1
FEATURES
DESCRIPTION
APPLICATIONS
(TOPVIEW)
RESET
GND
MR
VDD
PFI
TPS3103
DBVPACKAGE
PFO
3
2
4
6
1
5
(TOPVIEW)
RSTVDD
GND
MR
VDD
SENSE
TPS3106
DBVPACKAGE
RSTSENSE
3
2
4
6
1
5
(TOPVIEW)
RESET
GND
MR
VDD
SENSE
TPS3110
DBVPACKAGE
WDI
3
2
4
6
1
5TypicalApplicationCircuit
TPS3106K33DBV
VDD
RSTVDD
RSTSENSE
GND
SENSE
R1
R2
GND
VCORE VIO
RESET
R3 DSP
3.3V
1.6V
GND
MR
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007www.ti.com
UltraLow Supply-Current/Supply-Voltage Supervisory Circuits
2
Precision Supply Voltage Supervision Range:0.9 V, 1.2 V, 1.5 V, 1.6 V, 2 V, and 3.3 V
The TPS310x and TPS311x families of supervisorycircuits provide circuit initialization and timingHigh Trip-Point Accuracy: 0.75%
supervision, primarily for DSP and processor-basedSupply Current of 1.2 μA (typical)
systems.RESET Defined With Input Voltages as Low as
During power-on, RESET is asserted when the0.4 V
supply voltage (V
DD
) becomes higher than 0.4 V.Power-On Reset Generator With a Delay Time
Thereafter, the supervisory circuit monitors V
DD
andof 130 ms
keeps the RESET output active as long as V
DDPush/Pull or Open-Drain RESET Outputs
remains below the threshold voltage (V
IT
). An internaltimer delays the return of the output to the inactiveSOT23-6 Package
state to ensure proper system reset. The delay timePackage Temperature Range: 40 °C to +85 °C
starts after V
DD
has risen above V
IT
. When V
DD
dropsbelow V
IT
, the output becomes active again.
All the devices of this family have a fixed-senseApplications Using Low-Power DSPs,
threshold voltage (V
IT
) set by an internal voltageMicrocontrollers, or Microprocessors
divider.Portable- and Battery-Powered Equipment
The TPS3103 and TPS3106 have an active-low,Intelligent Instruments
open-drain RESET output. The TPS3110 has anWireless Communication Systems
active-low push/pull RESET.Industrial Equipment
The product spectrum is designed for supply voltagesNotebook/Desktop Computers
of 0.9 V up to 3.3 V. The circuits are available inSOT23-6 packages. The TPS31xx family ischaracterized for operation over a temperature rangeof 40 °C to +85 °C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001 2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
PRODUCT NOMINAL SUPPLY VOLTAGE THRESHOLD VOLTAGE, V
IT
(2)
TPS3103E12DBVR 1.2 V 1.142 VTPS3103E15DBVR 1.5 V 1.434 VTPS3103H20DBVR 2.0 V 1.84 VTPS3103K33DBVR 3.3 V 2.941 VTPS3106E09DBVR 0.9 V 0.86 VTPS3106E16DBVR 1.6 V 1.521 VTPS3106K33DBVR 3.3 V 2.941 VTPS3110E09DBVR 0.9 V 0.86 VTPS3110E12DBVR 1.2 V 1.142 VTPS3110E15DBVR 1.5 V 1.434 VTPS3110K33DBVR 3.3 V 2.941 V
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TIweb site at www.ti.com .(2) Custom threshold voltages are available. Minimum order quantities apply. Contact factory for details and availability.
AVAILABLE OPTIONS
DEVICE RESET OUTPUT RSTSENSE, RSTVDD OUTPUT SENSE INPUT WDI INPUT PFO OUTPUT
TPS3103 Open-drain Open-drainTPS3106 Open-drain ü
TPS3110 Push-pull ü ü
Over operating free-air temperature range, unless otherwise noted.
VALUE UNIT
Supply voltage, V
DD
(2)
0.3 to +3.6 VMR Pin, V
MR
0.3 to V
DD
+ 0.3 VAll other pins
(2)
0.3 to +3.6 VMaximum low output current, I
OL
5 mAMaximum high output current, I
OH
5 mAInput clamp current, I
IK
(V
I
< 0 or V
I
> V
DD
) ± 10 mAOutput clamp current, I
OK
(V
O
< 0 or V
O
> V
DD
)
(3)
± 10 mAContinuous total power dissipation See Dissipation Rating TableOperating temperature range, T
A
40 to +85 °CStorage temperature range, T
STG
65 to +150 °CSoldering temperature +260 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values are with respect to GND. For reliable operation, the device must not be operated at 3.6 V for more than t = 1000hcontinuously.
