 —

VLB JV KV

TCM8xxR ELB J5 —

VLB JU KU

TCM8xxJ ELB J6 —

VLB JT KS

TCM8xxZ ELB J7 —

VLB JS KT

TCM809/TCM810

3-Lead Plastic Small Outline Transistor (NB) (SOT-23)

10501050

Mold Draft Angle Bottom 10501050

Mold Draft Angle Top 0.510.440.37.020.017.015BLead Width 0.180.140.09.007.006.004

Lead Thickness 10501050

Foot Angle 0.550.450.35.022.018.014LFoot Length 3.042.922.80.120.115.110DOverall Length 1.401.301.20.055.051.047E1Molded Package Width 2.642.372.10.104.093.083EOverall Width 0.100.060.01.004.002.000A1Standoff § 1.020.950.88.040.037.035A2Molded Package Thickness 1.121.010.89.044.040.035AOverall Height 1.92.076

Outsid e lead pitch (basic ) 0.96

.038

Pitch 33

Number of Pins MAXNOMMINMAXNOMMINDimen sion Li mits MILLIMETERSINCHES*Units

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: TO-236

Drawing No. C04-104

§ Significant Characteristic

TCM809/TCM810

3-Lead Plastic Small Outline Transistor (LB) (SC-70)

12°8°12°8°

Mold Draft Angle Bottom

12°8°12°8°

Mold Draft Angle Top

0.400.15.016.006BLead Width

0.250.08.010.003

Lead Thickness

0.410.10.016.004LFoot Length

2.251.80.089.071DOverall Length

1.351.15.053.045E1Molded Package Width

2.401.80.094.071EOverall Width

.0100.00.0004.000A1Standoff

1.000.80.039.031A2Molded Package Thickness

1.100.80.043.031AOverall Height

1.30 BSC.

Outside lead pitch (basic)

0.65 BSC.

Pitch

33Number of Pins

MAXMINMAXMINDimension Limits

MILLIMETERS*INCHESUnits

shall not exceed .005" (0.127mm) per side.

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions

Notes:

JEITA (EIAJ) Equivalent: SC70

Drawing No. C04-104

*Controlling Parameter

p1 D

A A2

.026 BSC.

.051 BSC.

TCM809/TCM810

5.2 Product Tape and Reel Specifications

FIGURE 5-1: EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY)

FIGURE 5-2: 3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS

Top

Cover

Tape

TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS

Case

Outline Package

Type

Carrier

Dimensions Cavity

Dimensions Output

Quantity

Units

Reel

Diameter in

mm P

mm A0

mm B0

mm K0

NB SOT-23 3L 8 4 3.15 2.77 1.22 3000 180

LB SC-70 3L 8 4 2.4 2.4 1.19 3000 180

User Direction of Feed

Pitch

Standard Reel Component Orientation Reverse Reel Component Orientation

W, Width

of Carrier

Tape

Pin 1

Device

Marking

Device

Marking

TCM809/TCM810

APPENDIX A: REVISION HISTORY

Revision D (March 2005)

• Updated 6.0 “P ackaging Informat ion” to includ e

old and new packag ing examples.

• Applied new template and rearranged sections to

be consistent with cu rrent documentation.

Revision C (April 2004)

Revision B (January 2002)

Revision A (May 2001)

Initial release of data sheet.

TCM809/TCM810

NOTES:

TCM809/TCM810

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Sales and Support

Device: TCM809: Supervisor ci rcuit with active -l ow RESE T output

TCM810: Supervisor circuit with active-high RESET output

VDD Reset Threshold: L = 4.63V

M=4.38V

J=4.00V

T=3.08V

S=2.93V

R=2.63V

Z=2.32V

Temperature Range: E = -40°C to +85°C

V = -40°C to +125°C

Package: NB713 = SOT-23B, 3-pin (Tape and Reel)

LB713 = SC-70, 3-pin (Tape and Reel)

