V F1 V F2 V F3 V F4 VF5
Limits I F= 1 mA dc I F= 10 mA dc I F= 50 mA dc I F= 100 mA dc I F= 200 mA dc
(Pulsed) (Pulsed) (Pulsed)
V dc V dc V dc V dc V dc
minimum 0.540 0.660 0.760 0.820 0.870
maximum 0.620 0.740 0.860 0.920 1.000
Type V BR V RWM I R1 1 R2 Ct
rr
VR= 50 V dc VR= 50 V dc VR= 0; f = 1 Mhz; IF= IR= 10 to 100 mA dc
IR= 10 µA TA= 25°C TA= 150°C ac signals = 50 mV (p-p) RL= 100 ohms
V dc V (pk) µA dc µA dc pF ns
1N3600 75 50 0.1 100 2.5 4
1N4150,-1 75 50 0.1 100 2.5 4
37
6 LAKE STREET, LAWRENCE, MASSACHUSETTS 01841
PHONE (978) 620-2600 FAX (781) 689-0803
WEBSITE: http://www.microsemi.com
1N4150
and
1N4150-1
and
1N3600
MAXIMUM RATINGS
Junction Temperature: -65°C to +175°C
Storage Temperature: -65°C to +175°C
Operating Current: 300 mA @ TA= +25°C
Derating: 2.0 mA dc/°C Above TL = + 75°C @ L = 3/8”
Forward Surge Current: 4A, (tp = 1µs); 0.5A (tp = 1s)
ELECTRICAL CHARACTERISTICS @ 25°C, unless otherwise speci½ed.
• 1N4150-1 AVAILABLE IN JAN, JANTX, AND JANTXV PER MIL-PRF-19500/231
• 1N3600 AVAILABLE IN JAN, JANTX, AND JANTXV PER MIL-PRF-19500/231
• SWITCHING DIODES
• HERMETICALLY SEALED
• METALLURGICALLY BONDED
• DOUBLE PLUG CONSTRUCTION
FIGURE 1
DESIGN DATA
CASE: Hermetically sealed
glass case per MIL-S-19500/231
D0-35 outline.
LEAD MATERIAL: Copper clad steel.
LEAD FINISH: Tin / Lead
THERMAL RESISTANCE: (ROJL):
250 °C/W maximum at L = .375
THERMAL IMPEDANCE: (ZOJX): 70
°C/W maximum
POLARITY: Cathode end is banded.
MOUNTING POSITION: Any.
FORWARD VOLTAGE LIMITS – ALL TYPES
38
IN4150, IN4150-1 and IN3600
.3 .4 .5 .6 .7 .8 .9 1.0 1.1 1.2 1.3
VF - Forward Voltage (V)
FIGURE 2
Typical Forward Current
vs Forward Voltage
IF- Forward Current - (mA)
1000
100
10
1
0.1
150ºC
100ºC
25ºC
-65ºC
20 40 60 80 100 120 140
Percent of Reverse Working Voltage (%)
FIGURE 3
Typical Reverse Current
vs Reverse Voltage
IR- Reverse Current - (µA)
1000
100
10
1
0.1
.01
.001
150ºC
100ºC
25ºC
-65ºC
NOTE : All temperatures shown on graphs are
junction temperatures
