TXB0108 www.ti.com SCES643E - NOVEMBER 2006 - REVISED MAY 2012 8-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO-DIRECTION SENSING AND 15-kV ESD PROTECTION Check for Samples: TXB0108 FEATURES APPLICATIONS * * 1 * 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 B1 B2 B3 B4 VCCB GND B5 B6 B7 B8 1 20 VCCA 2 19 A2 A3 A4 A5 3 18 4 17 5 16 6 15 A6 A7 7 14 8 13 9 12 10 11 B6 B7 B8 GND 5 B A TERMINAL ASSIGNMENTS (20-Ball GXY/ZXY Package) 1 2 3 4 5 D VCCB B2 B4 B6 B8 C B1 B3 B5 B7 GND B A1 A3 A5 A7 OE A VCCA A2 A4 A6 A8 B1 VCCB B2 B3 B4 B5 4 C VCCA A2 A3 A4 A5 A6 A7 A8 1 20 YZP PACKAGE (BALL SIDE VIEW) E B6 B8 A8 A6 D GND B7 A7 OE 4 19 VCCB 18 B2 17 B3 5 6 16 B4 15 B5 C VCCB B5 A5 VCCA 7 14 B6 13 B7 B B4 B3 A3 A4 12 B8 A B2 B1 A1 A2 1 2 3 4 2 3 8 9 10 OE Note: 3 RGY PACKAGE (TOP VIEW) A1 A8 OE 2 D PW PACKAGE (TOP VIEW) DQS PACKAGE (TOP VIEW) A1 A2 A3 A4 VCCA OE A5 A6 A7 A8 1 B1 * GXY OR ZXY PACKAGE (BOTTOM VIEW) 11 GND * * * Handset, Smartphone, Tablet, Desktop PC A1 * 1.2 V to 3.6 V on A Port and 1.65 to 5.5 V on B Port (VCCA VCCB) VCC Isolation Feature - If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State OE Input Circuit Referenced to VCCA Low Power Consumption, 4-A Max ICC Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 - A Port - 2000-V Human-Body Model (A114-B) - 1000-V Charged-Device Model (C101) - B Port - 15-kV Human-Body Model (A114-B) - 8-kV Human-Body Model (A114-B) (YZP Package Only) - 1000-V Charged-Device Model (C101) For the RGY package, the exposed center thermal pad must be connected to ground. A. Pull up resistors are not required on both sides for Logic I/O. B. If pull up or pull down resistors are needed, the resistor value must be over 50 k. C. 50 k is a safe recommended value, if the customer can accept higher Vol or lower Voh, smaller pull up or pull down resistor is allowed, the draft estimation is Vol = Vccout x 4.5k/(4.5k + Rpu) and Voh = Vccout x Rdw/(4.5k + Rdw). D. If pull up resistors are needed, please refer to the TXS0108 or contact TI. E. For detailed information, please refer to application note SCEA043. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2006-2012, Texas Instruments Incorporated TXB0108 SCES643E - NOVEMBER 2006 - REVISED MAY 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION/ORDERING INFORMATION This 8-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. The TXB0101 is designed so that the OE input circuit is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. Table 1. ORDERING INFORMATION (1) PACKAGE (2) TA -40C to 85C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING QFN - RGY Reel of 1000 TXB0108RGYR YE08 SON - DQS Reel of 2000 TXB0108DQSR 5MR TSSOP - PW Reel of 2000 TXB0108PWR YE08 VFBGA - GXY Reel of 2500 TXB0108GXYR YE08 VFBGA - ZXY (Pb-free) Reel of 2500 TXB0108ZXYR YE08 DSBGA - YZP Reel of 2500 TXB0108YZPR 5M For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. PIN DESCRIPTION PIN NUMBER NAME DQS YZP 1 1 A3 A1 2 5 C4 VCCA 3 2 A4 A2 Input/output 2. Referenced to VCCA. 4 3 B3 A3 Input/output 3. Referenced to VCCA. 5 4 B4 A4 Input/output 4. Referenced to VCCA. 6 7 C3 A5 Input/output 5. Referenced to VCCA. 7 8 E4 A6 Input/output 6. Referenced to VCCA. 8 9 D3 A7 Input/output 7. Referenced to VCCA. 9 10 E3 A8 Input/output 8. Referenced to VCCA. 10 6 D4 OE Output enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA. 11 15 D1 GND 12 11 E2 B8 Input/output 8. Referenced to VCCB. 13 12 D2 B7 Input/output 7. Referenced to VCCB. 14 13 E1 B6 Input/output 6. Referenced to VCCB. 15 14 C2 B5 Input/output 5. Referenced to VCCB. 16 17 B1 B4 Input/output 4. Referenced to VCCB. 17 18 B2 B3 Input/output 3. Referenced to VCCB. 18 19 A1 B2 Input/output 2. Referenced to VCCB. 19 16 C1 VCCB 20 20 A2 B1 -- 2 FUNCTION PW, RGY Input/output 1. Referenced to VCCA. A-port supply voltage. 