0.300"
0.150"
0.151"
0.228"±0.010"
0.223"±0.010" 0.160"±0.010"
0.405"
0.303"
0.800"
0.400"
0.018" dia.
8°± 2°
0.100" typ.
0.050" typ.
0.300"
Side View
Top View
All tolerances: ±0.005" (unless stated otherwise). Materials and specifications are subject to change without notice.
Leads: Material- Brass Alloy 360 1/2 hard; finish-
10µ" Au over 50µ" Ni (min.).
Pins: shell material- Brass Alloy 360 1/2 hard;
finish- 10µ" Au over 50µ" Ni (min.). Contact
material- BeCu; f inish 10µ" Au over 10 0 µ" Ni
(min.)
4
3
Description: Package converter , DIP to SOIC
16 position (0.1" centers, 0.3 wide) DIP female receptacles to 16 position surface mountable SOIC leads (0.400" wide).
Status: Released
Drawing: S.Natarajan
Scale 4:1 Rev: B
Date: 10/25/05
Modified: 12/13/07
File: PC-DIP_SOGW16-02F Dwg.mcd
PC-DIP/SOGW16-02F Drawing
© 2005 IRONW OOD EL ECTR ONICS, INC.
Tele: (800) 404-0204
www.ironwoodelectronics.com
End View
1
2
3
4
2
1
Bonding material: High temperature epoxy
5
5
ROHS COMPLIANT
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
per IPC 4101/21/26/83/98, Td>=345C.
Finish: RoHS
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
per IPC 4101/21/26/83/98, Td>=345C.