(3) Output is clamped for push-pull outputs by the back gate diodes internal to the IC. No clamp exists for the open-drain outputs.
2Submit Documentation Feedback Copyright © 2001 2007, Texas Instruments Incorporated
www.ti.com
DISSIPATION RATINGS
RECOMMENDED OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007
T
A
+25 °C DERATING FACTOR T
A
= +70 °C T
A
= +85 °CPACKAGE POWER RATING ABOVE T
A
= +25 °C POWER RATING POWER RATING
DBV 437 mW 3.5 mW/ °C 280 mW 227 mW
Over operating free-air temperature range, unless otherwise noted.
MIN MAX UNIT
Supply voltage, V
DD
(1)
0.4 3.3 VInput voltage, V
I
0 V
DD
+ 0.3 VHigh-level input voltage, V
IH
at MR, WDI 0.7 ×V
DD
VLow-level input voltage, V
IL
at MR, WDI 0.3 ×V
DD
VInput transition rise and fall rate at Δt/ ΔV at MR, WDI 100 ns/VOperating temperature range, T
A
40 +85 °C
(1) For proper operation of SENSE, PFI, and WDI functions: V
DD
0.8 V.
Over operating free-air temperature range (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
DD
= 3.3 V, I
OH
= 3 mAV
DD
= 1.8 V, I
OH
= 2 mA
0.8 ×V
DD
VV
OH
High-level output voltage V
DD
= 1.5 V, I
OH
= 1 mAV
DD
= 0.9 V, I
OH
= 0.4 mAV
DD
= 0.5 V, I
OH
= 5 μA 0.7 ×V
DD
VV
DD
= 3.3 V, I
OL
= 3 mAV
DD
= 1.5 V, I
OL
= 2 mAV
OL
Low-level output voltage 0.3 VV
DD
= 1.2 V, I
OL
= 1 mAV
DD
= 0.9 V, I
OL
= 500 μAV
OL
Low-level output voltage RESET only V
DD
= 0.4 V, I
OL
= 5 μA 0.1 VTPS31xxE09 0.854 0.860 0.866TPS31xxE12 1.133 1.142 1.151TPS31xxE15 1.423 1.434 1.445Negative-going inputV
IT
T
A
= +25 °C Vthreshold voltage
(1)
TPS31xxE16 1.512 1.523 1.534TPS31xxH20 1.829 1.843 1.857TPS31xxK33 2.919 2.941 2.963Negative-going inputV
IT (S)
SENSE, PFI V
DD
0.8 V, T
A
= +25 °C 0.542 0.551 0.559 Vthreshold voltage
(1)
0.8 V V
IT
< 1.5 V 20V
HYS
Hysteresis at V
DD
input 1.6 V V
IT
< 2.4 V 30 mV2.5 V V
IT
< 3.3 V 50Temperature coefficient of V
IT
, PFI,T
(K)
T
A
= 40 °C to +85 °C 0.012 0.019 %/KSENSEV
HYS
Hysteresis at SENSE, PFI input V
DD
0.8 V 15 mVMR MR = V
DD
, V
DD
= 3.3 V 25 25I
IH
High-level input current nASENSE, PFI, SENSE, PFI, WDI = V
DD
,
25 25WDI V
DD
= 3.3 V
(1) To ensure the best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 μF) should be placed close to the supplyterminals.
Copyright © 2001 2007, Texas Instruments Incorporated Submit Documentation Feedback 3
www.ti.com
SWITCHING CHARACTERISTICS
TIMING REQUIREMENTS
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007
ELECTRICAL CHARACTERISTICS (continued)Over operating free-air temperature range (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
MR MR = 0 V, V
DD
= 3.3 V 47 33 25 μAI
IL
Low-level input current
SENSE, PFI, SENSE, PFI, WDI = 0 V,
25 25 nAWDI V
DD
= 3.3 VHigh-level output currentI
OH
Open-drain V
DD
= V
IT
+ 0.2 V, V
OH
= 3.3 V 200 nAat RESET
(2)
V
DD
> V
IT
(average current),
1.2 3V
DD
< 1.8 VV
DD
> V
IT
(average current),
2 4.5I
DD
Supply current μAV
DD
> 1.8 VV
DD
< V
IT
, V
DD
< 1.8 V 22V
DD
< V
IT
, V
DD
> 1.8 V 27Internal pull-up resistor at MR 70 100 130 k
C
I
Input capacitance at MR, SENSE, PFI, WDI V
I
= 0 V to V
DD
1 pF
(2) Also refers to RSTVDD and RSTSENSE.
