June 2005 ASM2P2309NZ
rev 0.2
Alliance Semiconductor
2575 Augustine Drive •Santa Clara, CA •Tel: 408.855.4900 •Fax: 408.855.4999 •www.alsc.com
Notice: The information in this document is subject to change without notice.
Nine Output 3.3V Buffer
Features
One-input to Nine-Output Buffer/Driver
Supports two DIMMs or four SO-DIMMs with one
additional output for feedback to an external or
chipset PLL
Low power consumption for mobile applications
Less than 32mA at 66.6MHz with unloaded
outputs
1nS Input-Output delay
Buffers all frequencies from DC to 133.33MHz
Output-output skew less than 250pS
Multiple VDD and VSS pins for noise and
electromagnetic interference (EMI) reduction
Space-saving 16-pin 150-mil SOIC Package
3.3V operation
Commercial and Industrial temperature parts are
available
Functional Description
The ASM2P2309NZ is a low-cost buffer designed to
distribute high-speed clocks in mobile PC systems and
desktop PC systems with SDRAM support. The part has
nine outputs, eight of which can be used to drive two
DIMMs or four SO-DIMMs, and the remaining can be used
for external feedback to a PLL. The device operates at
3.3V and outputs can run up to 133.33MHz.
The ASM2P2309NZ is designed for low EMI and power
optimization. It has multiple VSS and VDD pins for noise
optimization and consumes less than 32mA at 66.6MHz,
making it ideal for the low-power requirements of mobile
systems. It is available in an ultra-compact 150-mil 16-pin
SOIC Package.
Block Diagram
BUF_IN
OUTPUT1
OUTPUT2
OUTPUT3
OUTPUT4
OUTPUT5
OUTPUT6
OUTPUT7
OUTPUT8
OUTPUT9
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Notice: The information in this document is subject to change without notice.
Pin Configuration
Pin Description
Pin Signal Description
4, 8, 13 VDD 3.3V Digital Voltage Supply
5, 9, 12 GND Ground
1BUF_IN Input Clock
2, 3, 6, 7, 10, 11, 14, 15, 16 OUTPUT [1:9] Outputs
11
9
10
12
13
14
15
16
V
DD
2
1
3
4
5
6
7
8
OUTPUT2
V
DD
OUTPUT7
OUTPUT8
OUTPUT5
OUTPUT6
V
DD
OUTPUT9
GND
GND
ASM2P2309NZ
OUTPUT3
OUTPUT4
GND
OUTPUT1
BUF_IN
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Notice: The information in this document is subject to change without notice.
Absolute Maximum Ratings
Parameter Min Max Unit
Supply Voltage to Ground Potential -0.5 7.0 V
DC Input Voltage (Except BUF_IN) -0.5 VDD + 0.5 V
Storage Temperature -65 +150 °C
Junction Temperature 150 °C
Static Discharge Voltage
(As per JEDEC STD22- A114-B) >2000 V
Note: These are stress ratings only and functional usage is not implied. Exposure to absolute maximum ratings for prolonged periods can affect device
reliability.
Operating Conditions
Parameter Description Min Max Unit
VDD Supply Voltage 3.0 3.6 V
(Ambient Operating Temperature), Commercial 0 70 °C
TA(Ambient Operating Temperature), Industrial –40 85 °C
Load Capacitance, Fout < 100MHz - 30 pF
CLLoad Capacitance,100MHz < Fout < 133.33MHz - 15 pF
CIN Input Capacitance - 7 pF
BUF_IN, OUTPUT [1:9] Operating Frequency DC 133.33 MHz
tPU Power-up time for all VDD's to reach minimum
specified voltage (power ramps must be monotonic) 0.05 50 mS
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Notice: The information in this document is subject to change without notice.
Electrical Characteristics for Commercial and Industrial Temperature Devices
Parameter Description Test Conditions Min Max Unit
VIL Input LOW Voltage1-0.8 V
VIH Input HIGH Voltage12.0 - V
IIL Input LOW Current VIN = 0V - 50.0 MA
IIH Input HIGH Current VIN= VDD - 100.0 MA
VOL Output LOW Voltage2IOL= 8 mA - 0.4 V
VOH Output HIGH Voltage2IOH = –8 mA 2.4 - V
IDD Supply Current Unloaded outputs at 66.66MHz - 32 mA
Switching Characteristics for Commercial and Industrial Temperature Devices3
Parameter Name Description Min Typ Max Unit
tDDuty Cycle2= t2÷t1Measured at 1.4V 40.0 50.0 60.0 %
t3Rise Time2Measured between 0.8V and 2.0V - - 1.50 nS
t4Fall Time2Measured between 0.8V and 2.0V - - 1.50 nS
t5Output to Output Skew2All outputs equally loaded - - 250 pS
t6
Propagation Delay,
BUF_IN Rising Edge to
OUTPUT Rising Edge2Measured at VDD/2 1 5 9.2 nS
Note:
1. BUF_IN input has a threshold voltage of VDD/2.
2. Parameter is guaranteed by design and characterization. It is not 100% tested in production.
3. All parameters specified with loaded outputs.
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Notice: The information in this document is subject to change without notice.
Switching Waveforms
Duty Cycle Timing
All Outputs Rise/Fall Time
Output-Output Skew
Input-Output Propagation Delay
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Notice: The information in this document is subject to change without notice.
Test Circuits
VDD
VDD
GND
GND
CLKOUT
CLOAD
OUTPUTS
0.1uF
0.1uF
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Notice: The information in this document is subject to change without notice.
Package Information
16-lead (150 Mil) Molded SOIC Package
EH
A
A1
A2
D
e
B
L
h
Se ating Plan e
D
0.004
PI N 1 ID
1
8
916
Dimensions
Inches Millimeters
Symbol
Min Max Min Max
A0.053 0.069 1.35 1.75
A1 0.004 0.010 0.10 0.25
A2 0.049 0.059 1.25 1.50
B0.013 0.022 0.33 0.53
C0.008 0.012 0.19 0.27
D0.386 0.394 9.80 10.01
E0.150 0.157 3.80 4.00
e0.050 BSC 1.27 BSC
H0.228 0.244 5.80 6.20
h0.010 0.016 0.25 0.41
L0.016 0.035 0.40 0.89
P0° 8° 0° 8°
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Notice: The information in this document is subject to change without notice.
Ordering Codes
Part Number Marking Package Type Operating Range
ASM2P2309NZF-16-ST 2P2309NZF 16-pin 150-mil SOIC, Pb Free Commercial
ASM2P2309NZF-16-SR 2P2309NZF 16-pin 150-mil SOIC, Tape and Reel, Pb Free Commercial
ASM2I2309NZF-16-ST 2I2309NZF 16-pin 150-mil SOIC, Pb Free Industrial
ASM2I2309NZF-16-SR 2I2309NZF 16-pin 150-mil SOIC, Tape and Reel, Pb Free Industrial
ASM2P2309NZG-16-ST 2P2309NZG 16-pin 150-mil SOIC, Green Commercial
ASM2P2309NZG-16-SR 2P2309NZG 16-pin 150-mil SOIC, Tape and Reel, Green Commercial
ASM2I2309NZG-16-ST 2I2309NZG 16-pin 150-mil SOIC, Green Industrial
ASM2I2309NZG-16-SR 2I2309NZG 16-pin 150-mil SOIC ,Tape and Reel, Green Industrial
ASM2P2309NZ-16-ST 2P2309NZ 16-pin 150-mil SOIC Commercial
ASM2P2309NZ-16-SR 2P2309NZ 16-pin 150-mil SOIC, Tape and Reel Commercial
ASM2I2309NZ-16-ST 2I2309NZ 16-pin 150-mil SOIC Industrial
ASM2I2309NZ-16-SR 2I2309NZ 16-pin 150-mil SOIC ,Tape and Reel Industrial
Device Ordering Information
ASM2P2309NZ F-16-SR
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.
O = SOT
U = MSOP
S = SOIC E = TQFP
T = TSSOP L = LQFP
A = SSOP U = MSOP
V = TVSOP P = PDIP
B = BGA D = QSOP
Q = QFN
X = SC
-
70
DEVICE PIN COUNT
X= Automotive I= Industrial P or n/c = Commercial
(-40C to +125C) (-40C to +85C) (0C to +70C)
1 = Reserved 6 = Power Management
2 = Non PLL based 7 = Power Management
3 = EMI Reduction 8 = Power Management
4 = DDR support products 9 = Hi Performance
5 = STD Zero Delay Buffer
0 = Reserved
ALLIANCE SEMICONDUCTOR MIXED SIGNAL PRODUCT
PART NUMBER
F = LEAD FREE AND RoHS COMPLIANT PART
G = GREEN PACKAGE
R = Tape & reel, T = Tube or Tray
June 2005 ASM2P2309NZ
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Notice: The information in this document is subject to change without notice.
©Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are
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represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this
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Alliance Semiconductor Corporation
2575 Augustine Drive,
Santa Clara, CA 95054
Tel# 408-855-4900
Fax: 408-855-4999
www.alsc.com
Copyright © Alliance Semiconductor
All Rights Reserved
Part Number: ASM2P2309NZ
Document Version: 0.2
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, dated 11-11-2003