ROHS COMPLIANT 0.400" 0.300" 0.100" typ. 0.800" 0.300" Top View 0.150" 1 0.151" 4 8 2 0.228"0.010" 3 5 0.223"0.010" 2 0.160"0.010" 0.303" 0.050" typ. 0.405" Side View 0.018" dia. End View 1 Substrate: 1.59mm 0.18mm [0.0625" 0.007"] per IPC 4101/21/26/83/98, Td>=345C. Finish: RoHS 3 2 Substrate: 1.59mm 0.18mm [0.0625" 0.007"] per IPC 4101/21/26/83/98, Td>=345C. 4 5 Leads: Material- Brass Alloy 360 1/2 hard; finish10" Au over 50" Ni (min.). Pins: shell material- Brass Alloy 360 1/2 hard; finish- 10" Au over 50" Ni (min.). Contact material- BeCu; finish 10" Au over 100" Ni (min.) Bonding material: High temperature epoxy Description: Package converter , DIP to SOIC 16 position (0.1" centers, 0.3 wide) DIP female receptacles to 16 position surface mountable SOIC leads (0.400" wide). All tolerances: 0.005" (unless stated otherwise). Materials and specifications are subject to change without notice. PC-DIP/SOGW16-02F Drawing (c) 2005 IRONWOOD ELECTRONICS, INC. Tele: (800) 404-0204 www.ironwoodelectronics.com Status: Released Scale 4:1 Rev: B Drawing: S.Natarajan Date: 10/25/05 File: PC-DIP_SOGW16-02F Dwg.mcd Modified: 12/13/07