At R
L
= 1 M , C
L
= 50 pF, and T
A
= 40 °C to +85 °C, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t
D
Delay time V
DD
1.1 ×V
IT
, MR = 0.7 ×V
DD
, See Timing Diagrams 65 130 195 ms
Propagation delay time, V
DD
to RESET ort
PHL
V
IH
= 1.1 ×V
IT
, V
IL
= 0.9 ×V
IT
40 μshigh-to-low level output RSTVDD delay
Propagation delay time, V
DD
to RESET ort
PLH
V
IH
= 1.1 ×V
IT
, V
IL
= 0.9 ×V
IT
40 μslow-to-high level output RSTVDD delay
Propagation delay time, SENSE to RESET ort
PHL
V
DD
0.8 V, V
IH
= 1.1 ×V
IT
, V
IL
= 0.9 ×V
IT
40 μshigh-to-low level output RSTSENSE delay
Propagation delay time, SENSE to RESET ort
PLH
V
DD
0.8 V, V
IH
= 1.1 ×V
IT
, V
IL
= 0.9 ×V
IT
40 μshigh-to-low level output RSTSENSE delay
Propagation delay time,t
PHL
PFI to PFO delay V
DD
0.8 V, V
IH
= 1.1 ×V
IT
, V
IL
= 0.9 ×V
IT
40 μshigh-to-low level output
Propagation delay time,t
PLH
PFI to PFO delay V
DD
0.8 V, V
IH
= 1.1 ×V
IT
, V
IL
= 0.9 ×V
IT
300 μslow-to-high level output
MR to RESET.Propagation delay time,t
PHL
RSTVDD, V
DD
1.1 ×V
IT
, V
IL
= 0.3 ×V
DD
, V
IH
= 0.7 ×V
DD
1 5 μslow-to-high level output
RSTSENSE delay
MR to RESET.Propagation delay time,t
PLH
RSTVDD, V
DD
1.1 ×V
IT
, V
IL
= 0.3 ×V
DD
, V
IH
= 0.7 ×V
DD
1 5 μslow-to-high level output
RSTSENSE delay
At R
L
= 1 M , C
L
= 50 pF, and T
A
= 40 °C to +85 °C, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t
T(OUT)
Time-out period at WDI V
DD
0.85 V 0.55 1.1 1.65 sat V
DD
V
IH
= 1.1 ×V
IT
, V
IL
= 0.9 ×V
IT
, V
IT
= 0.86 V 20at MR V
DD
V
IT
+ 0.2 V, V
IL
= 0.3 ×V
DD
, V
IH
= 0.7 ×V
DD
0.1t
W
Pulse width at SENSE V
DD
V
IT
, V
IH
= 1.1 ×V
IT (S)
, V
IL
= 0.9 ×V
IT (S)
20 μsat PFI V
DD
0.85 V, V
IH
= 1.1 ×V
IT (S)
,V
IL
= 0.9 ×V
IT (S)
20at WDI V
DD
V
IT
, V
IL
= 0.3 ×V
DD
, V
IH
= 0.7 ×V
DD
0.3
4Submit Documentation Feedback Copyright © 2001 2007, Texas Instruments Incorporated
www.ti.com
FUNCTIONAL BLOCK DIAGRAMS
_
+
_
+
ResetLogic
andTimer
VIT-
0.551V
VDD
MR
PFI
GND
RESET
PFO
TPS3103
_
+
_
+
ResetLogic
andTimer
0.551V
VDD
MR
SENSE
GND
RSTVDD
ResetLogic
andTimer
RSTSENSE
TPS3106
VIT-
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007
Copyright © 2001 2007, Texas Instruments Incorporated Submit Documentation Feedback 5
www.ti.com
_
+
_
+ResetLogic
andTimer
0.551V
VDD
MR
SENSE
GND
RESET
Watchdog
Logicand
Control
WDI
TPS3110
VIT-
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007
Table 1. TPS3103 FUNCTION TABLE
MR V
(PFI)
> 0.551 V V
DD
> V
IT
RESET PFO
L 0 X
(1)
L LL 1 X L HH 00LLH 0 1 H LH 1 0 L HH 1 1 H H
(1) X = Don t care.