1.1 V VCCA 3.6 V, VCCA VCCB. Ground B-port supply voltage. 1.65 V VCCB 5.5 V. Input/output 1. Referenced to VCCB. Thermal Pad For the RGY package, the exposed center thermal pad must be connected to ground. Submit Documentation Feedback Copyright (c) 2006-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0108 TXB0108 www.ti.com SCES643E - NOVEMBER 2006 - REVISED MAY 2012 TYPICAL OPERATING CIRCUIT 1.8 V 3.3 V VCCA VCCB OE TXB0108 1.8 -V System Controller Data A1 A2 B1 B2 A3 A4 A5 A6 A7 A8 B3 B4 B5 B6 B7 B8 3.3-V System Data Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCCA Supply voltage range -0.5 4.6 V VCCB Supply voltage range -0.5 6.5 V VI Input voltage range (2) -0.5 6.5 V VO Voltage range applied to any output in the high-impedance or power-off state (2) -0.5 6.5 V VO Voltage range applied to any output in the high or low state (2) IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current 50 mA 100 mA (3) A inputs -0.5 VCCA + 0.5 B inputs -0.5 VCCB + 0.5 Continuous current through VCCA, VCCB, or GND DQS package JA Tstg (1) (2) (3) (4) (5) Package thermal impedance V TBD GXY/ZXY package (4) 78 PW package (4) 83 RGY package (5) 37 Storage temperature range UNIT -65 150 C/W C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCCA and VCCB are provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. Submit Documentation Feedback Copyright (c) 2006-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0108 3 TXB0108 SCES643E - NOVEMBER 2006 - REVISED MAY 2012 www.ti.com Recommended Operating Conditions (1) (2) VCCA VCCA VCCB Supply voltage VIH High-level input voltage VIL Low-level input voltage t/v Input transition rise or fall rate TA (1) (2) (3) 4 VCCB Data inputs OE 1.2 V to 3.6 V Data inputs 1.2 V to 5.5 V OE 1.2 V to 3.6 V A-port inputs 1.2 V to 3.6 V B-port inputs 1.2 V to 3.6 V 1.65 V to 5.5 V 1.65 V to 5.5 V MIN MAX 1.2 3.6 1.65 5.5 VCCI x 0.65 (3) VCCI VCCA x 0.65 5.5 0 VCCI x 0.35 (3) 0 VCCA x 0.35 1.65 V to 5.5 V 40 1.65 V to 3.6 V 40 4.5 V to 5.5 V 30 Operating free-air temperature -40 85 UNIT V V V ns/V C The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND. VCCA must be less than or equal to VCCB and must not exceed 3.6 V. VCCI is the supply voltage associated with the input port. Submit Documentation Feedback Copyright (c) 2006-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0108 TXB0108 www.ti.com SCES643E - NOVEMBER 2006 - REVISED MAY 2012 Electrical Characteristics (1) (2) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCCA TA = 25C VCCB MIN 1.2 V IOH = -20 A VOLA IOL = 20 A VOHB IOH = -20 A 1.65 V to 5.5 V VOLB IOL = 20 A 1.65 V to 5.5 V IOZ 1.4 V to 3.6 V VCCB - 0.4 V V A 1.65 V to 5.5 V 1 2 0 V to 5.5 V 1 2 B port 0 V to 3.6 V 0V 1 2 1.2 V to 3.6 V 1.65 V to 5.5 V 1 2 OE = GND VI = VCCI or GND, IO = 0 1.4 V to 3.6 V 0V 0V 5.5 V VI = VCCI or GND, IO = 0 1.4 V to 3.6 V ICCA + ICCB VI = VCCI or GND, IO = 0 1.2 V ICCZA VI = VCCI or GND, IO = 0, OE = GND ICCZB VI = VCCI or GND, IO = 0, OE = GND ICCB OE A port B port 0V 0V 5.5 V 1.4 V to 3.6 V 5 2 5 -2 A 2 3.5 1.65 V to 5.5 V 10 A 0.05 1.65 V to 5.5 V 5 1.2 V 1.4 V to 3.6 V A -2 1.2 V 1.4 V to 3.6 V A 3.4 1.65 V to 5.5 V 3.6 V A 0.06 1.65 V to 5.5 V 3.6 V V 0.4 0V 1.2 V (1) (2) 0.4 1.2 V to 3.6 V A or B port UNIT V A port ICCA Cio MAX 0.9 1.4 V to 3.6 V 1.2 V CI MIN VCCA - 0.4 1.2 V OE Ioff MAX 1.1 VOHA II TYP -40C to 85C A 3.3 1.65 V to 5.5 V 1.2 V to 3.6 V 1.65 V to 5.5 V 1.2 V to 3.6 V 1.65 V to 5.5 V 5 5 5.5 5 6.5 8 10 A pF pF VCCI is the supply voltage associated with the input port. VCCO is the supply voltage associated with the output port. Timing Requirements TA = 25C, VCCA = 1.2 V Data rate tw Pulse duration Data inputs VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V TYP TYP TYP