ESP32-WROOM-32D &
ESP32-WROOM-32U
Datasheet
Version 1.9
Espressif Systems
Copyright © 2019
www.espressif.com
About This Document
This document provides the specifications for the ESP32-WROOM-32D and ESP32-WROOM-32U modules.
Revision History
For revision history of this document, please refer to the last page.
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Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS
PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABIL-
ITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE
ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this docu-
ment is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights
are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property of their respective
owners, and are hereby acknowledged.
Copyright © 2019 Espressif Inc. All rights reserved.
Contents
1 Overview 1
2 Pin Definitions 3
2.1 Pin Layout 3
2.2 Pin Description 3
2.3 Strapping Pins 5
3 Functional Description 6
3.1 CPU and Internal Memory 6
3.2 External Flash and SRAM 6
3.3 Crystal Oscillators 6
3.4 RTC and Low-Power Management 7
4 Peripherals and Sensors 8
5 Electrical Characteristics 9
5.1 Absolute Maximum Ratings 9
5.2 Recommended Operating Conditions 9
5.3 DC Characteristics (3.3 V, 25 °C) 9
5.4 Wi-Fi Radio 10
5.5 BLE Radio 11
5.5.1 Receiver 11
5.5.2 Transmitter 11
5.6 Reflow Profile 12
6 Schematics 13
7 Peripheral Schematics 15
8 Physical Dimensions 17
9 Recommended PCB Land Pattern 19
10U.FL Connector Dimensions 21
11Learning Resources 22
11.1 Must-Read Documents 22
11.2 Must-Have Resources 22
Revision History 23
List of Tables
1 ESP32-WROOM-32D vs. ESP32-WROOM-32U 1
2 ESP32-WROOM-32D and ESP32-WROOM-32U Specifications 2
3 Pin Definitions 3
4 Strapping Pins 5
5 Absolute Maximum Ratings 9
6 Recommended Operating Conditions 9
7 DC Characteristics (3.3 V, 25 °C) 9
8 Wi-Fi Radio Characteristics 10
9 Receiver Characteristics – BLE 11
10 Transmitter Characteristics – BLE 11
List of Figures
1 ESP32-WROOM-32D Pin Layout (Top View) 3
2 Reflow Profile 12
3 ESP32-WROOM-32D Schematics 13
4 ESP32-WROOM-32U Schematics 14
5 ESP32-WROOM-32D & ESP32-WROOM-32U Peripheral Schematics 15
6 Physical Dimensions of ESP32-WROOM-32D 17
7 Physical Dimensions of ESP32-WROOM-32U 18
8 Recommended PCB Land Pattern of ESP32-WROOM-32D 19
9 Recommended PCB Land Pattern of ESP32-WROOM-32U 20
10 ESP32-WROOM-32U U.FL Dimensions 21
1. Overview
1. Overview
ESP32-WROOM-32D and ESP32-WROOM-32U are powerful, generic Wi-Fi+BT+BLE MCU modules that target
a wide variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as
voice encoding, music streaming and MP3 decoding.
ESP32-WROOM-32U is different from ESP32-WROOM-32D in that ESP32-WROOM-32U integrates a U.FL con-
nector. For detailed information of the U.FL connector please see Chapter 10. Note that the information in this
data sheet is applicable to both modules. Any differences between them will be clearly specified in the course of
this document. Table 1lists the difference between ESP32-WROOM-32D and ESP32-WROOM-32U.
Table 1: ESP32-WROOM-32D vs. ESP32-WROOM-32U
Module ESP32-WROOM-32D ESP32-WROOM-32U
Core ESP32-D0WD ESP32-D0WD
SPI flash 32 Mbits, 3.3 V 32 Mbits, 3.3 V
Crystal 40 MHz 40 MHz
Antenna onboard antenna U.FL connector (which needs to be connected
to an external IPEX antenna)
Dimensions
(Unit: mm)
(18.00±0.10) × (25.50±0.10) × (3.10±0.10)
(See Figure 6for details)
(18.00±0.10) × (19.20±0.10) × (3.20±0.10)
(See Figure 7for details)
Schematics See Figure 3for details. See Figure 4for details.
At the core of the two modules is the ESP32-D0WD chip that belongs to the ESP32 series* of chips. The chip
embedded is designed to be scalable and adaptive. There are two CPU cores that can be individually controlled,
and the CPU clock frequency is adjustable from 80 MHz to 240 MHz. The user may also power off the CPU
and make use of the low-power co-processor to constantly monitor the peripherals for changes or crossing of
thresholds. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, Hall sensors, SD
card interface, Ethernet, high-speed SPI, UART, I²S and I²C.
Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet.
The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet
through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast
low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable
for battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps,
and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer
industry-leading specifications and the best performance for electronic integration, range, power consumption,
and connectivity.
The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products
even after their release, at minimum cost and effort.
Table 2provides the specifications of ESP32-WROOM-32D and ESP32-WROOM-32U.
Espressif Systems 1 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
1. Overview
Table 2: ESP32-WROOM-32D and ESP32-WROOM-32U Specifications
Categories Items Specifications
Certification
RF Certification FCC/CE-RED/IC/TELEC/KCC/SRRC/NCC
Wi-Fi Certification Wi-Fi Alliance
Bluetooth certification BQB
Green Certification REACH/RoHS
Test Reliablity HTOL/HTSL/uHAST/TCT/ESD
Wi-Fi Protocols
802.11 b/g/n (802.11n up to 150 Mbps)
A-MPDU and A-MSDU aggregation and 0.4 µs guard
interval support
Frequency range 2.4 GHz ~2.5 GHz
Bluetooth
Protocols Bluetooth v4.2 BR/EDR and BLE specification
Radio
NZIF receiver with –97 dBm sensitivity
Class-1, class-2 and class-3 transmitter
AFH
Audio CVSD and SBC
Hardware
Module interfaces
SD card, UART, SPI, SDIO, I2C, LED PWM, Motor
PWM, I2S, IR, pulse counter, GPIO, capacitive touch
sensor, ADC, DAC
On-chip sensor Hall sensor
Integrated crystal 40 MHz crystal
Integrated SPI flash 14 MB
Operating voltage/Power supply 3.0 V ~3.6 V
Operating current Average: 80 mA
Minimum current delivered by power
supply 500 mA
Recommended operating temperature
range 2–40 °C ~+85 °C
Moisture sensitivity level (MSL) Level 3
Notice:
1. ESP32-WROOM-32D and ESP32-WROOM-32U with 8 MB flash or 16 MB flash are available for custom order.
2. ESP32-WROOM-32D and ESP32-WROOM-32U with high temperature range (–40 °C ~+105 °C) option are avail-
able for custom order. 4 MB SPI flash is supported on the high temperature range version.
3. For detailed ordering information, please see Espressif Product Ordering Information.
Espressif Systems 2 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
2. Pin Definitions
2. Pin Definitions
2.1 Pin Layout
Keepout Zone
GND
IO23
IO22
TXD0
RXD0
IO21
NC
IO19
IO18
IO5
IO17
IO16
IO4
IO0
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
IO2
IO15
SD1
SD0
CLK
CMD
SD3
SD2
IO13
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND
3V3
EN
SENSOR_VP
SENSOR_VN
IO34
IO35
IO32
IO33
IO25
IO26
IO27
IO14
IO12
39 GND
Figure 1: ESP32-WROOM-32D Pin Layout (Top View)
Note:
The pin layout of ESP32-WROOM-32U is the same as that of ESP32-WROOM-32D, except that ESP32-WROOM-32U
has no keepout zone.
2.2 Pin Description
The ESP32-WROOM-32D and ESP32-WROOM-32U have 38 pins. See pin definitions in Table 3.
Table 3: Pin Definitions
Name No. Type Function
GND 1 P Ground
3V3 2 P Power supply
EN 3 I Module-enable signal. Active high.
SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3
IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4
IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5
Espressif Systems 3 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
2. Pin Definitions
Name No. Type Function
IO32 8 I/O GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
TOUCH9, RTC_GPIO9
IO33 9 I/O GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5,
TOUCH8, RTC_GPIO8
IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
IO14 13 I/O GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK,
SD_CLK, EMAC_TXD2
IO12 14 I/O GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2,
SD_DATA2, EMAC_TXD3
GND 15 P Ground
IO13 16 I/O GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3,
SD_DATA3, EMAC_RX_ER
SHD/SD2* 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SWP/SD3* 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
SCS/CMD* 19 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
SCK/CLK* 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
SDO/SD0* 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SDI/SD1* 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
IO15 23 I/O GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD,
SD_CMD, EMAC_RXD3
IO2 24 I/O GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
SD_DATA0
IO0 25 I/O GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
IO4 26 I/O GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER
IO16 27 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO17 28 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7
IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC 32 - -
IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN
RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2
TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 37 I/O GPIO23, VSPID, HS1_STROBE
GND 38 P Ground
Notice:
* Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected
to the integrated SPI flash integrated on the module and are not recommended for other uses.
