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BBY58...
Silicon Tuning Diodes
• Excellent linearity
• High Q hyperabrupt tuning diode
• Low series resistance
• Designed for low tuning voltage operation
for VCO's in mobile communications equipment
• For low frequency control elements
such as TCXOs and VCXOs
• Very low capacitance spread
• Pb-free (RoHS compliant) package1)
• Qualified according AEC Q101
BBY58-02L/V
BBY58-02W
BBY58-03W
BBY58-06WBBY58-05W
!
,
,
!
,
,
Type Package Configuration LS(nH) Marking
BBY58-02L
BBY58-02V
BBY58-02W
BBY58-03W
BBY58-05W
BBY58-06W
TSLP-2-1
SC79
SCD80
SOD323
SOT323
SOT323
single, leadless
single
single
single
common cathode
common anode
0.4
0.6
0.6
0.6
1.4
1.4
88
8
88
8 yel.
B5s
B6s
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter Symbol Value Unit
Diode reverse voltage VR10 V
Forward current IF20 mA
Operating temperature range Top -55 ... 150 °C
Storage temperature Tst
g
-55 ... 150
1Pb-containing package may be available upon special request
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Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Reverse current
VR = 8 V
VR = 8 V, TA = 85 °C
IR
-
-
-
-
10
100
nA
AC Characteristics
Diode capacitance
VR = 1 V, f = 1 MHz
VR = 2 V, f = 1 MHz
VR = 3 V, f = 1 MHz
VR = 4 V, f = 1 MHz
VR = 6 V, f = 1 MHz
CT
17.5
11.4
7.8
5.5
3.8
18.3
12.35
8.6
6
4.7
19.3
13.3
9.3
6.6
5.5
pF
Capacitance ratio
VR = 1 V, VR = 3 V, f = 1 MHz CT1/CT3 1.9 2.15 2.4 -
Capacitance ratio
VR = 1 V, VR = 4 V, f = 1 MHz CT1/CT4 2.7 3.05 3.5
Capacitance ratio
VR = 4 V, VR = 6 V, f = 1 MHz CT4/CT6 1.15 1.3 1.45
Series resistance
VR = 1 V, f = 470 MHz, BBY58-02L, -07L4
VR = 1 V, f = 470 MHz, all other
rS
-
-
0.3
0.25
-
-
Ω
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Diode capacitance CT = ƒ (VR)
f = 1MHz
0 0.5 1 1.5 2 2.5 3 3.5 4 V5
VR
0
4
8
12
16
20
24
pF
32
CT
Normalized diode capacitance
C(TA)/C(25°C)= ƒ(TA)
f = 1MHz, VR = Parameter
-30 -10 10 30 50 70 °C 100
TA
0.95
0.96
0.97
0.98
0.99
1
1.01
1.02
1.03
-
1.05
CTA/C25
1V
4V
Temperature coefficient of the diode
capacitance TCc = ƒ (VR)
0 0.5 1 1.5 2 2.5 3 3.5 4 V5
VR
-4
10
-3
10
1/°C
TCC
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Package SC79
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
±0.1
1.6
0.3
1
2
marking
Cathode
0.8
±0.1
10
˚
MAX.
±0.1
1.2
A
±0.05
10
˚
MAX.
0.13
A0.2 M
+0.05
-0.03
±0.04
0.55
±0.05
0.2
0.35
0.35
1.35
BAR63-02V
Type code
Cathode marking
Laser marking
2
0.66
0.93
0.4
1.33
1.96
8
0.2
Cathode
marking
4
Cathode
marking
Standard Reel with 2 mm Pitch
2005, June
Date code
2007-09-19
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BBY58...
Package SCD80
Package Outline
Foot Print
Marking Layout (Example)
±0.1
1.7
0.3
1
2
marking
Cathode
0.8
±0.1
10
˚
MAX.
±0.1
0.7
±0.1
1.3 7
˚
0.13
±0.05
+0.05
-0.03
±1.5
˚
0.2
M
A
A
±0.05
0.2
0.35
0.35
1.45
BAR63-02W
Type code
Cathode marking
Laser marking
0.7
20.2
0.9
0.4
8
4
1.45
2.5
Standard Reel with 2 mm Pitch
Cathode
marking
Cathode
marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
2005, June
Date code
2007-09-19
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Date Code marking for discrete packages with
one digit (SCD80, SC79, SC751)) CES-Code
1) New Marking Layout for SC75, implemented at October 2005.
.
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01apAPapAPapAP
02bqBQbqBQbqBQ
03crCRcrCRcrCR
04dsDSdsDSdsDS
05et ETet ETet ET
06fuFUfuFUfuFU
07gvGVgvGVgvGV
08hxHXhxHXhxHX
09jyJYjyJYjyJY
10kzKZkzKZkzKZ
11l 2L4l 2L4l 2L4
12n3N5n3N5n3N5
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Package SOD323
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
BAR63-03W
Type code
Cathode marking
Laser marking
0.80.8
0.6
1.7
marking
Cathode
±0.2
2.5
0.25
0.3
1
-0.05
M
A
+0.1
+0.2
2
1.25
-0.1
+0.05
-0.2
1.7
0.3
0.15
-0.06
+0.1
0
±0.05
+0.2
-0.1
A
0.9
+0.2
-0.1
±0.15
0.45
0.2
4
8
2.9
1
2
1.35
0.65
Cathode
marking
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Package SOT323
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.25
±0.1
0.1 MAX.
2.1
±0.1
0.15+0.1
-0.05
0.3+0.1
±0.1
0.9
12
3A
±0.2
2
-0.05
0.650.65
M
3x 0.1
0.1 MIN.
0.1
M
0.2 A
0.2
4
2.15 1.1
8
2.3
Pin 1
Pin 1
2005, June
Date code (YM)
BCR108W
Type code
0.6
0.8
1.6
0.65 0.65
Manufacturer
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Package TSLP-2-1
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
For board assembly information please refer to Infineon website "Packages"
1
2
0.45
0.275 0.275
0.375
0.925
Copper Solder mask Stencil apertures
0.35
1
0.6
0.35
0.3
BAS16-02L
Type code
Cathode marking
Laser marking
0.76
4
1.16
8
0.5
Cathode
marking
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
0.4
0.05 MAX.
+0.1
Cathode
marking
1) Dimension applies to plated terminal
Top view Bottom view
1
2
±0.05
0.65
±0.035
0.25 1)
1±0.05
1)
±0.035
0.5
±0.05
0.6
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Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