TYP 20 20 20 20 Mbps 50 50 50 50 ns UNIT Timing Requirements over recommended operating free-air temperature range, VCCA = 1.5 V 0.1 V (unless otherwise noted) VCCB = 1.8 V 0.15 V MIN Data rate tw Pulse duration MAX VCCB = 2.5 V 0.2 V MIN 50 Data inputs 20 MAX VCCB = 3.3 V 0.3 V MIN 50 20 MAX VCCB = 5 V 0.5 V MIN 50 20 50 20 Submit Documentation Feedback Copyright (c) 2006-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0108 UNIT MAX Mbps ns 5 TXB0108 SCES643E - NOVEMBER 2006 - REVISED MAY 2012 www.ti.com Timing Requirements over recommended operating free-air temperature range, VCCA = 1.8 V 0.15 V (unless otherwise noted) VCCB = 1.8 V 0.15 V MIN MAX Data rate tw VCCB = 2.5 V 0.2 V MIN MAX 52 Pulse duration Data inputs VCCB = 3.3 V 0.3 V MIN MAX 60 19 VCCB = 5 V 0.5 V MIN 60 17 60 17 UNIT MAX 17 Mbps ns Timing Requirements over recommended operating free-air temperature range, VCCA = 2.5 V 0.2 V (unless otherwise noted) VCCB = 2.5 V 0.2 V MIN MAX Data rate tw VCCB = 3.3 V 0.3 V MIN MAX 70 Pulse duration Data inputs VCCB = 5 V 0.5 V MIN 100 14 100 10 UNIT MAX 10 Mbps ns Timing Requirements over recommended operating free-air temperature range, VCCA = 3.3 V 0.3 V (unless otherwise noted) VCCB = 3.3 V 0.3 V MIN Data rate tw VCCB = 5 V 0.5 V MAX MIN 100 Pulse duration Data inputs 10 UNIT MAX 100 10 Mbps ns Switching Characteristics TA = 25C, VCCA = 1.2 V FROM (INPUT) TO (OUTPUT) VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V TYP TYP TYP TYP A B 9.5 7.9 7.6 8.5 B A 9.2 8.8 8.4 8 A 1 1 1 1 B 1 1 1 1 A 20 17 17 18 B 20 16 15 15 trA, tfA A-port rise and fall times 4.1 4.4 4.1 3.9 ns trB, tfB B-port rise and fall times 5 5 5.1 5.1 ns tSK(O) Channel-to-channel skew 2.4 1.7 1.9 7 ns 20 20 20 20 Mbps PARAMETER tpd ten OE tdis OE Max data rate 6 Submit Documentation Feedback UNIT ns s ns Copyright (c) 2006-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0108 TXB0108 www.ti.com SCES643E - NOVEMBER 2006 - REVISED MAY 2012 Switching Characteristics over recommended operating free-air temperature range, VCCA = 1.5 V 0.1 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.8 V 0.15 V VCCB = 2.5 V 0.2 V VCCB = 3.3 V 0.3 V MIN MAX MIN MAX MIN B 1.4 12.9 1.2 10.1 A 0.9 14.2 0.7 12 VCCB = 5 V 0.5 V UNIT MAX MIN MAX 1.1 10 0.8 9.9 0.4 11.7 0.3 13.7 A 1 1 1 1 B 1 1 1 1 ns s A 6.6 33 6.4 25.3 6.1 23.1 5.9 24.6 B 6.6 35.6 5.8 25.6 5.5 22.1 5.6 20.6 trA, tfA A-port rise and fall times 0.8 6.5 0.8 6.3 0.8 6.3 0.8 6.3 ns trB, tfB B-port rise and fall times 1 7.3 0.7 4.9 0.7 4.6 0.6 4.6 ns tSK(O) Channel-to-channel skew 1.3 ns Max data rate 2.6 1.9 50 50 1.6 50 50 ns Mbps Switching Characteristics over recommended operating free-air temperature range, VCCA = 1.8 V 0.15 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.8 V 0.15 V VCCB = 2.5 V 0.2 V VCCB = 3.3 V 0.3 V VCCB = 5 V 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX B 1.6 11 1.4 7.7 1.3 6.8 1.2 6.5 A 1.5 12 1.2 8.4 0.8 7.6 0.5 7.1 A 1 1 1 1 B 1 1 1 1 ns s A 5.9 26.7 5.6 21.6 5.4 18.9 4.8 18.7 B 6.1 33.9 5.2 23.7 5 19.9 5 17.6 trA, tfA A-port rise and fall times 0.7 5.1 0.7 5 1 5 0.7 5 ns trB, tfB B-port rise and fall times 1 7.3 0.7 5 0.7 3.9 0.6 3.8 ns tSK(O) Channel-to-channel skew Max data rate 0.8 52 0.7 60 0.6 60 0.6 60 Submit Documentation Feedback Copyright (c) 2006-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0108 ns ns Mbps 7 TXB0108 SCES643E - NOVEMBER 2006 - REVISED MAY 2012 www.ti.com Switching Characteristics over recommended operating free-air temperature range, VCCA = 2.5 V 0.2 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 2.5 V 0.2 V VCCB = 3.3 V 0.3 V MIN MAX B 1.1 A 1 VCCB = 5 V 0.5 V UNIT MIN MAX MIN MAX 6.4 1 5.3 0.9 4.7 7 0.6 5.6 0.3 4.4 A 1 1 1 B 1 1 1 A 5 16.9 4.9 15 4.5 13.8 B 4.8 21.8 4.5 17.9 4.4 15.2 ns s ns trA, tfA A-port