TDA1308TT/N2 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 2002 Feb 27 2002 Jul 19

INTEGRATED CIRCUITS

TDA1308; TDA1308A

Class AB stereo headphone driver

2002 Jul 19 2

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308; TDA1308A

FEATURES

•Wide temperature range

•No switch ON/OFF clicks

•Excellent power supply ripple rejection

•Low power consumption

•Short-circuit resistant

•High performance

– high signal-to-noise ratio

– high slew rate

– low distortion

•Large output voltage swing.

GENERAL DESCRIPTION

TheTDA1308;TDA1308AisanintegratedclassABstereo

headphonedrivercontainedinanSO8,DIP8oraTSSOP8

plasticpackage. Thedevice isfabricated ina 1 mmCMOS

process and has been primarily developed for portable

digital audio applications.

The difference between the TDA1308 and the TDA1308A

is that the TDA1308A can be used at low supply voltages.

QUICK REFERENCE DATA

VDD =5V; V

SS =0V; T

amb =25°C; fi= 1 kHz; RL=32Ω; unless otherwise speciﬁed.

Notes

1. VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB).

2. VDD = 2.4 V; VO(p-p) = 1.62 V (at −4.8 dBV); for TDA1308A only.

3. VDD = 2.4 V; VO(p-p) = 1.19 V (at −7.96 dBV); for TDA1308A only.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VDD supply voltage TDA1308

single 3.0 5.0 7.0 V

dual 1.5 2.5 3.5 V

supply voltage TDA1308A

single 2.4 5.0 7.0 V

dual 1.2 2.5 3.5 V

VSS negative supply voltage −1.5 −2.5 −3.5 V

IDD supply current no load −35mA

tot total power dissipation no load −15 25 mW

Pomaximum output power THD < 0.1%; note 1 −60 −mW

(THD + N)/S total harmonic distortion

plus noise-to-signal ratio note 1 −0.03 0.06 %

−−70 −65 dB

RL=5kΩ; note 2 −−92 −89 dB

RL=5kΩ; note 3 −−52 −40 dB

RL=5kΩ−−101 −dB

S/N signal-to-noise ratio 100 110 −dB

αcs channel separation −70 −dB

RL = 5 kΩ−105 −dB

PSRR power supply ripple rejection fi= 100 Hz; Vripple(p-p) = 100 mV −90 −dB

Tamb ambient temperature −40 −+85 °C

2002 Jul 19 3

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308; TDA1308A

ORDERING INFORMATION

BLOCK DIAGRAM

TYPE NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA1308 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

TDA1308T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

TDA1308AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

TDA1308TT TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1

handbook, halfpage

INA(neg)

TDA1308(A)

OUTA

MKA779

VSS

VDD

INA(pos)

INB(neg)

INB(pos)

OUTB

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

OUTA 1 output A

CD) 2 inverting input A

INA(pos) 3 non-inverting input A

VSS 4 negative supply

INB(pos) 5 non-inverting input B

INB(neg) 6 inverting input B

OUTB 7 output B

VDD 8 positive supply

handbook, halfpage

MKA780

TDA1308(A)

VDD

OUTBINA(neg)

INB(neg)

INB(pos)

VSS

INA(pos)

OUTA

Fig.2 Pin configuration.

2002 Jul 19 4

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308; TDA1308A

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

Notes

1. Human body model: C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative.

2. Machine model: C = 200 pF: L = 0.5 mH: R = 0 Ω; 3 pulses positive plus 3 pulses negative.

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

In accordance with

“UZW-BO/FQ-0601”

. The numbers of the quality specification can be found in the

“Quality Reference

Handbook”

. The handbook can be ordered using the code 9398 510 63011.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VDD supply voltage 0 8.0 V

tSC(O) output short-circuit duration Tamb =25°C; Ptot =1W 20 −s

stg storage temperature −65 +150 °C

Tamb operating ambient temperature −40 +85 °C

Vesd electrostatic discharge note 1 −2000 +2000 V

note 2 −200 +200 V

SYMBOL PARAMETER VALUE UNIT

Rth j-a thermal resistance from junction to ambient in free air

DIP8 109 K/W

SO8 210 K/W

TSSOP8 220 K/W

handbook, full pagewidth

MKA781

M2 M3

VDD

INA/B(neg)

INA/B(pos)

OUTA/B

VSS

D3D2D1

Fig.3 Equivalent schematic diagram.

