FEATURES
SUPERIOR SOUND QUALITY
ULTRA LOW DISTORTION: 0.00008%
LOW NOISE: 8nV/Hz
TRUE FET-INPUT: IB = 5pA
HIGH SPEED:
SLEW RATE: 20V/µs
BANDWIDTH: 8MHz
HIGH OPEN-LOOP GAIN: 120dB (600)
WIDE SUPPLY RANGE: ±2.5V to ±18V
SINGLE, DUAL, AND QUAD VERSIONS
High Performance
AUDIO OPERATIONAL AMPLIFIERS
TM
DESCRIPTION
The OPA134 series are ultra-low distortion, low noise
operational amplifiers fully specified for audio appli-
cations. A true FET input stage was incorporated to
provide superior sound quality and speed for excep-
tional audio performance. This in combination with
high output drive capability and excellent dc perfor-
mance allows use in a wide variety of demanding
applications. In addition, the OPA134’s wide output
swing, to within 1V of the rails, allows increased
headroom making it ideal for use in any audio circuit.
OPA134 op amps are easy to use and free from phase
inversion and overload problems often found in com-
mon FET-input op amps. They can be operated from
±2.5V to ±18V power supplies. Input cascode cir-
cuitry provides excellent common-mode rejection and
maintains low input bias current over its wide input
voltage range, minimizing distortion. OPA134 series
op amps are unity-gain stable and provide excellent
dynamic behavior over a wide range of load condi-
tions, including high load capacitance. The dual and
quad versions feature completely independent cir-
cuitry for lowest crosstalk and freedom from interac-
tion, even when overdriven or overloaded.
Single and dual versions are available in 8-pin DIP
and SO-8 surface-mount packages in standard con-
figurations. The quad is available in 14-pin DIP and
SO-14 surface mount packages. All are specified for
–40°C to +85°C operation. A SPICE macromodel is
available for design analysis.
APPLICATIONS
PROFESSIONAL AUDIO AND MUSIC
LINE DRIVERS
LINE RECEIVERS
MULTIMEDIA AUDIO
ACTIVE FILTERS
PREAMPLIFIERS
INTEGRATORS
CROSSOVER NETWORKS
© 1996 Burr-Brown Corporation PDS-1339C Printed in U.S.A. December, 1997
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111
Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
1
2
3
4
8
7
6
5
V+
Out B
–In B
+In B
Out A
–In A
+In A
V–
OPA2134
8-Pin DIP, SO-8
A
B
1
2
3
4
5
6
7
14
13
12
11
10
9
8
Out D
–In D
+In D
V–
+In C
–In C
Out C
Out A
–In A
+In A
V+
+In B
–In B
Out B
OPA4134
14-Pin DIP
SO-14
AD
BC
1
2
3
4
8
7
6
5
Offset Trim
V+
Output
NC
Offset Trim
–In
+In
V–
OPA134
8-Pin DIP, SO-8
®
OPA134
OPA2134
OPA4134
OPA134
OPA2134
OPA4134
OPA4134
OPA134
OPA2134
SBOS058
2
®
OPA134/2134/4134
SPECIFICATIONS
At TA = +25°C, VS = ±15V, unless otherwise noted.
