2011-2012 Microchip Technology Inc. Preliminary DS41579C
PIC16(L)F1782/3
Data Sheet
28-Pin 8-Bit Advanced Analog
Flash Microcontrollers
DS41579C-page 2 Preliminary 2011-2012 Microchip Technology Inc.
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ISBN: 9781620761304
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YSTEM
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== ISO/TS 16949 ==
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 3
PIC16(L)F1782/3
High-Performance RISC CPU:
• Only 49 Instructions
• Operating Speed:
- DC – 32 MHz clock input
- DC – 125 ns instruction cycle
• Interrupt Capability with Automatic Context
Saving
• 16-Level Deep Hardware Stack with optional
Overflow/Underflow Reset
• Direct, Indirect and Relative Addressing modes:
- Two full 16-bit File Select Registers (FSRs)
- FSRs can read program and data memory
Memory Features:
• Up to 4 KW Flash Program Memory:
- Self-programmable under software control
- Programmable code protection
- Programmable write protection
• 256 Bytes of Data EEPROM
• Up to 512 Bytes of RAM
High Performance PWM Controller:
• Two Programmable Switch Mode Controller
(PSMC) modules:
- Digital and/or analog feedback control of
PWM frequency and pulse begin/end times
- 16-bit Period, Duty Cycle and Phase
- 16 ns clock resolution
- Supports Single PWM, Complementary, Push-
Pull and 3-phase modes of operation
- Dead-band control with 8-bit counter
- Auto-shutdown and restart
- Leading and falling edge blanking
-Burst mode
Extreme Low-Power Management
PIC16LF1782/3 with XLP:
• Sleep mode: 50 nA @ 1.8V, typical
• Watchdog Timer: 500 nA @ 1.8V, typical
• Secondary Oscillator: 500 nA @ 32 kHz
• Operating Current:
-8A @ 32 kHz, 1.8V, typical
-32A/MHz @ 1.8V, typical
Analog Peripheral Features:
• Analog-to-Digital Converter (ADC):
- Fully differential 12-bit converter
- 100 ksps conversion rate
- 11 single-ended channels
- 5 differential channels
- Positive and negative reference selection
• 8-bit Digital-to-Analog Converter (DAC):
- Output available externally
- Positive and negative reference selection
- Internal connections to comparators, op
amps, Fixed Voltage Reference (FVR) and
ADC
• Three High-Speed Comparators:
- 50 ns response time @ VDD = 5V
- Rail-to-rail inputs
- Software selectable hysteresis
- Internal connection to op amps, FVR and
DAC
• Two Operational Amplifiers:
- Rail-to-rail inputs/outputs
- High/Low selectable Gain Bandwidth Product
- Internal connection to DAC and FVR
• Fixed Voltage Reference (FVR):
- 1.024V, 2.048V and 4.096V output levels
- Internal connection to ADC, comparators and
DAC
I/O Features:
• Up to 24 I/O Pins and 1 Input-only Pin:
- High current sink/source for LED drivers
- Individually programmable interrupt-on-
change pins
- Individually programmable weak pull-ups
- Individual input level selection
- Individually programmable slew rate control
- Individually programmable open drain
outputs
28-Pin 8-Bit Advanced Analog Flash Microcontroller
PIC16(L)F1782/3
DS41579C-page 4 Preliminary 2011-2012 Microchip Technology Inc.
Digital Peripheral Features:
• Timer0: 8-Bit Timer/Counter with 8-Bit
Programmable Prescaler
• Enhanced Timer1:
- 16-bit timer/counter with prescaler
- External Gate Input mode
- Dedicated low-power 32 kHz oscillator driver
• Timer2: 8-Bit Timer/Counter with 8-Bit Period
Register, Prescaler and Postscaler
• Two Capture/Compare/PWM modules (CCP):
- 16-bit capture, maximum resolution 12.5 ns
- 16-bit compare, max resolution 31.25 ns
- 10-bit PWM, max frequency 32 kHz
• Master Synchronous Serial Port (SSP) with SPI
and I2CTM with:
- 7-bit address masking
- SMBus/PMBusTM compatibility
• Enhanced Universal Synchronous Asynchronous
Receiver Transmitter (EUSART):
- RS-232, RS-485 and LIN compatible
- Auto-baud detect
- Auto-wake-up on start
Oscillator Features:
• Operate up to 32 MHz from Precision Internal
Oscillator:
- Factory calibrated to ±1%, typical
- Software selectable frequency range from
32 MHz to 31 kHz
• 31 kHz Low-Power Internal Oscillator
• 32.768 kHz Timer1 Oscillator:
- Available as system clock
- Low-power RTC
• External Oscillator Block with:
- 4 crystal/resonator modes up to 32 MHz
using 4x PLL
- 3 external clock modes up to 32 MHz
• 4x Phase-Locked Loop (PLL)
• Fail-Safe Clock Monitor:
- Detect and recover from external oscillator
failure
• Two-Speed Start-up:
- Minimize latency between code execution
and external oscillator start-up
General Microcontroller Features:
• Power-Saving Sleep mode
• Power-on Reset (POR)
• Power-up Timer (PWRT)
• Oscillator Start-up Timer (OST)
• Brown-out Reset (BOR) with Selectable Trip Point
• Extended Watchdog Timer (WDT)
• In-Circuit Serial ProgrammingTM (ICSPTM)
• In-Circuit Debug (ICD)
• Enhanced Low-Voltage Programming (LVP)
• Operating Voltage Range:
- 1.8V to 3.6V (PIC16LF1782/3)
- 2.3V to 5.5V (PIC16F1782/3)
PIC16(L)F178X Family Types
Device
Data Sheet Index
Program Memory
Flash (words)
Data EEPROM
(bytes)
Data SRAM
(bytes)
I/O’s(2)
12-bit ADC (ch)
Comparators
Operational
Amplifiers
8-bit DAC
Timers
(8/16-bit)
Programmable Switch
Mode Controllers
(PSMC)
CCP
EUSART
MSSP (I2C™/SPI)
Debug(1)
XLP
PIC16(L)F1782 (1) 2048 256 256 25 11 3 2 1 2/1 2 2 1 1 I Y
PIC16(L)F1783 (1) 4096 256 512 25 11 3 2 1 2/1 2 2 1 1 I Y
PIC16(L)F1784 (2) 4096 256 512 36 14 4312/1 3 3 1 1 I Y
PIC16(L)F1786 (2) 8192 256 1024 25 11 4 2 1 2/1 3 3 1 1 I Y
PIC16(L)F1787 (2) 8192 256 1024 36 14 4 3 1 2/1 3 3 1 1 I Y
Note 1: I - Debugging, Integrated on Chip; H - Debugging, available using Debug Header.
2: One pin is input-only.
Data Sheet Index: (Unshaded devices are described in this document.)
1: DS41579 PIC16(L)F1782/3 Data Sheet, 28-Pin Flash, 8-bit Advanced Analog MCUs.
2: Future Release PIC16(L)F1784/6/7 Data Sheet, 28/40/44-Pin Flash, 8-bit Advanced Analog MCUs.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 5
PIC16(L)F1782/3
FIGURE 1: 28-PIN DIAGRAM FOR PIC16(L)F1782/3
SPDIP, SOIC, SSOP
1
2
3
4
5
6
7
8
9
10
VPP/MCLR/RE3
RA0
RA1
RA2
RA3
RA4
RA5
RB6/ICSPCLK
RB5
RB4
RB3
RB2
RB1
RB0
VDD
VSS
11
12
13
14 15
16
17
18
19
20
28
27
26
25
24
23
22
21
VSS
RA7
RA6
RC0
RC1
RC2
RC3
RC5
RC4
RC7
RC6
RB7/ICSPDAT
Note: See Table 1 for the location of all peripheral functions.
PIC16(L)F1782/3
PIC16(L)F1782/3
DS41579C-page 6 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 2: 28-PIN DIAGRAM FOR PIC16(L)F1782/3
2
3
6
1
18
19
20
21
15
7
16
17
RC0
5
4
RB7/ICSPDAT
RB6/ICSPCLK
RB5
RB4
RB3
RB2
RB1
RB0
VDD
VSS
RC7
RC6
RC5
RC4
RE3/MCLR/VPP
RA0
RA1
RA2
RA3
RA4
RA5
VSS
RA7
RA6
RC1
RC2
RC3
9
10
13
8
14
12
11
27
26
23
28
22
24
25
PIC16(L)F1782/3
QFN, UQFN
Note: See Table 1 for the location of all peripheral functions.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 7
PIC16(L)F1782/3
TABLE 1: 28-PIN ALLOCATION TABLE (PIC16(L)F1782/3)
I/O
28-Pin SPDIP, SOIC, SSOP
28-Pin QFN, UQFN
ADC
ADC Reference
Comparator
Operation Amplifiers
8-bit DAC
Timers
PSMC
CCP
EUSART
MSSP
Interrupt
Pull-up
Basic
RA0 227 AN0 —C1IN0-
C2IN0-
C3IN0-
— — — — — — — IOC Y —
RA1 3 28 AN1 — C1IN1-
C2IN1-
C3IN1-
OPA1OUT — — — — — — IOC Y —
RA2 4 1 AN2 VREF-C1IN0+
C2IN0+
C3IN0+
—DACOUT1
DACVREF-
— — — — — IOC Y —
RA3 5 2 AN3 VREF1+ C1IN1+ — DACVREF+— — — — —IOCY —
RA4 6 3 — — C1OUT OPA1IN+ —T0CKI — — — — IOC Y —
RA5 7 4 AN4 — C2OUT(1) OPA1IN- — — — — — SS IOC Y —
RA6 10 7 — — C2OUT(2) — — — — — — — IOC YOSC2/
CLKOUT
RA7 9 6 — VREF2+ — — — — PSMC1CLK
PSMC2CLK
———IOCYOSC1/
CLKIN
RB0 21 18 AN12 —C2IN1+ — — — PSMC1IN
PSMC2IN
CCP1(2) — — INT/
IOC
Y —
RB1 22 19 AN10 — C1IN3-
C2IN3-
C3IN3-
OPA2OUT — — — — — — IOC Y —
RB2 23 20 AN8 — — OPA2IN- — — — — — — IOC YCLKR
RB3 24 21 AN9 — C1IN2-
C2IN2-
C3IN2-
OPA2IN+ — — — CCP2(2) ——IOCY—
RB4 25 22 AN11 —C3IN1+ — — — — — — — IOC Y —
RB5 26 23 AN13 — C3OUT — — T1G — — — SDO(2) IOC Y —
RB6 27 24 — — — — — — — — TX(2)
CK(2) SDI(2)
SDA(2) IOC YICSPCLK
RB7 28 25 — — — — DACOUT2 — — — RX(2)
DT(2) SCK(2)
SCL(2) IOC Y ICSPDAT
RC0 11 8 — — — — — T1OSO
T1CKI
PSMC1A — — — IOC Y —
RC1 12 9 — — — — — T1OSI PSMC1B CCP2(1) ——IOCY—
RC2 13 10 — — — — — — PSMC1C CCP1(1) — — IOC Y —
RC3 14 11 — — — — — — PSMC1D — — SCK(1)
SCL(1) IOC Y —
RC4 15 12 — — — — — — PSMC1E — — SDI(1)
SDA(1) IOC Y —
RC5 16 13 — — — — — — PSMC1F — — SDO(1) IOC Y —
RC6 17 14 — — — — — — PSMC2A —TX(1)
CK(1) —IOC Y —
RC7 18 15 — — — — — — PSMC2B — RX(1)
DT(1) —IOCY —
RE3 1 26 — — — — — — — — — — IOC Y MCLR/
VPP
VDD 20 17 — — — — — — — — — — — — VDD
VSS 8,
19
5,
16
—— — — — — — —————VSS
Note 1: Default pin assignment.
2: Alternate pin assignment that can be selected via software.
PIC16(L)F1782/3
DS41579C-page 8 Preliminary 2011-2012 Microchip Technology Inc.
Table of Contents
1.0 Device Overview ........................................................................................................................................................................ 11
2.0 Enhanced Mid-Range CPU ........................................................................................................................................................ 17
3.0 Memory Organization ................................................................................................................................................................. 19
4.0 Device Configuration .................................................................................................................................................................. 43
5.0 Resets ........................................................................................................................................................................................ 49
6.0 Oscillator Module........................................................................................................................................................................ 57
7.0 Reference Clock Module ............................................................................................................................................................ 75
8.0 Interrupts .................................................................................................................................................................................... 79
9.0 Power-Down Mode (Sleep) ........................................................................................................................................................ 93
10.0 Low Dropout (LDO) Voltage Regulator ...................................................................................................................................... 97
11.0 Watchdog Timer (WDT) ............................................................................................................................................................. 99
12.0 Date EEPROM and Flash Program Memory Control ............................................................................................................... 103
13.0 I/O Ports ................................................................................................................................................................................... 117
14.0 Interrupt-on-Change ................................................................................................................................................................. 139
15.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 143
16.0 Temperature Indicator .............................................................................................................................................................. 147
17.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 149
18.0 Operational Amplifier (OPA) Module ........................................................................................................................................ 163
19.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 167
20.0 Comparator Module.................................................................................................................................................................. 171
21.0 Timer0 Module ......................................................................................................................................................................... 181
22.0 Timer1 Module ......................................................................................................................................................................... 185
23.0 Timer2 Module ......................................................................................................................................................................... 197
24.0 Programmable Switch Mode Control (PSMC) Module ............................................................................................................. 201
25.0 Capture/Compare/PWM Module .............................................................................................................................................. 255
26.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 265
27.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 317
28.0 In-Circuit Serial Programming™ (ICSP™) ................................................................................................................................ 347
29.0 Instruction Set Summary .......................................................................................................................................................... 349
30.0 Electrical Specifications............................................................................................................................................................ 363
31.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 397
32.0 Development Support............................................................................................................................................................... 415
33.0 Packaging Information.............................................................................................................................................................. 419
Appendix A: Revision History............................................................................................................................................................. 431
Index .................................................................................................................................................................................................. 433
The Microchip Web Site..................................................................................................................................................................... 441
Customer Change Notification Service .............................................................................................................................................. 441
Customer Support .............................................................................................................................................................................. 441
Reader Response .............................................................................................................................................................................. 441
Product Identification System............................................................................................................................................................. 443
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 9
PIC16(L)F1782/3
TO OUR VALUED CUSTOMERS
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PIC16(L)F1782/3
DS41579C-page 10 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 11
PIC16(L)F1782/3
1.0 DEVICE OVERVIEW
The PIC16(L)F1782/3 are described within this data
sheet. They are available in 28-pin packages.
Figure 1-1 shows a block diagram of the
PIC16(L)F1782/3 devices. Table 1-2 shows the pinout
descriptions.
Reference Tab l e 1 - 1 for peripherals available per
device.
TABLE 1-1: DEVICE PERIPHERAL
SUMMARY
Peripheral
PIC16(L)F1782
PIC16(L)F1783
Analog-to-Digital Converter (ADC) ●●
Digital-to-Analog Converter (DAC) ●●
Fixed Voltage Reference (FVR) ●●
Reference Clock Module ●●
Temperature Indicator ●●
Capture/Compare/PWM (CCP/ECCP) Modules
CCP1 ●●
CCP2 ●●
Comparators
C1 ●●
C2 ●●
C3 ●●
Enhanced Universal Synchronous/Asynchronous
Receiver/Transmitter (EUSART)
EUSART ●●
Master Synchronous Serial Ports
MSSP ●●
Op Amp
Op Amp 1 ●●
Op Amp 2 ●●
Programmable Switch Mode Controller (PSMC)
PSMC1 ●●
PSMC2 ●●
Timers
Timer0 ●●
Timer1 ●●
Timer2 ●●
PIC16(L)F1782/3
DS41579C-page 12 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 1-1: PIC16(L)F1782/3 BLOCK DIAGRAM
PORTA
PORTB
PORTC
Note 1: See applicable chapters for more information on peripherals.
CPU
Program
Flash Memory
RAM
Timing
Generation
LFINTOSC
Oscillator
MCLR
Figure 2-1
CLKIN
CLKOUT
ADC
12-Bit FVR
Tem p.
Indicator EUSART
Comparators
MSSPTimer2Timer1Timer0
DAC CCPs
PSMCsOp Amps
PORTE
HFINTOSC/
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 13
PIC16(L)F1782/3
TABLE 1-2: PIC16(L)F1782/3 PINOUT DESCRIPTION
Name Function Input
Type
Output
Type Description
RA0/AN0/C1IN0-/C2IN0-/C3IN0- RA0 TTL/ST CMOS General purpose I/O.
AN0 AN — A/D Channel 0 input.
C1IN0- AN — Comparator C1 negative input.
C2IN0- AN — Comparator C2 negative input.
C3IN0- AN — Comparator C3 negative input.
RA1/AN1/C1IN1-/C2IN1-/
C3IN1-/OPA1OUT
RA1 TTL/ST CMOS General purpose I/O.
AN1 AN — A/D Channel 1 input.
C1IN1- AN — Comparator C1 negative input.
C2IN1- AN — Comparator C2 negative input.
C3IN1- AN — Comparator C3 negative input.
OPA1OUT —AN
Operational Amplifier 1 output.
RA2/AN2/C1IN0+/C2IN0+/
C3IN0+/DACOUT1/VREF-/
DACVREF-
RA2 TTL/ST CMOS General purpose I/O.
AN2 AN — A/D Channel 2 input.
C1IN0+ AN — Comparator C1 positive input.
C2IN0+ AN — Comparator C2 positive input.
C3IN0+ AN — Comparator C3 positive input.
DACOUT — AN Digital-to-Analog Converter output.
VREF- AN — A/D Negative Voltage Reference input.
DACVREF- AN — Digital-to-Analog Converter negative reference.
RA3/AN3/VREF+(1)/C1IN1+/
DACVREF+
RA3 TTL/ST CMOS General purpose I/O.
AN3 AN — A/D Channel 3 input.
VREF+ AN — A/D Voltage Reference input.
C1IN1+ AN — Comparator C1 positive input.
DACVREF+ AN — Digital-to-Analog Converter positive reference.
RA4/C1OUT/OPA1IN+/T0CKI RA4 TTL/ST CMOS General purpose I/O.
C1OUT —CMOS Comparator C1 output.
OPA1IN+ AN — Operational Amplifier 1 non-inverting input.
T0CKI ST — Timer0 clock input.
RA5/AN4/C2OUT(1)/OP1INA-/
SS
RA5 TTL/ST CMOS General purpose I/O.
AN4 AN — A/D Channel 4 input.
C2OUT —CMOS Comparator C2 output.
OPA1IN- AN — Operational Amplifier 1 inverting input.
SS ST — Slave Select input.
RA6/C2OUT/OSC2/CLKOUT RA6 TTL/ST CMOS General purpose I/O.
C2OUT —CMOS Comparator C2 output.
OSC2 — XTAL Crystal/Resonator (LP, XT, HS modes).
CLKOUT — CMOS FOSC/4 output.
Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™ = Schmitt Trigger input with I2C
HV = High Voltage XTAL = Crystal levels
Note 1: Pin functions can be assigned to one of two locations via software. See Register 13-1.
2: All pins have Interrupt-on-Change functionality.
PIC16(L)F1782/3
DS41579C-page 14 Preliminary 2011-2012 Microchip Technology Inc.
RA7/VREF+(1)/PSMC1CLK/
PSMC2CLK/OSC1/CLKIN
RA7 TTL/ST CMOS General purpose I/O.
VREF+ AN — A/D Voltage Reference input.
PSMC1CLK ST — PSMC1 clock input.
PSMC2CLK ST — PSMC2 clock input.
OSC1 — XTAL Crystal/Resonator (LP, XT, HS modes).
CLKIN st — External clock input (EC mode).
RB0/AN12/C2IN1+/PSMC1IN/
PSMC2IN/CCP1(1)/INT
RB0 TTL/ST CMOS General purpose I/O.
AN12 AN — A/D Channel 12 input.
C2IN1+ AN — Comparator C2 positive input.
PSMC1IN ST — PSMC1 Event Trigger input.
PSMC2IN ST — PSMC2 Event Trigger input.
CCP1 ST CMOS Capture/Compare/PWM1.
INT ST — External interrupt.
RB1/AN10/C1IN3-/C2IN3-/
C3IN3-/OPA2OUT
RB1 TTL/ST CMOS General purpose I/O.
AN10 AN — A/D Channel 10 input.
C1IN3- AN — Comparator C1 negative input.
C2IN3- AN — Comparator C2 negative input.
C3IN3- AN — Comparator C3 negative input.
OPA2OUT —AN
Operational Amplifier 2 output.
RB2/AN8/OPA2IN-/CLKR RB2 TTL/ST CMOS General purpose I/O.
AN8 AN — A/D Channel 8 input.
OPA2IN- AN — Operational Amplifier 2 inverting input.
CLKR —CMOS
Clock output.
RB3/AN9/C1IN2-/C2IN2-/
C3IN2-/OPA2IN+/CCP2(1)
RB3 TTL/ST CMOS General purpose I/O.
AN9 AN — A/D Channel 9 input.
C1IN2- AN — Comparator C1 negative input.
C2IN2- AN — Comparator C2 negative input.
C3IN2- AN — Comparator C3 negative input.
OPA2IN+ AN — Operational Amplifier 2 non-inverting input.
CCP2 ST CMOS Capture/Compare/PWM2.
RB4/AN11/C3IN1+ RB4 TTL/ST CMOS General purpose I/O.
AN11 AN — A/D Channel 11 input.
C3IN1+ AN — Comparator C3 positive input.
RB5/AN13/C3OUT/T1G/SDO(1) RB5 TTL/ST CMOS General purpose I/O.
AN13 AN — A/D Channel 13 input.
C3OUT — CMOS Comparator C3 output.
T1G ST — Timer1 gate input.
SDO — CMOS SPI data output.
TABLE 1-2: PIC16(L)F1782/3 PINOUT DESCRIPTION (CONTINUED)
Name Function Input
Type
Output
Type Description
Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™ = Schmitt Trigger input with I2C
HV = High Voltage XTAL = Crystal levels
Note 1: Pin functions can be assigned to one of two locations via software. See Register 13-1.
2: All pins have Interrupt-on-Change functionality.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 15
PIC16(L)F1782/3
RB6/TX(1)/CK(1)/SDI(1)/SDA(1)/
ICSPCLK
RB6 TTL/ST CMOS General purpose I/O.
TX — CMOS USART asynchronous transmit.
CK ST CMOS USART synchronous clock.
SDI ST — SPI data input.
SDA I2CODI
2C™ data input/output.
ICSPCLK ST — Serial Programming Clock.
RB7/DACOUT2/RX(1)/DT(1)/
SCK(1)/SCL(1)/ICSPDAT
RB7 TTL/ST CMOS General purpose I/O.
DACOUT2 — AN Voltage Reference output.
RX ST — USART asynchronous input.
DT ST CMOS USART synchronous data.
SCK ST CMOS SPI clock.
SCL I2CODI
2C™ clock.
ICSPDAT ST CMOS ICSP™ Data I/O.
RC0/T1OSO/T1CKI/PSMC1A RC0 TTL/ST CMOS General purpose I/O.
T1OSO XTAL XTAL Timer1 oscillator connection.
T1CKI ST — Timer1 clock input.
PSMC1A — CMOS PSMC1 output A.
RC1/T1OSI/PSMC1B/CCP2(1) RC1 TTL/ST CMOS General purpose I/O.
T1OSI XTAL XTAL Timer1 oscillator connection.
PSMC1B — CMOS PSMC1 output B.
CCP2 ST CMOS Capture/Compare/PWM2.
RC2/PSMC1C/CCP1(1) RC2 TTL/ST CMOS General purpose I/O.
PSMC1C — CMOS PSMC1 output C.
CCP1 ST CMOS Capture/Compare/PWM1.
RC3/PSMC1D/SCK(1)/SCL(1) RC3 TTL/ST CMOS General purpose I/O.
PSMC1D — CMOS PSMC1 output D.
SCK ST CMOS SPI clock.
SCL I2CODI
2C™ clock.
RC4/PSMC1E/SDI(1)/SDA(1) RC4 TTL/ST CMOS General purpose I/O.
PSMC1E — CMOS PSMC1 output E.
SDI ST — SPI data input.
SDA I2CODI
2C™ data input/output.
RC5/PSMC1F/SDO(1) RC5 TTL/ST CMOS General purpose I/O.
PSMC1F — CMOS PSMC1 output F.
SDO — CMOS SPI data output.
RC6/PSMC2A/TX(1)/CK(1) RC6 TTL/ST CMOS General purpose I/O.
PSMC2A — CMOS PSMC2 output A.
TX — CMOS USART asynchronous transmit.
CK ST CMOS USART synchronous clock.
RC7/PSMC2B/RX(1)/DT(1) RC7 TTL/ST CMOS General purpose I/O.
PSMC2B — CMOS PSMC2 output B.
RX ST — USART asynchronous input.
DT ST CMOS USART synchronous data.
TABLE 1-2: PIC16(L)F1782/3 PINOUT DESCRIPTION (CONTINUED)
Name Function Input
Type
Output
Type Description
Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™ = Schmitt Trigger input with I2C
HV = High Voltage XTAL = Crystal levels
Note 1: Pin functions can be assigned to one of two locations via software. See Register 13-1.
2: All pins have Interrupt-on-Change functionality.
PIC16(L)F1782/3
DS41579C-page 16 Preliminary 2011-2012 Microchip Technology Inc.
RE3/MCLR/VPP RE3 TTL/ST — General purpose input.
MCLR ST — Master Clear with internal pull-up.
VPP HV — Programming voltage.
VDD VDD Power — Positive supply.
VSS VSS Power — Ground reference.
TABLE 1-2: PIC16(L)F1782/3 PINOUT DESCRIPTION (CONTINUED)
Name Function Input
Type
Output
Type Description
Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™ = Schmitt Trigger input with I2C
HV = High Voltage XTAL = Crystal levels
Note 1: Pin functions can be assigned to one of two locations via software. See Register 13-1.
2: All pins have Interrupt-on-Change functionality.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 17
PIC16(L)F1782/3
2.0 ENHANCED MID-RANGE CPU
This family of devices contain an enhanced mid-range
8-bit CPU core. The CPU has 49 instructions. Interrupt
capability includes automatic context saving. The
hardware stack is 16 levels deep and has Overflow and
Underflow Reset capability. Direct, Indirect, and
Relative addressing modes are available. Two File
Select Registers (FSRs) provide the ability to read
program and data memory.
• Automatic Interrupt Context Saving
• 16-level Stack with Overflow and Underflow
• File Select Registers
• Instruction Set
2.1 Automatic Interrupt Context
Saving
During interrupts, certain registers are automatically
saved in shadow registers and restored when returning
from the interrupt. This saves stack space and user
code. See 8.5 “Automatic Context Saving”, for more
information.
2.2 16-level Stack with Overflow and
Underflow
These devices have an external stack memory 15 bits
wide and 16 words deep. A Stack Overflow or Under-
flow will set the appropriate bit (STKOVF or STKUNF)
in the PCON register, and if enabled will cause a soft-
ware Reset. See Section 3.5 “Stack” for more details.
2.3 File Select Registers
There are two 16-bit File Select Registers (FSR). FSRs
can access all file registers and program memory,
which allows one Data Pointer for all memory. When an
FSR points to program memory, there is one additional
instruction cycle in instructions using INDF to allow the
data to be fetched. General purpose memory can now
also be addressed linearly, providing the ability to
access contiguous data larger than 80 bytes. There are
also new instructions to support the FSRs. See
Section 3.6 “Indirect Addressing” for more details.
2.4 Instruction Set
There are 49 instructions for the enhanced mid-range
CPU to support the features of the CPU. See
Section 29.0 “Instruction Set Summary” for more
details.
PIC16(L)F1782/3
DS41579C-page 18 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 2-1: CORE BLOCK DIAGRAM
Data Bus 8
14
Program
Bus
Instruction reg
Program Counter
8 Level Stack
(13-bit)
Direct Addr 7
12
Addr MUX
FSR reg
STATUS reg
MUX
ALU
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
VDD
8
8
Brown-out
Reset
12
3
VSS
Internal
Oscillator
Block
Data Bus 8
14
Program
Bus
Instruction reg
Program Counter
8 Level Stack
(13-bit)
Direct Addr 7
Addr MUX
FSR reg
STATUS reg
MUX
ALU
W reg
Instruction
Decode &
Control
Timing
Generation
VDD
8
8
3
VSS
Internal
Oscillator
Block
15 Data Bus 8
14
Program
Bus
Instruction Reg
Program Counter
16-Level Stack
(15-bit)
Direct Addr 7
RAM Addr
Addr MUX
Indirect
Addr
FSR0 Reg
STATUS Reg
MUX
ALU
Instruction
Decode and
Control
Timing
Generation
VDD
8
8
3
VSS
Internal
Oscillator
Block
RAM
FSR regFSR reg
FSR1 Reg
15
15
MUX
15
Program Memory
Read (PMR)
12
FSR regFSR reg
BSR Reg
5
ConfigurationConfigurationConfiguration
Flash
Program
Memory
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 19
PIC16(L)F1782/3
3.0 MEMORY ORGANIZATION
These devices contain the following types of memory:
• Program Memory
- Configuration Words
- Device ID
-User ID
- Flash Program Memory
• Data Memory
- Core Registers
- Special Function Registers
- General Purpose RAM
- Common RAM
• Data EEPROM memory(1)
The following features are associated with access and
control of program memory and data memory:
• PCL and PCLATH
•Stack
• Indirect Addressing
3.1 Program Memory Organization
The enhanced mid-range core has a 15-bit program
counter capable of addressing a 32K x 14 program
memory space. Table 3-1 shows the memory sizes
implemented for the PIC16(L)F1782/3 family. Accessing
a location above these boundaries will cause a
wrap-around within the implemented memory space.
The Reset vector is at 0000h and the interrupt vector is
at 0004h (see Figures 3-1, and 3-2).
Note 1: The Data EEPROM Memory and the
method to access Flash memory through
the EECON registers is described in
Section 12.0 “Data EEPROM and Flash
Program Memory Control”.
TABLE 3-1: DEVICE SIZES AND ADDRESSES
Device Program Memory Space (Words) Last Program Memory Address
PIC16(L)F1782 2,048 07FFh
PIC16(L)F1783 4,096 0FFFh
PIC16(L)F1782/3
DS41579C-page 20 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 3-1: PROGRAM MEMORY MAP
AND STACK FOR
PIC16F1782
FIGURE 3-2: PROGRAM MEMORY MAP
AND STACK FOR
PIC16F1783
PC<14:0>
15
0000h
0004h
Stack Level 0
Stack Level 15
Reset Vector
Interrupt Vector
Stack Level 1
0005h
On-chip
Program
Memory Page 0
07FFh
Wraps to Page 0
Wraps to Page 0
Wraps to Page 0
0800h
CALL, CALLW
RETURN, RETLW
Interrupt, RETFIE
Rollover to Page 0
Rollover to Page 0 7FFFh
PC<14:0>
15
0000h
0004h
Stack Level 0
Stack Level 15
Reset Vector
Interrupt Vector
CALL, CALLW
RETURN, RETLW
Stack Level 1
0005h
On-chip
Program
Memory
Page 0
07FFh
Rollover to Page 0
0800h
0FFFh
1000h
7FFFh
Page 1
Rollover to Page 1
Interrupt, RETFIE
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 21
PIC16(L)F1782/3
3.1.1 READING PROGRAM MEMORY AS
DATA
There are two methods of accessing constants in pro-
gram memory. The first method is to use tables of
RETLW instructions. The second method is to set an
FSR to point to the program memory.
3.1.1.1 RETLW Instruction
The RETLW instruction can be used to provide access
to tables of constants. The recommended way to create
such a table is shown in Example 3-1.
EXAMPLE 3-1: RETLW INSTRUCTION
The BRW instruction makes this type of table very sim-
ple to implement. If your code must remain portable
with previous generations of microcontrollers, then the
BRW instruction is not available so the older table read
method must be used.
3.1.1.2 Indirect Read with FSR
The program memory can be accessed as data by set-
ting bit 7 of the FSRxH register and reading the match-
ing INDFx register. The MOVIW instruction will place the
lower 8 bits of the addressed word in the W register.
Writes to the program memory cannot be performed via
the INDF registers. Instructions that access the pro-
gram memory via the FSR require one extra instruction
cycle to complete. Example 3-2 demonstrates access-
ing the program memory via an FSR.
The HIGH directive will set bit<7> if a label points to a
location in program memory.
EXAMPLE 3-2: ACCESSING PROGRAM
MEMORY VIA FSR
constants
BRW ;Add Index in W to
;program counter to
;select data
RETLW DATA0 ;Index0 data
RETLW DATA1 ;Index1 data
RETLW DATA2
RETLW DATA3
my_function
;… LOTS OF CODE…
MOVLW DATA_INDEX
call constants
;… THE CONSTANT IS IN W
constants
retlw DATA0 ;Index0 data
retlw DATA1 ;Index1 data
retlw DATA2
retlw DATA3
my_function
;… LOTS OF CODE…
movlw LOW constants
movwf FSR1L
movlw HIGH constants
movwf FSR1H
moviw 0[INDF1]
;THE PROGRAM MEMORY IS IN W
PIC16(L)F1782/3
DS41579C-page 22 Preliminary 2011-2012 Microchip Technology Inc.
3.2 Data Memory Organization
The data memory is partitioned in 32 memory banks
with 128 bytes in a bank. Each bank consists of
(Figure 3-3):
• 12 core registers
• 20 Special Function Registers (SFR)
• Up to 80 bytes of General Purpose RAM (GPR)
• 16 bytes of common RAM
The active bank is selected by writing the bank number
into the Bank Select Register (BSR). Unimplemented
memory will read as ‘0’. All data memory can be
accessed either directly (via instructions that use the
file registers) or indirectly via the two File Select
Registers (FSR). See Section 3.6 “Indirect
Addressing” for more information.
Data Memory uses a 12-bit address. The upper 7-bits
of the address define the Bank address and the lower
5-bits select the registers/RAM in that bank.
3.2.1 CORE REGISTERS
The core registers contain the registers that directly
affect the basic operation. The core registers occupy
the first 12 addresses of every data memory bank
(addresses x00h/x08h through x0Bh/x8Bh). These
registers are listed below in Ta bl e 3 - 2 . For detailed
information, see Table 3-7.
TABLE 3-2: CORE REGISTERS
Addresses BANKx
x00h or x80h INDF0
x01h or x81h INDF1
x02h or x82h PCL
x03h or x83h STATUS
x04h or x84h FSR0L
x05h or x85h FSR0H
x06h or x86h FSR1L
x07h or x87h FSR1H
x08h or x88h BSR
x09h or x89h WREG
x0Ah or x8Ah PCLATH
x0Bh or x8Bh INTCON
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 23
PIC16(L)F1782/3
3.2.1.1 STATUS Register
The STATUS register, shown in Register 3-1, contains:
• the arithmetic status of the ALU
• the Reset status
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bits are set or cleared according to the
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
For example, CLRF STATUS will clear the upper three
bits and set the Z bit. This leaves the STATUS register
as ‘000u u1uu’ (where u = unchanged).
It is recommended, therefore, that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
STATUS register, because these instructions do not
affect any Status bits. For other instructions not
affecting any Status bits (Refer to Section 29.0
“Instruction Set Summary”).
3.3 Register Definitions: Status
Note: The C and DC bits operate as Borrow and
Digit Borrow out bits, respectively, in
subtraction.
REGISTER 3-1: STATUS: STATUS REGISTER
U-0 U-0 U-0 R-1/q R-1/q R/W-0/u R/W-0/u R/W-0/u
— — —TOPD ZDC
(1) C(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7-5 Unimplemented: Read as ‘0’
bit 4 TO: Time-out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 3 PD: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2 Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1 DC: Digit Carry/Digit Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order
bit of the source register.
PIC16(L)F1782/3
DS41579C-page 24 Preliminary 2011-2012 Microchip Technology Inc.
3.3.1 SPECIAL FUNCTION REGISTER
The Special Function Registers are registers used by
the application to control the desired operation of
peripheral functions in the device. The Special Function
Registers occupy the 20 bytes after the core registers of
every data memory bank (addresses x0Ch/x8Ch
through x1Fh/x9Fh). The registers associated with the
operation of the peripherals are described in the
appropriate peripheral chapter of this data sheet.
3.3.2 GENERAL PURPOSE RAM
There are up to 80 bytes of GPR in each data memory
bank. The Special Function Registers occupy the 20
bytes after the core registers of every data memory
bank (addresses x0Ch/x8Ch through x1Fh/x9Fh).
3.3.2.1 Linear Access to GPR
The general purpose RAM can be accessed in a
non-banked method via the FSRs. This can simplify
access to large memory structures. See Section 3.6.2
“Linear Data Memory” for more information.
3.3.3 COMMON RAM
There are 16 bytes of common RAM accessible from all
banks.
FIGURE 3-3: BANKED MEMORY
PARTITIONING
3.3.4 DEVICE MEMORY MAPS
The memory maps for the device family are as shown
in Table 3-3.
0Bh
0Ch
1Fh
20h
6Fh
70h
7Fh
00h
Common RAM
(16 bytes)
General Purpose RAM
(80 bytes maximum)
Core Registers
(12 bytes)
Special Function Registers
(20 bytes maximum)
Memory Region
7-bit Bank Offset
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 25
PIC16(L)F1782/3
TABLE 3-3: PIC16(L)F1782/3 MEMORY MAP (BANKS 0-7)
Legend: = Unimplemented data memory locations, read as ‘0’.
BANK 0 BANK 1 BANK 2 BANK 3 BANK 4 BANK 5 BANK 6 BANK 7
000h
Core Registers
(Tab l e 3- 2)
080h
Core Registers
(Tab l e 3- 2)
100h
Core Registers
(Table 3-2)
180h
Core Registers
(Table 3-2)
200h
Core Registers
(Table 3-2)
280h
Core Registers
(Table 3-2)
300h
Core Registers
(Table 3-2)
380h
Core Registers
(Table 3-2)
00Bh 08Bh 10Bh 18Bh 20Bh 28Bh 30Bh 38Bh
00Ch PORTA 08Ch TRISA 10Ch LATA 18Ch ANSELA 20Ch WPUA 28Ch ODCONA 30Ch SLRCONA 38Ch INLVLA
00Dh PORTB 08Dh TRISB 10Dh LATB 18Dh ANSELB 20Dh WPUB 28Dh ODCONB 30Dh SLRCONB 38Dh INLVLB
00Eh PORTC 08Eh TRISC 10Eh LATC 18Eh — 20Eh WPUC 28Eh ODCONC 30Eh SLRCONC 38Eh INLVLC
00Fh —08Fh—10Fh—18Fh—20Fh—28Fh—30Fh—38Fh—
010h PORTE 090h TRISE 110h —190h— 210h WPUE 290h — 310h — 390h INLVLE
011h PIR1 091h PIE1 111h CM1CON0 191h EEADRL 211h SSPBUF 291h CCPR1L 311h — 391h IOCAP
012h PIR2 092h PIE2 112h CM1CON1 192h EEADRH 212h SSPADD 292h CCPR1H 312h — 392h IOCAN
013h —093h— 113h CM2CON0 193h EEDATL 213h SSPMSK 293h CCPR1CON 313h — 393h IOCAF
014h PIR4 094h PIE4 114h CM2CON1 194h EEDATH 214h SSPSTAT 294h — 314h — 394h IOCBP
015h TMR0 095h OPTION_REG 115h CMOUT 195h EECON1 215h SSPCON 295h — 315h — 395h IOCBN
016h TMR1L 096h PCON 116h BORCON 196h EECON2 216h SSPCON2 296h — 316h — 396h IOCBF
017h TMR1H 097h WDTCON 117h FVRCON 197h VREGCON 217h SSPCON3 297h — 317h — 397h IOCCP
018h T1CON 098h OSCTUNE 118h DACCON0 198h —218h— 298h CCPR2L 318h — 398h IOCCN
019h T1GCON 099h OSCCON 119h DACCON1 199h RCREG 219h — 299h CCPR2H 319h — 399h IOCCF
01Ah TMR2 09Ah OSCSTAT 11Ah — 19Ah TXREG 21Ah — 29Ah CCPR2CON 31Ah —39Ah—
01Bh PR2 09Bh ADRESL 11Bh — 19Bh SPBRG 21Bh —29Bh—31Bh—39Bh—
01Ch T2CON 09Ch ADRESH 11Ch — 19Ch SPBRGH 21Ch — 29Ch — 31Ch — 39Ch —
01Dh — 09Dh ADCON0 11Dh APFCON 19Dh RCSTA 21Dh — 29Dh — 31Dh — 39Dh IOCEP
01Eh — 09Eh ADCON1 11Eh CM3CON0 19Eh TXSTA 21Eh —29Eh—31Eh—39EhIOCEN
01Fh — 09Fh ADCON2 11Fh CM3CON1 19Fh BAUDCON 21Fh —29Fh—31Fh—39FhIOCEF
020h
General
Purpose
Register
80 Bytes
0A0h
General
Purpose
Register
80 Bytes
120h
General
Purpose
Register
80 Bytes
1A0h
General
Purpose
Register
80 Bytes(1)
220h
General
Purpose
Register
80 Bytes(1)
2A0h
General
Purpose
Register
80 Bytes(1)
320h General Purpose
Register
32 Bytes(1)
3A0h
Unimplemented
Read as ‘0’
13Fh 33Fh
140h 340h Unimplemented
Read as ‘0’
06Fh 0EFh 16Fh 1EFh 26Fh 2EFh 36Fh 3EFh
070h
Common RAM
70h – 7Fh
0F0h
Accesses
70h – 7Fh
170h
Accesses
70h – 7Fh
1F0h
Accesses
70h – 7Fh
270h
Accesses
70h – 7Fh
2F0h
Accesses
70h – 7Fh
370h
Accesses
70h – 7Fh
3F0h
Accesses
70h – 7Fh
07Fh 0FFh 17Fh 1FFh 27Fh 2FFh 37Fh 3FFh
PIC16(L)F1782/3
DS41579C-page 26 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 3-4: PIC16(L)F1782/3 MEMORY MAP (BANKS 8-31)
Legend: = Unimplemented data memory locations, read as ‘0’
BANK 8 BANK 9 BANK 10 BANK 11 BANK 12 BANK 13 BANK 14 BANK 15
400h
40Bh
Core Registers
(Ta b l e 3 -2 )
480h
48Bh
Core Registers
(Ta b l e 3 -2 )
500h
50Bh
Core Registers
(Ta b l e 3 -2 )
580h
58Bh
Core Registers
(Ta b l e 3 -2 )
600h
60Bh
Core Registers
(Ta b l e 3 -2 )
680h
68Bh
Core Registers
(Ta b l e 3 -2 )
700h
70Bh
Core Registers
(Ta b l e 3 -2 )
780h
78Bh
Core Registers
(Ta b l e 3 -2 )
40Ch
Unimplemented
Read as ‘0’
48Ch
Unimplemented
Read as ‘0’
50Ch Unimplemented
Read as ‘0’
58Ch
Unimplemented
Read as ‘0’
60Ch
Unimplemented
Read as ‘0’
68Ch
Unimplemented
Read as ‘0’
70Ch
Unimplemented
Read as ‘0’
78Ch
Unimplemented
Read as ‘0’
510h
511h OPA1CON
512h —
513h OPA2CON
514h Unimplemented
Read as ‘0’
519h
51Ah CLKRCON
51Bh Unimplemented
Read as ‘0’
46Fh 4EFh 56Fh 5EFh 66Fh 6EFh 76Fh 7EFh
470h Common RAM
(Accesses
70h – 7Fh)
4F0h Common RAM
(Accesses
70h – 7Fh)
570h Common RAM
(Accesses
70h – 7Fh)
5F0h Common RAM
(Accesses
70h – 7Fh)
670h Common RAM
(Accesses
70h – 7Fh)
6F0h Common RAM
(Accesses
70h – 7Fh)
770h Common RAM
(Accesses
70h – 7Fh)
7F0h Common RAM
(Accesses
70h – 7Fh)
47Fh 4FFh 57Fh 5FFh 67Fh 6FFh 77Fh 7FFh
BANK 16 BANK 17 BANK 18 BANK 19 BANK 20 BANK 21 BANK 22 BANK 23
800h
80Bh
Core Registers
(Ta b l e 3 -2 )
880h
88Bh
Core Registers
(Ta b l e 3 -2 )
900h
90Bh
Core Registers
(Ta b l e 3 -2 )
980h
98Bh
Core Registers
(Ta b l e 3 -2 )
A00h
A0Bh
Core Registers
(Ta b l e 3 -2 )
A80h
A8Bh
Core Registers
(Ta b l e 3 -2 )
B00h
B0Bh
Core Registers
(Ta b l e 3 -2 )
B80h
B8Bh
Core Registers
(Ta b l e 3 -2 )
80Ch
See Tab l e 3 - 5
88Ch
Unimplemented
Read as ‘0’
90Ch
Unimplemented
Read as ‘0’
98Ch
Unimplemented
Read as ‘0’
A0Ch
Unimplemented
Read as ‘0’
A8Ch
Unimplemented
Read as ‘0’
B0Ch
Unimplemented
Read as ‘0’
B8Ch
Unimplemented
Read as ‘0’
86Fh 8EFh 96Fh 9EFh A6Fh AEFh B6Fh BEFh
870h Common RAM
(Accesses
70h – 7Fh)
8F0h Common RAM
(Accesses
70h – 7Fh)
970h Common RAM
(Accesses
70h – 7Fh)
9F0h Common RAM
(Accesses
70h – 7Fh)
A70h Common RAM
(Accesses
70h – 7Fh)
AF0h Common RAM
(Accesses
70h – 7Fh)
B70h Common RAM
(Accesses
70h – 7Fh)
BF0h Common RAM
(Accesses
70h – 7Fh)
87Fh 8FFh 97Fh 9FFh A7Fh AFFh B7Fh BFFh
BANK 24 BANK 25 BANK 26 BANK 27 BANK 28 BANK 29 BANK 30 BANK 31
C00h
C0Bh
Core Registers
(Ta b l e 3 -2 )
C80h
C8Bh
Core Registers
(Ta b l e 3 -2 )
D00h
D0Bh
Core Registers
(Ta b l e 3 -2 )
D80h
D8Bh
Core Registers
(Ta b l e 3 -2 )
E00h
E0Bh
Core Registers
(Ta b l e 3 -2 )
E80h
E8Bh
Core Registers
(Ta b l e 3 -2 )
F00h
F0Bh
Core Registers
(Ta b l e 3 -2 )
F80h
F8Bh
Core Registers
(Ta b l e 3 -2 )
C0Ch
C6Fh
Unimplemented
Read as ‘0’
C8Ch
CEFh
Unimplemented
Read as ‘0’
D0Ch
D6Fh
Unimplemented
Read as ‘0’
D8Ch
DEFh
Unimplemented
Read as ‘0’
E0Ch
E6Fh
Unimplemented
Read as ‘0’
E8Ch
EEFh
Unimplemented
Read as ‘0’
F0Ch
F6Fh
Unimplemented
Read as ‘0’
F8Ch
FEFh
See Tabl e 3 -6
C70h Common RAM
(Accesses
70h – 7Fh)
CF0h Common RAM
(Accesses
70h – 7Fh)
D70h Common RAM
(Accesses
70h – 7Fh)
DF0h Common RAM
(Accesses
70h – 7Fh)
E70h Common RAM
(Accesses
70h – 7Fh)
EF0h Common RAM
(Accesses
70h – 7Fh)
F70h Common RAM
(Accesses
70h – 7Fh)
FF0h Common RAM
(Accesses
70h – 7Fh)
C7Fh CFFh D7Fh DFFh E7Fh EFFh F7Fh FFFh
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 27
PIC16(L)F1782/3
TABLE 3-5: PIC16(L)F1782/3 MEMORY
MAP (BANK 16 DETAILS)
TABLE 3-6: PIC16(L)F1782/3 MEMORY
MAP (BANK 31 DETAILS)
Legend: = Unimplemented data memory locations, read as ‘0’.
BANK 16 BANK 16
811h PSMC1CON 831h PSMC2CON
812h PSMC1MDL 832h PSMC2MDL
813h PSMC1SYNC 833h PSMC2SYNC
814h PSMC1CLK 834h PSMC2CLK
815h PSMC1OEN 835h PSMC2OEN
816h PSMC1POL 836h PSMC2POL
817h PSMC1BLNK 837h PSMC2BLNK
818h PSMC1REBS 838h PSMC2REBS
819h PSMC1FEBS 839h PSMC2FEBS
81Ah PSMC1PHS 83Ah PSMC2PHS
81Bh PSMC1DCS 83Bh PSMC2DCS
81Ch PSMC1PRS 83Ch PSMC2PRS
81Dh PSMC1ASDC 83Dh PSMC2ASDC
81Eh PSMC1ASDD 83Eh PSMC2ASDD
81Fh PSMC1ASDS 83Fh PSMC2ASDS
820h PSMC1INT 840h PSMC2INT
821h PSMC1PHL 841h PSMC2PHL
822h PSMC1PHH 842h PSMC2PHH
823h PSMC1DCL 843h PSMC2DCL
824h PSMC1DCH 844h PSMC2DCH
825h PSMC1PRL 845h PSMC2PRL
826h PSMC1PRH 846h PSMC2PRH
827h PSMC1TMRL 847h PSMC2TMRL
828h PSMC1TMRH 848h PSMC2TMRH
829h PSMC1DBR 849h PSMC2DBR
82Ah PSMC1DBF 84Ah PSMC2DBF
82Bh PSMC1BLKR 84Bh PSMC2BLKR
82Ch PSMC1BLKF 84Ch PSMC2BLKF
82Dh PSMC1FFA 84Dh PSMC1FFA
82Eh PSMC1STR0 84Eh PSMC2STR0
82Fh PSMC1STR1 84Fh PSMC2STR1
830h —840h
86Fh
Unimplemented
Read as ‘0’
Legend: = Unimplemented data memory locations, read as ‘0’.
BANK 31
F8Ch Unimplemented
Read as ‘0’
FE3h
FE4h STATUS_SHAD
FE5h WREG_SHAD
FE6h BSR_SHAD
FE7h PCLATH_SHAD
FE8h FSR0L_SHAD
FE9h FSR0H_SHAD
FEAh FSR1L_SHAD
FEBh FSR1H_SHAD
FECh —
FEDh STKPTR
FEEh TOSL
FEFh TOSH
PIC16(L)F1782/3
DS41579C-page 28 Preliminary 2011-2012 Microchip Technology Inc.
3.3.5 CORE FUNCTION REGISTERS
SUMMARY
The Core Function registers listed in Table 3-7 can be
addressed from any Bank.
TABLE 3-7: CORE FUNCTION REGISTERS SUMMARY
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other Resets
Bank 0-31
x00h or
x80h INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory
(not a physical register) xxxx xxxx uuuu uuuu
x01h or
x81h INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory
(not a physical register) xxxx xxxx uuuu uuuu
x02h or
x82h PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000
x03h or
x83h STATUS — — —TOPD ZDCC---1 1000 ---q quuu
x04h or
x84h FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu
x05h or
x85h FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000
x06h or
x86h FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu
x07h or
x87h FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000
x08h or
x88h BSR — — — BSR4 BSR3 BSR2 BSR1 BSR0 ---0 0000 ---0 0000
x09h or
x89h WREG Working Register 0000 0000 uuuu uuuu
x0Ah or
x8Ah PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000
x0Bh or
x8Bh INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 29
PIC16(L)F1782/3
TABLE 3-8: SPECIAL FUNCTION REGISTER SUMMARY
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
Bank 0
00Ch PORTA PORTA Data Latch when written: PORTA pins when read xxxx xxxx uuuu uuuu
00Dh PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu
00Eh PORTC PORTC Data Latch when written: PORTC pins when read xxxx xxxx uuuu uuuu
00Fh —Unimplemented — —
010h PORTE — — — —RE3— — — ---- x--- ---- u---
011h PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
012h PIR2 OSFIF C2IF C1IF EEIF BCL1IF — C3IF CCP2IF 0000 0-00 0000 0-00
013h —Unimplemented — —
014h PIR4 —— PSMC2TIF PSMC1TIF —— PSMC2SIF PSMC1SIF --00 --00 --00 --00
015h TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu
016h TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
017h TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
018h T1CON TMR1CS1 TMR1CS0 T1CKPS1 T1CKPS0 T1OSCEN T1SYNC —TMR1ON0000 00-0 uuuu uu-u
019h T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/
DONE
T1GVAL T1GSS1 T1GSS0 0000 0x00 uuuu uxuu
016h TMR2 Holding Register for the Least Significant Byte of the 16-bit TMR2 Register xxxx xxxx uuuu uuuu
017h PR2 Holding Register for the Most Significant Byte of the 16-bit TMR2 Register xxxx xxxx uuuu uuuu
018h T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> -000 0000 -000 0000
01Dh
to
01Fh
—Unimplemented — —
Bank 1
08Ch TRISA PORTA Data Direction Register 1111 1111 1111 1111
08Dh TRISB PORTB Data Direction Register 1111 1111 1111 1111
08Eh TRISC PORTC Data Direction Register 1111 1111 1111 1111
08Fh —Unimplemented — —
090h TRISE — — — — —(2) — — — ---- 1--- ---- 1---
091h PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
092h PIE2 OSFIE C2IE C1IE EEIE BCL1IE — C3IE CCP2IE 0000 0-00 0000 0-00
093h —Unimplemented — —
094h PIE4 —— PSMC2TIE PSMC1TIE —— PSMC2SIE PSMC2SIE --00 --00 --00 --00
095h
OPTION_REG
WPUEN INTEDG TMR0CS TMR0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
096h PCON STKOVF STKUNF —RWDTRMCLR RI POR BOR 00-1 11qq qq-q qquu
097h WDTCON —— WDTPS4 WDTPS3 WDTPS2 WDTPS1 WDTPS0 SWDTEN --01 0110 --01 0110
098h OSCTUNE —— TUN5 TUN4 TUN3 TUN2 TUN1 TUN0 --00 0000 --00 0000
099h OSCCON SPLLEN IRCF3 IRCF2 IRCF1 IRCF0 — SCS1 SCS0 0011 1-00 0011 1-00
09Ah OSCSTAT T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS 00q0 --00 qqqq --0q
09Bh ADRESL A/D Result Register Low xxxx xxxx uuuu uuuu
09Ch ADRESH A/D Result Register High xxxx xxxx uuuu uuuu
09Dh ADCON0 — CHS4 CHS3 CHS2 CHS1 CHS0
GO/DONE
ADON -000 0000 -000 0000
09Eh ADCON1 ADFM ADCS2 ADCS1 ADCS0 — ADNREF ADPREF1 ADPREF0 0000 -000 0000 -000
09Fh ADCON2 TRIGSEL3 TRIGSEL2 TRIGSEL1 TRIGSEL0 CHSN3 CHSN2 CHSN1 CHSN0 000- -000 000- -000
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: Unimplemented, read as ‘1’.
PIC16(L)F1782/3
DS41579C-page 30 Preliminary 2011-2012 Microchip Technology Inc.
Bank 2
10Ch LATA PORTA Data Latch xxxx xxxx uuuu uuuu
10Dh LATB PORTB Data Latch xxxx xxxx uuuu uuuu
10Eh LATC PORTC Data Latch xxxx xxxx uuuu uuuu
10Fh —Unimplemented — —
110h —Unimplemented — —
111h CM1CON0 C1ON C1OUT C1OE C1POL C1ZLF C1SP C1HYS C1SYNC 0000 0100 0000 0100
112h CM1CON1 C1INTP C1INTN C1PCH<2:0> C1NCH<2:0> 0000 0000 0000 0000
113h CM2CON0 C2ON C2OUT C2OE C2POL C2ZLF C2SP C2HYS C2SYNC 0000 0100 0000 0100
114h CM2CON1 C2INTP C2INTN C2PCH<2:0> C2NCH<2:0> 0000 0000 0000 0000
115h CMOUT — — — — — MC3OUT MC2OUT MC1OUT ---- -000 ---- -000
116h BORCON SBOREN BORFS — — — — — BORRDY 1x-- ---q uu-- ---u
117h FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR1 CDAFVR0 ADFVR1 ADFVR0 0q00 0000 0q00 0000
118h DACCON0 DACEN --- DACOE1 DACOE2 DACPSS<1:0> --- DACNSS 0-00 00-0 0-00 00-0
119h DACCON1 DACR<7:0> 0000 0000 0000 0000
11Ah
to
11Ch —Unimplemented — —
11Dh APFCON C2OUTSEL CC1PSEL SDOSEL SCKSEL SDISEL TXSEL RXSEL CCP2SEL 0000 0000 0000 0000
11Eh CM3CON0 C3ON C3OUT C3OE C3POL C3ZLF C3SP C3HYS C3SYNC 0000 0100 0000 0100
11Fh CM3CON1 C3INTP C3INTN C3PCH<2:0> C3NCH<2:0> 0000 0000 0000 0000
Bank 3
18Ch ANSELA ANSA7 —ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 1-11 1111 1-11 1111
18Dh ANSELB —— ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 --11 1111 --11 1111
18Eh
to
190h —Unimplemented — —
191h EEADRL EEPROM / Program Memory Address Register Low Byte 0000 0000 0000 0000
192h EEADRH —(2) EEPROM / Program Memory Address Register High Byte 1000 0000 1000 0000
193h EEDATL EEPROM / Program Memory Read Data Register Low Byte xxxx xxxx uuuu uuuu
194h EEDATH —— EEPROM / Program Memory Read Data Register High Byte --xx xxxx --uu uuuu
195h EECON1 EEPGD CFGS LWLO FREE WRERR WREN WR RD 0000 x000 0000 q000
196h EECON2 EEPROM / Program Memory Control Register 2 0000 0000 0000 0000
197h VREGCON — — — — — —VREGPMReserved ---- --01 ---- --01
198h —Unimplemented — —
199h RCREG USART Receive Data Register 0000 0000 0000 0000
19Ah TXREG USART Transmit Data Register 0000 0000 0000 0000
19Bh SPBRG BRG<7:0> 0000 0000 0000 0000
19Ch SPBRGH BRG<15:8> 0000 0000 0000 0000
19Dh RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 0000 0000 0000
19Eh TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
19Fh BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 01-0 0-00 01-0 0-00
TABLE 3-8: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: Unimplemented, read as ‘1’.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 31
PIC16(L)F1782/3
Bank 4
20Ch WPUA WPUA7 WPUA6 WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 1111 1111 1111 1111
20Dh WPUB WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 1111 1111 1111 1111
20Eh WPUC WPUC7 WPUC6 WPUC5 WPUC4 WPUC3 WPUC2 WPUC1 WPUC0 1111 1111 1111 1111
20Fh —Unimplemented — —
210h WPUE — — — — WPUE3 — — — ---- 1--- ---- 1---
211h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
212h SSPADD ADD<7:0> 0000 0000 0000 0000
213h SSPMSK MSK<7:0> 1111 1111 1111 1111
214h SSPSTAT SMP CKE D/A PSR/WUA BF 0000 0000 0000 0000
215h SSPCON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 0000 0000 0000 0000
216h SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 0000 0000
217h SSPCON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 0000 0000 0000 0000
218h
—
21Fh —Unimplemented — —
Bank 5
28Ch ODCONA Open Drain Control for PORTA 0000 0000 0000 0000
28Dh ODCONB Open Drain Control for PORTB 0000 0000 0000 0000
28Eh ODCONC Open Drain Control for PORTC 0000 0000 0000 0000
28Fh —Unimplemented — —
290h —Unimplemented — —
291h CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx uuuu uuuu
292h CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx uuuu uuuu
293h CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 0000 0000 0000 0000
294h
—
297h —Unimplemented — —
298h CCPR2L Capture/Compare/PWM Register 2 (LSB) xxxx xxxx uuuu uuuu
299h CCPR2H Capture/Compare/PWM Register 2 (MSB) xxxx xxxx uuuu uuuu
29Ah CCP2CON P2M<1:0> DC2B<1:0> CCP2M<3:0> 0000 0000 0000 0000
29Bh
—
29Fh —Unimplemented — —
Bank 6
30Ch SLRCONA Slew Rate Control for PORTA 0000 0000 0000 0000
30Dh SLRCONB Slew Rate Control for PORTB 0000 0000 0000 0000
30Eh SLRCONC Slew Rate Control for PORTC 0000 0000 0000 0000
30Fh
—
31Fh —Unimplemented — —
TABLE 3-8: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: Unimplemented, read as ‘1’.
PIC16(L)F1782/3
DS41579C-page 32 Preliminary 2011-2012 Microchip Technology Inc.
Bank 7
38Ch INLVLA Input Type Control for PORTA 0000 0000 0000 0000
38Dh INLVLB Input Type Control for PORTB 0000 0000 0000 0000
38Eh INLVLC Input Type Control for PORTC 1111 1111 1111 1111
38Fh —Unimplemented — —
390h INLVLE — — — — INLVLE3 — — — ---- 1--- ---- 1---
391h IOCAP IOCAP<7:0> 0000 0000 0000 0000
392h IOCAN IOCAN<7:0> 0000 0000 0000 0000
393h IOCAF IOCAF<7:0> 0000 0000 0000 0000
394h IOCBP IOCBP<7:0> 0000 0000 0000 0000
395h IOCBN IOCBN<7:0> 0000 0000 0000 0000
396h IOCBF IOCBF<7:0> 0000 0000 0000 0000
397h IOCCP IOCCP<7:0> 0000 0000 0000 0000
398h IOCCN IOCCN<7:0> 0000 0000 0000 0000
399h IOCCF IOCCF<7:0> 0000 0000 0000 0000
39Ah
—
39Ch —Unimplemented — —
39Dh IOCEP — — — — IOCEP3 — — — ---- 0--- ---- 0---
39Eh IOCEN — — — —IOCEN3— — — ---- 0--- ---- 0---
39Fh IOCEF — — — —IOCEF3— — — ---- 0--- ---- 0---
Bank 8-9
40Ch
or
41Fh
and
48Ch
or
49Fh
—Unimplemented — —
Bank 10
50Ch
—
510h —Unimplemented — —
511h OPA1CON OPA1EN OPA1SP — — — —OPA1PCH<1:0>00-- --00 00-- --00
512h —Unimplemented — —
513h OPA2CON OPA2EN OPA2SP — — — —OPA2PCH<1:0>00-- --00 00-- --00
514h
—
519h
—Unimplemented — —
51Ah CLKRCON CLKREN CLKROE CLKRSLR CLKRDC<1:0> CLKRDIV<2:0> 0011 0000 0011 0000
51Bh
—
51Fh —Unimplemented — —
Bank 11-15
x0Ch
or
x8Ch
to
x6Fh
or
xEFh
—Unimplemented — —
TABLE 3-8: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: Unimplemented, read as ‘1’.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 33
PIC16(L)F1782/3
Bank 16
80Ch
—
810h
—Unimplemented — —
811h PSMC1CON PSMC1EN PSMC1LD PSMC1DBFE PSMC1DBRE P1MODE<3:0> 0000 0000 0000 0000
812h PSMC1MDL P1MDLEN P1MDLPOL P1MDLBIT — P1MSRC<3:0> 000- 0000 000- 0000
813h PSMC1SYNC — — — — — — P1SYNC<1:0> ---- --00 ---- --00
814h PSMC1CLK —— P1CPRE<1:0> —— P1CSRC<1:0> --00 --00 --00 --00
815h PSMC1OEN —— P1OEF P1OEE P1OED P1OEC P1OEB P1OEA --00 0000 --00 0000
816h PSMC1POL — P1INPOL P1POLF P1POLE P1POLD P1POLC P1POLB P1POLA -000 0000 -000 0000
817h PSMC1BLNK —— P1FEBM<1:0> —— P1REBM<1:0> --00 --00 --00 --00
818h PSMCIREBS P1REBIN — — — P1REBSC3 P1REBSC2 P1REBSC1 —0--- 000- 0000 000-
819h PSMCIFEBS P1FEBIN — — — P1FEBSC3 P1FEBSC2 P1FEBSC1 —0--- 000- 0000 000-
81Ah PSMC1PHS P1PHSIN — — — P1PHSC3 P1PHSC2 P1PHSC1 P1PHST 0--- 0000 0--- 0000
81Bh PSMC1DCS P1DCSIN — — — P1DCSC3 P1DCSC2 P1DCSC1 P1DCST 0--- 0000 0--- 0000
81Ch PSMC1PRS P1PRSIN — — — P1PRSC3 P1PRSC2 P1PRSC1 P1PRST 0--- 0000 0--- 0000
81Dh PSMC1ASDC P1ASE P1ASDEN P1ARSEN — — — — P1ASDOV 000- ---0 000- ---0
81Eh PSMC1ASDL —— P1ASDLF P1ASDLE P1ASDLD P1ASDLC P1ASDLB P1ASDLA --00 0000 --00 0000
81Fh PSMC1ASDS P1ASDSIN — — — P1ASDSC3 P1ASDSC2 P1ASDSC1 —0--- 000- 0--- 000-
820h PSMC1INT P1TOVIE P1TPHIE P1TDCIE P1TPRIE P1TOVIF P1TPHIF P1TDCIF P1TPRIF 0000 0000 0000 0000
821h PSMC1PHL Phase Low Count 0000 0000 0000 0000
822h PSMC1PHH Phase High Count 0000 0000 0000 0000
823h PSMC1DCL Duty Cycle Low Count 0000 0000 0000 0000
824h PSMC1DCH Duty Cycle High Count 0000 0000 0000 0000
825h PSMC1PRL Period Low Count 0000 0000 0000 0000
826h PSMC1PRH Period High Count 0000 0000 0000 0000
827h PSMC1TMRL Time base Low Counter 0000 0001 0000 0001
828h PSMC1TMRH Time base High Counter 0000 0000 0000 0000
829h PSMC1DBR rising Edge Dead-band Counter 0000 0000 0000 0000
82Ah PSMC1DBF Falling Edge Dead-band Counter 0000 0000 0000 0000
82Bh PSMC1BLKR rising Edge Blanking Counter 0000 0000 0000 0000
82Ch PSMC1BLKF Falling Edge Blanking Counter 0000 0000 0000 0000
82Dh PSMC1FFA — — — — Fractional Frequency Adjust Register ---- 0000 ---- 0000
82Eh PSMC1STR0 —— P1STRF P1STRE P1STRD P1STRC P1STRB P1STRA --00 0001 --00 0001
82Fh PSMC1STR1 P1SYNC — — — — — P1LSMEN P1HSMEN 0--- --00 0--- --00
830h —Unimplemented — —
TABLE 3-8: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: Unimplemented, read as ‘1’.
PIC16(L)F1782/3
DS41579C-page 34 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 3-8: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
Bank 16 (Continued)
831h PSMC2CON PSMC2EN PSMC2LD PSMC2DBFE PSMC2DBRE P2MODE<3:0> 0000 0000 0000 0000
832h PSMC2MDL P2MDLEN P2MDLPOL P2MDLBIT — P2MSRC<3:0> 000- 0000 000- 0000
833h PSMC2SYNC — — — — — — P2SYNC<1:0> ---- --00 ---- --00
834h PSMC2CLK —— P2CPRE<1:0> —— P2CSRC<1:0> --00 --00 --00 --00
835h PSMC2OEN — — — — — — P2OEB P2OEA ---- --00 ---- --00
836h PSMC2POL —P2INPOL— — — — P2POLB P2POLA -0-- --00 -0-- --00
837h PSMC2BLNK —— P2FEBM<1:0> —— P2REBM<1:0> --00 --00 --00 --00
838h PSMC2REBS P2REBIN — — — P2REBSC3 P2REBSC2 P2REBSC1 —0--- 000- 0000 000-
839h PSMC2FEBS P2FEBIN — — — P2FEBSC3 P2FEBSC2 P2FEBSC1 —0--- 000- 0000 000-
83Ah PSMC2PHS P2PHSIN — — — P2PHSC3 P2PHSC2 P2PHSC1 P2PHST 0--- 0000 0--- 0000
83Bh PSMC2DCS P2DCSIN — — — P2DCSC3 P2DCSC2 P2DCSC1 P2DCST 0--- 0000 0--- 0000
83Ch PSMC2PRS P2PRSIN — — — P2PRSC3 P2PRSC2 P2PRSC1 P2PRST 0--- 0000 0--- 0000
83Dh PSMC2ASDC P2ASE P2ASDEN P2ARSEN — — — — P2ASDOV 000- ---0 000- ---0
83Eh PSMC2ASDL —— P2ASDLF P2ASDLE P2ASDLD P2ASDLC P2ASDLB P2ASDLA --00 0000 --00 0000
83Fh PSMC2ASDS P2ASDSIN — — — P2ASDSC3 P2ASDSC2 P2ASDSC1 —0--- 000- 0--- 000-
840h PSMC2INT P2TOVIE P2TPHIE P2TDCIE P2TPRIE P2TOVIF P2TPHIF P2TDCIF P2TPRIF 0000 0000 0000 0000
841h PSMC2PHL Phase Low Count 0000 0000 0000 0000
842h PSMC2PHH Phase High Count 0000 0000 0000 0000
843h PSMC2DCL Duty Cycle Low Count 0000 0000 0000 0000
844h PSMC2DCH Duty Cycle High Count 0000 0000 0000 0000
845h PSMC2PRL Period Low Count 0000 0000 0000 0000
846h PSMC2PRH Period High Count 0000 0000 0000 0000
847h PSMC2TMRL Time base Low Counter 0000 0001 0000 0001
848h PSMC2TMRH Time base High Counter 0000 0000 0000 0000
849h PSMC2DBR rising Edge Dead-band Counter 0000 0000 0000 0000
84Ah PSMC2DBF Falling Edge Dead-band Counter 0000 0000 0000 0000
84Bh PSMC2BLKR rising Edge Blanking Counter 0000 0000 0000 0000
84Ch PSMC2BLKF Falling Edge Blanking Counter 0000 0000 0000 0000
84Dh PSMC2FFA — — — — Fractional Frequency Adjust Register ---- 0000 ---- 0000
84Eh PSMC2STR0 — — — — — — P2STRB P2STRA ---- --01 ---- --01
84Fh PSMC2STR1 P2SYNC — — — — — P2LSMEN P2HSMEN 0--- --00 0--- --00
850h
—
86Fh
—Unimplemented — —
Bank 17-30
x0Ch
or
x8Ch
to
x1Fh
or
x9Fh
—Unimplemented — —
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: Unimplemented, read as ‘1’.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 35
PIC16(L)F1782/3
TABLE 3-8: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
Bank 31
F8Ch
to
FE3h
—Unimplemented — —
FE4h STATUS_
SHAD
— — — — —ZDCC---- -xxx ---- -uuu
FE5h WREG_SHAD Working Register Shadow xxxx xxxx uuuu uuuu
FE6h BSR_SHAD — — — Bank Select Register Shadow ---x xxxx ---u uuuu
FE7h PCLATH_
SHAD
— Program Counter Latch High Register Shadow -xxx xxxx uuuu uuuu
FE8h FSR0L_SHAD Indirect Data Memory Address 0 Low Pointer Shadow xxxx xxxx uuuu uuuu
FE9h FSR0H_
SHAD
Indirect Data Memory Address 0 High Pointer Shadow xxxx xxxx uuuu uuuu
FEAh FSR1L_SHAD Indirect Data Memory Address 1 Low Pointer Shadow xxxx xxxx uuuu uuuu
FEBh FSR1H_
SHAD
Indirect Data Memory Address 1 High Pointer Shadow xxxx xxxx uuuu uuuu
FECh —Unimplemented — —
FEDh STKPTR — — — Current Stack Pointer ---1 1111 ---1 1111
FEEh TOSL Top of Stack Low byte xxxx xxxx uuuu uuuu
FEFh TOSH — Top of Stack High byte -xxx xxxx -uuu uuuu
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: Unimplemented, read as ‘1’.
PIC16(L)F1782/3
DS41579C-page 36 Preliminary 2011-2012 Microchip Technology Inc.
3.4 PCL and PCLATH
The Program Counter (PC) is 15 bits wide. The low byte
comes from the PCL register, which is a readable and
writable register. The high byte (PC<14:8>) is not directly
readable or writable and comes from PCLATH. On any
Reset, the PC is cleared. Figure 3-4 shows the five
situations for the loading of the PC.
FIGURE 3-4: LOADING OF PC IN
DIFFERENT SITUATIONS
3.4.1 MODIFYING PCL
Executing any instruction with the PCL register as the
destination simultaneously causes the Program Coun-
ter PC<14:8> bits (PCH) to be replaced by the contents
of the PCLATH register. This allows the entire contents
of the program counter to be changed by writing the
desired upper 7 bits to the PCLATH register. When the
lower 8 bits are written to the PCL register, all 15 bits of
the program counter will change to the values con-
tained in the PCLATH register and those being written
to the PCL register.
3.4.2 COMPUTED GOTO
A computed GOTO is accomplished by adding an offset to
the program counter (ADDWF PCL). When performing a
table read using a computed GOTO method, care should
be exercised if the table location crosses a PCL memory
boundary (each 256-byte block). Refer to Application
Note AN556, “Implementing a Table Read” (DS00556).
3.4.3 COMPUTED FUNCTION CALLS
A computed function CALL allows programs to maintain
tables of functions and provide another way to execute
state machines or look-up tables. When performing a
table read using a computed function CALL, care
should be exercised if the table location crosses a PCL
memory boundary (each 256-byte block).
If using the CALL instruction, the PCH<2:0> and PCL
registers are loaded with the operand of the CALL
instruction. PCH<6:3> is loaded with PCLATH<6:3>.
The CALLW instruction enables computed calls by com-
bining PCLATH and W to form the destination address.
A computed CALLW is accomplished by loading the W
register with the desired address and executing CALLW.
The PCL register is loaded with the value of W and
PCH is loaded with PCLATH.
3.4.4 BRANCHING
The branching instructions add an offset to the PC.
This allows relocatable code and code that crosses
page boundaries. There are two forms of branching,
BRW and BRA. The PC will have incremented to fetch
the next instruction in both cases. When using either
branching instruction, a PCL memory boundary may be
crossed.
If using BRW, load the W register with the desired
unsigned address and execute BRW. The entire PC will
be loaded with the address PC + 1 + W.
If using BRA, the entire PC will be loaded with PC + 1 +,
the signed value of the operand of the BRA instruction.
PCLPCH 0
14
PC
06 7
ALU Result
8
PCLATH
PCLPCH 0
14
PC
06 4
OPCODE <10:0>
11
PCLATH
PCLPCH 0
14
PC
06 7
W
8
PCLATH
Instruction with
PCL as
Destination
GOTO, CALL
CALLW
PCL
PCH 0
14
PC
PC + W
15
BRW
PCLPCH 0
14
PC
PC + OPCODE <8:0>
15
BRA
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 37
PIC16(L)F1782/3
3.5 Stack
All devices have a 16-level x 15-bit wide hardware
stack (refer to Figures 3-3 and 3-3). The stack space is
not part of either program or data space. The PC is
PUSHed onto the stack when CALL or CALLW instruc-
tions are executed or an interrupt causes a branch. The
stack is POPed in the event of a RETURN, RETLW or a
RETFIE instruction execution. PCLATH is not affected
by a PUSH or POP operation.
The stack operates as a circular buffer if the STVREN
bit is programmed to ‘0‘ (Configuration Words). This
means that after the stack has been PUSHed sixteen
times, the seventeenth PUSH overwrites the value that
was stored from the first PUSH. The eighteenth PUSH
overwrites the second PUSH (and so on). The
STKOVF and STKUNF flag bits will be set on an Over-
flow/Underflow, regardless of whether the Reset is
enabled.
3.5.1 ACCESSING THE STACK
The stack is available through the TOSH, TOSL and
STKPTR registers. STKPTR is the current value of the
Stack Pointer. TOSH:TOSL register pair points to the
TOP of the stack. Both registers are read/writable. TOS
is split into TOSH and TOSL due to the 15-bit size of the
PC. To access the stack, adjust the value of STKPTR,
which will position TOSH:TOSL, then read/write to
TOSH:TOSL. STKPTR is 5 bits to allow detection of
overflow and underflow.
During normal program operation, CALL, CALLW and
interrupts will increment STKPTR while RETLW,
RETURN, and RETFIE will decrement STKPTR. At any
time, STKPTR can be inspected to see how much
stack is left. The STKPTR always points at the currently
used place on the stack. Therefore, a CALL or CALLW
will increment the STKPTR and then write the PC, and
a return will unload the PC and then decrement the
STKPTR.
Reference Figure 3-5 through Figure 3-8 for examples
of accessing the stack.
FIGURE 3-5: ACCESSING THE STACK EXAMPLE 1
Note: There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the CALL,
CALLW, RETURN, RETLW and RETFIE
instructions or the vectoring to an interrupt
address.
Note: Care should be taken when modifying the
STKPTR while interrupts are enabled.
PIC16(L)F1782/3
DS41579C-page 38 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 3-6: ACCESSING THE STACK EXAMPLE 2
FIGURE 3-7: ACCESSING THE STACK EXAMPLE 3
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x07
0x06
0x05
0x04
0x03
0x02
0x01
Return Address0x00 STKPTR = 0x00
This figure shows the stack configuration
after the first CALL or a single interrupt.
If a RETURN instruction is executed, the
return address will be placed in the
Program Counter and the Stack Pointer
decremented to the empty state (0x1F).
TOSH:TOSL
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x07
Return Address0x06
Return Address0x05
Return Address0x04
Return Address0x03
Return Address0x02
Return Address0x01
Return Address0x00
STKPTR = 0x06
After seven CALLs or six CALLs and an
interrupt, the stack looks like the figure
on the left. A series of RETURN instructions
will repeatedly place the return addresses
into the Program Counter and pop the stack.
TOSH:TOSL
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 39
PIC16(L)F1782/3
FIGURE 3-8: ACCESSING THE STACK EXAMPLE 4
3.5.2 OVERFLOW/UNDERFLOW RESET
If the STVREN bit in Configuration Words is
programmed to ‘1’, the device will be reset if the stack
is PUSHed beyond the sixteenth level or POPed
beyond the first level, setting the appropriate bits
(STKOVF or STKUNF, respectively) in the PCON
register.
3.6 Indirect Addressing
The INDFn registers are not physical registers. Any
instruction that accesses an INDFn register actually
accesses the register at the address specified by the
File Select Registers (FSR). If the FSRn address
specifies one of the two INDFn registers, the read will
return ‘0’ and the write will not occur (though Status bits
may be affected). The FSRn register value is created
by the pair FSRnH and FSRnL.
The FSR registers form a 16-bit address that allows an
addressing space with 65536 locations. These locations
are divided into three memory regions:
• Traditional Data Memory
• Linear Data Memory
• Program Flash Memory
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x07
0x06
0x05
0x04
0x03
0x02
0x01
Return Address0x00 STKPTR = 0x10
When the stack is full, the next CALL or
an interrupt will set the Stack Pointer to
0x10. This is identical to address 0x00
so the stack will wrap and overwrite the
return address at 0x00. If the Stack
Overflow/Underflow Reset is enabled, a
Reset will occur and location 0x00 will
not be overwritten.
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
TOSH:TOSL
PIC16(L)F1782/3
DS41579C-page 40 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 3-9: INDIRECT ADDRESSING
0x0000
0x0FFF
Traditional
FSR
Address
Range
Data Memory
0x1000 Reserved
Linear
Data Memory
Reserved
0x2000
0x29AF
0x29B0
0x7FFF
0x8000
0xFFFF
0x0000
0x0FFF
0x0000
0x7FFF
Program
Flash Memory
Note: Not all memory regions are completely implemented. Consult device memory tables for memory limits.
0x1FFF
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 41
PIC16(L)F1782/3
3.6.1 TRADITIONAL DATA MEMORY
The traditional data memory is a region from FSR
address 0x000 to FSR address 0xFFF. The addresses
correspond to the absolute addresses of all SFR, GPR
and common registers.
FIGURE 3-10: TRADITIONAL DATA MEMORY MAP
Indirect AddressingDirect Addressing
Bank Select Location Select
4BSR 6 0
From Opcode FSRxL70
Bank Select Location Select
00000 00001 00010 11111
0x00
0x7F
Bank 0 Bank 1 Bank 2 Bank 31
0FSRxH70
0000
PIC16(L)F1782/3
DS41579C-page 42 Preliminary 2011-2012 Microchip Technology Inc.
3.6.2 LINEAR DATA MEMORY
The linear data memory is the region from FSR
address 0x2000 to FSR address 0x29AF. This region is
a virtual region that points back to the 80-byte blocks of
GPR memory in all the banks.
Unimplemented memory reads as 0x00. Use of the
linear data memory region allows buffers to be larger
than 80 bytes because incrementing the FSR beyond
one bank will go directly to the GPR memory of the next
bank.
The 16 bytes of common memory are not included in
the linear data memory region.
FIGURE 3-11: LINEAR DATA MEMORY
MAP
3.6.3 PROGRAM FLASH MEMORY
To make constant data access easier, the entire
program Flash memory is mapped to the upper half of
the FSR address space. When the MSB of FSRnH is
set, the lower 15 bits are the address in program
memory which will be accessed through INDF. Only the
lower 8 bits of each memory location is accessible via
INDF. Writing to the program Flash memory cannot be
accomplished via the FSR/INDF interface. All
instructions that access program Flash memory via the
FSR/INDF interface will require one additional
instruction cycle to complete.
FIGURE 3-12: PROGRAM FLASH
MEMORY MAP
7
01
7
00
Location Select 0x2000
FSRnH FSRnL
0x020
Bank 0
0x06F
0x0A0
Bank 1
0x0EF
0x120
Bank 2
0x16F
0xF20
Bank 30
0xF6F
0x29AF
0
7
1
7
00
Location Select 0x8000
FSRnH FSRnL
0x0000
0x7FFF
0xFFFF
Program
Flash
Memory
(low 8
bits)
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 43
PIC16(L)F1782/3
4.0 DEVICE CONFIGURATION
Device Configuration consists of Configuration Words,
Code Protection and Device ID.
4.1 Configuration Words
There are several Configuration Word bits that allow
different oscillator and memory protection options.
These are implemented as Configuration Word 1 at
8007h and Configuration Word 2 at 8008h.
Note: The DEBUG bit in Configuration Words is
managed automatically by device
development tools including debuggers
and programmers. For normal device
operation, this bit should be maintained as
a ‘1’.
PIC16(L)F1782/3
DS41579C-page 44 Preliminary 2011-2012 Microchip Technology Inc.
4.2 Register Definitions: Configuration Words
REGISTER 4-1: CONFIG1: CONFIGURATION WORD 1
R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
FCMEN IESO CLKOUTEN BOREN<1:0> CPD
bit 13 bit 8
R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
CP MCLRE PWRTE WDTE<1:0> FOSC<2:0>
bit 7 bit 0
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’
‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase
bit 13 FCMEN: Fail-Safe Clock Monitor Enable bit
1 = Fail-Safe Clock Monitor and internal/external switchover are both enabled.
0 = Fail-Safe Clock Monitor is disabled
bit 12 IESO: Internal External Switchover bit
1 = Internal/External Switchover mode is enabled
0 = Internal/External Switchover mode is disabled
bit 11 CLKOUTEN: Clock Out Enable bit
If FOSC configuration bits are set to LP, XT, HS modes:
This bit is ignored, CLKOUT function is disabled. Oscillator function on the CLKOUT pin.
All other FOSC modes:
1 = CLKOUT function is disabled. I/O function on the CLKOUT pin.
0 = CLKOUT function is enabled on the CLKOUT pin
bit 10-9 BOREN<1:0>: Brown-out Reset Enable bits
11 = BOR enabled
10 = BOR enabled during operation and disabled in Sleep
01 = BOR controlled by SBOREN bit of the BORCON register
00 = BOR disabled
bit 8 CPD: Data Code Protection bit(1)
1 = Data memory code protection is disabled
0 = Data memory code protection is enabled
bit 7 CP: Code Protection bit
1 = Program memory code protection is disabled
0 = Program memory code protection is enabled
bit 6 MCLRE: MCLR/VPP Pin Function Select bit
If LVP bit = 1:
This bit is ignored.
If LVP bit = 0:
1 =MCLR
/VPP pin function is MCLR; Weak pull-up enabled.
0 =MCLR
/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of
WPUE3 bit.
bit 5 PWRTE: Power-up Timer Enable bit
1 = PWRT disabled
0 = PWRT enabled
bit 4-3 WDTE<1:0>: Watchdog Timer Enable bit
11 = WDT enabled
10 = WDT enabled while running and disabled in Sleep
01 = WDT controlled by the SWDTEN bit in the WDTCON register
00 = WDT disabled
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 45
PIC16(L)F1782/3
bit 2-0 FOSC<2:0>: Oscillator Selection bits
111 = ECH: External Clock, High-Power mode (4-20 MHz): device clock supplied to CLKIN pin
110 = ECM: External Clock, Medium-Power mode (0.5-4 MHz): device clock supplied to CLKIN pin
101 = ECL: External Clock, Low-Power mode (0-0.5 MHz): device clock supplied to CLKIN pin
100 = INTOSC oscillator: I/O function on CLKIN pin
011 = EXTRC oscillator: External RC circuit connected to CLKIN pin
010 = HS oscillator: High-speed crystal/resonator connected between OSC1 and OSC2 pins
001 = XT oscillator: Crystal/resonator connected between OSC1 and OSC2 pins
000 =LP oscillator: Low-power crystal connected between OSC1 and OSC2 pins
Note 1: The entire data EEPROM will be erased when the code protection is turned off during an erase.Once the
Data Code Protection bit is enabled, (CPD = 0), the Bulk Erase Program Memory Command (through
ICSP) can disable the Data Code Protection (CPD =1). When a Bulk Erase Program Memory Command
is executed, the entire Program Flash Memory, Data EEPROM and configuration memory will be erased.
REGISTER 4-1: CONFIG1: CONFIGURATION WORD 1 (CONTINUED)
PIC16(L)F1782/3
DS41579C-page 46 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 4-2: CONFIG2: CONFIGURATION WORD 2
R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
LVP DEBUG LPBOR BORV STVREN PLLEN
bit 13 bit 8
U-1 U-1 R/P-1 U-1 U-1 U-1 R/P-1 R/P-1
— — VCAPEN ———WRT<1:0>
bit 7 bit 0
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’
‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase
bit 13 LVP: Low-Voltage Programming Enable bit(1)
1 = Low-voltage programming enabled
0 = High-voltage on MCLR must be used for programming
bit 12 DEBUG: In-Circuit Debugger Mode bit(3)
1 = In-Circuit Debugger disabled, ICSPCLK and ICSPDAT are general purpose I/O pins
0 = In-Circuit Debugger enabled, ICSPCLK and ICSPDAT are dedicated to the debugger
bit 11 LPBOR: Low-Power BOR Enable bit
1 = Low-Power Brown-out Reset is disabled
0 = Low-Power Brown-out Reset is enabled
bit 10 BORV: Brown-out Reset Voltage Selection bit(4)
1 = Brown-out Reset voltage (Vbor), low trip point selected.
0 = Brown-out Reset voltage (Vbor), high trip point selected.
bit 9 STVREN: Stack Overflow/Underflow Reset Enable bit
1 = Stack Overflow or Underflow will cause a Reset
0 = Stack Overflow or Underflow will not cause a Reset
bit 8 PLLEN: PLL Enable bit
1 = 4xPLL enabled
0 = 4xPLL disabled
bit 7-6 Unimplemented: Read as ‘1’
bit 5 VCAPEN: Voltage Regulator Capacitor Enable bit(2)
1 = VCAP functionality is disabled on RA6
0 = VCAP functionality is enabled on RA6
bit 4-2 Unimplemented: Read as ‘1’
bit 1-0 WRT<1:0>: Flash Memory Self-Write Protection bits
4 kW Flash memory (PIC16(L)F1782 only):
11 = Write protection off
10 = 000h to 1FFh write-protected, 200h to 7FFh may be modified by EECON control
01 = 000h to 3FFh write-protected, 400h to 7FFh may be modified by EECON control
00 = 000h to 7FFh write-protected, no addresses may be modified by EECON control
8 kW Flash memory (PIC16(L)F1783 only):
11 = Write protection off
10 = 000h to 1FFh write-protected, 200h to FFFh may be modified by EECON control
01 = 000h to 7FFh write-protected, 800h to FFFh may be modified by EECON control
00 = 000h to FFFh write-protected, no addresses may be modified by EECON control
Note 1: The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP.
2: Not implemented on PIC16LF1782/3.
3: The DEBUG bit in Configuration Words is managed automatically by device development tools including debuggers
and programmers. For normal device operation, this bit should be maintained as a '1'.
4: See Vbor parameter for specific trip point voltages.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 47
PIC16(L)F1782/3
4.3 Code Protection
Code protection allows the device to be protected from
unauthorized access. Program memory protection and
data EEPROM protection are controlled independently.
Internal access to the program memory and data
EEPROM are unaffected by any code protection
setting.
4.3.1 PROGRAM MEMORY PROTECTION
The entire program memory space is protected from
external reads and writes by the CP bit in Configuration
Words. When CP = 0, external reads and writes of
program memory are inhibited and a read will return all
‘0’s. The CPU can continue to read program memory,
regardless of the protection bit settings. Writing the
program memory is dependent upon the write
protection setting. See Section 4.4 “Write
Protection” for more information.
4.3.2 DATA EEPROM PROTECTION
The entire data EEPROM is protected from external
reads and writes by the CPD bit. When CPD = 0,
external reads and writes of data EEPROM are
inhibited. The CPU can continue to read and write data
EEPROM regardless of the protection bit settings.
4.4 Write Protection
Write protection allows the device to be protected from
unintended self-writes. Applications, such as boot
loader software, can be protected while allowing other
regions of the program memory to be modified.
The WRT<1:0> bits in Configuration Words define the
size of the program memory block that is protected.
4.5 User ID
Four memory locations (8000h-8003h) are designated
as ID locations where the user can store checksum or
other code identification numbers. These locations are
readable and writable during normal execution. See
Section 12.5 “User ID, Device ID and Configuration
Word Access”for more information on accessing
these memory locations. For more information on
checksum calculation, see the “PIC16(L)F178X
Memory Programming Specification” (DS41457).
PIC16(L)F1782/3
DS41579C-page 48 Preliminary 2011-2012 Microchip Technology Inc.
4.6 Device ID and Revision ID
The memory location 8006h is where the Device ID and
Revision ID are stored. The upper nine bits hold the
Device ID. The lower five bits hold the Revision ID. See
Section 12.5 “User ID, Device ID and Configuration
Word Access” for more information on accessing
these memory locations.
Development tools, such as device programmers and
debuggers, may be used to read the Device ID and
Revision ID.
4.7 Register Definitions: Device ID
REGISTER 4-3: DEVICEID: DEVICE ID REGISTER
RRRRRR
DEV<8:3>
bit 13 bit 8
RRRRRRRR
DEV<2:0> REV<4:0>
bit 7 bit 0
Legend:
R = Readable bit
‘1’ = Bit is set ‘0’ = Bit is cleared -n = Value when blank or after Bulk Erase
bit 13-5 DEV<8:0>: Device ID bits
bit 4-0 REV<4:0>: Revision ID bits
These bits are used to identify the revision (see Table under DEV<8:0> above).
Device
DEVICEID<13:0> Values
DEV<8:0> REV<4:0>
PIC16F1782 10 1010 000 x xxxx
PIC16LF1782 10 1010 101 x xxxx
PIC16F1783 10 1010 001 x xxxx
PIC16LF1783 10 1010 110 x xxxx
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 49
PIC16(L)F1782/3
5.0 RESETS
There are multiple ways to reset this device:
• Power-on Reset (POR)
• Brown-out Reset (BOR)
• Low Power Brown-out Reset (LPBOR)
•MCLR Reset
•WDT Reset
•RESET instruction
• Stack Overflow
• Stack Underflow
• Programming mode exit
To a l lo w VDD to stabilize, an optional power-up timer
can be enabled to extend the Reset time after a BOR
or POR event.
