EP1100HSPDL-45.696M RoHS EP11 00 HS Pb PD L -45.696M Series RoHS Compliant (Pb-free) 5.0V 8 Pin DIP Metal Thru-Hole HCMOS/TTL Programmable Oscillator Nominal Frequency 45.696MHz Output Logic Type TTL Frequency Tolerance/Stability 100ppm Maximum Pin 1 Connection Power Down (Disabled Output: Logic Low) Package Operating Temperature Range -20C to +70C Duty Cycle 50 10(%) ELECTRICAL SPECIFICATIONS Nominal Frequency 45.696MHz Frequency Tolerance/Stability 100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range,Supply Voltage Change, Output Load Change, First Year Aging at 25C, Shock, and Vibration) Aging at 25C 5ppm/year Maximum Operating Temperature Range -20C to +70C Supply Voltage 5.0Vdc 10% Input Current 45mA Maximum (Unloaded) Output Voltage Logic High (Voh) 2.4Vdc Minimum (IOH=-16mA) Output Voltage Logic Low (Vol) 0.4Vdc Maximum (IOL=+16mA) Rise/Fall Time 4nSec Maximum (Measured at 0.8Vdc to 2.0Vdc) Duty Cycle 50 10(%) (Measured at 1.4Vdc with TTL Load; Measured at 50% of waveform with HCMOS Load) Load Drive Capability 5TTL Load Maximum Output Logic Type TTL Pin 1 Connection Power Down (Disabled Output: Logic Low) Pin 1 Input Voltage (Vih and Vil) +2.0Vdc Minimum to enable output, +0.8Vdc Maximum to disable output, No Connect to enable output. Standby Current 50A Maximum (Pin 1 = Ground) Disable Current 30mA Maximum (Pin 1 = Ground) Peak to Peak Jitter (tPK) 100pSec Maximum, 50pSec Typical RMS Period Jitter (tRMS) 13pSec Maximum, 8pSec Typical Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014, Condition A Gross Leak Test MIL-STD-883, Method 1014, Condition C Lead Integrity MIL-STD-883, Method 2004 Mechanical Shock MIL-STD-202, Method 213, Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/16/2010 | Page 1 of 7 EP1100HSPDL-45.696M MECHANICAL DIMENSIONS (all dimensions in millimeters) 7.620 0.203 1 7.620 0.203 8 0.8 0.1 (X3) 4 DIA 0.457 0.1 (X4) 5 PIN CONNECTION 1 Power Down (Logic Low) 4 Case/Ground 5 Output 8 Supply Voltage LINE MARKING 5.08 MIN 1 ECLIPTEK 2 EP11PD EP11=Product Series 3 45.696M 4 XXYZZ XX=Ecliptek Manufacturing Code Y=Last Digit of the Year ZZ=Week of the Year 5.6 MAX 13.2 MAX MARKING ORIENTATION 13.2 MAX CLOCK OUTPUT POWER DOWN INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% or 2.0VDC OUTPUT DISABLE (LOGIC LOW) 50% or 1.4VDC 20% or 0.8VDC VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/16/2010 | Page 2 of 7 EP1100HSPDL-45.696M Test Circuit for TTL Output Output Load Drive Capability RL Value (Ohms) CL Value (pF) 10TTL 5TTL 2TTL 10LSTTL 1TTL 390 780 1100 2000 2200 15 15 6 15 3 Oscilloscope Table 1: RL Resistance Value and CL Capacitance Value Vs. Output Load Drive Capability + + Power Supply _ Current Meter _ Supply Voltage (VDD) Frequency Counter Probe (Note 2) RL (Note 4) Output + Voltage Meter _ + 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) Power Supply _ No Connect or Tri-State Note 1: An external 0.1F low frequency tantalum bypass capacitor in parallel with a 0.01F high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'. Note 5: All diodes are MMBD7000, MMBD914, or equivalent. www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/16/2010 | Page 3 of 7 EP1100HSPDL-45.696M Test Circuit for CMOS Output Frequency Counter Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) No Connect or Tri-State Note 1: An external 0.1F low frequency tantalum bypass capacitor in parallel with a 0.01F high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/16/2010 | Page 4 of 7 EP1100HSPDL-45.696M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Solder Bath (Wave Solder) TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/16/2010 | Page 5 of 7 EP1100HSPDL-45.696M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 185C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 185C Maximum 185C Maximum 2 Times 10 seconds Maximum 2 Times 5C/second Maximum N/A Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/16/2010 | Page 6 of 7 EP1100HSPDL-45.696M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Solder Bath (Wave Solder) TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 30 - 60 Seconds 5C/second Maximum 150C 200 Seconds Maximum 245C Maximum 245C Maximum 1 Time / 235C Maximum 2 Times 5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/16/2010 | Page 7 of 7