2002 Jul 19 5

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308; TDA1308A

CHARACTERISTICS

VDD =5V; V

SS =0V; T

amb =25°C; fi= 1 kHz; RL=32Ω; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

VDD supply voltage TDA1308

single 3.0 5.0 7.0 V

dual 1.5 2.5 3.5 V

supply voltage TDA1308A

single 2.4 5.0 7.0 V

dual 1.2 2.5 3.5 V

VSS negative supply voltage −1.5 −2.5 −3.5 V

IDD supply current no load −35mA

tot total power dissipation no load −15 25 mW

DC characteristics

VI(os) input offset voltage −10 −mV

Ibias input bias current −10 −pA

VCM common mode voltage 0 −3.5 V

Gvopen-loop voltage gain RL=5kΩ−70 −dB

IOmaximum output current (THD + N)/S < 0.1% −60 −mA

ROoutput resistance −0.25 −Ω

Ooutput voltage swing note 1 0.75 −4.25 V

RL=16Ω1.5 −3.5 V

RL=5kΩ0.1 −4.9 V

PSRR power supply rejection ratio fi= 100 Hz;

Vripple(p-p) = 100 mV −90 −dB

αcs channel separation −70 −dB

RL=5kΩ−105 −dB

CLload capacitance −−200 pF

AC characteristics

(THD + N)/S totalharmonic distortionplus

noise-to-signal ratio note 2 −−70 −65 dB

−0.03 0.06 %

note 3 −−52 −40 dB

−0.25 1.0 %

RL=5kΩ; note 2 −−101 −dB

−0.0009 −%

S/N signal-to-noise ratio 100 110 −dB

fGunity gain frequency open-loop; RL=5kΩ− 5.5 −MHz

Pomaximum output power (THD + N)/S < 0.1% −60 −mW

Ciinput capacitance −3−pF

SR slew rate unity gain inverting −5−V/µs

B power bandwidth unity gain inverting −20 −kHz

2002 Jul 19 6

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308; TDA1308A

Notes

1. Values are proportional to VDD; (THD + N)/S < 0.1%.

2. VDD = 5.0 V; VO(p-p) = 3.5 V (at 0 dB).

3. VDD = 2.4 V; VO(p-p) = 1.13 V (at −7.96 dBV); for TDA1308A only.

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

MKA782

VOUTA

VDD

VINA

VINB

Vref

(typ. 2.5 V)

VOUTB

3.9 kΩ

100 µF

TDA1308(A)

Fig.4 Measurement circuit for inverting application.

2002 Jul 19 7

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308; TDA1308A

handbook, full pagewidth

MKA783

10 kΩ

1 µF

22 kΩ

1 nF

BCK

DATA

VDD

Vref

3.9 kΩ

33 kΩ

10 µFC1

100 nF

3.9 kΩ

1 nF

100 µF

TDA1308(A)TDA1545A

Fig.5 Example of application with TDA1545A (stereo continuous calibration DAC).

handbook, halfpage

MKA784

10−210−3fi (Hz)

(dB)

10−410−510−610−710−8

no load

RL = 32 Ω

Fig.6 Open-loop gain as a function of input

frequency.

handbook, halfpage

−130

−110

−70

−90

MKA785

10−2

10−110−310−410−5

fi (Hz)

(dB)

32 Ω

RL = 16 Ω

5 kΩ

Fig.7 Crosstalk as a function of input frequency.

2002 Jul 19 8

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308; TDA1308A

handbook, halfpage

(mW)

4VDD (V)

100

MKA786

RL = 16 Ω

32 Ω

8 Ω

Fig.8 Output power as a function of supply voltage.

handbook, halfpage

−110

−90

−70

−50

MKA787

10−110−210−310−410−5

fi (Hz)

(THD+N)/S

(dB)

RL = 5 kΩ; VO(p-p) = 3.5 V

RL = 32 Ω; Po = 50 mW

RL = 16 Ω; Po = 50 mW

Fig.9 Total harmonic distortion plus noise-to-signal ratio as a function of input frequency.

2002 Jul 19 9

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308; TDA1308A

handbook, halfpage

−40

−80

−100

−60

MKA788

10−210−1110

= 8 Ω

16 Ω

32 Ω

5 kΩ

fi = 1 kHz

VO(p-p) (V)

(THD+N)/S

(dB)

Fig.10 Total harmonic distortion plus noise-to-signal ratio as a function of output voltage level.

