RF01001, Rev. B (22/2/18) ©2018 Microsemi Corporation Page 1 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
Available
Surface Mount 1500 Watt
Transient Voltage Suppressor
Screening in
reference to
MIL-PRF-19500
available
DESCRIPTION
The MSMCG(J)5.0A through MXLSMCG(J)170A series of 1500 watt high-reliability Transient
Voltage Suppressors (TVSs) protects a variety of voltage-sensitive components. The SMCG gull-
wing design in the DO-215AB package allows for visible solder connections. The SMCJ J-bend
design in the DO-214AB package allows for greater PC board mounting density. Selections include
unidirectional and bidirectional as well as RoHS compliant versions. These are available with a
variety of upscreening options for enhanced reliability. They can protect against the secondary
effects of lightning per IEC61000-4-5 and against voltage pulses from inductive switching
environments and induced by RF radiation. Since their response time is virtually instantaneous,
they can also be used in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4.
DO-215AB
(SMCG) Package
DO-214AB
(SMCJ) Package
NOTE: All SMC series are
equivalent to prior SMM package
identifications.
Also available:
Commercial grade
SMCG(J)5.0A –
SMCG(J)170CAe3
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• High reliability devices with fabrication and assembly lot traceability.
• All devices are 100% surge tested.
• 3σ lot norm screening performed on standby current (ID).
• Available in both unidirectional and bidirectional versions.
• Moisture classification is “Level 1” with no dry pack required per IPC/JEDEC J-STD-020B.
• Enhanced reliability screening options are available in reference to MIL-PRF-19500.
Refer to High Reliability Up-Screened Plastic Products Portfolio for more details on the screening
options.
(See part nomenclature for all available options).
• RoHS compliant versions available.
• Axial-lead equivalent packages for thru-hole mounting are available as 1.5KE6.8A to 1.5KE200CA
or 1N6267 thru 1N6303A and 1N5908 (contact Microsemi for other surface mount options).
APPLICATIONS / BENEFITS
• High-reliability devices.
• Selections for 5.0 to 170 volts standoff voltages (VWM).
• Protection from switching transients and induced RF.
• Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4.
• Secondary lightning protection per IEC61000-4-5 with 42 ohms source impedance:
Class 1: MSMC 5.0A to MXLSMC 170A or CA
Class 2: MSMC 5.0A to MXLSMC 150A or CA
Class 3: MSMC 5.0A to MXLSMC 75A or CA
Class 4: MSMC 5.0A to MXLSMC 36A or CA
• Secondary lightning protection per IEC61000-4-5 with 12 ohms source impedance:
Class 1: MSMC 5.0A to MXLSMC 90A or CA
Class 2: MSMC 5.0A to MXLSMC 45A or CA
Class 3: MSMC 5.0A to MXLSMC 24A or CA
Class 4: MSMC 5.0A to MXLSMC 11A or CA
• Secondary lightning protection per IEC61000-4-5 with 2 ohms source impedance:
Class 2: MSMC 5.0A to MXLSMC 22A or CA
Class 3: MSMC 5.0A to MXLSMC 10A or CA
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
RF01001, Rev. B (22/2/18) ©2018 Microsemi Corporation Page 2 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
MAXIMUM RATINGS
Parameters/Test Conditions
Value
Unit
Junction and Storage Temperature
-65 to +150
ºC
Thermal Resistance Junction-to-Lead
20
ºC/W
Thermal Resistance Junction-to-Ambient (1)
80
ºC/W
Peak Pulse Power Dissipation @ 25 ºC (at 10/1000 s,
see Figures 1, 2, and 3)
1500
W
Impulse Repetition Rate (duty factor)
0.01
%
tclamping (0 volts to V(BR) min.)
Unidirectional
Bidirectional
<100
<5
ps
ns
Rated Average Power Dissipation
TL = +30 ºC
TA = +25 ºC
6
1.56(1)
W
Maximum Forward Surge Current (2)
200
A (pk)
Solder Temperature @ 10 s
260
oC
Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see last page).
2. Peak impulse of 8.3 ms half-sine wave at 25 ºC (unidirectional only).
MECHANICAL and PACKAGING
• CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0.
• TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating. Solderable to MIL-STD-750, method 2026.
• MARKING: Part number marked on package.
• POLARITY: Cathode indicated by band. No cathode band on bi-directional devices.
• TAPE & REEL option: Standard per EIA-481-2 with 16 mm tape (add “TR” suffix to part number). Consult factory for
quantities.
• WEIGHT: Approximately 0.25 grams.
• See Package Dimensions on last page.
