SMD B EASV1003RA0 Features Package in 8mm tape on 7diameter reel. Compatible with automatic placement equipment. Compatible with infrared and vapor phase reflow solder process. Mono-color type. Pb-free. The product itself will remain within RoHS compliant version. Compliance with EU REACH. Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm). Description The SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. Besides, lightweight makes them ideal for miniature applications. etc. Applications Telecommunication: indicator and backlighting in telephone and fax. Flat backlight for LCD, switch and symbol. General 1 Copyright (c) 2010,Everlight Americas Inc. All Rights Reserved.Release Date :12-Mar-2015 Issue No:DSE-0012873 Rev.2 www.everlightamericas.com DATASHEET SMD B EASV1003RA0 Device Selection Guide Chip Materials AlGaInP Emitted Color Resin Color Brilliant Red Water Clear Absolute Maximum Ratings (Ta=25) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF 25 mA IFP 60 mA Power Dissipation Pd 60 mW Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40 ~ +90 Electrostatic Discharge ESDHBM 2000 V Soldering Temperature Tsol Peak Forward Current (Duty 1/10 @1KHz) Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. Electro-Optical Characteristics (Ta=25) Parameter Symbol Min. Typ. Max. Unit Luminous Intensity Iv 11.5 ----- 28.5 mcd Viewing Angle 21/2 ----- 125 ----- deg Peak Wavelength p ----- 632 ----- nm Dominant Wavelength d 617.5 ----- 633.5 nm ----- 20 ----- nm Forward Voltage VF 1.7 ---- 2.2 V Reverse Current IR ----- ----- 10 A Spectrum Radiation Bandwidth Condition IF=5mA VR=5V Note: 1.Tolerance of Luminous Intensity: 11% 2.Tolerance of Dominant Wavelength 1nm 3.Tolerance of Forward Voltage: 0.05V 2 Copyright (c) 2010,Everlight Americas Inc. All Rights Reserved.Release Date :12-Mar-2015 Issue No:DSE-0012873 Rev.2 www.everlightamericas.com DATASHEET SMD B EASV1003RA0 Bin Range of Luminous Intensity Bin Code Min. Max. L1 11.5 14.5 L2 14.5 18.0 M1 18.0 22.5 M2 22.5 28.5 Unit Condition mcd IF =5mA Bin Range Of Dom. Wavelength Group Bin Code Min. Max. E4 617.5 621.5 E5 621.5 625.5 E6 625.5 629.5 E7 629.5 633.5 Bin Code Min. Max. 19 1.7 1.8 20 1.8 1.9 21 1.9 2.0 22 2.0 2.1 23 2.1 2.2 A Unit Condition nm IF =5mA Unit Condition V IF =5mA Bin Range Of Luminous Voltage Group V Note: 1.Tolerance of Luminous Intensity: 11% 2.Tolerance of Dominant Wavelength 1nm 3.Tolerance of Forward Voltage: 0.05V 3 Copyright (c) 2010,Everlight Americas Inc. All Rights Reserved.Release Date :12-Mar-2015 Issue No:DSE-0012873 Rev.2 www.everlightamericas.com DATASHEET SMD B EASV1003RA0 Typical Electro-Optical Characteristics Curves Forward Current vs. Forward Voltage 75 50 25 50 40 30 25 20 10 0 500 550 600 650 Wavelength (nm) 0 1.2 700 Forward Current Relative luminous intensity (%) Relative luminous intensity (%) Ambient Temperature 1000 100 10 1 -60 -40 -20 1.6 2.0 2.4 2.8 3.0 Forward Voltage VF (V) Luminous Intensity vs. Luminous Intensity vs. 0 20 40 60 80 100 Ta=25C 1000 100 10 1 0 10 10 1 10 2 Forward Current IF (mA) Ambient Temperature Ta (C) Radiation Diagram 0 10 Forward Current Derating Curve Forward Current IF (mA) Ta=25C Ta=25C 100 Forward Current IF (mA) Relative luminous intensity (%) Spectrum Distribution 50 Ta=25C 20 30 40 40 30 25 1.0 20 0.9 50 0.8 60 10 70 0.7 0 0 20 40 60 85 100 80 90 0.5 0.3 0.1 0.2 0.4 0.6 Ambient Temperature Ta (C) 4 Copyright (c) 2010,Everlight Americas Inc. All Rights Reserved.Release Date :12-Mar-2015 Issue No:DSE-0012873 Rev.2 www.everlightamericas.com DATASHEET SMD B EASV1003RA0 Package Dimension Suggested pad dimension is just for reference only. Please modify the pad dimension based on individual need. Note: Tolerances unless mentioned 0.1mm. Unit = mm 5 Copyright (c) 2010,Everlight Americas Inc. All Rights Reserved.Release Date :12-Mar-2015 Issue No:DSE-0012873 Rev.2 www.everlightamericas.com DATASHEET SMD B EASV1003RA0 Moisture Resistant Packing Materials Label Explanation Pb EVERLIGHT CPN : P N : XXXXXXXXXXXXX RoHS XXXXXXXXXXXXX CPN: Customer's Product Number P/N: Product Number QTY: Packing Quantity CAT: Luminous Intensity Rank HUE: Chromaticity Coordinates & Dom. Wavelength Rank REF: Forward Voltage Rank LOT No: Lot Number CAT : XXX HUE : XXX REF : XXX QTY : XXX LOT NO : XXXXXXXXXX Reference : XXXXXXXX MADE IN TAIWAN Reel Dimensions Note: The tolerances unless mentioned is 0.1mm ,Unit = mm 6 Copyright (c) 2010,Everlight Americas Inc. All Rights Reserved.Release Date :12-Mar-2015 Issue No:DSE-0012873 Rev.2 www.everlightamericas.com DATASHEET SMD B EASV1003RA0 Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel Front view Bottom view Note: The tolerances unless mentioned is 0.1mm ,Unit = mm Moisture Resistant Packaging Label 7 Aluminum moisture-proof bag Desiccant Label Copyright (c) 2010,Everlight Americas Inc. All Rights Reserved.Release Date :12-Mar-2015 Issue No:DSE-0012873 Rev.2 www.everlightamericas.com DATASHEET SMD B EASV1003RA0 Precautions For Use 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30 or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30 or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 605 for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 260C Max. 10sec. Max. Above255C 30sec.Max. 3C/sec.Max. 6C/sec.Max. Pre-heating Above 217C 60~150sec. 150~200C 60~120sec. 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 8 Copyright (c) 2010,Everlight Americas Inc. All Rights Reserved.Release Date :12-Mar-2015 Issue No:DSE-0012873 Rev.2 www.everlightamericas.com DATASHEET SMD B EASV1003RA0 Application Restrictions High reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. If you have any concerns, please contact Everlight before using this product in your application. This specification guarantees the quality and performance of the product as an individual component. Do not use this product beyond the specification described in this document. 9 Copyright (c) 2010,Everlight Americas Inc. All Rights Reserved.Release Date :12-Mar-2015 Issue No:DSE-0012873 Rev.2 www.everlightamericas.com