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IECQ-CECC QC 88000-C001
COMPONENT ISSUE 6
SPECIFICATION
March 2007
Component Specification
For
Ceramic Hermetically Sealed
Transistor Optocouplers
Up-to-date lists and bibliographical references of IEQC-CECC publications may be downloaded from www.iecq.org
Further copies of this document may be obtained from:
IEC
International Electrotechnical Commission
Commission Electrotechnique Internationale
Box 131, rue de Varembé, CH 1211 Geneva 20, Switzerland
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©2007 Copyright reserved to Isocom Limited Page 2 of 12 QC 88000-C001: 2007
FOREWORD
The IECQ Quality Assessment System for Electronic Components (IECQ) is composed of those member countries of
the International Electrotechnical Commission (IEC) who wish to take part in a harmonized system for electronic
components of assessed quality. IECQ is also known in some European member countries as IECQ-CECC.
The object of the System is to facilitate international trade by the harmonization of the specifications and quality
assessment procedures for electronic components, and by the grant of an internationally recognised Mark, or
Certificate of Conformity. The components produced or services provided under the system are thereby acceptable in
all member countries without further testing.
This Component Specification is based upon the requirements of IEC Publication QC 001002-2, and has been
prepared by:
Isocom Ltd
Hutton Close
Crowther Industrial Estate
Washington
Tyne and Wear
NE38 0AH
Tel: +44 0191 4166 546
Fax: +44 0191 4155 055
and published under the authority of:
BSI Product Services
Maylands Avenue
Hemel Hempstead
Hertfordshire
HP2 4SQ
United Kingdom
AMENDMENT RECORD
Issue 1 - Changed Page 10 – Amendments 25/06/10
Issue 2 - Changed Page 4 – Amendments 22/03/10
Issue 3 - Changed Pages 4 & 6 – Updated Drawings 25/06/10
Issue 4 - Changed Pages 3 & 4 – Added devices IS49 & 4N49 05/07/10
Issue 5 - Changed Pages 3, 4, 5, 6, 7 & 10 – RoHS Compliant, Added CSM165-2 & Amendments 13/07/10
REQUIREMENTS
The requirements for IECQ-CECC Component Specifications as detailed in QC 001002-2 Amendment 1 clause 5.4
are satisfied by the following data sheet.
It should note that IECQ-CECC are not responsible for manufacturers declarations made in data sheets which fall
outside the limits of approved detailed in IECQ-CECC certificates.
This Component Specification is intended for use with applicable IECQ-CECC Assessment Specifications. Eg: QC
88000-A0001
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©2007 Copyright reserved to Isocom Limited Page 3 of 12 QC 88000-C001: 2007
Ceramic Hermetically Sealed Transistor Optocouplers
■ 4N24 ■ CSM1200
■ 4N49 ■ CSM1224
■ CD500/501 ■ CSM165-2
■ CH300 ■ CSM165-4
■ CS200/201 ■ CSM2224
■ CS224 ■ IS49
■ CSM200
Features Applications
▪ Release to IECQ-CECC ▪ Military, high reliability system
▪ Hermetically Sealed ▪ Medical instruments
▪ High Density Packaging ▪ Mos, Cmos Applications
▪ 1500V DC withstand Test Voltage ▪ Logic Interfacing
▪ Low Input Requirements ▪ Data Transmission
▪ High Current Transfer Ratio ▪ Power Supply
▪ RoHS Compliant ▪ Modems
Description
These devices are single, dual and quad, hermetically sealed optocouplers. Each channel is
composed of an infra-red emitting diode and a silicon phototransistor. Package styles for these
devices include 6 pin, 8 pin, 16 pin flat pack, and hybrid 4 pin, with surface mount, butt cut and gull
wing options available.
The same electrical die, assembly processes and materials are used for each channel of each
device shown below. Therefore absolute maximum ratings, recommended operating conditions,
electrical specifications and performance characteristics are identical for all units. Any exceptions,
due to packaging variations and limitations, are as noted.
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©2007 Copyright reserved to Isocom Limited Page 4 of 12 QC 88000-C001: 2007
Selection Guide Package Styles and Configuration Options
Package
4 pin
Hybrid
6 pin
Metal Can
TO-5 6 pin LCC 6 pin DIP 8 pin DIP
16 pin
Flat Pack
Lead Style
Channels 1 1 1 1 2 2/4
Common Channel Wiring
Isocom Part Numbers and Options
Commercial CH300
4N24
4N49
CSM200, IS49
CSM1200/1244/2224
CS200/201
CS224
CD500
CD501 CSM165
Defense Screen Level CH300/L2
4N24/L2
4N49/L2
CSM200/L2, IS49/L2
CSM1200/1244/2224/L2
CM200/201/L2
CS224/L2
CD500/L2
CD501/L2 CSM165/L2
Space Screen Level CH300/L2S
4N24/L2S
4N49/L2S
CSM200/L2S, IS49/L2S
CSM1200/1244/2224/L2S
CS200/201/L2S
CS224/L2S
CD500/L2S
CD501/L2S CSM165/L2S
Standard Gold Plate Finish Gold Plate Gold Plate Gold Plate Gold Plate Gold Plate
Solder Dipped Option 20 Option 20
Butt Cut/Gold Plate Option 10 Option 10
Gull Wing/Soldered Option 30 Option 30
Crew Cut/Gold Plate Option 60 Option 60
Functional Diagrams
CH300 CS200/201 CSM200 CSM1224
IS49
CD500
CD501 CSM165-2
4 pin Hybrid 6 pin DIP 6 pin LCC 6 pin LCC 8 pin DIP 16 pin Flat Pack
1 Channel 1 Channel 1 Channel 1 Channel 2 Channel *2 Channel
1
2
6
5
4
6
1
5
4
3
4N24
4N49 CS224 CSM1200
CSM2224 CSM165-4
6 pin TO-5 6 pin DIP ** 6 pin LCC 6 pin LCC 16 pin Flat Pack
1 Channel 1 Channel 1 Channel 1 Channel 4 Channel
5
7
3
2
1
6
1
5
4
3
6
1
5
4
3
* Note 2 channel is only for circuit of 2 middle channels 2 & 3 channel on the circuits.