OPA134PA, UA
OPA2134PA, UA
OPA4134PA, UA
PARAMETER CONDITION MIN TYP MAX UNITS
AUDIO PERFORMANCE
Total Harmonic Distortion + Noise G = 1, f = 1kHz, VO = 3Vrms
RL = 2k0.00008 %
RL = 6000.00015 %
Intermodulation Distortion G = 1, f = 1kHz, VO = 1Vp-p –98 dB
Headroom(1) THD < 0.01%, RL = 2k, VS = ±18V 23.6 dBu
FREQUENCY RESPONSE
Gain-Bandwidth Product 8 MHz
Slew Rate(2) ±15 ±20 V/µs
Full Power Bandwidth 1.3 MHz
Settling Time 0.1% G = 1, 10V Step, CL = 100pF 0.7 µs
0.01% G = 1, 10V Step, CL = 100pF 1 µs
Overload Recovery Time (VIN) • (Gain) = VS0.5 µs
NOISE
Input Voltage Noise
Noise Voltage, f = 20Hz to 20kHz 1.2 µVrms
Noise Density, f = 1kHz 8 nV/Hz
Current Noise Density, f = 1kHz 3 fA/Hz
OFFSET VOLTAGE
Input Offset Voltage ±0.5 ±2mV
T
A
= –40°C to +85°C±1±3(3) mV
vs Temperature TA = –40°C to +85°C±2µV/°C
vs Power Supply (PSRR) VS = ±2.5V to ±18V 90 106 dB
Channel Separation (Dual, Quad) dc, RL = 2k135 dB
f = 20kHz, RL = 2k130 dB
INPUT BIAS CURRENT
Input Bias Current(4) VCM =0V +5 ±100 pA
vs Temperature(3) See Typical Curve ±5nA
Input Offset Current(4) VCM =0V ±2±50 pA
INPUT VOLTAGE RANGE
Common-Mode Voltage Range (V–)+2.5 ±13 (V+)–2.5 V
Common-Mode Rejection VCM = –12.5V to +12.5V 86 100 dB
TA = –40°C to +85°C90dB
INPUT IMPEDANCE
Differential 1013 || 2 || pF
Common-Mode VCM = –12.5V to +12.5V 1013 || 5 || pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain RL = 10k, VO = –14.5V to +13.8V 104 120 dB
RL = 2k, VO = –13.8V to +13.5V 104 120 dB
RL = 600, VO = –12.8V to +12.5V 104 120 dB
OUTPUT
Voltage Output RL = 10k(V–)+0.5 (V+)–1.2 V
RL = 2k(V–)+1.2 (V+)–1.5 V
RL = 600(V–)+2.2 (V+)–2.5 V
Output Current ±35 mA
Output Impedance, Closed-Loop(5) f = 10kHz 0.01
Open-Loop f = 10kHz 10
Short-Circuit Current ±40 mA
Capacitive Load Drive (Stable Operation) See Typical Curve
POWER SUPPLY
Specified Operating Voltage ±15 V
Operating Voltage Range ±2.5 ±18 V
Quiescent Current (per amplifier) IO = 0 4 5 mA
TEMPERATURE RANGE
Specified Range –40 +85 °C
Operating Range –55 +125 °C
Storage –55 +125 °C
Thermal Resistance,
θ
JA
8-Pin DIP 100 °C/W
SO-8 Surface-Mount 150 °C/W
14-Pin DIP 80 °C/W
SO-14 Surface-Mount 110 °C/W
NOTES: (1) dBu = 20*log (Vrms/0.7746) where Vrms is the maximum output voltage for which THD+Noise is less than 0.01%. See THD+Noise text. (2) Guaranteed
by design. (3) Guaranteed by wafer-level test to 95% confidence level. (4) High-speed test at TJ = 25°C. (5) See “Closed-Loop Output Impedance vs Frequency”
typical curve.
3OPA134/2134/4134
®
PACKAGE
DRAWING TEMPERATURE
PRODUCT PACKAGE NUMBER(1) RANGE
Single
OPA134PA 8-Pin Plastic DIP 006 –40°C to +85°C
OPA134UA SO-8 Surface-Mount 182 –40°C to +85°C
Dual
OPA2134PA 8-Pin Plastic DIP 006 –40°C to +85°C
OPA2134UA SO-8 Surface-Mount 182 –40°C to +85°C
Quad
OPA4134PA 14-Pin Plastic DIP 010 –40°C to +85°C
OPA4134UA SO-14 Surface-Mount 235 –40°C to +85°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage, V+ to V–.................................................................... 36V
Input Voltage .................................................... (V–) –0.7V to (V+) +0.7V
Output Short-Circuit(2) .............................................................. Continuous
Operating Temperature ................................................. –40°C to +125°C
Storage Temperature..................................................... –55°C to +125°C
Junction Temperature...................................................................... 150°C
Lead Temperature (soldering, 10s)................................................. 300°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
(2) Short-circuit to ground, one amplifier per package.
TYPICAL PERFORMANCE CURVES
At TA = +25°C, VS = ±15V, RL = 2k, unless otherwise noted.