A simplified block diagram of the On-Chip Reset Circuit
is shown in Figure 5-1.
FIGURE 5-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
Note 1: See Table 5-1 for BOR active conditions.
Device
Reset
Power-on
Reset
WDT
Time-out
Brown-out
Reset
LPBOR
Reset
RESET Instruction
MCLRE
Sleep
BOR
Active(1)
PWRT
R
Done
PWRTE
LFINTOSC
VDD
ICSP Programming Mode Exit
Stack
Pointer
PIC16(L)F1782/3
DS41579C-page 50 Preliminary 2011-2012 Microchip Technology Inc.
5.1 Power-On Reset (POR)
The POR circuit holds the device in Reset until VDD has
reached an acceptable level for minimum operation.
Slow rising VDD, fast operating speeds or analog
performance may require greater than minimum VDD.
The PWRT, BOR or MCLR features can be used to
extend the start-up period until all device operation
conditions have been met.
5.1.1 POWER-UP TIMER (PWRT)
The Power-up Timer provides a nominal 64 ms
time-out on POR or Brown-out Reset.
The device is held in Reset as long as PWRT is active.
The PWRT delay allows additional time for the VDD to
rise to an acceptable level. The Power-up Timer is
enabled by clearing the PWRTE bit in Configuration
Words.
The Power-up Timer starts after the release of the POR
and BOR.
For additional information, refer to Application Note
AN607, “Power-up Trouble Shooting” (DS00607).
5.2 Brown-Out Reset (BOR)
The BOR circuit holds the device in Reset when VDD
reaches a selectable minimum level. Between the
POR and BOR, complete voltage range coverage for
execution protection can be implemented.
The Brown-out Reset module has four operating
modes controlled by the BOREN<1:0> bits in Configu-
ration Words. The four operating modes are:
• BOR is always on
• BOR is off when in Sleep
• BOR is controlled by software
• BOR is always off
Refer to Table 5-1 for more information.
The Brown-out Reset voltage level is selectable by
configuring the BORV bit in Configuration Words.
A VDD noise rejection filter prevents the BOR from trig-
gering on small events. If VDD falls below VBOR for a
duration greater than parameter TBORDC, the device
will reset. See Figure 5-2 for more information.
TABLE 5-1: BOR OPERATING MODES
5.2.1 BOR IS ALWAYS ON
When the BOREN bits of Configuration Words are pro-
grammed to ‘11’, the BOR is always on. The device
start-up will be delayed until the BOR is ready and VDD
is higher than the BOR threshold.
BOR protection is active during Sleep. The BOR does
not delay wake-up from Sleep.
5.2.2 BOR IS OFF IN SLEEP
When the BOREN bits of Configuration Words are pro-
grammed to ‘10’, the BOR is on, except in Sleep. The
device start-up will be delayed until the BOR is ready
and VDD is higher than the BOR threshold.
BOR protection is not active during Sleep. The device
wake-up will be delayed until the BOR is ready.
5.2.3 BOR CONTROLLED BY SOFTWARE
When the BOREN bits of Configuration Words are pro-
grammed to ‘01’, the BOR is controlled by the SBO-
REN bit of the BORCON register. The device start-up
is not delayed by the BOR ready condition or the VDD
level.
BOR protection begins as soon as the BOR circuit is
ready. The status of the BOR circuit is reflected in the
BORRDY bit of the BORCON register.
BOR protection is unchanged by Sleep.
BOREN<1:0> SBOREN Device Mode BOR Mode Instruction Execution upon:
Release of POR or Wake-up from Sleep
11 X X Active Waits for BOR ready(1) (BORRDY = 1)
10 X
Awake Active Waits for BOR ready (BORRDY = 1)
Sleep Disabled
01 1X Active Waits for BOR ready(1) (BORRDY = 1)
0XDisabled
Begins immediately (BORRDY = x)
00 X XDisabled
Note 1: In these specific cases, “Release of POR” and “Wake-up from Sleep”, there is no delay in start-up. The BOR
ready flag, (BORRDY = 1), will be set before the CPU is ready to execute instructions because the BOR
circuit is forced on by the BOREN<1:0> bits.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 51
PIC16(L)F1782/3
FIGURE 5-2: BROWN-OUT SITUATIONS
5.3 Register Definitions: BOR Control
REGISTER 5-1: BORCON: BROWN-OUT RESET CONTROL REGISTER
R/W-1/u R/W-0/u U-0 U-0 U-0 U-0 U-0 R-q/u
SBOREN BORFS — — — — —BORRDY
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7 SBOREN: Software Brown-out Reset Enable bit
If BOREN <1:0> in Configuration Words 01:
SBOREN is read/write, but has no effect on the BOR.
If BOREN <1:0> in Configuration Words = 01:
1 = BOR Enabled
0 = BOR Disabled
bit 6 BORFS: Brown-out Reset Fast Start bit(1)
If BOREN<1:0> = 11 (Always on) or BOREN<1:0> = 00 (Always off)
BORFS is Read/Write, but has no effect.
If BOREN <1:0> = 10 (Disabled in Sleep) or BOREN<1:0> = 01 (Under software control):
1 = Band gap is forced on always (covers sleep/wake-up/operating cases)
0 = Band gap operates normally, and may turn off
bit 5-1 Unimplemented: Read as ‘0’
bit 0 BORRDY: Brown-out Reset Circuit Ready Status bit
1 = The Brown-out Reset circuit is active
0 = The Brown-out Reset circuit is inactive
Note 1: BOREN<1:0> bits are located in Configuration Words.
TPWRT(1)
VBOR
VDD
Internal
Reset
VBOR
VDD
Internal
Reset TPWRT(1)
< TPWRT
TPWRT(1)
VBOR
VDD
Internal
Reset
Note 1: TPWRT delay only if PWRTE bit is programmed to ‘0’.
PIC16(L)F1782/3
DS41579C-page 52 Preliminary 2011-2012 Microchip Technology Inc.
5.4 Low-Power Brown-Out Reset
(LPBOR)
The Low-Power Brown-Out Reset (LPBOR) is an
essential part of the Reset subsystem. Refer to
Figure 5-1 to see how the BOR interacts with other
modules.
The LPBOR is used to monitor the external VDD pin.
When too low of a voltage is detected, the device is
held in Reset. When this occurs, a register bit (BOR) is
changed to indicate that a BOR Reset has occurred.
The same bit is set for both the BOR and the LPBOR.
Refer to Register 5-2.
5.4.1 ENABLING LPBOR
The LPBOR is controlled by the LPBOR bit of
Configuration Words. When the device is erased, the
LPBOR module defaults to disabled.
5.4.1.1 LPBOR Module Output
The output of the LPBOR module is a signal indicating
whether or not a Reset is to be asserted. This signal is
OR’d together with the Reset signal of the BOR mod-
ule to provide the generic BOR signal, which goes to
the PCON register and to the power control block.
5.5 MCLR
The MCLR is an optional external input that can reset
the device. The MCLR function is controlled by the
MCLRE bit of Configuration Words and the LVP bit of
Configuration Words (Table 5-2).
5.5.1 MCLR ENABLED
When MCLR is enabled and the pin is held low, the
device is held in Reset. The MCLR pin is connected to
VDD through an internal weak pull-up.
The device has a noise filter in the MCLR Reset path.
The filter will detect and ignore small pulses.
5.5.2 MCLR DISABLED
When MCLR is disabled, the pin functions as a general
purpose input and the internal weak pull-up is under
software control. See Section 13.9 “PORTE Regis-
ters” for more information.
5.6 Watchdog Timer (WDT) Reset
The Watchdog Timer generates a Reset if the firmware
does not issue a CLRWDT instruction within the time-out
period. The TO and PD bits in the STATUS register are
changed to indicate the WDT Reset. See Section 11.0
“Watchdog Timer (WDT)” for more information.
5.7 RESET Instruction
A RESET instruction will cause a device Reset. The RI
bit in the PCON register will be set to ‘0’. See Ta b l e 5 - 4
for default conditions after a RESET instruction has
occurred.
5.8 Stack Overflow/Underflow Reset
The device can reset when the Stack Overflows or
Underflows. The STKOVF or STKUNF bits of the PCON
register indicate the Reset condition. These Resets are
enabled by setting the STVREN bit in Configuration
Words. See Section 5.8 “Stack Overflow/Underflow
Reset” for more information.
5.9 Programming Mode Exit
Upon exit of Programming mode, the device will
behave as if a POR had just occurred.
5.10 Power-up Timer
The Power-up Timer optionally delays device execution
after a BOR or POR event. This timer is typically used to
allow VDD to stabilize before allowing the device to start
running.
The Power-up Timer is controlled by the PWRTE bit of
Configuration Words.
5.11 Start-up Sequence
Upon the release of a POR or BOR, the following must
occur before the device will begin executing:
1. Power-up Timer runs to completion (if enabled).
2. Oscillator start-up timer runs to completion (if
required for oscillator source).
3. MCLR must be released (if enabled).
The total time-out will vary based on oscillator configu-
ration and Power-up Timer configuration. See
Section 6.0 “Oscillator Module (with Fail-Safe
Clock Monitor)” for more information.
The Power-up Timer and oscillator start-up timer run
independently of MCLR Reset. If MCLR is kept low
long enough, the Power-up Timer and oscillator
start-up timer will expire. Upon bringing MCLR high, the
device will begin execution immediately (see
Figure 5-3). This is useful for testing purposes or to
synchronize more than one device operating in parallel.
TABLE 5-2: MCLR CONFIGURATION
MCLRE LVP MCLR
00Disabled
10Enabled
x1Enabled
Note: A Reset does not drive the MCLR pin low.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 53
PIC16(L)F1782/3
FIGURE 5-3: RESET START-UP SEQUENCE
TOST
TMCLR
TPWRT
VDD
Internal POR
Power-up Timer
MCLR
Internal RESET
Oscillator Modes
Oscillator Start-up Timer
Oscillator
FOSC
Internal Oscillator
Oscillator
FOSC
External Clock (EC)
CLKIN
FOSC
External Crystal
PIC16(L)F1782/3
DS41579C-page 54 Preliminary 2011-2012 Microchip Technology Inc.
5.12 Determining the Cause of a Reset
Upon any Reset, multiple bits in the STATUS and
PCON register are updated to indicate the cause of the
Reset. Ta ble 5 - 3 and Ta b l e 5- 4 show the Reset condi-
tions of these registers.
TABLE 5-3: RESET STATUS BITS AND THEIR SIGNIFICANCE
TABLE 5-4: RESET CONDITION FOR SPECIAL REGISTERS
STKOVF STKUNF RWDT RMCLR RI POR BOR TO PD Condition
0 0 1 1 10 x11Power-on Reset
0 0 1 1 10 x0xIllegal, TO is set on POR
0 0 1 1 10 xx0Illegal, PD is set on POR
0 0 u 1 1u 011Brown-out Reset
u u 0 u uu u0uWDT Reset
u u u u uu u00WDT Wake-up from Sleep
u u u u uu u10Interrupt Wake-up from Sleep
u u u 0 uu uuuMCLR Reset during normal operation
u u u 0 uu u10MCLR Reset during Sleep
u u u u 0 u u u u RESET Instruction Executed
1 u u u uu uuuStack Overflow Reset (STVREN = 1)
u 1 u u uu uuuStack Underflow Reset (STVREN = 1)
Condition Program
Counter
STATUS
Register
PCON
Register
Power-on Reset 0000h ---1 1000 00-1 110x
MCLR Reset during normal operation 0000h ---u uuuu uu-u 0uuu
MCLR Reset during Sleep 0000h ---1 0uuu uu-u 0uuu
WDT Reset 0000h ---0 uuuu uu-0 uuuu
WDT Wake-up from Sleep PC + 1 ---0 0uuu uu-u uuuu
Brown-out Reset 0000h ---1 1uuu 00-1 11u0
Interrupt Wake-up from Sleep PC + 1(1) ---1 0uuu uu-u uuuu
RESET Instruction Executed 0000h ---u uuuu uu-u u0uu
Stack Overflow Reset (STVREN = 1) 0000h ---u uuuu 1u-u uuuu
Stack Underflow Reset (STVREN = 1) 0000h ---u uuuu u1-u uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’.
Note 1: When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed on
the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 55
PIC16(L)F1782/3
5.13 Power Control (PCON) Register
The Power Control (PCON) register contains flag bits
to differentiate between a:
• Power-on Reset (POR)
• Brown-out Reset (BOR)
• Reset Instruction Reset (RI)
•MCLR Reset (RMCLR)
• Watchdog Timer Reset (RWDT)
• Stack Underflow Reset (STKUNF)
• Stack Overflow Reset (STKOVF)
The PCON register bits are shown in Register 5-2.
5.14 Register Definitions: Power Control
REGISTER 5-2: PCON: POWER CONTROL REGISTER
R/W/HS-0/q R/W/HS-0/q U-0 R/W/HC-1/q R/W/HC-1/q R/W/HC-1/q R/W/HC-q/u R/W/HC-q/u
STKOVF STKUNF —RWDT RMCLR RI POR BOR
bit 7 bit 0
Legend:
HC = Bit is cleared by hardware HS = Bit is set by hardware
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -m/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7 STKOVF: Stack Overflow Flag bit
1 = A Stack Overflow occurred
0 = A Stack Overflow has not occurred or cleared by firmware
bit 6 STKUNF: Stack Underflow Flag bit
1 = A Stack Underflow occurred
0 = A Stack Underflow has not occurred or cleared by firmware
bit 5 Unimplemented: Read as ‘0’
bit 4 RWDT: Watchdog Timer Reset Flag bit
1 = A Watchdog Timer Reset has not occurred or set to ‘1’ by firmware
0 = A Watchdog Timer Reset has occurred (cleared by hardware)
bit 3 RMCLR: MCLR Reset Flag bit
1 = A MCLR Reset has not occurred or set to ‘1’ by firmware
0 = A MCLR Reset has occurred (cleared by hardware)
bit 2 RI: RESET Instruction Flag bit
1 = A RESET instruction has not been executed or set to ‘1’ by firmware
0 = A RESET instruction has been executed (cleared by hardware)
bit 1 POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR: Brown-out Reset Status bit
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset
occurs)
PIC16(L)F1782/3
DS41579C-page 56 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 5-5: SUMMARY OF REGISTERS ASSOCIATED WITH RESETS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BORCON SBOREN BORFS ————— BORRDY 51
PCON STKOVF STKUNF —RWDTRMCLR RI POR BOR 55
STATUS — — —TOPD ZDC C23
WDTCON —— WDTPS<4:0> SWDTEN 101
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Resets.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 57
PIC16(L)F1782/3
6.0 OSCILLATOR MODULE (WITH
FAIL-SAFE CLOCK MONITOR)
6.1 Overview
The oscillator module has a wide variety of clock
sources and selection features that allow it to be used
in a wide range of applications while maximizing perfor-
mance and minimizing power consumption. Figure 6-1
illustrates a block diagram of the oscillator module.
Clock sources can be supplied from external oscillators,
quartz crystal resonators, ceramic resonators and
Resistor-Capacitor (RC) circuits. In addition, the system
clock source can be supplied from one of two internal
oscillators and PLL circuits, with a choice of speeds
selectable via software. Additional clock features
include:
• Selectable system clock source between external
or internal sources via software.
• Two-Speed Start-up mode, which minimizes
latency between external oscillator start-up and
code execution.
• Fail-Safe Clock Monitor (FSCM) designed to
detect a failure of the external clock source (LP,
XT, HS, EC or RC modes) and switch
automatically to the internal oscillator.
• Oscillator Start-up Timer (OST) ensures stability
of crystal oscillator sources
The oscillator module can be configured in one of eight
clock modes.
1. ECL – External Clock Low-Power mode
(0 MHz to 0.5 MHz)
2. ECM – External Clock Medium-Power mode
(0.5 MHz to 4 MHz)
3. ECH – External Clock High-Power mode
(4 MHz to 32 MHz)
4. LP – 32 kHz Low-Power Crystal mode.
5. XT – Medium Gain Crystal or Ceramic Resonator
Oscillator mode (up to 4 MHz)
6. HS – High Gain Crystal or Ceramic Resonator
mode (4 MHz to 20 MHz)
7. RC – External Resistor-Capacitor (RC).
8. INTOSC – Internal oscillator (31 kHz to 32 MHz).
Clock Source modes are selected by the FOSC<2:0>
bits in the Configuration Words. The FOSC bits
determine the type of oscillator that will be used when
the device is first powered.
The EC clock mode relies on an external logic level
signal as the device clock source. The LP, XT, and HS
clock modes require an external crystal or resonator to
be connected to the device. Each mode is optimized for
a different frequency range. The RC clock mode
requires an external resistor and capacitor to set the
oscillator frequency.
The INTOSC internal oscillator block produces low,
medium, and high-frequency clock sources,
designated LFINTOSC, MFINTOSC and HFINTOSC.
(see Internal Oscillator Block, Figure 6-1). A wide
selection of device clock frequencies may be derived
from these three clock sources.
PIC16(L)F1782/3
DS41579C-page 58 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 6-1: SIMPLIFIED PIC® MCU CLOCK SOURCE BLOCK DIAGRAM
Oscillator
T1OSCEN
Enable
Oscillator
T1OSO
T1OSI
Timer1 Clock Source Option
for other modules
OSC1
OSC2
Sleep
LP, XT, HS, RC, EC
T1OSC
To CPU and
Postscaler
MUX
16 MHz
8 MHz
4 MHz
2 MHz
1 MHz
250 kHz
500 kHz
IRCF<3:0>
31 kHz
500 kHz
Source
Internal
Oscillator
Block
WDT, PWRT, Fail-Safe Clock Monitor
16 MHz
INTOSC
(HFINTOSC)
SCS<1:0>
HFPLL
31 kHz (LFINTOSC)
Two-Speed Start-up and other modules
Oscillator
31 kHz
Source
500 kHz
(MFINTOSC)
125 kHz
31.25 kHz
62.5 kHz
Peripherals
Sleep
External
Timer1
4 x PLL
÷ 2
PSMC 64 MHz
1X
01
00
00
01
10
0
1
1
0
PRIMUX PSMCMUX
PLLMUX
0000
1111
SCS FOSC<2:0> PLLEN or
SPLLEN PRIMUX PSMCMUX PLLMUX
=00
=100 01110
11101
≠100 00110
1(1) 0000
≠00 XXX X X 1 XX
Note 1: This selection should not be made when the PSMC is using the 64 MHz clock option.
FOSC
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 59
PIC16(L)F1782/3
6.2 Clock Source Types
Clock sources can be classified as external or internal.
External clock sources rely on external circuitry for the
clock source to function. Examples are: oscillator mod-
ules (EC mode), quartz crystal resonators or ceramic
resonators (LP, XT and HS modes) and Resis-
tor-Capacitor (RC) mode circuits.
Internal clock sources are contained within the oscilla-
tor module. The internal oscillator block has two inter-
nal oscillators and a dedicated Phase-Lock Loop
(HFPLL) that are used to generate three internal sys-
tem clock sources: the 16 MHz High-Frequency Inter-
nal Oscillator (HFINTOSC), 500 kHz (MFINTOSC) and
the 31 kHz Low-Frequency Internal Oscillator (LFIN-
TOSC).
The system clock can be selected between external or
internal clock sources via the System Clock Select
(SCS) bits in the OSCCON register. See Section 6.3
“Clock Switching” for additional information.
6.2.1 EXTERNAL CLOCK SOURCES
An external clock source can be used as the device
system clock by performing one of the following
actions:
• Program the FOSC<2:0> bits in the Configuration
Words to select an external clock source that will
be used as the default system clock upon a
device Reset.
• Write the SCS<1:0> bits in the OSCCON register
to switch the system clock source to:
- Timer1 oscillator during run-time, or
- An external clock source determined by the
value of the FOSC bits.
See Section 6.3 “Clock Switching”for more informa-
tion.
6.2.1.1 EC Mode
The External Clock (EC) mode allows an externally
generated logic level signal to be the system clock
source. When operating in this mode, an external clock
source is connected to the OSC1 input.
OSC2/CLKOUT is available for general purpose I/O or
CLKOUT. Figure 6-2 shows the pin connections for EC
mode.
EC mode has 3 power modes to select from through
Configuration Words:
• High power, 4-32 MHz (FOSC = 111)
• Medium power, 0.5-4 MHz (FOSC = 110)
• Low power, 0-0.5 MHz (FOSC = 101)
The Oscillator Start-up Timer (OST) is disabled when
EC mode is selected. Therefore, there is no delay in
operation after a Power-on Reset (POR) or wake-up
from Sleep. Because the PIC® MCU design is fully
static, stopping the external clock input will have the
effect of halting the device while leaving all data intact.
Upon restarting the external clock, the device will
resume operation as if no time had elapsed.
FIGURE 6-2: EXTERNAL CLOCK (EC)
MODE OPERATION
6.2.1.2 LP, XT, HS Modes
The LP, XT and HS modes support the use of quartz
crystal resonators or ceramic resonators connected to
OSC1 and OSC2 (Figure 6-3). The three modes select
a low, medium or high gain setting of the internal
inverter-amplifier to support various resonator types
and speed.
LP Oscillator mode selects the lowest gain setting of the
internal inverter-amplifier. LP mode current consumption
is the least of the three modes. This mode is designed to
drive only 32.768 kHz tuning-fork type crystals (watch
crystals).
XT Oscillator mode selects the intermediate gain
setting of the internal inverter-amplifier. XT mode
current consumption is the medium of the three modes.
This mode is best suited to drive resonators with a
medium drive level specification.
HS Oscillator mode selects the highest gain setting of the
internal inverter-amplifier. HS mode current consumption
is the highest of the three modes. This mode is best
suited for resonators that require a high drive setting.
Figure 6-3 and Figure 6-4 show typical circuits for
quartz crystal and ceramic resonators, respectively.
OSC1/CLKIN
OSC2/CLKOUT
Clock from
Ext. System
PIC® MCU
FOSC/4 or I/O(1)
Note 1: Output depends upon CLKOUTEN bit of the
Configuration Words.
PIC16(L)F1782/3
DS41579C-page 60 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 6-3: QUARTZ CRYSTAL
OPERATION (LP, XT OR
HS MODE)
FIGURE 6-4: CERAMIC RESONATOR
OPERATION
(XT OR HS MODE)
6.2.1.3 Oscillator Start-up Timer (OST)
If the oscillator module is configured for LP, XT or HS
modes, the Oscillator Start-up Timer (OST) counts
1024 oscillations from OSC1. This occurs following a
Power-on Reset (POR) and when the Power-up Timer
(PWRT) has expired (if configured), or a wake-up from
Sleep. During this time, the program counter does not
increment and program execution is suspended. The
OST ensures that the oscillator circuit, using a quartz
crystal resonator or ceramic resonator, has started and
is providing a stable system clock to the oscillator
module.
In order to minimize latency between external oscillator
start-up and code execution, the Two-Speed Clock
Start-up mode can be selected (see Section 6.4
“Two-Speed Clock Start-up Mode”).
Note 1: Quartz crystal characteristics vary
according to type, package and
manufacturer. The user should consult the
manufacturer data sheets for specifications
and recommended application.
2: Always verify oscillator performance over
the VDD and temperature range that is
expected for the application.
3: For oscillator design assistance, reference
the following Microchip Applications Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC® and PIC®
Devices” (DS00826)
• AN849, “Basic PIC® Oscillator Design”
(DS00849)
• AN943, “Practical PIC® Oscillator
Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work”
(DS00949)
Note 1: A series resistor (RS) may be required for
quartz crystals with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 M to 10 M.
C1
C2
Quartz
RS(1)
OSC1/CLKIN
RF(2) Sleep
To Internal
Logic
PIC® MCU
Crystal
OSC2/CLKOUT
Note 1: A series resistor (RS) may be required for
ceramic resonators with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 M to 10 M.
3: An additional parallel feedback resistor (RP)
may be required for proper ceramic resonator
operation.
C1
C2 Ceramic RS(1)
OSC1/CLKIN
RF(2) Sleep
To Internal
Logic
PIC® MCU
RP(3)
Resonator
OSC2/CLKOUT
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 61
PIC16(L)F1782/3
6.2.1.4 4x PLL
The oscillator module contains a 4x PLL that can be
used with both external and internal clock sources to
provide a system clock source. The input frequency for
the 4x PLL must fall within specifications. See the PLL
Clock Timing Specifications in Section 30.0
“Electrical Specifications”.
The 4x PLL may be enabled for use by one of two
methods:
1. Program the PLLEN bit in Configuration Words
to a ‘1’.
2. Write the SPLLEN bit in the OSCCON register to
a ‘1’. If the PLLEN bit in Configuration Words is
programmed to a ‘1’, then the value of SPLLEN
is ignored.
6.2.1.5 TIMER1 Oscillator
The Timer1 Oscillator is a separate crystal oscillator
that is associated with the Timer1 peripheral. It is opti-
mized for timekeeping operations with a 32.768 kHz
crystal connected between the T1OSO and T1OSI
device pins.
The Timer1 Oscillator can be used as an alternate sys-
tem clock source and can be selected during run-time
using clock switching. Refer to Section 6.3 “Clock
Switching” for more information.
FIGURE 6-5: QUARTZ CRYSTAL
OPERATION (TIMER1
OSCILLATOR)
C1
C2
32.768 kHz
T1OSI
To Internal
Logic
PIC® MCU
Crystal
T1OSO
Quartz
Note 1: Quartz crystal characteristics vary
according to type, package and
manufacturer. The user should consult the
manufacturer data sheets for specifications
and recommended application.
2: Always verify oscillator performance over
the VDD and temperature range that is
expected for the application.
3: For oscillator design assistance, reference
the following Microchip Applications Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC® and PIC®
Devices” (DS00826)
• AN849, “Basic PIC® Oscillator Design”
(DS00849)
• AN943, “Practical PIC® Oscillator
Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work”
(DS00949)
• TB097, “Interfacing a Micro Crystal
MS1V-T1K 32.768 kHz Tuning Fork
Crystal to a PIC16F690/SS” (DS91097)
• AN1288, “Design Practices for
Low-Power External Oscillators”
(DS01288)
PIC16(L)F1782/3
DS41579C-page 62 Preliminary 2011-2012 Microchip Technology Inc.
6.2.1.6 External RC Mode
The external Resistor-Capacitor (RC) modes support
the use of an external RC circuit. This allows the
designer maximum flexibility in frequency choice while
keeping costs to a minimum when clock accuracy is not
required.
The RC circuit connects to OSC1. OSC2/CLKOUT is
available for general purpose I/O or CLKOUT. The
function of the OSC2/CLKOUT pin is determined by the
CLKOUTEN bit in Configuration Words.
Figure 6-6 shows the external RC mode connections.
FIGURE 6-6: EXTERNAL RC MODES
The RC oscillator frequency is a function of the supply
voltage, the resistor (REXT) and capacitor (CEXT) values
and the operating temperature. Other factors affecting
the oscillator frequency are:
• threshold voltage variation
• component tolerances
• packaging variations in capacitance
The user also needs to take into account variation due
to tolerance of external RC components used.
6.2.2 INTERNAL CLOCK SOURCES
The device may be configured to use the internal oscil-
lator block as the system clock by performing one of the
following actions:
• Program the FOSC<2:0> bits in Configuration
Words to select the INTOSC clock source, which
will be used as the default system clock upon a
device Reset.
• Write the SCS<1:0> bits in the OSCCON register
to switch the system clock source to the internal
oscillator during run-time. See Section 6.3
“Clock Switching”for more information.
In INTOSC mode, OSC1/CLKIN is available for general
purpose I/O. OSC2/CLKOUT is available for general
purpose I/O or CLKOUT.
The function of the OSC2/CLKOUT pin is determined
by the CLKOUTEN bit in Configuration Words.
The internal oscillator block has two independent
oscillators and a dedicated Phase-Lock Loop, HFPLL
that can produce one of three internal system clock
sources.
1. The HFINTOSC (High-Frequency Internal
Oscillator) is factory calibrated and operates at
16 MHz. The HFINTOSC source is generated
from the 500 kHz MFINTOSC source and the
dedicated Phase-Lock Loop, HFPLL. The
frequency of the HFINTOSC can be
user-adjusted via software using the OSCTUNE
register (Register 6-3).
2. The MFINTOSC (Medium-Frequency Internal
Oscillator) is factory calibrated and operates at
500 kHz. The frequency of the MFINTOSC can
be user-adjusted via software using the
OSCTUNE register (Register 6-3).
3. The LFINTOSC (Low-Frequency Internal
Oscillator) is uncalibrated and operates at
31 kHz.
OSC2/CLKOUT
CEXT
REXT
PIC® MCU
OSC1/CLKIN
FOSC/4 or
Internal
Clock
VDD
VSS
Recommended values: 10 k REXT 100 k, <3V
3 k REXT 100 k, 3-5V
CEXT > 20 pF, 2-5V
Note 1: Output depends upon CLKOUTEN bit of the
Configuration Words.
I/O(1)
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 63
PIC16(L)F1782/3
6.2.2.1 HFINTOSC
The High-Frequency Internal Oscillator (HFINTOSC) is
a factory calibrated 16 MHz internal clock source. The
frequency of the HFINTOSC can be altered via
software using the OSCTUNE register (Register 6-3).
The output of the HFINTOSC connects to a postscaler
and multiplexer (see Figure 6-1). One of multiple
frequencies derived from the HFINTOSC can be
selected via software using the IRCF<3:0> bits of the
OSCCON register. See Section 6.2.2.7 “Internal
Oscillator Clock Switch Timing” for more information.
The HFINTOSC is enabled by:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired HF frequency, and
•FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’.
A fast startup oscillator allows internal circuits to power
up and stabilize before switching to HFINTOSC.
The High Frequency Internal Oscillator Ready bit
(HFIOFR) of the OSCSTAT register indicates when the
HFINTOSC is running.
The High Frequency Internal Oscillator Status Locked
bit (HFIOFL) of the OSCSTAT register indicates when
the HFINTOSC is running within 2% of its final value.
The High Frequency Internal Oscillator Stable bit
(HFIOFS) of the OSCSTAT register indicates when the
HFINTOSC is running within 0.5% of its final value.
6.2.2.2 MFINTOSC
The Medium-Frequency Internal Oscillator
(MFINTOSC) is a factory calibrated 500 kHz internal
clock source. The frequency of the MFINTOSC can be
altered via software using the OSCTUNE register
(Register 6-3).
The output of the MFINTOSC connects to a postscaler
and multiplexer (see Figure 6-1). One of nine
frequencies derived from the MFINTOSC can be
selected via software using the IRCF<3:0> bits of the
OSCCON register. See Section 6.2.2.7 “Internal
Oscillator Clock Switch Timing” for more information.
The MFINTOSC is enabled by:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired HF frequency, and
•FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’
The Medium Frequency Internal Oscillator Ready bit
(MFIOFR) of the OSCSTAT register indicates when the
MFINTOSC is running.
6.2.2.3 Internal Oscillator Frequency
Adjustment
The 500 kHz internal oscillator is factory calibrated.
This internal oscillator can be adjusted in software by
writing to the OSCTUNE register (Register 6-3). Since
the HFINTOSC and MFINTOSC clock sources are
derived from the 500 kHz internal oscillator a change in
the OSCTUNE register value will apply to both.
The default value of the OSCTUNE register is ‘0’. The
value is a 6-bit two’s complement number. A value of
1Fh will provide an adjustment to the maximum
frequency. A value of 20h will provide an adjustment to
the minimum frequency.
When the OSCTUNE register is modified, the oscillator
frequency will begin shifting to the new frequency. Code
execution continues during this shift. There is no
indication that the shift has occurred.
OSCTUNE does not affect the LFINTOSC frequency.
Operation of features that depend on the LFINTOSC
clock source frequency, such as the Power-up Timer
(PWRT), Watchdog Timer (WDT), Fail-Safe Clock
Monitor (FSCM) and peripherals, are not affected by the
change in frequency.
6.2.2.4 LFINTOSC
The Low-Frequency Internal Oscillator (LFINTOSC) is
an uncalibrated 31 kHz internal clock source.
The output of the LFINTOSC connects to a multiplexer
(see Figure 6-1). Select 31 kHz, via software, using the
IRCF<3:0> bits of the OSCCON register. See
Section 6.2.2.7 “Internal Oscillator Clock Switch
Timing” for more information. The LFINTOSC is also
the frequency for the Power-up Timer (PWRT),
Watchdog Timer (WDT) and Fail-Safe Clock Monitor
(FSCM).
The LFINTOSC is enabled by selecting 31 kHz
(IRCF<3:0> bits of the OSCCON register = 000) as the
system clock source (SCS bits of the OSCCON
register = 1x), or when any of the following are
enabled:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired LF frequency, and
•FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’
Peripherals that use the LFINTOSC are:
• Power-up Timer (PWRT)
• Watchdog Timer (WDT)
• Fail-Safe Clock Monitor (FSCM)
The Low-Frequency Internal Oscillator Ready bit
(LFIOFR) of the OSCSTAT register indicates when the
LFINTOSC is running.
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DS41579C-page 64 Preliminary 2011-2012 Microchip Technology Inc.
6.2.2.5 Internal Oscillator Frequency
Selection
The system clock speed can be selected via software
using the Internal Oscillator Frequency Select bits
IRCF<3:0> of the OSCCON register.
The output of the 16 MHz HFINTOSC, 500 kHz
MFINTOSC, and 31 kHz LFINTOSC connects to a
postscaler and multiplexer (see Figure 6-1). The
Internal Oscillator Frequency Select bits IRCF<3:0> of
the OSCCON register select the frequency output of the
internal oscillators. One of the following frequencies
can be selected via software:
- 32 MHz (requires 4x PLL)
-16 MHz
-8 MHz
-4 MHz
-2 MHz
-1 MHz
- 500 kHz (Default after Reset)
- 250 kHz
- 125 kHz
- 62.5 kHz
- 31.25 kHz
- 31 kHz (LFINTOSC)
The IRCF<3:0> bits of the OSCCON register allow
duplicate selections for some frequencies. These dupli-
cate choices can offer system design trade-offs. Lower
power consumption can be obtained when changing
oscillator sources for a given frequency. Faster transi-
tion times can be obtained between frequency changes
that use the same oscillator source.
6.2.2.6 32 MHz Internal Oscillator
Frequency Selection
The Internal Oscillator Block can be used with the
4x PLL associated with the External Oscillator Block to
produce a 32 MHz internal system clock source. The
following settings are required to use the 32 MHz inter-
nal clock source:
• The FOSC bits in Configuration Words must be
set to use the INTOSC source as the device sys-
tem clock (FOSC<2:0> = 100).
• The SCS bits in the OSCCON register must be
cleared to use the clock determined by
FOSC<2:0> in Configuration Words
(SCS<1:0> = 00).
• The IRCF bits in the OSCCON register must be
set to the 8 MHz or 16 MHz HFINTOSC set to use
(IRCF<3:0> = 111x).
• The SPLLEN bit in the OSCCON register must be
set to enable the 4x PLL, or the PLLEN bit of the
Configuration Words must be programmed to a
‘1’.
The 4x PLL is not available for use with the internal
oscillator when the SCS bits of the OSCCON register
are set to ‘1x’. The SCS bits must be set to ‘00’ to use
the 4x PLL with the internal oscillator.
Note: Following any Reset, the IRCF<3:0> bits
of the OSCCON register are set to ‘0111’
and the frequency selection is set to
500 kHz. The user can modify the IRCF
bits to select a different frequency.
Note: When using the PLLEN bit of the
Configuration Words, the 4x PLL cannot
be disabled by software and the SPLLEN
option will not be available.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 65
PIC16(L)F1782/3
6.2.2.7 Internal Oscillator Clock Switch
Timing
When switching between the HFINTOSC, MFINTOSC
and the LFINTOSC, the new oscillator may already be
shut down to save power (see Figure 6-7). If this is the
case, there is a delay after the IRCF<3:0> bits of the
OSCCON register are modified before the frequency
selection takes place. The OSCSTAT register will
reflect the current active status of the HFINTOSC,
MFINTOSC and LFINTOSC oscillators. The sequence
of a frequency selection is as follows:
1. IRCF<3:0> bits of the OSCCON register are
modified.
2. If the new clock is shut down, a clock start-up
delay is started.
3. Clock switch circuitry waits for a falling edge of
the current clock.
4. The current clock is held low and the clock
switch circuitry waits for a rising edge in the new
clock.
5. The new clock is now active.
6. The OSCSTAT register is updated as required.
7. Clock switch is complete.
See Figure 6-7 for more details.
If the internal oscillator speed is switched between two
clocks of the same source, there is no start-up delay
before the new frequency is selected. Clock switching
time delays are shown in Table 6-1.
Start-up delay specifications are located in the
oscillator tables of Section 30.0 “Electrical
Specifications”.
PIC16(L)F1782/3
DS41579C-page 66 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 6-7: INTERNAL OSCILLATOR SWITCH TIMING
HFINTOSC/
LFINTOSC
IRCF <3:0>
System Clock
HFINTOSC/
LFINTOSC
IRCF <3:0>
System Clock
00
00
Start-up Time 2-cycle Sync Running
2-cycle Sync Running
HFINTOSC/ LFINTOSC (FSCM and WDT disabled)
HFINTOSC/ LFINTOSC (Either FSCM or WDT enabled)
LFINTOSC
HFINTOSC/
IRCF <3:0>
System Clock
= 0 0
Start-up Time 2-cycle Sync Running
LFINTOSC HFINTOSC/MFINTOSC LFINTOSC turns off unless WDT or FSCM is enabled
MFINTOSC
MFINTOSC
MFINTOSC
MFINTOSC
MFINTOSC
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 67
PIC16(L)F1782/3
6.3 Clock Switching
The system clock source can be switched between
external and internal clock sources via software using
the System Clock Select (SCS) bits of the OSCCON
register. The following clock sources can be selected
using the SCS bits:
• Default system oscillator determined by FOSC
bits in Configuration Words
• Timer1 32 kHz crystal oscillator
• Internal Oscillator Block (INTOSC)
6.3.1 SYSTEM CLOCK SELECT (SCS)
BITS
The System Clock Select (SCS) bits of the OSCCON
register selects the system clock source that is used for
the CPU and peripherals.
• When the SCS bits of the OSCCON register = 00,
the system clock source is determined by value of
the FOSC<2:0> bits in the Configuration Words.
• When the SCS bits of the OSCCON register = 01,
the system clock source is the Timer1 oscillator.
• When the SCS bits of the OSCCON register = 1x,
the system clock source is chosen by the internal
oscillator frequency selected by the IRCF<3:0>
bits of the OSCCON register. After a Reset, the
SCS bits of the OSCCON register are always
cleared.
When switching between clock sources, a delay is
required to allow the new clock to stabilize. These oscil-
lator delays are shown in Table 6-1.
6.3.2 OSCILLATOR START-UP TIME-OUT
STATUS (OSTS) BIT
The Oscillator Start-up Time-out Status (OSTS) bit of
the OSCSTAT register indicates whether the system
clock is running from the external clock source, as
defined by the FOSC<2:0> bits in the Configuration
Words, or from the internal clock source. In particular,
OSTS indicates that the Oscillator Start-up Timer
(OST) has timed out for LP, XT or HS modes. The OST
does not reflect the status of the Timer1 oscillator.
6.3.3 TIMER1 OSCILLATOR
The Timer1 oscillator is a separate crystal oscillator
associated with the Timer1 peripheral. It is optimized
for timekeeping operations with a 32.768 kHz crystal
connected between the T1OSO and T1OSI device
pins.
The Timer1 oscillator is enabled using the T1OSCEN
control bit in the T1CON register. See Section 22.0
“Timer1 Module with Gate Control” for more
information about the Timer1 peripheral.
6.3.4 TIMER1 OSCILLATOR READY
(T1OSCR) BIT
The user must ensure that the Timer1 oscillator is
ready to be used before it is selected as a system clock
source. The Timer1 Oscillator Ready (T1OSCR) bit of
the OSCSTAT register indicates whether the Timer1
oscillator is ready to be used. After the T1OSCR bit is
set, the SCS bits can be configured to select the Timer1
oscillator.
Note: Any automatic clock switch, which may
occur from Two-Speed Start-up or
Fail-Safe Clock Monitor, does not update
the SCS bits of the OSCCON register. The
user can monitor the OSTS bit of the
OSCSTAT register to determine the current
system clock source.
PIC16(L)F1782/3
DS41579C-page 68 Preliminary 2011-2012 Microchip Technology Inc.
6.4 Two-Speed Clock Start-up Mode
Two-Speed Start-up mode provides additional power
savings by minimizing the latency between external
oscillator start-up and code execution. In applications
that make heavy use of the Sleep mode, Two-Speed
Start-up will remove the external oscillator start-up
time from the time spent awake and can reduce the
overall power consumption of the device. This mode
allows the application to wake-up from Sleep, perform
a few instructions using the INTOSC internal oscillator
block as the clock source and go back to Sleep without
waiting for the external oscillator to become stable.
Two-Speed Start-up provides benefits when the oscil-
lator module is configured for LP, XT or HS modes.
The Oscillator Start-up Timer (OST) is enabled for
these modes and must count 1024 oscillations before
the oscillator can be used as the system clock source.
If the oscillator module is configured for any mode
other than LP, XT or HS mode, then Two-Speed
Start-up is disabled. This is because the external clock
oscillator does not require any stabilization time after
POR or an exit from Sleep.
If the OST count reaches 1024 before the device
enters Sleep mode, the OSTS bit of the OSCSTAT reg-
ister is set and program execution switches to the
external oscillator. However, the system may never
operate from the external oscillator if the time spent
awake is very short.
6.4.1 TWO-SPEED START-UP MODE
CONFIGURATION
Two-Speed Start-up mode is configured by the
following settings:
• IESO (of the Configuration Words) = 1; Inter-
nal/External Switchover bit (Two-Speed Start-up
mode enabled).
• SCS (of the OSCCON register) = 00.
• FOSC<2:0> bits in the Configuration Words
configured for LP, XT or HS mode.
Two-Speed Start-up mode is entered after:
• Power-on Reset (POR) and, if enabled, after
Power-up Timer (PWRT) has expired, or
• Wake-up from Sleep.
TABLE 6-1: OSCILLATOR SWITCHING DELAYS
Note: Executing a SLEEP instruction will abort
the oscillator start-up time and will cause
the OSTS bit of the OSCSTAT register to
remain clear.
Switch From Switch To Frequency Oscillator Delay
Sleep/POR
LFINTOSC(1)
MFINTOSC(1)
HFINTOSC(1)
31 kHz
31.25 kHz-500 kHz
31.25kHz-16MHz
Oscillator Warm-up Delay (TWARM)
Sleep/POR EC, RC(1) DC – 32 MHz 2 cycles
LFINTOSC EC, RC(1) DC – 32 MHz 1 cycle of each
Sleep/POR Timer1 Oscillator
LP, XT, HS(1) 32 kHz-20 MHz 1024 Clock Cycles (OST)
Any clock source MFINTOSC(1)
HFINTOSC(1)
31.25 kHz-500 kHz
31.25kHz-16MHz 2s (approx.)
Any clock source LFINTOSC(1) 31 kHz 1 cycle of each
Any clock source Timer1 Oscillator 32 kHz 1024 Clock Cycles (OST)
PLL inactive PLL active 16-32 MHz 2 ms (approx.)
Note 1: PLL inactive.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 69
PIC16(L)F1782/3
6.4.2 TWO-SPEED START-UP
SEQUENCE
1. Wake-up from Power-on Reset or Sleep.
2. Instructions begin execution by the internal
oscillator at the frequency set in the IRCF<3:0>
bits of the OSCCON register.
3. OST enabled to count 1024 clock cycles.
4. OST timed out, wait for falling edge of the
internal oscillator.
5. OSTS is set.
6. System clock held low until the next falling edge
of new clock (LP, XT or HS mode).
7. System clock is switched to external clock
source.
6.4.3 CHECKING TWO-SPEED CLOCK
STATUS
Checking the state of the OSTS bit of the OSCSTAT
register will confirm if the microcontroller is running
from the external clock source, as defined by the
FOSC<2:0> bits in the Configuration Words, or the
internal oscillator.
FIGURE 6-8: TWO-SPEED START-UP
0 1 1022 1023
PC + 1
TOSTT
INTOSC
OSC1
OSC2
Program Counter
System Clock
PC - N PC
PIC16(L)F1782/3
DS41579C-page 70 Preliminary 2011-2012 Microchip Technology Inc.
6.5 Fail-Safe Clock Monitor
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue operating should the external oscillator fail.
The FSCM can detect oscillator failure any time after
the Oscillator Start-up Timer (OST) has expired. The
FSCM is enabled by setting the FCMEN bit in the
Configuration Words. The FSCM is applicable to all
external Oscillator modes (LP, XT, HS, EC, Timer1
Oscillator and RC).
FIGURE 6-9: FSCM BLOCK DIAGRAM
6.5.1 FAIL-SAFE DETECTION
The FSCM module detects a failed oscillator by
comparing the external oscillator to the FSCM sample
clock. The sample clock is generated by dividing the
LFINTOSC by 64. See Figure 6-9. Inside the fail
detector block is a latch. The external clock sets the
latch on each falling edge of the external clock. The
sample clock clears the latch on each rising edge of the
sample clock. A failure is detected when an entire
half-cycle of the sample clock elapses before the
external clock goes low.
6.5.2 FAIL-SAFE OPERATION
When the external clock fails, the FSCM switches the
device clock to an internal clock source and sets the bit
flag OSFIF of the PIR2 register. Setting this flag will
generate an interrupt if the OSFIE bit of the PIE2
register is also set. The device firmware can then take
steps to mitigate the problems that may arise from a
failed clock. The system clock will continue to be
sourced from the internal clock source until the device
firmware successfully restarts the external oscillator
and switches back to external operation.
The internal clock source chosen by the FSCM is
determined by the IRCF<3:0> bits of the OSCCON
register. This allows the internal oscillator to be
configured before a failure occurs.
6.5.3 FAIL-SAFE CONDITION CLEARING
The Fail-Safe condition is cleared after a Reset,
executing a SLEEP instruction or changing the SCS bits
of the OSCCON register. When the SCS bits are
changed, the OST is restarted. While the OST is
running, the device continues to operate from the
INTOSC selected in OSCCON. When the OST times
out, the Fail-Safe condition is cleared after successfully
switching to the external clock source. The OSFIF bit
should be cleared prior to switching to the external
clock source. If the Fail-Safe condition still exists, the
OSFIF flage will again become set by hardware.
6.5.4 RESET OR WAKE-UP FROM SLEEP
The FSCM is designed to detect an oscillator failure
after the Oscillator Start-up Timer (OST) has expired.
The OST is used after waking up from Sleep and after
any type of Reset. The OST is not used with the EC or
RC Clock modes so that the FSCM will be active as
soon as the Reset or wake-up has completed. When
the FSCM is enabled, the Two-Speed Start-up is also
enabled. Therefore, the device will always be executing
code while the OST is operating.
External
LFINTOSC ÷ 64
S
R
Q
31 kHz
(~32 s)
488 Hz
(~2 ms)
Clock Monitor
Latch
Clock
Failure
Detected
Oscillator
Clock
Q
Sample Clock
Note: Due to the wide range of oscillator start-up
times, the Fail-Safe circuit is not active
during oscillator start-up (i.e., after exiting
Reset or Sleep). After an appropriate
amount of time, the user should check the
Status bits in the OSCSTAT register to
verify the oscillator start-up and that the
system clock switchover has successfully
completed.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 71
PIC16(L)F1782/3
FIGURE 6-10: FSCM TIMING DIAGRAM
OSCFIF
System
Clock
Output
Sample Clock
Failure
Detected
Oscillator
Failure
Note: The system clock is normally at a much higher frequency than the sample clock. The relative frequencies in
this example have been chosen for clarity.
(Q)
Te s t Test Test
Clock Monitor Output
PIC16(L)F1782/3
DS41579C-page 72 Preliminary 2011-2012 Microchip Technology Inc.
6.6 Register Definitions: Oscillator Control
REGISTER 6-1: OSCCON: OSCILLATOR CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-1/1 R/W-1/1 R/W-1/1 U-0 R/W-0/0 R/W-0/0
SPLLEN IRCF<3:0> —SCS<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 SPLLEN: Software PLL Enable bit
If PLLEN in Configuration Words = 1:
SPLLEN bit is ignored. 4x PLL is always enabled (subject to oscillator requirements)
If PLLEN in Configuration Words = 0:
1 = 4x PLL Is enabled
0 = 4x PLL is disabled
bit 6-3 IRCF<3:0>: Internal Oscillator Frequency Select bits
1111 = 16 MHz HF or 32 MHz HF(2)
1110 = 8 MHz or 32 MHz HF(2)
1101 =4MHz HF
1100 =2MHz HF
1011 =1MHz HF
1010 = 500 kHz HF(1)
1001 = 250 kHz HF(1)
1000 = 125 kHz HF(1)
0111 = 500 kHz MF (default upon Reset)
0110 = 250 kHz MF
0101 = 125 kHz MF
0100 = 62.5 kHz MF
0011 = 31.25 kHz HF(1)
0010 = 31.25 kHz MF
000x =31kHz LF
bit 2 Unimplemented: Read as ‘0’
bit 1-0 SCS<1:0>: System Clock Select bits
1x = Internal oscillator block
01 = Timer1 oscillator
00 = Clock determined by FOSC<2:0> in Configuration Words.
Note 1: Duplicate frequency derived from HFINTOSC.
2: 32 MHz when SPLLEN bit is set. Refer to Section 6.2.2.6 “32 MHz Internal Oscillator Frequency
Selection”.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 73
PIC16(L)F1782/3
REGISTER 6-2: OSCSTAT: OSCILLATOR STATUS REGISTER
R-1/q R-0/q R-q/q R-0/q R-0/q R-q/q R-0/0 R-0/q
T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Conditional
bit 7 T1OSCR: Timer1 Oscillator Ready bit
If T1OSCEN = 1:
1 = Timer1 oscillator is ready
0 = Timer1 oscillator is not ready
If T1OSCEN = 0:
1 = Timer1 clock source is always ready
bit 6 PLLR 4x PLL Ready bit
1 = 4x PLL is ready
0 = 4x PLL is not ready
bit 5 OSTS: Oscillator Start-up Time-out Status bit
1 = Running from the clock defined by the FOSC<2:0> bits of the Configuration Words
0 = Running from an internal oscillator (FOSC<2:0> = 100)
bit 4 HFIOFR: High-Frequency Internal Oscillator Ready bit
1 = HFINTOSC is ready
0 = HFINTOSC is not ready
bit 3 HFIOFL: High-Frequency Internal Oscillator Locked bit
1 = HFINTOSC is at least 2% accurate
0 = HFINTOSC is not 2% accurate
bit 2 MFIOFR: Medium-Frequency Internal Oscillator Ready bit
1 = MFINTOSC is ready
0 = MFINTOSC is not ready
bit 1 LFIOFR: Low-Frequency Internal Oscillator Ready bit
1 = LFINTOSC is ready
0 = LFINTOSC is not ready
bit 0 HFIOFS: High-Frequency Internal Oscillator Stable bit
1 = HFINTOSC is at least 0.5% accurate
0 = HFINTOSC is not 0.5% accurate
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DS41579C-page 74 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 6-2: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES
TABLE 6-3: SUMMARY OF CONFIGURATION WORD WITH CLOCK SOURCES
REGISTER 6-3: OSCTUNE: OSCILLATOR TUNING REGISTER
U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
—— TUN<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 TUN<5:0>: Frequency Tuning bits
100000 = Minimum frequency
•
•
•
111111 =
000000 = Oscillator module is running at the factory-calibrated frequency.
000001 =
•
•
•
011110 =
011111 = Maximum frequency
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
OSCCON SPLLEN IRCF<3:0> —SCS<1:0>72
OSCSTAT T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS 73
OSCTUNE ——TUN<5:0>74
PIR2 OSFIF C2IF C1IF EEIF BCL1IF —C3IF CCP2IF 89
PIE2 OSFIE C2IE C1IE EEIE BCL1IE —C3IE CCP2IE 86
T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC —TMR1ON 193
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources.
Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1 13:8 —— FCMEN IESO CLKOUTEN BOREN<1:0> CPD 44
7:0 CP MCLRE PWRTE WDTE<1:0> FOSC<2:0>
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources.
Note 1: PIC16F1782/3 only.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 75
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7.0 REFERENCE CLOCK MODULE
The reference clock module provides the ability to send
a divided clock to the clock output pin of the device
(CLKR). This module is available in all oscillator config-
urations and allows the user to select a greater range
of clock submultiples to drive external devices in the
application. The reference clock module includes the
following features:
• System clock is the source
• Available in all oscillator configurations
• Programmable clock divider
• Output enable to a port pin
• Selectable duty cycle
• Slew rate control
The reference clock module is controlled by the
CLKRCON register (Register 7-1) and is enabled when
setting the CLKREN bit. To output the divided clock
signal to the CLKR port pin, the CLKROE bit must be
set. The CLKRDIV<2:0> bits enable the selection of 8
different clock divider options. The CLKRDC<1:0> bits
can be used to modify the duty cycle of the output
clock(1). The CLKRSLR bit controls slew rate limiting.
7.1 Slew Rate
The slew rate limitation on the output port pin can be
disabled. The slew rate limitation is removed by
clearing the CLKRSLR bit in the CLKRCON register.
7.2 Effects of a Reset
Upon any device Reset, the reference clock module is
disabled. The user’s firmware is responsible for
initializing the module before enabling the output. The
registers are reset to their default values.
7.3 Conflicts with the CLKR Pin
There are two cases when the reference clock output
signal cannot be output to the CLKR pin, if:
• LP, XT or HS Oscillator mode is selected.
• CLKOUT function is enabled.
7.3.1 OSCILLATOR MODES
If LP, XT or HS oscillator modes are selected, the
OSC2/CLKR pin must be used as an oscillator input pin
and the CLKR output cannot be enabled. See
Section 6.2 “Clock Source Types”for more informa-
tion on different oscillator modes.
7.3.2 CLKOUT FUNCTION
The CLKOUT function has a higher priority than the ref-
erence clock module. Therefore, if the CLKOUT func-
tion is enabled by the CLKOUTEN bit in Configuration
Words, FOSC/4 will always be output on the port pin.
Reference Section 4.0 “Device Configuration” for
more information.
7.4 Operation During Sleep
As the reference clock module relies on the system
clock as its source, and the system clock is disabled in
Sleep, the module does not function in Sleep, even if
an external clock source or the Timer1 clock source is
configured as the system clock. The module outputs
will remain in their current state until the device exits
Sleep.
Note 1: If the base clock rate is selected without
a divider, the output clock will always
have a duty cycle equal to that of the
source clock, unless a 0% duty cycle is
selected. If the clock divider is set to base
clock/2, then 25% and 75% duty cycle
accuracy will be dependent upon the
source clock.
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DS41579C-page 76 Preliminary 2011-2012 Microchip Technology Inc.
7.5 Register Definition: Reference Clock Control
REGISTER 7-1: CLKRCON: REFERENCE CLOCK CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-1/1 R/W-1/1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
CLKREN CLKROE CLKRSLR CLKRDC<1:0> CLKRDIV<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 CLKREN: Reference Clock Module Enable bit
1 = Reference clock module is enabled
0 = Reference clock module is disabled
bit 6 CLKROE: Reference Clock Output Enable bit
1 = Reference clock output is enabled on CLKR pin
0 = Reference clock output disabled on CLKR pin
bit 5 CLKRSLR: Reference Clock Slew Rate Control Limiting Enable bit
1 = Slew rate limiting is enabled
0 = Slew rate limiting is disabled
bit 4-3 CLKRDC<1:0>: Reference Clock Duty Cycle bits
11 = Clock outputs duty cycle of 75%
10 = Clock outputs duty cycle of 50%
01 = Clock outputs duty cycle of 25%
00 = Clock outputs duty cycle of 0%
bit 2-0 CLKRDIV<2:0> Reference Clock Divider bits
111 = Base clock value divided by 128
110 = Base clock value divided by 64
101 = Base clock value divided by 32
100 = Base clock value divided by 16
011 = Base clock value divided by 8
010 = Base clock value divided by 4
001 = Base clock value divided by 2(1)
000 = Base clock value(2)
Note 1: In this mode, the 25% and 75% duty cycle accuracy will be dependent on the source clock duty cycle.
2: In this mode, the duty cycle will always be equal to the source clock duty cycle, unless a duty cycle of 0%
is selected.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 77
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TABLE 7-1: SUMMARY OF REGISTERS ASSOCIATED WITH REFERENCE CLOCK SOURCES
TABLE 7-2: SUMMARY OF CONFIGURATION WORD WITH REFERENCE CLOCK SOURCES
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
CLKRCON CLKREN CLKROE CLKRSLR CLKRDC<1:0>
CLKRDIV<2:0>
76
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by reference clock sources.
Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1 13:8 — — FCMEN IESO CLKOUTEN BOREN<1:0> CPD 44
7:0 CP MCLRE PWRTE WDTE1<:0> FOSC<2:0>
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by reference clock sources.
PIC16(L)F1782/3
DS41579C-page 78 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 79
PIC16(L)F1782/3
8.0 INTERRUPTS
The interrupt feature allows certain events to preempt
normal program flow. Firmware is used to determine
the source of the interrupt and act accordingly. Some
interrupts can be configured to wake the MCU from
Sleep mode.
This chapter contains the following information for
Interrupts:
• Operation
• Interrupt Latency
• Interrupts During Sleep
•INT Pin
• Automatic Context Saving
Many peripherals produce interrupts. Refer to the
corresponding chapters for details.
A block diagram of the interrupt logic is shown in
Figure 8-1.
FIGURE 8-1: INTERRUPT LOGIC
TMR0IF
TMR0IE
INTF
INTE
IOCIF
IOCIE Interrupt
to CPU
Wake-up
(If in Sleep mode)
GIE
(TMR1IF) PIR1<0>
PIRn<7>
PIEn<7>
PEIE
Peripheral Interrupts
(TMR1IF) PIR1<0>
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DS41579C-page 80 Preliminary 2011-2012 Microchip Technology Inc.
8.1 Operation
Interrupts are disabled upon any device Reset. They
are enabled by setting the following bits:
• GIE bit of the INTCON register
• Interrupt Enable bit(s) for the specific interrupt
event(s)
• PEIE bit of the INTCON register (if the Interrupt
Enable bit of the interrupt event is contained in the
PIE1 or PIE2 registers)
The INTCON, PIR1 and PIR2 registers record individ-
ual interrupts via interrupt flag bits. Interrupt flag bits will
be set, regardless of the status of the GIE, PEIE and
individual interrupt enable bits.
The following events happen when an interrupt event
occurs while the GIE bit is set:
• Current prefetched instruction is flushed
• GIE bit is cleared
• Current Program Counter (PC) is pushed onto the
stack
• Critical registers are automatically saved to the
shadow registers (See “Section 8.5 “Automatic
Context Saving”.”)
• PC is loaded with the interrupt vector 0004h
The firmware within the Interrupt Service Routine (ISR)
should determine the source of the interrupt by polling
the interrupt flag bits. The interrupt flag bits must be
cleared before exiting the ISR to avoid repeated
interrupts. Because the GIE bit is cleared, any interrupt
that occurs while executing the ISR will be recorded
through its interrupt flag, but will not cause the
processor to redirect to the interrupt vector.
The RETFIE instruction exits the ISR by popping the
previous address from the stack, restoring the saved
context from the shadow registers and setting the GIE
bit.
For additional information on a specific interrupt’s
operation, refer to its peripheral chapter.
8.2 Interrupt Latency
Interrupt latency is defined as the time from when the
interrupt event occurs to the time code execution at the
interrupt vector begins. The latency for synchronous
interrupts is 3 or 4 instruction cycles. For asynchronous
interrupts, the latency is 3 to 5 instruction cycles,
depending on when the interrupt occurs. See Figure 8-2
and Figure 8.3 for more details.
Note 1: Individual interrupt flag bits are set,
regardless of the state of any other
enable bits.
2: All interrupts will be ignored while the GIE
bit is cleared. Any interrupt occurring
while the GIE bit is clear will be serviced
when the GIE bit is set again.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 81
PIC16(L)F1782/3
FIGURE 8-2: INTERRUPT LATENCY
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
CLKR
PC 0004h 0005h
PC
Inst(0004h)NOP
GIE
Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4
1 Cycle Instruction at PC
PC
Inst(0004h)NOP
2 Cycle Instruction at PC
FSR ADDR PC+1 PC+2 0004h 0005h
PC
Inst(0004h)NOP
GIE
PCPC-1
3 Cycle Instruction at PC
Execute
Interrupt
Inst(PC)
Interrupt Sampled
during Q1
Inst(PC)
PC-1 PC+1
NOP
PC New PC/
PC+1 0005hPC-1 PC+1/FSR
ADDR 0004h
NOP
Interrupt
GIE
Interrupt
INST(PC) NOPNOP
FSR ADDR PC+1 PC+2 0004h 0005h
PC
Inst(0004h)NOP
GIE
PCPC-1
3 Cycle Instruction at PC
Interrupt
INST(PC) NOPNOP NOP
Inst(0005h)
Execute
Execute
Execute
PIC16(L)F1782/3
DS41579C-page 82 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 8-3: INT PIN INTERRUPT TIMING
Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4
OSC1
CLKOUT
INT pin
INTF
GIE
INSTRUCTION FLOW
PC
Instruction
Fetched
Instruction
Executed
Interrupt Latency
PC PC + 1 PC + 1 0004h 0005h
Inst (0004h) Inst (0005h)
Forced NOP
Inst (PC) Inst (PC + 1)
Inst (PC – 1) Inst (0004h)
Forced NOP
Inst (PC)
—
Note 1: INTF flag is sampled here (every Q1).
2: Asynchronous interrupt latency = 3-5 TCY. Synchronous latency = 3-4 TCY, where TCY = instruction cycle time.
Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT not available in all oscillator modes.
4: For minimum width of INT pulse, refer to AC specifications in Section 30.0 “Electrical Specifications””.
5: INTF is enabled to be set any time during the Q4-Q1 cycles.
(1)
(2)
(3)
(4)
(5)
(1)
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PIC16(L)F1782/3
8.3 Interrupts During Sleep
Some interrupts can be used to wake from Sleep. To
wake from Sleep, the peripheral must be able to
operate without the system clock. The interrupt source
must have the appropriate Interrupt Enable bit(s) set
prior to entering Sleep.
On waking from Sleep, if the GIE bit is also set, the
processor will branch to the interrupt vector. Otherwise,
the processor will continue executing instructions after
the SLEEP instruction. The instruction directly after the
SLEEP instruction will always be executed before
branching to the ISR. Refer to Section 9.0
“Power-Down Mode (Sleep)” for more details.
8.4 INT Pin
The INT pin can be used to generate an asynchronous
edge-triggered interrupt. This interrupt is enabled by
setting the INTE bit of the INTCON register. The
INTEDG bit of the OPTION_REG register determines on
which edge the interrupt will occur. When the INTEDG
bit is set, the rising edge will cause the interrupt. When
the INTEDG bit is clear, the falling edge will cause the
interrupt. The INTF bit of the INTCON register will be set
when a valid edge appears on the INT pin. If the GIE and
INTE bits are also set, the processor will redirect
program execution to the interrupt vector.
8.5 Automatic Context Saving
Upon entering an interrupt, the return PC address is
saved on the stack. Additionally, the following registers
are automatically saved in the Shadow registers:
• W register
• STATUS register (except for TO and PD)
• BSR register
• FSR registers
• PCLATH register
Upon exiting the Interrupt Service Routine, these regis-
ters are automatically restored. Any modifications to
these registers during the ISR will be lost. If modifica-
tions to any of these registers are desired, the corre-
sponding Shadow register should be modified and the
value will be restored when exiting the ISR. The
Shadow registers are available in Bank 31 and are
readable and writable. Depending on the user’s appli-
cation, other registers may also need to be saved.
PIC16(L)F1782/3
DS41579C-page 84 Preliminary 2011-2012 Microchip Technology Inc.
8.6 Register Definitions: Interrupt Control
REGISTER 8-1: INTCON: INTERRUPT CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0
GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 GIE: Global Interrupt Enable bit
1 = Enables all active interrupts
0 = Disables all interrupts
bit 6 PEIE: Peripheral Interrupt Enable bit
1 = Enables all active peripheral interrupts
0 = Disables all peripheral interrupts
bit 5 TMR0IE: Timer0 Overflow Interrupt Enable bit
1 = Enables the Timer0 interrupt
0 = Disables the Timer0 interrupt
bit 4 INTE: INT External Interrupt Enable bit
1 = Enables the INT external interrupt
0 = Disables the INT external interrupt
bit 3 IOCIE: Interrupt-on-Change Enable bit
1 = Enables the interrupt-on-change
0 = Disables the interrupt-on-change
bit 2 TMR0IF: Timer0 Overflow Interrupt Flag bit
1 = TMR0 register has overflowed
0 = TMR0 register did not overflow
bit 1 INTF: INT External Interrupt Flag bit
1 = The INT external interrupt occurred
0 = The INT external interrupt did not occur
bit 0 IOCIF: Interrupt-on-Change Interrupt Flag bit(1)
1 = When at least one of the interrupt-on-change pins changed state
0 = None of the interrupt-on-change pins have changed state
Note 1: The IOCIF Flag bit is read-only and cleared when all the Interrupt-on-Change flags in the IOCBF register
have been cleared by software.
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 85
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REGISTER 8-2: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 TMR1GIE: Timer1 Gate Interrupt Enable bit
1 = Enables the Timer1 gate acquisition interrupt
0 = Disables the Timer1 gate acquisition interrupt
bit 6 ADIE: A/D Converter (ADC) Interrupt Enable bit
1 = Enables the ADC interrupt
0 = Disables the ADC interrupt
bit 5 RCIE: USART Receive Interrupt Enable bit
1 = Enables the USART receive interrupt
0 = Disables the USART receive interrupt
bit 4 TXIE: USART Transmit Interrupt Enable bit
1 = Enables the USART transmit interrupt
0 = Disables the USART transmit interrupt
bit 3 SSPIE: Synchronous Serial Port (MSSP) Interrupt Enable bit
1 = Enables the MSSP interrupt
0 = Disables the MSSP interrupt
bit 2 CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the Timer2 to PR2 match interrupt
0 = Disables the Timer2 to PR2 match interrupt
bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit
1 = Enables the Timer1 overflow interrupt
0 = Disables the Timer1 overflow interrupt
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
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DS41579C-page 86 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 8-3: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0
OSFIE C2IE C1IE EEIE BCLIE — C3IE CCP2IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 OSFIE: Oscillator Fail Interrupt Enable bit
1 = Enables the Oscillator Fail interrupt
0 = Disables the Oscillator Fail interrupt
bit 6 C2IE: Comparator C2 Interrupt Enable bit
1 = Enables the Comparator C2 interrupt
0 = Disables the Comparator C2 interrupt
bit 5 C1IE: Comparator C1 Interrupt Enable bit
1 = Enables the Comparator C1 interrupt
0 = Disables the Comparator C1 interrupt
bit 4 EEIE: EEPROM Write Completion Interrupt Enable bit
1 = Enables the EEPROM Write Completion interrupt
0 = Disables the EEPROM Write Completion interrupt
bit 3 BCLIE: MSSP Bus Collision Interrupt Enable bit
1 = Enables the MSSP Bus Collision Interrupt
0 = Disables the MSSP Bus Collision Interrupt
bit 2 Unimplemented: Read as ‘0’
bit 1 C3IE: Comparator C3 Interrupt Enable bit
1 = Enables the Comparator C3 Interrupt
0 = Disables the Comparator C3 Interrupt
bit 0 CCP2IE: CCP2 Interrupt Enable bit
1 = Enables the CCP2 interrupt
0 = Disables the CCP2 interrupt
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 87
PIC16(L)F1782/3
REGISTER 8-4: PIE4: PERIPHERAL INTERRUPT ENABLE REGISTER 4
U-0 U-0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0
—— PSMC2TIE PSMC1TIE —— PSMC2SIE PSMC1SIE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5 PSMC2TIE: PSMC2 Time Base Interrupt Enable bit
1 = Enables PSMC2 time base generated interrupts
0 = Disables PSMC2 time base generated interrupts
bit 4 PSMC1TIE: PSMC1 Time Base Interrupt Enable bit
1 = Enables PSMC1 time base generated interrupts
0 = Disables PSMC1 time base generated interrupts
bit 3-2 Unimplemented: Read as ‘0’
bit 1 PSMC2SIE: PSMC2 Auto-Shutdown Interrupt Enable bit
1 = Enables PSMC2 auto-shutdown interrupts
0 = Disables PSMC2 auto-shutdown interrupts
bit 0 PSMC1SIE: PSMC1 Auto-Shutdown Interrupt Enable bit
1 = Enables PSMC1 auto-shutdown interrupts
0 = Disables PSMC1 auto-shutdown interrupts
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
PIC16(L)F1782/3
DS41579C-page 88 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 8-5: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1
R/W-0/0 R/W-0/0 R-0/0 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 TMR1GIF: Timer1 Gate Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 6 ADIF: A/D Converter Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 5 RCIF: USART Receive Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 4 TXIF: USART Transmit Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 3 SSPIF: Synchronous Serial Port (MSSP) Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 2 CCP1IF: CCP1 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 1 TMR2IF: Timer2 to PR2 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 89
PIC16(L)F1782/3
REGISTER 8-6: PIR2: PERIPHERAL INTERRUPT REQUEST REGISTER 2
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0
OSFIF C2IF C1IF EEIF BCLIF — C3IF CCP2IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 OSFIF: Oscillator Fail Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 6 C2IF: Comparator C2 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 5 C1IF: Comparator C1 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 4 EEIF: EEPROM Write Completion Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 3 BCLIF: MSSP Bus Collision Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 2 Unimplemented: Read as ‘0’
bit 1 C3IF: Comparator C3 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 0 CCP2IF: CCP2 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
PIC16(L)F1782/3
DS41579C-page 90 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 8-7: PIR4: PERIPHERAL INTERRUPT REQUEST REGISTER42
U-0 U-0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0
—— PSMC2TIF PSMC1TIF —— PSMC2SIF PSMC1SIF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5 PSMC2TIF: PSMC2 Time Base Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 4 PSMC1TIF: PSMC1 Time Base Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 3-2 Unimplemented: Read as ‘0’
bit 1 PSMC2SIF: PSMC2 Auto-shutdown Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 0 PSMC1SIF: PSMC1 Auto-shutdown Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 91
PIC16(L)F1782/3
TABLE 8-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 183
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IFE TMR1IE 85
PIE2 OSFIE C2IE C1IE EEIE BCL1IE — C3IE CCP2IE 86
PIE4 —— PSMC2TIE PSMC1TIE —— PSMC2SIE PSMC2SIE 87
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 88
PIR2 OSFIF C2IF C1IF EEIF BCL1IF — C3IF CCP2IF 89
PIR4 —— PSMC2TIF PSMC1TIF —— PSMC2SIF PSMC1SIF 90
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by interrupts.
PIC16(L)F1782/3
DS41579C-page 92 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 93
PIC16(L)F1782/3
9.0 POWER-DOWN MODE (SLEEP)
The Power-down mode is entered by executing a
SLEEP instruction.
Upon entering Sleep mode, the following conditions
exist:
1. WDT will be cleared but keeps running, if
enabled for operation during Sleep.
2. PD bit of the STATUS register is cleared.
3. TO bit of the STATUS register is set.
4. CPU clock is disabled.
5. 31 kHz LFINTOSC is unaffected and peripherals
that operate from it may continue operation in
Sleep.
6. ADC is unaffected, if the dedicated FRC clock is
selected.
7. I/O ports maintain the status they had before
SLEEP was executed (driving high, low or
high-impedance).
8. Resets other than WDT are not affected by
Sleep mode.
Refer to individual chapters for more details on
peripheral operation during Sleep.
To minimize current consumption, the following condi-
tions should be considered:
• I/O pins should not be floating
• External circuitry sinking current from I/O pins
• Internal circuitry sourcing current from I/O pins
• Current draw from pins with internal weak pull-ups
• Modules using 31 kHz LFINTOSC
• Modules using Timer1 oscillator
I/O pins that are high-impedance inputs should be
pulled to VDD or VSS externally to avoid switching cur-
rents caused by floating inputs.
Examples of internal circuitry that might be sourcing
current include modules such as the DAC and FVR
modules. See Section 19.0 “Digital-to-Analog Con-
verter (DAC) Module” and Section 15.0 “Fixed Volt-
age Reference (FVR)” for more information on these
modules.
9.1 Wake-up from Sleep
The device can wake-up from Sleep through one of the
following events:
1. External Reset input on MCLR pin, if enabled
2. BOR Reset, if enabled
3. POR Reset
4. Watchdog Timer, if enabled
5. Any external interrupt
6. Interrupts by peripherals capable of running dur-
ing Sleep (see individual peripheral for more
information)
The first three events will cause a device Reset. The
last three events are considered a continuation of pro-
gram execution. To determine whether a device Reset
or wake-up event occurred, refer to Section 5.12
“Determining the Cause of a Reset”.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be enabled. Wake-up will
occur regardless of the state of the GIE bit. If the GIE
bit is disabled, the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
enabled, the device executes the instruction after the
SLEEP instruction, the device will then call the Interrupt
Service Routine. In cases where the execution of the
instruction following SLEEP is not desirable, the user
should have a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
PIC16(L)F1782/3
DS41579C-page 94 Preliminary 2011-2012 Microchip Technology Inc.
9.1.1 WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of a
SLEEP instruction
-SLEEP instruction will execute as a NOP.
- WDT and WDT prescaler will not be cleared
-TO
bit of the STATUS register will not be set
-PD
bit of the STATUS register will not be
cleared.
• If the interrupt occurs during or after the execu-
tion of a SLEEP instruction
-SLEEP instruction will be completely exe-
cuted
- Device will immediately wake-up from Sleep
- WDT and WDT prescaler will be cleared
-TO
bit of the STATUS register will be set
-PD bit of the STATUS register will be cleared.
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes. To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
FIGURE 9-1: WAKE-UP FROM SLEEP THROUGH INTERRUPT
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
CLKIN(1)
CLKOUT(2)
Interrupt flag
GIE bit
(INTCON reg.)
Instruction Flow
PC
Instruction
Fetched
Instruction
Executed
PC PC + 1 PC + 2
Inst(PC) = Sleep
Inst(PC - 1)
Inst(PC + 1)
Sleep
Processor in
Sleep
Interrupt Latency(4)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h) Inst(0005h)
Inst(0004h)
Forced NOP
PC + 2 0004h 0005h
Forced NOP
T1OSC(3)
PC + 2
Note 1: External clock. High, Medium, Low mode assumed.
2: CLKOUT is shown here for timing reference.
3: T1OSC; See Section 25.0 “Electrical Specifications”.
4: GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 95
PIC16(L)F1782/3
9.2 Low-Power Sleep Mode
The PIC16(L)F1783 device contains an internal Low
Dropout (LDO) voltage regulator, which allows the
device I/O pins to operate at voltages up to 5.5V while
the internal device logic operates at a lower voltage.
The LDO and its associated reference circuitry must
remain active when the device is in Sleep mode. The
PIC16(L)F1783 allows the user to optimize the
operating current in Sleep, depending on the
application requirements.
A Low-Power Sleep mode can be selected by setting
the VREGPM bit of the VREGCON register. With this
bit set, the LDO and reference circuitry are placed in a
low-power state when the device is in Sleep.
9.2.1 SLEEP CURRENT VS. WAKE-UP
TIME
In the default operating mode, the LDO and reference
circuitry remain in the normal configuration while in
Sleep. The device is able to exit Sleep mode quickly
since all circuits remain active. In Low-Power Sleep
mode, when waking up from Sleep, an extra delay time
is required for these circuits to return to the normal con-
figuration and stabilize.
The Low-Power Sleep mode is beneficial for applica-
tions that stay in Sleep mode for long periods of time.
The normal mode is beneficial for applications that
need to wake from Sleep quickly and frequently.
9.2.2 PERIPHERAL USAGE IN SLEEP
Some peripherals that can operate in Sleep mode will
not operate properly with the Low-Power Sleep mode
selected. The LDO will remain in the normal power
mode when those peripherals are enabled. The
Low-Power Sleep mode is intended for use with these
peripherals:
• Brown-Out Reset (BOR)
• Watchdog Timer (WDT)
• External interrupt pin/Interrupt-on-change pins
• Timer1 (with external clock source)
Note: The PIC16LF1782 does not have a con-
figurable Low-Power Sleep mode.
PIC16LF1782 is an unregulated device
and is always in the lowest power state
when in Sleep, with no wake-up time pen-
alty. This device has a lower maximum
VDD and I/O voltage than the
PIC16(L)F1783. See Section 29.0 “Elec-
trical Specifications” for more informa-
tion.
PIC16(L)F1782/3
DS41579C-page 96 Preliminary 2011-2012 Microchip Technology Inc.
9.3 Register Definitions: Voltage Regulator Control
TABLE 9-1: SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE
REGISTER 9-1: VREGCON: VOLTAGE REGULATOR CONTROL REGISTER(1)
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-1/1
— — — — — —VREGPMReserved
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-2 Unimplemented: Read as ‘0’
bit 1 VREGPM: Voltage Regulator Power Mode Selection bit
1 = Low-Power Sleep mode enabled in Sleep(2)
Draws lowest current in Sleep, slower wake-up
0 = Normal Power mode enabled in Sleep(2)
Draws higher current in Sleep, faster wake-up
bit 0 Reserved: Read as ‘1’. Maintain this bit set.
Note 1: PIC16F1782/3 only.
2: See Section 30.0 “Electrical Specifications”.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on
Page
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF RAIF 84
IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 142
IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 141
IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 141
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IFE TMR1IE 85
PIE2 OSFIE C2IE C1IE EEIE BCL1IE — C3IE CCP2IE 86
PIE4 —— PSMC2TIE PSMC1TIE —— PSMC2SIE PSMC2SIE 87
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 88
PIR2 OSFIF C2IF C1IF EEIF BCL1IF — C3IF CCP2IF 89
PIR4 —— PSMC2TIF PSMC1TIF —— PSMC2SIF PSMC1SIF 90
STATUS — — —TOPD ZDCC 23
VREGCON — — — — — —VREGPMReserved 96
WDTCON —— WDTPS<4:0> SWDTEN 101
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used in Power-Down mode.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 97
PIC16(L)F1782/3
10.0 LOW DROPOUT (LDO)
VOLTAGE REGULATOR
The PIC16F1782/3 has an internal Low Dropout
Regulator (LDO) which provides operation above 3.6V.
The LDO regulates a voltage for the internal device
logic while permitting the VDD and I/O pins to operate
at a higher voltage. There is no user enable/disable
control available for the LDO, it is always active. The
PIC16LF1782/3 operates at a maximum VDD of 3.6V
and does not incorporate an LDO.
A device I/O pin may be configured as the LDO voltage
output, identified as the VCAP pin. Although not
required, an external low-ESR capacitor may be con-
nected to the VCAP pin for additional regulator stability.
The VCAPEN bit of Configuration Words determines if
which pin is assigned as the VCAP pin. Refer to
Table 10-1.
On power-up, the external capacitor will load the LDO
voltage regulator. To prevent erroneous operation, the
device is held in Reset while a constant current source
charges the external capacitor. After the cap is fully
charged, the device is released from Reset. For more
information on the constant current rate, refer to the
LDO Regulator Characteristics Table in Section 30.0
“Electrical Specifications”.
TABLE 10-2: SUMMARY OF CONFIGURATION WORD WITH LDO
TABLE 10-1: VCAPEN SELECT BIT
VCAPEN Pin
0RA6
1No VCAP
Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG2 13:8 — — LVP DEBUG LPBOR BORV STVREN PLLEN 46
7:0 —— VCAPEN(1) — — — WRT<1:0>
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by LDO.
Note 1: Not implemented on PIC16LF1782/3.
PIC16(L)F1782/3
DS41579C-page 98 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 99
PIC16(L)F1782/3
11.0 WATCHDOG TIMER (WDT)
The Watchdog Timer is a system timer that generates
a Reset if the firmware does not issue a CLRWDT
instruction within the time-out period. The Watchdog
Timer is typically used to recover the system from
unexpected events.
The WDT has the following features:
• Independent clock source
• Multiple operating modes
- WDT is always on
- WDT is off when in Sleep
- WDT is controlled by software
- WDT is always off
• Configurable time-out period is from 1 ms to 256
seconds (nominal)
• Multiple Reset conditions
• Operation during Sleep
FIGURE 11-1: WATCHDOG TIMER BLOCK DIAGRAM
LFINTOSC 23-bit Programmable
Prescaler WDT WDT Time-out
WDTPS<4:0>
SWDTEN
Sleep
WDTE<1:0> = 11
WDTE<1:0> = 01
WDTE<1:0> = 10
PIC16(L)F1782/3
DS41579C-page 100 Preliminary 2011-2012 Microchip Technology Inc.
11.1 Independent Clock Source
The WDT derives its time base from the 31 kHz
LFINTOSC internal oscillator. Time intervals in this
chapter are based on a nominal interval of 1ms. See
Section 30.0 “Electrical Specifications” for the
LFINTOSC tolerances.
11.2 WDT Operating Modes
The Watchdog Timer module has four operating modes
controlled by the WDTE<1:0> bits in Configuration
Words. See Ta b l e 11 - 1.
11.2.1 WDT IS ALWAYS ON
When the WDTE bits of Configuration Words are set to
‘11’, the WDT is always on.
WDT protection is active during Sleep.
11.2.2 WDT IS OFF IN SLEEP
When the WDTE bits of Configuration Words are set to
‘10’, the WDT is on, except in Sleep.
WDT protection is not active during Sleep.
11.2.3 WDT CONTROLLED BY SOFTWARE
When the WDTE bits of Configuration Words are set to
‘01’, the WDT is controlled by the SWDTEN bit of the
WDTCON register.
WDT protection is unchanged by Sleep. See
Table 11-1 for more details.
TABLE 11-1: WDT OPERATING MODES
11.3 Time-Out Period
The WDTPS bits of the WDTCON register set the
time-out period from 1 ms to 256 seconds (nominal).
After a Reset, the default time-out period is 2 seconds.
11.4 Clearing the WDT
The WDT is cleared when any of the following condi-
tions occur:
•Any Reset
•CLRWDT instruction is executed
• Device enters Sleep
• Device wakes up from Sleep
• Oscillator fail
• WDT is disabled
• Oscillator Start-up TImer (OST) is running
See Table 11-2 for more information.
11.5 Operation During Sleep
When the device enters Sleep, the WDT is cleared. If
the WDT is enabled during Sleep, the WDT resumes
counting.
When the device exits Sleep, the WDT is cleared
again. The WDT remains clear until the OST, if
enabled, completes. See Section 6.0 “Oscillator
Module (with Fail-Safe Clock Monitor)” for more
information on the OST.
When a WDT time-out occurs while the device is in
Sleep, no Reset is generated. Instead, the device
wakes up and resumes operation. The TO and PD bits
in the STATUS register are changed to indicate the
event. See Section 3.0 “Memory Organization” and
Status Register (Register 3-1) for more information.
WDTE<1:0> SWDTEN Device
Mode
WDT
Mode
11 X XActive
10 X
Awake Active
Sleep Disabled
01 1XActive
0Disabled
00 X X Disabled
TABLE 11-2: WDT CLEARING CONDITIONS
Conditions WDT
WDTE<1:0> = 00
Cleared
WDTE<1:0> = 01 and SWDTEN = 0
WDTE<1:0> = 10 and enter Sleep
CLRWDT Command
Oscillator Fail Detected
Exit Sleep + System Clock = T1OSC, EXTRC, INTOSC, EXTCLK
Exit Sleep + System Clock = XT, HS, LP Cleared until the end of OST
Change INTOSC divider (IRCF bits) Unaffected
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 101
PIC16(L)F1782/3
11.6 Register Definitions: Watchdog Control
REGISTER 11-1: WDTCON: WATCHDOG TIMER CONTROL REGISTER
U-0 U-0 R/W-0/0 R/W-1/1 R/W-0/0 R/W-1/1 R/W-1/1 R/W-0/0
—— WDTPS<4:0> SWDTEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -m/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-1 WDTPS<4:0>: Watchdog Timer Period Select bits(1)
Bit Value = Prescale Rate
11111 = Reserved. Results in minimum interval (1:32)
•
•
•
10011 = Reserved. Results in minimum interval (1:32)
10010 = 1:8388608 (223) (Interval 256s nominal)
10001 = 1:4194304 (222) (Interval 128s nominal)
10000 = 1:2097152 (221) (Interval 64s nominal)
01111 = 1:1048576 (220) (Interval 32s nominal)
01110 = 1:524288 (219) (Interval 16s nominal)
01101 = 1:262144 (218) (Interval 8s nominal)
01100 = 1:131072 (217) (Interval 4s nominal)
01011 = 1:65536 (Interval 2s nominal) (Reset value)
01010 = 1:32768 (Interval 1s nominal)
01001 = 1:16384 (Interval 512 ms nominal)
01000 = 1:8192 (Interval 256 ms nominal)
00111 = 1:4096 (Interval 128 ms nominal)
00110 = 1:2048 (Interval 64 ms nominal)
00101 = 1:1024 (Interval 32 ms nominal)
00100 = 1:512 (Interval 16 ms nominal)
00011 = 1:256 (Interval 8 ms nominal)
00010 = 1:128 (Interval 4 ms nominal)
00001 = 1:64 (Interval 2 ms nominal)
00000 = 1:32 (Interval 1 ms nominal)
bit 0 SWDTEN: Software Enable/Disable for Watchdog Timer bit
If WDTE<1:0> = 1x:
This bit is ignored.
If WDTE<1:0> = 01:
1 = WDT is turned on
0 = WDT is turned off
If WDTE<1:0> = 00:
This bit is ignored.
Note 1: Times are approximate. WDT time is based on 31 kHz LFINTOSC.
PIC16(L)F1782/3
DS41579C-page 102 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 11-3: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER
TABLE 11-4: SUMMARY OF CONFIGURATION WORD WITH WATCHDOG TIMER
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
OSCCON SPLLEN IRCF<3:0> —SCS<1:0>
72
STATUS ———TOPD ZDC C23
WDTCON —— WDTPS<4:0> SWDTEN 101
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by
Watchdog Timer.
Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1 13:8 — — FCMEN IESO CLKOUTEN BOREN<1:0> CPD 44
7:0 CP MCLRE PWRTE WDTE<1:0> FOSC<2:0>
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Watchdog Timer.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 103
PIC16(L)F1782/3
12.0 DATA EEPROM AND FLASH
PROGRAM MEMORY
CONTROL
The data EEPROM and Flash program memory are
readable and writable during normal operation (full VDD
range). These memories are not directly mapped in the
register file space. Instead, they are indirectly
addressed through the Special Function Registers
(SFRs). There are six SFRs used to access these
memories:
• EECON1
• EECON2
• EEDATL
•EEDATH
• EEADRL
•EEADRH
When interfacing the data memory block, EEDATL
holds the 8-bit data for read/write, and EEADRL holds
the address of the EEDATL location being accessed.
These devices have 256 bytes of data EEPROM with
an address range from 0h to 0FFh.
When accessing the program memory block, the
EEDATH:EEDATL register pair forms a 2-byte word
that holds the 14-bit data for read/write, and the
EEADRL and EEADRH registers form a 2-byte word
that holds the 15-bit address of the program memory
location being read.
The EEPROM data memory allows byte read and write.
An EEPROM byte write automatically erases the loca-
tion and writes the new data (erase before write).
The write time is controlled by an on-chip timer. The
write/erase voltages are generated by an on-chip
charge pump rated to operate over the voltage range of
the device for byte or word operations.
Depending on the setting of the Flash Program
Memory Self Write Enable bits WRT<1:0> of the
Configuration Words, the device may or may not be
able to write certain blocks of the program memory.
However, reads from the program memory are always
allowed.
When the device is code-protected, the device
programmer can no longer access data or program
memory. When code-protected, the CPU may continue
to read and write the data EEPROM memory and Flash
program memory.
12.1 EEADRL and EEADRH Registers
The EEADRH:EEADRL register pair can address up to
a maximum of 256 bytes of data EEPROM or up to a
maximum of 32K words of program memory.
When selecting a program address value, the MSB of
the address is written to the EEADRH register and the
LSB is written to the EEADRL register. When selecting
a EEPROM address value, only the LSB of the address
is written to the EEADRL register.
12.1.1 EECON1 AND EECON2 REGISTERS
EECON1 is the control register for EE memory
accesses.
Control bit EEPGD determines if the access will be a
program or data memory access. When clear, any
subsequent operations will operate on the EEPROM
memory. When set, any subsequent operations will
operate on the program memory. On Reset, EEPROM is
selected by default.
Control bits RD and WR initiate read and write,
respectively. These bits cannot be cleared, only set, in
software. They are cleared in hardware at completion
of the read or write operation. The inability to clear the
WR bit in software prevents the accidental, premature
termination of a write operation.
The WREN bit, when set, will allow a write operation to
occur. On power-up, the WREN bit is clear. The
WRERR bit is set when a write operation is interrupted
by a Reset during normal operation. In these situations,
following Reset, the user can check the WRERR bit
and execute the appropriate error handling routine.
Interrupt flag bit EEIF of the PIR2 register is set when
write is complete. It must be cleared in the software.
Reading EECON2 will read all ‘0’s. The EECON2 reg-
ister is used exclusively in the data EEPROM write
sequence. To enable writes, a specific pattern must be
written to EECON2.
PIC16(L)F1782/3
DS41579C-page 104 Preliminary 2011-2012 Microchip Technology Inc.
12.2 Using the Data EEPROM
The data EEPROM is a high-endurance, byte address-
able array that has been optimized for the storage of
frequently changing information (e.g., program vari-
ables or other data that are updated often). When vari-
ables in one section change frequently, while variables
in another section do not change, it is possible to
exceed the total number of write cycles to the
EEPROM without exceeding the total number of write
cycles to a single byte. Refer to Section 30.0 “Electri-
cal Specifications”. If this is the case, then a refresh
of the array must be performed. For this reason, vari-
ables that change infrequently (such as constants, IDs,
calibration, etc.) should be stored in Flash program
memory.
12.2.1 READING THE DATA EEPROM
MEMORY
To read a data memory location, the user must write the
address to the EEADRL register, clear the EEPGD and
CFGS control bits of the EECON1 register, and then
set control bit RD. The data is available at the very next
cycle, in the EEDATL register; therefore, it can be read
in the next instruction. EEDATL will hold this value until
another read or until it is written to by the user (during
a write operation).
EXAMPLE 12-1: DATA EEPROM READ
12.2.2 WRITING TO THE DATA EEPROM
MEMORY
To write an EEPROM data location, the user must first
write the address to the EEADRL register and the data
to the EEDATL register. Then the user must follow a
specific sequence to initiate the write for each byte.
The write will not initiate if the above sequence is not
followed exactly (write 55h to EECON2, write AAh to
EECON2, then set the WR bit) for each byte. Interrupts
should be disabled during this code segment.
Additionally, the WREN bit in EECON1 must be set to
enable write. This mechanism prevents accidental
writes to data EEPROM due to errant (unexpected)
code execution (i.e., lost programs). The user should
keep the WREN bit clear at all times, except when
updating EEPROM. The WREN bit is not cleared
by hardware.
After a write sequence has been initiated, clearing the
WREN bit will not affect this write cycle. The WR bit will
be inhibited from being set unless the WREN bit is set.