PART NO. X X

Temperature

VDD

Reset

Device

Examples:

a) TCM809LENB713: SOT-23B-3-TR,

Microcontroller 4.63V

Reset Monitor,

-40°C to +85° C ,

Tape and Reel.

b) TCM809LVLB713: SC-70-3-TR,

Microcontroller 4.63V

Reset Monitor,

-40°C to +125 °C ,

Tape and Reel.

c) TCM809LVNB713: SOT-23B-3-TR,

Microcontroller 4.63V

Reset Monitor,

-40°C to +125 °C ,

Tape and Reel.

a) TCM810MENB713: SOT-23B-3-TR,

Microcontroller 4.38V

Reset Monitor,

-40°C to +85° C ,

Tape and Reel.

b) TCM810RVLB713: SOT-23B-3-TR,

Microcontroller 2.63V

Reset Monitor,

-40°C to +125 °C ,

Tape and Reel.

c) TCM810TVLB713: SC-70-3-TR,

Microcontroller 4.38V

Reset Monitor,

-40°C to +125 °C ,

Tape and Reel.

Range

Threshold

XXXXX

Package

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and

recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Dat a Sheet (include Literature #) you are using.

Customer Notification System

TCM809/TCM810

NOTES:

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR WAR-

RANTIES OF ANY KIN D WHETHER EXPRESS OR IMPLIED ,

WRITTEN OR ORAL, STATUTORY OR OTHERWISE,

RELATED TO THE INFORMATION, INCLUDING BUT NOT

LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,

MERCHANTABILITY OR FITNESS FOR PURPOSE.

Microchip disclaims all liability arising from this information and

its use. U se of Microc hip’s products as critical com ponents in

life support systems is not authorized except with express

written approval by Microchip. No licenses are conveyed,

implicitly or otherwise, under any Microchip intellectual property

rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICST ART,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are

registered trademarks of Microchip Technology Incorporated

in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,

PICMASTER, SEEVAL, SmartSensor and The Embedded

Control Solutions Company are registered trademarks of

Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,

dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,

FanSense, FlexROM, fuzzyLAB, In-Circuit Serial

Prog ra mming , ICSP, IC EPIC, M PASM , MP LIB, MPLINK,

MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICt ail,

PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance and WiperLock are trademarks of Microchip

Tec hnology Incor porated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is c onstantly evolving. We a t Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’ s code protection f eature may be a violati on of t he Digit al Millennium Copyright Act. If such act s

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 quality system certification for

its worldwide headquarters, design and wafer fabrication facilities in

Chandler and Tempe, Arizona and Mountain View, California in

October 2003. The Company’s quality system processes and

procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping

devices, Serial EEPROMs, micro peripherals, nonvolat ile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

AMERICAS

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Atlanta

Alpharetta, GA

Tel: 770-640-0034

Fax: 770-640-0307

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Chicago

Itasc a , IL

Tel: 630-285-0071

Fax: 630-285-0075

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

Los A n ge les

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

San Jose

Mountain View, CA

Tel: 650-215-1444

Fax: 650-961-0286

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

ASIA/PACIFIC

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8676-6200

Fax: 86-28-8676-6599

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

China - Shunde

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

China - Qingdao

Tel: 86-532-502-7355

Fax: 86-532-502-7205

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-2229-0061

Fax: 91-80-2229-0062

India - New Delhi

Tel: 91-11-5160-8631

Fax: 91-11-5160-8632

Japan - Kanagawa

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

Korea - Seoul

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Taiwan - Hsinchu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

EUROPE

Austria - Weis

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

Denmark - Ballerup

Tel: 45-4450-2828

Fax: 45-4485-2829

France - Massy

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany - Ismaning

Tel: 49-89-627-144-0

Fax: 49-89-627-14 4-44

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

England - Berkshire

Tel: 44-118-921-5869

Fax: 44-118-921- 5820

WORLDWIDE SALES AND SERVICE

03/01/05