This is information on a product in full production.
January 2014 Doc ID13566 Rev 3 1/11
T1635H , T1650H
High temperature 16 A Snubberless™ Triacs
Datasheet - production data
Features
Medi um current Triac
150 °C max. Tj tu r n - o ff commu ta tion
Low thermal resistance with clip bonding
Very high 3 quadr ants commutation capability
Packages are RoHS (2002/95 /EC) compliant
UL certified (ref. file E81734)
Applications
Especial ly designed to opera te in high power
dens ity or u nivers al motor applications such as
vacuum cleaner and washing machine drum
motor, these 16 A Triacs provide a very high
switching capability up to junction temperatures of
150 °C.
The heatsink can be reduced, com pared to
traditional Triacs, according to the high
perform ance at given junction temperatu res.
Description
Available in through-hole or surface mount
packages, the T1635 H and T1650H Triac se ries
are suitable for general purpo se mains power ac
switching.
By using an internal ceramic pad, the T16xxH-6I
provides voltage insulation (rated at 2500 V rms).
TM: Snubberless is a trademark of STMicroelect ronics
A2
A2
A2
A1
A1
G
G
A2
A2
A2
A1
A1
G
G
D²PAK
T16xxH-6G
TO-220AB insulated
T16xxH-6I
TO-220AB
T16xxH-6T
Table 1. Device summary
Symbol Value Unit
IT(RMS) 16 A
VDRM/VRRM 600 V
IGT 35 or 50 mA
www.st.com
Character istics T1635H, T1650 H
2/11 DocID13566 Rev 3
1 Characteristics
Table 2. Absol ute maximum ratin gs
Symbol Parameter Value Unit
IT(RMS) On-state rm s current (full sine wave) D2PAK, TO-220AB Tc = 130 °C 16 A
TO-220AB Ins Tc = 113 °C
ITSM Non repetitive surge peak on-state
current (full cyc le, Tj initial = 25 °C) F = 50 Hz t = 20 ms 160 A
F = 60 Hz t = 16.7 ms 168
I²tI
²t Value for fu sing tp = 10 ms 169 A²s
dI/dt Critical rate of rise of on- state current
IG = 2 x I GT, tr 100 ns F = 120 Hz Tj = 150 °C 50 A/µs
VDSM/VRSM Non repetitive surge peak off-state
voltage tp = 10 ms Tj = 25 °C VDRM/VRRM
+ 100 V
IGM Peak gate current tp = 20 µs Tj = 150 °C 4 A
PG(AV) Average gate power dissipation Tj = 150 °C 1 W
Tstg
Tj
S torage j unction temperature range
Operati ng junction temperature ra nge - 40 to + 150
- 40 to + 150 °C
Table 3 . Electrical chara cteri stics (Tj = 25 °C, unless otherwise specified)
Symbol Test conditions Quadrant Value Unit
T1635H T1650H
IGT (1) VD = 12 V, RL = 33 ΩI - II - II I MAX . 35 5 0 mA
VGT I - II - III MAX . 1 .0 V
VGD VD = VDRM, R L = 3.3 k I - II - III MIN. 0. 1 5 V
IH (2) IT = 500 mA MAX. 35 75 mA
ILIG = 1.2 IGT I - III MAX. 50 90 mA
II 80 110
dV/dt (2) VD = 67% VDRM, gate open, Tj = 150 °C MIN. 1000 1500 V/µs
(dI/dt)c (2) W ithout snubber, Tj = 150 °C MIN. 21 28 A/ms
1. minimum IGT is gua ranteed at 20% of IGT ma x .
2. for both polarities of A2 referenced to A1.
DocID13566 Rev 3 3/11
T1635H, T1650 H Characteri stics
11
Table 4. Static characteristics
Symbol Te st conditions V alue Unit
VT (1) ITM = 23 A, tp = 380 µs Tj = 25 °C MAX. 1.5 V
Vt0 (1) Threshold voltage Tj = 150 °C MAX. 0.80 V
Rd (1) Dynamic res istance Tj = 150 °C MAX. 23 m
IDRM
IRRM(2)
VDRM = VRRM Tj = 25 °C MAX. 5 µA
Tj = 150 °C MAX. 4.1
mAVD/VR = 400 V (at peak mains voltage) Tj = 150 °C MAX. 3.5
VD/VR = 200 V (at peak mains voltage) Tj = 150 °C MAX. 3.0
1. for both pol arities of A2 refer enced to A1
2. tp = 38 0 µs.