Espressif Systems 4 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
2. Pin Definitions
2.3 Strapping Pins
ESP32 has five strapping pins, which can be seen in Chapter 6Schematics:
• MTDI
• GPIO0
• GPIO2
• MTDO
• GPIO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches
of the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip
is powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping
pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will
determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset release, the strapping pins work as normal-function pins.
Refer to Table 4for a detailed boot-mode configuration by strapping pins.
Table 4: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
Pin Default 3.3 V 1.8 V
MTDI Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin Default U0TXD Active U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
Pin Default Falling-edge Sampling
Falling-edge Output
Falling-edge Sampling
Rising-edge Output
Rising-edge Sampling
Falling-edge Output
Rising-edge Sampling
Rising-edge Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1
Note:
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave” after booting.
• Both ESP32-WROOM-32D and ESP32-WROOM-32U integrate a 3.3 V SPI flash, so the pin MTDI cannot be set
to 1 when the modules are powered up.
Espressif Systems 5 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
3. Functional Description
3. Functional Description
This chapter describes the modules and functions integrated in ESP32-WROOM-32D and ESP32-WROOM-
32U.
3.1 CPU and Internal Memory
ESP32-D0WD contains a dual-core Xtensa®32-bit LX6 MCU. The internal memory includes:
• 448 KB of ROM for booting and core functions.
• 520 KB of on-chip SRAM for data and instructions.
• 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed
by the main CPU during RTC Boot from the Deep-sleep mode.
• 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during
the Deep-sleep mode.
• 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.
3.2 External Flash and SRAM
ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the
ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to pro-
tect developers’ programs and data in flash.
ESP32 can access the external QSPI flash and SRAM through high-speed caches.
• The external flash can be mapped into CPU instruction memory space and read-only memory space simul-
taneously.
–When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be
mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be
reduced due to speculative reads by the CPU.
–When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a
time. 8-bit, 16-bit and 32-bit reads are supported.
• External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time. 8-bit,
16-bit and 32-bit reads and writes are supported.
Both ESP32-WROOM-32D and ESP32-WROOM-32U integrate a 4 MB of external SPI flash. The integrated SPI
flash is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as
regular GPIOs.
3.3 Crystal Oscillators
The module uses a 40-MHz crystal oscillator.
Espressif Systems 6 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
3. Functional Description
3.4 RTC and Low-Power Management
With the use of advanced power-management technologies, ESP32 can switch between different power modes.
For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and Low-Power
Management” in ESP32 Datasheet.
Espressif Systems 7 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
4. Peripherals and Sensors
4. Peripherals and Sensors
Please refer to Section Peripherals and Sensors in ESP32 Datasheet.
Note:
External connections can be made to any GPIO except for GPIOs in the range 6-11. These six GPIOs are connected to
the module’s integrated SPI flash. For details, please see Section 6Schematics.
Espressif Systems 8 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
5. Electrical Characteristics
5. Electrical Characteristics
5.1 Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in Table 5below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should follow
the recommended operating conditions.
Table 5: Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
Ioutput
1Cumulative IO output current - 1,100 mA
Tstore Storage temperature –40 150 °C
1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains
(VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash
and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
2. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain.
