SN54HCT244, SN74HCT244 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS SCLS175D - MARCH 1984 - REVISED AUGUST 2003 D D D D D D Operating Voltage Range of 4.5 V to 5.5 V High-Current Outputs Drive Up To 15 LSTTL Loads Low Power Consumption, 80-A Max ICC Typical tpd = 13 ns 6-mA Output Drive at 5 V Low Input Current of 1 A Max Inputs Are TTL-Voltage Compatible 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers SN54HCT244 . . . J OR W PACKAGE SN74HCT244 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND description/ordering information These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The 'HCT244 devices are organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 2Y4 1A1 1OE VCC SN54HCT244 . . . FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 1Y1 2A4 1Y2 2A3 1Y3 2Y1 GND 2A1 1Y4 2A2 1A2 2Y3 1A3 2Y2 1A4 2OE D D ORDERING INFORMATION PACKAGE TA PDIP - N SN74HCT244N Tube of 25 SN74HCT244DW Reel of 2000 SN74HCT244DWR SOP - NS Reel of 2000 SN74HCT244NSR HCT244 SSOP - DB Reel of 2000 SN74HCT244DBR HT244 Tube of 70 SN74HCT244PW Reel of 2000 SN74HCT244PWR Reel of 250 SN74HCT244PWT CDIP - J Tube of 20 SNJ54HCT244J SNJ54HCT244J CFP - W Tube of 85 SNJ54HCT244W SNJ54HCT244W LCCC - FK Tube of 55 SNJ54HCT244FK TSSOP - PW -55C 125C -55 C to 125 C TOP-SIDE MARKING Tube of 20 SOIC - DW -40 C to 85 -40C 85C C ORDERABLE PART NUMBER SN74HCT244N HCT244 HT244 SNJ54HCT244FK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN54HCT244, SN74HCT244 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS SCLS175D - MARCH 1984 - REVISED AUGUST 2003 FUNCTION TABLE (each buffer/driver) INPUTS OE A OUTPUT Y L H H L L L H X Z logic diagram (positive logic) 1OE 1A1 1A2 1A3 1A4 1 2OE 2 18 4 16 6 14 8 12 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 19 11 9 13 7 15 5 17 3 2Y1 2Y2 2Y3 2Y4 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA Package thermal impedance, JA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN54HCT244, SN74HCT244 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS SCLS175D - MARCH 1984 - REVISED AUGUST 2003 recommended operating conditions (see Note 3) SN54HCT244 NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO t/v Output voltage 0 High-level input voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V SN74HCT244 MIN 2 2 Input transition rise/fall time V V 0.8 VCC VCC UNIT 0 0 500 0.8 V VCC VCC V 500 ns V TA Operating free-air temperature -55 125 -40 85 C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VOH VI = VIH or VIL IOH = -20 A IOH = -6 mA 4.5 V VOL VI = VIH or VIL IOL = 20 A IOL = 6 mA 4.5 V II IOZ VI = VCC or 0 VO = VCC or 0, ICC ICC VI = VIH or VIL VI = VCC or 0, IO = 0 One input at 0.5 V or 2.4 V, Other inputs at 0 or VCC TA = 25C TYP MAX SN54HCT244 MIN MAX SN74HCT244 MIN 4.4 4.499 4.4 4.4 3.98 4.3 3.7 3.84 MAX UNIT V 0.001 0.1 0.1 0.1 0.17 0.26 0.4 0.33 5.5 V 0.1 100 1000 1000 nA 5.5 V 0.01 0.5 10 5 A 8 160 80 A 1.4 2.4 3 2.9 mA 3 10 10 10 pF 5.5 V 5.5 V 4.5 V to 5.5 V Ci MIN V This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tpd A Y ten OE Y tdis OE Y tt Y VCC TA = 25C MIN TYP MAX SN54HCT244 MIN MAX SN74HCT244 MIN MAX 4.5 V 15 28 42 35 5.5 V 13 25 38 32 4.5 V 21 35 53 44 5.5 V 19 32 48 40 4.5 V 19 35 53 44 5.5 V 18 32 48 40 4.5 V 8 12 18 15 5.5 V 7 11 16 14 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 UNIT ns ns ns ns 3 SN54HCT244, SN74HCT244 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS SCLS175D - MARCH 1984 - REVISED AUGUST 2003 switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tpd A Y ten OE Y tt Y VCC MIN TA = 25C TYP MAX SN54HCT244 MIN MAX SN74HCT244 MIN MAX 4.5 V 21 45 68 56 5.5 V 18 40 61 51 4.5 V 25 52 79 65 5.5 V 22 47 71 59 4.5 V 17 42 63 53 5.5 V 14 38 57 48 UNIT ns ns ns operating characteristics, TA = 25C PARAMETER Cpd 4 TEST CONDITIONS Power dissipation capacitance per buffer/driver POST OFFICE