** See Outline Drawings 6 Terminal LCC Surface Mount, 1 Channel
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©2007 Copyright reserved to Isocom Limited Page 5 of 12 QC 88000-C001: 2007
Outline Drawings
16 pin Flat Pack, 2 and 4 Channel
7.24 (0.285)
6.99 (0.275)
11.13 (0.438)
10.72 (0.422)
2.29 (0.09)
max
1.27 (0.05)
Ref
0.46 (0.018)
0.36 (0.014)
8.13 (0.32)
Max
2.85 (0.112)
Max
5.23
(0.206)
Max
9.02 (0.355)
8.76 (0.345)
0.31 (0.012)
0.23 (0.009)
0.89 (0.035)
0.69 (0.027)
0.88 (0.0345)
Min
NOTE: DIMENSIONS IN MILLIMETERS
8 pin DIP 2 Channel
0.51 (0.020)
Min
9.40 (0.370)
9.91 (0.39)
0.76 (0.03)
1.27 (0.05)
4.32 (0.17)
Max
3.81 (0.15)
Min
0.51 (0.02)
Max
2.29 (0.09)
2.79 (0.11)
7.36 (0.29)
7.87 (0.31)
0.2 (0.008)
0.33 (0.013)
7.16 (0.282)
7.57 (0.298)
8.13 (0.32)
Max
NOTE: DIMENSIONS IN MILLIMETERS
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6 pin TO-5, 1 Channel
0.040(1.02)
0.32 (8.13)
0.5 (12.70)
0.17 (4.32)
0.022 (5.08)
45.0°
0.037 (0.935)
0.031 (0.787)
1
2
356
7
6 LEADS
0.0175 (0.445)
6 pin DIP 1 channel
8.94
9.34
7.16
7.56
7.62
8.12 0.63
1.14
0.4
0.5
2.54
3.5 MIN
1.37 TYP
2.8 MIN
0.22
0.3
NOTE: DIMENSIONS IN MILLIMETERS
6 Terminal LCC Surface Mount, 1 Channel
6.223
4.318
1.651 2.286
0.635
1.27 2.54
R = 0.2286
0.635
1.67
0.762
**
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©2007 Copyright reserved to Isocom Limited Page 7 of 12 QC 88000-C001: 2007
Device Marking
XXXXXXX
ISOCOM
XXXX
Isocom Part Number
Manufacturer
Date Code (XX year XX week)
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©2007 Copyright reserved to Isocom Limited Page 8 of 12 QC 88000-C001: 2007
Hermetic Optocoupler Options
Option
Description
10
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is
available on commercial hi-rel product in 8 and 16 pin DIP
0.51 (0.02)
Min 2.29 (0.09)
2.79 (0.11)
0.51 (0.02)
Max
1.14 (0.045)
1.40 (0.055)
4.32 (0.17)
Max
0.51 (0.2)
Min
2.29 (0.09)
2.79 (0.11)
0.51 (0.02)
Max
1.14 (0.045)
1.40 (0.055)
4.32 (0.17)
Max 0.2 (0.008)
0.33 (0.013)
7.36 (0.29)
7.87 (0.31)
20
30
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is
available on commercial and hi-rel product in 8 and 16 pin DIP.
0.51 (0.02)
Min
2.29 (0.9)
2.79 (0.11)
0.51 (0.02)
Max
1.4 (0.055)
1.65 (0.065)
4.57 (0.18)
Max
0.51 (0.02)
Min
2.29 (0.09)
2.79 (0.11) 0.51 (0.02)
Max
1.4 (0.055)
1.65 (0.065)
4.57 (0.18)
Max
9.65 (0.38)
9.91 (0.39)
0.2 (0.008)
0.33 (0.013)
4.57 (0.18)
Max
5 deg
Max
60
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is
available on commercial hi-rel product in 8 and 16 pin DIP
0.51 (0.02)
Min
2.29 (0.09)
2.79 (0.11) 1.14 (0.045)
1.25 (0.049)
0.2 (0.008)
0.33 (0.013)
7.36 (0.29)
7.87 (0.31)
3.81 (0.15)
Min
0.51 (0.02)
Min
2.29 (0.09)
2.79 (0.11)
1.02 (0.04)
Typ
3.81 (0.15)
Max
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Absolute Maximum Ratings
Storage Temperature -65°C to +150°C
Operating Temperature -55°C to +125°C
Lead Soldering Temperature 260°C 1.6mm from case for 10S
1500VDC Input-to-Output Isolation Voltage
500VDC for CH300
Input Diode
50mA Forward DC Current
15mA For CH300
7V
5V For CH300
3V For CSM165
Reverse DC Voltage
2V For CS224
Peak forward Current 1.5mA ≤ 10µS duration
100mW Derate linearly above 100°C at 1.6W/°C.