5.2 Recommended Operating Conditions
Table 6: Recommended Operating Conditions
Symbol Parameter Min Typical Max Unit
VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 - - A
T Operating temperature –40 - 85 °C
5.3 DC Characteristics (3.3 V, 25 °C)
Table 7: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit
CIN Pin capacitance - 2 - pF
VIH High-level input voltage 0.75×VDD1- VDD1+0.3 V
VIL Low-level input voltage –0.3 - 0.25×VDD1V
IIH High-level input current - - 50 nA
IIL Low-level input current - - 50 nA
VOH High-level output voltage 0.8×VDD1- - V
VOL Low-level output voltage - - 0.1×VDD1V
IOH
High-level source current VDD3P3_CPU power domain 1,2- 40 - mA
(VDD1= 3.3 V, VOH >= 2.64 V, VDD3P3_RTC power domain 1,2- 40 - mA
output drive strength set to the
maximum) VDD_SDIO power domain 1,3- 20 - mA
Espressif Systems 9 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
5. Electrical Characteristics
Symbol Parameter Min Typ Max Unit
IOL
Low-level sink current
(VDD1= 3.3 V, VOL = 0.495 V,
output drive strength set to the maximum)
- 28 - mA
RP U Resistance of internal pull-up resistor - 45 - kΩ
RP D Resistance of internal pull-down resistor - 45 - kΩ
VIL_nRST Low-level input voltage of CHIP_PU to power off the chip - - 0.6 V
Notes:
1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power
domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced
from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
5.4 Wi-Fi Radio
Table 8: Wi-Fi Radio Characteristics
Parameter Condition Min Typical Max Unit
Operating frequency range note1- 2412 - 2484 MHz
Output impedance note2- - note 2 -Ω
TX power note311n, MCS7 12 13 14 dBm
11b mode 17.5 18.5 20 dBm
Sensitivity 11b, 1 Mbps - –98 - dBm
11b, 11 Mbps - –89 - dBm
11g, 6 Mbps - –92 - dBm
11g, 54 Mbps - –74 - dBm
11n, HT20, MCS0 - –91 - dBm
11n, HT20, MCS7 - –71 - dBm
11n, HT40, MCS0 - –89 - dBm
11n, HT40, MCS7 - –69 - dBm
Adjacent channel rejection 11g, 6 Mbps - 31 - dB
11g, 54 Mbps - 14 - dB
11n, HT20, MCS0 - 31 - dB
11n, HT20, MCS7 - 13 - dB
1. Device should operate in the frequency range allocated by regional regulatory authorities. Target operating frequency
range is configurable by software.
2. For the modules that use IPEX antennas, the output impedance is 50 Ω. For other modules without IPEX antennas,
users do not need to concern about the output impedance.
3. Target TX power is configurable based on device or certification requirements.
Espressif Systems 10 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
5. Electrical Characteristics
5.5 BLE Radio
5.5.1 Receiver
Table 9: Receiver Characteristics – BLE
Parameter Conditions Min Typ Max Unit
Sensitivity @30.8% PER - - –97 - dBm
Maximum received signal @30.8% PER - 0 - - dBm
Co-channel C/I - - +10 - dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz - –5 - dB
F = F0 – 1 MHz - –5 - dB
F = F0 + 2 MHz - –25 - dB
F = F0 – 2 MHz - –35 - dB
F = F0 + 3 MHz - –25 - dB
F = F0 – 3 MHz - –45 - dB
Out-of-band blocking performance
30 MHz ~2000 MHz –10 - - dBm
2000 MHz ~2400 MHz –27 - - dBm
2500 MHz ~3000 MHz –27 - - dBm
3000 MHz ~12.5 GHz –10 - - dBm
Intermodulation - –36 - - dBm
5.5.2 Transmitter
Table 10: Transmitter Characteristics – BLE
Parameter Conditions Min Typ Max Unit
RF transmit power - - 0 - dBm
Gain control step - - 3 - dBm
RF power control range - –12 - +9 dBm
Adjacent channel transmit power
F = F0 ± 2 MHz - –52 - dBm
F = F0 ± 3 MHz - –58 - dBm
F = F0 ± > 3 MHz - –60 - dBm
∆f1avg - - - 265 kHz
∆f2max - 247 - - kHz
∆f2avg/∆f1avg - - –0.92 - -
ICFT - - –10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz
Espressif Systems 11 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
5. Electrical Characteristics
5.6 Reflow Profile
50 150
0
25
1 ~ 3℃/s
0
200
250
200
-1 ~ -5℃/s
Cooling zone
100
217
50
100 250
Reflow zone
!217℃ 60 ~ 90s
Temperature (℃)
Preheating zone
150 ~ 200℃ 60 ~ 120s
Ramp-up zone
Peak Temp.
235 ~ 250℃
Soldering time
> 30s
Time (sec.)
Ramp-up zone — Temp.: <150℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s
Preheating zone — Temp.: 150 ~ 200℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s
Reflow zone — Temp.: >217℃ 7LPH60 ~ 90s; Peak Temp.: 235 ~ 250℃ (<245℃ recommended) Time: 30 ~ 70s
Cooling zone — Peak Temp. ~ 180℃ Ramp-down rate: -1 ~ -5℃/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Figure 2: Reflow Profile
Espressif Systems 12 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
6. Schematics
6. Schematics
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
The values of C1 and C2 vary with
the selection of the crystal.
