2001-2012 Microchip Technology Inc. DS21661E-page 1
TCM809/TCM810
Features
• Precision VDD Monitor for 2.5V, 3.0V, 3.3V, 5.0V
Nominal System Voltage Supplies
• 140 msec Minimum RESET Time-Out Period
• RESET Output to VDD = 1.0V (TCM809)
• Low Supply Current, 9 µA (typ.)
•V
DD Transient Immunity
• Small 3-Pin SC-70 and SOT-23B Packages
• No External Compo nents
• Push-Pull RESET Output
• Temperature Ranges:
- Industrial: SC-70 (E): -40C to +85C
- Extended: SOT-23, SC-70 (V): -40C to +125C
Applications
• Computers
• Embedded Systems
• Battery-powered Equipment
• Critical Mi cro con trol ler Power Supply Monitori ng
• Automotive
Typical Application Circuit
General Description
The TCM809 and TCM810 are cost-effective system
supervisor circuits designed to monitor VDD in digital
system s; provid ing a rese t signal t o the host processo r ,
when necessary. No external components are
required.
The RESET output is typically driven active within
65 µsec of VDD falling through the reset voltage thresh-
old. RESET is maintained active for a minimum of
140 msec after VDD rises above the reset threshold.
The TCM810 has an active-high RESET output, while
the TCM809 has an active-low RESET output. The
output of the TCM809/TCM810 is valid down to
VDD = 1V. Both devices are available in 3-Pin SC-70
and SOT-23B packages.
The TCM809/TCM810 are optimized to reject fast
transient glitches on the VDD line. A low supply current
of 9 µA (typ., VDD = 3.3V) make these devices suitable
for battery-powered applications.
Pin Configurations
1
TCM809
VDD
VDD
VDD
RESET RESET
INPUT
(Active-Low)
GND GND
PIC®
Microcontroller
3
2
SOT-23B/SC-70
Note: 3-Pin SOT-23B is equivale nt to
VDD
TCM809 RESET
GND
TCM809/
TCM810
1
2
TCM810 (RESET)
3
JEDEC TO-236.
3-Pin Microcontroller Reset Monitors
TCM809/TCM810
DS21661E-page 2 2001-2012 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage (VDD to GND)........................................................6.0V
RESET, RESET ...................................................-0.3V to (VDD +0.3V)
Input Current, VDD.......................................................................20 mA
Output Current, RESET, RESET.................................................20 mA
dV/dt (VDD)...........................................................................100V/µsec
Operating Temperature Range ...................................-40°C to +125°C
Power Dissipation (TA = 70°C):
3-Pin SOT-23B (derate 4 mW/°C above +70°C)....................320 mW
3-Pin SC-70 (derate 2.17 mW/°C above +70°C)....................174 mW
Storage Temperature Range.......................................-65°C to +150°C
Maximum Junction Temperature, TJ............................................150°C
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to m aximum rating conditions for extended periods
may affect device reliability.
ELECTR ICAL CHARACTERISTICS
VDD = Full Range, TA = Operating Tem peratur e Range, unless otherwise noted. Typical values are at TA = +25°C,
VDD = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note 1).
