1996 Nov 15 1
Philips Components
Chip resistors General Introduction
INTRODUCTION
Data in data sheets is presented - whenever possible -
according to a ‘format’, in which the following chapters are
stated:
•TITLE
•FEATURES
•APPLICATIONS
•DESCRIPTION
•QUICK REFERENCE DATA
•ORDERING INFORMATION
•FUNCTIONAL DESCRIPTION
– Product characterization
– Limiting values
•MECHANICAL DATA
– Mass
– Marking
– Outlines
•TESTS AND REQUIREMENTS
The chapters listed above are explained in this section
“General Introduction Chip resi stors”
, with detailed
information in the relevant data sheet. Chapters
“Mounting” and “Packaging” are detailed in separate
sections.
DESCRIPTION
All types of chip resistors have a rectangular ceramic body.
The resistive element is a metal glaze film. The chips have
been trimmed to the required ohmic resistance by cutting
one or more grooves in the resistive layer. This process is
completely computer controlled and yields a high
reliability. The terminations are attached using either a
silver dipping method or by applying nickel terminations
which are covered with lead/tin.
The resistive layer is coated with a coloured protective
layer. This protective layer provides electrical, mechanical
and/or environmental protection - also against soldering
flux and cleaning solvents, in accordance with
“MIL-STD-202E”
, method 215 and
“IEC 68-2-45”
.
ORDERING INFORMATION
Resistors are ordered by their ordering code, a 12-digit
number. In general, the packaging method and resistance
code are integral parts of this number.
Exceptions to this rule are customer/application specific
resistors that are not included in our standard series, such
as higher ohmic values and non-standard values.
FUNCTIONAL DESCRIPTION
The functional description includes: nominal resistance
range and tolerance, limiting voltage, temperature
coefficient, absolute maximum dissipation, climatic
category and stability.
The limiting voltage (DC or RMS) is the maximum
voltage that may be continuously applied to the resistor
element, see
“IEC publications 115-8”.
The temperature rise in a resistor due to power dissipation,
is determined by the laws of heat - conduction, convection
and radiation. The maximum body temperature usually
occurs in the middle of the resistor and is called the
hot-spot temperature.
In the normal operating temperature range of chip
resistors the temperature rise at the hot-spot, ∆T, is
proportional to the power dissipated: ∆T=A×P. The
proportionally constant ‘A’ gives the temperature rise per
Watt of dissipated power and can be interpreted as a
thermal resistance in K/W. This thermal resistance is
dependent on the heat conductivity of the materials used
(including the PCB), the way of mounting and the
dimensions of the resistor. The sum of the temperature
rise and the ambient temperature is:
Tm=T
amb +∆T
where:
Tm= hot-spot temperature
Tamb = ambient temperature
∆T = temperature rise at hot-spot.
The stability of a chip resistor during endurance tests is
mainly determined by the hot-spot temperature and the
resistive materials used.
Summarizing
DESCRIPTION RELATIONSHIP
Dimensions, conductance of
materials and mounting determine heat resistance
Heat resistance ×dissipation gives temperature rise
Temperature rise + ambient
temperature give hot-spot
temperature