Pin.1
GND Pin.15
GND
Pin.2
3V3
Pin.3
CHIP_PU/EN
Pin.38
GND
Pin.4
SENSOR_VP
Pin.5
SENSOR_VN
Pin.6
IO34
Pin.7
IO35
Pin.8
IO32
Pin.9
IO33
Pin.10
IO25
Pin.11
IO26
Pin.12
IO27
Pin.13
IO14
Pin.16
IO13
Pin.14
IO12
Pin.17
SD2
Pin.20
CLK
Pin.19
CMD
Pin.18
SD3
Pin.23
IO15
Pin.22
SD1
Pin.21
SD0
Pin.24
IO2
Pin.37
IO23
Pin.36
IO22
Pin.28
IO17
Pin.27
IO16
Pin.25
IO0
Pin.32
NC
Pin.30
IO18
Pin.26
IO4
Pin.34
U0RXD
Pin.29
IO5
Pin.35
U0TXD
Pin.31
IO19
Pin.33
IO21
Pin.39
GND
The values of C14
、
L4 and C15
vary with the actual PCB board.
CHIP_PU
GPIO35
SCK/CLK
SCS/CMD
SENSOR_VP
SHD/SD2 SWP/SD3
SDI/SD1
SDO/SD0
SENSOR_VN
GPIO34
GPIO23GPIO13
GPIO32
U0TXD
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
GPIO15
GPIO13
GPIO2
GPIO0
GPIO4
GPIO16
GPIO17
SDO/SD0
SDI/SD1
SCK/CLK
SWP/SD3
SCS/CMD
SHD/SD2
GPIO18
GPIO5
GPIO23
GPIO19
GPIO22
U0RXD
GPIO21
CHIP_PU
SENSOR_VP
SENSOR_VN
GPIO34
GPIO32
GPIO35
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
SHD/SD2
SWP/SD3
SCS/CMD
SCK/CLK
SDO/SD0
SDI/SD1
GPIO15
GPIO2
GPIO22
U0TXD
U0RXD
GPIO21
GPIO19
GPIO18
GPIO5
GPIO17
GPIO16
GPIO4
GPIO0
VDD33
GND
VDD33
GND
VDD33
GND
GND
VDD_SDIO
GND
VDD33
GND
GND GND
VDD33
GND
GNDGND
GNDGNDGND
GND
GND
GND
VDD_SDIO
VDD33
GND
GNDGND
GND
GND
GND
GND
GND
Title
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2.2
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A2
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2.2
Title
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A2
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2.2
R1 20K(5%)
C14
TBD
C18
1uF
L4 TBD
C17
NC
C5
10nF/6.3V(10%)
L5 2.0nH
C3
100pF
C20
1uF
C2
22pF/6.3V(10%)
C11
1uF
C9
0.1uF
R2 0R
C21
NC
C16
NC
C15
TBD
C6
3.3nF/6.3V(10%)
C4
0.1uF
D1
LESD8D3.3CAT5G
ANT1
PCB ANT
1
2
C13
10uF
R3 499R
C19
0.1uF
U1
40MHz+/-10ppm
XIN
1
GND
2XOUT 3
GND 4
C10
0.1uF
C12
NC
U3
FLASH
/CS
1
DO 2
/WP 3
GND
4
DI 5
CLK
6
/HOLD
7
VCC 8
C1
22pF/6.3V(10%)
U2 ESP32-D0WD
VDDA
1
LNA_IN
2
VDD3P3
3
VDD3P3
4
SENSOR_VP
5
SENSOR_CAPP
6
SENSOR_CAPN
7
SENSOR_VN
8
CHIP_PU
9
VDET_1
10
VDET_2
11
32K_XP
12
32K_XN
13
GPIO25
14
GPIO26
15
GPIO27
16
MTMS
17
MTDI
18
VDD3P3_RTC
19
MTCK
20
MTDO
21
GPIO2
22
GPIO0
23
GPIO4
24
VDD_SDIO 26
GPIO16 25
GPIO17 27
SD_DATA_2 28
SD_DATA_3 29
SD_CMD 30
SD_CLK 31
SD_DATA_0 32
GND 49
SD_DATA_1 33
GPIO5 34
GPIO18 35
GPIO19 38
CAP2 47
VDDA 43
XTAL_N 44
XTAL_P 45
GPIO23 36
U0TXD 41
GPIO22 39
GPIO21 42
VDD3P3_CPU 37
CAP1 48
VDDA 46
U0RXD 40
Figure 3: ESP32-WROOM-32D Schematics
Espressif Systems 13 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
6. Schematics
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
Pin.1
GND Pin.15
GND
Pin.2
3V3
Pin.3
CHIP_PU/EN
Pin.38
GND
Pin.4
SENSOR_VP
Pin.5
SENSOR_VN
Pin.6
IO34
Pin.7
IO35
Pin.8
IO32
Pin.9
IO33
Pin.10
IO25
Pin.11
IO26
Pin.12
IO27
Pin.13
IO14
Pin.16
IO13
Pin.14
IO12
Pin.17
SD2
Pin.20
CLK
Pin.19
CMD
Pin.18
SD3
Pin.23
IO15
Pin.22
SD1
Pin.21
SD0
Pin.24
IO2
Pin.37
IO23
Pin.36
IO22
Pin.28
IO17
Pin.27
IO16
Pin.25
IO0
Pin.32
NC
Pin.30
IO18
Pin.26
IO4
Pin.34
U0RXD
Pin.29
IO5
Pin.35
U0TXD
Pin.31
IO19
Pin.33
IO21
Pin.39
GND
The values of C1 and C2 vary with
the selection of the crystal.
