1. Product profile
1.1 General description
NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages.
[1] Valid for all available selection groups.
[2] Also available in SOT54A and SOT54 variant packages (see Section 2).
1.2 Features
■General-purpose transistors
■SMD plastic packages
■Two different gain selections
1.3 Applications
■General-purpose switching and amplification
1.4 Quick reference data
BC846/BC546 series
65 V, 100 mA NPN general-purpose transistors
Rev. 06 — 7 February 2006 Product data sheet
Table 1: Product overview
Type number[1] Package PNP
complement
Philips JEITA JEDEC
BC846 SOT23 - TO-236AB BC856
BC846W SOT323 SC-70 - BC856W
BC846T SOT416 SC-75 - BC856T
BC546A[2] SOT54 SC-43A TO-92 BC556A
BC546B[2] SOT54 SC-43A TO-92 BC556B
Table 2: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCEO collector-emitter voltage open base - - 65 V
ICcollector current - - 100 mA
hFE DC current gain VCE =5V;
IC=2mA 110 - 450
hFE group A 110 180 220
hFE group B 200 290 450
BC846_BC546_SER_6 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 7 February 2006 2 of 14
Philips Semiconductors BC846/BC546 series
65 V, 100 mA NPN general-purpose transistors
2. Pinning information
Table 3: Pinning
Pin Description Simplified outline Symbol
SOT23; SOT323; SOT416
1 base
2 emitter
3 collector
SOT54
1 emitter
2 base
3 collector
SOT54A
1 emitter
2 base
3 collector
SOT54 variant
1 emitter
2 base
3 collector
006aaa144
12
3
sym021
3
2
1
001aab347
1
2
3
sym026
3
1
2
001aab348
1
2
3
sym026
3
1
2
001aab447
1
2
3
sym026
3
1
2
BC846_BC546_SER_6 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 7 February 2006 3 of 14
Philips Semiconductors BC846/BC546 series
65 V, 100 mA NPN general-purpose transistors
3. Ordering information
[1] Valid for all available selection groups.
[2] Also available in SOT54 and SOT54 variant packages (see Section 2 and Section 9).
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Table 4: Ordering information
Type number[1] Package
Name Description Version
BC846 - plastic surface mounted package; 3 leads SOT23
BC846W SC-70 plastic surface mounted package; 3 leads SOT323
BC846T SC-75 plastic surface mounted package; 3 leads SOT416
BC546A[2] SC-43A plastic single-ended leaded (through hole) package;
3 leads SOT54
BC546B[2] SC-43A plastic single-ended leaded (through hole) package;
3 leads SOT54
Table 5: Marking codes
Type number Marking code[1] Type number Marking code[1]
BC846 1D* BC846T 1M
BC846A 1A* BC846AT 1A
BC846B 1B* BC846BT 1B
BC846W 1D* BC546A C546A
BC846AW 1A* BC546B C546B
BC846BW 1B* - -
BC846_BC546_SER_6 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 7 February 2006 4 of 14
Philips Semiconductors BC846/BC546 series
65 V, 100 mA NPN general-purpose transistors
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Table 6: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 80 V
VCEO collector-emitter voltage open base - 65 V
VEBO emitter-base voltage open collector - 6 V
ICcollector current - 100 mA
ICM peak collector current single pulse;
tp≤1ms - 200 mA
IBM peak base current single pulse;
tp≤1ms - 200 mA
Ptot total power dissipation Tamb ≤25 °C[1]
SOT23 - 250 mW
SOT323 - 200 mW
SOT416 - 150 mW
SOT54 - 500 mW
Tjjunction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
Table 7: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1]
SOT23 - - 500 K/W
SOT323 - - 625 K/W
SOT416 - - 833 K/W
SOT54 - - 250 K/W
BC846_BC546_SER_6 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 7 February 2006 5 of 14
Philips Semiconductors BC846/BC546 series
65 V, 100 mA NPN general-purpose transistors
7. Characteristics
[1] Pulse test: tp≤300 µs; δ≤0.02.
[2] VBEsat decreases by approximately 1.7 mV/K with increasing temperature.
[3] VBE decreases by approximately 2 mV/K with increasing temperature.
Table 8: Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICBO collector-basecut-off
current VCB =30V; I
E=0A - - 15 nA
VCB =30V; I
E=0A;
Tj= 150 °C--5µA
IEBO emitter-base cut-off
current VEB =5V; I
E= 0 A - - 100 nA
hFE DC current gain
hFE group A VCE =5V; I
C=10µA - 180 -
hFE group B VCE =5V; I
C=10µA - 290 -
DC current gain VCE =5V; I
C= 2 mA 110 - 450
hFE group A VCE =5V; I
C= 2 mA 110 180 220
hFE group B VCE =5V; I
C= 2 mA 200 290 450
VCEsat collector-emitter
saturation voltage IC= 10 mA; IB= 0.5 mA - 90 200 mV
IC= 100 mA; IB=5mA [1] - 200 400 mV
VBEsat base-emitter
saturation voltage IC= 10 mA; IB= 0.5 mA [2] - 760 - mV
IC= 100 mA; IB=5mA [2] - 900 - mV
VBE base-emitter voltage IC= 2 mA; VCE =5V [3] 580 660 700 mV
IC= 10 mA; VCE =5V [3] - - 770 mV
fTtransition frequency VCE =5V; I
C= 10 mA;
f = 100 MHz 100 - - MHz
Cccollector capacitance VCB =10V; I
E=i
e=0A;
f=1MHz -23pF
Ceemitter capacitance VEB = 0.5 V; IC=i
c=0A;
f=1MHz -11- pF
NF noise figure IC= 200 µA; VCE =5V;
RS=2kΩ; f = 1 kHz;
B = 200 Hz
- 2 10 dB
BC846_BC546_SER_6 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 7 February 2006 6 of 14
Philips Semiconductors BC846/BC546 series
65 V, 100 mA NPN general-purpose transistors
VCE =5V
(1) Tamb = 150 °C
(2) Tamb =25°C
(3) Tamb =−55 °C
VCE =5V
(1) Tamb =−55 °C
(2) Tamb =25°C
(3) Tamb = 150 °C
Fig 1. Selection A: DC current gain as a function of
collector current; typical values Fig 2. Selection A: Base-emitter voltage as a function
of collector current; typical values
IC/IB=20
(1) Tamb = 150 °C
(2) Tamb =25°C
(3) Tamb =−55 °C
IC/IB=10
(1) Tamb =−55 °C
(2) Tamb =25°C
(3) Tamb = 150 °C
Fig 3. Selection A: Collector-emitter saturation
voltage as a function of collector current;
typical values
Fig 4. Selection A: Base-emitter saturation voltage as
a function of collector current; typical values
mgt723
10−111010
2103
IC (mA)
0
400
300
200
100
hFE
(1)
(2)
(3)
mgt724
10−111010
2103
IC (mA)
0
1200
1000
800
600
400
200
VBE
(mV)
(1)
(2)
(3)
103
102
10
mgt725
10−111010
2103
IC (mA)
VCEsat
(mV)
(1)
(2)
(3)
mgt726
10−111010
2103
IC (mA)
0
1200
1000
800
600
400
200
VBEsat
(mV)
(1)
(2)
(3)
BC846_BC546_SER_6 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 7 February 2006 7 of 14
Philips Semiconductors BC846/BC546 series
65 V, 100 mA NPN general-purpose transistors
VCE =5V
(1) Tamb = 150 °C
(2) Tamb =25°C
(3) Tamb =−55 °C
VCE =5V
(1) Tamb =−55 °C
(2) Tamb =25°C
(3) Tamb = 150 °C
Fig 5. Selection B: DC current gain as a function of
collector current; typical values Fig 6. Selection B: Base-emitter voltage as a function
of collector current; typical values
IC/IB=20
(1) Tamb = 150 °C
(2) Tamb =25°C
(3) Tamb =−55 °C
IC/IB=10
(1) Tamb =−55 °C
(2) Tamb =25°C
(3) Tamb = 150 °C
Fig 7. Selection B: Collector-emitter saturation
voltage as a function of collector current;
typical values
Fig 8. Selection B: Base-emitter saturation voltage as
a function of collector current; typical values
mgt727
10−111010
2103
IC (mA)
0
600
500
400
300
200
100
hFE
(1)
(2)
(3)
0
1200
1000
800
600
400
200
mgt728
10−210−111010
2103
IC (mA)
VBE
(mV)
(1)
(2)
(3)
104
103
102
10
mgt729
10−111010
2103
IC (mA)
VCEsat
(mV)
(1)
(2)
(3)
mgt730
10−111010
2103
IC (mA)
0
1200
1000
800
600
400
200
VBEsat
(mV)
(1)
(2)
(3)
BC846_BC546_SER_6 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 7 February 2006 8 of 14
Philips Semiconductors BC846/BC546 series
65 V, 100 mA NPN general-purpose transistors
8. Package outline
Fig 9. Package outline SOT23 (TO-236AB) Fig 10. Package outline SOT323 (SC-70)
Fig 11. Package outline SOT416 (SC-75) Fig 12. Package outline SOT54 (SC-43A/TO-92)
Fig 13. Package outline SOT54A Fig 14. Package outline SOT54 variant
04-11-04Dimensions in mm
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1 1.4
1.2
0.48
0.38 0.15
0.09
12
3
04-11-04Dimensions in mm
0.45
0.15
1.1
0.8
2.2
1.8
2.2
2.0 1.35
1.15
1.3
0.4
0.3 0.25
0.10
12
3
04-11-04Dimensions in mm
0.95
0.60
1.8
1.4
1.75
1.45 0.9
0.7
0.25
0.10
1
0.30
0.15
12
30.45
0.15
04-11-16Dimensions in mm
5.2
5.0 14.5
12.7
4.8
4.4
4.2
3.6 0.45
0.38
0.48
0.40
1.27 2.54
3
2
1
04-06-28Dimensions in mm
5.2
5.0 14.5
12.7
4.8
4.4
4.2
3.6 0.45
0.38
0.48
0.40
2.54
5.08
3 max
3
2
1
05-01-10Dimensions in mm
5.2
5.0 14.5
12.7
4.8
4.4
4.2
3.6
0.45
0.38
0.48
0.40
1.27
1.27
2.54
2.5
max
3
2
1
BC846_BC546_SER_6 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 7 February 2006 9 of 14
Philips Semiconductors BC846/BC546 series
65 V, 100 mA NPN general-purpose transistors
9. Packing information
[1] For further information and the availability of packing methods, see Section 16.
[2] Valid for all available selection groups.
Table 9: Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number[2] Package Description Packing quantity
3000 5000 10000
BC846 SOT23 4 mm pitch, 8 mm tape and reel -215 - -235
BC846W SOT323 4 mm pitch, 8 mm tape and reel -115 - -135
BC846T SOT416 4 mm pitch, 8 mm tape and reel -115 - -135
BC546A SOT54 bulk, straight leads - -412 -
SOT54A tape and reel, wide pitch - - -116
tape ammopack, wide pitch - - -126
SOT54 variant bulk, delta pinning - -112 -
BC546B SOT54 bulk, straight leads - -412 -
SOT54A tape and reel, wide pitch - - -116
tape ammopack, wide pitch - - -126
SOT54 variant bulk, delta pinning - -112 -
BC846_BC546_SER_6 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 7 February 2006 10 of 14
Philips Semiconductors BC846/BC546 series
65 V, 100 mA NPN general-purpose transistors
10. Soldering
Dimensions in mm
Fig 15. Reflow soldering footprint SOT23 (TO-236AB)
Dimensions in mm
Fig 16. Wave soldering footprint SOT23 (TO-236AB)
MSA439
1.00
0.60
(3x)
1.30
12
3
2.50
3.00 0.85 2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85
solder lands
solder resist
occupied area
solder paste
MSA427
4.00
4.60
2.80
4.50
1.20
3.40
3
21
1.20 (2x)
preferred transport direction during soldering
solder lands
solder resist
occupied area
BC846_BC546_SER_6 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 7 February 2006 11 of 14
Philips Semiconductors BC846/BC546 series
65 V, 100 mA NPN general-purpose transistors
Dimensions in mm
Fig 17. Reflow soldering footprint SOT323 (SC-70)
Dimensions in mm
Fig 18. Wave soldering footprint SOT323 (SC-70)
Dimensions in mm
Fig 19. Reflow soldering footprint SOT416 (SC-75)
MSA429
0.852.35
0.55
(3x)
1.3250.75
2.40
2.65
1.30
3
2
1
0.60
(3x) 0.50
(3x) 1.90
solder lands
solder resist
occupied area
solder paste
MSA419
4.00
4.60
2.103.65
1.15
2.70
3
2
10.90
(2x)
preferred transport direction during soldering
solder lands
solder resist
occupied area
MSA438
2.00
0.60
(3x)
0.70
1.50
1
2
3
1.10
2.20
0.50
(3x)
0.85
0.60
1.90
solder lands
solder resist
occupied area
solder paste
BC846_BC546_SER_6 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 7 February 2006 12 of 14
Philips Semiconductors BC846/BC546 series
65 V, 100 mA NPN general-purpose transistors
11. Revision history
Table 10: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
BC846_BC546_SER_6 20060207 Product data sheet - - BC846_BC847_
BC848_5
BC846T_847T_
SERIES_3
BC846W_BC847W_
BC848W_4
BC546_547_4
Modifications: •The format of this data sheet has been redesigned to comply with the new presentation
and information standard of Philips Semiconductors.
•This data sheet is a type combination out of the previous data sheets
BC846_BC847_BC848_5, BC846T_847T_SERIES_3, BC846W_BC847W_BC848W_4
and BC546_547_4.
•Table 8 “Characteristics”: F redefined to NF noise figure
BC846_BC847_BC848_5 20040206 Product
specification - 9397 750 12395 BC846_BC847_
BC848_4
BC846T_847T_SERIES_3 20001115 Product
specification - 9397 750 07524 BC846T_847T_2
BC846W_BC847W_
BC848W_4 20020204 Product
specification - 9397 750 09166 BC846W_847W_3
BC546_547_4 20041125 Product
specification - 9397 750 13568 BC546_547_3
Philips Semiconductors BC846/BC546 series
65 V, 100 mA NPN general-purpose transistors
BC846_BC546_SER_6 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 7 February 2006 13 of 14
12. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
13. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
makes no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
14. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
15. Trademarks
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
16. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2006
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.Date of release: 7 February 2006
Document number: BC846_BC546_SER_6
Published in The Netherlands
Philips Semiconductors BC846/BC546 series
65 V, 100 mA NPN general-purpose transistors
17. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
9 Packing information. . . . . . . . . . . . . . . . . . . . . . 9
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
12 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 13
13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
16 Contact information . . . . . . . . . . . . . . . . . . . . 13