rise and fall times 0.8 3.6 0.6 3.6 0.5 3.5 ns trB, tfB B-port rise and fall times 0.6 4.9 0.7 3.9 0.6 3.2 ns tSK(O) Channel-to-channel skew 0.3 ns 0.4 Max data rate 0.3 70 100 100 Mbps Switching Characteristics over recommended operating free-air temperature range, VCCA = 3.3 V 0.3 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 5 V 0.5 V UNIT MIN MAX MIN MAX B 0.9 4.9 0.8 4 A 0.5 5.4 0.2 4 A 1 1 B 1 1 A 4.5 13.9 4.1 12.4 B 4.1 17.3 4 14.4 ns s ns trA, tfA A-port rise and fall times 0.5 3 0.5 3 ns trB, tfB B-port rise and fall times 0.7 3.9 0.6 3.2 ns tSK(O) Channel-to-channel skew Max data rate 8 VCCB = 3.3 V 0.3 V 0.4 100 Submit Documentation Feedback 0.3 100 ns Mbps Copyright (c) 2006-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0108 TXB0108 www.ti.com SCES643E - NOVEMBER 2006 - REVISED MAY 2012 Operating Characteristics TA = 25C VCCA 1.2 V 1.2 V 1.5 V 1.8 V 2.5 V 2.5 V 3.3 V 2.5 V 5V 3.3 V to 5V VCCB PARAMETER TEST CONDITIONS 5V CpdA CpdB CpdA CpdB A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = VCCA (outputs enabled) CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = GND (outputs disabled) 1.8 V 1.8 V 1.8 V UNIT TYP TYP TYP TYP TYP TYP TYP 9 8 7 7 7 7 8 12 11 11 11 11 11 11 35 26 27 27 27 27 28 26 19 18 18 18 20 21 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.03 0.01 0.01 0.01 0.01 0.01 0.01 0.03 Submit Documentation Feedback Copyright (c) 2006-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0108 pF pF 9 TXB0108 SCES643E - NOVEMBER 2006 - REVISED MAY 2012 www.ti.com PRINCIPLES OF OPERATION Applications The TXB0108 can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. Architecture The TXB0108 architecture (see Figure 1) does not require a direction-control signal to control the direction of data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0108 can maintain a high or low, but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts flowing the opposite direction. The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly, during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up the high-to-low transition. The typical output impedance during output transition is 70 at VCCO = 1.2 V to 1.8 V, 50 at VCCO = 1.8 V to 3.3 V and 40 at VCCO = 3.3 V to 5 V. VCCA VCCB One Shot T1 4k One Shot T2 A B One Shot T3 4k T4 One Shot Figure 1. Architecture of TXB0108 I/O Cell Input Driver Requirements Typical IIN vs VIN characteristics of the TXB0108 are shown in Figure 2. For proper operation, the device driving the data I/Os of the TXB0108 must have drive strength of at least 2 mA. 10 Submit Documentation Feedback Copyright (c) 2006-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0108 TXB0108 www.ti.com SCES643E - NOVEMBER 2006 - REVISED MAY 2012 IIN VT/4 kW VIN -(VD - VT)/4 kW A. VT is the input threshold voltage of the TXB0108 (typically VCCI/2). B. VD is the supply voltage of the external driver. Figure 2. Typical IIN vs VIN Curve Power Up During operation, ensure that VCCA VCCB at all times. During power-up sequencing, VCCA VCCB does not damage the device, so any power supply can be ramped up first. The TXB0108 has circuitry that disables all output ports when either VCC is switched off (VCCA/B = 0 V). Enable and Disable The TXB0108 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the outputs actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the one-shot circuitry to become operational after OE is taken high. Pullup or Pulldown Resistors on I/O Lines The TXB0108 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0108 have low dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be kept higher than 50 k to ensure that they do not contend with the output drivers of the TXB0108. For the same reason, the TXB0108 should not be used in applications such as I2C or 1-Wire