DATA SH EET
Product specification
Supersedes data of 2002 Feb 27 2002 Jul 19
INTEGRATED CIRCUITS
TDA1308; TDA1308A
Class AB stereo headphone driver
2002 Jul 19 2
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308; TDA1308A
FEATURES
Wide temperature range
No switch ON/OFF clicks
Excellent power supply ripple rejection
Low power consumption
Short-circuit resistant
High performance
high signal-to-noise ratio
high slew rate
low distortion
Large output voltage swing.
GENERAL DESCRIPTION
TheTDA1308;TDA1308AisanintegratedclassABstereo
headphonedrivercontainedinanSO8,DIP8oraTSSOP8
plasticpackage. Thedevice isfabricated ina 1 mmCMOS
process and has been primarily developed for portable
digital audio applications.
The difference between the TDA1308 and the TDA1308A
is that the TDA1308A can be used at low supply voltages.
QUICK REFERENCE DATA
VDD =5V; V
SS =0V; T
amb =25°C; fi= 1 kHz; RL=32; unless otherwise specified.
Notes
1. VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB).
2. VDD = 2.4 V; VO(p-p) = 1.62 V (at 4.8 dBV); for TDA1308A only.
3. VDD = 2.4 V; VO(p-p) = 1.19 V (at 7.96 dBV); for TDA1308A only.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VDD supply voltage TDA1308
single 3.0 5.0 7.0 V
dual 1.5 2.5 3.5 V
supply voltage TDA1308A
single 2.4 5.0 7.0 V
dual 1.2 2.5 3.5 V
VSS negative supply voltage 1.5 2.5 3.5 V
IDD supply current no load 35mA
P
tot total power dissipation no load 15 25 mW
Pomaximum output power THD < 0.1%; note 1 60 mW
(THD + N)/S total harmonic distortion
plus noise-to-signal ratio note 1 0.03 0.06 %
−−70 65 dB
RL=5k; note 2 −−92 89 dB
RL=5k; note 3 −−52 40 dB
RL=5kΩ−101 dB
S/N signal-to-noise ratio 100 110 dB
αcs channel separation 70 dB
RL = 5 kΩ−105 dB
PSRR power supply ripple rejection fi= 100 Hz; Vripple(p-p) = 100 mV 90 dB
Tamb ambient temperature 40 +85 °C
2002 Jul 19 3
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308; TDA1308A
ORDERING INFORMATION
BLOCK DIAGRAM
TYPE NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA1308 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
TDA1308T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TDA1308AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TDA1308TT TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1
handbook, halfpage
2
1
3
4
8
7
6
5
INA(neg)
TDA1308(A)
OUTA
MKA779
VSS
VDD
INA(pos)
INB(neg)
INB(pos)
OUTB
Fig.1 Block diagram.
PINNING
SYMBOL PIN DESCRIPTION
OUTA 1 output A
CD) 2 inverting input A
INA(pos) 3 non-inverting input A
VSS 4 negative supply
INB(pos) 5 non-inverting input B
INB(neg) 6 inverting input B
OUTB 7 output B
VDD 8 positive supply
handbook, halfpage
1
2
3
4
8
7
6
5
MKA780
TDA1308(A)
VDD
OUTBINA(neg)
INB(neg)
INB(pos)
VSS
INA(pos)
OUTA
Fig.2 Pin configuration.
2002 Jul 19 4
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308; TDA1308A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Human body model: C = 100 pF; R = 1500 ; 3 pulses positive plus 3 pulses negative.
2. Machine model: C = 200 pF: L = 0.5 mH: R = 0 ; 3 pulses positive plus 3 pulses negative.
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
In accordance with
“UZW-BO/FQ-0601”
. The numbers of the quality specification can be found in the
“Quality Reference
Handbook”
. The handbook can be ordered using the code 9398 510 63011.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VDD supply voltage 0 8.0 V
tSC(O) output short-circuit duration Tamb =25°C; Ptot =1W 20 s
T
stg storage temperature 65 +150 °C
Tamb operating ambient temperature 40 +85 °C
Vesd electrostatic discharge note 1 2000 +2000 V
note 2 200 +200 V
SYMBOL PARAMETER VALUE UNIT
Rth j-a thermal resistance from junction to ambient in free air
DIP8 109 K/W
SO8 210 K/W
TSSOP8 220 K/W
handbook, full pagewidth
MKA781
A1
A2
M2 M3
M6
M5
M4
I1
Cm
VDD
INA/B(neg)
INA/B(pos)
OUTA/B
VSS
D4
M1
D3D2D1
Fig.3 Equivalent schematic diagram.
2002 Jul 19 5
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308; TDA1308A
CHARACTERISTICS
VDD =5V; V
SS =0V; T
amb =25°C; fi= 1 kHz; RL=32; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
VDD supply voltage TDA1308
single 3.0 5.0 7.0 V
dual 1.5 2.5 3.5 V
supply voltage TDA1308A
single 2.4 5.0 7.0 V
dual 1.2 2.5 3.5 V
VSS negative supply voltage 1.5 2.5 3.5 V
IDD supply current no load 35mA
P
tot total power dissipation no load 15 25 mW
DC characteristics
VI(os) input offset voltage 10 mV
Ibias input bias current 10 pA
VCM common mode voltage 0 3.5 V
Gvopen-loop voltage gain RL=5kΩ−70 dB
IOmaximum output current (THD + N)/S < 0.1% 60 mA
ROoutput resistance 0.25 −Ω
V
Ooutput voltage swing note 1 0.75 4.25 V
RL=161.5 3.5 V
RL=5k0.1 4.9 V
PSRR power supply rejection ratio fi= 100 Hz;