Parameter Sym Min Typ Max Unit s Test Conditions
VDD Range 1.0 — 5.5 V TA = 0°C to +70°C
1.2 — 5.5 TA = – 40°C to +125°C
Supply Current ICC —1230µATCM8xxL/M/J: VDD < 5.5V
—925 TCM8xxR/S/T/Z: VDD < 3.6V
Reset Threshold (Note 2) VTH 4.56 4.63 4.70 V TCM8xxL: TA = +25°C
4.50 — 4.75 TA = – 40°C to +125°C
4.31 4.38 4.45 V TCM8xxM: TA = +25°C
4.25 — 4.50 V TA = – 40°C to +125°C
3.93 4.00 4.06 V TCM809J: TA = +25°C
3.89 — 4.10 V TA = – 40°C to +125°C
3.04 3.08 3.11 V TCM8xxT: TA = +25°C
3.00 — 3.15 V TA = – 40°C to +125°C
2.89 2.93 2.96 V TCM8xxS: TA = +25°C
2.85 — 3.00 V TA = – 40°C to +125°C
2.59 2.63 2.66 V TCM8xxR: TA = +25°C
2.55 — 2.70 V TA = – 40°C to +125°C
2.28 2.32 2.35 V TCM8xxZ: TA = +25°C
2.25 — 2.38 V TA = – 40°C to +125°C
Reset Threshold Tempco — 30 — ppm/°C
VDD to Reset Delay, — 65 — µsec VDD = VTH to (VTH – 100 mV) (Note 2)
Reset Active T ime Out
Period 140 320 560 msec
RESET Output Voltage
Low (TCM809)VOL ——0.3VTCM809R/S/T/Z: VDD = VTH min, ISINK = 1.2 mA
——0.4 TCM809L/M/J: VDD = VTH min, ISINK = 3. 2 mA
——0.3 V
DD > 1.0V, ISINK = 50 µA
RESET Output Voltage
High (TCM809)VOH 0.8 VDD ——VTCM809R/S/T/Z: VDD > VTH max, ISOURCE = 500 µA
VDD – 1.5 — — TCM809L/M/J: VDD > VTH max, ISOURCE = 800 µA
RESET Output Voltage
Low (TCM810)VOL ——0.3VTCM810R/S/T/Z:VDD = VTH max, ISINK = 1.2 m A
——0.4 TCM810L/M: VDD = VTH max, ISINK = 3.2 mA
RESET Output Voltage
High (TCM810)VOH 0.8 VDD ——V1.8 < V
DD < VTH min, I SOURCE = 150 µA
Note 1: Production testing done at TA = +25°C, overtemperature limits ensured by QC screen.
2: RESET output for TCM809, RESET output for TCM810.
2001-2012 Microchip Technology Inc. DS21661E-page 3
TCM809/TCM810
2.0 TYPICAL PERFORMANCE CHARACTERISTICS
FIGURE 2-1: Supply Current vs.
Temperature.
FIGURE 2-2: Supply Current vs.
Temperature.
FIGURE 2-3: Power-up Reset Time Out
vs. Temperature.
FIGURE 2-4: Normalized Reset
Threshold vs. Temperature.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0
2
4
6
8
10
12
14
16
18
-40 -20 0 20 40 60 80 100 120
Temperatur e (°C)
Supply Current ( µA)
VDD = 1V
VDD = 3V
VDD = 5V
TCM8x x /R /S/ T/Z, No Load
0
2
4
6
8
10
12
14
16
-40-200 20406080100120
Temperatur e (°C)
Supply Current ( µA)
VDD = 5V
VDD = 3V
VDD = 1V
TCM8xx/L/M/J, No Load
0
50
100
150
200
250
300
350
400
450
-40 -20 0 20 40 60 80 100 120
Temperatur e (°C)
Power-up Reset Ti meout (µsec)
0.997
0.998
0.999
1
1.001
-40-200 20406080100120
Temperature (°C)
Norm alized Reset Th reshold
TCM809/TCM810
DS21661E-page 4 2001-2012 Microchip Technology Inc.
3.0 PIN DESCRIPTIONS
The descri pti ons of the pins are giv en in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
3.1 Ground (GND)
Ground term in al.
3.2 RESET Output (TCM809)
The RESET push-pull output remains low while VDD is
below the reset voltage threshold, and for 240 msec
(140 msec min.) af t er V DD rise s ab ov e res et th res hol d.
3.3 RESET Output ( TCM810 )
The RESET push-pull output remains high while VDD is
below the reset voltage threshold, and for 240 msec
(140 msec min.) af t er VDD rise s ab ov e res et th res hol d.
3.4 Supply Voltage (VDD)
VDD: +2.5V, +3.0V, +3.3V and +5.0V
NAME FUNCTION
GND Ground
RESET (TCM809) RESET push-pull outpu t
RESET (TCM810) RESET push-pull outpu t
VDD Supply voltage (+2.5V, +3.0V,
+3.3V, +5.0V).
2001-2012 Microchip Technology Inc. DS21661E-page 5
TCM809/TCM810
4.0 APPLICATIONS INFORMATION
4.1 VDD Transient Rejection
The T CM8 09/TCM810 prov id es ac cu rate V DD monitor-
ing and res et timi ng during powe r-up, power-d own an d
brown-out/sag conditions. These devices also reject
negative-going transients (glitches) on the power
supply line. Figure 4-1 shows the maximum transient
duration vs. maximum negative excursion (overdrive)
for glitch rejection. Any combination of duration and
overdrive that lies under the curve will not generate a
reset signal.
FIGURE 4-1: Maximum Transient
Duration vs. Overdrive for Glitch Rejection at
+25°C.
Combinations above the curve are detected as a
brown-out or power-down condition. Transient
immunity can be improved by adding a capacitor in
close pro ximity to the VDD pin of the TCM809/TC M810.
4.2 RESET Signal Integrity During
Power-Down
The TCM809 RESET output is valid to VDD = 1.0V.
Below this voltage the output becomes an "open cir-
cuit" and does not sink current. This means CMOS
logic inputs to the microcontroller will be floating at an
undetermined voltage. Most digital systems are
completely shut down well above this voltage.
However, in situations where RESET must be main-
tained valid to VDD = 0V, a pull-down resistor must be
connected from RESET to ground to discharge stray
capa citance s and hold the out put low (Figure 4-2 ). This
resistor value, though not critical, should be chosen
such that it does not appreciably load RESET under
normal operation (100 k will be suitable for most
applications). Similarly, a pull-up resistor to VDD is
required for the TCM 810 to ensure a valid high RESET
for VDD below 1.0V.
FIGURE 4-2: The addition of R1 at the
RESET output of the TCM809 ensures that the
RESET output is valid to VDD = 0V.
Reset Comparator Overdrive
[VTH – VDD] (mv)
400
240
160
320
80
0 1
5
100
1000
TA = +25°C
VTH
Duration
Overdrive
VDD
TCM8XXL/M/J (SOT-23)
Maximum Transient Duration (µsec)
TCM8XXZ/R/S/T
(SOT-23)
[VTH – VDD] (mv)
30
40
50
60
70
80
90
100
110
120
130
1 10 100 1000
Reset Comparator Overdrive (mV)
VDD to Reset Delay (µsec)
TCM8XXL/M/J (SC-70)
TCM8XXZ/R/S/T (SC-70)
TCM809
VDD
VDD
R1
100 k
RESET
GND
TCM809/TCM810
DS21661E-page 6 2001-2012 Microchip Technology Inc.
4.3 Controllers and Processors With
Bidirectional I/O Pins
Some microcontrollers have bidirectional reset pins.
Depending on the current drive capabi lity of the control-
ler pin, an indeterminate logic level may result if there
is a logic conflict. This can be avoided by adding a
4.7 k resistor in series with the output of the TCM80 9/
TCM810 (Figure 4-3). If there are other components in
the system that require a reset signal, they should be
buffered so as not to load the reset line. If the other
components are required to follow the reset I/O of the
microcontroller, the buffer should be connected as
shown with the solid line. FIGURE 4-3: I n te rf a ci n g t h e T CM 8 09 t o a
Bidirectional RES ET I/O .
TCM809
VDD
RESET
GND
RESET
GND
Buffered RESET
To Other System
Components
Micro-
4.7 kcontroller
Buffer
PIC®
2001-2012 Microchip Technology Inc. DS21661E-page 7
TCM809/TCM810
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
3-Pin SOT-23B
XXNN
Legend: XX...X Customer-spe cific informat ion*
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the even t the full M icrochip part nu mb er cann ot be marked o n one lin e, it wil l
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
Example:
Customer Specific Information Codes for:
TCM8xx =
Part Number TCM809 TCM810
TCM8xxLENB J1 K1
VNB JZ KZ
TCM8xxMENB J2 K2
VNB JY KY
TCM8xxTENB J3 K3
VNB JX KX
TCM8xxSENB J4 K4
VNB JV KV
TCM8xxRENB J5 K5
VNB JU KU
TCM8xxJ ENB J6 —
VNB JT KS
TCM8xxZENB J7 K6
3-Pin SC-70
Top Side Bottom Side
XXN
YWW
OR
XXNN
Example:
Customer Specific Information Codes for:
TCM8xx =
Part Number TCM809 TCM810
TCM8xxL ELB J1 —
VLB JZ KZ
TCM8xxM ELB J2 —
VLB JY KY
TCM8xxT ELB J3 —
VLB JX KX
TCM8xxS ELB J4 —
VLB JV KV
TCM8xxR ELB J5 —
VLB JU KU
TCM8xxJ ELB J6 —
VLB JT KS
TCM8xxZ ELB J7 —
VLB JS KT
TCM809/TCM810
DS21661E-page 8 2001-2012 Microchip Technology Inc.
3-Lead Plastic Small Outline Transistor (NB) (SOT-23)
10501050
Mold Draft Angle Bottom 10501050
Mold Draft Angle Top 0.510.440.37.020.017.015BLead Width 0.180.140.09.007.006.004
c
Lead Thickness 10501050
Fo ot Angle 0.550.450.35.022.018.014LFo ot Length 3.042.922.80.120.115.110DOverall Length 1.401.301.20.055.051.047E1Molded Packa ge Width 2.642.372.10.104.093.083EOverall Width 0.100.060.01.004.002.000A1Standoff § 1.020.950.88.040.037.035A2Molded Packa ge Thic kness 1.121.010.89.044.040.035AOverall Height 1.92.076
p1
Outside lead pitch (basic) 0.96
.038
p
Pitch 33
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2
1
p
D
B
n
E
E1
L
c
A2
A
A1
p1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2001-2012 Microchip Technology Inc. DS21661E-page 9
TCM809/TCM810
3-Lead Plastic Small Outline Transistor (LB) (SC-70)
12°8°12°8°
b
Mold Draft Angle Bottom
12°8°12°8°
a
Mold Draft Angle Top
0.400.15.016.006BLead Width
0.250.08.010.003
c
Lead Thickness
0.410.10.016.004LFoot Length
2.251.80.089.071DOverall Length
1.351.15.053.045E1Molded Package Width
2.401.80.094.071EOverall Width
.0100.00.0004.000A1Standoff
1.000.80.039.031A2Molded Package Thickness
1.100.80.043.031AOverall Height
1.30 BSC.
p1
Outside lead pitch (basic)
0.65 BSC.
p
Pitch
33Number of Pins
MAXMINMAXMINDimension Limits
MILLIMETERS*INCHESUnits
shall not exceed .005" (0.127mm) per side.
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
Notes:
JEITA (EIAJ) Equivalent: SC70
Drawing No. C04-104
*Controlling Parameter
L
B
E1
E
p
c
p1 D
1
2
3
b
a
A A2
A1
.026 BSC.
.051 BSC.
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
TCM809/TCM810
DS21661E-page 10 2001-2012 Microchip Technology Inc.
5.2 Product Tape and Reel Specifications
FIGURE 5-1: EMBOSSED CARRIER DIMEN SIO NS (8, 12, 16 AND 24 MM TAPE ONLY)
FIGURE 5-2: 3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS
Top
Cover
Tape
K0
P
W
B0
A0
TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS
Case
Outline Package
Type
Carrier
Dimensions Cavity
Dimensions Output
Quantity
Units
Reel
Diameter in
mm
W
mm P
mm A0
mm B0
mm K0
mm
NB SOT-23 3L 8 4 3.15 2.77 1.22 3000 180
LB SC-70 3L 8 4 2.4 2.4 1.19 3000 180
P,
Pitch
Device
Marking
2001-2012 Microchip Technology Inc. Confidential DS21661E-page 11
TCM809/TCM810
APPENDIX A: RE VISION HISTORY
Revision E (December 2012)
• Added a note to each package outline drawing.
Revision D (March 2005)
• Updated 6.0 “P ackaging Informat ion” to includ e
old and new packaging examples.
• Applied new template and rearranged sections to
be consistent with current docum entati on.
Revision C (April 2004)
Revision B (January 2002)
Revision A (May 2001)
Initial release of data sheet.
TCM809/TCM810
DS21661E-page 12 Confidential 2001-2012 Microchip Technology Inc.
NOTES:
2001-2012 Microchip Technology Inc. DS21661E-page 13
TCM809/TCM810
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
Device: TCM809: Supervisor ci rcuit with active -low RESE T output
TCM810: Supervisor circuit with active-high RESET output
VDD Reset Threshold: L = 4.63V
M=4.38V
J=4.00V
T=3.08V
S=2.93V
R=2.63V
Z=2.32V
Temperature Range: E = -40°C to +85°C
V = -40°C to +125°C
Package: NB713 = SOT-23B, 3-pin (Tape and Reel)
LB713 = SC-70, 3-pin (Tape and Reel)
PART NO. X X
Temperature
VDD
Reset
Device
Examples:
a) TCM809LENB713: SOT-23B-3-TR,
Microcontroller 4.63V
Reset Monitor,
-40°C to +85° C ,
Tape and Reel.
b) TCM809LVLB713: SC-70-3-TR,
Microcontroller 4.63V
Reset Monitor,
-40°C to +125 °C,
Tape and Reel.
c) TCM809LVNB713: SOT-23B-3-TR,
Microcontroller 4.63V
Reset Monitor,
-40°C to +125 °C,
Tape and Reel.
a) TCM810MENB713: SOT-23B-3-TR,
Microcontroller 4.38V
Reset Monitor,
-40°C to +85° C ,
Tape and Reel.
b) TCM810RVLB713: SOT-23B-3-TR,
Microcontroller 2.63V
Reset Monitor,
-40°C to +125 °C,
Tape and Reel.
c) TCM810TVLB713: SC-70-3-TR,
Microcontroller 4.38V
Reset Monitor,
-40°C to +125 °C,
Tape and Reel.
Range
Threshold
XXXXX
Package
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microc hip sales office
2. Th e Microchip Worldwide Site (www. micr ochip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.m icrochip.com ) to receive the most current information on our products.
TCM809/TCM810
DS21661E-page 14 2001-2012 Microchip Technology Inc.
NOTES:
2001-2012 Microchip Technology Inc. DS21661E-page 15
Information contained in this publication regarding device
applications a nd the lik e is provided only f or yo ur convenience
and may be supers ed ed by u pda t es . It is y our responsibil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
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suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip T echnology
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Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
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Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM ,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONIT OR, FanSense, HI-TIDE, In - Circuit Serial
Programm ing, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
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SQTP is a service mark of Microchip T echnology Incorporated
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GestIC and ULPP are registered trademarks of Microchip
Tec hnolo gy Germ any II GmbH & Co . & KG, a subsidiary of
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All other trademarks mentioned herein are property of their
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© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620768877
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• Microchip believes that its family of products is one of the most secure families of it s kind on the market today, when used in the
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• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
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CERTIFIED BY DNV
== ISO/TS 16949 ==
DS21661E-page 16 2001-2012 Microchip Technology Inc.
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Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los A n ge les
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Taiwan - T aipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Cop e nha gen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-14 4-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08 -91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921- 5820
Worldwide Sales and Service
11/29/12