FEATURES
* Planar Die Construction
*200mW Power Dissipation on FR-4 PCB
*General purpose,Medium Current
*
MECHANICAL DATA
* Case: Molded plastic
MMBZ5223BW-
MMBZ5259BW
Ldeally Suited for Automated Assembly
SOT-323
Dimensions in inches and (millimeters)
2008-12
REV: A
ELECTRICAL CHARACTERISTICS ( @ TA = 25oC unless otherwise noted )
Max. Instantaneous Forward Voltage at IF= 10mA
CHARACTERISTICS SYMBOL UNITS
625
0.9
Volts
oC/WThermal Resistance Junction to Ambient (Note 1)
MAXIMUM RATINGES (@ TA = 25oC unless otherwise noted )
RATINGS
Max. Steady State Power Dissipation @TA=25oC (Note 1)
Max. Operating Temperature Range
Storage Temperature Range
SYMBOL
PD
TJ
TSTG
RqJA
VF
VALUE
MAX.
-
-
TYP.
-
-
MIN.
UNITS
mW200
-65 to +150
-65 to +150
oC
oC
SURFACE MOUNT ZENER DIODE
VOLTAGE RANGE 2.7 to 39 Volts POWER RATING 200 mWatts
Note 1. Valid provided that device terminals are kept at amblent temperaturt.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 oC ambient temperature unless otherwise specified.
*Epoxy: UL 94V-O rate flame retardant
*Lead: MIL-STD-202E method 208C guaranteed
*Mounting position: Any
*Weight: 0.006 gram
0.087(2.20)
0.008(0.20)
0.016(0.40)
0.003(0.08)
0.006(0.15)
0.079(2.00)
0.055(1.40)
0.047(1.20)
0.096(2.45)
0.085(2.15)
REF 0.021(0.53)
0.043(1.10)
0.035(0.90)
0.004(0.10)
0.000(0.00)
0.053(1.35)
0.045(1.15)
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
3.0
4.0
5.0
6.0
6.5
7.0
8.0
8.4
9.1
9.9
11
12
14
15
17
18
21
21
23
25
27
30
75
50
25
15
10
5.0
5.0
5.0
5.0
5.0
3.0
3.0
3.0
3.0
3.0
2.0
1.0
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
1300
1600
1600
1700
1900
2000
1900
1600
1600
1000
750
500
500
600
600
600
600
600
600
600
600
600
600
600
600
600
600
700
700
800
30
30
28
24
23
22
19
17
11
7
5
6
8
10
17
22
30
13
16
17
21
25
29
33
41
44
49
58
70
80
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
9.5
8.5
7.8
7.0
6.2
5.6
5.2
5.0
4.5
4.2
3.8
3.4
3.2
2.57
2.85
3.14
3.42
3.71
4.09
4.47
4.85
5.32
5.89
5.89
6.46
7.13
7.79
8.65
9.50
10.45
11.40
12.35
14.25
15.20
17.10
19.00
20.90
22.80
25.65
28.50
31.35
34.20
37.05
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
28
30
33
36
39
2.84
3.15
3.47
3.78
4.10
4.52
4.94
5.36
5.88
6.51
7.14
7.88
8.61
9.56
11.55
10.50
12.60
13.65
15.75
16.80
18.90
21.00
23.10
25.20
28.35
29.40
31.50
34.65
37.80
40.95
MMBZ5223BW
MMBZ5225BW
MMBZ5226BW
MMBZ5227BW
MMBZ5228BW
MMBZ5229BW
MMBZ5230BW
MMBZ5231BW
MMBZ5232BW
MMBZ5234BW
MMBZ5235BW
MMBZ5236BW
MMBZ5237BW
MMBZ5239BW
MMBZ5240BW
MMBZ5241BW
MMBZ5242BW
MMBZ5243BW
MMBZ5245BW
MMBZ5246BW
MMBZ5248BW
MMBZ5250BW
MMBZ5251BW
MMBZ5252BW
MMBZ5254BW
MMBZ5255BW
MMBZ5256BW
MMBZ5257BW
MMBZ5258BW
MMBZ5259BW
ELECTRICAL CHARACTERISTICS
(@TA=25OC unless otherwise specified)
Test Maximum Zener impedance Maximum
Max
Min
Nom
Volts
Volts
Volts
Zener voltage Range (Note 1)
current reverse leakage current
V
Z
(V) @ I
ZT
Z
ZT
at
at I
ZT
Z
ZK
I
ZK
I
R
at V
R
I
ZT
(mA) (mA) (uA) (V)
TYPE
(W)(W)
Note 1. Tested with pulses,Tp<1.0ms.
RATING AND CHARACTERISTICS CURVES ( MMBZ5223BW-MMBZ5259BW )
0.4
0.3
0.2
0.1
0
1000
100
10
1000
1
50
PPK,PEAK SURGE POWER (W)
100
10
100
10
1
40
30
20
10
0
0 1 2 3 4 5 6 7 8 9 10
1 10 100
0 10 20 30 40
1 10 100 1000
0 25 50 75 100 125 150 1 10 100
30
20
10
0
PD,POWER DISSIPATION(W)DYNAMIC ZENER IMPEDANCE(W)IZ,ZENER CURRENT(mA)
IZ,ZENER CURRENT(mA) CT,TOTAL CAPACITANCE(pF)
Figure 1 Power Dissipation vs Ambient Temperature
PULSE WIDTH(ms)
Figure 3 Zener Voltage vs Zener Impedence Figure 4 Maximum Non-repetitive Surge Power
TA,AMBIENT TEMPERATURE(
O
C) VZ,NOMINAL ZENER VOLTAGE(V)
VZ,NOMINAL ZENER VOLTAGE(V)
VZ,ZENER VOLTAGE(V)
Figure 2 Total Capacitance vs Nominal Zener Voltage
Figure 5 Zener Breakdown Characteristics
VZ,ZENER VOLTAGE(V)
Figure 6 Zener Breakdown Characteristics
I
Z
= 1.0mA
TJ = 25
O
C TJ = 25
O
C
TJ = 25
O
C
f = 1MHz
5V6 10
12
15
18
22 27
33 36 39
6V8
8V2
Test Current Iz
20mA
Test Current Iz
Nominal Zener Voltage
V
R
=1V
V
R
=2V
RECTRON
Rectron Inc reserves the right to make changes without notice to any product
specification herein, to make corrections, modifications, enhancements or other
changes. Rectron Inc or anyone on its behalf assumes no responsibility or liabi-
lity for any errors or inaccuracies. Data sheet specifications and its information
contained are intended to provide a product description only. "Typical" paramet-
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n and do vary in different applications and actual performance may vary over ti-
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