SEMIPACK®1
Rectifier Diode Modules
SKMD 100
Features
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Typical Applications*
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SKMD
-./0 -..0 1+.0/ 3 45# ' 6 * 7
- - 1+'- 3 488 ' 6 498: ;3 9# <(7
#88 =88 />0, 488)8=
?88 988 />0, 488)89
4#88 4=88 />0, 488)4=
4588 4!88 />0, 488)4!
Symbol Conditions Values Units
1+'- 498: ;3 9# 64887 <( 488 6!57 '
1,@")498: ;3 =# <(: A$ ) A! 5" ) ?4 '
@")498+: ;3 "# <(: A$ ) A! 4#8 ) 4?8 '
1+/0 ;* 3 $# <(: 48 $#88 '
;* 3 4$# <(: 48 $888 '
B ;* 3 $# <(: 9" 48 "4$#8 'B
;* 3 4$# <(: 9" 48 $8888 'B
-+;* 3 $# <(: 1+3 "88 ' 4"# -
-6;C7 ;* 3 4$# <( 89# -
;;* 3 4$# <( 4" D
1., ;* 3 4$# <(: -., 3 -..0 # '
.6&7 ) 8"# ) 845# >)E
.6&7 ) 8$ ) 84 >)E
;* & =8 F 4$# <(
; & =8 F 4$# <(
- #8 : : 4 ) 4 "!88 ) "888 -G
0 H # I 4# J %
0 " I 4# J %
# K ?94 )B
?#
( />0, ' ""
SKMD 100 THYRISTOR BRIDGE,SCR,BRIDGE
1 08-07-2009 GIL © by SEMIKRON
http://store.iiic.cc/
Fig. 11L Power dissipation per diode vs. forward current Fig. 11R Power dissipation per diode vs. ambient temperature
Fig. 12L Power dissipation of two modules vs. direct current Fig. 12R Power dissipation of two modules vs case temperature
Fig. 13L Power dissipation of three modules vs. direct current Fig. 13R Power dissipation of three modules vs. case temperature
RECTIFIER,DIODE,THYRISTOR,MODULE
2 08-07-2009 GIL © by SEMIKRON
http://store.iiic.cc/
Fig. 14 Transient thermal impedance vs. time Fig. 15 Forward characteristics
Fig. 16 Surge overload current vs. time
SKMD 100 THYRISTOR BRIDGE,SCR,BRIDGE
3 08-07-2009 GIL © by SEMIKRON
http://store.iiic.cc/
Dimensions in mm
( ' 48 6/>>,7
( '"" />0,
* The specifications of our components may not be considered as an assurance of component characteristics.
Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON
products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We
therefore strongly recommend prior consultation of our personal.
RECTIFIER,DIODE,THYRISTOR,MODULE
4 08-07-2009 GIL © by SEMIKRON
http://store.iiic.cc/
