General Description
The MAX1778/MAX1880–MAX1885 multiple-output
DC-DC converters provide the regulated voltages
required by active matrix thin-film transistor (TFT) liquid
crystal displays (LCD) in a low-profile TSSOP package.
One high-power step-up converter and two low-power
charge pumps convert the 2.7V to 5.5V input voltage
into three independent output voltages. A built-in linear
regulator and VCOM buffer complete the power-supply
requirements.
The main step-up converter accurately generates an
externally set output voltage up to 13V that can supply
the display’s row/column drivers. The converter’s high
switching frequency and current-mode PWM architec-
ture provide fast transient response and allow the use
of small low-profile inductors and ceramic capacitors.
The low-power BiCMOS control circuitry and internal
14V switch (0.35ΩN-channel MOSFET) enable efficien-
cies up to 91%.
The dual low-power charge pumps (MAX1778/
MAX1880/MAX1881/MAX1882 only) independently reg-
ulate one positive output (VPOS) and one negative out-
put (VNEG). These low-power outputs use external
diode and capacitor stages (as many stages as
required) to regulate output voltages up to +40V and
-40V. A unique control scheme minimizes output ripple
as well as capacitor sizes for both charge pumps.
A resistor-programmable, 40mA, low-dropout linear
regulator (MAX1778/MAX1881/MAX1883/MAX1884
only) provides preregulation or postregulation for any of
the supplies. For higher current applications, an exter-
nal transistor can be added. Additionally, the VCOM
buffer provides a high current output that is ideal for
driving the capacitive backplane of TFT LCD panels.
The VCOM buffer’s output voltage is preset with an
internal 50% resistive-divider or can be externally
adjusted for other voltages.
The MAX1778/MAX1880–MAX1885 are protected
against output undervoltage and thermal overload con-
ditions by a latched fault detection circuit that shuts
down the device. All devices are available in the ultra-
thin TSSOP package (1.1mm max height).
Applications
TFT LCD Notebook Displays
TFT LCD Desktop Monitor Panels
Features
500kHz/1MHz Current-Mode PWM Step-Up
Regulator
Up to +13V Main High-Power Output
±1% Accurate
High Efficiency (91%)
Dual Regulated Charge-Pump Outputs
(MAX1778/MAX1880/MAX1881/MAX1882 only)
Up to +40V Positive Charge-Pump Output
Up to -40V Negative Charge-Pump Output
Low-Dropout 40mA Linear Regulator
(MAX1778/MAX1881/MAX1883/MAX1884 only)
Up to +15V LDO Input
Optional Higher Current with External Transistor
2.7V to 5.5V Input Supply
Internal Supply Sequencing and Soft-Start
Power-Ready Output
Adjustable Fault-Detection Latch
Thermal Protection (+160°C)
0.1µA Shutdown Current
0.7mA IN Quiescent Current
Ultra-Small External Components
Thin TSSOP Package (1.1mm max height)
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
________________________________________________________________ Maxim Integrated Products 1
19-1979; Rev 1; 9/05
Ordering Information
PART TEMP RANGE PIN-PACKAGE
MAX1778EUG -40°C to +85°C 24 TSSOP
MAX1778EUG+ -40°C to +85°C 24 TSSOP
MAX1880EUG -40°C to +85°C 24 TSSOP
MAX1881EUG -40°C to +85°C 24 TSSOP
MAX1882EUG -40°C to +85°C 24 TSSOP
MAX1883EUP -40°C to +85°C 20 TSSOP
MAX1884EUP -40°C to +85°C 20 TSSOP
MAX1885EUP -40°C to +85°C 20 TSSOP
Typical Operating Circuit appears at end of data sheet.
Pin Configurations and Selector Guide appear at end of
data sheet.
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
+ Denotes lead-free package.
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VIN = +3.0V, SHDN = IN, VSUPP = VSUPN = VSUPB = VSUPL = 10V, LDOOUT = FBL, BUF- = BUFOUT, BUF+ = FLTSET = TGND =
PGND = GND, CREF = 0.22µF, CBUF = 1µF, TA= 0°C to +85°C. Typical values are at TA= +25°C, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
IN, SHDN, TGND, FLTSET to GND...........................-0.3V to +6V
DRVN to GND .........................................-0.3V to (VSUPN + 0.3V)
DRVP to GND..........................................-0.3V to (VSUPP + 0.3V)
PGND to GND.....................................................................±0.3V
RDY, SUPB to GND ................................................-0.3V to +14V
LX, SUPP, SUPN to PGND .....................................-0.3V to +14V
SUPL to GND..........................................................-0.3V to +18V
LDOOUT to GND ....................................-0.3V to (VSUPL + 0.3V)
INTG, REF, FB, FBN, FBP to GND...............-0.3V to (VIN + 0.3V)
FBL to GND .............-0.3V to the lower of (VSUPL+ 0.3V) or +6V
BUFOUT, BUF+, BUF- to GND ...............-0.3V to (VSUPB + 0.3V)
Continuous Power Dissipation (TA= +70°C)
20-Pin TSSOP (derate 10.9mW/°C above +70°C) ......879mW
24-Pin TSSOP (derate 12.2mW/°C above +70°C) ......975mW
Operating Temperature Range
MAX1778EUG, MAX1883EUP ........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Input Supply Range VIN 2.7 5.5 V
Input Undervoltage Threshold
VUVLO
VIN rising, 40mV hysteresis (typ) 2.2 2.4 2.6 V
MAX1778/MAX1880/
MAX1883 (fOSC = 1MHz) 0.7 1
IN Quiescent Supply Current IIN
VFB = VFBP
= 1.5V, VFBN
= -0.2V
MAX1881/MAX1882/
MAX1884/MAX1885
(fOSC = 500kHz)
0.6 1
mA
MAX1778/MAX1880
(fOSC = 1MHz) 0.4 0.7
SUPP Quiescent Current ISUPP VFBP = 1.5V
MAX1881/MAX1882
(fOSC = 500kHz) 0.3 0.5
mA
MAX1778/MAX1880
(fOSC = 1MHz) 0.4 0.7
SUPN Quiescent Current ISUPN
VFBN = -0.2V
MAX1881/MAX1882
(fOSC = 500kHz) 0.3 0.5
mA
IN Shutdown Current VSHDN = 0, VIN = 5V 0.1 10 µA
SUPP Shutdown Current VSHDN = 0, VSUPP = 13V,
MAX1778/MAX1880/MAX1881/MAX1882 0.1 10 µA
SUPN Shutdown Current VSHDN = 0, VSUPN = 13V,
MAX1778/MAX1880/MAX1881/MAX1882 0.1 10 µA
SUPL Shutdown Current VSHDN = 0, VSUPL = 13V
MAX1778/MAX1881/MAX1883/MAX1884 0.1 10 µA
SUPB Shutdown Current VSHDN = 0, VSUPB = 13V 6 13 µA
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(VIN = +3.0V, SHDN = IN, VSUPP = VSUPN = VSUPB = VSUPL = 10V, LDOOUT = FBL, BUF- = BUFOUT, BUF+ = FLTSET = TGND =
PGND = GND, CREF = 0.22µF, CBUF = 1µF, TA= 0°C to +85°C. Typical values are at TA= +25°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Main Output Voltage Range VMAIN VIN 13 V
Integrator enabled, CINTG = 1000pF
1.234 1.247 1.260
FB Regulation Voltage VFB Integrator disabled (INTG = REF)
1.220 1.280
V
FB Input Bias Current IFB VFB = 1.25V, INTG = GND -50
+50
nA
MAX1778/MAX1880/MAX1883
0.85
1
1.15 MHz
Operating Frequency fOSC MAX1881/MAX1882/MAX1884/MAX1885
425 500
575
kHz
Oscillator Maximum Duty
Cycle 80 85 91 %
Integrator enabled,
CINTG = 1000pF
0.01
Load Regulation ILX = 0 to 200mA,
VMAIN = 10V Integrator disabled
(INTG = REF) 0.2
%
Line Regulation 0.1
%/V
Integrator Transconductance
317
µs
LX Switch On-Resistance
RLX
(
ON
)
ILX = 100mA
0.35
0.7 Ω
LX Leakage Current ILX VLX = 13V
0.01
20 µA
Phase I = soft-start (1024/fOSC)
0.275 0.38
0.5
Phase II = soft-start (1024/fOSC)
0.75
Phase III = soft-start (1024/fOSC)
1.12
LX Current Limit ILIM
Phase IV = fully-on (after 3072/fOSC)
1.15
1.5
1.85
A
Maximum RMS LX Current 1A
Soft-Start Period tSS Power-up to the end of Phase III 3072 / fOSC s
Falling edge, FLTSET = GND
1.07
1.1
1.14
FB Fault Trip Level Falling edge, FLTSET = 1V
0.955 0.99 1.025
V
POSITIVE CHARGE PUMP (MAX1778/MAX1880/MAX1881/MAX1882 only)
SUPP Input Supply Range VSUPP 2.7 13 V
Operating Frequency fCHP 0.5 x fOSC Hz
FBP Regulation Voltage VFBP 1.2
1.25
1.3 V
FBP Input Bias Current IFBP VFBP = 1.5V -50
+50
nA
DRVP PCH On-Resistance
RPCH
(
ON
)
510Ω
VFBP = 1.2V 2 4 Ω
DRVP NCH On-Resistance
RNCH
(
ON
)
VFBP = 1.3V 20 kΩ
Maximum RMS DRVP Current 0.1 A
FBP Power-Ready Trip Level Rising edge
1.09 1.125 1.16
V
Falling edge, FLTSET = GND
1.08 1.11 1.16
FBP Fault Trip Level Falling edge, FLTSET = 1V
0.955 0.99 1.025
V
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(VIN = +3.0V, SHDN = IN, VSUPP = VSUPN = VSUPB = VSUPL = 10V, LDOOUT = FBL, BUF- = BUFOUT, BUF+ = FLTSET = TGND =
PGND = GND, CREF = 0.22µF, CBUF = 1µF, TA= 0°C to +85°C. Typical values are at TA= +25°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX
UNITS
NEGATIVE CHARGE PUMP (MAX1778/MAX1880/MAX1881/MAX1882 only)
SUPN Input Supply Range
VSUPN
2.7 13 V
Operating Frequency fCHP 0.5 x fOSC Hz
FBN Regulation Voltage VFBN
-50
0
+50
mV
FBN Input Bias Current IFBN VFBN = 0 -50
+50
nA
DRVN PCH On-Resistance
RPCH
(
ON
)
510Ω
VFBN = +50mV 24Ω
DRVN NCH On-Resistance
RNCH
(
ON
)
VFBN = -50mV 20 kΩ
Maximum RMS DRVN Current 0.1 A
FBN Power-Ready Trip Level Falling edge 80
125
165 mV
FBN Fault Trip Level Rising edge 80
140
190 mV
LOW-DROPOUT LINEAR REGULATOR (MAX1778/MAX1881/MAX1883/MAX1884 only)
SUPL Input Supply Range VSUPL 4.5 15 V
SUPL Undervoltage Lockout Rising edge, 50mV hysteresis (typ) 3.8 4 4.3 V
SUPL Quiescent Current ISUPL ILDO = 100µA
120
220 µA
ILDO = 40mA
130
300
Dropout Voltage (Note 1)
VDROP
LDO is set to
regulate at 9V ILDO = 5mA 70 mV
FBL Regulation Voltage VFBL VSUPL = 10V, LDO regulating at 9V,
ILDO = 15mA
1.235 1.25 1.265
V
LDO Load Regulation VSUPL = 10V, LDO regulating at 9V,
ILDO = 100µA to 40mA 1.2 %
LDO Line Regulation VSUPL = 4.5V to 15V, FBL = LDOOUT,
ILDO = 15mA
0.02
%/V
FBL Input Bias Current IFBL VFBL = 1.25V
-0.8 +0.8
µA
LDO Current Limit
ILDOLIM
VSUPL = 10V, VLDOOUT = 9V, VFBL = 1.2V 40
130
220 mA
VCOM BUFFER
SUPB Input Supply Range
VSUPB
4.5 13 V
SUPB Quiescent Current ISUPB VSUPB = 13V
420
850 µA
BUFOUT Leakage Current -10
+10
µA
Power-Supply Rejection Ratio PSRR VSUPB = 4.5V to 13V, VCM = 2.25V 85 98 dB
Input Common-Mode Voltage
Range VCM |VOS| < 10mV 1.2 8.8 V
Common-Mode Rejection Ratio
CMRR
VCM = 1.2V to 8.8V 75 dB
Input Bias Current IBIAS VCM = 5V
-100
-10
+100
nA
Input Offset Current IOS VCM = 5V
-100 +100
nA
Gain Bandwidth Product GBW CBUF = 1µF 13
kHz
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
_______________________________________________________________________________________ 5
ELECTRICAL CHARACTERISTICS (continued)
(VIN = +3.0V, SHDN = IN, VSUPP = VSUPN = VSUPB = VSUPL = 10V, LDOOUT = FBL, BUF- = BUFOUT, BUF+ = FLTSET = TGND =
PGND = GND, CREF = 0.22µF, CBUF = 1µF, TA= 0°C to +85°C. Typical values are at TA= +25°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX
UNITS
IBUFOUT = 0
4.99 5.01
IBUFOUT = ±5mA
4.97 5.03
V
Output Voltage
VBUFOUT
BUF+ = GND
IBUFOUT = ±45mA
4.93 5.07
IBUFOUT = ±5mA -30 30
Input Offset Voltage VOS
VSUPB = 4.5V to 13V,
VCM = 1.2V to
(VSUPB –1.2V) IBUFOUT = ±45mA -70 70
mV
Output Voltage Swing High VOH IBUFOUT = -45mA, ΔVOS = 1V 9 9.6 V
Output Voltage Swing Low VOL IBUFOUT = +45mA, ΔVOS = 1V 0.4 1 V
Peak Buffer Output Current
±150
mA
BUF+ Dual Mode™ Threshold
Voltage Falling edge, 20mV hysteresis (typ) 80
125
170 mV
REFERENCE
Reference Voltage VREF -2μA < IREF < 50µA
1.231 1.25 1.269
V
Reference Undervoltage
Threshold 0.9
1.05
1.2 V
LOGIC SIGNALS
SHDN Input Low Voltage 0.9 V
SHDN Input High Voltage 2.1 V
SHDN Input Current ISHDN
0.01
A
FLTSET Input Voltage Range 0.67 x
VREF
0.85 x
VREF
V
FLTSET Threshold Voltage Rising edge, 25mV hysteresis (typ) 80
125
170 mV
FLTSET Input Current VFLTSET = 1V 0.1 50 nA
RDY Output Low Voltage ISINK = 2mA
0.25
0.5 V
RDY Output High Leakage V RDY = 13V
0.01
A
Thermal Shutdown Rising temperature
160
°C
Dual Mode is a registered trademark of Maxim Integrated Products, Inc.
Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
6 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS
(VIN = +3.0V, SHDN = IN, VSUPP = VSUPN = VSUPB = VSUPL = 10V, LDOOUT = FBL, BUF- = BUFOUT, BUF+ = FLTSET = TGND =
PGND = GND, CREF = 0.22µF, CBUF = 1µF, TA= -40°C to +85°C, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS MIN
MAX
UNITS
Input Supply Range VIN 2.7 5.5 V
Input Undervoltage
Threshold VUVLO VIN Rising, 40mV hysteresis (typ) 2.2 2.6 V
MAX1778/MAX1880/
MAX1883 (fOSC = 1MHz) 1
IN Quiescent Supply
Current IIN
VFB =
VFBP = 1.5V,
VFBN = -0.2V MAX1881/MAX1882/MAX1884/
MAX1885 (fOSC = 500kHz) 1
mA
MAX1778/MAX1880
(fOSC = 1MHz) 0.7
SUPP Quiescent Current ISUPP VFBP = 1.5V
MAX1881/MAX1882
(fOSC = 500kHz) 0.5
mA
MAX1778/MAX1880
(fOSC = 1MHz) 0.7
SUPN Quiescent Current ISUPN VFBN = -0.2V
MAX1881/MAX1882
(fOSC = 500kHz) 0.5
mA
IN Shutdown Current VSHDN = 0, VIN = 5V 10 µA
SUPP Shutdown Current VSHDN = 0, VSUPP = 13V,
MAX1778/MAX1880/MAX1881/MAX1882 10 µA
SUPN Shutdown Current VSHDN = 0, VSUPN = 13V,
MAX1778/MAX1880/MAX1881/MAX1882 10 µA
SUPL Shutdown Current VSHDN = 0, VSUPL = 13V,
MAX1778/MAX1881/MAX1883/MAX1884 10 µA
SUPB Shutdown Current VSHDN = 0, VSUPB = 13V 13 µA
MAIN STEP-UP CONVERTER
Main Output Voltage Range
VMAIN VIN 13 V
Integrator enabled, CINTG = 1000pF
1.223 1.269
FB Regulation Voltage VFB Integrator disabled (INTG = REF)
1.21 1.29
V
FB Input Bias Current IFB VFB = 1.25V, INTG = GND -50
+50
nA
MAX1778/MAX1880/MAX1883
0.75 1.25
MHz
Operating Frequency FOSC MAX1881/MAX1882/MAX1884/MAX1885
375
625
kHz
Oscillator Maximum Duty
Cycle 79 91 %
LX Switch On-Resistance
RLX
(
ON
)
ILX = 100mA 0.7 Ω
LX Leakage Current ILX VLX = 13V 20 µA
Phase I = soft-start (1024/fOSC)
0.275 0.525
LX Current Limit ILIM Phase IV = fully on (after 3072/fOSC) 1.1
2.05
A
FB Fault Trip Level Falling edge, FLTSET = GND
1.07 1.14
V
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
_______________________________________________________________________________________ 7
ELECTRICAL CHARACTERISTICS (continued)
(VIN = +3.0V, SHDN = IN, VSUPP = VSUPN = VSUPB = VSUPL = 10V, LDOOUT = FBL, BUF- = BUFOUT, BUF+ = FLTSET = TGND =
PGND = GND, CREF = 0.22µF, CBUF = 1µF, TA= -40°C to +85°C, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
MAX
UNITS
POSITIVE CHARGE PUMP (MAX1778/MAX1880/MAX1881/MAX1882 only)
SUPP Input Supply Range VSUPP 2.7 13 V
FBP Regulation Voltage VFBP 1.2 1.3 V
FBP Input Bias Current IFBP VFBP = 1.5V -50
+50
nA
DRVP PCH On-Resistance
RPCH
(
ON
)
10 Ω
VFBP = 1.2V 4 Ω
DRVP NCH On-Resistance
RNCH
(
ON
)
VFBP = 1.3V 20 kΩ
FBP Power-Ready Trip Level
Rising edge
1.09 1.16
V
NEGATIVE CHARGE PUMP (MAX1778/MAX1880/MAX1881/MAX1882 only)
SUPN Input Supply Range VSUPN 2.7 13 V
FBN Regulation Voltage VFBN
-50 +50
mV
FBN Input Bias Current IFBN VFBN = 0 -50
+50
nA
DRVN PCH On-Resistance
RPCH
(
ON
)
10 Ω
VFBN = +50mV 4 Ω
DRVN NCH On-Resistance
RNCH
(
ON
)
VFBN = -50mV 20 kΩ
FBN Power-Ready Trip Level
Falling edge 80 165 mV
LOW DROPOUT LINEAR REGULATOR (MAX1778/MAX1881/MAX1883/MAX1884 only)
SUPL Input Supply Range VSUPL 4.5 15 V
SUPL Undervoltage Lockout
Rising edge, 50mV hysteresis (typ) 3.8 4.3 V
SUPL Quiescent Current ISUPL ILDO = 100µA 240 µA
Dropout Voltage (Note 1) VDROP LDO regulating to 9V, ILDO = 40mA 330 mV
FBL Regulation Voltage VFBL VSUPL = 10V, LDO regulating to 9V,
ILDO = 15mA
1.222 1.265
V
LDO Load Regulation VSUPL = 10V, LDO regulating to 9V,
ILDO = 100µA to 40mA 1.2 %
LDO Line Regulation VSUPL = 4.5V to 15V, FBL = LDOOUT,
ILDO = 15mA
0.02 %/V
FBL Input Bias Current IFBL VFBL = 1.25V
-1.2 +1.2
µA
LDO Current Limit
ILDOLIM
VSUPL = 10V, VLDOOUT = 9V, VFBL = 1.2V 40 260 mA
VCOM BUFFER
SUPB Input Supply Range VSUPB 4.5 13 V
SUPB Quiescent Current ISUPB VSUPB = 13V 850 µA
BUFOUT Leakage Current -10
+10
µA
Input Common-Mode Voltage VCM |VOS| < 10mV 1.2 8.8 V
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
8 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(VIN = +3.0V, SHDN = IN, VSUPP = VSUPN = VSUPB = VSUPL = 10V, LDOOUT = FBL, BUF- = BUFOUT, BUF+ = FLTSET = TGND =
PGND = GND, CREF = 0.22µF, CBUF = 1µF, TA= -40°C to +85°C, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN MAX
UNITS
Input Bias Current IBIAS VCM = 5V
-500 +500
nA
Input Offset Current IOS VCM = 5V
-500 +500
nA
IBUFOUT = 0
4.988 5.012
IBUFOUT = ±5mA
4.97 5.03
Output Voltage
VBUFOUT
BUF+ = GND
IBUFOUT = ±45mA
4.93 5.07
V
IBUFOUT = ±5mA -30 30
Input Offset Voltage VOS
VSUPB = 4.5V to 13V
VCM = 1.2V to
(VSUPB - 1.2V) IBUFOUT = ±45mA -70 70
mV
Output Voltage Swing High VOH IBUFOUT = -45mA, ΔVOS = 1V 9 V
Output Voltage Swing Low VOL IBUFOUT = +45mA, ΔVOS = 1V 1 V
BUF+ Dual Mode
Threshold Voltage Falling edge, 20mV hysteresis (typ) 80 170 mV
REFERENCE
Reference Voltage VREF -2µA < IREF < 50µA
1.223 1.269
V
Reference Undervoltage
Threshold 0.9 1.2 V
LOGIC SIGNALS
SHDN Input Low Voltage 0.9 V
SHDN Input High Voltage 2.1 V
SHDN Input Current I SHDN A
FLTSET Input Voltage Range
0.74 x VREF 0.85 x VREF
V
FLTSET Threshold Voltage Rising edge, 25mV hysteresis (typ) 80 170 mV
FLTSET Input Current VFLTSET = 1V 50 nA
RDY Output Low Voltage ISINK = 2mA 0.5 V
RDY Output High Leakage V RDY = 13V 1 µA
Note 1: Dropout Voltage is defined as the VSUPL - VLDOOUT, when VSUPL is 100mV below the set value of VLDOOUT.
Note 2: Specifications to -40°C are guaranteed by design, not production tested.
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
_______________________________________________________________________________________ 9
7.88
7.92
7.96
8.00
8.04
8.08
8.12
0 200 400 600 800
MAIN 8V OUTPUT VOLTAGE
vs. LOAD CURRENT
MAX1778 toc01
IOUT (mA)
VOUT (V)
VIN = 5V
RCOMP = 24kΩ
CCOMP = 470pF
VIN = 3.3V
CINTG = 470pF
40
50
60
70
80
90
100
0 200 400 600 800
MAIN 8V OUTPUT EFFICIENCY
vs. LOAD CURRENT
MAX1778 toc02
IOUT (mA)
EFFICIENCY (%)
VIN = 3.3V
VOUT = 8V
RCOMP = 24kΩ
CCOMP = 470pF
CINTG = 470pF
VIN = 5V
11.76
11.92
11.84
12.08
12.00
12.16
12.24
0 200 300100 400 500 600
MAIN 12V OUTPUT VOLTAGE
vs. LOAD CURRENT
MAX1778 toc03
IOUT (mA)
VOUT (V)
FIGURE 8
CINTG = 470pF
VIN = 3.3V
VIN = 5V
40
60
50
80
70
90
100
0 200 300100 400 500 600
MAIN 12V OUTPUT EFFICIENCY
vs. LOAD CURRENT
MAX1778 toc04
IOUT (mA)
EFFICIENCY (%)
FIGURE 8
VOUT = 12V
CINTG = 470pF
VIN = 3.3V
VIN = 5V
0.80
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
2.5 3.53.0 4.0 4.5 5.0 5.5
STEP UP CONVERTERS
SWITCHING FREQUENCY vs. INPUT VOLTAGE
MAX1778 toc05
VIN (V)
SWITCHING FREQUENCY (MHz)
MAX1778
19.2
19.4
19.8
19.6
20.0
20.2
POSITIVE CHARGE-PUMP OUTPUT VOLTAGE
vs. LOAD CURRENT
MAX1778 toc06
IPOS (mA)
VPOS (V)
01051520
VSUPP = 10V
VSUPP = 8V
VSUPP = 7.5V
VSUPP = 7V
30
80
70
90
100
POSITIVE CHARGE-PUMP EFFICIENCY
vs. LOAD CURRENT
MAX1778 toc07
INEG (mA)
EFFICIENCY (%)
01051520
VPOS = 20V
VSUPP = 7.5V
VSUPP = 7V
VSUPP = 8V
VSUPP = 10V
60
50
40
5
15
10
25
20
35
30
40
2684101214
MAXIMUM POSITIVE CHARGE-PUMP
OUTPUT VOLTAGE vs. SUPPLY VOLTAGE
MAX1778 toc08
VSUPP (V)
VPOS (V)
IPOS = 10mA
IPOS = 1mA
-5.04
-5.00
-5.02
-4.96
-4.98
-4.92
-4.94
-4.90
NEGATIVE CHARGE-PUMP OUTPUT VOLTAGE
vs. LOAD CURRENT
MAX1778 toc09
INEG (mA)
VNEG (V)
0 10203040
VSUPN = 7V
VSUPN = 8V
VSUPN = 6V
Typical Operating Characteristics
(Circuit of Figure 1, VIN = +3.3V, SHDN = IN, VMAIN = VSUPP = VSUPN = VSUPB = VSUPL = 8V, BUF- = BUFOUT,
BUF+ = FLTSET = TGND = PGND = GND, TA= +25°C.)