Vripple(p-p) = 100 mV 90 dB
αcs channel separation 70 dB
RL=5kΩ−105 dB
CLload capacitance −−200 pF
AC characteristics
(THD + N)/S totalharmonic distortionplus
noise-to-signal ratio note 2 −−70 65 dB
0.03 0.06 %
note 3 −−52 40 dB
0.25 1.0 %
RL=5kΩ; note 2 −−101 dB
0.0009 %
S/N signal-to-noise ratio 100 110 dB
fGunity gain frequency open-loop; RL=5kΩ− 5.5 MHz
Pomaximum output power (THD + N)/S < 0.1% 60 mW
Ciinput capacitance 3pF
SR slew rate unity gain inverting 5V/µs
B power bandwidth unity gain inverting 20 kHz
2002 Jul 19 6
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308; TDA1308A
Notes
1. Values are proportional to VDD; (THD + N)/S < 0.1%.
2. VDD = 5.0 V; VO(p-p) = 3.5 V (at 0 dB).
3. VDD = 2.4 V; VO(p-p) = 1.13 V (at 7.96 dBV); for TDA1308A only.
TEST AND APPLICATION INFORMATION
handbook, full pagewidth
MKA782
1
2
3
5
6
74
8
RL
VOUTA
VDD
VINA
VINB
Vref
(typ. 2.5 V)
RL
VOUTB
3.9 k
3.9 k
3.9 k
3.9 k
100 µF
100 µF
C6
100 µF
TDA1308(A)
Fig.4 Measurement circuit for inverting application.
2002 Jul 19 7
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308; TDA1308A
handbook, full pagewidth
MKA783
1
2
3
5
6
74
8
R5
10 k
R6
10 k
C3
1 µF
R1
22 k
C8
C7
R4
C4
R3
C5
1 nF
R2
BCK
WS
DATA
VDD
Vref
5
4
1
2
36
7
8
3.9 k
33 k
C2
10 µFC1
100 nF
3.9 k
1 nF
100 µF
100 µF
C6
100 µF
TDA1308(A)TDA1545A
Fig.5 Example of application with TDA1545A (stereo continuous calibration DAC).
handbook, halfpage
0
40
80
MKA784
102103fi (Hz)
Gv
(dB)
104105106107108
no load
RL = 32
Fig.6 Open-loop gain as a function of input
frequency.
handbook, halfpage
130
110
70
90
MKA785
102
101103104105
fi (Hz)
Gv
(dB)
32
RL = 16
5 k
Fig.7 Crosstalk as a function of input frequency.
2002 Jul 19 8
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308; TDA1308A
handbook, halfpage
3
Po
(mW)
4VDD (V)
5
100
10
20
40
60
MKA786
RL = 16
32
8
Fig.8 Output power as a function of supply voltage.
handbook, halfpage
110
90
70
50
MKA787
101102103104105
fi (Hz)
(THD+N)/S
(dB)
RL = 5 kΩ; VO(p-p) = 3.5 V
RL = 32 Ω; Po = 50 mW
RL = 16 Ω; Po = 50 mW
Fig.9 Total harmonic distortion plus noise-to-signal ratio as a function of input frequency.
2002 Jul 19 9
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308; TDA1308A
handbook, halfpage
40
80
100
60
MKA788
102101110
R
L
= 8
16
32
5 k
fi = 1 kHz
VO(p-p) (V)
(THD+N)/S
(dB)
Fig.10 Total harmonic distortion plus noise-to-signal ratio as a function of output voltage level.
2002 Jul 19 10
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308; TDA1308A
PACKAGE OUTLINES
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT97-1 95-02-04
99-12-27
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0450.17 0.020 0.13
b2
050G01 MO-001 SC-504-8
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
2002 Jul 19 11
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308; TDA1308A
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03 MS-012
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
97-05-22
99-12-27
2002 Jul 19 12
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308; TDA1308A
UNIT A1
A
max. A2A3bpLHELpwyv
ceD
(1) E(2) Z(1) θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
0.05 0.95
0.80 0.45
0.25 0.28
0.15 3.10
2.90 3.10
2.90 0.65 5.10
4.70 0.70
0.35 6°
0°
0.1 0.10.10.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.70
0.40
SOT505-1 99-04-09
wM
bp
D
Z
e
0.25
14
85
θ
A
A
2
A
1
L
p
(A3)
detail X
L
HE
E
c
vMA
X
A
y
2.5 5 mm0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1
1.10
pin 1 index
2002 Jul 19 13
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308; TDA1308A
SOLDERING
Introduction
Thistextgivesa very briefinsighttoa complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-holeandsurfacemountcomponentsaremixedon
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Surface mount packages
REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit boardby screenprinting, stencillingor
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
WAVE SOLDERING
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Forpackageswithleadsonfour sides, the footprintmust
be placed at a 45°angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
MANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 °C.
2002 Jul 19 14
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308; TDA1308A
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
MOUNTING PACKAGE SOLDERING METHOD
WAVE REFLOW(1) DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable(2) suitable
Surface mount BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, SMS not suitable(3) suitable
PLCC(4), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(4)(5) suitable
SSOP, TSSOP, VSO not recommended(6) suitable
2002 Jul 19 15
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308; TDA1308A
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DATA SHEET STATUS(1) PRODUCT
STATUS(2) DEFINITIONS
Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseor at anyotherconditions above thosegiven in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentation orwarranty that such applicationswill be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofanyofthese products, conveys nolicenceortitle
under any patent, copyright, or mask work right to these
products,andmakes norepresentations or warrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
© Koninklijke Philips Electronics N.V. 2002 SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Printed in The Netherlands 753503/03/pp16 Date of release: 2002 Jul 19 Document order number: 9397 750 09985