The values of C14
、
L4 and C15
vary with the actual PCB board.
CHIP_PU
GPIO35
SCK/CLK
SCS/CMD
SENSOR_VP
SHD/SD2 SWP/SD3
SDI/SD1
SDO/SD0
SENSOR_VN
GPIO34
GPIO32
U0TXD
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
GPIO15
GPIO13
GPIO2
GPIO0
GPIO4
GPIO16
GPIO17
SDO/SD0
SDI/SD1
SCK/CLK
SWP/SD3
SCS/CMD
SHD/SD2
GPIO18
GPIO5
GPIO23
GPIO19
GPIO22
U0RXD
GPIO21
CHIP_PU
SENSOR_VP
SENSOR_VN
GPIO34
GPIO32
GPIO35
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
SHD/SD2
SWP/SD3
SCS/CMD
SCK/CLK
SDO/SD0
SDI/SD1
GPIO15
GPIO2
GPIO22
U0TXD
U0RXD
GPIO21
GPIO19
GPIO18
GPIO5
GPIO17
GPIO16
GPIO4
GPIO0
GPIO23GPIO13
VDD33
GND
VDD33
VDD33
GND
GND
VDD_SDIO
VDD33
GND
GNDGND
GNDGNDGND
GND
GND
GND
VDD_SDIO
VDD33
GND
GNDGND
GND
GND
GND
GND GND
VDD33
GND
GND
GND GND
GND
Title
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2.1
Title
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A2
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2.1
Title
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A2
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2.1
C14
TBD
C18
1uF
R1 20K(5%)
C5
10nF/6.3V(10%)
L4 TBD
C20
1uF
C17
NC
C3
100pF
L5 2.0nH
C2
22pF/6.3V(10%)
C15
TBD
R2 0R
C9
0.1uF
C13
10uF
C11
1uF
C21
NC
D1
LESD8D3.3CAT5G
C6
3.3nF/6.3V(10%)
C4
0.1uF
C16
NC
J39
IPEX
1
2
3
U1
40MHz+/-10ppm
XIN
1
GND
2XOUT 3
GND 4
C19
0.1uF
R3 499R
C12
NC
C10
0.1uF
U2 ESP32-D0WD
VDDA
1
LNA_IN
2
VDD3P3
3
VDD3P3
4
SENSOR_VP
5
SENSOR_CAPP
6
SENSOR_CAPN
7
SENSOR_VN
8
CHIP_PU
9
VDET_1
10
VDET_2
11
32K_XP
12
32K_XN
13
GPIO25
14
GPIO26
15
GPIO27
16
MTMS
17
MTDI
18
VDD3P3_RTC
19
MTCK
20
MTDO
21
GPIO2
22
GPIO0
23
GPIO4
24
VDD_SDIO 26
GPIO16 25
GPIO17 27
SD_DATA_2 28
SD_DATA_3 29
SD_CMD 30
SD_CLK 31
SD_DATA_0 32
GND 49
SD_DATA_1 33
GPIO5 34
GPIO18 35
GPIO19 38
CAP2 47
VDDA 43
XTAL_N 44
XTAL_P 45
GPIO23 36
U0TXD 41
GPIO22 39
GPIO21 42
VDD3P3_CPU 37
CAP1 48
VDDA 46
U0RXD 40
C1
22pF/6.3V(10%)
U3
FLASH
/CS
1
DO 2
/WP 3
GND
4
DI 5
CLK
6
/HOLD
7
VCC 8
Figure 4: ESP32-WROOM-32U Schematics
Espressif Systems 14 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
7. Peripheral Schematics
7. Peripheral Schematics
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
Espressif Systems
MTDI should be kept at a low electric level when powering up the module.
