USA 858 674 8100
••
Germany 49 7032 7806 0
••
Singapore 65 6287 8998
••
Shanghai
86 21 54643211 / 2
••
China 86 755 33966678
••
Taiwan 886 3 4641811
www.pulseeng.com
39 SPM2007 (7/07)
SMT POWER INDUCTORS
Shielded Drum Core - P1172/P1173 Series
.362
9,20
.492
12,50
.630
16,00
.945
24,00
TAPE & REEL LAYOUT
.079
2,00
SUGGESTED PAD LAYOUT
.472
12,00
.315
8,00
.315
8,00
.118
3,00
.134
3,40
.075
1,91
12
SUGGESTED PAD LAYOUT
.039
1,00
.472
12,00
.315
8,00
.039
1,00
.366
9,30
.315
8,00
.197
5,00
12
.075
1,91
P1172P1173P1172/P1173
.315
8,00
1
2
XXX
.482
12,24
MAX
.482
12,24
MAX
MAX
1
2
Mechanical
Schematic:
Weight . . . . . . . . 4.5 grams
Tape & Reel. . . . . . 400/reel
Dimensions: Inches
mm
Unless otherwise specified, all tolerances are ± .010
0,25
Height: 8.0mm Max
Footprint: 12.2mm x 12.2mm Max
Current Rating: up to 14A
Inductance Range: .8µH to 51µH
Part 2,3 Inductance Inductance Irated 5DCR (mΩΩ)Saturation 6Heating 7Core Loss 8
SRF
Numbers @0ADC @Irated (ADC)Current Current Factor (MHz)
(μH) (μH) MIN TYP MAX -25% (A) +40°C(A) (K2)
P1172.132 P1173.132 1.3* 0.8 14 2.3 3 15 14 90 >40
P1172.202 P1173.202 2.0* 1.3 10 4.5 6 13 10 110 >40
P1172.272 P1173.272 2.7* 1.8 9 5.8 7.3 11 9 130 >40
P1172.372 P1173.372 3.7* 2.4 8.3 6.8 8.5 9.2 8.3 150 37
P1172.472 P1173.472 4.7* 3.1 7.9 7.6 9.5 8.2 7.9 170 33
P1172.602 P1173.602 6.0* 3.9 6 13 16.5 6.9 6 200 30
P1172.762 P1173.762 7.6* 4.9 5.7 14.3 18.5 6.2 5.7 220 25
P1172.103 P1173.103 10 7.5 5.2 17.3 21.8 5.5 5.2 250 20
P1172.123 P1173.123 12 9 4.5 23.3 29 5.1 4.5 280 18
P1172.153 P1173.153 15 11.3 4.1 28.3 35.4 4.4 4.1 300 15
P1172.183 P1173.183 18 13.5 4 29.4 37 4.3 4 340 13
P1172.223 P1173.223 22 16.5 3.8 33.2 42 3.8 3.8 370 12
P1172.273 P1173.273 27 20.3 3.4 36.2 45.9 3.4 3.6 410 11
P1172.333 P1173.333 33 24.8 3 49.3 64.8 3 3.1 460 10
P1172.393 P1173.393 39 29.3 2.7 65.2 81.5 2.8 2.7 490 8
P1172.473 P1173.473 47 35.3 2.6 71.4 89 2.6 2.6 550 7
P1172.683 P1173.683 68 51 2.1 108 135 2.1 2.1 670 6
*Inductance at 0ADC tolerance on indicated part numbers is ±30%; tolerance is ±20% on all other parts.
NOTES FROM TABLE: (See page 43)
Electrical Specifications @ 25°C — Operating Temperature -40°C to +130°C
USA 858 674 8100
••
Germany 49 7032 7806 0
••
Singapore 65 6287 8998
••
Shanghai
86 21 54643211 / 2
••
China 86 755 33966678
••
Taiwan 886 3 4641811
www.pulseeng.com
43 SPM2007 (7/07)
SMT POWER INDUCTORS
Shielded Drum Core Series
Notes from Tables (pages 27 - 42)
1. Unless otherwise specified, all testing is made at
100kHz, 0.1VAC.
2. Optional Tape & Reel packaging can be ordered by
adding a "T" suffix to the part number (i.e. P1166.102
becomes P1166.102T). Pulse complies with industry
standard Tape and Tape & Reel specification EIA481.
3. To order RoHS compliant part, add the suffix "NL"
to the part number (i.e. P1166.102 becomes
P1166.102NL and P1166.102T becomes
P1166.102NLT).
4. Temperature of the component (ambient plus
temperature rise) must be within specified operating
temperature range.
5. The rated current (Irated) as listed is either the satura-
tion current or the heating current depending on which
value is lower.
6. The saturation current, Isat, is the current at which
the component inductance drops by the indicated
percentage (typical) at an ambient temperature of
25°C. This current is determined by placing the
component in the specified ambient environment and
applying a short duration pulse current (to eliminate
self-heating effects) to the component.
7. The heating current, Idc, is the DC current required
to raise the component temperature by the indicated
delta (approximately). The heating current is
determined by mounting the component on a
typical PCB and applying current for 30 minutes. The
temperature is measured by placing the thermocouple
on top of the unit under test.
8. In high volt*time (Et) or ripple current applications, addi-
tional heating in the component can occur due to core
losses in the inductor which may necessitate derating
the current in order to limit the temperature rise of the
component. In order to determine the approximate total
loss (or temperature rise) for a given application, both
copper losses and core losses should be taken into
account.
Estimated Temperature Rise:
Trise = [Total loss (mW) / K0].833 (oC )
Total loss = Copper loss + Core loss (mW)
Copper loss = IRMS2x DCR (Typical) (mW)
Irms = [IDC2+ ΔI2/12]1/2 (A)
Core loss = K1 x f (kHz)1.23 x Bac(Ga)2.38 (mW)
Bac (peak to peak flux density) = K2 x ΔI (Ga)
[= K2/L(µH) x Et(V-µSec) (Ga)]
where f varies between 25kHz and 1MHz, and Bac is
less than 2500 Gauss.
K2 is a core size and winding dependant value and
is given for each p/n in the proceeding datasheets.
K0 & K1 are platform and material dependant constants
and are given in the table below for each platform.
PG0085/86 2.3 5.29E-10
PG0087 5.8 15.2E-10
PG0040/41 0.8 2.80E-10
P1174 0.8 6.47E-10
PF0601 4.6 14.0E-10
PF0464 3.6 24.7E-10
PF0465 3.6 33.4E-10
P1166 1.9 29.6E-10
P1167 2.1 42.2E-10
PF0560NL 5.5 136E-10
P1168/69 4.8 184E-10
P1170/71 4.3 201E-10
P1172/73 5.6 411E-10
PF0552NL 8.3 201E-10
PF0553NL 7.1 411E-10
Part No. Trise Factor Core Loss Factor
(K0 ) (K1)
Take note that the component's temperature rise varies depending on the system condition. It is suggested that the
component be tested at the system level, to verify the temperature rise of the component during system operation.
CoreLoss/K1 Vs Flux Density
0
0.50E+10
1.00E+10
1.50E+10
2.00E+10
2.50E+10
3.00E+10
0 500 1000 1500 2000 2500
DB (Gauss)
where DB = K2 x DI [= K2/L(µH) x Et(V-µSec)]
Core Loss / K1 (mW)
100KHz
200KHz
300KHz
400KHz
500KHz
700KHz
1.0MHz