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
10 ______________________________________________________________________________________
Typical Operating Characteristics (continued)
(Circuit of Figure 1, VIN = +3.3V, SHDN = IN, VMAIN = VSUPP = VSUPN = VSUPB = VSUPL = 8V, BUF- = BUFOUT,
BUF+ = FLTSET = TGND = PGND = GND, TA= +25°C.)
30
50
40
70
60
90
80
100
NEGATIVE CHARGE-PUMP EFFICIENCY
vs. LOAD CURRENT
MAX1778 toc10
INEG (mA)
EFFICIENCY (%)
0 10203040
VSUPN = 7V
VSUPN = 8V
VSUPN = 6V
VNEG = -5V
-14
-10
-12
-6
-8
-4
-2
2684 101214
MAXIMUM NEGATIVE CHARGE-PUMP
OUTPUT VOLTAGE vs. SUPPLY VOLTAGE
MAX1778 toc11
VSUPN (V)
VNEG (V)
INEG = 10mA
INEG = 1mA
1.23
1.24
1.25
1.26
1.27
0 20406080100
REFERENCE VOLTAGE
vs. REFERENCE LOAD CURRENT
MAX1778 toc12
IREF (μA)
VREF (V)
STEP-UP CONVERTER LOAD-TRANSIENT
RESPONSE
MAX1778 toc13
200mA
0
8.1V
8.0V
7.9V
1A
0
40μs/div
A. IMAIN = 20mA to 200mA, 200mA/div
B. VMAIN = 8V, 100mV/div
C. INDUCTOR CURRENT, 1A/div
CINTG = 1000pF
C
B
A
STEP-UP CONVERTER LOAD-TRANSIENT
RESPONSE WITHOUT INTEGRATOR
MAX1778 toc14
200mA
0
8.1V
8.0V
7.9V
1A
0
40μs/div
A. IMAIN = 20mA to 200mA, 200mA/div
B. VMAIN = 8V, 100mV/div
C. INDUCTOR CURRENT, 1A/div
INTG = REF
C
B
A
STEP-UP CONVERTER LOAD-TRANSIENT
RESPONSE (1μs PULSES)
MAX1778 toc15
0.5A
0
8.0V
7.9V
1A
0.5A
0
4μs/div
A. IMAIN = 0 to 500mA, 500mA/div
B. VMAIN = 8V, 100mV/div
C. INDUCTOR CURRENT, 500mA/div
C
B
A
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
______________________________________________________________________________________ 11
RIPPLE VOLTAGE WAVEFORMS
MAX1778 toc16
8V
-5V
20V
1μs/div
A. VMAIN = 8V, IMAIN = 200mA, 10mV/div
B. VNEG = -5V, INEG = 10mA, 20mV/div
C. VPOS = 20V, IPOS = 5mA, 20mV/div
C
B
A
STEP-UP CONVERTER
SOFT-START (LIGHT LOAD)
MAX1778 toc17
0
6V
0.5A
1ms/div
A. VSHDN = O TO 2V, 2V/div
B. VMAIN = 8V, 2V/div
C. INDUCTOR CURRENT, 500mA/div
RLOAD = 400Ω
C
B
A
2V
8V
4V
0
STEP-UP CONVERTER
SOFT-START (HEAVY LOAD)
MAX1778 toc18
0
6V
1.0A
1ms/div
A. VSHDN = O TO 2V, 2V/div
B. VMAIN = 8V, 2V/div
C. INDUCTOR CURRENT, 500mA/div
RLOAD = 20Ω
C
B
A
2V
8V
4V
0.5A
0
POWER-UP SEQUENCE
MAX1778 toc19
0
0
10V
2ms/div
A. VSHDN = O TO 2V, 2V/div
B. RDY, 5V/div
C. POSITIVE CHARGE PUMP = VPOS = 20V, RLOAD = 4kΩ, 10V/div
D. STEP-UP CONVERTER: VMAIN = 8V, RLOAD = 40Ω, 10V/div
E. NEGATIVE CHARGE PUMP: VNEG = -5V, RLOAD = 500Ω, 10V/div
E
B
A
2V
5V
20V
0
-10V
C
D
POWER-UP SEQUENCE
(CIRCUIT OF FIGURE 10)
MAX1778 toc20
0
10V
0
1ms/div
A. RDY, 2V/div
B. POSITIVE CHARGE PUMP, VPOS(SYS) = 20V, 10V/div
C. STEP-UP CONVERTER: VMAIN(SYS) = 8V, 10V/div
D. NEGATIVE CHARGE PUMP, VNEG = -5V, -5V/div
B
A
2V
20V
0
-5V
C
D
4V
MAX1778 toc21
C
B
A
10V
5V
4V
5V
2V
0
0
0
100μs/div
POWER-UP INTO SHORT-CIRCUIT
(CIRCUIT OF FIGURE 10)
A. RDY, 2V/div
B. GATE OF N-CH MOSFET, 5V/div
C. STEP-UP CONVERTER, VMAIN(START) = 8V, 5V/div
VMAIN(SYS) = GND
Typical Operating Characteristics (continued)
(Circuit of Figure 1, VIN = +3.3V, SHDN = IN, VMAIN = VSUPP = VSUPN = VSUPB = VSUPL = 8V, BUF- = BUFOUT,
BUF+ = FLTSET = TGND = PGND = GND, TA= +25°C.)
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
12 ______________________________________________________________________________________
4.75
4.80
4.85
4.90
4.95
5.00
5.05
MAX1778 toc22
VSUPL (V)
VLDOOUT (V)
LDO OUTPUT VOLTAGE
vs. LDO INPUT VOLTAGE
(INTERNAL LINEAR REGULATOR)
4861012
ILDOOUT = 0
ILDOOUT = 40mA
5.04
5.02
4.90
0.01 0.1 10 100
4.92
4.96
4.94
5.00
4.98
MAX1778 toc23
ILDOOUT (mA)
VLDOOUT (V)
1
LDO OUTPUT VOLTAGE
vs. LDO OUTPUT CURRENT
(INTERNAL LINEAR REGULATOR)
4.90
4.96
4.94
4.92
4.98
5.00
5.02
5.04
5.06
5.08
5.10
-40 10-15 35 60 85
LDO OUTPUT VOLTAGE vs. TEMPERATURE
(INTERNAL LINEAR REGULATOR)
MAX1778 toc24
TEMPERATURE (°C)
VLDO (V)
ILDOOUT = 0
ILDOOUT = 40mA
0
40
120
80
160
200
MAX1778 toc25
ILDOOUT (mA)
VSUPL - VLDOOUT (mV)
02010 30 40
DROPOUT VOLTAGE
vs. LDO LOAD CURRENT
(INTERNAL LINEAR REGULATOR)
VLDOOUT = 5V
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0 10203040
MAX1778 toc26
ILDOOUT (mA)
ISUPL - ILDOOUT (mA)
LDO SUPPLY CURRENT
vs. LDO OUTPUT CURRENT
(INTERNAL LINEAR REGULATOR)
VLDOOUT = 5V
Typical Operating Characteristics (continued)
(Circuit of Figure 1, VIN = +3.3V, SHDN = IN, VMAIN = VSUPP = VSUPN = VSUPB = VSUPL = 8V, BUF- = BUFOUT,
BUF+ = FLTSET = TGND = PGND = GND, TA= +25°C.)
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
______________________________________________________________________________________ 13
0
1 100010010
100
40
20
80
60
MAX1778 toc27
FREQUENCY (kHz)
PSRR (dB)
POWER-SUPPLY REJECTION RATIO
vs. FREQUENCY
CLDOOUT = 4.7μF
ILDOOUT = 40mA
040
REGION OF STABLE CLDOOUT ESR
vs. LOAD CURRENT
MAX1778 toc28
ILDOOUT (mA)
CLDOOUT ESR (Ω)
10 20 30
100
0.01
0.1
10
1
CLDOOUT = 1μF
STABLE REGION
MAX1778 toc29
B
A
4.96V
4OmA
0
5.00V
100μs/div
LOAD-TRANSIENT RESPONSE
(INTERNAL LINEAR REGULATOR)
A. ILDO = 100μA TO 40mA, 40mA/div
B. VLDO = 5V, 20mV/div
VSUPL = VLDO + 500mV
MAX1778 toc30
B
A
4.94V
4OmA
0
5.00V
100μs/div
LOAD-TRANSIENT RESPONSE NEAR
DROPOUT (INTERNAL LINEAR REGULATOR)
A. ILDO = 100μA TO 40mA, 40mA/div
B. VLDO = 5V, 20mV/div
VIN = VLDO + 100mV
MAX1778 toc31
C
B
A
0.5A
0
5.0V
8.0V
1.0A
10μs/div
INTERNAL LINEAR-REGULATOR
RIPPLE REJECTION
A. VLDOOUT = 5V, ILDOOUT = 40mA, 10mV/div
B. VMAIN = VSUPL = 8V, 200mV/div
C. IMAIN = 0 TO 750mA, 500mA/div
MAX1778 toc32
C
B
A
4V
2V
2V
0
2V
4V
0
400μs/div
INTERNAL LINEAR-REGULATOR
STARTUP
A. V
S
HDN = 0 TO 2V, 2V/div
B. VLDOOUT = 5V, RLDOOUT = 125Ω, 2V/div
C. VMAIN = 8V, RMAIN = 40Ω, 2V/div
Typical Operating Characteristics (continued)
(Circuit of Figure 1, VIN = +3.3V, SHDN = IN, VMAIN = VSUPP = VSUPN = VSUPB = VSUPL = 8V, BUF- = BUFOUT,
BUF+ = FLTSET = TGND = PGND = GND, TA= +25°C.)
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
14 ______________________________________________________________________________________
2.45
2.47
2.49
2.51
2.53
2.55
2.5 3.53.0 4.0 4.5 5.0 5.5
MAX1778 toc33
VIN (V)
VLDO (V)
LINEAR-REGULATOR OUTPUT VOLTAGE
vs. INPUT VOLTAGE
(EXTERNAL LINEAR REGULATOR)
ILDO = 0
ILDO = 750mA
FIGURE 7
2.55
2.45
0.1 1 10 100 1000
2.47
MAX1778 toc34
ILDO (mA)
VLDO (V)
2.49
2.51
2.53
LINEAR-REGULATOR OUTPUT VOLTAGE
vs. LOAD CURRENT
(EXTERNAL LINEAR REGULATOR)
FIGURE 7
MAX1778 toc35
B
A
2.45V
250mA
2.55V
50mA
2.50V
100μs/div
EXTERNAL LINEAR-REGULATOR
LOAD-TRANSIENT RESPONSE
A. ILDO = 50mA TO 250mA, 200mA/div
B. VLDO = 2.5V, 50mV/div
FIGURE 7
MAX1778 toc36
C
B
A
0.5A
0
2.5V
7.8V
8.0V
1A
10μs/div
EXTERNAL LINEAR-REGULATOR
RIPPLE REJECTION
A. VLDO = 2.5V, ILDO = 200mA, 10mV/div
B. VMAIN = VSUPL = 8V, 200mV/div
C. IMAIN = 0 TO 750mA, 500mA/div
FIGURE 7
-2.5
-1.5
-0.5
1.5
0.5
2.5
02468101214
MAX1778 toc37
VCM (V)
ΔVOS (mV)
INPUT OFFSET VOLTAGE DEVIATION
vs. COMMON-MODE VOLTAGE
VSUPB = 4.5V VSUPB = 13V
-1.0
-0.6
-0.2
0.2
0.6
1.0
486101214
MAX1778 toc38
VSUPB (V)
ΔVOS (mV)
INPUT OFFSET VOLTAGE DEVIATION
vs. BUFFER SUPPLY VOLTAGE
VCM = VSUPB / 2
Typical Operating Characteristics (continued)
(Circuit of Figure 1, VIN = +3.3V, SHDN = IN, VMAIN = VSUPP = VSUPN = VSUPB = VSUPL = 8V, BUF- = BUFOUT,
BUF+ = FLTSET = TGND = PGND = GND, TA= +25°C.)
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
______________________________________________________________________________________ 15
0
-0.6
-0.2
0.2
0.6
1.0
-40 10-15 356085
MAX1778 toc39
TEMPERATURE (°C)
ΔVOS (mV)
INPUT OFFSET VOLTAGE DEVIATION
vs. TEMPERATURE
VSUPB = 13V
VCM = VSUPB / 2
0
-0.6
-0.2
0.2
0.6
1.0
-40 10-15 356085
MAX1778 toc39
TEMPERATURE (°C)
ΔVOS (mV)
INPUT OFFSET VOLTAGE DEVIATION
vs. TEMPERATURE
VSUPB = 13V
VCM = VSUPB / 2
0
2
6
4
8
10
042 6 8 101214
MAX1778 toc41
VCM (V)
IBIAS (nA)
BUFFER INPUT BIAS CURRENT
vs. COMMON-MODE VOLTAGE
VSUPB = 4.5V
VSUPB = 13V
4
6
8
10
486 101214
MAX1778 toc42
VSUPB (V)
IBIAS (nA)
BUFFER INPUT BIAS CURRENT
vs. BUFFER SUPPLY VOLTAGE
VCM = VSUPB / 2
4
5
6
7
8
9
10
11
12
-40 -15 10 35 60 85
MAX1778 toc43
TEMPERATURE (°C)
IBIAS (nA)
BUFFER INPUT BIAS CURRENT
vs. TEMPERATURE
VCM = VSUPB / 2
0.30
0.34
0.42
0.38
0.46
0.50
042 6 8 101214
MAX1778 toc44
VCM (V)
ISUPB (mA)
BUFFER SUPPLY CURRENT
vs. COMMON-MODE VOLTAGE
VSUPB = 4.5V
VSUPB = 13V
0.30
0.34
0.38
0.42
0.46
0.50
486 101214
MAX1778 toc45
VSUPB (V)
ISUPB (mA)
BUFFER SUPPLY CURRENT
vs. BUFFER SUPPLY VOLTAGE
VCM = VSUPB / 2
0
0.3
0.2
0.1
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-40 10-15 35 60 85
ISUPB (mA)
MAX1778 toc46
TEMPERATURE (°C)
NO-LOAD BUFFER SUPPLY CURRENT
vs. TEMPERATURE
VSUPB = 13V
VCM = VSUPB / 2
MAX1778 toc47
B
A
4.00V
3.95V
4.05V
4.00V
3.95V
4.05V
4μs/div
VCOM BUFFER
SMALL-SIGNAL RESPONSE
A. VBUF+ = 3.95V TO 4.05V, 50mV/div
B. BUFOUT = BUF-, 50mV/div
CBUF = 1μF, VSUPB = 8V
Typical Operating Characteristics (continued)
(Circuit of Figure 1, VIN = +3.3V, SHDN = IN, VMAIN = VSUPP = VSUPN = VSUPB = VSUPL = 8V, BUF- = BUFOUT,
BUF+ = FLTSET = TGND = PGND = GND, TA= +25°C.)
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
16 ______________________________________________________________________________________
MAX1778 toc48
B
A
4.00V
3.50V
4.50V
4.00V
3.50V
4.50V
10μs/div
VCOM BUFFER
LARGE-SIGNAL RESPONSE
A. VBUF+ = 3.50V TO 4.50V, 0.5V/div
B. BUFOUT = BUF-, 0.5V/div
CBUF = 1μF, VSUPB = 8V
MAX1778 toc49
C
B
A
3.8V
8.0V
200mA
4.2V
0
-200mA
4.0V
4μs/div
VCOM BUFFER
LOAD-TRANSIENT RESPONSE
A. IBUFOUT = 200mA PULSES, 200mA/div
B. BUFOUT = BUF-, 200mV/div
C. VMAIN = 8V, 50mV/div
VSUPB = VMAIN, BUF+ = GND, CBUF = 1μF
MAX1778 toc50
C
B
A
3.5V
8.0V
500mA
4.5V
0
-500mA
4.0V
4μs/div
VCOM BUFFER
LOAD-TRANSIENT RESPONSE
A. IBUFOUT = 400mA PULSES, 500mA/div
B. BUFOUT = BUF-, 0.5V/div
C. VMAIN = 8V, 100mV/div
VSUPB = VMAIN, BUF+ = GND, CBUF = 1μF
Typical Operating Characteristics (continued)
(Circuit of Figure 1, VIN = +3.3V, SHDN = IN, VMAIN = VSUPP = VSUPN = VSUPB = VSUPL = 8V, BUF- = BUFOUT,
BUF+ = FLTSET = TGND = PGND = GND, TA= +25°C.)
MAX1778 toc51
C
B
A
8.1V
7.8V
2V
4V
2V
0
4V
0
100μs/div
VCOM BUFFER STARTUP
A. RDY, 2V/div
B. BUFOUT = BUF-, CBUF = 1μF, 2V/div
C. VSUPB = VMAIN = 8V, IMAIN = 20mA, 200mV/div
BUF+ = GND
MAX1778 toc51
C
B
A
8.1V
7.8V
2V
4V
2V
0
4V
0
100μs/div
VCOM BUFFER STARTUP
A. RDY, 2V/div
B. BUFOUT = BUF-, CBUF = 1μF, 2V/div
C. VSUPB = VMAIN = 8V, IMAIN = 20mA, 200mV/div
BUF+ = GND
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
______________________________________________________________________________________ 17
Pin Description
PIN
MAX1778
MAX1881
MAX1880
MAX1882
MAX1883
MAX1884 MAX1885
NAME FUNCTION
1111FB
Main Step-Up Regulator Feedback Input. Regulates to 1.25V
nominal. Connect a resistive divider from the output (VMAIN) to FB
to analog ground (GND).
2222INTG
Main Step-Up Integrator Output. When using the integrator,
connect 1000pF to analog ground (GND). To disable the
integrator, connect INTG to REF.
3333IN
Main Supply Voltage. The supply voltage powers the control
circuitry for all of the regulators and may range from 2.7V to 5.5V.
Bypass with a 0.1µF capacitor between IN and GND, as close to
the pins as possible.
4444BUF+
VCOM Buffer (Operational Transconductance Amplifier) Positive
Feedback Input. Connect to GND to select the internal resistive
divider that sets the positive input to half the amplifier’s supply
voltage (VBUF+ = V SUPB /2).
5555BUF- VCOM Buffer (Operational Transconductance Amplifier) Negative
Feedback Input
6666SUPB VCOM Buffer (Operational Transconductance Amplifier) Supply
Voltage
7777
BUFOUT
VCOM Buffer (Operational Transconductance Amplifier) Output
8888GND
Analog Ground. Connect to power ground (PGND) underneath the
IC.
9999REF
Internal Reference Bypass Terminal. Connect a 0.22µF ceramic
capacitor from REF to analog ground (GND). External load
capability up to 50µA.
10 10 −−FBP
Positive Charge-Pump Regulator Feedback Input. Regulates to
1.25V nominal. Connect a resistive divider from the positive
charge-pump output (VPOS) to FBP to analog ground (GND).
11 11 −−FBN
Negative Charge-Pump Regulator Feedback Input. Regulates to
0V nominal. Connect a resistive divider from the negative charge-
pump output (VNEG) to FBN to the reference (REF).
12 12 10 10 SHDN
Active-Low Shutdown Control Input. Pull SHDN low to force the
controller into shutdown. If unused, connect SHDN to IN for normal
operation. A rising edge on SHDN clears the fault latch.
13 11 SUPL
Low-Dropout Linear Regulator Input Voltage. Can range from 4.5V
to 15V. Bypass with a 1µF capacitor to GND (see Capacitor
Selection and Regulator Stability). Connect both input pins
together externally.
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
18 ______________________________________________________________________________________
Pin Description (continued)
PIN
MAX1778
MAX1881
MAX1880
MAX1882
MAX1883
MAX1884 MAX1885
NAME FUNCTION
14 12
LDOOUT
Linear Regulator Output. Sources up to 40mA. Bypass to GND with
a ceramic capacitor determined by:
15 13 FBL Voltage Setting Input. Connect a resistive divider from the linear
regulator output (VLDOOUT) to FBL to analog ground (GND).
16 16 14 14 FLTSET
Fault Trip-Level Set Input. Connect to a resistive divider between
REF and GND to set the main step-up converter’s and positive
charge pump’s fault thresholds between 0.67 x VREF and 0.85 x
VREF. Connect to GND for the preset fault threshold (0.9 x VREF).
17 17 −−SUPN Negative Charge-Pump Driver Supply Voltage. Bypass to power
ground (PGND) with a 0.1µF capacitor.
18 18 −−DRVN Negative Charge-Pump Driver Output. Output high level is VSUPN
and low level is PGND.
19 19 −−SUPP Positive Charge-Pump Driver Supply Voltage. Bypass to power
ground (PGND) with a 0.1µF capacitor.
20 20 −−DRVP Positive Charge-Pump Driver Output. Output high level is VSUPP
and low level is PGND
21 21 17 17 PGND Power Ground. Connect to analog ground (GND) underneath the
IC.
22 22 18 18 LX Main Step-Up Regulator Power MOSFET N-Channel Drain. Place
output diode and output capacitor as close to PGND as possible.
23 23 19 19 TGND Must be connected to ground.
24 24 20 20 RDY Active-Low, Open-Drain Output. Indicates all outputs are ready.
On-resistance is 125Ω (typ).
13, 14, 15
15, 16 11, 12, 13,
15, 16 N.C. No Connection. Not internally connected.
CmsX
I
V
LDOOUT LDOOUT MAX
LDOOUT
. ()
05
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
______________________________________________________________________________________ 19
Detailed Description
The MAX1778/MAX1880–MAX1885 are highly efficient
multiple-output power supplies for thin-film transistor
(TFT) liquid crystal display (LCD) applications. The
devices contain one high-power step-up converter, two
low-power charge pumps, an operational transconduc-
tance amplifier (VCOM buffer), and a low-dropout linear
regulator. The primary step-up converter uses an inter-
nal N-channel MOSFET to provide maximum efficiency
and to minimize the number of external components.
The output voltage of the main step-up converter
(VMAIN) can be set from VIN to 13V with external resis-
tors.
The dual charge pumps (MAX1778/MAX1880/
MAX1881/MAX1882 only) independently regulate a
positive output (VPOS) and a negative output (VNEG).
These low-power outputs use external diode and
capacitor stages (as many stages as required) to regu-
late output voltages from -40V to +40V. A unique
control scheme minimizes output ripple as well as
capacitor sizes for both charge pumps.
A resistor-programmable 40mA linear regulator
(MAX1778/MAX1881/MAX1883/MAX1884 only) can
provide preregulation or postregulation for any of the
supplies. For higher current applications, an external
transistor can be added.
Additionally, the VCOM buffer provides a high current
output that is ideal for driving capacitive loads, such as
the backplane of a TFT LCD panel. The positive feed-
back input features dual mode operation, allowing this
input to be connected to an internal 50% resistive-
divider between the buffer’s supply voltage and
ground, or externally adjusted for other voltages.
Also included in the MAX1778/MAX1880–MAX1885 is a
precision 1.25V reference that sources up to 50µA,
logic shutdown, soft-start, power-up sequencing,
adjustable fault detection, thermal shutdown, and an
active-low, open-drain ready output.
IN
BUFFER OUTPUT
VBUFOUT = VSUPB/2
POSITIVE
VPOS = 20V
CBUF
1.0μF
CLDO
4.7μF
CREF
0.22μF
C7
1.0μF
C5
1.0μF
C4
0.1μF
L1
6.8μH
C4
0.1μF
C2
0.1μF
C1
0.22μF
CIN
4.7μF
SHDN
RDY
SUPL
LDOOUT SUPN
SUPP
DRVP
FBP
R3
750kΩ
R5
200kΩ
R7
150kΩ
R4
49.9kΩ
R6
49.9kΩ
R8
49.9kΩ
R2
49.9kΩ
R2
274kΩ
LX
INPUT
VIN = 3.3V
LDO
VLDOOUT = 5V
NEGATIVE
VNEG = -5V
TO LOGIC
FB
BUFOUT
BUF-
BUF+
GND
TGND
FBL
DRVN
FBN
REF
FLTSET
INTG
PGND
SUPB
MAX1778
MAIN
VMAIN = 8V
MAIN
(8V)
COUT
(2) 4.7μF
C3
1.0μF
RRDY
100kΩ
Figure 1. Typical Application Circuit
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
20 ______________________________________________________________________________________
Main Step-up Controller
During normal pulse-width modulation (PWM) opera-
tion, the MAX1778/MAX1880–MAX1885 main step-up
controllers switch at a constant frequency of 500kHz or
1MHz (see Selector Guide), allowing the use of low-
profile inductors and output capacitors. Depending on
the input-to-output voltage ratio, the controller regulates
the output voltage and controls the power transfer by
modulating the duty cycle (D) of each switching cycle:
On the rising edge of the internal clock, the controller
sets a flip-flop when the output voltage is too low, which
turns on the N-channel MOSFET (Figure 2). The induc-
tor current ramps up linearly, storing energy in a mag-
netic field. Once the sum of the feedback voltage error
amplifier, slope-compensation, and current-feedback
signals trip the multi-input comparator, the MOSFET
turns off, the flip-flop resets, and the diode (D1) turns
on. This forces the current through the inductor to ramp
back down, transferring the energy stored in the mag-
netic field to the output capacitor and load. The MOS-
FET remains off for the rest of the clock cycle. Changes
in the feedback voltage-error signal shift the switch-cur-
rent trip level, consequently modulating the MOSFET
duty cycle.
Under very light loads, an inherent switchover to pulse-
skipping takes place (Figure 3). When this occurs, the
controller skips most of the oscillator pulses in order to
reduce the switching frequency and gate charge loss-
es. When pulse-skipping, the step-up controller initiates
a new switching cycle only when the output voltage
drops too low. The N-channel MOSFET turns on, allow-
ing the inductor current to ramp up until the multi-input
comparator trips. Then, the MOSFET turns off and the
diode turns on, forcing the inductor current to ramp
down. When the inductor current reaches zero, the
diode turns off, so the inductor stops conducting cur-
rent. This forces the threshold between pulse-skipping
and PWM operation to coincide with the boundary
between continuous and discontinuous inductor-cur-
rent operation:
IV
V
VV
fL
LOAD CROSSOVER IN
MAIN
MAIN IN
OSC
()
1
2
2-
DVV
V
MAIN IN
MAIN
-
MAX1778
MAX1880
MAX1881
MAX1882
MAX1883
MAX1884
MAX1885
VMAIN = 1 + VREF
VREF = 1.25V
R1
R2
( )
S
R
ILIM
Q
CREF
VREF
1.25V
gm
L1
D1
R1
R2
INTG
CINTG
RCOMP
(OPTIONAL)
CCOMP
(OPTIONAL)
CIN
COUT
VMAIN
(UP TO 13V)
VIN
(2.7V TO 5.5V)
OSC
(80% DUTY)
REF
GND
LX
FB
PGND
PWM
COMPARATOR
ERROR
AMPLIFIER
ILIM
COMPARATOR
Figure 2. Main Step-Up Converter Block Diagram
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
______________________________________________________________________________________ 21
The switching waveforms will appear noisy and asyn-
chronous when light loading causes pulse-skipping
operation; this is a normal operating condition that
improves light-load efficiency.
Dual Charge-Pump Regulator (MAX1778/
MAX1880/MAX1881/MAX1882 Only)
The MAX1778/MAX1880/MAX1881/MAX1882 con-
trollers contain two independent low-power charge
pumps (Figure 4). One charge pump inverts the input
voltage and provides a regulated negative output volt-
age. The second charge pump doubles the input volt-
age and provides a regulated positive output voltage.
The controllers contain internal P-channel and N-chan-
nel MOSFETs to control the power transfer. The
internal MOSFETs switch at a constant frequency
(fCHP = fOSC/2).
Positive Charge Pump
During the first half-cycle, the N-channel MOSFET turns
on and charges flying capacitor CX(POS) (Figure 4).
This initial charge is controlled by the variable N-chan-
nel on-resistance. During the second half-cycle, the N-
channel MOSFET turns off and the P-channel MOSFET
turns on, level shifting CX(POS) by VSUPP volts. This
connects CX(POS) in parallel with the reservoir capaci-
tor COUT(POS). If the voltage across COUT(POS) plus a
diode drop (VPOS + VDIODE) is smaller than the level-
shifted flying capacitor voltage (VCX(POS) + VSUPP),
charge flows from CX(POS) to COUT(POS) until the diode
(D3) turns off.
INDUCTOR CURRENT
ILOAD
tON tOFF
TIME
IPEAK
Figure 3. Discontinuous-to-Continuous Conduction Crossover
Point
MAX1778
MAX1880
MAX1881
MAX1882
VNEG = - VREF
VREF = 1.25V
( )
R5
R6
R5
R6
COUT(NEG)
CX(NEG)
VSUPN
2.7V TO 13V
OSC
REF
PGNDGND
SUPN
DRVN
FBN
SUPP
DRVP
FBP
D4
D5
VPOS = 1 + VREF
VREF = 1.25V
R3
R4
( )
VSUPP
2.7V TO 13V
VSUPD
D2
D3
CREF
0.22μF
VREF
1.25V
R4
CX(POS)
COUT(POS)
VPOS VNEG
R3
Figure 4. Low-Power Charge Pump Block Diagram
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
22 ______________________________________________________________________________________
Negative Charge Pump
During the first half-cycle, the P-channel MOSFET turns
on, and flying capacitor CX(NEG) charges to VSUPN
minus a diode drop (Figure 4). During the second half-
cycle, the P-channel MOSFET turns off, and the N-
channel MOSFET turns on, level shifting CX(NEG). This
connects CX(NEG) in parallel with reservoir capacitor
COUT(NEG). If the voltage across COUT(NEG) minus a
diode drop is greater than the voltage across CX(NEG),
charge flows from COUT(NEG) to CX(NEG) until the diode
(D5) turns off. The amount of charge transferred to the
output is controlled by the variable N-channel on-resis-
tance.
Low-Dropout Linear Regulator (MAX1778/
MAX1881/MAX1883/MAX1884 Only)
The MAX1778/MAX1881/MAX1883/MAX1884 contain a
low-dropout linear regulator (Figure 5) that uses an
internal PNP pass transistor (QP) to supply loads up to
40mA. As illustrated in Figure 5, the 1.25V reference is
connected to the error amplifier, which compares this
reference with the feedback voltage and amplifies the
difference. If the feedback voltage is higher than the
reference voltage, the controller lowers the base cur-
rent of QP, which reduces the amount of current to the
output. If the feedback voltage is too low, the device
increases the pass transistor base current, which
allows more current to pass to the output and increases
the output voltage. However, the linear regulator also
includes an output current limit to protect the internal
pass transistor against short circuits.
The low-dropout linear regulator monitors and controls
the pass transistor’s base current, limiting the output
current to 130mA (typ). In conjunction with the thermal
overload protection, this current limit protects the out-
put, allowing it to be shorted to ground for an indefinite
period of time without damaging the part.
VCOM Buffer
The MAX1778/MAX1880–MAX1885 include a VCOM
buffer, which uses an operational transconductance
amplifier (OTA) to provide a current output that is ideal
for driving capacitive loads, such as the backplane of a
TFT LCD panel. The unity-gain bandwidth of this cur-
rent-output buffer is:
GBW = gm/COUT
where gm is the amplifier’s transconductance. The
bandwidth is inversely proportional to the output
capacitor, so large capacitive loads improve stability;
however, lower bandwidth decreases the buffer’s tran-
sient response time. To improve the transient response
SUPL
CSUPL
VSUPL
4.5V TO 15V
CLDOOUT
LDOOUT
VLDOOUT
1.25V TO (VSUPL - 0.3V)
FBL
VREF
1.25V
ERROR
AMPLIFIER
GND
R8
R7
QP
CURRENT
LIMIT
THERMAL
SENSOR
VLDOOUT = (1 + )VREF
VREF = 1.25V
R7
R8
MAX1778
MAX1881
MAX1883
MAX1884
Figure 5. Low-Dropout Linear Regulator Block Diagram
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
______________________________________________________________________________________ 23
times, the amplifier’s transconductance increases as
the output current increases (see Typical Operating
Characteristics).
The VCOM buffer’s positive feedback input features
dual mode operation. The buffer’s output voltage can
be internally set by a 50% resistive divider connected
to the buffer’s supply voltage (SUPB), or the output volt-
age can be externally adjusted for other voltages.
Shutdown (SHDN)
A logic-low level on SHDN shuts down all of the con-
verters and the reference. When shut down, the supply
current drops to 0.1µA to maximize battery life, and the
reference is pulled to ground. The output capacitance,
feedback resistors, and load current determine the rate
at which each output voltage will decay. A logic-level
high on SHDN power activates the MAX1778/
MAX1880–MAX1885 (see Power-Up Sequencing). Do
not leave SHDN floating. If unused, connect SHDN to
IN. A logic-level transition on SHDN clears the fault
latch.
Power-Up Sequencing
Upon power-up or exiting shutdown, the MAX1778/
MAX1880–MAX1885 start a power-up sequence. First,
the reference powers up. Then, the main DC-DC step-
up converter powers up with soft-start enabled. The lin-
ear regulator powers up at the same time as the main
step-up converter; however, the power sequence and
ready output signal are not affected by the regulation of
the linear regulator. While the main step-up converter
powers up, the output of the PWM comparator remains
low (Figure 2), and the step-up converter charges the
output capacitors, limited only by the maximum duty
cycle and current-limit comparator. When the step-up
converter approaches its nominal regulation value and
the PWM comparator’s output changes states for the
first time, the negative charge pump turns on. When the
negative output voltage reaches approximately 90% of
its nominal value (VFBN < 110mV), the positive charge
pump starts up. Finally, when the positive output volt-
age reaches 90% of its nominal value (VFBP > 1.125V),
the active-low ready signal (RDY) goes low (see Power
Ready), and the VCOM buffer powers up. The
MAX1883/MAX1884/MAX1885 do not contain the
charge pumps, but the power-up sequence still con-
tains the charge pumps’ startup logic, which appears
as a delay (2 4096/fOSC) between the step-up con-
verter reaching regulation and when the ready signal
and VCOM buffer are activated.
Soft-Start
For the main step-up regulator, soft-start allows a grad-
ual increase of the current-limit level during startup to
reduce input surge currents. The MAX1778/MAX1880–
MAX1885 divide the soft-start period into four phases.
During the first phase, the controller limits the current
limit to only 0.38A (see Electrical Characteristics),
approximately a quarter of the maximum current limit
SUPB VSUPB
4.5V TO 13V
CBUF
BUFOUT
BUF-
VBUFOUT
1.2V TO (VSUPB - 1.2V)
BUF+
125mV GND
R12
R
R
R11
VBUFOUT = ( )VSUPB
R12
R11 + R12
MAX1778
MAX1880
MAX1881
MAX1882
MAX1883
MAX1884
MAX1885
gm
Figure 6. VCOM Buffer Block Diagram
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
24 ______________________________________________________________________________________
(ILX(MAX)). If the output does not reach regulation within
1ms, soft-start enters phase II, and the current limit is
increased by another 25%. This process is repeated for
phase III. The maximum 1.5A (typ) current limit is
reached within 3072 clock cycles or when the output
reaches regulation, whichever occurs first (see the
startup waveforms in the Typical Operating
Characteristics).
For the charge pumps (MAX1778/MAX1880/
MAX1881/MAX1882 only), soft-start is achieved by con-
trolling the rate of rise of the output voltage. Both
charge-pump output voltages are controlled to be in
regulation within 4096 clock cycles, irregardless of out-
put capacitance and load, limited only by the charge
pump’s output impedance. Although the MAX1883/
MAX1884/MAX1885 controllers do not include the
charge pumps, the soft-start logic still contains the
4096 clock cycle startup periods for both charge
pumps.
Fault Trip Level (FLTSET)
The MAX1778/MAX1880–MAX1885 feature dual mode
operation to allow operation with either a preset fault
trip level or an adjustable trip level for the step-up con-
verter and positive charge-pump outputs. Connect FLT-
SET to GND to select the preset 0.9 VREF fault
threshold. The fault trip level may also be adjusted by
connecting a voltage divider from REF to FLTSET
(Figure 8). For greatest accuracy, the total load on the
reference (including current through the negative
charge-pump feedback resistors) should not exceed
50µA so that VREF is guaranteed to be in regulation
(see Electrical Characteristics Table). Therefore, select
R10 in the 100kΩto 1MΩrange, and calculate R9 with
the following equation:
R9 = R10 [(VREF / VFLTSET) - 1]
where VREF = 1.25V, and VFLTSET may range from 0.67
x VREF to 0.85 x VREF. FLTSET’s input bias current has
a maximum value of 50nA. For 1% error, the current
through R10 should be at least 100 times the FLTSET
input bias current (IFLTSET).
Fault Condition
Once RDY is low, if the output of the main regulator or
either low-power charge pump falls below its fault
detection threshold, or if the input drops below its
undervoltage threshold, then RDY goes high imped-
ance and all outputs shut down; however, the reference
remains active. After removing the fault condition, tog-
gle shutdown (below 0.8V) or cycle the input voltage
(below 0.2V) to clear the fault latch and reactivate the
device.
The reference fault threshold is 1.05V. For the step-up
converter and positive charge-pump, the fault trip level is
set by FLTSET (see Fault Trip Level). For the negative
charge pump, the fault threshold measured at the
charge-pump’s feedback input (FBN) is 140mV (typ).
Power Ready (RDY)
Power ready is an open-drain output. When the power-
up sequence for the main step-up converter and low-
power charge pumps has properly completed, the 14V
MOSFET turns on and pulls RDY low with a 125Ω(typ)
on-resistance. If a fault is detected on any of these
three outputs, the internal open-drain MOSFET appears
as a high impedance. Connect a 100kΩpullup resistor
between RDY and IN for a logic-level output.
Voltage Reference (REF)
The voltage at REF is nominally 1.25V. The reference
can source up to 50µA with good load regulation (see
Typical Operating Characteristics). Connect a 0.22µF
ceramic bypass capacitor between REF and GND.
Thermal-Overload Protection
Thermal-overload protection limits total power dissipa-
tion in the MAX1778/MAX1880–MAX1885. When the
junction temperature exceeds TJ= +160°C, a thermal
sensor activates the fault protection, which shuts down
the controller, allowing the IC to cool. Once the device
cools down by 15°C, toggle shutdown (below 0.8V) or
cycle the input voltage (below 0.2V) to clear the fault
latch and reactivate the controller. Thermal-overload
protection protects the controller in the event of fault
conditions. For continuous operation, do not exceed
the absolute maximum junction-temperature rating of
TJ= +150°C.
Operating Region and Power Dissipation
The MAX1778/MAX1880–MAX1885s’ maximum power
dissipation depends on the thermal resistance of the IC
package and circuit board, the temperature difference
between the die junction and ambient air, and the rate
of any airflow. The power dissipated in the device
depends on the operating conditions of each regulator
and the buffer.
The step-up controller dissipates power across the
internal N-channel MOSFET as the controller ramps up
the inductor current. In continuous conduction, the
power dissipated internally can be approximated by:
PIV
V
VD
fL
RD
STEP UP MAIN MAIN
IN
IN
OSC
DS ON
+
×
()
22
1
12
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
______________________________________________________________________________________ 25
where IMAIN includes the primary load current and the
input supply currents for the charge pumps (see
Charge-Pump Input Power and Efficiency
Considerations), linear regulator, and VCOM buffer.
The linear regulator generates an output voltage by dis-
sipating power across an internal pass transistor, so
the power dissipation is simply the load current times
the input-to-output voltage differential:
When driving an external transistor, the internal linear
regulator provides the base drive current. Depending
on the external transistor’s current gain (β) and the
maximum load current, the power dissipated by the
internal linear regulator may still be significant:
The charge pumps provide regulated output voltages
by dissipating power in the low-side N-channel MOS-
FET, so they could be modeled as linear regulators fol-
lowed by unregulated charge pumps. Therefore, their
power dissipation is similar to a linear regulator:
where N is the number of charge-pump stages, VDIODE
is the diodes’ forward voltage, and VSUPD is the posi-
tive charge-pump diode supply (Figure 4).
The VCOM buffer’s power dissipation depends on the
capacitive load (CLOAD) being driven, the peak-to-
peak voltage change (VP-P) across the load, and the
load’s switching rate:
To find the total power dissipated in the device, the
power dissipated by each regulator and the buffer must
be added together:
The maximum allowed power dissipation is 975mW (24-
pin TSSOP) / 879mW (20-pin TSSOP) or:
PMAX = (TJ(MAX) - TA) / ( θJB + θBA)
where TJ- TAis the temperature difference between
the controller’s junction and the surrounding air, θJB (or
θJC) is the thermal resistance of the package to the
board, and θBA is the thermal resistance from the print-
ed circuit board to the surrounding air.
Design Procedure
Main Step-Up Converter
Output Voltage Selection
Adjust the output voltage by connecting a voltage-
divider from the output (VMAIN) to FB to GND (see
Typical Operating Circuit). Select R2 in the 10kΩto
50kΩrange. Calculate R1 with the following equations:
R1 = R2 [(VMAIN / VREF) - 1]
where VREF = 1.25V. VMAIN may range from VIN to 13V.
Inductor Selection
Inductor selection depends upon the minimum required
inductance value, saturation rating, series resistance, and
size. These factors influence the converter’s efficiency,
maximum output load capability, transient response time,
and output voltage ripple. For most applications, values
between 4.7µH and 22µH work best with the controller’s
switching frequency (Tables 1 and 2).
The inductor value depends on the maximum output
load the application must support, input voltage, output
voltage, and switching frequency. With high inductor
values, the MAX1778/MAX1880–MAX1885 source high-
er output currents, have less output ripple, and enter
continuous conduction operation with lighter loads;
however, the circuit’s transient response time is slower.
On the other hand, low-value inductors respond faster
to transients, remain in discontinuous conduction oper-
ation, and typically offer smaller physical size for a
given series resistance and current rating. The equa-
tions provided here include a constant LIR, which is the
ratio of the peak-to-peak AC inductor current to the
average DC inductor current. For a good compromise
between the size of the inductor, power loss, and out-
put voltage ripple, select an LIR of 0.3 to 0.5. The
inductance value is then given by:
LV
V
VV
I f LIR
MIN IN MIN
MAIN
MAIN IN MIN
MAIN MAX OSC
() ()
()
=
21
-η
PP P
PPP
TOTAL STEP UP LDO INT
NEG POS BUF
()
=+
+++
-
PVCfV
BUF P P LOAD LOAD SUPB
=-
PIV VNV
PIV VNV V
NEG NEG SUPN DIODE NEG
POS POS SUPP DIODE SUPD POS
=
()
[]
=
()
+
[]
--
--
2
2
PIVV V
IVV
LDO INT LDO SUPL LDO
LDOOUT SUPL LDOOUT
()
.
( )
=+
()
[]
=
β-
-
07
PIVV
LDO INT LDO SUPL LDO()
( )=-
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
26 ______________________________________________________________________________________
where ηis the efficiency, fOSC is the oscillator frequen-
cy (see Electrical Characteristics), and IMAIN includes
the primary load current and the input supply currents
for the charge pumps (see Charge-Pump Input Power
and Efficiency Considerations), linear regulator, and
VCOM buffer. Considering the typical application cir-
cuit, the maximum average DC load current
(IMAIN(MAX)) is 300mA with an 8V output. Based on the
above equations and assuming 85% efficiency, the
inductance value is then chosen to be 4.7µH.
The inductor’s saturation current rating should exceed
the peak inductor current throughout the normal operat-
ing range. The peak inductor current is then given by:
Under fault conditions, the inductor current may reach
up to 1.85A (ILIM(MAX)), see Electrical Characteristics).
However, the controller’s fast current-limit circuitry
allows the use of soft-saturation inductors while still pro-
tecting the IC.
The inductor’s DC resistance may significantly affect
efficiency due to the power loss in the inductor. The
power loss due to the inductor’s series resistance (PLR)
may be approximated by the following equation:
where RLis the inductor’s series resistance. For best per-
formance, select inductors with resistance less than the
internal N-channel MOSFET on-resistance (0.35Ωtyp).
Use inductors with a ferrite core or equivalent. To mini-
mize radiated noise in sensitive applications, use a
shielded inductor.
Output Capacitor
Output capacitor selection depends on circuit stability
and output voltage ripple. A 10µF ceramic capacitor
works well in most applications (Tables 1 and 2).
Additional feedback compensation is required (see
Feedback Compensation) to increase the margin for
stability by reducing the bandwidth further. In cases
where the output capacitance is sufficiently large, addi-
tional feedback compensation will not be necessary.
Output voltage ripple has two components: variations in
the charge stored in the output capacitor with each LX
pulse, and the voltage drop across the capacitor’s
equivalent series resistance (ESR) caused by the cur-
rent into and out of the capacitor:
where IPEAK is the peak inductor current (see Inductor
Selection). For ceramic capacitors, the output voltage
ripple is typically dominated by VRIPPLE(C). The voltage
rating and temperature characteristics of the output
capacitor must also be considered.
Feedback Compensation
For stability, add a pole-zero pair from FB to GND in the
form of a compensation resistor (RCOMP) in series with
a compensation capacitor (CCOMP) as shown in Figure
2. Select RCOMP to be half the value of R2, the low-side
feedback resistor.
Integrator Capacitor
The MAX1778/MAX1880–MAX1885 contain an internal
current integrator that improves the DC load regulation
but increases the peak-to-peak transient voltage (see
the load-transient waveforms in the Typical Operating
Characteristics). For highly accurate DC load regula-
tion, enable the current integrator by connecting a
470pF (ƒOSC = 1MHz)/1000pF (ƒOSC = 500kHz)
capacitor to INTG. To minimize the peak-to-peak tran-
sient voltage at the expense of DC regulation, disable
the integrator by connecting INTG to REF. When using
the MAX1883/MAX1884/MAX1885, connect a 100kΩ
resistor to GND when disabling the integrator.
Input Capacitor
The input capacitor (CIN) in step-up designs reduces
the current peaks drawn from the input supply and
reduces noise injection. The value of CIN is largely
determined by the source impedance of the input sup-
ply. High source impedance requires high input capac-
itance, particularly as the input voltage falls. Since
step-up DC-DC converters act as “constant-power
loads to their input supply, input current rises as input
voltage falls. A good starting point is to use the same
capacitance value for CIN as for COUT.
VV V
V I R AND
VVV
V
I
Cf
RIPPLE RIPPLE C RIPPLE ESR
RIPPLE ESR PEAK ESR COUT
RIPPLE C MAIN IN
MAIN
MAIN
OUT OSC
,
() ( )
() ( )
()
=+
PR
IXV
V
LR L MAIN MAIN
IN
2
IIV
V
LIR
PEAK
MAIN MAX MAIN
IN MIN
()
()
=
+
12
1
η
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
______________________________________________________________________________________ 27
Rectifier Diode
Use a Schottky diode with an average current rating
equal to or greater than the peak inductor current, and
a voltage rating at least 1.5 times the main output volt-
age (VMAIN).
Charge Pumps (MAX1778/ MAX1880/
MAX1881/MAX1882 Only)
Selecting the Number of Charge-Pump Stages
The number of charge-pump stages required to regu-
late the output voltage depends on the supply voltage,
output voltage, load current, switching frequency, the
diode’s forward voltage drop, and ceramic capacitor
values.
For positive charge-pump outputs, the number of
required stages may be determined by:
where VSUPD is the positive charge-pump diode supply
(Figure 4), VDIODE is the diode’s forward voltage drop,
and RTX is the charge pump’s output impedance. The
charge pump’s output impedance may be approximat-
ed using the following equation:
where the charge pump’s switching frequency (fCHP) is
equal to 0.5 x fOSC, the P-channel MOSFET’s on-resis-
tance (RPCH(ON)) is 10Ω, and the N-channel MOSFET’s
on-resistance (RNCH(ON)) is 4Ω(see Electrical
Characteristics).
For negative charge pump outputs, the number of
required stages may be determined by:
where NNEG is rounded up to the nearest integer.
NV
VVRI
NEG NEG
SUPN DROP TX LOAD
.( ) +
-112
RR R Cf
Cf
TX PCH ON NCH ON X CHP
OUT CHP
( )
() ()
=++
+
21
1
NVV
VVRI
POS POS SUPD
SUPP DIODE TX LOAD
.( ) +
-
-112
CIRCUIT 1 CIRCUIT 2 CIRCUIT 3 CIRCUIT 4 CIRCUIT 5
VIN 3.3V 3.3V 3.3V 5V 5V
VMAIN 9V 9V 9V 12V 12V
IMAIN(MAX) 100mA 200mA 200mA 220mA 220mA
VNEG -5V -5V -5V -5V -5V
INEG 2mA 5mA 5mA 5mA 5mA
VPOS 24V 24V 24V 24V 24V
IPOS 2mA 5mA 5mA 5mA 5mA
L 2.2µH 4.7µH 4.7µH 6.8µH 6.8µH
IPEAK >1A >1A >1A >1A >1A
COUT 4.7µF 10µF 20µF 10µF 20µF
R1 309kΩ309kΩ309kΩ429kΩ429kΩ
R2 49.9kΩ49.9kΩ49.9kΩ49.9kΩ49.9kΩ
RCOMP None None 39kΩ* None 20kΩ*
CCOMP None None 100pF* None 200pF*
Table 1. MAX1778/MAX1880/MAX1883 Component Values (fOSC = 1MHz)
*RCOMP and CCOMP are connected between the step-up converter’s output (VMAIN) and FB.
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
28 ______________________________________________________________________________________
Charge-Pump Input Power and
Efficiency Considerations
The charge pumps in the MAX1778/MAX1880/
MAX1881/MAX1882 provide regulated output voltages
by controlling the voltage drop across the low-side N-
channel MOSFET, so they can be modeled as linear
regulators followed by an unregulated charge pump
when determining the input power requirements and
efficiency.
The charge pump only provides charge to the output
capacitor during half the period (50% duty cycle), so
the input current is a function of the number of stages
and the load current:
for the positive charge pump, and:
for the negative charge pump, where N is the number
of charge pump stages.
The efficiency characteristics of the MAX1778/
MAX1880/MAX1881/MAX1882 regulated charge
pumps are similar to a linear regulator. It is dominated
by quiescent current at low output currents and by the
IIN
SUPP POS
() =+1
CIRCUIT 6 CIRCUIT 7 CIRCUIT 8 CIRCUIT 9
VIN 3.3V 3.3V 3.3V 3.3V
VMAIN 9V 9V 9V 9V
IMAIN(MAX) 100mA 100mA 200mA 200mA
VNEG -5V -5V -5V -5V
INEG 2mA 2mA 5mA 5mA
VPOS 24V 24V 24V 24V
IPOS 2mA 2mA 5mA 5mA
L 4.7µH 10µH 10µH 10µH
IPEAK >1A >1A >1A >1A
COUT 4.7µF 10µF 10µF 20µF
R1 309kΩ309kΩ309kΩ309kΩ
R2 49.9kΩ49.9kΩ49.9kΩ49.9kΩ
RCOMP None None None 20kΩ*
CCOMP None None None 200pF*
Table 2. MAX1881/MAX1882/MAX1884/MAX1885 Component Values (fOSC = 500kHz)
SUPPLIER PHONE FAX
INDUCTORS
Coilcraft 847-639-6400 847-639-1469
Coiltronics 561-241-7876 561-241-9339
Sumida USA 847-956-0666 847-956-0702
Toko 847-297-0070 847-699-1194
CAPACITORS
AVX 803-946-0690 803-626-3123
Kemet 408-986-0424 408-986-1442
Sanyo 619-661-6835 619-661-1055
Taiyo Yuden 408-573-4150 408-573-4159
DIODES
Central
Semiconductor 516-435-1110 516-435-1824
International
Rectifier 310-322-3331 310-322-3332
Motorola 602-303-5454 602-994-6430
Nihon 847-843-7500 847-843-2798
Zetex 516-543-7100 516-864-7630
Table 3. Component Suppliers
*RCOMP and CCOMP are connected between the step-up converter’s output (VMAIN) and FB.
IIN
SUPP POS
() =+1
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
______________________________________________________________________________________ 29
input voltage at higher output currents (see Typical
Operating Characteristics). So the maximum efficiency
may be approximated by:
for the positive charge pump, and:
for the negative charge pump, where VSUPD is the pos-
itive charge pump’s diode supply (Figure 4).
Output Voltage Selection
Adjust the positive output voltage by connecting a volt-
age divider from the output (VPOS) to FBP to GND (see
Typical Operating Circuit). Adjust the negative output
voltage by connecting a voltage-divider from the output
(VNEG) to FBN to REF. Select R4 and R6 in the 50kΩto
100kΩrange. Higher resistor values improve efficiency
at low output current but increase output voltage error
due to the feedback input bias current. For the negative
charge pump, higher resistor values also reduce the
load on the reference, which should not exceed 50µA
for greatest accuracy (including current through the
FLTSET resistors) to guarantee that VREF remains in
regulation (see Electrical Characteristics Table).
Calculate the remaining resistors with the following
equations:
R3 = R4 [(VPOS / VREF) - 1]
R5 = R6 |VNEG / VREF|
where VREF = 1.25V. VPOS may range from VSUPP to
40V, and VNEG may range from 0V to -40V.
Flying Capacitor
Increasing the flying capacitor (CX) value increases the
output current capability. Above a certain point,
increasing the capacitance has a negligible effect
because the output current capability becomes domi-
nated by the internal switch resistance and the diode
impedance. The flying capacitor’s voltage rating must
exceed the following:
for the positive charge pump, and:
for the negative charge pump, where N is the stage
number in which the flying capacitor appears, and
VSUPD is the positive charge pump’s diode supply
(Figure 4). For example, the two-stage positive charge
pump in the typical application circuit (Figure 1) where
VSUPP = VSUPD = 8V contains two flying capacitors.
The flying capacitor in the first stage (C4) requires a
voltage rating over 12V. The flying capacitor in the sec-
ond stage (C6) requires a voltage rating over 24V.
Charge-Pump Output Capacitor
Increasing the output capacitance or decreasing the
ESR reduces the output ripple voltage and the peak-to-
peak transient voltage. With ceramic capacitors, the
output voltage ripple is dominated by the capacitance
value. Use the following equation to approximate the
required capacitor value:
where fCHP is typically fOSC/2 (see Electrical
Characteristics).
Charge-Pump Input Capacitor
Use a bypass capacitor with a value equal to or greater
than the flying capacitor. Place the capacitor as close
to the IC as possible. Connect directly to power ground
(PGND).
Charge-Pump Rectifier Diodes
Use Schottky diodes with a current rating equal to or
greater than two times the average charge-pump input
current, and a voltage rating at least 1.5 times VSUPP
for the positive charge pump and VSUPN for the nega-
tive charge pump.
Low-Dropout Linear Regulator (MAX1778/
MAX1881/MAX1883/MAX1884 Only)
Output Voltage Selection
Adjust the linear-regulator output voltage by connecting
a voltage-divider from LDOOUT to FBL to GND (Figure
5). Select R8 in the 5kΩto 50kΩrange. Calculate R7
with the following equation:
R7 = R8 [(VLDOOUT / VFBL) - 1]
where VFBL = 1.25V, and VLDOOUT may range from
1.25V to (VSUPL - 300mV). FBL’s input bias current is
CI
fV
OUT LOAD
CHP RIPPLE
VVN
CXN NEG SUPN()
.( )>15
VVVN
CXN POS SUPD SUPP()
. ( )>+
[]
15 1-
ηNEG
V
VN
NEG
SUPN
ηPOS
V
VVN
POS
SUPD SUPP
+
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
30 ______________________________________________________________________________________
0.8µA (max). For less than 0.5% error due to FBL input
bias current (IFBL), R8 must be less than 8kΩ.
Capacitor Selection and Regulator Stability
Capacitors are required at the input and output of the
MAX1778/MAX1881/MAX1883/MAX1884 for stable
operation over the full temperature range and with load
currents up to 40mA. Connect a 1µF input bypass
capacitor (CSUPL) between SUPL and ground to lower
the source impedance of the input supply. Connect a
ceramic capacitor between LDOOUT and ground,
using the following equation to determine the lowest
value required for stable operation:
For example, with a 5V linear regulator output voltage
and a maximum 40mA load, use at least 4µF of output
capacitance. Applications that experience high-current
load pulses may require more output capacitance.
The ESR of the linear regulator’s output capacitor
(CLDOOUT) affects stability and output noise. Use out-
put capacitors with an ESR of 0.1Ωor less to ensure
stability and optimum transient response. Surface-
mount ceramic capacitors are good for this purpose.
Place CSUPL and CLDOOUT as close to the linear regu-
lator as possible to minimize the impact of PC board
trace inductance.
External Pass Transistor
For applications where the linear regulator currents
exceed 40mA or where the power dissipation in the IC
needs to be reduced, an external NPN transistor can
be used. In this case, the internal LDO only provides
the necessary base drive while the external NPN tran-
sistor supports the load, so most of the power dissipa-
tion occurs across the external transistor’s collector
and emitter.
Selection of the external NPN transistor is based on
three factors: the package’s power dissipation, the cur-
rent gain (β), and the collector-to-emitter saturation volt-
age (VCE(SAT)). First, the maximum power dissipation
should not exceed the transistor’s package rating:
Once the appropriate package type is selected, con-
sider the NPN transistor’s current gain. Since the inter-
nal LDO cannot source more than 40mA (min), the
transistor’s current gain must be high enough at the
lowest collector-to-emitter voltage to support the maxi-
mum output load:
For stable operation, place a capacitor (CLDOOUT) and
a minimum load resistor (R5) at the output of the inter-
nal linear regulator (the base of the external transistor)
to set the dominant pole:
Since the LDO cannot sink current, a minimum pull-
down resistor (R5) is required at the base of the NPN
transistor to sink leakage currents and improve the
high-to-low load-transient response. Under no-load
conditions, leakage currents from the internal pass
transistor supply the output capacitor (CLDOOUT), even
when the transistor is off. As the leakage currents
increase over temperature, charge may build up on
CLDOOUT, making the linear regulator’s output rise
above its set point. Therefore, R5 must sink at least
100µA to guarantee proper regulation. Additionally, the
minimum load current provided by R5 improves the
high-to-low load transients by lowering the impedance
seen by CLDOOUT after the transient occurs. Therefore,
if large load transients are expected, select R5 so that
the minimum load current is 10% of the transistor’s
maximum base current:
Alternatively, output capacitance placed on the external
linear regulator’s output (the emitter) adds a second pole
that could destabilize the regulator. A capacitive-divider
from the transistor’s base to the feedback input (C2 and
C3, Figure 7) circumvents this second pole by adding a
pole-zero pair. Furthermore, to minimize excessive over-
shoot, the capacitive-divider’s ratio must be the same as
the resistive-divider’s ratio. Once the output capacitor is
selected, using the following equations to determine the
required capacitive-divider values:
CC CR
R
C
CC
R
RR
V
V
LDO
REF
LDO
23 100 14
3
2
23
4
34
+≥ +
+=+=
RVV
I
VV
I
LDO
LDOOUT MIN
LDO MIN
LOAD MAX
507 01 07
. .
( .)
() ( )
=+=+
β
Cms
V
xVV
R
I
LDOOUT LDO
LDO LOAD MAX
MIN
.
. ()
++
05 1
07
5β
βMIN LOAD MAX
ImA
mA
()
-40
40
PV V xI
COLLECTOR LDO LOAD MAX
( ) ()
=−
CmsX
I
V
LDOOUT
LDOOUT MAX
LDOOUT
. ()
05
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
______________________________________________________________________________________ 31
Input-Output (Dropout) Voltage and Startup
A linear regulator’s minimum input-to-output voltage dif-
ferential (dropout voltage) determines the lowest use-
able supply voltage. Because the MAX1778/
MAX1881/MAX1883/MAX1884 use an internal PNP
transistor (or external NPN transistor), their dropout
voltage is a function of the transistor’s collector-to-emit-
ter saturation voltage (see Typical Operating
Characteristics). The linear regulator’s quiescent cur-
rent increases when in dropout.
The internal linear regulator will try to start up once its
supply voltage (VSUPL) exceeds 4V. When the linear
regulator powers up, the linear regulator may be in
dropout if the linear regulator’s output set voltage is
higher than its input supply voltage. Therefore, during
this brief period, the linear regulator draws additional
supply current until the input supply voltage exceeds
the output set voltage plus the pass transistor’s satura-
tion voltage (VLDO(SET) + VCE(SAT)).
VCOM Buffer (Operational
Transconductance Amplifier)
Buffer Output Voltage and Capacitor Selection
The positive input (BUF+) features dual mode opera-
tion. Connect BUF+ to GND for the preset VSUPB/2
output voltage, set by an internal 50% resistive-divider.
Adjust the amplifier’s output voltage by connecting a
voltage-divider from SUPB to BUF+ to GND (Figure 6).
Select R12 in the 10kΩto 100kΩrange. Calculate R11
with the following equation:
where VSUPB may range from 4.5V to 13V, and VBUF+
may range from 1.2V to (VSUPB - 1.2V). Connect a mini-
mum 1µF ceramic capacitor from BUFOUT to ground.
PC Board Layout and Grounding
Careful PC board layout is extremely important for
proper operation. Follow the following guidelines for
good PC board layout:
1) Place the main step-up converter output diode and
output capacitor less than 0.2in (5mm) from the LX
and PGND pins with wide traces and no vias.
2) Separate analog ground and power ground. The
ground connections for the step-up converter’s and
charge pump’s input and output capacitors should
be connected to the power ground plane. The lin-
ear regulator’s and VCOM buffer’s input and output
capacitors should be connected to a separate
power-ground path, star-connected to the PGND
pin to minimize voltage drops. When using multi-
layer boards, the top layer should contain the boost
RR
V
V
SUPB
BUF
11 12 1 =
+
-
IN
SHDN
LDOOUT
LX
L1
6.8μH
INPUT
VIN = 3.3V
C1
0.22μF
COUT
(2) 4.7μF
CIN
4.7μFR1
274kΩ
R2
49.9kΩ
FB
GND
FBL
REF
Q1
INTG
PGND
CREF
0.22μF
MAX1778
MAX1883
(MAX1881)*
(MAX1884)*
R3
49.9kΩ
R4
49.9kΩ
CLDO
1μF
C3
0.01μF
C2
0.01μF
CLDOOUT
4.7μF
CLDOIN
1μF
R5
1.5kΩ
MAIN
VMAIN = 8V
LDO
VLDO = 2.5V
SUPL
Figure 7. External Linear Regulator
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
32 ______________________________________________________________________________________
regulator and charge-pump power ground plane,
and the inner layer should contain the analog
ground plane and power-ground plane/path for the
VCOM buffer and LDO. Connect all three ground
planes together at one place near the PGND pin.
3) Locate all feedback resistive-dividers as close to
their respective feedback pins as possible. The
voltage-divider’s center trace should be kept short.
Avoid running any feedback trace near the LX
switching node or the charge-pump drivers. The
resistive-dividers’ ground connections should be to
analog ground (GND).
4) When using multilayer boards, separate the top sig-
nal layer and bottom signal layer with a ground
plane between to eliminate capacitive coupling
between fast-charging nodes on the top layer and
high-impedance nodes on the bottom layer. The
fast-charging nodes, such as the LX and charge-
pump driver nodes, should not have any other
traces or ground planes near by.
5) Keep the charge-pump circuitry as close to the IC
as possible, using wide traces and avoiding vias
when possible. Place 0.1µF ceramic bypass
capacitors near the charge-pump input pins (SUPP
and SUPN) to the PGND pin.
6) To maximize output power and efficiency and mini-
mize output ripple voltage, use extra wide, power
ground traces, and solder the IC’s power ground
pin directly to it.
Refer to the MAX1778/MAX1880-MAX1885 evaluation
kit for an example of proper board layout.
IN
BUFFER OUTPUT
VBUFOUT = VSUPB/2
POSITIVE
VPOS = 20V
SHDN
RDY
SUPL
LDOOUT SUPN
SUPP
DRVP
FBP
LX
L1
10μH
INPUT
VIN = 5V
C1
0.22μF
C6
1μFC6
0.01μF
C7
0.01μF
C3
1.0μF
CREF
0.22μF
C2
0.1μF
CBUF
1.0μF
C5
1.0μF
CCOMP
470pF
COUT
(2) 10μF
C4
0.1μF
CIN
(2) 4.7μF
CLDOOUT
4.7μF
RRDY
100kΩ
R8
1.5kΩ
R8
10kΩ
R5
316kΩR9
30kΩ
R3
750kΩ
R4
49.9kΩ
R1
86.6kΩ
R2
10kΩ
RCOMP
4.7kΩ
R10
100kΩ
R6
49.9kΩ
R7
16.4kΩ
NEGATIVE
VNEG = -8V
TO LOGIC
FB
BUFOUT
BUF-
BUF+
FLTSET
GND
TGND
FBL
DRVN
FBN
REF
INTG
PGND
SUPB
MAX1778
LDO
VLDO = 3.3V
Q1
REF
MAIN
VMAIN = 12V
Figure 8. 5V Input Monitor Application
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
______________________________________________________________________________________ 33
Applications Information
Low-Profile Components
Notebook applications generally require low-profile
components, potentially limiting the circuit’s perfor-
mance. For example, low-profile inductors typically
have lower saturation ratings and more series resis-
tance, limiting output current and efficiency. Low-profile
capacitors have lower voltage ratings for a given
capacitance value, so 3.3µF low-profile capacitors with
voltage ratings greater than 10V were not available at
the time of publication.
Desktop Monitors
Monitor applications do not have the same component
height restrictions associated with laptops, allowing
more flexibility in component selection (Figure 8).
Larger output capacitors with higher voltage ratings
allow configurations with output voltages above 10V.
Additionally, physically larger inductors with less series
resistance and higher saturation ratings provide more
output current and higher efficiency.
Input Voltage Above and
Below the Output Voltage
Combining the step-up converter and linear regulator
as shown in Figure 9 provides output voltage regulation
above and below the input voltage. Supplied by the
step-up converter, the linear regulator output provides
a constant output voltage (VLDO). When the input volt-
age exceeds the main step-up converter’s nominal out-
put voltage, the controller stops switching but the linear
regulator maintains the output voltage. When the input
voltage drops below the output voltage, the step-up
IN
BUFFER OUTPUT
VBUFOUT = VSUPB/2
POSITIVE
VPOS = 24V
SHDN
RDY
BUF-
BUFOUT
SUPN
SUPP
LX
L1
6.8μH
POWER INPUT
VBATT = 10V TO 15V
INPUT
VIN = 3.3V TO 5V C1
0.1μF
CLDO
(2) 3.3μF
C6
0.1μF
C7
0.1μF
C3
1.0μF
CBUF
1.0μF
CINTG
470pF
C2
0.1μF
COUT
(3) 3.3μF
C4
0.1μF
CIN
4.7μF
CLDOOUT
3.3μF
RRDY
100kΩ
R10
100kΩ
R5
475kΩ
R3
909kΩ
R8
49.9kΩ
R1
511kΩ
R2
49.9kΩ
R4
49.9kΩ
R7
470kΩ
R6
49.9kΩ
R9
6.8kΩ
NEGATIVE
VNEG = -12V
TO LOGIC
FB
FBL
SUPL
LDOOUT
BUF+
FBP
DRVP
GND
TGND
FBN
DRVN
REF
FLTSET
INTG
PGND
SUPB
CREF
0.22μF
MAX1778
LDO
VLDO = 13V
Q1
C5
1.0μF
R9
30kΩ
Figure 9. Input Voltage Above and Below the Output Voltage
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
34 ______________________________________________________________________________________
converter steps up the input voltage so that the linear
regulator will not drop out. Therefore, to guarantee that
the external pass transistor does not saturate, the step-
up converter’s output voltage must be set above the lin-
ear regulator’s output voltage plus the transistor’s
saturation rating (VMAIN VLDO + VSAT).
Power-Up Sequencing and Fault Protection
The MAX1778/MAX1880–MAX1885’s fault protection
cannot be activated until the power-up sequence is
successfully completed and the power ready output
goes low. Therefore, faults on the main output or posi-
tive charge-pump output could damage the controller
or external components. Additional fault protection may
be added as shown in Figure 10. The external MOSFET
and PNP transistor isolate the positive outputs during
startup. When the controller finishes the power-up
sequence, the power-ready output goes low, turning on
the PNP transistor. Any fault on the positive charge-
pump output will pull down the charge pump’s output
voltage and trigger the fault protection; otherwise, the
MOSFET’s gate slow charges. Once the MOSFET turns
on, any faults on the main step-up converter’s output
will pull down the main output voltage and trigger the
fault protection.
VCOM Buffer Startup
The VCOM buffer does not include soft-start. Therefore,
once the VCOM buffer turns on, it draws high surge
currents while charging the output capacitance. In
some applications, the buffer’s high startup surge
current could potentially trip the fault detection circuit,
forcing the controller to shut down. In these cases,
adding a soft-start resistive divider between SUPB and
BUFOUT reduces the startup surge current and voltage
drops associated with this load (Figure 11), as shown in
IN
SYSTEM
POSITIVE
VPOS(SYS) = 20V
STARTUP
POSITIVE
VPOS(START) = 20V
INPUT
VIN = 3.3V
SHDN
SUPP
LX
L1
6.8μH
INPUT
VIN = 3.3V
C1
0.22μF
C5
1.0μF
C7
1.0μF
Q2
Q3
COUT
(2) 3.3μF
C4
0.1μF
CIN
4.7μF
R10
100kΩ
RRDY
5.1kΩ
R1
274kΩ
R2
49.9kΩ
R7
10kΩ
FB
RDY
FBP
DRVP
GND
TGND
REF
FLTSET
INTG
PGND
CREF
0.22μF
MAX1778
C8
3.3μF
SYSTEM MAIN
VMAIN(SYS) = 8V
STARTUP MAIN
VMAIN(START) = 8V
C10
0.1μF
C6
0.1μF
R8
100kΩ
R3
750kΩ
R4
49.9kΩ
R9
30kΩ
Figure 10. Power-Up Sequencing and Fault Protection;
the Typical Operating Characteristics. Set the resistive
divider to precharge BUFOUT, matching the buffer’s
output set voltage:
These resistor values are selected to charge the output
capacitor close to the output set voltage before the
buffer starts up:
CRR
f
BUFOUT OSC
(||) 34 5000
RR
V
V
SUPB
BUFOUT
34 1 =
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
______________________________________________________________________________________ 35
PART
STEP-UP
SWITCHING
FREQUENCY
(Hz)
DUAL
CHARGE
PUMPS
LINEAR
REGULATOR
MAX1778 1M Yes Yes
MAX1880 1M Yes No
MAX1881 500k Yes Yes
MAX1882 500k Yes No
MAX1883 1M No Yes
MAX1884 500k No Yes
MAX1885 500k No No
Selector Guide
IN
BUFFER OUTPUT
VBUFOUT = VSUPB/2
SHDN
SUPB
LX
L1
6.8μH
INPUT
VIN = 3.3V
C1
0.22μF
COUT
(2) 4.7μF
CIN
4.7μFR1
274kΩ
R2
49.9kΩ
FB
BUFOUT
GND
BUF+
BUF-
REF
INTG
PGND
CREF
0.22μF
MAX1778
CSUPB
1.0μF
CBUF
1.0μF
R3
10kΩ
R4
10kΩ
MAIN
VMAIN = 8V
R3 = R4[( ) -1]
VSUPB
VBUFOUT
Figure 11. VCOM Buffer Soft-Start;
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
36 ______________________________________________________________________________________
Typical Operating Circuit
IN
BUFFER OUTPUT
POSITIVE
SHDN
RDY
SUPL
LDOOUT
SUPN
SUPP
DRVP
FBP
LX
INPUT
LDO OUTPUT
NEGATIVE
TO LOGIC
FB
BUFOUT
BUF-
BUF+
FLTSET
GND
TGND
FBL
DRVN
FBN
REF
INTG
PGND
SUPB
MAX1778
MAIN
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
______________________________________________________________________________________ 37
Pin Configurations
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
TGND
LX
PGNDBUF+
IN
INTG
FB
TOP VIEW
DRVP
SUPP
DRVN
SUPNGND
BUFOUT
SUPB
BUF-
16
15
14
13
9
10
11
12
FLTSET
FBL
LDOOUT
SUPL
FBN
FBP
REF
TSSOP
MAX1778
MAX1881
RDY
SHDN
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
TGND
LX
PGNDBUF+
IN
INTG
FB
DRVP
SUPP
DRVN
SUPNGND
BUFOUT
SUPB
BUF-
16
15
14
13
9
10
11
12
FLTSET
N.C.
N.C.
N.C.
FBN
FBP
REF
TSSOP
MAX1880
MAX1882
RDY
SHDN
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
TGND
LX
PGNDBUF+
IN
INTG
FB
TOP VIEW
N.C.
N.C.
FLTSET
FBLGND
BUFOUT
SUPB
BUF-
12
11
9
10
LDOOUT
SUPL
REF
MAX1883
MAX1884
TSSOP
RDY
SHDN
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
TGND
LX
PGNDBUF+
IN
INTG
FB
N.C.
N.C.
FLTSET
N.C.GND
BUFOUT
SUPB
BUF-
12
11
9
10
N.C.
N.C.
REF
MAX1885
TSSOP
RDY
SHDN
Chip Information
TRANSISTOR COUNT: 3739
MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC-DC
Converters with Buffer
38 ______________________________________________________________________________________
Quad-Output TFT LCD DC/DC
Converters with Buffer
MAX1778/MAX1880–MAX1885
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
39 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.
TSSOP4.40mm.EPS
PACKAGE OUTLINE, TSSOP 4.40mm BODY
21-0066 1
1
G
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)