2002 Jul 19 10

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308; TDA1308A

PACKAGE OUTLINES

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

SOT97-1 95-02-04

99-12-27

UNIT A

max. 12 b

1(1) (1) (1)

b2cD E e M Z

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min. A

max. bmax.

1.73

1.14 0.53

0.38 0.36

0.23 9.8

9.2 6.48

6.20 3.60

3.05 0.2542.54 7.62 8.25

7.80 10.0

8.3 1.154.2 0.51 3.2

inches 0.068

0.045 0.021

0.015 0.014

0.009

1.07

0.89

0.042

0.035 0.39

0.36 0.26

0.24 0.14

0.12 0.010.10 0.30 0.32

0.31 0.39

0.33 0.0450.17 0.020 0.13

050G01 MO-001 SC-504-8

(e )

seating plane

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

pin 1 index

DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1

2002 Jul 19 11

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308; TDA1308A

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.050 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

97-05-22

99-12-27

2002 Jul 19 12

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308; TDA1308A

UNIT A1

max. A2A3bpLHELpwyv

ceD

(1) E(2) Z(1) θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 0.15

0.05 0.95

0.80 0.45

0.25 0.28

0.15 3.10

2.90 3.10

2.90 0.65 5.10

4.70 0.70

0.35 6°

0°

0.1 0.10.10.94

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.70

0.40

SOT505-1 99-04-09

0.25

(A3)

detail X

vMA

2.5 5 mm0

scale

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1

1.10

pin 1 index

2002 Jul 19 13

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308; TDA1308A

SOLDERING

Introduction

Thistextgivesa very briefinsighttoa complex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-holeandsurfacemountcomponentsaremixedon

one printed-circuit board. Wave soldering can still be used

for certain surface mount ICs, but it is not suitable for fine

pitch SMDs. In these situations reflow soldering is

recommended.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joints for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg(max)). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

MANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit

is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

tothe printed-circuit boardby screenprinting, stencillingor

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

convection or convection/infrared heating in a conveyor

type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending

on heating method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 220 °C for

thick/large packages, and below 235 °C for small/thin

packages.

WAVE SOLDERING

Conventional single wave soldering is not recommended

forsurfacemountdevices(SMDs)or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackageswithleadsonfour sides, the footprintmust

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

MANUAL SOLDERING

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C. When using a dedicated tool, all other leads can

be soldered in one operation within 2 to 5 seconds

between 270 and 320 °C.

2002 Jul 19 14

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308; TDA1308A

Suitability of IC packages for wave, reﬂow and dipping soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

MOUNTING PACKAGE SOLDERING METHOD

WAVE REFLOW(1) DIPPING

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable(2) −suitable

Surface mount BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable −

HBCC, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, HVQFN, SMS not suitable(3) suitable −

PLCC(4), SO, SOJ suitable suitable −

LQFP, QFP, TQFP not recommended(4)(5) suitable −

SSOP, TSSOP, VSO not recommended(6) suitable −

2002 Jul 19 15

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308; TDA1308A

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DATA SHEET STATUS(1) PRODUCT

STATUS(2) DEFINITIONS

Objective data Development This data sheet contains data from the objective specification for product

development. Philips Semiconductors reserves the right to change the

speciﬁcation in any manner without notice.

Preliminary data Qualiﬁcation This data sheet contains data from the preliminary specification.

Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the speciﬁcation without

notice, in order to improve the design and supply the best possible

product.

Product data Production This data sheet contains data from the product specification. Philips

Semiconductors reserves the right to make changes at any time in order

to improve the design, manufacturing and supply. Changes will be

communicated according to the Customer Product/Process Change

Notiﬁcation (CPCN) procedure SNW-SQ-650A.

DEFINITIONS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

attheseor at anyotherconditions above thosegiven in the

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Application information  Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

norepresentation orwarranty that such applicationswill be

suitable for the specified use without further testing or

modification.

DISCLAIMERS

Life support applications  These products are not

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductorscustomers using or selling these products

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes  Philips Semiconductors

reserves the right to make changes, without notice, in the

products, including circuits, standard cells, and/or

software, described or contained herein in order to

improve design and/or performance. Philips

Semiconductors assumes no responsibility or liability for

theuseofanyofthese products, conveys nolicenceortitle

under any patent, copyright, or mask work right to these

products,andmakes norepresentations or warrantiesthat

these products are free from patent, copyright, or mask

work right infringement, unless otherwise specified.

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Philips Semiconductors – a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825

For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands 753503/03/pp16 Date of release: 2002 Jul 19 Document order number: 9397 750 09985