PSoC® 3: CY8C36 Family Datasheet
Programmable System-on-Chip (PSoC®)
Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600
Document Number: 001-53413 Rev. *Z Revised June 1, 2017
General Description
PSoC® 3 is a true programmable embedded system-on-chip, integrating configurable analog and digital peripherals, memory, and a
microcontroller on a single chip. The PSoC 3 architecture boosts performance through:
8051 core plus DMA controller and digital filter processor, at up to 67 MHz
Ultra low power with industry's widest voltage range
Programmable digital and analog peripherals enable custom functions
Flexible routing of any analog or digital peripheral function to any pin
PSoC devices employ a highly configurable system-on-chip architecture for embedded control design. They integrate configurable
analog and digital circuits, controlled by an on-chip microcontroller. A single PSoC device can integrate as many as 100 digital and
analog peripheral functions, reducing design time, board space, power consumption, and system cost while improving system quality.
Features
Operating characteristics
Voltage range: 1.71 to 5.5 V, up to six power domains
Temperature range (ambient) –40 to 85 °C[1]
DC to 67-MHz operation
Power modes
• Active mode 1.2 mA at 6 MHz, and 12 mA at 48 MHz
• 1-µA sleep mode
• 200-nA hibernate mode with RAM retention
Boost regulator from 0.5-V input up to 5-V output
Performance
8-bit 8051 CPU, 32 interrupt inputs
24-channel direct memory access (DMA) controller
24-bit 64-tap fixed-point digital filter processor (DFB)
Memories
Up to 64 KB program flash, with cache and security features
Up to 8 KB additional flash for error correcting code (ECC)
Up to 8 KB RAM
Up to 2 KB EEPROM
Digital peripherals
Up to four 16-bit timer, counter, and PWM (TCPWM) blocks
I2C, 1 Mbps bus speed
USB 2.0 certified Full-Speed (FS) 12 Mbps peripheral
interface (TID#40770053) using internal oscillator[2]
Full CAN 2.0b, 16 Rx, 8 Tx buffers
16 to 24 universal digital blocks (UDB), programmable to
create any number of functions:
• 8-, 16-, 24-, and 32-bit timers, counters, and PWMs
•I
2C, UART, SPI, I2S, LIN 2.0 interfaces
• Cyclic redundancy check (CRC)
• Pseudo random sequence (PRS) generators
• Quadrature decoders
• Gate-level logic functions
Programmable clocking
3- to 62-MHz internal oscillator, 1% accuracy at 3 MHz
4- to 25-MHz external crystal oscillator
Internal PLL clock generation up to 67 MHz
Low-power internal oscillator at 1, 33, and 100 kHz
32.768-kHz external watch crystal oscillator
12 clock dividers routable to any peripheral or I/O
Analog peripherals
Configurable 8- to 12-bit delta-sigma ADC
Up to four 8-bit DACs
Up to four comparators
Up to four opamps
Up to four programmable analog blocks, to create:
• Programmable gain amplifier (PGA)
• Transimpedance amplifier (TIA)
•Mixer
• Sample and hold circuit
CapSense® support, up to 62 sensors
1.024 V ±0.1% internal voltage reference
Versatile I/O system
29 to 72 I/O pins – up to 62 general-purpose I/Os (GPIOs)
Up to eight performance I/O (SIO) pins
• 25 mA current sink
• Programmable input threshold and output high voltages
• Can act as a general-purpose comparator
• Hot swap capability and overvoltage tolerance
Two USBIO pins that can be used as GPIOs
Route any digital or analog peripheral to any GPIO
LCD direct drive from any GPIO, up to 46 × 16 segments
CapSense support from any GPIO
1.2-V to 5.5-V interface voltages, up to four power domains
Programming and debug
JTAG (4-wire), serial wire debug (SWD) (2-wire), and single
wire viewer (SWV) interfaces
Bootloader programming through I2C, SPI, UART, USB, and
other interfaces
Package options: 48-pin SSOP, 48-pin QFN, 68-pin QFN,
100-pin TQFP, and 72-pin WLCSP
Development support with free PSoC Creator™ tool
Schematic and firmware design support
Over 100 PSoC Components™ integrate multiple ICs and
system interfaces into one PSoC. Components are free
embedded ICs represented by icons. Drag and drop
component icons to design systems in PSoC Creator.
Includes free Keil 8051 compiler
Supports device programming and debugging
Notes
1. The maximum storage temperature is 150 °C in compliance with JEDEC Standard JESD22-A103, High Temperature Storage Life.
2. This feature on select devices only. See Ordering Information on page 120 for details.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 2 of 137
More Information
Cypress provides a wealth of data at www.cypress.com to help you to select the right PSoC device for your design, and to help you
to quickly and effectively integrate the device into your design. For a comprehensive list of resources, see the knowledge base article
KBA86521, How to Design with PSoC 3, PSoC 4, and PSoC 5LP. Following is an abbreviated list for PSoC 3:
Overview: PSoC Portfolio, PSoC Roadmap
Product Selectors: PSoC 1, PSoC 3, PSoC 4, PSoC 5LP
In addition, PSoC Creator includes a device selection tool.
Application notes: Cypress offers a large number of PSoC
application notes and code examples covering a broad range
of topics, from basic to advanced level. Recommended appli-
cation notes for getting started with PSoC 3 are:
AN54181: Getting Started With PSoC 3
AN61290: Hardware Design Considerations
AN57821: Mixed Signal Circuit Board Layout
AN58304: Pin Selection for Analog Designs
AN81623: Digital Design Best Practices
AN73854: Introduction To Bootloaders
Development Kits:
CY8CKIT-030 is designed for analog performance, for devel-
oping high-precision analog, low-power, and low-voltage ap-
plications.
CY8CKIT-001 provides a common development platform for
any one of the PSoC 1, PSoC 3, PSoC 4, or PSoC 5LP
families of devices.
The MiniProg3 device provides an interface for flash pro-
gramming and debug.
Technical Reference Manuals (TRM)
Architecture TRM
Registers TRM
Programming Specification
PSoC Creator
PSoC Creator is a free Windows-based Integrated Design Environment (IDE). It enables concurrent hardware and firmware design
of PSoC 3, PSoC 4, and PSoC 5LP based systems. Create designs using classic, familiar schematic capture supported by over 100
pre-verified, production-ready PSoC Components; see the list of component datasheets. With PSoC Creator, you can:
1. Drag and drop component icons to build your hardware
system design in the main design workspace
2. Codesign your application firmware with the PSoC hardware,
using the PSoC Creator IDE C compiler
3. Configure components using the configuration tools
4. Explore the library of 100+ components
5. Review component datasheets
Figure 1. Multiple-Sensor Example Project in PSoC Creator
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 3 of 137
Contents
1. Architectural Overview ..................................................... 4
2. Pinouts ............................................................................... 6
3. Pin Descriptions .............................................................. 12
4. CPU ................................................................................... 13
4.1 8051 CPU ................................................................. 13
4.2 Addressing Modes .................................................... 14
4.3 Instruction Set .......................................................... 14
4.4 DMA and PHUB ....................................................... 18
4.5 Interrupt Controller ................................................... 20
5. Memory ............................................................................. 23
5.1 Static RAM ............................................................... 23
5.2 Flash Program Memory ............................................ 23
5.3 Flash Security ........................................................... 23
5.4 EEPROM .................................................................. 24
5.5 Nonvolatile Latches (NVLs) ...................................... 24
5.6 External Memory Interface ....................................... 25
5.7 Memory Map ............................................................ 26
6. System Integration .......................................................... 28
6.1 Clocking System ....................................................... 28
6.2 Power System .......................................................... 31
6.3 Reset ........................................................................ 35
6.4 I/O System and Routing ........................................... 37
7. Digital Subsystem ........................................................... 44
7.1 Example Peripherals ................................................ 44
7.2 Universal Digital Block .............................................. 46
7.3 UDB Array Description ............................................. 49
7.4 DSI Routing Interface Description ............................ 49
7.5 CAN .......................................................................... 51
7.6 USB .......................................................................... 53
7.7 Timers, Counters, and PWMs .................................. 53
7.8 I2C ............................................................................ 54
7.9 Digital Filter Block ..................................................... 56
8. Analog Subsystem .......................................................... 56
8.1 Analog Routing ......................................................... 57
8.2 Delta-sigma ADC ...................................................... 59
8.3 Comparators ............................................................. 60
8.4 Opamps .................................................................... 61
8.5 Programmable SC/CT Blocks .................................. 61
8.6 LCD Direct Drive ...................................................... 62
8.7 CapSense ................................................................. 63
8.8 Temp Sensor ............................................................ 63
8.9 DAC .......................................................................... 64
8.10 Up/Down Mixer ....................................................... 64
8.11 Sample and Hold .................................................... 65
9. Programming, Debug Interfaces, Resources ................ 65
9.1 JTAG Interface ......................................................... 66
9.2 Serial Wire Debug Interface ..................................... 67
9.3 Debug Features ........................................................ 68
9.4 Trace Features ......................................................... 68
9.5 Single Wire Viewer Interface .................................... 68
9.6 Programming Features ............................................. 68
9.7 Device Security ........................................................ 68
9.8 CSP Package Bootloader ......................................... 69
10. Development Support ................................................... 70
10.1 Documentation ....................................................... 70
10.2 Online ..................................................................... 70
10.3 Tools ....................................................................... 70
11. Electrical Specifications ............................................... 71
11.1 Absolute Maximum Ratings .................................... 71
11.2 Device Level Specifications .................................... 72
11.3 Power Regulators ................................................... 76
11.4 Inputs and Outputs ................................................. 80
11.5 Analog Peripherals ................................................. 88
11.6 Digital Peripherals ................................................ 105
11.7 Memory ................................................................ 109
11.8 PSoC System Resources ..................................... 113
11.9 Clocking ................................................................ 116
12. Ordering Information ................................................... 120
12.1 Part Numbering Conventions ............................... 121
13. Packaging ..................................................................... 122
14. Acronyms ..................................................................... 126
15. Reference Documents ................................................. 127
16. Document Conventions .............................................. 128
16.1 Units of Measure .................................................. 128
17. Revision History .......................................................... 129
18. Sales, Solutions, and Legal Information ................... 137
Worldwide Sales and Design Support ..................... 137
Products .................................................................. 137
PSoC® Solutions .................................................... 137
Cypress Developer Community ............................... 137
Technical Support ........................................................ 137
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 4 of 137
1. Architectural Overview
Introducing the CY8C36 family of ultra low-power, flash Programmable System-on-Chip (PSoC®) devices, part of a scalable 8-bit
PSoC 3 and 32-bit PSoC 5 platform. The CY8C36 family provides configurable blocks of analog, digital, and interconnect circuitry
around a CPU subsystem. The combination of a CPU with a flexible analog subsystem, digital subsystem, routing, and I/O enables
a high level of integration in a wide variety of consumer, industrial, and medical applications.
Figure 1-1. Simplified Block Diagram
Figure 1-1 illustrates the major components of the CY8C36
family. They are:
8051 CPU subsystem
Nonvolatile subsystem
Programming, debug, and test subsystem
Inputs and outputs
Clocking
Power
Digital subsystem
Analog subsystem
PSoC’s digital subsystem provides half of its unique
configurability. It connects a digital signal from any peripheral to
any pin through the digital system interconnect (DSI). It also
provides functional flexibility through an array of small, fast,
low-power UDBs. PSoC Creator provides a library of prebuilt and
tested standard digital peripherals (UART, SPI, LIN, PRS, CRC,
timer, counter, PWM, AND, OR, and so on) that are mapped to
the UDB array. You can also easily create a digital circuit using
boolean primitives by means of graphical design entry. Each
UDB contains programmable array logic (PAL)/programmable
logic device (PLD) functionality, together with a small state
machine engine to support a wide variety of peripherals.
Digital
Filter
Block
Analog System
LCD Direct
Drive
CapSense
Temperature
Sensor
4 x
Opamp
+
-
ADC
4 x DAC
Del Sig
ADC
4 x SC/ CT Blocks
(TIA, PGA, Mixer etc)
4 x
CMP
+
-
CAN
2.0
I2C
Master/
Slave
Universal Digital Block Array (24 x UDB)
4 x
Timer
Counter
PWM
FS USB
2.0
System Wide
Resources
Digital System
Program
Debug &
Trace
Boundary
Scan
Program &
Debug
8051 or
Cortex M3 CPU
Interrupt
Controller
PHUB
DMA
SRAM
FLASH
EEPROM
EMIF
CPU SystemMemory System
System Bus
Digital Interconnect
Analog Interconnect
1.71 to
5.5 V
0. 5 to 5.5V
(Optional)
4to 25 MHz
( Optional)
Xtal
Osc
32.768 KHz
( Optional)
RTC
Timer
IMO
Clock Tree
WDT
and
Wake
ILO
Clocking System
1.8 V L DO
SMP
POR and
LVD
Sleep
Power
Power Management
System
USB
PHY
3 per
Opamp
GPIOs
GPIOs GPIOs
GPIOs
GPIOs
GPIOsSIO
GPIOsSIOs
UDB
UDB
UDB
UDB
UDB
UDB
UDB UDB UDB
UDB
UDB
UDBUDB UDB UDB
UART
Logic
12- Bit PWM
I2C Slave 8- Bit SPI
12- Bit SPI
Logic
8- Bit
Timer
16- Bit PRS
UDB
8- Bit
Timer
Quadrature Decoder 16- Bit
PWM
Sequencer
Usage Example for UDB
UDB
UDB
UDB
UDB
UDB
UDB
UDB
UDB
22
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 5 of 137
In addition to the flexibility of the UDB array, PSoC also provides
configurable digital blocks targeted at specific functions. For the
CY8C36 family these blocks can include four 16-bit timers,
counters, and PWM blocks; I2C slave, master, and multi-master;
FS USB; and Full CAN 2.0b.
For more details on the peripherals see the “Example
Peripherals” section on page 44 of this data sheet. For
information on UDBs, DSI, and other digital blocks, see the
“Digital Subsystem” section on page 44 of this data sheet.
PSoC’s analog subsystem is the second half of its unique
configurability. All analog performance is based on a highly
accurate absolute voltage reference with less than 0.1-percent
error over temperature and voltage. The configurable analog
subsystem includes:
Analog muxes
Comparators
Voltage references
ADC
DACs
DFB
All GPIO pins can route analog signals into and out of the device
using the internal analog bus. This allows the device to interface
up to 62 discrete analog signals. The heart of the analog
subsystem is a fast, accurate, configurable delta-sigma ADC
with these features:
Less than 100 µV offset
A gain error of 0.2 percent
INL less than ±1 LSB
DNL less than ±1 LSB
SINAD better than 66 dB
This converter addresses a wide variety of precision analog
applications, including some of the most demanding sensors.
The output of the ADC can optionally feed the programmable
DFB through the DMA without CPU intervention. You can
configure the DFB to perform IIR and FIR digital filters and
several user-defined custom functions. The DFB can implement
filters with up to 64 taps. It can perform a 48-bit
multiply-accumulate (MAC) operation in one clock cycle.
Four high-speed voltage or current DACs support 8-bit output
signals at an update rate of up to 8 Msps. They can be routed
out of any GPIO pin. You can create higher resolution voltage
PWM DAC outputs using the UDB array. This can be used to
create a PWM DAC of up to 10 bits, at up to 48 kHz. The digital
DACs in each UDB support PWM, PRS, or delta-sigma
algorithms with programmable widths.
In addition to the ADC, DACs, and DFB, the analog subsystem
provides multiple:
Uncommitted opamps
Configurable switched capacitor/continuous time (SC/CT)
blocks. These support:
Transimpedance amplifiers
Programmable gain amplifiers
Mixers
Other similar analog components
See the “Analog Subsystem” section on page 56 of this data
sheet for more details.
PSoC’s 8051 CPU subsystem is built around a single-cycle
pipelined 8051 8-bit processor running at up to 67 MHz. The
CPU subsystem includes a programmable nested vector
interrupt controller, DMA controller, and RAM. PSoC’s nested
vector interrupt controller provides low latency by allowing the
CPU to vector directly to the first address of the interrupt service
routine, bypassing the jump instruction required by other
architectures. The DMA controller enables peripherals to
exchange data without CPU involvement. This allows the CPU
to run slower (saving power) or use those CPU cycles to improve
the performance of firmware algorithms. The single cycle 8051
CPU runs ten times faster than a standard 8051 processor. The
processor speed itself is configurable, allowing you to tune active
power consumption for specific applications.
PSoC’s nonvolatile subsystem consists of flash, byte-writeable
EEPROM, and nonvolatile configuration options. It provides up
to 64 KB of on-chip flash. The CPU can reprogram individual
blocks of flash, enabling bootloaders. You can enable an ECC
for high reliability applications. A powerful and flexible protection
model secures the user's sensitive information, allowing
selective memory block locking for read and write protection. Up
to 2 KB of byte-writeable EEPROM is available on-chip to store
application data. Additionally, selected configuration options
such as boot speed and pin drive mode are stored in nonvolatile
memory. This allows settings to activate immediately after POR.
The three types of PSoC I/O are extremely flexible. All I/Os have
many drive modes that are set at POR. PSoC also provides up
to four I/O voltage domains through the VDDIO pins. Every GPIO
has analog I/O, LCD drive[3], CapSense[4], flexible interrupt
generation, slew rate control, and digital I/O capability. The SIOs
on PSoC allow VOH to be set independently of VDDIO when used
as outputs. When SIOs are in input mode they are high
impedance. This is true even when the device is not powered or
when the pin voltage goes above the supply voltage. This makes
the SIO ideally suited for use on an I2C bus where the PSoC may
not be powered when other devices on the bus are. The SIO pins
also have high current sink capability for applications such as
LED drives. The programmable input threshold feature of the
SIO can be used to make the SIO function as a general purpose
analog comparator. For devices with FS USB the USB physical
interface is also provided (USBIO). When not using USB these
pins may also be used for limited digital functionality and device
programming. All of the features of the PSoC I/Os are covered
in detail in the “I/O System and Routing” section on page 37 of
this data sheet.
The PSoC device incorporates flexible internal clock generators,
designed for high stability and factory trimmed for high accuracy.
The internal main oscillator (IMO) is the clock base for the
system, and has 1-percent accuracy at 3 MHz. The IMO can be
configured to run from 3 MHz up to 62 MHz. Multiple clock
derivatives can be generated from the main clock frequency to
meet application needs. The device provides a PLL to generate
clock frequencies up to 67 MHz from the IMO, external crystal,
or external reference clock. It also contains a separate, very
low-power internal low speed oscillator (ILO) for the sleep and
watchdog timers. A 32.768-kHz external watch crystal is also
supported for use in RTC applications. The clocks, together with
programmable clock dividers, provide the flexibility to integrate
most timing requirements.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 6 of 137
The CY8C36 family supports a wide supply operating range from
1.71 to 5.5 V. This allows operation from regulated supplies such
as 1.8 ± 5%, 2.5 V ±10%, 3.3 V ± 10%, or 5.0 V ± 10%, or directly
from a wide range of battery types. In addition, it provides an
integrated high efficiency synchronous boost converter that can
power the device from supply voltages as low as 0.5 V. This
enables the device to be powered directly from a single battery
or solar cell. In addition, you can use the boost converter to
generate other voltages required by the device, such as a 3.3-V
supply for LCD glass drive. The boost’s output is available on the
VBOOST pin, allowing other devices in the application to be
powered from the PSoC.
PSoC supports a wide range of low-power modes. These include
a 200-nA hibernate mode with RAM retention and a 1-µA sleep
mode with RTC. In the second mode the optional 32.768-kHz
watch crystal runs continuously and maintains an accurate RTC.
Power to all major functional blocks, including the programmable
digital and analog peripherals, can be controlled independently
by firmware. This allows low-power background processing
when some peripherals are not in use. This, in turn, provides a
total device current of only 1.2 mA when the CPU is running at
6 MHz, or 0.8 mA running at 3 MHz.
The details of the PSoC power modes are covered in the “Power
System” section on page 31 of this data sheet. PSoC uses JTAG
(4-wire) or SWD (2-wire) interfaces for programming, debug, and
test. The 1-wire SWV may also be used for ‘printf’ style
debugging. By combining SWD and SWV, you can implement a
full debugging interface with just three pins. Using these
standard interfaces enables you to debug or program the PSoC
with a variety of hardware solutions from Cypress or third party
vendors. PSoC supports on-chip break points and 4-KB
instruction and data race memory for debug. Details of the
programming, test, and debugging interfaces are discussed in
the “Programming, Debug Interfaces, Resources” section on
page 65 of this data sheet.
2. Pinouts
Each VDDIO pin powers a specific set of I/O pins. (The USBIOs
are powered from VDDD.) Using the VDDIO pins, a single PSoC
can support multiple voltage levels, reducing the need for
off-chip level shifters. The black lines drawn on the pinout
diagrams in Figure 2-3 through Figure 2-6, as well as Ta bl e 2- 1,
show the pins that are powered by each VDDIO.
Each VDDIO may source up to 100 mA total to its associated I/O
pins, as shown in Figure 2-1.
Figure 2-1. VDDIO Current Limit
Conversely, for the 100-pin and 68-pin devices, the set of I/O
pins associated with any VDDIO may sink up to 100 mA total, as
shown in Figure 2-2.
Figure 2-2. I/O Pins Current Limit
For the 48-pin devices, the set of I/O pins associated with
VDDIO0 plus VDDIO2 may sink up to 100 mA total. The set of
I/O pins associated with VDDIO1 plus VDDIO3 may sink up to a
total of 100 mA.
PSoC
VDDIO X
IDDIO X = 100 mA
I/O Pins
PSoC
VDDIO X
Ipins = 100 mA
I/O Pins
VSSD
Notes
3. This feature on select devices only. See Ordering Information on page 120 for details.
4. GPIOs with opamp outputs are not recommended for use with CapSense.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 7 of 137
Figure 2-3. 48-pin SSOP Part Pinout
Figure 2-4. 48-pin QFN Part Pinout[6]
SSOP
VSSA(SIO) P12[3] 247
VCCA(Opamp2OUT, GPIO) P0[0] 346
P15[3] (GPIO, KHZ XTAL: XI)(Opamp0OUT, GPIO) P0[1] 445
P12[0] (SIO, I2C1: SCL)VDDIO0 742
P12[1] (SIO, I2C1: SDA)
643
(Opamp0-/EXTREF0, GPIO) P0[3]
P15[1] (GPIO, MHZ XTAL: XI)(Opamp2-, GPIO) P0[5] 940
P15[0] (GPIO, MHZ XTAL: XO)(IDAC0, GPIO) P0[6] 10 39
VCCD(IDAC2, GPIO) P0[7] 11 38
VSSDVCCD 12 37
VDDD
VSSD 13 36
P15[7] (USBIO, D-, SWDCK)
VDDD 14 35
P15[6] (USBIO, D+, SWDIO)(GPIO) P2[3] 15 34
P1[7] (GPIO)(GPIO) P2[4] 16 33
P1[6] (GPIO)VDDIO2 17 32
VDDIO1(GPIO) P2[5] 18 31
P1[5] (GPIO, NTRST)(GPIO) P2[6] 19 30
P1[4] (GPIO, TDI)
(GPIO) P2[7] 20 29
P1[3] (GPIO, TDO, SWV)
VSSB 21 28
IND 22 27
P1[1] (GPIO, TCK, SWDCK)
VBOOST 23 26
P1[0] (GPIO, TMS, SWDIO)
VBAT 24 25
VDDA(SIO) P12[2] 148
VDDIO3(Opamp2+, GPIO) P0[4] 841
P15[2] (GPIO, KHZ XTAL: XO)(Opamp0+, GPIO) P0[2] 544
Lines show
VDDIO to
I/O supply
association
P1[2] (GPIO, CONFIGURABLE XRES)
[5]
[5]
QFN
(Top View)
VDDIO2
VDDIO0
10
11
12
VSSB
IND
VBOOST
VBAT
35
34
33
32
31
30
29
28
27
26
25
36
48
47
46
45
44
43
42
41
40
39
38
37
1
2
3
4
5
6
7
8
9
13
14
15
16
17
18
19
20
21
22
23
24
VDDIO1
(GPIO) P1[6]
VDDD
VSSD
VCCD
(GPIO, MHZ XTAL: XO) P15[0]
VDDIO3
VCCD
P2[5] (GPIO)
(GPIO) P1[7]
(GPIO, MHZ XTAL: XI) P15[1]
VCCA
VSSA
VDDA
VDDD
VSSD
P12[2] (SIO)
P12[3] (SIO)
P0[0] (Opamp2OUT, GPIO)
P0[1] (Opamp0OUT, GPIO)
P0[2] (Opamp0+, GPIO)
P0[3] (Opamp0-/Extref0, GPIO)
P0[4] (Opamp2+, GPIO)
P0[5] (Opamp2-, GPIO)
P0[6] (IDAC0, GPIO)
P0[7] (IDAC2, GPIO)
P2[3] (GPIO)
P2[4] (GPIO)
(GPIO) P2[6]
(GPIO) P2[7]
(GPIO, nTRST) P1[5]
(GPIO, TDI) P1[4]
(GPIO, TDO, SWV) P1[3]
(GPIO, TCK, SWDCK) P1[1]
(GPIO, TMS, SWDIO) P1[0]
(GPIO, Configurable XRES) P1[2]
(SIO, I2C1: SCL) P12[0]
P12[1] (SIO, I2C1: SDA)
P15[3] (GPIO, KHZ XTAL: XI)
P15[2] (GPIO, KHZ XTAL: XO)
(USBIO, D-, SWDCK) P15[7]
(USBIO, D+, SWDIO) P15[6]
Lines show
VDDIO to I/O
supply association
[5]
[5]
Notes
5. Pins are Do Not Use (DNU) on devices without USB. The pin must be left floating.
6. The center pad on the QFN package should be connected to digital ground (VSSD) for best mechanical, thermal, and electrical performance. If not connected to
ground, it should be electrically floated and not connected to any other signal. For more information, see AN72845, Design Guidelines for QFN Devices.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 8 of 137
Figure 2-5. 68-pin QFN Part Pinout[9]
Notes
7. Pins are Do Not Use (DNU) on devices without USB. The pin must be left floating.
8. This feature on select devices only. See Ordering Information on page 120 for details.
9. The center pad on the QFN package should be connected to digital ground (VSSD) for best mechanical, thermal, and electrical performance. If not connected to
ground, it should be electrically floated and not connected to any other signal. For more information, see AN72845, Design Guidelines for QFN Devices.
(GPIO) P2[6]
(GPIO) P2[7]
(I2C0: SCL, SIO) P12[4]
(I2C0: SDA, SIO) P12[5]
VSSB
IND
VBOOST
VBAT
VSSD
XRES
(TMS, SWDIO, GPIO) P1[0]
(TCK, SWDCK, GPIO) P1[1]
(CONFIGURABLE XRES, GPIO) P1[2]
(TDO, SWV, GPIO) P1[3]
(TDI, GPIO) P1[4]
(NTRST, GPIO) P1[5]
VDDIO1
(GPIO) P1[6]
VCCD
(OPAMP3+, GPIO) P3[3]
(GPIO) P1[7]
(SIO) P12[6]
(SIO) P12[7]
(USBIO, D+, SWDIO) P15[6]
(USBIO, D-, SWDCK) P15[7]
VDDD
VSSD
(MHZ XTAL: XO, GPIO) P15[0]
(MHZ XTAL: XI, GPIO) P15[1]
(IDAC1, GPIO) P3[0]
(IDAC3, GPIO) P3[1]
(OPAMP3-/EXTREF1, GPIO) P3[2]
(OPAMP1-, GPIO) P3[4]
(OPAMP1+, GPIO) P3[5]
P0[3] (GPIO, Opamp0-/EXTREF0)
P0[2] (GPIO,Opamp0+)
P0[1] (GPIO, Opamp0OUT)
P0[0] (GPIO, Opamp2OUT)
P12[3] (SIO)
P12[2] (SIO)
VSSD
VDDA
VSSA
VCCA
P15[3] (GPIO, KHZ XTAL: XI)
P15[2] (GPIO, KHZ XTAL: XO)
P12[1] (SIO, I2C1: SDA)
P12[0] (SIO, 12C1: SCL)
P3[7] (GPIO, Opamp3OUT)
P3[6] (GPIO, Opamp1OUT)
VDDIO3
P2[5] (GPIO)
VDDIO2
P2[4] (GPIO)
P2[3] (GPIO)
P2[2] (GPIO)
P2[1] (GPIO)
P2[0] (GPIO)
P15[5] (GPOI)
P15[4] (GPIO)
VDDD
VSSD
VCCD
P0[7] (GPIO, IDAC2)
P0[6] (GPIO, IDAC0)
P0[5] (GPIO, Opamp2-)
P0[4] (GPIO, Opamp2+)
VDDIO0
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
10
11
12
13
14
15
16
17
1
2
3
4
5
6
7
8
9
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
QFN
(Top View)
Lines show VDDIO
to I/O supply
association
[8]
[8]
[8]
[8]
[8]
[7]
[7]
[8]
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 9 of 137
Figure 2-6. 100-pin TQFP Part Pinout
Notes
10. Pins are Do Not Use (DNU) on devices without USB. The pin must be left floating.
11. This feature on select devices only. See Ordering Information on page 120 for details.
TQFP
(GPIO) P2[5]
(GPIO) P2[6]
(GPIO) P2[7]
(I2C0: SCL, SIO) P12[4]
(I2C0: SDA, SIO) P12[5]
(GPIO) P6[4]
(GPIO) P6[5]
(GPIO) P6[6]
(GPIO) P6[7]
VSSB
IND
VBOOST
VBAT
VSSD
XRES
(GPIO) P5[0]
(GPIO) P5[1]
(GPIO) P5[2]
(GPIO) P5[3]
(TMS, SWDIO, GPIO) P1[0]
(TCK, SWDCK, GPIO) P1[1]
(CONFIGURABLE XRES, GPIO) P1[2]
(TDO, SWV, GPIO) P1[3]
(TDI, GPIO) P1[4]
(NTRST, GPIO) P1[5]
VDDIO1
(GPIO) P5[7]
NC
(OPAMP3-/EXTREF1, GPIO) P3[2]
(GPIO) P1[6]
(GPIO) P1[7]
(SIO) P12[6]
(SIO) P12[7]
(GPIO) P5[4]
(GPIO) P5[5]
(GPIO) P5[6]
(USBIO, D+, SWDIO) P15[6]
(USBIO, D-, SWDCK) P15[7]
VDDD
VSSD
VCCD
NC
(MHZ XTAL: XO, GPIO) P15[0]
(MHZ XTAL: XI, GPIO) P15[1]
(IDAC1, GPIO) P3[0]
(IDAC3, GPIO) P3[1]
(Opamp3+, GPIO) P3[3]
(Opamp1-, GPIO) P3[4]
(Opamp1+, GPIO) P3[5]
VDDIO3
VDDIO0
P0[3] (GPIO, Opamp0-/EXTREF0)
P0[2] (GPIO, Opamp0+)
P0[1] (GPIO, Opamp0OUT)
P0[0] (GPIO, Opamp2OUT)
P4[1] (GPIO)
P4[0] (GPIO)
P12[3] (SIO)
P12[2] (SIO)
VSSD
VDDA
VSSA
VCCA
NC
NC
NC
NC
NC
NC
P15[3] (GPIO, KHZ XTAL: XI)
P15[2] (GPIO, KHZ XTAL: XO)
P12[1] (SIO, I2C1: SDA)
P12[0] (SIO, I2C1: SCL)
P3[7] (GPIO, Opamp3OUT)
P3[6] (GPIO, Opamp1OUT)
VDDIO2
P2[4] (GPIO)
P2[3] (GPIO)
P2[2] (GPIO)
P2[1] (GPIO)
P2[0] (GPIO)
P15[5] (GPIO)
P15[4] (GPIO)
P6[3] (GPIO)
P6[2] (GPIO)
P6[1] (GPIO)
P6[0] (GPIO)
VDDD
VSSD
VCCD
P4[7] (GPIO)
P4[6] (GPIO)
P4[5] (GPIO)
P4[4] (GPIO)
P4[3] (GPIO)
P4[2] (GPIO)
P0[7] (GPIO, IDAC2)
P0[6] (GPIO, IDAC0)
P0[5] (GPIO, Opamp2-)
P0[4] (GPIO, Opamp2+)
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
1
2
3
4
5
6
7
8
9
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
50
49
LINES SHOW
VDDIO TO I/O
SUPPLY
ASSOCIATION
[10]
[10
]
[11]
[11]
[11]
[11]
[11]
[11]
Table 2-1. VDDIO and Port Pin Associations
VDDIO Port Pins
VDDIO0 P0[7:0], P4[7:0], P12[3:2]
VDDIO1 P1[7:0], P5[7:0], P12[7:6]
VDDIO2 P2[7:0], P6[7:0], P12[5:4], P15[5:4]
VDDIO3 P3[7:0], P12[1:0], P15[3:0]
VDDD P15[7:6] (USB D+, D-)
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 10 of 137
Tab le 2 -2 shows the pinout for the 72-pin CSP package. Since there are four VDDIO pins, the set of I/O pins associated with any VDDIO
may sink up to 100 mA total, same as for the 100-pin and 68-pin devices.
Figure 2-7 and Figure 2-8 on page 12 show an example schematic and an example PCB layout, for the 100-pin TQFP part, for optimal
analog performance on a two-layer board.
The two pins labeled VDDD must be connected together.
The two pins labeled Vccd must be connected together, with capacitance added, as shown in Figure 2-7 and Power System on
page 31. The trace between the two Vccd pins should be as short as possible.
The two pins labeled VSSD must be connected together.
For information on circuit board layout issues for mixed signals, refer to the application note AN57821 - Mixed Signal Circuit Board
Layout Considerations for PSoC® 3 and PSoC 5.
Table 2-2. CSP Pinout
Ball Name Ball Name Ball Name
G6 P2[5] F1 VDDD A5 VDDA
E5 P2[6] E1 VSSD A6 VSSD
F5 P2[7] E2 VCCD B6 P12[2]
J7 P12[4] C1 P15[0] C6 P12[3]
H6 P12[5] C2 P15[1] A7 P0[0]
J6 VSSB D2 P3[0] B7 P0[1]
J5 Ind D3 P3[1] B5 P0[2]
H5 VBOOST D4 P3[2] C5 P0[3]
J4 VBAT D5 P3[3] A8 VIO0
H4 VSSD B4 P3[4] D6 P0[4]
J3 XRES_N B3 P3[5] D7 P0[5]
H3 P1[0] A1 VIO3 C7 P0[6]
G3 P1[1] B2 P3[6] C8 P0[7]
H2 P1[2] A2 P3[7] E8 VCCD
J2 P1[3] C3 P12[0] F8 VSSD
G4 P1[4] C4 P12[1] G8 VDDD
G5 P1[5] E3 P15[2] E7 P15[4]
J1 VIO1 E4 P15[3] F7 P15[5]
F4 P1[6] B1[12] NC G7 P2[0]
F3 P1[7] B8[12] NC H7 P2[1]
H1 P12[6] D1[12] NC H8 P2[2]
G1 P12[7] D8[12] NC F6 P2[3]
G2 P15[6] A3 VCCA E6 P2[4]
F2 P15[7] A4 VSSA J8 VIO2
Notes
12. Pins are Do Not Use (DNU) on devices without USB. The pin must be left floating.
13. This feature on select devices only. See Ordering Information on page 120 for details.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 11 of 137
Figure 2-7. Example Schematic for 100-pin TQFP Part With Power Connections
Note The two Vccd pins must be connected together with as short a trace as possible. A trace under the device is recommended, as
shown in Figure 2-8 on page 12.
For more information on pad layout, refer to http://www.cypress.com/cad-resources/psoc-3-cad-libraries.
VSSD
VDDA
VCCA
VCCD
VSSD
VDDD
VSSD
VDDD
VDDD
VSSD
VSSA
VSSA
VSSD
VSSD
VSSD
VSSD
0.1uF
C8
VSSD
VDDD
VDDD VDDD
VDDD
VDDD
VSSD
1uF
C9
0.1uF
C10
0.1uF
C11
0.1uF
C16
0.1uF
C12
0.1uF
C6
0.1uF
C2
1uF
C15
1uF
C1
VSSD
VDDD
VSSD
VDDA
VCCD
1uF
C17
VSSB
10
IND
11
VBOOST
12
VBAT
13
VSSD
14
XRES
15
VDDD
37
VSSD
38
VCCD
39
VCCA 63
VSSA 64
VDDA 65
VSSD 66
VCCD 86
VSSD 87
VDDD 88
SIO, P12[2] 67
SIO, P12[3] 68
P4[0] 69
P4[1] 70
OA2OUT, P0[0] 71
OA0OUT, P0[1] 72
OA0+, P0[2] 73
OA0-, REF0, P0[3] 74
VDDIO0 75
OA2+, P0[4] 76
OA2-, P0[5] 77
IDAC0, P0[6] 78
IDAC2, P0[7] 79
P4[2] 80
P4[3] 81
P4[4] 82
P4[5] 83
P4[6] 84
P4[7] 85
P5[0]
16
P5[1]
17
P5[2]
18
P5[3]
19
P1[0], SWIO, TMS
20
P1[1], SWDIO, TCK
21
P1[2]
22
P1[3], SWV, TDO
23
P1[4], TDI
24
P1[5], NTRST
25
VDDIO1
26
P1[6]
27
P1[7]
28
P12[6], SIO
29
P12[7], SIO
30
P5[4]
31
P5[5]
32
P5[6]
33
P5[7]
34
P15[6], USB D+
35
P15[7], USB D-
36
P6[7]
9
P6[0] 89
P6[1] 90
P6[2] 91
P6[3] 92
P15[4] 93
P15[5] 94
P2[0] 95
P2[1] 96
P2[2] 97
P2[3] 98
P2[4] 99
VDDIO2 100
P2[5]
1
P2[6]
2
P2[7]
3
P12[4], SIO
4
P12[5], SIO
5
P6[4]
6
P6[5]
7
P6[6]
8
NC
40
NC
41
P15[0], MHZXOUT
42
P15[1], MHZXIN
43
P3[0], IDAC1
44
P3[1], IDAC3
45
P3[2], OA3-, REF1
46
P3[3], OA3+
47
P3[4], OA1-
48
P3[5], OA1+
49
VDDIO3
50
OA1OUT, P3[6] 51
OA3OUT, P3[7] 52
SIO, P12[0] 53
SIO, P12[1] 54
KHZXOUT, P15[2] 55
KHZXIN, P15[3] 56
NC 57
NC 58
NC 59
NC 60
NC 61
NC 62
VDDA
VSSA
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 12 of 137
Figure 2-8. Example PCB Layout for 100-pin TQFP Part for Optimal Analog Performance
3. Pin Descriptions
IDAC0, IDAC1, IDAC2, IDAC3. Low resistance output pin for
high current DACs (IDAC).
Opamp0out, Opamp1out[15], Opamp2out, Opamp3out[15].
High current output of uncommitted opamp.[14]
Extref0, Extref1. External reference input to the analog system.
Opamp0–, Opamp1–[15], Opamp2–, Opamp3–[15]. Inverting
input to uncommitted opamp.
Opamp0+, Opamp1+[15], Opamp2+, Opamp3+[15].
Noninverting input to uncommitted opamp.
GPIO. General purpose I/O pin provides interfaces to the CPU,
digital peripherals, analog peripherals, interrupts, LCD segment
drive, and CapSense.[14]
I2C0: SCL, I2C1: SCL. I2C SCL line providing wake from sleep
on an address match. Any I/O pin can be used for I2C SCL if
wake from sleep is not required.
I2C0: SDA, I2C1: SDA. I2C SDA line providing wake from sleep
on an address match. Any I/O pin can be used for I2C SDA if
wake from sleep is not required.
Ind. Inductor connection to boost pump.
kHz XTAL: Xo, kHz XTAL: Xi. 32.768 kHz crystal oscillator pin.
MHz XTAL: Xo, MHz XTAL: Xi. 4 to 25 MHz crystal oscillator pin.
nTRST. Optional JTAG Test Reset programming and debug port
connection to reset the JTAG connection.
SIO. Special I/O provides interfaces to the CPU, digital
peripherals and interrupts with a programmable high threshold
voltage, analog comparator, high sink current, and high
impedance state when the device is unpowered.
SWDCK. Serial wire debug clock programming and debug port
connection.
SWDIO. Serial wire debug input and output programming and
debug port connection.
SWV. Single wire viewer debug output.
TCK. JTAG test clock programming and debug port connection.
TDI. JTAG test data in programming and debug port connection.
TDO. JTAG test data out programming and debug port
connection.
TMS. JTAG test mode select programming and debug port
connection.
USBIO, D+. Provides D+ connection directly to a USB 2.0 bus.
May be used as a digital I/O pin. Pins are Do Not Use (DNU) on
devices without USB.
USBIO, D–. Provides D– connection directly to a USB 2.0 bus.
May be used as a digital I/O pin. Pins are Do Not Use (DNU) on
devices without USB.
VBOOST. Power sense connection to boost pump.
VBAT. Battery supply to boost pump.
