1SS383T1G Preferred Device Dual Schottky Diode Dual 40 V, 300 mA Low VF Schottky Diodes in 4-lead SC-82 package. Features * Low Forward Voltage: VF = 0.48 V (typ) @ IF = 100 mA * Low Reverse Current: IR = 5 mA (max) * This is a Pb-Free Device* http://onsemi.com 4 3 1 2 MAXIMUM RATINGS (TA = 25C) Rating Symbol Max Unit Continuous Reverse Voltage VR 40 V Maximum Peak Forward Current* IFM 300 mA IFM(surge) 500 mA Max Unit 200 (Note 1) 1.6 (Note 1) mW Peak Forward Surge Current Pulse Width = 10 ms THERMAL CHARACTERISTICS Total Device Dissipation TA = 25C Symbol Derate above 25C Thermal Resistance, Junction-to-Ambient Junction and Storage Temperature SC-82 CASE 900AA PD mW/C RqJA 625 (Note 1) C/W TJ, Tstg -55 to +150 C MARKING DIAGRAM AE Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *Both Devices Active 1. FR-4 @ Minimum Pad. ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Symbol Forward Voltage (IF = 1.0 mA) (IF = 10 mA) (IF = 100 mA) VF Reverse Current (VR = 40 V) IR Capacitance (VR = 0, f = 1.0 MHz) CD Min Typ Max - - - 280 360 540 - - 600 - - 5 Unit M Characteristic (Both Junctions Heated) G G AE = Specific Device Code M = Date Code G = Pb-Free Package (Note: Microdot may be in either location) mV ORDERING INFORMATION mA 1SS383T1G pF - - Device Package Shipping SC-82 (Pb-Free) 3000/Tape & Reel 25 For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (c) Semiconductor Components Industries, LLC, 2006 March, 2006 - Rev. 2 1 Preferred devices are recommended choices for future use and best overall value. Publication Order Number: 1SS383T1G/D 1SS383T1G PACKAGE DIMENSIONS SC-82, 4 LEAD, GULL WING CASE 900AA-01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUMTHICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. D 4 3 E HE 1 2 DIM A A1 b C D E e HE L b e C A A1 MILLIMETERS MIN NOM MAX 0.80 0.90 1.00 0 --- 0.10 0.10 0.20 0.30 0.10 0.18 0.25 1.80 2.00 2.20 1.15 1.25 1.35 1.30 BSC 2.00 2.10 2.20 0.10 0.20 0.30 INCHES NOM MAX 0.035 0.04 --- 0.004 0.008 0.012 0.007 0.010 0.079 0.087 0.049 0.053 0.051 BSC 0.079 0.083 0.087 0.004 0.008 0.012 MIN 0.032 0 0.004 0.004 0.071 0.045 STYLE 1: PIN 1. ANODE 1 2. ANODE 2 3. CATHODE 2 4. CATHODE 1 L ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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