BOX 655303 No load * DALLAS, TEXAS 75265 TYP 40 UNIT pF SN54HCT244, SN74HCT244 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS SCLS175D - MARCH 1984 - REVISED AUGUST 2003 PARAMETER MEASUREMENT INFORMATION VCC From Output Under Test CL (see Note A) PARAMETER S1 Test Point tPZH ten RL S2 1 k tPZL tPHZ tdis -- LOAD CIRCUIT 2.7 V 2.7 V S1 S2 50 pF or 150 pF Open Closed Closed Open 1 k tPLZ tpd or tt Input 1.3 V 0.3 V CL RL 50 pF 50 pF or 150 pF Open Closed Closed Open Open Open 3V 1.3 V 0.3 V 0 V tr tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES 3V Input 1.3 V 1.3 V 0V tPLH In-Phase Output 1.3 V 10% tPHL 90% 90% tr tPHL Out-ofPhase Output 90% VOH 1.3 V 10% V OL tf tPLH 1.3 V 10% 1.3 V 10% tf 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES Output Control (Low-Level Enabling) 3V 1.3 V 1.3 V 0V tPZL Output Waveform 1 (See Note B) tPLZ VCC 1.3 V 10% tPZH Output Waveform 2 (See Note B) VOL tPHZ 1.3 V 90% VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. D. The outputs are measured one at a time with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type 5962-8513001VSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type 85130012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 8513001RA ACTIVE CDIP J 20 1 TBD Call TI Call TI JM38510/65755B2A ACTIVE LCCC FK 20 1 TBD JM38510/65755BRA ACTIVE CDIP J 20 1 TBD M38510/65755B2A ACTIVE LCCC FK 20 1 TBD M38510/65755BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SN54HCT244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SN74HCT244DBLE OBSOLETE SSOP DB 20 TBD Call TI SN74HCT244DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 Pb-Free (RoHS) SN74HCT244N ACTIVE PDIP N 20 SN74HCT244N3 OBSOLETE PDIP N 20 SN74HCT244NE4 ACTIVE PDIP N 20 TBD 20 Pb-Free (RoHS) Addendum-Page 1 POST-PLATE N / A for Pkg Type N / A for Pkg Type POST-PLATE N / A for Pkg Type Call TI CU NIPDAU N / A for Pkg Type Call TI Samples (Requires Login) 5962-8513001VRA A42 (3) Call TI CU NIPDAU N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 29-Aug-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244PWLE OBSOLETE TSSOP PW 20 SN74HCT244PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244PWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244PWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HCT244FK ACTIVE LCCC FK 20 1 TBD SNJ54HCT244J ACTIVE CDIP J 20 1 TBD Call TI Samples (Requires Login) SN74HCT244NSR TBD (3) Call TI POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2012 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54HCT244, SN54HCT244-SP, SN74HCT244 : * Catalog: SN74HCT244, SN54HCT244 * Automotive: SN74HCT244-Q1, SN74HCT244-Q1 * Enhanced Product: SN74HCT244-EP, SN74HCT244-EP * Military: SN54HCT244 * Space: SN54HCT244-SP NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Enhanced Product - Supports Defense, Aerospace and Medical Applications * Military - QML certified for Military and Defense Applications * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HCT244DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74HCT244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74HCT244NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74HCT244PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN74HCT244PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN74HCT244PWRG4 TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN74HCT244PWT TSSOP PW 20 250 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HCT244DBR SN74HCT244DWR SSOP DB 20 2000 367.0 367.0 38.0 SOIC DW 20 2000 367.0 367.0 45.0 SN74HCT244NSR SO NS 20 2000 367.0 367.0 45.0 SN74HCT244PWR TSSOP PW 20 2000 367.0 367.0 38.0 SN74HCT244PWR TSSOP PW 20 2000 364.0 364.0 27.0 SN74HCT244PWRG4 TSSOP PW 20 2000 367.0 367.0 38.0 SN74HCT244PWT TSSOP PW 20 250 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. 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