Dimensions are in mm
SnapTac Series
5
JUNE 2007
Miniature Rectangular Connectors •HyperSpring®spring loaded contacts, self cleaning
wiping action
•12, 21 ways
•Combine robust environmental performance with
compact size and light weight
•Easy and fast push-pull locking mechanism
•Full line EMI shielding
•IP67 sealing when mated and unmated
•D-shape hardware coding to avoid mismatching
•Overmolding solutions
•Upgrade commercial high speed Fast Ethernet, USB,
IEEE 1394 interconnect to Mil Spec performances
•High-reliability commercial and military interconnect
applications: Tactical Computers, Field Radios,
Dismounted Soldier, Weapon Interconnect, Battery
Chargers, Missiles, Helmet Breakaway System,
Commercial Airframe Sensors, Autosport Diagnostics
Technical Characteristics
General
Hyperspring Contact Number 12, 21
Receptacle Contact Termination Solder Cup,
Straight PCB
Plug Contact Termination Solder Cup
Cable Diameter Range Max 8 mm
AWG Contact 30 - 26
Connector Mating Cycles 2000
Hyperspring Contact Force Max 180g
Connector Mating Force 180 g
x contact number
Connector Unmating Force 2,5 Kg
Electrical and mechanical characteristics
EMI Shielding Yes
Current Rating 3A@25°C
Test Voltage (dc) Contact to Contact 300 V
Dielectric Withstanding Voltage (between contacts) 400 V
Contact Resistance (low level) < 15 mOhm
Insulation Resistance 5000 MOhm @ 500V d.c.
(MIL-STD1344 method 3003)
Vibration MIL-STD-1344 method 2004
condition III
Shock MIL-STD-1344 method 2004
Weight 22 g (12)
(Plug+Receptacle- with contacts - without cabling) 29 g (21)
Materials and Plating
Housing
– Material Aluminium Alloy
– Plating ZnCo conductive
RoHS compliant
Overmolding (Plug) Santoprene
Contact
– Material Brass, CuBe
– Plating Gold
Environmental Characteristics
Temperature Range -65°C +80°C
Salt Spray MIL-STD-1344 method 1001
test condition A
Humidity MIL-STD-1344 method 1002
type II
IP Level 67 mated and unmated