PART NOMENCLATURE
MX SM C G 5.0 C A e3
Reliability Level*
M
MA
MX
MXL
*(see High Reliability
Up-Screened Plastic
Products Portfolio)
Surface Mount
Package
1500 W Power Level
Gull-wing Lead Frame
G = Gull-Wing
J = J-Bend
RoHS Compliance
e3 = RoHS Compliant
Blank = non-RoHS Compliant
+/- 5% Tolerance Level
Uni/Bidirectional
C = Bidirectional
Blank = Unidirectional
Reverse Stand-Off Voltage
(see Electrical Characteristics
table)
RF01001, Rev. B (22/2/18) ©2018 Microsemi Corporation Page 3 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
SYMBOLS & DEFINITIONS
Symbol
Definition
I(BR)
Breakdown Current: The current used for measuring breakdown voltage V(BR).
ID
Standby Current: The current at the rated standoff voltage (VWM).
IF
Forward Current: The forward current dc value, no alternating component.
IO
Average Rectified Output Current: The output current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave input
and a 180-degree conduction angle.
IPP
Peak Impulse Current: The peak current during the impulse.
PPP
Peak Pulse Power: The peak power dissipation resulting from the peak impulse current IPP.
VC
Clamping Voltage: Maximum clamping voltage at specified IPP (Peak Pulse Current) at the specified pulse conditions.
V(BR)
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
VWM
Working Peak Voltage: The maximum peak voltage that can be applied over the operating temperature range. This is
also referred to as standoff voltage.
ELECTRICAL CHARACTERISTICS @ 25 ºC unless otherwise stated
MICROSEMI PART NUMBER
REVERSE
STAND-OFF
VOLTAGE
VWM
Volts
BREAKDOWN
VOLTAGE
V(BR) @ I(BR)
Volts
MAXIMUM
CLAMPING
VOLTAGE
@ IPP
Volts
PEAK PULSE
CURRENT
(See Fig. 2)
IPP
Amps
MAXIMUM
STANDBY
CURRENT
@ VWM
ID
A
Gull-Wing
J-Bend
MIN. MAX.
I(BR)
mA
MSMCG5.0A
MSMCG6.0A
MSMCJ5.0A
MSMCJ6.0A
5.0
6.0
6.40 – 7.00
6.67 – 7.37
10
10
9.2
10.3
163.0
145.6
1000
1000
MSMCG6.5A
MSMCG7.0A
MSMCJ6.5A
MSMCJ7.0A
6.5
7.0
7.22 – 7.98
7.78 – 8.60
10
10
11.2
12.0
133.9
125.0
500
200
MSMCG7.5A
MSMCG8.0A
MSMCJ7.5A
MSMCJ8.0A
7.5
8.0
8.33 – 9.21
8.89 – 9.83
1
1
12.9
13.6
116.3
110.3
100
50
MSMCG8.5A
MSMCG9.0A
MSMCJ8.5A
MSMCJ9.0A
8.5
9.0
9.44 – 10.4
10.0 – 11.1
1
1
14.4
15.4
104.2
97.4
20
10
MSMCG10A
MSMCG11A
MSMCJ10A
MSMCJ11A
10
11
11.1 – 12.3
12.2 – 13.5
1
1
17.0
18.2
88.2
82.4
5
5
MSMCG12A
MSMCG13A
MSMCJ12A
MSMCJ13A
12
13
13.3 – 14.7
14.4 – 15.9
1
1
19.9
21.5
75.3
69.7
5
1
MSMCG14A
MSMCG15A
MSMCJ14A
MSMCJ15A
14
15
15.6 – 17.2
16.7 – 18.5
1
1
23.2
24.4
64.7
61.5
1
1
MSMCG16A
MSMCG17A
MSMCJ16A
MSMCJ17A
16
17
17.8 – 19.7
18.9 – 20.9
1
1
26.0
27.6
57.7
53.3
1
1
MSMCG18A
MSMCG20A
MSMCJ18A
MSMCJ20A
18
20
20.0 – 22.1
22.2 – 24.5
1
1
29.2
32.4
51.4
46.3
1
1
MSMCG22A
MSMCG24A
MSMCJ22A
MSMCJ24A
22
24
24.4 – 26.9
26.7 – 29.5
1
1
35.5
38.9
42.2
38.6
1
1
MSMCG26A
MSMCG28A
MSMCJ26A
MSMCJ28A
26
28
28.9 – 31.9
31.1 – 34.4
1
1
42.1
45.4
35.6
33.0
1
1
MSMCG30A
MSMCG33A
MSMCJ30A
MSMCJ33A
30
33
33.3 – 36.8
36.7 – 40.6
1
1
48.4
53.3
31.0
28.1
1
1
MSMCG36A
MSMCG40A
MSMCJ36A
MSMCJ40A
36
40
40.0 – 44.2
44.4 – 49.1
1
1
58.1
64.5
25.8
23.2
1
1
MSMCG43A
MSMCG45A
MSMCJ43A
MSMCJ45A
43
45
47.8 – 52.8
50.0 – 55.3
1
1
69.4
72.7
21.6
20.6
1
1
MSMCG48A
MSMCG51A
MSMCJ48A
MSMCJ51A
48
51
53.3 – 58.9
56.7 – 62.7
1
1
77.4
82.4
19.4
18.2
1
1
MSMCG54A
MSMCG58A
MSMCJ54A
MSMCJ58A
54
58
60.0 – 66.3
64.4 – 71.2
1
1
87.1
93.6
17.2
16.0
1
1
MSMCG60A
MSMCG64A
MSMCJ60A
MSMCJ64A
60
64
66.7 – 73.7
71.1 – 78.6
1
1
96.8
103.0
15.5
14.6
1
1
MSMCG70A
MSMCG75A
MSMCJ70A
MSMCJ75A
70
75
77.8 – 86.0
83.3 – 92.1
1
1
113
121
13.3
12.4
1
1
Continued.