Vddd Vssd Vdda
Vssa
Vssd
Plane
Vssa
Plane
Notes
14. GPIOs with opamp outputs are not recommended for use with CapSense.
15. This feature on select devices only. See Ordering Information on page 120 for details.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 13 of 137
VCCA. Output of the analog core regulator or the input to
the analog core. Requires a 1uF capacitor to VSSA. The
regulator output is not designed to drive external circuits. Note
that if you use the device with an external core regulator
(externally regulated mode), the voltage applied to this pin
must not exceed the allowable range of 1.71 V to 1.89 V.
When using the internal core regulator, (internally regulated
mode, the default), do not tie any power to this pin. For details
see Power System on page 31.
VCCD. Output of the digital core regulator or the input to the
digital core. The two VCCD pins must be shorted together, with
the trace between them as short as possible, and a 1uF capacitor
to VSSD. The regulator output is not designed to drive external
circuits. Note that if you use the device with an external core
regulator (externally regulated mode), the voltage applied to
this pin must not exceed the allowable range of 1.71 V to
1.89 V. When using the internal core regulator (internally
regulated mode, the default), do not tie any power to this pin. For
details see Power System on page 31.
VDDA. Supply for all analog peripherals and analog core
regulator. VDDA must be the highest voltage present on the
device. All other supply pins must be less than or equal to
VDDA.
VDDD. Supply for all digital peripherals and digital core
regulator. VDDD must be less than or equal to VDDA.
VSSA. Ground for all analog peripherals.
VSSB. Ground connection for boost pump.
VSSD. Ground for all digital logic and I/O pins.
VDDIO0, VDDIO1, VDDIO2, VDDIO3. Supply for I/O pins. See
pinouts for specific I/O pin to VDDIO mapping. Each VDDIO must
be tied to a valid operating voltage (1.71 V to 5.5 V), and must
be less than or equal to VDDA.
XRES (and configurable XRES). External reset pin. Active low
with internal pull-up. Pin P1[2] may be configured to be a XRES
pin; see “Nonvolatile Latches (NVLs)” on page 24.
4. CPU
4.1 8051 CPU
The CY8C36 devices use a single cycle 8051 CPU, which is fully
compatible with the original MCS-51 instruction set. The
CY8C36 family uses a pipelined RISC architecture, which
executes most instructions in 1 to 2 cycles to provide peak
performance of up to 33 MIPS with an average of 2 cycles per
instruction. The single cycle 8051 CPU runs ten times faster than
a standard 8051 processor.
The 8051 CPU subsystem includes these features:
Single cycle 8051 CPU
Up to 64 KB of flash memory, up to 2 KB of EEPROM, and up
to 8 KB of SRAM
512-byte instruction cache between CPU and flash
Programmable nested vector interrupt controller
DMA controller
Peripheral HUB (PHUB)
External memory interface (EMIF)
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 14 of 137
4.2 Addressing Modes
The following addressing modes are supported by the 8051:
Direct addressing: The operand is specified by a direct 8-bit
address field. Only the internal RAM and the SFRs can be
accessed using this mode.
Indirect addressing: The instruction specifies the register which
contains the address of the operand. The registers R0 or R1
are used to specify the 8-bit address, while the data pointer
(DPTR) register is used to specify the 16-bit address.
Register addressing: Certain instructions access one of the
registers (R0 to R7) in the specified register bank. These
instructions are more efficient because there is no need for an
address field.
Register specific instructions: Some instructions are specific to
certain registers. For example, some instructions always act
on the accumulator. In this case, there is no need to specify the
operand.
Immediate constants: Some instructions carry the value of the
constants directly instead of an address.
Indexed addressing: This type of addressing can be used only
for a read of the program memory. This mode uses the Data
Pointer as the base and the accumulator value as an offset to
read a program memory.
Bit addressing: In this mode, the operand is one of 256 bits.
4.3 Instruction Set
The 8051 instruction set is highly optimized for 8-bit handling and
Boolean operations. The types of instructions supported include:
Arithmetic instructions
Logical instructions
Data transfer instructions
Boolean instructions
Program branching instructions
4.3.1 Instruction Set Summary
4.3.1.1 Arithmetic Instructions
Arithmetic instructions support the direct, indirect, register,
immediate constant, and register-specific instructions.
Arithmetic modes are used for addition, subtraction,
multiplication, division, increment, and decrement operations.
Table 4-1 on page 15 lists the different arithmetic instructions.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 15 of 137
4.3.1.2 Logical Instructions
The logical instructions perform Boolean operations such as AND, OR, XOR on bytes, rotate of accumulator contents, and swap of
nibbles in an accumulator. The Boolean operations on the bytes are performed on the bit-by-bit basis. Table 4-2 on page 15 shows
the list of logical instructions and their description.
Table 4-1. Arithmetic Instructions
Mnemonic Description Bytes Cycles
ADD A,Rn Add register to accumulator 1 1
ADD A,Direct Add direct byte to accumulator 2 2
ADD A,@Ri Add indirect RAM to accumulator 1 2
ADD A,#data Add immediate data to accumulator 2 2
ADDC A,Rn Add register to accumulator with carry 1 1
ADDC A,Direct Add direct byte to accumulator with carry 2 2
ADDC A,@Ri Add indirect RAM to accumulator with carry 1 2
ADDC A,#data Add immediate data to accumulator with carry 2 2
SUBB A,Rn Subtract register from accumulator with borrow 1 1
SUBB A,Direct Subtract direct byte from accumulator with borrow 2 2
SUBB A,@Ri Subtract indirect RAM from accumulator with borrow 1 2
SUBB A,#data Subtract immediate data from accumulator with borrow 2 2
INC A Increment accumulator 1 1
INC Rn Increment register 1 2
INC Direct Increment direct byte 2 3
INC @Ri Increment indirect RAM 1 3
DEC A Decrement accumulator 1 1
DEC Rn Decrement register 1 2
DEC Direct Decrement direct byte 2 3
DEC @Ri Decrement indirect RAM 1 3
INC DPTR Increment data pointer 1 1
MUL Multiply accumulator and B 1 2
DIV Divide accumulator by B 1 6
DAA Decimal adjust accumulator 1 3
Table 4-2. Logical Instructions
Mnemonic Description Bytes Cycles
ANL A,Rn AND register to accumulator 1 1
ANL A,Direct AND direct byte to accumulator 2 2
ANL A,@Ri AND indirect RAM to accumulator 1 2
ANL A,#data AND immediate data to accumulator 2 2
ANL Direct, A AND accumulator to direct byte 2 3
ANL Direct, #data AND immediate data to direct byte 3 3
ORL A,Rn OR register to accumulator 1 1
ORL A,Direct OR direct byte to accumulator 2 2
ORL A,@Ri OR indirect RAM to accumulator 1 2
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 16 of 137
4.3.1.3 Data Transfer Instructions
The data transfer instructions are of three types: the core RAM,
xdata RAM, and the lookup tables. The core RAM transfer
includes transfer between any two core RAM locations or SFRs.
These instructions can use direct, indirect, register, and
immediate addressing. The xdata RAM transfer includes only the
transfer between the accumulator and the xdata RAM location.
It can use only indirect addressing. The lookup tables involve
nothing but the read of program memory using the Indexed
addressing mode. Ta b l e 4 - 3 lists the various data transfer
instructions available.
4.3.1.4 Boolean Instructions
The 8051 core has a separate bit-addressable memory location.
It has 128 bits of bit addressable RAM and a set of SFRs that are
bit addressable. The instruction set includes the whole menu of
bit operations such as move, set, clear, toggle, OR, and AND
instructions and the conditional jump instructions. Table 4-4 on
page 17 lists the available Boolean instructions.
ORL A,#data OR immediate data to accumulator 2 2
ORL Direct, A OR accumulator to direct byte 2 3
ORL Direct, #data OR immediate data to direct byte 3 3
XRL A,Rn XOR register to accumulator 1 1
XRL A,Direct XOR direct byte to accumulator 2 2
XRL A,@Ri XOR indirect RAM to accumulator 1 2
XRL A,#data XOR immediate data to accumulator 2 2
XRL Direct, A XOR accumulator to direct byte 2 3
XRL Direct, #data XOR immediate data to direct byte 3 3
CLR A Clear accumulator 1 1
CPL A Complement accumulator 1 1
RL A Rotate accumulator left 1 1
RLC A Rotate accumulator left through carry 1 1
RR A Rotate accumulator right 1 1
RRC A Rotate accumulator right though carry 1 1
SWAP A Swap nibbles within accumulator 1 1
Table 4-2. Logical Instructions (continued)
Mnemonic Description Bytes Cycles
Table 4-3. Data Transfer Instructions
Mnemonic Description Bytes Cycles
MOV A,Rn Move register to accumulator 1 1
MOV A,Direct Move direct byte to accumulator 2 2
MOV A,@Ri Move indirect RAM to accumulator 1 2
MOV A,#data Move immediate data to accumulator 2 2
MOV Rn,A Move accumulator to register 1 1
MOV Rn,Direct Move direct byte to register 2 3
MOV Rn, #data Move immediate data to register 2 2
MOV Direct, A Move accumulator to direct byte 2 2
MOV Direct, Rn Move register to direct byte 2 2
MOV Direct, Direct Move direct byte to direct byte 3 3
MOV Direct, @Ri Move indirect RAM to direct byte 2 3
MOV Direct, #data Move immediate data to direct byte 3 3
MOV @Ri, A Move accumulator to indirect RAM 1 2
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 17 of 137
MOV @Ri, Direct Move direct byte to indirect RAM 2 3
MOV @Ri, #data Move immediate data to indirect RAM 2 2
MOV DPTR, #data16 Load data pointer with 16 bit constant 3 3
MOVC A, @A+DPTR Move code byte relative to DPTR to accumulator 1 5
MOVC A, @A + PC Move code byte relative to PC to accumulator 1 4
MOVX A,@Ri Move external RAM (8-bit) to accumulator 1 4
MOVX A, @DPTR Move external RAM (16-bit) to accumulator 1 3
MOVX @Ri, A Move accumulator to external RAM (8-bit) 1 5
MOVX @DPTR, A Move accumulator to external RAM (16-bit) 1 4
PUSH Direct Push direct byte onto stack 2 3
POP Direct Pop direct byte from stack 2 2
XCH A, Rn Exchange register with accumulator 1 2
XCH A, Direct Exchange direct byte with accumulator 2 3
XCH A, @Ri Exchange indirect RAM with accumulator 1 3
XCHD A, @Ri Exchange low order indirect digit RAM with accumulator 1 3
Table 4-4. Boolean Instructions
Mnemonic Description Bytes Cycles
CLR C Clear carry 1 1
CLR bit Clear direct bit 2 3
SETB C Set carry 1 1
SETB bit Set direct bit 2 3
CPL C Complement carry 1 1
CPL bit Complement direct bit 2 3
ANL C, bit AND direct bit to carry 2 2
ANL C, /bit AND complement of direct bit to carry 2 2
ORL C, bit OR direct bit to carry 2 2
ORL C, /bit OR complement of direct bit to carry 2 2
MOV C, bit Move direct bit to carry 2 2
MOV bit, C Move carry to direct bit 2 3
JC rel Jump if carry is set 2 3
JNC rel Jump if no carry is set 2 3
JB bit, rel Jump if direct bit is set 3 5
JNB bit, rel Jump if direct bit is not set 3 5
JBC bit, rel Jump if direct bit is set and clear bit 3 5
Table 4-3. Data Transfer Instructions (continued)
Mnemonic Description Bytes Cycles
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 18 of 137
4.3.1.5 Program Branching Instructions
The 8051 supports a set of conditional and unconditional jump instructions that help to modify the program execution flow. Table 4-5
shows the list of jump instructions.
4.4 DMA and PHUB
The PHUB and the DMA controller are responsible for data
transfer between the CPU and peripherals, and also data
transfers between peripherals. The PHUB and DMA also control
device configuration during boot. The PHUB consists of:
A central hub that includes the DMA controller, arbiter, and
router
Multiple spokes that radiate outward from the hub to most
peripherals
There are two PHUB masters: the CPU and the DMA controller.
Both masters may initiate transactions on the bus. The DMA
channels can handle peripheral communication without CPU
intervention. The arbiter in the central hub determines which
DMA channel is the highest priority if there are multiple requests.
4.4.1 PHUB Features
CPU and DMA controller are both bus masters to the PHUB
Eight Multi-layer AHB Bus parallel access paths (spokes) for
peripheral access
Simultaneous CPU and DMA access to peripherals located on
different spokes
Simultaneous DMA source and destination burst transactions
on different spokes
Supports 8-, 16-, 24-, and 32-bit addressing and data
Table 4-5. Jump Instructions
Mnemonic Description Bytes Cycles
ACALL addr11 Absolute subroutine call 2 4
LCALL addr16 Long subroutine call 3 4
RET Return from subroutine 1 4
RETI Return from interrupt 1 4
AJMP addr11 Absolute jump 2 3
LJMP addr16 Long jump 3 4
SJMP rel Short jump (relative address) 2 3
JMP @A + DPTR Jump indirect relative to DPTR 1 5
JZ rel Jump if accumulator is zero 2 4
JNZ rel Jump if accumulator is nonzero 2 4
CJNE A,Direct, rel Compare direct byte to accumulator and jump if not equal 3 5
CJNE A, #data, rel Compare immediate data to accumulator and jump if not equal 3 4
CJNE Rn, #data, rel Compare immediate data to register and jump if not equal 3 4
CJNE @Ri, #data, rel Compare immediate data to indirect RAM and jump if not equal 3 5
DJNZ Rn,rel Decrement register and jump if not zero 2 4
DJNZ Direct, rel Decrement direct byte and jump if not zero 3 5
NOP No operation 1 1
Table 4-6. PHUB Spokes and Peripherals
PHUB Spokes Peripherals
0SRAM
1IOs, PICU, EMIF
2 PHUB local configuration, Power manager,
Clocks, IC, SWV, EEPROM, Flash
programming interface
3Analog interface and trim, Decimator
4USB, CAN, I2C, Timers, Counters, and PWMs
5DFB
6UDBs group 1
7UDBs group 2
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 19 of 137
4.4.2 DMA Features
24 DMA channels
Each channel has one or more transaction descriptors (TD) to
configure channel behavior. Up to 128 total TDs can be defined
TDs can be dynamically updated
Eight levels of priority per channel
Any digitally routable signal, the CPU, or another DMA channel,
can trigger a transaction
Each channel can generate up to two interrupts per transfer
Transactions can be stalled or canceled
Supports transaction size of infinite or 1 to 64 KB
TDs may be nested and/or chained for complex transactions
4.4.3 Priority Levels
The CPU always has higher priority than the DMA controller
when their accesses require the same bus resources. Due to the
system architecture, the CPU can never starve the DMA. DMA
channels of higher priority (lower priority number) may interrupt
current DMA transfers. In the case of an interrupt, the current
transfer is allowed to complete its current transaction. To ensure
latency limits when multiple DMA accesses are requested
simultaneously, a fairness algorithm guarantees an interleaved
minimum percentage of bus bandwidth for priority levels 2
through 7. Priority levels 0 and 1 do not take part in the fairness
algorithm and may use 100% of the bus bandwidth. If a tie occurs
on two DMA requests of the same priority level, a simple round
robin method is used to evenly share the allocated bandwidth.
The round robin allocation can be disabled for each DMA
channel, allowing it to always be at the head of the line. Priority
levels 2 to 7 are guaranteed the minimum bus bandwidth shown
in Table 4-7 after the CPU and DMA priority levels 0 and 1 have
satisfied their requirements.
When the fairness algorithm is disabled, DMA access is granted
based solely on the priority level; no bus bandwidth guarantees
are made.
4.4.4 Transaction Modes Supported
The flexible configuration of each DMA channel and the ability to
chain multiple channels allow the creation of both simple and
complex use cases. General use cases include, but are not
limited to:
4.4.4.1 Simple DMA
In a simple DMA case, a single TD transfers data between a
source and sink (peripherals or memory location). The basic
timing diagrams of DMA read and write cycles shown in
Figure 4-1. For more description on other transfer modes, refer
to the Technical Reference Manual.
Figure 4-1. DMA Timing Diagram
4.4.4.2 Auto Repeat DMA
Auto repeat DMA is typically used when a static pattern is
repetitively read from system memory and written to a peripheral.
This is done with a single TD that chains to itself.
4.4.4.3 Ping Pong DMA
A ping pong DMA case uses double buffering to allow one buffer
to be filled by one client while another client is consuming the
data previously received in the other buffer. In its simplest form,
this is done by chaining two TDs together so that each TD calls
the opposite TD when complete.
4.4.4.4 Circular DMA
Circular DMA is similar to ping pong DMA except it contains more
than two buffers. In this case there are multiple TDs; after the last
TD is complete it chains back to the first TD.
Table 4-7. Priority Levels
Priority Level % Bus Bandwidth
0 100.0
1 100.0
2 50.0
3 25.0
4 12.5
56.2
63.1
71.5
CLK
ADDR 16/32
WRITE
DATA
READY
Basic DMA Read Transfer without wait states
AB
DATA (A)
ADDRESS Phase DATA Phase
AB
ADDRESS Phase DATA Phase
CLK
WRITE
DATA
READY
DATA (A)
Basic DMA Write Transfer without wait states
ADDR 16/32
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 20 of 137
4.4.4.5 Scatter Gather DMA
In the case of scatter gather DMA, there are multiple
noncontiguous sources or destinations that are required to
effectively carry out an overall DMA transaction. For example, a
packet may need to be transmitted off of the device and the
packet elements, including the header, payload, and trailer, exist
in various noncontiguous locations in memory. Scatter gather
DMA allows the segments to be concatenated together by using
multiple TDs in a chain. The chain gathers the data from the
multiple locations. A similar concept applies for the reception of
data onto the device. Certain parts of the received data may need
to be scattered to various locations in memory for software
processing convenience. Each TD in the chain specifies the
location for each discrete element in the chain.
4.4.4.6 Packet Queuing DMA
Packet queuing DMA is similar to scatter gather DMA but
specifically refers to packet protocols. With these protocols,
there may be separate configuration, data, and status phases
associated with sending or receiving a packet.
For instance, to transmit a packet, a memory mapped
configuration register can be written inside a peripheral,
specifying the overall length of the ensuing data phase. The CPU
can set up this configuration information anywhere in system
memory and copy it with a simple TD to the peripheral. After the
configuration phase, a data phase TD (or a series of data phase
TDs) can begin (potentially using scatter gather). When the data
phase TD(s) finish, a status phase TD can be invoked that reads
some memory mapped status information from the peripheral
and copies it to a location in system memory specified by the
CPU for later inspection. Multiple sets of configuration, data, and
status phase “subchains” can be strung together to create larger
chains that transmit multiple packets in this way. A similar
concept exists in the opposite direction to receive the packets.
4.4.4.7 Nested DMA
One TD may modify another TD, as the TD configuration space
is memory mapped similar to any other peripheral. For example,
a first TD loads a second TD’s configuration and then calls the
second TD. The second TD moves data as required by the
application. When complete, the second TD calls the first TD,
which again updates the second TD’s configuration. This
process repeats as often as necessary.
4.5 Interrupt Controller
The interrupt controller provides a mechanism for hardware
resources to change program execution to a new address,
independent of the current task being executed by the main
code. The interrupt controller provides enhanced features not
found on original 8051 interrupt controllers:
Thirty-two interrupt vectors
Jumps directly to ISR anywhere in code space with dynamic
vector addresses
Multiple sources for each vector
Flexible interrupt to vector matching
Each interrupt vector is independently enabled or disabled
Each interrupt can be dynamically assigned one of eight
priorities
Eight level nestable interrupts
Multiple I/O interrupt vectors
Software can send interrupts
Software can clear pending interrupts
When an interrupt is pending, the current instruction is
completed and the program counter is pushed onto the stack.
Code execution then jumps to the program address provided by
the vector. After the ISR is completed, a RETI instruction is
executed and returns execution to the instruction following the
previously interrupted instruction. To do this the RETI instruction
pops the program counter from the stack.
If the same priority level is assigned to two or more interrupts,
the interrupt with the lower vector number is executed first. Each
interrupt vector may choose from three interrupt sources: Fixed
Function, DMA, and UDB. The fixed function interrupts are direct
connections to the most common interrupt sources and provide
the lowest resource cost connection. The DMA interrupt sources
provide direct connections to the two DMA interrupt sources
provided per DMA channel. The third interrupt source for vectors
is from the UDB digital routing array. This allows any digital signal
available to the UDB array to be used as an interrupt source.
Fixed function interrupts and all interrupt sources may be routed
to any interrupt vector using the UDB interrupt source
connections.
Figure 4-2 on page 21 represents typical flow of events when an
interrupt triggered. Figure 4-3 on page 22 shows the interrupt
structure and priority polling.
Document Number: 001-53413 Rev. *Z Page 21 of 137
PSoC® 3: CY8C36 Family Datasheet
Figure 4-2. Interrupt Processing Timing Diagram
Notes
1: Interrupt triggered asynchronous to the clock
2: The PEND bit is set on next active clock edge to indicate the interrupt arrival
3: POST bit is set following the PEND bit
4: Interrupt request and the interrupt number sent to CPU core after evaluation priority (Takes 3 clocks)
5: ISR address is posted to CPU core for branching
6: CPU acknowledges the interrupt request
7: ISR address is read by CPU for branching
8, 9: PEND and POST bits are cleared respectively after receiving the IRA from core
10: IRA bit is cleared after completing the current instruction and starting the instruction execution from ISR location (Takes 7 cycles)
11: IRC is set to indicate the completion of ISR, Active int. status is restored with previous status
The total interrupt latency (ISR execution)
= POST + PEND + IRQ + IRA + Completing current instruction and branching
= 1+1+1+2+7 cycles
= 12 cycles
The active interrupt ISR
address is posted to core
Interrupt generation and posting to CPU
The active interrupt
number is posted to core
Interrupt request sent to core for processing
Interrupt is posted to ascertain the priority
Pend bit is set on next clock active edge
Arrival of new Interrupt
CLK
INT_INPUT
PEND
POST
IRQ
ACTIVE_INT_NUM
(#10)
INT_VECT_ADDR
IRA
IRC
S
S
S
S
S
S
S
S
S
S
S
0x0010NA
CPU Response
Int. State
Clear Completing current instruction and branching to vector address Complete ISR and return
NA
IRQ cleared after receiving IRA
POST and PEND bits cleared after IRQ is sleared
0x0000
NA
TIME
1 2 3 4 5 6 7 8 9 10 11
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 22 of 137
Figure 4-3. Interrupt Structure
Interrupts 0 to 31
from UDBs
Interrupt
routing logic
to select 32
sources
Interrupt 2 to 30
0
1
31
Individual
Enable Disable
bits
Global Enable
disable bit
Interrupt Enable/
Disable, PEND and
POST logic
Interrupts form Fixed
function blocks, DMA and
UDBs
8 Level
Priority
decoder
for all
interrupts
Polling sequence
Highest Priority
Lowest Priority
Interrupt Polling logic
IRC
IRA
IRQ
0 to 31
[15:0]
ACTIVE_INT_NUM
INT_VECT_ADDR
Interrupts 0 to 31
from Fixed
Function Blocks
Interrupts 0 to
31 from DMA
Table 4-8. Interrupt Vector Table
#Fixed Function DMA UDB
0 LVD phub_termout0[0] udb_intr[0]
1 Cache/ECC phub_termout0[1] udb_intr[1]
2Reserved phub_termout0[2] udb_intr[2]
3 Sleep (Pwr Mgr) phub_termout0[3] udb_intr[3]
4 PICU[0] phub_termout0[4] udb_intr[4]
5 PICU[1] phub_termout0[5] udb_intr[5]
6 PICU[2] phub_termout0[6] udb_intr[6]
7 PICU[3] phub_termout0[7] udb_intr[7]
8 PICU[4] phub_termout0[8] udb_intr[8]
9 PICU[5] phub_termout0[9] udb_intr[9]
10 PICU[6] phub_termout0[10] udb_intr[10]
11 PICU[12] phub_termout0[11] udb_intr[11]
12 PICU[15] phub_termout0[12] udb_intr[12]
13 Comparators Combined phub_termout0[13] udb_intr[13]
14 Switched Caps Combined phub_termout0[14] udb_intr[14]
15 I2C phub_termout0[15] udb_intr[15]
16 CAN phub_termout1[0] udb_intr[16]
17 Timer/Counter0 phub_termout1[1] udb_intr[17]
18 Timer/Counter1 phub_termout1[2] udb_intr[18]
19 Timer/Counter2 phub_termout1[3] udb_intr[19]
20 Timer/Counter3 phub_termout1[4] udb_intr[20]
21 USB SOF Int phub_termout1[5] udb_intr[21]
22 USB Arb Int phub_termout1[6] udb_intr[22]
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 23 of 137
5. Memory
5.1 Static RAM
CY8C36 Static RAM (SRAM) is used for temporary data storage.
Up to 8 KB of SRAM is provided and can be accessed by the
8051 or the DMA controller. See Memory Map on page 26.
Simultaneous access of SRAM by the 8051 and the DMA
controller is possible if different 4-KB blocks are accessed.
5.2 Flash Program Memory
Flash memory in PSoC devices provides nonvolatile storage for
user firmware, user configuration data, bulk data storage, and
optional ECC data. The main flash memory area contains up to
64 KB of user program space.
Up to an additional 8 KB of flash space is available for ECC. If
ECC is not used this space can store device configuration data
and bulk user data. User code may not be run out of the ECC
flash memory section. ECC can correct one bit error and detect
two bit errors per 8 bytes of firmware memory; an interrupt can
be generated when an error is detected.
The CPU reads instructions located in flash through a cache
controller. This improves instruction execution rate and reduces
system power consumption by requiring less frequent flash
access. The cache has 8 lines at 64 bytes per line for a total of
512 bytes. It is fully associative, automatically controls flash
power, and can be enabled or disabled. If ECC is enabled, the
cache controller also performs error checking and correction,
and interrupt generation.
Flash programming is performed through a special interface and
preempts code execution out of flash. The flash programming
interface performs flash erasing, programming and setting code
protection levels. Flash in-system serial programming (ISSP),
typically used for production programming, is possible through
both the SWD and JTAG interfaces. In-system programming,
typically used for bootloaders, is also possible using serial
interfaces such as I2C, USB, UART, and SPI, or any
communications protocol.
5.3 Flash Security
All PSoC devices include a flexible flash-protection model that
prevents access and visibility to on-chip flash memory. This
prevents duplication or reverse engineering of proprietary code.
Flash memory is organized in blocks, where each block contains
256 bytes of program or data and 32 bytes of ECC or
configuration data. A total of up to 256 blocks is provided on
64-KB flash devices.
The device offers the ability to assign one of four protection
levels to each row of flash. Table 5-1 lists the protection modes
available. Flash protection levels can only be changed by
performing a complete flash erase. The Full Protection and Field
Upgrade settings disable external access (through a debugging
tool such as PSoC Creator, for example). If your application
requires code update through a boot loader, then use the Field
Upgrade setting. Use the Unprotected setting only when no
security is needed in your application. The PSoC device also
offers an advanced security feature called Device Security that
permanently disables all test, programming, and debug ports,
protecting your application from external access (see Device
Security on page 68). For information about how to take full
advantage of the security features in PSoC, see the PSoC 3
TRM.
Disclaimer
Note the following details of the flash code protection features on
Cypress devices.
Cypress products meet the specifications contained in their
particular Cypress data sheets. Cypress believes that its family
of products is one of the most secure families of its kind on the
market today, regardless of how they are used. There may be
methods, unknown to Cypress, that can breach the code
protection features. Any of these methods, to our knowledge,
would be dishonest and possibly illegal. Neither Cypress nor any
other semiconductor manufacturer can guarantee the security of
their code. Code protection does not mean that we are
guaranteeing the product as “unbreakable.”
Cypress is willing to work with the customer who is concerned
about the integrity of their code. Code protection is constantly
evolving. We at Cypress are committed to continuously
improving the code protection features of our products.
23 USB Bus Int phub_termout1[7] udb_intr[23]
24 USB Endpoint[0] phub_termout1[8] udb_intr[24]
25 USB Endpoint Data phub_termout1[9] udb_intr[25]
26 Reserved phub_termout1[10] udb_intr[26]
27 LCD phub_termout1[11] udb_intr[27]
28 DFB Int phub_termout1[12] udb_intr[28]
29 Decimator Int phub_termout1[13] udb_intr[29]
30 PHUB Error Int phub_termout1[14] udb_intr[30]
31 EEPROM Fault Int phub_termout1[15] udb_intr[31]
Table 4-8. Interrupt Vector Table (continued)
#Fixed Function DMA UDB
Table 5-1. Flash Protection
Protection
Setting Allowed Not Allowed
Unprotected External read and write
+ internal read and write
–
Factory Upgrade External write + internal
read and write
External read
Field Upgrade Internal read and write External read
and write
Full Protection Internal read External read
and write +
internal write
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 24 of 137
5.4 EEPROM
PSoC EEPROM memory is a byte-addressable nonvolatile
memory. The CY8C36 has up to 2 KB of EEPROM memory to
store user data. Reads from EEPROM are random access at the
byte level. Reads are done directly; writes are done by sending
write commands to an EEPROM programming interface. CPU
code execution can continue from flash during EEPROM writes.
EEPROM is erasable and writeable at the row level. The
EEPROM is divided into 128 rows of 16 bytes each. The factory
default values of all EEPROM bytes are 0.
Because the EEPROM is mapped to the 8051 xdata space, the
CPU cannot execute out of EEPROM. There is no ECC
hardware associated with EEPROM. If ECC is required it must
be handled in firmware.
It can take as much as 20 milliseconds to write to EEPROM or
flash. During this time the device should not be reset, or
unexpected changes may be made to portions of EEPROM or
flash. Reset sources (see Section 6.3.1) include XRES pin,
software reset, and watchdog; care should be taken to make
sure that these are not inadvertently activated. In addition, the
low voltage detect circuits should be configured to generate an
interrupt instead of a reset.
5.5 Nonvolatile Latches (NVLs)
PSoC has a 4-byte array of nonvolatile latches (NVLs) that are
used to configure the device at reset. The NVL register map is
shown in Tab le 5 -2 .
The details for individual fields and their factory default settings are shown in Table 5-3.
Although PSoC Creator provides support for modifying the device configuration NVLs, the number of NVL erase / write cycles is limited
– see “Nonvolatile Latches (NVL))” on page 110.
Table 5-2. Device Configuration NVL Register Map
Register Address 7 6 5 4 3 2 1 0
0x00 PRT3RDM[1:0] PRT2RDM[1:0] PRT1RDM[1:0] PRT0RDM[1:0]
0x01 PRT12RDM[1:0] PRT6RDM[1:0] PRT5RDM[1:0] PRT4RDM[1:0]
0x02 XRESMEN DBGEN PRT15RDM[1:0]
0x03 DIG_PHS_DLY[3:0] ECCEN DPS[1:0] CFGSPEED
Table 5-3. Fields and Factory Default Settings
Field Description Settings
PRTxRDM[1:0] Controls reset drive mode of the corresponding IO
port. See “Reset Configuration” on page 43. All pins
of the port are set to the same mode.
00b (default) - high impedance analog
01b - high impedance digital
10b - resistive pull up
11b - resistive pull down
XRESMEN Controls whether pin P1[2] is used as a GPIO or as
an external reset. See “Pin Descriptions” on page 12,
XRES description.
0 (default for 68-pin 72-pin, and 100-pin parts) - GPIO
1 (default for 48-pin parts) - external reset
DBGEN Debug Enable allows access to the debug system, for
third-party programmers.
0 - access disabled
1 (default) - access enabled
CFGSPEED Controls the speed of the IMO-based clock during the
device boot process, for faster boot or low-power
operation
0 (default) - 12 MHz IMO
1 - 48 MHz IMO
DPS[1:0] Controls the usage of various P1 pins as a debug
port. See “Programming, Debug Interfaces,
Resources” on page 65.
00b - 5-wire JTAG
01b (default) - 4-wire JTAG
10b - SWD
11b - debug ports disabled
ECCEN Controls whether ECC flash is used for ECC or for
general configuration and data storage. See “Flash
Program Memory” on page 23.
0 - ECC disabled
1 (default) - ECC enabled
DIG_PHS_DLY[3:0] Selects the digital clock phase delay. See the TRM for details.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 25 of 137
5.6 External Memory Interface
CY8C36 provides an external memory interface (EMIF) for
connecting to external memory devices. The connection allows
read and write accesses to external memories. The EMIF
operates in conjunction with UDBs, I/O ports, and other
hardware to generate external memory address and control
signals. At 33 MHz, each memory access cycle takes four bus
clock cycles.
Figure 5-1 is the EMIF block diagram. The EMIF supports
synchronous and asynchronous memories. The CY8C36
supports only one type of external memory device at a time.
External memory can be accessed through the 8051 xdata
space; up to 24 address bits can be used. See xdata Space on
page 27. The memory can be 8 or 16 bits wide.
Figure 5-1. EMIF Block Diagram
PHUB
IO IF
UDB
EMIF
IO
PORTs
IO
PORTs
IO
PORTs
Data,
Address,
and Control
Signals
Data,
Address,
and Control
Signals
Address Signals
Data Signals
Control Signals
Data,
Address,
and Control
Signals
EM Control
Signals
Other
Control
Signals
DSI Dynamic Output
Control
DSI to Port
Control
External_ MEM_ DATA[15:0]
External_ MEM_ ADDR[23:0]
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 26 of 137
5.7 Memory Map
The CY8C36 8051 memory map is very similar to the MCS-51
memory map.
5.7.1 Code Space
The CY8C36 8051 code space is 64 KB. Only main flash exists
in this space. See the “Flash Program Memory” section on
page 23.
5.7.2 Internal Data Space
The CY8C36 8051 internal data space is 384 bytes, compressed
within a 256-byte space. This space consists of 256 bytes of
RAM (in addition to the SRAM mentioned in “Static RAM” on
page 23) and a 128-byte space for Special Function Registers
(SFRs). See Figure 5-2. The lowest 32 bytes are used for four
banks of registers R0-R7. The next 16 bytes are bit-addressable.
Figure 5-2. 8051 Internal Data Space
In addition to the register or bit address modes used with the
lower 48 bytes, the lower 128 bytes can be accessed with direct
or indirect addressing. With direct addressing mode, the upper
128 bytes map to the SFRs. With indirect addressing mode, the
upper 128 bytes map to RAM. Stack operations use indirect
addressing; the 8051 stack space is 256 bytes. See the
“Addressing Modes” section on page 14.
5.7.3 SFRs
The special function register (SFR) space provides access to frequently accessed registers. The memory map for the SFR memory
space is shown in Tabl e 5- 4.
The CY8C36 family provides the standard set of registers found on industry standard 8051 devices. In addition, the CY8C36 devices
add SFRs to provide direct access to the I/O ports on the device. The following sections describe the SFRs added to the CY8C36
family.
Upper Core RAM Shared
with Stack Space
(indirect addressing)
SFR
Special Function Registers
(direct addressing)
Lower Core RAM Shared with Stack Space
(direct and indirect addressing)
Bit-Addressable Area
4 Banks, R0-R7 Each
0xFF
0x80
0x7F
0x30
0x2F
0x20
0x1F
0x00
Table 5-4. SFR Map
Address 0/8 1/9 2/A 3/B 4/C 5/D 6/E 7/F
0×F8SFRPRT15DRSFRPRT15PSSFRPRT15SEL–––––
0×F0B – SFRPRT12SEL–––––
0×E8SFRPRT12DRSFRPRT12PSMXAX –––––
0×E0ACC – – –––––
0×D8SFRPRT6DRSFRPRT6PSSFRPRT6SEL–––––
0×D0PSW – – –––––
0×C8SFRPRT5DRSFRPRT5PSSFRPRT5SEL–––––
0×C0SFRPRT4DRSFRPRT4PSSFRPRT4SEL–––––
0×B8– – – –––––
0×B0SFRPRT3DRSFRPRT3PSSFRPRT3SEL–––––
0×A8IE – – –––––
0×A0P2AX – SFRPRT1SEL–––––
0×98SFRPRT2DRSFRPRT2PSSFRPRT2SEL–––––
0×90 SFRPRT1DR SFRPRT1PS – DPX0 – DPX1 – –
0×88– SFRPRT0PSSFRPRT0SEL–––––
0×80 SFRPRT0DR SP DPL0 DPH0 DPL1 DPH1 DPS –
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 27 of 137
5.7.3.1 XData Space Access SFRs
The 8051 core features dual DPTR registers for faster data
transfer operations. The data pointer select SFR, DPS, selects
which data pointer register, DPTR0 or DPTR1, is used for the
following instructions:
MOVX @DPTR, A
MOVX A, @DPTR
MOVC A, @A+DPTR
JMP @A+DPTR
INC DPTR
MOV DPTR, #data16
The extended data pointer SFRs, DPX0, DPX1, MXAX, and
P2AX, hold the most significant parts of memory addresses
during access to the xdata space. These SFRs are used only
with the MOVX instructions.
During a MOVX instruction using the DPTR0/DPTR1 register,
the most significant byte of the address is always equal to the
contents of DPX0/DPX1.
During a MOVX instruction using the R0 or R1 register, the most
significant byte of the address is always equal to the contents of
MXAX, and the next most significant byte is always equal to the
contents of P2AX.
5.7.3.2 I/O Port SFRs
The I/O ports provide digital input sensing, output drive, pin
interrupts, connectivity for analog inputs and outputs, LCD, and
access to peripherals through the DSI. Full information on I/O
ports is found in I/O System and Routing on page 37.
I/O ports are linked to the CPU through the PHUB and are also
available in the SFRs. Using the SFRs allows faster access to a
limited set of I/O port registers, while using the PHUB allows boot
configuration and access to all I/O port registers.
Each SFR supported I/O port provides three SFRs:
SFRPRTxDR sets the output data state of the port (where × is
port number and includes ports 0–6, 12 and 15).
The SFRPRTxSEL selects whether the PHUB PRTxDR
register or the SFRPRTxDR controls each pin’s output buffer
within the port. If a SFRPRTxSEL[y] bit is high, the
corresponding SFRPRTxDR[y] bit sets the output state for that
pin. If a SFRPRTxSEL[y] bit is low, the corresponding
PRTxDR[y] bit sets the output state of the pin (where y varies
from 0 to 7).
The SFRPRTxPS is a read only register that contains pin state
values of the port pins.
5.7.4 xdata Space
The 8051 xdata space is 24-bit, or 16 MB in size. The majority of
this space is not “external”—it is used by on-chip components.
See Tab le 5 -5 . External, that is, off-chip, memory can be
accessed using the EMIF. See External Memory Interface on
page 25.
Table 5-5. XDATA Data Address Map
Address Range Purpose
0×00 0000 – 0×00 1FFF SRAM
0×00 4000 – 0×00 42FF Clocking, PLLs, and oscillators
0×00 4300 – 0×00 43FF Power management
0×00 4400 – 0×00 44FF Interrupt controller
0×00 4500 – 0×00 45FF Ports interrupt control
0×00 4700 – 0×00 47FF Flash programming interface
0×00 4800 - 0×00 48FF Cache controller
0×00 4900 – 0×00 49FF I2C controller
0×00 4E00 – 0×00 4EFF Decimator
0×00 4F00 – 0×00 4FFF Fixed timer/counter/PWMs
0×00 5000 – 0×00 51FF I/O ports control
0×00 5400 – 0×00 54FF External Memory Interface
(EMIF) control registers
0×00 5800 – 0×00 5FFF Analog Subsystem interface
0×00 6000 – 0×00 60FF USB controller
0×00 6400 – 0×00 6FFF UDB Working Registers
0×00 7000 – 0×00 7FFF PHUB configuration
0×00 8000 – 0×00 8FFF EEPROM
0×00 A000 – 0×00 A400 CAN
0×00 C000 – 0×00 C800 Digital Filter Block
0×01 0000 – 0×01 FFFF Digital Interconnect
configuration
0×05 0220 – 0×05 02F0 Debug controller
0×08 0000 – 0×08 1FFF flash ECC bytes
0×80 0000 – 0×FF FFFF External Memory Interface
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 28 of 137
6. System Integration
6.1 Clocking System
The clocking system generates, divides, and distributes clocks
throughout the PSoC system. For the majority of systems, no
external crystal is required. The IMO and PLL together can
generate up to a 66 MHz clock, accurate to ±1% over voltage and
temperature. Additional internal and external clock sources allow
each design to optimize accuracy, power, and cost. Any of the
clock sources can be used to generate other clock frequencies
in the 16-bit clock dividers and UDBs for anything the user wants,
for example a UART baud rate generator.
Clock generation and distribution is automatically configured
through the PSoC Creator IDE graphical interface. This is based
on the complete system’s requirements. It greatly speeds the
design process. PSoC Creator allows you to build clocking
systems with minimal input. You can specify desired clock
frequencies and accuracies, and the software locates or builds a
clock that meets the required specifications. This is possible
because of the programmability inherent in PSoC.
Key features of the clocking system include:
Seven general purpose clock sources
3- to 62-MHz IMO, ±1% at 3 MHz
4- to 25-MHz external crystal oscillator (MHzECO)
Clock doubler provides a doubled clock frequency output for
the USB block, see USB Clock Domain on page 30.
DSI signal from an external I/O pin or other logic
24- to 67-MHz fractional PLL sourced from IMO, MHzECO,
or DSI
1-kHz, 33-kHz, 100-kHz ILO for WDT and sleep timer
32.768-kHz external crystal oscillator (kHzECO) for RTC
IMO has a USB mode that auto locks to the USB bus clock
requiring no external crystal for USB. (USB equipped parts only)
Independently sourced clock in all clock dividers
Eight 16-bit clock dividers for the digital system
Four 16-bit clock dividers for the analog system
Dedicated 16-bit divider for the bus clock
Dedicated 4-bit divider for the CPU clock
Automatic clock configuration in PSoC Creator
Figure 6-1. Clocking Subsystem
4-25 MHz
ECO
3-62 MHz
IMO 32 kHz ECO 1,33,100 kHz
ILO
s
k
e
w
7
7
Digital Clock
Divider 16 bit
Digital Clock
Divider 16 bit
Digital Clock
Divider 16 bit
Digital Clock
Divider 16 bit
Digital Clock
Divider 16 bit
Digital Clock
Divider 16 bit
Digital Clock
Divider 16 bit
Digital Clock
Divider 16 bit
Analog Clock
Divider 16 bit
Bus Clock Divider
16 bit
48 MHz
Doubler for
USB
24-67 MHz
PLL
Master
Mux
External IO
or DSI
0-33 MHz
s
k
e
w
Analog Clock
Divider 16 bit
s
k
e
w
Analog Clock
Divider 16 bit
s
k
e
w
Analog Clock
Divider 16 bit
CPU Clock Divider
4 bit
Bus
Clock
CPU
Clock
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 29 of 137
6.1.1 Internal Oscillators
Figure 6-1 shows that there are two internal oscillators. They can
be routed directly or divided. The direct routes may not have a
50% duty cycle. Divided clocks have a 50% duty cycle.
6.1.1.1 Internal Main Oscillator
In most designs the IMO is the only clock source required, due
to its ±1% accuracy. The IMO operates with no external
components and outputs a stable clock. A factory trim for each
frequency range is stored in the device. With the factory trim,
tolerance varies from ±1% at 3 MHz, up to ±7% at 62 MHz. The
IMO, in conjunction with the PLL, allows generation of other
clocks up to the device's maximum frequency (see
Phase-Locked Loop).
The IMO provides clock outputs at 3, 6, 12, 24, 48, and 62 MHz.
6.1.1.2 Clock Doubler
The clock doubler outputs a clock at twice the frequency of the
input clock. The doubler works at an input frequency of 24 MHz,
providing 48 MHz for the USB. It can be configured to use a clock
from the IMO, MHzECO, or the DSI (external pin).
6.1.1.3 Phase-Locked Loop
The PLL allows low frequency, high accuracy clocks to be
multiplied to higher frequencies. This is a tradeoff between
higher clock frequency and accuracy and, higher power
consumption and increased startup time.
The PLL block provides a mechanism for generating clock
frequencies based upon a variety of input sources. The PLL
outputs clock frequencies in the range of 24 to 67 MHz. Its input
and feedback dividers supply 4032 discrete ratios to create
almost any desired clock frequency. The accuracy of the PLL
output depends on the accuracy of the PLL input source. The
most common PLL use is to multiply the IMO clock at 3 MHz,
where it is most accurate, to generate the other clocks up to the
device’s maximum frequency.
The PLL achieves phase lock within 250 µs (verified by bit
setting). It can be configured to use a clock from the IMO,
MHzECO or DSI (external pin). The PLL clock source can be
used until lock is complete and signaled with a lock bit. The lock
signal can be routed through the DSI to generate an interrupt.
Disable the PLL before entering low-power modes.
6.1.1.4 Internal Low-Speed Oscillator
The ILO provides clock frequencies for low-power consumption,
including the watchdog timer, and sleep timer. The ILO
generates up to three different clocks: 1 kHz, 33 kHz, and
100 kHz.
The 1-kHz clock (CLK1K) is typically used for a background
‘heartbeat’ timer. This clock inherently lends itself to low-power
supervisory operations such as the watchdog timer and long
sleep intervals using the central timewheel (CTW).
The central timewheel is a 1-kHz, free-running, 13-bit counter
clocked by the ILO. The central timewheel is always enabled,
except in hibernate mode and when the CPU is stopped during
debug on chip mode. It can be used to generate periodic
interrupts for timing purposes or to wake the system from a
low-power mode. Firmware can reset the central timewheel.
Systems that require accurate timing should use the RTC
capability instead of the central timewheel.
The 100-kHz clock (CLK100K) can be used as a low power
master clock. It can also generate time intervals using the fast
timewheel.
The fast timewheel is a 5-bit counter, clocked by the 100-kHz
clock. It features programmable settings and automatically
resets when the terminal count is reached. An optional interrupt
can be generated each time the terminal count is reached. This
enables flexible, periodic interrupts of the CPU at a higher rate
than is allowed using the central timewheel.
The 33-kHz clock (CLK33K) comes from a divide-by-3 operation
on CLK100K. This output can be used as a reduced accuracy
version of the 32.768-kHz ECO clock with no need for a crystal.
6.1.2 External Oscillators
Figure 6-1 shows that there are two external oscillators. They
can be routed directly or divided. The direct routes may not have
a 50% duty cycle. Divided clocks have a 50% duty cycle.
6.1.2.1 MHz External Crystal Oscillator
The MHzECO provides high frequency, high precision clocking
using an external crystal (see Figure 6-2). It supports a wide
variety of crystal types, in the range of 4 to 25 MHz. When used
in conjunction with the PLL, it can generate other clocks up to the
device's maximum frequency (see Phase-Locked Loop). The
GPIO pins connecting to the external crystal and capacitors are
fixed. MHzECO accuracy depends on the crystal chosen.
Table 6-1. Oscillator Summary
Source Fmin Tolerance at Fmin Fmax Tolerance at Fmax Startup Time
IMO 3 MHz ±1% over voltage and temperature 62 MHz ±7% 13 µs max
MHzECO 4 MHz Crystal dependent 25 MHz Crystal dependent 5 ms typ, max is
crystal dependent
DSI 0 MHz Input dependent 33 MHz Input dependent Input dependent
PLL 24 MHz Input dependent 67 MHz Input dependent 250 µs max
Doubler 48 MHz Input dependent 48 MHz Input dependent 1 µs max
ILO 1 kHz –50%, +100% 100 kHz –55%, +100% 15 ms max in lowest
power mode
kHzECO 32 kHz Crystal dependent 32 kHz Crystal dependent 500 ms typ, max is
crystal dependent
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 30 of 137
Figure 6-2. MHzECO Block Diagram
6.1.2.2 32.768-kHz ECO
The 32.768-kHz external crystal oscillator (32kHzECO) provides
precision timing with minimal power consumption using an
external 32.768-kHz watch crystal (see Figure 6-3). The
32kHzECO also connects directly to the sleep timer and provides
the source for the RTC. The RTC uses a 1-second interrupt to
implement the RTC functionality in firmware.
The oscillator works in two distinct power modes. This allows
users to trade off power consumption with noise immunity from
neighboring circuits. The GPIO pins connected to the external
crystal and capacitors are fixed.
Figure 6-3. 32kHzECO Block Diagram
It is recommended that the external 32.768-kHz watch crystal
have a load capacitance (CL) of 6 pF or 12.5 pF. Check the
crystal manufacturer's datasheet. The two external capacitors,
CL1 and CL2, are typically of the same value, and their total
capacitance, CL1CL2 / (CL1 + CL2), including pin and trace
capacitance, should equal the crystal CL value. For more
information, refer to application note AN54439: PSoC 3 and
PSoC 5 External Oscillators. See also pin capacitance
specifications in the “GPIO” section on page 80.
6.1.2.3 Digital System Interconnect
The DSI provides routing for clocks taken from external clock
oscillators connected to I/O. The oscillators can also be
generated within the device in the digital system and UDBs.
While the primary DSI clock input provides access to all clocking
resources, up to eight other DSI clocks (internally or externally
generated) may be routed directly to the eight digital clock
dividers. This is only possible if there are multiple precision clock
sources.
6.1.3 Clock Distribution
All seven clock sources are inputs to the central clock distribution
system. The distribution system is designed to create multiple
high precision clocks. These clocks are customized for the
design’s requirements and eliminate the common problems
found with limited resolution prescalers attached to peripherals.
The clock distribution system generates several types of clock
trees.
The master clock is used to select and supply the fastest clock
in the system for general clock requirements and clock
synchronization of the PSoC device.
Bus clock 16-bit divider uses the master clock to generate the
bus clock used for data transfers. Bus clock is the source clock
for the CPU clock divider.
Eight fully programmable 16-bit clock dividers generate digital
system clocks for general use in the digital system, as
configured by the design’s requirements. Digital system clocks
can generate custom clocks derived from any of the seven
clock sources for any purpose. Examples include baud rate
generators, accurate PWM periods, and timer clocks, and
many others. If more than eight digital clock dividers are
required, the Universal Digital Blocks (UDBs) and fixed function
timer/counter/PWMs can also generate clocks.
Four 16-bit clock dividers generate clocks for the analog system
components that require clocking, such as ADC and mixers.
The analog clock dividers include skew control to ensure that
critical analog events do not occur simultaneously with digital
switching events. This is done to reduce analog system noise.
Each clock divider consists of an 8-input multiplexer, a 16-bit
clock divider (divide by 2 and higher) that generates ~50% duty
cycle clocks, master clock resynchronization logic, and deglitch
logic. The outputs from each digital clock tree can be routed into
the digital system interconnect and then brought back into the
clock system as an input, allowing clock chaining of up to 32 bits.
6.1.4 USB Clock Domain
The USB clock domain is unique in that it operates largely
asynchronously from the main clock network. The USB logic
contains a synchronous bus interface to the chip, while running
on an asynchronous clock to process USB data. The USB logic
requires a 48 MHz frequency. This frequency can be generated
from different sources, including DSI clock at 48 MHz or doubled
value of 24 MHz from internal oscillator, DSI signal, or crystal
oscillator.
Xo
(Pin P15[0])
4 – 25 MHz
Crystal Osc
XCLK_MHZ
4 – 25 MHz
crystal
Capacitors
External
Components
Xi
(Pin P15[1])
Xo
(Pin P15[2])
32 kHz
Crystal Osc
XCLK32K
32 kHz
crystal
Capacitors
External
Components
Xi
(Pin P15[3])
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 31 of 137
6.2 Power System
The power system consists of separate analog, digital, and I/O
supply pins, labeled VDDA, VDDD, and VDDIO×, respectively. It
also includes two internal 1.8 V regulators that provide the digital
(VCCD) and analog (VCCA) supplies for the internal core logic.
The output pins of the regulators (VCCD and VCCA) and the
VDDIO pins must have capacitors connected as shown in
Figure 6-4. The two VCCD pins must be shorted together, with
as short a trace as possible, and connected to a 1-µF ±10% ×5R
capacitor. The power system also contains a sleep regulator, an
I2C regulator, and a hibernate regulator.
Figure 6-4. PSoC Power System
Notes
The two VCCD pins must be connected together with as short a trace as possible. A trace under the device is recommended, as
shown in Figure 2-8 on page 12.
It is good practice to check the datasheets for your bypass capacitors, specifically the working voltage and the DC bias specifications.
With some capacitors, the actual capacitance can decrease considerably when the DC bias (VDDX or VCCX in Figure 6-4) is a
significant percentage of the rated working voltage.
You can power the device in internally regulated mode, where the voltage applied to the VDDx pins is as high as 5.5 V, and the
internal regulators provide the core voltages. In this mode, do not apply power to the VCCx pins, and do not tie the VDDx pins
to the VCCx pins.
You can also power the device in externally regulated mode, that is, by directly powering the VCCD and VCCA pins. In this
configuration, the VDDD pins should be shorted to the VCCD pins and the VDDA pin should be shorted to the VCCA pin. The
allowed supply range in this configuration is 1.71 V to 1.89 V. After power up in this configuration, the internal regulators are on by
default, and should be disabled to reduce power consumption.
VSSB
VDDIO2
VDDIO0
VDDIO3
VCCD
VDDD
VSSD
VCCD
VDDD
VSSA
VCCA
VDDA
Digital
Regulators
Analog
Regulator
Analog
Domain
Digital
Domain
I2C
Regulator
Sleep
Regulator
Hibernate
Regulator
I/O Supply I/O Supply
I/O SupplyI/O Supply
VDDIO2
VDDIO0
VDDIO3VDDIO1
0.1 µF
0.1 µF
0.1 µF
0.1µF
VDDD
VDDD
1µF
1µF
VDDA
0.1 µF
0.1 µF
0.1 µF
VDDIO1
VSSD
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 32 of 137
6.2.1 Power Modes
PSoC 3 devices have four different power modes, as shown in
Tab le 6 -2 and Ta b l e 6 - 3 . The power modes allow a design to
easily provide required functionality and processing power while
simultaneously minimizing power consumption and maximizing
battery life in low-power and portable devices.
PSoC 3 power modes, in order of decreasing power
consumption are:
Active
Alternate Active
Sleep
Hibernate
Active is the main processing mode. Its functionality is
configurable. Each power controllable subsystem is enabled or
disabled by using separate power configuration template
registers. In alternate active mode, fewer subsystems are
enabled, reducing power. In sleep mode most resources are
disabled regardless of the template settings. Sleep mode is
optimized to provide timed sleep intervals and RTC functionality.
The lowest power mode is hibernate, which retains register and
SRAM state, but no clocks, and allows wakeup only from I/O
pins. Figure 6-5 illustrates the allowable transitions between
power modes. Sleep and hibernate modes should not be entered
until all VDDIO supplies are at valid voltage levels.
.
Table 6-2. Power Modes
Power
Modes Description Entry Condition Wakeup
Source Active Clocks Regulator
Active Primary mode of operation, all periph-
erals available (programmable)
Wakeup, reset,
manual register
entry
Any interrupt Any
(programmable)
All regulators available. Digital
and analog regulators can be
disabled if external regulation
used.
Alternate
Active
Similar to Active mode, and is typically
configured to have fewer peripherals
active to reduce power. One possible
configuration is to use the UDBs for
processing, with the CPU turned off
Manual register
entry
Any interrupt Any
(programmable)
All regulators available. Digital
and analog regulators can be
disabled if external regulation
used.
Sleep All subsystems automatically disabled Manual register
entry
Comparator,
PICU, I2C,
RTC, CTW,
LVD
ILO/kHzECO Both digital and analog
regulators buzzed.
Digital and analog regulators
can be disabled if external
regulation used.
Hibernate All subsystems automatically disabled
Lowest power consuming mode with
all peripherals and internal regulators
disabled, except hibernate regulator is
enabled
Configuration and memory contents
retained
Manual register
entry
PICU – Only hibernate regulator active.
Table 6-3. Power Modes Wakeup Time and Power Consumption
Sleep
Modes
Wakeup
Time
Current
(Typ)
Code
Execution
Digital
Resources
Analog
Resources
Clock Sources
Available Wakeup Sources Reset
Sources
Active – 1.2 mA[16] Yes All All All – All
Alternate
Active
––User
defined
All All All – All
Sleep
<15 µs 1 µA No I2C Comparator ILO/kHzECO Comparator,
PICU, I2C, RTC,
CTW, LVD
XRES, LVD,
WDR
Hibernate <100 µs 200 nA No None None None PICU XRES
Note
16. Bus clock off. Execute from cache at 6 MHz. See Table 11-2 on page 72.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 33 of 137
Figure 6-5. Power Mode Transitions
6.2.1.1 Active Mode
Active mode is the primary operating mode of the device. When
in active mode, the active configuration template bits control
which available resources are enabled or disabled. When a
resource is disabled, the digital clocks are gated, analog bias
currents are disabled, and leakage currents are reduced as
appropriate. User firmware can dynamically control subsystem
power by setting and clearing bits in the active configuration
template. The CPU can disable itself, in which case the CPU is
automatically reenabled at the next wakeup event.
When a wakeup event occurs, the global mode is always
returned to active, and the CPU is automatically enabled,
regardless of its template settings. Active mode is the default
global power mode upon boot.
6.2.1.2 Alternate Active Mode
Alternate Active mode is very similar to Active mode. In alternate
active mode, fewer subsystems are enabled, to reduce power
consumption. One possible configuration is to turn off the CPU
and flash, and run peripherals at full speed.
6.2.1.3 Sleep Mode
Sleep mode reduces power consumption when a resume time of
15 µs is acceptable. The wake time is used to ensure that the
regulator outputs are stable enough to directly enter active
mode.
6.2.1.4 Hibernate Mode
In hibernate mode nearly all of the internal functions are
disabled. Internal voltages are reduced to the minimal level to
keep vital systems alive. Configuration state is preserved in
hibernate mode and SRAM memory is retained. GPIOs
configured as digital outputs maintain their previous values and
external GPIO pin interrupt settings are preserved. The device
can only return from hibernate mode in response to an external
I/O interrupt. The resume time from hibernate mode is less than
100 µs.
To achieve an extremely low current, the hibernate regulator has
limited capacity. This limits the frequency of any signal present
on the input pins - no GPIO should toggle at a rate greater than
10 kHz while in hibernate mode. If pins must be toggled at a high
rate while in a low power mode, use sleep mode instead.
6.2.1.5 Wakeup Events
Wakeup events are configurable and can come from an interrupt
or device reset. A wakeup event restores the system to active
mode. Firmware enabled interrupt sources include internally
generated interrupts, power supervisor, central timewheel, and
I/O interrupts. Internal interrupt sources can come from a variety
of peripherals, such as analog comparators and UDBs. The
central timewheel provides periodic interrupts to allow the
system to wake up, poll peripherals, or perform real-time
functions. Reset event sources include the external reset I/O pin
(XRES), WDT, and precision reset (PRES).
6.2.2 Boost Converter
Applications that use a supply voltage of less than 1.71 V, such
as solar panels or single cell battery supplies, may use the
on-chip boost converter to generate a minimum of 1.8 V supply
voltage. The boost converter may also be used in any system
that requires a higher operating voltage than the supply provides
such as driving 5.0 V LCD glass in a 3.3 V system. With the
addition of an inductor, Schottky diode, and capacitors, it
produces a selectable output voltage sourcing enough current to
operate the PSoC and other on-board components.
The boost converter accepts an input voltage VBAT from 0.5 V to
3.6 V, and can start up with VBAT as low as 0.5 V. The converter
provides a user configurable output voltage of 1.8 to 5.0 V (VOUT)
in 100 mV increments. VBAT is typically less than VOUT; if VBAT is
greater than or equal to VOUT, then VOUT will be slightly less than
VBAT due to resistive losses in the boost converter. The block can
deliver up to 50 mA (IBOOST) depending on configuration to both
the PSoC device and external components. The sum of all
current sinks in the design including the PSoC device, PSoC I/O
pin loads, and external component loads must be less than the
IBOOST specified maximum current.
Four pins are associated with the boost converter: VBAT, VSSB,
VBOOST, and IND. The boosted output voltage is sensed at the
VBOOST pin and must be connected directly to the chip’s supply
inputs; VDDA, VDDD, and VDDIO if used to power the PSoC
device.
The boost converter requires four components in addition to
those required in a non-boost design, as shown in Figure 6-6 on
page 34. A 22 µF capacitor (CBAT) is required close to the VBAT
pin to provide local bulk storage of the battery voltage and
provide regulator stability. A diode between the battery and VBAT
pin should not be used for reverse polarity protection because
the diodes forward voltage drop reduces the VBAT voltage.
Between the VBAT and IND pins, an inductor of 4.7 µH, 10 µH,
or 22 µH is required. The inductor value can be optimized to
increase the boost converter efficiency based on input voltage,
output voltage, temperature, and current. Inductor size is
determined by following the design guidance in this chapter and
electrical specifications. The inductor must be placed within 1 cm
of the VBAT and IND pins and have a minimum saturation
current of 750 mA. Between the IND and VBOOST pins a
Schottky diode must be placed within 1 cm of the pins. The
Schottky diode shall have a forward current rating of at least 1.0
A and a reverse voltage of at least 20 V. A 22 µF bulk capacitor
(CBOOST) must be connected close to VBOOST to provide
regulator output stability. It is important to sum the total
capacitance connected to the VBOOST pin and ensure the
maximum CBOOST specification is not exceeded. All capacitors
Active
Manual
Hibernate
Alternate
Active
Sleep
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 34 of 137
must be rated for a minimum of 10 V to minimize capacitive
losses due to voltage de-rating.
Figure 6-6. Application of Boost Converter powering PSoC device
The boost converter may also generate a supply that is not used
directly by the PSoC device. An example of this use case is
boosting a 1.8 V supply to 4.0 V to drive a white LED. If the boost
converter is not supplying the PSoC devices VDDA, VDDD, and
VDDIO it must comply with the same design rules as supplying
the PSoC device, but with a change to the bulk capacitor
requirements. A parallel arrangement 22 µF, 1.0 µF, and 0.1 µF
capacitors are all required on the Vout supply and must be
placed within 1 cm of the VBOOST pin to ensure regulator
stability.
Figure 6-7. Application of Boost Converter not powering PSoC device
VBOOST
VBAT
VSSB
IND
VDDD
VDDA
VDDIO0
VSSA
VSSD
Boost
Logic
VDDIO1
VDDIO2
VDDIO3
0.1 µF
0.1 µF
0.1 µF
0.1 µF
22 µF
0.1 µF
0.1 µF
1.0 µF
1.0 µF
22 µF
4.7 µH
10 µH
22 µH
Schottky, 1A
VDDD 0.1 µF 1.0 µF
All components and values are required
0.5–3.6 V
PSoC
External
Load
VBOOST
VBAT
VSSB
IND
VDDD
VDDA
VDDIO0
VSSA
VSSD
Boost
Logic
VDDIO1
VDDIO2
VDDIO3
22 µF
4.7 µH
10 µH
22 µH
Schottky, 1A
VDDD
All components and values are required
0.5–3.6 V
22 µF 0.1 µF1.0 µF
VDDA, VDDD, and
VDDIO connections
per section 6.2
Power System.
VOUT
PSoC
External
Load
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 35 of 137
The switching frequency is set to 400 kHz using an oscillator
integrated into the boost converter. The boost converter can be
operated in two different modes: active and standby. Active
mode is the normal mode of operation where the boost regulator
actively generates a regulated output voltage. In standby mode,
most boost functions are disabled, thus reducing power
consumption of the boost circuit. Only minimal power is provided,
typically < 5 µA to power the PSoC device in Sleep mode. The
boost typically draws 250 µA in active mode and 25 µA in
standby mode. The boost operating modes must be used in
conjunction with chip power modes to minimize total power
consumption. Tab le 6-1 lists the boost power modes available in
different chip power modes.
6.2.2.1 Boost Firmware Requirements
To ensure boost inrush current is within specification at startup,
the Enable Fast IMO During Startup value must be unchecked
in the PSoC Creator IDE. The Enable Fast IMO During Startup
option is found in PSoC Creator in the design wide resources
(cydwr) file System tab. Un-checking this option configures the
device to run at 12 MHz vs 48 MHz during startup while
configuring the device. The slower clock speed results in
reduced current draw through the boost circuit.
6.2.2.2 Boost Design Process
Correct operation of the boost converter requires specific
component values determined for each designs unique
operating conditions. The CBAT capacitor, Inductor, Schottky
diode, and CBOOST capacitor components are required with the
values specified in the electrical specifications, Ta b le 11 -7 on
page 78. The only variable component value is the inductor
LBOOST which is primarily sized for correct operation of the boost
across operating conditions and secondarily for efficiency.
Additional operating region constraints exist for VOUT, VBAT, IOUT,
and TA.
The following steps must be followed to determine boost
converter operating parameters and LBOOST value.
1. Choose desired VBAT, VOUT, TA, and IOUT operating condition
ranges for the application.
2. Determine if VBAT and VOUT ranges fit the boost operating
range based on the TA range over VBAT and VOUT chart,
Figure 11-8 on page 78. If the operating ranges are not met,
modify the operating conditions or use an external boost
regulator.
3. Determine if the desired ambient temperature (TA) range fits
the ambient temperature operating range based on the TA
range over VBAT and VOUT chart, Figure 11-8 on page 78. If
the temperature range is not met, modify the operating condi-
tions and return to step 2, or use an external boost regulator.
4. Determine if the desired output current (IOUT) range fits the
output current operating range based on the IOUT range over
VBAT and VOUT chart, Figure 11-9 on page 78. If the output
current range is not met, modify the operating conditions and
return to step 2, or use an external boost regulator.
5. Find the allowed inductor values based on the LBOOST values
over VBAT and VOUT chart, Figure 11-10 on page 78.
6. Based on the allowed inductor values, inductor dimensions,
inductor cost, boost efficiency, and VRIPPLE choose the
optimum inductor value for the system. Boost efficiency and
VRIPPLE typical values are provided in the Efficiency vs VBAT
and VRIPPLE vs VBAT charts, Figure 11-11 on page 79 through
Figure 11-14 on page 79. In general, if high efficiency and low
VRIPPLE are most important, then the highest allowed inductor
value should be used. If low inductor cost or small inductor
size are most important, then one of the smaller allowed
inductor values should be used. If the allowed inductor(s)
efficiency, VRIPPLE, cost or dimensions are not acceptable for
the application than an external boost regulator should be
used.
6.3 Reset
CY8C36 has multiple internal and external reset sources
available. The reset sources are:
Power source monitoring – The analog and digital power
voltages, VDDA, VDDD, VCCA, and VCCD are monitored in
several different modes during power up, active mode, and
sleep mode (buzzing). If any of the voltages goes outside
predetermined ranges then a reset is generated. The monitors
are programmable to generate an interrupt to the processor
under certain conditions before reaching the reset thresholds.
External – The device can be reset from an external source by
pulling the reset pin (XRES) low. The XRES pin includes an
internal pull-up to VDDIO1. VDDD, VDDA, and VDDIO1 must
all have voltage applied before the part comes out of reset.
Watchdog timer – A watchdog timer monitors the execution of
instructions by the processor. If the watchdog timer is not reset
by firmware within a certain period of time, the watchdog timer
generates a reset.
Software – The device can be reset under program control.
Table 6-1. Chip and Boost Power Modes Compatibility
Chip Power Modes Boost Power Modes
Chip-active or alternate
active mode
Boost must be operated in its active
mode.
Chip-sleep mode Boost can be operated in either active
or standby mode. In boost standby
mode, the chip must wake up periodi-
cally for boost active-mode refresh.
Chip-hibernate mode Boost can be operated in its active
mode. However, it is recommended not
to use the boost in chip hibernate mode
due to the higher current consumption
in boost active mode.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 36 of 137
Figure 6-8. Resets
The term device reset indicates that the processor as well as
analog and digital peripherals and registers are reset.
A reset status register shows some of the resets or power voltage
monitoring interrupts. The program may examine this register to
detect and report certain exception conditions. This register is
cleared after a power-on reset. For details see the Technical
Reference Manual.
6.3.1 Reset Sources
6.3.1.1 Power Voltage Level Monitors
IPOR – Initial POR
At initial power on, IPOR monitors the power voltages VDDD,
VDDA, VCCD and VCCA. The trip level is not precise. It is set
to approximately 1 volt, which is below the lowest specified
operating voltage but high enough for the internal circuits to be
reset and to hold their reset state. The monitor generates a
reset pulse that is at least 150 ns wide. It may be much wider
if one or more of the voltages ramps up slowly.
After boot, the IPOR circuit is disabled and voltage supervision
is handed off to the precise low-voltage reset (PRES) circuit.
PRES – Precise Low Voltage Reset
This circuit monitors the outputs of the analog and digital
internal regulators after power up. The regulator outputs are
compared to a precise reference voltage. The response to a
PRES trip is identical to an IPOR reset.
In normal operating mode, the program cannot disable the
digital PRES circuit. The analog regulator can be disabled,
which also disables the analog portion of the PRES. The PRES
circuit is disabled automatically during sleep and hibernate
modes, with one exception: During sleep mode the regulators
are periodically activated (buzzed) to provide supervisory
services and to reduce wakeup time. At these times the PRES
circuit is also buzzed to allow periodic voltage monitoring.
ALVI, DLVI, AHVI – Analog/Digital Low Voltage Interrupt,
Analog High Voltage Interrupt
Interrupt circuits are available to detect when VDDA and
VDDD go outside a voltage range. For AHVI, VDDA is
compared to a fixed trip level. For ALVI and DLVI, VDDA and
VDDD are compared to trip levels that are programmable, as
listed in Tab le 6 -2 . ALVI and DLVI can also be configured to
generate a device reset instead of an interrupt.
The monitors are disabled until after IPOR. During sleep mode
these circuits are periodically activated (buzzed). If an interrupt
occurs during buzzing then the system first enters its wake up
sequence. The interrupt is then recognized and may be
serviced.
The buzz frequency is adjustable, and should be set to be less
than the minimum time that any voltage is expected to be out
of range. For details on how to adjust the buzz frequency, see
the TRM.
6.3.1.2 Other Reset Sources
XRES – External Reset
PSoC 3 has either a single GPIO pin that is configured as an
external reset or a dedicated XRES pin. Either the dedicated
XRES pin or the GPIO pin, if configured, holds the part in reset
while held active (low). The response to an XRES is the same
as to an IPOR reset.
After XRES has been deasserted, at least 10 µs must elapse
before it can be reasserted.
The external reset is active low. It includes an internal pull-up
resistor. XRES is active during sleep and hibernate modes.
SRES – Software Reset
A reset can be commanded under program control by setting
a bit in the software reset register. This is done either directly
by the program or indirectly by DMA access. The response to
a SRES is the same as after an IPOR reset.
Another register bit exists to disable this function.
WRES – Watchdog Timer Reset
The watchdog reset detects when the software program is no
longer being executed correctly. To indicate to the watchdog
timer that it is running correctly, the program must periodically
reset the timer. If the timer is not reset before a user-specified
amount of time, then a reset is generated.
Note IPOR disables the watchdog function. The program must
enable the watchdog function at an appropriate point in the
code by setting a register bit. When this bit is set, it cannot be
cleared again except by an IPOR power on reset event.
Reset
Controller
Watchdog
Timer
External
Reset
Power
Voltage
Level
Monitors
Software
Reset
Register
VDDD VDDA
Reset
Pin
System
Reset
Processor
Interrupt
Table 6-2. Analog/Digital Low Voltage Interrupt, Analog High
Voltage Interrupt
Interrupt Supply Normal Voltage
Range Available Trip Settings
DLVI VDDD 1.71 V–5.5 V 1.70 V–5.45 V in 250 mV
increments
ALVI VDDA 1.71 V–5.5 V 1.70 V–5.45 V in 250 mV
increments
AHVI VDDA 1.71 V–5.5 V 5.75 V
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 37 of 137
6.4 I/O System and Routing
PSoC I/Os are extremely flexible. Every GPIO has analog and
digital I/O capability. All I/Os have a large number of drive modes,
which are set at POR. PSoC also provides up to four individual
I/O voltage domains through the VDDIO pins.
There are two types of I/O pins on every device; those with USB
provide a third type. Both General Purpose I/O (GPIO) and
Special I/O (SIO) provide similar digital functionality. The primary
differences are their analog capability and drive strength.
Devices that include USB also provide two USBIO pins that
support specific USB functionality as well as limited GPIO
capability.
All I/O pins are available for use as digital inputs and outputs for
both the CPU and digital peripherals. In addition, all I/O pins can
generate an interrupt. The flexible and advanced capabilities of
the PSoC I/O, combined with any signal to any pin routability,
greatly simplify circuit design and board layout. All GPIO pins can
be used for analog input, CapSense[17], and LCD segment drive,
while SIO pins are used for voltages in excess of VDDA and for
programmable output voltages.
Features supported by both GPIO and SIO:
User programmable port reset state
Separate I/O supplies and voltages for up to four groups of I/O
Digital peripherals use DSI to connect the pins
Input or output or both for CPU and DMA
Eight drive modes
Every pin can be an interrupt source configured as rising
edge, falling edge or both edges. If required, level sensitive
interrupts are supported through the DSI
Dedicated port interrupt vector for each port
Slew rate controlled digital output drive mode
Access port control and configuration registers on either port
basis or pin basis
Separate port read (PS) and write (DR) data registers to avoid
read modify write errors
Special functionality on a pin by pin basis
Additional features only provided on the GPIO pins:
LCD segment drive on LCD equipped devices
CapSense[17]
Analog input and output capability
Continuous 100 µA clamp current capability
Standard drive strength down to 1.7 V
Additional features only provided on SIO pins:
Higher drive strength than GPIO
Hot swap capability (5 V tolerance at any operating VDD)
Programmable and regulated high input and output drive
levels down to 1.2 V
No analog input, CapSense, or LCD capability
Over voltage tolerance up to 5.5 V
SIO can act as a general purpose analog comparator
USBIO features:
Full speed USB 2.0 compliant I/O
Highest drive strength for general purpose use
Input, output, or both for CPU and DMA
Input, output, or both for digital peripherals
Digital output (CMOS) drive mode
Each pin can be an interrupt source configured as rising
edge, falling edge, or both edges
Note
17. GPIOs with opamp outputs are not recommended for use with CapSense.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 38 of 137
Figure 6-9. GPIO Block Diagram
Drive
Logic
PRT[x]DM0
PRT[x]DR
PIN
Digital Output Path
Digital Input Path
PRT[x]SLW
LCD
Logic & MUX
PRT[x]DM1
PRT[x]DM2
PRT[x]LCD_EN
PRT[x]LCD_COM_SEG
Analog
Analog Mux
Analog Global
Digital System Output
0
1
PRT[x]BYP
PRT[x]BIE
Bidirectional Control
Capsense Global Control
Switches
Pin Interrupt Signal
Digital System Input
PRT[x]PS
PRT[x]CTL
Input Buffer Disable
Display
Data
Interrupt
Logic
PICU[x]INTTYPE[y]
PICU[x]INTSTAT
Vddio
Vddio Vddio
Slew
Cntl
LCD Bias Bus 5
PRT[x]AMUX
PRT[x]AG
1
CAPS[x]CFG1
OE
In
PRT[x]SYNC_OUT
PRT[x]DBL_SYNC_IN
PICU[x]INTSTAT
Naming Convention
‘x’ = Port Number
‘y’ = Pin Number
0
10
1
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 39 of 137
Figure 6-10. SIO Input/Output Block Diagram
Figure 6-11. USBIO Block Diagram
Drive
Logic
PRT[x]DM0
PRT[x]DR
PIN
Digital Output Path
Digital Input Path
PRT[x]SLW
PRT[x]DM1
PRT[x]DM2
Digital System Output
0
1
PRT[x]BYP
PRT[x]BIE
Bidirectional Control
Pin Interrupt Signal
Digital System Input
PRT[x]PS
Input Buffer Disable
Interrupt
Logic
PICU[x]INTTYPE[y]
PICU[x]INTSTAT
Slew
Cntl
OE
In
PRT[x]SYNC_OUT
PRT[x]DBL_SYNC_IN
PICU[x]INTSTAT
PRT[x]SIO_DIFF Buffer
Thresholds
Driver
Vhigh
PRT[x]SIO_CFG
PRT[x]SIO_HYST_EN
Naming Convention
‘x’ = Port Number
‘y’ = Pin Number
Reference Level
Reference Level
Drive
Logic
PRT[15]DR1[7,6]
PIN
Digital Output Path
Digital Input Path
Digital System Output
0
1
PRT[15]BYP
Pin Interrupt Signal
Digital System Input
USBIO_CR1[0,1]
Interrupt
Logic
PICU[15]INTTYPE[y]
PICU[15]INTSTAT
In
PRT[15]DBL_SYNC_IN
PICU[15]INTSTAT
Naming Convention
‘y’ = Pin Number
Vddd Vddd
Vddd
5 k 1.5 k
D+ pin only
PRT[15]DM1[6]
USBIO_CR1[5] USB or I/O
D+ 1.5 k
D+ 5 k
D+ Open
Drain
PRT[15]SYNC_OUT
USB SIE Control for USB Mode
USB Receiver Circuitry
Vddd
PRT[15]PS[6,7]
USBIO_CR1[2]
D- 5 k
PRT[15]DM1[7]
D- Open
Drain
PRT[15]DM0[6]
PRT[15]DM0[7]
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 40 of 137
6.4.1 Drive Modes
Each GPIO and SIO pin is individually configurable into one of the eight drive modes listed in Table 6-3. Three configuration bits are
used for each pin (DM[2:0]) and set in the PRTxDM[2:0] registers. Figure 6-12 depicts a simplified pin view based on each of the eight
drive modes. Ta bl e 6- 3 shows the I/O pin’s drive state based on the port data register value or digital array signal if bypass mode is
selected. Note that the actual I/O pin voltage is determined by a combination of the selected drive mode and the load at the pin. For
example, if a GPIO pin is configured for resistive pull-up mode and driven high while the pin is floating, the voltage measured at the
pin is a high logic state. If the same GPIO pin is externally tied to ground then the voltage unmeasured at the pin is a low logic state.
Figure 6-12. Drive Mode
Table 6-3. Drive Modes
Diagram Drive Mode PRTxDM2 PRTxDM1 PRTxDM0 PRTxDR = 1 PRTxDR = 0
0 High impedance analog 0 0 0 High Z High Z
1 High impedance digital 0 0 1 High Z High Z
2 Resistive pull-up[18] 0 1 0 Res High (5K) Strong Low
3 Resistive pull-down[18] 0 1 1 Strong High Res Low (5K)
4 Open drain, drives low 1 0 0 High Z Strong Low
5 Open drain, drive high 1 0 1 Strong High High Z
6 Strong drive 1 1 0 Strong High Strong Low
7 Resistive pull-up and pull-down[18] 1 1 1 Res High (5K) Res Low (5K)
Out
In Pin Out
In Pin Out
In Pin Out
In Pin
Out
In Pin Out
In Pin Out
In Pin Out
In Pin
0. High Impedance
Analog
1. High Impedance
Digital
2. Resistive Pull-Up 3. Resistive Pull-Down
4. Open Drain,
Drives Low
5. Open Drain,
Drives High
6. Strong Drive 7. Resistive Pull-Up
and Pull-Down
VDD VDD
VDD VDD VDD
An An An An
AnAnAnAn
The ‘Out’ connection is driven from either the Digital System (when the Digital Output terminal is connected) or the Data Register
(when HW connection is disabled).
The ‘In’ connection drives the Pin State register, and the Digital System if the Digital Input terminal is enabled and connected.
The ‘An’ connection connects to the Analog System.
Note
18. Resistive pull-up and pull-down are not available with SIO in regulated output mode.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 41 of 137
The USBIO pins (P15[7] and P15[6]), when enabled for I/O mode, have limited drive mode control. The drive mode is set using the
PRT15.DM0[7, 6] register. A resistive pull option is also available at the USBIO pins, which can be enabled using the PRT15.DM1[7,
6] register. When enabled for USB mode, the drive mode control has no impact on the configuration of the USB pins. Unlike the GPIO
and SIO configurations, the port wide configuration registers do not configure the USB drive mode bits. Table 6-4 shows the drive
mode configuration for the USBIO pins.
High Impedance Analog
The default reset state with both the output driver and digital
input buffer turned off. This prevents any current from flowing
in the I/O’s digital input buffer due to a floating voltage. This
state is recommended for pins that are floating or that support
an analog voltage. High impedance analog pins do not provide
digital input functionality.
To achieve the lowest chip current in sleep modes, all I/Os
must either be configured to the high impedance analog mode,
or have their pins driven to a power supply rail by the PSoC
device or by external circuitry.
High Impedance Digital
The input buffer is enabled for digital signal input. This is the
standard high impedance (HiZ) state recommended for digital
inputs.
Resistive pull-up or resistive pull-down
Resistive pull-up or pull-down, respectively, provides a series
resistance in one of the data states and strong drive in the
other. Pins can be used for digital input and output in these
modes. Interfacing to mechanical switches is a common
application for these modes. Resistive pull-up and pull-down
are not available with SIO in regulated output mode.
Open Drain, Drives High and Open Drain, Drives Low
Open drain modes provide high impedance in one of the data
states and strong drive in the other. Pins can be used for digital
input and output in these modes. A common application for
these modes is driving the I2C bus signal lines.
Strong Drive
Provides a strong CMOS output drive in either high or low
state. This is the standard output mode for pins. Strong Drive
mode pins must not be used as inputs under normal
circumstances. This mode is often used to drive digital output
signals or external FETs.
Resistive pull-up and pull-down
Similar to the resistive pull-up and resistive pull-down modes
except the pin is always in series with a resistor. The high data
state is pull-up while the low data state is pull-down. This mode
is most often used when other signals that may cause shorts
can drive the bus. Resistive pull-up and pull-down are not
available with SIO in regulated output mode.
6.4.2 Pin Registers
Registers to configure and interact with pins come in two forms
that may be used interchangeably.
All I/O registers are available in the standard port form, where
each bit of the register corresponds to one of the port pins. This
register form is efficient for quickly reconfiguring multiple port
pins at the same time.
I/O registers are also available in pin form, which combines the
eight most commonly used port register bits into a single register
for each pin. This enables very fast configuration changes to
individual pins with a single register write.
6.4.3 Bidirectional Mode
High speed bidirectional capability allows pins to provide both
the high impedance digital drive mode for input signals and a
second user selected drive mode such as strong drive (set using
PRT×DM[2:0] registers) for output signals on the same pin,
based on the state of an auxiliary control bus signal. The
bidirectional capability is useful for processor busses and
communications interfaces such as the SPI Slave MISO pin that
requires dynamic hardware control of the output buffer.
The auxiliary control bus routes up to 16 UDB or digital peripheral
generated output enable signals to one or more pins.
6.4.4 Slew Rate Limited Mode
GPIO and SIO pins have fast and slow output slew rate options
for strong and open drain drive modes, not resistive drive modes.
Because it results in reduced EMI, the slow edge rate option is
recommended for signals that are not speed critical, generally
less than 1 MHz. The fast slew rate is for signals between 1 MHz
and 33 MHz. The slew rate is individually configurable for each
pin, and is set by the PRT×SLW registers.
Table 6-4. USBIO Drive Modes (P15[7] and P15[6])
PRT15.DM1[7,6]
Pull up enable
PRT15.DM0[7,6]
Drive Mode enable PRT15.DR[7,6] = 1 PRT15.DR[7,6] = 0 Description
0 0 High Z Strong Low Open Drain, Strong Low
0 1 Strong High Strong Low Strong Outputs
1 0 Res High (5k) Strong Low Resistive Pull Up, Strong Low
1 1 Strong High Strong Low Strong Outputs
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 42 of 137
6.4.5 Pin Interrupts
All GPIO and SIO pins are able to generate interrupts to the
system. All eight pins in each port interface to their own Port
Interrupt Control Unit (PICU) and associated interrupt vector.
Each pin of the port is independently configurable to detect rising
edge, falling edge, both edge interrupts, or to not generate an
interrupt.
Depending on the configured mode for each pin, each time an
interrupt event occurs on a pin, its corresponding status bit of the
interrupt status register is set to “1” and an interrupt request is
sent to the interrupt controller. Each PICU has its own interrupt
vector in the interrupt controller and the pin status register
providing easy determination of the interrupt source down to the
pin level.
Port pin interrupts remain active in all sleep modes allowing the
PSoC device to wake from an externally generated interrupt.
While level sensitive interrupts are not directly supported;
universal digital blocks (UDB) provide this functionality to the
system when needed.
6.4.6 Input Buffer Mode
GPIO and SIO input buffers can be configured at the port level
for the default CMOS input thresholds or the optional LVTTL
input thresholds. All input buffers incorporate Schmitt triggers for
input hysteresis. Additionally, individual pin input buffers can be
disabled in any drive mode.
6.4.7 I/O Power Supplies
Up to four I/O pin power supplies are provided depending on the
device and package. Each I/O supply must be less than or equal
to the voltage on the chip’s analog (VDDA) pin. This feature
allows users to provide different I/O voltage levels for different
pins on the device. Refer to the specific device package pinout
to determine VDDIO capability for a given port and pin.
The SIO port pins support an additional regulated high output
capability, as described in Adjustable Output Level.
6.4.8 Analog Connections
These connections apply only to GPIO pins. All GPIO pins may
be used as analog inputs or outputs. The analog voltage present
on the pin must not exceed the VDDIO supply voltage to which
the GPIO belongs. Each GPIO may connect to one of the analog
global busses or to one of the analog mux buses to connect any
pin to any internal analog resource such as ADC or comparators.
In addition, select pins provide direct connections to specific
analog features such as the high current DACs or uncommitted
opamps.
6.4.9 CapSense
This section applies only to GPIO pins. All GPIO pins may be
used to create CapSense buttons and sliders[19]. See the
“CapSense” section on page 63 for more information.
6.4.10 LCD Segment Drive
This section applies only to GPIO pins. All GPIO pins may be
used to generate Segment and Common drive signals for direct
glass drive of LCD glass. See the “LCD Direct Drive” section on
page 62 for details.
6.4.11 Adjustable Output Level
This section applies only to SIO pins. SIO port pins support the
ability to provide a regulated high output level for interface to
external signals that are lower in voltage than the SIO’s
respective VDDIO. SIO pins are individually configurable to
output either the standard VDDIO level or the regulated output,
which is based on an internally generated reference. Typically a
voltage DAC (VDAC) is used to generate the reference (see
Figure 6-13). The “DAC” section on page 64 has more details on
VDAC use and reference routing to the SIO pins. Resistive
pull-up and pull-down drive modes are not available with SIO in
regulated output mode.
6.4.12 Adjustable Input Level
This section applies only to SIO pins. SIO pins by default support
the standard CMOS and LVTTL input levels but also support a
differential mode with programmable levels. SIO pins are
grouped into pairs. Each pair shares a reference generator block
which, is used to set the digital input buffer reference level for
interface to external signals that differ in voltage from VDDIO.
The reference sets the pins voltage threshold for a high logic
level (see Figure 6-13). Available input thresholds are:
0.5 VDDIO
0.4 VDDIO
0.5 VREF
VREF
Typically a voltage DAC (VDAC) generates the VREF reference.
“DAC” section on page 64 has more details on VDAC use and
reference routing to the SIO pins.
Note
19. GPIOs with opamp outputs are not recommended for use with CapSense
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 43 of 137
Figure 6-13. SIO Reference for Input and Output
6.4.13 SIO as Comparator
This section applies only to SIO pins. The adjustable input level
feature of the SIOs as explained in the Adjustable Input Level
section can be used to construct a comparator. The threshold for
the comparator is provided by the SIO's reference generator. The
reference generator has the option to set the analog signal
routed through the analog global line as threshold for the
comparator. Note that a pair of SIO pins share the same
threshold.
The digital input path in Figure 6-10 on page 39 illustrates this
functionality. In the figure, ‘Reference level’ is the analog signal
routed through the analog global. The hysteresis feature can
also be enabled for the input buffer of the SIO, which increases
noise immunity for the comparator.
6.4.14 Hot Swap
This section applies only to SIO pins. SIO pins support ‘hot swap’
capability to plug into an application without loading the signals
that are connected to the SIO pins even when no power is
applied to the PSoC device. This allows the unpowered PSoC to
maintain a high impedance load to the external device while also
preventing the PSoC from being powered through a SIO pin’s
protection diode.
Powering the device up or down while connected to an
operational I2C bus may cause transient states on the SIO pins.
The overall I2C bus design should take this into account.
6.4.15 Over Voltage Tolerance
All I/O pins provide an over voltage tolerance feature at any
operating VDD.
There are no current limitations for the SIO pins as they present a
high impedance load to the external circuit where VDDIO < VIN <
5.5 V.
The GPIO pins must be limited to 100 µA using a current limiting
resistor. GPIO pins clamp the pin voltage to approximately one
diode above the VDDIO supply where VDDIO < VIN < VDDA.
In case of a GPIO pin configured for analog input/output, the
analog voltage on the pin must not exceed the VDDIO supply
voltage to which the GPIO belongs.
A common application for this feature is connection to a bus such
as I2C where different devices are running from different supply
voltages. In the I2C case, the PSoC chip is configured in the
Open Drain, Drives Low mode for the SIO pin. This allows an
external pull-up to pull the I2C bus voltage above the PSoC pin
supply. For example, the PSoC chip can operate at 1.8 V, and an
external device can run from 5 V. Note that the SIO pin’s VIH and
VIL levels are determined by the associated VDDIO supply pin.
The SIO pin must be in one of the following modes: 0 (high
impedance analog), 1 (high impedance digital), or 4 (open drain
drives low). See Figure 6-12 for details. Absolute maximum
ratings for the device must be observed for all I/O pins.
6.4.16 Reset Configuration
While reset is active all I/Os are reset to and held in the High
Impedance Analog state. After reset is released, the state can be
reprogrammed on a port-by-port basis to pull-down or pull-up. To
ensure correct reset operation, the port reset configuration data
is stored in special nonvolatile registers. The stored reset data is
automatically transferred to the port reset configuration registers
at reset release.
6.4.17 Low-Power Functionality
In all low-power modes the I/O pins retain their state until the part
is awakened and changed or reset. To awaken the part, use a
pin interrupt, because the port interrupt logic continues to
function in all low-power modes.
6.4.18 Special Pin Functionality
Some pins on the device include additional special functionality
in addition to their GPIO or SIO functionality. The specific special
function pins are listed in Pinouts on page 6. The special features
are:
Digital
4- to 25-MHz crystal oscillator
32.768-kHz crystal oscillator
Wake from sleep on I2C address match. Any pin can be used
for I2C if wake from sleep is not required.
JTAG interface pins
SWD interface pins
SWV interface pins
External reset
Analog
Opamp inputs and outputs
High current IDAC outputs
External reference inputs
PIN
Drive
Logic
Driver
Vhigh
Reference
Generator
SIO_Ref
Digital
Input
Digital
Output
Input Path
Output Path
Vinref
Voutref
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 44 of 137
6.4.19 JTAG Boundary Scan
The device supports standard JTAG boundary scan chains on all
I/O pins for board level test.
7. Digital Subsystem
The digital programmable system creates application specific
combinations of both standard and advanced digital peripherals
and custom logic functions. These peripherals and logic are then
interconnected to each other and to any pin on the device,
providing a high level of design flexibility and IP security.
The features of the digital programmable system are outlined
here to provide an overview of capabilities and architecture. You
do not need to interact directly with the programmable digital
system at the hardware and register level. PSoC Creator
provides a high level schematic capture graphical interface to
automatically place and route resources similar to PLDs.
The main components of the digital programmable system are:
Universal Digital Blocks (UDB) – These form the core
functionality of the digital programmable system. UDBs are a
collection of uncommitted logic (PLD) and structural logic
(Datapath) optimized to create all common embedded
peripherals and customized functionality that are application or
design specific.
Universal Digital Block Array – UDB blocks are arrayed within
a matrix of programmable interconnect. The UDB array
structure is homogeneous and allows for flexible mapping of
digital functions onto the array. The array supports extensive
and flexible routing interconnects between UDBs and the
Digital System Interconnect.
Digital System Interconnect (DSI) – Digital signals from
Universal Digital Blocks (UDBs), fixed function peripherals, I/O
pins, interrupts, DMA, and other system core signals are
attached to the Digital System Interconnect to implement full
featured device connectivity. The DSI allows any digital function
to any pin or other feature routability when used with the
Universal Digital Block Array.
Figure 7-1. CY8C36 Digital Programmable Architecture
7.1 Example Peripherals
The flexibility of the CY8C36 family’s Universal Digital Blocks
(UDBs) and Analog Blocks allow the user to create a wide range
of components (peripherals). The most common peripherals
were built and characterized by Cypress and are shown in the
PSoC Creator component catalog, however, users may also
create their own custom components using PSoC Creator. Using
PSoC Creator, users may also create their own components for
reuse within their organization, for example sensor interfaces,
proprietary algorithms, and display interfaces.
The number of components available through PSoC Creator is
too numerous to list in the data sheet, and the list is always
growing. An example of a component available for use in
CY8C36 family, but, not explicitly called out in this data sheet is
the UART component.
7.1.1 Example Digital Components
The following is a sample of the digital components available in
PSoC Creator for the CY8C36 family. The exact amount of
hardware resources (UDBs, routing, RAM, flash) used by a
component varies with the features selected in PSoC Creator for
the component.
Communications
I2C
UART
SPI
Functions
EMIF
PWMs
Timers
Counters
Logic
NOT
OR
XOR
AND
7.1.2 Example Analog Components
The following is a sample of the analog components available in
PSoC Creator for the CY8C36 family. The exact amount of
hardware resources (SC/CT blocks, routing, RAM, flash) used
by a component varies with the features selected in PSoC
Creator for the component.
Amplifiers
TIA
PGA
opamp
ADC
Delta-Sigma
DACs
Current
Voltage
PWM
Comparators
Mixers
IO Port
Digital Core System
and Fixed Function Peripherals
UDB Array
UDB Array
IO PortIO Port
IO Port
DSI Routing Interface
DSI Routing Interface
Digital Core System
and Fixed Function Peripherals
UDB UDB UDB UDB
UDB UDB UDB UDB
UDB UDB UDB UDB
UDB UDB UDB UDB
UDB UDB UDB UDB
UDB UDB UDB UDB
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 45 of 137
7.1.3 Example System Function Components
The following is a sample of the system function components
available in PSoC Creator for the CY8C36 family. The exact
amount of hardware resources (UDBs, DFB taps, SC/CT blocks,
routing, RAM, flash) used by a component varies with the
features selected in PSoC Creator for the component.
CapSense
LCD Drive
LCD Control
Filters
7.1.4 Designing with PSoC Creator
7.1.4.1 More Than a Typical IDE
A successful design tool allows for the rapid development and
deployment of both simple and complex designs. It reduces or
eliminates any learning curve. It makes the integration of a new
design into the production stream straightforward.
PSoC Creator is that design tool.
PSoC Creator is a full featured Integrated Development
Environment (IDE) for hardware and software design. It is
optimized specifically for PSoC devices and combines a modern,
powerful software development platform with a sophisticated
graphical design tool. This unique combination of tools makes
PSoC Creator the most flexible embedded design platform
available.
Graphical design entry simplifies the task of configuring a
particular part. You can select the required functionality from an
extensive catalog of components and place it in your design. All
components are parameterized and have an editor dialog that
allows you to tailor functionality to your needs.
PSoC Creator automatically configures clocks and routes the I/O
to the selected pins and then generates APIs to give the
application complete control over the hardware. Changing the
PSoC device configuration is as simple as adding a new
component, setting its parameters, and rebuilding the project.
At any stage of development you are free to change the
hardware configuration and even the target processor. To
retarget your application (hardware and software) to new
devices, even from 8- to 32-bit families, just select the new
device and rebuild.
You also have the ability to change the C compiler and evaluate
an alternative. Components are designed for portability and are
validated against all devices, from all families, and against all
supported tool chains. Switching compilers is as easy as editing
the from the project options and rebuilding the application with
no errors from the generated APIs or boot code.
7.1.4.2 Component Catalog
The component catalog is a repository of reusable design
elements that select device functionality and customize your
PSoC device. It is populated with an impressive selection of
content; from simple primitives such as logic gates and device
registers, through the digital timers, counters and PWMs, plus
analog components such as ADC, DACs, and filters, and
communication protocols, such as I2C, USB, and CAN. See
Example Peripherals on page 44 for more details about available
peripherals. All content is fully characterized and carefully
documented in data sheets with code examples, AC/DC
specifications, and user code ready APIs.
7.1.4.3 Design Reuse
The symbol editor gives you the ability to develop reusable
components that can significantly reduce future design time. Just
draw a symbol and associate that symbol with your proven
design. PSoC Creator allows for the placement of the new
symbol anywhere in the component catalog along with the
content provided by Cypress. You can then reuse your content
as many times as you want, and in any number of projects,
without ever having to revisit the details of the implementation.
7.1.4.4 Software Development
Anchoring the tool is a modern, highly customizable user
interface. It includes project management and integrated editors
for C and assembler source code, as well the design entry tools.
Project build control leverages compiler technology from top
commercial vendors such as ARM® Limited, Keil™, and
CodeSourcery (GNU). Free versions of Keil C51 and GNU C
Compiler (GCC) for ARM, with no restrictions on code size or end
product distribution, are included with the tool distribution.
Upgrading to more optimizing compilers is a snap with support
for the professional Keil C51 product and ARM RealView™
compiler.
7.1.4.5 Nonintrusive Debugging
With JTAG (4-wire) and SWD (2-wire) debug connectivity
available on all devices, the PSoC Creator debugger offers full
control over the target device with minimum intrusion.
Breakpoints and code execution commands are all readily
available from toolbar buttons and an impressive lineup of
windows—register, locals, watch, call stack, memory and
peripherals—make for an unparalleled level of visibility into the
system.
PSoC Creator contains all the tools necessary to complete a
design, and then to maintain and extend that design for years to
come. All steps of the design flow are carefully integrated and
optimized for ease-of-use and to maximize productivity.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 46 of 137
7.2 Universal Digital Block
The universal digital block (UDB) represents an evolutionary
step to the next generation of PSoC embedded digital peripheral
functionality. The architecture in first generation PSoC digital
blocks provides coarse programmability in which a few fixed
functions with a small number of options are available. The new
UDB architecture is the optimal balance between configuration
granularity and efficient implementation. A cornerstone of this
approach is to provide the ability to customize the devices digital
operation to match application requirements.
To achieve this, UDBs consist of a combination of uncommitted
logic (PLD), structured logic (Datapath), and a flexible routing
scheme to provide interconnect between these elements, I/O
connections, and other peripherals. UDB functionality ranges
from simple self contained functions that are implemented in one
UDB, or even a portion of a UDB (unused resources are
available for other functions), to more complex functions that
require multiple UDBs. Examples of basic functions are timers,
counters, CRC generators, PWMs, dead band generators, and
communications functions, such as UARTs, SPI, and I2C. Also,
the PLD blocks and connectivity provide full featured general
purpose programmable logic within the limits of the available
resources.
Figure 7-2. UDB Block Diagram
The main component blocks of the UDB are:
PLD blocks – There are two small PLDs per UDB. These blocks
take inputs from the routing array and form registered or
combinational sum-of-products logic. PLDs are used to
implement state machines, state bits, and combinational logic
equations. PLD configuration is automatically generated from
graphical primitives.
Datapath module – This 8-bit wide datapath contains structured
logic to implement a dynamically configurable ALU, a variety
of compare configurations and condition generation. This block
also contains input/output FIFOs, which are the primary parallel
data interface between the CPU/DMA system and the UDB.
Status and control module – The primary role of this block is to
provide a way for CPU firmware to interact and synchronize
with UDB operation.
Clock and reset module – This block provides the UDB clocks
and reset selection and control.
7.2.1 PLD Module
The primary purpose of the PLD blocks is to implement logic
expressions, state machines, sequencers, lookup tables, and
decoders. In the simplest use model, consider the PLD blocks as
a standalone resource onto which general purpose RTL is
synthesized and mapped. The more common and efficient use
model is to create digital functions from a combination of PLD
and datapath blocks, where the PLD implements only the
random logic and state portion of the function while the datapath
(ALU) implements the more structured elements.
Figure 7-3. PLD 12C4 Structure
One 12C4 PLD block is shown in Figure 7-3. This PLD has 12
inputs, which feed across eight product terms. Each product term
(AND function) can be from 1 to 12 inputs wide, and in a given
product term, the true (T) or complement (C) of each input can
be selected. The product terms are summed (OR function) to
create the PLD outputs. A sum can be from 1 to 8 product terms
wide. The 'C' in 12C4 indicates that the width of the OR gate (in
this case 8) is constant across all outputs (rather than variable
as in a 22V10 device). This PLA like structure gives maximum
flexibility and insures that all inputs and outputs are permutable
for ease of allocation by the software tools. There are two 12C4
PLDs in each UDB.
PLD
12C4
(8 PTs)
PLD
12C4
(8 PTs)
Datapath
Clock
and Reset
Control
Routing Channel
Datapath
Chaining
PLD
Chaining
Status and
Control
PT0
IN0
IN1
IN2
IN3
IN4
IN5
IN6
IN7
IN8
IN9
IN10
IN11
TC TC TC TC TC TC TC TC
TC TC TC TC TC TC TC TC
TC TC TC TC TC TC TC TC
TC TC TC TC TC TC TC TC
TC TC TC TC TC TC TC TC
TC TC TC TC TC TC TC TC
TC TC TC TC TC TC TC TC
TC TC TC TC TC TC TC TC
TC TC TC TC TC TC TC TC
TC TC TC TC TC TC TC TC
TC TC TC TC TC TC TC TC
TC TC TC TC TC TC TC TC
PT1
PT2
PT3
PT4
PT5
PT6
PT7
TTTTTTTT
TTTTTTTT
TTTTTTTT
TTTTTTTT
AND
Array
OR
Array
MC0
MC1
MC2
OUT0
OUT1
OUT2
OUT3
MC3
Carry In
Carry Out
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 47 of 137
7.2.2 Datapath Module
The datapath contains an 8-bit single cycle ALU, with associated compare and condition generation logic. This datapath block is
optimized to implement embedded functions, such as timers, counters, integrators, PWMs, PRS, CRC, shifters and dead band
generators and many others.
Figure 7-4. Datapath Top Level
7.2.2.1 Working Registers
The datapath contains six primary working registers, which are
accessed by CPU firmware or DMA during normal operation.
7.2.2.2 Dynamic Configuration RAM
Dynamic configuration is the ability to change the datapath
function and internal configuration on a cycle-by-cycle basis,
under sequencer control. This is implemented using the
8-word × 16-bit configuration RAM, which stores eight unique
16-bit wide configurations. The address input to this RAM
controls the sequence, and can be routed from any block
connected to the UDB routing matrix, most typically PLD logic,
I/O pins, or from the outputs of this or other datapath blocks.
ALU
The ALU performs eight general purpose functions. They are:
Increment
Decrement
Add
Subtract
Logical AND
Logical OR
Logical XOR
Pass, used to pass a value through the ALU to the shift register,
mask, or another UDB register
A0
A1
D0
D1
PI
ALU
Mask
Shift
Data Registers
Output
Muxes
F1
F0
FIFOs
Accumulators
PO
A0
A1
D0
D1
Output to
Programmable
Routing
Chaining
Dynamic Configuration RAM
8 Word X 16 Bit
Parallel Input/Output
(To/From Programmable Routing)
Input from
Programmable
Routing
Input
Muxes
To/From
Next
Datapath
To/From
Previous
Datapath
Datapath Control
PHUB System Bus
R/W Access to All
Registers
Conditions: 2 Compares,
2 Zero Detect, 2 Ones
Detect Overflow Detect
6
6
Table 7-1. Working Datapath Registers
Name Function Description
A0 and A1 Accumulators These are sources and sinks for
the ALU and also sources for the
compares.
D0 and D1 Data Registers These are sources for the ALU
and sources for the compares.
F0 and F1 FIFOs These are the primary interface
to the system bus. They can be a
data source for the data registers
and accumulators or they can
capture data from the
accumulators or ALU. Each FIFO
is four bytes deep.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 48 of 137
Independent of the ALU operation, these functions are available:
Shift left
Shift right
Nibble swap
Bitwise OR mask
7.2.2.3 Conditionals
Each datapath has two compares, with bit masking options.
Compare operands include the two accumulators and the two
data registers in a variety of configurations. Other conditions
include zero detect, all ones detect, and overflow. These
conditions are the primary datapath outputs, a selection of which
can be driven out to the UDB routing matrix. Conditional
computation can use the built in chaining to neighboring UDBs
to operate on wider data widths without the need to use routing
resources.
7.2.2.4 Variable MSB
The most significant bit of an arithmetic and shift function can be
programmatically specified. This supports variable width CRC
and PRS functions, and in conjunction with ALU output masking,
can implement arbitrary width timers, counters and shift blocks.
7.2.2.5 Built in CRC/PRS
The datapath has built in support for single cycle CRC
computation and PRS generation of arbitrary width and arbitrary
polynomial. CRC/PRS functions longer than 8 bits may be
implemented in conjunction with PLD logic, or built in chaining
may be use to extend the function into neighboring UDBs.
7.2.2.6 Input/Output FIFOs
Each datapath contains two four-byte deep FIFOs, which can be
independently configured as an input buffer (system bus writes
to the FIFO, datapath internal reads the FIFO), or an output
buffer (datapath internal writes to the FIFO, the system bus reads
from the FIFO). The FIFOs generate status that are selectable
as datapath outputs and can therefore be driven to the routing,
to interact with sequencers, interrupts, or DMA.
Figure 7-5. Example FIFO Configurations
7.2.2.7 Chaining
The datapath can be configured to chain conditions and signals
such as carries and shift data with neighboring datapaths to
create higher precision arithmetic, shift, CRC/PRS functions.
7.2.2.8 Time Multiplexing
In applications that are over sampled, or do not need high clock
rates, the single ALU block in the datapath can be efficiently
shared with two sets of registers and condition generators. Carry
and shift out data from the ALU are registered and can be
selected as inputs in subsequent cycles. This provides support
for 16-bit functions in one (8-bit) datapath.
7.2.2.9 Datapath I/O
There are six inputs and six outputs that connect the datapath to
the routing matrix. Inputs from the routing provide the
configuration for the datapath operation to perform in each cycle,
and the serial data inputs. Inputs can be routed from other UDB
blocks, other device peripherals, device I/O pins, and so on. The
outputs to the routing can be selected from the generated
conditions, and the serial data outputs. Outputs can be routed to
other UDB blocks, device peripherals, interrupt and DMA
controller, I/O pins, and so on.
7.2.3 Status and Control Module
The primary purpose of this circuitry is to coordinate CPU
firmware interaction with internal UDB operation.
Figure 7-6. Status and Control Registers
The bits of the control register, which may be written to by the
system bus, are used to drive into the routing matrix, and thus
provide firmware with the opportunity to control the state of UDB
processing. The status register is read-only and it allows internal
UDB state to be read out onto the system bus directly from
internal routing. This allows firmware to monitor the state of UDB
processing. Each bit of these registers has programmable
connections to the routing matrix and routing connections are
made depending on the requirements of the application.
7.2.3.1 Usage Examples
As an example of control input, a bit in the control register can
be allocated as a function enable bit. There are multiple ways to
enable a function. In one method the control bit output would be
routed to the clock control block in one or more UDBs and serve
as a clock enable for the selected UDB blocks. A status example
is a case where a PLD or datapath block generated a condition,
such as a “compare true” condition that is captured and latched
by the status register and then read (and cleared) by CPU
firmware.
7.2.3.2 Clock Generation
Each subcomponent block of a UDB including the two PLDs, the
datapath, and Status and Control, has a clock selection and
control block. This promotes a fine granularity with respect to
allocating clocking resources to UDB component blocks and
allows unused UDB resources to be used by other functions for
maximum system efficiency.
System Bus
F0
F1
System Bus
A0/A1/ALU
D0/D1
A0/A1/ALU
System Bus
F1
A0/A1/ALU
F0
D0
System Bus
F1
A0
D1
A1
F0
TX/RX Dual Capture Dual Buffer
Routing Channel
8-bit Status Register
(Read Only)
8-bit Control Register
(Write/Read)
System Bus
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 49 of 137
7.3 UDB Array Description
Figure 7-7 shows an example of a 16-UDB array. In addition to
the array core, there are a DSI routing interfaces at the top and
bottom of the array. Other interfaces that are not explicitly shown
include the system interfaces for bus and clock distribution. The
UDB array includes multiple horizontal and vertical routing
channels each comprised of 96 wires. The wire connections to
UDBs, at horizontal/vertical intersection and at the DSI interface
are highly permutable providing efficient automatic routing in
PSoC Creator. Additionally the routing allows wire by wire
segmentation along the vertical and horizontal routing to further
increase routing flexibility and capability.
Figure 7-7. Digital System Interface Structure
7.3.1 UDB Array Programmable Resources
Figure 7-8 shows an example of how functions are mapped into
a bank of 16 UDBs. The primary programmable resources of the
UDB are two PLDs, one datapath and one status/control register.
These resources are allocated independently, because they
have independently selectable clocks, and therefore unused
blocks are allocated to other unrelated functions.
An example of this is the 8-bit Timer in the upper left corner of
the array. This function only requires one datapath in the UDB,
and therefore the PLD resources may be allocated to another
function. A function such as a Quadrature Decoder may require
more PLD logic than one UDB can supply and in this case can
utilize the unused PLD blocks in the 8-bit Timer UDB.
Programmable resources in the UDB array are generally
homogeneous so functions can be mapped to arbitrary
boundaries in the array.
Figure 7-8. Function Mapping Example in a Bank of UDBs
7.4 DSI Routing Interface Description
The DSI routing interface is a continuation of the horizontal and
vertical routing channels at the top and bottom of the UDB array
core. It provides general purpose programmable routing
between device peripherals, including UDBs, I/Os, analog
peripherals, interrupts, DMA and fixed function peripherals.
Figure 7-9 illustrates the concept of the digital system
interconnect, which connects the UDB array routing matrix with
other device peripherals. Any digital core or fixed function
peripheral that needs programmable routing is connected to this
interface.
Signals in this category include:
Interrupt requests from all digital peripherals in the system.
DMA requests from all digital peripherals in the system.
Digital peripheral data signals that need flexible routing to I/Os.
Digital peripheral data signals that need connections to UDBs.
Connections to the interrupt and DMA controllers.
Connection to I/O pins.
Connection to analog system digital signals.
UDB
UDB
HV
B
UDB
UDB
HV
A
UDB
UDB
HV
B
HV
A
UDB
UDB
HV
A
UDB
UDB
HV
B
UDB
UDB
HV
A
HV
B
HV
B
HV
A
HV
B
HV
A
HV
A
HV
B
HV
A
HV
B
UDB
UDB
UDB
UDB
System Connections
System Connections
UDB
UDB
HV
B
UDB
UDB
HV
A
UDB
UDB
HV
B
HV
A
UDB
HV
A
UDB
HV
B
UDB
HV
A
HV
B
UDB
UDB
UDBUDB UDB UDB
UART
Logic
12-Bit PWM
I2C Slave
8-Bit SPI
12-Bit SPI
Logic
8-Bit
Timer
16-Bit PYRS
UDB
8-Bit
Timer
Quadrature Decoder 16-Bit
PWM
Sequencer
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 50 of 137
Figure 7-9. Digital System Interconnect
Interrupt and DMA routing is very flexible in the CY8C36
programmable architecture. In addition to the numerous fixed
function peripherals that can generate interrupt requests, any
data signal in the UDB array routing can also be used to generate
a request. A single peripheral may generate multiple
independent interrupt requests simplifying system and firmware
design. Figure 7-10 shows the structure of the IDMUX
(Interrupt/DMA Multiplexer).
Figure 7-10. Interrupt and DMA Processing in the IDMUX
7.4.1 I/O Port Routing
There are a total of 20 DSI routes to a typical 8-bit I/O port, 16
for data and four for drive strength control.
When an I/O pin is connected to the routing, there are two
primary connections available, an input and an output. In
conjunction with drive strength control, this can implement a
bidirectional I/O pin. A data output signal has the option to be
single synchronized (pipelined) and a data input signal has the
option to be double synchronized. The synchronization clock is
the master clock (see Figure 6-1 on page 28). Normally all inputs
from pins are synchronized as this is required if the CPU
interacts with the signal or any signal derived from it.
Asynchronous inputs have rare uses. An example of this is a
feed through of combinational PLD logic from input pins to output
pins.
Figure 7-11. I/O Pin Synchronization Routing
Figure 7-12. I/O Pin Output Connectivity
There are four more DSI connections to a given I/O port to
implement dynamic output enable control of pins. This
connectivity gives a range of options, from fully ganged 8-bits
controlled by one signal, to up to four individually controlled pins.
The output enable signal is useful for creating tri-state
bidirectional pins and buses.
UDB ARRAY
Digital System Routing I/F
Digital System Routing I/F
CAN Interrupt
Controller
I2C IO Port
Pins
DMA
Controller
IO Port
Pins Del-Sig ComparatorsDACs
SC/CT
Blocks
Global
Clocks
EMIF
Global
Clocks
Timer
Counters
DMA termout (IRQs)
DMA
Controller
Interrupt
Controller
Fixed Function IRQs
Edge
Detect
Edge
Detect
IRQs
UDB Array
Fixed Function DRQs
DRQs
Interrupt and DMA Processing in IDMUX
0
1
2
3
0
1
2
DO
DI
Port i
PIN 0
DO PIN1
DO PIN2
DO PIN3
DO PIN4
DO PIN5
DO PIN6
DO PIN7
DO
8 IO Data Output Connections from the
UDB Array Digital System Interface
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 51 of 137
Figure 7-13. I/O Pin Output Enable Connectivity 7.5 CAN
The CAN peripheral is a fully functional CAN supporting
communication baud rates up to 1 Mbps. The CAN controller
implements the CAN2.0A and CAN2.0B specifications as
defined in the Bosch specification and conforms to the
ISO-11898-1 standard. The CAN protocol was originally
designed for automotive applications with a focus on a high level
of fault detection. This ensures high communication reliability at
a low cost. Because of its success in automotive applications,
CAN is used as a standard communication protocol for motion
oriented machine control networks (CANOpen) and factory
automation applications (DeviceNet). The CAN controller
features allow the efficient implementation of higher level
protocols without affecting the performance of the
microcontroller CPU. Full configuration support is provided in
PSoC Creator.
Figure 7-14. CAN Bus System Implementation
7.5.1 CAN Features
CAN2.0A/B protocol implementation – ISO 11898 compliant
Standard and extended frames with up to 8 bytes of data per
frame
Message filter capabilities
Remote Transmission Request (RTR) support
Programmable bit rate up to 1 Mbps
Listen Only mode
SW readable error counter and indicator
Sleep mode: Wake the device from sleep with activity on the
Rx pin
Supports two or three wire interface to external transceiver (Tx,
Rx, and Enable). The three-wire interface is compatible with
the Philips PHY; the PHY is not included on-chip. The three
wires can be routed to any I/O
Enhanced interrupt controller
CAN receive and transmit buffers status
CAN controller error status including BusOff
Receive path
16 receive buffers each with its own message filter
Enhanced hardware message filter implementation that
covers the ID, IDE, and RTR
DeviceNet addressing support
Multiple receive buffers linkable to build a larger receive
message array
Automatic transmission request (RTR) response handler
Lost received message notification
Transmit path
Eight transmit buffers
Programmable transmit priority
• Round robin
•Fixed priority
Message transmissions abort capability
7.5.2 Software Tools Support
CAN Controller configuration integrated into PSoC Creator:
CAN Configuration walkthrough with bit timing analyzer
Receive filter setup
Port i
PIN 0
OE
PIN1
OE
PIN2
OE
PIN3
OE
PIN4
OE
PIN5
OE
PIN6
OE
PIN7
OE
4 IO Control Signal Connections from
UDB Array Digital System Interface
CAN Node 1
PSoC
CAN Controller
CAN Transceiver
Tx RxEn
CAN Node 2 CAN Node n
CAN_H CAN_L CAN_H CAN_L CAN_H CAN_L
CAN
Drivers
CAN Bus
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 52 of 137
Figure 7-15. CAN Controller Block Diagram
TxMessage0
TxReq
TxAbort
TxMessage7
TxReq
TxAbort
TxMessage1
TxReq
TxAbort
TxMessage6
TxReq
TxAbort
Priority
Arbiter
RxMessage0
RxMessage15
RxMessage1
RxMessage14
RxMessage
Handler
Acceptance Code 0 Acceptance Mask 0
Acceptance Code 1 Acceptance Mask 1
Acceptance Code 14 Acceptance Mask 14
Acceptance Code 15 Acceptance Mask 15
RTR RxMessages
0-15
Tx
CAN
Framer
CRC
Generator
Rx
CAN
Framer
CRC Check
Bit Timing
Error Detection
CRC
Form
ACK
Bit Stuffing
Bit Error
Overload
Arbitration
TxInterrupt
Request
(if enabled)
RxInterrupt
Request
(if enabled)
Error Status
Error Active
Error Passive
Bus Off
Tx Error Counter
Rx Error Counter
ErrInterrupt
Request
(if enabled)
WakeUp
Request
Rx Buffer
Status
RxMessage
Available
Tx Buffer
Status
TxReq
Pending
Rx
Tx
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 53 of 137
7.6 USB
PSoC includes a dedicated Full-Speed (12 Mbps) USB 2.0
transceiver supporting all four USB transfer types: control,
interrupt, bulk, and isochronous. PSoC Creator provides full
configuration support. USB interfaces to hosts through two
dedicated USBIO pins, which are detailed in the “I/O System and
Routing” section on page 37.
USB includes the following features:
Eight unidirectional data endpoints
One bidirectional control endpoint 0 (EP0)
Shared 512-byte buffer for the eight data endpoints
Dedicated 8-byte buffer for EP0
Three memory modes
Manual Memory Management with No DMA Access
Manual Memory Management with Manual DMA Access
Automatic Memory Management with Automatic DMA
Access
Internal 3.3-V regulator for transceiver
Internal 48-MHz main oscillator mode that auto locks to USB
bus clock, requiring no external crystal for USB (USB equipped
parts only)
Interrupts on bus and each endpoint event, with device wakeup
USB reset, suspend, and resume operations
Bus-powered and self-powered modes
Figure 7-16. USB
7.7 Timers, Counters, and PWMs
The Timer/Counter/PWM peripheral is a 16-bit dedicated
peripheral providing three of the most common embedded
peripheral features. As almost all embedded systems use some
combination of timers, counters, and PWMs. Four of them have
been included on this PSoC device family. Additional and more
advanced functionality timers, counters, and PWMs can also be
instantiated in Universal Digital Blocks (UDBs) as required.
PSoC Creator allows you to choose the timer, counter, and PWM
features that they require. The tool set utilizes the most optimal
resources available.
The Timer/Counter/PWM peripheral can select from multiple
clock sources, with input and output signals connected through
the DSI routing. DSI routing allows input and output connections
to any device pin and any internal digital signal accessible
through the DSI. Each of the four instances has a compare
output, terminal count output (optional complementary compare
output), and programmable interrupt request line. The
Timer/Counter/PWMs are configurable as free running, one shot,
or Enable input controlled. The peripheral has timer reset and
capture inputs, and a kill input for control of the comparator
outputs. The peripheral supports full 16-bit capture.
Timer/Counter/PWM features include:
16-bit Timer/Counter/PWM (down count only)
Selectable clock source
PWM comparator (configurable for LT, LTE, EQ, GTE, GT)
Period reload on start, reset, and terminal count
Interrupt on terminal count, compare true, or capture
Dynamic counter reads
Timer capture mode
Count while enable signal is asserted mode
Free run mode
One Shot mode (stop at end of period)
Complementary PWM outputs with deadband
PWM output kill
Figure 7-17. Timer/Counter/PWM
S I E
(Serial Interface
Engine)
48 MHz
IMO
Arbiter 512 X 8
SRAM
USB
I/O
D+
D–
Interrupts
System Bus
External 22
Resistors
Timer / Counter /
PWM 16-bit
Clock
Reset
Enable
Capture
Kill
IRQ
Compare
TC / Compare!
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 54 of 137
7.8 I2C
PSoC includes a single fixed-function I2C peripheral. Additional
I2C interfaces can be instantiated using Universal Digital Blocks
(UDBs) in PSoC Creator, as required.
The I2C peripheral provides a synchronous two-wire interface
designed to interface the PSoC device with a two-wire I2C serial
communication bus. It is compatible[20] with I2C Standard-mode,
Fast-mode, and Fast-mode Plus devices as defined in the NXP
I2C-bus specification and user manual (UM10204). The I2C bus
I/O may be implemented with GPIO or SIO in open-drain modes.
To eliminate the need for excessive CPU intervention and
overhead, I2C specific support is provided for status detection
and generation of framing bits. I2C operates as a slave, a master,
or multimaster (Slave and Master)[21]. In slave mode, the unit
always listens for a start condition to begin sending or receiving
data. Master mode supplies the ability to generate the Start and
Stop conditions and initiate transactions. Multimaster mode
provides clock synchronization and arbitration to allow multiple
masters on the same bus. If Master mode is enabled and Slave
mode is not enabled, the block does not generate interrupts on
externally generated Start conditions. I2C interfaces through DSI
routing and allows direct connections to any GPIO or SIO pins.
I2C provides hardware address detect of a 7-bit address without
CPU intervention. Additionally the device can wake from
low-power modes on a 7-bit hardware address match. If wakeup
functionality is required, I2C pin connections are limited to one of
two specific pairs of SIO pins. See descriptions of SCL and SDA
pins in Pin Descriptions on page 12.
I2C features include:
Slave and master, transmitter, and receiver operation
Byte processing for low CPU overhead
Interrupt or polling CPU interface
Support for bus speeds up to 1 Mbps
7 or 10-bit addressing (10-bit addressing requires firmware
support)
SMBus operation (through firmware support – SMBus
supported in hardware in UDBs)
7-bit hardware address compare
Wake from low-power modes on address match
Glitch filtering (active and alternate-active modes only)
Data transfers follow the format shown in Figure 7-18. After the
START condition (S), a slave address is sent. This address is 7
bits long followed by an eighth bit which is a data direction bit
(R/W) - a 'zero' indicates a transmission (WRITE), a 'one'
indicates a request for data (READ). A data transfer is always
terminated by a STOP condition (P) generated by the master.
Figure 7-18. I2C Complete Transfer Timing
7.8.1 External Electrical Connections
As Figure 7-19 shows, the I2C bus requires external pull-up
resistors (RP). These resistors are primarily determined by the
supply voltage, bus speed, and bus capacitance. For detailed
information on how to calculate the optimum pull-up resistor
value for your design, we recommend using the UM10204
I2C-bus specification and user manual Rev 6, or newer, available
from the NXP website at www.nxp.com.
Figure 7-19. Connection of Devices to the I2C Bus
Notes
20. The I2C peripheral is non-compliant with the NXP I2C specification in the following areas: analog glitch filter, I/O VOL/IOL, I/O hysteresis. The I2C Block has a digital
glitch filter (not available in sleep mode). The Fast-mode minimum fall-time specification can be met by setting the I/Os to slow speed mode. See the I/O Electrical
Specifications in “Inputs and Outputs” section on page 80 for details.
21. Fixed-block I2C does not support undefined bus conditions, nor does it support Repeated Start in Slave mode. These conditions should be avoided, or the UDB-based
I2C component should be used instead.
SDA
SCL 1 - 7 8 9 1 - 7 8 9 1 - 7 8 9
START
Condition ADDRESS R/W ACK DATA ACK DATA ACK STOP
Condition
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 55 of 137
For most designs, the default values in Tab le 7 -2 will provide
excellent performance without any calculations. The default
values were chosen to use standard resistor values between the
minimum and maximum limits. The values in Ta b l e 7 - 2 work for
designs with 1.8 V to 5.0V VDD, less than 200-pF bus capaci-
tance (CB), up to 25 µA of total input leakage (IIL), up to 0.4 V
output voltage level (VOL), and a max VIH of 0.7 * VDD. Standard
Mode and Fast Mode can use either GPIO or SIO PSoC pins.
Fast Mode Plus requires use of SIO pins to meet the VOL spec
at 20 mA. Calculation of custom pull-up resistor values is
required; if your design does not meet the default assumptions,
you use series resistors (RS) to limit injected noise, or you need
to maximize the resistor value for low power consumption.
Calculation of the ideal pull-up resistor value involves finding a
value between the limits set by three equations detailed in the
NXP I2C specification. These equations are:
Equation 1:
Equation 2:
Equation 3:
Equation parameters:
VDD = Nominal supply voltage for I2C bus
VOL = Maximum output low voltage of bus devices.
IOL= Low-level output current from I2C specification
TR = Rise Time of bus from I2C specification
CB = Capacitance of each bus line including pins and PCB traces
VIH = Minimum high-level input voltage of all bus devices
VNH = Minimum high-level input noise margin from I2C specifi-
cation
IIH = Total input leakage current of all devices on the bus
The supply voltage (VDD) limits the minimum pull-up resistor
value due to bus devices maximum low output voltage (VOL)
specifications. Lower pull-up resistance increases current
through the pins and can, therefore, exceed the spec conditions
of VOL. Equation 1 is derived using Ohm's law to determine the
minimum resistance that will still meet the VOL specification at
3 mA for standard and fast modes, and 20 mA for fast mode plus
at the given VDD.
Equation 2 determines the maximum pull-up resistance due to
bus capacitance. Total bus capacitance is comprised of all pin,
wire, and trace capacitance on the bus. The higher the bus
capacitance, the lower the pull-up resistance required to meet
the specified bus speeds rise time due to RC delays. Choosing
a pull-up resistance higher than allowed can result in failing
timing requirements resulting in communication errors. Most
designs with five or less I2C devices and up to 20 centimeters of
bus trace length have less than 100 pF of bus capacitance.
A secondary effect that limits the maximum pull-up resistor value
is total bus leakage calculated in Equation 3. The primary source
of leakage is I/O pins connected to the bus. If leakage is too high,
the pull-ups will have difficulty maintaining an acceptable VIH
level causing communication errors. Most designs with five or
less I2C devices on the bus have less than 10 µA of total leakage
current.
Table 7-2. Recommended default Pull-up Resistor Values
RPUnits
Standard Mode – 100 kbps 4.7 k, 5%
Fast Mode – 400 kbps 1.74 k, 1%
Fast Mode Plus – 1 Mbps 620, 5%
RPMIN VDD maxVOL
–maxIOL min=
RPMAX TRmax0.8473 CBmax=
RPMAX VDD minVIH min–VNH minIIH max+=
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 56 of 137
7.9 Digital Filter Block
Some devices in the CY8C36 family of devices have a dedicated
HW accelerator block used for digital filtering. The DFB has a
dedicated multiplier and accumulator that calculates a 24-bit by
24-bit multiply accumulate in one bus clock cycle. This enables
the mapping of a direct form FIR filter that approaches a
computation rate of one FIR tap for each clock cycle. The MCU
can implement any of the functions performed by this block, but
at a slower rate that consumes MCU bandwidth.
The heart of the DFB is a datapath (DP), which is the numerical
calculation unit of the DFB. The DP is a 24-bit fixed-point
numerical processor containing a 48-bit multiply and accumulate
function (MAC), a multi-function ALU, sample and coefficient
data RAMs as well as data routing, shifting, holding and rounding
functions.
In the MAC, two 24-bit values can be multiplied and the result
added to the 48-bit accumulator in each bus clock cycle. The
MAC is the only portion of the DP that is wider than 24 bits. All
results from the MAC are passed on to the ALU as 24-bit values
representing the high-order 24 bits in the accumulator shifted by
one (bits 46:23). The MAC assumes an implied binary point after
the most significant bit.
The DP also contains an optimized ALU that supports add,
subtract, comparison, threshold, absolute value, squelch,
saturation, and other functions. The DP unit is controlled by
seven control fields totaling 18 bits coming from the DFB
Controller. For more information see the TRM.
The PSoC Creator interface provides a wizard to implement FIR
and IIR digital filters with coefficients for LPF, BPF, HPF, Notch
and arbitrary shape filters. 64 pairs of data and coefficients are
stored. This enables a 64 tap FIR filter or up to 4 16 tap filters of
either FIR or IIR formulation.
Figure 7-20. DFB Application Diagram (pwr/gnd not shown)
The typical use model is for data to be supplied to the DFB over
the system bus from another on-chip system data source such
as an ADC. The data typically passes through main memory or
is directly transferred from another chip resource through DMA.
The DFB processes this data and passes the result to another
on chip resource such as a DAC or main memory through DMA
on the system bus.
Data movement in or out of the DFB is typically controlled by the
system DMA controller but can be moved directly by the MCU.
8. Analog Subsystem
The analog programmable system creates application specific
combinations of both standard and advanced analog signal
processing blocks. These blocks are then interconnected to
each other and also to any pin on the device, providing a high
level of design flexibility and IP security. The features of the
analog subsystem are outlined here to provide an overview of
capabilities and architecture.
Flexible, configurable analog routing architecture provided by
analog globals, analog mux bus, and analog local buses.
High resolution Delta-Sigma ADC.
Up to four 8-bit DACs that provide either voltage or current
output.
Four comparators with optional connection to configurable LUT
outputs.
Up to four configurable switched capacitor/continuous time
(SC/CT) blocks for functions that include opamp, unity gain
buffer, programmable gain amplifier, transimpedance amplifier,
and mixer.
Up to four opamps for internal use and connection to GPIO that
can be used as high current output buffers.
CapSense subsystem to enable capacitive touch sensing.
Precision reference for generating an accurate analog voltage
for internal analog blocks.
Digital Filter
Block
write_data
read_data
System
Bus
DMA
CTRL
Data
Source
(PHUB)
Data
Dest
(PHUB)
addr
Digital
Routing
BUSCLK
DMA
Request
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 57 of 137
Figure 8-1. Analog Subsystem Block Diagram
The PSoC Creator software program provides a user friendly
interface to configure the analog connections between the GPIO
and various analog resources and connections from one analog
resource to another. PSoC Creator also provides component
libraries that allow you to configure the various analog blocks to
perform application specific functions (PGA, transimpedance
amplifier, voltage DAC, current DAC, and so on). The tool also
generates API interface libraries that allow you to write firmware
that allows the communication between the analog peripheral
and CPU/Memory.
8.1 Analog Routing
The CY8C36 family of devices has a flexible analog routing
architecture that provides the capability to connect GPIOs and
different analog blocks, and also route signals between different
analog blocks. One of the strong points of this flexible routing
architecture is that it allows dynamic routing of input and output
connections to the different analog blocks.
For information on how to make pin selections for optimal analog
routing, refer to the application note, AN58304 - PSoC® 3 and
PSoC® 5 - Pin Selection for Analog Designs.
8.1.1 Features
Flexible, configurable analog routing architecture
16 analog globals (AG) and two analog mux buses
(AMUXBUS) to connect GPIOs and the analog blocks
Each GPIO is connected to one analog global and one analog
mux bus
Eight analog local buses (abus) to route signals between the
different analog blocks
Multiplexers and switches for input and output selection of the
analog blocks
8.1.2 Functional Description
Analog globals (AGs) and analog mux buses (AMUXBUS)
provide analog connectivity between GPIOs and the various
analog blocks. There are 16 AGs in the CY8C36 family. The
analog routing architecture is divided into four quadrants as
shown in Figure 8-2. Each quadrant has four analog globals
(AGL[0..3], AGL[4..7], AGR[0..3], AGR[4..7]). Each GPIO is
connected to the corresponding AG through an analog switch.
The analog mux bus is a shared routing resource that connects
to every GPIO through an analog switch. There are two
AMUXBUS routes in CY8C36, one in the left half (AMUXBUSL)
and one in the right half (AMUXBUSR), as shown in Figure 8-2.
Analog
Interface
Precision
Reference
SC/CT Block
CMP CMPCMPCMP
CapSense Subsystem
DSI
Array
Clock
Distribution Decimator
Config &
Status
Registers PHUB CPU
Comparators
GPIO
Port
GPIO
Port
DAC
DAC
DelSig
ADC
DAC DAC
Op
Amp
Op
Amp
A
N
A
L
O
G
R
O
U
T
I
N
G
A
N
A
L
O
G
R
O
U
T
I
N
G
Op
Amp
Op
Amp
SC/CT Block
SC/CT Block
SC/CT Block
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 58 of 137
Figure 8-2. CY8C36 Analog Interconnect
Vddio0
SIO
P12[3]
SIO
P12[2]
GPIO
P15[3]
GPIO
P15[2]
SIO
P12[1]
SIO
P12[0]
GPIO
P3[7]
GPIO
P3[6]
Vddio3
Vccd
Vssd
Vddd
GPIO
P6[0]
GPIO
P6[3]
GPIO
P6[2]
GPIO
P6[1]
GPIO
P15[4]
GPIO
P15[5]
GPIO
P2[0]
GPIO
P2[4]
GPIO
P2[3]
GPIO
P2[2]
GPIO
P2[1]
Vddio2
GPIO
P2[5]
GPIO
P2[7]
GPIO
P2[6]
SIO
P12[4]
SIO
P12[5]
GPIO
P6[4]
GPIO
P6[5]
GPIO
P6[6]
GPIO
P6[7]
Vddio1
SIO
P12[6]
SIO
P12[7]
USB IO
P15[6]
USB IO
P15[7]
Vddd
Vssd
Vccd
GPXT
P15[0]
GPXT
P15[1]
GPIO
P3[5]
GPIO
P3[4]
GPIO
P3[3]
GPIO
P3[2]
GPIO
P3[1]
AGR[4]
AGR[7]
AGR[6]
AGR[5]
AGL[0]
AGL[3]
AGL[2]
AGL[1]
AGR[0]
AGR[3]
AGR[2]
AGR[1]
***
*
*
*
*
**
*
*
* Denotes pins on all packages
DSM
v0
v2
v1
v3
i1
i3
i0
i2
VIDAC
76543210
76543210
76543210
76543210
comp0
comp2
comp1
comp3
COMPARATOR
AGL[4]
AGL[7]
AGL[6]
AGL[5]
AGL[0]
AGL[3]
AGL[2]
AGL[1]
AGR[0]
AGR[3]
AGR[2]
AGR[1]
AGR[4]
AGR[7]
AGR[6]
AGR[5]
Notes:
AMUXBUSR
AMUXBUSL
i1
i3
i2
i0
Rev #60
13-Feb-2012
opamp0
Vssa
Vssd
Vcca
GPIO
P0[5]
*
GPIO
P0[7] *
GPIO
P1[3]
GPIO
P1[2]
GPIO
P1[1]
GPIO
P1[0]
**
**
GPIO
P1[4] *
GPIO
P1[5] *
GPIO
P1[6]
*
GPIO
P1[7]
*
GPIO
P5[7]
GPIO
P5[6]
GPIO
P5[5]
GPIO
P5[4]
GPIO
P4[4]
GPIO
P4[7]
GPIO
P4[6]
GPIO
P4[5]
GPIO
P5[2]
GPIO
P5[3]
GPIO
P5[1]
GPIO
P5[0]
GPIO
P4[3]
GPIO
P4[2]
ABUSL0
*
*
**
*
*
*
*
*
*
*
*
*
*
*
AGL[4]
AGL[7]
AGL[6]
AGL[5]
GPIO
P4[0]
GPIO
P4[1]
vssa
AMUXBUSL AMUXBUSR
AMUXBUSL
AMUXBUSR
AMUXBUSL AMUXBUSR
ABUSL1
ABUSL2
ABUSL3 ABUSR3
ABUSR2
ABUSR1
ABUSR0
ExVrefL
ExVrefR
Ind
Vssb
Vboost
XRES
Vssd
*
*
*
*
Vbat
ExVrefRExVrefL
+
-
qtz_ref refs
GPIO
P3[0]
GPIO
P0[6] *LPF
in0
out0
in1
out1
sc0 sc1
sc2 sc3
Vin
Vref
out
out
out
SC/CT
out
Mux Group
Switch Group
Connection
Large ( ~200 Ohms)
Small ( ~870 Ohms )
Switch Resistance
Vin
Vref
Vin
Vref
Vin
Vref
Vss ref
TS
ADC
GPIO
P0[0]
*
GPIO
P0[1]
*
GPIO
P0[2]
*
GPIO
P0[3]
*
GPIO
P0[4]
*
AMUXBUSR
AMUXBUSL
ANALOG
GLOBALS
ANALOG
BUS
0123 3210
ANALOG
BUS
ANALOG
GLOBALS
refbufr
refbufl
in
out
ref
in
out
ref
vssa
CAPSENSE
Vssa
ExVrefL1
opamp2 opamp3 opamp1
ExVrefL2
cmp0_vref
(1.024V)
vref_cmp1
(0.256V)
Vdda
sc0_bgref
(1.024V)
refbuf_vref1 (1.024V)
refbuf_vref2 (1.2V)
dac_vref (0.256V)
dsm0_vcm_vref1 (0.8V)
dsm0_qtz_vref2 (1.2V)
abuf_vref_int
(1.024V)
32100123
LCD signals are not shown.
*
:
Vdda
*
VBE
vref_vss_ext
sc2_bgref
(1.024V)
sc1_bgref
(1.024V)
sc3_bgref
(1.024V)
dsm0_vcm_vref2 (0.7V)
vcmsel[1:0]
Vdda/3
Vdda/4
refmux[2:0]
dsm0_qtz_vref1 (1.024V)
vcm
DAC0
DAC2
DAC1
DAC3
DSM0
+
-+
-
+
-
+
-
cmp_muxvn[1:0]
Vdda/2
bg_vda_swabusl0
cmp1_vref
cmp1_vref
cmp1_vref
refsel[1:0]
refbufl_
cmp
refbufr_
cmp
cmp0_vref
(1.024V)
abuf_vref_int
(1.024V)
bg_vda_res_en
refbuf_vref1 (1.024V)
refbuf_vref2 (1.2V)
refsel[1:0]
swout
swin
swout
swin
swfol swfol
swfol swfol
swinn
swinn
swinp
swinp
swinp
swinn
swinp
swinn
LPF
vssd
To preserve detail of this figure, this figure is best viewed with a PDF display program or printed on a 11" × 17" paper.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 59 of 137
Analog local buses (abus) are routing resources located within
the analog subsystem and are used to route signals between
different analog blocks. There are eight abus routes in CY8C36,
four in the left half (abusl [0:3]) and four in the right half (abusr
[0:3]) as shown in Figure 8-2. Using the abus saves the analog
globals and analog mux buses from being used for
interconnecting the analog blocks.
Multiplexers and switches exist on the various buses to direct
signals into and out of the analog blocks. A multiplexer can have
only one connection on at a time, whereas a switch can have
multiple connections on simultaneously. In Figure 8-2,
multiplexers are indicated by grayed ovals and switches are
indicated by transparent ovals.
8.2 Delta-sigma ADC
The CY8C36 device contains one delta-sigma ADC. This ADC
offers differential input, high resolution and excellent linearity,
making it a good ADC choice for measurement applications. The
converter can be configured to output 12-bit resolution at data
rates of up to 192 ksps. At a fixed clock rate, resolution can be
traded for faster data rates as shown in Ta bl e 8- 1 and Figure 8-3.
Figure 8-3. Delta-sigma ADC Sample Rates, Range = ±1.024 V
8.2.1 Functional Description
The ADC connects and configures three basic components,
input buffer, delta-sigma modulator, and decimator. The basic
block diagram is shown in Figure 8-4. The signal from the input
muxes is delivered to the delta-sigma modulator either directly or
through the input buffer. The delta-sigma modulator performs the
actual analog to digital conversion. The modulator over-samples
the input and generates a serial data stream output. This high
speed data stream is not useful for most applications without
some type of post processing, and so is passed to the decimator
through the Analog Interface block. The decimator converts the
high speed serial data stream into parallel ADC results. The
modulator/decimator frequency response is [(sin x)/x]4.
Figure 8-4. Delta-sigma ADC Block Diagram
Resolution and sample rate are controlled by the Decimator.
Data is pipelined in the decimator; the output is a function of the
last four samples. When the input multiplexer is switched, the
output data is not valid until after the fourth sample after the
switch.
8.2.2 Operational Modes
The ADC can be configured by the user to operate in one of four
modes: Single Sample, Multi Sample, Continuous, or Multi
Sample (Turbo). All four modes are started by either a write to
the start bit in a control register or an assertion of the Start of
Conversion (SoC) signal. When the conversion is complete, a
status bit is set and the output signal End of Conversion (EoC)
asserts high and remains high until the value is read by either the
DMA controller or the CPU.
8.2.2.1 Single Sample
In Single Sample mode, the ADC performs one sample
conversion on a trigger. In this mode, the ADC stays in standby
state waiting for the SoC signal to be asserted. When SoC is
signaled the ADC performs four successive conversions. The
first three conversions prime the decimator. The ADC result is
valid and available after the fourth conversion, at which time the
EoC signal is generated. To detect the end of conversion, the
system may poll a control register for status or configure the
external EoC signal to generate an interrupt or invoke a DMA
request. When the transfer is done the ADC reenters the standby
state where it stays until another SoC event.
8.2.2.2 Continuous
Continuous sample mode is used to take multiple successive
samples of a single input signal. Multiplexing multiple inputs
should not be done with this mode. There is a latency of three
conversion times before the first conversion result is available.
This is the time required to prime the decimator. After the first
result, successive conversions are available at the selected
sample rate.
8.2.2.3 Multi Sample
Multi sample mode is similar to continuous mode except that the
ADC is reset between samples. This mode is useful when the
input is switched between multiple signals. The decimator is
re-primed between each sample so that previous samples do not
affect the current conversion. Upon completion of a sample, the
next sample is automatically initiated. The results can be
transferred using either firmware polling, interrupt, or DMA.
More information on output formats is provided in the Technical
Reference Manual.
Table 8-1. Delta-sigma ADC Performance
Bits Maximum Sample Rate
(sps) SINAD (dB)
12 192 k 66
8 384 k 43
1000
10000
100000
1000000
e
Rate, sps
1
10
100
6 8 10 12 14 16 18 20 22
Sampl
e
Resolution, bits
Continuous Multi-Sample Multi-SampleTurbo
Delta
Sigma
Modulator
Decimator 12 to 20 Bit
Result
EOC
SOC
Positive
Input Mux
Negative
Input Mux
(Analog Routing) Input
Buffer
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 60 of 137
8.2.3 Start of Conversion Input
The SoC signal is used to start an ADC conversion. A digital
clock or UDB output can be used to drive this input. It can be
used when the sampling period must be longer than the ADC
conversion time or when the ADC must be synchronized to other
hardware. This signal is optional and does not need to be
connected if ADC is running in a continuous mode.
8.2.4 End of Conversion Output
The EoC signal goes high at the end of each ADC conversion.
This signal may be used to trigger either an interrupt or DMA
request.
8.3 Comparators
The CY8C36 family of devices contains four comparators in a
device. Comparators have these features:
Input offset factory trimmed to less than 5 mV
Rail-to-rail common mode input range (VSSA to VDDA)
Speed and power can be traded off by using one of three
modes: fast, slow, or ultra low-power
Comparator outputs can be routed to lookup tables to perform
simple logic functions and then can also be routed to digital
blocks
The positive input of the comparators may be optionally passed
through a low pass filter. Two filters are provided
Comparator inputs can be connections to GPIO, DAC outputs
and SC block outputs
8.3.1 Input and Output Interface
The positive and negative inputs to the comparators come from
the analog global buses, the analog mux line, the analog local
bus and precision reference through multiplexers. The output
from each comparator could be routed to any of the two input
LUTs. The output of that LUT is routed to the UDB Digital System
Interface.
Figure 8-5. Analog Comparator
ANAIF
+
_
+
+
_
comp2
_
comp0
comp1
+
_
comp3
4
LUT0 LUT1 LUT2 LUT3
4 4 4 4 4 4 4
From
Analog
Routing
From
Analog
Routing
From
Analog
Routing
From
Analog
Routing
UDBs
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 61 of 137
8.3.2 LUT
The CY8C36 family of devices contains four LUTs. The LUT is a
two input, one output lookup table that is driven by any one or
two of the comparators in the chip. The output of any LUT is
routed to the digital system interface of the UDB array. From the
digital system interface of the UDB array, these signals can be
connected to UDBs, DMA controller, I/O, or the interrupt
controller.
The LUT control word written to a register sets the logic function
on the output. The available LUT functions and the associated
control word is shown in Ta bl e 8- 2.
8.4 Opamps
The CY8C36 family of devices contain up to four general
purpose opamps in a device.
Figure 8-6. Opamp
The opamp is uncommitted and can be configured as a gain
stage or voltage follower, or output buffer on external or internal
signals.
See Figure 8-7. In any configuration, the input and output signals
can all be connected to the internal global signals and monitored
with an ADC, or comparator. The configurations are
implemented with switches between the signals and GPIO pins.
Figure 8-7. Opamp Configurations
The opamp has three speed modes, slow, medium, and fast. The
slow mode consumes the least amount of quiescent power and
the fast mode consumes the most power. The inputs are able to
swing rail-to-rail. The output swing is capable of rail-to-rail
operation at low current output, within 50 mV of the rails. When
driving high current loads (about 25 mA) the output voltage may
only get within 500 mV of the rails.
8.5 Programmable SC/CT Blocks
The CY8C36 family of devices contains up to four switched
capacitor/continuous time (SC/CT) blocks in a device. Each
switched capacitor/continuous time block is built around a single
rail-to-rail high bandwidth opamp.
Switched capacitor is a circuit design technique that uses
capacitors plus switches instead of resistors to create analog
functions. These circuits work by moving charge between
capacitors by opening and closing different switches.
Nonoverlapping in phase clock signals control the switches, so
that not all switches are ON simultaneously.
The PSoC Creator tool offers a user friendly interface, which
allows you to easily program the SC/CT blocks. Switch control
and clock phase control configuration is done by PSoC Creator
so users only need to determine the application use parameters
such as gain, amplifier polarity, VREF connection, and so on.
Table 8-2. LUT Function vs. Program Word and Inputs
Control Word Output (A and B are LUT inputs)
0000b FALSE (‘0’)
0001b A AND B
0010b A AND (NOT B)
0011b A
0100b (NOT A) AND B
0101b B
0110b A XOR B
0111b A OR B
1000b A NOR B
1001b A XNOR B
1010b NOT B
1011b A OR (NOT B)
1100b NOT A
1101b (NOT A) OR B
1110b A NAND B
1111b TRUE (‘1’)
Opamp
VREF
GPIO
GPIO
= Analog Switch
GPIO
Analog
Global Bus
Analog
Internal Bus
Analog
Global Bus
Opamp Vout to Pin
Vin
Vout to GPIO
Vp to GPIO
b) External Uncommitted
Opamp
a) Voltage Follower
Vout to Pin
Vp
Vn
To Internal Signals
c) Internal Uncommitted
Opamp
Vn to GPIO
GPIO Pin
Opamp
Opamp
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 62 of 137
The same opamps and block interfaces are also connectable to
an array of resistors which allows the construction of a variety of
continuous time functions.
The opamp and resistor array is programmable to perform
various analog functions including
Naked operational amplifier – Continuous mode
Unity-gain buffer – Continuous mode
Programmable gain amplifier (PGA) – Continuous mode
Transimpedance amplifier (TIA) – Continuous mode
Up/down mixer – Continuous mode
Sample and hold mixer (NRZ S/H) – Switched cap mode
First order analog to digital modulator – Switched cap mode
8.5.1 Naked Opamp
The Naked Opamp presents both inputs and the output for
connection to internal or external signals. The opamp has a unity
gain bandwidth greater than 6.0 MHz and output drive current up
to 650 µA. This is sufficient for buffering internal signals (such as
DAC outputs) and driving external loads greater than 7.5 k.
8.5.2 Unity Gain
The Unity Gain buffer is a Naked Opamp with the output directly
connected to the inverting input for a gain of 1.00. It has a –3 dB
bandwidth greater than 6.0 MHz.
8.5.3 PGA
The PGA amplifies an external or internal signal. The PGA can
be configured to operate in inverting mode or noninverting mode.
The PGA function may be configured for both positive and
negative gains as high as 50 and 49 respectively. The gain is
adjusted by changing the values of R1 and R2 as illustrated in
Figure 8-8 on page 62. The schematic in Figure 8-8 on page 62
shows the configuration and possible resistor settings for the
PGA. The gain is switched from inverting and non inverting by
changing the shared select value of the both the input muxes.
The bandwidth for each gain case is listed in Ta ble 8-3 .
Figure 8-8. PGA Resistor Settings
The PGA is used in applications where the input signal may not
be large enough to achieve the desired resolution in the ADC, or
dynamic range of another SC/CT block such as a mixer. The gain
is adjustable at runtime, including changing the gain of the PGA
prior to each ADC sample.
8.5.4 TIA
The Transimpedance Amplifier (TIA) converts an internal or
external current to an output voltage. The TIA uses an internal
feedback resistor in a continuous time configuration to convert
input current to output voltage. For an input current Iin, the output
voltage is VREF - Iin x Rfb, where VREF is the value placed on the
non inverting input. The feedback resistor Rfb is programmable
between 20 K and 1 M through a configuration register.
Tab le 8 -4 shows the possible values of Rfb and associated
configuration settings.
Figure 8-9. Continuous Time TIA Schematic
The TIA configuration is used for applications where an external
sensor's output is current as a function of some type of stimulus
such as temperature, light, magnetic flux etc. In a common
application, the voltage DAC output can be connected to the
VREF TIA input to allow calibration of the external sensor bias
current by adjusting the voltage DAC output voltage.
8.6 LCD Direct Drive
The PSoC Liquid Crystal Display (LCD) driver system is a highly
configurable peripheral designed to allow PSoC to directly drive
a broad range of LCD glass. All voltages are generated on chip,
eliminating the need for external components. With a high
multiplex ratio of up to 1/16, the CY8C36 family LCD driver
system can drive a maximum of 736 segments. The PSoC LCD
driver module was also designed with the conservative power
budget of portable devices in mind, enabling different LCD drive
modes and power down modes to conserve power.
Table 8-3. Bandwidth
Gain Bandwidth
1 6.0 MHz
24 340 kHz
48 220 kHz
50 215 kHz
R1 R2
20 k to 980 k
S
20 k or 40 k
1
0
1
0
Vin
Vref
Vref
Vin
Table 8-4. Feedback Resistor Settings
Configuration Word Nominal Rfb (K)
000b 20
001b 30
010b 40
011b 60
100b 120
101b 250
110b 500
111b 1000
Vref
Vout
Iin
Rfb
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 63 of 137
PSoC Creator provides an LCD segment drive component. The
component wizard provides easy and flexible configuration of
LCD resources. You can specify pins for segments and
commons along with other options. The software configures the
device to meet the required specifications. This is possible
because of the programmability inherent to PSoC devices.
Key features of the PSoC LCD segment system are:
LCD panel direct driving
Type A (standard) and Type B (low-power) waveform support
Wide operating voltage range support (2 V to 5 V) for LCD
panels
Static, 1/2, 1/3, 1/4, 1/5 bias voltage levels
Internal bias voltage generation through internal resistor ladder
Up to 62 total common and segment outputs
Up to 1/16 multiplex for a maximum of 16 backplane/common
outputs
Up to 62 front plane/segment outputs for direct drive
Drives up to 736 total segments (16 backplane × 46 front plane)
Up to 64 levels of software controlled contrast
Ability to move display data from memory buffer to LCD driver
through DMA (without CPU intervention)
Adjustable LCD refresh rate from 10 Hz to 150 Hz
Ability to invert LCD display for negative image
Three LCD driver drive modes, allowing power optimization
Figure 8-10. LCD System
8.6.1 LCD Segment Pin Driver
Each GPIO pin contains an LCD driver circuit. The LCD driver
buffers the appropriate output of the LCD DAC to directly drive
the glass of the LCD. A register setting determines whether the
pin is a common or segment. The pin’s LCD driver then selects
one of the six bias voltages to drive the I/O pin, as appropriate
for the display data.
8.6.2 Display Data Flow
The LCD segment driver system reads display data and
generates the proper output voltages to the LCD glass to
produce the desired image. Display data resides in a memory
buffer in the system SRAM. Each time you need to change the
common and segment driver voltages, the next set of pixel data
moves from the memory buffer into the Port Data Registers
through DMA.
8.6.3 UDB and LCD Segment Control
A UDB is configured to generate the global LCD control signals
and clocking. This set of signals is routed to each LCD pin driver
through a set of dedicated LCD global routing channels. In
addition to generating the global LCD control signals, the UDB
also produces a DMA request to initiate the transfer of the next
frame of LCD data.
8.6.4 LCD DAC
The LCD DAC generates the contrast control and bias voltage
for the LCD system. The LCD DAC produces up to five LCD drive
voltages plus ground, based on the selected bias ratio. The bias
voltages are driven out to GPIO pins on a dedicated LCD bias
bus, as required.
8.7 CapSense
The CapSense system provides a versatile and efficient means
for measuring capacitance in applications such as touch sense
buttons, sliders, and proximity detection. The CapSense system
uses a configuration of system resources, including a few
hardware functions primarily targeted for CapSense. Specific
resource usage is detailed in the CapSense component in PSoC
Creator. A capacitive sensing method using a Delta-Sigma
Modulator (CSD) is used. It provides capacitance sensing using
a switched capacitor technique with a delta-sigma modulator to
convert the sensing current to a digital code.
8.8 Temp Sensor
Die temperature is used to establish programming parameters
for writing flash. Die temperature is measured using a dedicated
sensor based on a forward biased transistor. The temperature
sensor has its own auxiliary ADC.
LCD Driver
Block
UDB
DMA Display
RAM
LCD
DAC
PIN
Global
Clock
PHUB
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 64 of 137
8.9 DAC
The CY8C36 parts contain up to four Digital to Analog
Convertors (DACs). Each DAC is 8-bit and can be configured for
either voltage or current output. The DACs support CapSense,
power supply regulation, and waveform generation. Each DAC
has the following features:
Adjustable voltage or current output in 255 steps
Programmable step size (range selection)
Eight bits of calibration to correct ± 25% of gain error
Source and sink option for current output
High and low speed / power modes
8 Msps conversion rate for current output
1 Msps conversion rate for voltage output
Monotonic in nature
Data and strobe inputs can be provided by the CPU or DMA,
or routed directly from the DSI
Dedicated low-resistance output pin for high-current mode
Figure 8-11. DAC Block Diagram
8.9.1 Current DAC
The current DAC (IDAC) can be configured for the ranges 0 to
31.875 µA, 0 to 255 µA, and 0 to 2.04 mA. The IDAC can be
configured to source or sink current.
8.9.2 Voltage DAC
For the voltage DAC (VDAC), the current DAC output is routed
through resistors. The two ranges available for the VDAC are 0
to 1.02 V and 0 to 4.08 V. In voltage mode any load connected
to the output of a DAC should be purely capacitive (the output of
the VDAC is not buffered).
8.10 Up/Down Mixer
In continuous time mode, the SC/CT block components are used
to build an up or down mixer. Any mixing application contains an
input signal frequency and a local oscillator frequency. The
polarity of the clock, Fclk, switches the amplifier between
inverting or noninverting gain. The output is the product of the
input and the switching function from the local oscillator, with
frequency components at the local oscillator plus and minus the
signal frequency (Fclk + Fin and Fclk – Fin) and reduced-level
frequency components at odd integer multiples of the local
oscillator frequency. The local oscillator frequency is provided by
the selected clock source for the mixer.
Continuous time up and down mixing works for applications with
input signals and local oscillator frequencies up to 1 MHz.
Figure 8-12. Mixer Configuration
Reference
Source
Scaler
IsourceRange
1x ,8x ,64x
IsinkRange
1x ,8x ,64x
R
3R
Vout Iout
Vref
Vout
0
1
Rmix 0 20 k or 40 k
Rmix 0 20 k or 40 k
sc_clk
sc_clk
Vin
C2 = 1.7 pF
C1 = 850 fF
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 65 of 137
8.11 Sample and Hold
The main application for a sample and hold, is to hold a value
stable while an ADC is performing a conversion. Some
applications require multiple signals to be sampled
simultaneously, such as for power calculations (V and I).
Figure 8-13. Sample and Hold Topology
(1 and 2 are opposite phases of a clock)
8.11.1 Down Mixer
The SC/CT block can be used as a mixer to down convert an
input signal. This circuit is a high bandwidth passive sample
network that can sample input signals up to 14 MHz. This
sampled value is then held using the opamp with a maximum
clock rate of 4 MHz. The output frequency is at the difference
between the input frequency and the highest integer multiple of
the Local Oscillator that is less than the input.
8.11.2 First Order Modulator – SC Mode
A first order modulator is constructed by placing the SC/CT block
in an integrator mode and using a comparator to provide a 1-bit
feedback to the input. Depending on this bit, a reference voltage
is either subtracted or added to the input signal. The block output
is the output of the comparator and not the integrator in the
modulator case. The signal is downshifted and buffered and then
processed by a decimator to make a delta-sigma converter or a
counter to make an incremental converter. The accuracy of the
sampled data from the first-order modulator is determined from
several factors.
The main application for this modulator is for a low frequency
ADC with high accuracy. Applications include strain gauges,
thermocouples, precision voltage, and current measurement.
9. Programming, Debug Interfaces,
Resources
PSoC devices include extensive support for programming,
testing, debugging, and tracing both hardware and firmware.
Three interfaces are available: JTAG, SWD, and SWV. JTAG and
SWD support all programming and debug features of the device.
JTAG also supports standard JTAG scan chains for board level
test and chaining multiple JTAG devices to a single JTAG
connection.
For more information on PSoC 3 Programming, refer to the
PSoC® 3 Device Programming Specifications.
Complete Debug on Chip (DoC) functionality enables full device
debugging in the final system using the standard production
device. It does not require special interfaces, debugging pods,
simulators, or emulators. Only the standard programming
connections are required to fully support debug.
The PSoC Creator IDE software provides fully integrated
programming and debug support for PSoC devices. The low cost
MiniProg3 programmer and debugger is designed to provide full
programming and debug support of PSoC devices in conjunction
with the PSoC Creator IDE. PSoC JTAG, SWD, and SWV
interfaces are compatible with industry standard third party tools.
All DOC circuits are disabled by default and can only be enabled
in firmware. If not enabled, the only way to reenable them is to
erase the entire device, clear flash protection, and reprogram the
device with new firmware that enables DOC. Disabling DOC
features, robust flash protection, and hiding custom analog and
digital functionality inside the PSoC device provide a level of
security not possible with multichip application solutions.
Additionally, all device interfaces can be permanently disabled
(Device Security) for applications concerned about phishing
attacks due to a maliciously reprogrammed device. Permanently
disabling interfaces is not recommended in most applications
because the you cannot access the device later. Because all
programming, debug, and test interfaces are disabled when
Device Security is enabled, PSoCs with Device Security enabled
may not be returned for failure analysis.
Vi
n
Vref
Vout
1
2
C1C2
2
1
1
2
1
2
1
1
2
2
C3C4V
ref
Vref
Table 9-1. Debug Configurations
Debug and Trace Configuration GPIO Pins Used
All debug and trace disabled 0
JTAG 4 or 5
SWD 2
SWV 1
SWD + SWV 3
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 66 of 137
9.1 JTAG Interface
The IEEE 1149.1 compliant JTAG interface exists on four or five
pins (the nTRST pin is optional). The JTAG interface is used for
programming the flash memory, debugging, I/O scan chains, and
JTAG device chaining.
PSoC 3 has certain timing requirements to be met for entering
programming mode through the JTAG interface. Due to these
timing requirements, not all standard JTAG programmers, or
standard JTAG file formats such as SVF or STAPL, can support
PSoC 3 programming. The list of programmers that support
PSoC 3 programming is available at
http://www.cypress.com/go/programming.
The JTAG clock frequency can be up to 14 MHz, or 1/3 of the
CPU clock frequency for 8 and 16-bit transfers, or 1/5 of the CPU
clock frequency for 32-bit transfers. By default, the JTAG pins are
enabled on new devices but the JTAG interface can be disabled,
allowing these pins to be used as GPIO instead.
Figure 9-1. JTAG Interface Connections between PSoC 3 and Programmer
TCK(P1[1]
TMS(P1[0])5
GND
GND
TCK
TMS5
XRES
Host Programmer PSoC 3
TDO TDI (P1[4])
TDI TDO (P1[3])
nTRST6nTRST (P1[5]) 6
1 The voltage levels of Host Programmer and the PSoC 3 voltage domains involved in Programming should be same. The
Port 1 JTAG pins, XRES pin (XRES_N or P1[2]) are powered by VDDIO1. So, VDDIO1 of PSoC 3 should be at same voltage
level as host VDD. Rest of PSoC 3 voltage domains ( VDDD,VDDA,VDDIO0,VDDIO2,VDDIO3) need not be at the same voltage level as
host Programmer.
2 Vdda must be greater than or equal to all other power supplies (Vddd, Vddio’s) in PSoC 3.
3 For Power cycle mode Programming, XRES pin is not required. But the Host programmer must have
the capability to toggle power (Vddd, Vdda, All Vddio’s) to PSoC 3. This may typically require external
interface circuitry to toggle power which will depend on the programming setup. The power supplies can
be brought up in any sequence, however, once stable, VDDA must be greater than or equal to all other
supplies.
4 For JTAG Programming, Device reset can also be done without connecting to the XRES pin or Power cycle mode by
using the TMS,TCK,TDI, TDO pins of PSoC 3, and writing to a specific register. But this requires that the DPS setting in
NVL is not equal to “Debug Ports Disabled”.
5 By default, PSoC 3 is configured for 4-wire JTAG mode unless user changes the DPS setting. So the TMS pin is
unidirectional. But if the DPS setting is changed to non-JTAG mode, the TMS pin in JTAG is bi-directional as the SWD
Protocol has to be used for acquiring the PSoC 3 device initially. After switching from SWD to JTAG mode, the TMS pin
will be uni-directional. In such a case, unidirectional buffer should not be used on TMS line.
6 nTRST JTAG pin (P1[5]) cannot be used to reset the JTAG TAP controlller during first time programming of PSoC 3 as
the default setting is 4-wire JTAG (nTRST disabled). Use the TMS, TCK pins to do a reset of JTAG TAP controller.
7 If XRES pin is used by host, P1[2] will be configured as XRES by default only for 48-pin devices (without dedicated XRES
pin). For devices with dedicated XRES pin, P1[2] is GPIO pin by default. So use P1[2] as Reset pin only for 48-pin
devices, but use dedicated XRES pin for rest of devices.
VDDD,VDDA,VDDIO0,VDDIO1,VDDIO2,VDDIO3 1, 2, 3, 4
VSSD,VSSA
XRESorP1[2]4,7
VDD
VDD
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 67 of 137
9.2 Serial Wire Debug Interface
The SWD interface is the preferred alternative to the JTAG
interface. It requires only two pins instead of the four or five
needed by JTAG. SWD provides all of the programming and
debugging features of JTAG at the same speed. SWD does not
provide access to scan chains or device chaining. The SWD
clock frequency can be up to 1/3 of the CPU clock frequency.
SWD uses two pins, either two of the JTAG pins (TMS and TCK)
or the USBIO D+ and D– pins. The USBIO pins are useful for in
system programming of USB solutions that would otherwise
require a separate programming connector. One pin is used for
the data clock and the other is used for data input and output.
SWD can be enabled on only one of the pin pairs at a time. This
only happens if, within 8 s (key window) after reset, that pin pair
(JTAG or USB) receives a predetermined acquire sequence of
1s and 0s. If the NVL latches are set for SWD (see Section 5.5),
this sequence need not be applied to the JTAG pin pair. The
acquire sequence must always be applied to the USB pin pair.
SWD is used for debugging or for programming the flash
memory.
The SWD interface can be enabled from the JTAG interface or
disabled, allowing its pins to be used as GPIO. Unlike JTAG, the
SWD interface can always be reacquired on any device during
the key window. It can then be used to reenable the JTAG
interface, if desired. When using SWD or JTAG pins as standard
GPIO, make sure that the GPIO functionality and PCB circuits do
not interfere with SWD or JTAG use.
Figure 9-2. SWD Interface Connections between PSoC 3 and Programmer
VSSD,VSSA
VDDD,VDDA,VDDIO0,VDDIO1,VDDIO2,VDDIO3 1, 2, 3
SWDCK(P1[1]orP15[7])
SWDIO(P1[0]orP15[6])
XRESorP1[2]3,4
GND
GND
SWDCK
SWDIO
XRES
Host Programmer PSoC 3
VDD
1 The voltage levels of the Host Programmer and the PSoC 3 voltage domains involved in Programming
should be the same. XRES pin (XRES_N or P1[2]) is powered by VDDIO1. The USB SWD pins are
powered by VDDD. So for Programming using the USB SWD pins with XRES pin, the VDDD, VDDIO1of
PSoC 3 should be at the same voltage level as Host VDD. Rest of PSoC 3 voltage domains ( VDDA,VDDIO0,
VDDIO2,VDDIO3) need not be at the same voltage level as host Programmer. The Port 1 SWD pins are
powered by VDDIO1. So VDDIO1 of PSoC 3 should be at same voltage level as host VDD for Port 1 SWD
programming. Rest of PSoC 3 voltage domains ( VDDD,VDDA,VDDIO0,VDDIO2,VDDIO3) need not be at the same
voltage level as host Programmer.
2 Vdda must be greater than or equal to all other power supplies (Vddd, Vddio’s) in PSoC 3.
3 For Power cycle mode Programming, XRES pin is not required. But the Host programmer must have
the capability to toggle power (Vddd, Vdda, All Vddio’s) to PSoC 3. This may typically require external
interface circuitry to toggle power which will depend on the programming setup. The power supplies can
be brought up in any sequence, however, once stable, VDDA must be greater than or equal to all other
supplies.
4 P1[2] will be configured as XRES by default only for 48-pin devices (without dedicated XRES pin). For
devices with dedicated XRES pin, P1[2] is GPIO pin by default. So use P1[2] as Reset pin only for 48-
pin devices, but use dedicated XRES pin for rest of devices.
VDD
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 68 of 137
9.3 Debug Features
Using the JTAG or SWD interface, the CY8C36 supports the
following debug features:
Halt and single-step the CPU
View and change CPU and peripheral registers, and RAM
addresses
Eight program address breakpoints
One memory access breakpoint—break on reading or writing
any memory address and data value
Break on a sequence of breakpoints (non recursive)
Debugging at the full speed of the CPU
Compatible with PSoC Creator and MiniProg3 programmer and
debugger
Standard JTAG programming and debugging interfaces make
CY8C36 compatible with other popular third-party tools (for
example, ARM / Keil)
9.4 Trace Features
The CY8C36 supports the following trace features when using
JTAG or SWD:
Trace the 8051 program counter (PC), accumulator register
(ACC), and one SFR / 8051 core RAM register
Trace depth up to 1000 instructions if all registers are traced,
or 2000 instructions if only the PC is traced (on devices that
include trace memory)
Program address trigger to start tracing
Trace windowing, that is, only trace when the PC is within a
given range
Two modes for handling trace buffer full: continuous (overwriting
the oldest trace data) or break when trace buffer is full
9.5 Single Wire Viewer Interface
The SWV interface is closely associated with SWD but can also
be used independently. SWV data is output on the JTAG
interface’s TDO pin. If using SWV, you must configure the device
for SWD, not JTAG. SWV is not supported with the JTAG
interface.
SWV is ideal for application debug where it is helpful for the
firmware to output data similar to 'printf' debugging on PCs. The
SWV is ideal for data monitoring, because it requires only a
single pin and can output data in standard UART format or
Manchester encoded format. For example, it can be used to tune
a PID control loop in which the output and graphing of the three
error terms greatly simplifies coefficient tuning.
The following features are supported in SWV:
32 virtual channels, each 32 bits long
Simple, efficient packing and serializing protocol
Supports standard UART format (N81)
9.6 Programming Features
The JTAG and SWD interfaces provide full programming
support. The entire device can be erased, programmed, and
verified. You can increase flash protection levels to protect
firmware IP. Flash protection can only be reset after a full device
erase. Individual flash blocks can be erased, programmed, and
verified, if block security settings permit.
9.7 Device Security
PSoC 3 offers an advanced security feature called device
security, which permanently disables all test, programming, and
debug ports, protecting your application from external access.
The device security is activated by programming a 32-bit key
(0×50536F43) to a Write Once Latch (WOL).
The WOL is a type of nonvolatile latch (NVL). The cell itself is an
NVL with additional logic wrapped around it. Each WOL device
contains four bytes (32 bits) of data. The wrapper outputs a ‘1’ if
a super-majority (28 of 32) of its bits match a pre-determined
pattern (0×50536F43); it outputs a ‘0’ if this majority is not
reached. When the output is 1, the Write Once NV latch locks the
part out of Debug and Test modes; it also permanently gates off
the ability to erase or alter the contents of the latch. Matching all
bits is intentionally not required, so that single (or few) bit failures
do not deassert the WOL output. The state of the NVL bits after
wafer processing is truly random with no tendency toward 1 or 0.
The WOL only locks the part after the correct 32-bit key
(0×50536F43) is loaded into the NVL's volatile memory,
programmed into the NVL's nonvolatile cells, and the part is
reset. The output of the WOL is only sampled on reset and used
to disable the access. This precaution prevents anyone from
reading, erasing, or altering the contents of the internal memory.
The user can write the key into the WOL to lock out external
access only if no flash protection is set (see “Flash Security” on
page 23). However, after setting the values in the WOL, a user
still has access to the part until it is reset. Therefore, a user can
write the key into the WOL, program the flash protection data,
and then reset the part to lock it.
If the device is protected with a WOL setting, Cypress cannot
perform failure analysis and, therefore, cannot accept RMAs
from customers. The WOL can be read out through the SWD port
to electrically identify protected parts. The user can write the key
in WOL to lock out external access only if no flash protection is
set. For more information on how to take full advantage of the
security features in PSoC see the PSoC 3 TRM.
Disclaimer
Note the following details of the flash code protection features on
Cypress devices.
Cypress products meet the specifications contained in their
particular Cypress data sheets. Cypress believes that its family
of products is one of the most secure families of its kind on the
market today, regardless of how they are used. There may be
methods, unknown to Cypress, that can breach the code
protection features. Any of these methods, to our knowledge,
would be dishonest and possibly illegal. Neither Cypress nor any
other semiconductor manufacturer can guarantee the security of
their code. Code protection does not mean that we are
guaranteeing the product as “unbreakable.”
Cypress is willing to work with the customer who is concerned
about the integrity of their code. Code protection is constantly
evolving. We at Cypress are committed to continuously
improving the code protection features of our products.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 69 of 137
9.8 CSP Package Bootloader
A factory-installed bootloader program is included in all devices
with CSP packages. The bootloader is compatible with PSoC
Creator 3.0 bootloadable project files and has the following
features:
I2C-based
SCLK and SDAT available at P1[6] and P1[7], respectively
External pull-up resistors required
I2C slave, address 4, data rate = 100 kbps
Single application
Wait two seconds for bootload command
Other bootloader options are as set by the PSoC Creator 3.0
Bootloader Component default
Occupies the bottom 9K of flash
For more information on this bootloader, see the following
Cypress application notes:
AN89611 – PSoC® 3 AND PSoC 5LP - Getting Started With
Chip Scale Packages (CSP)
AN73854 – PSoC 3 and PSoC 5 LP Introduction to Bootloaders
AN60317 – PSoC 3 and PSoC 5 LP I2C Bootloader
Note that a PSOC Creator bootloadable project must be
associated with .hex and .elf files for a bootloader project that is
configured for the target device. Bootloader .hex and .elf files
can be found at www.cypress.com/go/PSoC3datasheet.
The factory-installed bootloader can be overwritten using JTAG
or SWD programming.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 70 of 137
10. Development Support
The CY8C36 family has a rich set of documentation,
development tools, and online resources to assist you during
your development process. Visit
psoc.cypress.com/getting-started to find out more.
10.1 Documentation
A suite of documentation, supports the CY8C36 family to ensure
that you can find answers to your questions quickly. This section
contains a list of some of the key documents.
Software User Guide: A step-by-step guide for using PSoC
Creator. The software user guide shows you how the PSoC
Creator build process works in detail, how to use source control
with PSoC Creator, and much more.
Component data sheets: The flexibility of PSoC allows the
creation of new peripherals (components) long after the device
has gone into production. Component data sheets provide all of
the information needed to select and use a particular component,
including a functional description, API documentation, example
code, and AC/DC specifications.
Application Notes: PSoC application notes discuss a particular
application of PSoC in depth; examples include brushless DC
motor control and on-chip filtering. Application notes often
include example projects in addition to the application note
document.
Technical Reference Manual: The Technical Reference Manual
(TRM) contains all the technical detail you need to use a PSoC
device, including a complete description of all PSoC registers.
10.2 Online
In addition to print documentation, the Cypress PSoC forums
connect you with fellow PSoC users and experts in PSoC from
around the world, 24 hours a day, 7 days a week.
10.3 Tools
With industry standard cores, programming, and debugging
interfaces, the CY8C36 family is part of a development tool
ecosystem. Visit us at www.cypress.com/go/psoccreator for the
latest information on the revolutionary, easy to use PSoC Creator
IDE, supported third party compilers, programmers, debuggers,
and development kits.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 71 of 137
11. Electrical Specifications
Specifications are valid for –40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V,
except where noted. The unique flexibility of the PSoC UDBs and analog blocks enable many functions to be implemented in PSoC
Creator components, see the component data sheets for full AC/DC specifications of individual functions. See the “Example
Peripherals” section on page 44 for further explanation of PSoC Creator components.
11.1 Absolute Maximum Ratings
Table 11-1. Absolute Maximum Ratings DC Specifications[22]
Parameter Description Conditions Min Typ Max Units
VDDA Analog supply voltage relative to
VSSA
–0.5 – 6 V
VDDD Digital supply voltage relative to
VSSD
–0.5 – 6 V
VDDIO I/O supply voltage relative to VSSD –0.5 – 6 V
VCCA Direct analog core voltage input –0.5 – 1.95 V
VCCD Direct digital core voltage input –0.5 – 1.95 V
VSSA Analog ground voltage VSSD – 0.5 – VSSD +
0.5
V
VGPIO[23] DC input voltage on GPIO Includes signals sourced by VDDA
and routed internal to the pin
VSSD – 0.5 – VDDIO +
0.5
V
VSIO DC input voltage on SIO Output disabled VSSD – 0.5 – 7 V
Output enabled VSSD – 0.5 – 6 V
VIND Voltage at boost converter input 0.5 – 5.5 V
VBAT Boost converter supply VSSD – 0.5 – 5.5 V
IVDDIO Current per VDDIO supply pin – – 100 mA
IGPIO GPIO current –30 – 41 mA
ISIO SIO current –49 – 28 mA
IUSBIO USBIO current –56 – 59 mA
VEXTREF ADC external reference inputs Pins P0[3], P3[2] – – 2 V
LU Latch up current[24] –140 – 140 mA
ESDHBM
Electrostatic discharge voltage,
Human body model
VSSA tied to VSSD 2200 – – V
VSSA not tied to VSSD 750 – – V
ESDCDM
Electrostatic discharge voltage,
Charge device model
500 – – V
Notes
22. Usage above the absolute maximum conditions listed in Table 11-1 may cause permanent damage to the device. Exposure to Absolute Maximum conditions for
extended periods of time may affect device reliability. The Maximum Storage Temperature is 150 °C in compliance with JEDEC Standard JESD22-A103, High
Temperature Storage Life. When used below Absolute Maximum conditions but above normal operating conditions, the device may not operate to specification.
23. The VDDIO supply voltage must be greater than the maximum voltage on the associated GPIO pins. Maximum voltage on GPIO pin VDDIO VDDA.
24. Meets or exceeds JEDEC Spec EIA/JESD78 IC Latch-up Test.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 72 of 137
11.2 Device Level Specifications
Specifications are valid for –40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V,
except where noted.
11.2.1 Device Level Specifications
Table 11-2. DC Specifications
Parameter Description Conditions Min Typ[29] Max Units
VDDA Analog supply voltage and input to analog
core regulator Analog core regulator enabled 1.8 – 5.5 V
VDDA Analog supply voltage, analog regulator
bypassed Analog core regulator disabled 1.71 1.8 1.89 V
VDDD Digital supply voltage relative to VSSD Digital core regulator enabled 1.8 – VDDA[25]
V
––V
DDA + 0.1[31]
VDDD Digital supply voltage, digital regulator
bypassed Digital core regulator disabled 1.71 1.8 1.89 V
VDDIO[26] I/O supply voltage relative to VSSIO
1.71 – VDDA[25]
V
––V
DDA + 0.1[31]
VCCA Direct analog core voltage input (Analog
regulator bypass) Analog core regulator disabled 1.71 1.8 1.89 V
VCCD Direct digital core voltage input (Digital
regulator bypass) Digital core regulator disabled 1.71 1.8 1.89 V
IDD [27, 28] Active Mode
Only IMO and CPU clock enabled. CPU
executing simple loop from instruction
buffer.
VDDX = 2.7 V – 5.5 V;
FCPU = 6 MHz[30]
T = –40 °C – 1.2 2.9 mA
T = 25 °C – 1.2 3.1
T = 85 °C – 4.9 7.7
IMO enabled, bus clock and CPU clock
enabled. CPU executing program from
flash.
VDDX = 2.7 V – 5.5 V;
FCPU = 3 MHz[30]
T = –40 °C – 1.3 2.9
T = 25 °C – 1.6 3.2
T = 85 °C – 4.8 7.5
VDDX = 2.7 V – 5.5 V;
FCPU = 6 MHz
T = –40 °C – 2.1 3.7
T = 25 °C – 2.3 3.9
T = 85 °C – 5.6 8.5
VDDX = 2.7 V – 5.5 V;
FCPU = 12 MHz[30]
T = –40 °C – 3.5 5.2
T = 25 °C – 3.8 5.5
T = 85 °C – 7.1 9.8
VDDX = 2.7 V – 5.5 V;
FCPU = 24 MHz[30]
T = –40 °C – 6.3 8.1
T = 25 °C – 6.6 8.3
T = 85 °C – 10 13
VDDX = 2.7 V – 5.5 V;
FCPU = 48 MHz[30]
T = –40 °C – 11.5 13.5
T = 25 °C – 12 14
T = 85 °C – 15.5 18.5
VDDX = 2.7 V – 5.5 V;
FCPU = 62 MHz
T = –40 °C – 16 18
T = 25 °C – 16 18
T = 85 °C – 19.5 23
Notes
25. The power supplies can be brought up in any sequence however once stable VDDA must be greater than or equal to all other supplies.
26. The VDDIO supply voltage must be greater than the maximum voltage on the associated GPIO pins. Maximum voltage on GPIO pin VDDIO VDDA.
27. Total current for all power domains: digital (IDDD), analog (IDDA), and I/Os (IDDIO0, 1, 2, 3). Boost not included. All I/Os floating.
28. The current consumption of additional peripherals that are implemented only in programmed logic blocks can be found in their respective datasheets, available in
PSoC Creator, the integrated design environment. To estimate total current, find the CPU current at the frequency of interest and add peripheral currents for your
particular system from the device datasheet and component datasheets.
29. VDDX = 3.3 V.
30. Based on device characterization (Not production tested).
31. Guaranteed by design, not production tested.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 73 of 137
Sleep Mode[32]
CPU = OFF
RTC = ON (= ECO32K ON, in low-power
mode)
Sleep timer = ON (= ILO ON at 1 kHz)[33]
WDT = OFF
I2C Wake = OFF
Comparator = OFF
POR = ON
Boost = OFF
SIO pins in single ended input, unregulated
output mode
VDD = VDDIO =
4.5 V - 5.5 V
T = –40 °C – 1.1 2.3 µA
T = 25 °C – 1.1 2.2
T = 85 °C – 15 30
VDD = VDDIO =
2.7V–3.6V
T = –40 °C – 1 2.2
T = 25 °C – 1 2.1
T = 85 °C – 12 28
VDD = VDDIO =
1.71 V – 1.95 V[34] T = 25 °C – 2.2 4.2
Comparator = ON
CPU = OFF
RTC = OFF
Sleep timer = OFF
WDT = OFF
I2C Wake = OFF
POR = ON
Boost = OFF
SIO pins in single ended input, unregulated
output mode
VDD = VDDIO =
2.7V–3.6V
[35] T = 25 °C – 2.2 2.7
I2C Wake = ON
CPU = OFF
RTC = OFF
Sleep timer = OFF
WDT = OFF
Comparator = OFF
POR = ON
Boost = OFF
SIO pins in single ended input, unregulated
output mode
VDD = VDDIO =
2.7V–3.6V
[35] T = 25 °C – 2.2 2.8
Hibernate Mode[32]
Hibernate mode current
All regulators and oscillators off
SRAM retention
GPIO interrupts are active
Boost = OFF
SIO pins in single ended input, unregulated
output
mode
VDD = VDDIO =
4.5 V - 5.5 V
T = –40 °C – 0.2 1.5 µA
T = 25 °C – 0.5 1.5
T = 85 °C – 4.1 5.3
VDD = VDDIO =
2.7V–3.6V
T = –40 °C – 0.2 1.5
T = 25 °C – 0.2 1.5
T = 85 °C – 3.2 4.2
VDD = VDDIO =
1.71 V – 1.95 V[34] T = –40 °C – 0.2 1.5
T = 25 °C – 0.3 1.5
T = 85 °C – 3.3 4.3
IDDAR Analog current consumption while device
is reset[36] VDDA 3.6 V – 0.3 0.6 mA
VDDA 3.6 V – 1.4 3.3 mA
IDDDR Digital current consumption while device is
reset[36] VDDD 3.6 V – 1.1 3.1 mA
VDDD 3.6 V – 0.7 3.1 mA
Table 11-2. DC Specifications (continued)
Parameter Description Conditions Min Typ[29] Max Units
Notes
32. If VCCD and VCCA are externally regulated, the voltage difference between VCCD and VCCA must be less than 50 mV.
33. Sleep timer generates periodic interrupts to wake up the CPU. This specification applies only to those times that the CPU is off.
34. Externally regulated mode.
35. Based on device characterization (not production tested).
36. Based on device characterization (not production tested). USBIO pins tied to ground (VSSD).
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 74 of 137
Figure 11-1. Active Mode Current vs FCPU, VDD = 3.3 V,
Temperature = 25 °C
Figure 11-2. Active Mode Current vs Temperature and FCPU,
VDD = 3.3 V
Figure 11-3. Active Mode Current vs VDD and Temperature,
FCPU = 24 MHz
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 75 of 137
Figure 11-4. FCPU vs. VDD
Table 11-3. AC Specifications[37]
Parameter Description Conditions Min Typ Max Units
FCPU CPU frequency 1.71 V VDDD 5.5 V DC – 67.01 MHz
FBUSCLK Bus frequency 1.71 V VDDD 5.5 V DC – 67.01 MHz
Svdd VDD ramp rate – – 0.066 V/µs
TIO_INIT Time from VDDD/VDDA/VCCD/VCCA
IPOR to I/O ports set to their reset
states
––10µs
TSTARTUP Time from VDDD/VDDA/VCCD/VCCA
PRES to CPU executing code at
reset vector
VCCA/VDDA = regulated from
VDDA/VDDD, no PLL used, fast IMO
boot mode (48 MHz typ.)
––40µs
VCCA/VCCD = regulated from
VDDA/VDDD, no PLL used, slow
IMO boot mode (12 MHz typ.)
––74µs
TSLEEP Wakeup from sleep mode –
Application of non–LVD interrupt to
beginning of execution of next CPU
instruction
––15µs
THIBERNATE Wakeup from hibernate mode –
Application of external interrupt to
beginning of execution of next CPU
instruction
– – 100 µs
Note
37. Based on device characterization (Not production tested).
5.5 V
1.71 V
0.5 V
0 V
DC 1 MHz 10 MHz 67 MHz
3.3 V
Valid Operating Region
Valid Operating Region with SMP
CPU Frequency
Vdd Voltage
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 76 of 137
11.3 Power Regulators
Specifications are valid for –40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V,
except where noted.
11.3.1 Digital Core Regulator
Figure 11-5. Regulators VCC vs VDD Figure 11-6. Digital Regulator PSRR vs Frequency and VDD
11.3.2 Analog Core Regulator
Figure 11-7. Analog Regulator PSRR vs Frequency and VDD
Table 11-4. Digital Core Regulator DC Specifications
Parameter Description Conditions Min Typ Max Units
VDDD Input voltage 1.8 – 5.5 V
VCCD Output voltage – 1.80 – V
Regulator output capacitor ± 10%, ×5R ceramic or better. The two
VCCD pins must be shorted together, with
as short a trace as possible, see Power
System on page 31
0.9 1 1.1 µF
Table 11-5. Analog Core Regulator DC Specifications
Parameter Description Conditions Min Typ Max Units
VDDA Input voltage 1.8 – 5.5 V
VCCA Output voltage – 1.80 – V
Regulator output capacitor ±10%, ×5R ceramic or better 0.9 1 1.1 µF
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 77 of 137
11.3.3 Inductive Boost Regulator
Unless otherwise specified, operating conditions are: VBAT = 0.5 V–3.6 V, VOUT = 1.8 V–5.0 V, IOUT = 0 mA–50 mA,
LBOOST = 4.7 µH–22 µH, CBOOST = 22 µF || 3 × 1.0 µF || 3 × 0.1 µF, CBAT = 22 µF, IF = 1.0 A. Unless otherwise specified, all charts
and graphs show typical values.
Table 11-6. Inductive Boost Regulator DC Specifications
Parameter Description Conditions Min Typ Max Units
VOUT Boost output voltage[38] vsel = 1.8 V in register BOOST_CR0 1.71 1.8 1.89 V
vsel = 1.9 V in register BOOST_CR0 1.81 1.90 2.00 V
vsel = 2.0 V in register BOOST_CR0 1.90 2.00 2.10 V
vsel = 2.4 V in register BOOST_CR0 2.16 2.40 2.64 V
vsel = 2.7 V in register BOOST_CR0 2.43 2.70 2.97 V
vsel = 3.0 V in register BOOST_CR0 2.70 3.00 3.30 V
vsel = 3.3 V in register BOOST_CR0 2.97 3.30 3.63 V
vsel = 3.6 V in register BOOST_CR0 3.24 3.60 3.96 V
vsel = 5.0 V in register BOOST_CR0 4.50 5.00 5.50 V
VBAT Input voltage to boost[39] IOUT = 0 mA–5 mA vsel = 1.8 V–2.0 V,
TA = 0 °C–70 °C
0.5 – 0.8 V
IOUT = 0 mA–15 mA vsel = 1.8 V–5.0 V[40],
TA = –10 °C–85 °C
1.6 – 3.6 V
IOUT = 0 mA–25 mA vsel = 1.8 V–2.7 V,
TA = –10 °C–85 °C
0.8 – 1.6 V
IOUT = 0 mA–50 mA vsel = 1.8 V–3.3 V[40],
TA = –40 °C–85 °C
1.8 – 2.5 V
vsel = 1.8 V–3.3 V[40],
TA = –10 °C–85 °C
1.3 – 2.5 V
vsel = 2.5 V–5.0 V[40],
TA = –10 °C–85 °C
2.5 – 3.6 V
IOUT Output current TA = 0 °C–70 °C VBAT = 0.5 V–0.8 V 0 – 5 mA
TA = –10 °C–85 °C VBAT = 1.6 V–3.6 V 0 – 15 mA
VBAT = 0.8 V–1.6 V 0 – 25 mA
VBAT = 1.3 V–2.5 V 0 – 50 mA
VBAT = 2.5 V–3.6 V 0 – 50 mA
TA = –40 °C–85 °C VBAT = 1.8 V–2.5 V 0 – 50 mA
ILPK Inductor peak current – – 700 mA
IQQuiescent current Boost active mode – 250 – µA
Boost sleep mode, IOUT < 1 µA –25–µA
RegLOAD Load regulation – – 10 %
RegLINE Line regulation – – 10 %
Notes
38. Listed vsel options are characterized. Additional vsel options are valid and guaranteed by design.
39. The boost will start at all valid VBAT conditions including down to VBAT = 0.5 V.
40. If VBAT is greater than or equal to VOUT boost setting, then VOUT will be less than VBAT due to resistive losses in the boost circuit.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 78 of 137
Figure 11-8. TA range over VBAT and VOUT Figure 11-9. IOUT range over VBAT and VOUT
Figure 11-10. LBOOST values over VBAT and VOUT
Note
41. Based on device characterization (Not production tested).
Table 11-7. Recommended External Components for Boost Circuit
Parameter Description Conditions Min Typ Max Units
LBOOST Boost inductor 4.7 µH nominal 3.7 4.7 5.7 µH
10 µH nominal 8.0 10.0 12.0 µH
22 µH nominal 17.0 22.0 27.0 µH
CBOOST Total capacitance sum of
VDDD, VDDA, VDDIO[41] 17.0 26.0 31.0 µF
CBAT Battery filter capacitor 17.0 22.0 27.0 µF
IFSchottky diode average
forward current
1.0 – – A
VRSchottky reverse voltage 20.0 – – V
±&
± µ&
± &
± &
± &
1R%RRVW
9
%$7
9
9
287
9
P$
P$
P$
P$
1R%RRVW
9
%$7
9
9
287
9
P$
9
%$7
9
9
287
9
+
+
+
1R%RRVW
+
+
+
+
+
+
+
,
287
P$++
,
287
P$+
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 79 of 137
Figure 11-11. Efficiency vs VBAT, LBOOST = 4.7 µH [42] Figure 11-12. Efficiency vs VBAT, LBOOST = 10 µH [42]
Figure 11-13. Efficiency vs VBAT, LBOOST = 22 µH [42] Figure 11-14. VRIPPLE vs VBAT [42]
Note
42. Typical example. Actual values may vary depending on external component selection, PCB layout, and other design parameters.
65%
70%
75%
80%
85%
90%
95%
100%
% Efficiency
Vout = 1.8 V
Vout = 2.4 V
Vout = 3.3 V
Vout = 5.0 V
50%
55%
60%
65%
0 0.5 1 1.5 2 2.5 3 3.5 4
VBAT, V
65%
70%
75%
80%
85%
90%
95%
100%
% Efficiency
Vout = 1.8 V
Vout = 2.4 V
Vout = 3 3 V
50%
55%
60%
65%
00.511.522.533.54
VBAT, V
Vout
=
3
.
3
V
Vout = 5.0 V
65%
70%
75%
80%
85%
90%
95%
100%
% Efficiency
Vout = 1.8 V
Vout = 2.4 V
Vout = 3.3 V
50%
55%
60%
65%
00.511.522.533.54
VBAT, V
100
150
200
250
300
V
RIPPLE
, mV
Lboost = 4.7 uH
Lboost = 10 uH
0
50
0 0.5 1 1.5 2 2.5 3 3.5 4
V
BAT
, V
Lboost = 22 uH
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 80 of 137
11.4 Inputs and Outputs
Specifications are valid for –40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V,
except where noted. Unless otherwise specified, all charts and graphs show typical values.
When the power supplies ramp up, there are low-impedance connections between each GPIO pin and its VDDIO supply. This causes
the pin voltages to track VDDIO until both VDDIO and VDDA reach the IPOR voltage, which can be as high as 1.45 V. At that point, the
low-impedance connections no longer exist and the pins change to their normal NVL settings.
11.4.1 GPIO
Notes
43. Based on device characterization (Not production tested).
44. For information on designing with PSoC oscillators, refer to the application note, AN54439 - PSoC® 3 and PSoC 5 External Oscillator.
Table 11-9. GPIO DC Specifications
Parameter Description Conditions Min Typ Max Units
VIH Input voltage high threshold CMOS Input, PRT[×]CTL = 0 0.7 VDDIO ––V
VIL Input voltage low threshold CMOS Input, PRT[×]CTL = 0 – – 0.3 VDDIO V
VIH Input voltage high threshold LVTTL Input, PRT[×]CTL =
1,VDDIO < 2.7 V
0.7 × VDDIO ––V
VIH Input voltage high threshold LVTTL Input, PRT[×]CTL = 1,
VDDIO 2.7 V
2.0 – – V
VIL Input voltage low threshold LVTTL Input, PRT[×]CTL =
1,VDDIO < 2.7 V
– – 0.3 × VDDIO V
VIL Input voltage low threshold LVTTL Input, PRT[×]CTL = 1,
VDDIO 2.7 V
––0.8V
VOH Output voltage high IOH = 4 mA at 3.3 VDDIO VDDIO – 0.6 – – V
IOH = 1 mA at 1.8 VDDIO VDDIO – 0.5 – – V
VOL Output voltage low IOL = 8 mA at 3.3 VDDIO ––0.6V
IOL = 4 mA at 1.8 VDDIO ––0.6V
IOL = 3 mA at 3.3 VDDIO ––0.4V
Rpullup Pull-up resistor 3.5 5.6 8.5 k
Rpulldown Pull-down resistor 3.5 5.6 8.5 k
IIL Input leakage current (absolute value)[43] 25 °C, VDDIO = 3.0 V – – 2 nA
CIN Input capacitance[43] GPIOs not shared with opamp
outputs, MHz ECO or kHzECO
–47pF
GPIOs shared with MHz ECO
or kHzECO[44] –57pF
GPIOs shared with opamp
outputs
– – 18 pF
VHInput voltage hysteresis
(Schmitt-Trigger)[43] –40–mV
Idiode Current through protection diode to
VDDIO and VSSIO
––100µA
Rglobal Resistance pin to analog global bus 25 °C, VDDIO = 3.0 V – 320 –
Rmux Resistance pin to analog mux bus 25 °C, VDDIO = 3.0 V – 220 –
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 81 of 137
Figure 11-15. GPIO Output High Voltage and Current Figure 11-16. GPIO Output Low Voltage and Current
Table 11-10. GPIO AC Specifications
Parameter Description Conditions Min Typ Max Units
TriseF Rise time in Fast Strong Mode[45] 3.3 V VDDIO Cload = 25 pF – – 6 ns
TfallF Fall time in Fast Strong Mode[45] 3.3 V VDDIO Cload = 25 pF – – 6 ns
TriseS Rise time in Slow Strong Mode[45] 3.3 V VDDIO Cload = 25 pF – – 60 ns
TfallS Fall time in Slow Strong Mode[45] 3.3 V VDDIO Cload = 25 pF – – 60 ns
Fgpioout
GPIO output operating frequency – – – –
2.7 V < VDDIO < 5.5 V, fast strong drive
mode
90/10% VDDIO into 25 pF – – 33 MHz
1.71 V < VDDIO < 2.7 V, fast strong drive
mode
90/10% VDDIO into 25 pF – – 20 MHz
3.3 V < VDDIO < 5.5 V, slow strong drive
mode
90/10% VDDIO into 25 pF – – 7 MHz
1.71 V < VDDIO < 3.3 V, slow strong
drive mode
90/10% VDDIO into 25 pF – – 3.5 MHz
Fgpioin GPIO input operating frequency
1.71 V < VDDIO < 5.5 V 90/10% VDDIO ––33MHz
Note
45. Based on device characterization (Not production tested).
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 82 of 137
11.4.2 SIO
Notes
46. See Figure 6-10 on page 39 and Figure 6-13 on page 43 for more information on SIO reference.
47. Based on device characterization (Not production tested)
Table 11-11. SIO DC Specifications
Parameter Description Conditions Min Typ Max Units
Vinmax Maximum input voltage All allowed values of VDDIO and
VDDD, see Section 11.1
––5.5V
Vinref Input voltage reference (Differ-
ential input mode)
0.5 – 0.52 VDDIO V
Voutref
Output voltage reference (Regulated output mode)
VDDIO > 3.7 1 – VDDIO – 1 V
VDDIO < 3.7 1 – VDDIO – 0.5 V
VIH
Input voltage high threshold
GPIO mode CMOS input 0.7 VDDIO ––V
Differential input mode[46] Hysteresis disabled SIO_ref + 0.2 – – V
VIL
Input voltage low threshold
GPIO mode CMOS input – – 0.3 VDDIO V
Differential input mode[46] Hysteresis disabled – – SIO_ref – 0.2 V
VOH
Output voltage high
Unregulated mode IOH = 4 mA, VDDIO = 3.3 V VDDIO – 0.4 – – V
Regulated mode[46] IOH = 1 mA SIO_ref – 0.65 – SIO_ref + 0.2 V
Regulated mode[46] IOH = 0.1 mA SIO_ref – 0.3 – SIO_ref + 0.2 V
VOL
Output voltage low VDDIO = 3.30 V, IOL = 25 mA – – 0.8 V
VDDIO = 3.30 V, IOL = 20 mA – – 0.4 V
VDDIO = 1.80 V, IOL = 4 mA – – 0.4 V
Rpullup Pull-up resistor 3.5 5.6 8.5 k
Rpulldown Pull-down resistor 3.5 5.6 8.5 k
IIL Input leakage current (absolute
value)[47] ––––
VIH < Vddsio 25 °C, Vddsio = 3.0 V, VIH = 3.0 V – – 14 nA
VIH > Vddsio 25 °C, Vddsio = 0 V, VIH = 3.0 V – – 10 µA
CIN Input Capacitance[47] ––7pF
VH
Input voltage hysteresis
(Schmitt-Trigger)[47] Single ended mode (GPIO mode) – 40 – mV
Differential mode – 35 – mV
Idiode Current through protection diode
to VSSIO
––100µA
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 83 of 137
Figure 11-17. SIO Output High Voltage and Current,
Unregulated Mode
Figure 11-18. SIO Output Low Voltage and Current,
Unregulated Mode
Figure 11-19. SIO Output High Voltage and Current, Regulat-
ed Mode
Note
48. Based on device characterization (Not production tested).
Table 11-12. SIO AC Specifications
Parameter Description Conditions Min Typ Max Units
TriseF Rise time in Fast Strong Mode
(90/10%)[48] Cload = 25 pF, VDDIO = 3.3 V – – 12 ns
TfallF Fall time in Fast Strong Mode
(90/10%)[48] Cload = 25 pF, VDDIO = 3.3 V – – 12 ns
TriseS Rise time in Slow Strong Mode
(90/10%)[48] Cload = 25 pF, VDDIO = 3.0 V – – 75 ns
TfallS Fall time in Slow Strong Mode
(90/10%)[48] Cload = 25 pF, VDDIO = 3.0 V – – 60 ns
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 84 of 137
Figure 11-20. SIO Output Rise and Fall Times, Fast Strong
Mode, VDDIO = 3.3 V, 25 pF Load
Figure 11-21. SIO Output Rise and Fall Times, Slow Strong
Mode, VDDIO = 3.3 V, 25 pF Load
Fsioout
SIO output operating frequency
2.7 V < VDDIO < 5.5 V, Unregu-
lated output (GPIO) mode, fast
strong drive mode
90/10% VDDIO into 25 pF – – 33 MHz
1.71 V < VDDIO < 2.7 V, Unregu-
lated output (GPIO) mode, fast
strong drive mode
90/10% VDDIO into 25 pF – – 16 MHz
3.3 V < VDDIO < 5.5 V, Unregu-
lated output (GPIO) mode, slow
strong drive mode
90/10% VDDIO into 25 pF – – 5 MHz
1.71 V < VDDIO < 3.3 V, Unregu-
lated output (GPIO) mode, slow
strong drive mode
90/10% VDDIO into 25 pF – – 4 MHz
2.7 V < VDDIO < 5.5 V, Regulated
output mode, fast strong drive
mode
Output continuously switching
into 25 pF
––20MHz
1.71 V < VDDIO < 2.7 V, Regulated
output mode, fast strong drive
mode
Output continuously switching
into 25 pF
––10MHz
1.71 V < VDDIO < 5.5 V, Regulated
output mode, slow strong drive
mode
Output continuously switching
into 25 pF
––2.5MHz
Fsioin SIO input operating frequency
1.71 V < VDDIO < 5.5 V 90/10% VDDIO ––33MHz
Table 11-12. SIO AC Specifications (continued)
Parameter Description Conditions Min Typ Max Units
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 85 of 137
11.4.3 USBIO
For operation in GPIO mode, the standard range for VDDD applies, see Device Level Specifications on page 72.
Table 11-13. SIO Comparator Specifications[49]
Parameter Description Conditions Min Typ Max Units
Vos Offset voltage VDDIO = 2 V – – 68 mV
VDDIO = 2.7 V – – 72
VDDIO = 5.5 V – – 82
TCVos Offset voltage drift with temp – – 250 V/°C
CMRR Common mode rejection ratio VDDIO = 2 V 30 – – dB
VDDIO = 2.7 V 35 – –
VDDIO = 5.5 V 40 – –
Tresp Response time – – 30 ns
Table 11-14. USBIO DC Specifications
Parameter Description Conditions Min Typ Max Units
Rusbi USB D+ pull-up resistance With idle bus 0.900 – 1.575 k
Rusba USB D+ pull-up resistance While receiving traffic 1.425 – 3.090 k
Vohusb Static output high 15 k ±5% to Vss, internal pull-up
enabled
2.8 – 3.6 V
Volusb Static output low 15 k ±5% to Vss, internal pull-up
enabled
––0.3V
Vihgpio Input voltage high, GPIO mode VDDD 3V 2 – – V
Vilgpio Input voltage low, GPIO mode VDDD 3V – – 0.8 V
Vohgpio Output voltage high, GPIO mode IOH = 4 mA, VDDD 3V 2.4 – – V
Volgpio Output voltage low, GPIO mode IOL = 4 mA, VDDD 3V – – 0.3 V
Vdi Differential input sensitivity |(D+)–(D–)| – – 0.2 V
Vcm Differential input common mode
range
–0.8–2.5V
Vse Single ended receiver threshold – 0.8 – 2 V
Rps2 PS/2 pull-up resistance In PS/2 mode, with PS/2 pull-up
enabled
3–7k
Rext External USB series resistor In series with each USB pin 21.78
(–1%)
22 22.22
(+1%)
Zo USB driver output impedance Including Rext 28 – 44
CIN USB transceiver input capacitance – – 20 pF
IIL[49] Input leakage current (absolute value) 25 °C, VDDD = 3.0 V – – 2 nA
Note
49. Based on device characterization (Not production tested).
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 86 of 137
Figure 11-22. USBIO Output High Voltage and Current, GPIO
Mode
Figure 11-23. USBIO Output Low Voltage and Current, GPIO
Mode
Table 11-15. USBIO AC Specifications
Parameter Description Conditions Min Typ Max Units
Tdrate Full-speed data rate average bit rate 12 – 0.25% 12 12 +
0.25%
MHz
Tjr1 Receiver data jitter tolerance to next transition –8 – 8 ns
Tjr2 Receiver data jitter tolerance to pair transition –5 – 5 ns
Tdj1 Driver differential jitter to next transition –3.5 – 3.5 ns
Tdj2 Driver differential jitter to pair transition –4 – 4 ns
Tfdeop Source jitter for differential transition to SE0
transition
–2 – 5 ns
Tfeopt Source SE0 interval of EOP 160 – 175 ns
Tfeopr Receiver SE0 interval of EOP 82 – – ns
Tfst Width of SE0 interval during differential transition – – 14 ns
Fgpio_out GPIO mode output operating frequency 3 V VDDD 5.5 V – – 20 MHz
VDDD = 1.71 V – – 6 MHz
Tr_gpio Rise time, GPIO mode, 10%/90% VDDD VDDD > 3 V, 25 pF load – – 12 ns
VDDD = 1.71 V, 25 pF load – – 40 ns
Tf_gpio Fall time, GPIO mode, 90%/10% VDDD VDDD > 3 V, 25 pF load – – 12 ns
VDDD = 1.71 V, 25 pF load – – 40 ns
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 87 of 137
Figure 11-24. USBIO Output Rise and Fall Times, GPIO Mode,
VDDD = 3.3 V, 25 pF Load
Table 11-16. USB Driver AC Specifications
Parameter Description Conditions Min Typ Max Units
Tr Transition rise time – – 20 ns
Tf Transition fall time – – 20 ns
TR Rise/fall time matching VUSB_5, VUSB_3.3, see USB DC
Specifications on page 107
90% – 111%
Vcrs Output signal crossover voltage 1.3 – 2 V
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 88 of 137
11.4.4 XRES
11.5 Analog Peripherals
Specifications are valid for –40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V,
except where noted.
11.5.1 Opamp
Note
50. Based on device characterization (Not production tested).
Table 11-17. XRES DC Specifications
Parameter Description Conditions Min Typ Max Units
VIH Input voltage high threshold 0.7 VDDIO ––V
VIL Input voltage low threshold – – 0.3
VDDIO
V
Rpullup Pull-up resistor 3.5 5.6 8.5 k
CIN Input capacitance[50] –3–pF
VHInput voltage hysteresis (Schmitt–
Trigger)[50] –100–mV
Idiode Current through protection diode to
VDDIO and VSSIO
––100µA
Table 11-18. XRES AC Specifications
Parameter Description Conditions Min Typ Max Units
TRESET Reset pulse width 1 – – µs
Table 11-19. Opamp DC Specifications
Parameter Description Conditions Min Typ Max Units
VIOFF Input offset voltage – – 2 mV
VOS Input offset voltage – – 2.5 mV
Operating temperature –40 °C to
70 °C
––2mV
TCVOS Input offset voltage drift with temperature Power mode = high – – ±30 µV/°C
Ge1 Gain error, unity gain buffer mode Rload = 1 k––±0.1%
CIN Input capacitance Routing from pin – – 18 pF
VOOutput voltage range 1 mA, source or sink, power mode
= high
VSSA + 0.05 – VDDA – 0.05 V
IOUT Output current capability, source or sink VSSA + 500 mV Vout VDDA –
500 mV, VDDA > 2.7 V
25 – – mA
VSSA + 500 mV Vout VDDA –
500 mV, 1.7 V = VDDA 2.7 V
16 – – mA
IDD Quiescent current Power mode = min – 250 400 uA
Power mode = low – 250 400 uA
Power mode = med – 330 950 uA
Power mode = high – 1000 2500 uA
CMRR Common mode rejection ratio 80 – – dB
PSRR Power supply rejection ratio VDDA 2.7 V 85 – – dB
VDDA < 2.7 V 70 – – dB
IIB Input bias current
[
50
]
25 °C – 10 – pA
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 89 of 137
Figure 11-25. Opamp Voffset Histogram, 3388 samples/847
parts, 25 °C, VDDA = 5 V
Figure 11-26. Opamp Voffset vs Temperature, VDDA = 5 V
Figure 11-27. Opamp Voffset vs Vcommon and
VDDA, 25 °C Figure 11-28. Opamp Output Voltage vs Load Current and
Temperature, High Power Mode, 25 °C, VDDA = 2.7 V
Figure 11-29. Opamp Operating Current vs VDDA and Power
Mode
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 90 of 137
Figure 11-30. Opamp Noise vs Frequency, Power Mode =
High, VDDA = 5 V
Figure 11-31. Opamp Step Response, Rising
Figure 11-32. Opamp Step Response, Falling
Table 11-20. Opamp AC Specifications[51]
Parameter Description Conditions Min Typ Max Units
GBW Gain-bandwidth product Power mode = minimum, 15 pF load 1 – – MHz
Power mode = low, 15 pF load 2 – – MHz
Power mode = medium, 200 pF load 1 – – MHz
Power mode = high, 200 pF load 3 – – MHz
SR Slew rate, 20%–80% Power mode = low, 15 pF load 1.1 – – V/µs
Power mode = medium, 200 pF load 0.9 – – V/µs
Power mode = high, 200 pF load 3 – – V/µs
enInput noise density Power mode = high, VDDA = 5 V,
at 100 kHz
–45–nV/sqrtHz
Note
51. Based on device characterization (Not production tested).
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 91 of 137
11.5.2 Delta-Sigma ADC
Unless otherwise specified, operating conditions are:
Operation in continuous sample mode
fclk = 6.144 MHz
Reference = 1.024 V internal reference bypassed on P3.2 or P0.3
Unless otherwise specified, all charts and graphs show typical values
Table 11-21. 12-bit Delta-sigma ADC DC Specifications
Parameter Description Conditions Min Typ Max Units
Resolution 8 – 12 bits
Number of channels, single ended – – No. of
GPIO –
Number of channels, differential Differential pair is formed using a
pair of GPIOs. ––
No. of
GPIO/2 –
Monotonic Yes – – – –
Ge Gain error Buffered, buffer gain = 1,
Range = ±1.024 V, 25 °C ––±0.2%
Gd Gain drift Buffered, buffer gain = 1,
Range = ±1.024 V – – 50 ppm/°C
Vos Input offset voltage Buffered, 12-bit mode – – ±0.1 mV
TCVos
Temperature coefficient, input offset
voltage
Buffer gain = 1, 12-bit,
Range = ±1.024 V –– 1µV/°C
Input voltage range, single ended[52] VSSA –V
DDA V
Input voltage range, differential
unbuffered[52] VSSA –V
DDA V
Input voltage range, differential,
buffered[52] VSSA –V
DDA – 1 V
INL12 Integral non linearity[52] Range = ±1.024 V, unbuffered – –±1 LSB
DNL12 Differential non linearity[52] Range = ±1.024 V, unbuffered – –±1 LSB
INL8 Integral non linearity[52] Range = ±1.024 V, unbuffered – –±1 LSB
DNL8 Differential non linearity[52] Range = ±1.024 V, unbuffered – –±1 LSB
Rin_Buff ADC input resistance Input buffer used 10 – – M
Rin_ADC12
ADC input resistance Input buffer bypassed, 12 bit, Range
= ±1.024 V –148
[53] –k
Rin_ExtRef
ADC external reference input resistance – 70[53, 54] –k
Vextref
ADC external reference input voltage, see
also internal reference in Voltage
Reference on page 93
Pins P0[3], P3[2] 0.9 – 1.3 V
Current Consumption
IDD_12 IDDA + IDDD current consumption, 12 bit[52] 192 ksps, unbuffered – – 1.95 mA
IBUFF Buffer current consumption[52] –– 2.5mA
Notes
52. Based on device characterization (not production tested).
53. By using switched capacitors at the ADC input an effective input resistance is created. Holding the gain and number of bits constant, the resistance is proportional to
the inverse of the clock frequency. This value is calculated, not measured. For more information see the Technical Reference Manual.
54. Recommend an external reference device with an output impedance <100 , for example, the LM185/285/385 family. A 1-µF capacitor is recommended. For more
information, see AN61290 - PSoC® 3 and PSoC 5LP Hardware Design Considerations.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 92 of 137
Table 11-22. Delta-sigma ADC AC Specifications
Parameter Description Conditions Min Typ Max Units
Startup time –– 4
Samples
THD Total harmonic distortion[55] Buffer gain = 1, 12-bit,
Range = ±1.024 V
– – 0.0032 %
12-Bit Resolution Mode
SR12 Sample rate, continuous, high power[55] Range = ±1.024 V, unbuffered 4 – 192 ksps
BW12 Input bandwidth at max sample rate[55] Range = ±1.024 V, unbuffered –44 –kHz
SINAD12int Signal to noise ratio, 12-bit, internal reference[55] Range = ±1.024 V, unbuffered 66 – – dB
8-Bit Resolution Mode
SR8 Sample rate, continuous, high power[55] Range = ±1.024 V, unbuffered 8 – 384 ksps
BW8 Input bandwidth at max sample rate[55] Range = ±1.024 V, unbuffered –88 –kHz
SINAD8int Signal to noise ratio, 8-bit, internal reference[55] Range = ±1.024 V, unbuffered 43 – – dB
Table 11-23. Delta-sigma ADC Sample Rates, Range = ±1.024 V
Resolution,
Bits
Continuous Multi-Sample
Min Max Min Max
8 8000 384000 1911 91701
9 6400 307200 1543 74024
10 5566 267130 1348 64673
11 4741 227555 1154 55351
12 4000 192000 978 46900
Note
55. Based on device characterization (Not production tested).
Figure 11-33. Delta-sigma ADC IDD vs sps, Range = ±1.024 V,
Continuous Sample Mode, Input Buffer Bypassed
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 93 of 137
11.5.3 Voltage Reference
Figure 11-34. Voltage Reference vs. Temperature and VCCA Figure 11-35. Voltage Reference Long-Term Drift
11.5.4 Analog Globals
Table 11-24. Voltage Reference Specifications
See also ADC external reference specifications in Section 11.5.2.
Parameter Description Conditions Min Typ Max Units
VREF[56] Precision reference voltage Initial trimming, 25 °C 1.023 (–
0.1%)
1.024 1.025
(+0.1%)
V
After typical PCB assembly,
post reflow
Typical (non-optimized) board
layout and 250 °C solder reflow.
Device may be calibrated after
assembly to improve performance
–40 °C – ±0.5 – %
25 °C – ±0.2 – %
85 °C – ±0.2 – %
Temperature drift[57] Box method – – 30 ppm/°C
Long term drift – 100 – ppm/khr
Thermal cycling drift
(stability)[57, 58] – 100 – ppm
Table 11-25. Analog Globals Specifications
Parameter Description Conditions Min Typ Max Units
Rppag Resistance pin-to-pin through
P2[4], AGL0, DSM INP, AGL1,
P2[5][59]
VDDA = 3 V – 1472 2200
Rppmuxbus Resistance pin-to-pin through
P2[3], amuxbusL, P2[4][59] VDDA = 3 V – 706 1100
Notes
56. VREF is measured after packaging, and thus accounts for substrate and die attach stresses.
57. Based on device characterization (Not production tested).
58. After eight full cycles between –40 °C and 100 °C.
59. The resistance of the analog global and analog mux bus is high if VDDA 2.7 V, and the chip is in either sleep or hibernate mode. Use of analog global and analog
mux bus under these conditions is not recommended.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 94 of 137
11.5.5 Comparator
11.5.6 Current Digital-to-analog Converter (IDAC)
All specifications are based on use of the low-resistance IDAC output pins (see Pin Descriptions on page 12 for details). See the IDAC
component data sheet in PSoC Creator for full electrical specifications and APIs.
Unless otherwise specified, all charts and graphs show typical values.
Notes
60. The recommended procedure for using a custom trim value for the on-chip comparators can be found in the TRM.
61. Based on device characterization (Not production tested).
Table 11-26. Comparator DC Specifications
Parameter Description Conditions Min Typ Max Units
VOS
Input offset voltage in fast mode Factory trim, VDDA > 2.7 V,
Vin 0.5 V
–10mV
Input offset voltage in slow mode Factory trim, Vin 0.5 V – 9 mV
Input offset voltage in fast mode[60] Custom trim – – 4 mV
Input offset voltage in slow mode[60] Custom trim – – 4 mV
Input offset voltage in ultra
low-power mode
VDDA 4.6 V – ±12 – mV
VHYST Hysteresis Hysteresis enable mode – 10 32 mV
VICM Input common mode voltage High current / fast mode VSSA –V
DDA V
Low current / slow mode VSSA –V
DDA V
Ultra low power mode
VDDA 4.6 V
VSSA –V
DDA – 1.15 V
CMRR Common mode rejection ratio – 50 – dB
ICMP High current mode/fast mode[61] –– 400 µA
Low current mode/slow mode[61] –– 100µA
Ultra low-power mode[61] VDDA 4.6 V – 6 – µA
Table 11-27. Comparator AC Specifications
Parameter Description Conditions Min Typ Max Units
TRESP
Response time, high current
mode[61] 50 mV overdrive, measured
pin-to-pin
– 75 110 ns
Response time, low current
mode[61] 50 mV overdrive, measured
pin-to-pin
– 155 200 ns
Response time, ultra low-power
mode[61] 50 mV overdrive, measured
pin-to-pin, VDDA 4.6 V
–55 – µs
Table 11-28. IDAC DC Specifications
Parameter Description Conditions Min Typ Max Units
Resolution – – 8 bits
IOUT Output current at code = 255 Range = 2.04 mA, code = 255,
VDDA 2.7 V, Rload = 600
–2.04 – mA
Range = 2.04 mA, high speed
mode, code = 255, VDDA 2.7 V,
Rload = 300
–2.04 – mA
Range = 255 µA, code = 255, Rload
= 600
–255 – µA
Range = 31.875 µA, code = 255,
Rload = 600
– 31.875 – µA
Monotonicity – – Yes
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 95 of 137
Ezs Zero scale error – 0 ±1 LSB
Eg Gain error Range = 2.04 mA, 25 °C – – ±2.5 %
Range = 255 µA, 25 ° C – – ±2.5 %
Range = 31.875 µA, 25 ° C – – ±3.5 %
TC_Eg Temperature coefficient of gain
error
Range = 2.04 mA – – 0.04 % / °C
Range = 255 µA – – 0.04 % / °C
Range = 31.875 µA – – 0.05 % / °C
INL Integral nonlinearity Sink mode, range = 255 µA, Codes
8 – 255, Rload = 2.4 k, Cload =
15 pF
–±0.9±1 LSB
Source mode, range = 255 µA,
Codes 8 – 255, Rload = 2.4 k,
Cload = 15 pF
–±1.2±1.6 LSB
DNL Differential nonlinearity Sink mode, range = 255 µA, Rload
= 2.4 k, Cload = 15 pF
–±0.3±1 LSB
Source mode, range = 255 µA,
Rload = 2.4 k, Cload = 15 pF
–±0.3±1 LSB
Vcompliance Dropout voltage, source or sink
mode
Voltage headroom at max current,
Rload to VDDA or Rload to VSSA,
VDIFF from VDDA
1– – V
IDD Operating current, code = 0 Low speed mode, source mode,
range = 31.875 µA
– 44 100 µA
Low speed mode, source mode,
range = 255 µA,
– 33 100 µA
Low speed mode, source mode,
range = 2.04 mA
– 33 100 µA
Low speed mode, sink mode,
range = 31.875 µA
– 36 100 µA
Low speed mode, sink mode,
range = 255 µA
– 33 100 µA
Low speed mode, sink mode,
range = 2.04 mA
– 33 100 µA
High speed mode, source mode,
range = 31.875 µA
– 310 500 µA
High speed mode, source mode,
range = 255 µA
– 305 500 µA
High speed mode, source mode,
range = 2.04 mA
– 305 500 µA
High speed mode, sink mode,
range = 31.875 µA
– 310 500 µA
High speed mode, sink mode,
range = 255 µA
– 300 500 µA
High speed mode, sink mode,
range = 2.04 mA
– 300 500 µA
Table 11-28. IDAC DC Specifications (continued)
Parameter Description Conditions Min Typ Max Units
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 96 of 137
Figure 11-36. IDAC INL vs Input Code, Range = 255 µA,
Source Mode
Figure 11-37. IDAC INL vs Input Code, Range = 255 µA, Sink
Mode
Figure 11-38. IDAC DNL vs Input Code, Range = 255 µA,
Source Mode
Figure 11-39. IDAC DNL vs Input Code, Range = 255 µA, Sink
Mode
Figure 11-40. IDAC INL vs Temperature, Range = 255 µA, High
speed mode
Figure 11-41. IDAC DNL vs Temperature, Range = 255 µA,
High speed mode
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 97 of 137
Figure 11-42. IDAC Full Scale Error vs Temperature, Range
= 255 µA, Source Mode
Figure 11-43. IDAC Full Scale Error vs Temperature, Range
= 255 µA, Sink Mode
Figure 11-44. IDAC Operating Current vs Temperature,
Range = 255 µA, Code = 0, Source Mode
Figure 11-45. IDAC Operating Current vs Temperature,
Range = 255 µA, Code = 0, Sink Mode
Table 11-29. IDAC AC Specifications
Parameter Description Conditions Min Typ Max Units
FDAC Update rate – – 8 Msps
TSETTLE Settling time to 0.5 LSB Range = 31.875 µA or 255 µA, full
scale transition, High speed mode,
600 15-pF load
– – 125 ns
Current noise Range = 255 µA, source mode,
High speed mode, VDDA = 5 V,
10 kHz
–340 –pA/sqrtHz
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 98 of 137
Figure 11-46. IDAC Step Response, Codes 0x40 - 0xC0,
255 µA Mode, Source Mode, High speed mode, VDDA = 5 V
Figure 11-47. IDAC Glitch Response, Codes 0x7F - 0x80,
255 µA Mode, Source Mode, High speed mode, VDDA = 5 V
Figure 11-48. IDAC PSRR vs Frequency Figure 11-49. IDAC Current Noise, 255 µA Mode,
Source Mode, High speed mode, VDDA = 5 V
20
30
40
50
60
P
SRR, dB
0
10
20
0.1 1 10 100 1000 10000
P
Frequency, kHz
255 ȝA, code 0x7F 255 ȝA, code 0xFF
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 99 of 137
11.5.7 Voltage Digital to Analog Converter (VDAC)
See the VDAC component datasheet in PSoC Creator for full electrical specifications and APIs.
Unless otherwise specified, all charts and graphs show typical values.
Figure 11-50. VDAC INL vs Input Code, 1 V Mode Figure 11-51. VDAC DNL vs Input Code, 1 V Mode
Table 11-30. VDAC DC Specifications
Parameter Description Conditions Min Typ Max Units
Resolution – 8 – bits
INL1 Integral nonlinearity 1 V scale – ±2.1 ±2.5 LSB
INL4 Integral nonlinearity[62] 4 V scale – ±2.1 ±2.5 LSB
DNL1 Differential nonlinearity 1 V scale – ±0.3 ±1 LSB
DNL4 Differential nonlinearity[62] 4 V scale – ±0.3 ±1 LSB
Rout Output resistance 1 V scale – 4 – k
4 V scale – 16 – k
VOUT Output voltage range, code = 255 1 V scale – 1.02 – V
4 V scale, VDDA = 5 V – 4.08 – V
Monotonicity – – Yes –
VOS Zero scale error – 0 ±0.9 LSB
Eg Gain error 1 V scale – – ±2.5 %
4 V scale – – ±2.5 %
TC_Eg Temperature coefficient, gain error 1 V scale – – 0.03 %FSR / °C
4 V scale – – 0.03 %FSR / °C
IDD Operating current Low speed mode – – 100 µA
High speed mode – – 500 µA
Note
62. Based on device characterization (Not production tested).
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 100 of 137
Figure 11-52. VDAC INL vs Temperature, 1 V Mode Figure 11-53. VDAC DNL vs Temperature, 1 V Mode
Figure 11-54. VDAC Full Scale Error vs Temperature, 1 V
Mode
Figure 11-55. VDAC Full Scale Error vs Temperature, 4 V
Mode
Figure 11-56. VDAC Operating Current vs Temperature, 1V
Mode, Low speed mode
Figure 11-57. VDAC Operating Current vs Temperature, 1 V
Mode, High speed mode
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 101 of 137
Figure 11-58. VDAC Step Response, Codes 0x40 - 0xC0, 1 V
Mode, High speed mode, VDDA = 5 V
Figure 11-59. VDAC Glitch Response, Codes 0x7F - 0x80, 1 V
Mode, High speed mode, VDDA = 5 V
Figure 11-60. VDAC PSRR vs Frequency Figure 11-61. VDAC Voltage Noise, 1 V Mode, High speed
mode, VDDA = 5 V
Table 11-31. VDAC AC Specifications
Parameter Description Conditions Min Typ Max Units
FDAC Update rate 1 V scale – – 1000 ksps
4 V scale – – 250 ksps
TsettleP Settling time to 0.1%, step 25% to
75%
1 V scale, Cload = 15 pF – 0.45 1 µs
4 V scale, Cload = 15 pF – 0.8 3.2 µs
TsettleN Settling time to 0.1%, step 75% to
25%
1 V scale, Cload = 15 pF – 0.45 1 µs
4 V scale, Cload = 15 pF – 0.7 3 µs
Voltage noise Range = 1 V, High speed mode,
VDDA = 5 V, 10 kHz
–750 –nV/sqrtHz
20
30
40
50
P
SRR, dB
0
10
0.1 1 10 100 1000
P
Frequency, kHz
4 V, code 0x7F 4 V, code 0xFF
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 102 of 137
11.5.8 Mixer
The mixer is created using a SC/CT analog block; see the Mixer component data sheet in PSoC Creator for full electrical specifications
and APIs.
11.5.9 Transimpedance Amplifier
The TIA is created using a SC/CT analog block; see the TIA component data sheet in PSoC Creator for full electrical specifications
and APIs.
Table 11-32. Mixer DC Specifications
Parameter Description Conditions Min Typ Max Units
VOS Input offset voltage – – 15 mV
Quiescent current – 0.9 2 mA
G Gain – 0 – dB
Table 11-33. Mixer AC Specifications[63]
Parameter Description Conditions Min Typ Max Units
fLO Local oscillator frequency Down mixer mode – – 4 MHz
fin Input signal frequency Down mixer mode – – 14 MHz
fLO Local oscillator frequency Up mixer mode – – 1 MHz
fin Input signal frequency Up mixer mode – – 1 MHz
SR Slew rate 3 – – V/µs
Table 11-34. Transimpedance Amplifier (TIA) DC Specifications
Parameter Description Conditions Min Typ Max Units
VIOFF Input offset voltage – – 10 mV
Rconv Conversion resistance[64] R = 20K; 40 pF load –25 – +35 %
R = 30K; 40 pF load –25 – +35 %
R = 40K; 40 pF load –25 – +35 %
R = 80K; 40 pF load –25 – +35 %
R = 120K; 40 pF load –25 – +35 %
R = 250K; 40 pF load –25 – +35 %
R= 500K; 40 pF load –25 – +35 %
R = 1M; 40 pF load –25 – +35 %
Quiescent current – 1.1 2 mA
Table 11-35. Transimpedance Amplifier (TIA) AC Specifications
Parameter Description Conditions Min Typ Max Units
BW Input bandwidth (–3 dB) R = 20K; –40 pF load 1500 – – kHz
R = 120K; –40 pF load 240 – – kHz
R = 1M; –40 pF load 25 – – kHz
Notes
63. Based on device characterization (Not production tested).
64. Conversion resistance values are not calibrated. Calibrated values and details about calibration are provided in PSoC Creator component data sheets. External
precision resistors can also be used.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 103 of 137
11.5.10 Programmable Gain Amplifier
The PGA is created using a SC/CT analog block; see the PGA component data sheet in PSoC Creator for full electrical specifications
and APIs.
Unless otherwise specified, operating conditions are:
Operating temperature = 25 °C for typical values
Unless otherwise specified, all charts and graphs show typical values
Figure 11-62. PGA Voffset Histogram, 4096 samples/
1024 parts
Table 11-36. PGA DC Specifications
Parameter Description Conditions Min Typ Max Units
Vin Input voltage range Power mode = minimum VSSA –V
DDA V
Vos Input offset voltage Power mode = high,
gain = 1
––10mV
TCVos Input offset voltage drift
with temperature
Power mode = high,
gain = 1
––±30µV/°C
Ge1 Gain error, gain = 1 – – ±0.15 %
Ge16 Gain error, gain = 16 – – ±2.5 %
Ge50 Gain error, gain = 50 – – ±5 %
Vonl DC output nonlinearity Gain = 1 – – ±0.01 % of
FSR
Cin Input capacitance – – 7 pF
Voh Output voltage swing Power mode = high,
gain = 1, Rload = 100 k
to VDDA / 2
VDDA – 0.15 – – V
Vol Output voltage swing Power mode = high,
gain = 1, Rload = 100 k
to VDDA / 2
––V
SSA + 0.15 V
Vsrc Output voltage under load Iload = 250 µA, VDDA
2.7 V, power mode = high
– – 300 mV
Idd Operating current Power mode = high – 1.5 1.65 mA
PSRR Power supply rejection
ratio
48 – – dB
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 104 of 137
Figure 11-63. Bandwidth vs. Temperature, at Different Gain
Settings, Power Mode = High
Figure 11-64. Noise vs. Frequency, VDDA = 5 V,
Power Mode = High
11.5.11 Temperature Sensor
11.5.12 LCD Direct Drive
Table 11-37. PGA AC Specifications
Parameter Description Conditions Min Typ Max Units
BW1 –3 dB bandwidth Power mode = high,
gain = 1, input = 100 mV
peak-to-peak
6.7 8 – MHz
SR1 Slew rate Power mode = high,
gain = 1, 20% to 80%
3––V/µs
enInput noise density Power mode = high,
VDDA = 5 V, at 100 kHz
–43–nV/sqrtHz
1
10
, MHz
0.1
-40-20 0 20406080
BW
Temperature, °C
Gain = 1 Gain = 24 Gain = 48
Table 11-38. Temperature Sensor Specifications
Parameter Description Conditions Min Typ Max Units
Temp sensor accuracy Range: –40 °C to +85 °C – ±5 – °C
Table 11-39. LCD Direct Drive DC Specifications
Parameter Description Conditions Min Typ Max Units
ICC LCD system operating current Device sleep mode with wakeup at
400-Hz rate to refresh LCDs, bus
clock = 3 MHz, VDDIO = VDDA = 3 V,
4 commons, 16 segments, 1/4 duty
cycle, 50 Hz frame rate, no glass
connected
–38 –A
ICC_SEG Current per segment driver Strong drive mode – 260 – µA
VBIAS LCD bias range (VBIAS refers to the main
output voltage(V0) of LCD DAC)
VDDA 3 V and VDDA VBIAS 2– 5V
LCD bias step size VDDA 3 V and VDDA VBIAS – 9.1 × VDDA –mV
LCD capacitance per
segment/common driver
Drivers may be combined – 500 5000 pF
Long term segment offset – – 20 mV
IOUT Output drive current per segment driver) VDDIO = 5.5V, strong drive mode 355 – 710 µA
Table 11-40. LCD Direct Drive AC Specifications
Parameter Description Conditions Min Typ Max Units
fLCD LCD frame rate 10 50 150 Hz
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 105 of 137
11.6 Digital Peripherals
Specifications are valid for –40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V,
except where noted.
11.6.1 Timer
The following specifications apply to the Timer/Counter/PWM peripheral in timer mode. Timers can also be implemented in UDBs; for
more information, see the Timer component data sheet in PSoC Creator.
11.6.2 Counter
The following specifications apply to the Timer/Counter/PWM peripheral, in counter mode. Counters can also be implemented in
UDBs; for more information, see the Counter component data sheet in PSoC Creator.
Table 11-41. Timer DC Specifications
Parameter Description Conditions Min Typ Max Units
Block current consumption 16-bit timer, at listed input clock
frequency
–––µA
3 MHz – 15 – µA
12 MHz – 60 – µA
48 MHz – 260 – µA
67 MHz – 350 – µA
Table 11-42. Timer AC Specifications
Parameter Description Conditions Min Typ Max Units
Operating frequency DC – 67.01 MHz
Capture pulse width (Internal) 15 – – ns
Capture pulse width (external) 30 – – ns
Timer resolution 15 – – ns
Enable pulse width 15 – – ns
Enable pulse width (external) 30 – – ns
Reset pulse width 15 – – ns
Reset pulse width (external) 30 – – ns
Table 11-43. Counter DC Specifications
Parameter Description Conditions Min Typ Max Units
Block current consumption 16–bit counter, at listed input clock
frequency
–––µA
3 MHz – 15 – µA
12 MHz – 60 – µA
48 MHz – 260 – µA
67 MHz – 350 – µA
Table 11-44. Counter AC Specifications
Parameter Description Conditions Min Typ Max Units
Operating frequency DC – 67.01 MHz
Capture pulse 15 – – ns
Resolution 15 – – ns
Pulse width 15 – – ns
Pulse width (external) 30 – – ns
Enable pulse width 15 – – ns
Enable pulse width (external) 30 – – ns
Reset pulse width 15 – – ns
Reset pulse width (external) 30 – – ns
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 106 of 137
11.6.3 Pulse Width Modulation
The following specifications apply to the Timer/Counter/PWM peripheral, in PWM mode. PWM components can also be implemented
in UDBs; for more information, see the PWM component data sheet in PSoC Creator.
11.6.4 I2C
11.6.5 Controller Area Network
Table 11-45. PWM DC Specifications
Parameter Description Conditions Min Typ Max Units
Block current consumption 16-bit PWM, at listed input clock
frequency
–––µA
3 MHz – 15 – µA
12 MHz – 60 – µA
48 MHz – 260 – µA
67 MHz – 350 – µA
Table 11-46. Pulse Width Modulation (PWM) AC Specifications
Parameter Description Conditions Min Typ Max Units
Operating frequency DC – 67.01 MHz
Pulse width 15 – – ns
Pulse width (external) 30 – – ns
Kill pulse width 15 – – ns
Kill pulse width (external) 30 – – ns
Enable pulse width 15 – – ns
Enable pulse width (external) 30 – – ns
Reset pulse width 15 – – ns
Reset pulse width (external) 30 – – ns
Table 11-47. Fixed I2C DC Specifications
Parameter Description Conditions Min Typ Max Units
Block current consumption Enabled, configured for 100 kbps – – 250 µA
Enabled, configured for 400 kbps – – 260 µA
Wake from sleep mode – – 30 µA
Table 11-48. Fixed I2C AC Specifications
Parameter Description Conditions Min Typ Max Units
Bit rate – – 1 Mbps
Note
65. Refer to ISO 11898 specification for details.
Table 11-49. CAN DC Specifications[65]
Parameter Description Conditions Min Typ Max Units
IDD Block current consumption – – 200 µA
Table 11-50. CAN AC Specifications[65]
Parameter Description Conditions Min Typ Max Units
Bit rate Minimum 8 MHz clock – – 1 Mbit
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 107 of 137
11.6.6 Digital Filter Block
11.6.7 USB
Table 11-51. DFB DC Specifications
Parameter Description Conditions Min Typ Max Units
DFB operating current 64-tap FIR at FDFB
500 kHz (6.7 ksps) – 0.16 0.27 mA
1 MHz (13.4 ksps) – 0.33 0.53 mA
10 MHz (134 ksps) – 3.3 5.3 mA
48 MHz (644 ksps) – 15.7 25.5 mA
67 MHz (900 ksps) – 21.8 35.6 mA
Table 11-52. DFB AC Specifications
Parameter Description Conditions Min Typ Max Units
FDFB DFB operating frequency DC – 67.01 MHz
Note
66. Rise/fall time matching (TR) not guaranteed, see USB Driver AC Specifications on page 87.
Table 11-53. USB DC Specifications
Parameter Description Conditions Min Typ Max Units
VUSB_5 Device supply (VDDD) for USB
operation
USB configured, USB regulator
enabled
4.35 – 5.25 V
VUSB_3.3 USB configured, USB regulator
bypassed
3.15 – 3.6 V
VUSB_3 USB configured, USB regulator
bypassed[66] 2.85 – 3.6 V
IUSB_Configured Device supply current in device
active mode, bus clock and IMO =
24 MHz
VDDD = 5 V, FCPU = 1.5 MHz – 10 – mA
VDDD = 3.3 V, FCPU = 1.5 MHz – 8 – mA
IUSB_Suspended Device supply current in device
sleep mode
VDDD = 5 V, connected to USB
host, PICU configured to wake on
USB resume signal
–0.5 – mA
VDDD = 5 V, disconnected from
USB host
–0.3 – mA
VDDD = 3.3 V, connected to USB
host, PICU configured to wake on
USB resume signal
–0.5 – mA
VDDD = 3.3 V, disconnected from
USB host
–0.3 – mA
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 108 of 137
11.6.8 Universal Digital Blocks (UDBs)
PSoC Creator provides a library of prebuilt and tested standard digital peripherals (UART, SPI, LIN, PRS, CRC, timer, counter, PWM,
AND, OR, and so on) that are mapped to the UDB array. See the component data sheets in PSoC Creator for full AC/DC specifications,
APIs, and example code.
Figure 11-65. Clock to Output Performance
Table 11-54. UDB AC Specifications
Parameter Description Conditions Min Typ Max Units
Datapath Performance
FMAX_TIMER Maximum frequency of 16-bit timer in
a UDB pair
––67.01MHz
FMAX_ADDER Maximum frequency of 16-bit adder
in a UDB pair
––67.01MHz
FMAX_CRC Maximum frequency of 16-bit
CRC/PRS in a UDB pair
––67.01MHz
PLD Performance
FMAX_PLD Maximum frequency of a two-pass
PLD function in a UDB pair
––67.01MHz
Clock to Output Performance
tCLK_OUT Propagation delay for clock in to data
out, see Figure 11-65.
25 °C, VDDD 2.7 V – 20 25 ns
tCLK_OUT Propagation delay for clock in to data
out, see Figure 11-65.
Worst-case placement, routing,
and pin selection
– – 55 ns
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 109 of 137
11.7 Memory
Specifications are valid for –40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V,
except where noted.
11.7.1 Flash
11.7.2 EEPROM
Note
67. See PSoC® 3 Device Programming Specifications for a low-overhead method of programming PSoC 3 flash.
Table 11-55. Flash DC Specifications
Parameter Description Conditions Min Typ Max Units
Erase and program voltage VDDD pin 1.71 – 5.5 V
Table 11-56. Flash AC Specifications
Parameter Description Conditions Min Typ Max Units
TWRITE Row write time (erase + program) – 15 20 ms
TERASE Row erase time – 10 13 ms
Row program time – 5 7 ms
TBULK Bulk erase time (16 KB to 64 KB) – – 35 ms
Sector erase time (8 KB to 16 KB) – – 15 ms
TPROG Total device programming time No overhead[67] – 1.5 2 seconds
Flash data retention time, retention
period measured from last erase cycle
Average ambient temp.
TA 55 °C, 100 K erase/program
cycles
20 – – years
Average ambient temp.
TA 85 °C, 10 K erase/program
cycles
10 – –
Table 11-57. EEPROM DC Specifications
Parameter Description Conditions Min Typ Max Units
Erase and program voltage 1.71 – 5.5 V
Table 11-58. EEPROM AC Specifications
Parameter Description Conditions Min Typ Max Units
TWRITE Single row erase/write cycle time – 10 20 ms
EEPROM data retention time, retention
period measured from last erase cycle
Average ambient temp, TA 25 °C,
1M erase/program cycles
20 – – years
Average ambient temp, TA 55 °C,
100 K erase/program cycles
20 – –
Average ambient temp.
TA 85 °C, 10 K erase/program
cycles
10 – –
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 110 of 137
11.7.3 Nonvolatile Latches (NVL))
11.7.4 SRAM
Table 11-59. NVL DC Specifications
Parameter Description Conditions Min Typ Max Units
Erase and program voltage VDDD pin 1.71 – 5.5 V
Table 11-60. NVL AC Specifications
Parameter Description Conditions Min Typ Max Units
NVL endurance Programmed at 25 °C 1K – – program/
erase
cycles
Programmed at 0 °C to 70 °C 100 – – program/
erase
cycles
NVL data retention time Average ambient temp. TA 55 °C 20 – – years
Average ambient temp. TA 85 °C 10 – – years
Table 11-61. SRAM DC Specifications
Parameter Description Conditions Min Typ Max Units
VSRAM SRAM retention voltage 1.2 – – V
Table 11-62. SRAM AC Specifications
Parameter Description Conditions Min Typ Max Units
FSRAM SRAM operating frequency DC – 67.01 MHz
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 111 of 137
11.7.5 External Memory Interface
Figure 11-66. Asynchronous Write and Read Cycle Timing, No Wait States
Tbus_clock
Bus Clock
EM_Addr
EM_CE
EM_WE
EM_OE
EM_Data
Write Cycle Read Cycle
Minimum of 4 bus clock cycles between successive EMIF accesses
Trd_setup Trd_hold
Twr_setup
Notes
68. Based on device characterization (Not production tested).
69. EMIF signal timings are limited by GPIO frequency limitations. See “GPIO” section on page 80.
70. EMIF output signals are generally synchronized to bus clock, so EMIF signal timings are dependent on bus clock frequency.
Table 11-63. Asynchronous Write and Read Timing Specifications[68]
Parameter Description Conditions Min Typ Max Units
Fbus_clock Bus clock frequency[69] ––33MHz
Tbus_clock Bus clock period[70] 30.3 – – ns
Twr_Setup Time from EM_data valid to rising
edge of EM_WE and EM_CE
Tbus_clock – 10 – – ns
Trd_setup Time that EM_data must be valid
before rising edge of EM_OE
5––ns
Trd_hold Time that EM_data must be valid
after rising edge of EM_OE
5––ns
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 112 of 137
Figure 11-67. Synchronous Write and Read Cycle Timing, No Wait States
Table 11-64. Synchronous Write and Read Timing Specifications[71]
Parameter Description Conditions Min Typ Max Units
Fbus_clock Bus clock frequency[72] ––33MHz
Tbus_clock Bus clock period[73] 30.3 – – ns
Twr_Setup Time from EM_data valid to rising edge of
EM_Clock
Tbus_clock – 10 – – ns
Trd_setup Time that EM_data must be valid before
rising edge of EM_OE
5––ns
Trd_hold Time that EM_data must be valid after rising
edge of EM_OE
5––ns
Tbus_clock
Bus Clock
EM_Addr
EM_CE
EM_ADSC
EM_Clock
EM_WE
EM_OE
EM_Data
Trd_setup Trd_hold
Write Cycle Read Cycle
Minimum of 4 bus clock cycles between successive EMIF accesses
Twr_setup
Notes
71. Based on device characterization (Not production tested).
72. EMIF signal timings are limited by GPIO frequency limitations. See “GPIO” section on page 80.
73. EMIF output signals are generally synchronized to bus clock, so EMIF signal timings are dependent on bus clock frequency.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 113 of 137
11.8 PSoC System Resources
Specifications are valid for –40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V,
except where noted.
11.8.1 POR with Brown Out
For brown out detect in regulated mode, VDDD and VDDA must be 2.0 V. Brown out detect is not available in externally regulated
mode.
11.8.2 Voltage Monitors
Table 11-65. Precise Low-Voltage Reset (PRES) with Brown Out DC Specifications
Parameter Description Conditions Min Typ Max Units
PRESR Rising trip voltage Factory trim 1.64 – 1.68 V
PRESF Falling trip voltage 1.62 – 1.66 V
Table 11-66. Power On Reset (POR) with Brown Out AC Specifications
Parameter Description Conditions Min Typ Max Units
PRES_TR Response time – – 0.5 µs
VDDD/VDDA droop rate Sleep mode – 5 – V/sec
Note
74. Based on device characterization (Not production tested).
Table 11-67. Voltage Monitors DC Specifications
Parameter Description Conditions Min Typ Max Units
LVI Trip voltage – – – –
LVI_A/D_SEL[3:0] = 0000b 1.68 1.73 1.77 V
LVI_A/D_SEL[3:0] = 0001b 1.89 1.95 2.01 V
LVI_A/D_SEL[3:0] = 0010b 2.14 2.20 2.27 V
LVI_A/D_SEL[3:0] = 0011b 2.38 2.45 2.53 V
LVI_A/D_SEL[3:0] = 0100b 2.62 2.71 2.79 V
LVI_A/D_SEL[3:0] = 0101b 2.87 2.95 3.04 V
LVI_A/D_SEL[3:0] = 0110b 3.11 3.21 3.31 V
LVI_A/D_SEL[3:0] = 0111b 3.35 3.46 3.56 V
LVI_A/D_SEL[3:0] = 1000b 3.59 3.70 3.81 V
LVI_A/D_SEL[3:0] = 1001b 3.84 3.95 4.07 V
LVI_A/D_SEL[3:0] = 1010b 4.08 4.20 4.33 V
LVI_A/D_SEL[3:0] = 1011b 4.32 4.45 4.59 V
LVI_A/D_SEL[3:0] = 1100b 4.56 4.70 4.84 V
LVI_A/D_SEL[3:0] = 1101b 4.83 4.98 5.13 V
LVI_A/D_SEL[3:0] = 1110b 5.05 5.21 5.37 V
LVI_A/D_SEL[3:0] = 1111b 5.30 5.47 5.63 V
HVI Trip voltage 5.57 5.75 5.92 V
Table 11-68. Voltage Monitors AC Specifications
Parameter Description Conditions Min Typ Max Units
Response time[74] –– 1µs
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 114 of 137
11.8.3 Interrupt Controller
11.8.4 JTAG Interface
Figure 11-68. JTAG Interface Timing
Table 11-69. Interrupt Controller AC Specifications
Parameter Description Conditions Min Typ Max Units
Delay from interrupt signal input to ISR
code execution from ISR code
Includes worse case completion of
longest instruction DIV with 6
cycles
– – 25 Tcy CPU
Table 11-70. JTAG Interface AC Specifications[75]
Parameter Description Conditions Min Typ Max Units
f_TCK TCK frequency 3.3 V VDDD 5V – – 14
[76] MHz
1.71 V VDDD < 3.3 V – – 7[76] MHz
T_TDI_setup TDI setup before TCK high (T/10) – 5 – – ns
T_TMS_setup TMS setup before TCK high T/4 – –
T_TDI_hold TDI, TMS hold after TCK high T = 1/f_TCK max T/4 – –
T_TDO_valid TCK low to TDO valid T = 1/f_TCK max – – 2T/5
T_TDO_hold TDO hold after TCK high T = 1/f_TCK max T/4 – –
TDI
TCK
T_TDI_setup
TDO
(1/f_TCK)
T_TDI_hold
T_TDO_valid T_TDO_hold
TMS
T_TMS_setup T_TMS_hold
Notes
75. Based on device characterization (Not production tested).
76. f_TCK must also be no more than 1/3 CPU clock frequency.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 115 of 137
11.8.5 SWD Interface
Figure 11-69. SWD Interface Timing
11.8.6 SWV Interface
Table 11-71. SWD Interface AC Specifications[77]
Parameter Description Conditions Min Typ Max Units
f_SWDCK SWDCLK frequency 3.3 V VDDD 5V – – 14
[78] MHz
1.71 V VDDD < 3.3 V – – 7[78] MHz
1.71 V VDDD < 3.3 V,
SWD over USBIO pins
––5.5
[78] MHz
T_SWDI_setup SWDIO input setup before SWDCK high T = 1/f_SWDCK max T/4 – – –
T_SWDI_hold SWDIO input hold after SWDCK high T = 1/f_SWDCK max T/4 – – –
T_SWDO_valid SWDCK high to SWDIO output T = 1/f_SWDCK max – – 2T/5 –
SWDIO
(PSoC input)
SWDCK
T_SWDI_setup
SWDIO
(PSoC output)
(1/f_SWDCK)
T_SWDI_hold
T_SWDO_valid T_SWDO_hold
Table 11-72. SWV Interface AC Specifications[77]
Parameter Description Conditions Min Typ Max Units
SWV mode SWV bit rate – – 33 Mbit
Notes
77. Based on device characterization (Not production tested).
78. f_SWDCK must also be no more than 1/3 CPU clock frequency.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 116 of 137
11.9 Clocking
Specifications are valid for –40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V,
except where noted.
11.9.1 Internal Main Oscillator
Figure 11-70. IMO Current vs. Frequency
Notes
79. FIMO is measured after packaging, and thus accounts for substrate and die attach stresses.
80. Based on device characterization (Not production tested).
Table 11-73. IMO DC Specifications
Parameter Description Conditions Min Typ Max Units
Supply current
62.6 MHz – – 600 µA
48 MHz – – 500 µA
24 MHz – USB mode With oscillator locking to USB bus – – 500 µA
24 MHz – non USB mode – – 300 µA
12 MHz – – 200 µA
6 MHz – – 180 µA
3 MHz – – 150 µA
Table 11-74. IMO AC Specifications
Parameter Description Conditions Min Typ Max Units
FIMO[79]
IMO frequency stability (with factory trim)
62.6 MHz –7 – 7 %
48 MHz –5 – 5 %
24 MHz – Non USB mode –4 – 4 %
24 MHz – USB mode With oscillator locking to USB bus –0.25 – 0.25 %
12 MHz –3 – 3 %
6 MHz –2 – 2 %
3 MHz 0 °C to 70 °C –1 – 1 %
–40 °C to 85 °C –1.5 – 1.5 %
3 MHz frequency stability after typical
PCB assembly post-reflow.
Typical (non-optimized) board
layout and 250 °C solder reflow.
Device may be calibrated after
assembly to improve performance.
–±2 – %
Startup time[80] From enable (during normal system
operation)
––13µs
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 117 of 137
Figure 11-71. IMO Frequency Variation vs. Temperature Figure 11-72. IMO Frequency Variation vs. VCC
Jp–p
Jitter (peak to peak)[81]
F = 24 MHz – 0.9 – ns
F = 3 MHz – 1.6 – ns
Jperiod
Jitter (long term)[81]
F = 24 MHz – 0.9 – ns
F = 3 MHz – 12 – ns
Table 11-74. IMO AC Specifications (continued)
Parameter Description Conditions Min Typ Max Units
Note
81. Based on device characterization (Not production tested).
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 118 of 137
11.9.2 Internal Low Speed Oscillator
Figure 11-73. ILO Frequency Variation vs. Temperature Figure 11-74. ILO Frequency Variation vs. VDD
Table 11-75. ILO DC Specifications
Parameter Description Conditions Min Typ Max Units
ICC
Operating current[82] FOUT = 1 kHz – – 1.7 µA
FOUT = 33 kHz – – 2.6 µA
FOUT = 100 kHz – – 2.6 µA
Leakage current[82] Power down mode – – 15 nA
Table 11-76. ILO AC Specifications
Parameter Description Conditions Min Typ Max Units
Startup time, all frequencies Turbo mode – – 2 ms
FILO ILO frequencies
100 kHz 45 100 200 kHz
1 kHz 0.5 1 2 kHz
Note
82. This value is calculated, not measured.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 119 of 137
11.9.3 MHz External Crystal Oscillator
For more information on crystal or ceramic resonator selection for the MHzECO, refer to application note AN54439: PSoC 3 and PSoC
5 External Oscillators.
11.9.4 kHz External Crystal Oscillator
11.9.5 External Clock Reference
11.9.6 Phase-Locked Loop
Table 11-77. MHzECO DC Specifications
Parameter Description Conditions Min Typ Max Units
ICC Operating current[83] 13.56 MHz crystal – 3.8 – mA
Table 11-78. MHzECO AC Specifications
Parameter Description Conditions Min Typ Max Units
F Crystal frequency range 4 – 25 MHz
Table 11-79. kHzECO DC Specifications[83]
Parameter Description Conditions Min Typ Max Units
ICC Operating current Low-power mode; CL= 6 pF – 0.25 1.0 µA
DL Drive level – – 1 µW
Table 11-80. kHzECO AC Specifications
Parameter Description Conditions Min Typ Max Units
F Frequency – 32.768 – kHz
TON Startup time High power mode – 1 – s
Table 11-81. External Clock Reference AC Specifications[83]
Parameter Description Conditions Min Typ Max Units
External frequency range 0 – 33 MHz
Input duty cycle range Measured at VDDIO/2 30 50 70 %
Input edge rate VIL to VIH 0.5 – – V/ns
Table 11-82. PLL DC Specifications
Parameter Description Conditions Min Typ Max Units
IDD PLL operating current In = 3 MHz, Out = 67 MHz – 400 – µA
In = 3 MHz, Out = 24 MHz – 200 – µA
Table 11-83. PLL AC Specifications
Parameter Description Conditions Min Typ Max Units
Fpllin PLL input frequency[84] 1–48MHz
PLL intermediate frequency[85] Output of prescaler 1 – 3 MHz
Fpllout PLL output frequency[84] 24 – 67 MHz
Lock time at startup – – 250 µs
Jperiod-rms Jitter (rms)[83] ––250ps
Notes
83. Based on device characterization (Not production tested).
84. This specification is guaranteed by testing the PLL across the specified range using the IMO as the source for the PLL.
85. PLL input divider, Q, must be set so that the input frequency is divided down to the intermediate frequency range. Value for Q ranges from 1 to 16.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 120 of 137
12. Ordering Information
In addition to the features listed in Table 12-1, every CY8C36 device includes: a precision on-chip voltage reference, precision
oscillators, flash, ECC, DMA, a fixed function I2C, 4 KB trace RAM, JTAG/SWD programming and debug, external memory interface,
and more. In addition to these features, the flexible UDBs and analog subsection support a wide range of peripherals. To assist you
in selecting the ideal part, PSoC Creator makes a part recommendation after you choose the components required by your application.
All CY8C36 derivatives incorporate device and flash security in user-selectable security levels; see the TRM for details.
Table 12-1. CY8C36 Family with Single Cycle 8051
Part Number
MCU Core Analog Digital I/O[88]
Package JTAG ID[89]
CPU Speed (MHz)
Flash (KB)
SRAM (KB)
EEPROM (KB)
LCD Segment Drive
ADC
DAC
Comparator
SC/CT
Analog Blocks[86]
Opamps
DFB
CapSense
UDBs[87]
16-bit Timer/PWM
FS USB
CAN 2.0b
Total I/O
GPIO
SIO
USBIO
32 KB Flash
CY8C3665PVI-008 67 32 4 1 ✔12-bit Del-Sig 4 4 4 2 ✔✔20 4 ––
29 25 4 0 48-pin SSOP 0×1E008069
CY8C3665AXI-198 67 32 8 1 ✔12-bit Del-Sig 2 0 0 0 –✔16 0––
70 62 8 0 100-pin TQFP 0x1E0C6069
CY8C3665LTI-044 67 32 4 1 ✔12-bit Del-Sig 4 4 4 0✔✔20 4✔–48 38 8 2 68-pin QFN 0x1E02C069
CY8C3665LTI-199 67 32 8 1 ✔12-bit Del-Sig 2 0 0 0–
✔16 0––
46 38 8 0 68-pin QFN 0x1E0C7069
CY8C3665FNI-211 67 32 4 1 ✔12-bit Del-Sig 4 4 4 4 ✔✔20 4 ✔– 48 38 8 2 72 WLCSP 0x1E0D3069
64 KB Flash
CY8C3666AXI-052 67 64 8 2 ✔12-bit Del-Sig 4 4 4 4 ✔✔24 4 ––
70 62 8 0 100-pin TQFP 0×1E034069
CY8C3666AXI-036 67 64 8 2 ✔12-bit Del-Sig 4 4 4 4 ✔✔24 4 ✔–72 62 8 2 100-pin TQFP 0×1E024069
CY8C3666LTI-027 67 64 8 2 ✔12-bit Del-Sig 4 4 4 4 ✔✔24 4 ✔–48 38 8 2 68-pin QFN 0×1E01B069
CY8C3666LTI-050 67 64 8 2 ✔12-bit Del-Sig 4 4 4 2 ✔✔24 4 ✔–31 25 4 2 48-pin QFN 0×1E032069
CY8C3666AXI-037 67 64 8 2 ✔12-bit Del-Sig 4 4 4 4 ✔✔24 4 –✔70 62 8 0 100-pin TQFP 0×1E025069
CY8C3666AXI-200 67 64 8 2 ✔12-bit Del-Sig 2 2 0 2 –✔20 2 ––
70 62 8 0 100-pin TQFP 0x1E0C8069
CY8C3666LTI-201 67 64 8 2 ✔12-bit Del-Sig 2 2 0 2 –✔20 2 ––
46 38 8 0 68-pin QFN 0x1E0C9069
CY8C3666AXI-202 67 64 8 2 ✔12-bit Del-Sig 4 2 2 2 –✔24 4 ––
70 62 8 0 100-pin TQFP 0x1E0CA069
CY8C3666LTI-203 67 64 8 2 ✔12-bit Del-Sig 4 2 2 2 –✔24 4 ––
46 38 8 0 68-pin QFN 0x1E0CB069
Notes
86. Analog blocks support a wide variety of functionality including TIA, PGA, and mixers. See the Example Peripherals on page 44 for more information on how analog
blocks can be used.
87. UDBs support a wide variety of functionality including SPI, LIN, UART, timer, counter, PWM, PRS, and others. Individual functions may use a fraction of a UDB or
multiple UDBs. Multiple functions can share a single UDB. See the Example Peripherals on page 44 for more information on how UDBs can be used.
88. The I/O Count includes all types of digital I/O: GPIO, SIO, and the two USB I/O. See the I/O System and Routing on page 37 for details on the functionality of each of
these types of I/O.
89. The JTAG ID has three major fields. The most significant nibble (left digit) is the version, followed by a 2 byte part number and a 3 nibble manufacturer ID.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 121 of 137
12.1 Part Numbering Conventions
PSoC 3 devices follow the part numbering convention described here. All fields are single character alphanumeric (0, 1, 2, …, 9, A,
B, …, Z) unless stated otherwise.
CY8Cabcdefg-xxx
a: Architecture
3: PSoC 3
5: PSoC 5
b: Family group within architecture
4: CY8C34 family
6: CY8C36 family
8: CY8C38 family
c: Speed grade
4: 48 MHz
6: 67 MHz
d: Flash capacity
4: 16 KB
5: 32 KB
6: 64 KB
ef: Package code
Two character alphanumeric
AX: TQFP
LT: QFN
PV: SSOP
FN: CSP
g: Temperature range
C: commercial
I: industrial
A: automotive
xxx: Peripheral set
Three character numeric
No meaning is associated with these three characters.
Tape and reel versions of these devices are available and are marked with a "T" at the end of the part number.
All devices in the PSoC 3 CY8C36 family comply to RoHS-6 specifications, demonstrating the commitment by Cypress to lead-free
products. Lead (Pb) is an alloying element in solders that has resulted in environmental concerns due to potential toxicity. Cypress
uses nickel-palladium-gold (NiPdAu) technology for the majority of leadframe-based packages.
A high level review of the Cypress Pb-free position is available on our website. Specific package information is also available. Package
Material Declaration data sheets (PMDDs) identify all substances contained within Cypress packages. PMDDs also confirm the
absence of many banned substances. The information in the PMDDs will help Cypress customers plan for recycling or other “end of
life” requirements.
Architecture
Cypress Prefix
Family Group within Architecture
Speed Grade
Flash Capacity
Package Code
Temperature Range
Peripheral Set
3: PSoC 3
6: 67 MHz
6: 64 KB
PV: SSOP
I: Industrial
Example CY8C 3 6 VP66Ixx-x
6: CY8C36 Family
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 122 of 137
13. Packaging
Table 13-1. Package Characteristics
Parameter Description Conditions Min Typ Max Units
TAOperating ambient temperature –40 25.00 85 °C
TJOperating junction temperature –40 – 100 °C
TJA Package JA (48-pin SSOP) – 49 – °C/Watt
TJA Package JA (48-pin QFN) – 14 – °C/Watt
TJA Package JA (68-pin QFN) – 15 – °C/Watt
TJA Package JA (100-pin TQFP) – 34 – °C/Watt
TJC Package JC (48-pin SSOP) – 24 – °C/Watt
TJC Package JC (48-pin QFN) – 15 – °C/Watt
TJC Package JC (68-pin QFN) – 13 – °C/Watt
TJC Package JC (100-pin TQFP) – 10 – °C/Watt
TJA Package JA (72-pin CSP) – 18 – °C/Watt
TJC Package JC (72-pin CSP) – 0.13 – °C/Watt
Table 13-2. Solder Reflow Peak Temperature
Package Maximum Peak
Temperature
Maximum Time at Peak
Temperature
48-pin SSOP 260 °C 30 seconds
48-pin QFN 260 °C 30 seconds
68-pin QFN 260 °C 30 seconds
100-pin TQFP 260 °C 30 seconds
72-pin CSP 260 °C 30 seconds
Table 13-3. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Package MSL
48-pin SSOP MSL 3
48-pin QFN MSL 3
68-pin QFN MSL 3
100-pin TQFP MSL 3
72-pin CSP MSL 1
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 123 of 137
Figure 13-1. 48-pin (300 mil) SSOP Package Outline
Figure 13-2. 48-pin QFN Package Outline
51-85061 *F
001-45616 *F
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 124 of 137
Figure 13-3. 68-pin QFN 8×8 with 0.4 mm Pitch Package Outline (Sawn Version)
Figure 13-4. 100-pin TQFP (14 × 14 × 1.4 mm) Package Outline
001-09618 *E
51-85048 *J
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 125 of 137
Figure 13-5. WLCSP Package (4.25 × 4.98 × 0.60 mm)
A
B
123
TOP VIEW BOTTOM VIEWSIDE VIEW
2. ALL DIMENSIONS ARE IN MILLIMETERS
1. JEDEC Publication 95; Design Guide 4.18
45678
C
D
E
F
G
H
J
12345678
A
B
C
D
E
F
G
H
J
NOTES:
001-82897 **
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 126 of 137
14. Acronyms
Table 14-1. Acronyms Used in this Document
Acronym Description
abus analog local bus
ADC analog-to-digital converter
AG analog global
AHB AMBA (advanced microcontroller bus archi-
tecture) high-performance bus, an ARM data
transfer bus
ALU arithmetic logic unit
AMUXBUS analog multiplexer bus
API application programming interface
APSR application program status register
ARM®advanced RISC machine, a CPU architecture
ATM automatic thump mode
BW bandwidth
CAN Controller Area Network, a communications
protocol
CMRR common-mode rejection ratio
CPU central processing unit
CRC cyclic redundancy check, an error-checking
protocol
DAC digital-to-analog converter, see also IDAC, VDAC
DFB digital filter block
DIO digital input/output, GPIO with only digital
capabilities, no analog. See GPIO.
DMA direct memory access, see also TD
DNL differential nonlinearity, see also INL
DNU do not use
DR port write data registers
DSI digital system interconnect
DWT data watchpoint and trace
ECC error correcting code
ECO external crystal oscillator
EEPROM electrically erasable programmable read-only
memory
EMI electromagnetic interference
EMIF external memory interface
EOC end of conversion
EOF end of frame
EPSR execution program status register
ESD electrostatic discharge
ETM embedded trace macrocell
FIR finite impulse response, see also IIR
FPB flash patch and breakpoint
FS full-speed
GPIO general-purpose input/output, applies to a PSoC
pin
HVI high-voltage interrupt, see also LVI, LVD
IC integrated circuit
IDAC current DAC, see also DAC, VDAC
IDE integrated development environment
I2C, or IIC Inter-Integrated Circuit, a communications
protocol
IIR infinite impulse response, see also FIR
ILO internal low-speed oscillator, see also IMO
IMO internal main oscillator, see also ILO
INL integral nonlinearity, see also DNL
I/O input/output, see also GPIO, DIO, SIO, USBIO
IPOR initial power-on reset
IPSR interrupt program status register
IRQ interrupt request
ITM instrumentation trace macrocell
LCD liquid crystal display
LIN Local Interconnect Network, a communications
protocol.
LR link register
LUT lookup table
LVD low-voltage detect, see also LVI
LVI low-voltage interrupt, see also HVI
LVTTL low-voltage transistor-transistor logic
MAC multiply-accumulate
MCU microcontroller unit
MISO master-in slave-out
NC no connect
NMI nonmaskable interrupt
NRZ non-return-to-zero
NVIC nested vectored interrupt controller
NVL nonvolatile latch, see also WOL
opamp operational amplifier
PAL programmable array logic, see also PLD
PC program counter
PCB printed circuit board
PGA programmable gain amplifier
Table 14-1. Acronyms Used in this Document (continued)
Acronym Description
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 127 of 137
15. Reference Documents
PSoC® 3, PSoC® 5 Architecture TRM
PSoC® 3 Registers TRM
PHUB peripheral hub
PHY physical layer
PICU port interrupt control unit
PLA programmable logic array
PLD programmable logic device, see also PAL
PLL phase-locked loop
PMDD package material declaration data sheet
POR power-on reset
PRES precise low-voltage reset
PRS pseudo random sequence
PS port read data register
PSoC®Programmable System-on-Chip™
PSRR power supply rejection ratio
PWM pulse-width modulator
RAM random-access memory
RISC reduced-instruction-set computing
RMS root-mean-square
RTC real-time clock
RTL register transfer language
RTR remote transmission request
RX receive
SAR successive approximation register
SC/CT switched capacitor/continuous time
SCL I2C serial clock
SDA I2C serial data
S/H sample and hold
SINAD signal to noise and distortion ratio
SIO special input/output, GPIO with advanced
features. See GPIO.
SOC start of conversion
Table 14-1. Acronyms Used in this Document (continued)
Acronym Description
SOF start of frame
SPI Serial Peripheral Interface, a communications
protocol
SR slew rate
SRAM static random access memory
SRES software reset
SWD serial wire debug, a test protocol
SWV single-wire viewer
TD transaction descriptor, see also DMA
THD total harmonic distortion
TIA transimpedance amplifier
TRM technical reference manual
TTL transistor-transistor logic
TX transmit
UART Universal Asynchronous Transmitter Receiver, a
communications protocol
UDB universal digital block
USB Universal Serial Bus
USBIO USB input/output, PSoC pins used to connect to
a USB port
VDAC voltage DAC, see also DAC, IDAC
WDT watchdog timer
WOL write once latch, see also NVL
WRES watchdog timer reset
XRES external reset I/O pin
XTAL crystal
Table 14-1. Acronyms Used in this Document (continued)
Acronym Description
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 128 of 137
16. Document Conventions
16.1 Units of Measure
Table 16-1. Units of Measure
Symbol Unit of Measure
°C degrees Celsius
dB decibels
fF femtofarads
Hz hertz
KB 1024 bytes
kbps kilobits per second
Khr kilohours
kHz kilohertz
kkilohms
ksps kilosamples per second
LSB least significant bit
Mbps megabits per second
MHz megahertz
Mmegaohms
Msps megasamples per second
µA microamperes
µF microfarads
µH microhenrys
µs microseconds
µV microvolts
µW microwatts
mA milliamperes
ms milliseconds
mV millivolts
nA nanoamperes
ns nanoseconds
nV nanovolts
ohms
pF picofarads
ppm parts per million
ps picoseconds
s seconds
sps samples per second
sqrtHz square root of hertz
Vvolts
Table 16-1. Units of Measure (continued)
Symbol Unit of Measure
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 129 of 137
17. Revision History
Description Title: PSoC® 3: CY8C36 Family Datasheet Programmable System-on-Chip (PSoC®)
Document Number: 001-53413
Revision ECN Submission
Date
Orig. of
Change Description of Change
** 2714854 06/04/09 PVKV New data sheet
*A 2758970 09/02/09 MKEA Updated Part Numbering Conventions
Added Section 11.7.5 (EMIF Figures and Tables)
Updated GPIO and SIO AC specifications
Updated XRES Pin Description and Xdata Address Map specifications
Updated DFB and Comparator specifications
Updated PHUB features section and RTC in sleep mode
Updated IDAC and VDAC DC and Analog Global specifications
Updated USBIO AC and Delta Sigma ADC specifications
Updated PPOR and Voltage Monitors DC specifications
Updated Drive Mode diagram
Added 48-QFN Information
Updated other electrical specifications
*B 2824546 12/09/09 MKEA Updated I2C section to reflect 1 Mbps. Updated Table 11-6 and 11-7 (Boost AC
and DC specs); also added Shottky Diode specs. Changed current for
sleep/hibernate mode to include SIO; Added footnote to analog global specs.
Updated Figures 1-1, 6-2, 7-14, and 8-1. Updated Table 6-2 and Table 6-3
(Hibernate and Sleep rows) and Power Modes section. Updated GPIO and SIO
AC specifications. Updated Gain error in IDAC and VDAC specifications.
Updated description of VDDA spec in Table 11-1 and removed GPIO Clamp
Current parameter. Updated number of UDBs on page 1.
Moved FILO from ILO DC to AC table.
Added PCB Layout and PCB Schematic diagrams.
Updated Fgpioout spec (Table 11-9). Added duty cycle frequency in PLL AC spec
table. Added note for Sleep and Hibernate modes and Active Mode specs in Table
11-2. Linked URL in Section 10.3 to PSoC Creator site.
Updated Ja and Jc values in Table 13-1. Updated Single Sample Mode and Fast
FIR Mode sections. Updated Input Resistance specification in Del-Sig ADC table.
Added Tio_init parameter. Updated PGA and UGB AC Specs. Removed SPC
ADC. Updated Boost Converter section.
Added section 'SIO as Comparator'; updated Hysteresis spec (differential mode)
in Table 11-10.
Updated VBAT condition and deleted Vstart parameter in Table 11-6.
Added 'Bytes' column for Tables 4-1 to 4-5.
*C 2873322 02/04/10 MKEA Changed maximum value of PPOR_TR to '1'. Updated VBIAS specification.
Updated PCB Schematic. Updated Figure 8-1 and Figure 6-3. Updated Interrupt
Vector table, Updated Sales links. Updated JTAG and SWD specifications.
Removed Jp-p and Jperiod from ECO AC Spec table. Added note on sleep timer
in Table 11-2. Updated ILO AC and DC specifications. Added Resolution
parameter in VDAC and IDAC tables. Updated IOUT typical and maximum values.
Changed Temperature Sensor range to –40 °C to +85 °C. Removed Latchup
specification from Table 11-1.
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 130 of 137
*D 2903576 04/01/10 MKEA Updated Vb pin in PCB Schematic
Updated Tstartup parameter in AC Specifications table
Added Load regulation and Line regulation parameters to Inductive Boost
Regulator DC Specifications table
Updated ICC parameter in LCD Direct Drive DC Specs table
Updated IOUT parameter in LCD Direct Drive DC Specs table
Updated Table 6-2 and Table 6-3
Added bullets on CapSense in page 1; added CapSense column in Section 12
Removed some references to footnote [1]
Changed INC_Rn cycles from 3 to 2 (Table 4-1)
Added footnote in PLL AC Specification table
Added PLL intermediate frequency row with footnote in PLL AC Specs table
Added UDBs subsection under 11.6 Digital Peripherals
Updated Figure 2-6 (PCB Layout)
Updated Pin Descriptions section and modified Figures 6-6, 6-8, 6-9
Updated LVD in Tables 6-2 and 6-3; modified Low-power modes bullet in page 1
Added note to Figures 2-5 and 6-2; Updated Figure 6-2 to add capacitors for VDDA
and VDDD pins.
Changed VREF from 0.9 to 0.1%
Updated boost converter section (6.2.2)
Updated Tstartup values in Table 11-3.
Removed IPOR rows from Table 11-68. Updated 6.3.1.1, Power Voltage Level
Monitors.
Updated section 5.2 and Table 11-2 to correct suggestion of execution from flash.
Updated VREF specs in Table 11-21.
Updated IDAC uncompensated gain error in Table 11-25.
Updated Delay from Interrupt signal input to ISR code execution from ISR code
in Table11- 72. Removed other line in table.
Added sentence to last paragraph of section 6.1.1.3.
Updated TRESP, high and low-power modes, in Table 11-24.
Updated f_TCK values in Table 11-73 and f_SWDCK values in Table 11-74.
Updated SNR condition in Table 11-20.
Corrected unit of measurement in Table 11-21.
Updated sleep wakeup time in Table 6-3 and Tsleep in Table 11-3.
Added 1.71 V <= VDDD < 3.3 V, SWD over USBIO pins value to Table 11-74.
Removed mention of hibernate reset (HRES) from page 1 features, Table 6-3,
Section 6.2.1.4, Section 6.3, and Section 6.3.1.1. Change PPOR/PRES to TBDs
in Section 6.3.1.1, Section 6.4.1.6 (changed PPOR to reset), Table 11-3 (changed
PPOR to PRES), Table 11-68 (changed title, values TBD), and Table 11-69
(changed PPOR_TR to PRES_TR).
Added sentence saying that LVD
circuits can generate a reset to Section 6.3.1.1.
Changed IDD values on page 1, page 5, and Table 11-2.
Changed resume time value in Section 6.2.1.3.
Changed ESD HBM value in Table 11-1.
Changed sample rate row in Table 11-20.
Removed VDDA = 1.65 V rows and changed BWag value in Table 11-22.
Changed VIOFF values and changed CMRR value in Table 11-23.
Changed INL max value in Table 11-27.
Added max value to the Quiescent current specs in Tables 11-29 and 11-31.
Changed occurrences of “Block” to “Row” and deleted the “ECC not included”
footnote in Table 11-57.
Changed max response time value in Tables 11-69 and 11-71.
Changed the Startup time in Table 11-79.
Added condition to intermediate frequency row in Table 11-85.
Added row to Table 11-69.
Added brown out note to Section 11.8.1.
Description Title: PSoC® 3: CY8C36 Family Datasheet Programmable System-on-Chip (PSoC®) (continued)
Document Number: 001-53413
Revision ECN Submission
Date
Orig. of
Change Description of Change
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 131 of 137
*E 2938381 05/27/10 MKEA Replaced VDDIO with VDDD in USBIO diagram and specification tables, added
text in USBIO section of Electrical Specifications.
Added Table 13-2 (Package MSL)
Modified Tstorag condition and changed max spec to 100
Added bullet (Pass) under ALU (section 7.2.2.2)
Added figures for kHzECO and MHzECO in the External Oscillator section
Updated Figure 6-1(Clocking Subsystem diagram)
Removed CPUCLK_DIV in table 5-2, Deleted Clock Divider SFR subsection
Updated PSoC Creator Framework image
Updated SIO DC Specifications (VIH and VIL parameters)
Updated bullets in Clocking System and Clocking Distribution sections
Updated Figure 8-2
Updated PCB Layout and Schematic, updated as per MTRB review comments
Updated Table 6-3 (power changed to current)
In 32kHZ EC DC Specifications table, changed ICC Max to 0.25
In IMO DC Specifications table, updated Supply Current values
Updated GPIO DC Specs table
*F 2958674 06/22/10 SHEA Minor ECN to post data sheet to external website
*G 2989685 08/04/10 MKEA Added USBIO 22 ohm DP and DM resistors to Simplified Block Diagram
Added to Table 6-6 a footnote and references to same.
Added sentences to the resistive pull-up and pull-down description bullets.
Added sentence to Section 6.4.11, Adjustable Output Level.
Updated section 5.5 External Memory Interface
Updated Table 11-73 JTAG Interface AC Specifications
Updated Table 11-74 SWD Interface AC Specifications
Updated style changes as per the new template.
*H 3078568 11/04/10 MKEA Updated “Current Digital-to-analog Converter (IDAC)” on page 94
Updated “Voltage Digital to Analog Converter (VDAC)” on page 99
Updated “DC Specifications” on page 72
Updated “Voltage Reference Specifications” on page 93
*I 3107314 12/10/2010 MKEA Updated delta-sigma tables and graphs.
Updated Flash AC specs
Formatted table 11.2.
Updated interrupt controller table
Updated transimpedance amplifier section
Updated SIO DC specs table
Updated Voltage Monitors DC Specifications table
Updated LCD Direct Drive DC specs table
Replaced the Discrete Time Mixer and Continuous Time Mixer tables with Mixer
DC and AC specs tables
Updated ESDHBM value.
Updated IDAC and VDAC sections
Removed ESO parts from ordering information
Changed USBIO pins from NC to DNU and removed redundant USBIO pin
description notes
Updated POR with brown out DC and AC specs
Updated PGA AC specs
Updated 32 kHz External Crystal DC Specifications
Updated opamp AC specs
Updated XRES IO specs
Updated Inductive boost regulator section
Delta sigma ADC spec updates
Updated comparator section
Removed buzz mode from Power Mode Transition diagram
Updated opamp DC and AC spec tables
Updated PGA DC table
Description Title: PSoC® 3: CY8C36 Family Datasheet Programmable System-on-Chip (PSoC®) (continued)
Document Number: 001-53413
Revision ECN Submission
Date
Orig. of
Change Description of Change
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 132 of 137
*J 3179219 02/22/2011 MKEA Updated conditions for flash data retention time.
Updated 100-pin TQFP package spec.
Updated EEPROM AC specifications.
*K 3200146 03/28/2011 MKEA Removed Preliminary status from the data sheet.
Updated JTAG ID
Deleted Cin_G1, ADC input capacitance from Delta-Sigma ADC DC spec table
Updated JTAG Interface AC Specifications and SWD Interface Specifications
tables
Updated USBIO DC specs
Added 0.01 to max speed
Updated Features on page 1
Added Section 5.5, Nonvolatile Latches
Updated Flash AC specs
Added CAN DC specs
Updated delta-sigma graphs, noise histogram figures and RMS Noise spec tables
Add reference to application note AN58304 in section 8.1
Updated 100-pin TQFP package spec
Added oscillator, I/O, VDAC, regulator graphs
Updated JTAG/SWD timing diagrams
Updated GPIO and SIO AC specs
Updated POR with Brown Out AC spec table
Updated IDAC graphs
Added DMA timing diagram, interrupt timing and interrupt vector, I2C timing
diagrams
Updated opamp graphs and PGA graphs
Added full chip performance graphs
Changed MHzECO range.
Added “Solder Reflow Peak Temperature” table.
*L 3259185 05/17/2011 MKEA Added JTAG and SWD interface connection diagrams
Updated TJA and TJC values in Table 13-1
Changed typ and max values for the TCVos parameter in Opamp DC
specifications table.
Updated Clocking subsystem diagram.
Changed VSSD to VSSB in the PSoC Power System diagram
Updated Ordering information.
Description Title: PSoC® 3: CY8C36 Family Datasheet Programmable System-on-Chip (PSoC®) (continued)
Document Number: 001-53413
Revision ECN Submission
Date
Orig. of
Change Description of Change
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 133 of 137
*M 3464258 12/14/2011 MKEA Updated Analog Global specs
Updated IDAC range
Updated TIA section
Modified VDDIO description in Section 3
Added note on Sleep and Hibernate modes in the Power Modes section
Updated Boost Converter section
Updated conditions for Inductive boost AC specs
Added VDAC/IDAC noise graphs and specs
Added pin capacitance specs for ECO pins
Removed CL from 32 kHz External Crystal DC Specs table.
Added reference to AN54439 in Section 6.1.2.2
Deleted T_SWDO_hold row from the SWD Interface AC Specifications table
Removed Pin 46 connections in “Example Schematic for 100-pin TQFP Part with
Power Connections”
Updated Active Mode IDD description in Table 11-2.
Added IDDDR and IDDAR specs in Table 11-2.
Replaced “total device program time” with TPROG in Flash AC specs table
Added IGPIO, ISIO and IUSBIO specs in Absolute Maximum Ratings
Added conditions to ICC spec in 32 kHz External Crystal DC Specs table.
Updated TCVOS value
Removed Boost Efficiency vs VOUT graph
Updated boost graphs
Updated min value of GPIO input edge rate
Removed 3.4 Mbps in UDBs from I2C section
Updated USBIO Block diagram; added USBIO drive mode description
Updated Analog Interconnect diagram
Changed max IMO startup time to 12 µs
Added note for IIL spec in USBIO DC specs table
Updated GPIO Block diagram
Updated voltage reference specs
Added text explaining power supply ramp up in Section 11-4.
Description Title: PSoC® 3: CY8C36 Family Datasheet Programmable System-on-Chip (PSoC®) (continued)
Document Number: 001-53413
Revision ECN Submission
Date
Orig. of
Change Description of Change
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 134 of 137
*N 3645908 06/14/2012 MKEA Added paragraph clarifying that to achieve low hibernate current, you must limit
the frequency of IO input signals.
Revised description of IPOR and clarified PRES term.
Changed footnote to state that all GPIO input voltages - not just analog voltages
- must be less than Vddio.
Updated 100-TQFP package drawing
Clarified description of opamp Iout spec
Changed “compliant with I2C” to “compatible with I2C”
Updated 48-QFN package drawing
Changed reset status register description text to clarify that not all reset sources
are in the register
Updated example PCB layout figure
Removed text stating that FTW is a wakeup source
Changed supply ramp rate spec from 1 V/ns to 0.066 V/µs
Added “based on char” footnote to voltage monitors response time spec
Changed analog global spec descriptions and values
Added spec for ESDHBM for when Vssa and Vssd are separate
Added a statement about support for JTAG programmers and file formats
Changed comparator specs and conditions
Added text describing flash cache, and updated related text
Changed text and added figures describing Vddio source and sink
Added a statement about support for JTAG programmers and file formats.
Changed comparator specs and conditions
Added text on adjustability of buzz frequency
Updated terminology for “master” and “system” clock
Deleted the text “debug operations are possible while the device is reset”
Deleted and updated text regarding SIO performance under certain power ramp
conditions
Removed from boost mention of 22 µH inductors. This included deleting some
graph figures.
Changed DAC high and low speed/power mode descriptions and conditions
Changed IMO startup time spec
Added text on XRES and PRES re-arm times
Added text about usage in externally regulated mode
Updated package diagram spec 001-45616 to *D revision.
Changed supply ramp rate spec from 1 V/ns to 0.066 V/µs
Changed text describing SIO modes for overvoltage tolerance
Added chip Idd specs for active and low-power modes, for multiple voltage,
temperature and usage conditions
Added chip Idd specs for active and low-power modes, for multiple voltage,
temperature and usage conditions
Updated Vref temperature drift specs. Added Vref graphs and footnote.
Updated DFB description text
Changed load cap conditions in opamp specs
Updated del-sig ADC spec tables, to replace three the instances of “16 bit” with
“12 bit”
Updated package diagram spec 001-45616 to *D revision
*O 3648803 06/18/2012 WKA/
MKEA
No changes. EROS update.
Description Title: PSoC® 3: CY8C36 Family Datasheet Programmable System-on-Chip (PSoC®) (continued)
Document Number: 001-53413
Revision ECN Submission
Date
Orig. of
Change Description of Change
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 135 of 137
*P 3732521 09/03/2012 MKEA Replaced IDDDR and IDDAR specs in Table 11-2, “DC Specifications,” on page 72
that were dropped out in
*N revision.
Updated Table 11-32, “Mixer DC Specifications,” on page 102, VOS Max value
from 10 to 15.
Updated Table 11-21, “12-bit Delta-sigma ADC DC Specifications,” on page 91,
IDD_12 Max value from 1.4 to 1.95 mA
Replaced PSoC® 3 Programming AN62391 with TRM in footnote #67 and
“Programming, Debug Interfaces, Resources” section on page 65
Removed Figure 11-8 (Efficiency vs Vout)
UpdatedTable 11-19, “Opamp DC Specifications,” on page 88, IDD Quiescent
current row values from 200 and 270 to 250 and 400 respectively.
Updated conditions for Storage Temperature in Table 11-1, “Absolute Maximum
Ratings DC Specifications[22],” on page 71.
Updated conditions and min values for NVL data retention time in Table 11-60,
“NVL AC Specifications,” on page 110.
Updated Table 11-75, “ILO DC Specifications,” on page 118.
Removed the following pruned parts from the ordering information table.
CY8C3665AXI-010
CY8C3665AXI-016
CY8C3665LTI-044
CY8C3665LTI-006
CY8C3665PVI-007
CY8C3665PVI-080
Updated PSoC 3 boost circuit value throughout the document.
Removed 100 kHz sub row in Table 11-51, “DFB DC Specifications,” on
page 107.
Updated package diagram 51-85061 to *F revision.
*Q 3922905 03/25/2013 MKEA Updated IDD_XX parameters under Table 11-21, “12-bit Delta-sigma ADC DC
Specifications,” on page 91.
Updated Temperature Drift specification in Voltage Reference Specifications.
Added CY8C3665AXI-198, CY8C3665LTI-044, CY8C3665LTI-199,
CY8C3666AXI-200, CY8C3666LTI-201, CY8C3666AXI-202, and
CY8C3666LTI-203 part numbers in Ordering Information.
Updated I2C section and GPIO and SIO DC specifications tables.
Corrected Hibernate max limit.
Changed INL max value from ±1.5 to ±1.6 in IDAC DC Specifications.
Updated ECCEN default setting in Fields and Factory Default Settings.
*R 4064707 07/18/2013 MKEA Added USB test ID in Features.
Updated schematic in Section 2..
Added paragraph for device reset warning in Section 5.4.
Added NVL bit for DEBUG_EN in Section 5.5.
Updated UDB PLD array diagram in Section 7.2.1.
Changed Tstartup specs in Section 11.2.1.
Changed GPIO rise and fall time specs in Section 11.4.
Added Opamp IIB spec in Section 11.5.1.
Added VREF spec condition: pre-assembly and added "box method" to VREF
temperature drift spec conditions in Section 11.5.3.
Added IMO spec condition: pre-assembly in Section 11.9.1.
Added Appendix for CSP package (preliminary)
*S 4118845 09/10/2013 MKEA Removed TSTG spec and added note clarifying maximum storage temperature
range in Table 11-1.
Updated Vos spec conditions and TCVos in Table 11-21.
Updated FIMO spec (3 MHz).
Updated 100-TQFP package diagram.
Description Title: PSoC® 3: CY8C36 Family Datasheet Programmable System-on-Chip (PSoC®) (continued)
Document Number: 001-53413
Revision ECN Submission
Date
Orig. of
Change Description of Change
PSoC® 3: CY8C36 Family Datasheet
Document Number: 001-53413 Rev. *Z Page 136 of 137
*T 4188568 11/14/2013 MKEA Added SIO Comparator Specifications.
Corrected typo in the VREF parameter in the Voltage Reference Specifications.
Added CSP information in Packaging and Ordering Information sections.
Updated delta-sigma VOS spec conditions.
*U 4385782 05/21/2014 MKEA Updated General Description and Features.
Added More Information and PSoC Creator sections.
Updated 100-pin TQFP package diagram.
*V 4708125 03/31/2015 MKEA Added INL4 and DNL4 specs in VDAC DC Specifications.
Updated Figure 6-11.
Added second note after Figure 6-4.
Added a reference to Fig 6-1 in Section 6.1.1 and Section 6.1.2.
Updated Section 6.2.2.
Added Section 7.8.1.
Updated Boost specifications.
*W 4807497 06/23/2015 MKEA Added reference to code examples in More Information.
Updated typ value of TWRITE from 2 to 10 in EEPROM AC specs table.
Changed “Device supply for USB operation" to "Device supply (VDDD) for USB
operation" in USB DC Specifications.
Clarified power supply sequencing and margin for VDDA and VDDD.
Updated Serial Wire Debug Interface with limitations of debugging on Port 15.
Updated Section 11.7.5.
Updated Delta-sigma ADC DC Specifications
*X 4932879 09/24/2015 MKEA Changed the Regulator Output Capacitor min and max from "-" to 0.9 and 1.1,
respectively.
Added reference to AN54439 in Section 11.9.3.
Added MHz ECO DC specs table.
Removed references to IPOR rearm issues in Section 6.3.1.1.
Table 6-1: Changed DSI Fmax to 33 MHz.
Figure 6-1: Changed External I/O or DSI to 0-33 MHz.
Table 11-10: Changed Fgpioin Max to 33 MHz.
Table 11-12: Changed Fsioin Max to 33 MHz.
*Y 5322536 06/27/2016 MKEA Updated More Information.
Corrected typos in External Electrical Connections.
Added links to CAD Libraries in Section 2.
*Z 5758815 06/01/2017 MKEA Updated Packaging:
spec 001-45616 – Changed revision from *E to *F.
Updated to new template.
Completing Sunset Review.
Description Title: PSoC® 3: CY8C36 Family Datasheet Programmable System-on-Chip (PSoC®) (continued)
Document Number: 001-53413
Revision ECN Submission
Date
Orig. of
Change Description of Change
Document Number: 001-53413 Rev. *Z Revised June 1, 2017 Page 137 of 137
ARM is a registered trademark, and Keil, and RealView are trademarks, of ARM Limited.
PSoC® 3: CY8C36 Family Datasheet
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