EN
TXD
RXD
IO0
MTMS
MTDI
MTCK
MTDO
IO23
IO22
IO21
IO19
IO18
IO5
IO4
IO2
SD2
SD3
CMD
CLK
SD0
SD1
SENSOR_VP
SENSOR_VN
IO34
IO35
IO32
IO33
IO25
IO26
IO27
IO17
IO16
VDD33
GND
VDD33
GND
GND
GND
GND
GND
GND
Title
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Application of ESP32-WROOM-32
A4
1 1Wednesday, August 07, 2019
Title
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<Doc> 1.0
Application of ESP32-WROOM-32
A4
1 1Wednesday, August 07, 2019
Title
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Date: Sheet o f
<Doc> 1.0
Application of ESP32-WROOM-32
A4
1 1Wednesday, August 07, 2019
R2 100R
R4 100R
C1 10uF
U2
JTAG
MTMS 1
MTDI 2
MTCK 3
MTDO 4
U1
GND1
1
3V3
2
EN
3
SENSOR_VP
4
SENSOR_VN
5
IO34
6
IO35
7
IO32
8
IO33
9
IO25
10
IO26
11
IO27
12
IO14
13
IO12
14
GND3 38
IO23 37
IO22 36
TXD0 35
RXD0 34
IO21 33
NC 32
IO19 31
IO18 30
IO5 29
IO17 28
IO16 27
IO4 26
IO0 25
GND2
15
IO13
16
SD2
17
SD3
18
CMD
19
CLK
20
SD0
21
SD1
22
IO15
23
IO2
24
P_GND 39
R1
TBD
C3 TBD
J1
UART DOWNLOAD
1
2
3
R3 100R
R5 100R
C2 0.1uF
J2
BOOT OPTION
1
2
Figure 5: ESP32-WROOM-32D & ESP32-WROOM-32U Peripheral Schematics
Espressif Systems 15 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
7. Peripheral Schematics
Note:
• Soldering Pad 39 to the Ground is not necessary for a satisfactory thermal performance. If users do want to solder it, they need to ensure that the correct quantity of soldering
paste is applied.
• When ESP32 is powered on and off repeatedly by switching the power rails, and there is a large capacitor on the 3V3 rail, a discharge circuit can be added to the 3V3 rail to ensure
proper power-on-reset. Please find the discharge circuit in Chapter Peripheral Schematics, in ESP32-WROOM-32 Datasheet.
• When battery is used as the power supply for ESP32 series of chips and modules, a supply voltage supervisor is recommended to avoid boot failure due to low voltage. Users are
recommended to pull CHIP_PU low if the power supply for ESP32 is below 2.3 V. For the reset circuit, please refer to Chapter Peripheral Schematics, in ESP32-WROOM-32 Datasheet.
• To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually
R = 10 kΩand C = 0.1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip.
For ESP32’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32 Datasheet.
Espressif Systems 16 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
8. Physical Dimensions
8. Physical Dimensions
PCB Thickness
Module Thickness
3.10±0.10
0.80±0.10
1.27±0.10
1.50±0.10
17.60±0.10
Module Width
Module Length
1.27±0.10
11.43±0.10
25.50±0.10
18.00±0.10
Unit: mm
16.51±0.10
11.43±0.10
3.28±0.10
1.27±0.10
25.50±0.10
ESP32-WROOM-32D DIMENSIONS
Top View Side View Bottom View
Antenna Area
0.90±0.10
0.85±0.10
6.20±0.10
15.80±0.10
1.50±0.10
3.60±0.10
3.60±0.10
8.50±0.10
5.70±0.10
0.45±0.10
0.90±0.10
18.00±0.10
3.28±0.10
∅0.50±0.10
Figure 6: Physical Dimensions of ESP32-WROOM-32D
Espressif Systems 17 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
8. Physical Dimensions
Figure 7: Physical Dimensions of ESP32-WROOM-32U
Espressif Systems 18 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
9. Recommended PCB Land Pattern
9. Recommended PCB Land Pattern
Unit: mm
Copper
Via for thermal pad
Antenna Area
18.00
25.50
1.50
1.27
1.27
2.00
0.90
5.00
5.00
1.33
1.33
10.51
8.00
0.50
0.50
1
15 24
38
6.30
17.00
Figure 8: Recommended PCB Land Pattern of ESP32-WROOM-32D
Espressif Systems 19 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
9. Recommended PCB Land Pattern
Unit: mm
Copper
Via for thermal pad
18.00
19.20
1.50
1.27
1.27
2.00
0.90
5.00
5.00
1.33
1.33
10.51
8.00
0.50
0.50
1
15 24
38
17.00
Figure 9: Recommended PCB Land Pattern of ESP32-WROOM-32U
Espressif Systems 20 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
10. U.FL Connector Dimensions
10. U.FL Connector Dimensions
Unit: mm
Figure 10: ESP32-WROOM-32U U.FL Dimensions
Espressif Systems 21 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
11. Learning Resources
11. Learning Resources
11.1 Must-Read Documents
The following link provides documents related to ESP32.