150mW For CD500/501 andCSM165. Derate linearly above
100°C at 1.4W/°C for CD500/501, and at 1.6 W/°C for
CSM165
Power Dissipation
25mW For CH300
Output Transistor
Collector-Emitter Voltage 50V BV
CEO
30V For CH300
35V For CS224
Emitter-Collector Voltage 7V BV
ECO
70V BV
CBO
For CS200/201 and CS224 Collector-Base Voltage
35V For CS224
50mA Collector Current
20mA For CH300
Collector Current 100mA t = 1mS
100mW For CH300. Derate linearly above 100°C at 1.4W/°C Power Dissipation
150mW For CS200/201, CS224, CD500/501 and CSM165.
Derate linearly above 100°C at 1.4W/°C
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Electrical Characteristics
T
A
= 25°C U.O.S. (each channel where appropriate).
Input Diode Electrical Characteristics
Parameter Symbol Test Conditions Device Min Type Max Units
I
F
= 10mA 0.7 1.18 1.8
I
F
= 10mA, T
A
= 125°C 0.7 1.10 1.8
Forward Voltage V
F
I
F
= 10mA, T
A
= -55°C
0.7 1.29 1.8
V
(note 4)
Reverse Breakdown
Voltage
V
R
I
R
= 0.1mA 5 - - V
Reverse Current I
R
V
R
= 3V - - 100 µA
Capacitance C
IN
V = 0, f = 1MHz - 25 - pF
Output Detector Electrical Characteristics
Collector-Emitter
Breakdown Voltage
(See note 1 below)
BV
CEO
I
C
= 1mA
CH300
40
30
- - V
Collector-Base Breakdown
Voltage
(See note 1 below)
BV
CBO
I
B
= 0.1mA 70 - - V
Emitter-Collector
Breakdown Voltage
BV
ECO
I
E
= 0.1mA 7 - - V
Emitter-Base Breakdown
Voltage
BV
EBO
I
B
= 0.1mA 5 - - V
V
CE
= 20V, I
F
= 0
V
CE
= 15v I
F
= 0
CSM165
- 6 100 µA Collector-Emitter Leakage
Current
I
CEO
V
CE
= 20V, I
F
= 0, T
A
= 125°C - 8 100 µA
Coupled Electrical Characteristics
I
F
= 10mA, V
CE
= 5V
CS201
50
100
- -
I
F
= 10mA, V
CE
= 5V, T
A
= 125°C CS201 50 - -
I
F
= 10mA, V
CE
= 5V, T
A
= -55°C CS201 50 - -
DC Current Transfer Ratio
(See note 3)
IC/IF
I
F
= 10mA, V
CE
= 5V; T
A
= -55°C-125°C 35 - -
%
Optical Crosstalk I
CEOX
V
CE
= 15v, , I
F
2-4 = 10mA. CSM165 250 µA
I
F
= 10mA, I
C
= 2.5mA - - 0.3
I
F
= 10mA, I
C
= 10mA CSM165 0.4 0.9
V Collector-Emitter Saturation
Voltage
V
CE
(Sat)
I
F
= 2mA, I
C
= 0.2mA CH300 0.25
Input to Output Capacitance C
IO
V
IO
= 0, f = 1mhz (See note 2 below) - 3 5 pF
Input to Output Resistance R
IO
V
IO
= 500V (See note 2 below) - 10
11
-
Ω
Isolation Voltage V
IO
(See note 2 below)
CH300
1500
500
- - VDC
Delay Time td V
CC
= 5V, I
C
= 2mA - 4.0 µS
Rise Time tr R
L
= 100Ohms - 5.0 µS
Storage Time ts - 0.7 µS
Fall Time tf - 5.0 µS
Turn -on Time t
on
V
CC
= 5V, I
f
= 5mA - 9 µS
Turn-off Time t
off
R
L
= 1KOhms - 25 µS
Notes: 1. BV
CEO
and BV
CBO
can be selected to suit customer specifications.
2. Measured between input when leads 1, 2 and 3 are shorted together and output when leads 4, 5 and 6 are shorted together.
3. A higher CTR can be selected to suit customer specification as a standard part.
4. For Radiation Tolerant V
F
max = 2.0v
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©2007 Copyright reserved to Isocom Limited Page 11 of 12 QC 88000-C001: 2007
Electrical Characteristics
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