RF01001, Rev. B (22/2/18) ©2018 Microsemi Corporation Page 4 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
ELECTRICAL CHARACTERISTICS @ 25 ºC unless otherwise stated (continued)
MICROSEMI PART NUMBER
REVERSE
STAND-OFF
VOLTAGE
VWM
Volts
BREAKDOWN
VOLTAGE
V(BR) @ I(BR)
Volts
MAXIMUM
CLAMPING
VOLTAGE
@ IPP
Volts
PEAK PULSE
CURRENT
(See Fig. 2)
IPP
Amps
MAXIMUM
STANDBY
CURRENT
@ VWM
ID
A
Gull-Wing
J-Bend
MIN. MAX.
I(BR)
mA
MSMCG78A
MSMCG85A
MSMCJ78A
MSMCJ85A
78
85
86.7 – 95.8
94.4 – 104.0
1
1
126
137
11.4
10.4
1
1
MSMCG90A
MSMCG100A
MSMCJ90A
MSMCJ100A
90
100
100 – 111
111 – 123
1
1
146
162
10.3
9.3
1
1
MSMCG110A
MSMCG120A
MSMCJ110A
MSMCJ120A
110
120
122 – 135
133 – 147
1
1
177
193
8.4
7.8
1
1
MSMCG130A
MSMCG150A
MSMCJ130A
MSMCJ150A
130
150
144 – 159
167 – 185
1
1
209
243
7.2
6.2
1
1
MSMCG160A
MSMCG170A
MSMCJ160A
MSMCJ170A
160
170
178 – 197
189 – 209
1
1
259
275
5.8
5.5
1
1
RF01001, Rev. B (22/2/18) ©2018 Microsemi Corporation Page 5 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
GRAPHS
t – Time (msec)
tp – Pulse Time – sec
FIGURE 2 – Pulse Waveform
FIGURE 1 – Peak Pulse Power vs. Pulse Time
TL Lead Temperature oC BV – Breakdown Voltage (V)
FIGURE 3 – Derating Curve FIGURE 4
Typical Capacitance vs.
Breakdown Voltage (unidirectional configuration)
NOTE: Bidirectional capacitance is half that shown at zero volts.
(PPP) – Peak Pulse Power - kW
Peak Pulse Power (PPP) or continuous
Power in Percent of 25 oC Rating
100
10
1.0
0
IPP – Peak Pulse Current - % IPP
C – Capacitance (pF)
Test wave form
parameters
tr = 10 sec.
tp = 1000 sec.
0 1s 10sec 100sec 1ms 10ms
RF01001, Rev. B (22/2/18) ©2018 Microsemi Corporation Page 6 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
PACKAGE DIMENSIONS
NOTES: Dimension “E” exceeds the JEDEC outline as shown.
Typical Standoff Height: 0.004” – 0.008” (0.1 mm – 0.2 mm).
NOTES: Dimension “E” exceeds the JEDEC outline in height as shown.
Typical Standoff Height: 0.004” – 0.008” (0.1 mm – 0.2 mm).
Dimensions
Ltr
Inch
Millimeters
Min
Max
Min
Max
A
.115
.121
2.92
3.07
B
.260
.280
6.60
7.11
C
.220
.245
5.59
6.22
E
.077
.110
1.95
2.80
F
.380
.400
9.65
10.16
K
.025
.040
0.635
1.016
Dimensions
Ltr
Inch
Millimeters
Min
Max
Min
Max
A
.115
.121
2.92
3.07
B
.260
.280
6.60
7.11
C
.220
.245
5.59
6.22
D
.305
.320
7.75
8.13
E
.077
.110
1.95
2.80
L
.030
.060
.760
1.52
SMCG (DO-215AB)
SMCJ (DO-214AB)
RF01001, Rev. B (22/2/18) ©2018 Microsemi Corporation Page 7 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
PAD LAYOUT
SMCG (DO-215AB)
Ltr
Inch
Millimeters
A
.510
12.95
B
.110
2.79
C
.150
3.81
SMCJ (DO-214AB)
Ltr
Inch
Millimeters
A
.390
9.90
B
.110
2.79
C
.150
3.81