Pb
RoHS
EP2545ETTPDL-4.000M TR
EP25 45 ET T PD L -4.000M TR
Series
RoHS Compliant (Pb-free) 5.0V 4 Pad 5mm x 7mm
Ceramic SMD HCMOS/TTL Programmable Oscillator
Frequency Tolerance/Stability
±50ppm Maximum
Operating Temperature Range
-40°C to +85°C
Duty Cycle
50 ±5(%)
Packaging Options
Tape & Reel
Nominal Frequency
4.000MHz
Output Logic Type
TTL
Pin 1 Connection
Power Down (Disabled Output: Logic Low)
ELECTRICAL SPECIFICATIONS
Nominal Frequency 4.000MHz
Frequency Tolerance/Stability ±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range,Supply Voltage Change, Output Load Change,
First Year Aging at 25°C, Shock, and Vibration)
Aging at 25°C ±5ppm/year Maximum
Operating Temperature Range -40°C to +85°C
Supply Voltage 5.0Vdc ±10%
Input Current 45mA Maximum (Unloaded)
Output Voltage Logic High (Voh) 2.4Vdc Minimum (IOH = -16mA)
Output Voltage Logic Low (Vol) 0.4Vdc Maximum (IOL = +16mA)
Rise/Fall Time 4nSec Maximum (Measured at 0.8Vdc to 2.0Vdc)
Duty Cycle 50 ±5(%) (Measured at 1.4Vdc with TTL Load or 50% of waveform with HCMOS Load)
Load Drive Capability 10TTL Load Maximum
Output Logic Type TTL
Pin 1 Connection Power Down (Disabled Output: Logic Low)
Pin 1 Input Voltage (Vih and Vil) +2.0Vdc Minimum to enable output, +0.8Vdc Maximum to disable output, No Connect to enable output.
Standby Current 50µA Maximum (Pin 1 = Ground)
Disable Current 30mA Maximum (Pin 1 = Ground)
Absolute Clock Jitter 250pSec Maximum, ±100pSec Typical
One Sigma Clock Period Jitter ±50pSec Maximum
Start Up Time 10mSec Maximum
Storage Temperature Range -55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Flammability UL94-V0
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity J-STD-020, MSL 1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010, Condition B
Vibration MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 1 of 7
EP2545ETTPDL-4.000M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
1.60 ±0.20
5.00
±0.15
7.00
±0.15
MARKING
ORIENTATION
3.68
±0.15
1.4 ±0.1 1.4 ±0.2
2.20
±0.15
5.08
±0.15
12
34
PIN CONNECTION
1 Power Down (Logic Low)
2 Ground/Case Ground
3 Output
4 Supply Voltage
LINE MARKING
1ECLIPTEK
24.000M
3PXXYZZ
P=Configuration Designator
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X4)
All Dimensions in Millimeters
2.88
1.81
2.0 (X4)
2.2 (X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 2 of 7
EP2545ETTPDL-4.000M TR
OUTPUT DISABLE
(LOGIC LOW)
OUTPUT WAVEFORM & TIMING DIAGRAM
VOH
VOL
80% or 2.0VDC
50% or 1.4VDC
20% or 0.8VDC
Fall
Time Rise
Time TW
T
Duty Cycle (%) = TW/T x 100
VIH
VIL
tPLZ tPZL
CLOCK OUTPUT POWER DOWN INPUT
Supply
Voltage
(VDD)
Test Circuit for TTL Output
Output
No Connect
or Tri-State
Ground
+ +
+
+
_
_
__
Power
Supply Voltage
Meter
Current
Meter
0.01µF
(Note 1) 0.1µF
(Note 1) CL
(Note 3)
RL
(Note 4)
Power
Supply
Oscilloscope Frequency
Counter
Probe
(Note 2)
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.
Note 5: All diodes are MMBD7000, MMBD914, or equivalent.
Table 1: RL Resistance Value and CL Capacitance
Value Vs. Output Load Drive Capability
Output Load
Drive Capability RL Value
(Ohms) CL Value
(pF)
10TTL
5TTL
2TTL
10LSTTL
1TTL
390
780
1100
2000
2200
15
15
6
15
3
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 3 of 7
EP2545ETTPDL-4.000M TR
Supply
Voltage
(VDD)
Test Circuit for CMOS Output
Output
No Connect
or Tri-State
Ground
+ +
+_
__
Power
Supply 0.01µF
(Note 1) 0.1µF
(Note 1) CL
(Note 3)
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
Voltage
Meter
Current
Meter
Oscilloscope Frequency
Counter
Probe
(Note 2)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 4 of 7
DIA 50 MIN
DIA 20.2 MIN
DIA 13.0 ±0.2
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.5 MIN
Tape & Reel Dimensions
*Compliant to EIA 481A
EP2545ETTPDL-4.000M TR
16.0
+0.3/-0.1
7.5 ±0.1
6.75 ±0.10
4.0 ±0.1
2.0 ±0.1
8.0 ±0.1 B0*
1.5 +1/-0
A0*
0.30 ±0.05
K0*
22.4 MAX
360 MAX
Quantity Per Reel: 1,000 Units
16.4 +2/-0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 5 of 7
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EP2545ETTPDL-4.000M TR
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 6 of 7
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EP2545ETTPDL-4.000M TR
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 7 of 7
