HMPSA42M - Hi-Sincerity Mocroelectronics Corp.

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HE6347-B

Issued Date : 1992.11.25

Revised Date : 2000. 10.01

Page No. : 1/4

HSMC Product Specifi cation

HMPSA42M

NPN EPITACIAL PLANAR TRANSISTOR

Description

The HMPSA42M is designed for application as a video output to

drive color CRT, or as a dialer circuit in electronics telephone.

Absolute Maximum Ratings

• Maximum Temperatures

Storage Temperature............................................................................................ -55 ~ +150 °C

Junction Temp er ature................................................................................... +150 °C Maximum

• Maximum Power Dissipation

Total Power Dissipation (Ta=25°C)............................................................................... 625 mW

• Maximum Voltages and Currents (Ta=25°C)

VCBO Collector to Base Voltag e ...................................................................................... 300 V

VCEO Collector to Emitter Voltage................................................................................... 300 V

VEBO Emitter to Base Vo ltage ............................................................................................. 6 V

IC Collector Current....................................................................................................... 800 mA

Characteristics (Ta=2 5°C)

Symbol Min. Typ. Max. Unit Test Conditions

BVCBO 300 - - V IC=100uA, IE=0

BVCEO 300 - - V IC=1mA, IB= 0

BVEBO 6 - - V IE=10uA, IC=0

IEBO - - 100 nA VEB=3V, IC=0

*VCE(sat)1 - - 200 mV IC=20mA, IB=2mA

*VCE(sat)2 - - 750 mV IC=100mA, IB=10mA

*VBE(sat)1 - - 900 mV IC=20mA, IB=2mA

*VBE(sat)2 - - 1000 mV IC=100mA, IB=10mA

*hFE1 80 - - IC=10mA, VCE=10V

*hFE2 80 - - IC=100mA, VCE=10V

*hFE3 40 - - IC=200mA, VCE=10V

fT 50 - - MHz IC=10mA, VCE=20V, f=100MHZ

*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HE6347-B

Issued Date : 1992.11.25

Revised Date : 2000. 10.01

Page No. : 2/4

HSMC Product Specifi cation

Characteristics Curve

Cirrent Gain & Collector Curren t

100

1000

1 10 100 1000

Coll e c tor Cur r e nt (mA )

Current Gain

VCE=10V

Cut off Fr equency & Collector Current

100

1 10 100

Collector Curren t (mA)

Cutoff Frequency (MHz )

VCE=10V

Saturation Voltage & C ollector Curren t

0.01

0.1

100

1 10 100 1000

Collector Curren t (mA)

Satura t ion Volt ag e ( V)

VCE(sat) @ IC=10IB

Capacitance & Re verse-Biased Voltage

100

1 10 100

R evers e- Biased Vol tage ( V)

Cap a c itance (pF)

Cob

Saturation V olta ge & C ollector Current

0.1

1 10 100 1000

Coll e c tor Cur r e nt (mA )

Satura t ion Volt age (V)

VBE(sat) @ IC=10IB

Safe Oper ation Area

0.1

1 10 100

Forward Biased Vol t ag e ( V)

Collector Curren t (mA)

PT=1ms

PT=100ms

PT=1s

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HE6347-B

Issued Date : 1992.11.25

Revised Date : 2000. 10.01

Page No. : 3/4

HSMC Product Specifi cation

PD-Ta

100

200

300

400

500

600

700

0 20 40 60 80 100 120 140 160

Ambient Temper at ur e- Ta(oC)

Power Dissipation -PD(mW)

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HE6347-B

Issued Date : 1992.11.25

Revised Date : 2000. 10.01

Page No. : 4/4

HSMC Product Specifi cation

TO-92 Dimension

*:Typical

Inches Millimeters Inches Millimeters

DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.

A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56

B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54

C 0.5000 - 12.70 - I - *0.0500 - *1.27

D 0.0142 0.0220 0.36 0.56 α1-*5°-*5°

E-

*0.0500 - *1.27 α2-*2°-*2°

F 0.1323 0.1480 3.36 3.76 α3-*2°-*2°

Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.

2.Controll i ng dimens ion : millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing m ethod, please contact your l ocal HSMC sal es office.

Material :

• Lead : 42 Alloy ; solder plating

• Mold Compound : Epoxy resin famil y, flammabilit y sol i d burning class:UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its produc ts without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liabilit y for any cons equence of customer product design, infringem ent of patents, or application assistance.

Head Office And Factory :

• Head Office (Hi-Sincerit y Microelectronics Corp.) : 10F., No. 61, Sec. 2, Chung-Shan N. Rd. Tai pei Ta i wan R.O. C.

Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454

• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu I ndust ri al Park Hsin-Chu Taiwan. R.O.C

Tel : 886-3-5983621~5 Fax : 886-3-5982931

• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsi n-Chu Indust ri al Park Hs in-Chu Taiwan. R.O.C

Tel : 886-3-5977061 Fax : 886-3-5979220

Iα1

α2

α3

Style : Pin 1.Em itter 2.Bas e 3.C ol lec tor

3-Lead TO-92 Plastic Package

HSMC Packa

e Code : A

Marking :

HSMC Logo

Part Number

Date Code

Product Series

Rank

Laser Mark

HSMC Logo

Part Number

Product Series

Ink Mark