STPS1170 Power Schottky rectifier Datasheet - production data Description . $ $ . 60$IODW The STPS1170 is a 170 V Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in SMAflat, this device is especially intended for use in low voltage, high frequency inverters, freewheeling and polarity protection. Also ideal for all LED lighting applications where efficiency and space constraint are required. Table 1. Device summary Features * Negligible switching losses * High junction temperature capability * Very small conduction losses * Low leakage current Symbol Value IF(AV) 1A VRRM 170 V VF (typ) 0.62 V Tj (max) 175 C * Avalanche rated * ECOPACK(R) compliant component * Tj = -40 C minimum operating October 2014 This is information on a product in full production. DocID027018 Rev1 1/8 www.st.com 8 Characteristics 1 STPS1170 Characteristics Table 2. Absolute ratings (limiting values at 25 C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 170 V VRRM Repetitive peak reverse voltage, Tj = -40 C 160 V IF(RMS) Forward rms current 15 A IF(AV) Average forward current, = 0.5, square wave SMAflat, TL = 160 C 1 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 45 A 110 W -65 to +175 C -40 to +175 C PARM(1) Tstg Repetitive peak avalanche power, square wave tp = 10 s, Tj = 125 C Storage temperature range Tj Operating junction temperature(2) 1. For pulse time duration deratings, please refer to Figure 3. More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the STMicroelectronics Application notes AN1768, "Admissible avalanche power of Schottky diodes" and AN2025, "Converter improvement using Schottky rectifier avalanche specification". dPtot --------------dTj 2. 1 - condition to avoid thermal runaway for a diode on its own heatsink < ------------------------Rth ( j - a ) Table 3. Thermal parameters Symbol R th(j-l) Parameter Junction to lead, SMAflat Value Unit 20 C/W Table 4. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Tj = 25 C VF(2) Forward voltage drop Tj = 125 C Tj = 25 C Tj = 125 C Min. VR = VRRM 0.25 Max. Unit 1.5 A 1.5 mA 0.82 IF = 1 A 0.62 0.67 V 0.89 IF = 2 A 1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.08 x IF2(RMS) 2/8 Typ. DocID027018 Rev1 0.69 0.75 STPS1170 Characteristics Figure 1. Average forward power dissipation versus average forward current 3) $9 : Figure 2. Average forward current versus ambient temperature ( = 0.5) ,) $9 $ 5 60$IODW 5 WK MO WK MD 7 7 WS7 ,) $ $9 WS WS7 Figure 3. Normalized avalanche power derating versus pulse duration (pulse > 10 s, Tj < 150 C) 3$50 W3 3$50 V 7DPE & WS Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration = 5 WK MO WK MO 6LQJOHSXOVH Figure 5. Reverse leakage current versus reverse voltage applied (typical values) ( ,5 $ 7 & M ( 7 & M 7 & M ( 7 & M ( ( Figure 6. Junction capacitance versus reverse voltage applied (typical values) & S) 95 9 95 9 ( ( ( 7 & M 7 & M ( ( ) 0+] 926& P9506 7 & M ( ( ( W3 V W3 V DocID027018 Rev1 3/8 Characteristics STPS1170 Figure 7. Forward voltage drop versus forward Figure 8. Forward voltage drop versus forward current (typical values) current (maximum values) , $ ) ,) $ 7 & 7 & M M 7 & M 7 & M 9 9 ) 9 9 ) Figure 9. Thermal resistance junction to ambient versus copper surface under each lead (typical values) 5WK MD &: (SR[\SULQWHGERDUG)5H &8 60$IODW P 6 4/8 &8 FP DocID027018 Rev1 STPS1170 2 Package information Package information * Epoxy meets UL94,V0 * Lead-free package * Band indicates cathode In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Figure 10. SMAflat dimensions definitions $ F ' / [ /[ ( ( / /[ E DocID027018 Rev1 5/8 Package information STPS1170 Table 5. SMAflat dimension values Dimensions Ref. Millimeters Min. Inches Typ. Max. Min. Typ. A 0.90 1.10 0.035 0.043 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.95 0.088 0.116 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 L1 0.50 0.019 L2 0.50 0.019 Figure 11. SMAflat footprint, dimensions in mm (inches) Figure 12. Marking informations &DWKRGHEDU XQLGLUHFWLRQDO GHYLFHV RQO\ H [ [ [ ] \ ZZ 6/8 Max. DocID027018 Rev1 H (&23$&. /HDGIUHH ;;; 0DUNLQJ = 0DQXIDFWXULQJ ORFDWLRQ <