•ESP32 Datasheet
This document provides an introduction to the specifications of the ESP32 hardware, including overview, pin
definitions, functional description, peripheral interface, electrical characteristics, etc.
•ESP-IDF Programming Guide
It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.
•ESP32 Technical Reference Manual
The manual provides detailed information on how to use the ESP32 memory and peripherals.
•ESP32 Hardware Resources
The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development
boards.
•ESP32 Hardware Design Guidelines
The guidelines outline recommended design practices when developing standalone or add-on systems
based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development
boards.
•ESP32 AT Instruction Set and Examples
This document introduces the ESP32 AT commands, explains how to use them, and provides examples of
several common AT commands.
•Espressif Products Ordering Information
11.2 Must-Have Resources
Here are the ESP32-related must-have resources.
•ESP32 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share knowledge,
explore ideas, and help solve problems with fellow engineers.
•ESP32 GitHub
ESP32 development projects are freely distributed under Espressif’s MIT license on GitHub. It is established
to help developers get started with ESP32 and foster innovation and the growth of general knowledge about
the hardware and software surrounding ESP32 devices.
•ESP32 Tools
This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32 Certifi-
cation and Test”.
•ESP-IDF
This webpage links users to the official IoT development framework for ESP32.
•ESP32 Resources
This webpage provides the links to all available ESP32 documents, SDK and tools. �����������
Espressif Systems 22 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
Revision History
Revision History
Date Version Release notes
2019.09 V1.9
• Changed the supply voltage range from 2.7 V ~3.6 V to 3.0 V ~3.6 V;
• Added Moisture sensitivity level (MSL) 3 in Table 2ESP32-WROOM-32D and
ESP32-WROOM-32U Specifications;
• Added notes about ”Operating frequency range” and ”TX power” under Table
8Wi-Fi Radio Characteristics;
• Updated Section 7Peripheral Schematics and added a note about RC delay
circuit under it;
• Updated Figure 8and Figure 9Recommended PCB Land Pattern.
2019.01 V1.8 Changed the RF power control range in Table 10 from –12 ~+12 to –12 ~+9 dBm.
2018.10 V1.7
Added notice on module custom options under Table 2;
Added ”Cumulative IO output current” entry to Table 5: Absolute Maximum Ratings;
Added more parameters to Table 7: DC Characteristics.
2018.09 V1.6 Updated the hole diameter in the shield from 1.00 mm to 0.50 mm, in Figure 6.
2018.08 V1.5
• Added certifications and reliability test items the module has passed in Table 2:
ESP32-WROOM-32D and ESP32-WROOM-32U Specifications, and removed
software-specific information;
• Updated section 3.4: RTC and Low-Power Management;
• Changed the modules’ dimensions;
• Updated Figure 8and 7: Physical Dimensions;
• Updated Table 8: Wi-Fi Radio.
2018.06 V1.4
• Deleted Temperature Sensor in Table 2: ESP32-WROOM-32D & ESP32-
WROOM-32U Specifications;
• Updated Chapter 3: Functional Description;
• Added notes to Chapter 7: Peripheral Schematics;
• Added Chapter 8: Recommended PCB Land Pattern;
Changes to electrical characteristics:
• Updated Table 5: Absolute Maximum Ratings;
• Added Table 6: Recommended Operating Conditions;
• Added Table 7: DC Characteristics;
• Updated the values of ”Gain control step”, ”Adjacent channel transmit power”
in Table 10: Transmitter Characteristics - BLE.
2018.04 V1.3 Updated Figure 4ESP32-WROOM-32U Schematics and Figure 3ESP32-WROOM-
32D Schematics.
2018.02 V1.2 Update Figure 4ESP32-WROOM-32U Schematics.
2018.02 V1.1
Updated Chapter 6Schematics.
Deleted description of low-noise amplifier.
Replaced the module name ESP-WROOM-32D with ESP32-WROOM-32D.
Added information about module certification in Table 2.
Updated the description of eFuse bits in Section 3.1.
2017.11 V1.0 First release.
Espressif Systems 23 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9