SOD-123 PLASTIC sD101AW | SMD Schottky Diodes thru $D101CW Applications Guard ring protected schottky barrier. Low forward drop. Fast switching, high performance replacement for smail signal devices. Excellent protection for MOS devices. Used in steering, biasing andcoupling applications. Efficient portable system battery isolator. Able to directly replace SMA, MELF or SOD-80 packages on boards without redesign. SOD 123 PACKAGE OUTLINE Featu res (all dimensions In millimeters) e Six Sigma quality oss 401 og ee may e Thermally matched system catade wa oo , a . e High surge capability am fe|e [7 i | e Guaranteed solderability |i e e Also available in MELF & DO-35 Is " { - 0.8 Min. * leaded glass packages. - "155 0.15 1.352.015 marking Bond Pad Acceptable path for aree Dimensions PC board copper trace Absolute Maximum Ratings Symbol Value Unit Power Dissipation at T,,,= 25 C Pict 400 mW Average Forward Rectified Current at T,,,= 25 C lay 100 mAmps Operating and Storage Temperature Range Toast -65 to 150 C Single cycle Surge Current (toeak = 10 usecs.) les 2.0 Amps Detail Specifications @ 25C Peak Maximum Maximum Typical Typical Inverse Forward Voltage Drop Reverse Leakage Current Capacitance Reverse Voltage Recovery (MIN.) @ ov (NOTE 1) a (PIV) (V-) @ 1mA (Vz) @ 15mA (Ig) @ Vp (Co) (t,,) Type Voits Volts Volts pA Voits Pf ns + 1N5711W 70 0.41 1.0 0.2 50 2.0 1.0 Aa 1N6263W 60 0.41 1.0 0.2 50 2.2 1.0 SD101AW 60 0.41 1.0 0.2 50 2.0 1.0 = SD101BW 50 0.40 0.95 0.2 40 2.1 1.0 a SD101CW 40 0.39 0.90 0.2 30 2.2 1.0 = Note 1: I; =I, = 5mA, t, @ 0.1 Ip. For a DO-35 leaded glass package, drop the W at the end. For a glass MELF package, also replace the first two characters with "LL". 4 . 6 Lake Street - BKC Semiconductors Lawrence, MA . Incorporated USA 01841 Telephone (508) 681-0392 * FAX (508) 681-9135 ra t