where an opendrain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS01xx series of level translators. Submit Documentation Feedback Copyright (c) 2006-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0108 11 TXB0108 SCES643E - NOVEMBER 2006 - REVISED MAY 2012 www.ti.com PARAMETER MEASUREMENT INFORMATION 2 x VCCO From Output Under Test 50 kW From Output Under Test 15 pF 15 pF 1 MW Open 50 kW TEST tPZL/tPLZ tPHZ/tPZH LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT LOAD CIRCUIT FOR MAX DATA RATE, PULSE DURATION PROPAGATION DELAY OUTPUT RISE AND FALL TIME MEASUREMENT S1 S1 2 x VCCO Open VCCI Input VCCI/2 VCCI/2 0V tPLH tPHL tw Output VCCO/2 0.9 y VCCO 0.1 y VCCO VOH tf tr VCCI VCCO/2 VOL Input VCCI/2 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES A. B. C. D. E. F. G. VCCI/2 CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 , dv/dt 1 V/ns. The outputs are measured one at a time, with one transition per measurement. tPLH and tPHL are the same as tpd. VCCI is the VCC associated with the input port. VCCO is the VCC associated with the output port. All parameters and waveforms are not applicable to all devices. Figure 3. Load Circuits and Voltage Waveforms 12 Submit Documentation Feedback Copyright (c) 2006-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0108 TXB0108 www.ti.com SCES643E - NOVEMBER 2006 - REVISED MAY 2012 REVISION HISTORY Changes from Revision C (August 2011) to Revision D Page * Added 8-kV Human-Body Model (A114-B) (YZP Package Only) to Features ................................................................... 1 * Added YZP TOP-SIDE MARKING. ....................................................................................................................................... 2 Changes from Revision D (September 2011) to Revision E * Page Added notes to pin out graphics. .......................................................................................................................................... 1 Submit Documentation Feedback Copyright (c) 2006-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0108 13 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TXB0108DQSR ACTIVE USON DQS 20 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0108PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0108PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0108RGYR ACTIVE VQFN RGY 20 3000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR TXB0108RGYRG4 ACTIVE VQFN RGY 20 3000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR TXB0108YZPR ACTIVE DSBGA YZP 20 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM TXB0108ZXYR ACTIVE BGA MICROSTAR JUNIOR ZXY 20 2500 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2012 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing TXB0108DQSR USON SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DQS 20 3000 177.8 12.4 2.21 4.22 0.81 4.0 12.0 Q1 TXB0108PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 TXB0108RGYR VQFN RGY 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1 TXB0108RGYR VQFN RGY 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1 TXB0108YZPR DSBGA YZP 20 3000 180.0 8.4 1.99 2.49 0.56 4.0 8.0 Q1 TXB0108ZXYR BGA MI CROSTA R JUNI OR ZXY 20 2500 330.0 12.4 2.8 3.3 1.0 4.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXB0108DQSR USON DQS 20 3000 202.0 201.0 28.0 TXB0108PWR TSSOP PW 20 2000 367.0 367.0 38.0 TXB0108RGYR VQFN RGY 20 3000 367.0 367.0 35.0 TXB0108RGYR VQFN RGY 20 3000 355.0 350.0 50.0 TXB0108YZPR DSBGA YZP 20 3000 210.0 185.0 35.0 TXB0108ZXYR BGA MICROSTAR JUNIOR ZXY 20 2500 340.5 338.1 20.6 Pack Materials-Page 2 D: Max = 2.418 mm, Min =2.358 mm E: Max = 1.918 mm, Min =1.858 mm IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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