Document Number: 23089
Revision 14-May-02
www.vishay.com
12
307C Overcurrent Thermistors
Vishay Cera-Mite
ceramite.support@vishay.com
How Various Physical Parameters Influence a PTCs:
PARAMETER VOLTAGE & CURRENT CAPABILITY HOLD CURRENT & TRIP TIME
Disc Diameter (D) Increased diameter will increase voltage Increased diameter will increase
and current ratings. hold current and lengthen trip time.
Disc Thickness (T) Increased thickness will increase Increased thickness will increase
voltage rating; may or may not hold current and lengthen trip time.
increase current rating.
Curie (Switch) (T
SW
) Typically, lower switch temperature Higher switch temperature
Temperature materials have higher voltage/ materials increase hold current
current capability. and lengthen trip time.
Resistance (R25) Higher resistance will increase Lower resistance will increase hold
voltage capability. current and lengthen trip times.
Thermal Loading Increased thermal loading typically Increased thermal loading increases
(Heat Sink) reduces the maximum interrupting current. hold current and lengthens trip times.
Wire Leads Wire leads added to a PTCR pellet act as Depends on thermal conductivity of
a thermal load resulting in reduced wire used. Copper will increase
maximum interrupting current. hold current and trip time.
Coating Material Applying coating to a leaded PTCR has Applying coating to a leaded PTCR
minimal effect on voltage/current ratings. increases hold current/trip time 10-20%.
APPLICATION DATA
TRIPPING ACTION DUE TO OVERCURRENT
During normal operation, the PTCR remains in a low base
resistance state (Fig P-3, Region 1). However, if current
in excess of hold current (IH) is conducted, I2R losses
produce internal self heating. If the magnitude and time of
the overcurrent event develops an energy input in excess of
the device’s ability to dissipate heat, the PTCR temperature
will increase, thus reducing the current and protecting the
circuit.
PTC current limiters are intended for service on telecom
systems, automobiles, or the secondary of control transform-
ers or in similar applications where energy available is limited
by source impedance. They are not intended for application
on AC line voltages where source energy may be high and
source impedance low.
The current required to trip (IT) is typically specified as two
times the hold current (2 x IH). IT is defined as the minimum
rms conduction current required to guarantee thermistor
switching into a high resistance state (Fig P-3, Region 2) at
a 25°C ambient temperature.
Ambient temperature influences the ability of the PTCR to
transfer heat via surface radiation and thermal conduction at
the wire leads. At high ambient temperatures, less energy
input (via I2R) is required to reach the trip temperature. Low
ambients require greater energy input. Approximate derating
effects are shown in Fig P-2.
Since the tripping operation is due to thermal change, there
is a time-trip curve associated with each device. At relatively
low magnitudes of overcurrent, it may take minutes for the
device to trip. Higher current levels can result in millisecond
response time. Trip time (t) can be calculated as follows
kM(TSW -T
A)
Trip Time (t) = I 2R - D(TSW-T
A)
Where: k = coefficient of heat absorption = 0.603 J/g/°C
M = mass of PTCR = volume x 5.27x10 -3g/mm3
R = zero power resistance of PTCR at 25°C
Fig P-3
CERAMIC MATERIALS
The temperature at which the PTCR changes from the
base resistance to high resistance region is determined by
the PTCR ceramic material. Switching temperature (TSW)
described by the boundary between regions 1 & 2 (Fig P-3),
is the temperature point at which the PTCR has increased
to two times its base resistance at 25°C ambient (RSW = 2
x R25). Design flexibility is enhanced by Cera-Mite’s wide
selection of ceramic PTCR materials with different switching
temperatures (Fig P-4).
Fig P-4
Table 2
SELF RESETTING - NON CYCLING - REPEATABLE
After tripping, the PTCR will remain latched in its high
resistance state as long as voltage remains applied and
sufficient trickle current is maintained to keep the device
above the switching temperature. After voltage is removed,
the PTCR resets (cools) back to its low resistance state and
is again ready to provide protection.
PHYSICAL DESIGN CONSIDERATIONS
Diameter (D) - Common diameters range from 4 to 22mm.
Thickness (T) - Typical thickness ranges from 1 to 5mm.
Curie (Switching) Temperature (TSW) - See Fig P-4.
Resistivity (ρ) -
Determined during sintering process; combined
with pellet geometry results in final resistance
based on:
R25 = zero power resistance at 25°C = ρT
Area
PTCR Overcurrent Protection
Vishay Cera-Mite offers
a wide selection of
ceramic PTC materials
providing flexibility for
different ambient
temperatures. Close
protection levels are
possible by designing
resistance and physical
size to meet specific
hold current and trip
current requirements.
Curie Temperature °C (±5°)
Resistance Ratio
100K
10K
1K
100
10
2.0
1.0
0.1
55°C
70°C
80°C
90°C
105°C
120°C
PTC
RESISTANCE
REGION 2
HIGH
RESISTANCE
REGION 1
BASE
RESISTANCE
R vs. T Operating Characteristics
PTC
Temperature
TSW
25°C
10
R25
RSW =
2 x R25
100
1000
10000
100000
Resistance (log scale)