© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 2 1Publication Order Number:
1SS383T1G/D
1SS383T1G
Preferred Device
Dual Schottky Diode
Dual 40 V, 300 mA Low VF Schottky Diodes in 4−lead SC−82
package.
Features
•Low Forward Voltage: VF = 0.48 V (typ) @ IF = 100 mA
•Low Reverse Current: IR = 5 mA (max)
•This is a Pb−Free Device*
MAXIMUM RATINGS (TA = 25°C)
Rating Symbol Max Unit
Continuous Reverse Voltage VR40 V
Maximum Peak Forward Current* IFM 300 mA
Peak Forward Surge Current
Pulse Width = 10 msIFM(surge) 500 mA
THERMAL CHARACTERISTICS
Characteristic
(Both Junctions Heated) Symbol Max Unit
Total Device Dissipation
TA = 25°C
Derate above 25°C
PD200
(Note 1)
1.6
(Note 1)
mW
mW/°C
Thermal Resistance,
Junction-to-Ambient RqJA 625
(Note 1) °C/W
Junction and Storage
Temperature TJ, Tstg −55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*Both Devices Active
1. FR−4 @ Minimum Pad.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Forward Voltage
(IF = 1.0 mA)
(IF = 10 mA)
(IF = 100 mA)
VF−
−
−
280
360
540
−
−
600
mV
Reverse Current
(VR = 40 V) IR−−5 mA
Capacitance
(VR = 0, f = 1.0 MHz) CD− − 25 pF
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
Preferred devices are recommended choices for future use
and best overall value.
21
SC−82
CASE 900AA
MARKING DIAGRAM
Device Package Shipping†
ORDERING INFORMATION
1SS383T1G SC−82
(Pb−Free) 3000/Tape & Reel
34
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
AE
AE= Specific Device Code
M = Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
M
G
G
1SS383T1G
http://onsemi.com
2
PACKAGE DIMENSIONS
SC−82, 4 LEAD, GULL WING
CASE 900AA−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS IS
THE MINIMUMTHICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
STYLE 1:
PIN 1. ANODE 1
2. ANODE 2
3. CATHODE 2
4. CATHODE 1
12
34
D
e
H
b
A
AC
L
E
E
1
DIM MIN NOM MAX
MILLIMETERS
A0.80 0.90 1.00
A0 −−− 0.10
b0.10 0.20 0.30
C0.10 0.18 0.25
D1.80 2.00 2.20
E1.15 1.25 1.35
e1.30 BSC
2.00 2.10 2.20
L0.10 0.20 0.30
0.032 0.035 0.04
0 −−− 0.004
0.004 0.008 0.012
0.004 0.007 0.010
0.071 0.079 0.087
0.045 0.049 0.053
0.051 BSC
0.079 0.083 0.087
0.004 0.008 0.012
MIN NOM MAX
INCHES
1
HE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, af filiates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
1SS383T1G/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
