INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1017N-R10 1
CPC1017N
60V Normally-Open Single-Pole
4-Pin SOP OptoMOS® Relay
Part # Description
CPC1017N 4-Pin SOP (100/tube)
CPC1017NTR 4-Pin SOP (2000/reel)
Parameter Rating Units
Blocking Voltage 60 VP
Load Current 100 mArms / mADC
On-Resistance (max) 16
LED Current to operate 1 mA
Applications
Features
Description
Ordering Information
Pin Configuration
• Security
• Passive Infrared Detectors (PIR)
• Data Signalling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
• Designed for Use in Security Systems Complying
with EN50130-4
• Only 1mA of LED Current Required to Operate
• 1500Vrms Input/Output Isolation
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Immune to Radiated EM Fields
• Halogen Free
• Tape & Reel Version Available
• Small 4-Pin SOP Package
• Flammability Rating UL 94 V-0
The CPC1017N is a miniature single-pole,
normally-open (1-Form-A) solid state relay in a
4-pin SOP package that employs optically coupled
MOSFET technology to provide 1500Vrms of input
to output isolation. The super-efficient MOSFET
switches and photovoltaic die use IXYS Integrated
Circuits Division’s patented OptoMOS architecture
while the optically coupled output is controlled by a
highly efficient infrared LED.
IXYS Integrated Circuits Division’s state of the art
double-molded vertical construction packaging
enables CPC1017N to be one of the world’s smallest
relays. It offers board space savings of at least 20%
over the competitor’s larger 4-pin SOP relay.
Switching Characteristics
of Normally-Open Devices
Form-A
IF
ILOAD
10%
90%
ton toff
Approvals
1
23
4
+ Control
– Control
Load
Load
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
Certificate B 13 12 82667 003
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R10
CPC1017N
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 60 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 70 mW
Total Power Dissipation 1400 mW
Isolation Voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 ºC
Storage Temperature -40 to +125 ºC
1 Derate linearly 3.33 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1IF=2mA IL- - 100 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-Resistance 2IL=100mA RON --16
Off-State Leakage Current VL=60VPILEAK --1 A
Switching Speeds
Turn-On IF=5mA, VL=10V ton - - 10 ms
Turn-Off toff - - 10 ms
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -5 - pF
Input Characteristics
Input Control Current to Activate 3IL=100mA IF- 0.4 1 mA
Input Control Current to Deactivate - IF0.3 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Capacitance, Input to Output VIO=0V, f=1MHz CIO -1 - pF
1 Load current derates linearly from 100mA @ 25ºC to 80mA @ 80ºC.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (greater than 60ºC) a minimum LED drive current of 3mA is recommended.
Electrical Characteristics @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
INTEGRATED CIRCUITS DIVISION
CPC1017N
www.ixysic.com 3
R10
PERFORMANCE DATA*
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
1.0 1.2 1.4 1.61.1 1.3 1.5
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
0.26 0.30 0.34 0.380.360.320.28
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
0.35 0.45 0.550.30 0.40 0.50 0.60
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Operation
(N=50, IL=100mA)
25
20
15
10
5
0
0.35 0.45 0.550.30 0.40 0.50 0.60
LED Current (mA)
Device Count (N)
Typical IF for Switch Dropout
(N=50, IL=100mA)
35
30
25
20
15
10
5
0
On-Resistance (:)
Device Count (N)
6.8 6.9 7.17.0 7.47.2 7.3
Typical On-Resistance Distribution
(N=50, IL=100mA)
35
30
25
20
15
10
5
0
80 84 88 9282 86 90
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
IF=50mA
IF=5mA
IF=10mA
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
3.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
50
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifi cations, please contact our application department.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R10
CPC1017N
PERFORMANCE DATA*
Typical IF for Switch Operation
vs. Temperature
(IL=80mA)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC) Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (ms)
1.0
1.5
2.0
2.5
3.0
3.5
Typical Turn-On Time vs. Temperature
(IL=50mA)
IF=2mA
IF=5mA
Turn-Off Time (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Typical Turn-Off Time vs. Temperature
(IL=50mA)
Temperature (ºC)
I
F
=5mA
I
F
=2mA
-40
14
12
10
8
6
4
-20 0 20 40 60 80 100
2
Steady State
Instantaneous
IF=5mA
IF=5mA
IF=2mA
Temperature (ºC)
On-Resistance (:)
Typical On-Resistance vs. Temperature
(IL=Max Rated @ Temperature)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-1.5 -1.0 -0.5 0 0.5 1.0 1.5
Typical Load Current
vs. Load Voltage
(IF=5mA)
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
I
F
=5mA
Typical Maximum Load Current
vs. Temperature
I
F
=2mA
Blocking Voltage (VP)
-40
91
89
87
85
83
81
79
77
-20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Leakage (PA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(VL=60V)
Temperature (ºC) Load Voltage (V)
0 102030405060
Output Capacitance (pF)
4
6
8
10
12
14
Output Capacitance vs. Load Voltage
(IF=0mA, f=1MHz)
Energy Rating Curve
Time
Load Current (A)
10Ps
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100Ps 100ms 1s
10ms 10s 100s
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifi cations, please contact our application department.
INTEGRATED CIRCUITS DIVISION
CPC1017N
www.ixysic.com 5
R10
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
CPC1017N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
CPC1017N 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1017N-R10
©Copyright 2017, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
5/25/2017
For additional information please visit our website at: www.ixysic.com
6
CPC1017N
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction of Feed
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P=8.00
(0.315)
A0=6.50
(0.256)
CPC1017N
CPC1017NTR Tape & Reel
CPC1017N device weight = 0.076 grams
Recommended PCB Land Pattern
2.54
(0.10)
5.50
(0.217)
1.45
(0.057)
0.55
(0.022)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.025
(0.161 ± 0.001)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.025
(0.150 ± 0.001) 0.559 ± 0.127
(0.022 ± 0.005)
0.910 ± 0.025
(0.036 ± 0.001)
2.030± 0.025
(0.080± 0.001)
0.381 TYP.
(0.015 TYP.)
Pin to package standoff:
0.064 ± 0.040
(0.0025 ± 0.0015)
0-0.1
(0-0.004)
0.481
(0.019)
0.203 Typ
(0.008 Typ)