Table 5. Thermal resistance
Symbol Parameter Value Unit
Rth(j-c) Junction to case (AC) D2PAK / TO-220AB 1. 15
°C/W
TO- 2 2 0AB In s 2.1
Rth(j-a) Junction to ambient S = 1 cm2D2PAK 45
TO-220AB / TO-220AB Ins 60
Character istics T1635H, T1650 H
4/11 DocID13566 Rev 3
Figure 1. Maximum power dissipation versus
on-state rms current (full cycle) Figure 2. On-state rms current versus case
temperature (full cycle)
0
2
4
6
8
10
12
14
16
18
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
P(W)
=180 °
180°
I
T(RMS)
(A)
I
T(RMS)
(A)
0
2
4
6
8
10
12
14
16
18
0 25 50 75 100 125 150
D²PAK
TO-220AB
TO220AB ins
T
C
(°C)
Figure 3. On-st ate rms current versus ambient
temperature F igure 4. R elative variation of therm al
impeda nce vers us pu lse duration
I
T(RMS)
(A)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0 25 50 75 100 125 150
TO220AB ins
TO-220AB
Epoxy printed circuit board FR4,
copper thickness = 35 µm
T
amb
(°C)
= 180
°
D²PAK
S
CU
=1 cm²
1.0E-02
1.0E-01
1.0E+00
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
K=[Z
th
/R
th
]
Z
th(j-a)
Z
th(j-c)
tP(s)
Figure 5. On-state characteris tics
(maximum values) Figure 6. Surge peak on-st ate current versus
number of cycl es
1
10
100
1000
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
I
TM
(A)
T
j
=25 °C
T
j
=150 °C
T
j
max. :
V
t0
= 0.80 V
R
d
= 23 m
Ω
V
TM
(V)
0
20
40
60
80
100
120
140
160
180
1 10 100 1000
I
TSM
(A)
Non repetitive
Tjinitial=25 °C
Repetitive
Tc=110 °C
One cycle
t=20ms
Number of cycles
DocID13566 Rev 3 5/11
T1635H, T1650 H Characteri stics
11
Figure 7. Non-repetitive surge peak on-st ate
current for a sinuso idal puls e Figure 8. Rela tive variatio n of IGT,IH, IL vs
junction temper ature(typic al values)
100
1000
10000
0.01 0.10 1.00 10.00
I
TSM
(A), I²t (A²s)
Tj initial=25 °C
dI/dt limitation: 50 A/µs
I
TSM
I²t
t
P
(ms)
width t < 10 ms and corresponding value of I t
p
2
0.0
0.5
1.0
1.5
2.0
2.5
-40 -20 0 20 40 60 80 100 120 140 160
I
GT
,I
H
,I
L
[T
j
]/I
GT
,I
H
,I
L
[T
j
=25°C]
IGT
IH& IL
T
j
(°C)
Figure 9. Relative variation of crit ical rate of
decrease of main current (dI/dt)c versus
reap pl ied (dV /dt)c
Figur e 10. Relative variation of critical rate of
decrease of main current versus junction
temperature
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.1 1.0 10.0 100.0
(dI/dt)
c
[(dV/dt)
c
] / Specified (dI/dt)
c
(dV/dt)
C
(V/µs)
typical values
0
1
2
3
4
5
6
7
8
25 50 75 100 125 150
(dI/dt)
c
[T
j
] / (dI/dt)
c
[T
j
=150°C]
T
j
(°C)
Figure 11. Leakage current versus junction
temperature for different values of blocking
voltage (typical values)
Figure 12. Variation of therma l resistance
junction to ambient versus copper surface
unde r tab
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
R
th(j-a)
(°C/W)
D²PAK
S
CU
(cm²)
Epoxy printed circuit board FR4,
copper thickness = 35 µm
Pack age information T1635H, T1650 H
6/11 DocID13566 Rev 3
2 Package information
Epoxy meets UL94, V0
Lead-free package
Recomm ended t orque: 0.4 to 0.6 N ·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® pack ages, depe nding on their level of environmen tal co mpl iance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark .
Figure 13. TO-220AB dimension definitions
C
b2
c2
F
Ø I
L
A
a1
a2
B
eb1
I4
l3
l2
c1
M
DocID13566 Rev 3 7/11
T1635H, T1650 H Packag e in formati on
11
Table 6. TO-220AB dimension val ues
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 15.20 15.90 0.598 0.625
a1 3.75 0.147
a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
b1 0.61 0.88 0.024 0.034
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
c1 0.49 0.70 0.019 0.027
c2 2.40 2.72 0.094 0.107
e 2.40 2.70 0.094 0.106
F 6.20 6.60 0.244 0.259
ØI 3.75 3. 85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M 2.60 0.102
Pack age information T1635H, T1650 H
8/11 DocID13566 Rev 3
Figure 14. PAK dimension definitions
G
L
L3
L2
B
B2
E
2mm min.
FLAT ZONE
A
C2
D
R
A2
V2
C
A1
DocID13566 Rev 3 9/11
T1635H, T1650 H Packag e in formati on
11
Figure 15. PAK footprint
Table 7. D²PAK dimensi on values
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.25 1.40 0.048 0.055
C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
R 0.40 0.016
V2
16.90
12.2
9.75 3.50
5.08
1.60
2.54
Order ing informati on T1635H, T1650 H
10/11 DocID13566 Rev 3
3 Ordering information
Figure 16. Ordering information scheme
4 Revision history
Table 8. Ordering information
Orde r code Mark ing Package Weight Base qty Delivery mode
T16xxH-6G T16xxH 6G D2PAK 1.5 g 50 T ube
T16xxH-6G-TR T16xxH 6G D2PAK 1.5 g 1000 Tape and reel
T16xxH-6T T16xxH 6T TO-220AB 2.3 g 50 Tube
T16xxH-6I T16xxH 6I TO-220AB Ins 2. 3 g 50 Tube
T 16 xx H - 6 y -TR
Triac series
Current
Sensitivity
Package
16 = 16 A
35 = 35 mA
50 = 50 mA
G = D2PA K
High temperature
Voltage
Packing
6 = 600 V
T = TO-220AB
I = TO-220AB Ins
Blank = Tube (D2PAK, TO-220AB)
-TR = Tape and reel (D2PAK)
Table 9. Document revision history
Date Revision Changes
29-May-2007 1 First issue.
20-Sep-2011 2 Updated: Features, Description and Figure 2.
31-Jan-2014 3 Updated Figure 2, Figure 3, Figure 4, Table 2 and
Table 5.
DocID13566 Rev 3 11/11
T1635H, T1650 H
11
Pl ease Read Carefull y:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time , with out noti ce.
All ST products are sol d purs uant to ST’s te rm s and con di t io ns of sale.
Purc hasers are s ol ely res ponsible for the choice , se l ectio n and us e of the S T produc ts and se rvice s des cribed he rei n, and S T assumes no
liability whats oever relating to the choice, selection or use of the ST pro ducts and services desc ribed herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
docum ent refe rs to any th i rd par ty products or services i t s hall not be deem ed a license grant by ST for t he use of such third party products
or ser vic es, or an y inte llec tual proper ty co ntai ned t herei n or con sid ered as a war rant y cove rin g the us e in any mann er what soev er of such
third part y products or serv i ces or any i ntell ectual property contai ned t herein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE
SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B)
AE RO NAUTIC A PP L ICATIONS ; (C) AUTOM O T IV E APPL ICATION S O R E N V IRON ME NT S, AN D/OR (D ) AERO SP ACE A PP L ICATION S
OR ENVIR ONMENT S. WHERE ST PRO DUCTS ARE NO T DESIG NED FOR SU CH USE, THE PU RCHASER SHALL USE PROD UCTS AT
PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS
EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY
DOM AIN S A CCOR DIN G TO ST P ROD UCT DES IGN S PECI FI CAT IONS. PR ODUC TS F ORMA LL Y ESC C, QML OR J AN Q UALI FIE D AR E
DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any w arr anty grant ed by ST for t he ST pro duct or se rv ice des cri bed he rein and shal l no t cre ate o r ext end in a ny m anner w ha tsoe ver, any
liability of ST.
ST and the ST lo go are tradem arks or registered tr ademarks of ST in va ri ous countr i es.
Info rm ation in th i s document super sedes and replace s all i nfor m ation previ ously suppl i ed.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2014 ST M i croelectronics - Al l rights reserved
STM i cro el ectronics grou p of companies
Australi a - Belgi um - Bra zi l - Cana da - China - Czech Republ i c - Finl and - F ranc e - Germany - Hong Kong - India - Israel - It aly - Japan -
Malaysia - Malta - Morocco - Philippines - Singa pore - Spain - Sweden - Switzerla nd - United Kingdom - United States of America
www.st.com