Table 2. TPS3106 FUNCTION TABLE
MR V
(SENSE)
> 0.551 V V
DD
> V
IT
RSTVDD RSTSENSE
L X
(1)
X L LH 00LLH 0 1 H LH 1 0 L HH 1 1 H H
(1) X = Don t care.
Table 3. TPS3110 FUNCTION TABLE
(1)
MR V
(SENSE)
> 0.551 V V
DD
> V
IT
RESET
L X
(2)
X LH 0 0 LH 0 1 LH 1 0 LH 1 1 H
(1) Function of watchdog-timer not shown.(2) X = Don t care.
6Submit Documentation Feedback Copyright © 2001 2007, Texas Instruments Incorporated
www.ti.com
PIN DESCRIPTIONS
(TOPVIEW)
RSTVDD
GND
MR
VDD
SENSE
TPS3106
DBVPACKAGE
RSTSENSE
3
2
4
6
1
5
(TOPVIEW)
RESET
GND
MR
VDD
PFI
TPS3103
DBVPACKAGE
PFO
3
2
4
6
1
5
(TOPVIEW)
RESET
GND
MR
VDD
SENSE
TPS3110
DBVPACKAGE
WDI
3
2
4
6
1
5
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTIONNAME DEVICE NO.
GND ALL 2 GND
Manual-reset input. Pull low to force a reset. RESET remains low as long as MR is low and forMR ALL 3
the timeout period after MR goes high. Leave unconnected or connect to V
DD
when unused.PFI TPS3103 4 Power-fail input compares to 0.551 V with no additional delay. Connect to V
DD
if not used.PFO TPS3103 5 Power-fail output. Goes high when voltage at PFI rises above 0.551 V.TPS3103,RESET 1 Active-low reset output. Either push-pull or open-drain output stage.TPS3110
Active-low reset output. Logic level at RSTSENSE only depends on the voltage at SENSE andRSTSENSE TPS3106 5
the status of MR.Active-low reset output. Logic level at RSTVDD only depends on the voltage at V
DD
and theRSTVDD TPS3106 1
status of MR.TPS3106, A reset will be asserted if the voltage at SENSE is lower than 0.551 V. Connect to V
DD
ifSENSE 4TPS3110 unused.V
DD
ALL 6 Supply voltage. Powers the device and monitors its own voltage.Watchdog timer input. If WDI remains high or low longer than the time-out period, then reset isWDI TPS3110 5 triggered. The timer clears when reset is asserted or when WDI sees a rising edge or a fallingedge.
Copyright © 2001 2007, Texas Instruments Incorporated Submit Documentation Feedback 7
www.ti.com
TIMING DIAGRAMS
Timing Diagrams for TPS3103
tD
tDtDtDtD
VDD
VIT
0.4V
SENSE
V =0.551V
IT (S)-
RESET
OutputCondition
Undefined
MR
t
t
t
t
t
OutputCondition
Undefined
PFI
V =0.551V
IT (S)-
OutputCondition
Undefined
PFO
t
t
OutputCondition
Undefined
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007
8Submit Documentation Feedback Copyright © 2001 2007, Texas Instruments Incorporated
www.ti.com
Timing Diagram for TPS3106
VDD
VIT
0.4V
t
t
t
t
t
OutputCondition
Undefined
OutputCondition
Undefined
OutputCondition
Undefined
OutputCondition
Undefined
tDtD
tD
tD
RSTVDD
SENSE
V =0.551V
IT (S)-
RSTSENSE
MR
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007
Copyright © 2001 2007, Texas Instruments Incorporated Submit Documentation Feedback 9
www.ti.com
Timing Diagram for TPS3110
VDD
VIT
0.4V
t
t
OutputCondition
Undefined
OutputCondition
Undefined
t
tD
VIT (S)-=0.551V
SENSE
RESET
WDI
MR
tDtDtD
tDtD
t(TOUT)
x=Don’tCare
TYPICAL CHARACTERISTICS
0
0.05
0.10
0.15
0.20
0.25
0.30
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
T =25 C°
A
T =0 C°
A
T 40 C- °
A=
T =85 C
A°
V Low-LevelOutputVoltage V
OL- -
I Low-LevelOutputCurrent
OL - - mA
V =0.9V
DD
SENSE=GND
MR =GND
WDI=GND
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007
TPS3110E09 TPS3110E09SUPPLY CURRENT LOW-LEVEL OUTPUT VOLTAGEvs vsSUPPLY VOLTAGE LOW-LEVEL OUTPUT CURRENT
Figure 1. Figure 2.
10 Submit Documentation Feedback Copyright © 2001 2007, Texas Instruments Incorporated
www.ti.com
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 2 4 6 8 10 12 14 16 18 20
T =25 C°
A
T =0 C°
A
T = 40 C- °
A
T =85 C
A°
V =3.3V
DD
SENSE=GND
MR =GND
WDI=GND
V Low-LevelOutputVoltage V
OL- -
I Low-LevelOutputCurrent
OL - - mA
0.60
0.65
0.70
0.75
0.80
0.85
0.90
-0.5-0.4-0.3-0.2-0.10
T =25
A°C
T =0
A°C
T 40 C- °
A=
T =85
A°C
V =0.9V
DD
SENSE=VDD
MR =VDD
WDI:Triggered
I High-LevelOutputCurrent- -
OH mA
VHigh-LevelOutputVoltage V
OH - -
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
-25-20-15-10-50
T 40 C
A- °=
T =0 C°
A
T =25 C°
A
T =85 C°
A
V =3.3V
DD
SENSE=VDD
MR =VDD
WDI:Triggered
V High-LeveloutputVoltage V
OH - -
I Low-LevelOutputCurrent
OH - - mA
0
5
10
15
20
25
30
35
40
45
50
0 0.1 0.2 0.3 0.4 0.5
V ThresholdOverdriveVoltage- - V
DD
t VMinimumPulseDurationat--ms
W DD
V =3.3V
DD
V =0.9V
DD
MR :Open
SENSE=VDD
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
TPS3110E09 TPS3110E09LOW-LEVEL OUTPUT VOLTAGE HIGH-LEVEL OUTPUT VOLTAGEvs vsLOW-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT CURRENT
Figure 3. Figure 4.
TPS3110K33
HIGH-LEVEL OUTPUT VOLTAGE MINIMUM PULSE DURATION AT V
DDvs vsHIGH-LEVEL OUTPUT CURRENT THRESHOLD OVERDRIVE VOLTAGE
Figure 5. Figure 6.
Copyright © 2001 2007, Texas Instruments Incorporated Submit Documentation Feedback 11
www.ti.com
0.992
0.994
0.996
0.998
1.000
1.002
1.004
1.006
1.008
-50 0 50 100
V NormalizedThresholdVoltage
IT --V
T Free-AirTemperature
A- - °C
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
NORMALIZED THRESHOLD VOLTAGEvsFREE-AIR TEMPERATURE
Figure 7.
12 Submit Documentation Feedback Copyright © 2001 2007, Texas Instruments Incorporated
www.ti.com
APPLICATION INFORMATION
R1 +R2 ǒVTRIP
VIT(S)*1Ǔ
(1)
TPS3106E09DBV
SENSE
GND
R1
R2
VDD
RSTVDD
RSTSENSE
R3
2Cell
NiMH
ResetOutput
MR
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007
The TPS31xx family has a quiescent current in the 1- μA to 2- μA range. When RESET is active, triggered by thevoltage monitored at V
DD
, the quiescent current increases to about 20 μA (see the Electrical Characteristics ).
In some applications it is necessary to minimize the quiescent current even during the reset period. This isespecially true when the voltage of a battery is supervised and the RESET is used to shut down the system orfor an early warning. In this case the reset condition will last for a longer period of time. The current drawn fromthe battery should almost be zero, especially when the battery is discharged.
For this kind of application, either the TPS3103 or TPS3106 is a good fit. To minimize current consumption,select a version where the threshold voltage is lower than the voltage monitored at V
DD
. The TPS3106 has tworeset outputs. One output ( RSTVDD) is triggered from the voltage monitored at V
DD
. The other output( RSTSENSE) is triggered from the voltage monitored at SENSE. In the application shown in Figure 8 , theTPS3106E09 is used to monitor the input voltage of two NiCd or NiMH cells. The threshold voltage (V
(TH)
= 0.86V) was chosen as low as possible to ensure that the supply voltage is always higher than the threshold voltageat V
DD
. The voltage of the battery is monitored using the SENSE input. The voltage divider was calculated toassert a reset using the RSTSENSE output at 2 ×0.8 V = 1.6 V.
where:
V
TRIP
is the voltage of the battery at which a reset is asserted and
V
IT(S)
is the threshold voltage at SENSE = 0.551 V.
R1 was chosen for a resistor current in the 1- μA range.
With V
TRIP
= 1.6 V:
R1 1.9 ×R2
R1 = 820 k , R2 = 430 k
Figure 8. Battery Monitoring with 3- μA Supply Current for Device and Resistor Divider
Copyright © 2001 2007, Texas Instruments Incorporated Submit Documentation Feedback 13
www.ti.com
WATCHDOG
MANUAL RESET ( MR)
PFI, PFO
SENSE
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007
The TPS3110 device integrates a watchdog timer that must be periodically triggered by a positive or negativetransition of WDI. When the supervising system fails to retrigger the watchdog circuit within the time-out interval,RESET becomes active for the time period (t
D
). This event also reinitializes the watchdog timer.
Many μC-based products require manual-reset capability, allowing an operator or logic circuitry to initiate a reset.Logic low at MR asserts reset. Reset remains asserted while MR is low and for a time period (t
D
) after MRreturns high. The input has an internal 100-k pull-up resistor, so it can be left open if it is unused.
Connect a normally open momentary switch from MR to GND to create a manual reset function. Externaldebounce is not required. If MR is driven from long cables or if the device is used in noisy environments,connecting a 0.1- μF capacitor from MR to GND provides additional noise immunity.
If there is a possibility of transient or DC conditions causing MR to rise above V
DD
, a diode should be used tolimit MR to a diode drop above V
DD
.
The TPS3103 has an integrated power-fail (PFI) comparator with a separate open-drain ( PFO) output. The PFIand PFO can be used for low-battery detection, power-fail warning, or for monitoring a power supply other thanthe main supply, and has no effect on RESET.
An additional comparator is provided to monitor voltages other than the nominal supply voltage. The power-failinput (PFI) will be compared with an internal voltage reference of 0.551 V. If the input voltage falls below thepower-fail threshold (V
IT (S)
), the power-fail output ( PFO) goes low. If it goes above 0.551 V plus approximately15-mV hysteresis, the output returns to high. By connecting two external resistors, it is possible to supervise anyvoltage above 0.551 V. The sum of both resistors should be approximately 1 M , to minimize powerconsumption and to assure that the current into the PFI pin can be neglected, compared with the current throughthe resistor network. The tolerance of the external resistors should be not more than 1% to ensure minimalvariation of sensed voltage. If the power-fail comparator is unused, connect PFI to GND and leave PFOunconnected. For proper operation of the PFI-comparator, the supply voltage (V
DD
) must be higher than 0.8 V.
The voltage at the SENSE input is compared with a reference voltage of 0.551 V. If the voltage at SENSE fallsbelow the sense-threshold (V
IT (S)
), reset is asserted. On the TPS3106, a dedicated RSTSENSE output isavailable. On the TPS3110, the logic signal from SENSE is OR-wired with the logic signal from V
DD
or MR. Aninternal timer delays the return of the output to the inactive state, once the voltage at SENSE goes above 0.551V plus about 15 mV of hysteresis. For proper operation of the SENSE-comparator, the supply voltage must behigher than 0.8 V.
14 Submit Documentation Feedback Copyright © 2001 2007, Texas Instruments Incorporated
www.ti.com
TPS3103H20
PFI
GND
R1
R2
MSP430
RESET
GND
Analog
Circuit
Px.x
Py.x
(1)Resistormaybeintegratedin mC.
RESET
PFO
VDD VDD
Low-Power mC
2V
-2V
MR
(1) (1)
V =0.551V
(NEG_TH) -R2
R1 (V 0.551V)
DD -
TPS3110K33
GND
SENSE
GND
R1
R2
DSP
RESET
GND
WDI Px.y
V =
(CORE_TH) 0.551 Vx R1+ R2
R2
VDD
RESET
VCORE VIO
3.3V
1.5V
MR
TPS3103xxx
TPS3106xxx
TPS3110xxx
SLVS363E AUGUST 2001 REVISED SEPTEMBER 2007
Figure 9. TPS3103 Monitoring a Negative Voltage
Figure 10. TPS3110 in a DSP-System Monitoring Both Supply Voltages
Copyright © 2001 2007, Texas Instruments Incorporated Submit Documentation Feedback 15
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN0402002DBVR ACTIVE SOT-23 DBV 6 TBD Call TI Call TI
TPS3103E12DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103E12DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103E12DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103E12DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103E15DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103E15DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103E15DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103E15DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103H20DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103H20DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103H20DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103H20DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103K33DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103K33DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103K33DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3103K33DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS3106E09DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3106E09DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3106E09DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3106E09DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3106E16DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3106E16DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3106E16DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3106E16DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3106K33DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3106K33DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3106K33DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3106K33DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3110E09DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3110E09DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3110E09DBVT ACTIVE SOT-23 DBV 6 TBD Call TI Call TI
TPS3110E09DBVTG4 ACTIVE SOT-23 DBV 6 TBD Call TI Call TI
TPS3110E12DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3110E12DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3110E12DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS3110E12DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3110E15DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3110E15DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3110E15DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3110E15DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3110K33DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3110K33DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3110K33DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3110K33DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 4
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS3103E12DBVR SOT-23 DBV 6 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS3103E12DBVT SOT-23 DBV 6 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS3103E15DBVR SOT-23 DBV 6 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS3103E15DBVT SOT-23 DBV 6 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS3103H20DBVR SOT-23 DBV 6 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS3103H20DBVT SOT-23 DBV 6 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS3103K33DBVR SOT-23 DBV 6 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS3103K33DBVR SOT-23 DBV 6 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS3103K33DBVT SOT-23 DBV 6 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS3103K33DBVT SOT-23 DBV 6 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS3106E09DBVR SOT-23 DBV 6 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS3106E09DBVT SOT-23 DBV 6 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS3106E16DBVR SOT-23 DBV 6 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS3106E16DBVT SOT-23 DBV 6 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS3106K33DBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS3106K33DBVT SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS3110E09DBVR SOT-23 DBV 6 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS3110E12DBVR SOT-23 DBV 6 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS3110E12DBVT SOT-23 DBV 6 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS3110E15DBVR SOT-23 DBV 6 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS3110E15DBVT SOT-23 DBV 6 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS3110K33DBVR SOT-23 DBV 6 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS3110K33DBVT SOT-23 DBV 6 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS3103E12DBVR SOT-23 DBV 6 3000 203.0 203.0 35.0
TPS3103E12DBVT SOT-23 DBV 6 250 203.0 203.0 35.0
TPS3103E15DBVR SOT-23 DBV 6 3000 203.0 203.0 35.0
TPS3103E15DBVT SOT-23 DBV 6 250 203.0 203.0 35.0
TPS3103H20DBVR SOT-23 DBV 6 3000 203.0 203.0 35.0
TPS3103H20DBVT SOT-23 DBV 6 250 203.0 203.0 35.0
TPS3103K33DBVR SOT-23 DBV 6 3000 182.0 182.0 20.0
TPS3103K33DBVR SOT-23 DBV 6 3000 203.0 203.0 35.0
TPS3103K33DBVT SOT-23 DBV 6 250 182.0 182.0 20.0
TPS3103K33DBVT SOT-23 DBV 6 250 203.0 203.0 35.0
TPS3106E09DBVR SOT-23 DBV 6 3000 182.0 182.0 20.0
TPS3106E09DBVT SOT-23 DBV 6 250 182.0 182.0 20.0
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS3106E16DBVR SOT-23 DBV 6 3000 182.0 182.0 20.0
TPS3106E16DBVT SOT-23 DBV 6 250 182.0 182.0 20.0
TPS3106K33DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
TPS3106K33DBVT SOT-23 DBV 6 250 180.0 180.0 18.0
TPS3110E09DBVR SOT-23 DBV 6 3000 182.0 182.0 20.0
TPS3110E12DBVR SOT-23 DBV 6 3000 182.0 182.0 20.0
TPS3110E12DBVT SOT-23 DBV 6 250 182.0 182.0 20.0
TPS3110E15DBVR SOT-23 DBV 6 3000 182.0 182.0 20.0
TPS3110E15DBVT SOT-23 DBV 6 250 182.0 182.0 20.0
TPS3110K33DBVR SOT-23 DBV 6 3000 182.0 182.0 20.0
TPS3110K33DBVT SOT-23 DBV 6 250 182.0 182.0 20.0
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated