BD41020FJ-CE2 - ROHM SEMICONDUCTOR - Datasheet.Technology

1/17

Datashee

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・14・001

LIN Transceiver

BD41020FJ-C

●General Description

BD41020FJ-C is the best transceiver that can be used

for BMS (Battery Management System). It has a

Master/Slave protocol communication of LIN (Local

Interconnect Network). BD41020FJ-C is available in

small SOP Package. It has a normal slope mode, very

low Electro Magnetic Emission (EME) and low standby

electricity consumption that is realized by sleep mode.

●Features

■ LIN pin absolute maximum rating: -27 to +40V

■ Max transmission rate: 20kbps

■ Low Electro Magnetic Emission (EME)

■ High Electro Magnetic Immunity (EMI)

■ Low slope mode for an even further

reduction of EME

■ High impedance at power off BΜS

■ Interface (RXD/TXD) with protocol layer

corresponds to 3.3V/5.0V logic.

■ Built in terminator for LIN slave

■ Local/remote wake-up identification function

■ Standby power consumption in sleep mode

■ Transmit data (TXD) dominant time-out function

■ Resistant to LIN-BAT/GND short

■ Built in Thermal Shut Down (TSD)

●Applications

LIN communication for Automotive networks

●Key Specifications

■ Supply Voltage

■ Supply Current 1 on pin BAT

(sleep mode)

■ Supply Current 2 on pin BAT

(standby mode; recessive)

■ Supply Current 3 on pin BAT

(normal slope mode; recessiv e)

■ Supply Current 4 on pin BAT

(normal slope mode; dominant)

5 to 27(V)

1 to 8(µA)

100 to 1000(µA)

1.0 to 8.0(mA)

●Package W (Typ.) x D (Typ.) x H (Max.)

SOP-J8

4.90mm x 6.00mm x 1.65mm

●T ypical Application Circuits

Regulator

Micro

Controller

VDD

GND

BD41020FJ-C

100nF

+5V

VIN

100nF

VSAT

10kΩ

33kΩ

(1)

1kΩ

Only

Master Node

LIN

Bus Line

RXD

TXD

NSLP

BAT

NWAKE

LIN

GND

INH

Figure 1. T ypical Application Circuits

○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays

Example of circuit 1

(1) Master: C = 1 nF; Slave: C = 220 pF.

2/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

LIN

BAT

INH

●Pin Configuration ●Pin Description

●Block Diagram

Figure 3. Block Diagram

Pin No. Symbol Function

1 RXD

Receive data output pin(Open Drain)

“L” is output at standby mode.

2 NSLP Sleep control input pin (”L” Active mode)

Prohibits Output, request from

local/remote wake-up flag at TXD pin, and

resets wake-up from RXD pin.

3 NWAKE Local wake-up input pin (”L” Active mode)

Active at rising edge

4 TXD

Transmission data input pin (“L” Active

mode) Shift sleep mode to standby mode

by NWAKE, output is ”L”.

5 GND Ground

6 LIN LIN BMS input and output pin

7 BAT Power supply pin

8 INH

“Hi-Z” at sleep mode and “H” in other

mode.

Figure 2. Pin Configuration

（TOP VIEW）

GND

NWAKE

NSLP

RXD

TXD

3/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

●State transition

SLEEP MOD E

NORMAL SLOPE MODE LOW S LOP E MO D E

STANDBY MODE

t(NWA KE = 0; a fte r 1 to 0 ) > tNWAKE

t(LIN = 0 ; a fte r 1 to 0) > tBUS

t(NS L P = 1 ; a fte r 0 to 1 )

> tgotonorm

while TXD = 1

t(NS L P = 1 ; a fte r 0 to 1 )

> tgotonorm

while TXD = 0

t(NS L P = 1 ; a fte r 0 to 1 )

> tgotonorm

while TXD = 0

t(NSL P = 1 ; a fter 0 to 1 )

> tgotonorm

while TXD = 1

t(NSLP = 0; after 1 to 0)

> tgotosleep

t(NS L P = 0; a fte r 1 to 0 )

> tgotosleep

unpower

state

Power On

Figure 4. State transition chart

Terminal operation table according to state

STATE NSLP TXD RXD INH TRANSMIT and

RECEIVE FUNCTION

SLEEP 0 Weak pull-down Floating Floating OFF

STANDBY 0

Remote wake up:

Weak pull-down

Local wake up:

Strong pull-down

Low HIGH OFF

NORMAL

SLOPE 1 Weak pull-down

HIGH: recessive state

LOW: dominant state HIGH ON

LOW

SLOPE 1 Weak pull-down

HIGH: recessive state

LOW: dominant state HIGH ON

4/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

●Absolute Maximum Rating (Ta=25℃)

Parameter Symbol Rating Unit

Supply voltage on pin BAT *1 VBAT -0.3 to +40.0 V

DC voltage on pins TXD, RXD, NSLP VTXD, VRXD, VNSLP -0.3 to +7.0 V

DC voltage on pin LIN VLIN -27 to +40 V

DC voltage on pin NWAKE VNWAKE -1 to +40 V

Current on pin NWAKE INWAKE -15 mA

DC voltage on pin INH VINH -0.3 to VBAT + 0.3 V

Output current at pin INH IINH -50 to +15 mA

Power dissipation *2 Pd 674 mW

Storage temper ature range Tstg -55 to +150 ℃

Junction temperature Tjmax +150 ℃

*1 Pd, ASO should not be exceeded.

*2 Pd decreased at 5.39mW/℃ for temperatures above Ta=25℃, mounted on 70×70×1.6mm Glass-epoxy PCB.

NOTE: This product is not designed for protection against radioactive rays.

●Recommended Operating Rating(s) (Ta=25℃)

Parameter Symbol Rating Unit

Supply voltage VBAT 5.0 to 27.0 V

Operating temperature range Topr -40 to +125 ℃

5/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

●Electrical Characteristics

(Ta= -40 to 125℃; VBAT=5 to 27V; RL(LIN-BAT)=500Ω; typical values are given at Ta=25℃; VBAT=12V; unless otherwise specified)

Parameter Symbol Limit Unit Condition

Min Typ Max

○ BAT

Supply current 1 on pin BAT

(Sleep mode) IBAT1 1 3 8 µA

Sleep mode.

VLIN = VBAT

VNWAKE = VBAT

VTXD = 0V

VNSLP = 0V

Supply current 2 on pin BAT

(Standby mode,Recessive) IBAT2 100 400 1000 µA

Standby mode. (bus recessive)

VLIN = VBAT

VINH = VBAT

VNWAKE = VBAT

VTXD = 0V

VNSLP = 0V

Supply current 3 on pin BAT

(Standby mode,Dominant) IBAT3 300 900 2000

µA

Standby mode. (bus dominant)

VBAT = 12V

VLIN = 0V

VINH = VBAT

VNWAKE = VBAT

VTXD = 0V

VNSLP = 0V

Supply current 4 on pin BAT

(Low slope mode,

Recessive) IBAT4 100 400 1000 µA

Low slope mode. (bus recessive)

VLIN = VBAT

VINH = VBAT

VNWAKE = VBAT

VTXD = 5V

VNSLP = 5V

Supply current 5 on pin BAT

(Normal slope mode,

Recessive) IBAT5 100 400 1000 µA

Normal slope mode. (bus recessive)

VLIN = VBAT

VINH = VBAT

VNWAKE = VBAT

VTXD = 5V

VNSLP = 5V

Supply current 6 on pin BAT

(Low slope mode,

Dominant) IBAT6 1.0 3.5 8.0 mA

Low slope mode. (bus dominant)

VBAT = 12V

VINH = VBAT

VNWAKE = VBAT

VTXD = 0V

VNSLP = 5V

Supply current 7 on pin BAT

(Normal slope mode,

Dominant) IBAT7 1.0 3.5 8.0 mA

Normal slope mode. (bus

dominant)

VBAT = 12V

VINH = VBAT

VNWAKE = VBAT

VTXD = 0V

VNSLP = 5V

○ TXD

HIGH-level input voltage VIH 2.0 - 7.0 V

LOW-level input voltage VIL -0.3 - +0.8 V

Hysteresis voltage Vhys 0.03 - 0.50 V

Pull-down resistor RTXD 125 350 800 kΩ V

TXD = 5V

LOW-level input current IIL -5.0 0.0 +5.0 µA VTXD = 0V

LOW-level output current IOL 1.5 3.0 - mA

Standby mode.

Local wake-up.

VNWAKE = 0V

VLIN = VBAT

VTXD = 0.4V

6/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

●Electrical Characteristics

(Ta= -40 to 125℃; VBAT=5 to 27V; RL(LIN-BAT)=500Ω; typical values are given at Ta=25℃; VBAT=12V; unless otherwise specified)

Parameter Symbol Limit Unit Condition

Min Typ Max

○ NSLP

HIGH-level input voltage VIH 2.0 - 7.0 V

LOW-level input voltage VIL -0.3 - +0.8 V

Hysteresis voltage Vhys 0.03 - 0.50 V

Pull-down resistor RNSLP 125 350 800 kΩ V

NSLP = 5V

LOW-level input current IIL -5.0 0.0 +5.0 µA VNSLP = 0V

○ RXD (open-drain)

LOW-level output current IOL 1.3 3.5 - mA

Normal slope mode.

VLIN = 0V

VRXD = 0.4V

HIGH-level leakage current IOZH -5.0 0.0 +5.0 µA

Normal slope mode.

VLIN = VBAT

VRXD = 5V

○ NWAKE

HIGH-level input voltage VIH V

BAT - 1.0 - VBAT + 0.3 V

LOW-level input voltage VIL -0.3 - VBAT - 3.3 V

HIGH-level leakage current IIH -5.0 0.0 +5.0 µA

VNWAKE = 27V

VBAT = 27V

Pull-up current IIL -30 -10 -3 µA VNWAKE = 0V

○ INH

Switch-on resistance

between pins BAT and INH RINH - 30 50 Ω Standby mode, low slope or normal

slope mode.

IINH = -15mA, VBAT = 12V

HIGH-level leakage current I OZH -5.0 0.0 +5.0 µA

Sleep mode.

VINH = VBAT = 27V

○ LIN

LIN recessive

output voltage VO_rec V

BATｘ 0.9 - VBAT V VTXD = 5V, ILIN = 0mA

LIN dominant

output voltage

VO_dom1 - - 1.2 V VTXD = 0V, VBAT = 7.3V

VO_dom2 0.6 - - V

VTXD = 0V, VBAT = 7.3V

RL(LIN-BAT) = 1kΩ

VO_dom3 - - 2.0 V VTXD = 0V, VBAT = 18V

VO_dom4 0.8 - - V

VTXD = 0V, VBAT = 18V

RL(LIN-BAT) = 1kΩ

HIGH-level leakage current IIH -1.0 0.0 +1.0 µA VLIN = VBAT

LIN pull-up current IIL -10.0 -5.0 -2.0 µA

Sleep mode.

VLIN = VNSLP = 0V

Slave termination

resistance to pin BAT RSLAVE 20 30 47 kΩ Standby mode, low slope or normal

slope mode.

VLIN = 0V, VBAT = 12V

Capacitance on pin LIN CLIN - - 250 pF

Short-circuit output

current

IO_SC0 40 - 100 mA

VLIN = VBAT = 18V, VTXD = 0V

t < tdom

IO_SC1 27 40 60 mA

VLIN = VBAT = 12V, VTXD = 0V

t < tdom

IO_SC2 60 90 125 mA

VLIN = VBAT = 27V, VTXD = 0V

t < tdom

7/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

●Electrical Characteristics

(Ta= -40 to 125℃; VBAT=5 to 27V; RL(LIN-BAT)=500Ω; typical values are given at Ta=25℃; VBAT=12V; unless otherwise specified)

Parameter Symbol Limit Unit Condition

Min Typ Max

Input leakage current

at the Receiver

include pull-up resistor IBΜS_PAS_dom -1 - - mA VLIN = 0V

VBAT = 12V

VTXD = 5V

Receiver recessive

Input leakage current IBΜS_PAS_rec - - 20 µA VLIN = 18V

VBAT = 8V

VTXD = 5V

Loss of ground

leakage current IBΜS_NO_GND -1 - 1 mA VBAT = VGND = 12V

VLIN = 0V to 18V

Loss of battery

leakage current IBΜS_NO_BAT - - 100 µA

VBAT = 0V

VLIN = 18V

Receiver threshold voltage Vth_rx V

BAT x 0.4 - VBAT x 0.6 V VBAT = 7.3 to 27.0V

Receiver center voltage Vcn_rx V

BAT x 0.475 VBAT x 0.500 VBAT x 0.525 V VBAT = 7.3 to 27.0V

Receiver threshold

hysteresis voltage Vth_hys V

BAT x 0.145 VBAT x 0.160 VBAT x 0.175 V VBAT = 7.3 to 27.0V

○AC characteristics

TXD propagation

delay failure

∆td(TXD-BΜS)1 -2.0 0.0 +2.0 µs

Normal slope mode.

CL(LIN-BAT) = 10nF

RL(LIN-BAT) = 500Ω

tPro

TxDom-tPro

TxRec

Figure 6

∆td(TXD-BΜS)2 -5.0 0.0 +5.0 µs

Low slope mode.

CL(LIN-BAT) = 10nF

RL(LIN-BAT) = 500Ω

tPro

TxDom-tPro

TxRec

Figure 6

RXD propagation delay td_(BΜS-RXD) - - 5.5 µs

CRXD = 20pF

RRXD = 2.4kΩ

RXD propagation

delay failure ∆td_(BΜS-RXD) -2.0 0.0 +2.0 µs

Normal slope mode and

low slope mode

CL(LIN-BAT) = 0nF

RL(LIN-BAT) = ∞

Voltage on LIN

externally forced.

LIN tf, tr < 500ns

CRXD = 20pF

RRXD = 2.4kΩ

tPro

RxDom-tPro

RxRec

Figure 6

Fall time LIN tf_dom - 16 27

µs

Normal slope mode

CL(LIN-BAT) = 10nF

RL(LIN-BAT) = 500Ω

VBAT = 12V

Transition from recessive

to dominant.

VLIN: 100 to 0%

Figure 7

Rise time LIN tr_rec - 16 27 µs

Normal slope mode

CL(LIN-BAT) = 10nF

RL(LIN-BAT) = 500Ω

VBAT = 12V

Transition from dominant

to recessive.

VLIN: 0 to 100%

Figure 7

Normal slope symmetry ∆tslope_norm1 -5.0 0.0 +5.0 µs

Normal slope mode

CL(LIN-BAT) = 10nF

RL(LIN-BAT) = 500Ω

VBAT = 12V

dom - tr

8/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

●Electrical Characteristics

(Ta= -40 to 125℃; VBAT=5 to 27V; RL(LIN-BAT)=500Ω; typical values are given at Ta=25℃; VBAT=12V; unless otherwise specified)

Parameter Symbol Limit Unit Condition

Min Typ Max

Normal slope fall time LIN tf_norm_dom - 12.0 22.5 µs

Normal slope mode

CL(LIN-BAT) = 6.8nF

RL(LIN-BAT) = 660Ω

VBAT = 12V

Transition from recessive

to dominant.

VLIN: 100 to 0%

Figure 7

Normal slope rise time LIN tr_norm_rec - 12.0 22.5 µs

Normal slope mode

CL(LIN-BAT) = 6.8nF

RL(LIN-BAT) = 660Ω

VBAT = 12V

Transition from dominant

to recessive.

VLIN: 0 to 100%

Figure 7

Normal slope symmetry ∆tslope_norm2 -4.0 0.0 +4.0 µs

Normal slope mode

CL(LIN-BAT) = 6.8nF

RL(LIN-BAT) = 660Ω

VBAT = 12V

norm

dom - tr

norm

Low slope fall time LIN tf_low_dom - 30 62 µs

Low slope mode

CL(LIN-BAT) = 10nF

RL(LIN-BAT) = 500Ω

VBAT = 12V

Transition from recessive

to dominant.

VLIN: 100 to 0%

Figure 7

Low slope rise time LIN tr_low_rec - 30 62 µs

Low slope mode

CL(LIN-BAT) = 10nF

RL(LIN-BAT) = 500Ω

VBAT = 12V

Transition from dominant

to recessive.

VLIN: 0 to 100%

Figure 7

Duty cycle 1 D1 0.396 - -

Normal slope mode

THRec(max) = 0.744 x VBAT

THDom(max) = 0.581 x VBAT

VBAT=7.0 to 18.0V

tBit=50µs

Figure 8

Duty cycle 2 D2 - - 0.581

Normal slope mode

THRec(min) = 0.422 x VBAT

THDom(min) = 0.284 x VBAT

VBAT=7.6 to 18.0V

tBit=50µs

Figure 8

Duty cycle 3 D3 0.417 - -

THRec(max) = 0.778 x VBAT

THDom(max) = 0.616 x VBAT

VBAT=7.0 to 18.0V

tBit=96µs

Figure 8

Duty cycle 4 D4 - - 0.590

THRec(min) = 0.389 x VBAT

THDom(min) = 0.251 x VBAT

VBAT=7.6 to 18.0V

tBit=96µs

Figure 8

Dominant time for

wake-up via bus tBΜS 30 70 150 µs

Sleep mode

(Remote wake-up) Figure 8

Dominant time for

wake-up via pin NWAKE tNWAKE 7 20 50

µs Sleep mode

(Local wake-up) Figure 4

Time period for mode

change from sleep or

standby mode into

normal/low slope mode. tgotonorm 2 5 10 µs

Shift from sleep/standby

mode to normal/low slope

mode

Figure 5

Time period for mode

change from normal/low

slope mode into

sleep mode. tgotosleep 2 5 10

µs Shift from normal/low slope

mode to sleep mode Figure 6

TXD dominant time out tdom 6 12 20 ms VTXD = 0V

9/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

*1 When VBAT is more than 12V, add to the circuit current the value calculated by this expression because IBAT depends on pull-up resistor inside LIN

Terminal.

*4 Load condition at BΜS (CBΜS; RBΜS): 1nF; 1kΩ / 6.8nF; 660Ω / 10nF; 500Ω

(20kΩ is the minimum value of pull-up resistor inside LIN terminal)

IBAT (increase) = VBAT – 12V

20kΩ

tf_dom = (tVLIN=40%) - (tVLIN=95%)

0.55

D1, D3 = tBµs_rec (min)

2 x tBit

tr_rec = (tVLIN=60%) - (tVLIN=5%)

0.55

D2, D4 = tBµs_rec (max)

2 x tBit

10/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

●Timing Chart

50% 50%

tPropTXD om tPro pTX Re c

TXD

LIN

RXD

100%

95%

0.5xVBAT

50% 50%

tPro pRXD o m tPropRXRe c

Figure 5. AC characteristics Timing Chart

LIN

100%

95%

60%

40%

tf_dom tr_re c

Figure 6. Slope Timing Chart

Figure 7. BMS Timing Chart

Figure 8. Rating Circuit of AC Characteristics

tBµs_dom (max)

THRec (max)

THDom (max)

THRec (min)

THDom (min)

tBµs_rec (min)

VBAT

tBµs_rec (max)

tBµs_dom (min)

TXD

tBit tBit

LIN

11/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

Sleep mode

This mode is the most power saving mode that stops the transmit/receive function.

The following conditions will enter the sleep mode:

・After start-up of power supply (VBAT)

・Normal/Low slope mode switches when pin NSLP= “L”.

In this mode, one of the next wake-up event switches a state.

・Pin NWAKE “H“→“L“ (Shift to Standby mode)

・Pin LIN “H“→“L“→“H“ (Shift to Standby mode)

・Pin NSLP “L“→“H“ (Shift to Normal slope mode at TXD=“H“, Shift to Low slope mode at TXD=“L“）

All wake-up events must be maintained for a certain time period (tNWAKE, tBUS, tgotonorm)

Standby mode

Sleep mode will shift to standby mode if wake-up events occur at NWAKE terminal or LIN terminal.

While the device is in standby mode, each PIN has the following conditions:

・INH PIN is “H”(≒VBAT voltage)

・RXD PIN is at “L” level (It indicates to microcontroller that the state is in standby mode.)

・TXD PIN is weak/strong pull-down（It indicates to microcontroller the remote wake-up or local wake-up）

・Pin LIN Slave Resistance is ON

If the state is in Standby mode, a shift to slope mode will happen when NSLP INPUT is changed to ”H”. At the time that

TXD=”H”, the mode will shift to Normal slope mode, but If TXD=”L”, it will shift to Low slope mode.

Normal slope mode

The IC goes to Normal slope mode when NSLP changes to “H” at Sleep/Standby mode and TXD=”H”. In this mode, the

transceiver is able to transmit and receive data via the LIN bus line. The receiver detects the data stream at the LIN bus

input pin and transfers it via pi n RXD to the microcontroller. The transmit data stream of the protocol c ontroller at the TXD

input is converted by the transmitter into a bus signal with optimized slew rate.

The maximum operating frequency at normal slope mode is 10(kHz). BD41020FJ-C switches to sleep mode in case a

LOW logiclevel on pin NSLP ismaintained within a fi xed time( tgotosleep).

Low slope mode

The IC goes to Low slope mode when NSLP changes to “H” at Sleep/Standby mode and T XD=”L”. T he difference bet ween

Low slope mode and Normal slope mode is in the rate of transmission at LIN output. This mode conducts LIN bus signal

converted from TXD input signal to bus line when start and stop later than Normal slope mode.

The maximum operating frequency at low slope mode is 5.2(kHz). BD41020FJ-C shifts to sleep mode when input on pin

NSLP is changed to “L” and maintained within a fixed time (tgotosleep).

TXD dominant time-out counter function

A TXD dominant time-out counter prevents the bus line from being driven to a permanent dominant state (blocking all

network communication) if pin TXD is forced permanently LOW by a hardware and/or software application failure. The

timer is triggered by a negative edge on pin TXD. If the duration of the LOW-level on pin TXD exceeds the internal timer

value (tdom), the transmitter is disabled, driving the bus line into a recessiv e state. The timer is reset by a positive edge on

pin TXD.

12/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

Fail-safe function

・Pin TXD provides a pull-down to GND in order to force a predefined level on input pin TXD in case the pin TXD is

unsupplied.

・Pin NSLP provides a pull-down to GND in order to force the transceiver into sleep mode in case the pin NSLP is

unsupplied.

・Pin RXD is set floating in case of lost power supply o n pin VBAT.

・The output driver at pin LIN will be off when junction temperature exceeds T J activating the TSD circuit without relation to

input signal at pin TXD. However, when ju nction tem perat ure drops below TJ, the output driver at p in LIN will depend ag ain

on the input signal at pin TXD.

Figure 9. Timing Chart (at remote wake-up)

13/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

Floating

Figure 10. Timing Chart (At local wake-up)

Figure 11. Timing Chart (At shift to Normal slope mode)

14/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

●I/O equivalent circuit

①RXD ②NSLP

③NWAKE ④TXD

⑥LIN ⑧INH

INH

BAT BAT

LIN

SHUNT

15/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

●Operational Notes

1) Absolute maximum ratings

Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict al l

destructive situations such as short-circuit modes or open circuit modes. Therefore, it is important to consider circuit

protection measures, like adding a fuse, in case the IC is expected to be operated in a special mode e xceeding the

absolute maximum ratings

2) Thermal consideration

Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in

actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd).

Package Power dissipation : Pd (W)=(Tjmax－Ta)/θja

Power dissipation : Pc (W)=(Vcc－Vo)×Io+Vcc×Ib

Tjmax : Maximum juncti on temperature=150℃, Ta : Peripheral temperature(℃) ,

θja : Thermal resistance of package-ambience(℃/W), Pd : Package Power dissipation (W),

Pc : Power dissipation (W), Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current

3) Operation understrong ele ctromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

4) Thermal shutdown circuit(TSD)

The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperatur e

of the IC reaches a specified value. It is not designed to protect the IC from damage or guarantee its operation. Do not

continue to operate the IC after this function is activated. Do not use the IC in conditions where this function will always

be activated.

5) GND voltage

The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no

pins are at a voltage below the ground pin at any time, even during transient condition.

6) Short between pins and mounti ng errors

Be careful when mounting the IC on printed circuit boards. T he IC ma y be damaged if it is mounted in a wrong orientation

or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

7) GND wiring pattern

When using both small-signal and large-current GND traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large curre nts. Also ensur e that the GND traces of exter nal com pon ents do not caus e variatio ns on th e

GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.

8) Regarding input pins of the IC

This monolithic IC contains P + isolat io n and P substrate la yers between adjacent elements in order to k eep them isol ate d.

P-N junctions are formed at the intersection o f the P layers with the N l ayers of other ele ments, creating a par asitic diode

or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a para sitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Figure 12 . Example of IC’s basic structure

16/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

●Physical Dimension, Tape and Reel Information – continued

Package Name SOP-J8

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

()

Direction of feed

Reel 1pin

17/17

Datasheet

BD41020FJ-C

TSZ02201-0T1T0H500020-1-2

www.rohm.com

TSZ22111・15・001

●Ordering Information

B D 4 1 0 2 0 F J － C E 2

Part

Number

Package

FJ: SOP-J8

Packaging and Forming

Specification

E2: Embossed Tape and Reel

●Marking Diagram

●Revision History

Date Revision Changes

2013.02.12 002 New Release

2013.03.25 003

P.4 Item Name change

“Operating Condition”→”Recommended Operating Rating(s)”

P.16 Physical Dimension, Tape and Ree l Information

Format change

SOP-J8 (TOP VIEW)

41020

Part Number Marking

LOT Number

1PIN MARK

Datasheet

Notice - SS Rev.002

Notice

Precaution on using ROHM Products

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Datasheet

Notice - SS Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or

concerning such information.