At the completion of the write cycle, the WR bit is
cleared in hardware and the EE Write Complete
Interrupt Flag bit (EEIF) is set. The user can either
enable this interrupt or poll this bit. EEIF must be
cleared by software.
12.2.3 PROTECTION AGAINST SPURIOUS
WRITE
There are conditions when the user may not want to
write to the data EEPROM memory. To protect against
spurious EEPROM writes, various mechanisms have
been built-in. On power-up, WREN is cleared. Also, the
Power-up Timer (64 ms duration) prevents EEPROM
write.
The write initiate sequence and the WREN bit together
help prevent an accidental write during:
• Brown-out
• Power Glitch
• Software Malfunction
12.2.4 DATA EEPROM OPERATION
DURING CODE-PROTECT
Data memory can be code-protected by programming
the CPD bit in the Configuration Words to ‘0’.
When the data memory is code-protected, only the
CPU is able to read and write data to the data
EEPROM. It is recommended to code-protect the pro-
gram memory when code-protecting data memory.
This prevents anyone from replacing your program with
a program that will access the contents of the data
EEPROM.
Note: Data EEPROM can be read regardless of
the setting of the CPD bit.
BANKSEL EEADRL ;
MOVLW DATA_EE_ADDR ;
MOVWF EEADRL ;Data Memory
;Address to read
BCF EECON1, CFGS ;Deselect Config space
BCF EECON1, EEPGD;Point to DATA memory
BSF EECON1, RD ;EE Read
MOVF EEDATL, W ;W = EEDATL
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EXAMPLE 12-2: DATA EEPROM WRITE
FIGURE 12-1: FLASH PROGRAM MEMORY READ CYCLE EXECUTION
BANKSEL EEADRL ;
MOVLW DATA_EE_ADDR ;
MOVWF EEADRL ;Data Memory Address to write
MOVLW DATA_EE_DATA ;
MOVWF EEDATL ;Data Memory Value to write
BCF EECON1, CFGS ;Deselect Configuration space
BCF EECON1, EEPGD ;Point to DATA memory
BSF EECON1, WREN ;Enable writes
BCF INTCON, GIE ;Disable INTs.
MOVLW 55h ;
MOVWF EECON2 ;Write 55h
MOVLW 0AAh ;
MOVWF EECON2 ;Write AAh
BSF EECON1, WR ;Set WR bit to begin write
BSF INTCON, GIE ;Enable Interrupts
BCF EECON1, WREN ;Disable writes
BTFSC EECON1, WR ;Wait for write to complete
GOTO $-2 ;Done
Required
Sequence
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
BSF PMCON1,RD
executed here INSTR(PC + 1)
executed here Forced NOP
executed here
PC
PC + 1 EEADRH,EEADRL PC+3 PC + 5
Flash ADDR
RD bit
EEDATH,EEDATL
PC + 3 PC + 4
INSTR (PC + 1)
INSTR(PC - 1)
executed here INSTR(PC + 3)
executed here INSTR(PC + 4)
executed here
Flash Data
EEDATH
EEDATL
Register
INSTR (PC) INSTR (PC + 3) INSTR (PC + 4)
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12.3 Flash Program Memory Overview
It is important to understand the Flash program mem-
ory structure for erase and programming operations.
Flash Program memory is arranged in rows. A row con-
sists of a fixed number of 14-bit program memory
words. A row is the minimum block size that can be
erased by user software.
Flash program memory may only be written or erased
if the destination address is in a segment of memory
that is not write-protected, as defined in bits WRT<1:0>
of Configuration Words.
After a row has been erased, the user can reprogram
all or a portion of this row. Data to be written into the
program memory row is written to 14-bit wide data write
latches. These write latches are not directly accessible
to the user, but may be loaded via sequential writes to
the EEDATH:EEDATL register pair.
The number of data write latches may not be equivalent
to the number of row locations. During programming,
user software may need to fill the set of write latches
and initiate a programming operation multiple times in
order to fully reprogram an erased row. For example, a
device with a row size of 32 words and eight write
latches will need to load the write latches with data and
initiate a programming operation four times.
The size of a program memory row and the number of
program memory write latches may vary by device.
See Table 12-1 for details.
12.3.1 READING THE FLASH PROGRAM
MEMORY
To read a program memory location, the user must:
1. Write the Least and Most Significant address
bits to the EEADRH:EEADRL register pair.
2. Clear the CFGS bit of the EECON1 register.
3. Set the EEPGD control bit of the EECON1
register.
4. Then, set control bit RD of the EECON1 register.
Once the read control bit is set, the program memory
Flash controller will use the second instruction cycle to
read the data. This causes the second instruction
immediately following the “BSF EECON1,RD” instruction
to be ignored. The data is available in the very next cycle,
in the EEDATH:EEDATL register pair; therefore, it can
be read as two bytes in the following instructions.
EEDATH:EEDATL register pair will hold this value until
another read or until it is written to by the user.
Note: If the user wants to modify only a portion
of a previously programmed row, then the
contents of the entire row must be read
and saved in RAM prior to the erase.
TABLE 12-1: FLASH MEMORY
ORGANIZATION BY DEVICE
Device
Erase Block
(Row)
Size/Boundary
Number of Write
Latches/Boundary
PIC16F1782
PIC16LF1782
PIC16F1783
PIC16LF1783
32 words,
EEADRL<4:0>
= 00000
32 words,
EEADRL<4:0>
= 00000
Note 1: The two instructions following a program
memory read are required to be NOPs.
This prevents the user from executing a
two-cycle instruction on the next
instruction after the RD bit is set.
2: Flash program memory can be read
regardless of the setting of the CP bit.
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EXAMPLE 12-3: FLASH PROGRAM MEMORY READ
* This code block will read 1 word of program
* memory at the memory address:
PROG_ADDR_HI : PROG_ADDR_LO
* data will be returned in the variables;
* PROG_DATA_HI, PROG_DATA_LO
BANKSEL EEADRL ; Select Bank for EEPROM registers
MOVLW PROG_ADDR_LO ;
MOVWF EEADRL ; Store LSB of address
MOVLW PROG_ADDR_HI ;
MOVWL EEADRH ; Store MSB of address
BCF EECON1,CFGS ; Do not select Configuration Space
BSF EECON1,EEPGD ; Select Program Memory
BCF INTCON,GIE ; Disable interrupts
BSF EECON1,RD ; Initiate read
NOP ; Executed (Figure 12-1)
NOP ; Ignored (Figure 12-1)
BSF INTCON,GIE ; Restore interrupts
MOVF EEDATL,W ; Get LSB of word
MOVWF PROG_DATA_LO ; Store in user location
MOVF EEDATH,W ; Get MSB of word
MOVWF PROG_DATA_HI ; Store in user location
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DS41579C-page 108 Preliminary 2011-2012 Microchip Technology Inc.
12.3.2 ERASING FLASH PROGRAM
MEMORY
While executing code, program memory can only be
erased by rows. To erase a row:
1. Load the EEADRH:EEADRL register pair with
the address of new row to be erased.
2. Clear the CFGS bit of the EECON1 register.
3. Set the EEPGD, FREE, and WREN bits of the
EECON1 register.
4. Write 55h, then AAh, to EECON2 (Flash
programming unlock sequence).
5. Set control bit WR of the EECON1 register to
begin the erase operation.
6. Poll the FREE bit in the EECON1 register to
determine when the row erase has completed.
See Example 12-4.
After the “BSF EECON1,WR” instruction, the processor
requires two cycles to set up the erase operation. The
user must place two NOP instructions after the WR bit is
set. The processor will halt internal operations for the
typical 2 ms erase time. This is not Sleep mode as the
clocks and peripherals will continue to run. After the
erase cycle, the processor will resume operation with
the third instruction after the EECON1 write instruction.
12.3.3 WRITING TO FLASH PROGRAM
MEMORY
Program memory is programmed using the following
steps:
1. Load the starting address of the word(s) to be
programmed.
2. Load the write latches with data.
3. Initiate a programming operation.
4. Repeat steps 1 through 3 until all data is written.
Before writing to program memory, the word(s) to be
written must be erased or previously unwritten. Pro-
gram memory can only be erased one row at a time. No
automatic erase occurs upon the initiation of the write.
Program memory can be written one or more words at
a time. The maximum number of words written at one
time is equal to the number of write latches. See
Figure 12-2 (block writes to program memory with 32
write latches) for more details. The write latches are
aligned to the address boundary defined by EEADRL
as shown in Table 12-1. Write operations do not cross
these boundaries. At the completion of a program
memory write operation, the write latches are reset to
contain 0x3FFF.
The following steps should be completed to load the
write latches and program a block of program memory.
These steps are divided into two parts. First, all write
latches are loaded with data except for the last program
memory location. Then, the last write latch is loaded
and the programming sequence is initiated. A special
unlock sequence is required to load a write latch with
data or initiate a Flash programming operation. This
unlock sequence should not be interrupted.
1. Set the EEPGD and WREN bits of the EECON1
register.
2. Clear the CFGS bit of the EECON1 register.
3. Set the LWLO bit of the EECON1 register. When
the LWLO bit of the EECON1 register is ‘1’, the
write sequence will only load the write latches
and will not initiate the write to Flash program
memory.
4. Load the EEADRH:EEADRL register pair with
the address of the location to be written.
5. Load the EEDATH:EEDATL register pair with
the program memory data to be written.
6. Write 55h, then AAh, to EECON2, then set the
WR bit of the EECON1 register (Flash
programming unlock sequence). The write latch
is now loaded.
7. Increment the EEADRH:EEADRL register pair
to point to the next location.
8. Repeat steps 5 through 7 until all but the last
write latch has been loaded.
9. Clear the LWLO bit of the EECON1 register.
When the LWLO bit of the EECON1 register is
‘0’, the write sequence will initiate the write to
Flash program memory.
10. Load the EEDATH:EEDATL register pair with
the program memory data to be written.
11. Write 55h, then AAh, to EECON2, then set the
WR bit of the EECON1 register (Flash
programming unlock sequence). The entire
latch block is now written to Flash program
memory.
It is not necessary to load the entire write latch block
with user program data. However, the entire write latch
block will be written to program memory.
An example of the complete write sequence for eight
words is shown in Example 12-5. The initial address is
loaded into the EEADRH:EEADRL register pair; the
eight words of data are loaded using indirect addressing.
After the “BSF EECON1,WR” instruction, the processor
requires two cycles to set up the write operation. The
user must place two NOP instructions after the WR bit is
set. The processor will halt internal operations for the
typical 2 ms, only during the cycle in which the write
takes place (i.e., the last word of the block write). This
is not Sleep mode as the clocks and peripherals will
continue to run. The processor does not stall when
LWLO = 1, loading the write latches. After the write
cycle, the processor will resume operation with the third
instruction after the EECON1 WRITE instruction.
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FIGURE 12-2: BLOCK WRITES TO FLASH PROGRAM MEMORY WITH 32 WRITE LATCHES
EXAMPLE 12-4: ERASING ONE ROW OF PROGRAM MEMORY
14 14 14 14
Program Memory
Buffer Register
EEADRL<4:0> = 00000
Buffer Register
EEADRL<4:0> = 00001
Buffer Register
EEADRL<4:0> = 00010
Buffer Register
EEADRL<4:0> = 11111
EEDATAEEDATH
75 07 0
68
First word of block
to be written
Last word of block
to be written
; This row erase routine assumes the following:
; 1. A valid address within the erase block is loaded in ADDRH:ADDRL
; 2. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM)
BCF INTCON,GIE ; Disable ints so required sequences will execute properly
BANKSEL EEADRL
MOVF ADDRL,W ; Load lower 8 bits of erase address boundary
MOVWF EEADRL
MOVF ADDRH,W ; Load upper 6 bits of erase address boundary
MOVWF EEADRH
BSF EECON1,EEPGD ; Point to program memory
BCF EECON1,CFGS ; Not configuration space
BSF EECON1,FREE ; Specify an erase operation
BSF EECON1,WREN ; Enable writes
MOVLW 55h ; Start of required sequence to initiate erase
MOVWF EECON2 ; Write 55h
MOVLW 0AAh ;
MOVWF EECON2 ; Write AAh
BSF EECON1,WR ; Set WR bit to begin erase
NOP ; Any instructions here are ignored as processor
; halts to begin erase sequence
NOP ; Processor will stop here and wait for erase complete.
; after erase processor continues with 3rd instruction
BCF EECON1,WREN ; Disable writes
BSF INTCON,GIE ; Enable interrupts
Required
Sequence
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DS41579C-page 110 Preliminary 2011-2012 Microchip Technology Inc.
EXAMPLE 12-5: WRITING TO FLASH PROGRAM MEMORY
; This write routine assumes the following:
; 1. The 16 bytes of data are loaded, starting at the address in DATA_ADDR
; 2. Each word of data to be written is made up of two adjacent bytes in DATA_ADDR,
; stored in little endian format
; 3. A valid starting address (the least significant bits = 000) is loaded in ADDRH:ADDRL
; 4. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM)
;
BCF INTCON,GIE ; Disable ints so required sequences will execute properly
BANKSEL EEADRH ; Bank 3
MOVF ADDRH,W ; Load initial address
MOVWF EEADRH ;
MOVF ADDRL,W ;
MOVWF EEADRL ;
MOVLW LOW DATA_ADDR ; Load initial data address
MOVWF FSR0L ;
MOVLW HIGH DATA_ADDR ; Load initial data address
MOVWF FSR0H ;
BSF EECON1,EEPGD ; Point to program memory
BCF EECON1,CFGS ; Not configuration space
BSF EECON1,WREN ; Enable writes
BSF EECON1,LWLO ; Only Load Write Latches
LOOP
MOVIW FSR0++ ; Load first data byte into lower
MOVWF EEDATL ;
MOVIW FSR0++ ; Load second data byte into upper
MOVWF EEDATH ;
MOVF EEADRL,W ; Check if lower bits of address are '000'
XORLW 0x07 ; Check if we're on the last of 8 addresses
ANDLW 0x07 ;
BTFSC STATUS,Z ; Exit if last of eight words,
GOTO START_WRITE ;
MOVLW 55h ; Start of required write sequence:
MOVWF EECON2 ; Write 55h
MOVLW 0AAh ;
MOVWF EECON2 ; Write AAh
BSF EECON1,WR ; Set WR bit to begin write
NOP ; Any instructions here are ignored as processor
; halts to begin write sequence
NOP ; Processor will stop here and wait for write to complete.
; After write processor continues with 3rd instruction.
INCF EEADRL,F ; Still loading latches Increment address
GOTO LOOP ; Write next latches
START_WRITE
BCF EECON1,LWLO ; No more loading latches - Actually start Flash program
; memory write
MOVLW 55h ; Start of required write sequence:
MOVWF EECON2 ; Write 55h
MOVLW 0AAh ;
MOVWF EECON2 ; Write AAh
BSF EECON1,WR ; Set WR bit to begin write
NOP ; Any instructions here are ignored as processor
; halts to begin write sequence
NOP ; Processor will stop here and wait for write complete.
; after write processor continues with 3rd instruction
BCF EECON1,WREN ; Disable writes
BSF INTCON,GIE ; Enable interrupts
Required
Sequence
Required
Sequence
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12.4 Modifying Flash Program Memory
When modifying existing data in a program memory
row, and data within that row must be preserved, it must
first be read and saved in a RAM image. Program
memory is modified using the following steps:
1. Load the starting address of the row to be mod-
ified.
2. Read the existing data from the row into a RAM
image.
3. Modify the RAM image to contain the new data
to be written into program memory.
4. Load the starting address of the row to be rewrit-
ten.
5. Erase the program memory row.
6. Load the write latches with data from the RAM
image.
7. Initiate a programming operation.
8. Repeat steps 6 and 7 as many times as required
to reprogram the erased row.
12.5 User ID, Device ID and
Configuration Word Access
Instead of accessing program memory or EEPROM
data memory, the User ID’s, Device ID/Revision ID and
Configuration Words can be accessed when CFGS = 1
in the EECON1 register. This is the region that would
be pointed to by PC<15> = 1, but not all addresses are
accessible. Different access may exist for reads and
writes. Refer to Table 12- 2 .
When read access is initiated on an address outside
the parameters listed in Table 12-2, the EEDATH:EED-
ATL register pair is cleared.
TABLE 12-2: USER ID, DEVICE ID AND CONFIGURATION WORD ACCESS (CFGS = 1)
EXAMPLE 12-3: CONFIGURATION WORD AND DEVICE ID ACCESS
Address Function Read Access Write Access
8000h-8003h User IDs Yes Yes
8006h Device ID/Revision ID Yes No
8007h-8008h Configuration Words 1 and 2 Yes No
* This code block will read 1 word of program memory at the memory address:
* PROG_ADDR_LO (must be 00h-08h) data will be returned in the variables;
* PROG_DATA_HI, PROG_DATA_LO
BANKSEL EEADRL ; Select correct Bank
MOVLW PROG_ADDR_LO ;
MOVWF EEADRL ; Store LSB of address
CLRF EEADRH ; Clear MSB of address
BSF EECON1,CFGS ; Select Configuration Space
BCF INTCON,GIE ; Disable interrupts
BSF EECON1,RD ; Initiate read
NOP ; Executed (See Figure 12-1)
NOP ; Ignored (See Figure 12-1)
BSF INTCON,GIE ; Restore interrupts
MOVF EEDATL,W ; Get LSB of word
MOVWF PROG_DATA_LO ; Store in user location
MOVF EEDATH,W ; Get MSB of word
MOVWF PROG_DATA_HI ; Store in user location
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12.6 Write Verify
Depending on the application, good programming
practice may dictate that the value written to the data
EEPROM or program memory should be verified (see
Example 12-6) to the desired value to be written.
Example 12-6 shows how to verify a write to EEPROM.
EXAMPLE 12-6: EEPROM WRITE VERIFY
BANKSEL EEDATL ;
MOVF EEDATL, W ;EEDATL not changed
;from previous write
BSF EECON1, RD ;YES, Read the
;value written
XORWF EEDATL, W ;
BTFSS STATUS, Z ;Is data the same
GOTO WRITE_ERR ;No, handle error
: ;Yes, continue
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12.7 Register Definitions: EEPROM and Flash Control
REGISTER 12-1: EEDATL: EEPROM DATA LOW BYTE REGISTER
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
EEDAT<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 EEDAT<7:0>: Read/write value for EEPROM data byte or Least Significant bits of program memory
REGISTER 12-2: EEDATH: EEPROM DATA HIGH BYTE REGISTER
U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
—— EEDAT<13:8>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 EEDAT<13:8>: Read/write value for Most Significant bits of program memory
REGISTER 12-3: EEADRL: EEPROM ADDRESS REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
EEADR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 EEADR<7:0>: Specifies the Least Significant bits for program memory address or EEPROM address
REGISTER 12-4: EEADRH: EEPROM ADDRESS HIGH BYTE REGISTER
U-1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
—(1) EEADR<14:8>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 Unimplemented: Read as ‘1’
bit 6-0 EEADR<14:8>: Specifies the Most Significant bits for program memory address or EEPROM address
Note 1: Unimplemented, read as ‘1’.
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DS41579C-page 114 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 12-5: EECON1: EEPROM CONTROL 1 REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W/HC-0/0 R/W-x/q R/W-0/0 R/S/HC-0/0 R/S/HC-0/0
EEPGD CFGS LWLO FREE WRERR WREN WR RD
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware
bit 7 EEPGD: Flash Program/Data EEPROM Memory Select bit
1 = Accesses program space Flash memory
0 = Accesses data EEPROM memory
bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit
1 = Accesses Configuration, User ID and Device ID registers
0 = Accesses Flash Program or data EEPROM memory
bit 5 LWLO: Load Write Latches Only bit
If CFGS = 1 (Configuration space) OR CFGS = 0 and EEPGD = 1 (program Flash):
1 = The next WR command does not initiate a write; only the program memory latches are
updated.
0 = The next WR command writes a value from EEDATH:EEDATL into program memory latches
and initiates a write of all the data stored in the program memory latches.
If CFGS = 0 and EEPGD = 0: (Accessing data EEPROM)
LWLO is ignored. The next WR command initiates a write to the data EEPROM.
bit 4 FREE: Program Flash Erase Enable bit
If CFGS = 1 (Configuration space) OR CFGS = 0 and EEPGD = 1 (program Flash):
1 = Performs an erase operation on the next WR command (cleared by hardware after comple-
tion of erase).
0 = Performs a write operation on the next WR command.
If EEPGD = 0 and CFGS = 0: (Accessing data EEPROM)
FREE is ignored. The next WR command will initiate both a erase cycle and a write cycle.
bit 3 WRERR: EEPROM Error Flag bit
1 = Condition indicates an improper program or erase sequence attempt or termination (bit is set
automatically on any set attempt (write ‘1’) of the WR bit).
0 = The program or erase operation completed normally.
bit 2 WREN: Program/Erase Enable bit
1 = Allows program/erase cycles
0 = Inhibits programming/erasing of program Flash and data EEPROM
bit 1 WR: Write Control bit
1 = Initiates a program Flash or data EEPROM program/erase operation.
The operation is self-timed and the bit is cleared by hardware once operation is complete.
The WR bit can only be set (not cleared) in software.
0 = Program/erase operation to the Flash or data EEPROM is complete and inactive.
bit 0 RD: Read Control bit
1 = Initiates an program Flash or data EEPROM read. Read takes one cycle. RD is cleared in
hardware. The RD bit can only be set (not cleared) in software.
0 = Does not initiate a program Flash or data EEPROM data read.
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TABLE 12-3: SUMMARY OF REGISTERS ASSOCIATED WITH DATA EEPROM
REGISTER 12-6: EECON2: EEPROM CONTROL 2 REGISTER
W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0
EEPROM Control Register 2
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 Data EEPROM Unlock Pattern bits
To unlock writes, a 55h must be written first, followed by an AAh, before setting the WR bit of the
EECON1 register. The value written to this register is used to unlock the writes. There are specific
timing requirements on these writes. Refer to Section 12.2.2 “Writing to the Data EEPROM
Memory” for more information.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on
Page
EECON1 EEPGD CFGS LWLO FREE WRERR WREN WR RD 114
EECON2 EEPROM Control Register 2 (not a physical register) 115*
EEADRL EEADRL<7:0> 113
EEADRH —(1) EEADRH<6:0> 113
EEDATL EEDATL<7:0> 113
EEDATH —— EEDATH<5:0> 113
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
PIE2 OSFIE C2IE C1IE EEIE BCLIE —C3IE CCP2IE 86
PIR2 OSFIF C2IF C1IF EEIF BCLIF —C3IF CCP2IF 89
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by data EEPROM module.
* Page provides register information.
2: Unimplemented, read as ‘1’.
PIC16(L)F1782/3
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13.0 I/O PORTS
Each port has three standard registers for its operation.
These registers are:
• TRISx registers (data direction)
• PORTx registers (reads the levels on the pins of
the device)
• LATx registers (output latch)
Some ports may have one or more of the following
additional registers. These registers are:
• ANSELx (analog select)
• WPUx (weak pull-up)
In general, when a peripheral is enabled on a port pin,
that pin cannot be used as a general purpose output.
However, the pin can still be read.
The Data Latch (LATx registers) is useful for
read-modify-write operations on the value that the I/O
pins are driving.
A write operation to the LATx register has the same
effect as a write to the corresponding PORTx register.
A read of the LATx register reads of the values held in
the I/O PORT latches, while a read of the PORTx
register reads the actual I/O pin value.
Ports that support analog inputs have an associated
ANSELx register. When an ANSEL bit is set, the digital
input buffer associated with that bit is disabled.
Disabling the input buffer prevents analog signal levels
on the pin between a logic high and low from causing
excessive current in the logic input circuitry. A
simplified model of a generic I/O port, without the
interfaces to other peripherals, is shown in Figure 13-1.
FIGURE 13-1: GENERIC I/O PORT
OPERATION
EXAMPLE 13-1: INITIALIZING PORTA
TABLE 13-1: PORT AVAILABILITY PER
DEVICE
Device
PORTA
PORTB
PORTC
PORTE
PIC16(L)F1782 ●●●●
PIC16(L)F1783 ●●●●
QD
CK
Write LATx
Data Register
I/O pin
Read PORTx
Write PORTx
TRISx
Read LATx
Data Bus
To peripherals
ANSELx
VDD
VSS
; This code example illustrates
; initializing the PORTA register. The
; other ports are initialized in the same
; manner.
BANKSEL PORTA ;
CLRF PORTA ;Init PORTA
BANKSEL LATA ;Data Latch
CLRF LATA ;
BANKSEL ANSELA ;
CLRF ANSELA ;digital I/O
BANKSEL TRISA ;
MOVLW B'00111000' ;Set RA<5:3> as inputs
MOVWF TRISA ;and set RA<2:0> as
;outputs
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13.1 Alternate Pin Function
The Alternate Pin Function Control (APFCON) register
is used to steer specific peripheral input and output
functions between different pins. The APFCON register
is shown in Register 13-1. For this device family, the
following functions can be moved between different
pins.
• C2OUT output
• CCP1 output
• SDO output
• SCL/SCK output
• SDA/SDI output
• TX/RX output
• CCP2 output
These bits have no effect on the values of any TRIS
register. PORT and TRIS overrides will be routed to the
correct pin. The unselected pin will be unaffected.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 119
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13.2 Register Definitions: Alternate Pin Function Control
REGISTER 13-1: APFCON: ALTERNATE PIN FUNCTION CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
C2OUTSEL CCP1SEL SDOSEL SCKSEL SDISEL
TXSEL
RXSEL CCP2SEL
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 C2OUTSEL: C2OUT pin selection bit
1 = C2OUT is on pin RA6
0 = C2OUT is on pin RA5
bit 6 CCP1SEL: CCP1 Input/Output Pin Selection bit
1 = CCP1 is on pin RB0
0 = CCP1 is on pin RC2
bit 5 SDOSEL: MSSP SDO Pin Selection bit
1 = SDO is on pin RB5
0 = SDO is on pin RC5
bit 4 SCKSEL: MSSP Serial Clock (SCL/SCK) Pin Selection bit
1 = SCL/SCK is on pin RB7
0 = SCL/SCK is on pin RC3
bit 3 SDISEL: MSSP Serial Data (SDA/SDI) Output Pin Selection bit
1 = SDA/SDI is on pin RB6
0 = SDA/SDI is on pin RC4
bit 2 TXSEL: TX Pin Selection bit
1 = TX is on pin RB6
0 = TX is on pin RC6
bit 1 RXSEL: RX Pin Selection bit
1 = RX is on pin RB7
0 = RX is on pin RC7
bit 0 CCP2SEL: CCP2 Input/Output Pin Selection bit
1 = CCP2 is on pin RB3
0 = CCP2 is on pin RC1
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13.3 PORTA Registers
13.3.1 DATA REGISTER
PORTA is an 8-bit wide, bidirectional port. The
corresponding data direction register is TRISA
(Register 13-3). Setting a TRISA bit (= 1) will make the
corresponding PORTA pin an input (i.e., disable the
output driver). Clearing a TRISA bit (= 0) will make the
corresponding PORTA pin an output (i.e., enables
output driver and puts the contents of the output latch
on the selected pin). The exception is RA3, which is
input only and its TRIS bit will always read as ‘1’.
Example 13-1 shows how to initialize PORTA.
Reading the PORTA register (Register 13-2) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then
written to the PORT data latch (LATA).
13.3.2 DIRECTION CONTROL
The TRISA register (Register 13-3) controls the
PORTA pin output drivers, even when they are being
used as analog inputs. The user should ensure the bits
in the TRISA register are maintained set when using
them as analog inputs. I/O pins configured as analog
inputs always read ‘0’.
13.3.3 OPEN DRAIN CONTROL
The ODCONA register (Register 13-7) controls the
open-drain feature of the port. Open drain operation is
independently selected for each pin. When an
ODCONA bit is set, the corresponding port output
becomes an open drain driver capable of sinking
current only. When an ODCONA bit is cleared, the
corresponding port output pin is the standard push-pull
drive capable of sourcing and sinking current.
13.3.4 SLEW RATE CONTROL
The SLRCONA register (Register 13-8) controls the
slew rate option for each port pin. Slew rate control is
independently selectable for each port pin. When an
SLRCONA bit is set, the corresponding port pin drive is
slew rate limited. When an SLRCONA bit is cleared,
The corresponding port pin drive slews at the maximum
rate possible.
13.3.5 INPUT THRESHOLD CONTROL
The INLVLA register (Register 13-9) controls the input
voltage threshold for each of the available PORTA input
pins. A selection between the Schmitt Trigger CMOS or
the TTL Compatible thresholds is available. The input
threshold is important in determining the value of a
read of the PORTA register and also the level at which
an interrupt-on-change occurs, if that feature is
enabled. See Section 30.1 “DC Characteristics:
PIC16(L)F1782/3-I/E (Industrial, Extended)” for more
information on threshold levels.
13.3.6 ANALOG CONTROL
The ANSELA register (Register 13-5) is used to
configure the Input mode of an I/O pin to analog.
Setting the appropriate ANSELA bit high will cause all
digital reads on the pin to be read as ‘0’ and allow
analog functions on the pin to operate correctly.
The state of the ANSELA bits has no effect on digital
output functions. A pin with TRIS clear and ANSEL set
will still operate as a digital output, but the Input mode
will be analog. This can cause unexpected behavior
when executing read-modify-write instructions on the
affected port.
Note: Changing the input threshold selection
should be performed while all peripheral
modules are disabled. Changing the
threshold level during the time a module is
active may inadvertently generate a tran-
sition associated with an input pin, regard-
less of the actual voltage level on that pin.
Note: The ANSELA bits default to the Analog
mode after Reset. To use any pins as
digital general purpose or peripheral
inputs, the corresponding ANSEL bits
must be initialized to ‘0’ by user software.
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13.3.7 PORTA FUNCTIONS AND OUTPUT
PRIORITIES
Each PORTA pin is multiplexed with other functions. The
pins, their combined functions and their output priorities
are shown in Table 13-2.
When multiple outputs are enabled, the actual pin
control goes to the peripheral with the highest priority.
Analog input functions, such as ADC, and comparator
inputs, are not shown in the priority lists. These inputs
are active when the I/O pin is set for Analog mode using
the ANSELx registers. Digital output functions may
control the pin when it is in Analog mode with the
priority shown in the priority list.
TABLE 13-2: PORTA OUTPUT PRIORITY
Pin Name Function Priority(1)
RA0 RA0
RA1 OPA1OUT
RA1
RA2 DACOUT1
RA2
RA3 RA3
RA4 C1OUT
RA4
RA5 C2OUT
RA5
RA6 CLKOUT
C2OUT
RA6
RA7 RA7
Note 1: Priority listed from highest to lowest.
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13.4 Register Definitions: PORTA
REGISTER 13-2: PORTA: PORTA REGISTER
R/W-x/x R/W-x/x R/W-x/x R/W-x/x R-x/x R/W-x/x R/W-x/x R/W-x/x
RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 RA<7:0>: PORTA I/O Value bits(1)
1 = Port pin is > VIH
0 = Port pin is < VIL
Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return of
actual I/O pin values.
REGISTER 13-3: TRISA: PORTA TRI-STATE REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R-1/1 R/W-1/1 R/W-1/1 R/W-1/1
TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-4 TRISA<7:4>: PORTA Tri-State Control bits
1 = PORTA pin configured as an input (tri-stated)
0 = PORTA pin configured as an output
bit 3 TRISA3: RA3 Port Tri-State Control bit
This bit is always ‘1’ as RA3 is an input only
bit 2-0 TRISA<2:0>: PORTA Tri-State Control bits
1 = PORTA pin configured as an input (tri-stated)
0 = PORTA pin configured as an output
REGISTER 13-4: LATA: PORTA DATA LATCH REGISTER
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
LATA7 LATA6 LATA5 LATA4 LATA3 LATA2 LATA1 LATA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-4 LATA<7:0>: PORTA Output Latch Value bits(1)
Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return of
actual I/O pin values.
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REGISTER 13-5: ANSELA: PORTA ANALOG SELECT REGISTER
R/W-1/1 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
ANSA7 — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 5 ANSA7: Analog Select between Analog or Digital Function on pins RA7, respectively
0 = Digital I/O. Pin is assigned to port or digital special function.
1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled.
bit 6 Unimplemented: Read as ‘0’
bit 5-0 ANSA<5:0>: Analog Select between Analog or Digital Function on pins RA<5:0>, respectively
0 = Digital I/O. Pin is assigned to port or digital special function.
1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled.
Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to
allow external control of the voltage on the pin.
REGISTER 13-6: WPUA: WEAK PULL-UP PORTA REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
WPUA7 WPUA6 WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 WPUA<7:0>: Weak Pull-up Register bits
1 = Pull-up enabled
0 = Pull-up disabled
Note 1: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled.
2: The weak pull-up device is automatically disabled if the pin is in configured as an output.
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REGISTER 13-7: ODCONA: PORTA OPEN DRAIN CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
ODA7 ODA6 ODA5 ODA4 ODA3 ODA2 ODA1 ODA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 ODA<7:0>: PORTA Open Drain Enable bits
For RA<7:0> pins, respectively
1 = Port pin operates as open-drain drive (sink current only)
0 = Port pin operates as standard push-pull drive (source and sink current)
REGISTER 13-8: SLRCONA: PORTA SLEW RATE CONTROL REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
SLRA7 SLRA6 SLRA5 SLRA4 SLRA3 SLRA2 SLRA1 SLRA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 SLRA<7:0>: PORTA Slew Rate Enable bits
For RA<7:0> pins, respectively
1 = Port pin slew rate is limited
0 = Port pin slews at maximum rate
REGISTER 13-9: INLVLA: PORTA INPUT LEVEL CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
INLVLA7 INLVLA6 INLVLA5 INLVLA4 INLVLA3 INLVLA2 INLVLA1 INLVLA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 INLVLA<7:0>: PORTA Input Level Select bits
For RA<7:0> pins, respectively
1 = ST input used for PORT reads and interrupt-on-change
0 = TTL input used for PORT reads and interrupt-on-change
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TABLE 13-3: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA
TABLE 13-4: SUMMARY OF CONFIGURATION WORD WITH PORTA
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELA ANSA7 — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 123
INLVLA INLVLA7 INLVLA6 INLVLA5 INLVLA4 INLVLA3 INLVLA2 INLVLA1 INLVLA0 124
LATA LATA7 LATA6 LATA5 LATA4 LATA3 LATA2 LATA1 LATA0 122
ODCONA ODA7 ODA6 ODA5 ODA4 ODA3 ODA2 ODA1 ODA0 124
OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 183
PORTA RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 122
SLRCONA SLRA7 SLRA6 SLRA5 SLRA4 SLRA3 SLRA2 SLRA1 SLRA0 124
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 122
WPUA WPUA7 WPUA6 WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 123
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA.
Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1 13:8 — — FCMEN IESO CLKOUTEN BOREN<1:0> CPD 44
7:0 CP MCLRE PWRTE WDTE<1:0> FOSC<2:0>
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by PORTA.
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13.5 PORTB Registers
PORTB is an 8-bit wide, bidirectional port. The
corresponding data direction register is TRISB
(Register 13-11). Setting a TRISB bit (= 1) will make the
corresponding PORTB pin an input (i.e., put the
corresponding output driver in a High-Impedance mode).
Clearing a TRISB bit (= 0) will make the corresponding
PORTB pin an output (i.e., enable the output driver and
put the contents of the output latch on the selected pin).
Example 13-1 shows how to initialize an I/O port.
Reading the PORTB register (Register 13-10) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then written
to the PORT data latch (LATB).
13.5.1 DIRECTION CONTROL
The TRISB register (Register 13-11) controls the PORTB
pin output drivers, even when they are being used as
analog inputs. The user should ensure the bits in the
TRISB register are maintained set when using them as
analog inputs. I/O pins configured as analog inputs
always read ‘0’.
13.5.2 OPEN DRAIN CONTROL
The ODCONB register (Register 13-15) controls the
open-drain feature of the port. Open drain operation is
independently selected for each pin. When an
ODCONB bit is set, the corresponding port output
becomes an open drain driver capable of sinking
current only. When an ODCONB bit is cleared, the
corresponding port output pin is the standard push-pull
drive capable of sourcing and sinking current.
13.5.3 SLEW RATE CONTROL
The SLRCONB register (Register 13-16) controls the
slew rate option for each port pin. Slew rate control is
independently selectable for each port pin. When an
SLRCONB bit is set, the corresponding port pin drive is
slew rate limited. When an SLRCONB bit is cleared,
The corresponding port pin drive slews at the maximum
rate possible.
13.5.4 INPUT THRESHOLD CONTROL
The INLVLB register (Register 13-17) controls the input
voltage threshold for each of the available PORTB
input pins. A selection between the Schmitt Trigger
CMOS or the TTL Compatible thresholds is available.
The input threshold is important in determining the
value of a read of the PORTB register and also the level
at which an interrupt-on-change occurs, if that feature
is enabled. See Section 30.1 “DC Characteristics:
PIC16(L)F1782/3-I/E (Industrial, Extended)” for more
information on threshold levels.
13.5.5 ANALOG CONTROL
The ANSELB register (Register 13-13) is used to
configure the Input mode of an I/O pin to analog.
Setting the appropriate ANSELB bit high will cause all
digital reads on the pin to be read as ‘0’ and allow
analog functions on the pin to operate correctly.
The state of the ANSELB bits has no effect on digital out-
put functions. A pin with TRIS clear and ANSELB set will
still operate as a digital output, but the Input mode will be
analog. This can cause unexpected behavior when exe-
cuting read-modify-write instructions on the affected
port.
Note: Changing the input threshold selection
should be performed while all peripheral
modules are disabled. Changing the
threshold level during the time a module is
active may inadvertently generate a tran-
sition associated with an input pin, regard-
less of the actual voltage level on that pin.
Note: The ANSELB bits default to the Analog
mode after Reset. To use any pins as
digital general purpose or peripheral
inputs, the corresponding ANSEL bits
must be initialized to ‘0’ by user software.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 127
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13.5.6 PORTB FUNCTIONS AND OUTPUT
PRIORITIES
Each PORTB pin is multiplexed with other functions. The
pins, their combined functions and their output priorities
are shown in Table 13-5.
When multiple outputs are enabled, the actual pin
control goes to the peripheral with the highest priority.
Analog input and some digital input functions are not
included in the list below. These input functions can
remain active when the pin is configured as an output.
Certain digital input functions override other port
functions and are included in the priority list.
TABLE 13-5: PORTB OUTPUT PRIORITY
Pin Name Function Priority(1)
RB0 CCP1
RB0
RB1 OPA2OUT
RB1
RB2 CLKR
RB2
RB3 CCP2
RB3
RB4 RB4
RB5 SDO
C3OUT
RB5
RB6 ICSPCLK
SDA
TX/CK
RB6
RB7 ICSPDAT
DACOUT2
SCL/SCK
DT
RB7
Note 1: Priority listed from highest to lowest.
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13.6 Register Definitions: PORTB
REGISTER 13-10: PORTB: PORTB REGISTER
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 RB<7:0>: PORTB General Purpose I/O Pin bits(1)
1 = Port pin is > VIH
0 = Port pin is < VIL
Note 1: Writes to PORTB are actually written to corresponding LATB register. Reads from PORTB register is return of
actual I/O pin values.
REGISTER 13-11: TRISB: PORTB TRI-STATE REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 TRISB<7:0>: PORTB Tri-State Control bits
1 = PORTB pin configured as an input (tri-stated)
0 = PORTB pin configured as an output
REGISTER 13-12: LATB: PORTB DATA LATCH REGISTER
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 LATB<7:0>: PORTB Output Latch Value bits(1)
Note 1: Writes to PORTB are actually written to corresponding LATB register. Reads from PORTB register is
return of actual I/O pin values.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 129
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REGISTER 13-13: ANSELB: PORTB ANALOG SELECT REGISTER
U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
—— ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 ANSB<5:0>: Analog Select between Analog or Digital Function on pins RB<5:0>, respectively
0 = Digital I/O. Pin is assigned to port or digital special function.
1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled.
Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to
allow external control of the voltage on the pin.
REGISTER 13-14: WPUB: WEAK PULL-UP PORTB REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 WPUB<7:0>: Weak Pull-up Register bits
1 = Pull-up enabled
0 = Pull-up disabled
Note 1: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled.
2: The weak pull-up device is automatically disabled if the pin is in configured as an output.
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DS41579C-page 130 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 13-15: ODCONB: PORTB OPEN DRAIN CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
ODB7 ODB6 ODB5 ODB4 ODB3 ODB2 ODB1 ODB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 ODB<7:0>: PORTB Open Drain Enable bits
For RB<7:0> pins, respectively
1 = Port pin operates as open-drain drive (sink current only)
0 = Port pin operates as standard push-pull drive (source and sink current)
REGISTER 13-16: SLRCONB: PORTB SLEW RATE CONTROL REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
SLRB7 SLRB6 SLRB5 SLRB4 SLRB3 SLRB2 SLRB1 SLRB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 SLRB<7:0>: PORTB Slew Rate Enable bits
For RB<7:0> pins, respectively
1 = Port pin slew rate is limited
0 = Port pin slews at maximum rate
REGISTER 13-17: INLVLB: PORTB INPUT LEVEL CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
INLVLB7 INLVLB6 INLVLB5 INLVLB4 INLVLB3 INLVLB2 INLVLB1 INLVLB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 INLVLB<7:0>: PORTB Input Level Select bits
For RB<7:0> pins, respectively
1 = ST input used for PORT reads and interrupt-on-change
0 = TTL input used for PORT reads and interrupt-on-change
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 131
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TABLE 13-6: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELB —— ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 129
INLVLB INLVLB7 INLVLB6 INLVLB5 INLVLB4 INLVLB3 INLVLB2 INLVLB1 INLVLB0 130
LATB LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 128
ODCONB ODB7 ODB6 ODB5 ODB4 ODB3 ODB2 ODB1 ODB0 130
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 128
SLRCONB SLRB7 SLRB6 SLRB5 SLRB4 SLRB3 SLRB2 SLRB1 SLRB0 130
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 128
WPUB WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 129
Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by
PORTB.
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DS41579C-page 132 Preliminary 2011-2012 Microchip Technology Inc.
13.7 PORTC Registers
13.7.1 DATA REGISTER
PORTC is an 8-bit wide bidirectional port. The
corresponding data direction register is TRISC
(Register 13-19). Setting a TRISC bit (= 1) will make the
corresponding PORTC pin an input (i.e., put the
corresponding output driver in a High-Impedance mode).
Clearing a TRISC bit (= 0) will make the corresponding
PORTC pin an output (i.e., enable the output driver and
put the contents of the output latch on the selected pin).
Example 13-1 shows how to initialize an I/O port.
Reading the PORTC register (Register 13-18) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then written
to the PORT data latch (LATC).
13.7.2 DIRECTION CONTROL
The TRISC register (Register 13-19) controls the
PORTC pin output drivers, even when they are being
used as analog inputs. The user should ensure the bits in
the TRISC register are maintained set when using them
as analog inputs. I/O pins configured as analog inputs
always read ‘0’.
13.7.3 OPEN DRAIN CONTROL
The ODCONC register (Register 13-22) controls the
open-drain feature of the port. Open drain operation is
independently selected for each pin. When an
ODCONC bit is set, the corresponding port output
becomes an open drain driver capable of sinking
current only. When an ODCONC bit is cleared, the
corresponding port output pin is the standard push-pull
drive capable of sourcing and sinking current.
13.7.4 SLEW RATE CONTROL
The SLRCONC register (Register 13-23) controls the
slew rate option for each port pin. Slew rate control is
independently selectable for each port pin. When an
SLRCONC bit is set, the corresponding port pin drive is
slew rate limited. When an SLRCONC bit is cleared,
The corresponding port pin drive slews at the maximum
rate possible.
13.7.5 INPUT THRESHOLD CONTROL
The INLVLC register (Register 13-24) controls the input
voltage threshold for each of the available PORTC
input pins. A selection between the Schmitt Trigger
CMOS or the TTL Compatible thresholds is available.
The input threshold is important in determining the
value of a read of the PORTC register and also the
level at which an interrupt-on-change occurs, if that
feature is enabled. See Section 30.1 “DC Character-
istics: PIC16(L)F1782/3-I/E (Industrial, Extended)”
for more information on threshold levels.
13.7.6 PORTC FUNCTIONS AND OUTPUT
PRIORITIES
Each PORTC pin is multiplexed with other functions. The
pins, their combined functions and their output priorities
are shown in Table 13-7.
When multiple outputs are enabled, the actual pin
control goes to the peripheral with the highest priority.
Analog input and some digital input functions are not
included in the list below. These input functions can
remain active when the pin is configured as an output.
Certain digital input functions override other port
functions and are included in the priority list.
Note: Changing the input threshold selection
should be performed while all peripheral
modules are disabled. Changing the
threshold level during the time a module is
active may inadvertently generate a tran-
sition associated with an input pin, regard-
less of the actual voltage level on that pin.
TABLE 13-7: PORTC OUTPUT PRIORITY
Pin Name Function Priority(1)
RC0 T1OSO
PSMC1A
RC0
RC1 PSMC1B
CCP2
RC1
RC2 PSMC1C
CCP1
RC2
RC3 PSMC1D
SCL
SCK
RC3
RC4 PSMC1E
SDA
RC4
RC5 PSMC1F
SDO
RC5
RC6 PSMC2A
TX/CK
RC6
RC7 PSMC2B
DT
RC7
Note 1: Priority listed from highest to lowest.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 133
PIC16(L)F1782/3
13.8 Register Definitions: PORTC
REGISTER 13-18: PORTC: PORTC REGISTER
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 RC<7:0>: PORTC General Purpose I/O Pin bits(1)
1 = Port pin is > VIH
0 = Port pin is < VIL
Note 1: Writes to PORTC are actually written to corresponding LATC register. Reads from PORTC register is
return of actual I/O pin values.
REGISTER 13-19: TRISC: PORTC TRI-STATE REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 TRISC<7:0>: PORTC Tri-State Control bits
1 = PORTC pin configured as an input (tri-stated)
0 = PORTC pin configured as an output
REGISTER 13-20: LATC: PORTC DATA LATCH REGISTER
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
LATC7 LATC6 LATC5 LATC4 LATC3 LATC2 LATC1 LATC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 LATC<7:0>: PORTC Output Latch Value bits(1)
Note 1: Writes to PORTC are actually written to corresponding LATC register. Reads from PORTC register is
return of actual I/O pin values.
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REGISTER 13-21: WPUC: WEAK PULL-UP PORTC REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
WPUC7 WPUC6 WPUC5 WPUC4 WPUC3 WPUC2 WPUC1 WPUC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 WPUC<7:0>: Weak Pull-up Register bits
1 = Pull-up enabled
0 = Pull-up disabled
Note 1: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled.
2: The weak pull-up device is automatically disabled if the pin is in configured as an output.
REGISTER 13-22: ODCONC: PORTC OPEN DRAIN CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
ODC7 ODC6 ODC5 ODC4 ODC3 ODC2 ODC1 ODC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 ODC<7:0>: PORTC Open Drain Enable bits
For RC<7:0> pins, respectively
1 = Port pin operates as open-drain drive (sink current only)
0 = Port pin operates as standard push-pull drive (source and sink current)
REGISTER 13-23: SLRCONC: PORTC SLEW RATE CONTROL REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
SLRC7 SLRC6 SLRC5 SLRC4 SLRC3 SLRC2 SLRC1 SLRC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 SLRC<7:0>: PORTC Slew Rate Enable bits
For RC<7:0> pins, respectively
1 = Port pin slew rate is limited
0 = Port pin slews at maximum rate
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 135
PIC16(L)F1782/3
TABLE 13-8: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC
REGISTER 13-24: INLVLC: PORTC INPUT LEVEL CONTROL REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
INLVLC7 INLVLC6 INLVLC5 INLVLC4 INLVLC3 INLVLC2 INLVLC1 INLVLC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 INLVLC<7:0>: PORTC Input Level Select bits
For RC<7:0> pins, respectively
1 = ST input used for PORT reads and interrupt-on-change
0 = TTL input used for PORT reads and interrupt-on-change
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
LATC LATC7 LATC6 LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 133
PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 133
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 133
WPUC WPUC7 WPUC6 WPUC5 WPUC4 WPUC3 WPUC2 WPUC1 WPUC0 134
INLVLC INLVLC7 INLVLC6 INLVLC5 INLVLC4 INLVLC3 INLVLC2 INLVLC1 INLVLC0 135
LATC LATC7 LATC6 LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 133
ODCONC ODC7 ODC6 ODC5 ODC4 ODC3 ODC2 ODC1 ODC0 134
PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 133
SLRCONC SLRC7 SLRC6 SLRC5 SLRC4 SLRC3 SLRC2 SLRC1 SLRC0 134
Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by
PORTC.
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DS41579C-page 136 Preliminary 2011-2012 Microchip Technology Inc.
13.9 PORTE Registers
RE3 is input only, and also functions as MCLR. The
MCLR feature can be disabled via a configuration fuse.
RE3 also supplies the programming voltage. The TRIS bit
for RE3 (TRISE3) always reads ‘1’.
13.9.1 INPUT THRESHOLD CONTROL
The INLVLE register (Register 13-28) controls the input
voltage threshold for each of the available PORTE
input pins. A selection between the Schmitt Trigger
CMOS or the TTL Compatible thresholds is available.
The input threshold is important in determining the
value of a read of the PORTE register and also the level
at which an interrupt-on-change occurs, if that feature
is enabled. See Section 30.1 “DC Characteristics:
PIC16(L)F1782/3-I/E (Industrial, Extended)” for more
information on threshold levels.
13.9.2 PORTE FUNCTIONS AND OUTPUT
PRIORITIES
No output priorities, RE3 is an input only pin.
Note: Changing the input threshold selection
should be performed while all peripheral
modules are disabled. Changing the
threshold level during the time a module is
active may inadvertently generate a tran-
sition associated with an input pin, regard-
less of the actual voltage level on that pin.
REGISTER 13-25: PORTE: PORTE REGISTER
U-0 U-0 U-0 U-0 R-x/u U-0 U-0 U-0
— — — — RE3 — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-4 Unimplemented: Read as ‘0’
bit 3 RE3: PORTE Input Pin bit
1 = Port pin is > VIH
0 = Port pin is < VIL
bit 2-0 Unimplemented: Read as ‘0’
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 137
PIC16(L)F1782/3
13.10 Register Definitions: PORTE
REGISTER 13-26: TRISE: PORTE TRI-STATE REGISTER
U-0 U-0 U-0 U-0 U-1(1) U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-4 Unimplemented: Read as ‘0’
bit 3 Unimplemented: Read as ‘1’
bit 2-0 Unimplemented: Read as ‘0’
Note 1: Unimplemented, read as ‘1’.
REGISTER 13-27: WPUE: WEAK PULL-UP PORTE REGISTER
U-0 U-0 U-0 U-0 R/W-1/1 U-0 U-0 U-0
— — — — WPUE3 — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-4 Unimplemented: Read as ‘0’
bit 3 WPUE3: Weak Pull-up Register bit
1 = Pull-up enabled
0 = Pull-up disabled
bit 2-0 Unimplemented: Read as ‘0’
Note 1: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled.
2: The weak pull-up device is automatically disabled if the pin is in configured as an output.
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DS41579C-page 138 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 13-9: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE
REGISTER 13-28: INLVLE: PORTE INPUT LEVEL CONTROL REGISTER
U-0 U-0 U-0 U-0 R/W-1/1 U-0 U-0 U-0
— — — — INLVLE3 — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-4 Unimplemented: Read as ‘0’
bit 3 INLVLE3: PORTE Input Level Select bit
1 = ST input used for PORT reads and interrupt-on-change
0 = TTL input used for PORT reads and interrupt-on-change
bit 2-0 Unimplemented: Read as ‘0’
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ADCON0 —CHS<4:0> GO/DONE ADON 155
INLVLE ————INLVLE3 ———138
PORTE ————RE3———136
TRISE —————(1) ———137
WPUE ———— WPUE3 ———137
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by
PORTE.
Note 1: Unimplemented, read as ‘1’.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 139
PIC16(L)F1782/3
14.0 INTERRUPT-ON-CHANGE
All pins on all ports can be configured to operate as
Interrupt-On-Change (IOC) pins. An interrupt can be
generated by detecting a signal that has either a rising
edge or a falling edge. Any individual pin, or combination
of pins, can be configured to generate an interrupt. The
interrupt-on-change module has the following features:
• Interrupt-on-Change enable (Master Switch)
• Individual pin configuration
• Rising and falling edge detection
• Individual pin interrupt flags
Figure 14-1 is a block diagram of the IOC module.
14.1 Enabling the Module
To allow individual pins to generate an interrupt, the
IOCIE bit of the INTCON register must be set. If the
IOCIE bit is disabled, the edge detection on the pin will
still occur, but an interrupt will not be generated.
14.2 Individual Pin Configuration
For each pin, a rising edge detector and a falling edge
detector are present. To enable a pin to detect a rising
edge, the associated bit of the IOCxP register is set. To
enable a pin to detect a falling edge, the associated bit
of the IOCxN register is set.
A pin can be configured to detect rising and falling
edges simultaneously by setting the associated bits in
both of the IOCxP and IOCxN registers.
14.3 Interrupt Flags
The bits located in the IOCxF registers are status flags
that correspond to the Interrupt-on-change pins of each
port. If an expected edge is detected on an appropriately
enabled pin, then the status flag for that pin will be set,
and an interrupt will be generated if the IOCIE bit is set.
The IOCIF bit of the INTCON register reflects the status
of all IOCxF bits.
14.4 Clearing Interrupt Flags
The individual status flags, (IOCxF register bits), can be
cleared by resetting them to zero. If another edge is
detected during this clearing operation, the associated
status flag will be set at the end of the sequence,
regardless of the value actually being written.
In order to ensure that no detected edge is lost while
clearing flags, only AND operations masking out known
changed bits should be performed. The following
sequence is an example of what should be performed.
EXAMPLE 14-1: CLEARING INTERRUPT
FLAGS
(PORTA EXAMPLE)
14.5 Operation in Sleep
The interrupt-on-change interrupt sequence will wake
the device from Sleep mode, if the IOCIE bit is set.
If an edge is detected while in Sleep mode, the affected
IOCxF register will be updated prior to the first instruc-
tion executed out of Sleep.
EXAMPLE 14-2: CLEARING INTERRUPT
FLAGS
(PORTA EXAMPLE)
MOVLW 0xff
XORWF IOCAF, W
ANDWF IOCAF, F
MOVLW 0xff
XORWF IOCAF, W
ANDWF IOCAF, F
PIC16(L)F1782/3
DS41579C-page 140 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 14-1: INTERRUPT-ON-CHANGE BLOCK DIAGRAM
D
CK
R
Q
D
CK
R
Q
RBx
IOCBNx
IOCBPx
Q2
D
CK
SQ
Q4Q1
data bus =
0 or 1
write IOCBFx
IOCIE
to data bus
IOCBFx
edge
detect
IOC interrupt
to CPU core
from all other
IOCBFx individual
pin detectors
Q1
Q2
Q3
Q4
Q4Q1
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
Q4
Q4Q1 Q4Q1 Q4Q1
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 141
PIC16(L)F1782/3
14.6 Interrupt-On-Change Registers
REGISTER 14-1: IOCxP: INTERRUPT-ON-CHANGE POSITIVE EDGE REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
IOCxP7 IOCxP6 IOCxP5 IOCxP4 IOCxP3 IOCxP2 IOCxP1 IOCxP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 IOCxP<7:0>: Interrupt-on-Change Positive Edge Enable bits(1)
1 = Interrupt-on-Change enabled on the pin for a positive going edge. Associated Status bit and
interrupt flag will be set upon detecting an edge.
0 = Interrupt-on-Change disabled for the associated pin.
Note 1: For IOCEP register, bit 3 (IOCEP3) is the only implemented bit in the register.
REGISTER 14-2: IOCxN: INTERRUPT-ON-CHANGE NEGATIVE EDGE REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
IOCxN7 IOCxN6 IOCxN5 IOCxN4 IOCxN3 IOCxN2 IOCxN1 IOCxN0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 IOCxN<7:0>: Interrupt-on-Change Negative Edge Enable bits(1)
1 = Interrupt-on-Change enabled on the pin for a negative going edge. Associated Status bit and
interrupt flag will be set upon detecting an edge.
0 = Interrupt-on-Change disabled for the associated pin.
Note 1: For IOCEN register, bit 3 (IOCEN3) is the only implemented bit in the register.
PIC16(L)F1782/3
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TABLE 14-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE
REGISTER 14-3: IOCxF: INTERRUPT-ON-CHANGE FLAG REGISTER
R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0
IOCxF7 IOCxF6 IOCxF5 IOCxF4 IOCxF3 IOCxF2 IOCxF1 IOCxF0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HS - Bit is set in hardware
bit 7-0 IOCxF<7:0>: Interrupt-on-Change Flag bits(1)
1 = An enabled change was detected on the associated pin.
Set when IOCxPx = 1 and a rising edge was detected RBx, or when IOCxNx = 1 and a falling edge
was detected on RBx.
0 = No change was detected, or the user cleared the detected change.
Note 1: For IOCEF register, bit 3 (IOCEF3) is the only implemented bit in the register.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELB —— ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 129
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
IOCAF IOCAF7 IOCAF6 IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 142
IOCAN IOCAN7 IOCAN6 IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 141
IOCAP IOCAP7 IOCAP6 IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 141
IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 142
IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 141
IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 141
IOCCF IOCCF7 IOCCF6 IOCCF5 IOCCF4 IOCCF3 IOCCF2 IOCCF1 IOCCF0 142
IOCCN IOCCN7 IOCCN6 IOCCN5 IOCCN4 IOCCN3 IOCCN2 IOCCN1 IOCCN0 141
IOCCP IOCCP7 IOCCP6 IOCCP5 IOCCP4 IOCCP3 IOCCP2 IOCCP1 IOCCP0 141
IOCEF ————IOCEF3———142
IOCEN ————IOCEN3———141
IOCEP ———— IOCEP3 ———141
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 128
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by interrupt-on-change.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 143
PIC16(L)F1782/3
15.0 FIXED VOLTAGE REFERENCE
(FVR)
The Fixed Voltage Reference, or FVR, is a stable
voltage reference, independent of VDD, with 1.024V,
2.048V or 4.096V selectable output levels. The output
of the FVR can be configured to supply a reference
voltage to the following:
• ADC input channel
• ADC positive reference
• Comparator positive input
• Digital-to-Analog Converter (DAC)
The FVR can be enabled by setting the FVREN bit of
the FVRCON register.
15.1 Independent Gain Amplifiers
The output of the FVR supplied to the ADC,
Comparators, and DAC is routed through two
independent programmable gain amplifiers. Each
amplifier can be programmed for a gain of 1x, 2x or 4x,
to produce the three possible voltage levels.
The ADFVR<1:0> bits of the FVRCON register are
used to enable and configure the gain amplifier settings
for the reference supplied to the ADC module. Refer-
ence Section 19.0 “Digital-to-Analog Converter
(DAC) Module” for additional information.
The CDAFVR<1:0> bits of the FVRCON register are
used to enable and configure the gain amplifier settings
for the reference supplied to the DAC and comparator
module. Reference Section 17.0 Section 19.0 “Digi-
tal-to-Analog Converter (DAC) Module” and
Section 20.0 “Comparator Module” for additional
information.
15.2 FVR Stabilization Period
When the Fixed Voltage Reference module is enabled, it
requires time for the reference and amplifier circuits to
stabilize. Once the circuits stabilize and are ready for use,
the FVRRDY bit of the FVRCON register will be set. See
Section 30.0 “Electrical Specifications” for the
minimum delay requirement.
PIC16(L)F1782/3
DS41579C-page 144 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 15-1: VOLTAGE REFERENCE BLOCK DIAGRAM
ADFVR<1:0>
CDAFVR<1:0>
X1
X2
X4
X1
X2
X4
2
2
FVR BUFFER1
(To ADC Module)
FVR BUFFER2
(To Comparators, DAC)
+
_
FVREN FVRRDY
Any peripheral requiring the
Fixed Reference
(See Table 15-1)
To B O R, LD O
HFINTOSC Enable
HFINTOSC
TABLE 15-1: PERIPHERALS REQUIRING THE FIXED VOLTAGE REFERENCE (FVR)
Peripheral Conditions Description
HFINTOSC FOSC<2:0> = 100 and
IRCF<3:0> 000x
INTOSC is active and device is not in Sleep
BOR
BOREN<1:0> = 11 BOR always enabled
BOREN<1:0> = 10 and BORFS = 1BOR disabled in Sleep mode, BOR Fast Start enabled.
BOREN<1:0> = 01 and BORFS = 1BOR under software control, BOR Fast Start enabled
LDO All PIC16F1782/3 devices, when
VREGPM = 10 and not in Sleep
The device runs off of the ULP regulator when in Sleep mode.
PSMC 64 MHz PxSRC<1:0> 64 MHz clock forces HFINTOSC on during Sleep.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 145
PIC16(L)F1782/3
15.3 Register Definitions: FVR Control
TABLE 15-2: SUMMARY OF REGISTERS ASSOCIATED WITH FIXED VOLTAGE REFERENCE
REGISTER 15-1: FVRCON: FIXED VOLTAGE REFERENCE CONTROL REGISTER
R/W-0/0 R-q/q R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
FVREN FVRRDY(1) TSEN TSRNG CDAFVR<1:0> ADFVR<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7 FVREN: Fixed Voltage Reference Enable bit
1 = Fixed Voltage Reference is enabled
0 = Fixed Voltage Reference is disabled
bit 6 FVRRDY: Fixed Voltage Reference Ready Flag bit(1)
1 = Fixed Voltage Reference output is ready for use
0 = Fixed Voltage Reference output is not ready or not enabled
bit 5 TSEN: Temperature Indicator Enable bit(3)
1 = Temperature Indicator is enabled
0 = Temperature Indicator is disabled
bit 4 TSRNG: Temperature Indicator Range Selection bit(3)
1 =VOUT = VDD - 4VT (High Range)
0 =V
OUT = VDD - 2VT (Low Range)
bit 3-2 CDAFVR<1:0>: Comparator and DAC Fixed Voltage Reference Selection bit
11 = Comparator and DAC Fixed Voltage Reference Peripheral output is 4x (4.096V)(2)
10 = Comparator and DAC Fixed Voltage Reference Peripheral output is 2x (2.048V)(2)
01 = Comparator and DAC Fixed Voltage Reference Peripheral output is 1x (1.024V)
00 = Comparator and DAC Fixed Voltage Reference Peripheral output is off.
bit 1-0 ADFVR<1:0>: ADC Fixed Voltage Reference Selection bit
11 = ADC Fixed Voltage Reference Peripheral output is 4x (4.096V)(2)
10 = ADC Fixed Voltage Reference Peripheral output is 2x (2.048V)(2)
01 = ADC Fixed Voltage Reference Peripheral output is 1x (1.024V)
00 = ADC Fixed Voltage Reference Peripheral output is off.
Note 1: FVRRDY is always ‘1’ on PIC16F1782/3 only.
2: Fixed Voltage Reference output cannot exceed VDD.
3: See Section 16.0 “Temperature Indicator Module” for additional information.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on page
FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 145
Legend: Shaded cells are not used with the Fixed Voltage Reference.
PIC16(L)F1782/3
DS41579C-page 146 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 147
PIC16(L)F1782/3
16.0 TEMPERATURE INDICATOR
MODULE
This family of devices is equipped with a temperature
circuit designed to measure the operating temperature
of the silicon die. The circuit’s range of operating
temperature falls between -40°C and +85°C. The
output is a voltage that is proportional to the device
temperature. The output of the temperature indicator is
internally connected to the device ADC.
The circuit may be used as a temperature threshold
detector or a more accurate temperature indicator,
depending on the level of calibration performed. A one-
point calibration allows the circuit to indicate a
temperature closely surrounding that point. A two-point
calibration allows the circuit to sense the entire range
of temperature more accurately. Reference Application
Note AN1333, “Use and Calibration of the Internal
Temperature Indicator” (DS01333) for more details
regarding the calibration process.
16.1 Circuit Operation
Figure 16-1 shows a simplified block diagram of the
temperature circuit. The proportional voltage output is
achieved by measuring the forward voltage drop across
multiple silicon junctions.
Equation 16-1 describes the output characteristics of
the temperature indicator.
EQUATION 16-1: VOUT RANGES
The temperature sense circuit is integrated with the
Fixed Voltage Reference (FVR) module. See
Section 15.0 “Fixed Voltage Reference (FVR)” for
more information.
The circuit is enabled by setting the TSEN bit of the
FVRCON register. When disabled, the circuit draws no
current.
The circuit operates in either high or low range. The high
range, selected by setting the TSRNG bit of the
FVRCON register, provides a wider output voltage. This
provides more resolution over the temperature range,
but may be less consistent from part to part. This range
requires a higher bias voltage to operate and thus, a
higher VDD is needed.
The low range is selected by clearing the TSRNG bit of
the FVRCON register. The low range generates a lower
voltage drop and thus, a lower bias voltage is needed to
operate the circuit. The low range is provided for low
voltage operation.
FIGURE 16-1: TEMPERATURE CIRCUIT
DIAGRAM
16.2 Minimum Operating VDD vs.
Minimum Sensing Temperature
When the temperature circuit is operated in low range,
the device may be operated at any operating voltage
that is within specifications.
When the temperature circuit is operated in high range,
the device operating voltage, VDD, must be high
enough to ensure that the temperature circuit is cor-
rectly biased.
Table 16-1 shows the recommended minimum VDD vs.
range setting.
TABLE 16-1: RECOMMENDED VDD VS.
RANGE
16.3 Temperature Output
The output of the circuit is measured using the internal
Analog-to-Digital Converter. A channel is reserved for
the temperature circuit output. Refer to Section 17.0
“Analog-to-Digital Converter (ADC) Module” for
detailed information.
16.4 ADC Acquisition Time
To ensure accurate temperature measurements, the
user must wait at least 200 s after the ADC input
multiplexer is connected to the temperature indicator
output before the conversion is performed. In addition,
the user must wait 200 s between sequential
conversions of the temperature indicator output.
High Range: VOUT = VDD - 4VT
Low Range: VOUT = VDD - 2VT
Min. VDD, TSRNG = 1Min. VDD, TSRNG = 0
3.6V 1.8V
TSEN
ADC
MUX
TSRNG
VDD
ADC
CHS bits
(ADCON0 register)
n
VOUT
PIC16(L)F1782/3
DS41579C-page 148 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 149
PIC16(L)F1782/3
17.0 ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
The Analog-to-Digital Converter (ADC) allows
conversion of a single-ended and differential analog
input signals to a 12-bit binary representation of that
signal. This device uses analog inputs, which are
multiplexed into a single sample and hold circuit. The
output of the sample and hold is connected to the input
of the converter. The converter generates a 12-bit
binary result via successive approximation and stores
the conversion result into the ADC result registers
(ADRESH:ADRESL register pair). Figure 17-1 shows
the block diagram of the ADC.
The ADC voltage reference is software selectable to be
either internally generated or externally supplied.
The ADC can generate an interrupt upon completion of
a conversion. This interrupt can be used to wake-up the
device from Sleep.
FIGURE 17-1: ADC BLOCK DIAGRAM
DAC_output
VDD
VREF1+ ADPREF = 01
ADPREF = 00
FVR Buffer1
Note 1: When ADON = 0, all multiplexer inputs are disconnected.
2: See ADCON0 register (Register 17-1) and ADCON2 register (Register 17-3) for detailed
analog channel selection per device.
ADON(1)
GO/DONE
VSS
ADC
CHS<4:0>(2)
AN0
AN1
VREF-/AN2
AN4
Reserved
Reserved
Reserved
VREF1+/AN3
AN8
AN9
AN10
AN11
AN12
AN13
ADRESH ADRESL
12
16
ADFM 0 = Sign Magnitude
1 = 2’s Complement
Temperature Indicator
ADPREF = 11
ADPREF = 10
VREF2+
Ref+ Ref-
ADNREF = 1
ADPNEF = 0
+
-
00000
00001
00010
00011
00100
00101
00111
00110
01000
01001
01010
01011
01100
01101
11110
11111
11101
CHSN<3:0>
PIC16(L)F1782/3
DS41579C-page 150 Preliminary 2011-2012 Microchip Technology Inc.
17.1 ADC Configuration
When configuring and using the ADC the following
functions must be considered:
• Port configuration
• Channel selection
- Single-ended
- Differential
• ADC voltage reference selection
• ADC conversion clock source
• Interrupt control
• Result formatting
17.1.1 PORT CONFIGURATION
The ADC can be used to convert both analog and
digital signals. When converting analog signals, the I/O
pin should be configured for analog by setting the
associated TRIS and ANSEL bits. Refer to
Section 13.0 “I/O Ports” for more information.
17.1.2 CHANNEL SELECTION
There are up to 14 channel selections available:
• AN<13:8, 4:0> pins
• Temperature Indicator
• DAC Output
• FVR (Fixed Voltage Reference) Output
Refer to Section 15.0 “Fixed Voltage Reference
(FVR)” and Section 16.0 “Temperature Indicator
Module” for more information on these channel selec-
tions.
When converting differential signals, the negative input
for the channel is selected with the CHSN<3:0> bits of
the ADCON2 register. Any positive input can be paired
with any negative input to determine the differential
channel.
The CHS<4:0> bits of the ADCON0 register determine
which positive channel is selected.
When CHSN<3:0> = 1111 then the ADC is effectively
a single ended ADC converter.
When changing channels, a delay is required before
starting the next conversion.
17.1.3 ADC VOLTAGE REFERENCE
The ADPREF bits of the ADCON1 register provide
control of the positive voltage reference. The positive
voltage reference can be:
•V
REF1+
•V
DD
•VREF2+
• FVR Buffer1
The ADNREF bits of the ADCON1 register provide
control of the negative voltage reference. The negative
voltage reference can be:
•V
REF- pin
•V
SS
See Section 15.0 “Fixed Voltage Reference (FVR)”
for more details on the Fixed Voltage Reference.
17.1.4 CONVERSION CLOCK
The source of the conversion clock is software select-
able via the ADCS bits of the ADCON1 register. There
are seven possible clock options:
•F
OSC/2
•F
OSC/4
•F
OSC/8
•F
OSC/16
•F
OSC/32
•F
OSC/64
•F
RC (dedicated internal oscillator)
The time to complete one bit conversion is defined as
TAD. One full 12-bit conversion requires 15 TAD periods
as shown in Figure 17-2.
For correct conversion, the appropriate TAD specifica-
tion must be met. Refer to the A/D conversion require-
ments in Section 30.0 “Electrical Specifications” for
more information. Table 17-1 gives examples of appro-
priate ADC clock selections.
Note: Analog voltages on any pin that is defined
as a digital input may cause the input
buffer to conduct excess current.
Note: Unless using the FRC, any changes in the
system clock frequency will change the
ADC clock frequency, which may
adversely affect the ADC result.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 151
PIC16(L)F1782/3
TABLE 17-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES
FIGURE 17-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES
ADC Clock Period (TAD) Device Frequency (FOSC)
ADC
Clock Source ADCS<2:0> 32 MHz 20 MHz 16 MHz 8 MHz 4 MHz 1 MHz
FOSC/2 000 62.5ns(2) 100 ns(2) 125 ns(2) 250 ns(2) 500 ns(2) 2.0 s
FOSC/4 100 125 ns(2) 200 ns(2) 250 ns(2) 500 ns(2) 1.0 s4.0 s
FOSC/8 001 0.5 s(2) 400 ns(2) 0.5 s(2) 1.0 s2.0 s8.0 s(3)
FOSC/16 101 800 ns 800 ns 1.0 s2.0 s4.0 s16.0 s(3)
FOSC/32 010 1.0 s1.6 s2.0 s4.0 s8.0 s(3) 32.0 s(3)
FOSC/64 110 2.0 s3.2 s4.0 s8.0 s(3) 16.0 s(3) 64.0 s(3)
FRC x11 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4)
Legend: Shaded cells are outside of recommended range.
Note 1: The FRC source has a typical TAD time of 1.6 s for VDD.
2: These values violate the minimum required TAD time.
3: For faster conversion times, the selection of another clock source is recommended.
4: The ADC clock period (TAD) and total ADC conversion time can be minimized when the ADC clock is derived from the
system clock FOSC. However, the FRC clock source must be used when conversions are to be performed with the
device in Sleep mode.
TAD1TAD2TAD3TAD4 TAD5TAD6 TAD7TAD8 TAD11
Set GO
TAD9 TAD10
TCY - TAD
GO bit is cleared, ADIF bit is set,
holding capacitor is connected to analog input.
b2
b11 b8 b7 b6 b5 b4 b3
b10 b9
On the following cycle:
TAD13TAD12
b0b1
TAD15TAD14
sign
Input
Sample
Conversion
starts
Holding cap disconnected
from input
bit
TAD17TAD16
Holding cap.
discharge
PIC16(L)F1782/3
DS41579C-page 152 Preliminary 2011-2012 Microchip Technology Inc.
17.1.5 INTERRUPTS
The ADC module allows for the ability to generate an
interrupt upon completion of an Analog-to-Digital
conversion. The ADC Interrupt Flag is the ADIF bit in
the PIR1 register. The ADC Interrupt Enable is the
ADIE bit in the PIE1 register. The ADIF bit must be
cleared in software.
This interrupt can be generated while the device is
operating or while in Sleep. If the device is in Sleep, the
interrupt will wake-up the device. Upon waking from
Sleep, the next instruction following the SLEEP instruc-
tion is always executed. If the user is attempting to
wake-up from Sleep and resume in-line code execu-
tion, the GIE and PEIE bits of the INTCON register
must be disabled. If the GIE and PEIE bits of the
INTCON register are enabled, execution will switch to
the Interrupt Service Routine.
17.1.6 RESULT FORMATTING
The 12-bit A/D conversion result can be supplied in two
formats, 2’s complement or sign-magnitude. The
ADFM bit of the ADCON1 register controls the output
format.
Figure 17-3 shows the two output formats.
FIGURE 17-3: 12-BIT A/D CONVERSION RESULT FORMAT
TABLE 17-2: ADC OUTPUT RESULTS FORMAT
Note 1: The ADIF bit is set at the completion of
every conversion, regardless of whether
or not the ADC interrupt is enabled.
2: The ADC operates during Sleep only
when the FRC oscillator is selected.
Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 ‘0’ ‘0’ ‘0’ Sign
ADFM = 0bit 7 bit 0 bit 7 bit 0
12-bit ADC Result Loaded with ‘0’
Sign Sign Sign Sign Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
ADFM = 1bit 7 bit 0 bit 7 bit 0
Loaded with Sign bits’ 12-bit ADC Result
Sign and Magnitude Result
ADFM = 0
2’s Complement Result
ADFM = 1
ADRESH ADRESL ADRESH ADRESL
1001 0011 0011 0000 0000 1001 0011 0011
1111 1111 1111 0000 0000 1111 1111 1111
1111 1111 1111 0001 1111 0000 0000 0001
0000 0000 0001 0001 1111 1111 1111 1111
Note: The raw 13-bits from the ADC is presented in sign and magnitude format, so no data translation is required
for sign and magnitude results.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 153
PIC16(L)F1782/3
17.2 ADC Operation
17.2.1 STARTING A CONVERSION
To enable the ADC module, the ADON bit of the
ADCON0 register must be set to a ‘1’. Setting the
GO/DONE bit of the ADCON0 register to a ‘1’ will clear
the ADRESH and ADRESL registers and start the
Analog-to-Digital conversion.
17.2.2 COMPLETION OF A CONVERSION
When the conversion is complete, the ADC module will:
• Clear the GO/DONE bit
• Set the ADIF Interrupt Flag bit
17.2.3 TERMINATING A CONVERSION
If a conversion must be terminated before completion,
the GO/DONE bit can be cleared in software. The
ADRESH and ADRESL registers will contain the par-
tially complete Analog-to-Digital conversion sample.
Results shift into the ADRES registers from LSb to MSb
as each bit is converted. Incomplete results remain
where left by the shifting process. When the ADRESH
bit is clear then the shifted result enters the result reg-
isters at the unsigned LS bit, which is ADRESL bit 4.
17.2.4 ADC OPERATION DURING SLEEP
The ADC module can operate during Sleep. This
requires the ADC clock source to be set to the FRC
option. When the FRC clock source is selected, the
ADC waits one additional instruction before starting the
conversion. This allows the SLEEP instruction to be
executed, which can reduce system noise during the
conversion. If the ADC interrupt is enabled, the device
will wake-up from Sleep when the conversion
completes. If the ADC interrupt is disabled, the ADC
module is turned off after the conversion completes,
although the ADON bit remains set.
When the ADC clock source is something other than
FRC, a SLEEP instruction causes the present conver-
sion to be aborted and the ADC module is turned off,
although the ADON bit remains set.
17.2.5 AUTO-CONVERSION TRIGGER
The Auto-conversion Trigger of the CCP module allows
periodic ADC measurements without software inter-
vention. When a rising edge of the selected source
occurs, the GO/DONE bit is set by hardware and the
Timer1 counter resets to zero.
The Auto-conversion Trigger source is selected with
the TRIGSEL<3:0> bits of the ADCON2 register.
Using the Auto-conversion Trigger does not assure
proper ADC timing. It is the user’s responsibility to
ensure that the ADC timing requirements are met.
Auto-conversion sources are:
• CCP1
• CCP2
• PSMC1
• PSMC2
Note: The GO/DONE bit should not be set in the
same instruction that turns on the ADC.
Refer to Section 17.2.6 “A/D Conversion
Procedure”.
Note: A device Reset forces all registers to their
Reset state. Thus, the ADC module is
turned off and any pending conversion is
terminated.
PIC16(L)F1782/3
DS41579C-page 154 Preliminary 2011-2012 Microchip Technology Inc.
17.2.6 A/D CONVERSION PROCEDURE
This is an example procedure for using the ADC to
perform an Analog-to-Digital conversion:
1. Configure Port:
• Disable pin output driver (Refer to the TRIS
register)
• Configure pin as analog (Refer to the ANSEL
register)
2. Configure the ADC module:
• Select ADC conversion clock
• Configure voltage reference
• Select ADC input channel
• Turn on ADC module
3. Configure ADC interrupt (optional):
• Clear ADC interrupt flag
• Enable ADC interrupt
• Enable peripheral interrupt
• Enable global interrupt(1)
4. Wait the required acquisition time(2).
5. Start conversion by setting the GO/DONE bit.
6. Wait for ADC conversion to complete by one of
the following:
• Polling the GO/DONE bit
• Waiting for the ADC interrupt (interrupts
enabled)
7. Read ADC Result.
8. Clear the ADC interrupt flag (required if interrupt
is enabled).
EXAMPLE 17-1: A/D CONVERSION
Note 1: The global interrupt can be disabled if the
user is attempting to wake-up from Sleep
and resume in-line code execution.
2: Refer to Section 17.4 “A/D Acquisition
Requirements”.
;This code block configures the ADC
;for polling, Vdd and Vss references, Frc
;clock and AN0 input.
;
;Conversion start & polling for completion
; are included.
;
BANKSEL ADCON1 ;
MOVLW B’11110000’ ;2’s complement, Frc
;clock
MOVWF ADCON1 ;Vdd and Vss Vref
MOVLW B’00001111’ ;set negative input
MOVWF ADCON2 ;to negative
;reference
BANKSEL TRISA ;
BSF TRISA,0 ;Set RA0 to input
BANKSEL ANSEL ;
BSF ANSEL,0 ;Set RA0 to analog
BANKSEL ADCON0 ;
MOVLW B’00000001’ ;Select channel AN0
MOVWF ADCON0 ;Turn ADC On
CALL SampleTime ;Acquisiton delay
BSF ADCON0,ADGO ;Start conversion
BTFSC ADCON0,ADGO ;Is conversion done?
GOTO $-1 ;No, test again
BANKSEL ADRESH ;
MOVF ADRESH,W ;Read upper 2 bits
MOVWF RESULTHI ;store in GPR space
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 155
PIC16(L)F1782/3
17.3 Register Definitions: ADC Control
REGISTER 17-1: ADCON0: A/D CONTROL REGISTER 0
U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
— CHS<4:0> GO/DONE ADON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 Unimplemented: Read as ‘0’
bit 6-2 CHS<4:0>: Positive Differential Input Channel Select bits
11111 = FVR (Fixed Voltage Reference) Buffer 1 Output(2)
11110 = DAC_output(1)
11101 = Temperature Indicator(3)
11100 = Reserved. No channel connected.
•
•
•
01110 = Reserved. No channel connected.
01101 =AN13
01100 =AN12
01011 =AN11
01010 =AN10
01001 =AN9
01000 =AN8
00111 = Reserved. No channel connected.
00110 = Reserved. No channel connected.
00101 = Reserved. No channel connected.
00100 =AN4
00011 =AN3
00010 =AN2
00001 =AN1
00000 =AN0
bit 1 GO/DONE: A/D Conversion Status bit
1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle.
This bit is automatically cleared by hardware when the A/D conversion has completed.
0 = A/D conversion completed/not in progress
bit 0 ADON: ADC Enable bit
1 = ADC is enabled
0 = ADC is disabled and consumes no operating current
Note 1: See Section 19.0 “Digital-to-Analog Converter (DAC) Module” for more information.
2: See Section 15.0 “Fixed Voltage Reference (FVR)” for more information.
3: See Section 16.0 “Temperature Indicator Module” for more information.
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DS41579C-page 156 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 17-2: ADCON1: A/D CONTROL REGISTER 1
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0
ADFM ADCS<2:0> — ADNREF ADPREF<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 ADFM: A/D Result Format Select bit (see Figure 17-3)
1 = 2’s complement format.
0 = Sign-magnitude result format.
bit 6-4 ADCS<2:0>: A/D Conversion Clock Select bits
111 =F
RC (clock supplied from a dedicated RC oscillator)
110 =F
OSC/64
101 =F
OSC/16
100 =F
OSC/4
011 =F
RC (clock supplied from a dedicated RC oscillator)
010 =F
OSC/32
001 =F
OSC/8
000 =F
OSC/2
bit 3 Unimplemented: Read as ‘0’
bit 2 ADNREF: A/D Negative Voltage Reference Configuration bit
1 =V
REF- is connected to external VREF- pin(1)
0 =VREF- is connected to VSS
bit 1-0 ADPREF<1:0>: A/D Positive Voltage Reference Configuration bits
11 =V
REF+ is connected internally to FVR Buffer 1
10 =V
REF+ is connected to VREF2+ pin
01 =V
REF+ is connected to VREF1+ pin
00 =V
REF+ is connected to VDD
Note 1: When selecting the FVR, VREF1+ pin, or VREF2+ pin as the source of the positive reference, be aware that
a minimum voltage specification exists. See Section 30.0 “Electrical Specifications” for details.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 157
PIC16(L)F1782/3
REGISTER 17-3: ADCON2: A/D CONTROL REGISTER 2
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
TRIGSEL<3:0> CHSN<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-4 TRIGSEL<3:0>: ADC Auto-conversion Trigger Source Selection bits
1111 = Reserved. Auto-conversion Trigger disabled.
1111 = Reserved. Auto-conversion Trigger disabled.
1110 = Reserved. Auto-conversion Trigger disabled.
1101 = Reserved. Auto-conversion Trigger disabled.
1100 = Reserved. Auto-conversion Trigger disabled.
1011 = Reserved. Auto-conversion Trigger disabled.
1010 = Reserved. Auto-conversion Trigger disabled.
1001 = PSMC2 Falling Match Event
1000 = PSMC2 Rising Edge Event
0111 = PSMC2 Period Edge Event
0110 = PSMC1 Falling Edge Event
0101 = PSMC1 Rising Edge Event
0100 = PSMC1 Period Match Event
0011 = Reserved. Auto-conversion Trigger disabled.
0010 = CCP2, Auto-conversion Trigger
0001 = CCP1, Auto-conversion Trigger
0000 =Disabled
bit 3-0 CHSN<3:0>: Negative Differential Input Channel Select bits
When ADON = 0, all multiplexer inputs are disconnected.
1111 = ADC Negative reference - selected by ADNREF
1110 = Reserved. No channel connected.
1101 =AN13
1100 =AN12
1011 =AN11
1010 =AN10
1001 =AN9
1000 =AN8
0111 = Reserved. No channel connected.
0110 = Reserved. No channel connected.
0101 = Reserved. No channel connected.
0100 =AN4
0011 =AN3
0010 =AN2
0001 =AN1
0000 =AN0
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DS41579C-page 158 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 17-4: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
AD<11:4>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 AD<11:4>: ADC Result Register bits
Upper 8 bits of 12-bit conversion result
REGISTER 17-5: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
AD<3:0> — — —ADSIGN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-4 AD<3:0>: ADC Result Register bits
Lower 4 bits of 12-bit conversion result
bit 3-1 Extended LSb bits: These are cleared to zero by DC conversion.
bit 0 ADSIGN: ADC Result Sign bit
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 159
PIC16(L)F1782/3
REGISTER 17-6: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
ADSIGN AD<11:8>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-4 ADSIGN: Extended AD Result Sign bit
bit 3-0 AD<11:8>: ADC Result Register bits
Most significant 4 bits of 12-bit conversion result
REGISTER 17-7: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
AD<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 AD<7:0>: ADC Result Register bits
Least significant 8 bits of 12-bit conversion result
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DS41579C-page 160 Preliminary 2011-2012 Microchip Technology Inc.
17.4 A/D Acquisition Requirements
For the ADC to meet its specified accuracy, the charge
holding capacitor (CHOLD) must be allowed to fully
charge to the input channel voltage level. The Analog
Input model is shown in Figure 17-4. The source
impedance (RS) and the internal sampling switch (RSS)
impedance directly affect the time required to charge
the capacitor CHOLD. The sampling switch (RSS)
impedance varies over the device voltage (VDD), refer
to Figure 17-4. The maximum recommended
impedance for analog sources is 10 k. As the
source impedance is decreased, the acquisition time
may be decreased. After the analog input channel is
selected (or changed), an A/D acquisition must be
done before the conversion can be started. To calculate
the minimum acquisition time, Equation 17-1 may be
used. This equation assumes that 1/2 LSb error is used
(4,096 steps for the ADC). The 1/2 LSb error is the
maximum error allowed for the ADC to meet its
specified resolution.
EQUATION 17-1: ACQUISITION TIME EXAMPLE
TACQ Amplifier Settling Time Hold Capacitor Charging Time Temperature Coefficient++=
TAMP TCTCOFF++=
2µs TCTemperature - 25°C0.05µs/°C++=
TCCHOLD RIC RSS RS++ ln(1/8191)–=
10pF 1k
7k
10k
++– ln(0.000122)=
1.62=µs
VAPPLIED 1e
Tc–
RC
---------
–



VAPPLIED 11
2n1+
1–
--------------------------–


=
VAPPLIED 11
2n1+
1–
--------------------------
–


VCHOLD=
VAPPLIED 1e
TC–
RC
----------
–



VCHOLD=
;[1] VCHOLD charged to within 1/2 lsb
;[2] VCHOLD charge response to VAPPLIED
;combining [1] and [2]
The value for TC can be approximated with the following equations:
Solving for TC:
Therefore:
Temperature 50°C and external impedance of 10k
5.0V VDD=
Assumptions:
Note: Where n = number of bits of the ADC.
TACQ 2µs 1.62µs 50°C- 25°C0.05µs/°C++=
4.87µs=
Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out.
2: The charge holding capacitor (CHOLD) is not discharged after each conversion.
3: Maximum source impedance feeding the input pin should be considered so that the pin leakage does not
cause a voltage divider, thereby limiting the absolute accuracy.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 161
PIC16(L)F1782/3
FIGURE 17-4: ANALOG INPUT MODEL
FIGURE 17-5: ADC TRANSFER FUNCTION
CPIN
VA
Rs
Analog
5 pF
VDD
VT 0.6V
VT 0.6V I LEAKAGE(1)
RIC 1k
Sampling
Switch
SS Rss
CHOLD = 10 pF
VSS/VREF-
6V
Sampling Switch
5V
4V
3V
2V
567891011
(k)
VDD
Legend:
CPIN
VT
I LEAKAGE
RIC
SS
CHOLD
= Input Capacitance
= Threshold Voltage
= Leakage current at the pin due to
= Interconnect Resistance
= Sampling Switch
= Sample/Hold Capacitance
various junctions
RSS
Note 1: Refer to Section 30.0 “Electrical Specifications”.
RSS = Resistance of Sampling Switch
Input
pin
FFFh
FFEh
ADC Output Code
FFDh
FFCh
03h
02h
01h
00h
Full-Scale
FFBh
0.5 LSB
VREF-Zero-Scale
Transition VREF+
Transition
1.5 LSB
Full-Scale Range
Analog Input Voltage (Positive input channel
relative to negative
input channel)
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DS41579C-page 162 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 17-3: SUMMARY OF REGISTERS ASSOCIATED WITH ADC
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ADCON0 — CHS<4:0> GO/DONE ADON 155
ADCON1 ADFM ADCS<2:0> — ADNREF ADPREF<1:0> 156
ADCON2 TRIGSEL<3:0> CHSN<3:0> 157
ADRESH A/D Result Register High 158, 159
ADRESL A/D Result Register Low 158, 159
ANSELA ANSA7 — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 123
ANSELB —— ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 129
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 85
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 88
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 122
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 128
FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 145
Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not
used for ADC module.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 163
PIC16(L)F1782/3
18.0 OPERATIONAL AMPLIFIER
(OPA) MODULES
The Operational Amplifier (OPA) is a standard
three-terminal device requiring external feedback to
operate. The OPA module has the following features:
• External connections to I/O ports
• Selectable Gain Bandwidth Product
• Low leakage inputs
• Factory Calibrated Input Offset Voltage
FIGURE 18-1: OPAx MODULE BLOCK DIAGRAM
OPA
DAC_output
OPAXEN
OPAXSP
FVR Buffer 2
OPAxNCH<1:0>
OPAXOUT
OPAxIN-
OPAxIN+ 0x
10
11
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DS41579C-page 164 Preliminary 2011-2012 Microchip Technology Inc.
18.1 Effects of Reset
A device Reset forces all registers to their Reset state.
This disables the OPA module.
18.2 OPA Module Performance
Common AC and DC performance specifications for
the OPA module:
• Common Mode Voltage Range
• Leakage Current
• Input Offset Voltage
• Open Loop Gain
• Gain Bandwidth Product
Common mode voltage range is the specified voltage
range for the OPA+ and OPA- inputs, for which the OPA
module will perform to within its specifications. The
OPA module is designed to operate with input voltages
between 0 and VDD-1.4V. Behavior for Common mode
voltages greater than VDD-1.4V, or below 0V, are not
guaranteed.
Leakage current is a measure of the small source or
sink currents on the OPA+ and OPA- inputs. To mini-
mize the effect of leakage currents, the effective imped-
ances connected to the OPA+ and OPA- inputs should
be kept as small as possible and equal.
Input offset voltage is a measure of the voltage differ-
ence between the OPA+ and OPA- inputs in a closed
loop circuit with the OPA in its linear region. The offset
voltage will appear as a DC offset in the output equal to
the input offset voltage, multiplied by the gain of the cir-
cuit. The input offset voltage is also affected by the
Common mode voltage. The OPA is factory calibrated
to minimize the input offset voltage of the module.
Open loop gain is the ratio of the output voltage to the
differential input voltage, (OPA+) - (OPA-). The gain is
greatest at DC and falls off with frequency.
Gain Bandwidth Product or GBWP is the frequency
at which the open loop gain falls off to 0 dB. The lower
GBWP is optimized for systems requiring low fre-
quency response and low power consumption.
18.3 OPAxCON Control Register
The OPAxCON register, shown in Register 18-1,
controls the OPA module.
