SCLS177E - MARCH 1984 - REVISED AUGUST 2003 D D D D D D Drive Bus Lines Directly or Up To 15 LSTTL Loads Low Power Consumption, 80-A Max ICC Typical tpd = 22 ns 6-mA Output Drive at 5 V Low Input Current of 1 A Max Inputs Are TTL-Voltage Compatible Bus-Structured Pinout SN54HCT574 . . . J OR W PACKAGE SN74HCT574 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) OE 1D 2D 3D 4D 5D 6D 7D 8D GND description/ordering information These octal edge-triggered D-type flip-flops feature 3-state outputs designed specifically for bus driving. The 'HCT574 devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q CLK 2D 1D SN54HCT574 . . . FK PACKAGE (TOP VIEW) 3D 4D 5D 6D 7D The eight flip-flops enter data on the low-to-high transition of the clock (CLK) input. 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 2Q 3Q 4Q 5Q 6Q 8D GND CLK 8Q 7Q A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components. OE VCC 1Q D Operating Voltage Range of 4.5 V to 5.5 V D High-Current 3-State Noninverting Outputs ORDERING INFORMATION PACKAGE TA PDIP - N SN74HCT574N Tube of 25 SN74HCT574DW Reel of 2000 SN74HCT574DWR SOP - NS Reel of 2000 SN74HCT574NSR HCT574 SSOP - DB Reel of 2000 SN74HCT574DBR HT574 Tube of 70 SN74HCT574PW Reel of 2000 SN74HCT574PWR Reel of 250 SN74HCT574PWT CDIP - J Tube of 20 SNJ54HCT574J SNJ54HCT574J CFP - W Tube of 85 SNJ54HCT574W SNJ54HCT574W LCCC - FK Tube of 55 SNJ54HCT574FK TSSOP - PW -55C -55 C to 125 125C C TOP-SIDE MARKING Tube of 20 SOIC - DW -40C to 85C ORDERABLE PART NUMBER SN74HCT574N HCT574 HT574 SNJ54HCT574FK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated !"#$ $%$ $&'"%$ !''#$ % & (!)*%$ %#+ '! $&'" (#&%$ (#' # #'" & #,% $'!"#$ %$%' -%''%$.+ '!$ ('#$/ # $ $##%'*. $*!# #$/ & %** (%'%"##'+ POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SCLS177E - MARCH 1984 - REVISED AUGUST 2003 description/ordering information (continued) OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. FUNCTION TABLE (each flip-flop) INPUTS OE CLK D OUTPUT Q L H H L L L L H or L X Q0 H X X Z logic diagram (positive logic) OE CLK 1 11 C1 1D 2 19 1Q 1D To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA Package thermal impedance, JA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCLS177E - MARCH 1984 - REVISED AUGUST 2003 recommended operating conditions (see Note 3) SN54HCT574 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO t/v Output voltage 0 High-level input voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V SN74HCT574 2 2 Input transition rise/fall time V V 0.8 VCC VCC UNIT 0 0 500 0.8 V VCC VCC V 500 ns V TA Operating free-air temperature -55 125 -40 85 C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VOH VI = VIH or VIL IOH = -20 A IOH = -6 mA 4.5 V VOL VI = VIH or VIL IOL = 20 A IOL = 6 mA 4.5 V II IOZ VI = VCC or 0 VO = VCC or 0 ICC VI = VCC or 0, IO = 0 One input at 0.5 V or 2.4 V, Other inputs at 0 or VCC 5.5 V ICC MIN SN54HCT574 MIN MAX SN74HCT574 MIN 4.4 4.499 4.4 4.4 3.98 4.3 3.7 3.84 MAX UNIT V 0.001 0.1 0.1 0.1 0.17 0.26 0.4 0.33 5.5 V 0.1 100 1000 1000 nA 5.5 V 0.01 0.5 10 5 A 8 160 80 A 1.4 2.4 3 2.9 mA 3 10 10 10 pF 5.5 V 4.5 V to 5.5 V Ci TA = 25C TYP MAX V This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC. timing requirements over recommended operating free-air temperature range (unless otherwise noted) fclock Clock frequency tw Pulse duration, CLK high or low tsu Setup time, data before CLK th Hold time, data after CLK TA = 25C MIN MAX SN54HCT574 VCC 4.5 V 30 20 24 5.5 V 33 22 27 MIN MAX SN74HCT574 MIN 4.5 V 16 24 20 5.5 V 14 22 18 4.5 V 20 30 25 5.5 V 17 27 23 4.5 V 5 5 5 5.5 V 5 5 5 MAX UNIT MHz ns ns ns 0 $&'"%$ $#'$ ('! $ # &'"%1# ' #/$ (%# & #1#*("#$+ %'%#' %% %$ #' (#&%$ %'# #/$ /%*+ #,% $'!"#$ '##'1# # '/ %$/# ' $$!# ## ('! -! $#+ POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SCLS177E - MARCH 1984 - REVISED AUGUST 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax tpd CLK Any Q ten OE Any Q tdis OE Any Q tt Any Q TA = 25C TYP MAX SN54HCT574 SN74HCT574 VCC MIN 4.5 V 30 36 20 24 5.5 V 33 40 22 27 MIN MAX MIN MAX UNIT MHz 4.5 V 30 36 54 45 5.5 V 25 32 48 41 4.5 V 26 30 45 38 5.5 V 23 27 41 34 4.5 V 23 30 45 38 5.5 V 22 27 41 34 4.5 V 10 12 18 15 5.5 V 9 11 16 14 ns ns ns ns switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax tpd CLK Any Q ten OE Any Q tt Any Q TA = 25C TYP MAX SN54HCT574 SN74HCT574 VCC MIN 4.5 V 30 36 20 24 5.5 V 33 40 22 27 MIN MAX MIN MAX UNIT MHz 4.5 V 40 53 80 66 5.5 V 35 47 71 60 4.5 V 34 47 71 59 5.5 V 29 39 94 78 4.5 V 18 42 63 53 5.5 V 16 38 57 48 ns ns ns operating characteristics, TA = 25C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per flip-flop No load 0 $&'"%$ $#'$ ('! $ # &'"%1# ' #/$ (%# & #1#*("#$+ %'%#' %% %$ #' (#&%$ %'# #/$ /%*+ #,% $'!"#$ '##'1# # '/ %$/# ' $$!# ## ('! -! $#+ 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TYP 93 UNIT pF SCLS177E - MARCH 1984 - REVISED AUGUST 2003 PARAMETER MEASUREMENT INFORMATION VCC ten RL tdis CL (see Note A) RL tPZH S1 Test Point From Output Under Test PARAMETER S2 1 k tPZL tPHZ tPLZ tpd or tt 1 k CL S1 S2 50 pF or 150 pF Open Closed Closed Open Open Closed Closed Open Open Open 50 pF 50 pF or 150 pF -- LOAD CIRCUIT 3V High-Level Pulse 1.3 V 3V Reference Input 1.3 V 0V 1.3 V tsu 0V tw Data Input 1.3 V 0.3 V 3V Low-Level Pulse 1.3 V 1.3 V Output Control (Low-Level Enabling) 3V 1.3 V 0V tPLH In-Phase Output 1.3 V 10% tPHL 90% 90% tr Out-ofPhase Output tPHL 90% VOH 1.3 V 10% V OL tf 1.3 V 10% tf 3V 1.3 V 0.3 V 0 V tf 3V 1.3 V 1.3 V 0V tPZL Output Waveform 1 (See Note B) tPLZ VCC 1.3 V 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES Output Waveform 2 (See Note B) VOL tPHZ tPZH tPLH 1.3 V 10% 2.7 V VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES VOLTAGE WAVEFORMS PULSE DURATIONS 1.3 V 2.7 V tr 0V Input th 1.3 V 90% VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. D. For clock inputs, fmax is measured when the input duty cycle is 50%. E. The outputs are measured one at a time with one input transition per measurement. F. tPLZ and tPHZ are the same as tdis. G. tPZL and tPZH are the same as ten. H. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74HCT574DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574N ACTIVE PDIP N 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HCT574N3 OBSOLETE PDIP N 20 TBD Call TI SN74HCT574NE4 ACTIVE PDIP N 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HCT574NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574PWLE OBSOLETE TSSOP PW 20 SN74HCT574PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574PWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT574PWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 20 TBD (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Addendum-Page 1 Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HCT574DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74HCT574DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74HCT574NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74HCT574PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN74HCT574PWT TSSOP PW 20 250 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HCT574DBR SN74HCT574DWR SSOP DB 20 2000 367.0 367.0 38.0 SOIC DW 20 2000 367.0 367.0 45.0 SN74HCT574NSR SO NS 20 2000 367.0 367.0 45.0 SN74HCT574PWR TSSOP PW 20 2000 367.0 367.0 38.0 SN74HCT574PWT TSSOP PW 20 250 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated