TCM809/TCM810 3-Pin Microcontroller Reset Monitors Features General Description * Precision VDD Monitor for 2.5V, 3.0V, 3.3V, 5.0V Nominal System Voltage Supplies * 140 msec Minimum RESET Time-Out Period * RESET Output to VDD = 1.0V (TCM809) * Low Supply Current, 9 A (typ.) * VDD Transient Immunity * Small 3-Pin SC-70 and SOT-23B Packages * No External Components * Push-Pull RESET Output * Temperature Ranges: - Industrial: SC-70 (E): -40C to +85C - Extended: SOT-23, SC-70 (V): -40C to +125C The TCM809 and TCM810 are cost-effective system supervisor circuits designed to monitor VDD in digital systems; providing a reset signal to the host processor, when necessary. No external components are required. Applications * * * * * Computers Embedded Systems Battery-powered Equipment Critical Microcontroller Power Supply Monitoring Automotive The RESET output is typically driven active within 65 sec of VDD falling through the reset voltage threshold. RESET is maintained active for a minimum of 140 msec after VDD rises above the reset threshold. The TCM810 has an active-high RESET output, while the TCM809 has an active-low RESET output. The output of the TCM809/TCM810 is valid down to VDD = 1V. Both devices are available in 3-Pin SC-70 and SOT-23B packages. The TCM809/TCM810 are optimized to reject fast transient glitches on the VDD line. A low supply current of 9 A (typ., VDD = 3.3V) make these devices suitable for battery-powered applications. Pin Configurations SOT-23B/SC-70 Typical Application Circuit VDD 3 VDD PIC(R) Microcontroller TCM809 RESET TCM809/ TCM810 GND 1 VDD 2 GND 1 2001-2012 Microchip Technology Inc. RESET INPUT (Active-Low) GND TCM809 RESET TCM810 (RESET) 3 VDD 2 Note: 3-Pin SOT-23B is equivalent to JEDEC TO-236. DS21661E-page 1 TCM809/TCM810 1.0 ELECTRICAL CHARACTERISTICS Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings Supply Voltage (VDD to GND) ........................................................6.0V RESET, RESET ................................................... -0.3V to (VDD +0.3V) Input Current, VDD .......................................................................20 mA Output Current, RESET, RESET.................................................20 mA dV/dt (VDD)........................................................................... 100V/sec Operating Temperature Range ...................................-40C to +125C Power Dissipation (TA = 70C): 3-Pin SOT-23B (derate 4 mW/C above +70C) ....................320 mW 3-Pin SC-70 (derate 2.17 mW/C above +70C)....................174 mW Storage Temperature Range .......................................-65C to +150C Maximum Junction Temperature, TJ............................................ 150C ELECTRICAL CHARACTERISTICS VDD = Full Range, TA = Operating Temperature Range, unless otherwise noted. Typical values are at TA = +25C, VDD = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note 1). Parameter Sym VDD Range Min Typ Max Units 1.0 -- 5.5 V 1.2 -- 5.5 12 30 Supply Current ICC -- -- 9 25 Reset Threshold (Note 2) VTH 4.56 4.63 4.70 Reset Threshold Tempco VDD to Reset Delay, Reset Active Time Out Period RESET Output Voltage Low (TCM809) VOL RESET Output Voltage High (TCM809) VOH RESET Output Voltage Low (TCM810) VOL RESET Output Voltage High (TCM810) VOH 4.50 -- 4.75 4.31 4.38 4.45 TA = - 40C to +125C TCM8xxL/M/J: TCM8xxR/S/T/Z: VDD < 3.6V V TCM8xxL: TA = +25C V TCM8xxM: -- 4.50 V 4.00 4.06 V 3.89 -- 4.10 V 3.04 3.08 3.11 V 3.00 -- 3.15 V 2.89 2.93 2.96 V 2.85 -- 3.00 V 2.59 2.63 2.66 V 2.55 -- 2.70 V 2.28 2.32 2.35 V 2.25 -- 2.38 V -- 30 -- ppm/C -- 65 -- sec 140 320 560 msec -- -- 0.3 V -- -- 0.4 -- -- 0.3 0.8 VDD -- -- -- -- -- 0.3 -- -- 0.4 0.8 VDD -- -- VDD < 5.5V TA = - 40C to +125C 3.93 -- TA = 0C to +70C A 4.25 VDD - 1.5 Test Conditions TA = +25C TA = - 40C to +125C TCM809J: TA = +25C TA = - 40C to +125C TA = +25C TCM8xxT: TA = - 40C to +125C TA = +25C TCM8xxS: TA = - 40C to +125C TCM8xxR: TA = +25C TA = - 40C to +125C TA = +25C TCM8xxZ: TA = - 40C to +125C VDD = VTH to (VTH - 100 mV) (Note 2) TCM809R/S/T/Z: VDD = VTH min, ISINK = 1.2 mA TCM809L/M/J: VDD = VTH min, ISINK = 3.2 mA VDD > 1.0V, ISINK = 50 A V TCM809R/S/T/Z: VDD > VTH max, ISOURCE = 500 A TCM809L/M/J: VDD > VTH max, ISOURCE = 800 A V TCM810R/S/T/Z:VDD = VTH max, ISINK = 1.2 mA V 1.8 < VDD < VTH min, ISOURCE = 150 A TCM810L/M: VDD = VTH max, ISINK = 3.2 mA Note 1: Production testing done at TA = +25C, overtemperature limits ensured by QC screen. 2: RESET output for TCM809, RESET output for TCM810. DS21661E-page 2 2001-2012 Microchip Technology Inc. TCM809/TCM810 2.0 TYPICAL PERFORMANCE CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 18 TCM8xx/R/S/T/Z, No Load 450 16 VDD = 5V 400 Power-up Reset Timeout (sec) Supply Current ( A) 14 12 10 VDD = 3V 8 6 4 VDD = 1V 2 350 300 250 200 150 100 50 0 -40 -20 0 20 40 60 80 100 0 120 -40 Temperature (C) FIGURE 2-1: Temperature. -20 0 20 FIGURE 2-3: vs. Temperature. Supply Current vs. 16 40 60 Temperature (C) 80 100 120 Power-up Reset Time Out 1.001 TCM8xx/L/M/J, No Load 14 Normalized Reset Threshold VDD = 5V Supply Current ( A) 12 10 VDD = 3V 8 6 VDD = 1V 4 1 0.999 0.998 2 0 0.997 -40 -20 0 20 40 60 80 100 Temperature (C) FIGURE 2-2: Temperature. Supply Current vs. 2001-2012 Microchip Technology Inc. 120 -40 -20 0 20 40 60 80 100 120 Temperature (C) FIGURE 2-4: Normalized Reset Threshold vs. Temperature. DS21661E-page 3 TCM809/TCM810 3.0 PIN DESCRIPTIONS The descriptions of the pins are given in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE NAME GND FUNCTION Ground RESET (TCM809) RESET push-pull output RESET (TCM810) RESET push-pull output VDD 3.1 Supply voltage (+2.5V, +3.0V, +3.3V, +5.0V). Ground (GND) Ground terminal. 3.2 RESET Output (TCM809) The RESET push-pull output remains low while VDD is below the reset voltage threshold, and for 240 msec (140 msec min.) after VDD rises above reset threshold. 3.3 RESET Output (TCM810) The RESET push-pull output remains high while VDD is below the reset voltage threshold, and for 240 msec (140 msec min.) after VDD rises above reset threshold. 3.4 Supply Voltage (VDD) VDD: +2.5V, +3.0V, +3.3V and +5.0V DS21661E-page 4 2001-2012 Microchip Technology Inc. TCM809/TCM810 4.0 APPLICATIONS INFORMATION 4.1 VDD Transient Rejection The TCM809/TCM810 provides accurate VDD monitoring and reset timing during power-up, power-down and brown-out/sag conditions. These devices also reject negative-going transients (glitches) on the power supply line. Figure 4-1 shows the maximum transient duration vs. maximum negative excursion (overdrive) for glitch rejection. Any combination of duration and overdrive that lies under the curve will not generate a reset signal. VDD VTH Overdrive Maximum Transient Duration (sec) Duration 400 TA = +25C Combinations above the curve are detected as a brown-out or power-down condition. Transient immunity can be improved by adding a capacitor in close proximity to the VDD pin of the TCM809/TCM810. 4.2 RESET Signal Integrity During Power-Down The TCM809 RESET output is valid to VDD = 1.0V. Below this voltage the output becomes an "open circuit" and does not sink current. This means CMOS logic inputs to the microcontroller will be floating at an undetermined voltage. Most digital systems are completely shut down well above this voltage. However, in situations where RESET must be maintained valid to VDD = 0V, a pull-down resistor must be connected from RESET to ground to discharge stray capacitances and hold the output low (Figure 4-2). This resistor value, though not critical, should be chosen such that it does not appreciably load RESET under normal operation (100 k will be suitable for most applications). Similarly, a pull-up resistor to VDD is required for the TCM810 to ensure a valid high RESET for VDD below 1.0V. 320 VDD 240 160 VDD TCM8XXL/M/J (SOT-23) 80 0 TCM809 TCM8XXZ/R/S/T (SOT-23) 1 RESET 5 1000 100 Reset Comparator Overdrive [VTH - VDD] (mv) GND R1 100 k VDD to Reset Delay (sec) 130 120 FIGURE 4-2: The addition of R1 at the RESET output of the TCM809 ensures that the RESET output is valid to VDD = 0V. TCM8XXL/M/J (SC-70) 110 100 90 80 70 60 50 TCM8XXZ/R/S/T (SC-70) 40 30 1 10 100 1000 Reset Comparator Overdrive (mV) [VTH - VDD] (mv) FIGURE 4-1: Maximum Transient Duration vs. Overdrive for Glitch Rejection at +25C. 2001-2012 Microchip Technology Inc. DS21661E-page 5 TCM809/TCM810 4.3 Controllers and Processors With Bidirectional I/O Pins Some microcontrollers have bidirectional reset pins. Depending on the current drive capability of the controller pin, an indeterminate logic level may result if there is a logic conflict. This can be avoided by adding a 4.7 k resistor in series with the output of the TCM809/ TCM810 (Figure 4-3). If there are other components in the system that require a reset signal, they should be buffered so as not to load the reset line. If the other components are required to follow the reset I/O of the microcontroller, the buffer should be connected as shown with the solid line. Buffer Buffered RESET To Other System Components VDD TCM809 4.7 k RESET GND PIC(R) Microcontroller RESET GND FIGURE 4-3: Interfacing the TCM809 to a Bidirectional RESET I/O. DS21661E-page 6 2001-2012 Microchip Technology Inc. TCM809/TCM810 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Example: 3-Pin SOT-23B Customer Specific Information Codes for: TCM8xx = Part Number XXNN TCM8xxL TCM8xxM TCM8xxT TCM8xxS TCM8xxR TCM8xxJ TCM8xxZ 3-Pin SC-70 ENB VNB ENB VNB ENB VNB ENB VNB ENB VNB ENB VNB ENB TCM809 TCM810 J1 JZ J2 JY J3 JX J4 JV J5 JU J6 JT J7 K1 KZ K2 KY K3 KX K4 KV K5 KU -- KS K6 Example: Customer Specific Information Codes for: TCM8xx = XXN YWW Part Number TCM8xxL Bottom Side Top Side TCM8xxM TCM8xxT OR TCM8xxS TCM8xxR XXNN TCM8xxJ TCM8xxZ Legend: XX...X Y YY WW NNN e3 * Note: ELB VLB ELB VLB ELB VLB ELB VLB ELB VLB ELB VLB ELB VLB TCM809 TCM810 J1 JZ J2 JY J3 JX J4 JV J5 JU J6 JT J7 JS -- KZ -- KY -- KX -- KV -- KU -- KS -- KT Customer-specific information* Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2001-2012 Microchip Technology Inc. DS21661E-page 7 TCM809/TCM810 3-Lead Plastic Small Outline Transistor (NB) (SOT-23) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 2 B p1 n D p 1 c A A1 L Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A2 A A2 A1 E E1 D L c B MIN .035 .035 .000 .083 .047 .110 .014 0 .004 .015 0 0 INCHES* NOM 3 .038 .076 .040 .037 .002 .093 .051 .115 .018 5 .006 .017 5 5 MAX .044 .040 .004 .104 .055 .120 .022 10 .007 .020 10 10 MILLIMETERS NOM 3 0.96 1.92 0.89 1.01 0.88 0.95 0.01 0.06 2.10 2.37 1.20 1.30 2.80 2.92 0.35 0.45 0 5 0.09 0.14 0.37 0.44 0 5 0 5 MIN MAX 1.12 1.02 0.10 2.64 1.40 3.04 0.55 10 0.18 0.51 10 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104 DS21661E-page 8 2001-2012 Microchip Technology Inc. TCM809/TCM810 3-Lead Plastic Small Outline Transistor (LB) (SC-70) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 2 B p1 3 D p 1 a A2 A c b A1 L Units Dimension Limits Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom p p1 A A2 A1 E E1 D L c B a b INCHES MIN 3 .026 BSC. .051 BSC. .031 .031 .000 .071 .045 .071 .004 .003 .006 8 8 MAX .043 .039 .0004 .094 .053 .089 .016 .010 .016 12 12 MILLIMETERS* MIN MAX 3 0.65 BSC. 1.30 BSC. 0.80 1.10 0.80 1.00 0.00 .010 1.80 2.40 1.15 1.35 1.80 2.25 0.10 0.41 0.08 0.25 0.15 0.40 8 12 8 12 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (EIAJ) Equivalent: SC70 Drawing No. C04-104 2001-2012 Microchip Technology Inc. DS21661E-page 9 TCM809/TCM810 5.2 Product Tape and Reel Specifications FIGURE 5-1: EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY) Top Cover Tape A0 W B0 K0 P TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS Case Outline Carrier Dimensions Package Type W mm Cavity Dimensions P mm A0 mm B0 mm K0 mm Output Quantity Units Reel Diameter in mm NB SOT-23 3L 8 4 3.15 2.77 1.22 3000 180 LB SC-70 3L 8 4 2.4 2.4 1.19 3000 180 3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS Device Marking FIGURE 5-2: User Direction of Feed Device Marking Pin 1 W, Width of Carrier Tape Pin 1 P, Pitch Standard Reel Component Orientation DS21661E-page 10 Reverse Reel Component Orientation 2001-2012 Microchip Technology Inc. TCM809/TCM810 APPENDIX A: REVISION HISTORY Revision E (December 2012) * Added a note to each package outline drawing. Revision D (March 2005) * Updated 6.0 "Packaging Information" to include old and new packaging examples. * Applied new template and rearranged sections to be consistent with current documentation. Revision C (April 2004) Revision B (January 2002) Revision A (May 2001) Initial release of data sheet. 2001-2012 Microchip Technology Inc. Confidential DS21661E-page 11 TCM809/TCM810 NOTES: DS21661E-page 12 Confidential 2001-2012 Microchip Technology Inc. TCM809/TCM810 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X X XXXXX Device VDD Temperature Range Package Reset Threshold Device: TCM809: Supervisor circuit with active-low RESET output TCM810: Supervisor circuit with active-high RESET output VDD Reset Threshold: L M J T S R Z = = = = = = = Temperature Range: E V = -40C to +85C = -40C to +125C Package: NB713 = SOT-23B, 3-pin (Tape and Reel) LB713 = SC-70, 3-pin (Tape and Reel) 4.63V 4.38V 4.00V 3.08V 2.93V 2.63V 2.32V Examples: a) TCM809LENB713: b) TCM809LVLB713: c) TCM809LVNB713: a) TCM810MENB713: b) TCM810RVLB713: c) TCM810TVLB713: SOT-23B-3-TR, Microcontroller 4.63V Reset Monitor, -40C to +85C, Tape and Reel. SC-70-3-TR, Microcontroller 4.63V Reset Monitor, -40C to +125C, Tape and Reel. SOT-23B-3-TR, Microcontroller 4.63V Reset Monitor, -40C to +125C, Tape and Reel. SOT-23B-3-TR, Microcontroller 4.38V Reset Monitor, -40C to +85C, Tape and Reel. SOT-23B-3-TR, Microcontroller 2.63V Reset Monitor, -40C to +125C, Tape and Reel. SC-70-3-TR, Microcontroller 4.38V Reset Monitor, -40C to +125C, Tape and Reel. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. Your local Microchip sales office The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com) to receive the most current information on our products. 2001-2012 Microchip Technology Inc. DS21661E-page 13 TCM809/TCM810 NOTES: DS21661E-page 14 2001-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768877 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2001-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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