The OPA module is enabled by setting the OPAxEN bit
of the OPAxCON register. When enabled, the OPA
forces the output driver of OPAxOUT pin into tri-state to
prevent contention between the driver and the OPA
output.
The OPAxSP bit of the OPAxCON register controls the
power and gain bandwidth of the amplifier. Higher
power and greater bandwidth operations are selected
by setting the OPAxSP bit. The default is low power
reduced bandwidth.
Note: When the OPA module is enabled, the
OPAxOUT pin is driven by the op amp out-
put, not by the PORT digital driver. Refer
to the Electrical specifications for the op
amp output drive capability.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 165
PIC16(L)F1782/3
18.4 Register Definitions: Op Amp Control
TABLE 18-1: SUMMARY OF REGISTERS ASSOCIATED WITH OP AMPS
REGISTER 18-1: OPAxCON: OPERATIONAL AMPLIFIERS (OPAx) CONTROL REGISTERS
R/W-0/0 R/W-0/0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0
OPAxEN OPAxSP — — — — OPAxCH<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7 OPAxEN: Op Amp Enable bit
1 = Op amp is enabled
0 = Op amp is disabled and consumes no active power
bit 6 OPAxSP: Op Amp Speed/Power Select bit
1 = Comparator operates in high GBWP mode
0 = Comparator operates in low GBWP mode
bit 5-2 Unimplemented: Read as ‘0’
bit 1-0 OPAxCH<1:0>: Non-inverting Channel Selection bits
11 = Non-inverting input connects to FVR Buffer 2 output
10 = Non-inverting input connects to DAC_output
0x = Non-inverting input connects to OPAxIN+ pin
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELA ANSA7 —ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 123
ANSELB —— ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 129
DACCON0 DACEN — DACOE1 DACOE2 DACPSS<1:0> — DACNSS 170
DACCON1 DACR<7:0> 170
OPA1CON OPA1EN OPA1SP — — — — OPA1PCH<1:0> 165
OPA2CON OPA2EN OPA2SP — — — — OPA2PCH<1:0> 165
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 122
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 128
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 133
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by op amps.
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DS41579C-page 166 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 167
PIC16(L)F1782/3
19.0 DIGITAL-TO-ANALOG
CONVERTER (DAC) MODULE
The Digital-to-Analog Converter supplies a variable
voltage reference, ratiometric with the input source,
with 256 selectable output levels.
The input of the DAC can be connected to:
•External V
REF pins
•V
DD supply voltage
• FVR (Fixed Voltage Reference)
The output of the DAC can be configured to supply a
reference voltage to the following:
• Comparator positive input
• ADC input channel
•DACOUT1 pin
•DACOUT2 pin
The Digital-to-Analog Converter (DAC) is enabled by
setting the DACEN bit of the DACCON0 register.
19.1 Output Voltage Selection
The DAC has 256 voltage level ranges. The 256 levels
are set with the DACR<7:0> bits of the DACCON1
register.
The DAC output voltage is determined by Equation 19-1:
EQUATION 19-1: DAC OUTPUT VOLTAGE
19.2 Ratiometric Output Level
The DAC output value is derived using a resistor ladder
with each end of the ladder tied to a positive and
negative voltage reference input source. If the voltage
of either input source fluctuates, a similar fluctuation will
result in the DAC output value.
The value of the individual resistors within the ladder
can be found in Section 30.0 “Electrical
Specifications”.
19.3 DAC Voltage Reference Output
The DAC voltage can be output to the DACOUT1 and
DACOUT2 pins by setting the respective DACOE1 and
DACOE2 pins of the DACCON0 register. Selecting the
DAC reference voltage for output on either DACOUTX
pin automatically overrides the digital output buffer and
digital input threshold detector functions of that pin.
Reading the DACOUTX pin when it has been
configured for DAC reference voltage output will
always return a ‘0’.
Due to the limited current drive capability, a buffer must
be used on the DAC voltage reference output for
external connections to either DACOUTx pin.
Figure 19-2 shows an example buffering technique.
IF DACEN = 1
VSOURCE+ = VDD, VREF, or FVR BUFFER 2
VSOURCE- = VSS
VOUT VSOURCE+VSOURCE-–
DACR 7:0
28
------------------------------


VSOURCE-+=
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DS41579C-page 168 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 19-1: DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM
FIGURE 19-2: VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE
32-to-1 MUX
DACR<4:0>
R
VREF-
DACNSS
R
R
R
R
R
R
256 DAC_Output
DACOUT1
8
(To Comparator and
ADC Modules)
DACOE1
VDD
VREF+
DACPSS<1:0> 2
DACEN
Steps
Digital-to-Analog Converter (DAC)
FVR BUFFER2
R
VSOURCE-
VSOURCE+
VSS
DACOUT2
DACOE2
DACOUTXBuffered DAC Output
+
–
DAC
Module
Voltage
Reference
Output
Impedance
R
PIC® MCU
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 169
PIC16(L)F1782/3
19.4 Operation During Sleep
When the device wakes up from Sleep through an
interrupt or a Watchdog Timer time-out, the contents of
the DACCON0 register are not affected. To minimize
current consumption in Sleep mode, the voltage
reference should be disabled.
19.5 Effects of a Reset
A device Reset affects the following:
• DAC is disabled.
• DAC output voltage is removed from the
DACOUT pin.
• The DACR<4:0> range select bits are cleared.
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DS41579C-page 170 Preliminary 2011-2012 Microchip Technology Inc.
19.6 Register Definitions: DAC Control
TABLE 19-1: SUMMARY OF REGISTERS ASSOCIATED WITH THE DAC MODULE
REGISTER 19-1: DACCON0: VOLTAGE REFERENCE CONTROL REGISTER 0
R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0
DACEN — DACOE1 DACOE2 DACPSS<1:0> — DACNSS
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 DACEN: DAC Enable bit
1 = DAC is enabled
0 = DAC is disabled
bit 6 Unimplemented: Read as ‘0’
bit 5 DACOE1: DAC Voltage Output 1 Enable bit
1 = DAC voltage level is also an output on the DACOUT1 pin
0 = DAC voltage level is disconnected from the DACOUT1 pin
bit 4 DACOE2: DAC Voltage Output 2 Enable bit
1 = DAC voltage level is also an output on the DACOUT2 pin
0 = DAC voltage level is disconnected from the DACOUT2 pin
bit 3-2 DACPSS<1:0>: DAC Positive Source Select bits
11 = Reserved, do not use
10 = FVR Buffer2 output
01 =V
REF+ pin
00 =V
DD
bit 1 Unimplemented: Read as ‘0’
bit 0 DACNSS: DAC Negative Source Select bits
1 =V
REF- pin
0 =V
SS
REGISTER 19-2: DACCON1: VOLTAGE REFERENCE CONTROL REGISTER 1
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
DACR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 DACR<7:0>: DAC Voltage Output Select bits
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on page
FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 145
DACCON0 DACEN — DACOE1 DACOE2 DACPSS<1:0> — DACNSS 170
DACCON1 DACR<7:0> 170
Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used with the DAC module.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 171
PIC16(L)F1782/3
20.0 COMPARATOR MODULE
Comparators are used to interface analog circuits to a
digital circuit by comparing two analog voltages and
providing a digital indication of their relative magnitudes.
Comparators are very useful mixed signal building
blocks because they provide analog functionality
independent of program execution. The analog
comparator module includes the following features:
• Independent comparator control
• Programmable input selection
• Comparator output is available internally/externally
• Programmable output polarity
• Interrupt-on-change
• Wake-up from Sleep
• Programmable Speed/Power optimization
•PWM shutdown
• Programmable and fixed voltage reference
20.1 Comparator Overview
A single comparator is shown in Figure 20-1 along with
the relationship between the analog input levels and
the digital output. When the analog voltage at VIN+ is
less than the analog voltage at VIN-, the output of the
comparator is a digital low level. When the analog
voltage at VIN+ is greater than the analog voltage at
VIN-, the output of the comparator is a digital high level.
The comparators available for this device are located in
Table 20-1.
FIGURE 20-1: SINGLE COMPARATOR
TABLE 20-1: COMPARATOR AVAILABILITY
PER DEVICE
Device C1 C2 C3
PIC16(L)F1782 ●●●
PIC16(L)F1783 ●●●
–
+
VIN+
VIN-Output
Output
VIN+
VIN-
Note: The black areas of the output of the
comparator represents the uncertainty
due to input offsets and response time.
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DS41579C-page 172 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 20-2: COMPARATOR MODULE SIMPLIFIED BLOCK DIAGRAM
Note 1: When CxON = 0, the comparator will produce a ‘0’ at the output.
2: When CxON = 0, all multiplexer inputs are disconnected.
MUX
Cx
CxON(1)
CxNCH<2:0>
3
0
1
CXPCH<2:0>
CXIN1-
CXIN2-
CXIN3-
CXIN0+
MUX
-
+
CxVN
CxVP
To PSMC Logic
Q1
D
EN
Q
Set CxIF
0
1
CXSYNC CXOE
CXOUT
DQ
DAC_Output
FVR Buffer2
CXIN0-
2
CxSP
CxHYS
det
Interrupt
det
Interrupt
CxINTN
CxINTP
3
3
AGND
TRIS bit
CxON
(2)
(2)
From Timer1
tmr1_clk
Reserved
0
1
2
3
4
5
6
7
AGND
4
5
6
7
CXIN1+
Reserved
Reserved
Reserved
Reserved
Reserved
sync_CxOUT To Ti m e r 1
to CMXCON0 (CXOUT)
and CM2CON1 (MCXOUT)
CXPOL
0
1
CxZLF
ZLF
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 173
PIC16(L)F1782/3
20.2 Comparator Control
Each comparator has 2 control registers: CMxCON0 and
CMxCON1.
The CMxCON0 registers (see Register 20-1) contain
Control and Status bits for the following:
• Enable
•Output selection
• Output polarity
• Speed/Power selection
• Hysteresis enable
• Output synchronization
The CMxCON1 registers (see Register 20-2) contain
Control bits for the following:
• Interrupt enable
• Interrupt edge polarity
• Positive input channel selection
• Negative input channel selection
20.2.1 COMPARATOR ENABLE
Setting the CxON bit of the CMxCON0 register enables
the comparator for operation. Clearing the CxON bit
disables the comparator resulting in minimum current
consumption.
20.2.2 COMPARATOR OUTPUT
SELECTION
The output of the comparator can be monitored by
reading either the CxOUT bit of the CMxCON0 register
or the MCxOUT bit of the CMOUT register. In order to
make the output available for an external connection,
the following conditions must be true:
• CxOE bit of the CMxCON0 register must be set
• Corresponding TRIS bit must be cleared
• CxON bit of the CMxCON0 register must be set
20.2.3 COMPARATOR OUTPUT POLARITY
Inverting the output of the comparator is functionally
equivalent to swapping the comparator inputs. The
polarity of the comparator output can be inverted by
setting the CxPOL bit of the CMxCON0 register.
Clearing the CxPOL bit results in a non-inverted output.
Table 20-2 shows the output state versus input
conditions, including polarity control.
20.2.4 COMPARATOR SPEED/POWER
SELECTION
The trade-off between speed or power can be opti-
mized during program execution with the CxSP control
bit. The default state for this bit is ‘1’ which selects the
normal speed mode. Device power consumption can
be optimized at the cost of slower comparator propaga-
tion delay by clearing the CxSP bit to ‘0’.
Note 1: The CxOE bit of the CMxCON0 register
overrides the PORT data latch. Setting
the CxON bit of the CMxCON0 register
has no impact on the port override.
2: The internal output of the comparator is
latched with each instruction cycle.
Unless otherwise specified, external
outputs are not latched.
TABLE 20-2: COMPARATOR OUTPUT
STATE VS. INPUT
CONDITIONS
Input Condition CxPOL CxOUT
CxVN > CxVP00
CxVN < CxVP01
CxVN > CxVP11
CxVN < CxVP10
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20.3 Comparator Hysteresis
A selectable amount of separation voltage can be
added to the input pins of each comparator to provide a
hysteresis function to the overall operation. Hysteresis
is enabled by setting the CxHYS bit of the CMxCON0
register.
See Section 30.0 “Electrical Specifications” for
more information.
20.4 Timer1 Gate Operation
The output resulting from a comparator operation can
be used as a source for gate control of Timer1. See
Section 22.6 “Timer1 Gate” for more information.
This feature is useful for timing the duration or interval
of an analog event.
It is recommended that the comparator output be syn-
chronized to Timer1. This ensures that Timer1 does not
increment while a change in the comparator is occur-
ring.
20.4.1 COMPARATOR OUTPUT
SYNCHRONIZATION
The output from a comparator can be synchronized
with Timer1 by setting the CxSYNC bit of the
CMxCON0 register.
Once enabled, the comparator output is latched on the
falling edge of the Timer1 source clock. If a prescaler is
used with Timer1, the comparator output is latched after
the prescaling function. To prevent a race condition, the
comparator output is latched on the falling edge of the
Timer1 clock source and Timer1 increments on the
rising edge of its clock source. See the Comparator
Block Diagram (Figure 20-2) and the Timer1 Block
Diagram (Figure 22-1) for more information.
20.5 Comparator Interrupt
An interrupt can be generated upon a change in the
output value of the comparator for each comparator, a
rising edge detector and a falling edge detector are
present.
When either edge detector is triggered and its associ-
ated enable bit is set (CxINTP and/or CxINTN bits of
the CMxCON1 register), the Corresponding Interrupt
Flag bit (CxIF bit of the PIR2 register) will be set.
To enable the interrupt, you must set the following bits:
• CxON, CxPOL and CxSP bits of the CMxCON0
register
• CxIE bit of the PIE2 register
• CxINTP bit of the CMxCON1 register (for a rising
edge detection)
• CxINTN bit of the CMxCON1 register (for a falling
edge detection)
• PEIE and GIE bits of the INTCON register
The associated interrupt flag bit, CxIF bit of the PIR2
register, must be cleared in software. If another edge is
detected while this flag is being cleared, the flag will still
be set at the end of the sequence.
20.6 Comparator Positive Input
Selection
Configuring the CxPCH<2:0> bits of the CMxCON1
register directs an internal voltage reference or an
analog pin to the non-inverting input of the comparator:
• CxIN+ analog pin
• DAC output
• FVR (Fixed Voltage Reference)
•V
SS (Ground)
See Section 15.0 “Fixed Voltage Reference (FVR)”
for more information on the Fixed Voltage Reference
module.
See Section 19.0 “Digital-to-Analog Converter
(DAC) Module” for more information on the DAC input
signal.
Any time the comparator is disabled (CxON = 0), all
comparator inputs are disabled.
Note: Although a comparator is disabled, an
interrupt can be generated by changing
the output polarity with the CxPOL bit of
the CMxCON0 register, or by switching
the comparator on or off with the CxON bit
of the CMxCON0 register.
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20.7 Comparator Negative Input
Selection
The CxNCH<2:0> bits of the CMxCON0 register direct
one of eight analog pins to the comparator inverting
input.
20.8 Comparator Response Time
The comparator output is indeterminate for a period of
time after the change of an input source or the selection
of a new reference voltage. This period is referred to as
the response time. The response time of the comparator
differs from the settling time of the voltage reference.
Therefore, both of these times must be considered when
determining the total response time to a comparator
input change. See the Comparator and Voltage Refer-
ence Specifications in Section 30.0 “Electrical Speci-
fications” for more details.
20.9 Zero Latency Filter
In high-speed operation, and under proper circuit
conditions, it is possible for the comparator output to
oscillate. This oscillation can have adverse effects on
the hardware and software relying on this signal.
Therefore, a digital filter has been added to the
comparator output to suppress the comparator output
oscillation. Once the comparator output changes, the
output is prevented from reversing the change for a
nominal time of 20 ns. This allows the comparator
output to stabilize without affecting other dependent
devices. Refer to Figure 20-3.
FIGURE 20-3: COMPARATOR ZERO LATENCY FILTER OPERATION
Note: To use CxINy+ and CxINy- pins as analog
input, the appropriate bits must be set in
the ANSEL register and the correspond-
ing TRIS bits must also be set to disable
the output drivers.
CxOUT From Comparator
CxOUT From ZLF TZLF
Output waiting for TZLF to expire before an output change is allowed
TZLF has expired so output change of ZLF is immediate based on
comparator output change
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DS41579C-page 176 Preliminary 2011-2012 Microchip Technology Inc.
20.10 Analog Input Connection
Considerations
A simplified circuit for an analog input is shown in
Figure 20-4. Since the analog input pins share their
connection with a digital input, they have reverse
biased ESD protection diodes to VDD and VSS. The
analog input, therefore, must be between VSS and VDD.
If the input voltage deviates from this range by more
than 0.6V in either direction, one of the diodes is for-
ward biased and a latch-up may occur.
A maximum source impedance of 10 k is recommended
for the analog sources. Also, any external component
connected to an analog input pin, such as a capacitor or
a Zener diode, should have very little leakage current to
minimize inaccuracies introduced.
20.10.1 ALTERNATE PIN LOCATIONS
This module incorporates I/O pins that can be moved to
other locations with the use of the alternate pin function
register APFCON. To determine which pins can be
moved and what their default locations are upon a
reset, see Section 13.1 “Alternate Pin Function” for
more information.
FIGURE 20-4: ANALOG INPUT MODEL
Note 1: When reading a PORT register, all pins
configured as analog inputs will read as a
‘0’. Pins configured as digital inputs will
convert as an analog input, according to
the input specification.
2: Analog levels on any pin defined as a
digital input, may cause the input buffer to
consume more current than is specified.
VA
Rs < 10K
CPIN
5 pF
VDD
VT 0.6V
VT 0.6V
RIC
ILEAKAGE(1)
Vss
Legend: CPIN = Input Capacitance
ILEAKAGE = Leakage Current at the pin due to various junctions
RIC = Interconnect Resistance
RS= Source Impedance
VA= Analog Voltage
VT= Threshold Voltage
To Comparator
Note 1: See Section 30.0 “Electrical Specifications”
Analog
Input
pin
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20.11 Register Definitions: Comparator Control
REGISTER 20-1: CMxCON0: COMPARATOR Cx CONTROL REGISTER 0
R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-1/1 R/W-0/0 R/W-0/0
CxON CxOUT CxOE CxPOL CxZLF CxSP CxHYS CxSYNC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 CxON: Comparator Enable bit
1 = Comparator is enabled
0 = Comparator is disabled and consumes no active power
bit 6 CxOUT: Comparator Output bit
If CxPOL = 1 (inverted polarity):
1 = CxVP < CxVN
0 = CxVP > CxVN
If CxPOL = 0 (non-inverted polarity):
1 = CxVP > CxVN
0 = CxVP < CxVN
bit 5 CxOE: Comparator Output Enable bit
1 = CxOUT is present on the CxOUT pin. Requires that the associated TRIS bit be cleared to actually
drive the pin. Not affected by CxON.
0 = CxOUT is internal only
bit 4 CxPOL: Comparator Output Polarity Select bit
1 = Comparator output is inverted
0 = Comparator output is not inverted
bit 3 CxZLF: Comparator Zero Latency Filter Enable bit
1 = Comparator output is filtered
0 = Comparator output is unfiltered
bit 2 CxSP: Comparator Speed/Power Select bit
1 = Comparator operates in normal power, higher speed mode
0 = Comparator operates in low-power, low-speed mode
bit 1 CxHYS: Comparator Hysteresis Enable bit
1 = Comparator hysteresis enabled
0 = Comparator hysteresis disabled
bit 0 CxSYNC: Comparator Output Synchronous Mode bit
1 = Comparator output to Timer1 and I/O pin is synchronous to changes on Timer1 clock source.
Output updated on the falling edge of Timer1 clock source.
0 = Comparator output to Timer1 and I/O pin is asynchronous.
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REGISTER 20-2: CMxCON1: COMPARATOR Cx CONTROL REGISTER 1
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
CxINTP CxINTN CxPCH<2:0> CxNCH<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 CxINTP: Comparator Interrupt on Positive Going Edge Enable bits
1 = The CxIF interrupt flag will be set upon a positive going edge of the CxOUT bit
0 = No interrupt flag will be set on a positive going edge of the CxOUT bit
bit 6 CxINTN: Comparator Interrupt on Negative Going Edge Enable bits
1 = The CxIF interrupt flag will be set upon a negative going edge of the CxOUT bit
0 = No interrupt flag will be set on a negative going edge of the CxOUT bit
bit 5-3 CxPCH<2:0>: Comparator Positive Input Channel Select bits
111 = CxVP connects to AGND
110 = CxVP connects to FVR Buffer 2
101 = CxVP connects to VDAC
100 = Reserved, input floating
011 = Reserved, input floating
010 = Reserved, input floating
001 = CxVP connects to CxIN1+ pin
000 = CxVP connects to CxIN0+ pin
bit 2-0 CxNCH<2:0>: Comparator Negative Input Channel Select bits
111 = CxVN connects to AGND
110 = CxVN unconnected, input floating
101 = Reserved, input floating
100 = Reserved, input floating
011 = CxVN connects to CxIN3- pin
010 = CxVN connects to CxIN2- pin
001 = CxVN connects to CxIN1- pin
000 = CxVN connects to CxIN0- pin
REGISTER 20-3: CMOUT: COMPARATOR OUTPUT REGISTER
U-0 U-0 U-0 U-0 U-0 R-0/0 R-0/0 R-0/0
— — — — — MC3OUT MC2OUT MC1OUT
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-3 Unimplemented: Read as ‘0’
bit 2 MC3OUT: Mirror Copy of C3OUT bit
bit 1 MC2OUT: Mirror Copy of C2OUT bit
bit 0 MC1OUT: Mirror Copy of C1OUT bit
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TABLE 20-3: SUMMARY OF REGISTERS ASSOCIATED WITH COMPARATOR MODULE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELA ANSA7 — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 123
ANSELB —— ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 129
CM1CON0 C1ON C1OUT C1OE C1POL C1ZLF C1SP C1HYS C1SYNC 177
CM2CON0 C2ON C2OUT C2OE C2POL C2ZLF C2SP C2HYS C2SYNC 177
CM1CON1 C1NTP C1INTN C1PCH<2:0> C1NCH<2:0> 178
CM2CON1 C2NTP C2INTN C2PCH<2:0> C2NCH<2:0> 178
CM3CON0 C3ON C3OUT C3OE C3POL C3ZLF C3SP C3HYS C3SYNC 177
CM3CON1 C3INTP C3INTN C3PCH<2:0> C3NCH<2:0> 178
CMOUT — — — — — MC3OUT MC2OUT MC1OUT 178
FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 145
DACCON0 DACEN — DACOE1 DACOE2 DACPSS<1:0> — DACNSS 170
DACCON1 DACR<7:0> 170
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
PIE2 OSFIE C2IE C1IE EEIE BCLIE —C3IE CCP2IE 86
PIR2 OSFIF C2IF C1IF EEIF BCLIF —C3IF CCP2IF 89
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 123
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 129
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 133
Legend: — = unimplemented location, read as ‘0’. Shaded cells are unused by the comparator module.
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DS41579C-page 180 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 181
PIC16(L)F1782/3
21.0 TIMER0 MODULE
The Timer0 module is an 8-bit timer/counter with the
following features:
• 8-bit timer/counter register (TMR0)
• 8-bit prescaler (independent of Watchdog Timer)
• Programmable internal or external clock source
• Programmable external clock edge selection
• Interrupt on overflow
• TMR0 can be used to gate Timer1
Figure 21-1 is a block diagram of the Timer0 module.
21.1 Timer0 Operation
The Timer0 module can be used as either an 8-bit timer
or an 8-bit counter.
21.1.1 8-BIT TIMER MODE
The Timer0 module will increment every instruction
cycle, if used without a prescaler. 8-bit Timer mode is
selected by clearing the TMR0CS bit of the
OPTION_REG register.
When TMR0 is written, the increment is inhibited for
two instruction cycles immediately following the write.
21.1.2 8-BIT COUNTER MODE
In 8-Bit Counter mode, the Timer0 module will increment
on every rising or falling edge of the T0CKI pin.
8-Bit Counter mode using the T0CKI pin is selected by
setting the TMR0CS bit in the OPTION_REG register to
‘1’.
The rising or falling transition of the incrementing edge
for either input source is determined by the TMR0SE bit
in the OPTION_REG register.
FIGURE 21-1: BLOCK DIAGRAM OF THE TIMER0
Note: The value written to the TMR0 register
can be adjusted, in order to account for
the two instruction cycle delay when
TMR0 is written.
T0CKI
TMR0SE
TMR0
PS<2:0>
Data Bus
Set Flag bit TMR0IF
on Overflow
TMR0CS
0
1
0
1
8
8
8-bit
Prescaler
FOSC/4
PSA
Sync
2 TCY
Overflow to Timer1
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21.1.3 SOFTWARE PROGRAMMABLE
PRESCALER
A software programmable prescaler is available for
exclusive use with Timer0. The prescaler is enabled by
clearing the PSA bit of the OPTION_REG register.
There are 8 prescaler options for the Timer0 module
ranging from 1:2 to 1:256. The prescale values are
selectable via the PS<2:0> bits of the OPTION_REG
register. In order to have a 1:1 prescaler value for the
Timer0 module, the prescaler must be disabled by set-
ting the PSA bit of the OPTION_REG register.
The prescaler is not readable or writable. All instructions
writing to the TMR0 register will clear the prescaler.
21.1.4 TIMER0 INTERRUPT
Timer0 will generate an interrupt when the TMR0
register overflows from FFh to 00h. The TMR0IF
interrupt flag bit of the INTCON register is set every
time the TMR0 register overflows, regardless of
whether or not the Timer0 interrupt is enabled. The
TMR0IF bit can only be cleared in software. The Timer0
interrupt enable is the TMR0IE bit of the INTCON
register.
21.1.5 8-BIT COUNTER MODE
SYNCHRONIZATION
When in 8-Bit Counter mode, the incrementing edge on
the T0CKI pin must be synchronized to the instruction
clock. Synchronization can be accomplished by
sampling the prescaler output on the Q2 and Q4 cycles
of the instruction clock. The high and low periods of the
external clocking source must meet the timing
requirements as shown in Section 30.0 “Electrical
Specifications”.
21.1.6 OPERATION DURING SLEEP
Timer0 cannot operate while the processor is in Sleep
mode. The contents of the TMR0 register will remain
unchanged while the processor is in Sleep mode.
Note: The Watchdog Timer (WDT) uses its own
independent prescaler.
Note: The Timer0 interrupt cannot wake the
processor from Sleep since the timer is
frozen during Sleep.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 183
PIC16(L)F1782/3
21.2 Register Definitions: Option Register
TABLE 21-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0
REGISTER 21-1: OPTION_REG: OPTION REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 WPUEN: Weak Pull-Up Enable bit
1 = All weak pull-ups are disabled (except MCLR, if it is enabled)
0 = Weak pull-ups are enabled by individual WPUx latch values
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of INT pin
0 = Interrupt on falling edge of INT pin
bit 5 TMR0CS: Timer0 Clock Source Select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clock (FOSC/4)
bit 4 TMR0SE: Timer0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3 PSA: Prescaler Assignment bit
1 = Prescaler is not assigned to the Timer0 module
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS<2:0>: Prescaler Rate Select bits
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
Bit Value Timer0 Rate
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 183
TMR0 Timer0 Module Register 181*
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 122
Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the Timer0 module.
* Page provides register information.
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NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 185
PIC16(L)F1782/3
22.0 TIMER1 MODULE WITH GATE
CONTROL
The Timer1 module is a 16-bit timer/counter with the
following features:
• 16-bit timer/counter register pair (TMR1H:TMR1L)
• Programmable internal or external clock source
• 2-bit prescaler
• Dedicated 32 kHz oscillator circuit
• Optionally synchronized comparator out
• Multiple Timer1 gate (count enable) sources
• Interrupt on overflow
• Wake-up on overflow (external clock,
Asynchronous mode only)
• Time base for the Capture/Compare function
• Auto-conversion Trigger (with CCP)
• Selectable Gate Source Polarity
• Gate Toggle mode
• Gate Single-pulse mode
• Gate Value Status
• Gate Event Interrupt
Figure 22-1 is a block diagram of the Timer1 module.
FIGURE 22-1: TIMER1 BLOCK DIAGRAM
TMR1H TMR1L
T1SYNC
T1CKPS<1:0>
Prescaler
1, 2, 4, 8
0
1
Synchronized
clock input
2
TMR1(2)
TMR1ON
Note 1: ST Buffer is high speed type when using T1CKI.
2: Timer1 register increments on rising edge.
3: Synchronize does not operate while in Sleep.
T1G
T1OSC
FOSC/4
Internal
Clock
T1OSO
T1OSI
T1OSCEN
1
0
T1CKI
TMR1CS<1:0>
(1)
Synchronize(3)
det
Sleep input
TMR1GE
0
1
00
01
10
11
T1GPOL
D
Q
CK
Q
0
1
T1GVAL
T1GTM
Single-Pulse
Acq. Control
T1GSPM
T1GGO/DONE
T1GSS<1:0>
EN
OUT
10
11
00
01
FOSC
Internal
Clock
R
D
EN
Q
Q1
RD
T1GCON
Data Bus
det
Interrupt
TMR1GIF
Set
T1CLK
FOSC/2
Internal
Clock
D
EN
Q
t1g_in
TMR1ON
Reserved
From Timer0
Overflow
sync_C2OUT
sync_C1OUT
To Comparator Module
To Clock Switching Modules
Set flag bit
TMR1IF on
Overflow
To ADC Auto-Conversion
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DS41579C-page 186 Preliminary 2011-2012 Microchip Technology Inc.
22.1 Timer1 Operation
The Timer1 module is a 16-bit incrementing counter
which is accessed through the TMR1H:TMR1L register
pair. Writes to TMR1H or TMR1L directly update the
counter.
When used with an internal clock source, the module is
a timer and increments on every instruction cycle.
When used with an external clock source, the module
can be used as either a timer or counter and incre-
ments on every selected edge of the external source.
Timer1 is enabled by configuring the TMR1ON and
TMR1GE bits in the T1CON and T1GCON registers,
respectively. Table 22-1 displays the Timer1 enable
selections.
22.2 Clock Source Selection
The TMR1CS<1:0> and T1OSCEN bits of the T1CON
register are used to select the clock source for Timer1.
Table 22-2 displays the clock source selections.
22.2.1 INTERNAL CLOCK SOURCE
When the internal clock source is selected, the
TMR1H:TMR1L register pair will increment on multiples
of FOSC as determined by the Timer1 prescaler.
When the FOSC internal clock source is selected, the
Timer1 register value will increment by four counts every
instruction clock cycle. Due to this condition, a 2 LSB
error in resolution will occur when reading the Timer1
value. To utilize the full resolution of Timer1, an
asynchronous input signal must be used to gate the
Timer1 clock input.
The following asynchronous sources may be used:
• Asynchronous event on the T1G pin to Timer1
gate
• C1 or C2 comparator input to Timer1 gate
22.2.2 EXTERNAL CLOCK SOURCE
When the external clock source is selected, the Timer1
module may work as a timer or a counter.
When enabled to count, Timer1 is incremented on the
rising edge of the external clock input T1CKI, which can
be synchronized to the microcontroller system clock or
can run asynchronously.
When used as a timer with a clock oscillator, an
external 32.768 kHz crystal can be used in conjunction
with the dedicated internal oscillator circuit.
TABLE 22-1: TIMER1 ENABLE
SELECTIONS
TMR1ON TMR1GE Timer1
Operation
00Off
01Off
10Always On
11Count Enabled
Note: In Counter mode, a falling edge must be
registered by the counter prior to the first
incrementing rising edge after any one or
more of the following conditions:
• Timer1 enabled after POR
• Write to TMR1H or TMR1L
• Timer1 is disabled
• Timer1 is disabled (TMR1ON = 0)
when T1CKI is high then Timer1 is
enabled (TMR1ON=1) when T1CKI is
low.
TABLE 22-2: CLOCK SOURCE SELECTIONS
TMR1CS<1:0> T1OSCEN Clock Source
11 x LFINTOSC
10 0 External Clocking on T1CKI Pin
01 x System Clock (FOSC)
00 x Instruction Clock (FOSC/4)
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22.3 Timer1 Prescaler
Timer1 has four prescaler options allowing 1, 2, 4 or 8
divisions of the clock input. The T1CKPS bits of the
T1CON register control the prescale counter. The
prescale counter is not directly readable or writable;
however, the prescaler counter is cleared upon a write to
TMR1H or TMR1L.
22.4 Timer1 Oscillator
A dedicated low-power 32.768 kHz oscillator circuit is
built-in between pins T1OSI (input) and T1OSO
(amplifier output). This internal circuit is to be used in
conjunction with an external 32.768 kHz crystal.
The oscillator circuit is enabled by setting the
T1OSCEN bit of the T1CON register. The oscillator will
continue to run during Sleep.
22.5 Timer1 Operation in
Asynchronous Counter Mode
If the control bit T1SYNC of the T1CON register is set,
the external clock input is not synchronized. The timer
increments asynchronously to the internal phase
clocks. If the external clock source is selected then the
timer will continue to run during Sleep and can
generate an interrupt on overflow, which will wake-up
the processor. However, special precautions in
software are needed to read/write the timer (see
Section 22.5.1 “Reading and Writing Timer1 in
Asynchronous Counter Mode”).
22.5.1 READING AND WRITING TIMER1 IN
ASYNCHRONOUS COUNTER
MODE
Reading TMR1H or TMR1L while the timer is running
from an external asynchronous clock will ensure a valid
read (taken care of in hardware). However, the user
should keep in mind that reading the 16-bit timer in two
8-bit values itself, poses certain problems, since the
timer may overflow between the reads.
For writes, it is recommended that the user simply stop
the timer and write the desired values. A write
contention may occur by writing to the timer registers,
while the register is incrementing. This may produce an
unpredictable value in the TMR1H:TMR1L register pair.
22.6 Timer1 Gate
Timer1 can be configured to count freely or the count
can be enabled and disabled using Timer1 gate
circuitry. This is also referred to as Timer1 Gate Enable.
Timer1 gate can also be driven by multiple selectable
sources.
22.6.1 TIMER1 GATE ENABLE
The Timer1 Gate Enable mode is enabled by setting
the TMR1GE bit of the T1GCON register. The polarity
of the Timer1 Gate Enable mode is configured using
the T1GPOL bit of the T1GCON register.
When Timer1 Gate Enable mode is enabled, Timer1
will increment on the rising edge of the Timer1 clock
source. When Timer1 Gate Enable mode is disabled,
no incrementing will occur and Timer1 will hold the
current count. See Figure 22-3 for timing details.
Note: The oscillator requires a start-up and
stabilization time before use. Thus,
T1OSCEN should be set and a suitable
delay observed prior to using Timer1. A
suitable delay similar to the OST delay
can be implemented in software by
clearing the TMR1IF bit then presetting
the TMR1H:TMR1L register pair to
FC00h. The TMR1IF flag will be set when
1024 clock cycles have elapsed, thereby
indicating that the oscillator is running and
reasonably stable.
Note: When switching from synchronous to
asynchronous operation, it is possible to
skip an increment. When switching from
asynchronous to synchronous operation,
it is possible to produce an additional
increment.
TABLE 22-3: TIMER1 GATE ENABLE
SELECTIONS
T1CLK T1GPOL T1G Timer1 Operation
00Counts
01Holds Count
10Holds Count
11Counts
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22.6.2 TIMER1 GATE SOURCE
SELECTION
Timer1 gate source selections are shown in Table 22-4.
Source selection is controlled by the T1GSS bits of the
T1GCON register. The polarity for each available source
is also selectable. Polarity selection is controlled by the
T1GPOL bit of the T1GCON register.
TABLE 22-4: TIMER1 GATE SOURCES
22.6.2.1 T1G Pin Gate Operation
The T1G pin is one source for Timer1 gate control. It
can be used to supply an external source to the Timer1
gate circuitry.
22.6.2.2 Timer0 Overflow Gate Operation
When Timer0 increments from FFh to 00h, a
low-to-high pulse will automatically be generated and
internally supplied to the Timer1 gate circuitry.
22.6.2.3 Comparator C1 Gate Operation
The output resulting from a Comparator 1 operation can
be selected as a source for Timer1 gate control. The
Comparator 1 output (sync_C1OUT) can be
synchronized to the Timer1 clock or left asynchronous.
For more information see Section 20.4.1 “Comparator
Output Synchronization”.
22.6.2.4 Comparator C2 Gate Operation
The output resulting from a Comparator 2 operation
can be selected as a source for Timer1 gate control.
The Comparator 2 output (sync_C2OUT) can be
synchronized to the Timer1 clock or left asynchronous.
For more information see Section 20.4.1 “Comparator
Output Synchronization”.
22.6.3 TIMER1 GATE TOGGLE MODE
When Timer1 Gate Toggle mode is enabled, it is possi-
ble to measure the full-cycle length of a Timer1 gate
signal, as opposed to the duration of a single level
pulse.
The Timer1 gate source is routed through a flip-flop that
changes state on every incrementing edge of the sig-
nal. See Figure 22-4 for timing details.
Timer1 Gate Toggle mode is enabled by setting the
T1GTM bit of the T1GCON register. When the T1GTM
bit is cleared, the flip-flop is cleared and held clear. This
is necessary in order to control which edge is
measured.
22.6.4 TIMER1 GATE SINGLE-PULSE
MODE
When Timer1 Gate Single-Pulse mode is enabled, it is
possible to capture a single-pulse gate event. Timer1
Gate Single-Pulse mode is first enabled by setting the
T1GSPM bit in the T1GCON register. Next, the
T1GGO/DONE bit in the T1GCON register must be set.
The Timer1 will be fully enabled on the next
incrementing edge. On the next trailing edge of the
pulse, the T1GGO/DONE bit will automatically be
cleared. No other gate events will be allowed to
increment Timer1 until the T1GGO/DONE bit is once
again set in software. See Figure 22-5 for timing details.
If the Single-Pulse Gate mode is disabled by clearing the
T1GSPM bit in the T1GCON register, the T1GGO/DONE
bit should also be cleared.
Enabling the Toggle mode and the Single-Pulse mode
simultaneously will permit both sections to work
together. This allows the cycle times on the Timer1 gate
source to be measured. See Figure 22-6 for timing
details.
22.6.5 TIMER1 GATE VALUE STATUS
When Timer1 Gate Value Status is utilized, it is possible
to read the most current level of the gate control value.
The value is stored in the T1GVAL bit in the T1GCON
register. The T1GVAL bit is valid even when the Timer1
gate is not enabled (TMR1GE bit is cleared).
22.6.6 TIMER1 GATE EVENT INTERRUPT
When Timer1 Gate Event Interrupt is enabled, it is pos-
sible to generate an interrupt upon the completion of a
gate event. When the falling edge of T1GVAL occurs,
the TMR1GIF flag bit in the PIR1 register will be set. If
the TMR1GIE bit in the PIE1 register is set, then an
interrupt will be recognized.
The TMR1GIF flag bit operates even when the Timer1
gate is not enabled (TMR1GE bit is cleared).
T1GSS Timer1 Gate Source
00 Timer1 Gate Pin
01 Overflow of Timer0
(TMR0 increments from FFh to 00h)
10 Comparator 1 Output sync_C1OUT
(optionally Timer1 synchronized output)
11 Comparator 2 Output sync_C2OUT
(optionally Timer1 synchronized output)
Note: Enabling Toggle mode at the same time
as changing the gate polarity may result in
indeterminate operation.
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22.7 Timer1 Interrupt
The Timer1 register pair (TMR1H:TMR1L) increments
to FFFFh and rolls over to 0000h. When Timer1 rolls
over, the Timer1 interrupt flag bit of the PIR1 register is
set. To enable the interrupt on rollover, you must set
these bits:
• TMR1ON bit of the T1CON register
• TMR1IE bit of the PIE1 register
• PEIE bit of the INTCON register
• GIE bit of the INTCON register
The interrupt is cleared by clearing the TMR1IF bit in
the Interrupt Service Routine.
22.8 Timer1 Operation During Sleep
Timer1 can only operate during Sleep when setup in
Asynchronous Counter mode. In this mode, an external
crystal or clock source can be used to increment the
counter. To set up the timer to wake the device:
• TMR1ON bit of the T1CON register must be set
• TMR1IE bit of the PIE1 register must be set
• PEIE bit of the INTCON register must be set
• T1SYNC bit of the T1CON register must be set
• TMR1CS bits of the T1CON register must be
configured
• T1OSCEN bit of the T1CON register must be
configured
The device will wake-up on an overflow and execute
the next instructions. If the GIE bit of the INTCON
register is set, the device will call the Interrupt Service
Routine.
Timer1 oscillator will continue to operate in Sleep
regardless of the T1SYNC bit setting.
22.9 CCP Capture/Compare Time Base
The CCP modules use the TMR1H:TMR1L register
pair as the time base when operating in Capture or
Compare mode.
In Capture mode, the value in the TMR1H:TMR1L
register pair is copied into the CCPR1H:CCPR1L
register pair on a configured event.
In Compare mode, an event is triggered when the value
CCPR1H:CCPR1L register pair matches the value in
the TMR1H:TMR1L register pair. This event can be a
Auto-conversion Trigger.
For more information, see Section 13.0 “I/O Ports”.
22.10 CCP Auto-Conversion Trigger
When any of the CCP’s are configured to trigger a
auto-conversion, the trigger will clear the
TMR1H:TMR1L register pair. This auto-conversion
does not cause a Timer1 interrupt. The CCP module
may still be configured to generate a CCP interrupt.
In this mode of operation, the CCPR1H:CCPR1L
register pair becomes the period register for Timer1.
Timer1 should be synchronized and FOSC/4 should be
selected as the clock source in order to utilize the
Auto-conversion Trigger. Asynchronous operation of
Timer1 can cause a Auto-conversion Trigger to be
missed.
In the event that a write to TMR1H or TMR1L coincides
with a Auto-conversion Trigger from the CCP, the write
will take precedence.
For more information, see Section 25.2.4 “Auto-Con-
version Trigger”.
FIGURE 22-2: TIMER1 INCREMENTING EDGE
Note: The TMR1H:TMR1L register pair and the
TMR1IF bit should be cleared before
enabling interrupts.
T1CKI = 1
when TMR1
Enabled
T1CKI = 0
when TMR1
Enabled
Note 1: Arrows indicate counter increments.
2: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock.
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FIGURE 22-3: TIMER1 GATE ENABLE MODE
FIGURE 22-4: TIMER1 GATE TOGGLE MODE
TMR1GE
T1GPOL
t1g_in
T1CKI
T1GVAL
Timer1 N N + 1 N + 2 N + 3 N + 4
TMR1GE
T1GPOL
T1GTM
t1g_in
T1CKI
T1GVAL
Timer1 N N + 1 N + 2 N + 3 N + 4 N + 5 N + 6 N + 7 N + 8
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FIGURE 22-5: TIMER1 GATE SINGLE-PULSE MODE
TMR1GE
T1GPOL
t1g_in
T1CKI
T1GVAL
Timer1 N N + 1 N + 2
T1GSPM
T1GGO/
DONE
Set by software
Cleared by hardware on
falling edge of T1GVAL
Set by hardware on
falling edge of T1GVAL
Cleared by software
Cleared by
software
TMR1GIF
Counting enabled on
rising edge of T1G
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FIGURE 22-6: TIMER1 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE
TMR1GE
T1GPOL
t1g_in
T1CKI
T1GVAL
Timer1 NN + 1
N + 2
T1GSPM
T1GGO/
DONE
Set by software
Cleared by hardware on
falling edge of T1GVAL
Set by hardware on
falling edge of T1GVAL
Cleared by software
Cleared by
software
TMR1GIF
T1GTM
Counting enabled on
rising edge of T1G
N + 4
N + 3
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22.11 Register Definitions: Timer1 Control
T
REGISTER 22-1: T1CON: TIMER1 CONTROL REGISTER
R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W-0/u U-0 R/W-0/u
TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC —TMR1ON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 TMR1CS<1:0>: Timer1 Clock Source Select bits
11 = Reserved, do not use.
10 = Timer1 clock source is pin or oscillator:
If T1OSCEN = 0:
External clock from T1CKI pin (on the rising edge)
If T1OSCEN = 1:
Crystal oscillator on T1OSI/T1OSO pins
01 = Timer1 clock source is system clock (FOSC)
00 = Timer1 clock source is instruction clock (FOSC/4)
bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale value
10 = 1:4 Prescale value
01 = 1:2 Prescale value
00 = 1:1 Prescale value
bit 3 T1OSCEN: LP Oscillator Enable Control bit
1 = Dedicated Timer1 oscillator circuit enabled
0 = Dedicated Timer1 oscillator circuit disabled
bit 2 T1SYNC: Timer1 Synchronization Control bit
1 = Do not synchronize asynchronous clock input
0 = Synchronize asynchronous clock input with system clock (FOSC)
bit 1 Unimplemented: Read as ‘0’
bit 0 TMR1ON: Timer1 On bit
1 = Enables Timer1
0 = Stops Timer1 and clears Timer1 gate flip-flop
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REGISTER 22-2: T1GCON: TIMER1 GATE CONTROL REGISTER
R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W/HC-0/u R-x/x R/W-0/u R/W-0/u
TMR1GE T1GPOL T1GTM T1GSPM T1GGO/
DONE
T1GVAL T1GSS<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware
bit 7 TMR1GE: Timer1 Gate Enable bit
If TMR1ON = 0:
This bit is ignored
If TMR1ON = 1:
1 = Timer1 counting is controlled by the Timer1 gate function
0 = Timer1 counts regardless of Timer1 gate function
bit 6 T1GPOL: Timer1 Gate Polarity bit
1 = Timer1 gate is active-high (Timer1 counts when gate is high)
0 = Timer1 gate is active-low (Timer1 counts when gate is low)
bit 5 T1GTM: Timer1 Gate Toggle Mode bit
1 = Timer1 Gate Toggle mode is enabled
0 = Timer1 Gate Toggle mode is disabled and toggle flip-flop is cleared
Timer1 gate flip-flop toggles on every rising edge.
bit 4 T1GSPM: Timer1 Gate Single-Pulse Mode bit
1 = Timer1 Gate Single-Pulse mode is enabled and is controlling Timer1 gate
0 = Timer1 Gate Single-Pulse mode is disabled
bit 3 T1GGO/DONE: Timer1 Gate Single-Pulse Acquisition Status bit
1 = Timer1 gate single-pulse acquisition is ready, waiting for an edge
0 = Timer1 gate single-pulse acquisition has completed or has not been started
bit 2 T1GVAL: Timer1 Gate Current State bit
Indicates the current state of the Timer1 gate that could be provided to TMR1H:TMR1L.
Unaffected by Timer1 Gate Enable (TMR1GE).
bit 1-0 T1GSS<1:0>: Timer1 Gate Source Select bits
11 = Comparator 2 optionally synchronized output (sync_C2OUT)
10 = Comparator 1 optionally synchronized output (sync_C1OUT)
01 = Timer0 overflow output
00 = Timer1 gate pin
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TABLE 22-5: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELB ——ANSB5ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 129
CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 264
CCP2CON P2M<1:0> DC2B<1:0> CCP2M<3:0> 264
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 85
PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 88
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 185*
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 185*
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 128
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 133
T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC —TMR1ON193
T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/
DONE
T1GVAL T1GSS<1:0> 194
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the Timer1 module.
* Page provides register information.
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NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 197
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23.0 TIMER2 MODULE
The Timer2 module incorporates the following features:
• 8-bit Timer and Period registers (TMR2 and PR2,
respectively)
• Readable and writable (both registers)
• Software programmable prescaler (1:1, 1:4, 1:16,
and 1:64)
• Software programmable postscaler (1:1 to 1:16)
• Interrupt on TMR2 match with PR2, respectively
• Optional use as the shift clock for the MSSP mod-
ule
See Figure 23-1 for a block diagram of Timer2.
FIGURE 23-1: TIMER2 BLOCK DIAGRAM
Comparator
TMR2 Output
Sets Flag bit TMR2IF
TMR2 Reset
Postscaler
Prescaler
PR2
2
FOSC/4
1:1 to 1:16
1:1, 1:4, 1:16, 1:64
EQ
4
T2OUTPS<3:0>
T2CKPS<1:0>
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23.1 Timer2 Operation
The clock input to the Timer2 modules is the system
instruction clock (FOSC/4).
TMR2 increments from 00h on each clock edge.
A 4-bit counter/prescaler on the clock input allows direct
input, divide-by-4 and divide-by-16 prescale options.
These options are selected by the prescaler control bits,
T2CKPS<1:0> of the T2CON register. The value of
TMR2 is compared to that of the Period register, PR2, on
each clock cycle. When the two values match, the
comparator generates a match signal as the timer
output. This signal also resets the value of TMR2 to 00h
on the next cycle and drives the output
counter/postscaler (see Section 23.2 “Timer2
Interrupt”).
The TMR2 and PR2 registers are both directly readable
and writable. The TMR2 register is cleared on any
device Reset, whereas the PR2 register initializes to
FFh. Both the prescaler and postscaler counters are
cleared on the following events:
• a write to the TMR2 register
• a write to the T2CON register
• Power-on Reset (POR)
• Brown-out Reset (BOR)
•MCLR
Reset
• Watchdog Timer (WDT) Reset
• Stack Overflow Reset
• Stack Underflow Reset
•RESET Instruction
23.2 Timer2 Interrupt
Timer2 can also generate an optional device interrupt.
The Timer2 output signal (TMR2-to-PR2 match)
provides the input for the 4-bit counter/postscaler. This
counter generates the TMR2 match interrupt flag which
is latched in TMR2IF of the PIR1 register. The interrupt
is enabled by setting the TMR2 Match Interrupt Enable
bit, TMR2IE, of the PIE1 register.
A range of 16 postscale options (from 1:1 through 1:16
inclusive) can be selected with the postscaler control
bits, T2OUTPS<3:0>, of the T2CON register.
23.3 Timer2 Output
The unscaled output of TMR2 is available primarily to
the CCP modules, where it is used as a time base for
operations in PWM mode.
Timer2 can be optionally used as the shift clock source
for the MSSP module operating in SPI mode.
Additional information is provided in Section 26.0
“Master Synchronous Serial Port (MSSP) Module”
23.4 Timer2 Operation During Sleep
The Timer2 timers cannot be operated while the
processor is in Sleep mode. The contents of the TMR2
and PR2 registers will remain unchanged while the
processor is in Sleep mode.
Note: TMR2 is not cleared when T2CON is
written.
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23.5 Register Definitions: Timer2 Control
REGISTER 23-1: T2CON: TIMER2 CONTROL REGISTER
U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
— T2OUTPS<3:0> TMR2ON T2CKPS<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 Unimplemented: Read as ‘0’
bit 6-3 T2OUTPS<3:0>: Timer2 Output Postscaler Select bits
1111 = 1:16 Postscaler
1110 = 1:15 Postscaler
1101 = 1:14 Postscaler
1100 = 1:13 Postscaler
1011 = 1:12 Postscaler
1010 = 1:11 Postscaler
1001 = 1:10 Postscaler
1000 = 1:9 Postscaler
0111 = 1:8 Postscaler
0110 = 1:7 Postscaler
0101 = 1:6 Postscaler
0100 = 1:5 Postscaler
0011 = 1:4 Postscaler
0010 = 1:3 Postscaler
0001 = 1:2 Postscaler
0000 = 1:1 Postscaler
bit 2 TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits
11 = Prescaler is 64
10 = Prescaler is 16
01 =Prescaler is 4
00 =Prescaler is 1
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TABLE 23-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
CCP2CON P2M<1:0> DC2B<1:0> CCP2M<3:0> 264
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 85
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 88
PR2 Timer2 Module Period Register 197*
T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> 199
TMR2 Holding Register for the 8-bit TMR2 Register 197*
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Timer2 module.
* Page provides register information.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 201
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24.0 PROGRAMMABLE SWITCH
MODE CONTROL (PSMC)
The Programmable Switch Mode Controller (PSMC) is
a high-performance Pulse Width Modulator (PWM) that
can be configured to operate in one of several modes
to support single or multiple phase applications.
A simplified block diagram indicating the relationship
between inputs, outputs, and controls is shown in
Figure 24-1.
This section begins with the fundamental aspects of the
PSMC operation. A more detailed description of opera-
tion for each mode is located later in Section 24.3
“Modes of Operation”
Modes of operation include:
• Single-phase
• Complementary Single-phase
•Push-Pull
• Push-Pull 4-Bridge
• Complementary Push-Pull 4-Bridge
• Pulse Skipping
• Variable Frequency Fixed Duty Cycle
• Complementary Variable Frequency Fixed Duty
Cycle
• ECCP Compatible modes
- Full-Bridge
- Full-Bridge Reverse
• 3-Phase 6-Step PWM
FIGURE 24-1: PSMC SIMPLIFIED BLOCK DIAGRAM
PSMCXA
PSMCXB
PSMCXC
PSMCXD
PSMCXE
PSMCXF
Output Control
PSMCXOEN
PSMCXPOL
Mode Control
PSMCXCLK
FOSC
64 MHZ
PXCSRC<1:0> PXCPRE<1:0>
1,2, PSMCXTMR
PSMCXIN
S
R
C1OUT
C2OUT
C3OUT
CLR
CCP1
CCP2
PSMCXDCS
PSMCXPHS Q
PSMCXPRS
PSMCXFEBS
PSMCXREBS
PSMCXMDL
PXMODE
PSMCXSTR
Shutdown
PSMCXASDS
psmc_clk
Blanking
Rising
Event
Falling
Event
PSMCXDC =
PSMCXPH =
PSMCXPR =
FFA
Period
Event
sync_out
sync_in
4, 8
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24.1 Fundamental Operation
PSMC operation is based on the sequence of three
events:
• Period Event – Determines the frequency of the
active signal.
• Rising Edge Event – Determines start of the
active pulse. This is also referred to as the phase.
• Falling Edge Event – Determines the end of the
active pulse. This is also referred to as the duty
cycle.
The basic waveform generated from these events is
shown in Figure 24-2.
FIGURE 24-2: BASIC PWM WAVEFORM GENERATION
Each of the three types of events is triggered by a user
selectable combination of synchronous timed and
asynchronous external inputs.
Asynchronous event inputs may come directly from an
input pin or through the comparators.
Synchronous timed events are determined from the
PSMCxTMR counter, which is derived from internal
clock sources. See Section 24.2.5 “PSMC Time Base
Clock Sources” for more detail.
The active pulse stream can be further modulated by
one of several internal or external sources:
• Register control bit
• Comparator output
• CCP output
• Input pin
User selectable deadtime can be inserted in the drive
outputs to prevent shoot through of configurations with
two devices connected in series between the supply
rails.
Applications requiring very small frequency granularity
control when the PWM frequency is large can do so
with the fractional frequency control available in the
variable frequency fixed Duty Cycle modes.
PSMC operation can be quickly terminated without
software intervention by the auto-shutdown control.
Auto-shutdown can be triggered by any combination of
the following:
• PSMCxIN pin
• Comparator 1 output
• Comparator 2 output
• Comparator 3 output
24.1.1 PERIOD EVENT
The period event determines the frequency of the
active pulse. Period event sources include any combi-
nation of the following:
• PSMCxTMR counter match
• PSMC input pin
• Comparator 1 output
• Comparator 2 output
• Comparator 3 output
Period event sources are selected with the PSMC
Period Source (PSMCxPRS) register (Register 24-13).
Section 24.2.1.2 “16-bit Period Register” contains
details on configuring the PSMCxTMR counter match
for synchronous period events.
1 2 3
PWM Cycle Number
Inputs
Period Event
Rising Edge Event
Falling Edge Event
Outputs
PWM output
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 203
PIC16(L)F1782/3
All period events cause the PSMCxTMR counter to
reset on the counting clock edge immediately following
the period event. The PSMCxTMR counter resumes
counting from zero on the counting clock edge after the
period event Reset.
During a period, the rising event and falling event are
each permitted to occur only once. Subsequent rising
or falling events that may occur within the period are
suppressed, thereby preventing output chatter from
spurious inputs.
24.1.2 RISING EDGE EVENT
The rising edge event determines the start of the active
drive period. The rising edge event is also referred to
as the phase because two synchronized PSMC periph-
erals may have different rising edge events relative to
the period start, thereby creating a phase relationship
between the two PSMC peripheral outputs.
Depending on the PSMC mode, one or more of the
PSMC outputs will change in immediate response to
the rising edge event. Rising edge event sources
include any combination of the following:
• Synchronous:
- PSMCxTMR time base counter match
• Asynchronous:
- PSMC input pin
- Comparator 1 output
- Comparator 2 output
- Comparator 3 output
Rising edge event sources are selected with the PSMC
Phase Source (PSMCxPHS) register (Register 24-11).
For configuring the PSMCxTMR time base counter
match for synchronous rising edge events, see
Section 24.2.1.3 “16-bit Phase Register”.
The first rising edge event in a cycle period is the only
one permitted to cause action. All subsequent rising
edge events in the same period are suppressed to pre-
vent the PSMC output from chattering in the presence
of spurious event inputs. A rising edge event is also
suppressed when it occurs after a falling edge event in
the same period.
The rising edge event also triggers the start of two other
timers when needed: falling edge blanking and
dead-band period. For more detail refer to
Section 24.2.8 “Input Blanking” and Section 24.4
“Dead-Band Control”.
When the rising edge event is delayed from the period
start, the amount of delay subtracts from the total
amount of time available for the drive duty cycle. For
example, if the rising edge event is delayed by 10% of
the period time, the maximum duty cycle for that period
is 90%. A 100% duty cycle is still possible in this exam-
ple, but duty cycles from 90% to 100% are not possible.
24.1.3 FALLING EDGE EVENT
The falling edge event determines the end of the active
drive period. The falling edge event is also referred to
as the duty cycle because varying the falling edge
event, while keeping the rising edge event and period
events fixed, varies the active drive duty cycle.
Depending on the PSMC mode, one or more of the
PSMC outputs will change in immediate response to
the falling edge event. Falling edge event sources
include any combination of the following:
• Synchronous:
- PSMCxTMR time base counter match
• Asynchronous:
- PSMC input pin
- Comparator 1 output
- Comparator 2 output
- Comparator 3 output
Falling edge event sources are selected with PSMC Duty
Cycle Source (PSMCxDCS) register (Register 24-12).
For configuring the PSMCxTMR time base counter
match for synchronous falling edge events, see
Section 24.2.1.4 “16-bit Duty Cycle Register”.
The first falling edge event in a cycle period is the only
one permitted to cause action. All subsequent falling
edge events in the same period are suppressed to pre-
vent the PSMC output from chattering in the presence
of spurious event inputs.
A falling edge event suppresses any subsequent rising
edges that may occur in the same period. In other
words, if an asynchronous falling event input should
come late and occur early in the period, following that
for which it was intended, the rising edge in that period
will be suppressed. This will have a similar effect as
pulse skipping.
The falling edge event also triggers the start of two
other timers: rising edge blanking and dead-band
period. For more detail refer to Section 24.2.8 “Input
Blanking” and Section 24.4 “Dead-Band Control”.
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24.2 Event Sources
There are two main sources for the period, rising edge
and falling edge events:
• Synchronous input
- Time base
• Asynchronous Inputs
- Digital Inputs
- Analog inputs
24.2.1 TIME BASE
The Time Base section consists of several smaller
pieces.
• 16-bit time base counter
• 16-bit Period register
• 16-bit Phase register (rising edge event)
• 16-bit Duty Cycle register (falling edge event)
• Clock control
• Interrupt Generator
An example of a fully synchronous PWM waveform
generated with the time base is shown in Figure 24-2.
The PSMCxLD bit of the PSMCxCON register is
provided to synchronize changes to the event Count
registers. Changes are withheld from taking action until
the first period event Reset after the PSMCxLD bit is
set. For example, to change the PWM frequency, while
maintaining the same effective duty cycle, the Period
and Duty Cycle registers need to be changed. The
changes to all four registers take effect simultaneously
on the period event Reset after the after the PSMCxLD
bit is set.
24.2.1.1 16-bit Counter (Time Base)
The PSMCxTMR is the counter used as a timing
reference for each synchronous PWM period. The
counter starts at 0000h and increments to FFFFh on
the rising edge of the psmc_clk signal.
When the counter rolls over from FFFFh to 0000h
without a period event occurring, the overflow interrupt
will be generated, thereby setting the PxTOVIF bit of
the PSMC Time Base Interrupt Control (PSMCxINT)
register (Register 24-32).
The PSMCxTMR counter is reset on both synchronous
and asynchronous period events.
The PSMCxTMR is accessible to software as two 8-bit
registers:
• PSMC Time Base Counter Low (PSMCxTMRL)
register (Register 24-17)
• PSMC PSMC Time Base Counter High
(PSMCxTMRH) register (Register 24-18)
PSMCxTMR is reset to the default POR value when the
PSMCxEN bit is cleared.
24.2.1.2 16-bit Period Register
The PSMCxPR Period register is used to determine a
synchronous period event referenced to the 16-bit
PSMCxTMR digital counter. A match between the
PSMCxTMR and PSMCxPR register values will
generate a period event.
The match will generate a period match interrupt,
thereby setting the PxTPRIF bit of the PSMC Time Base
Interrupt Control (PSMCxINT) register (Register 24-32).
The 16-bit period value is accessible to software as
two 8-bit registers:
• PSMC Period Count Low Byte (PSMCxPRL)
register (Register 24-23)
• PSMC Period Count High Byte (PSMCxPRH)
register (Register 24-24)
The 16-bit period value is double-buffered before it is
presented to the 16-bit time base for comparison. The
buffered registers are updated on the first period event
Reset after the PSMCxLD bit of the PSMCxCON
register is set.
The synchronous PWM period time can be determined
from Equation 24-1.
EQUATION 24-1: PWM PERIOD
24.2.1.3 16-bit Phase Register
The PSMCxPH Phase register is used to determine a
synchronous rising edge event referenced to the 16-bit
PSMCxTMR digital counter. A match between the
PSMCxTMR and the PSMCxPH register values will
generate a rising edge event.
The match will generate a phase match interrupt,
thereby setting the PxTPHIF bit of the PSMC Time
Base Interrupt Control (PSMCxINT) register
(Register 24-32).
The 16-bit phase value is accessible to software as
two 8-bit registers:
• PSMC Phase Count Low Byte (PSMCxPHL)
register (Register 24-32)
• PSMC Phase Count High Byte (PSMCxPHH)
register (Register 24-32)
The 16-bit phase value is double-buffered before it is
presented to the 16-bit PSMCxTMR for comparison.
The buffered registers are updated on the first period
event Reset after the PSMCxLD bit of the PSMCxCON
register is set.
Period PSMCxPR[15:0] 1+
Fpsmc_clk
--------------------------------------------------=
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24.2.1.4 16-bit Duty Cycle Register
The PSMCxDC Duty Cycle register is used to deter-
mine a synchronous falling edge event referenced to
the 16-bit PSMCxTMR digital counter. A match
between the PSMCxTMR and PSMCxDC register val-
ues will generate a falling edge event.
The match will generate a duty cycle match interrupt,
thereby setting the PxTDCIF bit of the PSMC Time
Base Interrupt Control (PSMCxINT) register
(Register 24-32).
The 16-bit duty cycle value is accessible to software
as two 8-bit registers:
• PSMC Duty Cycle Count Low Byte (PSMCxDCL)
register (Register 24-21)
• PSMC Duty Cycle Count High Byte (PSMCxDCH)
register (Register 24-22)
The 16-bit duty cycle value is double-buffered before it
is presented to the 16-bit time base for comparison.
The buffered registers are updated on the first period
event Reset after the PSMCxLD bit of the PSMCxCON
register is set.
When the period, phase, and duty cycle are all deter-
mined from the time base, the effective PWM duty
cycle can be expressed as shown in Equation 24-2.
EQUATION 24-2: PWM DUTY CYCLE
24.2.2 0% DUTY CYCLE OPERATION
USING TIME BASE
To configure the PWM for 0% duty cycle set
PSMCxDC<15:0> = PSMCxPH<15:0>. This will trigger
a falling edge event simultaneous with the rising edge
event and prevent the PWM from being asserted.
24.2.3 100% DUTY CYCLE OPERATION
USING TIME BASE
To configure the PWM for 100% duty cycle set
PSMCxDC<15:0> > PSMCxPR<15:0>.
This will prevent a falling edge event from occurring as
the PSMCxDC<15:0> value and the time base value
PSMCxTMR<15:0> will never be equal.
24.2.4 TIME BASE INTERRUPT
GENERATION
The Time Base section can generate four unique
interrupts:
• Time Base Counter Overflow Interrupt
• Time Base Phase Register Match Interrupt
• Time Base Duty Cycle Register Match Interrupt
• Time Base Period Register Match Interrupt
Each interrupt has an interrupt flag bit and an interrupt
enable bit. The interrupt flag bit is set anytime a given
event occurs, regardless of the status of the enable bit.
Time base interrupt enables and flags are located in the
PSMC Time Base Interrupt Control (PSMCxINT)
register (Register 24-32).
PSMC time base interrupts also require that the
PSMCxTIE bit in the PIE4 register and the PEIE and
GIE bits in the INTCON register be set in order to
generate an interrupt. The PSMCxTIF interrupt flag in
the PIR4 register will only be set by a time base
interrupt when one or more of the enable bits in the
PSMCxINT register is set.
The interrupt flag bits need to be cleared in software.
However, all PMSCx time base interrupt flags, except
PSMCxTIF, are cleared when the PSMCxEN bit is
cleared.
Interrupt bits that are set by software will generate an
interrupt provided that the corresponding interrupt is
enabled.
24.2.5 PSMC TIME BASE CLOCK
SOURCES
There are 3 clock sources available to the module:
• Internal 64 MHz clock
• Fosc system clock
• External clock input pin
The clock source is selected with the PxCSRC<1:0>
bits of the PSMCx Clock Control (PSMCxCLK) register
(Register 24-5).
When the Internal 64 MHz clock is selected as the
source, the HFINTOSC continues to operate and clock
the PSMC circuitry in Sleep. However, the system
clock to other peripherals and the CPU is suppressed.
The Internal 64 MHz clock utilizes the system clock
4x PLL. When the system clock source is external and
the PSMC is using the Internal 64 MHz clock, the
4x PLL should not be used for the system clock.
24.2.6 CLOCK PRESCALER
There are four prescaler choices available to be
applied to the selected clock:
• Divide by 1
• Divide by 2
• Divide by 4
• Divide by 8
The clock source is selected with the PxCPRE<1:0>
bits of the PSMCx Clock Control (PSMCxCLK) register
(Register 24-5).
The prescaler output is psmc_clk, which is the clock
used by all of the other portions of the PSMC module.
DUTYCYCLE PSMCxDC[15:0] PSMCxPH[15:0]–
PSMCxPR[15:0] 1+
-----------------------------------------------------------------------------------------=
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DS41579C-page 206 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 24-3: TIME BASE WAVEFORM GENERATION
24.2.7 ASYNCHRONOUS INPUTS
The PSMC module supports asynchronous inputs
alone or in combination with the synchronous inputs.
asynchronous inputs include:
•Analog
- Comparator 1 output
- Comparator 2 output
- Comparator 3 output
•Digital
- PSMCxIN pin
24.2.7.1 Comparator Inputs
The outputs of any combination of the comparators
may be used to trigger any of the three events as well
as auto-shutdown.
The event triggers on the rising edge of the compara-
tor output. Except for auto-shutdown, the event input is
not level sensitive.
24.2.7.2 PSMCxIN Pin Input
The PSMCxIN pin may be used to trigger PSMC
events. Data is passed through straight to the PSMC
module without any synchronization to a system clock.
This is so that input blanking may be applied to any
external circuit using the module.
The event triggers on the rising edge of the PSMCxIN
signal.
1
0030h 0000h 0001h 0002h 0003h 0027h 0028h 0029h 0030h 0000h
0002h
0028h
0030h
psmc_clk
Counter
><15:0PSMCxPH
><15:0PSMCxDC
><15:0PSMCxPR
Inputs
Period Event
Rising Edge Event
Falling Edge Event
Output
PWM Output
Period
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24.2.8 INPUT BLANKING
Input blanking is a function whereby the inputs from
any selected asynchronous input may be driven inac-
tive for a short period of time. This is to prevent electri-
cal transients from the turn-on/off of power
components from generating a false event.
Rising edge and falling edge blanking are controlled
independently. The following features are available for
blanking:
• Blanking mode
• Blanking time counters
• Blanking enable
There is no blanking available for a period event.
The following Blanking modes are available:
• Blanking disabled
• Immediate blanking
The Falling Edge Blanking mode is set with the
PxFEBM<1:0> bits of the PSMCx Blanking Control
(PSMCxBLNK) register (Register 24-8).
The Rising Edge Blanking mode is set with the
PxREBM<1:0> bits of the PSMCx Blanking Control
(PSMCxBLNK) register (Register 24-8).
24.2.8.1 Blanking Disabled
With blanking disabled, the asynchronous inputs are
passed to PSMC module without any intervention.
24.2.8.2 Immediate Blanking
With Immediate blanking, a counter is used to deter-
mine the blanking period. The desired blanking time is
measured in psmc_clk periods. A rising edge event
will start incrementing the rising edge blanking coun-
ter. A falling edge event will start incrementing the fall-
ing edge blanking counter.
The rising edge blanking time is set with the PSMC
Rising Edge Blanking Time (PSMCxBLKR) register
(Register 24-28). The inputs to be blanked are
selected with the PSMC Rising Edge Blanked Source
(PSMCxREBS) register (Register 24-9). During rising
edge blanking, the selected blanked sources are sup-
pressed for falling edge as well as rising edge,
auto-shutdown and period events.
The falling edge blanking time is set with the PSMC
Falling Edge Blanking Time (PSMCxBLKF) register
(Register 24-29). The inputs to be blanked are
selected with the PSMC Falling Edge Blanked Source
(PSMCxFEBS) register (Register 24-10). During fall-
ing edge blanking, the selected blanked sources are
suppressed for rising edge, as well as falling edge,
auto-shutdown, and period events.
The blanking counters are incremented on the rising
edge of psmc_clk. Blanked sources are suppressed
until the counter value equals the blanking time regis-
ter causing the blanking to terminate.
As the rising and falling edge events are from asyn-
chronous inputs, there may be some uncertainty in the
actual blanking time implemented in each cycle. The
maximum uncertainty is equal to one psmc_clk period.
24.2.9 OUTPUT WAVEFORM
GENERATION
The PSMC PWM output waveform is generated based
upon the different input events. However, there are
several other factors that affect the PWM waveshapes:
• Output Control
- Output Enable
- Output Polarity
• Waveform Mode Selection
• Dead-band Control
• Steering control
24.2.10 OUTPUT CONTROL
24.2.10.1 Output Pin Enable
Each PSMC PWM output pin has individual output
enable control.
When the PSMC output enable control is disabled, the
module asserts no control over the pin. In this state,
the pin can be used for general purpose I/O or other
associate peripheral use.
When the PSMC output enable is enabled, the active
PWM waveform is applied to the pin per the port prior-
ity selection.
PSMC output enable selections are made with the
PSMC Output Enable Control (PSMCxOEN) register
(Register 24-6).
24.2.10.2 Output Steering
PWM output will be presented only on pins for which
output steering is enabled. The PSMC has up to 6
PWM outputs. The PWM signal in some modes can be
steered to one or more of these outputs.
Steering differs from output enable in the following
manner: When the output is enabled but the PWM
steering to the corresponding output is not enabled,
then general purpose output to the pin is disabled and
the pin level will remain constantly in the inactive PWM
state. Output steering is controlled with the PSMCS
Steering Control 0 (PSMCxSTR0) register
(Register 24-30).
Steering operates only in the following modes:
• Single-phase
• Complementary Single-phase
• 3-phase 6-step PWM
24.2.10.3 Polarity Control
Each PSMC output has individual output polarity con-
trol. Polarity is set with the PSMC Polarity Control
(PSMCxPOL) register (Register 24-7).
PIC16(L)F1782/3
DS41579C-page 208 Preliminary 2011-2012 Microchip Technology Inc.
24.3 Modes of Operation
All modes of operation use the period, rising edge, and
falling edge events to generate the various PWM out-
put waveforms.
The 3-phase 6-step PWM mode makes special use of
the software controlled steering to generate the
required waveform.
Modes of operation are selected with the PSMC
Control (PSMCxCON) register (Register 24-1).
24.3.1 SINGLE-PHASE MODE
The single PWM is the most basic of all the wave-
shapes generated by the PSMC module. It consists of
a single output that uses all three events (rising edge,
falling edge and period events) to generate the wave-
form.
24.3.1.1 Mode Features
• No dead-band control available
• PWM can be steered to any combination of the
following PSMC outputs:
- PSMCxA
- PSMCxB
- PSMCxC
- PSMCxD
- PSMCxE
- PSMCxF
• Identical PWM waveform is presented to all pins
for which steering is enabled.
24.3.1.2 Waveform Generation
Rising Edge Event
• All outputs with PxSTR enabled are set to the
active state
Falling Edge Event
• All outputs with PxSTR enabled are set to the
inactive state
Code for setting up the PSMC generate the
single-phase waveform shown in Figure 24-4, and given
in Example 24-1.
EXAMPLE 24-1: SINGLE-PHASE SETUP
FIGURE 24-4: SINGLE PWM WAVEFORM - PSMCXSTR0 = 01H
; Single-phase PWM PSMC setup
; Fully synchronous operation
; Period = 10 us
; Duty cycle = 50%
BANKSEL PSMC1CON
MOVLW 0x02 ; set period
MOVWF PSMC1PRH
MOVLW 0x7F
MOVWF PSMC1PRL
MOVLW 0x01 ; set duty cycle
MOVWF PSMC1DCH
MOVLW 0x3F
MOVWF PSMC1DCL
CLRF PSMC1PHH ; no phase offset
CLRF PSMC1PHL
MOVLW 0x01 ; PSMC clock=64 MHz
MOVWF PSMC1CLK
; output on A, normal polarity
BSF PSMC1STR0,P1STRA
BCF PSMC1POL, P1POLA
BSF PSMC1OEN, P1OEA
; set time base as source for all events
BSF PSMC1PRS, P1PRST
BSF PSMC1PHS, P1PHST
BSF PSMC1DCS, P1DCST
; enable PSMC in Single-Phase Mode
; this also loads steering and time buffers
MOVLW B’11000000’
BANKSEL TRISC
BCF TRISC, 0 ; enable pin driver
1 2 3
PWM Period Number
Period Event
Rising Edge Event
Falling Edge Event
PSMCxA
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 209
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24.3.2 COMPLEMENTARY PWM
The complementary PWM uses the same events as
the single PWM, but two waveforms are generated
instead of only one.
The two waveforms are opposite in polarity to each
other. The two waveforms may also have dead-band
control as well.
24.3.2.1 Mode Features and Controls
• Dead-band control available
• PWM primary output can be steered to the
following pins:
- PSMCxA
- PSMCxC
- PSMCxE
• PWM complementary output can be steered to
the following pins:
- PSMCxB
- PSMCxD
- PSMCxE
24.3.2.2 Waveform Generation
Rising Edge Event
• Complementary output is set inactive
• Optional rising edge dead band is activated
• Primary output is set active
Falling Edge Event
• Primary output is set inactive
• Optional falling edge dead band is activated
• Complementary output is set active
Code for setting up the PSMC generate the
complementary single-phase waveform shown in
Figure 24-5, and given in Example 24-2.
EXAMPLE 24-2: COMPLEMENTARY
SINGLE-PHASE SETUP
FIGURE 24-5: COMPLEMENTARY PWM WAVEFORM – PSMCXSTR0 = 03H
; Complementary Single-phase PWM PSMC setup
; Fully synchronous operation
; Period = 10 us
; Duty cycle = 50%
; Deadband = 93.75 +15.6/-0 ns
BANKSEL PSMC1CON
MOVLW 0x02 ; set period
MOVWF PSMC1PRH
MOVLW 0x7F
MOVWF PSMC1PRL
MOVLW 0x01 ; set duty cycle
MOVWF PSMC1DCH
MOVLW 0x3F
MOVWF PSMC1DCL
CLRF PSMC1PHH ; no phase offset
CLRF PSMC1PHL
MOVLW 0x01 ; PSMC clock=64 MHz
MOVWF PSMC1CLK
; output on A, normal polarity
MOVLW B’00000011’ ; A and B enables
MOVWF PSMC1OEN
MOVWF PSMC1STR0
CLRF PSMC1POL
; set time base as source for all events
BSF PSMC1PRS, P1PRST
BSF PSMC1PHS, P1PHST
BSF PSMC1DCS, P1DCST
; set rising and falling dead-band times
MOVLW D’6’
MOVWF PSMC1DBR
MOVWF PSMC1DBF
; enable PSMC in Complementary Single Mode
; this also loads steering and time buffers
; and enables rising and falling deadbands
MOVLW B’11110001’
BANKSEL TRISC
BCF TRISC, 0 ; enable pin drivers
BCF TRISC, 1
1 2 3
Rising Edge Dead Band
Falling Edge Dead Band
Rising Edge Dead Band
Falling Edge Dead Band
Period Event
Rising Edge Event
Falling Edge Event
PSMCxA
PSMCxB
PWM Period Number
(Primary Output)
(Complementary Output)
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DS41579C-page 210 Preliminary 2011-2012 Microchip Technology Inc.
24.3.3 PUSH-PULL PWM
The push-pull PWM is used to drive transistor bridge
circuits. It uses at least two outputs and generates
PWM signals that alternate between the two outputs in
even and odd cycles.
Variations of the push-pull waveform include four out-
puts with two outputs being complementary or two sets
of two identical outputs. Refer to Sections 24.3.4
through 24.3.6 for the other Push-Pull modes.
24.3.3.1 Mode Features
• No dead-band control available
• No steering control available
• Output is on the following two pins only:
- PSMCxA
- PSMCxB
24.3.3.2 Waveform Generation
Odd numbered period rising edge event:
• PSMCxA is set active
Odd numbered period falling edge event:
• PSMCxA is set inactive
Even numbered period rising edge event:
• PSMCxB is set active
Even numbered period falling edge event:
• PSMCxB is set inactive
Code for setting up the PSMC generate the comple-
mentary single-phase waveform shown in Figure 24-6,
and given in Example 24-3.
EXAMPLE 24-3: PUSH-PULL SETUP
FIGURE 24-6: PUSH-PULL PWM WAVEFORM
Note: This is a subset of the 6-pin output of the
push-pull PWM output, which is why pin
functions are fixed in these positions, so
they are compatible with that mode. See
Section 24.3.6 “Push-Pull PWM with 4
Full-Bridge and Complementary Out-
puts”
; Push-Pull PWM PSMC setup
; Fully synchronous operation
; Period = 10 us
; Duty cycle = 50% (25% each phase)
BANKSEL PSMC1CON
MOVLW 0x02 ; set period
MOVWF PSMC1PRH
MOVLW 0x7F
MOVWF PSMC1PRL
MOVLW 0x01 ; set duty cycle
MOVWF PSMC1DCH
MOVLW 0x3F
MOVWF PSMC1DCL
CLRF PSMC1PHH ; no phase offset
CLRF PSMC1PHL
MOVLW 0x01 ; PSMC clock=64 MHz
MOVWF PSMC1CLK
; output on A and B, normal polarity
MOVLW B’00000011’
MOVWF PSMC1OEN
CLRF PSMC1POL
; set time base as source for all events
BSF PSMC1PRS, P1PRST
BSF PSMC1PHS, P1PHST
BSF PSMC1DCS, P1DCST
; enable PSMC in Push-Pull Mode
; this also loads steering and time buffers
MOVLW B’11000010’
BANKSEL TRISC
BCF TRISC, 0 ; enable pin drivers
BCF TRISC, 1
1 2 3
B Output
A Output A Output
PWM Period Number
Period Event
Rising Edge Event
Falling Edge Event
PSMCxA
PSMCxB
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 211
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24.3.4 PUSH-PULL PWM WITH
COMPLEMENTARY OUTPUTS
The complementary push-pull PWM is used to drive
transistor bridge circuits as well as synchronous
switches on the secondary side of the bridge. The
PWM waveform is output on four pins presented as
two pairs of two-output signals with a normal and com-
plementary output in each pair. Dead band can be
inserted between the normal and complementary out-
puts at the transition times.
24.3.4.1 Mode Features
• Dead-band control is available
• No steering control available
• Primary PWM output is only on:
- PSMCxA
- PSMCxE
• Complementary PWM output is only on:
- PSMCxB
- PSMCxF
24.3.4.2 Waveform Generation
Push-Pull waveforms generate alternating outputs on
the output pairs. Therefore, there are two sets of rising
edge events and two sets of falling edge events
Odd numbered period rising edge event:
• PSMCxE is set inactive
• Dead-band rising is activated (if enabled)
• PSMCxA is set active
Odd numbered period falling edge odd event:
• PSMCxA is set inactive
• Dead-band falling is activated (if enabled)
• PSMCxE is set active
Even numbered period rising edge event:
• PSMCxF is set inactive
• Dead-band rising is activated (if enabled)
• PSMCxB is set active
Even numbered period falling edge event:
• PSMCxB is set inactive
• Dead-band falling is activated (if enabled)
• PSMCxF is set active
FIGURE 24-7: PUSH-PULL WITH COMPLEMENTARY OUTPUTS PWM WAVEFORM
Note: This is a subset of the 6-pin output of the
push-pull PWM output, which is why pin
functions are fixed in these positions, so
they are compatible with that mode. See
Section 24.3.6 “Push-Pull PWM with 4
Full-Bridge and Complementary Out-
puts”.
1 2 3
Falling Edge Dead Band
Rising Edge Dead Band
Falling Edge Dead Band
Falling Edge Dead Band
Rising Edge Dead BandRising Edge Dead Band
PWM Period Number
Period Event
Rising Edge Event
Falling Edge Event
PSMCxA
PSMCxB
PSMCxE
PSMCxF
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DS41579C-page 212 Preliminary 2011-2012 Microchip Technology Inc.
24.3.5 PUSH-PULL PWM WITH 4
FULL-BRIDGE OUTPUTS
The full-bridge push-pull PWM is used to drive transis-
tor bridge circuits as well as synchronous switches on
the secondary side of the bridge.
24.3.5.1 Mode Features
• No Dead-band control
• No Steering control available
• PWM is output on the following four pins only:
- PSMCxA
- PSMCxB
- PSMCxC
- PSMCxD
24.3.5.2 Waveform generation
Push-pull waveforms generate alternating outputs on
the output pairs. Therefore, there are two sets of rising
edge events and two sets of falling edge events.
Odd numbered period rising edge event:
• PSMCxOUT0 and PSMCxOUT2 is set active
Odd numbered period falling edge event:
• PSMCxOUT0 and PSMCxOUT2 is set inactive
Even numbered period rising edge event:
• PSMCxOUT1 and PSMCxOUT3 is set active
Even numbered period falling edge event:
• PSMCxOUT1 and PSMCxOUT3 is set inactive
FIGURE 24-8: PUSH-PULL PWM WITH 4 FULL-BRIDGE OUTPUTS
Note: PSMCxA and PSMCxC are identical
waveforms, and PSMCxB and PSMCxD are
identical waveforms.
Note: This is a subset of the 6-pin output of the
push-pull PWM output, which is why pin
functions are fixed in these positions, so
they are compatible with that mode. See
Section 24.3.6 “Push-Pull PWM with 4
Full-Bridge and Complementary Out-
puts”.
1 2 3
PWM Period Number
Period Event
Rising Edge Event
Falling Edge Event
PSMCxA
PSMCxB
PSMCxC
PSMCxD
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 213
PIC16(L)F1782/3
24.3.6 PUSH-PULL PWM WITH 4
FULL-BRIDGE AND
COMPLEMENTARY OUTPUTS
The push-pull PWM is used to drive transistor bridge
circuits as well as synchronous switches on the sec-
ondary side of the bridge. It uses six outputs and gen-
erates PWM signals with dead band that alternate
between the six outputs in even and odd cycles.
24.3.6.1 Mode Features and Controls
• Dead-band control is available
• No steering control available
• Primary PWM is output on the following four pins:
- PSMCxA
- PSMCxB
- PSMCxC
- PSMCxD
• Complementary PWM is output on the following
two pins:
- PSMCxE
- PSMCxF
24.3.6.2 Waveform Generation
Push-pull waveforms generate alternating outputs on
two sets of pin. Therefore, there are two sets of rising
edge events and two sets of falling edge events
Odd numbered period rising edge event:
• PSMCxE is set inactive
• Dead-band rising is activated (if enabled)
• PSMCxA and PSMCxC are set active
Odd numbered period falling edge event:
• PSMCxA and PSMCxC are set inactive
• Dead-band falling is activated (if enabled)
• PSMCxE is set active
Even numbered period rising edge event:
• PSMCxF is set inactive
• Dead-band rising is activated (if enabled)
• PSMCxB and PSMCxD are set active
Even numbered period falling edge event:
• PSMCxB and PSMCxOUT3 are set inactive
• Dead-band falling is activated (if enabled)
• PSMCxF is set active
Note: PSMCxA and PSMCxC are identical
waveforms, and PSMCxB and PSMCxD are
identical waveforms.
PIC16(L)F1782/3
DS41579C-page 214 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 24-9: PUSH-PULL 4 FULL-BRIDGE AND COMPLEMENTARY PWM
24.3.7 PULSE-SKIPPING PWM
The pulse-skipping PWM is used to generate a series
of fixed-length pulses that can be triggered at each
period event. A rising edge event will be generated
when any enabled asynchronous rising edge input is
active when the period event occurs, otherwise no
event will be generated.
The rising edge event occurs based upon the value in
the PSMCxPH register pair.
The falling edge event always occurs according to the
enabled event inputs without qualification between any
two inputs.
24.3.7.1 Mode Features
• No dead-band control available
• No steering control available
• PWM is output to only one pin:
- PSMCxA
24.3.7.2 Waveform Generation
Rising Edge Event
If any enabled asynchronous rising edge event = 1
when there is a period event, then upon the next syn-
chronous rising edge event:
• PSMCxA is set active
Falling Edge Event
• PSMCxA is set inactive
1 2 3
Falling Edge Dead Band
Rising Edge Dead Band
Falling Edge Dead BandFalling Edge Dead Band
Rising Edge Dead BandRising Edge Dead Band
PWM Period Number
Period Event
Rising Edge Event
Falling Edge Event
PSMCxA
PSMCxB
PSMCxE
PSMCxF
PSMCxC
PSMCxD
Note: To use this mode, an external source must
be used for the determination of whether or
not to generate the set pulse. If the phase
time base is used, it will either always gener-
ate a pulse or never generate a pulse based
on the PSMCxPH value.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 215
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FIGURE 24-10: PULSE-SKIPPING PWM WAVEFORM
1 2 3 4 5 6 7 8 9 10 11 12
PWM Period Number
period_event
Asynchronous
Synchronous
Falling Edge Event
PSMCxA
Rising Edge Event
Rising Edge Event
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DS41579C-page 216 Preliminary 2011-2012 Microchip Technology Inc.
24.3.8 PULSE-SKIPPING PWM WITH
COMPLEMENTARY OUTPUTS
The pulse-skipping PWM is used to generate a series
of fixed-length pulses that may or not be triggered at
each period event. If any of the sources enabled to
generate a rising edge event are high when a period
event occurs, a pulse will be generated. If the rising
edge sources are low at the period event, no pulse will
be generated.
The rising edge occurs based upon the value in the
PSMCxPH register pair.
The falling edge event always occurs according to the
enabled event inputs without qualification between any
two inputs.
24.3.8.1 Mode Features
• Dead-band control is available
• No steering control available
• Primary PWM is output on only PSMCxA.
• Complementary PWM is output on only PSMCxB.
24.3.8.2 Waveform Generation
Rising Edge Event
If any enabled asynchronous rising edge event = 1
when there is a period event, then upon the next syn-
chronous rising edge event:
• Complementary output is set inactive
• Dead-band rising is activated (if enabled)
• Primary output is set active
Falling Edge Event
• Primary output is set inactive
• Dead-band falling is activated (if enabled)
• Complementary output is set active
FIGURE 24-11: PULSE SKIPPING WITH COMPLEMENTARY OUTPUT PWM WAVEFORM
Note: To use this mode, an external source must
be used for the determination of whether or
not to generate the set pulse. If the phase
time base is used, it will either always gener-
ate a pulse or never generate a pulse based
on the PSMCxPH value.
12345678910
Falling Edge Dead Band
Rising Edge Dead Band
PWM Period Number
Period Event
Asynchronous
Synchronous
Rising Edge Event
Rising Edge Event
PSMCxA
PSMCxB
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 217
PIC16(L)F1782/3
24.3.9 ECCP COMPATIBLE FULL-BRIDGE
PWM
This mode of operation is designed to match the
Full-Bridge mode from the ECCP module. It is called
ECCP compatible as the term “full-bridge” alone has
different connotations in regards to the output wave-
forms.
Full-Bridge Compatible mode uses the same wave-
form events as the single PWM mode to generate the
output waveforms.
There are both Forward and Reverse modes available
for this operation, again to match the ECCP implemen-
tation. Direction is selected with the mode control bits.
24.3.9.1 Mode Features
• Dead-band control available on direction switch
- Changing from forward to reverse uses the
falling edge dead-band counters.
- Changing from reverse to forward uses the
rising edge dead-band counters.
• No steering control available
• PWM is output on the following four pins only:
- PSMCxA
- PSMCxB
- PSMCxC
- PSMCxD
24.3.9.2 Waveform Generation - Forward
In this mode of operation, three of the four pins are
static. PSMCxA is the only output that changes based
on rising edge and falling edge events.
Static Signal Assignment
• Outputs set to active state
- PSMCxD
• Outputs set to inactive state
- PSMCxB
- PSMCxC
Rising Edge Event
• PSMCxA is set active
Falling Edge Event
• PSMCxA is set inactive
24.3.9.3 Waveform Generation - Reverse
In this mode of operation, three of the four pins are
static. Only PSMCxB toggles based on rising edge
and falling edge events.
Static Signal Assignment
• Outputs set to active state
- PSMCxC
• Outputs set to inactive state
- PSMCxA
- PSMCxD
Rising Edge Event
• PSMCxB is set active
Falling Edge Event
• PSMCxB is set inactive
FIGURE 24-12: ECCP COMPATIBLE FULL-BRIDGE PWM WAVEFORM - PSMCXSTR0 = 0FH
12345678910 11 12
Rising Edge Dead Band
Falling Edge Dead Band
Forward mode operation
PWM Period Number
Period Event
Falling Edge Event
Reverse mode operation
PSMCxA
PSMCxB
PSMCxC
PSMCxD
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DS41579C-page 218 Preliminary 2011-2012 Microchip Technology Inc.
24.3.10 VARIABLE FREQUENCY - FIXED
DUTY CYCLE PWM
This mode of operation is quite different from all of the
other modes. It uses only the period event for wave-
form generation. At each period event, the PWM out-
put is toggled.
The rising edge and falling edge events are unused in
this mode.
24.3.10.1 Mode Features
• No dead-band control available
• No steering control available
• Fractional Frequency Adjust
- Fine period adjustments are made with the
PSMC Fractional Frequency Adjust
(PSMCxFFA) register (Register 24-27)
• PWM is output on the following pin only:
- PSMCxA
24.3.10.2 Waveform Generation
Period Event
• Output of PSMCxA is toggled
• FFA counter is incremented by the 4-bit value in
PSMCxF FA
FIGURE 24-13: VARIABLE FREQUENCY – FIXED DUTY CYCLE PWM WAVEFORM
1 2 3 4 5 6 7 8 9 10
Unused in this mode
Unused in this mode
PWM Period Number
period_event
Rising Edge Event
Falling Edge Event
PSMCxA
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 219
PIC16(L)F1782/3
24.3.11 VARIABLE FREQUENCY - FIXED
DUTY CYCLE PWM WITH
COMPLEMENTARY OUTPUTS
This mode is the same as the single output Fixed Duty
Cycle mode except a complementary output with
dead-band control is generated.
The rising edge and falling edge events are unused in
this mode. Therefore, a different triggering mechanism
is required for the dead-band counters.
A period events that generate a rising edge on
PSMCxA use the rising edge dead-band counters.
A period events that generate a falling edge on
PSMCxA use the falling edge dead-band counters.
24.3.11.1 Mode Features
• Dead-band control is available
• No steering control available
• Fractional Frequency Adjust
- Fine period adjustments are made with the
PSMC Fractional Frequency Adjust
(PSMCxFFA) register (Register 24-27)
• Primary PWM is output to the following pins:
- PSMCxA
- PSMCxC
- PSMCxE
• Complementary PWM is output to the following
pins:
- PSMCxB
- PSMCxD
- PSMCxF
24.3.11.2 Waveform Generation
Period Event
When output is going inactive to active:
• Complementary output is set inactive
• FFA counter is incremented by the 4-bit value in
PSMCFFA register.
• Dead-band rising is activated (if enabled)
• Primary output is set active
When output is going active to inactive:
• Primary output is set inactive
• FFA counter is incremented by the 4-bit value in
PSMCFFA register
• Dead-band falling is activated (if enabled)
• Complementary output is set active
FIGURE 24-14: VARIABLE FREQUENCY – FIXED DUTY CYCLE PWM WITH COMPLEMENTARY
OUTPUTS WAVEFORM
12345678910
Unused in this mode
Unused in this mode
Falling Edge Dead Band
Rising Edge Dead Band
PWM Period Number
period_event
Rising Edge Event
Falling Edge Event
PSMCxA
PSMCxB
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DS41579C-page 220 Preliminary 2011-2012 Microchip Technology Inc.
24.3.12 3-PHASE PWM
The 3-Phase mode of operation is used in 3-phase
power supply and motor drive applications configured
as three half-bridges. A half-bridge configuration con-
sists of two power driver devices in series, between
the positive power rail (high side) and negative power
rail (low side). The three outputs come from the junc-
tions between the two drivers in each half-bridge.
When the steering control selects a phase drive,
power flows from the positive rail through a high-side
power device to the load and back to the power supply
through a low-side power device.
In this mode of operation, all six PSMC outputs are
used, but only two are active at a time.
The two active outputs consist of a high-side driver
and low-side driver output.
24.3.12.1 Mode Features
• No dead-band control is available
• PWM can be steered to the following six pairs:
- PSMCxA and PSMCxD
- PSMCxA and PSMCxF
- PSMCxC and PSMCxF
- PSMCxC and PSMCxB
- PSMCxE and PSMCxB
- PSMCxE and PSMCxD
24.3.12.2 Waveform Generation
3-phase steering has a more complex waveform gen-
eration scheme than the other modes. There are sev-
eral factors which go into what waveforms are created.
The PSMC outputs are grouped into 3 sets of drivers:
one for each phase. Each phase has two associated
PWM outputs: one for the high-side drive and one for
the low-side drive.
High Side drives are indicated by 1H, 2H and 3H.
Low Side drives are indicated by 1L, 2L, 3L.
Phase grouping is mapped as shown in Table 24-1.
There are six possible phase drive combinations.
Each phase drive combination activates two of the six
outputs and deactivates the other four. Phase drive is
selected with the steering control as shown in
Table 24-2.
TABLE 24-1: PHASE GROUPING
TABLE 24-2: 3-PHASE STEERING CONTROL
High/Low Side Modulation Enable
It is also possible to enable the PWM output on the low
side or high side drive independently using the
PxLSMEN and PXHSMEN bits of the PSMC Steering
Control 1 (PSMCxSTR1) register (Register 24-31).
When the PxHSMEN bit is set, the active-high side
output listed in Table 24-2 is modulated using the
normal rising edge and falling edge events.
When the PxLSMEN bit is set, the active-low side
output listed in Table 24-2 is modulated using the
normal rising edge and falling edge events.
When both the PxHSMEN and PxLSMEN bits are
cleared, the active outputs listed in Table 24-2 go
immediately to the rising edge event states and do not
change.
Rising Edge Event
• Active outputs are set to their active states
Falling Edge Event
• Active outputs are set to their inactive state
PSMC grouping
PSMCxA 1H
PSMCxB 1L
PSMCxC 2H
PSMCxD 2L
PSMCxE 3H
PSMCxF 3L
PSMCxSTR0 Value(1)
PSMC outputs 00h 01h 02h 04h 08h 10h 20h
PSMCxA 1H inactive active active inactive inactive inactive inactive
PSMCxB 1L inactive inactive inactive inactive active active inactive
PSMCxC 2H inactive inactive inactive active active inactive inactive
PSMCxD 2L inactive active inactive inactive inactive inactive active
PSMCxE 3H inactive inactive inactive inactive inactive active active
PSMCxF 3L inactive inactive active active inactive inactive inactive
Note 1: Steering for any value other than those shown will default to the output combination of the Least Significant
steering bit that is set.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 221
PIC16(L)F1782/3
FIGURE 24-15: 3-PHASE PWM STEERING WAVEFORM (PXHSMEN = 0 AND PXLSMEN = 1)
1 2 3 4 5 6
3-Phase State
Period Event
Rising Edge Event
Falling Edge Event
PSMCxA (1H)
PSMCxB (1L)
PSMCxC (2H)
PSMCxD (2L)
PSMCxE (3H)
PSMCxF (3L)
PSMCxSTR0 01h 02h 04h 08h 10h 20h
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DS41579C-page 222 Preliminary 2011-2012 Microchip Technology Inc.
24.4 Dead-Band Control
The dead-band control provides non-overlapping
PWM signals to prevent shoot-through current in
series connected power switches. Dead-band control
is available only in modes with complementary drive
and when changing direction in the ECCP compatible
Full-Bridge modes.
The module contains independent 8-bit dead-band
counters for rising edge and falling edge dead-band
control.
24.4.1 DEAD-BAND TYPES
There are two separate dead-band generators avail-
able, one for rising edge events and the other for fall-
ing edge events.
24.4.1.1 Rising Edge Dead Band
Rising edge dead-band control is used to delay the
turn-on of the primary switch driver from when the
complementary switch driver is turned off.
Rising edge dead band is initiated with the rising edge
event.
Rising edge dead-band time is adjusted with the
PSMC Rising Edge Dead-Band Time (PSMCxDBR)
register (Register 24-25).
If the PSMCxDBR register value is changed when the
PSMC is enabled, the new value does not take effect
until the first period event after the PSMCxLD bit is set.
24.4.1.2 Falling Edge Dead Band
Falling edge dead-band control is used to delay the
turn-on of the complementary switch driver from when
the primary switch driver is turned off.
Falling edge dead band is initiated with the falling
edge event.
Falling edge dead-band time is adjusted with the
PSMC Falling Edge Dead-Band Time (PSMCxDBF)
register (Register 24-26).
If the PSMCxDBF register value is changed when the
PSMC is enabled, the new value does not take effect
until the first period event after the PSMCxLD bit is set.
24.4.2 DEAD-BAND ENABLE
When a mode is selected that may use dead-band
control, dead-band timing is enabled by setting one of
the enable bits in the PSMC Control (PSMCxCON)
register (Register 24-1).
Rising edge dead band is enabled with the PxDBRE
bit.
Rising edge dead band is enabled with the PxDBFE
bit.
Enable changes take effect immediately.
24.4.3 DEAD-BAND CLOCK SOURCE
The dead-band counters are incremented on every
rising edge of the psmc_clk signal.
24.4.4 DEAD-BAND UNCERTAINTY
When the rising and falling edge events that trigger the
dead-band counters come from asynchronous inputs,
there will be uncertainty in the actual dead-band time of
each cycle. The maximum uncertainty is equal to one
psmc_clk period. The one clock of uncertainty may still
be introduced, even when the dead-band count time is
cleared to zero.
24.4.5 DEAD-BAND OVERLAP
There are two cases of dead-band overlap and each is
treated differently due to system requirements.
24.4.5.1 Rising to Falling Overlap
In this case, the falling edge event occurs while the ris-
ing edge dead-band counter is still counting. The fol-
lowing sequence occurs:
1. Dead-band rising count is terminated.
2. Dead-band falling count is initiated.
3. Primary output is suppressed.
24.4.5.2 Falling to Rising Overlap
In this case, the rising edge event occurs while the fall-
ing edge dead-band counter is still counting. The fol-
lowing sequence occurs:
1. Dead-band falling count is terminated.
2. Dead-band rising count is initiated.
3. Complementary output is suppressed.
24.4.5.3 Rising Edge-to-Rising Edge or
Falling Edge-to-Falling Edge
In cases where one of the two dead-band counters is
set for a short period, or disabled all together, it is
possible to get rising-to-rising or falling-to-falling
overlap. When this is the case, the following sequence
occurs:
1. Dead-band count is terminated.
2. Dead-band count is restarted.
3. Output waveform control freezes in the present
state.
4. Restarted dead-band count completes.
5. Output control resumes normally.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 223
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24.5 Output Steering
Output Steering allows for PWM signals generated by
the PSMC module to be placed on different pins under
software control. Synchronized steering will hold steer-
ing changes until the first period event after the
PSMCxLD bit is set. Unsynchronized steering
changes will take place immediately.
Output steering is available in the following modes:
• 3-phase PWM
• Single PWM
• Complementary PWM
24.5.1 3-PHASE STEERING
3-phase steering is available in the 3-Phase Modulation
mode only. For more details on 3-phase steering refer to
Section 24.3.12 “3-Phase PWM”.
24.5.2 SINGLE PWM STEERING
In Single PWM Steering mode, the single PWM signal
can be routed to any combination of the PSMC output
pins. Examples of unsynchronized single PWM steer-
ing are shown in Figure 24-16.
FIGURE 24-16: SINGLE PWM STEERING WAVEFORM (NO SYNCHRONIZATION)
Base_PWM_signal
PxSTRA
PSMCxA
PxSTRB
PSMCxB
PxSTRC
PSMCxC
PxSTRD
PSMCxD
PxSTRE
PSMCxE
PxSTRF
PSMCxF
With synchronization disabled, it is possible to get glitches on the PWM outputs.
PIC16(L)F1782/3
DS41579C-page 224 Preliminary 2011-2012 Microchip Technology Inc.
24.5.3 COMPLEMENTARY PWM
STEERING
In Complementary PWM Steering mode, the primary
PWM signal (non-complementary) and complementary
signal can be steered according to their respective type.
Primary PWM signal can be steered to any of the
following outputs:
• PSMCxA
• PSMCxC
• PSMCxE
The complementary PWM signal can be steered to any
of the following outputs:
• PSMCxB
• PSMCxD
• PSMCxE
Examples of unsynchronized complementary steering
are shown in Figure 24-17.
FIGURE 24-17: COMPLEMENTARY PWM STEERING WAVEFORM (NO SYNCHRONIZATION,
ZERO DEAD-BAND TIME)
Arrows indicate where a change in the steering bit automatically
Base_PWM_signal
PxSTRA
PxSTRB
PxSTRC
PxSTRD
PxSTRE
PxSTRF
forces a change in the corresponding PSMC output.
PSMCxA
PSMCxB
PSMCxC
PSMCxD
PSMCxE
PSMCxF
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 225
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24.5.4 SYNCHRONIZED PWM STEERING
In Single, Complementary and 3-phase PWM modes,
it is possible to synchronize changes to steering
selections with the period event. This is so that PWM
outputs do not change in the middle of a cycle and
therefore, disrupt operation of the application.
Steering synchronization is enabled by setting the
PxSSYNC bit of the PSMC Steering Control 1
(PSMCxSTR1) register (Register 24-31).
When synchronized steering is enabled while the
PSMC module is enabled, steering changes do not
take effect until the first period event after the
PSMCxLD bit is set.
Examples of synchronized steering are shown in
Figure 24-18.
24.5.5 INITIALIZING SYNCHRONIZED
STEERING
If synchronized steering is to be used, special care
should be taken to initialize the PSMC Steering
Control 0 (PSMCxSTR0) register (Register 24-30) in a
safe configuration before setting either the PSMCxEN
or PSMCxLD bits. When either of those bits are set,
the PSMCxSTR0 value at that time is loaded into the
synchronized steering output buffer. The buffer load
occurs even if the PxSSYNC bit is low. When the
PxSSYNC bit is set, the outputs will immediately go to
the drive states in the preloaded buffer.
FIGURE 24-18: PWM STEERING WITH SYNCHRONIZATION WAVEFORM
1234567
PWM Signal
PxSTRA
Synchronized PxSTRA
PSMCxA
Period Number
PxSTRB
Synchronized PxSTRB
PSMCxB
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24.6 PSMC Modulation (Burst Mode)
PSMC Modulation is a method to stop/start PWM
operation of the PSMC without having to disable the
module. It also allows other modules to control the
operational period of the PSMC. This is also referred
to as Burst mode.
This is a method to implement PWM dimming.
24.6.1 MODULATION ENABLE
The modulation function is enabled by setting the
PxMDLEN bit of PSMC Modulation Control
(PSMCxMDL) register (Register 24-2).
When modulation is enabled, the modulation source
controls when the PWM signals are active and
inactive.
When modulation is disabled, the PWM signals
operate continuously, regardless of the selected
modulation source.
24.6.2 MODULATION SOURCES
There are multiple sources that can be used for
modulating the PSMC. However, unlike the PSMC
input sources, only one modulation source can be
selected at a time. Modulation sources include:
• PSMCxIN Pin
• Any CCP output
• Any Comparator output
• PxMDLBIT of the PSMCxMDL register
24.6.2.1 PxMDLBIT Bit
The PxMDLBIT bit of the PSMC Modulation Control
(PSMCxMDL) register (Register 24-2) allows for
software modulation control without having to
enable/disable other module functions.
24.6.3 MODULATION EFFECT ON PWM
SIGNALS
When modulation starts, the PSMC begins operation
on a new period, just as if it had rolled over from one
period to another during continuous operation.
When modulation stops, its operation depends on the
type of waveform being generated.
In Operation modes other than Fixed Duty Cycle, the
PSMC completes its current PWM period and then
freezes the module. The PSMC output pins are forced
into the default inactive state ready for use when
modulation starts.
In Fixed Duty Cycle mode operation, the PSMC
continues to operate until the period event changes
the PWM to its inactive state, at which point the PSMC
module is frozen. The PSMC output pins are forced
into the default inactive state ready for use when
modulation starts.
FIGURE 24-19: PSMC MODULATION WAVEFORM
1 2 3 4 5 6 7 1 1 2 3 4 5
PWM PWM PWM OffPWM OffPWM OffPWM Off
Modulation Input
PWM Period Off
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 227
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24.7 Auto-Shutdown
Auto-shutdown is a method to immediately override
the PSMC output levels with specific overrides that
allow for safe shutdown of the application.
Auto-shutdown includes a mechanism to allow the
application to restart under different conditions.
Auto-shutdown is enabled with the PxASDEN bit of the
PSMC Auto-shutdown Control (PSMCxASDC) register
(Register 24-14). All auto-shutdown features are
enabled when PxASDEN is set and disabled when
cleared.
24.7.1 SHUTDOWN
There are two ways to generate a shutdown event:
• Manual
• External Input
24.7.1.1 Manual Override
The auto-shutdown control register can be used to
manually override the pin functions. Setting the PxASE
bit of the PSMC Auto-shutdown Control (PSMCxASDC)
register (Register 24-14) generates a software
shut-down event.
The auto-shutdown override will persist as long as
PxASE remains set.
24.7.1.2 External Input Source
Any of the given sources that are available for event
generation are also available for system shut-down.
This is so that external circuitry can monitor and force
a shutdown without any software overhead.
Auto-shutdown sources are selected with the PSMC
Auto-shutdown Source (PSMCxASDS) register
(Register 24-16).
When any of the selected external auto-shutdown
sources go high, the PxASE bit is set and an
auto-shutdown interrupt is generated.
24.7.2 PIN OVERRIDE LEVELS
The logic levels driven to the output pins during an
auto-shutdown event are determined by the PSMC
Auto-shutdown Output Level (PSMCxASDL) register
(Register 24-15).
24.7.2.1 PIN Override Enable
Setting the PxASDOV bit of the PSMC Auto-shutdown
Control (PSMCxASDC) register (Register 24-14) will
also force the override levels onto the pins, exactly like
what happens when the auto-shutdown is used.
However, whereas setting PxASE causes an
auto-shutdown interrupt, setting PxASDOV does not
generate an interrupt.
24.7.3 RESTART FROM
AUTO-SHUTDOWN
After an auto-shutdown event has occurred, there are
two ways for the module to resume operation:
• Manual restart
• Automatic restart
The restart method is selected with the PxARSEN bit of
the PSMC Auto-shutdown Control (PSMCxASDC)
register (Register 24-14).
24.7.3.1 Manual Restart
When PxARSEN is cleared, and once the PxASDE bit
is set, it will remain set until cleared by software.
The PSMC will restart on the period event after
PxASDE bit is cleared in software.
24.7.3.2 Auto-Restart
When PxARSEN is set, the PxASDE bit will clear
automatically when the source causing the Reset and
no longer asserts the shut-down condition.
The PSMC will restart on the next period event after
the auto-shutdown condition is removed.
Examples of manual and automatic restart are shown
in Figure 24-20.
Note: The external shutdown sources are level
sensitive, not edge sensitive. The shutdown
condition will persist as long as the circuit is
driving the appropriate logic level.
Note: Whether manual or auto-restart is selected,
the PxASDE bit cannot be cleared in
software when the auto-shutdown condition
is still present.
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DS41579C-page 228 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 24-20: AUTO-SHUTDOWN AND RESTART WAVEFORM
1 2 3 4 5
Next Period Event
Next Period Event
Cleared
Cleared
Normal Normal Auto- Normal
Manual Restart Auto-restart
cleared cleared
Base PWM signal
PxARSEN
Auto-Shutdown Source
PSMCx Auto-shutdown int flag bit
PxASE
PSMCxA
PSMCxB
Operating State
in software
in software
in hardware
in software
Output Output Output
shutdown
Auto-
shutdown
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 229
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24.8 PSMC Synchronization
It is possible to synchronize the periods of two or more
PSMC modules together, provided that both modules
are on the same device.
Synchronization is achieved by sending a sync signal
from the master PSMC module to the desired slave
modules. This sync signal generates a period event in
each slave module, thereby aligning all slaves with the
master. This is useful when an application requires dif-
ferent PWM signal generation from each module but
the waveforms must be consistent within a PWM
period.
24.8.1 SYNCHRONIZATION SOURCES
The synchronization source can be any PSMC module
on the same device. For example, in a device with two
PSMC modules, the possible sources for each device
is as shown below:
• Sources for PSMC1
- PSMC2
• Sources for PSMC2
- PSMC1
FIGURE 24-21: PSMC SYNCHRONIZATION - SYNC OUTPUT TO PIN
24.8.1.1 PSMC Internal Connections
The sync signal from the master PSMC module is
essentially that module’s period event trigger. The
slave PSMC modules receive and process the sync
signal as an additional period event input.
Enabling a module as a slave recipient is done with
the PxSYNC bits of the PSMC Synchronization
Control 1 (PSMC1SYNC) register (Register 24-3) and
the PSMC Synchronization Control 2 (PSMC2SYNC)
register (Register 24-4).
24.8.1.2 Synchronization Skid
At high frequencies (i.e., 64 MHz clock), it is possible
for slave modules to lag synchronization by a maximum
of one clock period.
1 2 3
Caution must be used so that glitches on the period event are not missed
psmc_clk
Period Event
Rising Edge Event
Falling Edge Event
PSMCx Output
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24.9 Fractional Frequency Adjust (FFA)
FFA is a method by which PWM resolution can be
improved on 50% fixed duty cycle signals. Higher
resolution is achieved by altering the PWM period by a
single count for calculated intervals. This increased
resolution is based upon the PWM frequency
averaged over a large number of PWM periods. For
example, if the period event time is increased by one
psmc_clk period (TPSMC_CLK) every N events, then
the effective resolution of the average event period is
TPSMC_CLK/N.
When active, after every period event the FFA
hardware adds the PSMCxFFA value with the
previously accumulated result. Each time the addition
causes an overflow, the period event time is increased
by one. Refer to Figure 24-22.
FIGURE 24-22: FFA BLOCK DIAGRAM.
The FFA function is only available when using one of
the two Fixed Duty Cycle modes of operation. In fixed
duty cycle operation each PWM period is comprised of
two period events. That is why the PWM periods in
Table 24-3 example calculations are multiplied by 2 as
opposed to the normal period calculations for normal
mode operation.
The extra resolution gained by the FFA is based upon
the number of bits in the FFA register and the
psmc_clk frequency. The parameters of interest are:
•T
PWM – this is the lower bound of the PWM period
that will be adjusted
•T
PWM+1 – this is the upper bound of the PWM
period that will be adjusted. This is used to help
determine the step size for each increment of the
FFA register
•T
RESOLUTION – each increment of the FFA regis-
ter will add this amount of period to average PWM
frequency
TABLE 24-3: FRACTIONAL FREQUENCY
ADJUST CALCULATIONS
PSMCxPR<15:0>
PSMCxTMR<15:0>
Comparator =
Period Event
PSMCxFFA<3:0>
Accumulator<3:0> carry
psmc_clk
Parameter Value
FPSMC_CLK 64 MHz
TPSMC_CLK 15.625 ns
PSMCxPR<15:0> 00FFh = 255
TPWM = (PSMCxPR<15:0>+1)*2*TPSMC_CLK
= 256*2*15.625ns
= 8 us
FPWM 125 kHz
TPWM+1 = (PSMCxPR<15:0>+2)*2*TPSMC_CLK
= 257*2*15.625ns
= 8.03125 us
FPWM+1 = 124.513 kHz
TRESOLUTION = (TPWM+1-TPWM)/2FFA-Bits
= (8.03125us - 8.0 us)/16
= 0.03125us/16
~ 1.95 ns
FRESOLUTION (FPWM+1-FPWM)/2FFA-Bits
~ -30.4 Hz
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 231
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TABLE 24-4: SAMPLE FFA OUTPUT PERIODS/FREQUENCIES
FFA number Output Frequency (kHz) Step Size (Hz)
0125.000 0
1 124.970 -30.4
2 124.939 -60.8
3 124.909 -91.2
4 124.878 -121.6
5 124.848 -152.0
6 124.818 -182.4
7 124.787 -212.8
8 124.757 -243.2
9 124.726 -273.6
10 124.696 -304.0
11 124.666 -334.4
12 124.635 -364.8
13 124.605 -395.2
14 124.574 -425.6
15 124.544 -456.0
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DS41579C-page 232 Preliminary 2011-2012 Microchip Technology Inc.
24.10 Register Updates
There are 10 double-buffered registers that can be
updated “on the fly”. However, due to the
asynchronous nature of the potential updates, a
special hardware system is used for the updates.
There are two operating cases for the PSMC:
• module is enabled
• module is disabled
24.10.1 DOUBLE BUFFERED REGISTERS
The double-buffered registers that are affected by the
special hardware update system are:
• PSMCxPRL
• PSMCxPRH
• PSMCxDCL
• PSMCxDCH
• PSMCxPHL
• PSMCxPHH
• PSMCxDBR
• PSMCxDBF
• PSMCxBLKR
• PSMCxBLKF
• PSMCxSTR0 (when the PxSSYNC bit is set)
24.10.2 MODULE DISABLED UPDATES
When the PSMC module is disabled (PSMCxEN = 0),
any write to one of the buffered registers will also write
directly to the buffer. This means that all buffers are
loaded and ready for use when the module is enabled.
24.10.3 MODULE ENABLED UPDATES
When the PSMC module is enabled (PSMCxEN = 1),
the PSMCxLD bit of the PSMC Control (PSMCxCON)
register (Register 24-1) must be used.
When the PSMCxLD bit is set, the transfer from the
register to the buffer occurs on the next period event.
The PSMCxLD bit is automatically cleared by hardware
after the transfer to the buffers is complete.
The reason that the PSMCxLD bit is required is that
depending on the customer application and operation
conditions, all 10 registers may not be updated in one
PSMC period. If the buffers are loaded at different
times (i.e., DCL gets updated, but DCH does not OR
DCL and DCL are updated by PRH and PRL are not),
then unintended operation may occur.
The sequence for loading the buffer registers when the
PSMC module is enabled is as follows:
1. Software updates all registers.
2. Software sets the PSMCxLD bit.
3. Hardware updates all buffers on the next period
event.
4. Hardware clears PSMCxLD bit.
24.11 Operation During Sleep
The PSMC continues to operate in sleep with the
following clock sources:
• Internal 64 MHz
• External clock
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 233
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24.12 Register Definitions: PSMC Control
REGISTER 24-1: PSMCxCON – PSMC CONTROL REGISTER
R/W-0/0 R/W/HC-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PSMCxEN PSMCxLD PxDBFE PxDBRE PxMODE<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 PSMCxEN: PSMC Module Enable bit
1 = PSMCx module is enabled
0 = PSMCx module is disabled
bit 6 PSMCxLD: PSMC Load Buffer Enable bit
1 = PSMCx registers are ready to be updated with the appropriate register contents
0 = PSMCx buffer update complete
bit 5 PxDBFE: PSMC Falling Edge Dead-Band Enable bit
1 = PSMCx falling edge dead band enabled
0 = PSMCx falling edge dead band disabled
bit 4 PxDBRE: PSMC Rising Edge Dead-Band Enable bit
1 = PSMCx rising edge dead band enabled
0 = PSMCx rising edge dead band disabled
bit 3-0 PxMODE<3:0> PSMC Operating Mode bits
1111 = Reserved
1110 = Reserved
1101 = Reserved
1100 = 3-phase steering PWM
1011 = Fixed duty cycle, variable frequency, complementary PWM
1010 = Fixed duty cycle, variable frequency, single PWM
1001 = ECCP compatible Full-Bridge forward output
1000 = ECCP compatible Full-Bridge reverse output
0111 = Pulse-skipping with complementary output
0110 = Pulse-skipping PWM output
0101 = Push-pull with 4-full-bridge outputs and complementary outputs
0100 = Push-pull with 4-full-bridge outputs
0011 = Push-pull with complementary outputs
0010 = Push-pull output
0001 = Single PWM with complementary output (with PWM steering capability)
0000 = Single PWM waveform generation (with PWM steering capability)
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DS41579C-page 234 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 24-2: PSMCxMDL – PSMC MODULATION CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PxMDLEN PxMDLPOL PxMDLBIT — PxMSRC<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 PxMDLEN: PSMC Periodic Modulation Mode Enable bit
1 = PSMCx is active when input signal selected by PxMSRC<3:0> is in its active state (see PxMPOL)
0 = PSMCx module is always active
bit 6 PxMDLPOL: PSMC Periodic Modulation Polarity bit
1 = PSMCx is active when the PSMCx Modulation source output equals logic ‘0’ (active-low)
0 = PSMCx is active when the PSMCx Modulation source output equals logic ‘1’ (active-high)
bit 5 PxMDLBIT: PSMC Periodic Modulation Software Control bit
PxMDLEN = 1 AND PxMSRC<3:0> = 0000
1 = PSMCx is active when the PxMPOL equals logic ‘0’
0 = PSMCx is active when the PxMPOL equals logic ‘1’
PxMDLEN = 0 OR (PxMEN = 1 and PxMSRC<3:0> <> ‘0000’
Does not affect module operation
bit 4 Unimplemented: Read as ‘0’
bit 3-0 PxMSRC<3:0> PSMC Periodic Modulation Source Selection bits
1111 = Reserved
1110 = Reserved
1101 = Reserved
1100 = Reserved
1011 = Reserved
1010 = Reserved
1001 = Reserved
1000 = PSMCx Modulation Source is PSMCxIN pin
0111 = Reserved
0110 = PSMCx Modulation Source is CCP2
0101 = PSMCx Modulation Source is CCP1
0100 = Reserved
0011 = PSMCx Modulation Source is Comparator 3 output
0010 = PSMCx Modulation Source is Comparator 2 output
0001 = PSMCx Modulation Source is Comparator 1 output
0000 = PSMCx Modulation Source is PxMDLBIT register bit
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REGISTER 24-3: PSMC1SYNC – PSMC1 SYNCHRONIZATION CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0
— — — — — — P1SYNC<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-2 Unimplemented: Read as ‘0’
bit 1-0 P1SYNC<1:0>: PSMC1 Period Synchronization Mode bits
10 = PSMC1 is synchronized with the PSMC2 module
01 = Reserved - Do not use
00 = PSMC1 is not synchronized with any other PSMC module
REGISTER 24-4: PSMC2SYNC – PSMC2 SYNCHRONIZATION CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0
— — — — — — P2SYNC<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-2 Unimplemented: Read as ‘0’
bit 1-0 P2SYNC<1:0>: PSMC2 Period Synchronization Mode bits
10 = Reserved - Do not use
01 = PSMC2 is synchronized with the PSMC1 module
00 = PSMC2 is not synchronized with any other PSMC module
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REGISTER 24-5: PSMCxCLK – PSMC CLOCK CONTROL REGISTER
U-0 U-0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0
—— PxCPRE<1:0> —— PxCSRC<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 PxCPRE<1:0>: PSMCx Clock Prescaler Selection bits
11 = PSMCx Clock frequency/8
10 = PSMCx Clock frequency/4
01 = PSMCx Clock frequency/2
00 = PSMCx Clock frequency/1
bit 3-2 Unimplemented: Read as ‘0’
bit 1-0 PxCSRC<1:0>: PSMCx Clock Source Selection bits
11 = Reserved
10 = PSMCxCLK pin
01 = 64 MHz clock in from PLL
00 =F
OSC system clock
REGISTER 24-6: PSMCxOEN – PSMC OUTPUT ENABLE CONTROL REGISTER
U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
——PxOEF
(1) PxOEE(1) PxOED(1) PxOEC(1) PxOEB PxOEA
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 PxOEy: PSMCx Output y Enable bit(1)
1 = PWM output is active on PSMCx output y pin
0 = PWM output is not active, normal port functions in control of pin
Note 1: These bits are not implemented on PSMC2.
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REGISTER 24-7: PSMCxPOL – PSMC POLARITY CONTROL REGISTER
U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
— PxPOLIN PxPOLF(1) PxPOLE(1) PxPOLD(1) PxPOLC(1) PxPOLB PxPOLA
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 Unimplemented: Read as ‘0’
bit 6 PxPOLIN: PSMCxIN Polarity bit
1 = PSMCxIN input is active-low
0 = PSMCxIN input is active-high
bit 5-0 PxPOLy: PSMCx Output y Polarity bit(1)
1 = PWM PSMCx output y is active-low
0 = PWM PSMCx output y is active-high
Note 1: These bits are not implemented on PSMC2.
REGISTER 24-8: PSMCxBLNK – PSMC BLANKING CONTROL REGISTER
U-0 U-0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0
—— PxFEBM1 PxFEBM0 —— PxREBM1 PxREBM0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 PxFEBM<1:0> PSMC Falling Edge Blanking Mode bits
11 = Reserved - do not use
10 = Reserved - do not use
01 = Immediate blanking
00 = No blanking
bit 3-2 Unimplemented: Read as ‘0’
bit 1-0 PxREBM<1:0> PSMC Rising Edge Blanking Mode bits
11 = Reserved - do not use
10 = Reserved - do not use
01 = Immediate blanking
00 = No blanking
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DS41579C-page 238 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 24-9: PSMCxREBS – PSMC RISING EDGE BLANKED SOURCE REGISTER
R/W-0/0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 U-0
PxREBSIN — — — PxREBSC3 PxREBSC2 PxREBSC1 —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 PxREBSIN: PSMCx Rising Edge Event Blanked from PSMCxIN pin
1 = PSMCxIN pin cannot cause a rising or falling event for the duration indicated by the PSMCxBLNK register
0 = PSMCxIN pin is not blanked
bit 6-4 Unimplemented: Read as ‘0’
bit 3 PxREBSC3: PSMCx Rising Edge Event Blanked from Comparator 3
1 = Comparator 3 cannot cause a rising or falling event for the duration indicated by the PSMCxBLNK register
0 = Comparator 3 is not blanked
bit 2 PxREBSC2: PSMCx Rising Edge Event Blanked from Comparator 2
1 = Comparator 2 cannot cause a rising or falling event for the duration indicated by the PSMCxBLNK register
0 = Comparator 2 is not blanked
bit 1 PxREBSC1: PSMCx Rising Edge Event Blanked from Comparator 1
1 = Comparator 1 cannot cause a rising or falling event for the duration indicated by the PSMCxBLNK register
0 = Comparator 1 is not blanked
bit 0 Unimplemented: Read as ‘0’
REGISTER 24-10: PSMCxFEBS – PSMC FALLING EDGE BLANKED SOURCE REGISTER
R/W-0/0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 U-0
PxFEBSIN — — — PxFEBSC3 PxFEBSC2 PxFEBSC1 —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 PxFEBSIN: PSMCx Falling Edge Event Blanked from PSMCxIN pin
1 = PSMCxIN pin cannot cause a rising or falling event for the duration indicated by the PSMCxBLNK register
0 = PSMCxIN pin is not blanked
bit 6-4 Unimplemented: Read as ‘0’
bit 3 PxFEBSC3: PSMCx Falling Edge Event Blanked from Comparator 3
1 = Comparator 3 cannot cause a rising or falling event for the duration indicated by the PSMCxBLNK register
0 = Comparator 3 is not blanked
bit 2 PxFEBSC2: PSMCx Falling Edge Event Blanked from Comparator 2
1 = Comparator 2 cannot cause a rising or falling event for the duration indicated by the PSMCxBLNK register
0 = Comparator 2 is not blanked
bit 1 PxFEBSC1: PSMCx Falling Edge Event Blanked from Comparator 1
1 = Comparator 1 cannot cause a rising or falling event for the duration indicated by the PSMCxBLNK register
0 = Comparator 1 is not blanked
bit 0 Unimplemented: Read as ‘0’
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 239
PIC16(L)F1782/3
REGISTER 24-11: PSMCxPHS – PSMC PHASE SOURCE REGISTER(1)
R/W-0/0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PxPHSIN — — — PxPHSC3 PxPHSC2 PxPHSC1 PxPHST
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 PxPHSIN: PSMCx Rising Edge Event occurs on PSMCxIN pin
1 = Rising edge event will occur when PSMCxIN pin goes true
0 = PSMCxIN pin will not cause rising edge event
bit 6-4 Unimplemented: Read as ‘0’
bit 3 PxPHSC3: PSMCx Rising Edge Event occurs on Comparator 3 output
1 = Rising edge event will occur when Comparator 3 output goes true
0 = Comparator 3 will not cause rising edge event
bit 2 PxPHSC2: PSMCx Rising Edge Event occurs on Comparator 2 output
1 = Rising edge event will occur when Comparator 2 output goes true
0 = Comparator 2 will not cause rising edge event
bit 1 PxPHSC1: PSMCx Rising Edge Event occurs on Comparator 1 output
1 = Rising edge event will occur when Comparator 1 output goes true
0 = Comparator 1 will not cause rising edge event
bit 0 PxPHST: PSMCx Rising Edge Event occurs on Time Base match
1 = Rising edge event will occur when PSMCxTMR = PSMCxPH
0 = Time base will not cause rising edge event
Note 1: Sources are not mutually exclusive: more than one source can cause a rising edge event.
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DS41579C-page 240 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 24-12: PSMCxDCS – PSMC DUTY CYCLE SOURCE REGISTER(1)
R/W-0/0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PxDCSIN — — — PxDCSC3 PxDCSC2 PxDCSC1 PxDCST
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 PxDCSIN: PSMCx Falling Edge Event occurs on PSMCxIN pin
1 = Falling edge event will occur when PSMCxIN pin goes true
0 = PSMCxIN pin will not cause falling edge event
bit 6-4 Unimplemented: Read as ‘0’
bit 3 PxDCSC3: PSMCx Falling Edge Event occurs on Comparator 3 output
1 = Falling edge event will occur when Comparator 3 output goes true
0 = Comparator 3 will not cause falling edge event
bit 2 PxDCSC2: PSMCx Falling Edge Event occurs on Comparator 2 output
1 = Falling edge event will occur when Comparator 2 output goes true
0 = Comparator 2 will not cause falling edge event
bit 1 PxDCSC1: PSMCx Falling Edge Event occurs on Comparator 1 output
1 = Falling edge event will occur when Comparator 1 output goes true
0 = Comparator 1 will not cause falling edge event
bit 0 PxDCST: PSMCx Falling Edge Event occurs on Time Base match
1 = Falling edge event will occur when PSMCxTMR = PSMCxDC
0 = Time base will not cause falling edge event
Note 1: Sources are not mutually exclusive: more than one source can cause a falling edge event.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 241
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REGISTER 24-13: PSMCxPRS – PSMC PERIOD SOURCE REGISTER(1)
R/W-0/0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PxPRSIN — — — PxPRSC3 PxPRSC2 PxPRSC1 PxPRST
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 PxPRSIN: PSMCx Period Event occurs on PSMCxIN pin
1 = Period event will occur and PSMCxTMR will reset when PSMCxIN pin goes true
0 = PSMCxIN pin will not cause period event
bit 6-4 Unimplemented: Read as ‘0’
bit 3 PxPRSC3: PSMCx Period Event occurs on Comparator 3 output
1 = Period event will occur and PSMCxTMR will reset when Comparator 3 output goes true
0 = Comparator 3 will not cause period event
bit 2 PxPRSC2: PSMCx Period Event occurs on Comparator 2 output
1 = Period event will occur and PSMCxTMR will reset when Comparator 2 output goes true
0 = Comparator 2 will not cause period event
bit 1 PxPRSC1: PSMCx Period Event occurs on Comparator 1 output
1 = Period event will occur and PSMCxTMR will reset when Comparator 1 output goes true
0 = Comparator 1 will not cause period event
bit 0 PxPRST: PSMCx Period Event occurs on Time Base match
1 = Period event will occur and PSMCxTMR will reset when PSMCxTMR = PSMCxPR
0 = Time base will not cause period event
Note 1: Sources are not mutually exclusive: more than one source can force the period event and reset the
PSMCxTMR.
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DS41579C-page 242 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 24-14: PSMCxASDC – PSMC AUTO-SHUTDOWN CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 U-0 U-0 R/W-0/0
PxASE PxASDEN PxARSEN — — — — PxASDOV
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 PxASE: PWM Auto-Shutdown Event Status bit(1)
1 = A shutdown event has occurred, PWM outputs are inactive and in their shutdown states
0 = PWM outputs are operating normally
bit 6 PxASDEN: PWM Auto-Shutdown Enable bit
1 = Auto-shutdown is enabled. If any of the sources in PSMCxASDS assert a logic ‘1’, then the out-
puts will go into their auto-shutdown state and PSMCxSIF flag will be set.
0 = Auto-shutdown is disabled
bit 5 PxARSEN: PWM Auto-Restart Enable bit
1 = PWM restarts automatically when the shutdown condition is removed.
0 = The PxASE bit must be cleared in firmware to restart PWM after the auto-shutdown condition is
cleared.
bit 4-1 Unimplemented: Read as ‘0’
bit 0 PxASDOV: PWM Auto-Shutdown Override bit
PxASDEN = 1:
1 = Force PxASDL[n] levels on the PSMCx[n] pins without causing a PSMCxSIF interrupt
0 = Normal PWM and auto-shutdown execution
PxASDEN = 0:
No effect
Note 1: PASE bit may be set in software. When this occurs the functionality is the same as that caused by
hardware.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 243
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REGISTER 24-15: PSMCxASDL – PSMC AUTO-SHUTDOWN OUTPUT LEVEL REGISTER
U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
—— PxASDLF(1) PxASDLE(1) PxASDLD(1) PxASDLC(1) PxASDLB PxASDLA
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5 PxASDLF: PSMCx Output F Auto-Shutdown Pin Level bit(1)
1 = When auto-shutdown is asserted, pin PSMCxF will drive logic ‘1’
0 = When auto-shutdown is asserted, pin PSMCxF will drive logic ‘0’
bit 4 PxASDLE: PSMCx Output E Auto-Shutdown Pin Level bit(1)
1 = When auto-shutdown is asserted, pin PSMCxE will drive logic ‘1’
0 = When auto-shutdown is asserted, pin PSMCxE will drive logic ‘0’
bit 3 PxASDLD: PSMCx Output D Auto-Shutdown Pin Level bit(1)
1 = When auto-shutdown is asserted, pin PSMCxD will drive logic ‘1’
0 = When auto-shutdown is asserted, pin PSMCxD will drive logic ‘0’
bit 2 PxASDLC: PSMCx Output C Auto-Shutdown Pin Level bit(1)
1 = When auto-shutdown is asserted, pin PSMCxC will drive logic ‘1’
0 = When auto-shutdown is asserted, pin PSMCxC will drive logic ‘0’
bit 1 PxASDLB: PSMCx Output B Auto-Shutdown Pin Level bit
1 = When auto-shutdown is asserted, pin PSMCxB will drive logic ‘1’
0 = When auto-shutdown is asserted, pin PSMCxB will drive logic ‘0’
bit 0 PxASDLA: PSMCx Output A Auto-Shutdown Pin Level bit
1 = When auto-shutdown is asserted, pin PSMCxA will drive logic ‘1’
0 = When auto-shutdown is asserted, pin PSMCxA will drive logic ‘0’
Note 1: These bits are not implemented on PSMC2.
PIC16(L)F1782/3
DS41579C-page 244 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 24-16: PSMCxASDS – PSMC AUTO-SHUTDOWN SOURCE REGISTER
R/W-0/0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 U-0
PxASDSIN — — — PxASDSC3 PxASDSC2 PxASDSC1 —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 PxASDSIN: Auto-shutdown occurs on PSMCxIN pin
1 = Auto-shutdown will occur when PSMCxIN pin goes true
0 = PSMCxIN pin will not cause auto-shutdown
bit 6-4 Unimplemented: Read as ‘0’
bit 3 PxASDSC3: Auto-shutdown occurs on Comparator 3 output
1 = Auto-shutdown will occur when Comparator 3 output goes true
0 = Comparator 3 will not cause auto-shutdown
bit 2 PxASDSC2: Auto-shutdown occurs on Comparator 2 output
1 = Auto-shutdown will occur when Comparator 2 output goes true
0 = Comparator 2 will not cause auto-shutdown
bit 1 PxASDSC1: Auto-shutdown occurs on Comparator 1 output
1 = Auto-shutdown will occur when Comparator 1 output goes true
0 = Comparator 1 will not cause auto-shutdown
bit 0 Unimplemented: Read as ‘0’
REGISTER 24-17: PSMCxTMRL – PSMC TIME BASE COUNTER LOW REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PSMCxTMRL<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PSMCxTMRL<7:0>: 16-bit PSMCx Time Base Counter Least Significant bits
= PSMCxTMR<7:0>
REGISTER 24-18: PSMCxTMRH – PSMC TIME BASE COUNTER HIGH REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-1/1
PSMCxTMRH<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PSMCxTMRH<7:0>: 16-bit PSMCx Time Base Counter Most Significant bits
= PSMCxTMR<15:8>
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 245
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REGISTER 24-19: PSMCxPHL – PSMC PHASE COUNT LOW BYTE REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PSMCxPHL<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PSMCxPHL<7:0>: 16-bit Phase Count Least Significant bits
= PSMCxPH<7:0>
REGISTER 24-20: PSMCxPHH – PSMC PHASE COUNT HIGH BYTE REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PSMCxPHH<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PSMCxPHH<7:0>: 16-bit Phase Count Most Significant bits
= PSMCxPH<15:8>
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DS41579C-page 246 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 24-21: PSMCxDCL – PSMC DUTY CYCLE COUNT LOW BYTE REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PSMCxDCL<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PSMCxDCL<7:0>: 16-bit Duty Cycle Count Least Significant bits
= PSMCxDC<7:0>
REGISTER 24-22: PSMCxDCH – PSMC DUTY CYCLE COUNT HIGH REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PSMCxDCH<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PSMCxDCH<7:0>: 16-bit Duty Cycle Count Most Significant bits
= PSMCxDC<15:8>
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 247
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REGISTER 24-23: PSMCxPRL – PSMC PERIOD COUNT LOW BYTE REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PSMCxPRL<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PSMCxPRL<7:0>: 16-bit Period Time Least Significant bits
= PSMCxPR<7:0>
REGISTER 24-24: PSMCxPRH – PSMC PERIOD COUNT HIGH BYTE REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PSMCxPRH<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PSMCxPRH<7:0>: 16-bit Period Time Most Significant bits
= PSMCxPR<15:8>
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DS41579C-page 248 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 24-25: PSMCxDBR – PSMC RISING EDGE DEAD-BAND TIME REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PSMCxDBR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PSMCxDBR<7:0>: Rising Edge Dead-Band Time
= Unsigned number of PSMCx psmc_clk clock periods in rising edge dead band
REGISTER 24-26: PSMCxDBF – PSMC FALLING EDGE DEAD-BAND TIME REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PSMCxDBF<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PSMCxDBF<7:0>: Falling Edge Dead-Band Time
= Unsigned number of PSMCx psmc_clk clock periods in falling edge dead band
REGISTER 24-27: PSMCxFFA – PSMC FRACTIONAL FREQUENCY ADJUST REGISTER
U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
— — — — PSMCxFFA<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-4 Unimplemented: Read as ‘0’
bit 3-0 PSMCxFFA<3:0>: Fractional Frequency Adjustment bits
= Unsigned number of fractional PSMCx psmc_clk clock periods to add to each period event time.
The fractional time period = 1/(16*psmc_clk)
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 249
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REGISTER 24-28: PSMCxBLKR – PSMC RISING EDGE BLANKING TIME REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PSMCxBLKR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PSMCxBLKR<7:0>: Rising Edge Blanking Time
= Unsigned number of PSMCx psmc_clk clock periods in rising edge blanking
REGISTER 24-29: PSMCxBLKF – PSMC FALLING EDGE BLANKING TIME REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PSMCxBLKF<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PSMCxBLKF<7:0>: Falling Edge Blanking Time bits
= Unsigned number of PSMCx psmc_clk clock periods in falling edge blanking
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DS41579C-page 250 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 24-30: PSMCxSTR0 – PSMC STEERING CONTROL REGISTER 0
U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-1/1
——PxSTRF
(2) PxSTRE(2) PxSTRD(2) PxSTRC(2) PxSTRB PxSTRA
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5 PxSTRF: PWM Steering PSMCxF Output Enable bit(2)
If PxMODE<3:0> = 0000 (Single-phase PWM):
1 = Single PWM output is active on pin PSMCxF
0 = Single PWM output is not active on pin PSMCxF. PWM drive is in inactive state
If PxMODE<3:0> = 0001 (Complementary Single-phase PWM):
1 = Complementary PWM output is active on pin PSMCxF
0 = Complementary PWM output is not active on pin PSMCxOUT5. PWM drive is in inactive state
IF PxMODE<3:0> = 1100 (3-phase Steering):(1)
1 = PSMCxD and PSMCxE are high. PSMCxA, PMSCxB, PSMCxC and PMSCxF are low.
0 = 3-phase output combination is not active
bit 4 PxSTRE: PWM Steering PSMCxE Output Enable bit(2)
If PxMODE<3:0> = 000x (single-phase PWM or Complementary PWM):
1 = Single PWM output is active on pin PSMCxE
0 = Single PWM output is not active on pin PSMCxE. PWM drive is in inactive state
IF PxMODE<3:0> = 1100 (3-phase Steering):(1)
1 = PSMCxB and PSMCxE are high. PSMCxA, PMSCxC, PSMCxD and PMSCxF are low.
0 = 3-phase output combination is not active
bit 3 PxSTRD: PWM Steering PSMCxD Output Enable bit(2)
If PxMODE<3:0> = 0000 (Single-phase PWM):
1 = Single PWM output is active on pin PSMCxD
0 = Single PWM output is not active on pin PSMCxD. PWM drive is in inactive state
If PxMODE<3:0> = 0001 (Complementary single-phase PWM):
1 = Complementary PWM output is active on pin PSMCxD
0 = Complementary PWM output is not active on pin PSMCxD. PWM drive is in inactive state
IF PxMODE<3:0> = 1100 (3-phase Steering):(1)
1 = PSMCxB and PSMCxC are high. PSMCxA, PMSCxD, PSMCxE and PMSCxF are low.
0 = 3-phase output combination is not active
bit 2 PxSTRC: PWM Steering PSMCxC Output Enable bit(2)
If PxMODE<3:0> = 000x (Single-phase PWM or Complementary PWM):
1 = Single PWM output is active on pin PSMCxC
0 = Single PWM output is not active on pin PSMCxC. PWM drive is in inactive state
IF PxMODE<3:0> = 1100 (3-phase Steering):(1)
1 = PSMCxC and PSMCxF are high. PSMCxA, PMSCxB, PSMCxD and PMSCxE are low.
0 = 3-phase output combination is not active
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 251
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bit 1 PxSTRB: PWM Steering PSMCxB Output Enable bit
If PxMODE<3:0> = 0000 (Single-phase PWM):
1 = Single PWM output is active on pin PSMCxOUT1
0 = Single PWM output is not active on pin PSMCxOUT1. PWM drive is in inactive state
If PxMODE<3:0> = 0001 (Complementary Single-phase PWM):
1 = Complementary PWM output is active on pin PSMCxB
0 = Complementary PWM output is not active on pin PSMCxB. PWM drive is in inactive state
IF PxMODE<3:0> = 1100 (3-phase Steering):(1)
1 = PSMCxA and PSMCxF are high. PSMCxB, PMSCxC, PSMCxD and PMSCxE are low.
0 = 3-phase output combination is not active
bit 0 PxSTRA: PWM Steering PSMCxA Output Enable bit
If PxMODE<3:0> = 000x (Single-phase PWM or Complementary PWM):
1 = Single PWM output is active on pin PSMCxA
0 = Single PWM output is not active on pin PSMCxA. PWM drive is in inactive state
IF PxMODE<3:0> = 1100 (3-phase Steering):(1)
1 = PSMCxA and PSMCxD are high. PSMCxB, PMSCxC, PSMCxE and PMSCxF are low.
0 = 3-phase output combination is not active
Note 1: In 3-phase Steering mode, only one PSTRx bit should be set at a time. If more than one is set, then the
lowest bit number steering combination has precedence.
2: These bits are not implemented on PSMC2.
REGISTER 24-30: PSMCxSTR0 – PSMC STEERING CONTROL REGISTER 0
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DS41579C-page 252 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 24-31: PSMCxSTR1 – PSMC STEERING CONTROL REGISTER 1
R/W-0/0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0
PxSSYNC — — — — — PxLSMEN PxHSMEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 PxSSYNC: PWM Steering Synchronization bit
1 = PWM outputs are updated on period boundary
0 = PWM outputs are updated immediately
bit 6-2 Unimplemented: Read as ‘0’
bit 1 PxLSMEN: 3-Phase Steering Low Side Modulation Enable bit
PxMODE = 1100:
1 = Low side driver PSMCxB, PSMCxD and PSMCxF outputs are modulated according to
PSMCxMDL when the output is high and driven low without modulation when the output is low.
0 = PSMCxB, PSMCxD, and PSMCxF outputs are driven high and low by PSMCxSTR0 control
without modulation.
PxMODE <> 1100:
No effect on output
bit 0 PxHSMEN: 3-Phase Steering High Side Modulation Enable bit
PxMODE = 1100:
1 = High side driver PSMCxA, PSMCxC and PSMCxE outputs are modulated according to
PSMCxMDL when the output is high and driven low without modulation when the output is low.
0 = PSMCxA, PSMCxC and PSMCxE outputs are driven high and low by PSMCxSTR0 control
without modulation.
PxMODE <> 1100:
No effect on output
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 253
PIC16(L)F1782/3
REGISTER 24-32: PSMCxINT – PSMC TIME BASE INTERRUPT CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PxTOVIE PxTPHIE PxTDCIE PxTPRIE PxTOVIF PxTPHIF PxTDCIF PxTPRIF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 PxTOVIE: PSMC Time Base Counter Overflow Interrupt Enable bit
1 = Time base counter overflow interrupts are enabled
0 = Time base counter overflow interrupts are disabled
bit 6 PxTPHIE: PSMC Time Base Phase Interrupt Enable bit
1 = Time base phase match interrupts are enabled
0 = Time base phase match interrupts are disabled
bit 5 PxTDCIE: PSMC Time Base Duty Cycle Interrupt Enable bit
1 = Time base duty cycle match interrupts are enabled
0 = Time base duty cycle match interrupts are disabled
bit 4 PxTPRIE: PSMC Time Base Period Interrupt Enable bit
1 = Time base period match interrupts are enabled
0 = Time base period match Interrupts are disabled
bit 3 PxTOVIF: PSMC Time Base Counter Overflow Interrupt Flag bit
1 = The 16-bit PSMCxTMR has overflowed from FFFFh to 0000h
0 = The 16-bit PSMCxTMR counter has not overflowed
bit 2 PxTPHIF: PSMC Time Base Phase Interrupt Flag bit
1 = The 16-bit PSMCxTMR counter has matched PSMCxPH<15:0>
0 = The 16-bit PSMCxTMR counter has not matched PSMCxPH<15:0>
bit 1 PxTDCIF: PSMC Time Base Duty Cycle Interrupt Flag bit
1 = The 16-bit PSMCxTMR counter has matched PSMCxDC<15:0>
0 = The 16-bit PSMCxTMR counter has not matched PSMCxDC<15:0>
bit 0 PxTPRIF: PSMC Time Base Period Interrupt Flag bit
1 = The 16-bit PSMCxTMR counter has matched PSMCxPR<15:0>
0 = The 16-bit PSMCxTMR counter has not matched PSMCxPR<15:0>
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DS41579C-page 254 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 24-5: SUMMARY OF REGISTERS ASSOCIATED WITH PSMC
Name Bit7 Bit6 Bit5 Bit4 BIt3 Bit2 Bit1 Bit0 Register
on Page
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
ODCONC ODC7 ODC6 ODC5 ODC4 ODC3 ODC2 ODC1 ODC0 134
PIE4 —— PSMC2TIE PSMC1TIE —— PSMC2SIE PSMC1SIE 87
PIR4 —— PSMC2TIF PSMC1TIF —— PSMC2SIF PSMC1SIF 90
PSMCxASDC PxASE PxASDEN PxARSEN — — — — PxASDOV 242
PSMCxASDL — — PxASDLF(1) PxASDLE(1) PxASDLD(1) PxASDLC(1) PxASDLB PxASDLA 243
PSMCxASDS PxASDSIN — — — PxASDSC3 PxASDSC2 PxASDSC1 —244
PSMCxBLKF PSMCxBLKF<7:0> 249
PSMCxBLKR PSMCxBLKR<7:0> 249
PSMCxBLNK — — PxFEBM1 PxFEBM0 — — PxREBM1 PxREBM0 237
PSMCxCLK — — PxCPRE<1:0> — — PxCSRC<1:0> 236
PSMCxCON PSMCxEN PSMCxLD PxDBFE PxDBRE PxMODE<3:0> 233
PSMCxDBF PSMCxDBF<7:0> 248
PSMCxDBR PSMCxDBR<7:0> 248
PSMCxDCH PSMCxDC<15:8> 246
PSMCxDCL PSMCxDC<7:0> 246
PSMCxDCS PxDCSIN — — — PxDCSC3 PxDCSC2 PxDCSC1 PxDCST 240
PSMCxFEBS PxFEBSIN — — — PxFEBSC3 PxFEBSC2 PxFEBSC1 —238
PSMCxFFA — — — — PSMCxFFA<3:0> 248
PSMCxINT PxTOVIE PxTPHIE PxTDCIE PxTPRIE PxTOVIF PxTPHIF PxTDCIF PxTPRIF 253
PSMCxMDL PxMDLEN PxMDLPOL PxMDLBIT — PxMSRC<3:0> 234
PSMCxOEN — — PxOEF(1) PxOEE(1) PxOED(1) PxOEC(1) PxOEB PxOEA 236
PSMCxPHH PSMCxPH<15:8> 245
PSMCxPHL PSMCxPH<7:0> 245
PSMCxPHS PxPHSIN — — — PxPHSC3 PxPHSC2 PxPHSC1 PxPHST 239
PSMCxPOL —PxPOLIN PxPOLF(1) PxPOLE(1) PxPOLD(1) PxPOLC(1) PxPOLB PxPOLA 237
PSMCxPRH PSMCxPR<15:8> 247
PSMCxPRL PSMCxPR<7:0> 247
PSMCxPRS PxPRSIN — — — PxPRSC3 PxPRSC2 PxPRSC1 PxPRST 241
PSMCxREBS PxREBSIN — — — PxREBSC3 PxREBSC2 PxREBSC1 —238
PSMCxSTR0 — — PxSTRF(1) PxSTRE(1) PxSTRD(1) PxSTRC(1) PxSTRB PxSTRA 250
PSMCxSTR1 PxSSYNC —————PxLSMEN PxHSMEN 252
PSMCxSYNC —————— PxSYNC<1:0> 235
PSMCxTMRH PSMCxTMR<15:8> 244
PSMCxTMRL PSMCxTMR<7:0> 244
SLRCONC SLRC7 SLRC6 SLRC5 SLRC4 SLRC3 SLCR2 SRC1 SLRC0 134
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 133
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by PSMC module.
Note 1: Unimplemented in PSMC2.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 255
PIC16(L)F1782/3
25.0 CAPTURE/COMPARE/PWM
MODULES
The Capture/Compare/PWM module is a peripheral
which allows the user to time and control different
events, and to generate Pulse-Width Modulation
(PWM) signals. In Capture mode, the peripheral allows
the timing of the duration of an event. The Compare
mode allows the user to trigger an external event when
a predetermined amount of time has expired. The
PWM mode can generate Pulse-Width Modulated
signals of varying frequency and duty cycle.
This family of devices contains 2 standard
Capture/Compare/PWM modules (CCP1 and CCP2).
The Capture and Compare functions are identical for all
CCP modules.
Note 1: In devices with more than one CCP
module, it is very important to pay close
attention to the register names used. A
number placed after the module acronym
is used to distinguish between separate
modules. For example, the CCP1CON
and CCP2CON control the same
operational aspects of two completely
different CCP modules.
2: Throughout this section, generic
references to a CCP module in any of its
operating modes may be interpreted as
being equally applicable to CCPx module.
Register names, module signals, I/O pins,
and bit names may use the generic
designator ‘x’ to indicate the use of a
numeral to distinguish a particular module,
when required.
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DS41579C-page 256 Preliminary 2011-2012 Microchip Technology Inc.
25.1 Capture Mode
The Capture mode function described in this section is
available and identical for all CCP modules.
Capture mode makes use of the 16-bit Timer1
resource. When an event occurs on the CCPx pin, the
16-bit CCPRxH:CCPRxL register pair captures and
stores the 16-bit value of the TMR1H:TMR1L register
pair, respectively. An event is defined as one of the
following and is configured by the CCPxM<3:0> bits of
the CCPxCON register:
• Every falling edge
• Every rising edge
• Every 4th rising edge
• Every 16th rising edge
When a capture is made, the Interrupt Request Flag bit
CCPxIF of the PIRx register is set. The interrupt flag
must be cleared in software. If another capture occurs
before the value in the CCPRxH, CCPRxL register pair
is read, the old captured value is overwritten by the new
captured value.
Figure 25-1 shows a simplified diagram of the Capture
operation.
25.1.1 CCP PIN CONFIGURATION
In Capture mode, the CCPx pin should be configured
as an input by setting the associated TRIS control bit.
Also, the CCP2 pin function can be moved to
alternative pins using the APFCON register. Refer to
Section 13.1 “Alternate Pin Function” for more
details.
FIGURE 25-1: CAPTURE MODE
OPERATION BLOCK
DIAGRAM
25.1.2 TIMER1 MODE RESOURCE
Timer1 must be running in Timer mode or Synchronized
Counter mode for the CCP module to use the capture
feature. In Asynchronous Counter mode, the capture
operation may not work.
See Section 22.0 “Timer1 Module with Gate
Control” for more information on configuring Timer1.
25.1.3 SOFTWARE INTERRUPT MODE
When the Capture mode is changed, a false capture
interrupt may be generated. The user should keep the
CCPxIE interrupt enable bit of the PIEx register clear to
avoid false interrupts. Additionally, the user should
clear the CCPxIF interrupt flag bit of the PIRx register
following any change in Operating mode.
25.1.4 CCP PRESCALER
There are four prescaler settings specified by the
CCPxM<3:0> bits of the CCPxCON register. Whenever
the CCP module is turned off, or the CCP module is not
in Capture mode, the prescaler counter is cleared. Any
Reset will clear the prescaler counter.
Switching from one capture prescaler to another does not
clear the prescaler and may generate a false interrupt. To
avoid this unexpected operation, turn the module off by
clearing the CCPxCON register before changing the
prescaler. Equation 25-1 demonstrates the code to
perform this function.
EXAMPLE 25-1: CHANGING BETWEEN
CAPTURE PRESCALERS
Note: If the CCPx pin is configured as an output,
a write to the port can cause a capture
condition.
CCPRxH CCPRxL
TMR1H TMR1L
Set Flag bit CCPxIF
(PIRx register)
Capture
Enable
CCPxM<3:0>
Prescaler
1, 4, 16
and
Edge Detect
pin
CCPx
System Clock (FOSC)
Note: Clocking Timer1 from the system clock
(FOSC) should not be used in Capture
mode. In order for Capture mode to
recognize the trigger event on the CCPx
pin, Timer1 must be clocked from the
instruction clock (FOSC/4) or from an
external clock source.
BANKSEL CCPxCON ;Set Bank bits to point
;to CCPxCON
CLRF CCPxCON ;Turn CCP module off
MOVLW NEW_CAPT_PS ;Load the W reg with
;the new prescaler
;move value and CCP ON
MOVWF CCPxCON ;Load CCPxCON with this
;value
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 257
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25.1.5 CAPTURE DURING SLEEP
Capture mode depends upon the Timer1 module for
proper operation. There are two options for driving the
Timer1 module in Capture mode. It can be driven by the
instruction clock (FOSC/4), or by an external clock source.
When Timer1 is clocked by FOSC/4, Timer1 will not
increment during Sleep. When the device wakes from
Sleep, Timer1 will continue from its previous state.
Capture mode will operate during Sleep when Timer1
is clocked by an external clock source.
25.1.6 ALTERNATE PIN LOCATIONS
This module incorporates I/O pins that can be moved to
other locations with the use of the alternate pin function
register APFCON. To determine which pins can be
moved and what their default locations are upon a
Reset, see Section 13.1 “Alternate Pin Function” for
more information.
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DS41579C-page 258 Preliminary 2011-2012 Microchip Technology Inc.
25.2 Compare Mode
The Compare mode function described in this section
is available and identical for al CCP modules.
Compare mode makes use of the 16-bit Timer1
resource. The 16-bit value of the CCPRxH:CCPRxL
register pair is constantly compared against the 16-bit
value of the TMR1H:TMR1L register pair. When a
match occurs, one of the following events can occur:
• Toggle the CCPx output
• Set the CCPx output
• Clear the CCPx output
• Generate an Auto-conversion Trigger
• Generate a Software Interrupt
The action on the pin is based on the value of the
CCPxM<3:0> control bits of the CCPxCON register. At
the same time, the interrupt flag CCPxIF bit is set.
All Compare modes can generate an interrupt.
Figure 25-2 shows a simplified diagram of the compare
operation.
FIGURE 25-2: COMPARE MODE
OPERATION BLOCK
DIAGRAM
25.2.1 CCPX PIN CONFIGURATION
The user must configure the CCPx pin as an output by
clearing the associated TRIS bit.
The CCP2 pin function can be moved to alternate pins
using the APFCON register (Register 13-1). Refer to
Section 13.1 “Alternate Pin Function” for more
details.
25.2.2 TIMER1 MODE RESOURCE
In Compare mode, Timer1 must be running in either
Timer mode or Synchronized Counter mode. The
compare operation may not work in Asynchronous
Counter mode.
See Section 22.0 “Timer1 Module with Gate Control”
for more information on configuring Timer1.
25.2.3 SOFTWARE INTERRUPT MODE
When Generate Software Interrupt mode is chosen
(CCPxM<3:0> = 1010), the CCPx module does not
assert control of the CCPx pin (see the CCPxCON
register).
25.2.4 AUTO-CONVERSION TRIGGER
When Auto-conversion Trigger mode is chosen
(CCPxM<3:0> = 1011), the CCPx module does the
following:
• Resets Timer1
• Starts an ADC conversion if ADC is enabled
The CCPx module does not assert control of the CCPx
pin in this mode.
The Auto-conversion Trigger output of the CCP occurs
immediately upon a match between the TMR1H,
TMR1L register pair and the CCPRxH, CCPRxL regis-
ter pair. The TMR1H, TMR1L register pair is not reset
until the next rising edge of the Timer1 clock. The
Auto-conversion Trigger output starts an A/D conver-
sion (if the A/D module is enabled). This allows the
CCPRxH, CCPRxL register pair to effectively provide a
16-bit programmable period register for Timer1.
Refer to Section 17.2.5 “Auto-Conversion Trigger”
for more information.
Note: Clearing the CCPxCON register will force
the CCPx compare output latch to the
default low level. This is not the PORT I/O
data latch.
CCPRxH CCPRxL
TMR1H TMR1L
Comparator
QS
R
Output
Logic
Auto-conversion Trigger
Set CCPxIF Interrupt Flag
(PIRx)
Match
TRIS
CCPxM<3:0>
Mode Select
Output Enable
Pin
CCPx
4
Note: Clocking Timer1 from the system clock
(FOSC) should not be used in Compare
mode. In order for Compare mode to
recognize the trigger event on the CCPx
pin, TImer1 must be clocked from the
instruction clock (FOSC/4) or from an
external clock source.
Note 1: The Auto-conversion Trigger from the
CCP module does not set interrupt flag
bit TMR1IF of the PIR1 register.
2: Removing the match condition by
changing the contents of the CCPRxH
and CCPRxL register pair, between the
clock edge that generates the
Auto-conversion Trigger and the clock
edge that generates the Timer1 Reset,
will preclude the Reset from occurring.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 259
PIC16(L)F1782/3
25.2.5 COMPARE DURING SLEEP
The Compare mode is dependent upon the system
clock (FOSC) for proper operation. Since FOSC is shut
down during Sleep mode, the Compare mode will not
function properly during Sleep.
25.2.6 ALTERNATE PIN LOCATIONS
This module incorporates I/O pins that can be moved to
other locations with the use of the alternate pin function
register APFCON. To determine which pins can be
moved and what their default locations are upon a
Reset, see Section 13.1 “Alternate Pin Function”for
more information.
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DS41579C-page 260 Preliminary 2011-2012 Microchip Technology Inc.
25.3 PWM Overview
Pulse-Width Modulation (PWM) is a scheme that
provides power to a load by switching quickly between
fully on and fully off states. The PWM signal resembles
a square wave where the high portion of the signal is
considered the on state and the low portion of the signal
is considered the off state. The high portion, also known
as the pulse width, can vary in time and is defined in
steps. A larger number of steps applied, which
lengthens the pulse width, also supplies more power to
the load. Lowering the number of steps applied, which
shortens the pulse width, supplies less power. The
PWM period is defined as the duration of one complete
cycle or the total amount of on and off time combined.
PWM resolution defines the maximum number of steps
that can be present in a single PWM period. A higher
resolution allows for more precise control of the pulse
width time and in turn the power that is applied to the
load.
The term duty cycle describes the proportion of the on
time to the off time and is expressed in percentages,
where 0% is fully off and 100% is fully on. A lower duty
cycle corresponds to less power applied and a higher
duty cycle corresponds to more power applied.
Figure 25-3 shows a typical waveform of the PWM
signal.
25.3.1 STANDARD PWM OPERATION
The standard PWM function described in this section is
available and identical for all CCP modules.
The standard PWM mode generates a Pulse-Width
Modulation (PWM) signal on the CCPx pin with up to 10
bits of resolution. The period, duty cycle, and resolution
are controlled by the following registers:
• PR2 registers
• T2CON registers
• CCPRxL registers
• CCPxCON registers
Figure 25-4 shows a simplified block diagram of PWM
operation.
FIGURE 25-3: CCP PWM OUTPUT SIGNAL
FIGURE 25-4: SIMPLIFIED PWM BLOCK
DIAGRAM
Note 1: The corresponding TRIS bit must be
cleared to enable the PWM output on the
CCPx pin.
2: Clearing the CCPxCON register will
relinquish control of the CCPx pin.
Period
Pulse Width
TMR2 = 0
TMR2 = CCPRxH:CCPxCON<5:4>
TMR2 = PR2
CCPR1L
CCPR1H(2) (Slave)
Comparator
TMR2
PR2
(1)
RQ
S
Duty Cycle Registers CCP1CON<5:4>
Clear Timer,
toggle CCP1 pin and
latch duty cycle
Note 1: The 8-bit timer TMR2 register is
concatenated with the 2-bit internal system
clock (FOSC), or 2 bits of the prescaler, to
create the 10-bit time base.
2: In PWM mode, CCPR1H is a read-only
register.
TRIS
CCP1
Comparator
To PSMC module
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 261
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25.3.2 SETUP FOR PWM OPERATION
The following steps should be taken when configuring
the CCP module for standard PWM operation:
1. Disable the CCPx pin output driver by setting the
associated TRIS bit.
2. Load the PR2 register with the PWM period
value.
3. Configure the CCP module for the PWM mode
by loading the CCPxCON register with the
appropriate values.
4. Load the CCPRxL register and the DCxBx bits
of the CCPxCON register, with the PWM duty
cycle value.
5. Configure and start Timer2:
• Clear the TMR2IF interrupt flag bit of the
PIRx register. See Note below.
• Configure the T2CKPS bits of the T2CON
register with the Timer prescale value.
• Enable the Timer by setting the TMR2ON
bit of the T2CON register.
6. Enable PWM output pin:
• Wait until the Timer overflows and the
TMR2IF bit of the PIR1 register is set. See
Note below.
• Enable the CCPx pin output driver by clear-
ing the associated TRIS bit.
25.3.3 TIMER2 TIMER RESOURCE
The PWM standard mode makes use of the 8-bit
Timer2 timer resources to specify the PWM period.
25.3.4 PWM PERIOD
The PWM period is specified by the PR2 register of
Timer2. The PWM period can be calculated using the
formula of Equation 25-1.
EQUATION 25-1: PWM PERIOD
When TMR2 is equal to PR2, the following three events
occur on the next increment cycle:
•TMR2 is cleared
• The CCPx pin is set. (Exception: If the PWM duty
cycle = 0%, the pin will not be set.)
• The PWM duty cycle is latched from CCPRxL into
CCPRxH.
25.3.5 PWM DUTY CYCLE
The PWM duty cycle is specified by writing a 10-bit
value to multiple registers: CCPRxL register and
DCxB<1:0> bits of the CCPxCON register. The
CCPRxL contains the eight MSbs and the DCxB<1:0>
bits of the CCPxCON register contain the two LSbs.
CCPRxL and DCxB<1:0> bits of the CCPxCON
register can be written to at any time. The duty cycle
value is not latched into CCPRxH until after the period
completes (i.e., a match between PR2 and TMR2
registers occurs). While using the PWM, the CCPRxH
register is read-only.
Equation 25-2 is used to calculate the PWM pulse
width.
Equation 25-3 is used to calculate the PWM duty cycle
ratio.
EQUATION 25-2: PULSE WIDTH
EQUATION 25-3: DUTY CYCLE RATIO
The CCPRxH register and a 2-bit internal latch are
used to double buffer the PWM duty cycle. This double
buffering is essential for glitchless PWM operation.
The 8-bit timer TMR2 register is concatenated with
either the 2-bit internal system clock (FOSC), or 2 bits of
the prescaler, to create the 10-bit time base. The system
clock is used if the Timer2 prescaler is set to 1:1.
When the 10-bit time base matches the CCPRxH and
2-bit latch, then the CCPx pin is cleared (see
Figure 25-4).
Note: In order to send a complete duty cycle and
period on the first PWM output, the above
steps must be included in the setup
sequence. If it is not critical to start with a
complete PWM signal on the first output,
then step 6 may be ignored.
PWM Period PR21+4TOSC =
(TMR2 Prescale Value)
Note 1: TOSC = 1/FOSC
Note: The Timer postscaler (see Section 23.1
“Timer2 Operation”) is not used in the
determination of the PWM frequency.
Pulse Width CCPRxL:CCPxCON<5:4>
=
TOSC
(TMR2 Prescale Value)
Duty Cycle Ratio CCPRxL:CCPxCON<5:4>
4PR21+
-----------------------------------------------------------------------=
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25.3.6 PWM RESOLUTION
The resolution determines the number of available duty
cycles for a given period. For example, a 10-bit resolution
will result in 1024 discrete duty cycles, whereas an 8-bit
resolution will result in 256 discrete duty cycles.
The maximum PWM resolution is 10 bits when PR2 is
255. The resolution is a function of the PR2 register
value as shown by Equation 25-4.
EQUATION 25-4: PWM RESOLUTION
TABLE 25-1: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz)
TABLE 25-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz)
Note: If the pulse width value is greater than the
period the assigned PWM pin(s) will
remain unchanged.
Resolution 4PR21+log
2log
------------------------------------------ bits=
PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17
Maximum Resolution (bits) 10 10 10 8 7 6.6
PWM Frequency 1.22 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0x65 0x65 0x65 0x19 0x0C 0x09
Maximum Resolution (bits) 8 8 8 6 5 5
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 263
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25.3.7 OPERATION IN SLEEP MODE
In Sleep mode, the TMR2 register will not increment
and the state of the module will not change. If the CCPx
pin is driving a value, it will continue to drive that value.
When the device wakes up, TMR2 will continue from its
previous state.
25.3.8 CHANGES IN SYSTEM CLOCK
FREQUENCY
The PWM frequency is derived from the system clock
frequency. Any changes in the system clock frequency
will result in changes to the PWM frequency. See
Section 6.0 “Oscillator Module (with Fail-Safe
Clock Monitor)” for additional details.
25.3.9 EFFECTS OF RESET
Any Reset will force all ports to Input mode and the
CCP registers to their Reset states.
TABLE 25-3: SUMMARY OF REGISTERS ASSOCIATED WITH STANDARD PWM
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
APFCON C2OUTSEL CC1PSEL SDOSEL SCKSEL SDISEL TXSEL RXSEL CCP2SEL 119
CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 264
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 84
PIE2 OSFIE C2IE C1IE EEIE BCL1IE —C3IE CCP2IE 86
PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 88
PIR2 OSFIF C2IF C1IF EEIF BCL1IF —C3IF CCP2IF 89
PR2 Timer2 Period Register 197*
T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> 199
TMR2 Timer2 Module Register 197
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 122
Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the PWM.
* Page provides register information.
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DS41579C-page 264 Preliminary 2011-2012 Microchip Technology Inc.
25.4 CCP Control Register
REGISTER 25-1: CCPxCON: CCPx CONTROL REGISTER
U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
—— DCxB<1:0> CCPxM<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 DCxB<1:0>: PWM Duty Cycle Least Significant bits
Capture mode:
Unused
Compare mode:
Unused
PWM mode:
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPRxL.
bit 3-0 CCPxM<3:0>: CCPx Mode Select bits
0000 = Capture/Compare/PWM off (resets CCPx module)
0001 = Reserved
0010 = Compare mode: toggle output on match
0011 =Reserved
0100 = Capture mode: every falling edge
0101 = Capture mode: every rising edge
0110 = Capture mode: every 4th rising edge
0111 = Capture mode: every 16th rising edge
1000 = Compare mode: set output on compare match (set CCPxIF)
1001 = Compare mode: clear output on compare match (set CCPxIF)
1010 = Compare mode: generate software interrupt only
1011 = Compare mode: Auto-conversion Trigger (sets CCPxIF bit (CCP2), starts A/D conversion if
A/D module is enabled)(1)
11xx =PWM mode
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 265
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26.0 MASTER SYNCHRONOUS
SERIAL PORT (MSSP)
MODULE
26.1 Master SSP (MSSP) Module
Overview
The Master Synchronous Serial Port (MSSP) module is
a serial interface useful for communicating with other
peripheral or microcontroller devices. These peripheral
devices may be serial EEPROMs, shift registers, dis-
play drivers, A/D converters, etc. The MSSP module
can operate in one of two modes:
• Serial Peripheral Interface (SPI)
• Inter-Integrated Circuit (I2C™)
The SPI interface supports the following modes and
features:
•Master mode
• Slave mode
• Clock Parity
• Slave Select Synchronization (Slave mode only)
• Daisy-chain connection of slave devices
Figure 26-1 is a block diagram of the SPI interface
module.
FIGURE 26-1: MSSP BLOCK DIAGRAM (SPI MODE)
( )
Read Write
Data Bus
SSPSR Reg
SSPM<3:0>
bit 0 Shift
Clock
SS Control
Enable
Edge
Select
Clock Select
TMR2 Output
2
Edge
Select
2 (CKP, CKE)
4
TRIS bit
SDO
SSPBUF Reg
SDI
SS
SCK TOSC
Prescaler
4, 16, 64
Baud Rate
Generator
(SSPADD)
PIC16(L)F1782/3
DS41579C-page 266 Preliminary 2011-2012 Microchip Technology Inc.
The I2C interface supports the following modes and
features:
•Master mode
• Slave mode
• Byte NACKing (Slave mode)
• Limited Multi-master support
• 7-bit and 10-bit addressing
• Start and Stop interrupts
• Interrupt masking
• Clock stretching
• Bus collision detection
• General call address matching
•Address masking
• Address Hold and Data Hold modes
• Selectable SDA hold times
Figure 26-2 is a block diagram of the I2C interface mod-
ule in Master mode. Figure 26-3 is a diagram of the I2C
interface module in Slave mode.
FIGURE 26-2: MSSP BLOCK DIAGRAM (I2C™ MASTER MODE)
Read Write
SSPSR
Start bit, Stop bit,
Start bit detect,
SSP1BUF
Internal
data bus
Set/Reset: S, P, SSPSTAT, WCOL, SSPOV
Shift
Clock
MSb LSb
SDA
Acknowledge
Generate (SSPCON2)
Stop bit detect
Write collision detect
Clock arbitration
State counter for
end of XMIT/RCV
SCL
SCL in
Bus Collision
SDA in
Receive Enable (RCEN)
Clock Cntl
Clock arbitrate/BCOL detect
(Hold off clock source)
[SSPM<3:0>]
Baud rate
Reset SEN, PEN (SSPCON2)
generator
(SSPADD)
Address Match detect
Set SSPIF, BCLIF
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 267
PIC16(L)F1782/3
FIGURE 26-3: MSSP BLOCK DIAGRAM (I2C™ SLAVE MODE)
Read Write
SSPSR Reg
Match Detect
SSPADD Reg
Start and
Stop bit Detect
SSPBUF Reg
Internal
Data Bus
Addr Match
Set, Reset
S, P bits
(SSPSTAT Reg)
SCL
SDA
Shift
Clock
MSb LSb
SSPMSK Reg
PIC16(L)F1782/3
DS41579C-page 268 Preliminary 2011-2012 Microchip Technology Inc.
26.2 SPI Mode Overview
The Serial Peripheral Interface (SPI) bus is a
synchronous serial data communication bus that
operates in Full-Duplex mode. Devices communicate
in a master/slave environment where the master device
initiates the communication. A slave device is
controlled through a Chip Select known as Slave
Select.
The SPI bus specifies four signal connections:
• Serial Clock (SCK)
• Serial Data Out (SDO)
• Serial Data In (SDI)
• Slave Select (SS)
Figure 26-1 shows the block diagram of the MSSP
module when operating in SPI mode.
The SPI bus operates with a single master device and
one or more slave devices. When multiple slave
devices are used, an independent Slave Select con-
nection is required from the master device to each
slave device.
Figure 26-4 shows a typical connection between a
master device and multiple slave devices.
The master selects only one slave at a time. Most slave
devices have tri-state outputs so their output signal
appears disconnected from the bus when they are not
selected.
Transmissions involve two shift registers, eight bits in
size, one in the master and one in the slave. With either
the master or the slave device, data is always shifted
out one bit at a time, with the Most Significant bit (MSb)
shifted out first. At the same time, a new Least
Significant bit (LSb) is shifted into the same register.
Figure 26-5 shows a typical connection between two
processors configured as master and slave devices.
Data is shifted out of both shift registers on the pro-
grammed clock edge and latched on the opposite edge
of the clock.
The master device transmits information out on its SDO
output pin which is connected to, and received by, the
slave’s SDI input pin. The slave device transmits infor-
mation out on its SDO output pin, which is connected
to, and received by, the master’s SDI input pin.
To begin communication, the master device first sends
out the clock signal. Both the master and the slave
devices should be configured for the same clock polar-
ity.
The master device starts a transmission by sending out
the MSb from its shift register. The slave device reads
this bit from that same line and saves it into the LSb
position of its shift register.
During each SPI clock cycle, a full-duplex data
transmission occurs. This means that while the master
device is sending out the MSb from its shift register (on
its SDO pin) and the slave device is reading this bit and
saving it as the LSb of its shift register, that the slave
device is also sending out the MSb from its shift register
(on its SDO pin) and the master device is reading this
bit and saving it as the LSb of its shift register.
After 8 bits have been shifted out, the master and slave
have exchanged register values.
If there is more data to exchange, the shift registers are
loaded with new data and the process repeats itself.
Whether the data is meaningful or not (dummy data),
depends on the application software. This leads to
three scenarios for data transmission:
• Master sends useful data and slave sends dummy
data.
• Master sends useful data and slave sends useful
data.
• Master sends dummy data and slave sends useful
data.
Transmissions may involve any number of clock
cycles. When there is no more data to be transmitted,
the master stops sending the clock signal and it dese-
lects the slave.
Every slave device connected to the bus that has not
been selected through its slave select line must disre-
gard the clock and transmission signals and must not
transmit out any data of its own.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 269
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FIGURE 26-4: SPI MASTER AND MULTIPLE SLAVE CONNECTION
26.2.1 SPI MODE REGISTERS
The MSSP module has five registers for SPI mode
operation. These are:
• MSSP STATUS register (SSPSTAT)
• MSSP Control register 1 (SSPCON1)
• MSSP Control register 3 (SSPCON3)
• MSSP Data Buffer register (SSPBUF)
• MSSP Address register (SSPADD)
• MSSP Shift register (SSPSR)
(Not directly accessible)
SSPCON1 and SSPSTAT are the control and STATUS
registers in SPI mode operation. The SSPCON1 regis-
ter is readable and writable. The lower 6 bits of the
SSPSTAT are read-only. The upper two bits of the
SSPSTAT are read/write.
In one SPI master mode, SSPADD can be loaded with
a value used in the Baud Rate Generator. More infor-
mation on the Baud Rate Generator is available in
Section 26.7 “Baud Rate Generator”.
SSPSR is the shift register used for shifting data in and
out. SSPBUF provides indirect access to the SSPSR
register. SSPBUF is the buffer register to which data
bytes are written, and from which data bytes are read.
In receive operations, SSPSR and SSPBUF together
create a buffered receiver. When SSPSR receives a
complete byte, it is transferred to SSPBUF and the
SSPIF interrupt is set.
During transmission, the SSPBUF is not buffered. A
write to SSPBUF will write to both SSPBUF and
SSPSR.
SPI Master SCK
SDO
SDI
General I/O
General I/O
General I/O
SCK
SDI
SDO
SS
SPI Slave
#1
SCK
SDI
SDO
SS
SPI Slave
#2
SCK
SDI
SDO
SS
SPI Slave
#3
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DS41579C-page 270 Preliminary 2011-2012 Microchip Technology Inc.
26.2.2 SPI MODE OPERATION
When initializing the SPI, several options need to be
specified. This is done by programming the appropriate
control bits (SSPCON1<5:0> and SSPSTAT<7:6>).
These control bits allow the following to be specified:
• Master mode (SCK is the clock output)
• Slave mode (SCK is the clock input)
• Clock Polarity (Idle state of SCK)
• Data Input Sample Phase (middle or end of data
output time)
• Clock Edge (output data on rising/falling edge of
SCK)
• Clock Rate (Master mode only)
• Slave Select mode (Slave mode only)
To enable the serial port, SSP Enable bit, SSPEN of the
SSPCON1 register, must be set. To reset or reconfig-
ure SPI mode, clear the SSPEN bit, re-initialize the
SSPCONx registers and then set the SSPEN bit. This
configures the SDI, SDO, SCK and SS pins as serial
port pins. For the pins to behave as the serial port func-
tion, some must have their data direction bits (in the
TRIS register) appropriately programmed as follows:
• SDI must have corresponding TRIS bit set
• SDO must have corresponding TRIS bit cleared
• SCK (Master mode) must have corresponding
TRIS bit cleared
• SCK (Slave mode) must have corresponding
TRIS bit set
•SS
must have corresponding TRIS bit set
Any serial port function that is not desired may be
overridden by programming the corresponding data
direction (TRIS) register to the opposite value.
The MSSP consists of a transmit/receive shift register
(SSPSR) and a buffer register (SSPBUF). The SSPSR
shifts the data in and out of the device, MSb first. The
SSPBUF holds the data that was written to the SSPSR
until the received data is ready. Once the 8 bits of data
have been received, that byte is moved to the SSPBUF
register. Then, the Buffer Full Detect bit, BF of the
SSPSTAT register, and the interrupt flag bit, SSPIF, are
set. This double-buffering of the received data
(SSPBUF) allows the next byte to start reception before
reading the data that was just received. Any write to the
SSPBUF register during transmission/reception of data
will be ignored and the write collision detect bit WCOL
of the SSPCON1 register, will be set. User software
must clear the WCOL bit to allow the following write(s)
to the SSPBUF register to complete successfully.
When the application software is expecting to receive
valid data, the SSPBUF should be read before the next
byte of data to transfer is written to the SSPBUF. The
Buffer Full bit, BF of the SSPSTAT register, indicates
when SSPBUF has been loaded with the received data
(transmission is complete). When the SSPBUF is read,
the BF bit is cleared. This data may be irrelevant if the
SPI is only a transmitter. Generally, the MSSP interrupt
is used to determine when the transmission/reception
has completed. If the interrupt method is not going to
be used, then software polling can be done to ensure
that a write collision does not occur.
The SSPSR is not directly readable or writable and can
only be accessed by addressing the SSPBUF register.
Additionally, the SSPSTAT register indicates the
various Status conditions.
FIGURE 26-5: SPI MASTER/SLAVE CONNECTION
Serial Input Buffer
(BUF)
Shift Register
(SSPSR)
MSb LSb
SDO
SDI
Processor 1
SCK
SPI Master SSPM<3:0> = 00xx
Serial Input Buffer
(SSPBUF)
Shift Register
(SSPSR)
LSb
MSb
SDI
SDO
Processor 2
SCK
SPI Slave SSPM<3:0> = 010x
Serial Clock
SS
Slave Select
General I/O (optional)
= 1010
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 271
PIC16(L)F1782/3
26.2.3 SPI MASTER MODE
The master can initiate the data transfer at any time
because it controls the SCK line. The master
determines when the slave (Processor 2, Figure 26-5)
is to broadcast data by the software protocol.
In Master mode, the data is transmitted/received as
soon as the SSPBUF register is written to. If the SPI is
only going to receive, the SDO output could be dis-
abled (programmed as an input). The SSPSR register
will continue to shift in the signal present on the SDI pin
at the programmed clock rate. As each byte is
received, it will be loaded into the SSPBUF register as
if a normal received byte (interrupts and Status bits
appropriately set).
The clock polarity is selected by appropriately
programming the CKP bit of the SSPCON1 register
and the CKE bit of the SSPSTAT register. This then,
would give waveforms for SPI communication as
shown in Figure 26-6, Figure 26-8 and Figure 26-9,
where the MSB is transmitted first. In Master mode, the
SPI clock rate (bit rate) is user programmable to be one
of the following:
•F
OSC/4 (or TCY)
•F
OSC/16 (or 4 * TCY)
•F
OSC/64 (or 16 * TCY)
• Timer2 output/2
• Fosc/(4 * (SSPADD + 1))
Figure 26-6 shows the waveforms for Master mode.
When the CKE bit is set, the SDO data is valid before
there is a clock edge on SCK. The change of the input
sample is shown based on the state of the SMP bit. The
time when the SSPBUF is loaded with the received
data is shown.
FIGURE 26-6: SPI MODE WAVEFORM (MASTER MODE)
SCK
(CKP = 0
SCK
(CKP = 1
SCK
(CKP = 0
SCK
(CKP = 1
4 Clock
Modes
Input
Sample
Input
Sample
SDI
bit 7 bit 0
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
bit 7
SDI
SSPIF
(SMP = 1)
(SMP = 0)
(SMP = 1)
CKE = 1)
CKE = 0)
CKE = 1)
CKE = 0)
(SMP = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
(CKE = 0)
(CKE = 1)
bit 0
PIC16(L)F1782/3
DS41579C-page 272 Preliminary 2011-2012 Microchip Technology Inc.
26.2.4 SPI SLAVE MODE
In Slave mode, the data is transmitted and received as
external clock pulses appear on SCK. When the last
bit is latched, the SSPIF interrupt flag bit is set.
Before enabling the module in SPI Slave mode, the clock
line must match the proper Idle state. The clock line can
be observed by reading the SCK pin. The Idle state is
determined by the CKP bit of the SSPCON1 register.
While in Slave mode, the external clock is supplied by
the external clock source on the SCK pin. This external
clock must meet the minimum high and low times as
specified in the electrical specifications.
While in Sleep mode, the slave can transmit/receive
data. The shift register is clocked from the SCK pin
input and when a byte is received, the device will gen-
erate an interrupt. If enabled, the device will wake-up
from Sleep.
26.2.4.1 Daisy-Chain Configuration
The SPI bus can sometimes be connected in a
daisy-chain configuration. The first slave output is con-
nected to the second slave input, the second slave
output is connected to the third slave input, and so on.
The final slave output is connected to the master input.
Each slave sends out, during a second group of clock
pulses, an exact copy of what was received during the
first group of clock pulses. The whole chain acts as
one large communication shift register. The
daisy-chain feature only requires a single Slave Select
line from the master device.
Figure 26-7 shows the block diagram of a typical
daisy-chain connection when operating in SPI Mode.
In a daisy-chain configuration, only the most recent
byte on the bus is required by the slave. Setting the
BOEN bit of the SSPCON3 register will enable writes
to the SSPBUF register, even if the previous byte has
not been read. This allows the software to ignore data
that may not apply to it.
26.2.5 SLAVE SELECT
SYNCHRONIZATION
The Slave Select can also be used to synchronize com-
munication. The Slave Select line is held high until the
master device is ready to communicate. When the
Slave Select line is pulled low, the slave knows that a
new transmission is starting.
If the slave fails to receive the communication properly,
it will be reset at the end of the transmission, when the
Slave Select line returns to a high state. The slave is
then ready to receive a new transmission when the
Slave Select line is pulled low again. If the Slave Select
line is not used, there is a risk that the slave will even-
tually become out of sync with the master. If the slave
misses a bit, it will always be one bit off in future trans-
missions. Use of the Slave Select line allows the slave
and master to align themselves at the beginning of
each transmission.
The SS pin allows a Synchronous Slave mode. The
SPI must be in Slave mode with SS pin control enabled
(SSPCON1<3:0> = 0100).
When the SS pin is low, transmission and reception are
enabled and the SDO pin is driven.
When the SS pin goes high, the SDO pin is no longer
driven, even if in the middle of a transmitted byte and
becomes a floating output. External pull-up/pull-down
resistors may be desirable depending on the applica-
tion.
When the SPI module resets, the bit counter is forced
to ‘0’. This can be done by either forcing the SS pin to
a high level or clearing the SSPEN bit.
Note 1: When the SPI is in Slave mode with SS pin
control enabled (SSPCON1<3:0> =
0100), the SPI module will reset if the SS
pin is set to VDD.
2: When the SPI is used in Slave mode with
CKE set; the user must enable SS pin
control.
3: While operated in SPI Slave mode the
SMP bit of the SSPSTAT register must
remain clear.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 273
PIC16(L)F1782/3
FIGURE 26-7: SPI DAISY-CHAIN CONNECTION
FIGURE 26-8: SLAVE SELECT SYNCHRONOUS WAVEFORM
SPI Master SCK
SDO
SDI
General I/O
SCK
SDI
SDO
SS
SPI Slave
#1
SCK
SDI
SDO
SS
SPI Slave
#2
SCK
SDI
SDO
SS
SPI Slave
#3
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI
bit 7
SDO bit 7 bit 6 bit 7
SSPIF
Interrupt
CKE = 0)
CKE = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SS
Flag
bit 0
bit 7
bit 0
bit 6
SSPBUF to
SSPSR
Shift register SSPSR
and bit count are reset
PIC16(L)F1782/3
DS41579C-page 274 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 26-9: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0)
FIGURE 26-10: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1)
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI
bit 7
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
SSPIF
Interrupt
CKE = 0)
CKE = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SS
Flag
Optional
bit 0
detection active
Write Collision
Valid
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI
bit 7 bit 0
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
SSPIF
Interrupt
CKE = 1)
CKE = 1)
Write to
SSPBUF
SSPSR to
SSPBUF
SS
Flag
Not Optional
Write Collision
detection active
Valid
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 275
PIC16(L)F1782/3
26.2.6 SPI OPERATION IN SLEEP MODE
In SPI Master mode, module clocks may be operating
at a different speed than when in Full-Power mode; in
the case of the Sleep mode, all clocks are halted.
Special care must be taken by the user when the MSSP
clock is much faster than the system clock.
In Slave mode, when MSSP interrupts are enabled,
after the master completes sending data, an MSSP
interrupt will wake the controller from Sleep.
If an exit from Sleep mode is not desired, MSSP inter-
rupts should be disabled.
In SPI Master mode, when the Sleep mode is selected,
all module clocks are halted and the transmis-
sion/reception will remain in that state until the device
wakes. After the device returns to Run mode, the mod-
ule will resume transmitting and receiving data.
In SPI Slave mode, the SPI Transmit/Receive Shift
register operates asynchronously to the device. This
allows the device to be placed in Sleep mode and data
to be shifted into the SPI Transmit/Receive Shift
register. When all 8 bits have been received, the MSSP
interrupt flag bit will be set and if enabled, will wake the
device.
TABLE 26-1: SUMMARY OF REGISTERS ASSOCIATED WITH SPI OPERATION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELA ANSA7 — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 123
APFCON C2OUTSEL CCP1SEL SDOSEL SCKSEL SDISEL TXSEL RXSEL CCP2SEL 119
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 85
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 88
SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register 269*
SSPCON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 313
SSPCON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 315
SSPSTAT SMP CKE D/A P S R/W UA BF 312
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 122
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISA0 133
Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the MSSP in SPI mode.
* Page provides register information.
Note 1: PIC16(L)F1783 only.
PIC16(L)F1782/3
DS41579C-page 276 Preliminary 2011-2012 Microchip Technology Inc.
26.3 I2C MODE OVERVIEW
The Inter-Integrated Circuit Bus (I2C) is a multi-master
serial data communication bus. Devices communicate
in a master/slave environment where the master
devices initiate the communication. A Slave device is
controlled through addressing.
The I2C bus specifies two signal connections:
• Serial Clock (SCL)
• Serial Data (SDA)
Figure 26-11 shows the block diagram of the MSSP
module when operating in I2C mode.
Both the SCL and SDA connections are bidirectional
open-drain lines, each requiring pull-up resistors for the
supply voltage. Pulling the line to ground is considered
a logical zero and letting the line float is considered a
logical one.
Figure 26-11 shows a typical connection between two
processors configured as master and slave devices.
The I2C bus can operate with one or more master
devices and one or more slave devices.
There are four potential modes of operation for a given
device:
• Master Transmit mode
(master is transmitting data to a slave)
• Master Receive mode
(master is receiving data from a slave)
•Slave Transmit mode
(slave is transmitting data to a master)
• Slave Receive mode
(slave is receiving data from the master)
To begin communication, a master device starts out in
Master Transmit mode. The master device sends out a
Start bit followed by the address byte of the slave it
intends to communicate with. This is followed by a sin-
gle Read/Write bit, which determines whether the mas-
ter intends to transmit to or receive data from the slave
device.
If the requested slave exists on the bus, it will respond
with an Acknowledge bit, otherwise known as an ACK.
The master then continues in either Transmit mode or
Receive mode and the slave continues in the comple-
ment, either in Receive mode or Transmit mode,
respectively.
A Start bit is indicated by a high-to-low transition of the
SDA line while the SCL line is held high. Address and
data bytes are sent out, Most Significant bit (MSb) first.
The Read/Write bit is sent out as a logical one when the
master intends to read data from the slave, and is sent
out as a logical zero when it intends to write data to the
slave.
FIGURE 26-11: I2C MASTER/
SLAVE CONNECTION
The Acknowledge bit (ACK) is an active-low signal,
which holds the SDA line low to indicate to the transmit-
ter that the slave device has received the transmitted
data and is ready to receive more.
The transition of a data bit is always performed while
the SCL line is held low. Transitions that occur while the
SCL line is held high are used to indicate Start and Stop
bits.
If the master intends to write to the slave, then it repeat-
edly sends out a byte of data, with the slave responding
after each byte with an ACK bit. In this example, the
master device is in Master Transmit mode and the
slave is in Slave Receive mode.
If the master intends to read from the slave, then it
repeatedly receives a byte of data from the slave, and
responds after each byte with an ACK bit. In this exam-
ple, the master device is in Master Receive mode and
the slave is Slave Transmit mode.
On the last byte of data communicated, the master
device may end the transmission by sending a Stop bit.
If the master device is in Receive mode, it sends the
Stop bit in place of the last ACK bit. A Stop bit is indi-
cated by a low-to-high transition of the SDA line while
the SCL line is held high.
In some cases, the master may want to maintain con-
trol of the bus and re-initiate another transmission. If
so, the master device may send another Start bit in
place of the Stop bit or last ACK bit when it is in receive
mode.
The I2C bus specifies three message protocols;
• Single message where a master writes data to a
slave.
• Single message where a master reads data from
a slave.
• Combined message where a master initiates a
minimum of two writes, or two reads, or a
combination of writes and reads, to one or more
slaves.
Master
SCL
SDA
SCL
SDA
Slave
VDD
VDD
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When one device is transmitting a logical one, or letting
the line float, and a second device is transmitting a log-
ical zero, or holding the line low, the first device can
detect that the line is not a logical one. This detection,
when used on the SCL line, is called clock stretching.
Clock stretching gives slave devices a mechanism to
control the flow of data. When this detection is used on
the SDA line, it is called arbitration. Arbitration ensures
that there is only one master device communicating at
any single time.
26.3.1 CLOCK STRETCHING
When a slave device has not completed processing
data, it can delay the transfer of more data through the
process of clock stretching. An addressed slave device
may hold the SCL clock line low after receiving or send-
ing a bit, indicating that it is not yet ready to continue.
The master that is communicating with the slave will
attempt to raise the SCL line in order to transfer the
next bit, but will detect that the clock line has not yet
been released. Because the SCL connection is
open-drain, the slave has the ability to hold that line low
until it is ready to continue communicating.
Clock stretching allows receivers that cannot keep up
with a transmitter to control the flow of incoming data.
26.3.2 ARBITRATION
Each master device must monitor the bus for Start and
Stop bits. If the device detects that the bus is busy, it
cannot begin a new message until the bus returns to an
Idle state.
However, two master devices may try to initiate a trans-
mission on or about the same time. When this occurs,
the process of arbitration begins. Each transmitter
checks the level of the SDA data line and compares it
to the level that it expects to find. The first transmitter to
observe that the two levels do not match, loses arbitra-
tion, and must stop transmitting on the SDA line.
For example, if one transmitter holds the SDA line to a
logical one (lets it float) and a second transmitter holds
it to a logical zero (pulls it low), the result is that the
SDA line will be low. The first transmitter then observes
that the level of the line is different than expected and
concludes that another transmitter is communicating.
The first transmitter to notice this difference is the one
that loses arbitration and must stop driving the SDA
line. If this transmitter is also a master device, it also
must stop driving the SCL line. It then can monitor the
lines for a Stop condition before trying to reissue its
transmission. In the meantime, the other device that
has not noticed any difference between the expected
and actual levels on the SDA line continues with its
original transmission. It can do so without any compli-
cations, because so far, the transmission appears
exactly as expected with no other transmitter disturbing
the message.
Slave Transmit mode can also be arbitrated, when a
master addresses multiple slaves, but this is less com-
mon.
If two master devices are sending a message to two dif-
ferent slave devices at the address stage, the master
sending the lower slave address always wins arbitra-
tion. When two master devices send messages to the
same slave address, and addresses can sometimes
refer to multiple slaves, the arbitration process must
continue into the data stage.
Arbitration usually occurs very rarely, but it is a neces-
sary process for proper multi-master support.
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26.4 I2C MODE OPERATION
All MSSP I2C communication is byte oriented and
shifted out MSb first. Six SFR registers and 2 interrupt
flags interface the module with the PIC® microcon-
troller and user software. Two pins, SDA and SCL, are
exercised by the module to communicate with other
external I2C devices.
26.4.1 BYTE FORMAT
All communication in I2C is done in 9-bit segments. A
byte is sent from a master to a slave or vice-versa, fol-
lowed by an Acknowledge bit sent back. After the 8th
falling edge of the SCL line, the device outputting data
on the SDA changes that pin to an input and reads in
an acknowledge value on the next clock pulse.
The clock signal, SCL, is provided by the master. Data
is valid to change while the SCL signal is low, and
sampled on the rising edge of the clock. Changes on
the SDA line while the SCL line is high define special
conditions on the bus, explained below.
26.4.2 DEFINITION OF I2C TERMINOLOGY
There is language and terminology in the description
of I2C communication that have definitions specific to
I2C. That word usage is defined below and may be
used in the rest of this document without explanation.
This table was adapted from the Philips I2C
specification.
26.4.3 SDA AND SCL PINS
Selection of any I2C mode with the SSPEN bit set,
forces the SCL and SDA pins to be open-drain. These
pins should be set by the user to inputs by setting the
appropriate TRIS bits.
26.4.4 SDA HOLD TIME
The hold time of the SDA pin is selected by the SDAHT
bit of the SSPCON3 register. Hold time is the time SDA
is held valid after the falling edge of SCL. Setting the
SDAHT bit selects a longer 300 ns minimum hold time
and may help on buses with large capacitance.
TABLE 26-2: I2C BUS TERMS
Note: Data is tied to output zero when an I2C
mode is enabled.
TERM Description
Transmitter The device which shifts data out
onto the bus.
Receiver The device which shifts data in
from the bus.
Master The device that initiates a transfer,
generates clock signals and termi-
nates a transfer.
Slave The device addressed by the mas-
ter.
Multi-master A bus with more than one device
that can initiate data transfers.
Arbitration Procedure to ensure that only one
master at a time controls the bus.
Winning arbitration ensures that
the message is not corrupted.
Synchronization Procedure to synchronize the
clocks of two or more devices on
the bus.
Idle No master is controlling the bus,
and both SDA and SCL lines are
high.
Active Any time one or more master
devices are controlling the bus.
Addressed
Slave
Slave device that has received a
matching address and is actively
being clocked by a master.
Matching
Address
Address byte that is clocked into a
slave that matches the value
stored in SSPADD.
Write Request Slave receives a matching
address with R/W bit clear, and is
ready to clock in data.
Read Request Master sends an address byte with
the R/W bit set, indicating that it
wishes to clock data out of the
Slave. This data is the next and all
following bytes until a Restart or
Stop.
Clock Stretching When a device on the bus hold
SCL low to stall communication.
Bus Collision Any time the SDA line is sampled
low by the module while it is out-
putting and expected high state.
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26.4.5 START CONDITION
The I2C specification defines a Start condition as a
transition of SDA from a high to a low state while SCL
line is high. A Start condition is always generated by
the master and signifies the transition of the bus from
an Idle to an Active state. Figure 26-10 shows wave
forms for Start and Stop conditions.
A bus collision can occur on a Start condition if the
module samples the SDA line low before asserting it
low. This does not conform to the I2C Specification that
states no bus collision can occur on a Start.
26.4.6 STOP CONDITION
A Stop condition is a transition of the SDA line from
low-to-high state while the SCL line is high.
26.4.7 RESTART CONDITION
A Restart is valid any time that a Stop would be valid.
A master can issue a Restart if it wishes to hold the
bus after terminating the current transfer. A Restart
has the same effect on the slave that a Start would,
resetting all slave logic and preparing it to clock in an
address. The master may want to address the same or
another slave.
In 10-bit Addressing Slave mode a Restart is required
for the master to clock data out of the addressed
slave. Once a slave has been fully addressed, match-
ing both high and low address bytes, the master can
issue a Restart and the high address byte with the
R/W bit set. The slave logic will then hold the clock
and prepare to clock out data.
After a full match with R/W clear in 10-bit mode, a prior
match flag is set and maintained. Until a Stop condi-
tion, a high address with R/W clear, or high address
match fails.
26.4.8 START/STOP CONDITION INTERRUPT
MASKING
The SCIE and PCIE bits of the SSPCON3 register can
enable the generation of an interrupt in Slave modes
that do not typically support this function. Slave modes
where interrupt on Start and Stop detect are already
enabled, these bits will have no effect.
FIGURE 26-12: I2C START AND STOP CONDITIONS
FIGURE 26-13: I2C RESTART CONDITION
Note: At least one SCL low time must appear
before a Stop is valid, therefore, if the SDA
line goes low then high again while the SCL
line stays high, only the Start condition is
detected.
SDA
SCL
P
Stop
Condition
S
Start
Condition
Change of
Data Allowed
Change of
Data Allowed
Restart
Condition
Sr
Change of
Data Allowed
Change of
Data Allowed
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26.4.9 ACKNOWLEDGE SEQUENCE
The 9th SCL pulse for any transferred byte in I2C is
dedicated as an Acknowledge. It allows receiving
devices to respond back to the transmitter by pulling
the SDA line low. The transmitter must release control
of the line during this time to shift in the response. The
Acknowledge (ACK) is an active-low signal, pulling the
SDA line low indicated to the transmitter that the
device has received the transmitted data and is ready
to receive more.
The result of an ACK is placed in the ACKSTAT bit of
the SSPCON2 register.
Slave software, when the AHEN and DHEN bits are
set, allow the user to set the ACK value sent back to
the transmitter. The ACKDT bit of the SSPCON2 regis-
ter is set/cleared to determine the response.
Slave hardware will generate an ACK response if the
AHEN and DHEN bits of the SSPCON3 register are
clear.
There are certain conditions where an ACK will not be
sent by the slave. If the BF bit of the SSPSTAT register
or the SSPOV bit of the SSPCON1 register are set
when a byte is received.
When the module is addressed, after the 8th falling
edge of SCL on the bus, the ACKTIM bit of the
SSPCON3 register is set. The ACKTIM bit indicates
the acknowledge time of the active bus. The ACKTIM
Status bit is only active when the AHEN bit or DHEN
bit is enabled.
26.5 I2C SLAVE MODE OPERATION
The MSSP Slave mode operates in one of four modes
selected in the SSPM bits of SSPCON1 register. The
modes can be divided into 7-bit and 10-bit Addressing
mode. 10-bit Addressing modes operate the same as
7-bit with some additional overhead for handling the
larger addresses.
Modes with Start and Stop bit interrupts operated the
same as the other modes with SSPIF additionally get-
ting set upon detection of a Start, Restart, or Stop
condition.
26.5.1 SLAVE MODE ADDRESSES
The SSPADD register (Register 26-6) contains the
Slave mode address. The first byte received after a
Start or Restart condition is compared against the
value stored in this register. If the byte matches, the
value is loaded into the SSPBUF register and an inter-
rupt is generated. If the value does not match, the
module goes idle and no indication is given to the soft-
ware that anything happened.
The SSP Mask register (Register 26-5) affects the
address matching process. See Section 26.5.9 “SSP
Mask Register” for more information.
26.5.1.1 I2C Slave 7-bit Addressing Mode
In 7-bit Addressing mode, the LSb of the received data
byte is ignored when determining if there is an address
match.
26.5.1.2 I2C Slave 10-bit Addressing Mode
In 10-bit Addressing mode, the first received byte is
compared to the binary value of ‘1 1 1 1 0 A9 A8 0’. A9
and A8 are the two MSb of the 10-bit address and
stored in bits 2 and 1 of the SSPADD register.
After the acknowledge of the high byte the UA bit is set
and SCL is held low until the user updates SSPADD
with the low address. The low address byte is clocked
in and all 8 bits are compared to the low address value
in SSPADD. Even if there is not an address match;
SSPIF and UA are set, and SCL is held low until
SSPADD is updated to receive a high byte again.
When SSPADD is updated the UA bit is cleared. This
ensures the module is ready to receive the high
address byte on the next communication.
A high and low address match as a write request is
required at the start of all 10-bit addressing communi-
cation. A transmission can be initiated by issuing a
Restart once the slave is addressed, and clocking in
the high address with the R/W bit set. The slave hard-
ware will then acknowledge the read request and pre-
pare to clock out data. This is only valid for a slave
after it has received a complete high and low address
byte match.
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26.5.2 SLAVE RECEPTION
When the R/W bit of a matching received address byte
is clear, the R/W bit of the SSPSTAT register is cleared.
The received address is loaded into the SSPBUF reg-
ister and acknowledged.
When the overflow condition exists for a received
address, then not Acknowledge is given. An overflow
condition is defined as either bit BF of the SSPSTAT
register is set, or bit SSPOV of the SSPCON1 register
is set. The BOEN bit of the SSPCON3 register modifies
this operation. For more information see Register 26-4.
An MSSP interrupt is generated for each transferred
data byte. Flag bit, SSPIF, must be cleared by software.
When the SEN bit of the SSPCON2 register is set, SCL
will be held low (clock stretch) following each received
byte. The clock must be released by setting the CKP
bit of the SSPCON1 register, except sometimes in
10-bit mode. See Section 26.2.3 “SPI Master Mode”
for more detail.
26.5.2.1 7-bit Addressing Reception
This section describes a standard sequence of events
for the MSSP module configured as an I2C Slave in
7-bit Addressing mode. All decisions made by hard-
ware or software and their effect on reception.
Figure 26-13 and Figure 26-14 is used as a visual
reference for this description.
This is a step by step process of what typically must
be done to accomplish I2C communication.
1. Start bit detected.
2. S bit of SSPSTAT is set; SSPIF is set if interrupt
on Start detect is enabled.
3. Matching address with R/W bit clear is received.
4. The slave pulls SDA low sending an ACK to the
master, and sets SSPIF bit.
5. Software clears the SSPIF bit.
6. Software reads received address from SSPBUF
clearing the BF flag.
7. If SEN = 1; Slave software sets CKP bit to
release the SCL line.
8. The master clocks out a data byte.
9. Slave drives SDA low sending an ACK to the
master, and sets SSPIF bit.
10. Software clears SSPIF.
11. Software reads the received byte from SSPBUF
clearing BF.
12. Steps 8-12 are repeated for all received bytes
from the master.
13. Master sends Stop condition, setting P bit of
SSPSTAT, and the bus goes idle.
26.5.2.2 7-bit Reception with AHEN and DHEN
Slave device reception with AHEN and DHEN set
operate the same as without these options with extra
interrupts and clock stretching added after the 8th fall-
ing edge of SCL. These additional interrupts allow the
slave software to decide whether it wants to ACK the
receive address or data byte, rather than the hard-
ware. This functionality adds support for PMBus™ that
was not present on previous versions of this module.
This list describes the steps that need to be taken by
slave software to use these options for I2C communi-
cation. Figure 26-15 displays a module using both
address and data holding. Figure 26-16 includes the
operation with the SEN bit of the SSPCON2 register
set.
1. S bit of SSPSTAT is set; SSPIF is set if interrupt
on Start detect is enabled.
2. Matching address with R/W bit clear is clocked
in. SSPIF is set and CKP cleared after the 8th
falling edge of SCL.
3. Slave clears the SSPIF.
4. Slave can look at the ACKTIM bit of the
SSPCON3 register to determine if the SSPIF
was after or before the ACK.
5. Slave reads the address value from SSPBUF,
clearing the BF flag.
6. Slave sets ACK value clocked out to the master
by setting ACKDT.
7. Slave releases the clock by setting CKP.
8. SSPIF is set after an ACK, not after a NACK.
9. If SEN = 1 the slave hardware will stretch the
clock after the ACK.
10. Slave clears SSPIF.
11. SSPIF set and CKP cleared after 8th falling
edge of SCL for a received data byte.
12. Slave looks at ACKTIM bit of SSPCON3 to
determine the source of the interrupt.
13. Slave reads the received data from SSPBUF
clearing BF.
14. Steps 7-14 are the same for each received data
byte.
15. Communication is ended by either the slave
sending an ACK =1, or the master sending a
Stop condition. If a Stop is sent and Interrupt on
Stop Detect is disabled, the slave will only know
by polling the P bit of the SSTSTAT register.
Note: SSPIF is still set after the 9th falling edge of
SCL even if there is no clock stretching and
BF has been cleared. Only if NACK is sent
to master is SSPIF not set
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FIGURE 26-14: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 0, DHEN = 0)
Receiving Address
ACK
Receiving Data
ACK
Receiving Data ACK =1
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
SDA
SCL
SSPIF
BF
SSPOV
12345678 12345678 12345678
999
ACK is not sent.
SSPOV set because
SSPBUF is still full.
Cleared by software
First byte
of data is
available
in SSPBUF
SSPBUF is read
SSPIF set on 9th
falling edge of
SCL
Cleared by software
P
Bus Master sends
Stop condition
S
From Slave to Master
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FIGURE 26-15: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0)
SEN SEN
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0SDA
SCL 123456789 123456789 123456789 P
SSPIF set on 9th
SCL is not held
CKP is written to ‘1’ in software,
CKP is written to ‘1’ in software,
ACK
low because
falling edge of SCL
releasing SCL
ACK is not sent.
Bus Master sends
CKP
SSPOV
BF
SSPIF
SSPOV set because
SSPBUF is still full.
Cleared by software
First byte
of data is
available
in SSPBUF
ACK=1
Cleared by software
SSPBUF is read
Clock is held low until CKP is set to ‘1’
releasing SCL
Stop condition
S
ACK
ACK
Receive Address Receive Data Receive Data
R/W=0
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FIGURE 26-16: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 1)
Receiving Address Receiving Data Received Data
P
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
SDA
SCL
BF
CKP
S
P
12 3 4 567 8 912345678 9
12345678
Master sends
Stop condition
S
Data is read from SSPBUF
Cleared by software
SSPIF is set on
9th falling edge of
SCL, after ACK
CKP set by software,
SCL is released
Slave software
9
ACKTIM cleared by
hardware in 9th
rising edge of SCL
sets ACKDT to
not ACK
When DHEN=1:
CKP is cleared by
hardware on 8th falling
edge of SCL
Slave software
clears ACKDT to
ACK the received
byte
ACKTIM set by hardware
on 8th falling edge of SCL
When AHEN=1:
CKP is cleared by hardware
and SCL is stretched
Address is
read from
SSBUF
ACKTIM set by hardware
on 8th falling edge of SCL
ACK
Master Releases SDA
to slave for ACK sequence
No interrupt
after not ACK
from Slave
ACK=1
ACK
ACKDT
ACKTIM
SSPIF
If AHEN = 1:
SSPIF is set
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FIGURE 26-17: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 1, DHEN = 1)
Receiving Address Receive Data Receive Data
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
SDA
SCL
SSPIF
BF
ACKDT
CKP
S
P
ACK
S12
345678 912
34567 8 9 1234567 8 9
ACK
ACK
Cleared by software
ACKTIM is cleared by hardware
SSPBUF can be
Set by software,
read any time before
next byte is loaded
release SCL
on 9th rising edge of SCL
Received
address is loaded into
SSPBUF
Slave software clears
ACKDT to ACK
R/W = 0Master releases
SDA to slave for ACK sequence
the received byte
When AHEN = 1;
on the 8th falling edge
of SCL of an address
byte, CKP is cleared
ACKTIM is set by hardware
on 8th falling edge of SCL
When DHEN = 1;
on the 8th falling edge
of SCL of a received
data byte, CKP is cleared
Received data is
available on SSPBUF
Slave sends
not ACK
CKP is not cleared
if not ACK
P
Master sends
Stop condition
No interrupt after
if not ACK
from Slave
ACKTIM
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26.5.3 SLAVE TRANSMISSION
When the R/W bit of the incoming address byte is set
and an address match occurs, the R/W bit of the
SSPSTAT register is set. The received address is
loaded into the SSPBUF register, and an ACK pulse is
sent by the slave on the ninth bit.
Following the ACK, slave hardware clears the CKP bit
and the SCL pin is held low (see Section 26.5.6
“Clock Stretching” for more detail). By stretching the
clock, the master will be unable to assert another clock
pulse until the slave is done preparing the transmit
data.
The transmit data must be loaded into the SSPBUF
register which also loads the SSPSR register. Then the
SCL pin should be released by setting the CKP bit of
the SSPCON1 register. The eight data bits are shifted
out on the falling edge of the SCL input. This ensures
that the SDA signal is valid during the SCL high time.
The ACK pulse from the master-receiver is latched on
the rising edge of the ninth SCL input pulse. This ACK
value is copied to the ACKSTAT bit of the SSPCON2
register. If ACKSTAT is set (not ACK), then the data
transfer is complete. In this case, when the not ACK is
latched by the slave, the slave goes idle and waits for
another occurrence of the Start bit. If the SDA line was
low (ACK), the next transmit data must be loaded into
the SSPBUF register. Again, the SCL pin must be
released by setting bit CKP.
An MSSP interrupt is generated for each data transfer
byte. The SSPIF bit must be cleared by software and
the SSPSTAT register is used to determine the status
of the byte. The SSPIF bit is set on the falling edge of
the ninth clock pulse.
26.5.3.1 Slave Mode Bus Collision
A slave receives a Read request and begins shifting
data out on the SDA line. If a bus collision is detected
and the SBCDE bit of the SSPCON3 register is set, the
BCLIF bit of the PIR register is set. Once a bus collision
is detected, the slave goes idle and waits to be
addressed again. User software can use the BCLIF bit
to handle a slave bus collision.
26.5.3.2 7-bit Transmission
A master device can transmit a read request to a
slave, and then clock data out of the slave. The list
below outlines what software for a slave will need to
do to accomplish a standard transmission.
Figure 26-17 can be used as a reference to this list.
1. Master sends a Start condition on SDA and
SCL.
2. S bit of SSPSTAT is set; SSPIF is set if interrupt
on Start detect is enabled.
3. Matching address with R/W bit set is received by
the Slave setting SSPIF bit.
4. Slave hardware generates an ACK and sets
SSPIF.
5. SSPIF bit is cleared by user.
6. Software reads the received address from
SSPBUF, clearing BF.
7. R/W is set so CKP was automatically cleared
after the ACK.
8. The slave software loads the transmit data into
SSPBUF.
9. CKP bit is set releasing SCL, allowing the mas-
ter to clock the data out of the slave.
10. SSPIF is set after the ACK response from the
master is loaded into the ACKSTAT register.
11. SSPIF bit is cleared.
12. The slave software checks the ACKSTAT bit to
see if the master wants to clock out more data.
13. Steps 9-13 are repeated for each transmitted
byte.
14. If the master sends a not ACK; the clock is not
held, but SSPIF is still set.
15. The master sends a Restart condition or a Stop.
16. The slave is no longer addressed.
Note 1: If the master ACKs the clock will be
stretched.
2: ACKSTAT is the only bit updated on the
rising edge of SCL (9th) rather than the
falling.
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FIGURE 26-18: I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 0)
Receiving Address Automatic Transmitting Data Automatic Transmitting Data
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
SDA
SCL
SSPIF
BF
CKP
ACKSTAT
R/W
D/A
S
P
Received address
When R/W is set
R/W is copied from the
Indicates an address
is read from SSPBUF
SCL is always
held low after 9th SCL
falling edge
matching address byte
has been received
Masters not ACK
is copied to
ACKSTAT
CKP is not
held for not
ACK
BF is automatically
cleared after 8th falling
edge of SCL
Data to transmit is
loaded into SSPBUF
Set by software
Cleared by software
ACK
ACK
ACK
R/W = 1
SP
Master sends
Stop condition
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26.5.3.3 7-bit Transmission with Address
Hold Enabled
Setting the AHEN bit of the SSPCON3 register
enables additional clock stretching and interrupt gen-
eration after the 8th falling edge of a received match-
ing address. Once a matching address has been
clocked in, CKP is cleared and the SSPIF interrupt is
set.
Figure 26-18 displays a standard waveform of a 7-bit
Address Slave Transmission with AHEN enabled.
1. Bus starts Idle.
2. Master sends Start condition; the S bit of SSP-
STAT is set; SSPIF is set if interrupt on Start
detect is enabled.
3. Master sends matching address with R/W bit
set. After the 8th falling edge of the SCL line the
CKP bit is cleared and SSPIF interrupt is gener-
ated.
4. Slave software clears SSPIF.
5. Slave software reads ACKTIM bit of SSPCON3
register, and R/W and D/A of the SSPSTAT reg-
ister to determine the source of the interrupt.
6. Slave reads the address value from the
SSPBUF register clearing the BF bit.
7. Slave software decides from this information if it
wishes to ACK or not ACK and sets the ACKDT
bit of the SSPCON2 register accordingly.
8. Slave sets the CKP bit releasing SCL.
9. Master clocks in the ACK value from the slave.
10. Slave hardware automatically clears the CKP bit
and sets SSPIF after the ACK if the R/W bit is
set.
11. Slave software clears SSPIF.
12. Slave loads value to transmit to the master into
SSPBUF setting the BF bit.
13. Slave sets the CKP bit releasing the clock.
14. Master clocks out the data from the slave and
sends an ACK value on the 9th SCL pulse.
15. Slave hardware copies the ACK value into the
ACKSTAT bit of the SSPCON2 register.
16. Steps 10-15 are repeated for each byte transmit-
ted to the master from the slave.
17. If the master sends a not ACK the slave
releases the bus allowing the master to send a
Stop and end the communication.
Note: SSPBUF cannot be loaded until after the
ACK.
Note: Master must send a not ACK on the last
byte to ensure that the slave releases the
SCL line to receive a Stop.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 289
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FIGURE 26-19: I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 1)
Receiving Address Automatic Transmitting Data Automatic Transmitting Data
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
SDA
SCL
SSPIF
BF
ACKDT
ACKSTAT
CKP
R/W
D/A
Received address
is read from SSPBUF
BF is automatically
cleared after 8th falling
edge of SCL
Data to transmit is
loaded into SSPBUF
Cleared by software
Slave clears
ACKDT to ACK
address
Master’s ACK
response is copied
to SSPSTAT
CKP not cleared
after not ACK
Set by software,
releases SCL
ACKTIM is cleared
on 9th rising edge of SCL
ACKTIM is set on 8th falling
edge of SCL
When AHEN = 1;
CKP is cleared by hardware
after receiving matching
address.
When R/W = 1;
CKP is always
cleared after ACK
SP
Master sends
Stop condition
ACK
R/W = 1
Master releases SDA
to slave for ACK sequence
ACK
ACK
ACKTIM
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26.5.4 SLAVE MODE 10-BIT ADDRESS
RECEPTION
This section describes a standard sequence of events
for the MSSP module configured as an I2C slave in
10-bit Addressing mode.
Figure 26-19 is used as a visual reference for this
description.
This is a step by step process of what must be done by
slave software to accomplish I2C communication.
1. Bus starts Idle.
2. Master sends Start condition; S bit of SSPSTAT
is set; SSPIF is set if interrupt on Start detect is
enabled.
3. Master sends matching high address with R/W
bit clear; UA bit of the SSPSTAT register is set.
4. Slave sends ACK and SSPIF is set.
5. Software clears the SSPIF bit.
6. Software reads received address from SSPBUF
clearing the BF flag.
7. Slave loads low address into SSPADD,
releasing SCL.
8. Master sends matching low address byte to the
slave; UA bit is set.
9. Slave sends ACK and SSPIF is set.
10. Slave clears SSPIF.
11. Slave reads the received matching address
from SSPBUF clearing BF.
12. Slave loads high address into SSPADD.
13. Master clocks a data byte to the slave and
clocks out the slaves ACK on the 9th SCL pulse;
SSPIF is set.
14. If SEN bit of SSPCON2 is set, CKP is cleared by
hardware and the clock is stretched.
15. Slave clears SSPIF.
16. Slave reads the received byte from SSPBUF
clearing BF.
17. If SEN is set the slave sets CKP to release the
SCL.
18. Steps 13-17 repeat for each received byte.
19. Master sends Stop to end the transmission.
26.5.5 10-BIT ADDRESSING WITH ADDRESS OR
DATA HOLD
Reception using 10-bit addressing with AHEN or
DHEN set is the same as with 7-bit modes. The only
difference is the need to update the SSPADD register
using the UA bit. All functionality, specifically when the
CKP bit is cleared and SCL line is held low are the
same. Figure 26-20 can be used as a reference of a
slave in 10-bit addressing with AHEN set.
Figure 26-21 shows a standard waveform for a slave
transmitter in 10-bit Addressing mode.
Note: Updates to the SSPADD register are not
allowed until after the ACK sequence.
Note: If the low address does not match, SSPIF
and UA are still set so that the slave soft-
ware can set SSPADD back to the high
address. BF is not set because there is no
match. CKP is unaffected.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 291
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FIGURE 26-20: I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0)
SSPIF
Receive First Address Byte
ACK
Receive Second Address Byte
ACK
Receive Data
ACK
Receive Data
ACK
11110
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
SDA
SCL
UA
CKP
12345678912345678
912345678
9123456789P
Master sends
Stop condition
Cleared by software
Receive address is
Software updates SSPADD
Data is read
SCL is held low
Set by software,
while CKP =
0
from SSPBUF
releasing SCL
When SEN =
1
;
CKP is cleared after
9th falling edge of received byte
read from SSPBUF
and releases SCL
When UA =
1
;
If address matches
Set by hardware
on 9th falling edge
SSPADD it is loaded into
SSPBUF
SCL is held low
S
BF
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FIGURE 26-21: I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 0)
Receive First Address Byte
UA
Receive Second Address Byte
UA
Receive Data
ACK
Receive Data
1 1 1 1 0
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5SDA
SCL
SSPIF
BF
ACKDT
UA
CKP
ACKTIM
12345678 9
S
ACK
ACK
12345678 91234567891
2
SSPBUF
is read from
Received data
SSPBUF can be
read anytime before
the next received byte
Cleared by software
falling edge of SCL
not allowed until 9th
Update to SSPADD is
Set CKP with software
releases SCL
SCL
clears UA and releases
Update of SSPADD,
Set by hardware
on 9th falling edge
Slave software clears
ACKDT to ACK
the received byte
If when AHEN = 1;
on the 8th falling edge
of SCL of an address
byte, CKP is cleared
ACKTIM is set by hardware
on 8th falling edge of SCL
Cleared by software
R/W = 0
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FIGURE 26-22: I2C SLAVE, 10-BIT ADDRESS, TRANSMISSION (SEN = 0, AHEN = 0, DHEN = 0)
Receiving Address
ACK
Receiving Second Address Byte
Sr
Receive First Address Byte
ACK
Transmitting Data Byte
1 1 1 1 0
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
1 1 1 1 0
A9 A8 D7 D6 D5 D4 D3 D2 D1 D0SDA
SCL
SSPIF
BF
UA
CKP
R/W
D/A
123456789 123456789 123 456789 123456789
ACK = 1
P
Master sends
Stop condition
Master sends
not ACK
Master sends
Restart event
ACK
R/W = 0
S
Cleared by software
After SSPADD is
updated, UA is cleared
and SCL is released
High address is loaded
Received address is Data to transmit is
Set by software
Indicates an address
When R/W = 1;
R/W is copied from the
Set by hardware
UA indicates SSPADD
SSPBUF loaded
with received address
must be updated
has been received
loaded into SSPBUF
releases SCL
Masters not ACK
is copied
matching address byte
CKP is cleared on
9th falling edge of SCL
read from SSPBUF
back into SSPADD
ACKSTAT
Set by hardware
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26.5.6 CLOCK STRETCHING
Clock stretching occurs when a device on the bus
holds the SCL line low effectively pausing communica-
tion. The slave may stretch the clock to allow more
time to handle data or prepare a response for the mas-
ter device. A master device is not concerned with
stretching as anytime it is active on the bus and not
transferring data it is stretching. Any stretching done
by a slave is invisible to the master software and han-
dled by the hardware that generates SCL.
The CKP bit of the SSPCON1 register is used to con-
trol stretching in software. Any time the CKP bit is
cleared, the module will wait for the SCL line to go low
and then hold it. Setting CKP will release SCL and
allow more communication.
26.5.6.1 Normal Clock Stretching
Following an ACK if the R/W bit of SSPSTAT is set, a
read request, the slave hardware will clear CKP. This
allows the slave time to update SSPBUF with data to
transfer to the master. If the SEN bit of SSPCON2 is
set, the slave hardware will always stretch the clock
after the ACK sequence. Once the slave is ready; CKP
is set by software and communication resumes.
26.5.6.2 10-bit Addressing Mode
In 10-bit Addressing mode, when the UA bit is set the
clock is always stretched. This is the only time the SCL
is stretched without CKP being cleared. SCL is
released immediately after a write to SSPADD.
26.5.6.3 Byte NACKing
When AHEN bit of SSPCON3 is set; CKP is cleared by
hardware after the 8th falling edge of SCL for a
received matching address byte. When DHEN bit of
SSPCON3 is set; CKP is cleared after the 8th falling
edge of SCL for received data.
Stretching after the 8th falling edge of SCL allows the
slave to look at the received address or data and
decide if it wants to ACK the received data.
26.5.7 CLOCK SYNCHRONIZATION AND
THE CKP BIT
Any time the CKP bit is cleared, the module will wait
for the SCL line to go low and then hold it. However,
clearing the CKP bit will not assert the SCL output low
until the SCL output is already sampled low. There-
fore, the CKP bit will not assert the SCL line until an
external I2C master device has already asserted the
SCL line. The SCL output will remain low until the CKP
bit is set and all other devices on the I2C bus have
released SCL. This ensures that a write to the CKP bit
will not violate the minimum high time requirement for
SCL (see Figure 26-22).
FIGURE 26-23: CLOCK SYNCHRONIZATION TIMING
Note 1: The BF bit has no effect on if the clock will
be stretched or not. This is different than
previous versions of the module that
would not stretch the clock, clear CKP, if
SSPBUF was read before the 9th falling
edge of SCL.
2: Previous versions of the module did not
stretch the clock for a transmission if
SSPBUF was loaded before the 9th fall-
ing edge of SCL. It is now always cleared
for read requests.
Note: Previous versions of the module did not
stretch the clock if the second address byte
did not match.
SDA
SCL
DX ‚ – 1DX
WR
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
SSPCON1
CKP
Master device
releases clock
Master device
asserts clock
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26.5.8 GENERAL CALL ADDRESS SUPPORT
The addressing procedure for the I2C bus is such that
the first byte after the Start condition usually deter-
mines which device will be the slave addressed by the
master device. The exception is the general call
address which can address all devices. When this
address is used, all devices should, in theory, respond
with an acknowledge.
The general call address is a reserved address in the
I2C protocol, defined as address 0x00. When the
GCEN bit of the SSPCON2 register is set, the slave
module will automatically ACK the reception of this
address regardless of the value stored in SSPADD.
After the slave clocks in an address of all zeros with
the R/W bit clear, an interrupt is generated and slave
software can read SSPBUF and respond.
Figure 26-23 shows a general call reception
sequence.
In 10-bit Address mode, the UA bit will not be set on
the reception of the general call address. The slave
will prepare to receive the second byte as data, just as
it would in 7-bit mode.
If the AHEN bit of the SSPCON3 register is set, just as
with any other address reception, the slave hardware
will stretch the clock after the 8th falling edge of SCL.
The slave must then set its ACKDT value and release
the clock with communication progressing as it would
normally.
FIGURE 26-24: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE
26.5.9 SSP MASK REGISTER
An SSP Mask (SSPMSK) register (Register 26-5) is
available in I2C Slave mode as a mask for the value
held in the SSPSR register during an address
comparison operation. A zero (‘0’) bit in the SSPMSK
register has the effect of making the corresponding bit
of the received address a “don’t care”.
This register is reset to all ‘1’s upon any Reset
condition and, therefore, has no effect on standard
SSP operation until written with a mask value.
The SSP Mask register is active during:
• 7-bit Address mode: address compare of A<7:1>.
• 10-bit Address mode: address compare of A<7:0>
only. The SSP mask has no effect during the
reception of the first (high) byte of the address.
SDA
SCL
S
SSPIF
BF (SSPSTAT<0>)
Cleared by software
SSPBUF is read
R/W = 0
ACK
General Call Address
Address is compared to General Call Address
Receiving Data ACK
123456789123456789
D7 D6 D5 D4 D3 D2 D1 D0
after ACK, set interrupt
GCEN (SSPCON2<7>)
’1’
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26.6 I2C Master Mode
Master mode is enabled by setting and clearing the
appropriate SSPM bits in the SSPCON1 register and
by setting the SSPEN bit. In Master mode, the SDA and
SCK pins must be configured as inputs. The MSSP
peripheral hardware will override the output driver TRIS
controls when necessary to drive the pins low.
Master mode of operation is supported by interrupt
generation on the detection of the Start and Stop con-
ditions. The Stop (P) and Start (S) bits are cleared from
a Reset or when the MSSP module is disabled. Control
of the I2C bus may be taken when the P bit is set, or the
bus is Idle.
In Firmware Controlled Master mode, user code
conducts all I2C bus operations based on Start and
Stop bit condition detection. Start and Stop condition
detection is the only active circuitry in this mode. All
other communication is done by the user software
directly manipulating the SDA and SCL lines.
The following events will cause the SSP Interrupt Flag
bit, SSPIF, to be set (SSP interrupt, if enabled):
• Start condition detected
• Stop condition detected
• Data transfer byte transmitted/received
• Acknowledge transmitted/received
• Repeated Start generated
26.6.1 I2C MASTER MODE OPERATION
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I2C bus will
not be released.
In Master Transmitter mode, serial data is output
through SDA, while SCL outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the Read/Write (R/W) bit.
In this case, the R/W bit will be logic ‘0’. Serial data is
transmitted 8 bits at a time. After each byte is transmit-
ted, an Acknowledge bit is received. Start and Stop
conditions are output to indicate the beginning and the
end of a serial transfer.
In Master Receive mode, the first byte transmitted con-
tains the slave address of the transmitting device
(7 bits) and the R/W bit. In this case, the R/W bit will be
logic ‘1’. Thus, the first byte transmitted is a 7-bit slave
address followed by a ‘1’ to indicate the receive bit.
Serial data is received via SDA, while SCL outputs the
serial clock. Serial data is received 8 bits at a time. After
each byte is received, an Acknowledge bit is transmit-
ted. Start and Stop conditions indicate the beginning
and end of transmission.
A Baud Rate Generator is used to set the clock fre-
quency output on SCL. See Section 26.7 “Baud Rate
Generator” for more detail.
Note 1: The MSSP module, when configured in
I2C Master mode, does not allow queue-
ing of events. For instance, the user is not
allowed to initiate a Start condition and
immediately write the SSPBUF register to
initiate transmission before the Start con-
dition is complete. In this case, the
SSPBUF will not be written to and the
WCOL bit will be set, indicating that a
write to the SSPBUF did not occur
2: When in Master mode, Start/Stop detec-
tion is masked and an interrupt is gener-
ated when the SEN/PEN bit is cleared
and the generation is complete.
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26.6.2 CLOCK ARBITRATION
Clock arbitration occurs when the master, during any
receive, transmit or Repeated Start/Stop condition,
releases the SCL pin (SCL allowed to float high). When
the SCL pin is allowed to float high, the Baud Rate Gen-
erator (BRG) is suspended from counting until the SCL
pin is actually sampled high. When the SCL pin is sam-
pled high, the Baud Rate Generator is reloaded with
the contents of SSPADD<7:0> and begins counting.
This ensures that the SCL high time will always be at
least one BRG rollover count in the event that the clock
is held low by an external device (Figure 26-25).
FIGURE 26-25: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION
26.6.3 WCOL STATUS FLAG
If the user writes the SSPBUF when a Start, Restart,
Stop, Receive or Transmit sequence is in progress, the
WCOL is set and the contents of the buffer are
unchanged (the write does not occur). Any time the
WCOL bit is set it indicates that an action on SSPBUF
was attempted while the module was not idle.
SDA
SCL
SCL deasserted but slave holds
DX ‚ – 1DX
BRG
SCL is sampled high, reload takes
place and BRG starts its count
03h 02h 01h 00h (hold off) 03h 02h
Reload
BRG
Value
SCL low (clock arbitration)
SCL allowed to transition high
BRG decrements on
Q2 and Q4 cycles
Note: Because queueing of events is not
allowed, writing to the lower 5 bits of
SSPCON2 is disabled until the Start
condition is complete.
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26.6.4 I2C MASTER MODE START
CONDITION TIMING
To initiate a Start condition, the user sets the Start
Enable bit, SEN bit of the SSPCON2 register. If the
SDA and SCL pins are sampled high, the Baud Rate
Generator is reloaded with the contents of
SSPADD<7:0> and starts its count. If SCL and SDA
are both sampled high when the Baud Rate Generator
times out (TBRG), the SDA pin is driven low. The action
of the SDA being driven low while SCL is high is the
Start condition and causes the S bit of the SSPSTAT1
register to be set. Following this, the Baud Rate Gen-
erator is reloaded with the contents of SSPADD<7:0>
and resumes its count. When the Baud Rate Genera-
tor times out (TBRG), the SEN bit of the SSPCON2 reg-
ister will be automatically cleared by hardware; the
Baud Rate Generator is suspended, leaving the SDA
line held low and the Start condition is complete.
FIGURE 26-26: FIRST START BIT TIMING
Note 1: If at the beginning of the Start condition,
the SDA and SCL pins are already sam-
pled low, or if during the Start condition,
the SCL line is sampled low before the
SDA line is driven low, a bus collision
occurs, the Bus Collision Interrupt Flag,
BCLIF, is set, the Start condition is
aborted and the I2C module is reset into
its Idle state.
2: The Philips I2C specification states that a
bus collision cannot occur on a Start.
SDA
SCL
S
TBRG
1st bit 2nd bit
TBRG
SDA = 1, At completion of Start bit,
SCL = 1
Write to SSPBUF occurs here
TBRG
hardware clears SEN bit
TBRG
Write to SEN bit occurs here Set S bit (SSPSTAT<3>)
and sets SSPIF bit
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26.6.5 I2C MASTER MODE REPEATED
START CONDITION TIMING
A Repeated Start condition occurs when the RSEN bit
of the SSPCON2 register is programmed high and the
master state machine is no longer active. When the
RSEN bit is set, the SCL pin is asserted low. When the
SCL pin is sampled low, the Baud Rate Generator is
loaded and begins counting. The SDA pin is released
(brought high) for one Baud Rate Generator count
(TBRG). When the Baud Rate Generator times out, if
SDA is sampled high, the SCL pin will be deasserted
(brought high). When SCL is sampled high, the Baud
Rate Generator is reloaded and begins counting. SDA
and SCL must be sampled high for one TBRG. This
action is then followed by assertion of the SDA pin
(SDA = 0) for one TBRG while SCL is high. SCL is
asserted low. Following this, the RSEN bit of the
SSPCON2 register will be automatically cleared and
the Baud Rate Generator will not be reloaded, leaving
the SDA pin held low. As soon as a Start condition is
detected on the SDA and SCL pins, the S bit of the
SSPSTAT register will be set. The SSPIF bit will not be
set until the Baud Rate Generator has timed out.
FIGURE 26-27: REPEAT START CONDITION WAVEFORM
Note 1: If RSEN is programmed while any other
event is in progress, it will not take effect.
2: A bus collision during the Repeated Start
condition occurs if:
• SDA is sampled low when SCL
goes from low-to-high.
• SCL goes low before SDA is
asserted low. This may indicate
that another master is attempting
to transmit a data ‘1’.
SDA
SCL
Repeated Start
Write to SSPCON2
Write to SSPBUF occurs here
At completion of Start bit,
hardware clears RSEN bit
1st bit
S bit set by hardware
TBRG
TBRG
SDA = 1,SDA = 1,
SCL (no change) SCL = 1
occurs here
TBRG TBRG TBRG
and sets SSPIF
Sr
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26.6.6 I2C MASTER MODE TRANSMISSION
Transmission of a data byte, a 7-bit address or the
other half of a 10-bit address is accomplished by simply
writing a value to the SSPBUF register. This action will
set the Buffer Full flag bit, BF and allow the Baud Rate
Generator to begin counting and start the next trans-
mission. Each bit of address/data will be shifted out
onto the SDA pin after the falling edge of SCL is
asserted. SCL is held low for one Baud Rate Generator
rollover count (TBRG). Data should be valid before SCL
is released high. When the SCL pin is released high, it
is held that way for TBRG. The data on the SDA pin
must remain stable for that duration and some hold
time after the next falling edge of SCL. After the eighth
bit is shifted out (the falling edge of the eighth clock),
the BF flag is cleared and the master releases SDA.
This allows the slave device being addressed to
respond with an ACK bit during the ninth bit time if an
address match occurred, or if data was received prop-
erly. The status of ACK is written into the ACKSTAT bit
on the rising edge of the ninth clock. If the master
receives an Acknowledge, the Acknowledge Status bit,
ACKSTAT, is cleared. If not, the bit is set. After the ninth
clock, the SSPIF bit is set and the master clock (Baud
Rate Generator) is suspended until the next data byte
is loaded into the SSPBUF, leaving SCL low and SDA
unchanged (Figure 26-27).
After the write to the SSPBUF, each bit of the address
will be shifted out on the falling edge of SCL until all
seven address bits and the R/W bit are completed. On
the falling edge of the eighth clock, the master will
release the SDA pin, allowing the slave to respond with
an Acknowledge. On the falling edge of the ninth clock,
the master will sample the SDA pin to see if the address
was recognized by a slave. The status of the ACK bit is
loaded into the ACKSTAT Status bit of the SSPCON2
register. Following the falling edge of the ninth clock
transmission of the address, the SSPIF is set, the BF
flag is cleared and the Baud Rate Generator is turned
off until another write to the SSPBUF takes place, hold-
ing SCL low and allowing SDA to float.
26.6.6.1 BF Status Flag
In Transmit mode, the BF bit of the SSPSTAT register
is set when the CPU writes to SSPBUF and is cleared
when all 8 bits are shifted out.
26.6.6.2 WCOL Status Flag
If the user writes the SSPBUF when a transmit is
already in progress (i.e., SSPSR is still shifting out a
data byte), the WCOL is set and the contents of the buf-
fer are unchanged (the write does not occur).
WCOL must be cleared by software before the next
transmission.
26.6.6.3 ACKSTAT Status Flag
In Transmit mode, the ACKSTAT bit of the SSPCON2
register is cleared when the slave has sent an Acknowl-
edge (ACK =0) and is set when the slave does not
Acknowledge (ACK =1). A slave sends an Acknowl-
edge when it has recognized its address (including a
general call), or when the slave has properly received
its data.
26.6.6.4 Typical transmit sequence:
1. The user generates a Start condition by setting
the SEN bit of the SSPCON2 register.
2. SSPIF is set by hardware on completion of the
Start.
3. SSPIF is cleared by software.
4. The MSSP module will wait the required start
time before any other operation takes place.
5. The user loads the SSPBUF with the slave
address to transmit.
6. Address is shifted out the SDA pin until all 8 bits
are transmitted. Transmission begins as soon
as SSPBUF is written to.
7. The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit of the SSPCON2 register.
8. The MSSP module generates an interrupt at the
end of the ninth clock cycle by setting the SSPIF
bit.
9. The user loads the SSPBUF with eight bits of
data.
10. Data is shifted out the SDA pin until all 8 bits are
transmitted.
11. The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit of the SSPCON2 register.
12. Steps 8-11 are repeated for all transmitted data
bytes.
13. The user generates a Stop or Restart condition
by setting the PEN or RSEN bits of the
SSPCON2 register. Interrupt is generated once
the Stop/Restart condition is complete.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 301
PIC16(L)F1782/3
FIGURE 26-28: I2C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS)
SDA
SCL
SSPIF
BF (SSPSTAT<0>)
SEN
A7 A6 A5 A4 A3 A2 A1 ACK = 0D7 D6 D5 D4 D3 D2 D1 D0
ACK
Transmitting Data or Second Half
R/W = 0Transmit Address to Slave
123456789 123456789 P
Cleared by software service routine
SSPBUF is written by software
from SSP interrupt
After Start condition, SEN cleared by hardware
S
SSPBUF written with 7-bit address and R/W
start transmit
SCL held low
while CPU
responds to SSPIF
SEN = 0
of 10-bit Address
Write SSPCON2<0> SEN = 1
Start condition begins From slave, clear ACKSTAT bit SSPCON2<6>
ACKSTAT in
SSPCON2 = 1
Cleared by software
SSPBUF written
PEN
R/W
Cleared by software
PIC16(L)F1782/3
DS41579C-page 302 Preliminary 2011-2012 Microchip Technology Inc.
26.6.7 I2C MASTER MODE RECEPTION
Master mode reception is enabled by programming the
Receive Enable bit, RCEN bit of the SSPCON2
register.
The Baud Rate Generator begins counting and on each
rollover, the state of the SCL pin changes
(high-to-low/low-to-high) and data is shifted into the
SSPSR. After the falling edge of the eighth clock, the
receive enable flag is automatically cleared, the con-
tents of the SSPSR are loaded into the SSPBUF, the
BF flag bit is set, the SSPIF flag bit is set and the Baud
Rate Generator is suspended from counting, holding
SCL low. The MSSP is now in Idle state awaiting the
next command. When the buffer is read by the CPU,
the BF flag bit is automatically cleared. The user can
then send an Acknowledge bit at the end of reception
by setting the Acknowledge Sequence Enable, ACKEN
bit of the SSPCON2 register.
26.6.7.1 BF Status Flag
In receive operation, the BF bit is set when an address
or data byte is loaded into SSPBUF from SSPSR. It is
cleared when the SSPBUF register is read.
26.6.7.2 SSPOV Status Flag
In receive operation, the SSPOV bit is set when 8 bits
are received into the SSPSR and the BF flag bit is
already set from a previous reception.
26.6.7.3 WCOL Status Flag
If the user writes the SSPBUF when a receive is
already in progress (i.e., SSPSR is still shifting in a data
byte), the WCOL bit is set and the contents of the buffer
are unchanged (the write does not occur).
26.6.7.4 Typical Receive Sequence:
1. The user generates a Start condition by setting
the SEN bit of the SSPCON2 register.
2. SSPIF is set by hardware on completion of the
Start.
3. SSPIF is cleared by software.
4. User writes SSPBUF with the slave address to
transmit and the R/W bit set.
5. Address is shifted out the SDA pin until all 8 bits
are transmitted. Transmission begins as soon
as SSPBUF is written to.
6. The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit of the SSPCON2 register.
7. The MSSP module generates an interrupt at the
end of the ninth clock cycle by setting the SSPIF
bit.
8. User sets the RCEN bit of the SSPCON2 register
and the master clocks in a byte from the slave.
9. After the 8th falling edge of SCL, SSPIF and BF
are set.
10. Master clears SSPIF and reads the received
byte from SSPUF, clears BF.
11. Master sets ACK value sent to slave in ACKDT
bit of the SSPCON2 register and initiates the
ACK by setting the ACKEN bit.
12. Masters ACK is clocked out to the slave and
SSPIF is set.
13. User clears SSPIF.
14. Steps 8-13 are repeated for each received byte
from the slave.
15. Master sends a not ACK or Stop to end
communication.
Note: The MSSP module must be in an Idle
state before the RCEN bit is set or the
RCEN bit will be disregarded.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 303
PIC16(L)F1782/3
FIGURE 26-29: I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS)
P
9
87
6
5
D0
D1
D2
D3D4
D5
D6D7
S
A7 A6 A5 A4 A3 A2 A1
SDA
SCL 12345678912345678 9 1234
Bus master
terminates
transfer
ACK
Receiving Data from Slave
Receiving Data from Slave
D0
D1
D2
D3D4
D5
D6D7
ACK
R/W
Transmit Address to Slave
SSPIF
BF
ACK is not sent
Write to SSPCON2<0> (SEN = 1),
Write to SSPBUF occurs here, ACK from Slave
Master configured as a receiver
by programming SSPCON2<3> (RCEN = 1)
PEN bit = 1
written here
Data shifted in on falling edge of CLK
Cleared by software
start XMIT
SEN = 0
SSPOV
SDA = 0, SCL = 1
while CPU
(SSPSTAT<0>)
ACK
Cleared by software
Cleared by software
Set SSPIF interrupt
at end of receive
Set P bit
(SSPSTAT<4>)
and SSPIF
Cleared in
software
ACK from Master
Set SSPIF at end
Set SSPIF interrupt
at end of Acknowledge
sequence
Set SSPIF interrupt
at end of Acknow-
ledge sequence
of receive
Set ACKEN, start Acknowledge sequence
SSPOV is set because
SSPBUF is still full
SDA = ACKDT = 1
RCEN cleared
automatically
RCEN = 1, start
next receive
Write to SSPCON2<4>
to start Acknowledge sequence
SDA = ACKDT (SSPCON2<5>) = 0
RCEN cleared
automatically
responds to SSPIF
ACKEN
begin Start condition
Cleared by software
SDA = ACKDT = 0
Last bit is shifted into SSPSR and
contents are unloaded into SSPBUF
RCEN
Master configured as a receiver
by programming SSPCON2<3> (RCEN = 1)
RCEN cleared
automatically
ACK from Master
SDA = ACKDT = 0 RCEN cleared
automatically
PIC16(L)F1782/3
DS41579C-page 304 Preliminary 2011-2012 Microchip Technology Inc.
26.6.8 ACKNOWLEDGE SEQUENCE
TIMING
An Acknowledge sequence is enabled by setting the
Acknowledge Sequence Enable bit, ACKEN bit of the
SSPCON2 register. When this bit is set, the SCL pin is
pulled low and the contents of the Acknowledge data bit
are presented on the SDA pin. If the user wishes to gen-
erate an Acknowledge, then the ACKDT bit should be
cleared. If not, the user should set the ACKDT bit before
starting an Acknowledge sequence. The Baud Rate
Generator then counts for one rollover period (TBRG)
and the SCL pin is deasserted (pulled high). When the
SCL pin is sampled high (clock arbitration), the Baud
Rate Generator counts for TBRG. The SCL pin is then
pulled low. Following this, the ACKEN bit is automatically
cleared, the Baud Rate Generator is turned off and the
MSSP module then goes into Idle mode (Figure 26-29).
26.6.8.1 WCOL Status Flag
If the user writes the SSPBUF when an Acknowledge
sequence is in progress, then WCOL is set and the
contents of the buffer are unchanged (the write does
not occur).
26.6.9 STOP CONDITION TIMING
A Stop bit is asserted on the SDA pin at the end of a
receive/transmit by setting the Stop Sequence Enable
bit, PEN bit of the SSPCON2 register. At the end of a
receive/transmit, the SCL line is held low after the
falling edge of the ninth clock. When the PEN bit is set,
the master will assert the SDA line low. When the SDA
line is sampled low, the Baud Rate Generator is
reloaded and counts down to ‘0’. When the Baud Rate
Generator times out, the SCL pin will be brought high
and one TBRG (Baud Rate Generator rollover count)
later, the SDA pin will be deasserted. When the SDA
pin is sampled high while SCL is high, the P bit of the
SSPSTAT register is set. A TBRG later, the PEN bit is
cleared and the SSPIF bit is set (Figure 26-30).
26.6.9.1 WCOL Status Flag
If the user writes the SSPBUF when a Stop sequence
is in progress, then the WCOL bit is set and the
contents of the buffer are unchanged (the write does
not occur).
FIGURE 26-30: ACKNOWLEDGE SEQUENCE WAVEFORM
FIGURE 26-31: STOP CONDITION RECEIVE OR TRANSMIT MODE
Note: TBRG = one Baud Rate Generator period.
SDA
SCL
SSPIF set at
Acknowledge sequence starts here,
write to SSPCON2 ACKEN automatically cleared
Cleared in
TBRG TBRG
the end of receive
8
ACKEN = 1, ACKDT = 0
D0
9
SSPIF
software SSPIF set at the end
of Acknowledge sequence
Cleared in
software
ACK
SCL
SDA
SDA asserted low before rising edge of clock
Write to SSPCON2,
set PEN
Falling edge of
SCL = 1 for TBRG, followed by SDA = 1 for TBRG
9th clock
SCL brought high after TBRG
Note: TBRG = one Baud Rate Generator period.
TBRG TBRG
after SDA sampled high. P bit (SSPSTAT<4>) is set.
TBRG
to setup Stop condition
ACK
P
TBRG
PEN bit (SSPCON2<2>) is cleared by
hardware and the SSPIF bit is set
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 305
PIC16(L)F1782/3
26.6.10 SLEEP OPERATION
While in Sleep mode, the I2C slave module can receive
addresses or data and when an address match or
complete byte transfer occurs, wake the processor
from Sleep (if the MSSP interrupt is enabled).
26.6.11 EFFECTS OF A RESET
A Reset disables the MSSP module and terminates the
current transfer.
26.6.12 MULTI-MASTER MODE
In Multi-Master mode, the interrupt generation on the
detection of the Start and Stop conditions allows the
determination of when the bus is free. The Stop (P) and
Start (S) bits are cleared from a Reset or when the
MSSP module is disabled. Control of the I2C bus may
be taken when the P bit of the SSPSTAT register is set,
or the bus is Idle, with both the S and P bits clear. When
the bus is busy, enabling the SSP interrupt will gener-
ate the interrupt when the Stop condition occurs.
In multi-master operation, the SDA line must be
monitored for arbitration to see if the signal level is the
expected output level. This check is performed by
hardware with the result placed in the BCLIF bit.
The states where arbitration can be lost are:
• Address Transfer
• Data Transfer
• A Start Condition
• A Repeated Start Condition
• An Acknowledge Condition
26.6.13 MULTI -MASTER COMMUNICATION,
BUS COLLISION AND BUS
ARBITRATION
Multi-Master mode support is achieved by bus arbitra-
tion. When the master outputs address/data bits onto
the SDA pin, arbitration takes place when the master
outputs a ‘1’ on SDA, by letting SDA float high and
another master asserts a ‘0’. When the SCL pin floats
high, data should be stable. If the expected data on
SDA is a ‘1’ and the data sampled on the SDA pin is ‘0’,
then a bus collision has taken place. The master will set
the Bus Collision Interrupt Flag, BCLIF and reset the
I2C port to its Idle state (Figure 26-31).
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the BF flag is
cleared, the SDA and SCL lines are deasserted and the
SSPBUF can be written to. When the user services the
bus collision Interrupt Service Routine and if the I2C
bus is free, the user can resume communication by
asserting a Start condition.
If a Start, Repeated Start, Stop or Acknowledge condi-
tion was in progress when the bus collision occurred, the
condition is aborted, the SDA and SCL lines are deas-
serted and the respective control bits in the SSPCON2
register are cleared. When the user services the bus col-
lision Interrupt Service Routine and if the I2C bus is free,
the user can resume communication by asserting a Start
condition.
The master will continue to monitor the SDA and SCL
pins. If a Stop condition occurs, the SSPIF bit will be set.
A write to the SSPBUF will start the transmission of
data at the first data bit, regardless of where the
transmitter left off when the bus collision occurred.
In Multi-Master mode, the interrupt generation on the
detection of Start and Stop conditions allows the deter-
mination of when the bus is free. Control of the I2C bus
can be taken when the P bit is set in the SSPSTAT
register, or the bus is Idle and the S and P bits are
cleared.
FIGURE 26-32: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE
SDA
SCL
BCLIF
SDA released
SDA line pulled low
by another source
Sample SDA. While SCL is high,
data does not match what is driven
Bus collision has occurred.
Set bus collision
interrupt (BCLIF)
by the master.
by master
Data changes
while SCL = 0
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DS41579C-page 306 Preliminary 2011-2012 Microchip Technology Inc.
26.6.13.1 Bus Collision During a Start
Condition
During a Start condition, a bus collision occurs if:
a) SDA or SCL are sampled low at the beginning of
the Start condition (Figure 26-32).
b) SCL is sampled low before SDA is asserted low
(Figure 26-33).
During a Start condition, both the SDA and the SCL
pins are monitored.
If the SDA pin is already low, or the SCL pin is already
low, then all of the following occur:
• the Start condition is aborted,
• the BCLIF flag is set and
• the MSSP module is reset to its Idle state
(Figure 26-32).
The Start condition begins with the SDA and SCL pins
deasserted. When the SDA pin is sampled high, the
Baud Rate Generator is loaded and counts down. If the
SCL pin is sampled low while SDA is high, a bus colli-
sion occurs because it is assumed that another master
is attempting to drive a data ‘1’ during the Start
condition.
If the SDA pin is sampled low during this count, the
BRG is reset and the SDA line is asserted early
(Figure 26-34). If, however, a ‘1’ is sampled on the SDA
pin, the SDA pin is asserted low at the end of the BRG
count. The Baud Rate Generator is then reloaded and
counts down to zero; if the SCL pin is sampled as ‘0’
during this time, a bus collision does not occur. At the
end of the BRG count, the SCL pin is asserted low.
FIGURE 26-33: BUS COLLISION DURING START CONDITION (SDA ONLY)
Note: The reason that bus collision is not a fac-
tor during a Start condition is that no two
bus masters can assert a Start condition
at the exact same time. Therefore, one
master will always assert SDA before the
other. This condition does not cause a bus
collision because the two masters must be
allowed to arbitrate the first address fol-
lowing the Start condition. If the address is
the same, arbitration must be allowed to
continue into the data portion, Repeated
Start or Stop conditions.
SDA
SCL
SEN
SDA sampled low before
SDA goes low before the SEN bit is set.
S bit and SSPIF set because
SSP module reset into Idle state.
SEN cleared automatically because of bus collision.
S bit and SSPIF set because
Set SEN, enable Start
condition if SDA = 1, SCL = 1
SDA = 0, SCL = 1.
BCLIF
S
SSPIF
SDA = 0, SCL = 1.
SSPIF and BCLIF are
cleared by software
SSPIF and BCLIF are
cleared by software
Set BCLIF,
Start condition. Set BCLIF.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 307
PIC16(L)F1782/3
FIGURE 26-34: BUS COLLISION DURING START CONDITION (SCL = 0)
FIGURE 26-35: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION
SDA
SCL
SEN bus collision occurs. Set BCLIF.
SCL = 0 before SDA = 0,
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
TBRG TBRG
SDA = 0, SCL = 1
BCLIF
S
SSPIF
Interrupt cleared
by software
bus collision occurs. Set BCLIF.
SCL = 0 before BRG time-out,
’0’’0’
’0’’0’
SDA
SCL
SEN
Set S
Less than TBRG TBRG
SDA = 0, SCL = 1
BCLIF
S
SSPIF
S
Interrupts cleared
by software
set SSPIF
SDA = 0, SCL = 1,
SCL pulled low after BRG
time-out
Set SSPIF
’0’
SDA pulled low by other master.
Reset BRG and assert SDA.
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
PIC16(L)F1782/3
DS41579C-page 308 Preliminary 2011-2012 Microchip Technology Inc.
26.6.13.2 Bus Collision During a Repeated
Start Condition
During a Repeated Start condition, a bus collision
occurs if:
a) A low level is sampled on SDA when SCL goes
from low level to high level.
b) SCL goes low before SDA is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
When the user releases SDA and the pin is allowed to
float high, the BRG is loaded with SSPADD and counts
down to zero. The SCL pin is then deasserted and
when sampled high, the SDA pin is sampled.
If SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’, Figure 26-35).
If SDA is sampled high, the BRG is reloaded and begins
counting. If SDA goes from high-to-low before the BRG
times out, no bus collision occurs because no two
masters can assert SDA at exactly the same time.
If SCL goes from high-to-low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition,
see Figure 26-36.
If, at the end of the BRG time-out, both SCL and SDA
are still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is
complete.
FIGURE 26-36: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
FIGURE 26-37: BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SDA
SCL
RSEN
BCLIF
S
SSPIF
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
Cleared by software
’0’
’0’
SDA
SCL
BCLIF
RSEN
S
SSPIF
Interrupt cleared
by software
SCL goes low before SDA,
set BCLIF. Release SDA and SCL.
TBRG TBRG
’0’
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 309
PIC16(L)F1782/3
26.6.13.3 Bus Collision During a Stop
Condition
Bus collision occurs during a Stop condition if:
a) After the SDA pin has been deasserted and
allowed to float high, SDA is sampled low after
the BRG has timed out.
b) After the SCL pin is deasserted, SCL is sampled
low before SDA goes high.
The Stop condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPADD and
counts down to 0. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ‘0’ (Figure 26-37). If the SCL pin is sampled
low before SDA is allowed to float high, a bus collision
occurs. This is another case of another master
attempting to drive a data ‘0’ (Figure 26-38).
FIGURE 26-38: BUS COLLISION DURING A STOP CONDITION (CASE 1)
FIGURE 26-39: BUS COLLISION DURING A STOP CONDITION (CASE 2)
SDA
SCL
BCLIF
PEN
P
SSPIF
TBRG TBRG TBRG
SDA asserted low
SDA sampled
low after TBRG,
set BCLIF
’0’
’0’
SDA
SCL
BCLIF
PEN
P
SSPIF
TBRG TBRG TBRG
Assert SDA SCL goes low before SDA goes high,
set BCLIF
’0’
’0’
PIC16(L)F1782/3
DS41579C-page 310 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 26-3: SUMMARY OF REGISTERS ASSOCIATED WITH I2C™ OPERATION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values on
Page:
APFCON C2OUTSEL CCP1SEL SDOSEL SCKSEL SDISEL TXSEL RXSEL CCP2SEL 119
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 85
PIE2 OSFIE C2IE C1IE EEIE BCL1IE —C3IE CCP2IE 86
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 88
PIR2 OSFIF C2IF C1IF EEIF BCL1IF —C3IF CCP2IF 89
SSPADD ADD<7:0> 316
SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register 269*
SSPCON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 313
SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 314
SSPCON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 313
SSPMSK MSK<7:0> 316
SSPSTAT SMP CKE D/A P S R/W UA BF 312
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISA0 133
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the MSSP module in I2C™ mode.
* Page provides register information.
Note 1: PIC16(L)F1783 only.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 311
PIC16(L)F1782/3
26.7 BAUD RATE GENERATOR
The MSSP module has a Baud Rate Generator avail-
able for clock generation in both I2C and SPI Master
modes. The Baud Rate Generator (BRG) reload value
is placed in the SSPADD register (Register 26-6).
When a write occurs to SSPBUF, the Baud Rate Gen-
erator will automatically begin counting down.
Once the given operation is complete, the internal clock
will automatically stop counting and the clock pin will
remain in its last state.
An internal signal “Reload” in Figure 26-39 triggers the
value from SSPADD to be loaded into the BRG counter.
This occurs twice for each oscillation of the module
clock line. The logic dictating when the reload signal is
asserted depends on the mode the MSSP is being
operated in.
Table 26-4 demonstrates clock rates based on
instruction cycles and the BRG value loaded into
SSPADD.
EQUATION 26-1:
FIGURE 26-40: BAUD RATE GENERATOR BLOCK DIAGRAM
TABLE 26-4: MSSP CLOCK RATE W/BRG
FCLOCK FOSC
SSPxADD 1+4
-------------------------------------------------=
Note: Values of 0x00, 0x01 and 0x02 are not valid
for SSPADD when used as a Baud Rate
Generator for I2C. This is an implementation
limitation.
FOSC FCY BRG Value FCLOCK
(2 Rollovers of BRG)
32 MHz 8 MHz 13h 400 kHz(1)
32 MHz 8 MHz 19h 308 kHz
32 MHz 8 MHz 4Fh 100 kHz
16 MHz 4 MHz 09h 400 kHz(1)
16 MHz 4 MHz 0Ch 308 kHz
16 MHz 4 MHz 27h 100 kHz
4 MHz 1 MHz 09h 100 kHz
Note 1: The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than
100 kHz) in all details, but may be used with care where higher rates are required by the application.
SSPM<3:0>
BRG Down Counter
SSPCLK FOSC/2
SSPADD<7:0>
SSPM<3:0>
SCL
Reload
Control
Reload
PIC16(L)F1782/3
DS41579C-page 312 Preliminary 2011-2012 Microchip Technology Inc.
26.8 Register Definitions: MSSP Control
REGISTER 26-1: SSPSTAT: SSP STATUS REGISTER
R/W-0/0 R/W-0/0 R-0/0 R-0/0 R-0/0 R-0/0 R-0/0 R-0/0
SMP CKE D/A PSR/WUA BF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 SMP: SPI Data Input Sample bit
SPI Master mode:
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
SPI Slave mode:
SMP must be cleared when SPI is used in Slave mode
In I2 C Master or Slave mode:
1 = Slew rate control disabled for standard speed mode (100 kHz and 1 MHz)
0 = Slew rate control enabled for high speed mode (400 kHz)
bit 6 CKE: SPI Clock Edge Select bit (SPI mode only)
In SPI Master or Slave mode:
1 = Transmit occurs on transition from active to Idle clock state
0 = Transmit occurs on transition from Idle to active clock state
In I2 C™ mode only:
1 = Enable input logic so that thresholds are compliant with SMBus specification
0 = Disable SMBus specific inputs
bit 5 D/A: Data/Address bit (I2C mode only)
1 = Indicates that the last byte received or transmitted was data
0 = Indicates that the last byte received or transmitted was address
bit 4 P: Stop bit
(I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.)
1 = Indicates that a Stop bit has been detected last (this bit is ‘0’ on Reset)
0 = Stop bit was not detected last
bit 3 S: Start bit
(I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.)
1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset)
0 = Start bit was not detected last
bit 2 R/W: Read/Write bit information (I2C mode only)
This bit holds the R/W bit information following the last address match. This bit is only valid from the address match
to the next Start bit, Stop bit, or not ACK bit.
In I2 C Slave mode:
1 = Read
0 = Write
In I2 C Master mode:
1 = Transmit is in progress
0 = Transmit is not in progress
OR-ing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Idle mode.
bit 1 UA: Update Address bit (10-bit I2C mode only)
1 = Indicates that the user needs to update the address in the SSPADD register
0 = Address does not need to be updated
bit 0 BF: Buffer Full Status bit
Receive (SPI and I2 C modes):
1 = Receive complete, SSPBUF is full
0 = Receive not complete, SSPBUF is empty
Transmit (I2 C mode only):
1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full
0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty
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REGISTER 26-2: SSPCON1: SSP CONTROL REGISTER 1
R/C/HS-0/0 R/C/HS-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
WCOL SSPOV SSPEN CKP SSPM<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HS = Bit is set by hardware C = User cleared
bit 7 WCOL: Write Collision Detect bit
Master mode:
1 = A write to the SSPBUF register was attempted while the I2C conditions were not valid for a transmission to be started
0 = No collision
Slave mode:
1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software)
0 = No collision
bit 6 SSPOV: Receive Overflow Indicator bit(1)
In SPI mode:
1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow, the data in SSPSR is lost.
Overflow can only occur in Slave mode. In Slave mode, the user must read the SSPBUF, even if only transmitting data, to avoid
setting overflow. In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the
SSPBUF register (must be cleared in software).
0 = No overflow
In I2 C mode:
1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV is a “don’t care” in Transmit mode
(must be cleared in software).
0 = No overflow
bit 5 SSPEN: Synchronous Serial Port Enable bit
In both modes, when enabled, these pins must be properly configured as input or output
In SPI mode:
1 = Enables serial port and configures SCK, SDO, SDI and SS as the source of the serial port pins(2)
0 = Disables serial port and configures these pins as I/O port pins
In I2 C mode:
1 = Enables the serial port and configures the SDA and SCL pins as the source of the serial port pins(3)
0 = Disables serial port and configures these pins as I/O port pins
bit 4 CKP: Clock Polarity Select bit
In SPI mode:
1 = Idle state for clock is a high level
0 = Idle state for clock is a low level
In I2 C Slave mode:
SCL release control
1 = Enable clock
0 = Holds clock low (clock stretch). (Used to ensure data setup time.)
In I2 C Master mode:
Unused in this mode
bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits
0000 = SPI Master mode, clock = FOSC/4
0001 = SPI Master mode, clock = FOSC/16
0010 = SPI Master mode, clock = FOSC/64
0011 = SPI Master mode, clock = TMR2 output/2
0100 = SPI Slave mode, clock = SCK pin, SS pin control enabled
0101 = SPI Slave mode, clock = SCK pin, SS pin control disabled, SS can be used as I/O pin
0110 = I2C Slave mode, 7-bit address
0111 = I2C Slave mode, 10-bit address
1000 = I2C Master mode, clock = FOSC / (4 * (SSPADD+1))(4)
1001 = Reserved
1010 = SPI Master mode, clock = FOSC/(4 * (SSPADD+1))(5)
1011 = I2C firmware controlled Master mode (Slave idle)
1100 = Reserved
1101 = Reserved
1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled
1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled
Note 1: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register.
2: When enabled, these pins must be properly configured as input or output.
3: When enabled, the SDA and SCL pins must be configured as inputs.
4: SSPADD values of 0, 1 or 2 are not supported for I2C mode.
5: SSPADD value of ‘0’ is not supported. Use SSPM = 0000 instead.
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REGISTER 26-3: SSPCON2: SSP CONTROL REGISTER 2
R/W-0/0 R-0/0 R/W-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/W/HS-0/0
GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HC = Cleared by hardware S = User set
bit 7 GCEN: General Call Enable bit (in I2C Slave mode only)
1 = Enable interrupt when a general call address (0x00 or 00h) is received in the SSPSR
0 = General call address disabled
bit 6 ACKSTAT: Acknowledge Status bit (in I2C mode only)
1 = Acknowledge was not received
0 = Acknowledge was received
bit 5 ACKDT: Acknowledge Data bit (in I2C mode only)
In Receive mode:
Value transmitted when the user initiates an Acknowledge sequence at the end of a receive
1 = Not Acknowledge
0 = Acknowledge
bit 4 ACKEN: Acknowledge Sequence Enable bit (in I2C Master mode only)
In Master Receive mode:
1 = Initiate Acknowledge sequence on SDA and SCL pins, and transmit ACKDT data bit.
Automatically cleared by hardware.
0 = Acknowledge sequence idle
bit 3 RCEN: Receive Enable bit (in I2C Master mode only)
1 = Enables Receive mode for I2C
0 = Receive idle
bit 2 PEN: Stop Condition Enable bit (in I2C Master mode only)
SCKMSSP Release Control:
1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Stop condition Idle
bit 1 RSEN: Repeated Start Condition Enable bit (in I2C Master mode only)
1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Repeated Start condition Idle
bit 0 SEN: Start Condition Enable/Stretch Enable bit
In Master mode:
1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Start condition Idle
In Slave mode:
1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled)
0 = Clock stretching is disabled
Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, this bit may not be
set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled).
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REGISTER 26-4: SSPCON3: SSP CONTROL REGISTER 3
R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 ACKTIM: Acknowledge Time Status bit (I2C mode only)(3)
1 = Indicates the I2C bus is in an Acknowledge sequence, set on 8TH falling edge of SCL clock
0 = Not an Acknowledge sequence, cleared on 9TH rising edge of SCL clock
bit 6 PCIE: Stop Condition Interrupt Enable bit (I2C mode only)
1 = Enable interrupt on detection of Stop condition
0 = Stop detection interrupts are disabled(2)
bit 5 SCIE: Start Condition Interrupt Enable bit (I2C mode only)
1 = Enable interrupt on detection of Start or Restart conditions
0 = Start detection interrupts are disabled(2)
bit 4 BOEN: Buffer Overwrite Enable bit
In SPI Slave mode:(1)
1 = SSPBUF updates every time that a new data byte is shifted in ignoring the BF bit
0 = If new byte is received with BF bit of the SSPSTAT register already set, SSPOV bit of the
SSPCON1 register is set, and the buffer is not updated
In I2C Master mode and SPI Master mode:
This bit is ignored.
In I2C Slave mode:
1 = SSPBUF is updated and ACK is generated for a received address/data byte, ignoring the state
of the SSPOV bit only if the BF bit = 0.
0 = SSPBUF is only updated when SSPOV is clear
bit 3 SDAHT: SDA Hold Time Selection bit (I2C mode only)
1 = Minimum of 300 ns hold time on SDA after the falling edge of SCL
0 = Minimum of 100 ns hold time on SDA after the falling edge of SCL
bit 2 SBCDE: Slave Mode Bus Collision Detect Enable bit (I2C Slave mode only)
If on the rising edge of SCL, SDA is sampled low when the module is outputting a high state, the BCLIF
bit of the PIR2 register is set, and bus goes idle
1 = Enable slave bus collision interrupts
0 = Slave bus collision interrupts are disabled
bit 1 AHEN: Address Hold Enable bit (I2C Slave mode only)
1 = Following the 8th falling edge of SCL for a matching received address byte; CKP bit of the
SSPCON1 register will be cleared and the SCL will be held low.
0 = Address holding is disabled
bit 0 DHEN: Data Hold Enable bit (I2C Slave mode only)
1 = Following the 8th falling edge of SCL for a received data byte; slave hardware clears the CKP bit
of the SSPCON1 register and SCL is held low.
0 = Data holding is disabled
Note 1: For daisy-chained SPI operation; allows the user to ignore all but the last received byte. SSPOV is still set
when a new byte is received and BF = 1, but hardware continues to write the most recent byte to SSPBUF.
2: This bit has no effect in Slave modes that Start and Stop condition detection is explicitly listed as enabled.
3: The ACKTIM Status bit is only active when the AHEN bit or DHEN bit is set.
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REGISTER 26-5: SSPMSK: SSP MASK REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
MSK<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-1 MSK<7:1>: Mask bits
1 = The received address bit n is compared to SSPADD<n> to detect I2C address match
0 = The received address bit n is not used to detect I2C address match
bit 0 MSK<0>: Mask bit for I2C Slave mode, 10-bit Address
I2C Slave mode, 10-bit address (SSPM<3:0> = 0111 or 1111):
1 = The received address bit 0 is compared to SSPADD<0> to detect I2C address match
0 = The received address bit 0 is not used to detect I2C address match
I2C Slave mode, 7-bit address, the bit is ignored
REGISTER 26-6: SSPADD: MSSP ADDRESS AND BAUD RATE REGISTER (I2C MODE)
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
ADD<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
Master mode:
bit 7-0 ADD<7:0>: Baud Rate Clock Divider bits
SCL pin clock period = ((ADD<7:0> + 1) *4)/FOSC
10-Bit Slave mode — Most Significant Address Byte:
bit 7-3 Not used: Unused for Most Significant Address byte. Bit state of this register is a “don’t care”. Bit pat-
tern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits are
compared by hardware and are not affected by the value in this register.
bit 2-1 ADD<2:1>: Two Most Significant bits of 10-bit address
bit 0 Not used: Unused in this mode. Bit state is a “don’t care”.
10-Bit Slave mode — Least Significant Address Byte:
bit 7-0 ADD<7:0>: Eight Least Significant bits of 10-bit address
7-Bit Slave mode:
bit 7-1 ADD<7:1>: 7-bit address
bit 0 Not used: Unused in this mode. Bit state is a “don’t care”.
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27.0 ENHANCED UNIVERSAL
SYNCHRONOUS
ASYNCHRONOUS RECEIVER
TRANSMITTER (EUSART)
The Enhanced Universal Synchronous Asynchronous
Receiver Transmitter (EUSART) module is a serial I/O
communications peripheral. It contains all the clock
generators, shift registers and data buffers necessary
to perform an input or output serial data transfer
independent of device program execution. The
EUSART, also known as a Serial Communications
Interface (SCI), can be configured as a full-duplex
asynchronous system or half-duplex synchronous
system. Full-Duplex mode is useful for
communications with peripheral systems, such as CRT
terminals and personal computers. Half-Duplex
Synchronous mode is intended for communications
with peripheral devices, such as A/D or D/A integrated
circuits, serial EEPROMs or other microcontrollers.
These devices typically do not have internal clocks for
baud rate generation and require the external clock
signal provided by a master synchronous device.
The EUSART module includes the following capabilities:
• Full-duplex asynchronous transmit and receive
• Two-character input buffer
• One-character output buffer
• Programmable 8-bit or 9-bit character length
• Address detection in 9-bit mode
• Input buffer overrun error detection
• Received character framing error detection
• Half-duplex synchronous master
• Half-duplex synchronous slave
• Programmable clock polarity in synchronous
modes
• Sleep operation
The EUSART module implements the following
additional features, making it ideally suited for use in
Local Interconnect Network (LIN) bus systems:
• Automatic detection and calibration of the baud rate
• Wake-up on Break reception
• 13-bit Break character transmit
Block diagrams of the EUSART transmitter and
receiver are shown in Figure 27-1 and Figure 27-2.
FIGURE 27-1: EUSART TRANSMIT BLOCK DIAGRAM
TXIF
TXIE
Interrupt
TXEN
TX9D
MSb LSb
Data Bus
TXREG Register
Transmit Shift Register (TSR)
(8) 0
TX9
TRMT SPEN
TX/CK pin
Pin Buffer
and Control
8
SPBRGL
SPBRGH
BRG16
FOSC ÷ n
n
+ 1 Multiplier x4 x16 x64
SYNC 1X00 0
BRGH X110 0
BRG16 X101 0
Baud Rate Generator
•••
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FIGURE 27-2: EUSART RECEIVE BLOCK DIAGRAM
The operation of the EUSART module is controlled
through three registers:
• Transmit Status and Control (TXSTA)
• Receive Status and Control (RCSTA)
• Baud Rate Control (BAUDCON)
These registers are detailed in Register 27-1,
Register 27-2 and Register 27-3, respectively.
When the receiver or transmitter section is not enabled
then the corresponding RX or TX pin may be used for
general purpose input and output.
RX/DT pin
Pin Buffer
and Control
SPEN
Data
Recovery
CREN OERR
FERR
RSR Register
MSb LSb
RX9D RCREG Register FIFO
Interrupt
RCIF
RCIE
Data Bus
8
Stop START
(8) 7 1 0
RX9
• • •
SPBRGLSPBRGH
BRG16
RCIDL
FOSC ÷ n
n
+ 1 Multiplier x4 x16 x64
SYNC 1X00 0
BRGH X110 0
BRG16 X101 0
Baud Rate Generator
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27.1 EUSART Asynchronous Mode
The EUSART transmits and receives data using the
standard non-return-to-zero (NRZ) format. NRZ is
implemented with two levels: a VOH mark state which
represents a ‘1’ data bit, and a VOL space state which
represents a ‘0’ data bit. NRZ refers to the fact that
consecutively transmitted data bits of the same value
stay at the output level of that bit without returning to a
neutral level between each bit transmission. An NRZ
transmission port idles in the mark state. Each character
transmission consists of one Start bit followed by eight
or nine data bits and is always terminated by one or
more Stop bits. The Start bit is always a space and the
Stop bits are always marks. The most common data
format is 8 bits. Each transmitted bit persists for a period
of 1/(Baud Rate). An on-chip dedicated 8-bit/16-bit Baud
Rate Generator is used to derive standard baud rate
frequencies from the system oscillator. See Table 27-5
for examples of baud rate configurations.
The EUSART transmits and receives the LSb first. The
EUSART’s transmitter and receiver are functionally
independent, but share the same data format and baud
rate. Parity is not supported by the hardware, but can
be implemented in software and stored as the ninth
data bit.
27.1.1 EUSART ASYNCHRONOUS
TRANSMITTER
The EUSART transmitter block diagram is shown in
Figure 27-1. The heart of the transmitter is the serial
Transmit Shift Register (TSR), which is not directly
accessible by software. The TSR obtains its data from
the transmit buffer, which is the TXREG register.
27.1.1.1 Enabling the Transmitter
The EUSART transmitter is enabled for asynchronous
operations by configuring the following three control
bits:
•TXEN = 1
• SYNC = 0
• SPEN = 1
All other EUSART control bits are assumed to be in
their default state.
Setting the TXEN bit of the TXSTA register enables the
transmitter circuitry of the EUSART. Clearing the SYNC
bit of the TXSTA register configures the EUSART for
asynchronous operation. Setting the SPEN bit of the
RCSTA register enables the EUSART and automatically
configures the TX/CK I/O pin as an output. If the TX/CK
pin is shared with an analog peripheral, the analog I/O
function must be disabled by clearing the corresponding
ANSEL bit.
27.1.1.2 Transmitting Data
A transmission is initiated by writing a character to the
TXREG register. If this is the first character, or the
previous character has been completely flushed from
the TSR, the data in the TXREG is immediately
transferred to the TSR register. If the TSR still contains
all or part of a previous character, the new character
data is held in the TXREG until the Stop bit of the
previous character has been transmitted. The pending
character in the TXREG is then transferred to the TSR
in one TCY immediately following the Stop bit
transmission. The transmission of the Start bit, data bits
and Stop bit sequence commences immediately
following the transfer of the data to the TSR from the
TXREG.
27.1.1.3 Transmit Data Polarity
The polarity of the transmit data can be controlled with
the SCKP bit of the BAUDxCON register. The default
state of this bit is ‘0’ which selects high true transmit Idle
and data bits. Setting the SCKP bit to ‘1’ will invert the
transmit data resulting in low true Idle and data bits. The
SCKP bit controls transmit data polarity in
Asynchronous mode only. In Synchronous mode, the
SCKP bit has a different function. See Section 27.5.1.2
“Clock Polarity”.
27.1.1.4 Transmit Interrupt Flag
The TXIF interrupt flag bit of the PIR1 register is set
whenever the EUSART transmitter is enabled and no
character is being held for transmission in the TXREG.
In other words, the TXIF bit is only clear when the TSR
is busy with a character and a new character has been
queued for transmission in the TXREG. The TXIF flag bit
is not cleared immediately upon writing TXREG. TXIF
becomes valid in the second instruction cycle following
the write execution. Polling TXIF immediately following
the TXREG write will return invalid results. The TXIF bit
is read-only, it cannot be set or cleared by software.
The TXIF interrupt can be enabled by setting the TXIE
interrupt enable bit of the PIE1 register. However, the
TXIF flag bit will be set whenever the TXREG is empty,
regardless of the state of TXIE enable bit.
To use interrupts when transmitting data, set the TXIE
bit only when there is more data to send. Clear the
TXIE interrupt enable bit upon writing the last character
of the transmission to the TXREG.
Note: The TXIF Transmitter Interrupt flag is set
when the TXEN enable bit is set.
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27.1.1.5 TSR Status
The TRMT bit of the TXSTA register indicates the
status of the TSR register. This is a read-only bit. The
TRMT bit is set when the TSR register is empty and is
cleared when a character is transferred to the TSR
register from the TXREG. The TRMT bit remains clear
until all bits have been shifted out of the TSR register.
No interrupt logic is tied to this bit, so the user has to
poll this bit to determine the TSR status.
27.1.1.6 Transmitting 9-Bit Characters
The EUSART supports 9-bit character transmissions.
When the TX9 bit of the TXSTA register is set, the
EUSART will shift 9 bits out for each character transmit-
ted. The TX9D bit of the TXSTA register is the ninth,
and Most Significant, data bit. When transmitting 9-bit
data, the TX9D data bit must be written before writing
the 8 Least Significant bits into the TXREG. All nine bits
of data will be transferred to the TSR shift register
immediately after the TXREG is written.
A special 9-bit Address mode is available for use with
multiple receivers. See Section 27.1.2.7 “Address
Detection” for more information on the address mode.
27.1.1.7 Asynchronous Transmission Set-up:
1. Initialize the SPBRGH, SPBRGL register pair and
the BRGH and BRG16 bits to achieve the desired
baud rate (see Section 27.4 “EUSART Baud
Rate Generator (BRG)”).
2. Enable the asynchronous serial port by clearing
the SYNC bit and setting the SPEN bit.
3. If 9-bit transmission is desired, set the TX9 con-
trol bit. A set ninth data bit will indicate that the 8
Least Significant data bits are an address when
the receiver is set for address detection.
4. Set SCKP bit if inverted transmit is desired.
5. Enable the transmission by setting the TXEN
control bit. This will cause the TXIF interrupt bit
to be set.
6. If interrupts are desired, set the TXIE interrupt
enable bit of the PIE1 register. An interrupt will
occur immediately provided that the GIE and
PEIE bits of the INTCON register are also set.
7. If 9-bit transmission is selected, the ninth bit
should be loaded into the TX9D data bit.
8. Load 8-bit data into the TXREG register. This
will start the transmission.
FIGURE 27-3: ASYNCHRONOUS TRANSMISSION
Note: The TSR register is not mapped in data
memory, so it is not available to the user.
Word 1
Stop bit
Word 1
Transmit Shift Reg.
Start bit bit 0 bit 1 bit 7/8
Write to TXREG
Word 1
BRG Output
(Shift Clock)
TX/CK
TXIF bit
(Transmit Buffer
Reg. Empty Flag)
TRMT bit
(Transmit Shift
Reg. Empty Flag)
1 TCY
pin
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FIGURE 27-4: ASYNCHRONOUS TRANSMISSION (BACK-TO-BACK)
TABLE 27-1: SUMMARY OF REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on
Page
APFCON C2OUTSEL CC1PSEL SDOSEL SCKSEL SDISEL TXSEL RXSEL CCP2SEL 119
BAUDCON ABDOVF RCIDL — SCKP BRG16 —WUE ABDEN 329
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 85
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 88
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 328
SPBRGL BRG<7:0> 330
SPBRGH BRG<15:8> 330
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 133
TXREG EUSART Transmit Data Register 319*
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 327
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for asynchronous transmission.
* Page provides register information.
Transmit Shift Reg.
Write to TXREG
BRG Output
(Shift Clock)
TX/CK
TRMT bit
(Transmit Shift
Reg. Empty Flag)
Word 1 Word 2
Word 1 Word 2
Start bit Stop bit Start bit
Transmit Shift Reg.
Word 1 Word 2
bit 0 bit 1 bit 7/8 bit 0
Note: This timing diagram shows two consecutive transmissions.
1 TCY
1 TCY
pin
TXIF bit
(Transmit Buffer
Reg. Empty Flag)
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27.1.2 EUSART ASYNCHRONOUS
RECEIVER
The Asynchronous mode is typically used in RS-232
systems. The receiver block diagram is shown in
Figure 27-2. The data is received on the RX/DT pin and
drives the data recovery block. The data recovery block
is actually a high-speed shifter operating at 16 times
the baud rate, whereas the serial Receive Shift
Register (RSR) operates at the bit rate. When all 8 or 9
bits of the character have been shifted in, they are
immediately transferred to a two character
First-In-First-Out (FIFO) memory. The FIFO buffering
allows reception of two complete characters and the
start of a third character before software must start
servicing the EUSART receiver. The FIFO and RSR
registers are not directly accessible by software.
Access to the received data is via the RCREG register.
27.1.2.1 Enabling the Receiver
The EUSART receiver is enabled for asynchronous
operation by configuring the following three control bits:
• CREN = 1
• SYNC = 0
• SPEN = 1
All other EUSART control bits are assumed to be in
their default state.
Setting the CREN bit of the RCSTA register enables the
receiver circuitry of the EUSART. Clearing the SYNC bit
of the TXSTA register configures the EUSART for
asynchronous operation. Setting the SPEN bit of the
RCSTA register enables the EUSART. The programmer
must set the corresponding TRIS bit to configure the
RX/DT I/O pin as an input.
27.1.2.2 Receiving Data
The receiver data recovery circuit initiates character
reception on the falling edge of the first bit. The first bit,
also known as the Start bit, is always a zero. The data
recovery circuit counts one-half bit time to the center of
the Start bit and verifies that the bit is still a zero. If it is
not a zero then the data recovery circuit aborts
character reception, without generating an error, and
resumes looking for the falling edge of the Start bit. If
the Start bit zero verification succeeds then the data
recovery circuit counts a full bit time to the center of the
next bit. The bit is then sampled by a majority detect
circuit and the resulting ‘0’ or ‘1’ is shifted into the RSR.
This repeats until all data bits have been sampled and
shifted into the RSR. One final bit time is measured and
the level sampled. This is the Stop bit, which is always
a ‘1’. If the data recovery circuit samples a ‘0’ in the
Stop bit position then a framing error is set for this
character, otherwise the framing error is cleared for this
character. See Section 27.1.2.4 “Receive Framing
Error” for more information on framing errors.
Immediately after all data bits and the Stop bit have
been received, the character in the RSR is transferred
to the EUSART receive FIFO and the RCIF interrupt
flag bit of the PIR1 register is set. The top character in
the FIFO is transferred out of the FIFO by reading the
RCREG register.
27.1.2.3 Receive Interrupts
The RCIF interrupt flag bit of the PIR1 register is set
whenever the EUSART receiver is enabled and there is
an unread character in the receive FIFO. The RCIF
interrupt flag bit is read-only, it cannot be set or cleared
by software.
RCIF interrupts are enabled by setting all of the
following bits:
• RCIE, Interrupt Enable bit of the PIE1 register
• PEIE, Peripheral Interrupt Enable bit of the
INTCON register
• GIE, Global Interrupt Enable bit of the INTCON
register
The RCIF interrupt flag bit will be set when there is an
unread character in the FIFO, regardless of the state of
interrupt enable bits.
Note: If the RX/DT function is on an analog pin,
the corresponding ANSEL bit must be
cleared for the receiver to function.
Note: If the receive FIFO is overrun, no additional
characters will be received until the overrun
condition is cleared. See Section 27.1.2.5
“Receive Overrun Error” for more
information on overrun errors.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 323
PIC16(L)F1782/3
27.1.2.4 Receive Framing Error
Each character in the receive FIFO buffer has a
corresponding framing error Status bit. A framing error
indicates that a Stop bit was not seen at the expected
time. The framing error status is accessed via the
FERR bit of the RCSTA register. The FERR bit
represents the status of the top unread character in the
receive FIFO. Therefore, the FERR bit must be read
before reading the RCREG.
The FERR bit is read-only and only applies to the top
unread character in the receive FIFO. A framing error
(FERR = 1) does not preclude reception of additional
characters. It is not necessary to clear the FERR bit.
Reading the next character from the FIFO buffer will
advance the FIFO to the next character and the next
corresponding framing error.
The FERR bit can be forced clear by clearing the SPEN
bit of the RCSTA register which resets the EUSART.
Clearing the CREN bit of the RCSTA register does not
affect the FERR bit. A framing error by itself does not
generate an interrupt.
27.1.2.5 Receive Overrun Error
The receive FIFO buffer can hold two characters. An
overrun error will be generated if a third character, in its
entirety, is received before the FIFO is accessed. When
this happens the OERR bit of the RCSTA register is set.
The characters already in the FIFO buffer can be read
but no additional characters will be received until the
error is cleared. The error must be cleared by either
clearing the CREN bit of the RCSTA register or by
resetting the EUSART by clearing the SPEN bit of the
RCSTA register.
27.1.2.6 Receiving 9-bit Characters
The EUSART supports 9-bit character reception. When
the RX9 bit of the RCSTA register is set the EUSART
will shift 9 bits into the RSR for each character
received. The RX9D bit of the RCSTA register is the
ninth and Most Significant data bit of the top unread
character in the receive FIFO. When reading 9-bit data
from the receive FIFO buffer, the RX9D data bit must
be read before reading the 8 Least Significant bits from
the RCREG.
27.1.2.7 Address Detection
A special Address Detection mode is available for use
when multiple receivers share the same transmission
line, such as in RS-485 systems. Address detection is
enabled by setting the ADDEN bit of the RCSTA
register.
Address detection requires 9-bit character reception.
When address detection is enabled, only characters
with the ninth data bit set will be transferred to the
receive FIFO buffer, thereby setting the RCIF interrupt
bit. All other characters will be ignored.
Upon receiving an address character, user software
determines if the address matches its own. Upon
address match, user software must disable address
detection by clearing the ADDEN bit before the next
Stop bit occurs. When user software detects the end of
the message, determined by the message protocol
used, software places the receiver back into the
Address Detection mode by setting the ADDEN bit.
Note: If all receive characters in the receive
FIFO have framing errors, repeated reads
of the RCREG will not clear the FERR bit.
PIC16(L)F1782/3
DS41579C-page 324 Preliminary 2011-2012 Microchip Technology Inc.
27.1.2.8 Asynchronous Reception Set-up:
1. Initialize the SPBRGH, SPBRGL register pair
and the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 27.4 “EUSART
Baud Rate Generator (BRG)”).
2. Clear the ANSEL bit for the RX pin (if applicable).
3. Enable the serial port by setting the SPEN bit.
The SYNC bit must be clear for asynchronous
operation.
4. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
5. If 9-bit reception is desired, set the RX9 bit.
6. Enable reception by setting the CREN bit.
7. The RCIF interrupt flag bit will be set when a
character is transferred from the RSR to the
receive buffer. An interrupt will be generated if
the RCIE interrupt enable bit was also set.
8. Read the RCSTA register to get the error flags
and, if 9-bit data reception is enabled, the ninth
data bit.
9. Get the received 8 Least Significant data bits
from the receive buffer by reading the RCREG
register.
10. If an overrun occurred, clear the OERR flag by
clearing the CREN receiver enable bit.
27.1.2.9 9-bit Address Detection Mode Set-up
This mode would typically be used in RS-485 systems.
To set up an Asynchronous Reception with Address
Detect Enable:
1. Initialize the SPBRGH, SPBRGL register pair
and the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 27.4 “EUSART
Baud Rate Generator (BRG)”).
2. Clear the ANSEL bit for the RX pin (if applicable).
3. Enable the serial port by setting the SPEN bit.
The SYNC bit must be clear for asynchronous
operation.
4. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
5. Enable 9-bit reception by setting the RX9 bit.
6. Enable address detection by setting the ADDEN
bit.
7. Enable reception by setting the CREN bit.
8. The RCIF interrupt flag bit will be set when a
character with the ninth bit set is transferred
from the RSR to the receive buffer. An interrupt
will be generated if the RCIE interrupt enable bit
was also set.
9. Read the RCSTA register to get the error flags.
The ninth data bit will always be set.
10. Get the received 8 Least Significant data bits
from the receive buffer by reading the RCREG
register. Software determines if this is the
device’s address.
11. If an overrun occurred, clear the OERR flag by
clearing the CREN receiver enable bit.
12. If the device has been addressed, clear the
ADDEN bit to allow all received data into the
receive buffer and generate interrupts.
FIGURE 27-5: ASYNCHRONOUS RECEPTION
Start
bit bit 7/8
bit 1bit 0 bit 7/8 bit 0Stop
bit
Start
bit
Start
bit
bit 7/8 Stop
bit
RX/DT pin
Reg
Rcv Buffer Reg.
Rcv Shift
Read Rcv
Buffer Reg.
RCREG
RCIF
(Interrupt Flag)
OERR bit
CREN
Word 1
RCREG
Word 2
RCREG
Stop
bit
Note: This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after the third word,
causing the OERR (overrun) bit to be set.
RCIDL
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 325
PIC16(L)F1782/3
TABLE 27-2: SUMMARY OF REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
APFCON C2OUTSEL CC1PSEL SDOSEL SCKSEL SDISEL TXSEL RXSEL CCP2SEL 119
BAUDCON ABDOVF RCIDL — SCKP BRG16 —WUE ABDEN 329
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 85
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 88
RCREG EUSART Receive Data Register 322*
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 328
SPBRGL BRG<7:0> 330
SPBRGH BRG<15:8> 330
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 133
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 327
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for asynchronous reception.
* Page provides register information.
PIC16(L)F1782/3
DS41579C-page 326 Preliminary 2011-2012 Microchip Technology Inc.
27.2 Clock Accuracy with
Asynchronous Operation
The factory calibrates the internal oscillator block out-
put (INTOSC). However, the INTOSC frequency may
drift as VDD or temperature changes, and this directly
affects the asynchronous baud rate. Two methods may
be used to adjust the baud rate clock, but both require
a reference clock source of some kind.
The first (preferred) method uses the OSCTUNE
register to adjust the INTOSC output. Adjusting the
value in the OSCTUNE register allows for fine resolution
changes to the system clock source. See Section 6.2.2
“Internal Clock Sources” for more information.
The other method adjusts the value in the Baud Rate
Generator. This can be done automatically with the
Auto-Baud Detect feature (see Section 27.4.1
“Auto-Baud Detect”). There may not be fine enough
resolution when adjusting the Baud Rate Generator to
compensate for a gradual change in the peripheral
clock frequency.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 327
PIC16(L)F1782/3
27.3 Register Definitions: EUSART Control
REGISTER 27-1: TXSTA: TRANSMIT STATUS AND CONTROL REGISTER
R/W-/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-1/1 R/W-0/0
CSRC TX9 TXEN(1) SYNC SENDB BRGH TRMT TX9D
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 CSRC: Clock Source Select bit
Asynchronous mode:
Don’t care
Synchronous mode:
1 = Master mode (clock generated internally from BRG)
0 = Slave mode (clock from external source)
bit 6 TX9: 9-bit Transmit Enable bit
1 = Selects 9-bit transmission
0 = Selects 8-bit transmission
bit 5 TXEN: Transmit Enable bit(1)
1 = Transmit enabled
0 = Transmit disabled
bit 4 SYNC: EUSART Mode Select bit
1 = Synchronous mode
0 = Asynchronous mode
bit 3 SENDB: Send Break Character bit
Asynchronous mode:
1 = Send Sync Break on next transmission (cleared by hardware upon completion)
0 = Sync Break transmission completed
Synchronous mode:
Don’t care
bit 2 BRGH: High Baud Rate Select bit
Asynchronous mode:
1 = High speed
0 = Low speed
Synchronous mode:
Unused in this mode
bit 1 TRMT: Transmit Shift Register Status bit
1 = TSR empty
0 = TSR full
bit 0 TX9D: Ninth bit of Transmit Data
Can be address/data bit or a parity bit.
Note 1: SREN/CREN overrides TXEN in Sync mode.
PIC16(L)F1782/3
DS41579C-page 328 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 27-2: RCSTA: RECEIVE STATUS AND CONTROL REGISTER (1)
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0 R-0/0 R-0/0
SPEN RX9 SREN CREN ADDEN FERR OERR RX9D
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 SPEN: Serial Port Enable bit
1 = Serial port enabled (configures RX/DT and TX/CK pins as serial port pins)
0 = Serial port disabled (held in Reset)
bit 6 RX9: 9-bit Receive Enable bit
1 = Selects 9-bit reception
0 = Selects 8-bit reception
bit 5 SREN: Single Receive Enable bit
Asynchronous mode:
Don’t care
Synchronous mode – Master:
1 = Enables single receive
0 = Disables single receive
This bit is cleared after reception is complete.
Synchronous mode – Slave
Don’t care
bit 4 CREN: Continuous Receive Enable bit
Asynchronous mode:
1 = Enables receiver
0 = Disables receiver
Synchronous mode:
1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN)
0 = Disables continuous receive
bit 3 ADDEN: Address Detect Enable bit
Asynchronous mode 9-bit (RX9 = 1):
1 = Enables address detection, enable interrupt and load the receive buffer when RSR<8> is set
0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit
Asynchronous mode 8-bit (RX9 = 0):
Don’t care
bit 2 FERR: Framing Error bit
1 = Framing error (can be updated by reading RCREG register and receive next valid byte)
0 = No framing error
bit 1 OERR: Overrun Error bit
1 = Overrun error (can be cleared by clearing bit CREN)
0 = No overrun error
bit 0 RX9D: Ninth bit of Received Data
This can be address/data bit or a parity bit and must be calculated by user firmware.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 329
PIC16(L)F1782/3
REGISTER 27-3: BAUDCON: BAUD RATE CONTROL REGISTER
R-0/0 R-1/1 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0
ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 ABDOVF: Auto-Baud Detect Overflow bit
Asynchronous mode:
1 = Auto-baud timer overflowed
0 = Auto-baud timer did not overflow
Synchronous mode:
Don’t care
bit 6 RCIDL: Receive Idle Flag bit
Asynchronous mode:
1 = Receiver is Idle
0 = Start bit has been received and the receiver is receiving
Synchronous mode:
Don’t care
bit 5 Unimplemented: Read as ‘0’
bit 4 SCKP: Synchronous Clock Polarity Select bit
Asynchronous mode:
1 = Transmit inverted data to the TX/CK pin
0 = Transmit non-inverted data to the TX/CK pin
Synchronous mode:
1 = Data is clocked on rising edge of the clock
0 = Data is clocked on falling edge of the clock
bit 3 BRG16: 16-bit Baud Rate Generator bit
1 = 16-bit Baud Rate Generator is used
0 = 8-bit Baud Rate Generator is used
bit 2 Unimplemented: Read as ‘0’
bit 1 WUE: Wake-up Enable bit
Asynchronous mode:
1 = Receiver is waiting for a falling edge. No character will be received, byte RCIF will be set. WUE
will automatically clear after RCIF is set.
0 = Receiver is operating normally
Synchronous mode:
Don’t care
bit 0 ABDEN: Auto-Baud Detect Enable bit
Asynchronous mode:
1 = Auto-Baud Detect mode is enabled (clears when auto-baud is complete)
0 = Auto-Baud Detect mode is disabled
Synchronous mode:
Don’t care
PIC16(L)F1782/3
DS41579C-page 330 Preliminary 2011-2012 Microchip Technology Inc.
27.4 EUSART Baud Rate Generator
(BRG)
The Baud Rate Generator (BRG) is an 8-bit or 16-bit
timer that is dedicated to the support of both the
asynchronous and synchronous EUSART operation.
By default, the BRG operates in 8-bit mode. Setting the
BRG16 bit of the BAUDCON register selects 16-bit
mode.
The SPBRGH, SPBRGL register pair determines the
period of the free running baud rate timer. In
Asynchronous mode the multiplier of the baud rate
period is determined by both the BRGH bit of the TXSTA
register and the BRG16 bit of the BAUDCON register. In
Synchronous mode, the BRGH bit is ignored.
Table 27-3 contains the formulas for determining the
baud rate. Example 27-1 provides a sample calculation
for determining the baud rate and baud rate error.
Typical baud rates and error values for various
asynchronous modes have been computed for your
convenience and are shown in Table 27-3. It may be
advantageous to use the high baud rate (BRGH = 1),
or the 16-bit BRG (BRG16 = 1) to reduce the baud rate
error. The 16-bit BRG mode is used to achieve slow
baud rates for fast oscillator frequencies.
Writing a new value to the SPBRGH, SPBRGL register
pair causes the BRG timer to be reset (or cleared). This
ensures that the BRG does not wait for a timer overflow
before outputting the new baud rate.
If the system clock is changed during an active receive
operation, a receive error or data loss may result. To
avoid this problem, check the status of the RCIDL bit to
make sure that the receive operation is Idle before
changing the system clock.
EXAMPLE 27-1: CALCULATING BAUD
RATE ERROR
For a device with FOSC of 16 MHz, desired baud rate
of 9600, Asynchronous mode, 8-bit BRG:
Solving for SPBRGH:SPBRGL:
X
FOSC
Desired Baud Rate
---------------------------------------------
64
--------------------------------------------- 1–=
Desired Baud Rate FOSC
64 [SPBRGH:SPBRGL] 1+
------------------------------------------------------------------------=
16000000
9600
------------------------
64
------------------------1–=
25.04225==
Calculated Baud Rate 16000000
64 25 1+
---------------------------=
9615=
Error Calc. Baud Rate Desired Baud Rate –
Desired Baud Rate
--------------------------------------------------------------------------------------------=
9615 9600–
9600
---------------------------------- 0 . 1 6 %==
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 331
PIC16(L)F1782/3
TABLE 27-3: BAUD RATE FORMULAS
TABLE 27-4: SUMMARY OF REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR
Configuration Bits
BRG/EUSART Mode Baud Rate Formula
SYNC BRG16 BRGH
000 8-bit/Asynchronous FOSC/[64 (n+1)]
001 8-bit/Asynchronous FOSC/[16 (n+1)]
010 16-bit/Asynchronous
011 16-bit/Asynchronous
FOSC/[4 (n+1)]10x 8-bit/Synchronous
11x 16-bit/Synchronous
Legend: x = Don’t care, n = value of SPBRGH, SPBRGL register pair
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BAUDCON ABDOVF RCIDL —SCKP BRG16 —WUE ABDEN 329
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 328
SPBRGL BRG<7:0> 330
SPBRGH BRG<15:8> 330
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 327
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for the baud rate generator.
* Page provides register information.
PIC16(L)F1782/3
DS41579C-page 332 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 27-5: BAUD RATES FOR ASYNCHRONOUS MODES
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 0
FOSC = 32.000 MHz FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300—— — —— — —— — —— —
1200 — — — 1221 1.73 255 1200 0.00 239 1200 0.00 143
2400 2404 0.16 207 2404 0.16 129 2400 0.00 119 2400 0.00 71
9600 9615 0.16 51 9470 -1.36 32 9600 0.00 29 9600 0.00 17
10417 10417 0.00 47 10417 0.00 29 10286 -1.26 27 10165 -2.42 16
19.2k 19.23k 0.16 25 19.53k 1.73 15 19.20k 0.00 14 19.20k 0.00 8
57.6k 55.55k -3.55 3 — — — 57.60k 0.00 7 57.60k 0.00 2
115.2k — — — — — — — — — — — —
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 0
FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 — — — 300 0.16 207 300 0.00 191 300 0.16 51
1200 1202 0.16 103 1202 0.16 51 1200 0.00 47 1202 0.16 12
2400 2404 0.16 51 2404 0.16 25 2400 0.00 23 — — —
9600 9615 0.16 12 — — — 9600 0.00 5 — — —
10417 10417 0.00 11 10417 0.00 5 — — — — — —
19.2k — — — — — — 19.20k 0.00 2 — — —
57.6k — — — — — — 57.60k 0.00 0 — — —
115.2k — — — — — — — — — — — —
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 0
FOSC = 32.000 MHz FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 —— — —— — —— — —— —
1200 — — — — — — — — — — — —
2400 — — — — — — — — — —— —
9600 9615 0.16 207 9615 0.16 129 9600 0.00 119 9600 0.00 71
10417 10417 0.00 191 10417 0.00 119 10378 -0.37 110 10473 0.53 65
19.2k 19.23k 0.16 103 19.23k 0.16 64 19.20k 0.00 59 19.20k 0.00 35
57.6k 57.14k -0.79 34 56.82k -1.36 21 57.60k 0.00 19 57.60k 0.00 11
115.2k 117.64k 2.12 16 113.64k -1.36 10 115.2k 0.00 9 115.2k 0.00 5
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 333
PIC16(L)F1782/3
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 0
FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 —— — — — — — — — 300 0.16 207
1200 — — — 1202 0.16 207 1200 0.00 191 1202 0.16 51
2400 2404 0.16 207 2404 0.16 103 2400 0.00 95 2404 0.16 25
9600 9615 0.16 51 9615 0.16 25 9600 0.00 23 — — —
10417 10417 0.00 47 10417 0.00 23 10473 0.53 21 10417 0.00 5
19.2k 19231 0.16 25 19.23k 0.16 12 19.2k 0.00 11 — — —
57.6k 55556 -3.55 8 — — — 57.60k 0.00 3 — — —
115.2k — — — — — — 115.2k 0.00 1 — — —
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 1
FOSC = 32.000 MHz FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 300.0 0.00 6666 300.0 -0.01 4166 300.0 0.00 3839 300.0 0.00 2303
1200 1200 -0.02 3332 1200 -0.03 1041 1200 0.00 959 1200 0.00 575
2400 2401 -0.04 832 2399 -0.03 520 2400 0.00 479 2400 0.00 287
9600 9615 0.16 207 9615 0.16 129 9600 0.00 119 9600 0.00 71
10417 10417 0.00 191 10417 0.00 119 10378 -0.37 110 10473 0.53 65
19.2k 19.23k 0.16 103 19.23k 0.16 64 19.20k 0.00 59 19.20k 0.00 35
57.6k 57.14k -0.79 34 56.818 -1.36 21 57.60k 0.00 19 57.60k 0.00 11
115.2k 117.6k 2.12 16 113.636 -1.36 10 115.2k 0.00 9 115.2k 0.00 5
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 1
FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 299.9 -0.02 1666 300.1 0.04 832 300.0 0.00 767 300.5 0.16 207
1200 1199 -0.08 416 1202 0.16 207 1200 0.00 191 1202 0.16 51
2400 2404 0.16 207 2404 0.16 103 2400 0.00 95 2404 0.16 25
9600 9615 0.16 51 9615 0.16 25 9600 0.00 23 — — —
10417 10417 0.00 47 10417 0.00 23 10473 0.53 21 10417 0.00 5
19.2k 19.23k 0.16 25 19.23k 0.16 12 19.20k 0.00 11 — — —
57.6k 55556 -3.55 8 — — — 57.60k 0.00 3 — — —
115.2k — — — — — — 115.2k 0.00 1 — — —
TABLE 27-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
PIC16(L)F1782/3
DS41579C-page 334 Preliminary 2011-2012 Microchip Technology Inc.
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
FOSC = 32.000 MHz FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 300.0 0.00 26666 300.0 0.00 16665 300.0 0.00 15359 300.0 0.00 9215
1200 1200 0.00 6666 1200 -0.01 4166 1200 0.00 3839 1200 0.00 2303
2400 2400 0.01 3332 2400 0.02 2082 2400 0.00 1919 2400 0.00 1151
9600 9604 0.04 832 9597 -0.03 520 9600 0.00 479 9600 0.00 287
10417 10417 0.00 767 10417 0.00 479 10425 0.08 441 10433 0.16 264
19.2k 19.18k -0.08 416 19.23k 0.16 259 19.20k 0.00 239 19.20k 0.00 143
57.6k 57.55k -0.08 138 57.47k -0.22 86 57.60k 0.00 79 57.60k 0.00 47
115.2k 115.9k 0.64 68 116.3k 0.94 42 115.2k 0.00 39 115.2k 0.00 23
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 300.0 0.00 6666 300.0 0.01 3332 300.0 0.00 3071 300.1 0.04 832
1200 1200 -0.02 1666 1200 0.04 832 1200 0.00 767 1202 0.16 207
2400 2401 0.04 832 2398 0.08 416 2400 0.00 383 2404 0.16 103
9600 9615 0.16 207 9615 0.16 103 9600 0.00 95 9615 0.16 25
10417 10417 0 191 10417 0.00 95 10473 0.53 87 10417 0.00 23
19.2k 19.23k 0.16 103 19.23k 0.16 51 19.20k 0.00 47 19.23k 0.16 12
57.6k 57.14k -0.79 34 58.82k 2.12 16 57.60k 0.00 15 — — —
115.2k 117.6k 2.12 16 111.1k -3.55 8 115.2k 0.00 7 — — —
TABLE 27-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 335
PIC16(L)F1782/3
27.4.1 AUTO-BAUD DETECT
The EUSART module supports automatic detection
and calibration of the baud rate.
In the Auto-Baud Detect (ABD) mode, the clock to the
BRG is reversed. Rather than the BRG clocking the
incoming RX signal, the RX signal is timing the BRG.
The Baud Rate Generator is used to time the period of
a received 55h (ASCII “U”) which is the Sync character
for the LIN bus. The unique feature of this character is
that it has five rising edges including the Stop bit edge.
Setting the ABDEN bit of the BAUDCON register starts
the auto-baud calibration sequence (Figure 27-6).
While the ABD sequence takes place, the EUSART
state machine is held in Idle. On the first rising edge of
the receive line, after the Start bit, the SPBRG begins
counting up using the BRG counter clock as shown in
Table 27-6. The fifth rising edge will occur on the RX pin
at the end of the eighth bit period. At that time, an
accumulated value totaling the proper BRG period is
left in the SPBRGH, SPBRGL register pair, the ABDEN
bit is automatically cleared and the RCIF interrupt flag
is set. The value in the RCREG needs to be read to
clear the RCIF interrupt. RCREG content should be
discarded. When calibrating for modes that do not use
the SPBRGH register the user can verify that the
SPBRGL register did not overflow by checking for 00h
in the SPBRGH register.
The BRG auto-baud clock is determined by the BRG16
and BRGH bits as shown in Table 27-6. During ABD,
both the SPBRGH and SPBRGL registers are used as
a 16-bit counter, independent of the BRG16 bit setting.
While calibrating the baud rate period, the SPBRGH
and SPBRGL registers are clocked at 1/8th the BRG
base clock rate. The resulting byte measurement is the
average bit time when clocked at full speed.
TABLE 27-6: BRG COUNTER CLOCK RATES
FIGURE 27-6: AUTOMATIC BAUD RATE CALIBRATION
Note 1: If the WUE bit is set with the ABDEN bit,
auto-baud detection will occur on the byte
following the Break character (see
Section 27.4.3 “Auto-Wake-up on
Break”).
2: It is up to the user to determine that the
incoming character baud rate is within the
range of the selected BRG clock source.
Some combinations of oscillator frequency
and EUSART baud rates are not possible.
3: During the auto-baud process, the
auto-baud counter starts counting at 1.
Upon completion of the auto-baud
sequence, to achieve maximum accuracy,
subtract 1 from the SPBRGH:SPBRGL reg-
ister pair.
BRG16 BRGH BRG Base
Clock
BRG ABD
Clock
00FOSC/64 FOSC/512
01FOSC/16 FOSC/128
10FOSC/16 FOSC/128
11 FOSC/4 FOSC/32
Note: During the ABD sequence, SPBRGL and
SPBRGH registers are both used as a 16-bit
counter, independent of BRG16 setting.
BRG Value
RX pin
ABDEN bit
RCIF bit
bit 0 bit 1
(Interrupt)
Read
RCREG
BRG Clock
Start
Auto Cleared
Set by User
XXXXh 0000h
Edge #1
bit 2 bit 3
Edge #2
bit 4 bit 5
Edge #3
bit 6 bit 7
Edge #4
Stop bit
Edge #5
001Ch
Note 1: The ABD sequence requires the EUSART module to be configured in Asynchronous mode.
SPBRGL XXh 1Ch
SPBRGH XXh 00h
RCIDL
PIC16(L)F1782/3
DS41579C-page 336 Preliminary 2011-2012 Microchip Technology Inc.
27.4.2 AUTO-BAUD OVERFLOW
During the course of automatic baud detection, the
ABDOVF bit of the BAUDCON register will be set if the
baud rate counter overflows before the fifth rising edge
is detected on the RX pin. The ABDOVF bit indicates
that the counter has exceeded the maximum count that
can fit in the 16 bits of the SPBRGH:SPBRGL register
pair. After the ABDOVF bit has been set, the counter
continues to count until the fifth rising edge is detected
on the RX pin. Upon detecting the fifth RX edge, the
hardware will set the RCIF interrupt flag and clear the
ABDEN bit of the BAUDCON register. The RCIF flag
can be subsequently cleared by reading the RCREG
register. The ABDOVF flag of the BAUDCON register
can be cleared by software directly.
To terminate the auto-baud process before the RCIF
flag is set, clear the ABDEN bit then clear the ABDOVF
bit of the BAUDCON register. The ABDOVF bit will
remain set if the ABDEN bit is not cleared first.
27.4.3 AUTO-WAKE-UP ON BREAK
During Sleep mode, all clocks to the EUSART are
suspended. Because of this, the Baud Rate Generator
is inactive and a proper character reception cannot be
performed. The Auto-Wake-up feature allows the
controller to wake-up due to activity on the RX/DT line.
This feature is available only in Asynchronous mode.
The Auto-Wake-up feature is enabled by setting the
WUE bit of the BAUDCON register. Once set, the normal
receive sequence on RX/DT is disabled, and the
EUSART remains in an Idle state, monitoring for a
wake-up event independent of the CPU mode. A
wake-up event consists of a high-to-low transition on the
RX/DT line. (This coincides with the start of a Sync Break
or a wake-up signal character for the LIN protocol.)
The EUSART module generates an RCIF interrupt
coincident with the wake-up event. The interrupt is
generated synchronously to the Q clocks in normal CPU
operating modes (Figure 27-7), and asynchronously if
the device is in Sleep mode (Figure 27-8). The interrupt
condition is cleared by reading the RCREG register.
The WUE bit is automatically cleared by the low-to-high
transition on the RX line at the end of the Break. This
signals to the user that the Break event is over. At this
point, the EUSART module is in Idle mode waiting to
receive the next character.
27.4.3.1 Special Considerations
Break Character
To avoid character errors or character fragments during
a wake-up event, the wake-up character must be all
zeros.
When the wake-up is enabled the function works
independent of the low time on the data stream. If the
WUE bit is set and a valid non-zero character is
received, the low time from the Start bit to the first rising
edge will be interpreted as the wake-up event. The
remaining bits in the character will be received as a
fragmented character and subsequent characters can
result in framing or overrun errors.
Therefore, the initial character in the transmission must
be all ‘0’s. This must be 10 or more bit times, 13-bit
times recommended for LIN bus, or any number of bit
times for standard RS-232 devices.
Oscillator Start-up Time
Oscillator start-up time must be considered, especially
in applications using oscillators with longer start-up
intervals (i.e., LP, XT or HS/PLL mode). The Sync
Break (or wake-up signal) character must be of
sufficient length, and be followed by a sufficient
interval, to allow enough time for the selected oscillator
to start and provide proper initialization of the EUSART.
WUE Bit
The wake-up event causes a receive interrupt by
setting the RCIF bit. The WUE bit is cleared in
hardware by a rising edge on RX/DT. The interrupt
condition is then cleared in software by reading the
RCREG register and discarding its contents.
To ensure that no actual data is lost, check the RCIDL
bit to verify that a receive operation is not in process
before setting the WUE bit. If a receive operation is not
occurring, the WUE bit may then be set just prior to
entering the Sleep mode.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 337
PIC16(L)F1782/3
FIGURE 27-7: AUTO-WAKE-UP BIT (WUE) TIMING DURING NORMAL OPERATION
FIGURE 27-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
WUE bit
RX/DT Line
RCIF
Bit set by user Auto Cleared
Cleared due to User Read of RCREG
Note 1: The EUSART remains in Idle while the WUE bit is set.
Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4
OSC1
WUE bit
RX/DT Line
RCIF
Bit Set by User Auto Cleared
Cleared due to User Read of RCREG
Sleep Command Executed
Note 1
Note 1: If the wake-up event requires long oscillator warm-up time, the automatic clearing of the WUE bit can occur while the stposc signal is
still active. This sequence should not depend on the presence of Q clocks.
2: The EUSART remains in Idle while the WUE bit is set.
Sleep Ends
PIC16(L)F1782/3
DS41579C-page 338 Preliminary 2011-2012 Microchip Technology Inc.
27.4.4 BREAK CHARACTER SEQUENCE
The EUSART module has the capability of sending the
special Break character sequences that are required by
the LIN bus standard. A Break character consists of a
Start bit, followed by 12 ‘0’ bits and a Stop bit.
To send a Break character, set the SENDB and TXEN
bits of the TXSTA register. The Break character trans-
mission is then initiated by a write to the TXREG. The
value of data written to TXREG will be ignored and all
‘0’s will be transmitted.
The SENDB bit is automatically reset by hardware after
the corresponding Stop bit is sent. This allows the user
to preload the transmit FIFO with the next transmit byte
following the Break character (typically, the Sync
character in the LIN specification).
The TRMT bit of the TXSTA register indicates when the
transmit operation is active or Idle, just as it does during
normal transmission. See Figure 27-9 for the timing of
the Break character sequence.
27.4.4.1 Break and Sync Transmit Sequence
The following sequence will start a message frame
header made up of a Break, followed by an auto-baud
Sync byte. This sequence is typical of a LIN bus
master.
1. Configure the EUSART for the desired mode.
2. Set the TXEN and SENDB bits to enable the
Break sequence.
3. Load the TXREG with a dummy character to
initiate transmission (the value is ignored).
4. Write ‘55h’ to TXREG to load the Sync character
into the transmit FIFO buffer.
5. After the Break has been sent, the SENDB bit is
reset by hardware and the Sync character is
then transmitted.
When the TXREG becomes empty, as indicated by the
TXIF, the next data byte can be written to TXREG.
27.4.5 RECEIVING A BREAK CHARACTER
The Enhanced EUSART module can receive a Break
character in two ways.
The first method to detect a Break character uses the
FERR bit of the RCSTA register and the Received data
as indicated by RCREG. The Baud Rate Generator is
assumed to have been initialized to the expected baud
rate.
A Break character has been received when;
• RCIF bit is set
• FERR bit is set
• RCREG = 00h
The second method uses the Auto-Wake-up feature
described in Section 27.4.3 “Auto-Wake-up on
Break”. By enabling this feature, the EUSART will
sample the next two transitions on RX/DT, cause an
RCIF interrupt, and receive the next data byte followed
by another interrupt.
Note that following a Break character, the user will
typically want to enable the Auto-Baud Detect feature.
For both methods, the user can set the ABDEN bit of
the BAUDCON register before placing the EUSART in
Sleep mode.
FIGURE 27-9: SEND BREAK CHARACTER SEQUENCE
Write to TXREG Dummy Write
BRG Output
(Shift Clock)
Start bit bit 0 bit 1 bit 11 Stop bit
Break
TXIF bit
(Transmit
Interrupt Flag)
TX (pin)
TRMT bit
(Transmit Shift
Empty Flag)
SENDB
(send Break
control bit)
SENDB Sampled Here Auto Cleared
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 339
PIC16(L)F1782/3
27.5 EUSART Synchronous Mode
Synchronous serial communications are typically used
in systems with a single master and one or more
slaves. The master device contains the necessary cir-
cuitry for baud rate generation and supplies the clock
for all devices in the system. Slave devices can take
advantage of the master clock by eliminating the inter-
nal clock generation circuitry.
There are two signal lines in Synchronous mode: a bidi-
rectional data line and a clock line. Slaves use the
external clock supplied by the master to shift the serial
data into and out of their respective receive and trans-
mit shift registers. Since the data line is bidirectional,
synchronous operation is half-duplex only. Half-duplex
refers to the fact that master and slave devices can
receive and transmit data but not both simultaneously.
The EUSART can operate as either a master or slave
device.
Start and Stop bits are not used in synchronous trans-
missions.
27.5.1 SYNCHRONOUS MASTER MODE
The following bits are used to configure the EUSART
for Synchronous Master operation:
• SYNC = 1
• CSRC = 1
• SREN = 0 (for transmit); SREN = 1 (for receive)
• CREN = 0 (for transmit); CREN = 1 (for receive)
• SPEN = 1
Setting the SYNC bit of the TXSTA register configures
the device for synchronous operation. Setting the CSRC
bit of the TXSTA register configures the device as a
master. Clearing the SREN and CREN bits of the RCSTA
register ensures that the device is in the Transmit mode,
otherwise the device will be configured to receive. Setting
the SPEN bit of the RCSTA register enables the
EUSART.
27.5.1.1 Master Clock
Synchronous data transfers use a separate clock line,
which is synchronous with the data. A device config-
ured as a master transmits the clock on the TX/CK line.
The TX/CK pin output driver is automatically enabled
when the EUSART is configured for synchronous
transmit or receive operation. Serial data bits change
on the leading edge to ensure they are valid at the trail-
ing edge of each clock. One clock cycle is generated
for each data bit. Only as many clock cycles are gener-
ated as there are data bits.
27.5.1.2 Clock Polarity
A clock polarity option is provided for Microwire
compatibility. Clock polarity is selected with the SCKP
bit of the BAUDCON register. Setting the SCKP bit sets
the clock Idle state as high. When the SCKP bit is set,
the data changes on the falling edge of each clock.
Clearing the SCKP bit sets the Idle state as low. When
the SCKP bit is cleared, the data changes on the rising
edge of each clock.
27.5.1.3 Synchronous Master Transmission
Data is transferred out of the device on the RX/DT pin.
The RX/DT and TX/CK pin output drivers are automat-
ically enabled when the EUSART is configured for syn-
chronous master transmit operation.
A transmission is initiated by writing a character to the
TXREG register. If the TSR still contains all or part of a
previous character the new character data is held in the
TXREG until the last bit of the previous character has
been transmitted. If this is the first character, or the pre-
vious character has been completely flushed from the
TSR, the data in the TXREG is immediately transferred
to the TSR. The transmission of the character com-
mences immediately following the transfer of the data
to the TSR from the TXREG.
Each data bit changes on the leading edge of the mas-
ter clock and remains valid until the subsequent leading
clock edge.
27.5.1.4 Synchronous Master Transmission
Set-up:
1. Initialize the SPBRGH, SPBRGL register pair
and the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 27.4 “EUSART
Baud Rate Generator (BRG)”).
2. Enable the synchronous master serial port by
setting bits SYNC, SPEN and CSRC.
3. Disable Receive mode by clearing bits SREN
and CREN.
4. Enable Transmit mode by setting the TXEN bit.
5. If 9-bit transmission is desired, set the TX9 bit.
6. If interrupts are desired, set the TXIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
7. If 9-bit transmission is selected, the ninth bit
should be loaded in the TX9D bit.
8. Start transmission by loading data to the TXREG
register.
Note: The TSR register is not mapped in data
memory, so it is not available to the user.
PIC16(L)F1782/3
DS41579C-page 340 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 27-10: SYNCHRONOUS TRANSMISSION
FIGURE 27-11: SYNCHRONOUS TRANSMISSION (THROUGH TXEN)
TABLE 27-7: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER
TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
APFCON C2OUTSEL CC1PSEL SDOSEL SCKSEL SDISEL TXSEL RXSEL CCP2SEL 119
BAUDCON ABDOVF RCIDL — SCKP BRG16 —WUE ABDEN 329
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 85
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 88
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 328
SPBRGL BRG<7:0> 330
SPBRGH BRG<15:8> 330
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 133
TXREG EUSART Transmit Data Register 319*
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 327
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for synchronous master transmission.
* Page provides register information.
bit 0 bit 1 bit 7
Word 1
bit 2 bit 0 bit 1 bit 7
RX/DT
Write to
TXREG Reg
TXIF bit
(Interrupt Flag)
TXEN bit ‘1’ ‘1’
Word 2
TRMT bit
Write Word 1 Write Word 2
Note: Sync Master mode, SPBRGL = 0, continuous transmission of two 8-bit words.
pin
TX/CK pin
TX/CK pin
(SCKP = 0)
(SCKP = 1)
RX/DT pin
TX/CK pin
Write to
TXREG reg
TXIF bit
TRMT bit
bit 0 bit 1 bit 2 bit 6 bit 7
TXEN bit
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 341
PIC16(L)F1782/3
27.5.1.5 Synchronous Master Reception
Data is received at the RX/DT pin. The RX/DT pin
output driver is automatically disabled when the
EUSART is configured for synchronous master receive
operation.
In Synchronous mode, reception is enabled by setting
either the Single Receive Enable bit (SREN of the
RCSTA register) or the Continuous Receive Enable bit
(CREN of the RCSTA register).
When SREN is set and CREN is clear, only as many
clock cycles are generated as there are data bits in a
single character. The SREN bit is automatically cleared
at the completion of one character. When CREN is set,
clocks are continuously generated until CREN is
cleared. If CREN is cleared in the middle of a character
the CK clock stops immediately and the partial charac-
ter is discarded. If SREN and CREN are both set, then
SREN is cleared at the completion of the first character
and CREN takes precedence.
To initiate reception, set either SREN or CREN. Data is
sampled at the RX/DT pin on the trailing edge of the
TX/CK clock pin and is shifted into the Receive Shift
Register (RSR). When a complete character is
received into the RSR, the RCIF bit is set and the char-
acter is automatically transferred to the two character
receive FIFO. The Least Significant eight bits of the top
character in the receive FIFO are available in RCREG.
The RCIF bit remains set as long as there are unread
characters in the receive FIFO.
27.5.1.6 Slave Clock
Synchronous data transfers use a separate clock line,
which is synchronous with the data. A device configured
as a slave receives the clock on the TX/CK line. The
TX/CK pin output driver is automatically disabled when
the device is configured for synchronous slave transmit
or receive operation. Serial data bits change on the
leading edge to ensure they are valid at the trailing edge
of each clock. One data bit is transferred for each clock
cycle. Only as many clock cycles should be received as
there are data bits.
27.5.1.7 Receive Overrun Error
The receive FIFO buffer can hold two characters. An
overrun error will be generated if a third character, in its
entirety, is received before RCREG is read to access
the FIFO. When this happens the OERR bit of the
RCSTA register is set. Previous data in the FIFO will
not be overwritten. The two characters in the FIFO
buffer can be read, however, no additional characters
will be received until the error is cleared. The OERR bit
can only be cleared by clearing the overrun condition.
If the overrun error occurred when the SREN bit is set
and CREN is clear then the error is cleared by reading
RCREG. If the overrun occurred when the CREN bit is
set then the error condition is cleared by either clearing
the CREN bit of the RCSTA register or by clearing the
SPEN bit which resets the EUSART.
27.5.1.8 Receiving 9-bit Characters
The EUSART supports 9-bit character reception. When
the RX9 bit of the RCSTA register is set the EUSART
will shift 9-bits into the RSR for each character
received. The RX9D bit of the RCSTA register is the
ninth, and Most Significant, data bit of the top unread
character in the receive FIFO. When reading 9-bit data
from the receive FIFO buffer, the RX9D data bit must
be read before reading the 8 Least Significant bits from
the RCREG.
27.5.1.9 Synchronous Master Reception
Set-up:
1. Initialize the SPBRGH, SPBRGL register pair for
the appropriate baud rate. Set or clear the
BRGH and BRG16 bits, as required, to achieve
the desired baud rate.
2. Clear the ANSEL bit for the RX pin (if applicable).
3. Enable the synchronous master serial port by
setting bits SYNC, SPEN and CSRC.
4. Ensure bits CREN and SREN are clear.
5. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
6. If 9-bit reception is desired, set bit RX9.
7. Start reception by setting the SREN bit or for
continuous reception, set the CREN bit.
8. Interrupt flag bit RCIF will be set when reception
of a character is complete. An interrupt will be
generated if the enable bit RCIE was set.
9. Read the RCSTA register to get the ninth bit (if
enabled) and determine if any error occurred
during reception.
10. Read the 8-bit received data by reading the
RCREG register.
11. If an overrun error occurs, clear the error by
either clearing the CREN bit of the RCSTA
register or by clearing the SPEN bit which resets
the EUSART.
Note: If the RX/DT function is on an analog pin,
the corresponding ANSEL bit must be
cleared for the receiver to function.
Note: If the device is configured as a slave and
the TX/CK function is on an analog pin, the
corresponding ANSEL bit must be cleared.
PIC16(L)F1782/3
DS41579C-page 342 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 27-12: SYNCHRONOUS RECEPTION (MASTER MODE, SREN)
TABLE 27-8: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER
RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
APFCON C2OUTSEL CC1PSEL SDOSEL SCKSEL SDISEL TXSEL RXSEL CCP2SEL 119
BAUDCON ABDOVF RCIDL — SCKP BRG16 —WUE ABDEN 329
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 85
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 88
RCREG EUSART Receive Data Register 322*
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 328
SPBRGL BRG<7:0> 330
SPBRGH BRG<15:8> 330
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 133
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 327
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for synchronous master reception.
* Page provides register information.
CREN bit
RX/DT
Write to
bit SREN
SREN bit
RCIF bit
(Interrupt)
Read
RCREG
‘0’
bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7
‘0’
Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0.
TX/CK pin
TX/CK pin
pin
(SCKP = 0)
(SCKP = 1)
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 343
PIC16(L)F1782/3
27.5.2 SYNCHRONOUS SLAVE MODE
The following bits are used to configure the EUSART
for synchronous slave operation:
• SYNC = 1
• CSRC = 0
• SREN = 0 (for transmit); SREN = 1 (for receive)
• CREN = 0 (for transmit); CREN = 1 (for receive)
• SPEN = 1
Setting the SYNC bit of the TXSTA register configures the
device for synchronous operation. Clearing the CSRC bit
of the TXSTA register configures the device as a slave.
Clearing the SREN and CREN bits of the RCSTA register
ensures that the device is in the Transmit mode,
otherwise the device will be configured to receive. Setting
the SPEN bit of the RCSTA register enables the
EUSART.
27.5.2.1 EUSART Synchronous Slave
Transmit
The operation of the Synchronous Master and Slave
modes are identical (see Section 27.5.1.3
“Synchronous Master Transmission”), except in the
case of the Sleep mode.
If two words are written to the TXREG and then the
SLEEP instruction is executed, the following will occur:
1. The first character will immediately transfer to
the TSR register and transmit.
2. The second word will remain in TXREG register.
3. The TXIF bit will not be set.
4. After the first character has been shifted out of
TSR, the TXREG register will transfer the second
character to the TSR and the TXIF bit will now be
set.
5. If the PEIE and TXIE bits are set, the interrupt
will wake the device from Sleep and execute the
next instruction. If the GIE bit is also set, the
program will call the Interrupt Service Routine.
27.5.2.2 Synchronous Slave Transmission
Set-up:
1. Set the SYNC and SPEN bits and clear the
CSRC bit.
2. Clear the ANSEL bit for the CK pin (if applicable).
3. Clear the CREN and SREN bits.
4. If interrupts are desired, set the TXIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
5. If 9-bit transmission is desired, set the TX9 bit.
6. Enable transmission by setting the TXEN bit.
7. If 9-bit transmission is selected, insert the Most
Significant bit into the TX9D bit.
8. Start transmission by writing the Least
Significant 8 bits to the TXREG register.
TABLE 27-9: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE
TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
APFCON C2OUTSEL CC1PSEL SDOSEL SCKSEL SDISEL TXSEL RXSEL CCP2SEL 119
BAUDCON ABDOVF RCIDL —SCKPBRG16 —WUE ABDEN 329
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 85
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 88
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 328
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 133
TXREG EUSART Transmit Data Register 319*
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 327
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for synchronous slave transmission.
* Page provides register information.
PIC16(L)F1782/3
DS41579C-page 344 Preliminary 2011-2012 Microchip Technology Inc.
27.5.2.3 EUSART Synchronous Slave
Reception
The operation of the Synchronous Master and Slave
modes is identical (Section 27.5.1.5 “Synchronous
Master Reception”), with the following exceptions:
• Sleep
• CREN bit is always set, therefore the receiver is
never Idle
• SREN bit, which is a “don’t care” in Slave mode
A character may be received while in Sleep mode by
setting the CREN bit prior to entering Sleep. Once the
word is received, the RSR register will transfer the data
to the RCREG register. If the RCIE enable bit is set, the
interrupt generated will wake the device from Sleep
and execute the next instruction. If the GIE bit is also
set, the program will branch to the interrupt vector.
27.5.2.4 Synchronous Slave Reception
Set-up:
1. Set the SYNC and SPEN bits and clear the
CSRC bit.
2. Clear the ANSEL bit for both the CK and DT pins
(if applicable).
3. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
4. If 9-bit reception is desired, set the RX9 bit.
5. Set the CREN bit to enable reception.
6. The RCIF bit will be set when reception is
complete. An interrupt will be generated if the
RCIE bit was set.
7. If 9-bit mode is enabled, retrieve the Most
Significant bit from the RX9D bit of the RCSTA
register.
8. Retrieve the 8 Least Significant bits from the
receive FIFO by reading the RCREG register.
9. If an overrun error occurs, clear the error by
either clearing the CREN bit of the RCSTA
register or by clearing the SPEN bit which resets
the EUSART.
TABLE 27-10: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE
RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
APFCON C2OUTSEL CC1PSEL SDOSEL SCKSEL SDISEL TXSEL RXSEL CCP2SEL 119
BAUDCON ABDOVF RCIDL —SCKPBRG16 —WUE ABDEN 329
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 84
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 85
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 88
RCREG EUSART Receive Data Register 322*
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 328
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 133
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 327
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for synchronous slave reception.
* Page provides register information.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 345
PIC16(L)F1782/3
27.6 EUSART Operation During Sleep
The EUSART will remain active during Sleep only in the
Synchronous Slave mode. All other modes require the
system clock and therefore cannot generate the neces-
sary signals to run the Transmit or Receive Shift regis-
ters during Sleep.
Synchronous Slave mode uses an externally generated
clock to run the Transmit and Receive Shift registers.
27.6.1 SYNCHRONOUS RECEIVE DURING
SLEEP
To receive during Sleep, all the following conditions
must be met before entering Sleep mode:
• RCSTA and TXSTA Control registers must be
configured for Synchronous Slave Reception (see
Section 27.5.2.4 “Synchronous Slave
Reception Set-up:”).
• If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
• The RCIF interrupt flag must be cleared by read-
ing RCREG to unload any pending characters in
the receive buffer.
Upon entering Sleep mode, the device will be ready to
accept data and clocks on the RX/DT and TX/CK pins,
respectively. When the data word has been completely
clocked in by the external device, the RCIF interrupt
flag bit of the PIR1 register will be set. Thereby, waking
the processor from Sleep.
Upon waking from Sleep, the instruction following the
SLEEP instruction will be executed. If the Global Inter-
rupt Enable (GIE) bit of the INTCON register is also set,
then the Interrupt Service Routine at address 004h will
be called.
27.6.2 SYNCHRONOUS TRANSMIT
DURING SLEEP
To transmit during Sleep, all the following conditions
must be met before entering Sleep mode:
• RCSTA and TXSTA Control registers must be
configured for Synchronous Slave Transmission
(see Section 27.5.2.2 “Synchronous Slave
Transmission Set-up:”).
• The TXIF interrupt flag must be cleared by writing
the output data to the TXREG, thereby filling the
TSR and transmit buffer.
• If interrupts are desired, set the TXIE bit of the
PIE1 register and the PEIE bit of the INTCON reg-
ister.
• Interrupt enable bits TXIE of the PIE1 register and
PEIE of the INTCON register must set.
Upon entering Sleep mode, the device will be ready to
accept clocks on TX/CK pin and transmit data on the
RX/DT pin. When the data word in the TSR has been
completely clocked out by the external device, the
pending byte in the TXREG will transfer to the TSR and
the TXIF flag will be set. Thereby, waking the processor
from Sleep. At this point, the TXREG is available to
accept another character for transmission, which will
clear the TXIF flag.
Upon waking from Sleep, the instruction following the
SLEEP instruction will be executed. If the Global
Interrupt Enable (GIE) bit is also set then the Interrupt
Service Routine at address 0004h will be called.
27.6.3 ALTERNATE PIN LOCATIONS
This module incorporates I/O pins that can be moved to
other locations with the use of the alternate pin function
register, APFCON. To determine which pins can be
moved and what their default locations are upon a
Reset, see Section 13.1 “Alternate Pin Function” for
more information.
PIC16(L)F1782/3
DS41579C-page 346 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 347
PIC16(L)F1782/3
28.0 IN-CIRCUIT SERIAL
PROGRAMMING™ (ICSP™)
ICSP™ programming allows customers to manufacture
circuit boards with unprogrammed devices. Programming
can be done after the assembly process allowing the
device to be programmed with the most recent firmware
or a custom firmware. Five pins are needed for ICSP™
programming:
• ICSPCLK
• ICSPDAT
•MCLR
/VPP
•VDD
•VSS
In Program/Verify mode the program memory, user IDs
and the Configuration Words are programmed through
serial communications. The ICSPDAT pin is a
bidirectional I/O used for transferring the serial data
and the ICSPCLK pin is the clock input. For more
information on ICSP™ refer to the “PIC16(L)F178X
Memory Programming Specification” (DS41457).
28.1 High-Voltage Programming Entry
Mode
The device is placed into High-Voltage Programming
Entry mode by holding the ICSPCLK and ICSPDAT
pins low then raising the voltage on MCLR/VPP to VIHH.
28.2 Low-Voltage Programming Entry
Mode
The Low-Voltage Programming Entry mode allows the
PIC® Flash MCUs to be programmed using VDD only,
without high voltage. When the LVP bit of Configuration
Words is set to ‘1’, the low-voltage ICSP programming
entry is enabled. To disable the Low-Voltage ICSP
mode, the LVP bit must be programmed to ‘0’.
Entry into the Low-Voltage Programming Entry mode
requires the following steps:
1. MCLR is brought to VIL.
2. A 32-bit key sequence is presented on
ICSPDAT, while clocking ICSPCLK.
Once the key sequence is complete, MCLR must be
held at VIL for as long as Program/Verify mode is to be
maintained.
If low-voltage programming is enabled (LVP = 1), the
MCLR Reset function is automatically enabled and
cannot be disabled. See Section 5.5 “MCLR” for more
information.
The LVP bit can only be reprogrammed to ‘0’ by using
the High-Voltage Programming mode.
28.3 Common Programming Interfaces
Connection to a target device is typically done through
an ICSP™ header. A commonly found connector on
development tools is the RJ-11 in the 6P6C (6 pin, 6
connector) configuration. See Figure 28-1.
FIGURE 28-1: ICD RJ-11 STYLE
CONNECTOR INTERFACE
Another connector often found in use with the PICkit™
programmers is a standard 6-pin header with 0.1 inch
spacing. Refer to Figure 28-2.
1
2
3
4
5
6
Target
Bottom Side
PC Board
VPP/MCLR VSS
ICSPCLK
VDD
ICSPDAT
NC
Pin Description*
1 = VPP/MCLR
2 = VDD Target
3 = VSS (ground)
4 = ICSPDAT
5 = ICSPCLK
6 = No Connect
PIC16(L)F1782/3
DS41579C-page 348 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 28-2: PICkit™ PROGRAMMER STYLE CONNECTOR INTERFACE
For additional interface recommendations, refer to your
specific device programmer manual prior to PCB
design.
It is recommended that isolation devices be used to
separate the programming pins from other circuitry.
The type of isolation is highly dependent on the specific
application and may include devices such as resistors,
diodes, or even jumpers. See Figure 28-3 for more
information.
FIGURE 28-3: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING
1
2
3
4
5
6
* The 6-pin header (0.100" spacing) accepts 0.025" square pins.
Pin Description*
1 = VPP/MCLR
2 = VDD Target
3 = VSS (ground)
4 = ICSPDAT
5 = ICSPCLK
6 = No Connect
Pin 1 Indicator
VDD
VPP
VSS
External
Device to be
Data
Clock
VDD
MCLR/VPP
VSS
ICSPDAT
ICSPCLK
**
*
To Normal Connections
*Isolation devices (as required).
Programming
Signals Programmed
VDD
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 349
PIC16(L)F1782/3
29.0 INSTRUCTION SET SUMMARY
Each instruction is a 14-bit word containing the opera-
tion code (opcode) and all required operands. The
opcodes are broken into three broad categories.
• Byte Oriented
• Bit Oriented
• Literal and Control
The literal and control category contains the most var-
ied instruction word format.
Table 29-3 lists the instructions recognized by the
MPASMTM assembler.
All instructions are executed within a single instruction
cycle, with the following exceptions, which may take
two or three cycles:
• Subroutine takes two cycles (CALL, CALLW)
• Returns from interrupts or subroutines take two
cycles (RETURN, RETLW, RETFIE)
• Program branching takes two cycles (GOTO, BRA,
BRW, BTFSS, BTFSC, DECFSZ, INCSFZ)
• One additional instruction cycle will be used when
any instruction references an indirect file register
and the file select register is pointing to program
memory.
One instruction cycle consists of 4 oscillator cycles; for
an oscillator frequency of 4 MHz, this gives a nominal
instruction execution rate of 1 MHz.
All instruction examples use the format ‘0xhh’ to
represent a hexadecimal number, where ‘h’ signifies a
hexadecimal digit.
29.1 Read-Modify-Write Operations
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (R-M-W)
operation. The register is read, the data is modified,
and the result is stored according to either the instruc-
tion, or the destination designator ‘d’. A read operation
is performed on a register even if the instruction writes
to that register.
TABLE 29-1: OPCODE FIELD
DESCRIPTIONS
TABLE 29-2: ABBREVIATION
DESCRIPTIONS
Field Description
fRegister file address (0x00 to 0x7F)
WWorking register (accumulator)
bBit address within an 8-bit file register
kLiteral field, constant data or label
xDon’t care location (= 0 or 1).
The assembler will generate code with x = 0.
It is the recommended form of use for
compatibility with all Microchip software tools.
dDestination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1.
nFSR or INDF number. (0-1)
mm Pre-post increment-decrement mode
selection
Field Description
PC Program Counter
TO Time-out bit
CCarry bit
DC Digit carry bit
ZZero bit
PD Power-down bit
PIC16(L)F1782/3
DS41579C-page 350 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 29-1: GENERAL FORMAT FOR
INSTRUCTIONS
Byte-oriented file register operations
13 8 7 6 0
d = 0 for destination W
OPCODE d f (FILE #)
d = 1 for destination f
f = 7-bit file register address
Bit-oriented file register operations
13 10 9 7 6 0
OPCODE b (BIT #) f (FILE #)
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
13 8 7 0
OPCODE k (literal)
k = 8-bit immediate value
13 11 10 0
OPCODE k (literal)
k = 11-bit immediate value
General
CALL and GOTO instructions only
MOVLP instruction only
13 5 4 0
OPCODE k (literal)
k = 5-bit immediate value
MOVLB instruction only
13 9 8 0
OPCODE k (literal)
k = 9-bit immediate value
BRA instruction only
FSR Offset instructions
13 7 6 5 0
OPCODE n k (literal)
n = appropriate FSR
FSR Increment instructions
13 7 6 0
OPCODE k (literal)
k = 7-bit immediate value
13 3 2 1 0
OPCODE n m (mode)
n = appropriate FSR
m = 2-bit mode value
k = 6-bit immediate value
13 0
OPCODE
OPCODE only
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 351
PIC16(L)F1782/3
TABLE 29-3: PIC16(L)F1782/3 INSTRUCTION SET
Mnemonic,
Operands Description Cycles
14-Bit Opcode Status
Affected Notes
MSb LSb
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ADDWFC
ANDWF
ASRF
LSLF
LSRF
CLRF
CLRW
COMF
DECF
INCF
IORWF
MOVF
MOVWF
RLF
RRF
SUBWF
SUBWFB
SWAPF
XORWF
f, d
f, d
f, d
f, d
f, d
f, d
f
–
f, d
f, d
f, d
f, d
f, d
f
f, d
f, d
f, d
f, d
f, d
f, d
Add W and f
Add with Carry W and f
AND W with f
Arithmetic Right Shift
Logical Left Shift
Logical Right Shift
Clear f
Clear W
Complement f
Decrement f
Increment f
Inclusive OR W with f
Move f
Move W to f
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Subtract with Borrow W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
00
11
00
11
11
11
00
00
00
00
00
00
00
00
00
00
00
11
00
00
0111
1101
0101
0111
0101
0110
0001
0001
1001
0011
1010
0100
1000
0000
1101
1100
0010
1011
1110
0110
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0000
dfff
dfff
dfff
dfff
dfff
1fff
dfff
dfff
dfff
dfff
dfff
dfff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
00xx
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
C, DC, Z
C, DC, Z
Z
C, Z
C, Z
C, Z
Z
Z
Z
Z
Z
Z
Z
C
C
C, DC, Z
C, DC, Z
Z
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
BYTE ORIENTED SKIP OPERATIONS
DECFSZ
INCFSZ
f, d
f, d
Decrement f, Skip if 0
Increment f, Skip if 0
1(2)
1(2)
00
00
1011
1111
dfff
dfff
ffff
ffff
1, 2
1, 2
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
f, b
f, b
Bit Clear f
Bit Set f
1
1
01
01
00bb
01bb
bfff
bfff
ffff
ffff
2
2
BIT-ORIENTED SKIP OPERATIONS
BTFSC
BTFSS
f, b
f, b
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1 (2)
1 (2)
01
01
10bb
11bb
bfff
bfff
ffff
ffff
1, 2
1, 2
LITERAL OPERATIONS
ADDLW
ANDLW
IORLW
MOVLB
MOVLP
MOVLW
SUBLW
XORLW
k
k
k
k
k
k
k
k
Add literal and W
AND literal with W
Inclusive OR literal with W
Move literal to BSR
Move literal to PCLATH
Move literal to W
Subtract W from literal
Exclusive OR literal with W
1
1
1
1
1
1
1
1
11
11
11
00
11
11
11
11
1110
1001
1000
0000
0001
0000
1100
1010
kkkk
kkkk
kkkk
001k
1kkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
C, DC, Z
Z
Z
C, DC, Z
Z
Note 1: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second
cycle is executed as a NOP.
2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require
one additional instruction cycle.
PIC16(L)F1782/3
DS41579C-page 352 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 29-3: PIC16(L)F1782/3 INSTRUCTION SET (CONTINUED)
Mnemonic,
Operands Description Cycles
14-Bit Opcode Status
Affected Notes
MSb LSb
CONTROL OPERATIONS
BRA
BRW
CALL
CALLW
GOTO
RETFIE
RETLW
RETURN
k
–
k
–
k
k
k
–
Relative Branch
Relative Branch with W
Call Subroutine
Call Subroutine with W
Go to address
Return from interrupt
Return with literal in W
Return from Subroutine
2
2
2
2
2
2
2
2
11
00
10
00
10
00
11
00
001k
0000
0kkk
0000
1kkk
0000
0100
0000
kkkk
0000
kkkk
0000
kkkk
0000
kkkk
0000
kkkk
1011
kkkk
1010
kkkk
1001
kkkk
1000
INHERENT OPERATIONS
CLRWDT
NOP
OPTION
RESET
SLEEP
TRIS
–
–
–
–
–
f
Clear Watchdog Timer
No Operation
Load OPTION_REG register with W
Software device Reset
Go into Standby mode
Load TRIS register with W
1
1
1
1
1
1
00
00
00
00
00
00
0000
0000
0000
0000
0000
0000
0110
0000
0110
0000
0110
0110
0100
0000
0010
0001
0011
0fff
TO, PD
TO, PD
C-COMPILER OPTIMIZED
ADDFSR
MOVIW
MOVWI
n, k
n mm
k[n]
n mm
k[n]
Add Literal k to FSRn
Move Indirect FSRn to W with pre/post inc/dec
modifier, mm
Move INDFn to W, Indexed Indirect.
Move W to Indirect FSRn with pre/post inc/dec
modifier, mm
Move W to INDFn, Indexed Indirect.
1
1
1
1
1
11
00
11
00
11
0001
0000
1111
0000
1111
0nkk
0001
0nkk
0001
1nkk
kkkk
0nmm
kkkk
1nmm
kkkk
Z
Z
2, 3
2
2, 3
2
Note 1: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second
cycle is executed as a NOP.
2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require
one additional instruction cycle.
3: See Table in the MOVIW and MOVWI instruction descriptions.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 353
PIC16(L)F1782/3
29.2 Instruction Descriptions
ADDFSR Add Literal to FSRn
Syntax: [ label ] ADDFSR FSRn, k
Operands: -32 k 31
n [ 0, 1]
Operation: FSR(n) + k FSR(n)
Status Affected: None
Description: The signed 6-bit literal ‘k’ is added to
the contents of the FSRnH:FSRnL
register pair.
FSRn is limited to the range 0000h -
FFFFh. Moving beyond these bounds
will cause the FSR to wrap-around.
ADDLW Add literal and W
Syntax: [ label ] ADDLW k
Operands: 0 k 255
Operation: (W) + k (W)
Status Affected: C, DC, Z
Description: The contents of the W register are
added to the eight-bit literal ‘k’ and the
result is placed in the W register.
ADDWF Add W and f
Syntax: [ label ] ADDWF f,d
Operands: 0 f 127
d 0,1
Operation: (W) + (f) (destination)
Status Affected: C, DC, Z
Description: Add the contents of the W register
with register ‘f’. If ‘d’ is ‘0’, the result is
stored in the W register. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
ADDWFC ADD W and CARRY bit to f
Syntax: [ label ] ADDWFC f {,d}
Operands: 0 f 127
d [0,1]
Operation: (W) + (f) + (C) dest
Status Affected: C, DC, Z
Description: Add W, the Carry flag and data mem-
ory location ‘f’. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed in data memory location ‘f’.
ANDLW AND literal with W
Syntax: [ label ] ANDLW k
Operands: 0 k 255
Operation: (W) .AND. (k) (W)
Status Affected: Z
Description: The contents of W register are
AND’ed with the eight-bit literal ‘k’.
The result is placed in the W register.
ANDWF AND W with f
Syntax: [ label ] ANDWF f,d
Operands: 0 f 127
d 0,1
Operation: (W) .AND. (f) (destination)
Status Affected: Z
Description: AND the W register with register ‘f’. If
‘d’ is ‘0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is stored
back in register ‘f’.
ASRF Arithmetic Right Shift
Syntax: [ label ] ASRF f {,d}
Operands: 0 f 127
d [0,1]
Operation: (f<7>) dest<7>
(f<7:1>) dest<6:0>,
(f<0>) C,
Status Affected: C, Z
Description: The contents of register ‘f’ are shifted
one bit to the right through the Carry
flag. The MSb remains unchanged. If
‘d’ is ‘0’, the result is placed in W. If ‘d’
is ‘1’, the result is stored back in reg-
ister ‘f’.
register f C
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BCF Bit Clear f
Syntax: [ label ] BCF f,b
Operands: 0 f 127
0 b 7
Operation: 0 (f<b>)
Status Affected: None
Description: Bit ‘b’ in register ‘f’ is cleared.
BRA Relative Branch
Syntax: [ label ] BRA label
[ label ] BRA $+k
Operands: -256 label - PC + 1 255
-256 k 255
Operation: (PC) + 1 + k PC
Status Affected: None
Description: Add the signed 9-bit literal ‘k’ to the
PC. Since the PC will have incre-
mented to fetch the next instruction,
the new address will be PC + 1 + k.
This instruction is a two-cycle instruc-
tion. This branch has a limited range.
BRW Relative Branch with W
Syntax: [ label ] BRW
Operands: None
Operation: (PC) + (W) PC
Status Affected: None
Description: Add the contents of W (unsigned) to
the PC. Since the PC will have incre-
mented to fetch the next instruction,
the new address will be PC + 1 + (W).
This instruction is a two-cycle instruc-
tion.
BSF Bit Set f
Syntax: [ label ] BSF f,b
Operands: 0 f 127
0 b 7
Operation: 1 (f<b>)
Status Affected: None
Description: Bit ‘b’ in register ‘f’ is set.
BTFSC Bit Test f, Skip if Clear
Syntax: [ label ] BTFSC f,b
Operands: 0 f 127
0 b 7
Operation: skip if (f<b>) = 0
Status Affected: None
Description: If bit ‘b’ in register ‘f’ is ‘1’, the next
instruction is executed.
If bit ‘b’, in register ‘f’, is ‘0’, the next
instruction is discarded, and a NOP is
executed instead, making this a
2-cycle instruction.
BTFSS Bit Test f, Skip if Set
Syntax: [ label ] BTFSS f,b
Operands: 0 f 127
0 b < 7
Operation: skip if (f<b>) = 1
Status Affected: None
Description: If bit ‘b’ in register ‘f’ is ‘0’, the next
instruction is executed.
If bit ‘b’ is ‘1’, then the next
instruction is discarded and a NOP is
executed instead, making this a
2-cycle instruction.
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PIC16(L)F1782/3
CALL Call Subroutine
Syntax: [ label ] CALL k
Operands: 0 k 2047
Operation: (PC)+ 1 TOS,
k PC<10:0>,
(PCLATH<6:3>) PC<14:11>
Status Affected: None
Description: Call Subroutine. First, return address
(PC + 1) is pushed onto the stack.
The eleven-bit immediate address is
loaded into PC bits <10:0>. The upper
bits of the PC are loaded from
PCLATH. CALL is a two-cycle instruc-
tion.
CALLW Subroutine Call With W
Syntax: [ label ] CALLW
Operands: None
Operation: (PC) +1 TOS,
(W) PC<7:0>,
(PCLATH<6:0>) PC<14:8>
Status Affected: None
Description: Subroutine call with W. First, the
return address (PC + 1) is pushed
onto the return stack. Then, the con-
tents of W is loaded into PC<7:0>,
and the contents of PCLATH into
PC<14:8>. CALLW is a two-cycle
instruction.
CLRF Clear f
Syntax: [ label ] CLRF f
Operands: 0 f 127
Operation: 00h (f)
1 Z
Status Affected: Z
Description: The contents of register ‘f’ are cleared
and the Z bit is set.
CLRW Clear W
Syntax: [ label ] CLRW
Operands: None
Operation: 00h (W)
1 Z
Status Affected: Z
Description: W register is cleared. Zero bit (Z) is
set.
CLRWDT Clear Watchdog Timer
Syntax: [ label ] CLRWDT
Operands: None
Operation: 00h WDT
0 WDT prescaler,
1 TO
1 PD
Status Affected: TO, PD
Description: CLRWDT instruction resets the Watch-
dog Timer. It also resets the prescaler
of the WDT.
Status bits TO and PD are set.
COMF Complement f
Syntax: [ label ] COMF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination)
Status Affected: Z
Description: The contents of register ‘f’ are com-
plemented. If ‘d’ is ‘0’, the result is
stored in W. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
DECF Decrement f
Syntax: [ label ] DECF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination)
Status Affected: Z
Description: Decrement register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W
register. If ‘d’ is ‘1’, the result is stored
back in register ‘f’.
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DECFSZ Decrement f, Skip if 0
Syntax: [ label ] DECFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination);
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are decre-
mented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
If the result is ‘1’, the next instruction is
executed. If the result is ‘0’, then a
NOP is executed instead, making it a
2-cycle instruction.
GOTO Unconditional Branch
Syntax: [ label ] GOTO k
Operands: 0 k 2047
Operation: k PC<10:0>
PCLATH<6:3> PC<14:11>
Status Affected: None
Description: GOTO is an unconditional branch. The
eleven-bit immediate value is loaded
into PC bits <10:0>. The upper bits of
PC are loaded from PCLATH<4:3>.
GOTO is a two-cycle instruction.
INCF Increment f
Syntax: [ label ] INCF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination)
Status Affected: Z
Description: The contents of register ‘f’ are incre-
mented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
INCFSZ Increment f, Skip if 0
Syntax: [ label ] INCFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination),
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are incre-
mented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
If the result is ‘1’, the next instruction is
executed. If the result is ‘0’, a NOP is
executed instead, making it a 2-cycle
instruction.
IORLW Inclusive OR literal with W
Syntax: [ label ] IORLW k
Operands: 0 k 255
Operation: (W) .OR. k (W)
Status Affected: Z
Description: The contents of the W register are
OR’ed with the eight-bit literal ‘k’. The
result is placed in the W register.
IORWF Inclusive OR W with f
Syntax: [ label ] IORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .OR. (f) (destination)
Status Affected: Z
Description: Inclusive OR the W register with regis-
ter ‘f’. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.
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PIC16(L)F1782/3
LSLF Logical Left Shift
Syntax: [ label ] LSLF f {,d}
Operands: 0 f 127
d [0,1]
Operation: (f<7>) C
(f<6:0>) dest<7:1>
0 dest<0>
Status Affected: C, Z
Description: The contents of register ‘f’ are shifted
one bit to the left through the Carry flag.
A ‘0’ is shifted into the LSb. If ‘d’ is ‘0’,
the result is placed in W. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
LSRF Logical Right Shift
Syntax: [ label ] LSRF f {,d}
Operands: 0 f 127
d [0,1]
Operation: 0 dest<7>
(f<7:1>) dest<6:0>,
(f<0>) C,
Status Affected: C, Z
Description: The contents of register ‘f’ are shifted
one bit to the right through the Carry
flag. A ‘0’ is shifted into the MSb. If ‘d’ is
‘0’, the result is placed in W. If ‘d’ is ‘1’,
the result is stored back in register ‘f’.
register f 0
C
register f C0
MOVF Move f
Syntax: [ label ] MOVF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (dest)
Status Affected: Z
Description: The contents of register f is moved to
a destination dependent upon the
status of d. If d = 0,
destination is W register. If d = 1, the
destination is file register f itself. d = 1
is useful to test a file register since
status flag Z is affected.
Words: 1
Cycles: 1
Example: MOVF FSR, 0
After Instruction
W = value in FSR register
Z= 1
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MOVIW Move INDFn to W
Syntax: [ label ] MOVIW ++FSRn
[ label ] MOVIW --FSRn
[ label ] MOVIW FSRn++
[ label ] MOVIW FSRn--
[ label ] MOVIW k[FSRn]
Operands: n [0,1]
mm [00,01, 10, 11]
-32 k 31
Operation: INDFn W
Effective address is determined by
• FSR + 1 (preincrement)
• FSR - 1 (predecrement)
• FSR + k (relative offset)
After the Move, the FSR value will be
either:
• FSR + 1 (all increments)
• FSR - 1 (all decrements)
• Unchanged
Status Affected: Z
Mode Syntax mm
Preincrement ++FSRn 00
Predecrement --FSRn 01
Postincrement FSRn++ 10
Postdecrement FSRn-- 11
Description: This instruction is used to move data
between W and one of the indirect
registers (INDFn). Before/after this
move, the pointer (FSRn) is updated by
pre/post incrementing/decrementing it.
Note: The INDFn registers are not
physical registers. Any instruction that
accesses an INDFn register actually
accesses the register at the address
specified by the FSRn.
FSRn is limited to the range 0000h -
FFFFh. Incrementing/decrementing it
beyond these bounds will cause it to
wrap-around.
MOVLB Move literal to BSR
Syntax: [ label ] MOVLB k
Operands: 0 k 15
Operation: k BSR
Status Affected: None
Description: The five-bit literal ‘k’ is loaded into the
Bank Select Register (BSR).
MOVLP Move literal to PCLATH
Syntax: [ label ] MOVLP k
Operands: 0 k 127
Operation: k PCLATH
Status Affected: None
Description: The seven-bit literal ‘k’ is loaded into the
PCLATH register.
MOVLW Move literal to W
Syntax: [ label ] MOVLW k
Operands: 0 k 255
Operation: k (W)
Status Affected: None
Description: The eight-bit literal ‘k’ is loaded into W
register. The “don’t cares” will assem-
ble as ‘0’s.
Words: 1
Cycles: 1
Example: MOVLW 0x5A
After Instruction
W = 0x5A
MOVWF Move W to f
Syntax: [ label ] MOVWF f
Operands: 0 f 127
Operation: (W) (f)
Status Affected: None
Description: Move data from W register to register
‘f’.
Words: 1
Cycles: 1
Example: MOVWF OPTION_REG
Before Instruction
OPTION_REG = 0xFF
W = 0x4F
After Instruction
OPTION_REG = 0x4F
W = 0x4F
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PIC16(L)F1782/3
MOVWI Move W to INDFn
Syntax: [ label ] MOVWI ++FSRn
[ label ] MOVWI --FSRn
[ label ] MOVWI FSRn++
[ label ] MOVWI FSRn--
[ label ] MOVWI k[FSRn]
Operands: n [0,1]
mm [00,01, 10, 11]
-32 k 31
Operation: W INDFn
Effective address is determined by
• FSR + 1 (preincrement)
• FSR - 1 (predecrement)
• FSR + k (relative offset)
After the Move, the FSR value will be
either:
• FSR + 1 (all increments)
• FSR - 1 (all decrements)
Unchanged
Status Affected: None
Mode Syntax mm
Preincrement ++FSRn 00
Predecrement --FSRn 01
Postincrement FSRn++ 10
Postdecrement FSRn-- 11
Description: This instruction is used to move data
between W and one of the indirect
registers (INDFn). Before/after this
move, the pointer (FSRn) is updated by
pre/post incrementing/decrementing it.
Note: The INDFn registers are not
physical registers. Any instruction that
accesses an INDFn register actually
accesses the register at the address
specified by the FSRn.
FSRn is limited to the range 0000h -
FFFFh. Incrementing/decrementing it
beyond these bounds will cause it to
wrap-around.
The increment/decrement operation on
FSRn WILL NOT affect any Status bits.
NOP No Operation
Syntax: [ label ] NOP
Operands: None
Operation: No operation
Status Affected: None
Description: No operation.
Words: 1
Cycles: 1
Example: NOP
OPTION Load OPTION_REG Register
with W
Syntax: [ label ] OPTION
Operands: None
Operation: (W) OPTION_REG
Status Affected: None
Description: Move data from W register to
OPTION_REG register.
Words: 1
Cycles: 1
Example: OPTION
Before Instruction
OPTION_REG = 0xFF
W = 0x4F
After Instruction
OPTION_REG = 0x4F
W = 0x4F
RESET Software Reset
Syntax: [ label ] RESET
Operands: None
Operation: Execute a device Reset. Resets the
RI flag of the PCON register.
Status Affected: None
Description: This instruction provides a way to
execute a hardware Reset by soft-
ware.
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RETFIE Return from Interrupt
Syntax: [ label ] RETFIE
Operands: None
Operation: TOS PC,
1 GIE
Status Affected: None
Description: Return from Interrupt. Stack is POPed
and Top-of-Stack (TOS) is loaded in
the PC. Interrupts are enabled by
setting Global
Interrupt Enable bit, GIE
(INTCON<7>). This is a two-cycle
instruction.
Words: 1
Cycles: 2
Example: RETFIE
After Interrupt
PC = TOS
GIE = 1
RETLW Return with literal in W
Syntax: [ label ] RETLW k
Operands: 0 k 255
Operation: k (W);
TOS PC
Status Affected: None
Description: The W register is loaded with the eight
bit literal ‘k’. The program counter is
loaded from the top of the stack (the
return address). This is a two-cycle
instruction.
Words: 1
Cycles: 2
Example:
TABLE
CALL TABLE;W contains table
;offset value
• ;W now has table value
•
•
ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
•
•
•
RETLW kn ; End of table
Before Instruction
W = 0x07
After Instruction
W = value of k8
RETURN Return from Subroutine
Syntax: [ label ] RETURN
Operands: None
Operation: TOS PC
Status Affected: None
Description: Return from subroutine. The stack is
POPed and the top of the stack (TOS)
is loaded into the program counter.
This is a two-cycle instruction.
RLF Rotate Left f through Carry
Syntax: [ label ] RLF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are rotated
one bit to the left through the Carry
flag. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
Words: 1
Cycles: 1
Example: RLF REG1,0
Before Instruction
REG1 = 1110 0110
C=0
After Instruction
REG1 = 1110 0110
W = 1100 1100
C=1
Register fC
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RRF Rotate Right f through Carry
Syntax: [ label ] RRF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are rotated
one bit to the right through the Carry
flag. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.
SLEEP Enter Sleep mode
Syntax: [ label ]SLEEP
Operands: None
Operation: 00h WDT,
0 WDT prescaler,
1 TO,
0 PD
Status Affected: TO, PD
Description: The power-down Status bit, PD is
cleared. Time-out Status bit, TO is
set. Watchdog Timer and its pres-
caler are cleared.
The processor is put into Sleep mode
with the oscillator stopped.
Register fC
SUBLW Subtract W from literal
Syntax: [ label ]SUBLW k
Operands: 0 k 255
Operation: k - (W) W)
Status Affected: C, DC, Z
Description: The W register is subtracted (2’s com-
plement method) from the eight-bit
literal ‘k’. The result is placed in the W
register.
SUBWF Subtract W from f
Syntax: [ label ] SUBWF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - (W) destination)
Status Affected: C, DC, Z
Description: Subtract (2’s complement method) W
register from register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W
register. If ‘d’ is ‘1’, the result is stored
back in register ‘f.
SUBWFB Subtract W from f with Borrow
Syntax: SUBWFB f {,d}
Operands: 0 f 127
d [0,1]
Operation: (f) – (W) – (B) dest
Status Affected: C, DC, Z
Description: Subtract W and the BORROW flag
(CARRY) from register ‘f’ (2’s comple-
ment method). If ‘d’ is ‘0’, the result is
stored in W. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
C = 0W k
C = 1W k
DC = 0W<3:0> k<3:0>
DC = 1W<3:0> k<3:0>
C = 0W f
C = 1W f
DC = 0W<3:0> f<3:0>
DC = 1W<3:0> f<3:0>
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SWAPF Swap Nibbles in f
Syntax: [ label ] SWAPF f,d
Operands: 0 f 127
d [0,1]
Operation: (f<3:0>) (destination<7:4>),
(f<7:4>) (destination<3:0>)
Status Affected: None
Description: The upper and lower nibbles of regis-
ter ‘f’ are exchanged. If ‘d’ is ‘0’, the
result is placed in the W register. If ‘d’
is ‘1’, the result is placed in register ‘f’.
TRIS Load TRIS Register with W
Syntax: [ label ] TRIS f
Operands: 5 f 7
Operation: (W) TRIS register ‘f’
Status Affected: None
Description: Move data from W register to TRIS
register.
When ‘f’ = 5, TRISA is loaded.
When ‘f’ = 6, TRISB is loaded.
When ‘f’ = 7, TRISC is loaded.
XORLW Exclusive OR literal with W
Syntax: [ label ] XORLW k
Operands: 0 k 255
Operation: (W) .XOR. k W)
Status Affected: Z
Description: The contents of the W register are
XOR’ed with the eight-bit
literal ‘k’. The result is placed in the
W register.
XORWF Exclusive OR W with f
Syntax: [ label ] XORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .XOR. (f) destination)
Status Affected: Z
Description: Exclusive OR the contents of the W
register with register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W register. If ‘d’
is ‘1’, the result is stored back in regis-
ter ‘f’.
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30.0 ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings(†)
Ambient temperature under bias....................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on VDD with respect to VSS, PIC16F1782/3 .......................................................................... -0.3V to +6.5V
Voltage on VCAP pin with respect to VSS, PIC16F1782/3 .................................................................... -0.3V to +4.0V
Voltage on VDD with respect to VSS, PIC16LF1782/3 ........................................................................ -0.3V to +4.0V
Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V
Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V)
Total power dissipation(1) ............................................................................................................................... 800 mW
Maximum current out of VSS pin, -40°C TA +85°C for industrial............................................................... 170 mA
Maximum current out of VSS pin, -40°C TA +125°C for extended .............................................................. 70 mA
Maximum current into VDD pin, -40°C TA +85°C for industrial.................................................................... 85 mA
Maximum current into VDD pin, -40°C TA +125°C for extended ................................................................. 35 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD)20 mA
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOl x IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above
those indicated in the operation listings of this specification is not implied. Exposure above maximum rating condi-
tions for extended periods may affect device reliability.
PIC16(L)F1782/3
DS41579C-page 364 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 30-1: PIC16F1782/3 VOLTAGE FREQUENCY GRAPH, -40°C
TA

+125°C
FIGURE 30-2: PIC16LF1782/3 VOLTAGE FREQUENCY GRAPH, -40°C
TA

+125°C
0
2.7
Frequency (MHz)
VDD (V)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: Refer to Table 30-1 for each Oscillator mode’s supported frequencies.
432
10 16
5.5
2.3
2.3
0
2.7
Frequency (MHz)
VDD (V)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: Refer to Table 30-1 for each Oscillator mode’s supported frequencies.
43210 16
3.6
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 365
PIC16(L)F1782/3
FIGURE 30-3: HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE
125
25
2.0
0
60
85
VDD (V)
4.0 5.04.5
Temperature (°C)
2.5 3.0 3.5 5.51.8
-40
-20
± 5%
± 2%
± 5%
± 3%
PIC16(L)F1782/3
DS41579C-page 366 Preliminary 2011-2012 Microchip Technology Inc.
30.1 DC Characteristics: PIC16(L)F1782/3-I/E (Industrial, Extended)
PIC16LF1782/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
PIC16F1782/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param.
No.
Sym. Characteristic Min. Typ† Max. Units Conditions
D001 VDD Supply Voltage (VDDMIN, VDDMAX)
PIC16LF1782/3 1.8
2.7
—
—
3.6
3.6
V
V
FOSC 16 MHz:
FOSC 32 MHz (Note 2)
D001 PIC16F1782/3 2.3
2.7
—
—
5.5
5.5
V
V
FOSC 16 MHz:
FOSC 32 MHz (Note 2)
D002* VDR RAM Data Retention Voltage(1)
PIC16LF1782/3 1.5 — — V Device in Sleep mode
D002* PIC16F1782/3 1.7 — — V Device in Sleep mode
VPOR*Power-on Reset Release Voltage —1.6— V
VPORR*Power-on Reset Rearm Voltage
PIC16LF1782/3 — 0.8 — V Device in Sleep mode
PIC16F1782/3 —1.5 — V Device in Sleep mode
D003 VFVR Fixed Voltage Reference Voltage -3 — 3 % 1.024V, VDD 2.5V
2.048V, VDD 2.5V
4.096V, VDD 4.75V
D004* SVDD VDD Rise Rate to ensure internal
Power-on Reset signal
0.05 — — V/ms See Section 5.1 “Power-On Reset
(POR)” for details.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
2: PLL required for 32 MHz operation.
3: For proper operation, the minimum value of the ADC positive voltage reference must be 1.8V or greater. When selecting
the FVR or the VREF+ pin as the source of the ADC positive voltage reference, be aware that the voltage must be 1.8V or
greater.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 367
PIC16(L)F1782/3
FIGURE 30-4: POR AND POR REARM WITH SLOW RISING VDD
VDD
VPOR
VPORR
VSS
VSS
NPOR
TPOR(3)
POR REARM
Note 1: When NPOR is low, the device is held in Reset.
2: TPOR 1 s typical.
3: TVLOW 2.7 s typical.
TVLOW(2)
PIC16(L)F1782/3
DS41579C-page 368 Preliminary 2011-2012 Microchip Technology Inc.
30.2 DC Characteristics: PIC16(L)F1782/3-I/E (Industrial, Extended)
PIC16LF1782/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
PIC16F1782/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No.
Device
Characteristics Min. Typ† Max. Units
Conditions
VDD Note
Supply Current (IDD)(1, 2)
D009 LDO Regulator —75 — A — High Power mode, normal operation
—15 — A—
Sleep VREGCON<1> = 0
—0.3 — A—
Sleep VREGCON<1> = 1
D010 — 8 16 A1.8F
OSC = 32 kHz
LP Oscillator mode (Note 4),
-40°C TA +85°C
—12 20 A3.0
D010 —18 63 A2.3 FOSC = 32 kHz
LP Oscillator mode (Note 4, 5),
-40°C TA +85°C
—20 74 A3.0
—22 75 A5.0
D012 — 160 650 A1.8F
OSC = 4 MHz
XT Oscillator mode
— 320 1000 A3.0
D012 —260 700 A2.3 FOSC = 4 MHz
XT Oscillator mode (Note 5)
—330 1100 A3.0
—380 1200 A5.0
Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from
rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current
consumption.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended
by the formula IR = VDD/2REXT (mA) with REXT in k
4: FVR and BOR are disabled.
5: 0.1 F capacitor on VCAP.
6: 8 MHz crystal oscillator with 4x PLL enabled.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 369
PIC16(L)F1782/3
Supply Current (IDD)(1, 2)
D014 — 125 550 A1.8FOSC = 4 MHz
EC Oscillator mode
Medium-Power mode
— 280 1100 A3.0
D014 —220 650 A2.3 FOSC = 4 MHz
EC Oscillator mode (Note 5)
Medium-Power mode
—290 1000 A3.0
—350 1200 A5.0
D015 — 2.1 6.2 mA 3.0 FOSC = 32 MHz
EC Oscillator High-Power mode
—2.57.5mA 3.6
D015 —2.1 6.5 mA 3.0 FOSC = 32 MHz
EC Oscillator High-Power mode (Note 5)
—2.2 7.5 mA 5.0
30.2 DC Characteristics: PIC16(L)F1782/3-I/E (Industrial, Extended) (Continued)
PIC16LF1782/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
PIC16F1782/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No.
Device
Characteristics Min. Typ† Max. Units
Conditions
VDD Note
Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from
rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current
consumption.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended
by the formula IR = VDD/2REXT (mA) with REXT in k
4: FVR and BOR are disabled.
5: 0.1 F capacitor on VCAP.
6: 8 MHz crystal oscillator with 4x PLL enabled.
PIC16(L)F1782/3
DS41579C-page 370 Preliminary 2011-2012 Microchip Technology Inc.
D017
Supply Current (IDD)(1, 2)
— 130 180 A1.8FOSC = 500 kHz
MFINTOSC mode
— 150 250 A3.0
D017 —150 250 A2.3 FOSC = 500 kHz
MFINTOSC mode (Note 5)
—170 330 A3.0
—220 430 A5.0
D019 — 0.8 2.2 mA 1.8 FOSC = 16 MHz
HFINTOSC mode
—1.23.7mA 3.0
D019 —1.0 2.3 mA 2.3 FOSC = 16 MHz
HFINTOSC mode (Note 5)
—1.3 3.9 mA 3.0
—1.4 4.1 mA 5.0
D020 — 2.1 6.2 mA 3.0 FOSC = 32 MHz
HFINTOSC mode
— 2.5 7.5 mA 3.6
D020 —2.1 6.5 mA 3.0 FOSC = 32 MHz
HFINTOSC mode
—2.2 7.5 mA 5.0
D022 — 2.1 6.2 mA 3.0 FOSC = 32 MHz
HS Oscillator mode (Note 6)
—2.57.5mA 3.6
D022 —2.1 6.5 mA 3.0 FOSC = 32 MHz
HS Oscillator mode (Note 5, 6)
—2.2 7.5 mA 5.0
30.2 DC Characteristics: PIC16(L)F1782/3-I/E (Industrial, Extended) (Continued)
PIC16LF1782/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
PIC16F1782/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No.
Device
Characteristics Min. Typ† Max. Units
Conditions
VDD Note
Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from
rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current
consumption.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended
by the formula IR = VDD/2REXT (mA) with REXT in k
4: FVR and BOR are disabled.
5: 0.1 F capacitor on VCAP.
6: 8 MHz crystal oscillator with 4x PLL enabled.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 371
PIC16(L)F1782/3
30.3 DC Characteristics: PIC16(L)F1782/3-I/E (Power-Down)
PIC16LF1782/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
PIC16F1782/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Characteristics Min. Typ† Max.
+85°C
Max.
+125°C Units
Conditions
VDD Note
Power-down Base Current (IPD)(2)
D023 — 0.05 1.0 8.0 A 1.8 WDT, BOR, FVR, and T1OSC
disabled, all Peripherals Inactive
— 0.08 2.0 9.0 A3.0
D023 —0.3 211 A2.3 WDT, BOR, FVR, and T1OSC
disabled, all Peripherals Inactive
—0.4 312 A3.0
—0.5 615 A5.0
D024 — 0.5 6 14 A 1.8 LPWDT Current (Note 1)
—0.8 7 17 A3.0
D024 —0.8 615 A2.3 LPWDT Current (Note 1)
—0.9 720 A3.0
—1.0 822 A5.0
D025 — 15 25 — A 1.8 FVR Current
—18 30 — A3.0
D025 —18 33 —A2.3 FVR Current (Note 4)
—19 35 —A3.0
—20 37 —A5.0
D026 — 7.5 17 20 A 3.0 BOR Current (Note 1)
D026 —40 17 30 A3.0 BOR Current (Note 1, Note 4)
—87 20 40 A5.0
D027 — 1 4 8 A 3.0 LPBOR Current (Note 1)
D028 — 0.5 5 9 A 1.8 SOSC Current (Note 1)
—0.88.5 12 A3.0
D028 —1.1 610 A2.3 SOSC Current (Note 1)
—1.3 8.5 20 A3.0
—1.4 10 25 A5.0
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Legend: TBD = To Be Determined
Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is
enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max
values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD, and VREGCON = 0x03.
3: A/D oscillator source is FRC.
4: 0.1 F capacitor on VCAP.
PIC16(L)F1782/3
DS41579C-page 372 Preliminary 2011-2012 Microchip Technology Inc.
Power-down Base Current (IPD)(2)
D029 — 9 18 — A 1.8 A/D Current (Note 1, Note 3), no
conversion in progress
—11 22 — A3.0
D029 —12 24 —A2.3 A/D Current (Note 1, Note 3), no
conversion in progress
—14 28 —A3.0
—15 30 —A5.0
D030 — TBD — — A 1.8 A/D Current (Note 1, Note 3),
conversion in progress
—TBD — — A3.0
D030 —TBD — — A2.3 A/D Current (Note 1, Note 3,
Note 4), conversion in progress
—TBD — — A3.0
—TBD — — A5.0
D031 — 250 — — A 3.0 Op Amp (High power)
—280 — — A3.6
D031 —230 — — A2.3 Op Amp (High power)
—250 — — A3.0
—350 — — A5.0
D032 — 250 — — A 1.8 Comparator, High-Power mode
—300 — — A3.0
D032 —280 — — A2.3 Comparator, High-Power mode
—300 — — A3.0
—310 — — A5.0
D033 — TBD — — A 3.0 PSMC (64 MHz)
—TBD — — A3.6
D033 —TBD — — A2.3
—TBD — — A3.0
—TBD — — A5.0
30.3 DC Characteristics: PIC16(L)F1782/3-I/E (Power-Down) (Continued)
PIC16LF1782/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
PIC16F1782/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Characteristics Min. Typ† Max.
+85°C
Max.
+125°C Units
Conditions
VDD Note
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Legend: TBD = To Be Determined
Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is
enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max
values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD, and VREGCON = 0x03.
3: A/D oscillator source is FRC.
4: 0.1 F capacitor on VCAP.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 373
PIC16(L)F1782/3
30.4 DC Characteristics: PIC16(L)F1782/3-I/E
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
VIL Input Low Voltage
I/O PORT:
D034 with TTL buffer — — 0.8 V 4.5V VDD 5.5V
D034A — — 0.15 VDD V1.8V VDD 4.5V
D035 with Schmitt Trigger buffer — — 0.2 VDD V2.0V VDD 5.5V
with I2C™ levels — — 0.3 VDD V
with SMBus levels — — 0.8 V 2.7V VDD 5.5V
D036 MCLR, OSC1 (RC mode)(1) ——0.2VDD V
D036A OSC1 (HS mode) — — 0.3 VDD V
VIH Input High Voltage
I/O ports:
D040 with TTL buffer 2.0 — — V 4.5V VDD 5.5V
D040A 0.25 VDD +
0.8
——V1.8V VDD 4.5V
D041 with Schmitt Trigger buffer 0.8 VDD ——V2.0V VDD 5.5V
with I2C™ levels 0.7 VDD ——V
with SMBus levels 2.1 — — V 2.7V VDD 5.5V
D042 MCLR 0.8 VDD ——V
D043A OSC1 (HS mode) 0.7 VDD ——V
D043B OSC1 (RC mode) 0.9 VDD ——V(Note 1)
IIL Input Leakage Current(2)
D060 I/O ports — ± 5
± 5
± 125
± 1000
nA
nA
VSS VPIN VDD, Pin at
high-impedance @ 85°C
125°C
D061 MCLR(3) —± 50± 200nAVSS VPIN VDD @ 85°C
IPUR Weak Pull-up Current
D070* 25
25
100
140
200
300 A
VDD = 3.3V, VPIN = VSS
VDD = 5.0V, VPIN = VSS
VOL Output Low Voltage(4)
D080 I/O ports
——0.6V
IOL = 8mA, VDD = 5V
IOL = 6mA, VDD = 3.3V
IOL = 1.8mA, VDD = 1.8V
VOH Output High Voltage(4)
D090 I/O ports
VDD - 0.7 — — V
IOH = 3.5mA, VDD = 5V
IOH = 3mA, VDD = 3.3V
IOH = 1mA, VDD = 1.8V
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
4: Including OSC2 in CLKOUT mode.
PIC16(L)F1782/3
DS41579C-page 374 Preliminary 2011-2012 Microchip Technology Inc.
Capacitive Loading Specs on Output Pins
D101* COSC2 OSC2 pin — — 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1
D101A* CIO All I/O pins — — 50 pF
VCAP Capacitor Charging
D102 Charging current — 200 — A
D102A Source/sink capability when
charging complete
—0.0—mA
30.4 DC Characteristics: PIC16(L)F1782/3-I/E (Continued)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
4: Including OSC2 in CLKOUT mode.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 375
PIC16(L)F1782/3
30.5 Memory Programming Requirements
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
Program Memory
Programming Specifications
D110 VIHH Voltage on MCLR/VPP/RE3 pin 8.0 — 9.0 V (Note 3)
D111 IDDP Supply Current during
Programming
——10mA
D112 VDD for Bulk Erase 2.7 — VDDMAX V
D113 VPEW VDD for Write or Row Erase VDDMIN —VDDMAX V
D114 IPPPGM Current on MCLR/VPP during
Erase/Write
——1.0mA
D115 IDDPGM Current on VDD during Erase/Write — 5.0 mA
Data EEPROM Memory
D116 EDByte Endurance 100K ——E/W-40C to +85C
D117 VDRW VDD for Read/Write VDDMIN —VDDMAX V
D118 TDEW Erase/Write Cycle Time — 4.0 5.0 ms
D119 TRETD Characteristic Retention — 40 — Year Provided no other
specifications are violated
D120 TREF Number of Total Erase/Write
Cycles before Refresh(2)
100k — — E/W -40°C to +85°C
Program Flash Memory
D121 EPCell Endurance 10K ——E/W-40C to +85C (Note 1)
D122 VPR VDD for Read VDDMIN —VDDMAX V
D123 TIW Self-timed Write Cycle Time — 2 2.5 ms
D124 TRETD Characteristic Retention — 40 — Year Provided no other
specifications are violated
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Self-write and Block Erase.
2: Refer to Section 12.2 “Using the Data EEPROM” for a more detailed discussion on data EEPROM
endurance.
3: Required only if single-supply programming is disabled.
PIC16(L)F1782/3
DS41579C-page 376 Preliminary 2011-2012 Microchip Technology Inc.
30.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym. Characteristic Typ. Units Conditions
TH01 JA Thermal Resistance Junction to Ambient 60 C/W 28-pin SPDIP package
80 C/W 28-pin SOIC package
90 C/W 28-pin SSOP package
27.5 C/W 28-pin UQFN 4x4mm package
27.5 C/W 28-pin QFN 6x6mm package
TH02 JC Thermal Resistance Junction to Case 31.4 C/W 28-pin SPDIP package
24 C/W 28-pin SOIC package
24 C/W 28-pin SSOP package
24 C/W 28-pin UQFN 4x4mm package
24 C/W 28-pin QFN 6x6mm package
TH03 TJMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1)
TH06 PI/OI/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD - VOH))
TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/JA(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature
3: TJ = Junction Temperature
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 377
PIC16(L)F1782/3
30.7 Timing Parameter Symbology
The timing parameter symbols have been created with
one of the following formats:
FIGURE 30-5: LOAD CONDITIONS
1. TppS2ppS
2. TppS
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O PORT t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
FFall PPeriod
HHigh RRise
I Invalid (High-impedance) V Valid
L Low Z High-impedance
Vss
Cl
Legend: CL = 50 pF for all pins, 15 pF for
OSC2 output
Load Condition
Pin
PIC16(L)F1782/3
DS41579C-page 378 Preliminary 2011-2012 Microchip Technology Inc.
30.8 AC Characteristics: PIC16(L)F1782/3-I/E
FIGURE 30-6: CLOCK TIMING
TABLE 30-1: CLOCK OSCILLATOR TIMING REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
OS01 FOSC External CLKIN Frequency(1) DC — 0.5 MHz EC Oscillator mode (low)
DC — 4 MHz EC Oscillator mode (medium)
DC — 20 MHz EC Oscillator mode (high)
Oscillator Frequency(1) — 32.768 — kHz LP Oscillator mode
0.1 — 4 MHz XT Oscillator mode
1 — 4 MHz HS Oscillator mode
1 — 20 MHz HS Oscillator mode, VDD > 2.3V
DC — 4 MHz RC Oscillator mode, VDD > 2.0V
OS02 TOSC External CLKIN Period(1) 27 — s LP Oscillator mode
250 — ns XT Oscillator mode
50 — ns HS Oscillator mode
50 — ns EC Oscillator mode
Oscillator Period(1) — 30.5 — s LP Oscillator mode
250 — 10,000 ns XT Oscillator mode
50 — 1,000 ns HS Oscillator mode
250 — — ns RC Oscillator mode
OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC
OS04* TosH,
TosL
External CLKIN High,
External CLKIN Low
2——s LP oscillator
100 — — ns XT oscillator
20 — — ns HS oscillator
OS05* TosR,
TosF
External CLKIN Rise,
External CLKIN Fall
0—ns LP oscillator
0—ns XT oscillator
0—ns HS oscillator
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (T
CY) equals four times the input oscillator time base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at “min” values with an external clock applied to OSC1 pin. When an external
clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
OSC1/CLKIN
OSC2/CLKOUT
Q4 Q1 Q2 Q3 Q4 Q1
OS02
OS03
OS04 OS04
OSC2/CLKOUT
(LP,XT,HS Modes)
(CLKOUT Mode)
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 379
PIC16(L)F1782/3
TABLE 30-2: OSCILLATOR PARAMETERS
TABLE 30-3: PLL CLOCK TIMING SPECIFICATIONS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Freq.
Tolerance Min. Typ† Max. Units Conditions
OS08 HFOSC Internal Calibrated HFINTOSC
Frequency(2)
±2%
±3%
—
—
16.0
16.0
—
—
MHz
MHz
0°C TA +60°C, VDD 2.5V
60°C T
A 85°C, VDD 2.5V
±5% — 16.0 — MHz -40°C TA +125°C
OS08A MFOSC Internal Calibrated MFINTOSC
Frequency(2)
±2%
±3%
—
—
500
500
—
—
kHz
kHz
0°C TA +60°C, VDD 2.5V
60°C T
A 85°C, VDD 2.5V
±5% — 500 — kHz -40°C TA +125°C
OS09 LFOSC Internal LFINTOSC Frequency — — 31 — kHz -40°C TA +125°C
OS10* TIOSC ST HFINTOSC
Wake-up from Sleep Start-up Time
MFINTOSC
Wake-up from Sleep Start-up Time
——58s
— — 20 30 s
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1 pin. When an exter-
nal clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
2: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1 F and 0.01 F values in parallel are recommended.
3: By design.
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C, 2.7V VDD5.5V
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
F10 FOSC Oscillator Frequency Range 4 — 8 MHz
F11 FSYS On-Chip VCO System Frequency 16 — 32 MHz
F12 TRC PLL Start-up Time (Lock Time) — — 2 ms
F13* CLK CLKOUT Stability (Jitter) -0.25% — +0.25% %
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
PIC16(L)F1782/3
DS41579C-page 380 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 30-7: CLKOUT AND I/O TIMING
FOSC
CLKOUT
I/O pin
(Input)
I/O pin
(Output)
Q4 Q1 Q2 Q3
OS11
OS19
OS13
OS15
OS18, OS19
OS20
OS21
OS17
OS16
OS14
OS12
OS18
Old Value New Value
Write Fetch Read ExecuteCycle
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 381
PIC16(L)F1782/3
TABLE 30-4: CLKOUT AND I/O TIMING PARAMETERS
FIGURE 30-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
OS11 TosH2ckL FOSC to CLKOUT (1) ——70nsVDD = 3.3-5.0V
OS12 TosH2ckH FOSC to CLKOUT (1) ——72nsVDD = 3.3-5.0V
OS13 TckL2ioV CLKOUT to Port out valid(1) ——20ns
OS14 TioV2ckH Port input valid before CLKOUT(1) TOSC + 200 ns — — ns
OS15 TosH2ioV Fosc (Q1 cycle) to Port out valid — 50 70* ns VDD = 3.3-5.0V
OS16 TosH2ioI Fosc (Q2 cycle) to Port input invalid
(I/O in hold time)
50 — — ns VDD = 3.3-5.0V
OS17 TioV2osH Port input valid to Fosc(Q2 cycle)
(I/O in setup time)
20 — — ns
OS18 TioR Port output rise time(2) —
—
40
15
72
32
ns VDD = 1.8V
VDD = 3.3-5.0V
OS19 TioF Port output fall time(2) —
—
28
15
55
30
ns VDD = 1.8V
VDD = 3.3-5.0V
OS20* Tinp INT pin input high or low time 25 — — ns
OS21* Tioc Interrupt-on-change new input level
time
25 — — ns
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25C unless otherwise stated.
Note 1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC.
2: Includes OSC2 in CLKOUT mode.
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Start-up Time
Internal Reset(1)
Watchdog Timer
33
32
30
31
34
I/O pins
34
Note 1: Asserted low.
Reset(1)
PIC16(L)F1782/3
DS41579C-page 382 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 30-9: BROWN-OUT RESET TIMING AND CHARACTERISTICS
VBOR
VDD
(Device in Brown-out Reset) (Device not in Brown-out Reset)
33(1)
Note 1: 64 ms delay only if PWRTE bit in the Configuration Word register is programmed to ‘0’.
2 ms delay if PWRTE = 0 and VREGEN = 1.
Reset
(due to BOR)
VBOR and VHYST
37
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 383
PIC16(L)F1782/3
TABLE 30-5: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
30 TMCLMCLR Pulse Width (low) 2
5
—
—
—
—
s
s
VDD = 3.3-5V, -40°C to +85°C
VDD = 3.3-5V
31 TWDTLP Low-Power Watchdog Timer
Time-out Period
10 16 27 ms VDD = 3.3V-5V
1:16 Prescaler used
32 TOST Oscillator Start-up Timer Period(1), (2) — 1024 — Tosc (Note 3)
33* TPWRT Power-up Timer Period, PWRTE =040 65 140 ms
34* TIOZ I/O high-impedance from MCLR Low
or Watchdog Timer Reset
——2.0s
35 VBOR Brown-out Reset Voltage 2.55
2.30
1.80
2.70
2.45
1.90
2.85
2.6
2.10
V
V
V
BORV = 0
BORV=1 (F device)
BORV=1 (LF device)
35A VLPBOR Low-Power Brown-out 1.8 2.1 2.5 V LPBOR = 1
36* VHYST Brown-out Reset Hysteresis 0 25 75 mV -40°C to +85°C
37* TBORDC Brown-out Reset DC Response
Time
135sVDD VBOR
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are
based on characterization data for that particular oscillator type under standard operating conditions with the
device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption. All devices are tested to operate at “min” values with an external
clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no
clock) for all devices.
2: By design.
3: Period of the slower clock.
4: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1 F and 0.01 F values in parallel are recommended.
PIC16(L)F1782/3
DS41579C-page 384 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 30-10: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 30-6: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns
With Prescaler 10 — — ns
41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns
With Prescaler 10 — — ns
42* TT0P T0CKI Period Greater of:
20 or TCY + 40
N
— — ns N = prescale value
(2, 4, ..., 256)
45* TT1H T1CKI High
Time
Synchronous, No Prescaler 0.5 TCY + 20 — — ns
Synchronous,
with Prescaler
15 — — ns
Asynchronous 30 — — ns
46* TT1L T1CKI Low
Time
Synchronous, No Prescaler 0.5 TCY + 20 — — ns
Synchronous, with Prescaler 15 — — ns
Asynchronous 30 — — ns
47* TT1P T1CKI Input
Period
Synchronous Greater of:
30 or TCY + 40
N
— — ns N = prescale value
(1, 2, 4, 8)
Asynchronous 60 — — ns
48 FT1 Timer1 Oscillator Input Frequency Range
(oscillator enabled by setting bit T1OSCEN)
32.4 32.768 33.1 kHz
49* TCKEZTMR1 Delay from External Clock Edge to Timer
Increment
2 TOSC —7 TOSC — Timers in Sync
mode
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
T0CKI
T1CKI
40 41
42
45 46
47 49
TMR0 or
TMR1
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 385
PIC16(L)F1782/3
FIGURE 30-11: CAPTURE/COMPARE/PWM TIMINGS (CCP)
TABLE 30-7: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP)
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
CC01* TccL CCPx Input Low Time No Prescaler 0.5TCY + 20 — — ns
With Prescaler 20 — — ns
CC02* TccH CCPx Input High Time No Prescaler 0.5TCY + 20 — — ns
With Prescaler 20 — — ns
CC03* TccP CCPx Input Period 3TCY + 40
N
— — ns N = prescale value (1, 4 or 16)
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 30.5 for load conditions.
(Capture mode)
CC01 CC02
CC03
CCPx
PIC16(L)F1782/3
DS41579C-page 386 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 30-8: PIC16(L)F1782/3 A/D CONVERTER (ADC) 12-BIT DIFFERENTIAL CHARACTERISTICS:
TABLE 30-9: PIC16(L)F1782/3 A/D CONVERSION REQUIREMENTS
Operating Conditions
VDD = 3V, Temp. = 25°C, Single-ended 2 s TAD, VREF+ = 3V, VREF- = VSS
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
AD01 NRResolution — — 10 bit
AD02 EIL Integral Error — ±1 ±1.6 LSb
AD03 EDL Differential Error — ±1 ±1.4 LSb No missing codes
AD04 EOFF Offset Error — ±1 ±2 LSb
AD05 EGN Gain Error — ±1 ±2 LSb
AD06 VREF Reference Voltage(3) 1.8 — VDD VVREF = (VREF+ minus VREF-) (Note 5)
AD07 VAIN Full-Scale Range — — VREF V
AD08 ZAIN Recommended Impedance of
Analog Voltage Source
—— 10
kCan go higher if external 0.01F capacitor is
present on input pin.
AD09 NRResolution — — 12 bit
AD10 EIL Integral Error — ±2 — LSb
AD11 EDL Differential Error — ±2 — LSb
AD12 EOFF Offset Error — ±1 — LSb
AD13 EGN Gain Error — ±1 — LSb
AD14 VREF Reference Voltage(3) 1.8 — VDD VVREF = (VREF+ minus VREF-) (Note 5)
AD15 VAIN Full-Scale Range — — VREF V
AD16 ZAIN Recommended Impedance of
Analog Voltage Source
—— 10
kCan go higher if external 0.01F capacitor is
present on input pin.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Total Absolute Error includes integral, differential, offset and gain errors.
2: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes.
3: ADC VREF is from external VREF, VDD pin or FVR, whichever is selected as reference input.
4: When ADC is off, it will not consume any current other than leakage current. The power-down current specification
includes any such leakage from the ADC module.
5: FVR voltage selected must be 2.048V or 4.096V.
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
AD130* TAD A/D Clock Period 1.0 — 9.0 sTOSC-based
A/D Internal RC Oscillator
Period
1.0 1.6 6.0 s ADCS<1:0> = 11 (ADRC mode)
AD131 TCNV Conversion Time (not including
Acquisition Time)(1)
—15—TAD Set GO/DONE bit to conversion
complete
AD132* TACQ Acquisition Time — 5.0 — s
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: The ADRES register may be read on the following TCY cycle.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 387
PIC16(L)F1782/3
FIGURE 30-12: PIC16(L)F1782/3 A/D CONVERSION TIMING (NORMAL MODE)
FIGURE 30-13: PIC16(L)F1782/3 A/D CONVERSION TIMING (SLEEP MODE)
AD131
AD130
BSF ADCON0, GO
Q4
A/D CLK
A/D Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
765 3210
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This
allows the SLEEP instruction to be executed.
1 Tcy
4
AD134 (TOSC/2(1))
1 Tcy
AD132
AD132
AD131
AD130
BSF ADCON0, GO
Q4
A/D CLK
A/D Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
7 5 3210
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This
allows the SLEEP instruction to be executed.
AD134
4
6
1 Tcy
(TOSC/2 + TCY(1))
1 Tcy
PIC16(L)F1782/3
DS41579C-page 388 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 30-10: OPERATIONAL AMPLIFIER (OPA)
TABLE 30-11: COMPARATOR SPECIFICATIONS
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated):
VDD = 3.0 Temperature 25°C, High-Power Mode
Param
No. Symbol Parameters Min Typ Max Units Conditions
OPA01 GBWP Gain Bandwidth Product — 4.3 — MHz High-Power mode
OPA02 TON Turn on Time — 10 — s
OPA03 PMPhase Margin — 60 — degrees
OPA04 SRSlew Rate — 3 — V/s
OPA05 OFF Offset — ±2 ±5 mV
OPA06 CMRR Common Mode Rejection Ratio 60 70 — dB
OPA07 AOL Open Loop Gain — 90 — dB
Operating Conditions: VDD = 3.0V, Temperature = 25°C (unless otherwise stated).
Param
No. Sym. Characteristics Min. Typ. Max. Units Comments
CM01 VIOFF Input Offset Voltage — ±2.5 ±5 mV High Power mode
VICM = VDD/2
CM02 VICM Input Common Mode Voltage 0 — VDD V
CM03 CMRR Common Mode Rejection Ratio 40 50 — dB
CM04A
TRESP
Response Time Rising Edge — 60 85 ns High-Power mode measured
at VDD/2 100 mV Overdrive
CM04B Response Time Falling Edge — 60 90 ns High-Power mode measured
at VDD/2 100 mV Overdrive
CM04C Response Time Rising Edge — 85 — ns Low-Power mode measured
at VDD/2 100 mV Overdrive
CM04D Response Time Falling Edge — 85 — ns Low-Power mode measured
at VDD/2 100 mV Overdrive
CM05 Tmc2ov Comparator Mode Change to
Output Valid*
——10s
CM06 CHYSTER Comparator Hysteresis 20 45 75 mV Hystersis ON, High Power
measured at VDD/2 (Note 2)
* These parameters are characterized but not tested.
Note 1: Response time measured with one comparator input at VDD/2, while the other input transitions
from VSS to VDD.
2: Comparator Hysteresis is available when the CxHYS bit of the CMxCON0 register is enabled.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 389
PIC16(L)F1782/3
TABLE 30-12: DIGITAL-TO-ANALOG CONVERTER (DAC) SPECIFICATIONS
FIGURE 30-14: EUSART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING
TABLE 30-13: EUSART SYNCHRONOUS TRANSMISSION REQUIREMENTS
FIGURE 30-15: EUSART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING
Operating Conditions: VDD = 3V, Temperature = 25°C (unless otherwise stated).
Param
No. Sym. Characteristics Min. Typ. Max. Units Comments
DAC01* CLSB Step Size — VDD/256 — V
DAC02* CACC Absolute Accuracy — — 1LSb
DAC03* CRUnit Resistor Value (R) — 600 —
DAC04* CST Settling Time(1) ——10s
* These parameters are characterized but not tested.
Legend: TBD = To Be Determined
Note 1: Settling time measured while DACR<7:0> transitions from ‘0x00’ to ‘0xFF’.
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param.
No. Symbol Characteristic Min. Max. Units Conditions
US120 TCKH2DTV SYNC XMIT (Master and Slave)
Clock high to data-out valid
3.0-5.5V — 80 ns
1.8-5.5V — 100 ns
US121 TCKRF Clock out rise time and fall time
(Master mode)
3.0-5.5V — 45 ns
1.8-5.5V — 50 ns
US122 TDTRF Data-out rise time and fall time 3.0-5.5V — 45 ns
1.8-5.5V — 50 ns
Note: Refer to Figure 30-5 for load conditions.
US121 US121
US120 US122
CK
DT
Note: Refer to Figure 30-5 for load conditions.
US125
US126
CK
DT
PIC16(L)F1782/3
DS41579C-page 390 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 30-14: EUSART SYNCHRONOUS RECEIVE REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param.
No. Symbol Characteristic Min. Max. Units Conditions
US125 TDTV2CKL SYNC RCV (Master and Slave)
Data-hold before CK (DT hold time) 10 — ns
US126 T
CKL2DTL Data-hold after CK (DT hold time) 15 — ns
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 391
PIC16(L)F1782/3
FIGURE 30-16: SPI MASTER MODE TIMING (CKE = 0, SMP = 0)
FIGURE 30-17: SPI MASTER MODE TIMING (CKE = 1, SMP = 1)
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
SP70
SP71 SP72
SP73
SP74
SP75, SP76
SP78
SP79
SP80
SP79
SP78
MSb LSb
bit 6 - - - - - -1
MSb In LSb In
bit 6 - - - -1
Note: Refer to Figure 30-5 for load conditions.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
SP81
SP71 SP72
SP74
SP75, SP76
SP78
SP80
MSb
SP79
SP73
MSb In
bit 6 - - - - - -1
LSb In
bit 6 - - - -1
LSb
Note: Refer to Figure 30-5 for load conditions.
PIC16(L)F1782/3
DS41579C-page 392 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 30-18: SPI SLAVE MODE TIMING (CKE = 0)
FIGURE 30-19: SPI SLAVE MODE TIMING (CKE = 1)
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
SP70
SP71 SP72
SP73
SP74
SP75, SP76 SP77
SP78
SP79
SP80
SP79
SP78
MSb LSb
bit 6 - - - - - -1
MSb In bit 6 - - - -1 LSb In
SP83
Note: Refer to Figure 30-5 for load conditions.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
SP70
SP71 SP72
SP82
SP74
SP75, SP76
MSb bit 6 - - - - - -1 LSb
SP77
MSb In bit 6 - - - -1 LSb In
SP80
SP83
Note: Refer to Figure 30-5 for load conditions.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 393
PIC16(L)F1782/3
TABLE 30-15: SPI MODE REQUIREMENTS
FIGURE 30-20: I2C™ BUS START/STOP BITS TIMING
Param
No. Symbol Characteristic Min. Typ† Max. Units Conditions
SP70* TSSL2SCH,
TSSL2SCL
SS to SCK or SCK input TCY ——ns
SP71* TSCH SCK input high time (Slave mode) TCY + 20 — — ns
SP72* TSCL SCK input low time (Slave mode) TCY + 20 — — ns
SP73* TDIV2SCH,
TDIV2SCL
Setup time of SDI data input to SCK edge 100 — — ns
SP74* TSCH2DIL,
TSCL2DIL
Hold time of SDI data input to SCK edge 100 — — ns
SP75* TDOR SDO data output rise time 3.0-5.5V — 10 25 ns
1.8-5.5V — 25 50 ns
SP76* TDOF SDO data output fall time — 10 25 ns
SP77* TSSH2DOZSS to SDO output high-impedance 10 — 50 ns
SP78* TSCR SCK output rise time
(Master mode)
3.0-5.5V — 10 25 ns
1.8-5.5V — 25 50 ns
SP79* TSCF SCK output fall time (Master mode) — 10 25 ns
SP80* TSCH2DOV,
TSCL2DOV
SDO data output valid after
SCK edge
3.0-5.5V — — 50 ns
1.8-5.5V — — 145 ns
SP81* TDOV2SCH,
TDOV2SCL
SDO data output setup to SCK edge Tcy — — ns
SP82* TSSL2DOV SDO data output valid after SS edge — — 50 ns
SP83* TSCH2SSH,
TSCL2SSH
SS after SCK edge 1.5TCY + 40 — — ns
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note: Refer to Figure 30-5 for load conditions.
SP91
SP92
SP93
SCL
SDA
Start
Condition
Stop
Condition
SP90
PIC16(L)F1782/3
DS41579C-page 394 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 30-16: I2C™ BUS START/STOP BITS REQUIREMENTS
FIGURE 30-21: I2C™ BUS DATA TIMING
Param
No. Symbol Characteristic Min. Typ Max. Units Conditions
SP90* TSU:STA Start condition 100 kHz mode 4700 — — ns Only relevant for Repeated
Start condition
Setup time 400 kHz mode 600 — —
SP91* THD:STA Start condition 100 kHz mode 4000 — — ns After this period, the first
clock pulse is generated
Hold time 400 kHz mode 600 — —
SP92* TSU:STO Stop condition 100 kHz mode 4700 — — ns
Setup time 400 kHz mode 600 — —
SP93 THD:STO Stop condition 100 kHz mode 4000 — — ns
Hold time 400 kHz mode 600 — —
* These parameters are characterized but not tested.
Note: Refer to Figure 30-5 for load conditions.
SP90
SP91 SP92
SP100
SP101
SP103
SP106 SP107
SP109 SP109
SP110
SP102
SCL
SDA
In
SDA
Out
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 395
PIC16(L)F1782/3
TABLE 30-17: I2C™ BUS DATA REQUIREMENTS
Param.
No. Symbol Characteristic Min. Max. Units Conditions
SP100* THIGH Clock high time 100 kHz mode 4.0 — s Device must operate at a
minimum of 1.5 MHz
400 kHz mode 0.6 — s Device must operate at a
minimum of 10 MHz
SSP module 1.5TCY —
SP101* TLOW Clock low time 100 kHz mode 4.7 — s Device must operate at a
minimum of 1.5 MHz
400 kHz mode 1.3 — s Device must operate at a
minimum of 10 MHz
SSP module 1.5TCY —
SP102* TRSDA and SCL rise
time
100 kHz mode — 1000 ns
400 kHz mode 20 + 0.1CB300 ns CB is specified to be from
10-400 pF
SP103* TFSDA and SCL fall
time
100 kHz mode — 250 ns
400 kHz mode 20 + 0.1CB250 ns CB is specified to be from
10-400 pF
SP106* THD:DAT Data input hold time 100 kHz mode 0 — ns
400 kHz mode 0 0.9 s
SP107* TSU:DAT Data input setup
time
100 kHz mode 250 — ns (Note 2)
400 kHz mode 100 — ns
SP109* TAA Output valid from
clock
100 kHz mode — 3500 ns (Note 1)
400 kHz mode — — ns
SP110* TBUF Bus free time 100 kHz mode 4.7 — s Time the bus must be free
before a new transmission
can start
400 kHz mode 1.3 — s
SP111 CBBus capacitive loading — 400 pF
* These parameters are characterized but not tested.
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
2: A Fast mode (400 kHz) I2C™ bus device can be used in a Standard mode (100 kHz) I2C bus system, but
the requirement T
SU:DAT 250 ns must then be met. This will automatically be the case if the device does
not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal,
it must output the next data bit to the SDA line TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to
the Standard mode I2C bus specification), before the SCL line is released.
PIC16(L)F1782/3
DS41579C-page 396 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 397
PIC16(L)F1782/3
31.0 DC AND AC
CHARACTERISTICS GRAPHS
AND CHARTS
The graphs and tables provided in this section are for design guidance and are not tested.
In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD
range). This is for information only and devices are ensured to operate properly only within the specified range.
“Typical” represents the mean of the distribution at 25C. “Maximum”, “Max.”, “Minimum” or “Min.”
represents (mean + 3) or (mean - 3) respectively, where is a standard deviation, over each temper-
ature range.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.
PIC16(L)F1782/3
DS41579C-page 398 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 31-1: IPD BASE, PIC16LF1782/3 ONLY
FIGURE 31-2: IPD BASE, LOW-POWER SLEEP MODE (VREGPM = 1), PIC16F1782/3 ONLY
450
Max.
200
250
300
350
400
450
IPD (nA)
Max: 85°C + 3
Typical: 25°C
Typical
0
50
100
150
200
250
16
18
20
22
24
26
28
30
32
34
36
38
IPD (n
A
0
50
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
600
Max.
300
400
500
600
IPD (nA)
Max: 85°C + 3
Typical: 25°C
Typical
0
100
200
300
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
IPD (n
A
0
2.3 2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
VDD (V)
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 399
PIC16(L)F1782/3
FIGURE 31-3: IPD, WATCH DOG TIMER (WDT), PIC16LF1782/3 ONLY
FIGURE 31-4: IPD, WATCH DOG TIMER (WDT), PIC16F1782/3 ONLY
1200
Max.
Typical
600
800
1000
1200
I
PD (nA)
Max: 85°C + 3
Typical: 25°C
Typical
0
200
400
600
16
18
20
22
24
26
28
30
32
34
36
38
IPD (nA
)
0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
1200
Max.
Typical
600
800
1000
1200
IPD (nA)
Max: 85°C + 3
Typical: 25°C
Typical
0
200
400
600
15
20
25
30
35
40
45
50
55
60
IPD (n
A
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
PIC16(L)F1782/3
DS41579C-page 400 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 31-5: IPD, BROWN-OUT RESET (BOR), PIC16LF1782/3 ONLY
FIGURE 31-6: IPD, BROWN-OUT RESET (BOR), PIC16F1782/3 ONLY
11
Max: 85
°
C+3
Max.
Typical
7
8
9
10
11
IPD (μA)
Max: 85°C + 3
Typical: 25°C
4
5
6
7
24
26
28
30
32
34
36
38
IPD
(
4
2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
14
Max: 85
°
C
+
3
Max.
Typical
6
8
10
12
14
P
D(μA)
Max: 85°C + 3
Typical: 25°C
0
2
4
6
8
24
29
34
39
44
49
54
59
IPD (μA)
0
2.4 2.9 3.4 3.9 4.4 4.9 5.4 5.9
VDD (V)
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 401
PIC16(L)F1782/3
FIGURE 31-7: IPD, LOW-POWER BROWN-OUT RESET (LPBOR), PIC16LF1782/3 ONLY
FIGURE 31-8: IPD, LOW-POWER BROWN-OUT RESET (LPBOR), PIC16F1782/3 ONLY
800
Max: 85
°
C+3
Max.
300
400
500
600
700
800
IPD (nA)
Max: 85°C + 3
Typical: 25°C
Typical
0
100
200
300
400
2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IPD (n
A
0
2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
700
Max: 85
°
C+3
Max.
300
400
500
600
700
IPD (nA)
Max: 85°C + 3
Typical: 25°C
Typical
0
100
200
300
400
20
25
30
35
40
45
50
55
60
IPD (n
A
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
PIC16(L)F1782/3
DS41579C-page 402 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 31-9: IPD, TIMER1 OSCILLATOR, FOSC = 32 kHz, PIC16LF1782/3 ONLY
FIGURE 31-10: IPD, TIMER1 OSCILLATOR, FSC = 32 kHz, PIC16F1782/3 ONLY
6
Max.
3
4
5
6
IPD (μA)
Max: 85°C + 3
Typical: 25°C
Typical
0
1
2
3
16
18
20
22
24
26
28
30
32
34
36
38
IPD (μ
A
0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
12
Max: 85
°
C+3
Max.
6
8
10
12
PD (μA)
Max: 85°C + 3
Typical: 25°C
Typical
0
2
4
6
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD (μA
)
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 403
PIC16(L)F1782/3
FIGURE 31-11: IPD, VOH vs. IOH OVER TEMPERATURE, VDD = 5.0V, PIC16F1782/3 ONLY
FIGURE 31-12: IPD, VOL vs. IOL OVER TEMPERATURE, VDD = 5.0V, PIC16F1782/3 ONLY
-40°C
Typical
125°C
0
1
2
3
4
5
6
-30 -25 -20 -15 -10 -5 0
VOH (V)
IOH (mA)
Graph represents
3 Limits
-40°C
Typical
125°C
0
1
2
3
4
5
0 1020304050607080
VOL (V)
IOL (mA)
Graph represents
3 Limits
PIC16(L)F1782/3
DS41579C-page 404 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 31-13: IPD, VOH vs. IOH OVER TEMPERATURE, VDD = 3.0V
FIGURE 31-14: IPD, VOL vs. IOL OVER TEMPERATURE, VDD = 3.0V
-40°C
Typical
125°C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
-14 -12 -10 -8 -6 -4 -2 0
VOH (V)
IOH (mA)
Graph represents
3 Limits
-40°C
125°C
Typical
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 5 10 15 20 25 30
VOL (V)
IOL (mA)
Graph represents
3 Limits
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 405
PIC16(L)F1782/3
FIGURE 31-15: IPD, VOL vs. IOL OVER TEMPERATURE, VDD = 1.8V, PIC16LF1782/3 ONLY
FIGURE 31-16: IPD, VOL vs. IOL OVER TEMPERATURE, VDD = 1.8V, PIC16LF1782/3 ONLY
-40°C Typical
125°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-4 -3.5 -3 -2.5 -2 -1.5 -1 -0.5 0
VOH (V)
IOH (mA)
Graph represents
3 Limits
-40°C
Typical
125°C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
012345678910
Vol (V)
IOL (mA)
Graph represents
3 Limits
PIC16(L)F1782/3
DS41579C-page 406 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 31-17: POR RELEASE VOLTAGE
FIGURE 31-18: POR REARM VOLTAGE, NORMAL POWER MODE (VREGPM1 = 0),
PIC16F1782/3 ONLY
Typical
Max.
Min.
1.5
1.52
1.54
1.56
1.58
1.6
1.62
1.64
1.66
1.68
1.7
-40 -20 0 20 40 60 80 100 120
Voltage (V)
Temperature (°C)
Max: Typical + 3
Typical: 25°C
Min: Typical - 3
Typical
Max.
Min.
1.34
1.36
1.38
1.4
1.42
1.44
1.46
1.48
1.5
1.52
1.54
-40 -20 0 20 40 60 80 100 120
Voltage (V)
Temperature (°C)
Max: Typical + 3
Typical: 25°C
Min: Typical - 3
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 407
PIC16(L)F1782/3
FIGURE 31-19: BROWN-OUT RESET VOLTAGE, LOW TRIP POINT (BORV = 1),
PIC16LF1782/3 ONLY
FIGURE 31-20: BROWN-OUT RESET HYSTERESIS, LOW TRIP POINT (BORV = 1),
PIC16LF1782/3 ONLY
Max.
Min.
1.70
1.75
1.80
1.85
1.90
1.95
2.00
2.05
2.10
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3
Min: Typical - 3
Typical
Max.
Min.
0
10
20
30
40
50
60
70
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (mV)
Temperature (°C)
Max: Typical + 3
Typical: 25°C
Min: Typical - 3
PIC16(L)F1782/3
DS41579C-page 408 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 31-21: BROWN-OUT RESET VOLTAGE, HIGH TRIP POINT (BORV = 0)
FIGURE 31-22: BROWN-OUT RESET HYSTERESIS, HIGH TRIP POINT (BORV = 0)
Max.
Min.
2.40
2.45
2.50
2.55
2.60
2.65
2.70
2.75
2.80
2.85
2.90
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3
Min: Typical - 3
Typical
Max.
Min.
0
10
20
30
40
50
60
70
80
90
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (mV)
Temperature (°C)
Max: Typical + 3
Typical: 25°C
Min: Typical - 3
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 409
PIC16(L)F1782/3
FIGURE 31-23: LPBOR RESET VOLTAGE
FIGURE 31-24: LPBOR RESET HYSTERESIS
Max.
Min.
Typical
1.80
1.85
1.90
1.95
2.00
2.05
2.10
2.15
2.20
2.25
2.30
2.35
2.40
2.45
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3
Typical: 25°C
Min: Typical - 3
Typical
Max.
Min.
0
10
20
30
40
50
60
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (mV)
Temperature (°C)
Max: Typical + 3
Typical: 25°C
Min: Typical - 3
PIC16(L)F1782/3
DS41579C-page 410 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 31-25: WDT TIME-OUT PERIOD
FIGURE 31-26: PWRT PERIOD
Typical
Max.
Min.
10
12
14
16
18
20
22
24
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Time (mS)
Voltage (V)
Max: Typical + 3 (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3 (-40°C to +125°C)
Typical
Max.
Min.
40
50
60
70
80
90
100
110
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Time (mS)
Voltage (V)
Max: Typical + 3 (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3 (-40°C to +125°C)
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 411
PIC16(L)F1782/3
FIGURE 31-27: ADC 12-BIT MODE, SINGE-ENDED DNL, VDD = 3.0V, TAD = 4S, 25°C
FIGURE 31-28: ADC 12-BIT MODE, SINGE-ENDED DNL, VDD = 5.5V, TAD = 4S, 25°C
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
0 512 1024 1536 2048 2560 3072 3584 4096
DNL (LSb)
Output Code
-1.0
-0.5
0.0
0.5
1.0
0 512 1024 1536 2048 2560 3072 3584 4096
DNL (LSb)
Output Code
PIC16(L)F1782/3
DS41579C-page 412 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 31-29: COMPARATOR HYSTERESIS, NORMAL SPEED MODE (CxSP = 1), VDD = 1.8V,
TYPICAL MEASURED VALUES, PIC16LF1782/3 ONLY
FIGURE 31-30: COMPARATOR HYSTERESIS, NORMAL SPEED MODE (CxSP = 1), VDD = 3.6V,
TYPICAL MEASURED VALUES
Typical -40°C
Typical 25°C
Typical 125°
40
45
50
55
60
65
70
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
Hysteresis (mV)
Common Mode Voltage (V)
Typical -40°C
Typical 25°C
Typical 125°
25
30
35
40
45
00.511.522.533.54
Hysteresis (mV)
Common Mode Voltage (V)
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 413
PIC16(L)F1782/3
FIGURE 31-31: COMPARATOR HYSTERESIS, NORMAL SPEED MODE (CxSP = 1), VDD = 5.5V,
TYPICAL MEASURED VALUES, PIC16F1782/3 ONLY
FIGURE 31-32: COMPARATOR RESPONSE TIME OVER TEMPERATURE, NORMAL POWER
MODE (CxSP = 1), TYPICAL MEASURED VALUES
Typical -40°C
Typical 25°C
Typical 125°
25
30
35
40
45
50
55
0123456
Hysteresis (mV)
Common Mode Voltage (V)
-40°C
25°C
125°C
40.0
50.0
60.0
70.0
80.0
90.0
100.0
110.0
120.0
1.522.533.544.555.56
Time (nS)
VDD (V)
PIC16(L)F1782/3
DS41579C-page 414 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 415
PIC16(L)F1782/3
32.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers and dsPIC® digital signal
controllers are supported with a full range of software
and hardware development tools:
• Integrated Development Environment
- MPLAB® IDE Software
• Compilers/Assemblers/Linkers
- MPLAB C Compiler for Various Device
Families
- HI-TECH C® for Various Device Families
- MPASMTM Assembler
-MPLINK
TM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
• Simulators
- MPLAB SIM Software Simulator
•Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debuggers
- MPLAB ICD 3
- PICkit™ 3 Debug Express
• Device Programmers
- PICkit™ 2 Programmer
- MPLAB PM3 Device Programmer
• Low-Cost Demonstration/Development Boards,
Evaluation Kits, and Starter Kits
32.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16/32-bit
microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
• A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- In-Circuit Emulator (sold separately)
- In-Circuit Debugger (sold separately)
• A full-featured editor with color-coded context
• A multiple project manager
• Customizable data windows with direct edit of
contents
• High-level source code debugging
• Mouse over variable inspection
• Drag and drop variables from source to watch
windows
• Extensive on-line help
• Integration of select third party tools, such as
IAR C Compilers
The MPLAB IDE allows you to:
• Edit your source files (either C or assembly)
• One-touch compile or assemble, and download to
emulator and simulator tools (automatically
updates all project information)
• Debug using:
- Source files (C or assembly)
- Mixed C and assembly
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
PIC16(L)F1782/3
DS41579C-page 416 Preliminary 2011-2012 Microchip Technology Inc.
32.2 MPLAB C Compilers for Various
Device Families
The MPLAB C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC18,
PIC24 and PIC32 families of microcontrollers and the
dsPIC30 and dsPIC33 families of digital signal control-
lers. These compilers provide powerful integration
capabilities, superior code optimization and ease of
use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
32.3 HI-TECH C for Various Device
Families
The HI-TECH C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC
family of microcontrollers and the dsPIC family of digital
signal controllers. These compilers provide powerful
integration capabilities, omniscient code generation
and ease of use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
The compilers include a macro assembler, linker, pre-
processor, and one-step driver, and can run on multiple
platforms.
32.4 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
• Integration into MPLAB IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multi-purpose
source files
• Directives that allow complete control over the
assembly process
32.5 MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
32.6 MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC devices. MPLAB C Compiler uses
the assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
• Support for the entire device instruction set
• Support for fixed-point and floating-point data
• Command line interface
• Rich directive set
• Flexible macro language
• MPLAB IDE compatibility
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 417
PIC16(L)F1782/3
32.7 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C Compilers,
and the MPASM and MPLAB Assemblers. The soft-
ware simulator offers the flexibility to develop and
debug code outside of the hardware laboratory envi-
ronment, making it an excellent, economical software
development tool.
32.8 MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs PIC® Flash MCUs and dsPIC® Flash DSCs
with the easy-to-use, powerful graphical user interface of
the MPLAB Integrated Development Environment (IDE),
included with each kit.
The emulator is connected to the design engineer’s PC
using a high-speed USB 2.0 interface and is connected
to the target with either a connector compatible with in-
circuit debugger systems (RJ11) or with the new high-
speed, noise tolerant, Low-Voltage Differential Signal
(LVDS) interconnection (CAT5).
The emulator is field upgradable through future firmware
downloads in MPLAB IDE. In upcoming releases of
MPLAB IDE, new devices will be supported, and new
features will be added. MPLAB REAL ICE offers
significant advantages over competitive emulators
including low-cost, full-speed emulation, run-time
variable watches, trace analysis, complex breakpoints, a
ruggedized probe interface and long (up to three meters)
interconnection cables.
32.9 MPLAB ICD 3 In-Circuit Debugger
System
MPLAB ICD 3 In-Circuit Debugger System is Micro-
chip's most cost effective high-speed hardware
debugger/programmer for Microchip Flash Digital Sig-
nal Controller (DSC) and microcontroller (MCU)
devices. It debugs and programs PIC® Flash microcon-
trollers and dsPIC® DSCs with the powerful, yet easy-
to-use graphical user interface of MPLAB Integrated
Development Environment (IDE).
The MPLAB ICD 3 In-Circuit Debugger probe is con-
nected to the design engineer's PC using a high-speed
USB 2.0 interface and is connected to the target with a
connector compatible with the MPLAB ICD 2 or MPLAB
REAL ICE systems (RJ-11). MPLAB ICD 3 supports all
MPLAB ICD 2 headers.
32.10 PICkit 3 In-Circuit Debugger/
Programmer and
PICkit 3 Debug Express
The MPLAB PICkit 3 allows debugging and program-
ming of PIC® and dsPIC® Flash microcontrollers at a
most affordable price point using the powerful graphical
user interface of the MPLAB Integrated Development
Environment (IDE). The MPLAB PICkit 3 is connected
to the design engineer's PC using a full speed USB
interface and can be connected to the target via an
Microchip debug (RJ-11) connector (compatible with
MPLAB ICD 3 and MPLAB REAL ICE). The connector
uses two device I/O pins and the reset line to imple-
ment in-circuit debugging and In-Circuit Serial Pro-
gramming™.
The PICkit 3 Debug Express include the PICkit 3, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
PIC16(L)F1782/3
DS41579C-page 418 Preliminary 2011-2012 Microchip Technology Inc.
32.11 PICkit 2 Development
Programmer/Debugger and
PICkit 2 Debug Express
The PICkit™ 2 Development Programmer/Debugger is
a low-cost development tool with an easy to use inter-
face for programming and debugging Microchip’s Flash
families of microcontrollers. The full featured
Windows® programming interface supports baseline
(PIC10F, PIC12F5xx, PIC16F5xx), midrange
(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,
dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit
microcontrollers, and many Microchip Serial EEPROM
products. With Microchip’s powerful MPLAB Integrated
Development Environment (IDE) the PICkit™ 2
enables in-circuit debugging on most PIC® microcon-
trollers. In-Circuit-Debugging runs, halts and single
steps the program while the PIC microcontroller is
embedded in the application. When halted at a break-
point, the file registers can be examined and modified.
The PICkit 2 Debug Express include the PICkit 2, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
32.12 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a modu-
lar, detachable socket assembly to support various
package types. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an MMC card for file
storage and data applications.
32.13 Demonstration/Development
Boards, Evaluation Kits, and
Starter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully func-
tional systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demon-
stration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 419
PIC16(L)F1782/3
33.0 PACKAGING INFORMATION
33.1 Package Marking Information
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
28-Lead SOIC (7.50 mm) Example
YYWWNNN
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
3
e
28-Lead SPDIP (.300”) Example
28-Lead SSOP (5.30 mm) Example
1204017
3
e
PIC16F1782
-I/SP
1204017
3
e
-I/SO
PIC16F1782
1204017
PIC16F1782
-I/SS
PIC16(L)F1782/3
DS41579C-page 420 Preliminary 2011-2012 Microchip Technology Inc.
Package Marking Information (Continued)
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
28-Lead UQFN (4x4x0.5 mm) Example
PIN 1 PIN 1
28-Lead QFN (6x6 mm) Example
XXXXXXXX
XXXXXXXX
YYWWNNN
PIN 1 PIN 1
120417
3
e
16F1782
-I/ML
PIC16
LF1782
I/MV
204017
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 421
PIC16(L)F1782/3
33.2 Package Details
The following sections give the technical details of the packages.
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N
12
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E1
eB
c
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A2
eb
b1
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A
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PIC16(L)F1782/3
DS41579C-page 422 Preliminary 2011-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 423
PIC16(L)F1782/3
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC16(L)F1782/3
DS41579C-page 424 Preliminary 2011-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 425
PIC16(L)F1782/3
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e
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PIC16(L)F1782/3
DS41579C-page 426 Preliminary 2011-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 427
PIC16(L)F1782/3
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DEXPOSED D2
e
b
K
E2
E
L
N
NOTE 1
1
2
2
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TOP VIEW BOTTOM VIEW
PAD
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PIC16(L)F1782/3
DS41579C-page 428 Preliminary 2011-2012 Microchip Technology Inc.
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2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 429
PIC16(L)F1782/3
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC16(L)F1782/3
DS41579C-page 430 Preliminary 2011-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 431
PIC16(L)F1782/3
APPENDIX A: DATA SHEET
REVISION HISTORY
Revision A (04/2011)
Original release.
Revision B (06/2011)
Revised Section 18.0; Revised Table 30-8; Add
Operational Amplifier Table.
Revision C (03/2012)
Electrical Specifications update.
PIC16(L)F1782/3
DS41579C-page 432 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 433
PIC16(L)F1782/3
INDEX
A
A/D
Specifications............................................................ 386
Absolute Maximum Ratings .............................................. 363
AC Characteristics
Industrial and Extended ............................................ 378
Load Conditions ........................................................ 377
ACKSTAT ......................................................................... 300
ACKSTAT Status Flag ...................................................... 300
ADC .................................................................................. 149
Acquisition Requirements ......................................... 160
Associated registers.................................................. 162
Block Diagram........................................................... 149
Calculating Acquisition Time..................................... 160
Channel Selection..................................................... 150
Configuration............................................................. 150
Configuring Interrupt ................................................. 154
Conversion Clock...................................................... 150
Conversion Procedure .............................................. 154
Internal Sampling Switch (RSS) Impedance.............. 160
Interrupts................................................................... 152
Operation .................................................................. 153
Operation During Sleep ............................................ 153
Port Configuration..................................................... 150
Reference Voltage (VREF)......................................... 150
Source Impedance.................................................... 160
Starting an A/D Conversion ...................................... 152
ADCON0 Register....................................................... 29, 155
ADCON1 Register....................................................... 29, 156
ADCON2 Register............................................................. 157
ADDFSR ........................................................................... 353
ADDWFC .......................................................................... 353
ADRESH Register............................................................... 29
ADRESH Register (ADFM = 0) ......................................... 158
ADRESH Register (ADFM = 1) ......................................... 159
ADRESL Register ............................................................... 29
ADRESL Register (ADFM = 0).......................................... 158
ADRESL Register (ADFM = 1).......................................... 159
Alternate Pin Function.......................................................118
Analog-to-Digital Converter. See ADC
ANSELA Register ............................................................. 123
ANSELB Register ............................................................. 129
APFCON Register............................................................. 119
Assembler
MPASM Assembler................................................... 416
Automatic Context Saving................................................... 83
B
BAUDCON Register.......................................................... 329
BF ............................................................................. 300, 302
BF Status Flag .......................................................... 300, 302
Block Diagrams
(CCP) Capture Mode Operation ............................... 256
ADC .......................................................................... 149
ADC Transfer Function ............................................. 161
Analog Input Model ........................................... 161, 176
CCP PWM................................................................. 260
Clock Source............................................................... 58
Compare ................................................................... 258
Core ............................................................................ 18
Crystal Operation .................................................. 60, 61
Digital-to-Analog Converter (DAC)............................ 168
EUSART Receive ..................................................... 318
EUSART Transmit .................................................... 317
External RC Mode ...................................................... 62
Fail-Safe Clock Monitor (FSCM)................................. 70
Generic I/O Port........................................................ 117
Interrupt Logic............................................................. 79
On-Chip Reset Circuit................................................. 49
OPA Module ............................................................. 163
PIC16(L)F1782/3 .................................................... 5, 12
Resonator Operation .................................................. 60
Timer0 ...................................................................... 181
Timer1 ...................................................................... 185
Timer1 Gate.............................................. 190, 191, 192
Timer2 ...................................................................... 197
Voltage Reference.................................................... 144
Voltage Reference Output Buffer Example .............. 168
BORCON Register.............................................................. 51
BRA .................................................................................. 354
Break Character (12-bit) Transmit and Receive ............... 338
Brown-out Reset (BOR)...................................................... 51
Specifications ........................................................... 383
Timing and Characteristics ....................................... 382
C
C Compilers
MPLAB C18.............................................................. 416
CALL................................................................................. 355
CALLW ............................................................................. 355
Capture Module. See Capture/Compare/PWM(CCP)
Capture/Compare/PWM ................................................... 255
Capture/Compare/PWM (CCP) ........................................ 256
Associated Registers w/ PWM ................................. 263
Capture Mode........................................................... 256
CCPx Pin Configuration............................................ 256
Compare Mode......................................................... 258
CCPx Pin Configuration.................................... 258
Software Interrupt Mode........................... 256, 258
Special Event Trigger ....................................... 258
Timer1 Mode Resource ............................ 256, 258
Prescaler .................................................................. 256
PWM Mode
Duty Cycle ........................................................ 261
Effects of Reset ................................................ 263
Example PWM Frequencies and
Resolutions, 20 MHZ................................ 262
Example PWM Frequencies and
Resolutions, 8 MHz .................................. 262
Operation in Sleep Mode.................................. 263
Resolution ........................................................ 262
System Clock Frequency Changes .................. 263
PWM Operation ........................................................ 260
PWM Overview......................................................... 260
PWM Period ............................................................. 261
PWM Setup .............................................................. 261
Specifications ........................................................... 385
CCP. See Capture/Compare/PWM
CCPxCON (CCPx) Register ............................................. 264
CLKRCON Register............................................................ 76
Clock Accuracy with Asynchronous Operation ................. 326
Clock Sources
External Modes........................................................... 59
EC ...................................................................... 59
HS ...................................................................... 59
LP ....................................................................... 59
OST .................................................................... 60
PIC16(L)F1782/3
DS41579C-page 434 Preliminary 2011-2012 Microchip Technology Inc.
RC....................................................................... 62
XT ....................................................................... 59
Internal Modes ............................................................ 62
HFINTOSC.......................................................... 63
Internal Oscillator Clock Switch Timing...............65
LFINTOSC .......................................................... 63
MFINTOSC ......................................................... 63
Clock Switching................................................................... 67
CMOUT Register............................................................... 178
CMxCON0 Register ..........................................................177
CMxCON1 Register ..........................................................178
Code Examples
A/D Conversion.........................................................154
Changing Between Capture Prescalers .................... 256
Initializing PORTA..................................................... 117
Write Verify ...............................................................112
Writing to Flash Program Memory ............................110
Comparator
Associated Registers ................................................ 179
Operation .................................................................. 171
Comparator Module ..........................................................171
Cx Output State Versus Input Conditions ................. 173
Comparator Specifications................................................ 388
Comparators
C2OUT as T1 Gate ...................................................187
Compare Module. See Capture/Compare/PWM (CCP)
CONFIG1 Register..............................................................44
CONFIG2 Register..............................................................46
Configuration as OPAMP or Comparator..........................164
Core Function Register ....................................................... 28
Customer Change Notification Service ............................. 441
Customer Notification Service........................................... 441
Customer Support ............................................................. 441
D
DACCON0 (Digital-to-Analog Converter Control 0)
Register..................................................................... 170
DACCON1 (Digital-to-Analog Converter Control 1)
Register..................................................................... 170
Data EEPROM Memory ....................................................103
Associated Registers ................................................ 115
Code Protection ........................................................ 104
Reading..................................................................... 104
Writing....................................................................... 104
Data Memory....................................................................... 22
DC and AC Characteristics ............................................... 397
Graphs and Tables ...................................................397
DC Characteristics
Extended and Industrial ............................................ 373
Industrial and Extended ............................................ 366
Development Support ....................................................... 415
Device Configuration...........................................................43
Code Protection .......................................................... 47
Configuration Word .....................................................43
User ID..................................................................47, 48
Device ID Register ..............................................................48
Device Overview ................................................... 11, 99, 201
Digital-to-Analog Converter (DAC).................................... 167
Associated Registers ................................................ 170
Effects of a Reset......................................................168
Specifications............................................................ 389
E
EEADR Registers.............................................................. 103
EEADRH Registers...........................................................103
EEADRL Register ............................................................. 113
EEADRL Registers ........................................................... 103
EECON1 Register..................................................... 103, 114
EECON2 Register..................................................... 103, 115
EEDATH Register............................................................. 113
EEDATL Register ............................................................. 113
EEPROM Data Memory
Avoiding Spurious Write ........................................... 104
Write Verify ............................................................... 112
Effects of Reset
PWM mode............................................................... 263
Electrical Specifications (PIC16F/LF1933) ....................... 363
Enhanced Mid-Range CPU ................................................ 17
Enhanced Universal Synchronous Asynchronous
Receiver Transmitter (EUSART) .............................. 317
Errata .................................................................................... 9
EUSART ........................................................................... 317
Associated Registers
Baud Rate Generator ....................................... 331
Asynchronous Mode ................................................. 319
12-bit Break Transmit and Receive .................. 338
Associated Registers
Receive .................................................... 325
Transmit.................................................... 321
Auto-Wake-up on Break ................................... 336
Baud Rate Generator (BRG) ............................ 330
Clock Accuracy................................................. 326
Receiver ........................................................... 322
Setting up 9-bit Mode with Address Detect ...... 324
Transmitter ....................................................... 319
Baud Rate Generator (BRG)
Auto Baud Rate Detect..................................... 335
Baud Rate Error, Calculating............................ 330
Baud Rates, Asynchronous Modes .................. 332
Formulas........................................................... 331
High Baud Rate Select (BRGH Bit) .................. 330
Synchronous Master Mode............................... 339, 343
Associated Registers
Receive .................................................... 342
Transmit.................................................... 340
Reception ......................................................... 341
Transmission .................................................... 339
Synchronous Slave Mode
Associated Registers
Receive .................................................... 344
Transmit.................................................... 343
Reception ......................................................... 344
Transmission .................................................... 343
Extended Instruction Set
ADDFSR................................................................... 353
F
Fail-Safe Clock Monitor ...................................................... 70
Fail-Safe Condition Clearing....................................... 70
Fail-Safe Detection ..................................................... 70
Fail-Safe Operation..................................................... 70
Reset or Wake-up from Sleep .................................... 70
Firmware Instructions ....................................................... 349
Fixed Voltage Reference (FVR)
Associated Registers ................................................ 145
Flash Program Memory .................................................... 103
Erasing ..................................................................... 108
Modifying .................................................................. 111
Writing ...................................................................... 108
FSR0H Register.................................................................. 28
FSR0L Register .................................................................. 28
FSR1H Register.................................................................. 28
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 435
PIC16(L)F1782/3
FSR1L Register .................................................................. 28
FVRCON (Fixed Voltage Reference Control) Register..... 145
I
I2C Mode (MSSP)
Acknowledge Sequence Timing................................ 304
Bus Collision
During a Repeated Start Condition................... 308
During a Stop Condition.................................... 309
Effects of a Reset...................................................... 305
I2C Clock Rate w/BRG.............................................. 311
Master Mode
Operation .......................................................... 296
Reception.......................................................... 302
Start Condition Timing .............................. 298, 299
Transmission .................................................... 300
Multi-Master Communication, Bus Collision and
Arbitration ......................................................... 305
Multi-Master Mode .................................................... 305
Read/Write Bit Information (R/W Bit) ........................ 281
Slave Mode
Transmission .................................................... 286
Sleep Operation ........................................................ 305
Stop Condition Timing............................................... 304
INDF0 Register ................................................................... 28
INDF1 Register ................................................................... 28
Indirect Addressing ............................................................. 39
INLVLA Register ............................................................... 124
INLVLB Register ............................................................... 130
INLVLC Register ............................................................... 135
INLVLE Register ............................................................... 138
Instruction Format............................................................. 350
Instruction Set ................................................................... 349
ADDLW ..................................................................... 353
ADDWF..................................................................... 353
ADDWFC .................................................................. 353
ANDLW ..................................................................... 353
ANDWF..................................................................... 353
BRA........................................................................... 354
CALL ......................................................................... 355
CALLW...................................................................... 355
LSLF ......................................................................... 357
LSRF......................................................................... 357
MOVF........................................................................ 357
MOVIW ..................................................................... 358
MOVLB ..................................................................... 358
MOVWI ..................................................................... 359
OPTION .................................................................... 359
RESET ...................................................................... 359
SUBWFB................................................................... 361
TRIS.......................................................................... 362
BCF........................................................................... 354
BSF........................................................................... 354
BTFSC ...................................................................... 354
BTFSS ...................................................................... 354
CALL ......................................................................... 355
CLRF......................................................................... 355
CLRW ....................................................................... 355
CLRWDT................................................................... 355
COMF ....................................................................... 355
DECF ........................................................................ 355
DECFSZ.................................................................... 356
GOTO ....................................................................... 356
INCF.......................................................................... 356
INCFSZ..................................................................... 356
IORLW ...................................................................... 356
IORWF...................................................................... 356
MOVLW .................................................................... 358
MOVWF.................................................................... 358
NOP.......................................................................... 359
RETFIE..................................................................... 360
RETLW ..................................................................... 360
RETURN................................................................... 360
RLF........................................................................... 360
RRF .......................................................................... 361
SLEEP ...................................................................... 361
SUBLW..................................................................... 361
SUBWF..................................................................... 361
SWAPF..................................................................... 362
XORLW .................................................................... 362
XORWF .................................................................... 362
INTCON Register................................................................ 84
Internal Oscillator Block
INTOSC
Specifications ................................................... 379
Internal Sampling Switch (RSS) Impedance ..................... 160
Internet Address ............................................................... 441
Interrupt-On-Change......................................................... 139
Associated Registers................................................ 142
Interrupts ............................................................................ 79
ADC .......................................................................... 154
Associated registers w/ Interrupts .............................. 91
Configuration Word w/ Clock Sources... 74, 77, 97, 102,
125
Configuration Word w/ LDO........................................ 97
Configuration Word w/ Reference Clock Sources ...... 77
TMR1........................................................................ 189
INTOSC Specifications ..................................................... 379
IOCxF Register................................................................. 142
IOCxN Register................................................................. 141
IOCxP Register................................................................. 141
L
LATA Register .................................................................. 122
LATB Register .................................................................. 128
LATC Register .................................................................. 133
Load Conditions................................................................ 377
Low Power Brown-out Reset (LPBOR)............................... 52
LSLF ................................................................................. 357
LSRF ................................................................................ 357
M
Master Synchronous Serial Port. See MSSP
MCLR ................................................................................. 52
Internal........................................................................ 52
Memory Organization
Data ............................................................................ 22
Program...................................................................... 19
Microchip Internet Web Site.............................................. 441
MOVIW ............................................................................. 358
MOVLB ............................................................................. 358
MOVWI ............................................................................. 359
MPLAB ASM30 Assembler, Linker, Librarian ................... 416
MPLAB Integrated Development Environment Software.. 415
MPLAB PM3 Device Programmer .................................... 418
MPLAB REAL ICE In-Circuit Emulator System ................ 417
MPLINK Object Linker/MPLIB Object Librarian ................ 416
MSSP ............................................................................... 265
SPI Mode.................................................................. 268
SSPBUF Register..................................................... 271
SSPSR Register ....................................................... 271
MSSPx
PIC16(L)F1782/3
DS41579C-page 436 Preliminary 2011-2012 Microchip Technology Inc.
I2C Mode...................................................................276
I2C Mode Operation .................................................. 278
O
ODCONA Register............................................................124
ODCONB Register............................................................130
ODCONC Register............................................................134
OPA Module
Associated Registers ................................................ 165
Common Mode Voltage Range................................. 164
Effects of a Reset......................................................164
Gain Bandwidth Product ........................................... 164
Input Offset Voltage .................................................. 164
Leakage Current ....................................................... 164
Open Loop Gain........................................................ 164
OPACON Register ............................................................165
OPCODE Field Descriptions .............................................349
Operational Amplifier (OPA) Module................................. 163
OPTION ............................................................................ 359
OPTION Register..............................................................183
OSCCON Register.............................................................. 72
Oscillator
Associated Registers ..................................................74
Oscillator Module ................................................................57
ECH ............................................................................ 57
ECL ............................................................................. 57
ECM ............................................................................ 57
HS ............................................................................... 57
INTOSC ......................................................................57
LP................................................................................ 57
RC............................................................................... 57
XT ............................................................................... 57
Oscillator Parameters........................................................ 379
Oscillator Specifications.................................................... 378
Oscillator Start-up Timer (OST)
Specifications............................................................ 383
Oscillator Switching
Fail-Safe Clock Monitor...............................................70
Two-Speed Clock Start-up..........................................68
OSCSTAT Register.............................................................73
OSCTUNE Register ............................................................ 74
P
Packaging ......................................................................... 419
Marking ............................................................. 419, 420
PDIP Details..............................................................421
PCL and PCLATH ............................................................... 18
PCL Register.......................................................................28
PCLATH Register................................................................28
PCON Register ............................................................. 29, 55
PIE1 Register................................................................ 29, 85
PIE2 Register................................................................ 29, 86
PIE4 Register......................................................................87
Pinout Descriptions
PIC16LF1904/6/7 ........................................................ 13
PIR1 Register................................................................29, 88
PIR2 Register................................................................29, 89
PIR4 Register......................................................................90
PORTA.............................................................................. 120
Associated Registers ................................................ 125
Configuration Word w/ PORTA .................................125
LATA Register.............................................................30
PORTA Register ......................................................... 29
Specifications............................................................ 381
PORTA Register ...............................................................122
PORTB.............................................................................. 126
Associated Registers ................................................ 131
LATB Register ............................................................ 30
PORTB Register......................................................... 29
PORTB Register............................................................... 128
PORTC ............................................................................. 132
Associated Registers ................................................ 135
LATC Register ............................................................ 30
PORTC Register................................................... 29, 32
Specifications ........................................................... 381
PORTC Register............................................................... 133
PORTE ............................................................................. 136
Associated Registers ................................................ 138
PORTE Register......................................................... 29
PORTE Register............................................................... 136
Power-Down Mode (Sleep)................................................. 93
Associated Registers .................................................. 96
Power-on Reset.................................................................. 50
Power-up Time-out Sequence ............................................ 52
Power-up Timer (PWRT) .................................................... 50
Specifications ........................................................... 383
Precision Internal Oscillator Parameters .......................... 379
Program Memory ................................................................ 19
Map and Stack (Bank 16) ........................................... 27
Map and Stack (Bank 31) ........................................... 27
Map and Stack (Banks 0-7) ........................................ 25
Map and Stack (PIC16F1782) .................................... 20
Map and Stack (PIC16LF1906/7) ............................... 20
Reading Memory ........................................................ 21
Programmable Switch Mode Control (PSMC) .................. 201
Programming, Device Instructions.................................... 349
PSMC
Auto-Shutdown ......................................................... 227
Dead-Band Control ................................................... 222
Fractional Frequency Adjust (FFA)........................... 230
Modes ....................................................................... 208
Modulation ................................................................ 226
Operation.................................................................. 202
Output Steering ........................................................ 223
Synchronization ........................................................ 229
PSMC1SYNC Register ..................................................... 235
PSMC2SYNC Register ..................................................... 235
PSMCxASDC Register ..................................................... 242
PSMCxASDL Register...................................................... 243
PSMCxASDS Register ..................................................... 244
PSMCxBLKF Register ...................................................... 249
PSMCxBLKR Register...................................................... 249
PSMCxBLNK Register...................................................... 237
PSMCxCLK Register ........................................................ 236
PSMCxCON Register ....................................................... 233
PSMCxDBF Register........................................................ 248
PSMCxDBR Register........................................................ 248
PSMCxDCH Register ....................................................... 246
PSMCxDCL Register........................................................ 246
PSMCxDCS Register........................................................ 240
PSMCxFEBS Register...................................................... 238
PSMCxFFA Register ........................................................ 248
PSMCxINT Register ......................................................... 253
PSMCxMDL Register........................................................ 234
PSMCxOEN Register ....................................................... 236
PSMCxPHH Register........................................................ 245
PSMCxPHL Register ........................................................ 245
PSMCxPHS Register........................................................ 239
PSMCxPOL Register ........................................................ 237
PSMCxPRH Register........................................................ 247
PSMCxPRL Register ........................................................ 247
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 437
PIC16(L)F1782/3
PSMCxPRS Register ........................................................ 241
PSMCxREBS Register...................................................... 238
PSMCxSTR0 Register ...................................................... 250
PSMCxSTR1 Register ...................................................... 252
PSMCxTMRH Register ..................................................... 244
PSMCxTMRL Register...................................................... 244
R
RCREG ............................................................................. 324
RCREG Register................................................................. 30
RCSTA Register ......................................................... 30, 328
Reader Response ............................................................. 442
Read-Modify-Write Operations ......................................... 349
Reference Clock ................................................................. 75
Associated Registers .................................................. 77
Registers
ADCON0 (ADC Control 0) ........................................ 155
ADCON1 (ADC Control 1) ........................................ 156
ADCON2 (ADC Control 2) ........................................ 157
ADRESH (ADC Result High) with ADFM = 0)........... 158
ADRESH (ADC Result High) with ADFM = 1)........... 159
ADRESL (ADC Result Low) with ADFM = 0)............ 158
ADRESL (ADC Result Low) with ADFM = 1)............ 159
ANSELA (PORTA Analog Select)............................. 123
ANSELB (PORTB Analog Select)............................. 129
APFCON (Alternate Pin Function Control)................ 119
BAUDCON (Baud Rate Control) ............................... 329
BORCON Brown-out Reset Control)........................... 51
Calibration Control Register (CALCON) ................... 164
CCPxCON (CCPx Control) ....................................... 264
CLKRCON (Reference Clock Control)........................ 76
CMOUT (Comparator Output)................................... 178
CMxCON0 (Cx Control) ............................................ 177
CMxCON1 (Cx Control 1) ......................................... 178
Configuration Word 1 .................................................. 44
Configuration Word 2 .................................................. 46
Core Function, Summary............................................ 28
DACCON0 ................................................................ 170
DACCON1 ................................................................ 170
Device ID .................................................................... 48
EEADRL (EEPROM Address) ..................................113
EECON1 (EEPROM Control 1)................................. 114
EECON2 (EEPROM Control 2)................................. 115
EEDATH (EEPROM Data)........................................ 113
EEDATL (EEPROM Data) ........................................ 113
FVRCON................................................................... 145
INLVLA (Input Level Control PORTA)....................... 124
INLVLB (Input Level Control PORTB)....................... 130
INLVLC (Input Level Control PORTC) ...................... 135
INLVLE (Input Level Control PORTE)....................... 138
INTCON (Interrupt Control)......................................... 84
IOCxF (Interrupt-On-Change Flag) ........................... 142
IOCxN (Interrupt-On-Change Negative Edge) .......... 141
IOCxP (Interrupt-On-Change Positive Edge)............ 141
LATA (Data Latch PORTA)....................................... 122
LATB (Data Latch PORTB)....................................... 128
LATC (Data Latch PORTC) ...................................... 133
ODCONA (Open Drain Control PORTA) .................. 124
ODCONB (Open Drain Control PORTB) .................. 130
ODCONC (Open Drain Control PORTC) .................. 134
OPAMP Control Register (OPACON)....................... 165
OPTION_REG (OPTION) ......................................... 183
OSCCON (Oscillator Control) ..................................... 72
OSCSTAT (Oscillator Status) ..................................... 73
OSCTUNE (Oscillator Tuning).................................... 74
PCON (Power Control Register) ................................. 55
PCON (Power Control) ............................................... 55
PIE1 (Peripheral Interrupt Enable 1) .......................... 85
PIE2 (Peripheral Interrupt Enable 2) .......................... 86
PIE4 (Peripheral Interrupt Enable 4) .......................... 87
PIR1 (Peripheral Interrupt Register 1) ........................ 88
PIR2 (Peripheral Interrupt Request 2) ........................ 89
PIR4 (Peripheral Interrupt Request 4) ........................ 90
PORTA ..................................................................... 122
PORTB ..................................................................... 128
PORTC ..................................................................... 133
PORTE ..................................................................... 136
PSMC1SYNC (PSMC1 Synchronization Control) .... 235
PSMC2SYNC (PSMC2 Synchronization Control) .... 235
PSMCxASDC (PSMC Auto-Shutdown Control) ....... 242
PSMCxASDL (PSMC Auto-Shutdown Output Level) 243
PSMCxASDS (PSMC Auto-Shutdown Source)........ 244
PSMCxBLKF (PSMC Falling Edge Blanking Time).. 249
PSMCxBLKR (PSMC Rising Edge Blanking Time) .. 249
PSMCxBLNK (PSMC Blanking Control)................... 237
PSMCxCLK (PSMC Clock Control).......................... 236
PSMCxCON (PSMC Control) ................................... 233
PSMCxDBF (PSMC Falling Edge Dead-band Time) 248
PSMCxDBR (PSMC Rising Edge Dead-band Time) 248
PSMCxDCH (PSMC Duty Cycle High Byte)............. 246
PSMCxDCL (PSMC Duty Cycle Low Byte) .............. 246
PSMCxDCS (PSMC Duty Cycle Source) ................. 240
PSMCxFEBS (PSMC Falling Edge Blanked Source)238
PSMCxFFA (PSMC Fractional Frequency Adjust) ... 248
PSMCxINT (PSMC Time Base Interrupt Control)..... 253
PSMCxMDL (PSMC Modulation Control)................. 234
PSMCxOEN (PSMC Output Enable Control) ........... 236
PSMCxPHH (PSMC Phase Count High Byte).......... 245
PSMCxPHL (PSMC Phase Count Low Byte) ........... 245
PSMCxPHS (PSMC Phase Source)......................... 239
PSMCxPOL (PSMC Polarity Control)....................... 237
PSMCxPRH (PSMC Period Count High Byte) ......... 247
PSMCxPRL (PSMC Period Count Low Byte)........... 247
PSMCxPRS (PSMC Period Source) ........................ 241
PSMCxREBS (PSMC Rising Edge Blanked Source) 238
PSMCxSTR0 (PSMC Steering Control 0) ................ 250
PSMCxSTR1 (PSMC Steering Control 1) ................ 252
PSMCxTMRH (PSMC Time Base Counter High)..... 244
PSMCxTMRL (PSMC Time Base Counter Low) ...... 244
RCREG..................................................................... 335
RCSTA (Receive Status and Control) ...................... 328
SLRCONA (Slew Rate Control PORTA) .................. 124
SLRCONB (Slew Rate Control PORTB) .................. 130
SLRCONC (Slew Rate Control PORTC) .................. 134
SPBRGH .................................................................. 330
SPBRGL ................................................................... 330
Special Function, Summary............................ 29, 34, 35
SSPADD (MSSP Address and Baud Rate,
I2C Mode) ......................................................... 316
SSPCON1 (MSSP Control 1) ................................... 313
SSPCON2 (SSP Control 2) ...................................... 314
SSPCON3 (SSP Control 3) ...................................... 315
SSPMSK (SSP Mask) .............................................. 316
SSPSTAT (SSP Status) ........................................... 312
STATUS ..................................................................... 23
T1CON (Timer1 Control) .......................................... 193
T1GCON (Timer1 Gate Control)............................... 194
T2CON ..................................................................... 199
TRISA (Tri-State PORTA) ........................................ 122
TRISB (Tri-State PORTB) ........................................ 128
TRISC (Tri-State PORTC) ........................................ 133
PIC16(L)F1782/3
DS41579C-page 438 Preliminary 2011-2012 Microchip Technology Inc.
TRISE (Tri-State PORTE)......................................... 137
TXSTA (Transmit Status and Control) ...................... 327
VREGCON (Voltage Regulator Control) ..................... 96
WDTCON (Watchdog Timer Control)........................ 101
WPUA (Weak Pull-up PORTA) .................................123
WPUB (Weak Pull-up PORTB) .................................129
WPUC (Weak Pull-up PORTC)................................. 134
RESET .............................................................................. 359
Reset Instruction .................................................................52
Resets ................................................................................. 49
Associated Registers ..................................................56
Revision History ................................................................431
S
SLRCONA Register ..........................................................124
SLRCONB Register ..........................................................130
SLRCONC Register .......................................................... 134
Software Simulator (MPLAB SIM).....................................417
SPBRG Register ................................................................. 30
SPBRGH Register............................................................. 330
SPBRGL Register .............................................................330
Special Function Registers (SFRs) ......................... 29, 34, 35
SPI Mode (MSSP)
Associated Registers ................................................ 275
SPI Clock ..................................................................271
SSPADD Register.......................................................31, 316
SSPBUF Register ...............................................................31
SSPCON Register...............................................................31
SSPCON1 Register...........................................................313
SSPCON2 Register...........................................................314
SSPCON3 Register...........................................................315
SSPMSK Register.............................................................316
SSPOV.............................................................................. 302
SSPOV Status Flag...........................................................302
SSPSTAT Register ..................................................... 31, 312
R/W Bit......................................................................281
Stack ................................................................................... 37
Accessing.................................................................... 37
Reset........................................................................... 39
Stack Overflow/Underflow...................................................52
STATUS Register................................................................23
SUBWFB........................................................................... 361
T
T1CON Register.......................................................... 29, 193
T1GCON Register.............................................................194
T2CON (Timer2) Register .................................................199
Temperature Indicator Module .......................................... 147
Thermal Considerations.................................................... 376
Timer0 ............................................................................... 181
Associated Registers ................................................ 183
Operation .................................................................. 181
Specifications............................................................ 384
Timer1 ............................................................................... 185
Associated registers.................................................. 195
Asynchronous Counter Mode ................................... 187
Reading and Writing ......................................... 187
Clock Source Selection............................................. 186
Interrupt..................................................................... 189
Operation .................................................................. 186
Operation During Sleep ............................................189
Oscillator ................................................................... 187
Prescaler................................................................... 187
Specifications............................................................ 384
Timer1 Gate
Selecting Source...............................................187
TMR1H Register....................................................... 185
TMR1L Register........................................................ 185
Timer2............................................................................... 197
Associated registers ................................................. 200
Timers
Timer1
T1CON ............................................................. 193
T1GCON........................................................... 194
Timer2
T2CON ............................................................. 199
Timing Diagrams
A/D Conversion......................................................... 387
A/D Conversion (Sleep Mode) .................................. 387
Acknowledge Sequence ........................................... 304
Asynchronous Reception.......................................... 324
Asynchronous Transmission..................................... 320
Asynchronous Transmission (Back to Back) ............ 321
Auto Wake-up Bit (WUE) During Normal Operation . 337
Auto Wake-up Bit (WUE) During Sleep .................... 337
Automatic Baud Rate Calibration.............................. 335
Baud Rate Generator with Clock Arbitration............. 297
BRG Reset Due to SDA Arbitration During
Start Condition.................................................. 307
Brown-out Reset (BOR)............................................ 382
Brown-out Reset Situations ........................................ 51
Bus Collision During a Repeated Start Condition
(Case 1)............................................................ 308
Bus Collision During a Repeated Start Condition
(Case 2)............................................................ 308
Bus Collision During a Start Condition (SCL = 0) ..... 307
Bus Collision During a Stop Condition (Case 1) ....... 309
Bus Collision During a Stop Condition (Case 2) ....... 309
Bus Collision During Start Condition (SDA only) ...... 306
Bus Collision for Transmit and Acknowledge ........... 305
Capture/Compare/PWM (CCP) ................................ 385
CLKOUT and I/O ...................................................... 380
Clock Synchronization .............................................. 294
Clock Timing............................................................. 378
Comparator Output ................................................... 171
Fail-Safe Clock Monitor (FSCM)................................. 71
First Start Bit Timing ................................................. 298
I2C Bus Data............................................................. 394
I2C Bus Start/Stop Bits ............................................. 393
I2C Master Mode (7 or 10-Bit Transmission) ............ 301
I2C Master Mode (7-Bit Reception)........................... 303
I2C Stop Condition Receive or Transmit Mode......... 304
INT Pin Interrupt ......................................................... 82
Internal Oscillator Switch Timing ................................ 66
Repeat Start Condition ............................................. 299
Reset Start-up Sequence ........................................... 53
Reset, WDT, OST and Power-up Timer ................... 381
Send Break Character Sequence............................. 338
SPI Master Mode (CKE = 1, SMP = 1) ..................... 391
SPI Mode (Master Mode).......................................... 271
SPI Slave Mode (CKE = 0) ....................................... 392
SPI Slave Mode (CKE = 1) ....................................... 392
Synchronous Reception (Master Mode, SREN) ....... 342
Synchronous Transmission ...................................... 340
Synchronous Transmission (Through TXEN) ........... 340
Timer0 and Timer1 External Clock ........................... 384
Timer1 Incrementing Edge ....................................... 189
Two Speed Start-up.................................................... 69
USART Synchronous Receive (Master/Slave) ......... 389
USART Synchronous Transmission (Master/Slave). 389
Wake-up from Interrupt............................................... 94
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 439
PIC16(L)F1782/3
Timing Diagrams and Specifications
PLL Clock.................................................................. 379
Timing Parameter Symbology........................................... 377
Timing Requirements
I2C Bus Data............................................................. 395
I2C Bus Start/Stop Bits ............................................. 394
SPI Mode .................................................................. 393
TMR0 Register.................................................................... 29
TMR1H Register ................................................................. 29
TMR1L Register.................................................................. 29
TRIS.................................................................................. 362
TRISA Register ........................................................... 29, 122
TRISB ............................................................................... 126
TRISB Register ........................................................... 29, 128
TRISC ............................................................................... 132
TRISC Register........................................................... 29, 133
TRISE ............................................................................... 136
TRISE Register ........................................................... 29, 137
Two-Speed Clock Start-up Mode ........................................ 68
TXREG.............................................................................. 319
TXREG Register ................................................................. 30
TXSTA Register .......................................................... 30, 327
BRGH Bit .................................................................. 330
U
USART
Synchronous Master Mode
Requirements, Synchronous Receive .............. 389
Requirements, Synchronous Transmission ...... 389
Timing Diagram, Synchronous Receive ........... 389
Timing Diagram, Synchronous Transmission ... 389
V
VREF. SEE ADC Reference Voltage
VREGCON Register ........................................................... 96
W
Wake-up on Break ............................................................ 336
Wake-up Using Interrupts ................................................... 94
Watchdog Timer (WDT) ...................................................... 52
Associated Registers ................................................ 102
Configuration Word w/ Watchdog Timer ................... 102
Modes ....................................................................... 100
Specifications............................................................ 383
WCOL ....................................................... 297, 300, 302, 304
WCOL Status Flag .................................... 297, 300, 302, 304
WDTCON Register ........................................................... 101
WPUA Register................................................................. 123
WPUB Register................................................................. 129
WPUC Register................................................................. 134
Write Protection .................................................................. 47
WWW Address.................................................................. 441
WWW, On-Line Support ....................................................... 9
PIC16(L)F1782/3
DS41579C-page 440 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 441
PIC16(L)F1782/3
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
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specified product family or development tool of interest.
To register, access the Microchip web site at
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CUSTOMER SUPPORT
Users of Microchip products can receive assistance
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Customers should contact their distributor,
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customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
PIC16(L)F1782/3
DS41579C-page 442 2011-2012 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO: Technical Publications Manager
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Application (optional):
Would you like a reply? Y N
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Questions:
FAX: (______) _________ - _________
DS41579CPIC16(L)F1782/3
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
2011-2012 Microchip Technology Inc. Preliminary DS41579C-page 443
PIC16(L)F1782/3
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device: PIC16F1782, PIC16LF1782, PIC16F1783, PIC16LF1783
Tape and Reel
Option:
Blank = Standard packaging (tube or tray)
T = Tape and Reel(1)
Temperature
Range:
I= -40C to +85C(Industrial)
E= -40
C to +125C (Extended)
Package: ML = QFN
MV = UQFN
SP = SPDIP
SO = SOIC
SS = SSOP
Pattern: QTP, SQTP, Code or Special Requirements
(blank otherwise)
Examples:
a) PIC16LF1782T- I/MV 301
Tape and Reel,
Industrial temperature,
UQFN package,
QTP pattern #301
b) PIC16LF1783- I/P
Industrial temperature
SPDIP package
c) PIC16F1783- E/SS
Extended temperature,
SSOP package
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and is
not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
[X](1)
Tape and Reel
Option
-
DS41579C-page 444 2011-2012 Microchip Technology Inc.
AMERICAS
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Tel: 86-756-3210040
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Tel: 91-80-3090-4444
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Tel: 81-66-152-7160
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82-2-558-5934
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Fax: 43-7242-2244-393
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Fax: 33-1-69-30-90-79
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Tel: 39-0331-742611
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Fax: 44-118-921-5820
Worldwide Sales and Service
11/29/11
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Microchip:
PIC16F1783T-I/SO PIC16F1782-I/SP PIC16F1783-I/SP PIC16F1782-E/SS PIC16F1783-I/SO PIC16F1783-I/SS
PIC16LF1782-E/MV PIC16LF1782-I/SO PIC16LF1782T-I/MV PIC16LF1782T-I/SO PIC16LF1783-I/MV
PIC16F1783T-I/SS PIC16LF1782-I/MV PIC16LF1783-E/ML PIC16LF1783T-I/ML PIC16LF1782T-I/ML PIC16LF1783-
I/SO PIC16LF1783T-I/SS PIC16LF1783-I/SS PIC16LF1783-I/SP PIC16LF1782-E/SS PIC16LF1783-I/ML
PIC16LF1782-I/SS PIC16F1782T-I/ML PIC16LF1783-E/SO PIC16F1782-I/ML PIC16LF1783-E/MV PIC16LF1782-
E/ML PIC16LF1782-E/SO PIC16LF1782-I/SP PIC16F1782-I/SO PIC16LF1782-I/ML PIC16LF1782T-I/SS
PIC16LF1782-E/SP PIC16F1782-E/MV PIC16F1783-I/MV PIC16F1783-I/ML PIC16LF1783-E/SS PIC16LF1783-E/SP
PIC16LF1783T-I/MV PIC16F1782-I/MV PIC16LF1783T-I/SO PIC16F1782T-I/SS PIC16F1782-I/SS