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
Frequency (Hz)
THD+Noise (%)
0.1
0.01
0.001
0.0001
0.00001 10 100 1k 10k 100k
2k
600
R
L
V
O
= 3Vrms
G = +1
G = +10
SMPTE INTERMODULATION DISTORTION
vs OUTPUT AMPLITUDE
Output Amplitude (Vpp)
IMD (%)
1
0.1
0.010
0.001
0.0005
5
30m 0.1 1 10 30
G = +1
f = 1kHz
R
L
= 2k
Baseline
OP176
OPA134
OPA134
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
PACKAGE/ORDERING INFORMATION
4
®
OPA134/2134/4134
HEADROOM – TOTAL HARMONIC DISTORTION
+ NOISE vs OUTPUT AMPLITUDE
Output Amplitude (Vrms)
THD+Noise (%)
1
0.1
0.010
0.001
0.00050.1 110 20
V
S
= ±18V
R
L
= 2k
f = 1kHz
THD < 0.01%
OPA134 – 11.7Vrms
OP176 – 11.1Vrms
Baseline
OP176
OPA134 OPA134
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°C, VS = ±15V, RL = 2k, unless otherwise noted.
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
Frequency (Hz)
THD+Noise (%)
0.01
0.001
0.0001
0.00001 20 100 1k 10k 20k
V
O
= 10Vrms
R
L
= 2k
V
S
= ±16
V
S
= ±17 V
S
= ±18
HARMONIC DISTORTION + NOISE vs FREQUENCY
Frequency (Hz)
Amplitude (% of Fundamentals)
0.01
0.001
0.0001
0.00001
0.000001 20 100 1k 10k 20k
2nd Harmonic
3rd Harmonic
V
O
= 1Vrms
R
L
= 600
R
L
= 2k
VOLTAGE NOISE vs SOURCE RESISTANCE
Source Resistance ()
Voltage Noise (nV/Hz)
1k
100
10
1
0.110 100 1k 10k 100k 1M 10M
OP176+
Resistor
OPA134+
Resistor
Resistor Noise
Only V
n
(total) = (i
n
R
S
)
2
+ e
n2
+ 4kTR
S
INPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
1
1k
100
10
Voltage Noise (nV/Hz)
Frequency (Hz)
10 100 1k 10k 100k 1M
1
Current Noise (fA/Hz)
Voltage Noise
Current Noise
INPUT-REFERRED NOISE VOLTAGE
vs NOISE BANDWIDTH
Noise Bandwidth (Hz)
Noise Voltage (µV)
100
10
1
0.1 1 10 100 1k 10k 100k
R
S
= 20
Peak-to-Peak
RMS
5OPA134/2134/4134
®
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°C, VS = ±15V, RL = 2k, unless otherwise noted.
OPEN-LOOP GAIN/PHASE vs FREQUENCY
0.1 1 10 100 1k 10k 100k 1M 10M
160
140
120
100
80
60
40
20
0
–20
0
–45
–90
–135
–180
Voltage Gain (dB)
Phase Shift (°)
Frequency (Hz)
φ
G
CLOSED-LOOP GAIN vs FREQUENCY
Frequency (Hz)
Closed-Loop Gain (dB)
50
40
30
20
10
0
–10
–20 1k 10k 100k 1M 10M
G = +10
G = +100
G = +1
POWER SUPPLY AND COMMON-MODE REJECTION
vs FREQUENCY
Frequency (Hz)
PSR, CMR (dB)
120
100
80
60
40
20
010 100 1k 10k 100k 1M
CMR
–PSR
+PSR
MAXIMUM OUTPUT VOLTAGE
vs FREQUENCY
Frequency (Hz)
10k 100k 1M 10M
30
20
10
0
Output Voltage (Vp-p)
V
S
= ±15V
V
S
= ±2.5V
V
S
= ±5V
Maximum output voltage
without slew-rate
induced distortion
CLOSED-LOOP OUTPUT IMPEDANCE vs FREQUENCY
Frequency (Hz)
Closed-Loop Output Impedance ()
10
1
0.1
0.01
0.001
0.000110 100 1k 10k 100k
G = +1
G = +2
G = +10
G = +100
Note: Open-Loop
Output Impedance
at f = 10kHz is 10
CHANNEL SEPARATION vs FREQUENCY
Frequency (Hz)
Channel Separation (dB)
160
140
120
100
80
100 1k 10k 100k
Dual and quad devices.
G = 1, all channels.
Quad measured channel
A to D or B to C—other
combinations yield improved
rejection.
R
L
=
R
L
= 2k
6
®
OPA134/2134/4134
FPO
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°C, VS = ±15V, RL = 2k, unless otherwise noted.
INPUT BIAS CURRENT vs TEMPERATURE
Ambient Temperature (°C)
Input Bias Current (pA)
100k
10k
1k
100
10
1
0.1–75 –50 –25 0 25 50 75 100 125
Dual
Single
High Speed Test
Warmed Up
INPUT BIAS CURRENT
vs INPUT COMMON-MODE VOLTAGE
Common-Mode Voltage (V)
Input Bias Current (pA)
10
9
8
7
6
5
4
3
2
1
0–15 –10 –5 0 5 10 15
High Speed Test
OPEN-LOOP GAIN vs TEMPERATURE
150
140
130
120
110
100
Open-Loop Gain (dB)
Temperature (°C)
–75 –50 –25 0 25 50 75 100 125
R
L
= 600
R
L
= 2k
R
L
= 10k
CMR, PSR vs TEMPERATURE
Ambient Temperature (°C)
CMR, PSR (dB)
120
110
100
90–75 –50 –25 0 25 50 75 100 125
PSR
CMR
QUIESCENT CURRENT AND SHORT-CIRCUIT CURRENT
vs TEMPERATURE
Ambient Temperature (°C)
Quiescent Current Per Amp (mA)
4.3
4.2
4.1
4.0
3.9
3.8
60
50
40
30
20
10
Short-Circuit Current (mA)
–75 –50 –25 0 25 50 75 100 125
±I
SC
±I
Q
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
15
14
13
12
11
10
–10
–11
–12
–13
–14
–150 102030405060
Output Current (mA)
Output Voltage Swing (V)
–55°C
–55°C
25°C25°C
85°C
85°C
125°C
125°C
25°C
V
IN
= –15V
V
IN
= 15V
7OPA134/2134/4134
®
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°C, VS = ±15V, RL = 2k, unless otherwise noted.
SMALL-SIGNAL STEP RESPONSE
G =1, C
L
= 100pF
200ns/div
50mV/div
LARGE-SIGNAL STEP RESPONSE
G = 1, C
L
= 100pF
5V/div
1µs/div
SETTLING TIME vs CLOSED-LOOP GAIN
Closed-Loop Gain (V/V)
Settling Time (µs)
100
10
1
0.1 ±1 ±10 ±100 ±1000
0.01%
0.1%
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
60
50
40
30
20
10
0
100pF 1nF 10nF
Load Capacitance
Overshoot (%)
G = +1
G = ±10
G = –1
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
Percent of Amplifiers (%)
Offset Voltage (V)
–2000
–1800
–1600
–1400
–1200
–1000
–800
–600
–400
–200
0
200
400
600
800
1000
1200
1400
1600
1800
2000
18
16
14
12
10
8
6
4
2
0
Typical production
distribution of packaged
units.
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
Percent of Amplifiers (%)
Offset Voltage Drift (µV/°C)
0.5
1.5
2.5
3.5
4.5
5.5
6.5
7.5
8.5
9.5
10.5
11.5
12.5
12
10
8
6
4
2
0
Typical production
distribution of packaged
units.
8
®
OPA134/2134/4134
APPLICATIONS INFORMATION
OPA134 series op amps are unity-gain stable and suitable
for a wide range of audio and general-purpose applications.
All circuitry is completely independent in the dual version,
assuring normal behavior when one amplifier in a package
is overdriven or short-circuited. Power supply pins should
be bypassed with 10nF ceramic capacitors or larger to
minimize power supply noise.
OPERATING VOLTAGE
OPA134 series op amps operate with power supplies from
±2.5V to ±18V with excellent performance. Although
specifications are production tested with ±15V supplies,
most behavior remains unchanged throughout the full
operating voltage range. Parameters which vary signifi-
cantly with operating voltage are shown in the typical
performance curves.
OFFSET VOLTAGE TRIM
Offset voltage of OPA134 series amplifiers is laser trimmed
and usually requires no user adjustment. The OPA134
(single op amp version) provides offset trim connections
on pins 1 and 8, identical to 5534 amplifiers. Offset
voltage can be adjusted by connecting a potentiometer as
shown in Figure 1. This adjustment should be used only to
null the offset of the op amp, not to adjust system offset or
offset produced by the signal source. Nulling offset could
change the offset voltage drift behavior of the op amp.
While it is not possible to predict the exact change in drift,
the effect is usually small.
TOTAL HARMONIC DISTORTION
OPA134 series op amps have excellent distortion character-
istics. THD+Noise is below 0.0004% throughout the audio
frequency range, 20Hz to 20kHz, with a 2k load. In
addition, distortion remains relatively flat through its
wide output voltage swing range, providing increased head-
room compared to other audio amplifiers, including the
OP176/275.
FIGURE 1. OPA134 Offset Voltage Trim Circuit.
V+
V–
100k
OPA134 single op amp only. 
Use offset adjust pins only to null
offset voltage of op amp—see text.
Trim Range: ±4mV typ
OPA134 6
7
8
4
3
21
10nF
10nF
In many ways headroom is a subjective measurement. It can
be thought of as the maximum output amplitude allowed
while still maintaining a very low level of distortion. In an
attempt to quantify headroom, we have defined “very low
distortion” as 0.01%. Headroom is expressed as a ratio
which compares the maximum allowable output voltage
level to a standard output level (1mW into 600, or
0.7746Vrms). Therefore, OPA134 series op amps, which
have a maximum allowable output voltage level of 11.7Vrms
(THD+Noise < 0.01%), have a headroom specification of
23.6dBu. See the typical curve “Headroom - Total Harmonic
Distortion + Noise vs Output Amplitude.”
DISTORTION MEASUREMENTS
The distortion produced by OPA134 series op amps is below
the measurement limit of all known commercially available
equipment. However, a special test circuit can be used to
extend the measurement capabilities.
Op amp distortion can be considered an internal error source
which can be referred to the input. Figure 2 shows a
circuit which causes the op amp distortion to be 101 times
greater than normally produced by the op amp. The addition
of R3 to the otherwise standard non-inverting amplifier
FIGURE 2. Distortion Test Circuit.
R
2
OPA134
R
1
Signal Gain = 1+
Distortion Gain = 1+
R
3
V
O
= 3Vrms
Generator
Output Analyzer
Input
Audio Precision
System One
Analyzer
(1)
R
L
1k
IBM PC
or
Compatible
SIG.
GAIN DIST.
GAIN R
1
R
2
R
3
100
10
1k
1k
1k
10
11
1
11
101
101
101
101
NOTE: (1) Measurement BW = 80kHz
R
2
R
1
R
2
R
1
II R
3
9OPA134/2134/4134
®
V
OUT
V
IN
R
1
If R
S
> 2k or R
1
II R
2
> 2k
R
S
= R
1
II R
2
R
2
OPA134
configuration alters the feedback factor or noise gain of the
circuit. The closed-loop gain is unchanged, but the feedback
available for error correction is reduced by a factor of 101,
thus extending the resolution by 101. Note that the input
signal and load applied to the op amp are the same as with
conventional feedback without R3. The value of R3 should
be kept small to minimize its effect on the distortion mea-
surements.
Validity of this technique can be verified by duplicating
measurements at high gain and/or high frequency where the
distortion is within the measurement capability of the test
equipment. Measurements for this data sheet were made
with an Audio Precision distortion/noise analyzer which
greatly simplifies such repetitive measurements. The mea-
surement technique can, however, be performed with manual
distortion measurement instruments.
SOURCE IMPEDANCE AND DISTORTION
For lowest distortion with a source or feedback network
which has an impedance greater than 2k, the impedance
seen by the positive and negative inputs in noninverting
applications should be matched. The p-channel JFETs in the
FET input stage exhibit a varying input capacitance with
applied common-mode input voltage. In inverting configu-
rations the input does not vary with input voltage since the
inverting input is held at virtual ground. However, in
noninverting applications the inputs do vary, and the gate-
to-source voltage is not constant. The effect is increased
distortion due to the varying capacitance for unmatched
source impedances greater than 2k.
To maintain low distortion, match unbalanced source im-
pedance with appropriate values in the feedback network as
shown in Figure 3. Of course, the unbalanced impedance
may be from gain-setting resistors in the feedback path. If
the parallel combination of R1 and R2 is greater than 2k, a
matching impedance on the noninverting input should be
used. As always, resistor values should be minimized to
reduce the effects of thermal noise.
FIGURE 3. Impedance Matching for Maintaining Low
Distortion in Non-Inverting Circuits.
NOISE PERFORMANCE
Circuit noise is determined by the thermal noise of external
resistors and op amp noise. Op amp noise is described by
two parameters—noise voltage and noise current. The total
noise is quantified by the equation:
With low source impedance, the current noise term is
insignificant and voltage noise dominates the noise perfor-
mance. At high source impedance, the current noise term
becomes the dominant contributor.
Low noise bipolar op amps such as the OPA27 and OPA37
provide very low voltage noise at the expense of a higher
current noise. However, OPA134 series op amps are unique
in providing very low voltage noise and very low current
noise. This provides optimum noise performance over a
wide range of sources, including reactive source imped-
ances, refer to the typical curve, “Voltage Noise vs Source
Resistance.” Above 2k source resistance, the op amp
contributes little additional noise—the voltage and current
terms in the total noise equation become insignificant and
the source resistance term dominates. Below 2k, op amp
voltage noise dominates over the resistor noise, but com-
pares favorably with other audio op amps such as OP176.
PHASE REVERSAL PROTECTION
OPA134 series op amps are free from output phase-reversal
problems. Many audio op amps, such as OP176, exhibit
phase-reversal of the output when the input common-mode
voltage range is exceeded. This can occur in voltage-fol-
lower circuits, causing serious problems in control loop
applications. OPA134 series op amps are free from this
undesirable behavior even with inputs of 10V beyond the
input common-mode range.
POWER DISSIPATION
OPA134 series op amps are capable of driving 600 loads
with power supply voltage up to ±18V. Internal power
dissipation is increased when operating at high supply
voltages. Copper leadframe construction used in OPA134
series op amps improves heat dissipation compared to con-
ventional materials. Circuit board layout can also help
minimize junction temperature rise. Wide copper traces help
dissipate the heat by acting as an additional heat sink.
Temperature rise can be further minimized by soldering the
devices to the circuit board rather than using a socket.
OUTPUT CURRENT LIMIT
Output current is limited by internal circuitry to approxi-
mately ±40mA at 25°C. The limit current decreases with
increasing temperature as shown in the typical performance
curve “Short-Circuit Current vs Temperature.”
V total i R e kTR
nnSns
()( )=++
2
2
4
PACKAGE OPTION ADDENDUM
www.ti.com 28-Mar-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA134PA ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
OPA134PA3 OBSOLETE PDIP P 8 TBD Call TI Call TI
OPA134PAG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
OPA134UA ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA134UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA134UA/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA134UA3 OBSOLETE PDIP P 8 TBD Call TI Call TI
OPA134UAE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA134UAG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA2134PA ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
OPA2134PAG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
OPA2134UA ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA2134UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA2134UA/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA2134UAE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA2134UAG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA4134PA OBSOLETE PDIP N 14 TBD Call TI Call TI
OPA4134UA ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
PACKAGE OPTION ADDENDUM
www.ti.com 28-Mar-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA4134UA/2K5 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA4134UA/2K5E4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
OPA4134UAE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
SN412008DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
OPA134UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA2134UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA4134UA/2K5 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA134UA/2K5 SOIC D 8 2500 367.0 367.0 35.0
OPA2134UA/2K5 SOIC D 8 2500 367.0 367.0 35.0
OPA4134UA/2K5 SOIC D 14 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated