STTH110 High voltage ultrafast rectifier Datasheet - production data Description K A The STTH110, which is using ST ultrafast high voltage planar technology, is especially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. A Table 1. Device summary A K K DO-41 STTH110 SMA (JEDEC DO-214AC) STTH110A Symbol Value IF(AV) 1A VRRM 1000 V Tj (max) 175 C VF (max) 1.42 V Features Low forwarded voltage drop High reliability High surge current capability Soft switching for reduced EMI disturbances Planar technology December 2013 This is information on a product in full production. DocID9344 Rev 3 1/8 www.st.com Characteristics 1 STTH110 Characteristics Table 2. Absolute ratings (limiting values at Tj = 25 C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 1000 V V(RMS) Voltage rms 700 V SMA TL = 110 C = 0.5 1 DO-41 TL = 125 C = 0.5 1 IF(AV) Average forward current IFSM Forward Surge current t = 8.3 ms Tstg Storage temperature range Tj A SMA 18 DO-41 20 A -50 to + 175 C 175 C Value Unit Maximum operating junction temperature Table 3. Thermal resistance Symbol Parameter Rth(j-l) Junction to lead Rth(j-a) Junction to ambient SMA 30 Lead length = 10 mm DO-41 45 Lead length = 10 mm DO-41 110 C/W Table 4. Static electrical characteristics Symbol Parameter Tests conditions IR Reverse leakage current VF Forward voltage drop Tj = 25 C Min. Typ. Max. Unit 10 Tj = 125 C Tj = 25 C VR = 1000 V A 50 1.7 Tj = 150 C IF = 1 A V 0.98 1.42 To evaluate the conduction losses use the following equation: P = 1.20 x IF(AV) + 0.225 IF2(RMS) Table 5. Dynamic electrical characteristics Symbol trr Reverse recovery time tfr Forward recovery time VFP 2/8 Parameter Forward recovery voltage Tests conditions Tj = 25 C IF = 0.5, A Irr = 0.25 A, IR = 1 A Tj = 25 C IF = 1 A, dIF/dt = 50 A/ms VFR = 1.1 x VFmax DocID9344 Rev 3 Min. Typ. Max. Unit 75 ns 300 ns 18 V STTH110 Characteristics Figure 1. Conduction losses versus average current 1.8 P(W) Figure 2. Forward voltage drop versus forward current (typical values) IFM(A) 100.0 = 0.05 1.6 = 0.2 = 0.1 = 0.5 Tj=150C (maximum values) 1.4 =1 1.2 10.0 Tj=150C (typical values) 1.0 Tj=25C (maximum values) 0.8 0.6 1.0 T 0.4 0.2 IF(AV)(A) VFM(V) tp =tp/T 0.0 0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 Figure 3. Relative variation of thermal impedance junction ambient versus pulse duration (DO-41) 1.0 1.0 epoxy FR4, leads = 10 mm 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Zth(j-c)/Rth(j-c) 0.9 0.8 0.8 0.7 0.7 0.6 0.5 Figure 4. Relative variation of thermal impedance junction ambient versus pulse duration (SMA) Zth(j-c)/Rth(j-c) 0.9 0.0 0.6 = 0.5 = 0.5 = 0.2 = 0.1 0.5 0.5 0.4 0.4 0.3 0.3 = 0.2 0.2 T 0.2 = 0.1 0.1 Single pulse tp(s) 0.0 1.E-01 1.E+00 = tp/T 1.E+01 0.1 tp 1.E+02 T tp(s) Single pulse 0.0 1.E+03 1.E-01 1.E+00 =tp/T 1.E+01 tp 1.E+02 1.E+03 Figure 5. Thermal resistance junction to Figure 6. Thermal resistance junction to ambient versus copper surface under each lead ambient versus copper surface under each lead (DO-41) (SMA) 120 Rth(j-a)(C/W) 140 epoxy printed circuit board FR4, copper thickness: 35 m 110 Rth(j-a)(C/W) epoxy printed circuit board FR4, copper thickness: 35 m 130 120 100 110 90 100 80 90 70 80 60 70 50 60 50 40 40 30 30 20 20 10 10 S(cm) 0 0 1 2 3 4 5 S(cm) 0 6 7 8 9 10 0.0 DocID9344 Rev 3 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 3/8 8 Package information 2 STTH110 Package information Epoxy meets UL94,V0 Lead-free package Band indicates cathode Bending method (DO-41): see Application note AN1471 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Figure 7. SMA dimensions definitions E1 D E A1 A2 C L 4/8 DocID9344 Rev 3 b STTH110 Package information Table 6. SMA dimension values Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 Figure 8. SMA footprint, dimensions in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.064) 5.43 (0.214) DocID9344 Rev 3 5/8 8 Package information STTH110 Figure 9. DO-41 (plastic) dimensions definitions C A C B D D Table 7. DO-41 (plastic) dimension values Dimensions Ref. Millimeters Min. 6/8 Typ. Inches Max. Min. Typ. Max. A 4.07 5.20 0.160 0.205 B 2.04 2.71 0.080 0.107 C 25.4 D 0.71 1 0.86 DocID9344 Rev 3 0.028 0.034 STTH110 3 Ordering information Ordering information Table 8. Ordering information 4 Order codes Marking Package Weight Base qty Delivery mode STTH110 STTH110 DO-41 0.34 g 2000 Ammopack STTH110A H10 SMA 0.068 g 5000 Tape and reel 13" STTH110RL STTH110 DO-41 0,34 g 5000 Tape and reel 13" Revision history Table 9. Document revision history Date Revision Changes Jan-2003 1 Initial release. 30-Sept-2009 2 Updated Table 8. 20-Dec-2013 3 Updated Table 4. DocID9344 Rev 3 7/8 8 STTH110 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. 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